KR20210040905A - Method for manufacturing master on which nano-sized or micro-sized stuructures are formed - Google Patents

Abstract

The present invention relates to a method for manufacturing a master on which nano or micro structures are formed. The method for manufacturing a master on which nano or micro structures are formed, in a method for manufacturing a master for a replication process, comprises the following steps of: preparing a base material having durability for a repeated molding process; and depositing a deposition material on the base material to form the nano or micro structures.

Description

How to manufacture a master with nano or microstructures {METHOD FOR MANUFACTURING MASTER ON WHICH NANO-SIZED OR MICRO-SIZED STURUCTURES ARE FORMED}

The present invention relates to a method of manufacturing a master having a nano or micro structure, and more particularly, a nano or a mold constituting a mold for a replication process of a pattern in which a nano pattern, a micro pattern, or a pattern in which various sizes of fine patterns are mixed It relates to a method of manufacturing a master in which microstructures are formed.

Recently, there are increasing cases in which a surface structure of a size of several hundreds of micrometers is mixed in products of various industries such as bio-devices, hydrophobic surface products, and products that realize color by microstructure.

For example, in the case of micro-channels or bio-devices composed of microstructures, applications of several micro- or sub-micro-sized flow paths are increasing for fine reaction or flow control. It is necessary to apply flow paths and structures of micro or several millimeters.

In addition, a structure having a size of several tens of nanometers to several hundreds of microns may be required at the same time depending on the size of the target material to be controlled, the sample or the flow characteristics.

In this way, in order to manufacture a product to which a fine embossed or engraved pattern or structure is applied to the surface through a duplication process such as molding, the pattern or structure is processed in an embossed or engraved opposite direction to the surface, and is repeatedly used for the forming or duplication You need a master or template that you can use.

Conventionally, the processing of such a master or template has been applied in consideration of the size, shape, processing area, and processing base material of the pattern by various processing processes such as mechanical cutting processing, laser processing, chemical etching process, lithography process, and electroplating process. However, in spite of these various processing methods, it is necessary to manufacture a master or template based on a metal base material in order to be applied to a repetitive replication process for mass manufacturing.

It is possible to directly process a surface pattern or structure with a size of tens of microns or more through mechanical processing on a metal base material with excellent durability, and because it is based on a metal base material, it is suitable for a replication process where high pressure or temperature is applied or a large amount of replication process. It can be applied as a master or template, but mechanical processing cannot be applied to a surface pattern or structure of several micrometers or less.

Accordingly, in the case of a surface pattern or structure of several microns or less, which is difficult to mechanically process, a method of processing the pattern or structure by a lithography process such as exposure, development, and etching to a silicon wafer or a glass substrate is generally applied.

However, it is difficult to apply a master or template in which a fine pattern or structure is processed on a silicon wafer or glass substrate due to durability problems in a high-pressure or high-temperature replication process or a large-scale replication process.

In order to solve this problem, a stamper in the form of a thin substrate in which a pattern or a structure is processed on a silicon wafer or a glass substrate by electrolytic or electroless plating, such as a metal material such as nickel, is manufactured and utilized.

However, in the case of a stamper by such a manufacturing process, when a surface pattern or structure of a size and shape that is advantageous for machining and a pattern or structure of several micrometers or less are mixed, the processing process becomes very complicated or processing may not be possible.

In addition, when molding is performed under conditions of high temperature and high pressure, such as injection molding, a mold is composed of parts processed in a block shape using a metal material such as mold steel with excellent durability, and in the case of a stamper type, it is installed and used in such a mold. In addition, there is a problem in that the shape of the applied product, for example, a product having a curved surface, is limited due to a fastening structure or a processing process problem.

Korean Patent Registration No. 10-0768329

Accordingly, an object of the present invention is to solve such a conventional problem, in which a nano or micro structure is formed by directly processing a micro or nano-sized microstructure on a metal base material having durability against repetitive molding processes. It is to provide a way to make a master.

The problems to be solved by the present invention are not limited to the problems mentioned above, and other problems that are not mentioned will be clearly understood by those skilled in the art from the following description.

The above object is, according to the present invention, in the method of manufacturing a master for the replication process, (a) preparing a base material having durability for a repetitive molding process; And (b) forming a nano- or micro-sized structure by depositing a deposition material on the base material.

Here, the step (b) includes depositing the deposition material on the base material by aligning a shadow mask having a nano- or micro-sized pattern formed on the base material; And removing the shadow mask.

Here, the step (b) includes forming a photo resist layer on the base material; Forming a nano- or micro-sized pattern on the photoresist layer by exposure and etching by arranging a mask for fabricating a nano- or micro-sized pattern on the base material; Depositing the deposition material on the base material through the photoresist layer on which the nano- or micro-sized pattern is formed; And lifting the photoresist layer off.

