KR20210047484A - Electroluminescent Display - Google Patents

Abstract

This application relates to an electroluminescent display device. According to this application, the electroluminescent display device includes a substrate, pixels, a first electrode, a bank, a spacer, a spacer dam, an organic light emitting layer, a second electrode, a compensation pattern, and an encapsulation layer. The plurality of pixels are defined in a matrix manner on the substrate. The first electrode is disposed in one pixel. The bank is stacked over the substrate to define an opening area at the first electrode. The spacer is formed over the bank. The spacer dam surrounds the spacer over the bank. The organic light emitting layer is stacked on the opening area. The second electrode is stacked over the bank, the spacer, the spacer dam, and the organic light emitting layer. The compensation pattern covers the spacer over the second electrode. The encapsulation layer covers the second electrode and the compensation pattern. The present invention provides the electroluminescent display device capable of compensating for damage to the spacer due to interference with a screen mask.

Description

Electroluminescent Display {Electroluminescent Display}

This application relates to an electroluminescent display device. In particular, this application relates to an electroluminescent display device having a structure that compensates for the damage when a spacer preventing interference between an element and a screen mask is damaged by the screen mask.

Various types of image display devices such as CRT (Cathode Ray Tube), LCD (Liquid Crystal Display), PDP (Plasma Display Panel), and electroluminescent devices (Luminescent Display) have been developed and developed. As such, various types of display devices are used to display image data of various products such as computers, mobile phones, bank deposit and withdrawal devices (ATM), and vehicle navigation systems according to their respective characteristics.

Particularly, an electroluminescent display device, which is a self-luminous display device, has excellent optical performance such as a viewing angle and color realization, and thus its application field is gradually expanded, and is in the spotlight for an image display device. In the case of an organic electroluminescent display device, the device may be damaged by a screen mask in the process of applying the organic emission layer. In order to solve this problem, spacers are spread over the surface of the display panel to prevent interference between the screen mask and the device.

In this way, interference between the screen mask and the device can be prevented, but the spacer may be damaged by the screen mask. In this case, the shape of the damaged spacer is projected onto the in-cap stacked thereon as it is, and the damaged portion may not be resolved. When used for a long time in such a state, moisture or gas may penetrate through the damaged portion, thereby damaging the organic light-emitting device. Accordingly, there is a need for structural improvement capable of compensating for a damaged portion of the spacer due to interference with the screen mask.

The object of this application is to overcome the problems of the prior art, and to provide an electroluminescent display device capable of compensating for a damaged portion of a spacer due to interference with a screen mask. Another object of this application is to apply compensation patterns on all spacers scattered at a certain density on the substrate to cover the damaged part even if a specific spacer is damaged, so that the damaged part is not projected onto the en-cap layer deposited thereon. It is to provide a light-emitting display device. Another object of this application is to provide an electroluminescent display device having a structure that prevents deterioration of display quality by a damaged portion by limiting a compensation pattern for preventing damage to the spacer to completely cover the spacer.

In order to achieve the above object, the electroluminescent display device according to this application includes a substrate, pixels, a first electrode, a bank, a spacer, a spacer dam, an organic emission layer, a second electrode, a compensation pattern, and an encapsulation layer. A plurality of pixels are defined in a matrix manner on a substrate. The first electrode is disposed on one pixel. The bank is stacked on the substrate to define an opening region in the first electrode. The spacers are formed on the bank. The spacer dam surrounds the spacer on the bank. The organic light emitting layer is laminated in the opening region. The second electrode is stacked on the bank, the spacer, the spacer dam, and the organic light emitting layer. The compensation pattern covers the spacer on the second electrode. The encapsulation layer covers the second electrode and the compensation pattern.

In one example, the compensation pattern includes an organic material.

For example, the compensation pattern is limited to the inner space surrounded by the spacer dam to cover the spacer.

As an example, the compensation pattern is stacked on the damaged portion generated in the spacer and the second electrode exposing the damaged portion to cover the damaged portion.

As an example, the spacer has a columnar shape. The spacer dam has a closed curve shape surrounding the spacer at a predetermined distance from the spacer.

For example, the encapsulation layer includes a cathode electrode, a first inorganic layer covering the compensation pattern, an organic layer stacked on the first inorganic layer, and a second inorganic layer stacked on the organic layer.

For example, the organic emission layer includes any one of a red organic emission layer, a blue organic emission layer, and a green organic emission layer.

For example, the organic light-emitting layer includes an organic light-emitting material that emits white light. It further includes a color filter disposed in one of the upper and lower portions of the organic emission layer.

For example, the substrate may include a display area for displaying an image; And a non-display area surrounding the light emitting area. The spacers and the spacer dams are distributed in the display area and the non-display area at a certain density.

For example, in the display area, light-emitting elements formed by stacking a first electrode, an organic emission layer, and a second electrode are disposed.

As an example, the spacers are disposed one per unit of 4x4 array of pixels.

For example, a driving element disposed in each of the pixels; And a planarization film covering the driving element. The first electrode is disposed on the planarization film and connected to the driving element.

In addition, the electroluminescent display device according to this application includes a substrate, a first electrode, a bank, a spacer, a spacer dam, a compensation pattern, an organic emission layer, and a second electrode. The first electrode is disposed on the substrate. The bank defines an opening area on the first electrode. The spacer is disposed on the bank. The spacer dam surrounds the spacer. The compensation pattern is limited inside the spacer dam to cover the spacer. The organic light-emitting layer is disposed in the opening region. The second electrode is stacked on the organic light-emitting layer.

In one example, the second electrode is deposited over the spacer and spacer dam and under the compensation pattern.

In one example, it further includes an encapsulation layer. The encapsulation layer includes a first inorganic layer stacked on the spacer and the spacer dam, an organic layer on the first inorganic layer, and a second inorganic layer on the organic layer.

For example, the second electrode is stacked on the compensation pattern.

In one example, it further includes an encapsulation layer. The encapsulation layer includes a first inorganic film stacked on the second electrode, an organic film on the first inorganic film, and a second inorganic film on the organic film.

For example, the compensation pattern covers the damaged portion generated in the spacer, and prevents the shape of the damaged portion from being transferred to layers stacked on the compensation pattern.

