KR20210021140A - 기판 재치 방법, 성막 방법, 전자 디바이스 제조 방법 - Google Patents

기판 재치 방법, 성막 방법, 전자 디바이스 제조 방법 Download PDF

Info

Publication number
KR20210021140A
KR20210021140A KR1020217004745A KR20217004745A KR20210021140A KR 20210021140 A KR20210021140 A KR 20210021140A KR 1020217004745 A KR1020217004745 A KR 1020217004745A KR 20217004745 A KR20217004745 A KR 20217004745A KR 20210021140 A KR20210021140 A KR 20210021140A
Authority
KR
South Korea
Prior art keywords
substrate
mask
alignment
holding
film
Prior art date
Application number
KR1020217004745A
Other languages
English (en)
Korean (ko)
Inventor
히로시 이시이
겐타로 스즈키
고타로 도리카타
Original Assignee
캐논 톡키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐논 톡키 가부시키가이샤 filed Critical 캐논 톡키 가부시키가이샤
Publication of KR20210021140A publication Critical patent/KR20210021140A/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L27/32—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020217004745A 2016-06-24 2017-06-22 기판 재치 방법, 성막 방법, 전자 디바이스 제조 방법 KR20210021140A (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2016125834 2016-06-24
JP2016125833 2016-06-24
JPJP-P-2016-125833 2016-06-24
JPJP-P-2016-125834 2016-06-24
JPJP-P-2017-101233 2017-05-22
JP2017101233 2017-05-22
PCT/JP2017/023004 WO2017222009A1 (ja) 2016-06-24 2017-06-22 基板載置方法、成膜方法、電子デバイスの製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020177036310A Division KR102219478B1 (ko) 2016-06-24 2017-06-22 기판 재치 방법, 성막 방법, 전자 디바이스 제조 방법

Publications (1)

Publication Number Publication Date
KR20210021140A true KR20210021140A (ko) 2021-02-24

Family

ID=60784142

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020177036310A KR102219478B1 (ko) 2016-06-24 2017-06-22 기판 재치 방법, 성막 방법, 전자 디바이스 제조 방법
KR1020217004745A KR20210021140A (ko) 2016-06-24 2017-06-22 기판 재치 방법, 성막 방법, 전자 디바이스 제조 방법

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020177036310A KR102219478B1 (ko) 2016-06-24 2017-06-22 기판 재치 방법, 성막 방법, 전자 디바이스 제조 방법

Country Status (4)

Country Link
JP (1) JP6351918B2 (ja)
KR (2) KR102219478B1 (ja)
CN (1) CN107851603B (ja)
WO (1) WO2017222009A1 (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102019490B1 (ko) 2014-12-10 2019-09-06 어플라이드 머티어리얼스, 인코포레이티드 프로세싱 챔버에서 기판을 마스킹하기 위한 마스크 어레인지먼트, 기판 상에 층을 증착하기 위한 장치, 및 프로세싱 챔버에서 기판을 마스킹하기 위한 마스크 어레인지먼트를 정렬하기 위한 방법
KR101979149B1 (ko) * 2018-04-27 2019-05-15 캐논 톡키 가부시키가이샤 얼라인먼트 방법, 이를 사용한 증착방법 및 전자디바이스 제조방법
CN108642452B (zh) * 2018-06-08 2020-07-03 芜湖市亿仑电子有限公司 一种电容器金属化薄膜加工真空镀膜机
KR102427823B1 (ko) * 2018-06-11 2022-07-29 캐논 톡키 가부시키가이샤 정전척 시스템, 성막장치, 흡착방법, 성막방법 및 전자 디바이스의 제조방법
JP7170524B2 (ja) * 2018-12-14 2022-11-14 キヤノントッキ株式会社 基板載置方法、成膜方法、成膜装置、有機ｅｌパネルの製造システム
CN113490762A (zh) 2019-03-15 2021-10-08 应用材料公司 沉积掩模、及制造和使用沉积掩模的方法
US11538706B2 (en) 2019-05-24 2022-12-27 Applied Materials, Inc. System and method for aligning a mask with a substrate
US11189516B2 (en) 2019-05-24 2021-11-30 Applied Materials, Inc. Method for mask and substrate alignment
WO2020251696A1 (en) 2019-06-10 2020-12-17 Applied Materials, Inc. Processing system for forming layers
US10916464B1 (en) 2019-07-26 2021-02-09 Applied Materials, Inc. Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency
CN211339668U (zh) * 2019-12-26 2020-08-25 昆山国显光电有限公司 夹持装置
JP2022083681A (ja) * 2020-11-25 2022-06-06 キヤノントッキ株式会社 アライメント装置、成膜装置、アライメント方法、成膜方法、および電子デバイスの製造方法
JP2022093003A (ja) * 2020-12-11 2022-06-23 キヤノントッキ株式会社 アライメント装置、成膜装置、アライメント方法、成膜方法及び電子デバイスの製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009277655A (ja) 2008-05-15 2009-11-26 Samsung Mobile Display Co Ltd 有機電界発光表示装置の製造装置及び製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3641709B2 (ja) * 1999-12-09 2005-04-27 株式会社 日立インダストリイズ 基板の組立方法とその装置
JP4773834B2 (ja) * 2006-02-03 2011-09-14 キヤノン株式会社 マスク成膜方法およびマスク成膜装置
WO2010106958A1 (ja) * 2009-03-18 2010-09-23 株式会社アルバック 位置合わせ方法、蒸着方法
JP2013035611A (ja) * 2011-08-03 2013-02-21 Sekisui Chem Co Ltd 表面処理における基板移送装置及び方法
JP5813555B2 (ja) * 2012-03-30 2015-11-17 株式会社アドテックエンジニアリング 露光描画装置及び露光描画方法
JP2014065959A (ja) * 2012-09-27 2014-04-17 Hitachi High-Technologies Corp 蒸着装置、および、蒸着装置における基板設置方法
JP6250999B2 (ja) * 2013-09-27 2017-12-20 キヤノントッキ株式会社 アライメント方法並びにアライメント装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009277655A (ja) 2008-05-15 2009-11-26 Samsung Mobile Display Co Ltd 有機電界発光表示装置の製造装置及び製造方法

