KR20210004059A - Inductor complex element substrate - Google Patents

Abstract

Provided are an inductor composite element including a liquid metal, a manufacturing method of a passive device substrate including the inductor composite element, and a tuning method of the passive device substrate. The inductor composite element includes: a base substrate; a barrier rib pattern layer disposed on the base substrate to form a channel; a liquid metal pattern layer disposed in a channel and including a liquid metal, and forming at least partially an inductor pattern; and a sealing layer disposed on the liquid metal pattern layer. Therefore, it is possible to provide the inductor composite element with excellent electrical properties by using the liquid metal.

Description

Inductor composite element substrate {INDUCTOR COMPLEX ELEMENT SUBSTRATE}

The present invention relates to an inductor composite element containing a liquid metal, a method of manufacturing a passive element substrate including an inductor composite element, and a tuning method of a passive element substrate using a liquid metal, and more specifically, functions as an inductor element and a resistance element. It relates to a composite passive device, a method of manufacturing a composite passive device, and a tuning method.

With the recent development of IoT technology, various sensor devices are being developed. For example, a biological monitoring device attached to an animal such as a human is attached to the body surface to measure body fluid components, or collect body temperature information, heart rate information, location information, and various other information, and monitor physical activity based on the collected information. Can be managed. For another example, a food safety monitoring device attached to a food may collect information on a distribution history and quality of food to secure food safety and contribute to the promotion of public health.

Such a sensor device must satisfy various characteristics depending on the surface to be provided. In the case of the above-described biological monitoring or food monitoring device, if the target surface to which the sensor device is attached is curved, and further, the target surface is fluid and the adhesion between the target surface and the sensor device is poor, the problem of remarkably deteriorating sensing sensitivity may occur. have. Therefore, there is an urgent need to develop a technology for implementing a sensor device having complete flexibility.

Meanwhile, an electronic device such as a sensor device may include a circuit board. The circuit board may include passive elements such as a resistance element, an inductor element, and a capacitor element, and an electric line connected by the passive element may be configured to be most suitable for an electric signal to be transmitted. For example, the inductor device is a device capable of generating induced electromotive force. The inductor element may be used as a frequency filter or the like. The inductor element may be classified into a coil type, a stack type, and a thin type according to its structure. Since the inductor element generates induced electromotive force according to its structure, even if the circuit board is deformed, the inductor element itself must maintain a stable structure.

US registered patent US 9,945,739 B2 (2018.04.17.) US registered patent US 10,184,779 B2 (2019.01.22.) US registered patent US 8,826,747 B2 (2014.09.09.) US Patent Publication US 2019-0003818 A1 (2019.01.03.) US Patent Publication US 2018-0192911 A1 (2018.07.12.) US Patent Publication US 2018-0305563 A1 (2018.10.25.) US published patent US 2017-0312849 A1 (2017.11.02.) Chinese Patent Registration CN 105938021 B (2018.02.23.) Korean Patent Registration KR 10-1993313 B1 (2019.06.26.) Korean Patent Registration KR 10-1993314 B1 (2019.06.26.)

One method for implementing a flexible electronic device, and furthermore, a flexible circuit board is a method of forming a circuit board using a flexible conductive pattern.

For example, Patent Document 1 (US 9,945,739 B2) discloses a pressure and temperature sensor using an amorphous metal. Specifically, Patent Document 1 discloses a sensor device having stretchable properties so that it can be used for electronic skin use. Patent Document 1 uses an amorphous metal and its alloy to form a device wiring in order to implement a flexible sensor, but the sensor device of Patent Document 1 also only uses a metal layer with improved flexibility, and the degree to which the device is bent. It still has a problem that the wiring is damaged if it is large or is completely folded.

In addition, Patent Document 2 (US 10,184,779 B2) discloses an elastic electrode and a sensor sheet used for a sensor having elasticity, such as in the field of medical materials such as artificial muscle or artificial skin. Patent Document 2 teaches that an electrode body is formed by using fibers using multi-walled carbon nanotubes. However, although the carbon nanotubes of Patent Document 2 can be formed locally, there is a limit in which it is extremely difficult to form a wiring or the like.

In addition, various attempts have been made to implement a flexible sensor device, such as Patent Document 3 (US 8,826,747 B2), Patent Document 4 (US 2019-0003818 A1), and Patent Document 5 (US 2018-0192911 A1).

In addition, Patent Document 6 (US 2018-0305563 A1) discloses a method of forming a conductive pattern using a liquid metal mixture. Patent Document 6 discloses forming a conductive pattern through a method of pressing or heating a liquid metal mixture.

In addition, a method of discharging liquid metal like ink jet has been developed to form a conductive pattern using liquid metal. For example, Patent Document 7 (US 2017-0312849 A1) discloses an extruder for injecting or discharging liquid metal.

In addition, Patent Document 8 (CN 105938021 B) discloses a stacked type of inductor element. Patent Document 8 teaches that an inductor element and a capacitor element can be used as a temperature sensor.

