KR20200132475A - Mask and skin care device including the same - Google Patents

Abstract

A mask according to an embodiment comprises: a first substrate disposed on a first base layer; a first wiring disposed on the first substrate and extending in a first direction; a second wiring disposed on the first substrate and extending in a second direction; a first insulating layer disposed between the first and second wirings; a second insulating layer disposed on the first substrate while surrounding parts of the first and second wirings and the first insulating layer; a piezoelectric element disposed on the second insulating layer; a second substrate disposed on the piezoelectric element; and a second base layer disposed on the second substrate. The second insulating layer comprises: a first through-hole that overlaps the first wiring; and a second through-hole that overlaps the second wiring. In the first through-hole, a first connection wiring electrically connected to the first wiring is disposed. In the second through-hole, a second connection wiring electrically connected to the second wiring is disposed. The piezoelectric element is electrically connected to the first and second connection wirings. In addition, a skin care device according to an embodiment comprises: a main body including an opened one side and an accommodating space in the opened region; and the mask disposed in the opened region and connected to the main body. According to the present invention, the mask can be effectively in close contact with the skin of a user.

Description

Mask and skin care device including the same TECHNICAL FIELD [MASK AND SKIN CARE DEVICE INCLUDING THE SAME}

The embodiment relates to a mask and a skin care device.

Human skin may be damaged or contaminated depending on external factors such as environmental pollution, ultraviolet rays, and stress, and wrinkles may occur due to internal factors such as aging and hormonal changes. Recently, as interest in skin increases, various devices for skin treatment, beauty, and anti-aging have been developed.

In detail, devices capable of applying thermal energy to the skin, such as devices capable of improving skin elasticity by applying infrared energy, have been developed. In addition, devices using sound waves or light rays have been developed to effectively inject cosmetics or drugs into the skin. For example, a device capable of forming a path through which cosmetics or drugs are injected into the skin by using sonophoresis and laser pollination are being developed. In addition, devices using electric propulsion force have been developed to effectively inject cosmetics or drugs into the skin. For example, a device that can effectively inject ionic substances contained in cosmetics or drugs into the skin using iontophoresis, electroporation, and electroosmosis has been developed. have. That is, various devices are being developed that can care or treat a user's skin by providing light energy, microcurrent, and vibration to the skin.

In general, the above-described devices may be provided in the form of a patch detachable to the skin, and are attached to a specific skin area to care or treat the skin of the attached area. In addition, the above-described devices are provided in the form of a mask pack disposed to cover the entire user's face to care or treat facial skin.

However, the devices have a problem in that it is difficult to effectively contact the curved skin surface such as both cheeks and nose. In detail, it may be difficult to effectively contact the user's skin due to the material and variable characteristics of the device. In addition, since the device is formed to have a predetermined thickness, it may be difficult to effectively contact the user's skin.

Accordingly, the device may be operated in a state that is not completely in close contact with the user's skin, and may be separated from the user's skin due to the user's movement and vibration of the device during the operation process. Therefore, there is a problem in that it is difficult to effectively obtain a care or treatment effect through the device.

Therefore, a new mask capable of solving the above-described problem is required.

The embodiment is to provide a mask and skin care device having variability and improved reliability.

In addition, the embodiment is to provide a mask and a skin care device capable of effectively contacting the user's skin.

In addition, the embodiment is to provide a mask and a skin care device capable of providing uniform ultrasonic energy to a user's skin.

In addition, the embodiment is to provide a mask and skin care device capable of reducing the overall thickness and weight.

In addition, the embodiment is to provide a mask and a skin care device capable of minimizing the loss of ultrasonic energy generated during operation.

The mask according to the embodiment includes a first substrate disposed on a first base layer, a first wiring disposed on the first substrate and extending in a first direction, and disposed on the first substrate and extending in a second direction. A second wiring, a first insulating layer disposed between the first and second wirings, a second insulating layer disposed on the first substrate and surrounding some of the first and second wirings and the first insulating layer , A piezoelectric element disposed on the second insulating layer, a second substrate disposed on the piezoelectric element, and a second base layer disposed on the second substrate, and the second insulating layer is the first wiring A first through hole overlapping with and a second through hole overlapping with the second wire, and a first connection wire electrically connected to the first wire is disposed in the first through hole, and the second A second connection wire electrically connected to the second wire is disposed in the through hole, and the piezoelectric element is electrically connected to the first and second connection wires.

In addition, a skin care device according to an embodiment includes a body having one side open and an accommodation space in the open area, and the mask disposed in the open area and connected to the body.

The mask according to the embodiment may be changed according to the shape of the user's curved skin by the base layers and base layers having a variable material. Accordingly, the mask can effectively contact the user's skin.

In addition, the mask according to the embodiment includes a plurality of piezoelectric elements, and the piezoelectric elements may generate ultrasonic energy in the entire area of the mask. Accordingly, ultrasonic energy having a uniform intensity may be provided to a user wearing the mask.

In addition, piezoelectric elements according to the embodiment may be disposed at different intervals according to the shape of the user's face. In detail, piezoelectric elements arranged in relatively curved areas such as the user's nose and cheeks, and flat areas such as forehead are arranged at different intervals, so that ultrasonic energy of uniform intensity can be provided to the curved area of the user's face. I can.

In addition, the piezoelectric device according to the embodiment may include a MEMS device. Accordingly, the piezoelectric element can be provided with a slim thickness and a light weight, so that the overall thickness and weight of the mask can be effectively reduced. In addition, as the thickness and weight of the mask decreases, the mask may have improved variability and more effectively adhere to the user's skin.

In addition, the piezoelectric device may have an improved degree of integration as the MEMS device is included, and thus, ultrasonic energy may be effectively provided to the user's skin.

Further, the piezoelectric device according to the embodiment may be disposed on the substrate at a high ratio per unit area as the MEMS device is included. Accordingly, it is possible to generate uniform ultrasonic energy over the entire area of the mask, thereby effectively providing ultrasonic waves to the user's skin.

1 is a front view of a mask according to an embodiment.
FIG. 2 is an exploded perspective view of area A1 of FIG. 1.
3 is a top view of area A1 of FIG. 1.
4 is another top view of area A1 of FIG. 1.
5 is a top view in which the piezoelectric element is omitted in FIG. 4.
6 is a cross-sectional view showing a cross-section AA′ of FIG. 4.
7 is an enlarged cross-sectional view of area A2 in FIG. 6.
8 is another cross-sectional view showing an enlarged view of area A2 of FIG. 6.
9 to 11 are diagrams illustrating examples in which indicators and protrusions are provided to the mask according to the embodiment.
12 is a diagram illustrating a user wearing a mask according to an embodiment.
13 is a diagram illustrating a skin care device to which a mask is applied according to an embodiment.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the technical idea of the present invention is not limited to some embodiments to be described, but may be implemented in various different forms, and within the scope of the technical idea of the present invention, one or more of the constituent elements may be selectively selected between the embodiments. It can be combined with and substituted for use.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention are generally understood by those of ordinary skill in the art, unless explicitly defined and described. It can be interpreted as a meaning, and terms generally used, such as terms defined in a dictionary, may be interpreted in consideration of the meaning in the context of the related technology.

In addition, terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention. In the present specification, the singular form may include the plural form unless specifically stated in the phrase, and when described as "at least one (or more than one) of A and (and) B and C", it is combined with A, B, and C. It may contain one or more of all possible combinations.