Also Published As

Publication number Publication date
KR20180137393A (ko) 2018-12-27
CN107851603B (zh) 2021-11-23
WO2017222009A1 (ja) 2017-12-28
JP6351918B2 (ja) 2018-07-04
CN107851603A (zh) 2018-03-27
JPWO2017222009A1 (ja) 2018-07-19
KR102219478B1 (ko) 2021-02-23

Similar Documents

Publication Publication Date Title
KR102219478B1 (ko) 기판 재치 방법, 성막 방법, 전자 디바이스 제조 방법
JP6999769B2 (ja) 成膜装置、制御方法、及び電子デバイスの製造方法
KR102241187B1 (ko) 기판 지지 장치, 기판 재치 장치, 성막 장치, 기판 지지 방법, 성막 방법 및 전자 디바이스의 제조 방법
JP6448067B2 (ja) 基板載置方法、基板載置機構、成膜方法、成膜装置及び電子デバイスの製造方法
JP6393802B1 (ja) 基板載置装置、基板載置方法、成膜装置、成膜方法、アライメント装置、アライメント方法、および、電子デバイスの製造方法
KR101870586B1 (ko) 기판 반송 기구, 기판 재치 기구, 성막 장치 및 그 방법
JP7244401B2 (ja) アライメント装置、成膜装置、アライメント方法、成膜方法、及び電子デバイスの製造方法
JP7296303B2 (ja) アライメントシステム、成膜装置、成膜方法、電子デバイスの製造方法、および、アライメント装置
JP2019060027A (ja) 基板載置装置、成膜装置、基板載置方法、成膜方法、および電子デバイスの製造方法
JP2022083681A (ja) アライメント装置、成膜装置、アライメント方法、成膜方法、および電子デバイスの製造方法
KR102665610B1 (ko) 얼라인먼트 장치, 성막 장치, 얼라인먼트 방법, 성막 방법, 및 전자 디바이스의 제조 방법
KR102578750B1 (ko) 얼라인먼트 시스템, 성막 장치, 성막 방법, 및 전자 디바이스 제조방법
KR20210028626A (ko) 얼라인먼트 장치, 성막 장치, 얼라인먼트 방법, 성막 방법, 및 전자 디바이스 제조방법
KR20210007814A (ko) 성막 장치, 마스크의 클리닝 방법, 성막 방법 및 전자 디바이스의 제조방법

Legal Events

Date Code Title Description
A107 Divisional application of patent
E902 Notification of reason for refusal
E601 Decision to refuse application