KR20210048874A - Method for protecting fuel injection pump of vehicle and electronic device thereof - Google Patents

Abstract

The present invention relates to a method for protecting a fuel injection pump of a vehicle and an electronic device thereof. In accordance with the present invention, an electronic device comprises a sensor module, a cooling device, and a processor operatively coupled to the sensor module and the cooling device, and the processor is capable of monitoring the temperature of a high-pressure pump between a high-pressure pump for injecting fuel in a gasoline direct injection (GDI) method and a low-pressure pump for injecting fuel in a multi-point injection (MPI) method through the sensor module, controlling the cooling device to perform a cooling function for cooling the high-pressure pump, in response to identifying that the temperature of the high-pressure pump is equal to or more than a reference temperature, and controlling the cooling device to stop the cooling function for cooling the high-pressure pump, in response to identifying that the temperature of the high-pressure pump is below the reference temperature.

Description

TECHNICAL FIELD The method for protecting a vehicle's fuel injection pump and its electronic device TECHNICAL FIELD

Various embodiments of the present disclosure relate to a method for protecting a fuel injection pump of a vehicle and an electronic device thereof.

The spark ignition type engine applied to vehicles burns fuel by injecting fuel into the throttle body or intake manifold so that it is sucked into the combustion chamber of the cylinder with air during the intake stroke. MPI (multi point injection) method, or gasoline direct injection (GDI) method, in which fuel is burned by injecting fuel directly into the combustion chamber of a cylinder to improve engine performance and fuel economy and to reduce exhaust gas, is applied. Compared to the GDI method, the MPI method has an advantage in that the engine structure is simple and the overall weight of the engine is light, but there is a disadvantage in that the fuel efficiency is lower than that of the GDI fuel injection method.

Recently, a dual injection system for increasing combustion efficiency and reducing PM (Particulate Matter) has been applied to an internal combustion engine of a vehicle. The dual injection system improves combustion efficiency and reduces PM generation by dividing the engine's operating area according to combustion efficiency and PM generation values based on a structure in which two injectors are installed in one cylinder, and appropriately distributing the GDI method and MPI method. I can make it.

The background technology of the present invention is disclosed in Korean Patent Registration No. 10-2012337 (registered on August 13, 2019, an apparatus and method for diagnosing failure of an internal combustion engine).

The dual injection system includes a high-pressure pump for the GDI method and a low-pressure pump for the MPI method, and injects fuel in a specific area according to the characteristics of the engine using the GDI method, the MPI method, or a combination of the GDI method and the MPI method. I can make it. Here, the high-pressure pump for the GDI method can independently generate system pressure regardless of fuel injection. When fuel is injected through the MPI method, fuel is stagnated in the high-pressure pump, which increases the temperature and pressure of the high-pressure pump, which may damage the high-pressure pump. Therefore, a solution may be required to prevent damage to the high pressure pump in the dual injection system.

Various embodiments of the present invention disclose an apparatus and method for preventing damage to a high pressure pump in a dual injection system.

In various embodiments of the present disclosure, an electronic device includes a sensor module, a cooling device, and a processor operatively coupled to the sensor module and the cooling device, and the processor includes a GDI through the sensor module. The temperature of the high-pressure pump is monitored among the high-pressure pump for injecting fuel by the (gasoline direct injection) method and the low-pressure pump for injecting the fuel by the MPI (multi point injection) method, and the temperature of the high-pressure pump is higher than the reference temperature. In response to identifying, controlling the cooling device to perform a cooling function for cooling the high pressure pump, and in response to identifying that the temperature of the high pressure pump is less than the reference temperature, cooling the high pressure pump The cooling device can be controlled to stop the cooling function.

A method of operating an electronic device according to various embodiments of the present disclosure includes a high-pressure pump and multi-point injection (MPI) for injecting fuel by a gasoline direct injection (GDI) method through a sensor module of the electronic device. Monitoring the temperature of the high-pressure pump among low-pressure pumps for injecting fuel in a manner, the processor performs a cooling function for cooling the high-pressure pump in response to identifying that the temperature of the high-pressure pump is higher than or equal to a reference temperature. Controlling a cooling device of the electronic device to perform, and in response to identifying that the temperature of the high pressure pump is less than the reference temperature, the processor stops the cooling function for cooling the high pressure pump. It may include controlling the cooling device.