In addition, terms such as first, second, A, B, (a), and (b) may be used in describing the constituent elements of the embodiment of the present invention. These terms are only for distinguishing the component from other components, and are not limited to the nature, order, or order of the component by the term. And, when a component is described as being'connected','coupled' or'connected' to another component, the component is not only directly connected, coupled or connected to the other component, but also the component and The case of being'connected','coupled', or'connected' due to another element between the other elements may also be included.

In addition, when it is described as being formed or disposed on the “top (top) or bottom (bottom)” of each component, the top (top) or bottom (bottom) is one as well as when the two components are in direct contact with each other. It also includes a case in which the above other component is formed or disposed between the two components. In addition, when expressed as "upper (upper) or lower (lower)", the meaning of not only an upward direction but also a downward direction based on one component may be included.

In addition, before describing the embodiments of the present invention, the first direction may refer to the x-axis direction shown in the drawings, and the second direction may be a different direction from the first direction. For example, the second direction may mean a y-axis direction shown in the drawing in a direction perpendicular to the first direction. In addition, the horizontal direction may mean first and second directions, and the vertical direction may mean a direction perpendicular to at least one of the first and second directions. For example, the horizontal direction may mean the x-axis and y-axis directions of the drawing, and the vertical direction may be a direction perpendicular to the x-axis and y-axis directions in the z-axis direction of the drawing.

1 is a front view of a mask according to an embodiment, and FIG. 2 is an exploded perspective view of area A1 of FIG. 1. Further, FIG. 3 is a top view of area A1 of FIG. 1, and FIG. 4 is another top view of area A1 of FIG. 1. In addition, FIG. 5 is a top view in which the piezoelectric element is omitted in FIG. 4, and FIG. 6 is a cross-sectional view showing a cross section taken along line A-A' of FIG.

Referring to FIGS. 1 to 6, the mask 1000 according to the embodiment is provided in a predetermined size to cover the user's face and may have a predetermined elasticity in order to closely contact the user's face. The mask 1000 includes one surface in contact with the user's skin and the other surface opposite to the one surface, and one surface of the mask 1000 is made of a material that is harmless to the human body, so that it may be harmless even if it is in contact with the user's skin for a long time. have.

The mask 1000 may include at least one of an opening 1010 and a cutout 1020. In detail, the opening 1010 may be formed in a portion corresponding to the user's eyes or mouth. The opening 1010 is a region penetrating one surface and the other surface of the mask 1000 facing the user's skin. When the user wears the mask 1000, the user's eyes, mouth, etc. are in the opening 1010. It may be inserted, and the area excluding the opening 1010 may be in close contact with the user's face. In addition, the cutting portion 1020 may be formed in a portion corresponding to a relatively curved ball line, a chin, etc. to improve adhesion between the mask 1000 and the skin. The cutting part 1020 may have a form in which one surface and the other surface of the mask 1000 are partially cut.

In the mask 1000 according to the embodiment, the first substrate 110, the first wiring 210, the second wiring 220, the piezoelectric element 300, and the second substrate 120 are formed in a region other than the opening 1010. ) Can be included.

The first substrate 110 is transparent and may include a material in consideration of moisture barrier properties and thermal stability. In addition, the first substrate 110 may include a material that has flexibility and varies according to the shape of the user's curved skin. For example, the first substrate 110 may include a resin material such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyimide (PI). The first substrate 110 may be provided in the form of a film.

The first substrate 110 may have a thickness of about 0.5 μm to about 5 μm or less. When the thickness of the first substrate 110 is less than about 0.5 μm, the components disposed on the first substrate 110, for example, the first substrate 110 overlapped with the components by the weight of the piezoelectric element 300 1 There may be a problem that the area of the substrate 110 is struck. Accordingly, reliability of the first substrate 110 may be deteriorated, and a problem of alignment of components disposed on the first substrate 110 may occur. In addition, when the thickness of the first substrate 110 exceeds about 5 μm, the total thickness of the mask 1000 may be increased. Accordingly, there is a problem in that the mask 1000 cannot be effectively changed according to the shape of the user's skin, and thus does not effectively adhere to the user's skin. Preferably, the first substrate 110 may have a thickness of about 0.5 μm to about 3 μm. When the thickness of the first substrate 110 satisfies the above-described range, reliability and alignment characteristics can be maintained and can be efficiently varied in a shape corresponding to the user's skin, and the total thickness and weight of the mask 1000 May decrease.

A first wiring 210 may be disposed on the first substrate 110. The first wiring 210 may be electrically connected to the piezoelectric element 300.

The first wiring 210 may include a conductive material. For example, the first wiring 210 is aluminum (Al), copper (Cu), silver (Ag), gold (Au), chromium (Cr), nickel (Ni), molimden (Mo), titanium (Ti ) And at least one of the alloys thereof. In addition, the first wiring 210 may include a non-metal such as carbon.

The first wiring 210 may be disposed on one surface of the first substrate 110 facing the piezoelectric element 300. The first wiring 210 may directly contact one surface of the first substrate 110 and may extend in a first direction. The first wiring 210 may be formed on one surface of the first substrate 110 by a process such as deposition or printing.

The first wiring 210 may include a plurality of first sub-wirings 211 disposed on the first substrate 110. The plurality of first sub-wires 211 extend in a first direction and may be disposed to be spaced apart from each other in a second direction different from the first direction. The plurality of first sub-wires 211 may be electrically connected to each other. Here, the second direction is a direction different from the first direction and may be a vertical direction, for example, but is not limited thereto.

The thickness of the first sub-wire 211 may be about 2 μm to about 50 μm. In detail, the thickness of the first sub-wire 211 may be about 2 μm to about 40 μm. When the thickness of the first sub-wiring 211 is less than about 2 μm, electrical characteristics may be degraded, and it may be difficult to form uniformly. In addition, when the thickness of the first sub-wiring 211 exceeds about 50 μm, the total thickness of the mask 1000 may increase, and the manufacturing time of the first wire 210 may increase. In addition, the first sub-wiring 211 is too thick to deteriorate the stretchable property. Preferably, the thickness of the first sub-wire 211 may be about 5 μm to about 35 μm or less in consideration of stretchable characteristics, reliability, and process efficiency in the horizontal direction.

In addition, a line width of the first sub-wire 211 may be greater than a thickness of the first sub-wire 211. The line width of the first sub-wire 211 may be about 50 μm to about 500 μm. In detail, the line width of the first sub-wire 211 may be about 100 μm to about 450 μm. When the line width of the first sub-wire 211 is less than about 50 μm, reliability may be degraded, and when the line width of the first sub-wire 211 exceeds about 500 μm, the elongation decreases, resulting in a stretchable characteristic. It can be degraded. Preferably, the line width of the first sub-wire 211 may be about 100 μm to about 400 μm in consideration of stretchable characteristics.

The first wiring 210 may have various shapes. For example, when viewed in a plan view, each of the plurality of first sub-wires 211 may have a shape extending in the first direction as shown in FIG. 3. In detail, the plurality of first sub-wires 211 may have an equal interval with the adjacent first sub-wires 211 and may have a straight line extending in a first direction.

