KR20210012727A - Mask, method of manufacturing thereof and skin care device comprising thereof - Google Patents

Abstract

A mask according to an embodiment comprises: a first wire disposed on a first base layer; a plurality of piezoelectric elements disposed on the first wire; a second wire disposed on the piezoelectric elements; a second base layer disposed on the second wire; and a protective layer disposed between the first and second base layers, and wrapping the first wire, the second wire, and the plurality of piezoelectric elements. The first base layer, the second base layer, and the protective layer include the same material. In addition, a method for producing a mask according to an embodiment comprises the steps of: forming a first wire on a first protective film, and forming a second wire on a second protective film; disposing piezoelectric elements on the first wire and the second wire; sealing the piezoelectric elements by forming a first filling layer; forming a first structure by removing the first and second protective films; and forming a second filling layer on the first structure. Moreover, a skincare device according to an embodiment comprises: a body having one side opened, and including a receiving space inside the open area; and the mask disposed in the open area and connected to the body. Enhanced reliability is ensured.

Description

A mask, a method for manufacturing the same, and a skin care device including the same TECHNICAL FIELD [0002] A mask, a method of manufacturing the same, and a skin care device including the same

Embodiments relate to a mask, a method of manufacturing the mask, and a skin care device including the mask.

Human skin may be damaged or contaminated depending on external factors such as environmental pollution, ultraviolet rays, and stress, and wrinkles may occur due to internal factors such as aging and hormonal changes. Recently, as interest in skin increases, various devices for skin treatment, beauty, and anti-aging have been developed.

In detail, devices capable of applying thermal energy to the skin, such as devices capable of improving skin elasticity by applying infrared energy, have been developed. In addition, devices using sound waves or light rays have been developed to effectively inject cosmetics or drugs into the skin. For example, a device capable of forming a path through which cosmetics or drugs are injected into the skin by using sonophoresis and laser pollination are being developed. In addition, devices using electric propulsion force have been developed to effectively inject cosmetics or drugs into the skin. For example, a device that can effectively inject ionic substances contained in cosmetics or drugs into the skin using iontophoresis, electroporation, and electroosmosis has been developed. have. That is, various devices are being developed that can care or treat a user's skin by providing light energy, microcurrent, and vibration to the skin.

In general, the above-described devices may be provided in the form of a patch detachable to the skin, and are attached to a specific skin area to care or treat the skin of the attached area. In addition, the above-described devices are provided in the form of a mask pack disposed to cover the entire user's face to care or treat facial skin.

However, since the devices are formed to have a predetermined thickness, it may be difficult to effectively contact the user's skin.

In addition, the devices may be difficult to effectively contact the user's skin in a relatively curved area such as both cheeks and nose. In detail, it may be difficult to effectively contact the user's skin due to the material and variable characteristics of the device. Accordingly, the device may be operated in a state not in close contact with the user's skin, and may be separated from the user's skin due to the user's movement and vibration of the device during the operation process. For this reason, the care or treatment effect using the device may be insignificant.

In addition, there is a problem in that the internal wires are damaged due to deformation of the device that occurs while the device is in close contact with the user's skin. In particular, there is a problem in that the electric wire in the area of the device corresponding to the relatively curved skin is disconnected due to deformation of the device that occurs when the device is worn.

In addition, in the process of manufacturing the mask, there is a problem in that the width of some of the layers constituting the mask changes. For example, the wiring of the mask may be disposed on a predetermined protective film, and a base layer disposed to surround the wiring may be disposed on the protective film. Thereafter, the protective film may be removed. When the protective film is removed, there is a problem in that the width and thickness of the base layer are changed due to ductility.

In addition, there is a problem in that the thickness of some of the layers constituting the mask changes due to external pressure applied during the manufacturing process of the mask. For example, the piezoelectric element and the wiring may be bonded through a pressure process in which a predetermined pressure is applied, and in this process, the thickness of a base layer supporting the wiring may be reduced.

Accordingly, there is a problem that the alignment error of the wiring, piezoelectric element, base layer, etc. is large or difficult due to changes in thickness and width generated during the manufacturing process, and the probability of occurrence of defects in the manufactured mask is high. There is this.

Therefore, a new mask capable of solving the above-described problem is required.

The embodiment is to provide a mask having variability and improved reliability, a method of manufacturing the same, and a skin care device including the same.

In addition, the embodiment is to provide a mask capable of effectively contacting the user's skin, a method for manufacturing the same, and a skin care device including the same.

In addition, the embodiment is to provide a mask capable of providing uniform ultrasonic energy to a user's skin, a method of manufacturing the same, and a skin care device including the same.

In addition, the embodiment is a mask having improved process efficiency, a mask having improved process efficiency, and a method of manufacturing the same, and a skin care device including the same, by minimizing deformation of the thickness and width of the layer included in the mask during the manufacturing process of the mask Want to provide.

In addition, the embodiment is to provide a mask in which a first base layer, a second base layer, and a protective layer may have various colors, a method of manufacturing the same, and a skin care device including the same.

The mask according to the embodiment may include a first wiring disposed on a first base layer, a plurality of piezoelectric elements disposed on the first wiring, a second wiring disposed on the plurality of piezoelectric elements, and the second wiring. A second base layer disposed and a protective layer disposed between the first and second base layers and surrounding the first wire, the second wire, and the plurality of piezoelectric elements, the first base layer, and the The second base layer and the protective layer include the same material.

In addition, the method of manufacturing a mask according to the embodiment includes forming a first wiring on a first protective film, forming a second wiring on a second protective film, and piezoelectric on the first wiring and the second wiring. Arranging an element, sealing the piezoelectric element by forming a first filling layer, forming a first structure by removing the first and second protective films, and a second filling layer on the first structure And forming.

In addition, a skin care device according to an embodiment includes a body having one side open and an accommodation space in the open area, and the mask disposed in the open area and connected to the body.

The mask according to the embodiment may be elastically deformed according to the shape of the user's curved skin by the first base layer, the second base layer, or the like. Accordingly, the mask can effectively contact the user's skin.

In addition, the mask according to the embodiment includes a plurality of piezoelectric elements, and the piezoelectric elements may generate ultrasonic energy in the entire area of the mask. Accordingly, ultrasonic energy having a uniform intensity may be provided to a user wearing the mask.

In addition, the piezoelectric elements according to the embodiment may be disposed at different intervals according to the shape of the user's face. For example, piezoelectric elements arranged in relatively curved areas such as the user's nose and cheeks, and flat areas such as forehead are arranged at different intervals, so that the ultrasonic energy of uniform intensity is applied to the curved area of the user's face. Can provide.

In addition, the mask according to the embodiment may prevent deformation of the layers included in the mask during the manufacturing process. In detail, the manufacturing method according to the embodiment may connect the wiring and the piezoelectric element before forming a separate filling layer surrounding the wiring on the protective film. In more detail, in the embodiment, since a separate filling layer is not disposed on the protective film when the wiring and the piezoelectric element are connected, the position of the wiring is shifted from the set position due to the ductility of the filling layer or the filling layer Can be prevented from being disconnected by the deformation of.

In addition, it is possible to prevent or minimize the occurrence of an alignment defect between the piezoelectric element and the wiring due to the ductility of the filling layer.

In addition, in the manufacturing method of the mask according to the embodiment, the wiring and the piezoelectric element may be connected before a separate filling layer is disposed, and a filling layer surrounding the piezoelectric element and the wiring may be formed thereafter. Accordingly, it is possible to prevent an alignment failure between the wiring and the piezoelectric element from occurring due to the colored filling layer.

In addition, in the manufacturing method of the mask according to the embodiment, the step of pressing the filling layer with a predetermined pressure can be omitted, and thus the thickness and width of the filling layer may be prevented from being deformed by the pressing.

In addition, the manufacturing method of the mask according to the embodiment may uniformly form the ultrasonic reflective layer and the matching layer to a set thickness using a molding jig, and thus may have uniform ultrasonic reflection characteristics and impedance characteristics.

1 is a front view of a mask according to an embodiment.
FIG. 2 is an exploded perspective view of area A1 of FIG. 1.
3 is a top view of area A1 of FIG. 1.
4 is another top view of area A1 of FIG. 1.
5 is a cross-sectional view showing a cross-section AA′ of FIG. 4.
6 is an enlarged view of area A2 of FIG. 5.
7 to 11 are diagrams for a conventional mask manufacturing method.
12 to 16 are diagrams for a method of manufacturing a mask according to an embodiment.
17 is another exploded perspective view of area A1 of FIG. 1.
18 is a cross-sectional view illustrating a cross section of the mask of FIG. 17.
19 to 21 are diagrams illustrating an example in which an indicator and a protrusion are provided to a mask according to an embodiment.
22 is a diagram illustrating a user wearing a mask according to an embodiment.
23 is a diagram illustrating a skin care device to which a mask is applied according to an embodiment.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the technical idea of the present invention is not limited to some embodiments to be described, but may be implemented in various different forms, and within the scope of the technical idea of the present invention, one or more of the constituent elements may be selectively selected between the embodiments. It can be combined with and substituted for use.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention are generally understood by those of ordinary skill in the art, unless explicitly defined and described. It can be interpreted as a meaning, and terms generally used, such as terms defined in a dictionary, may be interpreted in consideration of the meaning in the context of the related technology.

In addition, terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention. In the present specification, the singular form may include the plural form unless specifically stated in the phrase, and when described as "at least one (or more than one) of A and (and) B and C", it is combined with A, B, and C. It may contain one or more of all possible combinations.

In addition, terms such as first, second, A, B, (a), and (b) may be used in describing the constituent elements of the embodiment of the present invention. These terms are only for distinguishing the component from other components, and are not limited to the nature, order, or order of the component by the term. And, when a component is described as being'connected','coupled' or'connected' to another component, the component is not only directly connected, coupled or connected to the other component, but also the component and The case of being'connected','coupled', or'connected' due to another element between the other elements may also be included.

In addition, when it is described as being formed or disposed on the “top (top) or bottom (bottom)” of each component, the top (top) or bottom (bottom) is one as well as when the two components are in direct contact with each other. It also includes a case in which the above other component is formed or disposed between the two components. In addition, when expressed as "upper (upper) or lower (lower)", the meaning of not only an upward direction but also a downward direction based on one component may be included.