The electroluminescent display device according to this application has a structure in which spacers are scattered at a preset density so that interference does not occur between a screen mask and an element. In particular, a spacer dam is disposed around the spacer, and a compensation pattern is further provided that is limited to the inner space of the spacer dam to cover the spacer. Therefore, even if the spacer is damaged by the screen mask, the damaged portion has a structure covered by the compensation pattern. As a result, the shape of the damaged portion is not projected onto the encapsulation layer laminated thereon, so that the encapsulation structure and function can be fully maintained. In the display device according to this application, even if the spacer is damaged due to interference between the screen mask and the spacer, the damaged part is compensated with a compensation pattern, thereby preventing the penetration of external foreign substances and improving the function and life of the device. have.

In addition to the effects of this application mentioned above, other features and advantages of this application will be described below, or will be clearly understood by those of ordinary skill in the art from such description and description.

1 is a diagram illustrating a schematic structure of an electroluminescent display device according to an example of this application.
2 is a diagram illustrating a circuit configuration of one pixel constituting an electroluminescent display device according to an example of this application.
3 is a plan view showing a structure of pixels according to an example of this application.
4 is a cross-sectional view of an electroluminescent display device according to the first embodiment of this application, taken along line II′ of FIG. 3.
5 is a comparison diagram illustrating a structure of a display device in the case where there is no compensation pattern in FIG. 4.
6 is a plan view showing an example of the distribution density of a spacer and a spacer dam according to the present invention.
7 is a cross-sectional view of an electroluminescent display device according to a second embodiment of this application, taken along line II′ of FIG. 3.
FIG. 8 is a cross-sectional view of an electroluminescent display device according to a third embodiment of this application, taken along line II′ of FIG. 3.
9 is a cross-sectional view of an electroluminescent display device according to a fourth embodiment of this application, taken along line II′ of FIG. 3.

Advantages and features of this application, and a method of achieving them will become apparent with reference to examples described below in detail together with the accompanying drawings. However, this application is not limited to the examples disclosed below, but will be implemented in a variety of different forms. It is provided to completely inform the scope of the invention to those skilled in the art, and the invention of this application is only defined by the scope of the claims.

The shape, size, ratio, angle, number, etc. disclosed in the drawings for explaining an example of this application are exemplary, and are not limited to the matters shown here. The same reference numerals refer to the same elements throughout the specification. In addition, in describing an example of this application, when it is determined that a detailed description of a related known technology may unnecessarily obscure the subject matter of the application, the detailed description thereof will be omitted.

When'include','have','consists of' and the like mentioned in the specification of this application are used, other parts may be added unless'only' is used. In the case of expressing the constituent elements in the singular, it includes the case of including the plural unless specifically stated otherwise.

In interpreting the constituent elements, it is interpreted as including an error range even if there is no explicit description.

In the case of a description of the positional relationship, for example, if the positional relationship of two parts is described as'upper','upper of','lower of','next to','right' Or, unless'direct' is used, one or more other parts may be located between the two parts.

In the case of a description of a temporal relationship, for example, when a temporal predecessor relationship is described as'after','following','after','before', etc.,'right' or'direct' It may also include cases that are not continuous unless this is used.

First, second, etc. are used to describe various components, but these components are not limited by these terms. These terms are only used to distinguish one component from another component. Accordingly, the first constituent element mentioned below may be a second constituent element within the technical idea of this application.

The term “at least one” is to be understood as including all possible combinations from one or more related items. For example, the meaning of “at least one of the first item, the second item, and the third item” means that each of the first item, the second item, or the third item, as well as the first item, the second item, and the third item, It may mean a combination of all items that can be presented from more than one.

Each of the features of the various examples of this application can be partially or completely combined or combined with each other, technically various interlocking and driving are possible, and each of the examples can be implemented independently of each other or can be implemented together in an association relationship. .

Hereinafter, various structures of the display device according to this application will be described in detail with reference to the accompanying drawings. In adding reference numerals to elements of each drawing, the same elements may have the same numerals as possible even if they are indicated on different drawings.

1 is a diagram showing a schematic structure of an electroluminescent display device according to this application. In FIG. 1, the X axis represents a direction parallel to the scan wiring, the Y axis represents a direction parallel to the data wiring, and the Z axis represents the height direction of the display device.

Referring to FIG. 1, the electroluminescent display device according to this application includes a substrate 110, a gate (or scan) driver 200, a data pad part 300, a source driving integrated circuit 410, and a flexible film 430. , A circuit board 450, and a timing controller 500.

The substrate 110 may include an insulating material or a material having flexibility. The substrate 110 may be made of glass, metal, or plastic, but is not limited thereto. When the electroluminescent display device is a flexible display device, the substrate 110 may be made of a flexible material such as plastic. For example, it may include a transparent polyimide material.

The substrate 110 may be divided into a display area DA and a non-display area NDA. The display area DA is an area in which an image is displayed, and may be defined in most areas including the central portion of the substrate 110, but is not limited thereto. Scan lines (or gate lines), data lines, and pixels are formed in the display area DA. The pixels include a plurality of sub-pixels, and each of the plurality of sub-pixels includes scan lines and data lines.

The non-display area NDA is an area in which an image is not displayed, and may be defined at an edge portion of the substrate 110 so as to surround all or part of the display area DA. A gate driving part 200 and a data pad part 300 may be formed in the non-display area NDA.

The gate driver 200 supplies scan (or gate) signals to scan lines according to a gate control signal input from the timing controller 500. The gate driver 200 may be formed in a non-display area NDA outside one side of the display area DA of the base substrate 110 in a GIP (gate driver in panel) method. The GIP method refers to a structure in which a gate driver 200 including a thin film transistor and a capacitor is directly formed on the substrate 110.

The data pad unit 300 supplies data signals to data lines according to a data control signal input from the timing controller 500. The data pad unit 300 is manufactured as a driving chip and mounted on the flexible film 430, and is mounted on the non-display area NDA outside one side of the display area DA of the substrate 110 in a TAB (tape automated bonding) method. Can be attached.

The source driving integrated circuit 410 receives digital video data and a source control signal from the timing controller 500. The source driving integrated circuit 410 converts digital video data into analog data voltages according to a source control signal and supplies them to data lines. When the source driving integrated circuit 410 is manufactured as a chip, it may be mounted on the flexible film 430 in a chip on film (COF) or chip on plastic (COP) method.

Wires connecting the data pad part 300 and the source driving integrated circuit 410 and wires connecting the data pad part 300 and the circuit board 450 may be formed on the flexible film 430. The flexible film 430 is attached on the data pad unit 300 using an anisotropic conducting film, whereby the data pad unit 300 and the wires of the flexible film 430 may be connected.