In contrast, when viewed in a plan view, each of the plurality of first sub-wires 211 may have a curved shape extending in the first direction as shown in FIG. 4. For example, each of the plurality of first sub-wires 211 may be provided in a form in which a wavy pattern is repeated. In this case, the first sub-wire 211 may have a curvature pattern of about 3R to about 20R (mm). Accordingly, when the mask 1000 is stretched or contracted in one direction, the first wiring 210 may have a stretchable characteristic and may not be cut off. Preferably, the first sub-wiring 211 may have a curvature pattern of about 5R to about 15R (mm). In addition, the first sub-wiring 211 may have an elongation of about 10% to about 50%. Accordingly, since the first wiring 210 may have improved stretchable characteristics, reliability may be improved, and adhesion with the user's skin may be improved.

Alternatively, although not shown in the drawings, each of the plurality of first sub-wires 211 may have a shape in which a pattern in which a straight line and a curve extending in the first direction are mixed is repeated. For example, when viewed from a plane, the first sub-wire 211 located in a region overlapping with a relatively curved region (nose, cheek, etc.) of the user's face may be provided in a curved shape, and may be relatively flat. The first sub-wiring 211 located in an area overlapping an area (forehead, etc.) may be provided in a straight line. Accordingly, when the mask 1000 is attached to the user's face, a problem in which the first wiring 210 is damaged due to the deformation of the mask 1000 may be solved. In addition, since the first sub-wiring 211 is provided in a form in which a straight line and a curved line are mixed, it is possible to maintain electrical characteristics and reduce a ratio occupied by the first wire 210, thereby reducing manufacturing cost.

A second wiring 220 may be disposed on the first substrate 110. The second wiring 220 may be disposed on one surface of the first substrate 110 facing the piezoelectric element 300. The second wiring 220 and the second wiring 220 may be disposed on the first wiring 210. The second wiring 220 may be disposed closer to the piezoelectric element 300 than the first wiring 210. For example, a part of the second wiring 220 may be disposed on the second insulating layer 420 to be described later, and may be disposed closer to the piezoelectric element 300 than the first wiring 210. have. The second wiring 220 may be electrically connected to the piezoelectric element 300.

The second wiring 220 may include a conductive material. For example, the second wiring 220 is aluminum (Al), copper (Cu), silver (Ag), gold (Au), chromium (Cr), nickel (Ni), molimdenum (Mo), titanium (Ti ) And at least one of the alloys thereof. In addition, the second wiring 220 may include a non-metal such as carbon. The second wiring 220 may include the same material as the first wiring 210.

The second wiring 220 may extend in a direction different from that of the first wiring 210. In detail, the second wiring 220 may extend in the second direction different from the first direction in which the first wiring 210 extends. For example, the second wiring 220 may extend in a second direction perpendicular to the first direction. The second wiring 220 may be formed on one surface of the second substrate 120 by a process such as deposition or printing.

The second wiring 220 may include a plurality of second sub-wirings 221 disposed on the first substrate 110. The plurality of second sub-wires 221 may extend in the second direction and may be spaced apart from each other in the first direction. The plurality of second sub-wires 221 may be electrically connected to each other.

The first wiring 210 and the second wiring 220 may be disposed to cross each other. In detail, when viewed in a plan view as shown in FIGS. 3 and 4, the first sub-wire 211 and the second sub-wire 221 may be disposed to cross each other in the form of a mesh. That is, the first wiring 210 and the second wiring 220 may include a cross region OA where the first sub-wiring 211 and the second sub-wiring 221 cross each other, and the sub An open area in which the wires 210 and 220 are not disposed may be included between the wires 211 and 221.

The thickness of the second sub-wire 221 may be about 2 μm to about 50 μm. In detail, the thickness of the second sub-wire 221 may be about 2 μm to about 40 μm. When the thickness of the second sub-wiring 221 is less than about 2 μm, electrical characteristics may be deteriorated, and it may be difficult to form uniformly. In addition, when the thickness of the second sub-wire 221 exceeds about 50 μm, the total thickness of the mask 1000 may increase, and the manufacturing time of the second wire 220 may increase. In addition, the thickness of the second sub-wiring 221 is too thick, so that stretchable characteristics may be deteriorated. Preferably, the thickness of the second sub-wire 221 may be about 30 μm or less in consideration of stretchable characteristics in the horizontal direction, reliability, and process efficiency. The thickness of the second sub-wire 221 is provided equal to the thickness of the first sub-wire 211, so that process efficiency may be improved.

In addition, a line width of the second sub-wire 221 may be greater than a thickness of the second sub-wire 221. For example, the line width of the second sub-wire 221 may be about 50 μm to about 500 μm or less. In detail, the line width of the second sub-wire 221 may be about 100 μm to about 450 μm. When the line width of the second sub-electrode 221 is less than about 50 μm, reliability may be degraded, and when the line width of the second sub-wire 221 exceeds about 500 μm, the elongation decreases, resulting in a stretchable characteristic. It can be degraded. Preferably, the line width of the second sub-wire 221 may be about 100 μm to about 400 μm in consideration of stretchable characteristics. The line width of the second sub-wire 221 is provided equal to the line width of the first sub-wire 211, so that process efficiency can be improved.

The second wiring 220 may have various shapes. For example, when viewed in a plan view, each of the plurality of second sub-wires 221 may have a shape extending in the second direction as shown in FIG. 3. In detail, the plurality of second sub-wires 221 may have an equal interval with the adjacent second sub-wires 221 and may have a straight line extending in a second direction.

In contrast, when viewed in a plan view, each of the plurality of second sub-wires 221 may have a curved shape extending in the second direction as shown in FIG. 4. For example, each of the plurality of second sub-wires 221 may be provided in a form in which a wavy pattern is repeated. In this case, the second sub-wiring 221 may have a curvature pattern of about 3R to about 20R (mm). Accordingly, when the mask 1000 is stretched or contracted in one direction, the second wiring 220 may have a stretchable characteristic and may not be cut off. Preferably, the second sub-wiring 221 may have a curvature pattern of about 5R to about 15R (mm). In addition, the second sub-wiring 221 may have an elongation of about 10% to about 50%. Accordingly, since the second wiring 220 may have improved stretchable characteristics, reliability may be improved, and adhesion with the user's skin may be improved.

Alternatively, although not shown in the drawings, each of the plurality of second sub-wires 221 may have a shape in which a pattern in which a straight line and a curve extending in the second direction are mixed is repeated. For example, when viewed in a plan view, the second sub-wire 221 located in a region overlapping with a relatively curved region (nose, cheek, etc.) of the user's face may be provided in a curved shape and may be relatively flat. The second sub-wires 221 positioned in an area overlapping an area (forehead, etc.) may be provided in a straight line. Accordingly, when the mask 1000 is attached to the user's face, a problem in which the second wiring 220 is damaged due to the deformation of the mask 1000 may be solved. In addition, since the second sub-wire 221 is provided in a form in which a straight line and a curved line are mixed, it is possible to maintain electrical characteristics and reduce a ratio occupied by the second wire 220, thereby reducing manufacturing cost.

It is preferable that the second wiring 220 has the same shape as the first wiring 210 in consideration of the stretchable characteristic of the mask 1000. That is, it is preferable that the first wiring 210 and the second wiring 220 disposed in the same area of the mask 1000 have the same shape.