Various embodiments of the present invention, in a dual injection system using the GDI method and the MPI method, prevent damage to the high pressure pump due to temperature rise by performing a cooling function to cool the high pressure pump based on the temperature of the high pressure pump. can do.

1 is a block diagram of an electronic device for protecting a fuel injection pump of a vehicle according to various embodiments of the present disclosure.
2 is a flowchart illustrating a method for protecting a fuel injection pump of a vehicle in an electronic device according to various embodiments of the present disclosure.
3 is a flowchart illustrating a method of performing a cooling function for cooling a high pressure pump in an electronic device according to various embodiments of the present disclosure.

Hereinafter, various embodiments of the present document will be described with reference to the accompanying drawings. The embodiments and terms used therein are not intended to limit the technology described in this document to a specific embodiment, and should be understood to include various changes, equivalents, and/or substitutes for the corresponding embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar elements. Singular expressions may include plural expressions unless the context clearly indicates otherwise. In this document, expressions such as "A or B" or "at least one of A and/or B" may include all possible combinations of items listed together. Expressions such as "first", "second", "first", or "second" can modify the corresponding elements regardless of their order or importance, and are used to distinguish one element from another. However, it does not limit the components. When any (eg, first) component is referred to as being “(functionally or communicatively) connected” or “connected” to another (eg, second) component, the component is It may be directly connected to the component, or may be connected through another component (eg, a third component).

In this document, "configured to" means "suitable for", "having the ability to ...", "modified to" depending on the situation, for example, in hardware or software. It may be used interchangeably with ", "made to", "can do", or "designed to". In some situations, the expression "a device configured to" may mean that the device "can" along with other devices or parts. For example, the phrase “a processor configured (or configured) to perform A, B, and C” means a dedicated processor (eg, an embedded processor) for performing the operation, or by executing one or more software programs stored in a memory device. , May mean a general-purpose processor (eg, a CPU or an application processor) capable of performing the corresponding operations.

1 is a block diagram of an electronic device for protecting a fuel injection pump of a vehicle according to various embodiments of the present disclosure.

Referring to FIG. 1, the electronic device 100 may include a processor 120, a memory 130, a communication circuit 140, a sensor module 150, and a cooling device 160. However, it is not limited thereto. For example, in addition to the above-described configurations, the electronic device 100 may further include configurations of an output device (not shown) for outputting information and/or an input device (not shown) for input.

According to various embodiments, a vehicle (not shown) in which the electronic device 100 is installed may inject fuel in a specific area according to the characteristics of an engine in a GDI method, an MPI method, or a method using a GDI method and an MPI method together. It may include a dual injection system. According to an embodiment, the dual injection system may include a high pressure pump for injecting fuel using the GDI method and a low pressure pump for injecting fuel using the MPI method.

According to various embodiments, the processor 120 may control a plurality of hardware or software components connected to the processor 120 by driving an operating system or application, and may perform various data processing and operations. According to an embodiment, the processor 120 may be implemented as a system on chip (SoC). The processor 120 may load instructions or data received from at least one of the other components into the memory 130 and process them, and store various data in the memory 130.

According to various embodiments, the processor 120 may obtain information on an operation mode of an engine of the vehicle through the communication circuit 140. For example, the processor 120 may receive information indicating that the operation mode of the engine of the vehicle is a GDI mode (or a first mode) using only the GDI method through the communication circuit 140. For another example, the processor 120 may receive information indicating that the operation mode of the engine of the vehicle is an MPI mode (or a second mode) using only the MPI method through the communication circuit 140. As another example, the processor 120 may obtain information indicating that the operation mode of the vehicle engine is a GDI+MPI mode (or a third mode) using both the GDI method and the MPI method through the communication circuit 140. have.

According to various embodiments, the processor 120 may monitor the temperature of the high-pressure pump of the vehicle through the sensor module 150. For example, the processor 120 may monitor the temperature of the high-pressure pump of the vehicle periodically or aperiodically through the sensor module 150 while the vehicle engine is running. For another example, the processor 120 may monitor the temperature of the high-pressure pump of the vehicle periodically or aperiodically through the sensor module 150 after a specified time after the engine of the vehicle is driven.