The circuit board 450 may be attached to the flexible films 430. The circuit board 450 may mount a plurality of circuits implemented with driving chips. For example, the timing controller 500 may be mounted on the circuit board 450. The circuit board 450 may be a printed circuit board or a flexible printed circuit board.

The timing controller 500 receives digital video data and a timing signal from an external system board through a cable of the circuit board 450. The timing controller 500 generates a gate control signal for controlling the operation timing of the gate driver 200 and a source control signal for controlling the source driving integrated circuits 410 based on the timing signal. The timing controller 500 supplies a gate control signal to the gate driver 200 and supplies a source control signal to the source driving integrated circuits 410. Depending on the product, the timing controller 500 may be formed of the source driving integrated circuit 410 and one driving chip and mounted on the substrate 110.

2 is a diagram showing a circuit configuration of one pixel constituting the electroluminescent display device according to this application. 3 is a plan view showing a structure of pixels according to this application. In FIGS. 2 to 3, an organic light emitting display device, which is a type of electroluminescent display device, will be described as an example.

2 to 3, one pixel of the organic light emitting display device is defined by a scan line SL, a data line DL, and a driving current line VDD. Also, one pixel may include a circuit area CA and a light emitting area EA. The circuit area CA of one pixel of the organic light emitting display device includes a switching thin film transistor ST, a driving thin film transistor DT, a light emitting element OLE, an auxiliary capacitor Cst, and various wires.

For example, the switching thin film transistor ST may be disposed at a portion where the scan line SL and the data line DL cross each other. The switching thin film transistor ST includes a switching gate electrode SG, a switching source electrode SS, and a switching drain electrode SD. The switching gate electrode SG is connected to the scan line SL. The switching source electrode SS is connected to the data line DL, and the switching drain electrode SD is connected to the driving thin film transistor DT. For example, the switching source electrode SS has a structure branched from the data line DL, and the switching drain electrode SD is the driving gate electrode DG of the driving thin film transistor DT through the drain contact hole DH. Is connected with. The switching thin film transistor ST serves to select a pixel to be driven by applying a data signal to the driving thin film transistor DT.

The driving thin film transistor DT serves to drive the light emitting element OLE of a pixel selected by the switching thin film transistor ST. The driving thin film transistor DT includes a driving gate electrode DG, a driving source electrode DS, and a driving drain electrode DD. The driving gate electrode DG is connected to the switching drain electrode SD of the switching thin film transistor ST. The driving source electrode DS is connected to the driving current line VDD, and the driving drain electrode DD is connected to the first electrode or the anode electrode ANO of the light emitting element OLE. For example, the driving source electrode DS has a structure branched from the driving current line VDD, and the driving drain electrode DD is connected to the anode electrode ANO through the pixel contact hole PH. An auxiliary capacitor Cst is disposed between the driving gate electrode DG of the driving thin film transistor DT and the anode electrode ANO of the light emitting element OLE.

The driving thin film transistor DT is disposed between the driving current line VDD and the light emitting element OLE. The high potential voltage for driving the light emitting element OLE is applied to the driving current line VDD. The driving thin film transistor DT adjusts the amount of current flowing from the driving current line VDD to the light emitting element OLE according to the magnitude of the voltage of the gate electrode connected to the drain electrode of the switching thin film transistor ST.

The light emitting device OLE may include either an organic light emitting diode or an inorganic light emitting diode. For example, in the case of an organic light emitting diode, the light emitting element OLE includes an anode electrode ANO, an organic light emitting layer OL, and a cathode electrode CAT. The light emitting device OLE emits light according to a current controlled by the driving thin film transistor DT. In other words, since the light emission amount of the light emitting element OLE is adjusted according to the current controlled by the driving thin film transistor DT, the luminance of the electroluminescent display device can be adjusted. The anode electrode ANO of the light emitting element OLE is connected to the driving drain electrode DD of the driving thin film transistor DT. Meanwhile, the cathode electrode CAT, which is the second electrode, is connected to the low power wiring VSS to which the low potential voltage is supplied. That is, the light emitting device OLE is driven by a low potential voltage and a high potential voltage controlled by the driving thin film transistor DT.

Hereinafter, various embodiments of the electroluminescent display device according to this application will be described with reference to various cross-sectional views showing the cross-sectional structure of the electroluminescent display device according to this application.

<First embodiment>

With further reference to Fig. 4, the first embodiment of this application will be described. 4 is a cross-sectional view of an electroluminescent display device according to the first embodiment of this application, taken along line II′ of FIG. 3. Reference numerals not shown in FIG. 4 refer to reference numerals described in FIGS. 1 to 3.

Referring to FIG. 4, the display device according to the first exemplary embodiment of this application may be most suitably applied when implemented in a top emission (top emission) method. However, it is not necessarily limited thereto, and may be implemented in a bottom emission (bottom emission) method. The display device according to the first embodiment includes a substrate SUB, a device layer 200, and an encapsulation layer ENC.

The substrate SUB includes a display area DA and a non-display area NDA surrounding the display area DA. The display area DA of the substrate SUB may include a circuit area CA and a light emitting area EA. The circuit area CA of the substrate SUB may include a driving circuit for driving the light emitting element OLE, and the driving circuit may include at least one thin film transistor. For example, the driving circuit may include a driving transistor DT and at least one switching transistor ST.

The light emitting area EA of the substrate SUB may include a light emitting element OLE that generates light by a driving circuit. According to an example, the emission area EA may correspond to an opening area formed in each of the plurality of pixels defined by the bank BA.

The device layer 200 may be stacked on the upper surface of the substrate SUB. The device layer 200 may include a driving device layer 210 and a light emitting device layer 220. A driving thin film transistor DT and a switching thin film transistor ST as described in FIGS. 2 and 3 may be formed on the driving element layer 210. A light-emitting element OLE may be formed on the light-emitting element layer 220.

The switching thin film transistor ST and the driving thin film transistor DT may be disposed in the circuit area CA. According to an example, the switching thin film transistor ST may include a switching semiconductor layer SA, a switching gate electrode SG, a switching drain electrode SD, and a switching source electrode SS. In addition, the driving thin film transistor DT may include a driving semiconductor layer DA, a driving gate electrode DG, a driving drain electrode DD, and a driving source electrode DS.