Patent Document 9 (KR 10-1993313 B1) and Patent Document 10 (KR 10-1993314 B1) are applications by the present applicant, and Patent Document 9 and Patent Document 10 disclose a substrate laminate constituted by using a liquid metal. In particular, Patent Document 9 and Patent Document 10 disclose a flexible substrate structure capable of functioning as a frequency filter element by constructing a capacitor element and an inductor element using a liquid metal, and laminating them. However, these only disclose stacking the inductor element and/or the capacitor element in the vertical direction, and are not disclosed at all for the structure constituting the composite element in the horizontal direction.

On the other hand, since the liquid metal maintains the liquid state at room temperature, it is difficult to apply deformation to the conductive pattern, so that the conventional passive element using the liquid metal is difficult to tune once it is manufactured.

In particular, when heterogeneous passive elements that perform different functions, such as a resistance element and an inductor element, are integrally formed on a single substrate, the characteristics of the inductor element are not controlled during the tuning process of the resistance element, or resistance during the tuning process of the inductor element. It is very difficult to form the intended impedance because the characteristics of the device are not controlled. This problem is intensified as the passive element substrate becomes thinner and smaller, and the circuit substrate arrangement becomes more integrated.

Accordingly, a problem to be solved by the present invention is to provide an inductor composite device capable of exhibiting excellent inductance or impedance. In addition, in the case of being integrated with a resistance element or the like, it is to provide an inductor composite element having a structure that has a stable structure and electrical characteristics and is easy to tune.

In addition, another object to be solved by the present invention is to provide a method of manufacturing a passive element substrate having a structure that is easy to tune while having a stable structure and electrical characteristics.

Another problem to be solved by the present invention is to provide a method of tuning a passive element substrate capable of tuning by a simple method and maintaining a stable structure and electrical characteristics during the tuning process.

The problems of the present invention are not limited to the technical problems mentioned above, and other technical problems that are not mentioned will be clearly understood by those skilled in the art from the following description.

An inductor composite device according to an embodiment of the present invention for solving the above problem includes: a base substrate; A partition wall pattern layer disposed on the base substrate to form a channel; A liquid metal pattern layer disposed in the channel and including a liquid metal, the liquid metal pattern layer at least partially forming an inductor pattern; And a sealing layer disposed on the liquid metal pattern layer.

The inductor pattern of the liquid metal pattern layer may include an inductor line pattern portion and a pad pattern portion that is extended compared to the inductor line pattern portion, and a side surface of the inductor line pattern portion and a side surface of the pad pattern portion may have a tapered slope. have.

In this case, a side inclination angle of the inductor line pattern portion may be greater than a side inclination angle of the pad pattern portion.

In addition, the inductor composite device may further include a thickness control layer disposed between the base substrate and the partition pattern layer.

The inductor line pattern portion may at least partially overlap the thickness control layer, and the pad pattern portion may at least partially non-overlap the thickness control layer.

A thickness of the thickness control layer may be smaller than a thickness of the partition wall pattern layer, and an average thickness of the inductor line pattern portion may be smaller than a maximum thickness of the pad pattern portion.

In addition, the liquid metal pattern layer may further include a resistance line pattern portion at least partially forming a resistance pattern.

In this case, the average thickness of the resistance line pattern portion may be greater than the average thickness of the inductor line pattern portion.

In addition, the resistance line pattern portion may have a zigzag shape in a plane, and a pitch of the resistance line pattern portion may be three times or more of a width of the resistance line pattern portion.

A side surface of the liquid metal pattern layer may have a tapered inclination, and a side inclination angle of the resistance line pattern portion may be greater than or equal to a side inclination angle of the inductor line pattern portion.

The thickness control layer may be at least partially non-overlapping with the resistance line pattern portion, and a maximum thickness of the pad pattern portion may be the same as a maximum thickness of the resistance line pattern portion.

In addition, the pad pattern portion may contact an upper surface of the thickness control layer, and the resistance line pattern portion may not contact an upper surface of the thickness control layer.

In some embodiments, the inductor line pattern portion has a rounded spiral shape in a plan view, and a width of the spiral line pattern portion may be greater than a separation distance between adjacent line pattern portions.

In addition, the average thickness of the inductor line pattern portion may be greater than the width of the inductor line pattern portion.

A method of manufacturing a passive device substrate according to an exemplary embodiment of the present invention for solving the above other problems may include: disposing a thickness control layer forming a first channel on a base substrate; Disposing a partition wall pattern layer forming a second channel on the thickness control layer; Disposing a sealing layer on the partition pattern layer, comprising: disposing a sealing layer to form the empty first channel and the second channel; And filling a liquid metal in the first channel and the second channel.

In a plan view, the second channel may include an inductor channel region having a rounded spiral shape and a resistance channel region having a zigzag shape.

In the step of filling the liquid metal, both the inductor channel region and the resistance channel region may be filled through a single injection process.

In this case, the liquid metal filled in the inductor channel region may form an inductor pattern, and the liquid metal filled in the resistance channel region may form a resistance pattern.

Also, the first channel may not be connected to the inductor channel region, and the first channel may be connected to the resistance channel region.

In a plan view, the second channel may further include a pad channel region having a larger width than that of the inductor channel region and the resistance channel region.