Further, although not shown in the drawings, the second wiring 220 may extend on the second substrate 120 in the same direction as the first wiring 210. That is, the second wiring 220 may extend in the same first direction as the first wiring 210.

A first insulating layer 410 may be disposed on the first substrate 110. The first insulating layer 410 may include a resin such as silicon oxide, metal oxide, or acrylic. In addition, the first insulating layer 410 may include a photosensitive insulating material having properties such as positive photoresist or negative photoresist.

The first insulating layer 410 may be disposed between the first wiring 210 and the second wiring 220. The first insulating layer 410 may be disposed between the first wiring 210 and the second wiring 220 to insulate the first wiring 210 and the second wiring 220. For example, the first insulating layer 410 may be disposed in a region where the first wiring 210 and the second wiring 220 overlap each other. In detail, the first insulating layer 410 may be disposed in a cross region OA where the first wiring 210 extending in the first direction and the second wiring 220 extending in the second direction cross each other. . In more detail, the first insulating layer 410 may be disposed in a cross region OA where the first sub-wire 211 and the second sub-wire 221 cross each other to insulate between the two sub-wires. . That is, the first insulating layer 410 is provided on the first substrate 110 in a number corresponding to the number of the cross-regions OA, so that the first wiring 210 and the second wiring 220 You can insulate the space.

The first insulating layer 410 may have a width in a horizontal direction greater than a line width of the first wiring 210. Further, the first insulating layer 410 may have a thickness thicker than that of the first wiring 210. Accordingly, the first insulating layer 410 may be disposed to surround the first wiring 210 disposed in the crossing area OA. The first insulating layer 410 may directly contact an upper surface and a side surface of the first wiring 210 of the crossing region OA. In addition, the first insulating layer 410 may be disposed in direct contact with the upper surface of the first substrate 110.

A second insulating layer 420 may be disposed on the first substrate 110. The second insulating layer 420 may include a resin such as silicon oxide, metal oxide, or acrylic. In addition, the second insulating layer 420 may include a photosensitive insulating material having properties such as positive photoresist or negative photoresist. The second insulating layer 420 may include the same material as the first insulating layer 410, but is not limited thereto.

The second insulating layer 420 may be disposed on the first insulating layer 410. The second insulating layer 420 may be disposed on a region overlapping the first insulating layer 410 in a vertical direction. The second insulating layer 420 may be disposed on the first wiring 210 and the second wiring 220. For example, the second insulating layer 420 may be disposed in a region where the first wiring 210 and the second wiring 220 overlap. In detail, the second insulating layer 420 may be disposed in an area overlapping the crossing area OA of the first wiring 210 and the second wiring 220. That is, the second insulating layer 420 may be disposed on the cross region OA where the first sub-wire 211 and the second sub-wire 221 cross each other to protect the two sub-wires. The second insulating layer 420 may be provided in a number corresponding to the number of the crossing regions OA. In addition, the second insulating layer 420 may be provided in a number corresponding to the first insulating layer 410 to protect the first sub-wire 211 and the second sub-wire 221.

The second insulating layer 420 may have a width in a horizontal direction greater than a line width of the first wiring 210 and the second wiring 220. In addition, the second insulating layer 420 may have a width greater in the horizontal direction than the piezoelectric element 300 to be described later. In detail, the second insulating layer 420 may have a width greater than that of the piezoelectric element 300 in the horizontal direction for the arrangement of the piezoelectric element 300 and electrical connection of the piezoelectric element.

The second insulating layer 420 may have a thickness greater than that of the first wiring 210 and the second wiring 220. In addition, the second insulating layer 420 may have a horizontal width and thickness greater than that of the first insulating layer 410 in a horizontal direction. Accordingly, the second insulating layer 420 may be disposed to surround a portion of the first insulating layer 410 and the second wiring 220 disposed on the crossing region OA. In detail, the second insulating layer 420 may directly contact an upper surface and a side surface of the first insulating layer 410, and the upper surface of the second wiring 220 disposed on the crossing area OA and It can be placed in direct contact with the side. In addition, the second insulating layer 420 may be disposed to surround a portion of the first wiring 210 and the second wiring 220 adjacent to the cross-region OA, respectively, and the second insulating layer 420 The top and side surfaces of the first wiring 210 and the top and side surfaces of the second wiring 220 may be directly contacted. In addition, the second insulating layer 420 may be disposed in direct contact with the upper surface of the first substrate 110.

The second insulating layer 420 may include at least one through hole. For example, the second insulating layer 420 includes a first through hole TH1 overlapping the first wiring 210 and a second through hole TH2 overlapping the second wiring 220 can do.

The first through hole TH1 may be disposed in a region spaced apart from the second wiring 220. In detail, the first through hole TH1 may be disposed in an area spaced apart from the crossing area OA. The first through hole TH1 may be disposed in a region spaced apart from the first insulating layer 410.

The second through hole TH2 may be disposed in a region overlapping the first insulating layer 410 in a vertical direction. That is, the second through hole TH2 may be disposed in an area overlapping the crossing area OA in a vertical direction.

The first through hole TH1 and the second through hole TH2 may have a shape extending from an upper surface of the second insulating layer 420 to an upper surface of the first substrate 110. Accordingly, a part of the upper surface of the first wiring 210 may be positioned under the first through hole TH1. In addition, a part of the upper surface of the second wiring 220 may be positioned under the second through hole TH2.

The width of the first through hole TH1 in the horizontal direction may be the same as the width of the second through hole TH2 in the horizontal direction. Widths of the first through hole TH1 and the second through hole TH2 in the horizontal direction may be less than or equal to a line width of the first wire 210 and the second wire 220.

In addition, the depth (vertical direction) of the first through hole TH1 may be different from the depth of the second through hole TH2. For example, a depth of the first through hole TH1 may be greater than a depth of the second through hole TH2. In detail, the first through hole TH1 may be disposed on the first wiring 210 in an area spaced apart from the crossing area OA, and the second through hole TH2 is the crossing area OA. It may be disposed on the second wiring 220 in an area overlapping the. Accordingly, the first through hole TH1 and the second through hole TH2 may have different depths.

Unlike this, although not shown in the drawings, the second through hole TH2 may be disposed in a region spaced apart from the first wiring 210. In detail, the second through hole TH2 may be formed in an area spaced apart from the crossing area OA. The second through hole TH2 may be disposed in a region spaced apart from the first insulating layer 410. That is, the first through hole TH1 and the second through hole TH2 may be disposed in a region spaced apart from the first insulating layer 410 and may be provided with the same depth.

A first connection wire 251 may be disposed in the first through hole TH1. The first connection wiring 251 extends from an upper portion to a lower direction of the first through hole TH1 and may be electrically connected to the first wiring 210. One end of the first connection wiring 251 may be disposed on the same plane as the top surface of the second insulating layer 420. In addition, the other end of the first connection wire 251 opposite to one end may directly contact the first wire 210 under the first through hole TH1.

In addition, a second connection wire 252 may be disposed in the second through hole TH2. The second connection wiring 252 extends from the top to the bottom of the second through hole TH2 and may be electrically connected to the second wiring 220. One end of the second connection wiring 252 may be disposed on the same plane as the top surface of the second insulating layer 420. In addition, the other end of the second connection wire 252 opposite to one end may directly contact the second wire 220 under the second through hole TH2.