According to various embodiments, the processor 120 may measure the amount of air accumulated in the cylinder of the engine through the sensor module 150. For example, while the engine operation mode of the vehicle is set to the MPI mode, the processor 120 may accumulate and measure the amount of air introduced into the cylinder of the engine through the sensor module 150.

According to various embodiments, the processor 120 may control the cooling device 160 to perform a cooling function for cooling the high pressure pump. For example, when the processor 120 identifies that the temperature of the high pressure pump is equal to or higher than the reference temperature, the processor 120 may control the cooling device 160 to perform a cooling function for cooling the high pressure pump. For another example, when the processor 120 accumulates the amount of air flowing into the cylinder of the engine and identifies that the measured accumulation amount is greater than or equal to the reference amount in a state in which the operation mode of the vehicle's engine is the MPI mode, the processor 120 cools the high-pressure pump. The cooling device 160 may be controlled to perform a cooling function.

According to various embodiments, the processor 120 stops the cooling function for cooling the high pressure pump based on a preset condition while the cooling device 160 performs a cooling function for cooling the high pressure pump. ) Can be controlled. For example, when the processor 120 identifies that the temperature of the high pressure pump is less than the reference temperature while the cooling device 160 performs a cooling function for cooling the high pressure pump, the cooling function for cooling the high pressure pump is stopped. The cooling device 160 can be controlled so as to be. For another example, when the processor 120 identifies that a specified time has passed since the cooling device 160 performs the cooling function for cooling the high pressure pump, the processor 120 cools to stop the cooling function for cooling the high pressure pump. The device 160 can be controlled.

According to various embodiments, the communication circuit 140 may form a wired or wireless channel for data communication between the electronic device 100 and an external electronic device. According to an embodiment, when information on an operation mode of an engine of a vehicle is received from an external electronic device, the communication circuit 140 may provide the received information to the processor 120.

According to various embodiments, the sensor module 150 includes a temperature sensor for measuring the temperature of a high-pressure pump for injecting fuel in the GDI method, and an air mass flow meter for accumulating and measuring the amount of air introduced into the cylinder of the engine. I can.

According to various embodiments, the cooling device 160 may cool a high-pressure pump for injecting fuel using the GDI method. For example, by driving at least one fan included in the cooling device 160 under the control of the processor 120, the high pressure pump may be cooled. According to an embodiment, the cooling device 160 may further include a radiator for cooling the high pressure pump, coolant, and a pump.

As described above, in a vehicle equipped with a dual injection system using the GDI method and the MPI method, the electronic device 100 performs a cooling function to cool the high pressure pump based on the temperature of the high pressure pump, thereby preventing temperature rise. Therefore, damage to the high pressure pump can be prevented.

2 is a flowchart illustrating a method of protecting a fuel injection pump of a vehicle in an electronic device according to various embodiments of the present disclosure.

In the following description, the vehicle may include a dual injection system capable of injecting fuel in a specific region according to the characteristics of the engine in a GDI method, an MPI method, or a method using a combination of the GDI method and the MPI method. According to an embodiment, the dual injection system may include a high pressure pump for injecting fuel using the GDI method and a low pressure pump for injecting fuel using the MPI method.

Referring to FIG. 2, in operation 201, a processor (eg, the processor 120 of FIG. 1) of an electronic device (eg, the electronic device 100 of FIG. 1) is a sensor module (eg, the sensor module 150 of FIG. 1 ). )) to monitor the temperature of the high pressure pump. For example, the processor 120 may monitor the temperature of the high-pressure pump of the vehicle periodically or aperiodically through the sensor module 150 while the vehicle engine is running. For another example, the processor 120 may monitor the temperature of the high-pressure pump of the vehicle periodically or aperiodically through the sensor module 150 after a specified time after the engine of the vehicle is driven.

In operation 203, in response to identifying that the temperature of the high-pressure pump is equal to or higher than the reference temperature, the processor 120 may control the cooling device 160 to perform a cooling function for cooling the high-pressure pump. According to an embodiment, the processor 120 may control the cooling device 160 to perform a cooling function for cooling the high pressure pump even when the temperature of the high pressure pump is not at the reference temperature. For example, the processor 120 has a cooling function for cooling the high-pressure pump, regardless of the temperature of the high-pressure pump, when the vehicle engine operates in the MPI mode and the accumulated amount of air flowing into the cylinder of the vehicle is greater than or equal to the reference amount. The cooling device 160 can be controlled to perform.