Here, the step (a) may further include processing a structure having a size larger than that of the deposited structure on the deposition surface of the base material.

Here, after the step (a), the step of forming an adhesive layer for improving the interfacial adhesion between the base material and the deposited structure on the deposition surface of the base material may be further included.

Here, after step (b), the step of performing heat treatment by heating the base material and the deposition structure may be further included.

Here, the deposition material may be deposited by sputtering or electron beam evaporation.

Here, the base material may be formed of any one of nickel (Ni), susceptor (SUS), brass, copper, mold steel, zirconium (Zr), steel, titanium (Ti), and chromium (Cr).

Here, the deposition material is nickel (Ni), titanium (Ti), chromium (Cr), aluminum (Al), gold (Au), platinum (Pt), copper (Cu), iron (Fe), zinc (Zn) , At least one of zirconium (Zr), molybdenum (Mo), ruthenium (Ru), palladium (Pd), tin (Sn), hafnium (Hf), tantalum (Ta), tungsten (W), and laurentium (Lr) Can include.

Here, the adhesive layer is titanium (Ti), chromium (Cr), zirconium (Zr), laurentium (Lr), tungsten (W), tantalum (Ta), niobium (Nb), titanium dioxide (TiO ₂ ), nickel oxide It may be formed of a material containing at least one of (nickel oxide) and titanium nitride (TiN).

According to the method of manufacturing a master having a nano or micro structure formed thereon as described above, it is manufactured by a conventional complex and expensive lithography process and an electroplating process for replica molding a nano or micro-sized micro pattern or structure. Compared to fabricating a stamper that has been used, there is an advantage in that it is possible to simply and quickly fabricate a master in which a fine pattern is formed through a deposition process on a metal base material.

In addition, even for complex patterns in which surface structures of hundreds of micro-sized and tens of nano-sized, which were difficult to process in the past, can be directly processed on materials such as metals with high durability that can be applied to the injection molding process, which is a high-temperature and high-pressure process. As it is possible, there is also an advantage that it can contribute to the commercialization and aspect of related products.

1 is a diagram showing a manufacturing process of a method of manufacturing a master having a nano or micro structure according to an embodiment of the present invention.
2 is a modified example of FIG. 1 to which an adhesive layer is applied.
3 is a diagram illustrating a manufacturing process of a method of manufacturing a master having a nano or micro structure according to another embodiment of the present invention.
4 is a modification example of FIG. 1 to which an adhesive layer is applied.
5 is a diagram showing a master having a mixed pattern structure fabricated by pre-processing a primary pattern on a deposition surface of a base material and depositing a microstructure on the base material according to the present invention.
6 shows a master actually manufactured according to the present invention.

Specific details of the embodiments are included in the detailed description and drawings.

Advantages and features of the present invention, and a method of achieving them will become apparent with reference to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in a variety of different forms, and only these embodiments make the disclosure of the present invention complete, and are common knowledge in the technical field to which the present invention pertains. It is provided to completely inform the scope of the invention to those who have, and the invention is only defined by the scope of the claims. The same reference numerals refer to the same elements throughout the specification.

Hereinafter, the present invention will be described with reference to the drawings for explaining a method of manufacturing a master having a nano or microstructure formed according to embodiments of the present invention.

1 is a diagram showing a manufacturing process of a method for manufacturing a master having a nano or micro structure according to an embodiment of the present invention, FIG. 2 is a modified example of FIG. 1 to which an adhesive layer is applied, and FIG. 3 is another example of the present invention. A diagram showing a manufacturing process of a method of manufacturing a master having a nano or micro structure according to an embodiment, and FIG. 4 is a modified example of FIG. 1 to which an adhesive layer is applied, and FIG. 5 is a first pattern on the deposition surface of the base material. It is a diagram showing a master having a mixed pattern structure fabricated by pre-processing and depositing a microstructure on the base material according to the present invention, Figure 6 shows a master actually fabricated according to the present invention.

The method of manufacturing the master 100 on which the nano or micro structure 120 is formed according to the present invention relates to the production of the master 100 used in a mold in a replication process such as injection molding, and in particular, nano or micro size It relates to a method of manufacturing the master 100 in which the nano or micro-sized microstructure 120 for forming the microchannel or pattern of is formed.

First, as described above, unlike conventionally forming a fine pattern on a silicon wafer or a glass substrate and manufacturing a stamper by a method such as plating, the present invention has a high durability level that can be applied in a high-temperature and high-pressure molding process. The micro- or nano-sized microstructure 120 is directly processed on the base material 110 formed of a material such as metal that can be stably applied to a general mold structure.