In the filling of the liquid metal, a pad channel region is filled through a single injection process, and the liquid metal filled in the pad channel region may form a pad pattern.

In this case, the first channel may not be connected to the inductor channel region, and the first channel may be connected to the pad channel region.

A method for tuning a passive element substrate according to an embodiment of the present invention for solving the another problem is a flexible base substrate, and a liquid metal pattern layer disposed on the base substrate and comprising a liquid metal, at least partially As a tuning method of a passive element substrate including a liquid metal pattern layer forming an inductor pattern and a resistance pattern, impedance is adjusted by stretching, bending, or pressing a resistance pattern region of the passive element substrate.

Details of other embodiments are included in the detailed description.

According to embodiments of the present invention, it is possible to provide an inductor composite device having excellent electrical characteristics using a liquid metal. In addition, it is possible to provide not only an inductor element but also a composite passive element substrate integrated with a resistance element.

Furthermore, even if the integrated passive element substrate is tuned by making the thickness of the portion forming the inductor element smaller than that of the portion forming the resistance element, the electrical characteristics can be stably maintained.

Effects according to the embodiments of the present invention are not limited by the contents illustrated above, and more various effects are included in the present specification.

1 is a plan view of a resistive element substrate according to an embodiment of the present invention.
2 is a plan view of a resistive element substrate according to another embodiment of the present invention.
3 is an enlarged view showing an enlarged area A of FIG. 2.
4 is a cross-sectional view taken along lines BB′ and CC′ of FIG. 2.
5 is a cross-sectional view of a resistive element substrate according to still another embodiment of the present invention.
6 is a cross-sectional view of a resistive element substrate according to still another embodiment of the present invention.
7 is a cross-sectional view of a resistive element substrate according to another embodiment of the present invention.
8 is a schematic diagram showing a method of tuning a passive element substrate according to an embodiment of the present invention.
9 is a schematic diagram showing a method of tuning a passive element substrate according to another embodiment of the present invention.
10 is a schematic diagram showing a method of tuning a passive element substrate according to another embodiment of the present invention.
11 is a plan view of an inductor device substrate according to an embodiment of the present invention.
12 is a plan view of an inductor device substrate according to another embodiment of the present invention.
13 is an enlarged view showing an enlarged area A of FIG. 12.
14 is a cross-sectional view taken along line BB′ of FIG. 12.
15 is a cross-sectional view of an inductor device substrate according to another embodiment of the present invention.
16 is a cross-sectional view of an inductor device substrate according to another embodiment of the present invention.
17 is a cross-sectional view of an inductor device substrate according to another embodiment of the present invention.
18 is a plan view of an inductor composite device substrate according to an embodiment of the present invention.
19 is a cross-sectional view taken along lines AA', BB' and CC' of FIG. 18.
20 is a cross-sectional view of an inductor composite device substrate according to another embodiment of the present invention.
21 to 24 are cross-sectional views illustrating a method of manufacturing an inductor composite device substrate according to an embodiment of the present invention.
25 is an image of a resistive element according to Preparation Example 1-1.
26 is an image of a resistive element according to Preparation Example 1-2.
27 is an image of an inductor device according to Preparation Example 2-1.
28 is an image of an inductor device according to Preparation Example 2-2.
29 is an image of measuring inductance according to an experimental example.

Advantages and features of the present invention, and a method of achieving them will become apparent with reference to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms different from each other, and only the embodiments make the disclosure of the present invention complete, and those skilled in the art to which the present invention pertains. It is provided to fully inform the person of the scope of the invention, and the invention is only defined by the scope of the claims.

Spatially relative terms such as'above','upper','on','below','beneath', and'lower' are As shown, it may be used to easily describe the correlation between one device or components and other devices or components. Spatially relative terms should be understood as terms including different directions of the device when used in addition to the directions shown in the drawings. For example, when an element shown in the figure is turned over, an element described as'below or beneath' another element may be placed'above' another element. Therefore, the exemplary term'below' may include both the lower and upper directions.

The size, thickness, width, length, etc. of the components shown in the drawings may be exaggerated or reduced for convenience and clarity of description, so the present invention is not limited to the illustrated form.

The terms used in the present specification are for describing exemplary embodiments and are not intended to limit the present invention. In this specification,'and/or' includes each and every combination of one or more of the recited items. In addition, the singular form also includes the plural form unless otherwise stated in the text. As used in the specification,'comprises' and/or'comprising' does not exclude the presence or addition of one or more other elements other than the mentioned elements. Numerical ranges indicated using'to' represent numerical ranges including the values listed before and after them as lower and upper limits, respectively. "About" or "approximately" means a value or numerical range within 20% of the value or numerical range described thereafter.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used as meanings that can be commonly understood by those of ordinary skill in the art to which the present invention belongs. In addition, terms defined in a commonly used dictionary are not interpreted ideally or excessively unless explicitly defined specifically.