In addition, before describing the embodiments of the present invention, the first direction may refer to the x-axis direction shown in the drawings, and the second direction may be a different direction from the first direction. For example, the second direction may mean a y-axis direction shown in the drawing in a direction perpendicular to the first direction. In addition, the horizontal direction may mean first and second directions, and the vertical direction may mean a direction perpendicular to at least one of the first and second directions. For example, the horizontal direction may mean the x-axis and y-axis directions of the drawing, and the vertical direction may be a direction perpendicular to the x-axis and y-axis directions in the z-axis direction of the drawing.

1 is a front view of a mask according to an embodiment, and FIG. 2 is an exploded perspective view of area A1 of FIG. 1. In addition, FIGS. 3 and 4 are top views of area A1 of FIG. 1, FIG. 5 is a cross-sectional view showing section A-A′ of FIG. 4, and FIG. 6 is an enlarged view of area A2 of FIG. 5.

1 to 6, the mask 1000 according to the embodiment may have a shape corresponding to a shape of a human face. The mask 1000 is provided in a predetermined size to cover the user's face, and may have a predetermined elasticity in order to be in close contact with the user's face. The mask 1000 includes one surface in contact with the user's skin and the other surface opposite to the one surface, and one surface of the mask 1000 is made of a material that is harmless to the human body, so that it may be harmless even if it is in contact with the user's skin for a long time. have.

The mask 1000 may include at least one of an opening 1010 and a cutout 1020. In detail, the opening 1010 may be formed in a portion corresponding to the user's eyes or mouth. The opening 1010 is a region penetrating one surface and the other surface of the mask 1000 facing the user's skin. When the user wears the mask 1000, the user's eyes, mouth, etc. are in the opening 1010. It may be inserted, and the area excluding the opening 1010 may be in close contact with the user's face.

In addition, the cutting portion 1020 may be formed in a portion corresponding to the relatively curved both ball lines, chins, etc. in order to improve adhesion between the mask 1000 and the skin, but is not limited thereto. The cutting part 1020 may have a form in which one surface and the other surface of the mask 1000 are partially cut.

The mask 1000 is adhered to the user's skin and may provide ultrasonic waves to the user's skin through a piezoelectric member included therein. Accordingly, a drug or cosmetics between the mask 1000 and the skin can be effectively provided to the user.

In the mask 1000 according to the embodiment, the first base layer 110, the first wiring 200, the piezoelectric element 400, the second wiring 300, and the second base layer are regions excluding the opening 1010. 120 and a protective layer 550 may be included. In detail, the mask 1000 includes a first wiring 200, a piezoelectric element 400, a second wiring 300, and a second base layer 120 sequentially disposed on the first base layer 110. It may include, and may include a protective layer 550 disposed between the first base layer 110 and the second base layer 120.

The first base layer 110 may include a material harmless to the human body. In addition, the first base layer 110 may include a soft and elastic material. For example, the first base layer 110 is polyvinyl chloride to which silicone, thermoplastic resin, thermoplastic silicone resin, thermoplastic elastomer, polyurethane elastomer, ethylene vinyl acetate (EVA), a harmless plasticizer and a stabilizer are added ( PVC) may include at least one material. Preferably, the first base layer 110 is relatively light, can minimize irritation upon contact with the user's skin, and may include a silicone elastomer having a predetermined elasticity.

The first base layer 110 may reflect a wavelength emitted from the piezoelectric element 400 to be described later in the direction of one surface of the mask 1000. That is, the first base layer 110 may be a reflective layer.

To this end, the thickness t1 of the first base layer 110 may be smaller than or equal to the thickness t2 of the second base layer 120 to be described later. In detail, the thickness t1 of the first base layer 110 in order to reflect the wavelength emitted from the piezoelectric element 400 toward the first base layer 110 to the first base layer 110 is It may be thinner than or equal to the thickness t2 of the second base layer 120. That is, the second base layer 120 may be a base layer facing the user's skin, and the first base layer 110 may be a base layer disposed in an area opposite to the second base layer 120. .

The thickness t1 of the first base layer 110 may be about 50 μm to about 10 mm. When the thickness t1 of the first base layer 110 is less than about 50 μm, the thickness t1 of the first base layer 110 is relatively thin, so that the configuration is disposed on the first base layer 110 Cannot effectively protect them. In detail, when the mask 1000 is elastically deformed and the first base layer 110 is elastically deformed, the wirings 200 and 300 and the piezoelectric element 400 on the first base layer 110 can be effectively protected. Can't.

In addition, when the thickness t1 of the first base layer 110 exceeds about 10 mm, the thickness of the entire mask 1000 may increase, and the first base layer 110 in the piezoelectric element 400 The amount of most of the wavelengths emitted in the) direction passes through the first base layer 110 and is reflected in the direction of one surface of the mask 1000 may be small.

In addition, when the thickness t1 of the first base layer 110 exceeds about 10 mm, the required thickness of the second base layer 120 may increase for reflection in the direction of one surface of the mask 1000. In addition, since the range of wavelengths generated by the piezoelectric element 400 for reflection is high, it may not be suitable for use in the mask 1000.

In addition, when the thickness t1 of the first base layer 110 exceeds about 10 mm, the elastic deformation characteristics of the mask 1000 may be deteriorated. Accordingly, the mask 1000 may not be elastically deformed effectively in a shape corresponding to the user's skin.

Therefore, it is preferable that the thickness t1 of the first base layer 110 satisfies the above-described range in order to prevent the above problems. More preferably, the thickness t1 of the first base layer 110 may be about 100 μm to about 1000 μm. That is, it is preferable that the first base layer 110 has a thickness range of about 100 μm to about 1000 μm in consideration of reliability, reflection characteristics, variability of the manufactured mask 1000, thickness, weight, and ultrasonic impedance characteristics. Do.

In addition, the first base layer 110 may have grooves and pores formed therein to effectively reflect the wavelength generated by the piezoelectric element 400. For example, the grooves and pores may be disposed in a region overlapping with the piezoelectric element 400 for effective reflection, but is not limited thereto.

A first wiring 200 may be disposed on the first base layer 110. The first wiring 200 may be disposed on one surface of the first base layer 110 facing the piezoelectric element 400. The first wiring 200 may extend on the first base layer 110 in a first direction (x-axis direction). The first wiring 200 may directly contact one surface of the first base layer 110. The first wiring 200 may be formed on one surface of the first base layer 110 by a process such as deposition, printing, or bonding. The first wiring 200 may be electrically connected to the piezoelectric element 400.

The first wiring 200 may include a conductive material. For example, the first wiring 200 is aluminum (Al), copper (Cu), silver (Ag), gold (Au), chromium (Cr), nickel (Ni), molybdenum (Mo), titanium (Ti) And it may include at least one metal of these alloys. In addition, the first wiring 200 may include a non-metal such as carbon, and may include a conductive elastic body.

The first wiring 200 may have a single layer or a multilayer structure. As an example, the first wiring 200 may have a single layer structure including one selected from the above-described materials. In addition, the first wiring 200 may have a multilayer structure including a metal material selected from the above-described materials and a conductive elastic body.

The first wiring 200 may include a plurality of first sub-wirings 201 disposed on the first base layer 110. Each of the plurality of first sub-wires 201 may extend in a first direction and may be disposed to be spaced apart from each other in a second direction different from the first direction. The plurality of first sub-wires 201 may be electrically connected to each other. Here, the second direction may be a direction perpendicular to the first direction in a direction different from the first direction, but is not limited thereto.

The thickness of the first sub-wiring 201 may be about 2 μm to about 50 μm. In detail, the thickness of the first sub-wire 201 may be about 2 μm to about 40 μm. When the thickness of the first sub-wiring 201 is less than about 2 μm, electrical characteristics may be deteriorated, and it may be difficult to form uniformly. In addition, when the thickness of the first sub-wire 201 exceeds about 50 μm, the total thickness of the mask 1000 may increase, and the manufacturing time of the first wire 200 may increase. In addition, the first sub-wiring 201 may be too thick to reduce stretchable characteristics. Preferably, the thickness of the first sub-wire 201 may be about 5 μm to about 35 μm or less in consideration of stretchable characteristics, reliability, and process efficiency in the horizontal direction.

In addition, the line width of the first sub-wire 201 may be about 50 μm to about 500 μm. In detail, the line width of the first sub-wire 201 may be about 100 μm to about 450 μm. A line width of the first sub-wire 201 may be greater than a thickness of the first sub-wire 201. If the line width of the first sub-wire 201 is less than about 50 μm, reliability may be degraded, and if the line width of the first sub-wire 201 exceeds about 500 μm, the elongation rate decreases, resulting in a stretchable characteristic. It can be degraded. Preferably, the line width of the first sub-wire 201 may be about 100 μm to about 400 μm in consideration of stretchable characteristics.

The first wiring 200 may include a first connection part 210 and a first extension part 220. For example, one of the first sub-wires 201 may include a first connection part 210 and a first extension part 220 connected to the first connection part 210.

The first connection part 210 may be disposed in a region corresponding to a lower surface of the piezoelectric element 400. In detail, the first connection part 210 may be disposed in a region overlapping the lower surface of the piezoelectric element 400 in a vertical direction. The first connection part 210 may face a lower surface of the piezoelectric element 400. The first connector 210 may be provided in a number corresponding to the piezoelectric element 400.

The first connection part 210 may have a shape corresponding to a lower surface of the piezoelectric element 400. The first connection part 210 may have a width corresponding to a lower surface of the piezoelectric element 400. For example, the width in the horizontal direction of the first connector 210 may be less than or equal to the width in the horizontal direction of the bottom surface of the piezoelectric element 400. In detail, the width of the first connection part 210 in the horizontal direction may be about 50% to about 100% of the width of the lower surface of the piezoelectric element 400 in the horizontal direction. When the width of the first connection part 210 in the horizontal direction is less than about 50%, electrical characteristics between the first wiring 200 and the piezoelectric element 400 may be deteriorated. In addition, when the width in the horizontal direction of the first connector 210 is larger than the width of the lower surface of the piezoelectric element 400, the transmittance of ultrasonic energy may be reduced. Accordingly, it is preferable that the horizontal width of the first connection part 210 satisfies the above-described range.