In operation 205, the processor 120 may control the cooling device 160 to stop a cooling function for cooling the high pressure pump in response to identifying that the temperature of the high pressure pump is less than the reference temperature. According to an embodiment, the processor 120 may control the cooling device 160 to stop a cooling function for cooling the high pressure pump according to a specified condition regardless of the temperature of the high pressure pump. For example, the processor 120 may control the cooling device 160 to stop the cooling function when a specified time elapses after the cooling device 160 performs the cooling function.

In the above, it has been described that the electronic device 100 cools the high-pressure pump based on the temperature of the high-pressure pump, but according to various embodiments of the present invention, the electronic device 100 cools the high-pressure pump for a specified time every specified period. It can also be set to make it happen.

As described above, in a vehicle equipped with a dual injection system using the GDI method and the MPI method, the electronic device 100 performs a cooling function to cool the high pressure pump based on the temperature of the high pressure pump, thereby preventing temperature rise. Therefore, damage to the high pressure pump can be prevented.

3 is a flowchart illustrating a method of performing a cooling function for cooling a high-pressure pump in an electronic device according to various embodiments of the present disclosure. The following description may be a detailed operation of an operation of performing a cooling function for cooling the high-pressure pump in operation 203 of FIG. 2.

Referring to FIG. 3, in operation 301, a processor (eg, the processor 120 of FIG. 1) of an electronic device (eg, the electronic device 100 of FIG. 1) determines whether the temperature of the high-pressure pump is higher than or equal to a reference temperature. I can. The processor 120 may perform operation 303 when the temperature of the high-pressure pump is higher than or equal to the reference temperature, and perform operation 305 when the temperature of the high-pressure pump is less than the reference temperature.

In operation 303, when the temperature of the high-pressure pump is equal to or higher than the reference temperature, the processor 120 may control the cooling device 160 to perform a cooling function for cooling the high-pressure pump.

In operation 305, when the temperature of the high-pressure pump is less than the reference temperature, the processor 120 may determine whether the operation mode of the engine of the vehicle is the MPI mode. For example, the processor 120 receives information related to the operation mode of the vehicle engine from an external electronic device through the communication circuit 140, and whether the operation mode of the vehicle engine is the MPI mode based on the received information. Can be determined. When the operation mode of the vehicle engine is the MPI mode, the processor 120 performs operation 307, and when the operation mode of the vehicle engine is not the MPI mode (for example, in the case of GDI mode or GDI+MPI mode), FIG. You can perform operation 201 of 2 again.

In operation 307, when the operation mode of the vehicle engine is the MPI mode, the processor 120 may determine whether the amount of accumulated air flowing into the cylinder of the vehicle engine through the sensor module 150 is greater than or equal to a reference amount. The processor 120 performs operation 303 when the amount of accumulated air flowing into the cylinder of the vehicle engine is greater than or equal to the reference amount, and performs operation 201 of FIG. 2 again when the amount of accumulated air flowing into the cylinder of the vehicle engine is less than the reference amount. have.

The term "module" used in this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic blocks, parts, or circuits. The module may be an integrally configured component or a minimum unit of the component or a part thereof that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more instructions stored in a storage medium (eg, the memory 130 of FIG. 1) readable by a machine (eg, the electronic device 100 of FIG. 1). It can be implemented as software including (instructions). For example, a processor (eg, the processor 120 of FIG. 1) of a device (eg, the electronic device 100 of FIG. 1) calls at least one instruction among one or more instructions stored from a storage medium, and You can do it. This may enable the device to be operated to perform at least one function according to the at least one instruction called. One or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here,'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term refers to the case where data is semi-permanently stored in the storage medium. It does not distinguish between temporary storage cases.

According to various embodiments, each component (eg, module or program) of the above-described components may include a singular number or a plurality of entities. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar to that performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be sequentially, parallel, repeatedly, or heuristically executed, or one or more of the operations may be executed in a different order or omitted. , Or one or more other actions may be added.