At this time, the material of the base material 110 may be formed of any one of nickel (Ni), sus (SUS), brass, copper, mold steel, zirconium (Zr), steel, titanium (Ti), and chromium (Cr), It is not limited thereto as long as it has a high durability enough to withstand the processing conditions of high temperature and high pressure when forming the composite material.

In this way, after preparing the base material 110 having high durability, the deposition material is dry-deposited on the base material 110 to form a nano- or micro-sized microstructure 120.

At this time, the deposition material is nickel (Ni), titanium (Ti), chromium (Cr), aluminum (Al), gold (Au), platinum (Pt), copper (Cu), iron (Fe), zinc (Zn) , At least one of zirconium (Zr), molybdenum (Mo), ruthenium (Ru), palladium (Pd), tin (Sn), hafnium (Hf), tantalum (Ta), tungsten (W), and laurentium (Lr) It may be a material containing.

Referring to FIG. 1, a method of manufacturing the master 100 having a nano or micro structure according to an embodiment of the present invention will be described in more detail. As described above, it is formed of a highly durable material such as metal and has a predetermined thickness. To prepare the base material 110 for manufacturing the master 100 having (S310). At this time, the thickness of the base material may be 2 mm or more, preferably 5 mm or more, and the master manufactured according to the present invention is mounted on a mold and used.In order to assemble the mold with bolts, it is necessary to prepare a base material having at least the above thickness range. need.

Next, the shadow mask 210 having a nano- or micro-sized pattern formed on the deposition surface of the base material 110 is aligned (S320), and a deposition material is deposited to form the deposition layer 220 (S330). Accordingly, the deposition material may pass through the fine pattern formed on the shadow mask to be deposited on the base material 110.

In this case, as a method of depositing the evaporation material, sputtering or electron beam evaporation for forming a thin film may be used.

Next, the shadow mask 210 is removed, leaving only the structure 120 deposited on the base material 110 through a fine pattern of the shadow mask, and the deposition materials deposited on the remaining shadow mask 210 may be removed (S340). ).

2 shows a modified example of FIG. 1, as described above, preparing a high-durability base material (S410), and depositing the base material 110 and the base material 110 before depositing the deposition material on the base material 110 A process of forming the adhesive layer 250 may be further included in order to improve the interfacial adhesion between the microstructures 120 deposited on the surface (S420). Next, the shadow mask 210 is aligned in the same manner as in FIG. 1 (S430), and a deposition material is deposited on the base material 110 to form the deposition layer 220 (S440). At this time, since the adhesive layer 250 is previously formed on the base material 110, the adhesive layer 250 is positioned between the base material 110 and the evaporation material, so that the base material 110 and the microstructure 120 are formed by the adhesive layer 250. ) It can improve the adhesion properties of the interface.

At this time, as the adhesive material forming the adhesive layer 250, titanium (Ti), chromium (Cr), zirconium (Zr), laurentium (Lr), tungsten (W), tantalum (Ta), niobium (Nb), and dioxide A material containing at least one of titanium (TiO ₂ ), nickel oxide, and titanium nitride (TiN) may be used, and the adhesive layer 250 may be formed on the base material 110 by a deposition method. It is not limited.

After forming the microstructure 120 on the base material 110 in the same manner as described above, a heat treatment process by heating may be further included. At this time, the heat treatment temperature and heat treatment time may vary depending on the type of material constituting the base material 110, the deposition material, and the adhesive layer 250, and the strength of the microstructure 120 formed by the deposition material by the heat treatment process It can be further improved, and the interfacial adhesion by the adhesive layer 250 can be further improved.

Hereinafter, a method of manufacturing the master 100 in which the nano or microstructure 120 is formed according to another embodiment of the present invention will be described with reference to FIG. 3.

In this embodiment, a base material 110 is prepared for manufacturing the master 100 having a predetermined thickness and formed of a material having high durability such as metal (S510), and on the deposition surface on which the deposition material is deposited on the base material 110 To form a photoresist layer 230 on. A method of forming the photoresist layer 230 may use the same method as a method generally used in a lithography process, such as a spin coater.

Next, the mask 240 for manufacturing a nano or micro micro pattern is aligned on the photoresist layer 230 (S530), and a fine pattern is formed on the photoresist layer 230 by exposure and etching processes (S530). S540).

Next, a deposition material is deposited on the base material 110 through the photoresist layer 230 on which the fine pattern is formed to form the deposition layer 220 (S550). In this case, the deposition material may penetrate through the fine pattern formed on the photoresist layer 230 and may be deposited on the base material 110.

Next, the photoresist layer 230 is lifted off to separate and remove it from the base material 110, leaving only the microstructure 120 deposited on the base material 110 through the photoresist layer 230 The remaining deposition materials are removed together with the photoresist layer 230 to finally fabricate the master 100 (S560).