The first extension part 220 may extend in a first direction from the first connection part 210. The first extension part 220 may be disposed between a plurality of first connection parts 210. In detail, the first extension part 220 may be disposed between the first connection parts 210 spaced apart in a first direction. That is, the first extension part 220 may connect between adjacent first connection parts 210.

The first wiring 200 may have various shapes. For example, when viewed in a plan view, each of the plurality of first sub-wires 201 may extend in a first direction in a linear shape as shown in FIG. 3. In detail, the plurality of first sub-wires 201 are spaced apart from the adjacent first sub-wires 201 in the second direction at equal intervals, and may extend in the first direction in the form of a straight line. That is, the first extension part 220 of the first wiring 200 may have a shape of a straight line extending in the first direction.

In contrast, when viewed in a plan view, each of the plurality of first sub-wires 201 may extend in the first direction in a curved shape as shown in FIG. 4. For example, each of the plurality of first sub-wires 201 may be provided in a form in which a wavy pattern is repeated. That is, the first extension part 220 of the first wiring 200 may have a curved shape extending in the first direction.

In this case, the first extension part 220 may have a curvature pattern of about 3R to about 20R (mm). Accordingly, when the mask 1000 is stretched or contracted in one direction, the first wiring 200 has a stretchable characteristic and may not be cut off. Preferably, the first extension part 220 may have a curvature pattern of about 5R to about 15R (mm). In addition, the first extension part 220 may have an elongation of about 10% to about 50%. Accordingly, since the first wiring 200 may have improved stretchable characteristics, reliability may be improved, and adhesion with the user's skin may be improved.

Alternatively, although not shown in the drawings, the first extension part 220 may have a shape in which a pattern in which a straight line and a curve extending in a first direction are mixed is repeated. For example, the first extension part 220 located in an area overlapping with a relatively curved area (nose, cheek, etc.) of the user's face when viewed from a plane may be provided in a curved shape, and a relatively flat area The first extension part 220 located in a region overlapping with (forehead, etc.) may be provided in a straight line. Accordingly, when the mask 1000 is attached to the user's face, it is possible to prevent the first wiring 200 from being damaged due to the deformation of the mask 1000. In addition, since the first extension part 220 is provided in a form in which a straight line and a curved line are mixed, an electrical characteristic can be maintained and a ratio occupied by the first wiring 200 can be reduced. Accordingly, the embodiment can reduce the manufacturing cost of the first wiring 200 and minimize the loss of ultrasonic energy emitted from the piezoelectric element 400.

A piezoelectric element 400 may be disposed on the first base layer 110. The piezoelectric element 400 may be disposed on the first wiring 200. In detail, the piezoelectric element 400 may be disposed on the first connection part 210 of the first wire 200 to be electrically connected to the first wire 200.

The piezoelectric element 400 may include a ceramic material. For example, the piezoelectric element 400 includes ZnO, AlN, LiNbO ₄ , lead antimony stannate, lead magnesium tantalate, lead nickel tantalate, and titanate ( titanates), tungstates, zirconates, or lead zirconate titanate [Pb(Zr _x Ti _1-x )O ₃ (PZT)], lead lanthanum zirconate titanate (PLZT), lead niobium Zirconate titanate (PNZT), BaTiO ₃ , SrTiO ₃ , lead magnesium niobate, lead nickel niobate, lead manganese niobate, lead zinc niobate, lead including lead titanate, barium, bismuth, or niobium of strontium It may contain at least one of niobates.

A plurality of piezoelectric elements 400 may be disposed on the first wiring 200. The plurality of piezoelectric elements 400 may be disposed to be spaced apart from each other on the first sub-wire 201. For example, the plurality of piezoelectric elements 400 may be disposed on the first connection part 210 on the first sub-wire 201. In detail, one piezoelectric element 400 may be disposed on one first connection part 210. The center of the lower surface of the piezoelectric element 400 may overlap the first sub-wire 201 in a vertical direction. In detail, the center of the lower surface of the piezoelectric element 400 may overlap the first connection part 210. In more detail, the center of the lower surface of the piezoelectric element 400 may overlap the center of the first connection part 210.

The plurality of piezoelectric elements 400 may be spaced apart from each other at equal intervals on the first sub-wiring 201. For example, a plurality of piezoelectric elements 400 disposed on one first sub-wire 201 may be disposed at equal intervals based on the first direction. Further, the piezoelectric elements 400 disposed on the adjacent first sub-wires 201 may be disposed at equal intervals based on the second direction. Accordingly, a virtual line connecting the centers of the adjacent piezoelectric elements 400 in the first direction and the second direction may have a mesh shape.

In addition, the piezoelectric element 400 disposed on one first sub-wire 201 is the piezoelectric element 400 disposed on the first sub-wire 201 closest to the one first sub-wire 201 And may or may not overlap in the second direction. For example, when viewed in a plan view, the piezoelectric element 400 may be arranged in a zigzag shape on the adjacent first sub-wire 201.

In addition, some of the piezoelectric elements 400 may be spaced at equal intervals, and the remaining piezoelectric elements 400 may not be disposed at equal intervals. For example, in a region overlapping with a relatively flat region of the user's face surface, spaces between the piezoelectric elements 400 may be arranged at equal intervals. However, in a region overlapping with a relatively curved skin region, the spacing between the piezoelectric elements 400 may not be arranged at equal intervals. That is, the spacing between the piezoelectric elements 400 may be relatively narrow or large depending on the degree of curvature of the skin surface. For example, a gap between the piezoelectric elements 400 in a region overlapping with a curved region, such as a user's nose and both cheeks, may be relatively narrow. Accordingly, the mask 1000 according to the embodiment may effectively provide ultrasonic energy even to curved skin.

The piezoelectric element 400 may be disposed on the entire area of the mask 1000 to evenly generate ultrasonic energy. For example, the piezoelectric element 400 may generate ultrasonic energy of about 1 MHz or less by an applied current. In detail, the piezoelectric element 400 may generate ultrasonic energy of about 10 kHz to about 1 MHz. In more detail, the piezoelectric element 400 may generate ultrasonic energy of about 100 KHz to about 800 KHz. The ultrasonic energy generated by the piezoelectric element 400 may move in a direction of one surface of the mask 1000, and may be transferred to the user's skin and massage the user's skin.

The thickness of the piezoelectric element 400 may be about 1500 μm or less. In detail, the thickness of the piezoelectric element 400 may be about 1200 μm or less. Preferably, the thickness of the piezoelectric element 400 may be about 1000 μm or less. It is preferable that the thickness of the piezoelectric element 400 satisfies the above-described range in consideration of the overall thickness and variable characteristics of the mask 1000.

The piezoelectric element 400 may have various shapes. For example, the piezoelectric element 400 may have a polygonal column shape in which lower and upper surfaces are polygonal, and the lower and upper surfaces may have a circular column shape. In addition, the piezoelectric element 400 may have one of a lower surface and an upper surface of a polygon and the other surface may have a columnar shape. For example, an area of at least one of a lower surface and an upper surface of the piezoelectric element 400 may be about 100 mm ² or less.

As described above, the piezoelectric element 400 may have various pillar shapes, and the intensity of ultrasonic energy generated according to the pillar shape, the oscillation direction, and the like can be controlled. In addition, the intensity of ultrasonic energy delivered to the user's skin may be adjusted according to the size, arrangement interval, and arrangement density of the piezoelectric element 400.

The piezoelectric element 400 may generate various waves. For example, the piezoelectric element 400 may generate at least one wave of a horizontal wave in which a direction in which the wave travels and a vibration direction of the medium are perpendicular, and a longitudinal wave in which the direction in which the wave travels and the vibration direction of the medium are the same. In addition, the piezoelectric element 400 may resonate multiple times. For example, the piezoelectric element 400 may include at least one via hole, and may resonate multiple times by the formed via hole. In this case, the upper area of the via hole may be about 10% to about 45% of the upper surface area of the piezoelectric element 400 for multiple resonance. In addition, when the piezoelectric element 400 has multiple resonances by the via holes, the number of multiple resonance frequency domains may correspond to the number of via holes. That is, the piezoelectric element 400 may emit wavelengths of various frequency ranges, for example, ultrasonic energy, as the number of via holes increases within a set number range of via holes.

A second base layer 120 may be disposed on the piezoelectric element 400. The second base layer 120 is a portion that faces the user's skin and can contact the skin, and may include a material harmless to the human body. In addition, the second base layer 120 may include a soft and elastic material. For example, the second base layer 120 is polyvinyl chloride to which silicone, thermoplastic resin, thermoplastic silicone resin, thermoplastic elastomer, polyurethane elastomer, ethylene vinyl acetate (EVA), harmless plasticizer and stabilizer are added ( PVC) may include at least one material. Preferably, the second base layer 120 may be relatively light and may include a silicone elastomer having a predetermined elasticity and may minimize irritation upon contact with the user's skin. The first base layer 110 may be made of the same material as the second base layer 120.

The second base layer 120 may pass the wavelength emitted from the piezoelectric element 400 in the direction of one surface of the mask 1000 to transmit the wavelength to the user's skin. That is, the second base layer 120 may be a transmission layer and may be a matching layer.

To this end, the thickness t2 of the second base layer 120 may vary according to an impedance of the second base layer 120 and a driving frequency of the piezoelectric element 400. In addition, the thickness t2 of the second base layer 120 may be greater than or equal to the thickness t1 of the first base layer 110.

For example, when the driving frequency of the piezoelectric element 400 is about 1 MHz or less, the thickness t2 of the second base layer 120 may be about 50 μm to about 10 mm. When the thickness (t2) of the second base layer 120 is less than about 50 μm, the thickness (t2) of the second base layer 120 is relatively thin, so that the configuration is disposed on the second base layer 120 Cannot effectively protect them. In detail, when the mask 1000 is elastically deformed and the second base layer 120 is elastically deformed, the wirings 200 and 300 and the piezoelectric element 400 on the second base layer 120 are It cannot be effectively protected.

In addition, when the thickness t2 of the second base layer 120 exceeds about 10 mm, the thickness of the entire mask 1000 may increase. It is preferable that the thickness t2 of the second base layer 120 satisfies the above-described range in order to effectively pass the wavelength emitted from the piezoelectric element 400. Preferably, the thickness t2 of the second base layer 120 is about 100 μm to about 1000 μm in consideration of reliability, transmission characteristics, variability of the manufactured mask 1000, thickness, weight, and ultrasonic impedance characteristics. It can have a thickness range.