In this specification, the first direction (X) refers to an arbitrary direction in the plane, and the second direction (Y) refers to another direction in the plane that intersects the first direction (X). In addition, the third direction Z means a direction perpendicular to the plane. Unless otherwise defined, a'plane' means a plane to which the first direction X and the second direction Y belong. Further, unless otherwise defined, "overlapping" means overlapping in the third direction (Z) from the plane viewpoint.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view of a resistive element substrate 10 according to an embodiment of the present invention.

Referring to FIG. 1, the passive element substrate according to the present embodiment may be a resistive element substrate 10. The resistance element substrate 10 may include a base substrate 100 and a resistance pattern 200 disposed on the base substrate 100. FIG. 1 illustrates a case in which a resistance pattern 200 extends substantially in a first direction (X) from a plan view and has a zigzag shape in a second direction (Y).

The base substrate 100 may provide a space in which the resistance pattern 200 is disposed. That is, the base substrate 100 may provide a planar space to which the first direction X and the second direction Y belong. The material of the base substrate 100 is not particularly limited as long as it can stably support the resistance pattern 200, but, for example, flexibility, stretchability, foldable, and/or rollable ( It may be made of a material having rollable) properties. For a specific example, the base substrate 100 may be made of a polymer resin such as polydimethylsiloxane (PDMS), polyacrylate, and polyimide. For another example, the base substrate 100 may be made of a material such as paper. In this case, the base substrate 100 may have a predetermined liquid permeability.

A resistance pattern 200, which is a liquid metal conductive pattern including a liquid metal, may be disposed on the base substrate 100. The liquid metal may be a liquid metal having a complex composition including gallium and indium. In a plan view, the resistance pattern 200 may have a predetermined shape, and may exhibit unique electrical characteristics due to the shape of the pattern.

As a non-limiting example, the liquid metal may further include nanoparticles maintaining a solid state at room temperature in addition to gallium and indium maintaining a liquid state at room temperature. The nanoparticles may have electrical conductivity. The nanoparticles having electrical conductivity are not particularly limited, but may be, for example, metal nanoparticles such as iron, copper, silver, aluminum, titanium, nickel, or carbon-based nanoparticles such as carbon nanotubes (CNT). . The sheet resistance of the resistance pattern 200 may be easily controlled by the nanoparticles.

In some embodiments, the resistance pattern 200 may include a resistance line pattern portion 201 and a pad pattern portion 202. The resistance line pattern part 201 extends in approximately one direction to function as an electric line and at the same time, has a zigzag shape, so that it can function as a resistance element. The pad pattern portion 202 may have a width greater than that of the resistance line pattern portion 201 to form a contact pad portion. The pad pattern portion 202 may be located at both ends of the resistance line pattern portion 201 in the first direction X, but the present invention is not limited thereto. The resistance line pattern portion 201 and the pad pattern portion 202 may be integrally formed without a physical boundary, and may be continuously filled with the same liquid metal.

Although not shown in the drawings, the resistive element substrate 10 may be electrically connected to other external components, such as electronic circuit devices or other electrical lines. The pad pattern part 202 has a larger width than the resistance line pattern part 201 and can stably perform electrical connection with other external components.

Hereinafter, a passive element substrate according to another embodiment of the present invention will be described. However, redundant descriptions of the same components as those of the passive device substrate according to the above-described embodiment or components to which obvious changes have been applied are omitted, which can be clearly understood by those of ordinary skill in the art from the accompanying drawings. will be.

2 is a plan view of a resistive element substrate 11 according to another embodiment of the present invention. 3 is an enlarged view showing an enlarged area A of FIG. 2. 4 is a cross-sectional view taken along lines B-B' and C-C' of FIG. 2, in which the left side is a cross-sectional view of the pad pattern part 212 cut away, and the right side is a cross-sectional view of the plurality of resistance line pattern parts 211.

2 to 4, the passive element substrate according to the present embodiment is a resistive element substrate 11, which does not have a zigzag shape in the second direction Y in a plane, and has a first direction X and a second direction. A point having a zigzag shape in a diagonal direction crossing the direction Y is different from the resistance element substrate 10 according to the embodiment of FIG. 1.

Although the present invention is not limited thereto, the resistive element substrate 11 according to the present exemplary embodiment may be formed by injecting a liquid metal from one side of the resistance pattern 210 extending approximately in the first direction X. That is, it may be formed through a liquid metal injection process from one side of the first direction X to the other side.

In this case, the resistance pattern 210, specifically, the resistance line pattern portion 211 has a portion extending in the first direction X and a portion extending in the second direction Y perpendicular to the first direction X. It is not a zigzag shape, but a zigzag shape having a portion extending in a diagonal direction crossing the first direction X and the second direction Y, so that the injection of the liquid metal may be easier. For example, when liquid metal is injected from the pad pattern part 212 on the left side of the first direction X, the liquid metal may be gradually filled from left to right. At this time, the pressure inside the channel may increase due to the liquid metal filling the inside of the channel. Therefore, by allowing the liquid metal to move in a diagonal direction in the first direction X, not in a direction perpendicular to the first direction X, an increase in pressure inside the channel can be suppressed, and a larger amount of liquid metal can be injected. .