The first connection wiring 251 and the second connection wiring 252 may include a conductive material. For example, the first connection wire 251 and the second connection wire 252 are aluminum (Al), copper (Cu), silver (Ag), gold (Au), chromium (Cr), nickel (Ni) , Molymeden (Mo), titanium (Ti), and may include at least one metal of an alloy thereof. In addition, the first connection wiring 251 and the second connection wiring 252 may include a non-metal such as carbon. The first connection wire 251 and the second connection wire 252 may include the same material, but the embodiment is not limited thereto. In addition, the first connection wiring 251 and the second connection wiring 252 may each include the same material as the connected first wiring 210 and the second wiring 220, but are not limited thereto.

A piezoelectric element 300 may be disposed on the first substrate 110. The piezoelectric element 300 may include a material having a piezo effect. For example, the piezoelectric device 300 may include a ceramic material, ZnO, AlN, LiNbO ₄ , lead antimony stannate, lead magnesium tantalate, lead nickel tantalate ( lead nickel tantalate), titanates, tungstates, zirconates, or lead zirconate titanate [Pb(Zr _x Ti _1-x )O ₃ (PZT)], lead lanthanum zirconate Lead containing titanate (PLZT), lead niobium zirconate titanate (PNZT), BaTiO ₃ , SrTiO ₃ , lead magnesium niobate, lead nickel niobate, lead manganese niobate, lead zinc niobate, lead titanate, It may contain at least one of barium, bismuth, or niobates of strontium.

The piezoelectric device 300 may include a MEMS (Micro Electro Mechanical Systems) device, such as a micromachined ultrasonic transducer (MUT), manufactured in the form of a thin sheet. In detail, the piezoelectric element 300 includes at least one of a piezoelectric micromachined ultrasonic transducer (PMUT), a capacitive micromachined ultrasonic transducer (CMUT), and a magnetic micromachined ultrasonic transducer (MMUT). It can contain one.

The piezoelectric element 300 may generate wave energy by an applied current. For example, for example, the piezoelectric device 300 may generate ultrasonic energy of about 1 MHz or less. In detail, the piezoelectric element 300 may generate ultrasonic energy of about 5 kHz to about 1 MHz. In more detail, the piezoelectric element 300 may generate ultrasonic energy of about 10 KHz to about 800 KHz. The ultrasonic energy generated by the piezoelectric element 300 may be provided to a user by moving in a direction of one surface of the mask 1000.

The piezoelectric element 300 may be disposed on the second insulating layer 420. The piezoelectric element 300 may be disposed on an area overlapping the crossing area OA. The piezoelectric element 300 may be disposed on the first connection wiring 251 and the second connection wiring 252 to be electrically connected to the first wiring 210 and the second wiring 220.

A plurality of piezoelectric elements may be disposed on the second insulating layer 420. For example, one piezoelectric element 300 may be disposed on one second insulating layer 420. In detail, a plurality of piezoelectric elements 300 may be disposed on one second sub-wire 221, and the plurality of piezoelectric elements 300 may be spaced apart on the second sub-wire 221 at equal intervals. .

In addition, the piezoelectric element 300 disposed on one second sub-wire 221 is the piezoelectric element 300 disposed on the second sub-wire 221 closest to the one second sub-wire 221 And may be disposed not to overlap or overlap in the first direction. In detail, the piezoelectric element 300 may be disposed to face the piezoelectric element 300 disposed on the adjacent second sub-wire 221 in a first direction, and may be disposed in a zigzag shape.

In addition, intervals between some of the piezoelectric elements 300 among the piezoelectric elements 300 may be arranged at equal intervals, and the rest may not be arranged at equal intervals. For example, human skin may have a relatively flat area and a curved area. At this time, the piezoelectric elements 300 in the region corresponding to the relatively flat region of the user's skin may be disposed at equal intervals with the adjacent piezoelectric elements 300, and the piezoelectric elements 300 in the region corresponding to the relatively curved region ) May not be placed at equal intervals.

That is, the spacing between the piezoelectric elements 300 may be relatively narrow or large depending on the degree of curvature of the skin surface. For example, a spacing between the piezoelectric elements 300 disposed in a region overlapping a curved region such as a nose and both cheeks of the user's face may be relatively narrow. Accordingly, the mask 1000 according to the embodiment may effectively provide ultrasonic energy even to curved skin.

In addition, the piezoelectric element 300 may have various shapes. For example, the piezoelectric element 300 may have a polygonal column shape in which lower and upper surfaces are polygonal, and the lower and upper surfaces may have a circular column shape. In addition, the piezoelectric element 300 may have a polygonal one of a lower surface and an upper surface, and the other surface may have a pillar shape. For example, the piezoelectric element 300 may be provided in a cylindrical shape, and the diameter of the piezoelectric element 300 may be about 2.5 mm or less. In detail, the diameter of the piezoelectric element 300 may be about 2 mm or less. In addition, an area of at least one of a lower surface and an upper surface of the piezoelectric element 300 may be about 20 mm ² or less.

In addition, the piezoelectric element 300 may generate various waves. As an example, the piezoelectric element 300 may generate at least one wave of a horizontal wave in which a direction in which the wave travels and a vibration direction of the medium are perpendicular, and a longitudinal wave in which the direction in which the wave travels and the vibration direction of the medium are the same. In addition, the piezoelectric element 300 may generate waves of different wavelength bands. That is, the piezoelectric element 300 may resonate multiple times.

That is, the piezoelectric element 300 may have various shapes, and the intensity, type, and direction of oscillation of ultrasonic energy generated according to the shape may be controlled. Accordingly, various ultrasonic energy can be provided to the user's skin. In addition, the piezoelectric element 300 may be disposed on the entire area of the mask 1000 at set intervals to evenly generate ultrasonic energy over the entire area of the mask 1000.

A second substrate 120 may be disposed on the piezoelectric element 300. The second substrate 120 may be disposed above the piezoelectric element 300 and may be spaced apart from the piezoelectric element 300.

The second substrate 120 is transparent and may include a material in consideration of moisture barrier properties and thermal stability. In addition, the second substrate 120 may include a material that has flexibility and is variable according to the shape of the user's curved skin. For example, the second substrate 120 may include a resin material such as polyethylene terephthalate (PET), polyethylene natalate (PEN), and polyimide (PI). The second substrate 120 may be provided in the form of a film. The second substrate 120 may have the same material and the same shape as the first substrate 110, but is not limited thereto.

The second substrate 120 may have a thickness of about 0.5 μm to about 5 μm. When the thickness of the second substrate 120 is less than about 0.5 μm, components disposed on the second substrate 120, for example, a piezoelectric element 300 disposed under the second substrate 120 There may be a problem that the area of the second substrate 120 overlapping with the components is hit by weight. Accordingly, the reliability of the second substrate 120 may be deteriorated, and an alignment problem may occur. In addition, when the thickness of the second substrate 120 exceeds about 5 μm, the total thickness of the mask 1000 may be increased. Accordingly, there is a problem in that the mask 1000 cannot be effectively changed according to the shape of the user's skin, and thus does not effectively adhere to the user's skin. Preferably, the second substrate 120 may have a thickness of about 0.5 μm to about 3 μm. When the thickness of the second substrate 120 satisfies the above-described range, reliability and alignment characteristics can be maintained, and the thickness and weight of the mask 1000 can be efficiently varied in a shape corresponding to the user's skin. May decrease. The second substrate 120 may have the same thickness as the first substrate 110, but is not limited thereto.