That is, some of the ultrasonic energy emitted from the piezoelectric device 400 according to the embodiment may be emitted toward the second base layer 120 and passed through the second base layer 120 to be transmitted to the user's skin. have. In addition, another part of the ultrasonic energy may be emitted toward the first base layer 110 and reflected toward the second base layer 120 by the first base layer 110. Thereafter, the reflected ultrasonic energy may pass through the second base layer 120 and be transferred to the user's skin.

A second wiring 300 may be disposed on the second base layer 120. The second wiring 300 may be disposed on one surface of the second base layer 120 facing the piezoelectric element 400. The second wiring 300 may extend on the second base layer 120 in a different direction from the first wiring 200. For example, the second wiring 300 may extend in a second direction (y-axis direction) perpendicular to the first direction. The second wiring 300 may directly contact one surface of the second base layer 120. The second wiring 300 may be formed on one surface of the second base layer 120 by a process such as deposition, printing, or bonding. The second wiring 300 may be electrically connected to the piezoelectric element 400.

The second wiring 300 may include a conductive material. For example, the second wiring 300 is aluminum (Al), copper (Cu), silver (Ag), gold (Au), chromium (Cr), nickel (Ni), molybdenum (Mo), titanium (Ti) And it may include at least one metal of these alloys. In addition, the second wiring 300 may include a non-metal such as carbon, and may include a conductive elastic body. The second wiring 300 may include the same material as the first wiring 200.

The second wiring 300 may have a single layer or a multilayer structure. As an example, the second wiring 300 may have a single layer structure including one selected from the above-described materials. In addition, the second wiring 300 may have a multilayer structure including a metal selected from the above-described materials and a conductive elastic body. The second wiring 300 may have the same structure as the first wiring 200.

The second wiring 300 may include a plurality of second sub-wirings 301 disposed on the second base layer 120. Each of the plurality of second sub-wires 301 may extend in the second direction and may be disposed to be spaced apart from each other in the first direction. The plurality of second sub-wires 301 may be electrically connected to each other.

The thickness of the second sub-wire 301 may be about 2 μm to about 50 μm. In detail, the thickness of the second sub-wire 301 may be about 2 μm to about 40 μm. When the thickness of the second sub-wiring 301 is less than about 2 μm, electrical characteristics may be deteriorated, and it may be difficult to form uniformly. In addition, when the thickness of the second sub-wire 301 exceeds about 50 μm, the total thickness of the mask 1000 may increase, and the manufacturing time of the second wire 300 may increase. In addition, the thickness of the second sub-wire 301 is too thick, so that the stretchable characteristic may be deteriorated. Preferably, the thickness of the second sub-wire 301 may be about 5 μm to about 35 μm or less in consideration of stretchable characteristics, reliability, and process efficiency in the horizontal direction.

Also, the line width of the second sub-wiring 301 may be about 50 μm to about 500 μm. In detail, the line width of the second sub-wire 301 may be about 100 μm to about 450 μm. A line width of the second sub-wire 301 may be greater than a thickness of the second sub-wire 301. When the line width of the second sub-wire 301 is less than about 50 μm, reliability may be degraded, and when the line width of the second sub-wire 301 exceeds about 500 μm, the elongation decreases, resulting in a stretchable characteristic. It can be degraded. Preferably, the line width of the second sub-wire 301 may be about 100 μm to about 400 μm in consideration of stretchable characteristics.

The second wiring 300 may include a second connection part 310 and a second extension part 320. For example, one of the second sub-wires 301 may include a second connection part 310 and a second extension part 320 connected to the second connection part 310.

The second connection part 310 may be disposed in a region corresponding to the upper surface of the piezoelectric element 400. In detail, the second connection part 310 may be disposed in a region overlapping the upper surface of the piezoelectric element 400 in a vertical direction. The second connection part 310 may face an upper surface of the piezoelectric element 400. The second connector 310 may be provided in a number corresponding to the piezoelectric element 400.

The second connection part 310 may have a shape corresponding to an upper surface of the piezoelectric element 400. The second connection part 310 may have a width corresponding to the upper surface of the piezoelectric element 400. For example, the width of the second connection part 310 in the horizontal direction may be less than or equal to the width of the upper surface of the piezoelectric element 400 in the horizontal direction. In detail, the width of the second connection part 310 in the horizontal direction may be about 50% to about 100% of the width of the upper surface of the piezoelectric element 400 in the horizontal direction. When the width of the second connection part 310 in the horizontal direction is less than about 50%, electrical characteristics between the second wiring 300 and the piezoelectric element 400 may be deteriorated. In addition, when the width of the second connection part 310 in the horizontal direction is greater than the width of the lower surface of the piezoelectric element 400, the transmittance of ultrasonic energy may decrease. Therefore, it is preferable that the width of the second connection part 310 in the horizontal direction satisfies the above-described range.

The second extension part 320 may extend in a second direction from the second connection part 310. The second extension part 320 may be disposed between the plurality of second connection parts 310. In detail, the second extension part 320 may be disposed between the second connection parts 310 spaced apart in a second direction. That is, the second extension part 320 may connect between the adjacent second connection parts 310.

The second wiring 300 may have various shapes. For example, when viewed in a plan view, each of the plurality of second sub-wires 301 may extend in the second direction in the form of a straight line as shown in FIG. 3. In detail, the plurality of second sub-wires 301 are spaced apart from the adjacent second sub-wires 301 in the first direction at equal intervals, and may extend in the second direction in the form of a straight line. That is, the second extension part 320 of the second wiring 300 may have a straight line extending in the second direction.

In contrast, when viewed in a plan view, each of the plurality of second sub-wires 301 may extend in the second direction in a curved shape as shown in FIG. 4. For example, each of the plurality of second sub-wires 301 may be provided in a form in which a wavy pattern is repeated. That is, the second extension part 320 of the second wiring 300 may have a curved shape extending in the second direction.

In this case, the second extension part 320 may have a curvature pattern of about 3R to about 20R (mm). Accordingly, when the mask 1000 is stretched or contracted in one direction, the second wiring 300 has a stretchable characteristic and may not be cut off. Preferably, the second extension part 320 may have a curvature pattern of about 5R to about 15R (mm). In addition, the second extension part 320 may have an elongation of about 10% to about 50%. Accordingly, since the second wiring 300 may have improved stretchable characteristics, reliability may be improved, and adhesion with the user's skin may be improved.

Alternatively, although not shown in the drawings, the second extension part 320 may have a repeating pattern in which a straight line and a curved line extending in the second direction are mixed. For example, the second extension part 320 located in a region overlapping with a relatively curved region (nose, cheek, etc.) of the user's face when viewed from a plane may be provided in a curved shape, and a relatively flat region The second extension part 320 located in a region overlapping with (forehead, etc.) may be provided in a straight line. Accordingly, when the mask 1000 is attached to the user's face, damage to the second wiring 300 due to the deformation of the mask 1000 may be prevented. In addition, since the second extension part 320 is provided in a form in which straight lines and curves are mixed, it is possible to maintain electrical characteristics and reduce a ratio occupied by the second wires 300. Accordingly, according to the embodiment, the manufacturing cost of the second wiring 300 may be reduced, and loss of ultrasonic energy emitted from the piezoelectric element 400 may be minimized.

The first wiring 200 and the second wiring 300 may be disposed to cross each other. In detail, when viewed in a plan view as shown in FIG. 3, the first sub-wire 201 and the second sub-wire 301 may be disposed to cross each other in a mesh shape, and the sub-wires 201 and 301 ), an open area in which the wirings 200 and 300 are not disposed may be formed.

The piezoelectric element 400 may be disposed on an area where the first wiring 200 and the second wiring 300 cross each other. In detail, the center of the piezoelectric element 400 may overlap with an intersection point of the first sub-wire 201 and the second sub-wire 301. In more detail, the center of each of the lower and upper surfaces of the piezoelectric element 400 is the center of the first connection part 210 of the first wire 200 and the center of the second connection part 310 of the second wire 300 Can overlap with

Further, although not shown in the drawings, a vibration member (not shown) may be further disposed on the piezoelectric element. In order to improve the vibration characteristics of the piezoelectric element 400, a vibration member may be further disposed on the upper surface of the piezoelectric element 400. For example, the vibration member may be a vibration plate. The vibration member may be disposed between the piezoelectric element 400 and the second wiring 300.

The vibration member may be electrically connected to the piezoelectric element 400. The vibration member may include a metal material. As an example, the vibration member is aluminum (Al), copper (Cu), zinc (Zn), iron (Fe), nickel (Ni), chromium (Cr), silver (Ag), gold (Pt), stainless steel ( SUS) and at least one of the alloys thereof may be included.

The vibration member may have a shape corresponding to the piezoelectric element 400. For example, the vibration member may have a planar shape corresponding to an upper surface of the piezoelectric element 400. In addition, the vibration member may have a horizontal width corresponding to the upper surface of the piezoelectric element 400.

The thickness of the vibration member may be about 1500 μm or less. In detail, the thickness of the vibration member may be about 1200 μm or less. Preferably, the thickness of the vibration member may be about 1000 μm or less. The thickness of the vibration member preferably satisfies the above-described range in consideration of the variable characteristics of the mask 1000 and the vibration characteristics of the piezoelectric element 400.

The mask 1000 according to the embodiment may include a protective layer 550. The protective layer 550 may be disposed between the first base layer 110 and the second base layer 120. The protective layer 550 may be disposed in direct contact with one surface of the first base layer 110 and one surface of the second base layer 120.

The protective layer 550 may be disposed between the first base layer 110 and the second base layer 120 to protect the piezoelectric element 400. In detail, the protective layer 550 may be disposed between the base layers 110 and 120 to surround the piezoelectric element 400 and the wires 200 and 300 to protect the components.

The protective layer 550 may include a soft and elastic material. For example, the protective layer 550 is a polyvinyl chloride (PVC) containing silicone, a thermoplastic resin, a thermoplastic silicone resin, a thermoplastic elastomer, a polyurethane elastomer, an ethylene vinyl acetate (EVA), a harmless plasticizer and a stabilizer At least one of the materials may be included. Among them, the protective layer 550 may be relatively light and may minimize irritation upon contact with the user's skin, and may preferably include a silicone elastomer having a predetermined elasticity.