In addition, since it is possible to minimize the pressure increase in the channel, it is possible to alleviate unfilled defects that may occur in the angled corner of the resistance line pattern part 211 in the liquid metal injection process, and intention due to the unfilled area. It is possible to prevent an inadequate rise in line resistance, or a defect such as an open middle of the line of the resistance line pattern part 211 can be prevented in advance.

Meanwhile, the width W ₂₁₁ and the pitch P of the resistance line pattern part 211 may have a predetermined relationship. In an exemplary embodiment, the pitch P of the resistance line pattern portion 211 may have three times or more of the width W ₂₁₁ . The upper limit of the ratio of the pitch (P) and the width (W ₂₁₁ ) is not particularly limited, but about 10 times or less, or about 9 times or less, or about 8 times or less, or about 7 times or less, or about 6 times or less, or It may be about 5 times or less. The pitch P of the resistance line pattern part 211 may mean a repetition period when the resistance line pattern part 211 has a repetitive shape. For example, in the case of having a shape that repeatedly extends to one side and the other side in the second direction (Y) as shown in FIG. 2, at a portion protruding maximally in one side of the second direction (Y) (for example, the upper side of FIG. It may mean the distance in the first direction X to the next largest protruding part.

As described above, due to the characteristic shape of the resistance line pattern part 211, the resistance pattern 210 may function as a resistance element. In particular, when the resistance line pattern part 211 is formed by using a liquid metal that maintains a liquid state at room temperature, the shape of the resistance line pattern part 211 very sensitively affects the electrical characteristics of the resistance element substrate 11. Can give. This may be because the liquid metal maintains a liquid state at room temperature, so electrical properties are affected by the external environment.

The inventors of the present invention experimentally confirmed that the stability of the electrical characteristics of the resistive element substrate 11 is affected according to the relationship between the pitch (P) and the width (W ₂₁₁ ) of the resistance line pattern part 211, and the present invention It came to completion. Specifically, when the pitch P of the resistance line pattern part 211 is less than 3 times, or less than 2.5 times, particularly less than 2 times the width W ₂₁₁ , the capacitance in measuring the electrical properties of the resistance element substrate 11 It was confirmed that the component was reflected and could not be implemented as a completely resistive element. Therefore, in the case of forming the resistance element substrate 11 using liquid metal, it is preferable that the pitch P of the resistance line pattern portion 211 is at least three times the width W ₂₁₁ .

In the stacked structure of the resistance element substrate 11, as described above, the resistance element substrate 11 includes a base substrate 100 and a resistance pattern 210 disposed on the base substrate 100, As illustrated, the resistive element substrate 11 may further include a partition wall pattern layer 620 and a sealing layer 700 disposed on the base substrate 100.

In an exemplary embodiment, the barrier rib pattern layer 620 may be directly disposed on the base substrate 100. The partition pattern layer 620 may be filled with a liquid metal to provide a channel or a trench for forming the resistance pattern 210. That is, from a plan view, the partition wall pattern layer 620 may have a substantially inverse shape of the resistance pattern 210. The partition wall pattern layer 620 may have insulating properties. For example, the partition wall pattern layer 620 may include a polymer material such as polyethyleneterephthalate, polymethylmethacrylate, and polycarbonate, but the present invention is not limited thereto. . In some embodiments, the barrier rib pattern layer 620 may have greater hydrophobicity than the base substrate 100. That is, the hydrophilicity of the base substrate 100 in contact with the liquid metal in the resistance pattern 210 in the gravitational direction may be configured to have a greater hydrophilicity, thereby stably forming a filled state of the liquid metal.

In addition, a sealing layer 700 may be disposed on the resistance pattern 210 and the partition pattern layer 620. The sealing layer 700 has insulating properties and may seal the liquid metal of the resistance pattern 210. The sealing layer 700 may be made of the same or different material as the partition wall pattern layer 620. The sealing layer 700 may have greater hydrophobicity than the base substrate 100. Although not shown in the drawings, an adhesive layer (not shown) may be interposed between the sealing layer 700 and the partition pattern layer 620, but the present invention is not limited thereto.

5 is a cross-sectional view of a resistive element substrate 12 according to another embodiment of the present invention, and is a cross-sectional view showing a position corresponding to that of FIG. 4.

5, the resistive element substrate 12 according to the present embodiment includes a base substrate 100 and resistance patterns 211 and 212 disposed on the base substrate 100, but does not include a partition pattern layer. It is different from the resistive element substrate 11 according to the embodiment of FIG. 4 and the like in that the upper surface of the base substrate 100 has a patterned structure.

The base substrate 100 may itself provide a channel for filling the liquid metal. A resistance line pattern portion 211 and a pad pattern portion 212 of a resistance pattern may be inserted into the channel of the base substrate 100. In this case, the portion protruding upward of the base substrate 100 may directly contact the sealing layer 700, or an adhesive layer (not shown) may be interposed therebetween.

6 is a cross-sectional view of a resistive element substrate 13 according to another embodiment of the present invention, and is a cross-sectional view showing a position corresponding to that of FIG. 4.