The mask 1000 according to the embodiment may include a first base layer 510. The first base layer 510 may be disposed under the first substrate 110. The first base layer 510 may be disposed on the other surface opposite to one surface of the first substrate 110. The first base layer 510 may be disposed in direct contact with the other surface of the first substrate 110.

The first base layer 510 may include a material harmless to the human body. In addition, the first base layer 510 may include a soft and elastic material. For example, the first base layer 510 is polyvinyl chloride to which silicone, thermoplastic resin, thermoplastic silicone resin, thermoplastic elastomer, polyurethane elastomer, ethylene vinyl acetate (EVA), harmless plasticizer and stabilizer are added ( PVC) may include at least one material. Preferably, the first base layer 510 may be relatively light and may include a silicone elastomer having a predetermined elasticity and may minimize irritation upon contact with the user's skin.

The first base layer 510 may be disposed to cover the entire area of the other surface of the first substrate 110. That is, when viewed in a plan view, a plan area of the first base layer 510 may correspond to an area of the other surface of the first base layer 110. In addition, a plan area of the first base layer 510 may be larger than an area of the other surface of the first substrate 110. For example, the first base layer 510 may be disposed to surround the side surface of the first substrate 110 and may be connected to a protective layer 551 to be described later. Accordingly, the first base layer 510 may prevent the other surface of the first substrate 110 from being exposed to the outside.

In addition, the first base layer 510 may reflect the wavelength emitted from the piezoelectric element 300 in the direction of one surface of the mask 1000. That is, the first base layer 51 may be a reflective layer. To this end, the thickness of the first base layer 510 may be different from or equal to the thickness of the second base layer 520 to be described later. For example, in order to reflect the wavelength emitted from the piezoelectric device 300 toward the first substrate 110 to the first base layer 510, the thickness of the first base layer 510 is the second It may be thinner than or equal to the thickness of the base layer 520.

The thickness of the first base layer 510 may be about 50 μm to about 1 mm. When the thickness of the first base layer 510 is less than about 50 μm, the thickness of the first base layer 510 is relatively thin, so that the first base layer 110 cannot be effectively protected. In addition, when the thickness of the first base layer 510 exceeds about 1 mm, the thickness of the entire mask 1000 may be increased, and the piezoelectric element 300 is discharged in the direction of the first substrate 110 Most of the wavelengths passed through the first base layer 510 and reflected by the first base layer 510 may be less reflected in the direction of one surface of the mask 1000. In addition, the required thickness of the second base layer 520 may be increased for reflection in one surface direction of the mask 1000, and the wavelength range generated by the piezoelectric element 300 for reflection is high, so that the mask May not be suitable for use in (1000). Therefore, it is preferable that the thickness of the first base layer 510 satisfies the above-described range in order to prevent the above problems.

More preferably, the thickness of the first base layer 510 may be about 100 μm to about 700 μm. That is, it is preferable that the first base layer 510 has a thickness ranging from about 100 μm to about 700 μm in consideration of reliability, reflective properties, and the thickness and weight of the mask 1000 to be manufactured.

In addition, the first base layer 510 may have pores or the like formed therein to effectively reflect the wavelength generated by the piezoelectric element 300, but the embodiment is not limited thereto.

The mask 1000 according to the embodiment may include a second base layer 520. The second base layer 520 may be disposed on the second substrate 120. The second base layer 520 may be disposed on the other surface opposite to the one surface of the second substrate 120. The second base layer 520 may be disposed in direct contact with the other surface of the second substrate 120.

The second base layer 520 is a portion that faces the user's skin and can contact the skin, and may include a material harmless to the human body. In addition, the second base layer 520 may include a soft and elastic material. For example, the second base layer 520 is polyvinyl chloride to which silicone, thermoplastic resin, thermoplastic silicone resin, thermoplastic elastomer, polyurethane elastomer, ethylene vinyl acetate (EVA), a harmless plasticizer and a stabilizer are added ( PVC) may include at least one material. Preferably, the second base layer 520 is relatively light, can minimize irritation upon contact with the user's skin, and may include a silicone elastomer having a predetermined elasticity. The first base layer 510 may be made of the same material as the second base layer 520.

The second base layer 520 may be disposed to cover the entire area of the other surface of the second substrate 120. That is, when viewed in a plan view, a plan area of the second base layer 520 may correspond to an area of the other surface of the second substrate 120. In addition, a plan area of the second base layer 520 may be larger than an area of the other surface of the second base layer 120. For example, the second base layer 520 may be disposed to surround the side surface of the second substrate 120 and may be connected to a protective layer 551 to be described later. Accordingly, the second base layer 520 may prevent the other surface of the second substrate 120 from being exposed to the outside.

In addition, the second base layer 520 may pass the wavelength emitted from the piezoelectric element 300 in the direction of one surface of the mask 1000 and transmit it to the user's skin. That is, the second base layer 520 may be a transmission layer and may be a matching layer. To this end, the thickness of the second base layer 520 may vary according to an impedance of the second base layer 520 and a driving frequency of the piezoelectric element 300. For example, the thickness of the second base layer 520 may be the same as or different from the thickness of the first base layer 510. In detail, the thickness of the second base layer 520 may be greater than or equal to the thickness of the first base layer according to the driving frequency of the piezoelectric element 300. In addition, the second base layer 520 according to the embodiment may be omitted depending on the driving frequency of the piezoelectric element 300, but the embodiment is not limited thereto.

For example, when the driving frequency of the piezoelectric element 300 is about 1 MHz or less, the thickness of the second base layer 520 may be about 1 mm or less. In detail, the thickness of the second base layer 520 may be about 50 μm to about 1 mm. When the thickness of the second base layer 520 is less than about 50 μm, the thickness of the second base layer 520 is relatively thin, so that the second base layer 120 cannot be effectively protected. In addition, when the thickness of the second base layer 520 exceeds about 1 mm, the thickness of the entire mask 1000 may increase. It is preferable that the thickness of the second base layer 520 satisfies the above-described range in order to effectively pass the wavelength emitted from the piezoelectric element 300. Preferably, the thickness of the second base layer 520 may have a thickness ranging from about 100 μm to about 700 μm in consideration of reliability, transmission characteristics, thickness and weight of the manufactured mask 1000.

Accordingly, the wave energy emitted from the piezoelectric element 300 may be reflected by the first base layer 510 and may move toward the second base layer 520, and the second base layer 120 and the second base layer 520 2 It can be effectively delivered to the user's skin through the base layer 520.

The mask 1000 according to the embodiment may include a protective layer 551. The protective layer 551 may be disposed between the first substrate 110 and the second substrate 120. The protective layer 551 may be disposed in direct contact with one surface of the first substrate 110 and one surface of the second substrate 120.

The protective layer 551 may include a soft and elastic material. For example, the protective layer 551 is a polyvinyl chloride (PVC) containing silicone, a thermoplastic resin, a thermoplastic silicone resin, a thermoplastic elastomer, a polyurethane elastomer, an ethylene vinyl acetate (EVA), a harmless plasticizer and a stabilizer At least one of the materials may be included. Among them, the protective layer 551 is relatively light and can minimize irritation upon contact with the user's skin, and it may be preferable to include a silicone elastomer having a predetermined elasticity.