The protective layer 550 may be connected to the first base layer 110 and the second base layer 120. For example, the protective layer 550 may be integrally formed with the first base layer 110 and the second base layer 120. The protective layer 550 may be physically connected to the first base layer 110 and the second base layer 120 to protect components disposed therein.

The protective layer 550 may include the same material as the first base layer 110 and the second base layer 120. That is, the first base layer 110, the second base layer 120, and the protective layer 550 may have improved bonding strength as they include the same material.

Referring to FIG. 6, a connection relationship between the piezoelectric element 400, the first wiring 200, and the second wiring 300 will be described in more detail.

Referring to FIG. 6, the piezoelectric element 400 may be electrically connected to the first wiring 200 and the second wiring 300. In detail, the piezoelectric element 400 may include a first electrode 410 disposed on a lower surface. The first electrode 410 may be disposed in an area of about 80% or more of the total area of the lower surface of the piezoelectric element 400 in consideration of electrical characteristics. The first electrode 410 may be disposed in an area of about 90% of the total area of the lower surface of the piezoelectric element 400. In addition, the first electrode 410 may be disposed on the entire lower surface of the piezoelectric element 400.

The first electrode 410 may include a conductive material. For example, the first electrode 410 may include a metal material. In detail, the first electrode 410 includes aluminum (Al), copper (Cu), silver (Ag), gold (Au), chromium (Cr), nickel (Ni), molybdenum (Mo), titanium (Ti), and It may include at least one metal among these alloys.

The first electrode 410 may be disposed facing the first wire 200 and may be electrically connected to the first wire 200. In detail, a first bonding layer 451 may be disposed between the first electrode 410 and the first wiring 200. The first bonding layer 451 may physically and electrically connect the first electrode 410 and the first wiring 200. The overlapping ratio between the first bonding layer 451 and the first wiring 200 may be about 20% or more in consideration of physical and electrical characteristics. In detail, an overlapping ratio of one surface of the first wiring 200 facing the piezoelectric element 400 and the first bonding layer 451 may be about 20% or more.

The first bonding layer 451 is aluminum (Al), copper (Cu), silver (Ag), gold (Au), chromium (Cr), nickel (Ni), molybdenum (Mo), titanium (Ti), and these It may include at least one metal of the alloy.

The thickness of the first bonding layer 451 may be about 100 μm or less. In detail, the thickness of the first bonding layer 451 may be about 20 μm to about 80 μm. Preferably, the thickness of the first bonding layer 451 may be about 30 μm to about 60 μm.

The first bonding layer 451 may be disposed between the first electrode 410 and the first wiring 200 to serve as a conductive adhesive. As an example, the first bonding layer 451 may be applied in the form of a paste on the first wiring 200, and a piezoelectric structure including the first electrode 410 on the first bonding layer 451 The device 400 may be disposed. Accordingly, the piezoelectric element 400 may be physically and electrically connected to the first wiring 200.

The piezoelectric element 400 may include a second electrode 420 disposed on an upper surface. The second electrode 420 may be disposed in an area of about 80% or more of the total area of the top surface of the piezoelectric element 400 in consideration of electrical characteristics. In detail, the second electrode 420 may be disposed in an area of about 90% of the total area of the upper surface of the piezoelectric element 400. In addition, the second electrode 420 may be disposed on the entire lower surface of the piezoelectric element 400.

The second electrode 420 may include a conductive material. For example, the second electrode 420 may include a metal material. In detail, the second electrode 420 includes aluminum (Al), copper (Cu), silver (Ag), gold (Au), chromium (Cr), nickel (Ni), molybdenum (Mo), titanium (Ti), and It may include at least one metal among these alloys.

The second electrode 420 may be disposed facing the second wiring 300 and may be electrically connected to the second wiring 300. In detail, a second bonding layer 452 may be disposed between the second electrode 420 and the second wiring 300. The second bonding layer 452 may physically and electrically connect the second electrode 420 and the second wiring 300. The overlapping ratio between the second bonding layer 452 and the second wiring 300 may be about 20% or more in consideration of physical and electrical characteristics. In detail, an overlapping ratio between one surface of the second wiring 300 facing the piezoelectric element 400 and the second bonding layer 452 may be about 20% or more.

The second bonding layer 452 includes aluminum (Al), copper (Cu), silver (Ag), gold (Au), chromium (Cr), nickel (Ni), molybdenum (Mo), titanium (Ti), and these It may include at least one metal of the alloy.

The thickness of the second bonding layer 452 may be about 100 μm or less. In detail, the thickness of the second bonding layer 452 may be about 20 μm to about 80 μm. Preferably, the thickness of the second bonding layer 452 may be about 30 μm to about 60 μm.

The second bonding layer 452 may be disposed between the second electrode 420 and the second wiring 300 to serve as a conductive adhesive. For example, the second bonding layer 452 may be applied in the form of a paste on the second wiring 300, and a piezoelectric structure including the second electrode 420 on the second bonding layer 452 The device 400 may be disposed. Accordingly, the piezoelectric element 400 may be physically and electrically connected to the second wiring 300.

The thickness of the first bonding layer 451 may be the same as or different from the thickness of the second bonding layer 452. For example, since the first bonding layer 451 has the same thickness as the second bonding layer 452, the variability of the mask 1000 may be improved. As another example, the thickness of the first bonding layer 451 may be thicker than the thickness of the second bonding layer 452. Accordingly, a wavelength emitted from the piezoelectric element 400 toward the first base layer 110 may be reflected by the first bonding layer 451 and may move toward the second base layer 120.

The protective layer 550 includes the piezoelectric element 400, the first wiring 200, the second wiring 300, the first electrode 410, the second electrode 420, and the first bonding It may be disposed to surround the layer 451 and the second bonding layer 452, and it is possible to prevent the components from being exposed to the outside.

7 to 11 are diagrams for a method of manufacturing a conventional mask, and FIGS. 12 to 16 are diagrams for a method of manufacturing a mask according to an embodiment. In the description using FIGS. 7 to 16, descriptions of the same and similar configurations as the above-described mask are omitted, and the same reference numerals denote the same and similar configurations.

Prior to the description of the method of manufacturing a mask according to the embodiment, a method of manufacturing a conventional mask is first described.

Referring to FIG. 7, a method of manufacturing a conventional mask may include forming a wire on the protective film (S101).

The protective film may include a resin material. For example, the protective film may include resin materials such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyimide (PI), and may be provided in the form of a film having a predetermined thickness. I can. In addition, the wiring may include a conductive material. For example, the wiring is aluminum (Al), copper (Cu), silver (Ag), gold (Au), chromium (Cr), nickel (Ni), molybdenum (Mo), titanium (Ti), and alloys thereof It may contain at least one metal. In addition, the wiring may include a non-metal such as carbon, and may include a conductive elastic body.

The step of forming the wiring (S101) may include forming a first wiring 200 on the protective film and forming a second wiring 300 on the protective film. In detail, in the step (S101), the first wiring 200 may be disposed on the first protective film 811, and the second wiring 300 is a second wiring different from the first protective film 811 It may be disposed on the protective film 812.

Referring to FIG. 8, a method of manufacturing a conventional mask may include forming a filling layer on the protective film (S102).

The filling layer may include a soft and elastic material. For example, the filling layer is at least one of a polyvinyl chloride (PVC) material to which a silicone, a thermoplastic resin, a thermoplastic silicone resin, a thermoplastic elastomer, a polyurethane elastomer, an ethylene vinyl acetate (EVA), a harmless plasticizer and a stabilizer are added. It may contain one material. The filling layer may be relatively light and may minimize irritation upon contact with the user's skin, and may preferably include a silicone elastomer having a predetermined elasticity.

Forming a filling layer on the protective film (S102) includes forming a first filling layer 821 on the first protective film 811 and a second filling on the second protective film 812 Forming layer 822 may be included.

In the step of forming the first filling layer 821, the first filling layer 821 may be disposed on one surface of the first protective film 811. The first filling layer 821 may be disposed to directly contact one surface of the first protective film 811 and cover the entire surface of the first protective film 811. In addition, the first filling layer 821 may be disposed to surround the first wiring 200 disposed on one surface of the first protective film 811. The first filling layer 821 may be formed to be thicker than the thickness of the first wiring 200 to cover the entire side surface and the upper surface of the first wiring 200.

In addition, in the step of forming the second filling layer 822, the second filling layer 822 may be disposed on one surface of the second protective film 812. The second filling layer 822 may be disposed to directly contact one surface of the second protective film 812 and cover the entire surface of the second protective film 812. In addition, the second filling layer 822 may be disposed to surround the second wiring 300 disposed on one surface of the second protective film 812. The second filling layer 822 may be formed to be thicker than the thickness of the second wiring 300 to cover the entire side surface and the upper surface of the second wiring 300.

In the step of forming a filling layer on the protective film (S102), the first filling layer 821 and the second filling layer 822 may include the same material.

Referring to FIG. 9, the conventional method of manufacturing a mask may include removing the protective film (S103).

The step of removing the protective film (S103) may include removing the first protective film 811 and removing the second protective film 812.

In the step of removing the first protective film 811, the first protective film 811 may be removed and the lower surface of the first wiring 200 facing and directly contacting the first protective film 811 And a lower surface of the first filling layer 821 may be exposed.

In addition, in the step of removing the second protective film 812, the second protective film 812 may be removed, and the second wiring 300 facing and in direct contact with the second protective film 812 ) And the lower surface of the second filling layer 822 may be exposed.

Referring to FIG. 10, a method of manufacturing a conventional mask may include arranging a piezoelectric element (S104).

The piezoelectric element 400 may include a ceramic material. For example, the piezoelectric element 400 includes ZnO, AlN, LiNbO ₄ , lead antimony stannate, lead magnesium tantalate, lead nickel tantalate, and titanate ( titanates), tungstates, zirconates, or lead zirconate titanate [Pb(Zr _x Ti _1-x )O ₃ (PZT)], lead lanthanum zirconate titanate (PLZT), lead niobium Zirconate titanate (PNZT), BaTiO ₃ , SrTiO ₃ , lead magnesium niobate, lead nickel niobate, lead manganese niobate, lead zinc niobate, lead including lead titanate, barium, bismuth, or niobium of strontium It may contain at least one of niobates.