The switching gate electrode SG and the driving gate electrode DG may be provided in the circuit area CA of the substrate SUB. The gate electrodes SA and DA are disposed on the substrate SUB. A gate insulating layer GI may be stacked on the gate electrodes SA and DA to cover the entire substrate SUB. The switching semiconductor layer SA and the driving semiconductor layer DA may be disposed on the gate insulating layer GI to overlap the switching gate electrode SG and the driving gate electrode DG, respectively. The gate insulating layer GI may insulate the semiconductor layers SA and DA from the gate electrodes SG and DG. The gate insulating layer GI may be formed of an inorganic insulating material, for example, a single thin film including silicon oxide (SiO2), silicon nitride (SiNx), and silicon oxynitride (SiON), or multiple thin films thereof. Not limited.

The semiconductor layers SA and DA may directly contact the source electrodes SS and DS and the drain electrodes SD and DD, and may face each other with the gate electrodes SG and DG and the gate insulating layer GI interposed therebetween.

The drain electrodes SD and DD and the source electrodes SS and DS may be provided to be spaced apart from each other on the gate insulating layer GI and the semiconductor layers SA and DA. The drain electrodes SD and DD may contact one end of the semiconductor layers SA and DA, and the source electrodes SS and DS may contact the other ends of the semiconductor layers SA and DA.

A flat protective layer PL is stacked on the entire surface of the substrate SUB on which the drain electrodes SD and DD and the source electrodes SS and DS are formed. The flat protective layer PL may function to protect the source electrodes SS and DS, the drain electrodes SD and DD, and the semiconductor layers SA and DA. The planarization passivation layer PL may include a pixel contact hole PH through which the anode electrode ANO passes. Although not shown in the drawing, a protective film made of an inorganic material is further stacked under the flat protective layer PL to protect the source electrodes (SS, DS), drain electrodes (SD, DD), and the semiconductor layers (SA, DA). May be.

A flat protective layer PL is stacked on the thin film transistors ST and DT to cover the entire substrate SUB. An anode electrode ANO is formed on the flat protective layer PL. The anode electrode ANO is connected to the drain electrode DD of the driving thin film transistor DT through the pixel contact hole PH formed in the flat protective layer PL.

A bank BA is formed on the anode electrode ANO. The bank BA opens an opening area, which is the central part of the anode electrode ANO, and defines the light emission area EA by covering the edge area. That is, the opening area opened by the bank BA is defined as the light emitting area EA.

The bank BA may be disposed on the flat protective layer PL in the circuit area CA. According to an example, the bank BA is disposed between the emission areas EA of each of the plurality of pixels, so that the emission area EA of each of the plurality of pixels may be defined. For example, the bank BA may cover a part of the anode electrode ANO, and the other part of the anode electrode ANO, which is not covered by the bank BA, covers the light emitting area EA of each of the plurality of pixels. Can be exposed through.

A spacer SP is disposed on the bank BA. Further, a spacer dam SPD is disposed around the spacer SP. The spacer dam SPD may be spaced apart from the spacer SP by a predetermined distance and may have a closed curve shape surrounding the periphery.

The organic emission layer OL is stacked in the opening area defined by the bank BA. The organic emission layer OL may be divided and disposed for each pixel. For example, a red organic emission layer may be disposed on a red pixel, a green organic emission layer may be disposed on a green pixel, and a blue organic emission layer may be disposed on a blue pixel.

In this way, when the organic emission layer OL representing a unique color for each pixel is disposed, a screen mask may be used. In the process of disposing the screen mask on the substrate SUB and depositing the organic emission layer, the screen mask may contact the surface of the substrate SUB, thereby damaging the device. To prevent this, the spacer SP is disposed on the bank BA.

Interference with an element in which the screen mask is formed on the surface of the substrate SUB may be prevented by the spacer SP. However, the spacer SP may be damaged during contact with the screen mask. For example, as illustrated in FIG. 4, a damaged portion ERR may be generated in the spacer SP.

A cathode electrode CAT, which is a second electrode, may be stacked on the organic emission layer OL. The cathode electrode CAT may not be classified for each pixel and may be implemented in the form of a sheet electrode common to all pixels. According to an example, the cathode electrode CAT may be made of a transparent conductive oxide (TCO) such as indium tin oxide (ITO) or indium zinc oxide (IZO).

The cathode electrode CAT may be deposited with an inorganic material to have a very thin thickness. Accordingly, as illustrated in FIG. 4, the damaged part ERR generated in the spacer SP may not be completely covered, and the shape of the damaged part ERR may be reflected and exposed as it is.

The compensation pattern IK is covered on the spacer SP. The compensation pattern IK may be disposed so as to have a shape that is limited to the space inside the spacer dam SPD and completely covers the spacer SP. As an example, when a liquid organic material is dropped on the spacer SP using an ink jet device, the organic material is limited to be limited to the spacer SP by the spacer dam SPD and completely covers the spacer SP. It can be applied so as to. Thereafter, as the liquid organic material is cured, the compensation pattern IK is completed. In this case, as illustrated in FIG. 4, even if the damaged portion IK generated in the spacer SP is not covered by the cathode electrode CAT, it may have a structure completely covered by the compensation pattern IK.

An encapsulation layer ENC may be stacked on the device layer 200 including the cathode electrode CAT and the compensation pattern IK, particularly on the light emitting device layer 220. The encapsulation layer ENC is a structure for preventing moisture or air from penetrating into the light emitting device OLE. For example, the encapsulation layer ENC may have a structure in which a first inorganic layer PA1, an organic layer PCL, and a second inorganic layer PA2 are sequentially stacked. Specifically, the first inorganic layer PA1 may be deposited on the cathode electrode CAT and the compensation pattern IK. The first inorganic layer PA1 may include silicon oxide (SiOx) or silicon nitride (SiNx). Each of the first inorganic layer and the second inorganic layer may be formed of a single layer, or may have a structure in which several inorganic layers are stacked.

The electroluminescent display device according to the first embodiment of this application has a structure in which the compensation pattern IK covers the spacer SP. Even if the damaged part ERR occurs in the spacer SP, the damaged part ERR does not affect the encapsulation layer ENC stacked after that because the compensation pattern IK completely covers the damaged part ERR. can not do it. As a result, the function of the encapsulation layer ENC is completely guaranteed, so that foreign substances can be completely prevented from penetrating from the outside.

Hereinafter, with reference to FIG. 5, a problem that may occur in the electroluminescent display device due to the case in which the compensation pattern IK is not provided unlike this application will be described. 5 is a comparison diagram illustrating a structure of a display device in the case where there is no compensation pattern in FIG. 4. The structure of the electroluminescent display device shown in FIG. 5 is basically the same as that of the electroluminescent display device according to this application shown in FIG. 4. Therefore, the same description will be omitted.