The protective layer 551 may be disposed between the first substrate 110 and the second substrate 120 to protect the piezoelectric element 300. In detail, the protective layer 551 is disposed to surround the piezoelectric element 300 and the first and second wires 210 and 220 between the first and second substrates 110 and 120 and protect the components. can do.

In addition, the protective layer 551 may be connected to the first base layer 510 and the second base layer 520. For example, the protective layer 551 may be connected to at least one of the first base layer 510 and the second base layer 520 in an end region of the mask 1000. For example, the first base layer 510, the second base layer 520, and the protective layer 551 may be integrally formed to be physically connected, and effectively support and protect components disposed therein. .

The protective layer 551 may include the same material as the first base layer 510 and the second base layer 520. That is, the first base layer 510, the second base layer 520, and the protective layer 551 may have improved bonding strength as they include the same material.

7 is an enlarged cross-sectional view of area A2 of FIG. 6, and FIG. 8 is another cross-sectional view of an enlarged area A2 of FIG. 6. A piezoelectric element according to an embodiment will be described in more detail with reference to FIGS. 7 and 8. In addition, in the description of FIGS. 7 and 8, the same reference numerals are assigned to the same and similar configurations.

First, referring to FIG. 7, the piezoelectric device 300 according to the embodiment may be a capacitive micromachined ultrasonic transducer (CMUT).

The piezoelectric element 300 may include a body 310, an electrode 330, and a first piezoelectric layer 351.

The body 310 may include silicon (Si). The body 310 may be provided as a single body, or may have a structure in which a plurality of substrates are combined. For example, the body 310 may include a silicon on insulator (SOI) structure. In detail, the body 310 may have a structure in which one insulating layer or a plurality of insulating layers are disposed on a silicon (Si) wafer. Here, the insulating layer may include oxide or nitride. In addition, the body 310 may include a cavity 305 therein. The cavity 305 may be disposed in a central region of the piezoelectric element 300. Gas such as air may be disposed in the cavity 305 and may be provided in a vacuum.

A first piezoelectric layer 351 may be disposed on the body 310. The first piezoelectric layer 351 may be disposed on a region corresponding to the cavity 305. The first piezoelectric layer 351 may include a material having a piezo effect. For example, the first piezoelectric layer 351 may include a material of the piezoelectric element 300 described above, such as ZnO, AlN, LiNbO _4, or the like.

An electrode 330 may be disposed on the body 310. For example, the electrode 330 may include a first electrode 331 disposed on the body 310. In detail, the first electrode 331 may be disposed on the first piezoelectric layer 351 to be electrically connected to the first piezoelectric layer 351. The first electrode 331 may directly contact the first piezoelectric layer 351. In addition, the first electrode 331 may be connected to the first connection wiring 251. The first electrode 331 may receive current through the first connection line 251. The first electrode 331 may directly contact the first connection wiring 251.

The electrode 330 may include a second electrode 332 disposed under the body 310. The second electrode 332 may be spaced apart from the first piezoelectric layer 351. The second electrode 332 may be connected to the second connection wiring 252. The second electrode 332 may receive current through the second connection wire 252. The second electrode 332 may directly contact the second connection wiring 252.

The first electrode 331 and the second electrode 332 may form capacitance. In detail, the capacitance between the first electrode 331 and the second electrode 332 may be changed by the current applied to the first connection line 251 and the second connection line 252. Accordingly, the first piezoelectric layer 351 may move to generate ultrasonic waves.

Also, referring to FIG. 8, the piezoelectric device 300 according to the embodiment may be a piezoelectric micromachined ultrasonic transducer (PMUT).

The piezoelectric device 300 may include a body 310, an electrode 330, and a second piezoelectric layer 352.

The body 310 may include silicon (Si). The body 310 may be provided as a single body, or may have a structure in which a plurality of substrates are combined. For example, the body 310 may include a silicon on insulator (SOI) structure. In detail, the body 310 may have a structure in which one insulating layer or a plurality of insulating layers are disposed on a silicon (Si) wafer. Here, the insulating layer may include oxide or nitride. In addition, the body 310 may include a cavity 305 therein. The cavity 305 may be disposed in a central region of the piezoelectric element 300. Gas such as air may be disposed in the cavity 305 and may be provided in a vacuum.

A second piezoelectric layer 352 may be disposed on the body 310. The second piezoelectric layer 352 may be disposed on a region corresponding to the cavity 305. The second piezoelectric layer 352 may include a material having a piezo effect. For example, the second piezoelectric layer 352 may include a material of the piezoelectric element 300 described above, such as ZnO, AlN, LiNbO _4, or the like.

An electrode 330 may be disposed on the body 310. For example, the electrode 330 may include a first electrode 331 disposed on the second piezoelectric layer 352 and electrically connected to the second piezoelectric layer 352. The first electrode 331 may directly contact the second piezoelectric layer 352. In addition, the first electrode 331 may be connected to the first connection wiring 251. The first electrode 331 may receive current through the first connection wire 251. The first electrode 331 may directly contact the first connection wiring 251.

In addition, the electrode 330 may include the second electrode 332. The second electrode 332 may be disposed under the second piezoelectric layer 352 to be electrically connected to the second piezoelectric layer 352. The second electrode 332 may be disposed between the cavity 305 and the second piezoelectric layer 352. The second electrode 332 may directly contact the second piezoelectric layer 352. In addition, the second electrode 332 may be connected to the second connection wiring 252. The second electrode 332 may receive current through the second connection wire 252. The second electrode 332 may directly contact the second connection wiring 252.

The second piezoelectric layer 352 may be moved by a current applied to the first electrode 331 and the second electrode 332. Accordingly, the second piezoelectric layer 352 may generate ultrasonic waves. Further, although not shown in the drawings, a plurality of insulating layers may be further disposed between the second electrode 332 and the cavity 305.

The mask 1000 according to the embodiment may include the piezoelectric element 300 to provide ultrasonic energy to a user. In this case, the piezoelectric element 300 may include a microfabricated ultrasonic transducer (MUT) such as a capacitive ultrasonic transducer (CMUT) and a piezoelectric ultrasonic transducer (PMUT). That is, since the piezoelectric device 300 includes a MEMS device, it may have a slimmer thickness, a lighter weight, and the like, thereby effectively reducing the overall thickness and weight of the mask 1000. In addition, as the size of the piezoelectric element 300 decreases, adhesion to the user's skin may be improved.

In addition, since the piezoelectric device 300 according to the embodiment includes a MEMS device, the ratio of the piezoelectric devices 300 disposed per unit area may be increased. Accordingly, the piezoelectric element 300 may evenly generate ultrasonic energy over the entire area of the mask 1000 and may have an improved degree of integration, thereby effectively providing ultrasonic energy to the user's skin.

9 to 11 are diagrams illustrating examples in which indicators and protrusions are provided to the mask according to the embodiment.

Referring to FIG. 9, the mask 1000 may include an indicator 610. The indicator 610 may include at least one of members such as an LED, a display, and a buzzer that can transmit information to a user, such as visually or aurally.

The indicator 610 may be disposed outside the mask 1000 to display an operation state of the mask 1000. For example, the indicator 610 may provide information on the start of the operation of the mask 1000, information indicating that the operation is in progress, and information on the completion of the operation through auditory information generated from a buzzer. In addition, the indicator 610 may display an operation state according to the light emission color of the LED. In addition, the indicator may display information on an operating frequency domain through the display.