Referring to FIG. 6, the resistive element substrate 13 according to the present embodiment further includes a thickness control layer 635 interposed between the partition wall pattern layer 630 and the base substrate 100. This is different from the resistive element substrate 11 according to the example.

In an exemplary embodiment, the thickness control layer 635 may be a pattern layer having substantially the same shape as the partition wall pattern layer 630. The thickness control layer 635 may have insulating properties. The material of the thickness control layer 635 may be made of the same material as or different from the material of the partition pattern layer 630. The material of the thickness control layer 635 is not particularly limited, but may include a polymer material such as polyethyleneterephthalate, polymethylmethacrylate, and polycarbonate.

The thickness control layer 635 may be a layer for providing structural stability between the inductor element and the resistive element when a composite passive element including a resistive element and an inductor element is implemented as an integrated substrate as described later.

The partition wall pattern layer 630 may be directly disposed on the thickness control layer 635. For example, the side surface of the thickness control layer 635 and the side surface of the partition wall pattern layer 630 may be aligned.

On the other hand, the thickness control layer 635 and the partition pattern layer 630 together provide a channel for filling the liquid metal, but the resistance line pattern in the channel provided by the thickness control layer 635 and the partition pattern layer 630 The portion 231 and the pad pattern portion 232 may be disposed. In this embodiment, the thickness control layer 635 may be non-overlapping with the resistance line pattern portion 231 and the pad pattern portion 232.

In addition, when the thickness control layer 635 and the partition pattern layer 630 have substantially the same shape, the average thickness T ₂₃₁ of the resistance line pattern portion 231 is the maximum thickness T ₂₃₂ of the pad pattern portion 232. ) May be substantially the same.

In some embodiments, the maximum thickness of the thickness control layer 635 may be less than the maximum thickness of the partition wall pattern layer 630.

7 is a cross-sectional view of a resistive element substrate 14 according to another embodiment of the present invention, and is a cross-sectional view showing a position corresponding to that of FIG. 4.

Referring to FIG. 7, the resistance line pattern portion 241 and the pad pattern portion 242 of the resistance patterns 241 and 242 of the resistance element substrate 14 according to the present embodiment each have inclined sides. It is different from the resistive element substrate 13 according to the embodiment of.

In an exemplary embodiment, a side surface of the partition wall pattern layer 640 has a partially reverse tapered shape, and a side surface of the resistance line pattern portion 241 and/or the pad pattern portion 242 has a tapered shape. It can have a slope. As described above, the resistance line pattern portion 241 and the pad pattern portion 242 may be formed of a liquid metal that maintains a liquid state at room temperature. In this case, the side surface of the partition wall pattern layer 640 forming the upper end of the channel may have a reverse slope, thereby stably trapping the liquid metal.

In addition, the side inclination angle θ ₁ of the resistance line pattern portion 241 may be different from the side inclination angle θ ₂ of the pad pattern portion 242. For example, the side inclination angle θ ₁ of the resistance line pattern part 241 may be greater than the side inclination angle θ ₂ of the pad pattern part 242. 7 illustrates a case where both the resistance line pattern portion 241 and the pad pattern portion 242 have an inclination angle of less than 90 degrees, but the resistance line pattern portion 241 has an inclination angle of about 90 degrees, that is, a substantially inclination. It will be understood by those of ordinary skill in the art that if the pad pattern portion 242 does not have an inclination angle of less than 90 degrees, it also falls within the scope of an equal change of this embodiment.

As described above, the liquid metal can be stably trapped by using the side slope of the partition wall pattern layer 640 and structural stability of the resistance patterns 241 and 242 can be improved. In particular, the pad pattern portion 242 occupies a relatively large area compared to the resistance line pattern portion 241 and may be a portion in which electrical connection with other components outside the resistance element substrate 14 is made. Therefore, a stable trap of liquid metal is very important, and by forming a relatively small side inclination angle of the pad pattern portion 242, structural stability and stability of electrical connection with external components can be achieved. In addition, since the pad pattern portion 242 has a relatively large width, the problem of non-uniformity in sheet resistance may not occur despite having a side inclination.

The resistance line pattern portion 241 also has a predetermined side inclination angle and the necessity of stably trapping the liquid metal is the same as that of the pad pattern portion 242, but the resistance line pattern portion 241 is somewhat different from the pad pattern portion 242 Different properties are required. That is, the resistance line pattern portion 241 has a greater contribution to the current flow than the pad pattern portion 242, and thus, a difference in local sheet resistance may affect the electrical characteristics of the passive element.

For example, when the side inclination angle of the resistance line pattern part 241 is too small, the difference between the width at the top and the bottom of the resistance line pattern part 241 may increase, and the resistance at the top and bottom of the line This can be localized. Therefore, it is advantageous that the side inclination angle θ ₁ of the resistance line pattern portion 241 is relatively larger than the side inclination angle θ ₂ of the pad pattern portion 242. In this respect, the side inclination angle θ ₁ of the resistance line pattern part 241 is about 80 degrees to 85 degrees, and the side inclination angle θ ₂ of the pad pattern part 242 is about 60 degrees to 84 degrees, or It may be about 70 degrees to 80 degrees.