The difference is that the compensation pattern IK is not provided. For example, a damaged portion ERR may occur in the spacer SP. A cathode electrode CAT is stacked on the spacer SP. The cathode electrode CAT may include a metal material or a transparent conductive material. This conductive material is an inorganic material and is deposited to a very thin thickness. Accordingly, the cathode electrode CAT cannot cover the damaged portion ERR, and the shape of the damaged portion ERR is projected or reproduced as it is on the cathode electrode CAT.

By depositing the cathode electrode CAT, the device layer 200 is completed. An encapsulation layer ENC is stacked on the device layer 200. The encapsulation layer ENC includes a first inorganic layer PA1, an organic layer PCL, and a second inorganic layer PA2. The first inorganic layer PA1 is stacked on the cathode electrode CAT. The first inorganic layer PA1 is also deposited to a thin thickness. Accordingly, the first inorganic layer PA1 also cannot cover the damaged portion ERR, and the shape of the damaged portion ERR may be projected or reproduced as it is on the first inorganic layer PA1.

An organic layer PCL is applied on the first inorganic layer PA1. The organic film (PCL) is applied to a fairly thick thickness so that it can completely cover when an external material penetrates. Accordingly, the organic layer PCL may completely cover the damaged portion ERR. After that, a second inorganic layer PA2 is deposited on the organic layer PCL. In such a structure, since the damaged portion ERR generated in the spacer SP is exposed by the first inorganic film PA1, moisture may penetrate into this portion. As a result, moisture may penetrate into the light emitting device OLE under the encapsulation layer ENC, thereby damaging the device.

5 and 4, in the electroluminescent display according to this application, the compensation pattern IK covers the spacer SP, and the encapsulation layer ENC is stacked on the compensation pattern IK, so that the encapsulation layer ( ERR does not occur in ENC). Accordingly, the function of the encapsulation layer ENC is maintained intact, and penetration of moisture from the outside can be completely prevented.

Hereinafter, a distribution structure of the spacer SP and the spacer dam SPD in the electroluminescent display device according to this application will be described with reference to FIG. 6. 6 is a plan view showing an example of the distribution density of a spacer and a spacer dam according to the present invention.

Referring to FIG. 6, the electroluminescent display device according to this application includes a plurality of pixels PXL arranged on a substrate SUB in a matrix manner. One light-emitting element OLE is disposed in one pixel PXL. Although not shown in FIG. 6, as shown in FIG. 3, a switching thin film transistor ST and a driving thin film transistor DT may be included in one pixel PXL. The bank BA is covered in a portion of the pixel PXL excluding the light emitting element OLE. A spacer SP, a spacer dam SPD, and a compensation pattern IK are disposed on the bank BA.

The spacer SP may have a circular column shape. However, it is not limited thereto, and may have a polygonal column shape. In addition, the size of the bottom and the top may have the same column shape, and the size of the top surface may have a trapezoidal column shape that is larger than the size of the bottom surface.

The spacer dam SPD may have a closed curve shape that completely surrounds the spacer SP by being spaced apart from the spacer SP by a predetermined distance. The spacer dam SPD may have the same closed curve shape as the outer shape of the spacer SP. However, the present invention is not limited thereto, and may have a circular or polygonal shape regardless of the outer shape of the spacer SP. The spacer dam SPD may have a height lower than that of the spacer SP.

The compensation pattern IK is formed in the inner region of the spacer dam SPD. The position of the compensation pattern IK is limited by the spacer dam SPD, and has a shape that completely covers the spacer SP.

The spacer SP, the spacer dam SPD, and the compensation pattern IK are disposed on the substrate SUB in a predetermined density distribution. For example, the spacer SP, the spacer dam SPD, and the compensation pattern IK may be disposed one by one for each 4X4 pixel unit based on the pixel density. As shown in FIG. 5, when only the spacer SP is disposed, when the spacer SP interferes with the screen mask, it is highly likely to be completely separated. However, since the spacer SP according to this application is surrounded by the spacer dam SPD, it is not completely separated and may have a robust structure. In addition, afterwards, the spacer SP may be fixed and protected inside the spacer dam SPD by the compensation pattern IK. Accordingly, in the electroluminescent display according to this application, since the loss of the spacer SP is small, the distribution density of the spacer SP can be lowered. For example, in the structure shown in FIG. 5, one must be disposed per 2X2 pixel unit based on the pixel density, but this application may be disposed one per 4X4 pixel unit as shown in FIG. 6.

<Second Example>

With reference to Fig. 7, a second embodiment of this application will be described. 7 is a cross-sectional view of an electroluminescent display device according to a second embodiment of this application, taken along line II′ of FIG. 3. Reference numerals not shown in FIG. 7 refer to reference numerals described in FIGS. 1 to 3.

Referring to FIG. 7, the display device according to the second exemplary embodiment of this application may be suitably applied when implemented in a top emission (top emission) method. The display device according to the second embodiment includes a substrate SUB, a device layer 200, and an encapsulation layer ENC.

The substrate SUB includes a display area DA and a non-display area NDA surrounding the display area DA. The display area DA of the substrate SUB may include a circuit area CA and a light emitting area EA. The circuit area CA of the substrate SUB may include a driving circuit for driving the light emitting element OLE, and the driving circuit may include at least one thin film transistor. For example, the driving circuit may include a driving transistor DT and at least one switching transistor ST.

The light emitting area EA of the substrate SUB may include a light emitting element OLE that generates light by a driving circuit. According to an example, the emission area EA may correspond to an opening area formed in each of the plurality of pixels defined by the bank BA.

The device layer 200 may be stacked on the upper surface of the substrate SUB. The device layer 200 may include a driving device layer 210 and a light emitting device layer 220. A driving thin film transistor DT and a switching thin film transistor ST as described in FIGS. 2 and 3 may be formed on the driving element layer 210. A light-emitting element OLE may be formed on the light-emitting element layer 220.

Hereinafter, detailed descriptions of the switching thin film transistor ST and the driving thin film transistor DT are the same as those of the first embodiment, and thus redundant descriptions will be omitted.

A flat protective layer PL is stacked on the thin film transistors ST and DT to cover the entire substrate SUB. An anode electrode ANO is formed on the flat protective layer PL. The anode electrode ANO is connected to the drain electrode DD of the driving thin film transistor DT through the pixel contact hole PH formed in the flat protective layer PL.