4 shows a modified example of FIG. 3, before forming a photoresist layer on the base material 110 (S630), as described above with reference to FIG. 2, the interface between the base material 110 and the deposition structure 120 A process of forming the adhesive layer 250 may be further included in order to improve adhesion (S620). The subsequent process may be the same as that described with reference to FIG. 3. A photoresist layer 230 is formed on the adhesive layer 250 (S630), and a fine pattern is formed on the photoresist layer 230 by exposure and etching processes. (S650), depositing a deposition material on the base material 110 through the photoresist layer 230 (S660), and finally lifting off the photoresist layer 230 to separate and remove it from the base material 110 The master 100 is manufactured (S670).

The material, function, etc. of the adhesive layer 250 used in the present embodiment are the same as those described with reference to FIG. 2, and detailed descriptions thereof will be omitted.

On the other hand, as shown on the left side of FIG. 5, before forming the microstructure on the base material 110 constituting the master 100 by a deposition process, a structure 122 or a pattern of a larger category compared to the microstructure. Can be formed in advance by machining or the like.

With respect to the structure 122 of a relatively large size or the metal base material 110 in which the pattern has been previously processed, the microstructure of a smaller size of a nano or micro size by evaporation according to the method described with reference to FIGS. 1 to 4 ( By forming 120), it is possible to easily manufacture the master 100 having a structure in which structures 120 and 122 of different sizes are mixed.

6 shows a state of thread processing of the master 100 in which a channel having a height of 500 nm is formed by depositing nickel on a base material 110 made of SUS material by an electron beam evaporation method according to the present invention. At this time, a Ti adhesive layer 250 having a thickness of 25 nm was applied to improve adhesion between the SUS material base material 110 and the Ni material microstructure 120.

The scope of the present invention is not limited to the above-described embodiments, but may be implemented in various forms within the scope of the appended claims. Anyone of ordinary skill in the technical field to which the present invention belongs without departing from the gist of the present invention claimed in the claims is considered to be within the scope of the description of the claims of the present invention to various ranges that can be modified.

100: master
110: base material
120: (fine) structure
210: shadow mask
220: evaporation layer
230: photoresist layer
240: mask
250: adhesive layer

Claims (10)

In the method of producing a master for the cloning process,
(a) preparing a durable base material for repetitive molding processes; And
(b) a method of manufacturing a master having a nano or micro structure comprising the step of forming a nano or micro-sized structure by depositing a deposition material on the base material. The method of claim 1,
The step (b) is
Depositing the deposition material on the base material by aligning a shadow mask having a nano- or micro-sized pattern formed on the base material; And
A method of manufacturing a master having nano or microstructures formed thereon, comprising removing the shadow mask. The method of claim 1,
The step (b) is
Forming a photo resist layer on the base material;
Forming a nano- or micro-sized pattern on the photoresist layer by exposure and etching by aligning a mask for fabricating a nano- or micro-sized pattern on the base material;
Depositing the deposition material on the base material through the photoresist layer on which the nano- or micro-sized pattern is formed; And
A method of fabricating a master with nano or microstructures comprising the step of lifting the photoresist layer off. The method of claim 1,
The step (a) is
A method of manufacturing a master having a nano or micro structure further comprising the step of processing a structure having a size larger than that of the deposited structure on the deposition surface of the base material. The method of claim 1,
After step (a) above
A method of manufacturing a master having a nano or micro structure further comprising the step of forming an adhesive layer on the deposition surface of the base material to improve interfacial adhesion between the base material and the structure to be deposited. The method of claim 1,
after step (b)
A method of manufacturing a master having a nano or micro structure further comprising the step of performing heat treatment by heating the base material and the deposition structure. The method of claim 1,
A method of manufacturing a master having nano or microstructures for depositing the deposition material by sputtering or electron beam evaporation. The method of claim 1,
The base material is made of a nano or microstructure formed of any one of nickel (Ni), sus (SUS), brass, copper, mold steel, zirconium (Zr), steel, titanium (Ti), and chromium (Cr). How to. The method of claim 1,
The deposition material is nickel (Ni), titanium (Ti), chromium (Cr), aluminum (Al), gold (Au), platinum (Pt), copper (Cu), iron (Fe), zinc (Zn), zirconium Contains at least one of (Zr), molybdenum (Mo), ruthenium (Ru), palladium (Pd), tin (Sn), hafnium (Hf), tantalum (Ta), tungsten (W), and laurentium (Lr) A method of manufacturing a master in which nano or microstructures are formed. The method of claim 5,
The adhesive layer is titanium (Ti), chromium (Cr), zirconium (Zr), laurentium (Lr), tungsten (W), tantalum (Ta), niobium (Nb), titanium dioxide (TiO ₂ ), nickel oxide (nickel). oxide) and titanium nitride (TiN).

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