In addition, in an exemplary embodiment, the thickness control layer 645 may have a shape partially different from that of the partition wall pattern layer 640. For example, the side surface of the partition wall pattern layer 640 has a reverse slope of a reverse tapered shape, but the thickness control layer 645 has a different side slope from the partition wall pattern layer 640, or does not have a side slope angle May not.

In addition, in the resistance line region in which the resistance line pattern portion 241 is disposed (the right cross section in FIG. 7 ), the width of the lower surface of the partition wall pattern layer 640 is substantially the same as the width of the upper surface of the thickness control layer 645 , In the pad area where the pad pattern part 242 is disposed (the left end surface in FIG. 7 ), the width of the lower surface of the partition pattern layer 640 may be different from the width of the upper surface of the thickness control layer 645. For example, in the pad area, the side surface of the partition wall pattern layer 640 and the side surface of the thickness control layer 645 are not aligned, and the upper surface of the partition wall pattern layer 640 may be partially exposed.

As described above, electrical characteristics or stability required by the resistance line pattern portion 241 and the pad pattern portion 242 formed by filling the liquid metal may be different. That is, the thickness control layer 645 and the partition wall pattern layer 640 adjacent to the resistance line pattern part 241 have their side surfaces continuously formed so that the local resistance difference between the upper and lower portions of the resistance line pattern part 241 Can be prevented from occurring. On the other hand, since the pad pattern portion 242 has a larger width than the resistance line pattern portion 241 and a degree of contributing to the flow of current is small, implementing a stable structural characteristic may take priority over the occurrence of a local sheet resistance difference. .

Therefore, the upper portion of the pad pattern portion 242 is formed to have a side inclination angle using the partition wall pattern layer 640, and the partition wall pattern layer 640 and the thickness control layer 645 are formed near the lower portion of the pad pattern portion 242. By forming a step by using, it is possible to minimize unnecessary liquid metal filling areas and prevent defects in which unfilled areas occur.

Hereinafter, a method of tuning a passive element substrate will be described.

8 is a schematic diagram showing a method of tuning a passive element substrate according to an embodiment of the present invention. FIG. 8 illustrates a tuning method using a resistive element substrate according to FIG. 2 as an example, but the present invention is not limited thereto. In another embodiment, the inductor element substrate may be tuned using the tuning method according to the present exemplary embodiment, or a composite passive element substrate in which a resistance element and an inductor element are combined may be tuned.

Referring to FIG. 8, the passive element tuning method according to the present embodiment is tuned by stretching a passive element substrate having a resistance pattern having a shape extending in a first direction (X) in a first direction (X). It may include the step of. As described above, the resistive element substrate may include a flexible base substrate and a resistive pattern disposed on the base substrate and including a liquid metal. Therefore, the resistive element substrate according to the present invention has excellent elasticity, especially in the extension direction of the resistance pattern (i.e., in the first direction (X)), and a liquid metal functioning as an electrical line despite the expansion and contraction of the resistance element substrate. The pattern can maintain a stable structure.

If the passive element substrate is stretched in the first direction (X), the cross-sectional area of the liquid metal pattern of the passive element substrate may be reduced as a whole, and overall resistance of the passive element substrate may be increased. Through this, it is possible to change the resistance of the passive element substrate, and further change the impedance, and tune the passive element substrate.

9 is a schematic diagram showing a method of tuning a passive element substrate according to another embodiment of the present invention. 9 illustrates a method of tuning using a resistive element substrate according to FIG. 2 as an example, but the present invention is not limited thereto. In another embodiment, the inductor element substrate may be tuned using the tuning method according to the present exemplary embodiment, or a composite passive element substrate in which a resistance element and an inductor element are combined may be tuned.

9, the passive element tuning method according to the present embodiment partially bends a passive element substrate having a resistance pattern extending in a first direction X in a third direction Z. It may include the step of tuning. The resistive element substrate according to the present invention can maintain a stable structure in which a liquid metal pattern functioning as an electrical line is stable despite bending.

If the passive element substrate is bent in the third direction (Z), the cross-sectional area of the liquid metal pattern of the passive element substrate may be locally reduced and the overall resistance of the passive element substrate may increase. Through this, it is possible to change the resistance of the passive element substrate, and further change the impedance, and tune the passive element substrate.

10 is a schematic diagram showing a method of tuning a passive element substrate according to another embodiment of the present invention. 10 illustrates a tuning method using a resistive element substrate according to FIG. 7 as an example, but the present invention is not limited thereto. In another embodiment, the inductor element substrate may be tuned using the tuning method according to the present exemplary embodiment, or a composite passive element substrate in which a resistance element and an inductor element are combined may be tuned.

Referring to FIG. 10, a method of tuning a passive element according to the present exemplary embodiment may include tuning by partially pressing a resistance pattern including a resistance line pattern portion 241 and a pad pattern portion 242. The resistive element substrate according to the present invention may maintain a stable structure in which the resistive line pattern portion 241 functions as an electrical line despite local pressure.