In the step of arranging the piezoelectric element (S104), the piezoelectric element 400 is aligned between the first protective film 811 and the second protective film 812 so that the first wiring 200 And the second wiring 300 may be connected.

In detail, in the step of arranging the piezoelectric element (S104), the first wiring 200 may be disposed to face the lower surface of the piezoelectric element 400, and the second wiring 300 may be formed of the piezoelectric element 400 ) May be disposed to face each of the upper surfaces.

In this case, a bonding member may be disposed between the first wiring 200 and the lower surface of the piezoelectric element 400, and between the second wiring 300 and the upper surface of the piezoelectric element 400, and the bonding member Accordingly, the piezoelectric element 400 may be bonded to the first wiring 200 and the second wiring 300. For example, the above-described first bonding layer 451 may be disposed between the first wiring 200 and the lower surface of the piezoelectric element 400, and the second wiring 300 and the piezoelectric element 400 The second bonding layer 452 described above may be disposed between the upper surfaces of ). The piezoelectric element 400 may be physically and electrically connected to the wirings 200 and 300 by the first and second bonding layers 451 and 452.

In addition, the step of arranging the piezoelectric element (S104) may include pressing. For example, the pressing may be a step of pressing (P) from the outside of the piezoelectric element 400 toward the center of the piezoelectric element.

In detail, the pressing may include the first filling layer 821 and the second filling layer in order to more effectively bond the piezoelectric element 400, the first wiring 200, and the second wiring 300. It may be a step of pressing (P) from the outside of 822 in the direction of the center of the piezoelectric element 400. That is, the pressing step may be a step of pressing (P) in a vertical direction (z axis, -z axis) with reference to FIG. 10.

Referring to FIG. 11, a method of manufacturing a conventional mask may include sealing a piezoelectric element.

Sealing the piezoelectric element (S105) may be a step of forming a third filling layer 823 between the first filling layer 821 and the second filling layer 822 using a filling material.

The third filling layer 823 may include a soft and elastic material. For example, the third filling layer 823 is a polyvinyl chloride containing silicone, a thermoplastic resin, a thermoplastic silicone resin, a thermoplastic elastomer, a polyurethane elastomer, an ethylene vinyl acetate (EVA), a harmless plasticizer and a stabilizer ( PVC) may include at least one material. The third filling layer 823 may be relatively light and may minimize irritation upon contact with the user's skin, and may preferably include a silicone elastomer having a predetermined elasticity.

In the sealing of the piezoelectric element (S105), the filler may be supplied between the first filling layer 821 and the second filling layer 822. Thereafter, the filler may be cured to form the third filler layer 823.

The third filling layer 823 may be disposed to surround the piezoelectric element 400. In addition, the third filling layer 823 may be disposed in direct contact with the lower surface of the first filling layer 821 and the lower surface of the second filling layer 822.

The third filling layer 823 may include the same material as the first filling layer 821 and the second filling layer 822. Since the third filling layer 823 includes the same material as the first filling layer 821 and the second filling layer 822, it may have improved bonding strength.

The first base layer 110, the second base layer 120, the piezoelectric element 400, the first wiring 200, the second wiring 300 and protection through the sealing of the piezoelectric element (S105) A mask including layer 550 may be manufactured.

However, the conventional method of manufacturing a mask has a problem in that the length and shape are changed due to the ductility of the material during the manufacturing process. In addition, the conventional manufacturing method has a problem in that the thickness of some layers changes due to pressure applied during the pressing process, and in severe cases, there is a problem in that the physical properties are partially changed.

In detail, referring to FIG. 9, when the protective film is removed in the step of removing the protective film (S103 ), the width, thickness, etc. may change due to the ductility of the filling layer. For example, when removing the first protective film 811 in the step (S103), the first filling layer 821 is in a horizontal direction (a plane direction formed by the x-axis and y-axis) by ductility. It can be stretched. In addition, when the second protective film 812 is removed, the second filling layer 822 may also be stretched in a horizontal direction due to ductility. In detail, when the first protective film 811 and the second protective film 812 are removed, the degree of increase of the first filling layer 821 and the second filling layer 822 may be random. I can. Accordingly, there is a problem in that the alignment of the first wiring 200 and the second wiring 300 disposed on the filling layers 821 and 822 is misaligned. For example, the first wiring 200 and the second wiring 300 may be disposed at a position deviated by a maximum of 150 μm or more in a horizontal direction from a position set by the above-described twisting. In addition, when the degree of stretching of the filling layers 821 and 822 described above is large, there is a problem that the wirings 200 and 00 are disconnected due to the ductility of the filling layers 821 and 822.

In addition, referring to FIG. 10, in the step of arranging the piezoelectric element 400 (S104 ), an alignment problem may occur between the piezoelectric element 400 and the wirings 200 and 300. In detail, as described above, when the first protective film 811 and the second protective film 812 are removed, there is a problem that the alignment of the first and second wirings 200 and 300 is misaligned. For example, due to a misalignment of the wires 200 and 300, the wires 200 and 300 and the piezoelectric element 400 may be disposed at a position deviating by a maximum of 1.7 mm or more in a horizontal direction. Accordingly, in the step of arranging the piezoelectric element 400 (S104), a connection between the piezoelectric element 400 and the wirings 200 and 300 may be unstable or a failure may occur.

In addition, the first filling layer 821 and the second filling layer 822 from which the protective film has been removed may have relatively very thin thicknesses. Accordingly, when the first filling layer 821 and the second filling layer 822 are disposed above and below the piezoelectric element 400, the piezoelectric element 400 and the first wiring ( It may be difficult to align the 200) and the second wiring 300.

In addition, when the first filling layer 821 and the second filling layer 822 are not transparent and colored, the first wiring 200 and the second wiring 300 are located above and below the piezoelectric element 400. It can be very difficult to align by placing each.

Accordingly, in the case of a mask manufactured by the conventional manufacturing method, there is a problem that some piezoelectric elements 400 are not electrically connected, and the overlapping ratio between the wirings 200 and 300 and the piezoelectric elements 400 is low There is a problem with an unstable connection.

In addition, the width and thickness of the first filling layer 821 and the second filling layer 822 may be changed in the step S104 of disposing the piezoelectric element 400. In detail, in step S104, the first filling layer 821 and the second filling layer 822 are used for bonding the piezoelectric element 400, the first wiring 200, and the second wiring 300. ) Can be pressurized. In this process, the thickness of the first filling layer 821 and the second filling layer 822 may be reduced, and the width may be increased by extending in a horizontal direction. For example, in step S104, the thicknesses of the first filling layer 821 and the second filling layer 822 may be reduced by about 5% to 30%.

Accordingly, the thickness of the first base layer 110 and the second base layer 120 of the manufactured mask, such as the thickness of the reflective layer and the matching layer, is changed to reflect the ultrasonic waves emitted from the piezoelectric element 400 There may be a problem in that the characteristics and impedance characteristics of ultrasonic waves change.

In order to solve the above-described problem, the mask according to the embodiment may be formed by a different manufacturing method than the above-described manufacturing method.

Hereinafter, a method of manufacturing a mask according to an exemplary embodiment will be described with reference to FIGS. 12 to 16.

Referring to FIG. 12, a method of manufacturing a mask according to an embodiment may include forming a wire on the protective film (S301).

The protective film may include a resin material. For example, the protective film may include resin materials such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyimide (PI), and may be provided in the form of a film having a predetermined thickness. I can. In addition, the wiring may include a conductive material. For example, the wiring is aluminum (Al), copper (Cu), silver (Ag), gold (Au), chromium (Cr), nickel (Ni), molybdenum (Mo), titanium (Ti), and alloys thereof It may contain at least one metal. In addition, the wiring may include a non-metal such as carbon, and may include a conductive elastic body.

The step of forming the wiring (S301) may include forming a first wiring 200 on the protective film and forming a second wiring 300 on the protective film. In detail, in the step (S301), the first wiring 200 may be disposed on the first protective film 811, and the second wiring 300 is a second wiring different from the first protective film 811 It may be disposed on the protective film 812.

Referring to FIG. 13, a method of manufacturing a mask according to an embodiment may include arranging a piezoelectric element (S302).

The piezoelectric element 400 may include a ceramic material. For example, the piezoelectric element 400 includes ZnO, AlN, LiNbO ₄ , lead antimony stannate, lead magnesium tantalate, lead nickel tantalate, and titanate ( titanates), tungstates, zirconates, or lead zirconate titanate [Pb(Zr _x Ti _1-x )O ₃ (PZT)], lead lanthanum zirconate titanate (PLZT), lead niobium Zirconate titanate (PNZT), BaTiO ₃ , SrTiO ₃ , lead magnesium niobate, lead nickel niobate, lead manganese niobate, lead zinc niobate, lead including lead titanate, barium, bismuth, or niobium of strontium It may contain at least one of niobates.

Arranging the piezoelectric element (S302) may be a step of disposing the piezoelectric element 400 between the first protective film 811 and the second protective film 812. The step S302 may be a step of disposing the piezoelectric element 400 between the first wiring 200 and the second wiring 300. In the step (S302), the piezoelectric element 400 is connected to the first wiring 200 and the second wiring 300

The step of arranging the piezoelectric element (S302) may be a step of disposing the piezoelectric element 400 on the first wiring 200 and the second wiring 300. In the step S302, the piezoelectric element 400 may be electrically connected to the first wiring 200 and the second wiring 300.

For example, a bonding member may be disposed between the first wiring 200 and the lower surface of the piezoelectric element 400, and between the second wiring 300 and the upper surface of the piezoelectric element 400, and the bonding member As a result, the piezoelectric element 400 may be bonded to the first wiring 200 and the second wiring 300. In detail, in step S302, a first bonding layer 451 may be disposed between the first wiring 200 and the lower surface of the piezoelectric element 400. The first wiring 200 and the bottom surface of the piezoelectric element 400 may be bonded by the first bonding layer 451. In addition, a second bonding layer 452 may be disposed between the second wiring 300 and the upper surface of the piezoelectric element 400. The second wiring 300 and the upper surface of the piezoelectric element 400 may be bonded by the second bonding layer 452. The piezoelectric element 400 may be physically and electrically connected to the wirings 200 and 300 by the first and second bonding layers 451 and 452.