A bank BA is formed on the anode electrode ANO. The bank BA opens an opening area, which is the central part of the anode electrode ANO, and defines the light emission area EA by covering the edge area. That is, the opening area opened by the bank BA is defined as the light emitting area EA.

The bank BA may be disposed on the flat protective layer PL in the circuit area CA. According to an example, the bank BA is disposed between the emission areas EA of each of the plurality of pixels, so that the emission area EA of each of the plurality of pixels may be defined. For example, the bank BA may cover a part of the anode electrode ANO, and the other part of the anode electrode ANO, which is not covered by the bank BA, covers the light emitting area EA of each of the plurality of pixels. Can be exposed through.

A spacer SP is disposed on the bank BA. Further, a spacer dam SPD is disposed around the spacer SP. The spacer dam SPD may be spaced apart from the spacer SP by a predetermined distance and may have a closed curve shape surrounding the periphery.

The organic emission layer OL is stacked in the opening area defined by the bank BA. The organic emission layer OL may be divided and disposed for each pixel. For example, a red organic emission layer may be disposed on a red pixel, a green organic emission layer may be disposed on a green pixel, and a blue organic emission layer may be disposed on a blue pixel.

In this way, when the organic emission layer OL representing a unique color for each pixel is disposed, a screen mask may be used. In the process of disposing the screen mask on the substrate SUB and depositing the organic emission layer, the screen mask may contact the surface of the substrate SUB, thereby damaging the device. To prevent this, the spacer SP is disposed on the bank BA.

Interference with an element in which the screen mask is formed on the surface of the substrate SUB may be prevented by the spacer SP. However, the spacer SP may be damaged during contact with the screen mask. For example, as illustrated in FIG. 7, a damaged portion ERR may be generated in the spacer SP.

The compensation pattern IK is covered on the spacer SP. The compensation pattern IK may be disposed so as to have a shape that is limited to the space inside the spacer dam SPD and completely covers the spacer SP. As an example, when a liquid organic material is dropped on the spacer SP using an ink jet device, the organic material is limited to be limited to the spacer SP by the spacer dam SPD and completely covers the spacer SP. It can be applied so as to be. Thereafter, as the liquid organic material is cured, the compensation pattern IK is completed. In this case, as shown in FIG. 7, the damaged portion IK generated in the spacer SP may have a structure completely covered by the compensation pattern IK.

A second electrode, a cathode electrode CAT, may be stacked on the entire surface of the substrate SUB on which the bank BA, the spacer dam SPD, the compensation pattern IK, and the organic emission layer OL are disposed. The cathode electrode CAT may not be classified for each pixel and may be implemented in the form of a sheet electrode common to all pixels. According to an example, the cathode electrode CAT may be made of a transparent conductive oxide (TCO) such as indium tin oxide (ITO) or indium zinc oxide (IZO).

Since the cathode electrode CAT is deposited on the compensation pattern IK, even if there is a damaged part ERR in the spacer SP, it is not affected by the damaged part ERR, and is formed in a state of an intact thin film. .

An encapsulation layer ENC may be stacked on the device layer 200 including the cathode electrode CAT, particularly on the light emitting device layer 220. The encapsulation layer ENC is a structure for preventing moisture or air from penetrating into the light emitting device OLE. For example, the encapsulation layer ENC may have a structure in which a first inorganic layer PA1, an organic layer PCL, and a second inorganic layer PA2 are sequentially stacked. Specifically, the first inorganic layer PA1 may be deposited on the cathode electrode CAT covering the compensation pattern IK. The first inorganic layer PA1 may include silicon oxide (SiOx) or silicon nitride (SiNx). Each of the first inorganic layer and the second inorganic layer may be formed of a single layer, or may have a structure in which several inorganic layers are stacked.

The electroluminescent display device according to the second exemplary embodiment of the present application has a structure in which the compensation pattern IK covers the spacer SP. Even if the damaged part ERR occurs in the spacer SP, the compensation pattern IK completely covers the damaged part ERR, so that the damaged part ( ERR) has no effect. As a result, the function of the encapsulation layer ENC is completely guaranteed, so that foreign substances can be completely prevented from penetrating from the outside.

In the embodiments of this application described so far, a case in which a light emitting layer of a unique color is separated and deposited for each pixel unit has been described. However, this application is not limited to this case, and can also be applied to the case of depositing an organic light emitting material that emits white light on the entire substrate.

When an organic emission layer that emits white light is stacked, a screen mask may be used to open the entire display area DA and cover the non-display area NDA. Even in this case, the screen mask covering the non-display area NDA interferes with the devices on the substrate, and the devices may be damaged. In order to prevent such damage, the spacer SP, the spacer dam SPD, and the compensation pattern IK may be disposed in the non-display area NDA. In this structure, a color filter (not shown) may be further disposed above or below the light emitting element OLE.

Of course, even in the case described above, in order to prevent the screen mask from interfering with the non-display area NDA, a spacer SP, a spacer dam SPD, and a compensation pattern are provided in both the display area DA and the non-display area NDA. (IK) can be placed.

<Third Example>

Hereinafter, a third embodiment of this application will be described with reference to FIG. 8. FIG. 8 is a cross-sectional view of an electroluminescent display device according to a third embodiment of this application, taken along line II′ of FIG. 3. 8 shows in detail a specific stacked structure of the organic emission layer OL. Other structures are the same as those of the first embodiment, and thus redundant descriptions are omitted.

Referring to FIG. 8, a device layer 200 may be stacked on the upper surface of the substrate SUB. The device layer 200 may include a driving device layer 210 and a light emitting device layer 220. A driving thin film transistor DT and a switching thin film transistor ST as described in FIGS. 2 and 3 may be formed on the driving element layer 210. A light-emitting element OLE may be formed on the light-emitting element layer 220.

A flat protective layer PL is stacked on the thin film transistors ST and DT to cover the entire substrate SUB. An anode electrode ANO is formed on the flat protective layer PL. The anode electrode ANO is connected to the drain electrode DD of the driving thin film transistor DT through the pixel contact hole PH formed in the flat protective layer PL.

A bank BA is formed on the anode electrode ANO. The bank BA opens an opening area, which is the central part of the anode electrode ANO, and defines the light emission area EA by covering the edge area. That is, the opening area opened by the bank BA is defined as the light emitting area EA.