100: electronic device
120: processor
130: memory
140: communication circuit
150: sensor module
160: cooling device

Claims (12)

Sensor module;
Cooling device; And
And a processor operatively coupled to the sensor module and the cooling device, wherein the processor,
Monitoring the temperature of the high-pressure pump among high-pressure pumps for injecting fuel by a gasoline direct injection (GDI) method and a low-pressure pump for injecting fuel by a multi point injection (MPI) method through the sensor module,
In response to identifying that the temperature of the high pressure pump is equal to or higher than the reference temperature, controlling the cooling device to perform a cooling function for cooling the high pressure pump, and
In response to identifying that the temperature of the high pressure pump is less than the reference temperature, the electronic device controls the cooling device to stop the cooling function for cooling the high pressure pump.
The method of claim 1,
The processor, as at least part of the operation of monitoring the temperature of the high pressure pump,
An electronic device that periodically or aperiodically monitors the temperature of the high-pressure pump through the sensor module while the vehicle engine is running.
The method of claim 1,
The processor, as at least part of the operation of monitoring the temperature of the high pressure pump,
An electronic device that periodically or aperiodically monitors the temperature of the high-pressure pump through the sensor module in response to identifying that a specified time has elapsed since the engine of the vehicle is driven.
The method of claim 1,
The processor, as at least part of the operation of controlling the cooling device,
When it is identified that the temperature of the high-pressure pump is equal to or higher than the reference temperature, it is determined whether the operation mode of the engine of the vehicle is an MPI mode in which fuel is injected in the MPI method, and
When the operation mode is the MPI mode in which fuel is injected in the MPI method, it is determined whether the amount of accumulated air introduced into the cylinder of the engine of the vehicle through the sensor module is greater than or equal to a reference amount, and
When the accumulated air amount is greater than or equal to the reference amount, the electronic device controls the cooling device to perform the cooling function.
The method of claim 4,
Further comprising a communication circuit operatively connected to the processor,
The processor,
Receiving information associated with the mode of operation through the communication circuit, and
An electronic device that identifies the operation mode based on the received information.
The method of claim 4,
The processor,
An electronic device that measures an accumulated amount of air flowing into the cylinder of the engine of the vehicle while the engine of the vehicle is operating in the MPI mode through the sensor module.
The temperature of the high-pressure pump among a high-pressure pump for injecting fuel by a gasoline direct injection (GDI) method and a low-pressure pump for injecting fuel by a multi point injection (MPI) method by the processor of the electronic device through the sensor module of the electronic device Monitoring;
Controlling, by the processor, a cooling device of the electronic device to perform a cooling function for cooling the high-pressure pump in response to identifying that the temperature of the high-pressure pump is equal to or higher than a reference temperature; And
In response to identifying, by the processor, that the temperature of the high pressure pump is less than the reference temperature, controlling the cooling device to stop the cooling function for cooling the high pressure pump. .
The method of claim 7,
Monitoring the temperature of the high pressure pump,
And periodically or aperiodically monitoring the temperature of the high-pressure pump through the sensor module while the engine of the processor is running.
The method of claim 7,
Monitoring the temperature of the high pressure pump,
The operation of the electronic device comprising the step of periodically or aperiodically monitoring the temperature of the high pressure pump through the sensor module in response to the processor identifying that a specified time has elapsed since the engine of the vehicle is driven Way.
The method of claim 7,
The step of controlling the cooling device,
If the processor identifies that the temperature of the high-pressure pump is equal to or higher than the reference temperature, determining whether an operation mode of an engine of the vehicle is an MPI mode in which fuel is injected by the MPI method;
When the operation mode is the MPI mode in which fuel is injected using the MPI method, determining, by the processor, whether the accumulated air amount flowing into the cylinder of the engine of the vehicle through the sensor module is greater than or equal to a reference amount; And
And when the accumulated air amount is greater than or equal to the reference amount, controlling, by the processor, the cooling device to perform the cooling function.
The method of claim 10,
Receiving, by the processor, information associated with the operation mode through a communication circuit of the electronic device; And
And identifying, by the processor, the operation mode based on the received information.
The method of claim 10,
And measuring, by the processor, an accumulated amount of air flowing into the cylinder of the engine of the vehicle while the engine of the vehicle is operating in the MPI mode through the sensor module.

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