Referring to FIG. 14, a method of manufacturing a mask according to an embodiment may include sealing a piezoelectric element (S303).

Sealing the piezoelectric element (S303) may be a step of forming a fourth filling layer 851 between the first protective film 811 and the second protective film 812 using a filler.

The fourth filling layer 851 may include a soft and elastic material. For example, the fourth filling layer 851 is polyvinyl chloride to which silicone, thermoplastic resin, thermoplastic silicone resin, thermoplastic elastomer, polyurethane elastomer, ethylene vinyl acetate (EVA), a harmless plasticizer and a stabilizer are added ( PVC) may include at least one material. The fourth filling layer 851 may be relatively light and may minimize irritation upon contact with the user's skin, and may preferably include a silicone elastomer having a predetermined elasticity.

In the step of sealing the piezoelectric element (S303), the filler may be supplied between the first protective film 811 and the second protective film 812. Thereafter, the filler may be cured to form the fourth filler layer 851.

The fourth filling layer 851 may be disposed surrounding the piezoelectric element 400. The fourth filling layer 851 may directly contact the piezoelectric element 400. The fourth filling layer 851 may be formed to be thicker than the piezoelectric element 400 and may be disposed to surround the entire piezoelectric element 400. In addition, the fourth filling layer 851 may be disposed to surround the first and second wirings 200 and 300 disposed on the first and second protective films 811 and 812. The fourth filling layer 851 may directly contact the first and second wirings 200 and 300. In addition, the fourth filling layer 851 may directly contact the first bonding layer 451 and the second bonding layer 452.

Referring to FIG. 15, a method of manufacturing a mask according to an embodiment may include removing the protective film (S304).

The step of removing the protective film (S304) may be a step of removing the first protective film 811 and the second protective film 812 and forming a structure defined as the first structure S1.

In the step S304, the first protective film 811 disposed on the lower surface of the fourth filling layer 851 may be removed. In addition, in the step S304, the second protective film 812 disposed on the upper surface of the fourth filling layer 851 may be removed. In the step S304, the first and second protective films 811 and 812 may be removed by a mechanical or chemical method, but the embodiment is not limited thereto.

After removing the protective film (S304), the lower and upper surfaces of the fourth filling layer 851 may be exposed. In detail, the lower surface of the first wiring 200 facing the upper surface of the first protective film 811 may be exposed. In this case, the lower surface of the fourth filling layer 851 may be disposed on the same plane as the lower surface of the first wiring 200. In addition, a lower surface of the second wiring 300 facing the upper surface of the second protective film 812 may be exposed. In this case, the upper surface of the fourth filling layer 851 may be disposed on the same plane as the lower surface of the second wiring 300.

The first structure S1 including the piezoelectric element 400, the first wiring 200, the second wiring 300, and the fourth filling layer 851 may be formed through the step S304.

Referring to FIG. 16, a method of manufacturing a mask according to an embodiment may include forming a filling layer on the first structure (S305).

The step of forming the filling layer (S305) may be a step of forming a fifth filling layer 852 on the first structure S1 by disposing a filler on the first structure S1.

The fifth filling layer 852 is made of polyvinyl chloride (PVC) to which silicone, thermoplastic resin, thermoplastic silicone resin, thermoplastic elastomer, polyurethane elastomer, ethylene vinyl acetate (EVA), harmless plasticizer and stabilizer are added. It may include at least one material. The fifth filling layer 852 is relatively light and can minimize irritation upon contact with the user's skin, and may preferably include a silicone elastomer having a predetermined elasticity.

In the step S305, the filler may be supplied around the first structure S1. For example, in step S305, the first structure S1 may be disposed in a molding jig having a receiving portion of a set shape and size. Thereafter, the filler may be supplied into the molding jig, and the filler may be disposed to surround the first structure S1. Thereafter, the filler may be cured to become the fifth filler layer 852. In this case, the fifth filling layer 852 may include the same material as the fourth filling layer 851. Since the fifth filling layer 852 includes the same material as the fourth filling layer 851, it may have an improved bonding force.

The fifth filling layer 852 may be disposed surrounding the upper and lower surfaces of the first structure S1. Further, although not shown in the drawings, the fifth filling layer 852 may be disposed to surround at least one side surface of the first structure S1. For example, the fifth filling layer 852 may be disposed to surround the entire side surface of the first structure S1.

That is, the fifth filling layer 852 may directly contact the upper and lower surfaces of the fourth filling layer 851. In addition, the fifth filling layer 852 may directly contact a side surface of the fourth filling layer 851. In addition, the fifth filling layer 852 may directly contact the first wiring 200 and the second wiring 300. The fifth filling layer 852 may be disposed to selectively surround the outer surface of the first structure S1 according to the shape and/or size of the molding jig, but is not limited thereto.

The first base layer 110, the second base layer 120, the piezoelectric element 400, the first wiring 200, and the second wiring are formed through the step of forming a filling layer on the first structure (S305). The mask 1000 according to the embodiment including 300) and the protective layer 550 may be manufactured.

Therefore, the method of manufacturing a mask according to the embodiment can prevent or minimize the deformation of the layer that occurs during the manufacturing process, and the alignment characteristic between the piezoelectric element 400 and the wirings 200 and 300 is improved. Can be improved.

In detail, in the conventional mask manufacturing method (see FIGS. 9 and 10), filling layers 821 and 822 surrounding the wirings 200 and 300 are formed on the protective films 811 and 812, and the protective film 811 After removing the, 812 ), the piezoelectric element and the wirings 200 and 300 were connected.

However, in the method of manufacturing a mask according to the embodiment, prior to forming a separate filling layer surrounding the wirings 200 and 300 on the protective films 811 and 812, the wirings 200 and 300 and the piezoelectric element 400 can be connected.

That is, in the embodiment, when the wirings 200 and 300 and the piezoelectric element 400 are connected, a separate filling layer is not disposed on the protective films 811 and 812, and thus, due to the ductility of the filling layer. It is possible to prevent or reduce the occurrence of an alignment failure between the piezoelectric element 400 and the wirings 200 and 300. For example, in the process of manufacturing the mask 1000, a maximum degree of shift between the wirings 200 and 300 and the piezoelectric element 400 based on a horizontal direction may be about 1 mm or less. In detail, the degree of deviation may be about 500 μm or less. Preferably, the degree of deviation may be about 300 μm or less. That is, the embodiment may have improved alignment characteristics compared to a conventional manufacturing method that is displaced by a maximum of 1.7 mm or more, and the piezoelectric element 400 may have improved reliability with the wirings 200 and 300. .

In addition, conventionally, when the filling layers 821 and 822 surrounding the wires 200 and 300 are colored (refer to FIGS. 8 to 10), alignment of the wires 200 and 300 and the piezoelectric element 400 There is a problem that (align) is very difficult.

However, in the embodiment, the wirings 200 and 300 and the piezoelectric element 400 may be first connected before a separate filling layer is disposed, and thereafter, a fourth filling layer surrounding the piezoelectric element 400 ( 851) can be placed. Accordingly, the fourth filling layer 851 surrounding the piezoelectric element 400 may be provided in various colors regardless of color.

In addition, conventionally, in the step of arranging the piezoelectric element (see S104 (refer to FIG. 10)), a pressurization process of applying a predetermined pressure for coupling between the piezoelectric element 400 and the wirings 200 and 300 was performed.

However, in the embodiment, a separate pressing process may be omitted, and the mask 1000 may be manufactured by arranging the first structure in the molding jig and forming the fifth filling layer 852. Accordingly, the thickness of the first base layer 110 and the second base layer 120 of the manufactured mask 1000, for example, the thickness of the reflective layer and the matching layer may be manufactured to a set thickness. Accordingly, the mask 1000 according to the embodiment may have uniform ultrasonic reflection characteristics and impedance characteristics.

FIG. 17 is another exploded perspective view of area A1 of FIG. 1, and FIG. 18 is a cross-sectional view of the mask of FIG. 17. In the description using FIGS. 17 and 18, descriptions of the same and similar configurations as the above-described mask are omitted, and the same reference numerals are assigned to the same and similar configurations.

17 and 18, the mask 1000 according to the embodiment may further include a first substrate 510 and a second substrate 520.

The first substrate 510 may be disposed on the first base layer 110. The first substrate 510 may be disposed between the first base layer 110 and the first wiring 200. The first substrate 510 may directly contact one surface of the first base layer 110. In this case, the first wiring 200 may be spaced apart from the first base layer 110 and may directly contact the first substrate 510.

The first substrate 510 is transparent and may include a material in consideration of moisture barrier properties and thermal stability. In addition, the first substrate 510 may include a material that has flexibility and is elastically deformed according to the curved shape of the user's skin. For example, the first substrate 510 may include a resin material such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyimide (PI). The first substrate 510 may be provided in the form of a film.

The first substrate 510 may have a thickness of about 0.5 μm to about 5 μm or less. When the thickness of the first substrate 510 is less than about 0.5 μm, the components disposed on the first substrate 510, for example, the first substrate 510 overlapped with the components by the weight of the piezoelectric element 400 1 There may be a problem that the area of the substrate 510 is struck. Accordingly, reliability of the first substrate 510 may be deteriorated, and a problem of alignment of components disposed on the first substrate 510 may occur. In addition, when the thickness of the first substrate 510 exceeds about 5 μm, the total thickness of the mask 1000 may be increased. Accordingly, there is a problem in that the mask 1000 cannot be elastically deformed efficiently according to the shape of the user's skin, and thus cannot be effectively in close contact with the user's skin. Preferably, the first substrate 510 may have a thickness of about 0.5 μm to about 3 μm. When the thickness of the first substrate 510 satisfies the above-described range, reliability and alignment characteristics can be maintained and elastically deformed efficiently into a shape corresponding to the user's skin, and the total thickness of the mask 1000 and Weight can be reduced.

The second substrate 520 may be disposed on the second base layer 120. The second substrate 520 may be disposed between the second base layer 120 and the second wiring 300. The second substrate 520 may directly contact one surface of the second base layer 120. In this case, the second wiring 300 may be spaced apart from the second base layer 120 and may directly contact the second substrate 520.