A spacer SP is disposed on the bank BA. Further, a spacer dam SPD is disposed around the spacer SP. The spacer dam SPD may be spaced apart from the spacer SP by a predetermined distance and may have a closed curve shape surrounding the periphery.

In the opening area defined by the bank BA, a hole injection layer HIL, a hole transport layer HTL, and an organic emission layer OL are disposed for each pixel. In this case, a screen mask can be used. In the process of placing the screen mask on the substrate SUB and sequentially depositing the hole injection layer HIL, the hole transport layer HTL, and the organic light emitting layer OL, the screen mask contacts the surface of the substrate SUB, causing the device to It can be damaged. To prevent this, the spacer SP is disposed on the bank BA.

Interference with an element in which the screen mask is formed on the surface of the substrate SUB may be prevented by the spacer SP. However, the spacer SP may be damaged during contact with the screen mask. For example, as illustrated in FIG. 8, a damaged portion ERR may be generated in the spacer SP.

After removing the screen mask, subsequent layers commonly stacked on the entire surface of the substrate SUB may be formed. For example, the electron transport layer ETL, the electron injection layer EIL, and the cathode CAT may be sequentially stacked.

As a result, the electron transport layer ETL, the electron injection layer EIL, and the cathode CAT are stacked on the spacer SP where the damaged part ERR has occurred, but as shown in FIG. 8, the damaged part ERR is completely It is not covered and can be exposed.

However, the compensation pattern IK is covered on the spacer SP. The compensation pattern IK may be disposed so as to have a shape that is limited to the space inside the spacer dam SPD and completely covers the spacer SP. As an example, when a liquid organic material is dropped on the spacer SP using an ink jet device, the organic material is limited to be limited to the spacer SP by the spacer dam SPD and completely covers the spacer SP. It can be applied so as to. Thereafter, as the liquid organic material is cured, the compensation pattern IK is completed. Accordingly, as illustrated in FIG. 8, the damaged portion ERR generated in the spacer SP may have a structure completely covered by the compensation pattern IK.

An encapsulation layer ENC may be stacked on the device layer 200, in particular, on the light emitting device layer 220. The encapsulation layer ENC is a structure for preventing moisture or air from penetrating into the light emitting device OLE. For example, the encapsulation layer ENC may have a structure in which a first inorganic layer PA1, an organic layer PCL, and a second inorganic layer PA2 are sequentially stacked. Specifically, the first inorganic layer PA1 may be deposited on the compensation pattern IK and the cathode CAT. The first inorganic layer PA1 may include silicon oxide (SiOx) or silicon nitride (SiNx). Each of the first inorganic layer and the second inorganic layer may be formed of a single layer, or may have a structure in which several inorganic layers are stacked.

The electroluminescent display according to the third embodiment of this application has a structure in which the compensation pattern IK covers the spacer SP. Even if the damaged part ERR occurs in the spacer SP, the damaged part ERR does not affect the encapsulation layer ENC stacked after that because the compensation pattern IK completely covers the damaged part ERR. can not do it. As a result, the function of the encapsulation layer ENC is completely guaranteed, so that foreign substances can be completely prevented from penetrating from the outside.

Although not shown in the drawings, a specific stacked structure of the light emitting device OLE according to the third embodiment of this application may also be applied to the second embodiment.

<Fourth embodiment>

Hereinafter, a fourth embodiment of this application will be described with reference to FIG. 9. 9 is a cross-sectional view of an electroluminescent display device according to a fourth exemplary embodiment of this application, taken along line II′ of FIG. 3. 9 shows in detail a specific stacked structure of the organic emission layer OL. Other structures are the same as those of the first embodiment, and thus redundant descriptions are omitted.

Referring to FIG. 9, a device layer 200 may be stacked on the upper surface of the substrate SUB. The device layer 200 may include a driving device layer 210 and a light emitting device layer 220. A driving thin film transistor DT and a switching thin film transistor ST as described in FIGS. 2 and 3 may be formed on the driving element layer 210. A light-emitting element OLE may be formed on the light-emitting element layer 220.

A flat protective layer PL is stacked on the thin film transistors ST and DT to cover the entire substrate SUB. An anode electrode ANO is formed on the flat protective layer PL. The anode electrode ANO is connected to the drain electrode DD of the driving thin film transistor DT through the pixel contact hole PH formed in the flat protective layer PL.

A bank BA is formed on the anode electrode ANO. The bank BA opens an opening area, which is the central part of the anode electrode ANO, and defines the light emission area EA by covering the edge area. That is, the opening area opened by the bank BA is defined as the light emitting area EA.

A spacer SP is disposed on the bank BA. Further, a spacer dam SPD is disposed around the spacer SP. The spacer dam SPD may be spaced apart from the spacer SP by a predetermined distance and may have a closed curve shape surrounding the periphery.

An organic emission layer OL is disposed for each pixel in the opening area defined by the bank BA. In this case, a screen mask can be used. In the process of disposing the screen mask on the substrate SUB and depositing the organic emission layer OL, the screen mask may contact the surface of the substrate SUB, thereby damaging the device. To prevent this, the spacer SP is disposed on the bank BA.

Interference with an element in which the screen mask is formed on the surface of the substrate SUB may be prevented by the spacer SP. However, the spacer SP may be damaged during contact with the screen mask. For example, as illustrated in FIG. 9, a damaged portion ERR may be generated in the spacer SP.

After removing the screen mask, a cathode CAT and a capping layer CPL may be sequentially stacked on the entire surface of the substrate SUB. The capping layer CPL may be a functional layer added in an organic light emitting display device for various purposes. For example, in the case of the top emission type, the anode ANO uses a light reflecting material. In this case, light generated from the light-emitting layer OL is reflected by the anode ANO and is emitted in the direction of the cathode CAT. In this case, there may be a case in which light of a specific wavelength is re-reflected from the surface of the cathode CAT and disappears. In such a case, a transparent high refractive layer is stacked on the cathode CAT, and the re-reflected light is reused by using the micro-cavity effect, thereby improving light luminance. As another example, the cathode CAT is formed to have a very thin thickness, and a capping layer CPL may be formed for the purpose of supplementing a weak portion of the cathode CAT or protecting it from foreign substances in a subsequent process.