Further, referring to FIGS. 10 and 11, the mask 1000 may include a protrusion 620 disposed on an outer surface. In detail, the protrusion 620 may be disposed on one surface of the second base layer 520 facing the user's skin.

The protrusion 620 may include a material harmless to the human body and may be disposed to protrude from one surface of the second base layer 520 toward the user's skin. The protrusions 620 may be disposed in the form of a plurality of points spaced apart from each other on one surface of the second base layer 520. In addition, the protrusions 620 may be arranged in the form of a plurality of straight lines or curved lines spaced apart from each other on one surface of the second base layer 520. In addition, the protrusion 620 may be disposed on one surface of the second base layer 520 in a single spiral shape.

When the user wears the mask 1000, the protrusion 620 may form a predetermined space between the mask 1000 and the user's skin. Accordingly, by the pressure generated when the mask 1000 is worn and/or the ultrasonic energy generated from the piezoelectric element 300, cosmetics or drugs between the mask 1000 and the skin are at the edge of the mask 1000 You can prevent it from being pushed into the area. That is, the protrusion 620 may serve as a partition wall preventing cosmetics or drugs from escaping from the mask 1000. Accordingly, the user can effectively inject cosmetics or drugs into the skin by using the mask 1000.

12 is a diagram illustrating a user wearing a mask according to an embodiment, and FIG. 13 is a diagram illustrating a skin care device to which the mask is applied according to the embodiment.

Referring to FIG. 12, the user 50 may wear the mask 1000. The mask 1000 may include the above-described opening 1010, and the user 50 may secure a view through the opening 1010. In addition, the mask 1000 may include the above-described cutting portion 1020, and the mask 1000 may be effectively in close contact with the curved skin by the cutting portion 1020. In this case, one surface of the second base layer 520 may directly contact the skin of the user 50. In addition, drugs or cosmetics are disposed between the second bath layer 520 and the skin of the user 50 so that the base layer 520 may directly or indirectly contact the skin of the user 50.

The mask 1000 may be operated by receiving power through an external power connected to the mask 1000. In addition, the mask 1000 may operate by receiving power through a power supply unit (not shown) disposed outside the mask 1000, for example, on a lower surface of the first base layer 510.

Further, referring to FIG. 13, the mask 1000 may be applied to and operated on the skin care device 1. In detail, referring to FIG. 13, the skin care device 1 may include a body 10 that is open on one side and includes an accommodation space 11 therein.

The body 10 is light and may include a material capable of preventing damage from external impact or contact. For example, the body 10 may include a plastic or ceramic material, and may have improved reliability from an external environment, and may protect the mask 1000 disposed inside the accommodation space 11. In addition, the main body 10 may include a viewing part 13 formed at a position corresponding to the user's eyes. The viewing part 13 is formed in an area corresponding to the opening 1010 of the mask 1000, and a user can secure an external view through the viewing part 13.

The mask 1000 may be disposed in the receiving space 11 of the body 10. The mask 1000 may be disposed between the body 10 and the user's skin. In detail, the first base layer 510 of the mask 1000 may be disposed to face the receiving space 11 of the body 10, and the second base layer 520 of the mask 1000 is It can be arranged to face the skin of the person.

The mask 1000 may be coupled to the body 10. For example, the mask 1000 may be fixed to a set position in the receiving space 11 by a fastening member (not shown), and may have a structure that is detachable from the main body 10.

The mask 1000 may receive power through a power supply (not shown) disposed outside the mask 1000, for example, on a lower surface of the first base layer 510. Alternatively, the mask 1000 may be connected to the body 10 to receive power through a power supply unit (not shown) disposed on the body 10.

The mask 1000 may include a deformable member (not shown) disposed on a lower surface of the first base layer 510. The deformable member may directly contact the first base layer 510 and may be disposed facing the receiving space 11 of the body 10. That is, the deformable member may be disposed between the body 10 and the first base layer 510 of the mask 1000.

The deformable member may include a material whose shape is changed by external pressure. For example, the deformable member may include a material such as an air gap or a sponge, but is not limited thereto, and may include various materials whose shape is changed by external pressure. Accordingly, when the user wears the skin care device 1, the deformable member may be deformed into a shape corresponding to the shape of the user's face. Accordingly, the mask 1000 and the user's skin can be effectively brought into close contact. In addition, when a plurality of users wear the skin care device 1, it is deformed to correspond to each face shape, so that the user's skin and the mask 1000 can be effectively brought into close contact with each other.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in each embodiment can be implemented by combining or modifying other embodiments by a person having ordinary knowledge in the field to which the embodiments belong. Accordingly, contents related to such combinations and modifications should be construed as being included in the scope of the present invention.

In addition, although the embodiments have been described above, these are only examples and do not limit the present invention, and those of ordinary skill in the field to which the present invention belongs are illustrated above within the scope not departing from the essential characteristics of the present embodiment. It will be seen that various modifications and applications that are not available are possible. For example, each component specifically shown in the embodiment can be modified and implemented. And differences related to these modifications and applications should be construed as being included in the scope of the present invention defined in the appended claims.

Claims (11)

A first substrate disposed on the first base layer;
A first wiring disposed on the first substrate and extending in a first direction;
A second wiring disposed on the first substrate and extending in a second direction;
A first insulating layer disposed between the first and second wirings;
A second insulating layer disposed on the first substrate and enclosing some of the first and second wirings and the first insulating layer;
A piezoelectric element disposed on the second insulating layer;
A second substrate disposed on the piezoelectric element; And
Including a second base layer disposed on the second substrate,
The second insulating layer includes a first through hole overlapping the first wiring and a second through hole overlapping the second wiring,
A first connection wire electrically connected to the first wire is disposed in the first through hole,
A second connection wire electrically connected to the second wire is disposed in the second through hole,
The piezoelectric element is a mask electrically connected to the first and second connection wirings. The method of claim 1,
The piezoelectric element is a mask including at least one of a piezoelectric micromachined ultrasonic transducer (PMUT) and a capacitive micromachined ultrasonic transducer (CMUT). The method of claim 2,
The piezoelectric element,
A first electrode connected to the first connection wire;
A second electrode connected to the second connection wire; And
A mask including a piezoelectric layer disposed between the first and second electrodes. The method of claim 3,
The piezoelectric element further includes a cavity therein,
The cavity is a mask disposed in a region overlapping the piezoelectric layer in a vertical direction. The method of claim 3,
The piezoelectric layer is a mask made of a piezo material. The method of claim 1,
The piezoelectric element is a mask disposed on a region overlapping a cross region where the first wire and the second wire cross. The method of claim 1,
A mask having a horizontal width of the second insulating layer greater than a horizontal width of the piezoelectric element. The method of claim 1,
And a protective layer disposed between the first and second substrates surrounding the piezoelectric element,
The protective layer is a mask including the same material as the first and second base layers. The method of claim 1,
One end of the first and second connection electrodes is disposed on the same plane as the upper surface of the second insulating layer. The method of claim 1,
The thickness of the first base layer is less than or equal to the thickness of the second base layer. A main body having one side open and an accommodation space in the open area; And
A mask disposed in the open area and connected to the main body,
The skin care device, wherein the mask is a mask according to any one of claims 1 to 10.

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