The second substrate 520 is transparent and may include a material in consideration of moisture barrier properties and thermal stability. In addition, the second substrate 520 may include a material that has flexibility and is elastically deformed according to the curved shape of the user's skin. For example, the second substrate 520 may include a resin material such as polyethylene terephthalate (PET), polyethylene nattalate (PEN), and polyimide (PI). The second substrate 520 may be provided in the form of a film. The second substrate 520 may have the same material and shape as the first substrate 510, but is not limited thereto.

The second substrate 520 may have a thickness of about 0.5 μm to about 5 μm. When the thickness of the second substrate 520 is less than about 0.5 μm, components disposed on the second substrate 520, for example, the second substrate 520 overlapping the components by the weight of the piezoelectric element 400 2 There may be a problem that the area of the substrate 520 is hit. Accordingly, reliability of the second substrate 520 may be deteriorated, and an alignment problem may occur between components disposed on the second substrate 520. In addition, when the thickness of the second substrate 520 exceeds about 5 μm, the total thickness of the mask 1000 may be increased. Accordingly, there is a problem in that the mask 1000 cannot be elastically deformed efficiently according to the shape of the user's skin, and thus cannot be effectively in close contact with the user's skin. Preferably, the second substrate 520 may have a thickness of about 0.5 μm to about 3 μm. When the thickness of the second substrate 520 satisfies the above-described range, reliability and alignment characteristics can be maintained and elastically deformed efficiently into a shape corresponding to the user's skin, and the total thickness of the mask 1000 and Weight can be reduced. The second substrate 520 may have the same thickness as the first substrate 510, but is not limited thereto.

In the embodiment, as the first substrate 510 and the second substrate 520 are added, alignment characteristics of the piezoelectric element 400 may be improved. In addition, since the first substrate 510 and the second substrate 520 are added, an inflow path of moisture and foreign substances introduced from the outside may be increased, so that the mask 1000 may have improved reliability.

19 to 21 are diagrams illustrating an example in which an indicator and a protrusion are provided to a mask according to an embodiment.

Referring to FIG. 19, the mask 1000 may include an indicator 610. The indicator 610 may include at least one of members such as an LED, a display, and a buzzer that can transmit information to a user, such as visually or aurally.

The indicator 610 may be disposed outside the mask 1000 to display an operation state of the mask 1000. For example, the indicator 610 may provide information on the start of the operation of the mask 1000, information indicating that the operation is in progress, and information on the completion of the operation through auditory information generated from a buzzer. In addition, the indicator 610 may display an operation state according to the emission color of the LED. In addition, the indicator may display information on an operating frequency domain through the display.

Further, referring to FIGS. 20 and 21, the mask 1000 may include a protrusion 620 disposed on an outer surface. In detail, the protrusion 620 may be disposed on a surface of the second base layer 120 facing the user's skin. For example, the protrusion 620 may be disposed on the other surface opposite to one surface of the second base layer 120 on which the second wiring 300 is disposed.

The protrusion 620 may include a material harmless to the human body and may be disposed to protrude from the other surface of the second base layer 120 toward the user's skin. The protrusions 620 may be disposed in the form of a plurality of points spaced apart from each other on the other surface of the second base layer 120. In addition, the protrusions 620 may be disposed on the other surface of the second base layer 120 in the form of a plurality of straight lines or curved lines spaced apart from each other. In addition, the protrusion 620 may be disposed in the form of at least one line on the other surface of the second base layer 120. For example, the protrusion 620 may be disposed on the other surface of the second base layer 120 in at least one spiral shape.

When the user wears the mask 1000, the protrusion 620 may form a predetermined space between the mask 1000 and the user's skin. Accordingly, by the pressure generated when the mask 1000 is worn and/or the ultrasonic energy generated from the piezoelectric element 400, cosmetics or drugs between the mask 1000 and the skin are at the edge of the mask 1000 It can prevent being pushed into the area. That is, the protrusion 620 may serve as a partition wall preventing cosmetics or drugs from escaping from the mask 1000. Therefore, the user can effectively inject cosmetics or drugs into the skin using the mask 1000.

22 is a diagram illustrating a user wearing a mask according to an embodiment, and FIG. 23 is a diagram illustrating a skin care device to which the mask according to the embodiment is applied.

Referring to FIG. 22, the user 50 may wear the mask 1000. The mask 1000 may include the above-described opening 1010, and the user 50 may secure a view through the opening 1010. In addition, the mask 1000 may include the above-described cutting portion 1020, and the mask 1000 may be effectively in close contact with the curved skin by the cutting portion 1020. In this case, one surface of the second base layer 120 may directly contact the skin of the user 50. In addition, drugs or cosmetics are disposed between the second bath layer 520 and the skin of the user 50 so that the base layer 520 may directly or indirectly contact the skin of the user 50.

The mask 1000 may be operated by receiving power through an external power connected to the mask 1000. In addition, the mask 1000 may be operated by receiving power through a power supply unit (not shown) disposed outside the mask 1000, for example, on the other surface of the first base layer 110.

Also, referring to FIG. 23, the mask 1000 may be applied to and operated on the skin care device 1.

In detail, referring to FIG. 23, the skin care device 1 may include a body 10 that is open on one side and includes an accommodation space 11 therein.

The body 10 is light and may include a material capable of preventing damage from external impact or contact. For example, the body 10 may include a plastic or ceramic material, and may have improved reliability from an external environment, and may protect the mask 1000 disposed inside the accommodation space 11. In addition, the main body 10 may include a viewing part 13 formed at a position corresponding to the user's eyes. The viewing part 13 is formed in an area corresponding to the opening 1010 of the mask 1000, and a user can secure an external view through the viewing part 13.

The mask 1000 may be disposed in the receiving space 11 of the body 10. The mask 1000 may be disposed between the body 10 and the skin of the user 50. In detail, the first base layer 110 of the mask 1000 may be disposed to face the receiving space 11 of the body 10, and the second base layer 120 of the mask 1000 is 50 can be arranged to face the skin.

The mask 1000 may be coupled to the body 10. For example, the mask 1000 may be fixed to a set position of the receiving space 11 by a fastening member (not shown), and may have a structure that is detachable from the main body 10.

The mask 1000 may receive power through a power supply (not shown) disposed outside the mask 1000, for example, on the other surface of the first base layer 110. Alternatively, the mask 1000 may be connected to the body 10 to receive power through a power supply unit (not shown) disposed on the body 10.

The mask 1000 may include a deformable member (not shown) disposed on the lower surface of the first base layer 110. The deformable member may directly contact the first base layer 110 and may be disposed facing the receiving space 11 of the main body 10. That is, the deformable member may be disposed between the body 10 and the first base layer 110 of the mask 1000.

The deformable member may include a material whose shape is changed by external pressure. For example, the deformable member may include a material such as an air gap or a sponge, but is not limited thereto, and may include various materials whose shape is changed by external pressure. Accordingly, when the user 50 wears the skin care device 1, the deformable member may be transformed into a form corresponding to the face form of the user 50. Accordingly, the mask 1000 and the skin of the user 50 can be effectively brought into close contact. In addition, when a plurality of users wear the skin care device 1, the skin of the user 50 and the mask 1000 may be effectively brought into close contact with each other by deforming to correspond to each face shape.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Further, the features, structures, effects, and the like illustrated in each embodiment may be combined or modified for other embodiments by a person having ordinary knowledge in the field to which the embodiments belong. Accordingly, contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention.

In addition, although the embodiments have been described above, these are only examples and do not limit the present invention, and those of ordinary skill in the field to which the present invention belongs are illustrated above within the scope not departing from the essential characteristics of the present embodiment. It will be seen that various modifications and applications that are not available are possible. For example, each component specifically shown in the embodiment can be modified and implemented. And differences related to these modifications and applications should be construed as being included in the scope of the present invention defined in the appended claims.

Claims (10)

A first wiring disposed on the first base layer;
A plurality of piezoelectric elements disposed on the first wiring;
Second wirings disposed on the plurality of piezoelectric elements;
A second base layer disposed on the second wiring; And
A protective layer disposed between the first and second base layers and surrounding the first wiring, the second wiring, and the plurality of piezoelectric elements; and
The first base layer, the second base layer, and the protective layer are made of the same material. The method of claim 1,
The thickness of the first base layer is less than or equal to the thickness of the second base layer. The method of claim 1,
The first wiring includes a first connection part disposed in a region corresponding to a lower surface of the piezoelectric element; And a first extension part extending in a first direction from the first connection part,
The second wiring includes a second connector disposed in a region corresponding to an upper surface of the piezoelectric element; And a second extension part extending in a second direction from the second connection part,
The width of the first connection portion in the horizontal direction is 50% to 100% of the width of the lower surface of the piezoelectric element,
A mask having a width of the second connection part in a horizontal direction of 50% to 100% of a width of an upper surface of the piezoelectric element. The method of claim 3,
Each of the first and second extension portions has a shape of a curve extending while serpentinely at a set curvature,
The set curvature of each of the first and second extension portions is 3R(mm) to 20R(mm). The method of claim 1,
A first substrate disposed between the first base layer and the first wiring; And
A mask further comprising a second substrate disposed between the second base layer and the second wiring. Forming a first wiring on the first protective film and forming a second wiring on the second protective film;
Disposing a piezoelectric element on the first wiring and the second wiring;
Sealing the piezoelectric element by forming a first filling layer;
Forming a first structure by removing the first and second protective films; And
A method of manufacturing a mask including forming a second filling layer on the first structure. The method of claim 6,
The forming of the second filling layer includes forming the first structure by molding a filler by placing the first structure in a molding jig. The method of claim 6,
The method of manufacturing a mask wherein the first filling layer and the second filling layer include the same material. The method of claim 7,
The first filling layer and the second filling layer are polyvinyl chloride (PVC) containing silicone, thermoplastic resin, thermoplastic silicone resin, thermoplastic elastomer, polyurethane elastomer, ethylene vinyl acetate (EVA), a harmless plasticizer and a stabilizer. ) A method of manufacturing a mask including at least one of the materials. A main body having one side open and an accommodation space in the open area; And
A mask disposed in the open area and connected to the main body,
The skin care device, wherein the mask is a mask according to any one of claims 1 to 5.

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