Although the cathode CAT and the capping layer CPL are stacked on the spacer SP where the damaged part ERR has occurred, the damaged part ERR may not be completely covered and exposed as shown in FIG. 9. However, the compensation pattern IK is covered on the spacer SP. The compensation pattern IK may be disposed so as to have a shape that is limited to the space inside the spacer dam SPD and completely covers the spacer SP. As an example, when a liquid organic material is dropped on the spacer SP using an ink jet device, the organic material is limited to be limited to the spacer SP by the spacer dam SPD and completely covers the spacer SP. It can be applied so as to. Thereafter, as the liquid organic material is cured, the compensation pattern IK is completed. Therefore, as shown in FIG. 9, the damaged portion ERR that occurs in the spacer SP and is not covered by the cathode CAT and the capping layer CPL, is completely covered by the compensation pattern IK. Can have a structure.

An encapsulation layer ENC may be stacked on the device layer 200, in particular, on the light emitting device layer 220. The encapsulation layer ENC is a structure for preventing moisture or air from penetrating into the light emitting device OLE. For example, the encapsulation layer ENC may have a structure in which a first inorganic layer PA1, an organic layer PCL, and a second inorganic layer PA2 are sequentially stacked. Specifically, the first inorganic layer PA1 may be deposited on the compensation pattern IK and the capping layer CPL. The first inorganic layer PA1 may include silicon oxide (SiOx) or silicon nitride (SiNx). Each of the first inorganic layer and the second inorganic layer may be formed of a single layer, or may have a structure in which several inorganic layers are stacked.

The electroluminescent display according to the third embodiment of this application has a structure in which the compensation pattern IK covers the spacer SP. Even if the damaged part ERR occurs in the spacer SP, the damaged part ERR does not affect the encapsulation layer ENC stacked after that because the compensation pattern IK completely covers the damaged part ERR. can not do it. As a result, the function of the encapsulation layer ENC is completely guaranteed, so that foreign substances can be completely prevented from penetrating from the outside.

Although not shown in the drawings, the structure further including the capping layer CPL on the cathode CAT described in the fourth embodiment of this application may also be applied to the second and third embodiments.

Features, structures, effects, and the like described in the examples of this application described above are included in at least one example of this application, and are not necessarily limited to only one example. Furthermore, the features, structures, effects, and the like illustrated in at least one example of this application may be combined or modified for other examples by a person having ordinary knowledge in the field to which this application belongs. Accordingly, contents related to such combinations and modifications should be construed as being included in the scope of this application.

This application described above is not limited to the above-described embodiment and the accompanying drawings, and that various substitutions, modifications and changes are possible within the scope of the technical matters of this application. It will be obvious to those who have the knowledge of. Therefore, the scope of this application is indicated by the claims to be described later, and all changes or modified forms derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of this application.

SUB: substrate 200: element layer
ENC: Encapsulation layer OLE: Light-emitting element
ST: switching thin film transistor DT: driving thin film transistor
ANO: first electrode (anode electrode) OL: light-emitting layer
CAT: second electrode (cathode electrode) CF: color filter
P: Pixel EA: Light-emitting area
CA: Circuit area SP: Spacer
SPD: Spacer Dam IK: Compensation Pattern

Claims (18)

A plurality of pixels defined in a matrix manner on the substrate;
A first electrode disposed on one of the pixels;
A bank stacked on the substrate to define an opening area in the first electrode;
A spacer formed on the bank;
A spacer dam surrounding the spacer on the bank;
An organic emission layer stacked on the opening area;
A second electrode stacked on the bank, the spacer, the spacer dam, and the organic emission layer;
A compensation pattern covering the spacer on the second electrode; And
An electroluminescent display device including an encapsulation layer covering the second electrode and the compensation pattern. The method of claim 1,
The compensation pattern,
An electroluminescent display device including an organic material. The method of claim 1,
The compensation pattern,
The electroluminescent display device is limited to an inner space surrounded by the spacer dam to cover the spacer. The method of claim 1,
The compensation pattern,
An electroluminescent display device that is stacked on the damaged portion generated in the spacer and the second electrode exposing the damaged portion to cover the damaged portion. The method of claim 1,
The spacer has a columnar shape; And
The spacer dam has a closed curve shape surrounding the spacer at a predetermined distance apart from the spacer. The method of claim 1,
The encapsulation layer,
A first inorganic layer covering the cathode electrode and the compensation pattern;
An organic layer stacked on the first inorganic layer;
An electroluminescent display device comprising a second inorganic layer stacked on the organic layer. The method of claim 1,
The organic emission layer,
An electroluminescent display device comprising any one of a red organic emission layer, a blue organic emission layer, and a green organic emission layer. The method of claim 1,
The organic emission layer,
Including an organic light emitting material that emits white light,
The electroluminescent display device further comprising a color filter disposed in one direction of an upper portion and a lower portion of the organic emission layer. The method of claim 1,
The substrate,
A display area for displaying an image; And
A non-display area surrounding the light-emitting area,
The spacer and the spacer dam are distributed at a predetermined density in the display area and the non-display area. The method of claim 9,
The display area,
An electroluminescent display device in which light-emitting elements formed by stacking the first electrode, the organic emission layer, and the second electrode are disposed. The method of claim 1,
The spacer,
An electroluminescent display device arranged one per 4x4 unit in the matrix arrangement of the pixels. The method of claim 1,
A driving element disposed on each of the pixels; And
Further comprising a planarization film covering the driving element,
The first electrode is disposed on the planarization layer and connected to the driving element. A first electrode disposed on the substrate;
A bank defining an opening area on the first electrode;
A spacer disposed on the bank;
A spacer dam surrounding the spacer;
A compensation pattern limited to the spacer dam and covering the spacer;
An organic emission layer disposed in the opening area; And
An electroluminescent display device including a second electrode stacked on the organic emission layer. The method of claim 13,
The second electrode,
An electroluminescent display device stacked on the spacer and the spacer dam and under the compensation pattern. The method of claim 14,
Stacked on the spacer and the spacer dam,
A first inorganic film;
An organic layer on the first inorganic layer;
An electroluminescent display device further comprising an encapsulation layer including a second inorganic layer on the organic layer. The method of claim 13,
The second electrode,
An electroluminescent display device stacked on the compensation pattern. The method of claim 16,
Stacked on the second electrode,
A first inorganic film;
An organic layer on the first inorganic layer;
An electroluminescent display device further comprising an encapsulation layer including a second inorganic layer on the organic layer. The method of claim 13,
The compensation pattern,
An electroluminescent display device that covers the damaged part in the spacer and prevents the shape of the damaged part from being transferred to layers stacked on the compensation pattern.

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