If a part of the resistance line pattern portion 241 is pressed in the vertical direction, the cross-sectional area of the resistance line pattern portion 241 of the passive element substrate may be locally reduced and the overall resistance of the passive element substrate may increase. Through this, it is possible to change the resistance of the passive element substrate, and further change the impedance, and tune the passive element substrate.

In some embodiments, the pressing may be performed from the sealing layer 700 direction. As described above, the passive element substrate may include a base substrate 100, a thickness control layer 645, a partition wall pattern layer 640, and a sealing layer 700. The thickness control layer 645 and the partition wall pattern layer 640 may affect the shape of the side surface of the resistance line pattern portion 241. In this case, the thickness control layer 645 may have a smaller thickness than the partition wall pattern layer 640, and a change in the shape of the lower portion of the resistance line pattern portion 241 may be caused by the pressure applied from the base substrate 100 side. I can. Therefore, in the method of tuning the passive element substrate, the pressure is preferably applied from the sealing layer 700 side rather than the base substrate 100 side.

Hereinafter, an inductor element substrate including an inductor element and an inductor composite element substrate will be described.

11 is a plan view of an inductor element substrate 20 according to an embodiment of the present invention.

Referring to FIG. 11, the passive element substrate according to the present embodiment may be an inductor element substrate 20 or an inductor composite element substrate. The inductor device substrate 20 may include a base substrate 100 and an inductor pattern 300 disposed on the base substrate 100. 11 illustrates a case in which the inductor pattern 300 extends in the first direction (X) and the second direction (Y) from a plan view to have an angled spiral shape.

The base substrate 100 may provide a space in which the inductor pattern 300 is disposed. The base substrate 100 may be made of a material having flexibility, elasticity, foldable and/or rollable properties. Since the base substrate 100 has been described above with reference to FIG. 1, overlapping descriptions will be omitted.

An inductor pattern 300 that is a liquid metal conductive pattern including a liquid metal may be disposed on the base substrate 100. The liquid metal may be a liquid metal having a complex composition including gallium and indium.

In a plan view, the inductor pattern 300 has a predetermined shape and may exhibit unique electrical characteristics due to the shape of the pattern. In an exemplary embodiment, the inductor pattern 300 may have an angled spiral shape in a plan view. When a current flows through the inductor pattern 300, induced electromotive force may be generated from a spiral-shaped line, thereby functioning as an inductor element.

In some embodiments, the inductor pattern 300 may include an inductor line pattern portion 301 and a pad pattern portion 302. The inductor line pattern part 301 may extend in the first direction X and the second direction Y to function as an electrical line and generate induced electromotive force. The pad pattern portion 302 may have a width greater than that of the inductor line pattern portion 301 to form a contact pad portion. The pad pattern portion 302 may be located at both ends of the inductor line pattern portion 301, but the present invention is not limited thereto. The inductor line pattern portion 301 and the pad pattern portion 302 may be integrally formed without a physical boundary, and may be continuously filled with the same liquid metal.

Although not shown in the drawings, the inductor element substrate 20 may be electrically connected to other external components. The pad pattern unit 302 has a larger width than the inductor line pattern unit 301 and can stably perform electrical connection with other external components.

12 is a plan view of an inductor element substrate 21 according to another embodiment of the present invention. 13 is an enlarged view showing an enlarged area A of FIG. 12. 14 is a cross-sectional view taken along line B-B' of FIG. 12.

12 to 14, the passive element substrate according to the present embodiment is an inductor element substrate 21, which differs from the inductor element substrate 20 according to the embodiment of FIG. 11 in that it has a rounded helical shape on a plane. Point.

Although the present invention is not limited thereto, the inductor device substrate 21 according to the present embodiment may be formed through a liquid metal injection process. For example, a liquid metal may be gradually injected from the pad pattern portion 312 on the edge side to the pad pattern portion 312 on the center side.

In this case, the inductor pattern 310, specifically, the inductor line pattern part 311, is configured to have a rounded line shape without having an angular shape, so that the injection of the liquid metal may be easier. At this time, the pressure inside the channel may increase due to the liquid metal filling the inside of the channel. Accordingly, by forming the inductor line pattern part 311 in a round shape and allowing the liquid metal to move along it, an increase in pressure inside the channel can be suppressed, and a larger amount of liquid metal can be injected.

In addition, since it is possible to minimize the pressure increase in the channel, it is possible to alleviate unfilled defects that may occur in the angled corners of the inductor line pattern part 311 in the liquid metal injection process, and intention due to the unfilled area. It is possible to prevent an inadequate increase in line resistance, or to prevent a defect such as an open middle of the line of the inductor line pattern part 311 in advance.

Meanwhile, the width W ₃₁₁ of the inductor line pattern part 311 and the separation distance D ₃₁₁ between the adjacent inductor line pattern part ₃₁₁ may have a predetermined relationship. In an exemplary embodiment, the width W ₃₁₁ of the inductor line pattern part 311 may be greater than the separation distance D ₃₁₁ . As described above, due to the characteristic shape of the inductor line pattern part 311, the inductor pattern 310 may function as an inductor element. In this case, when the width W ₃₁₁ of the inductor line pattern part 311 is larger than the separation distance D ₃₁₁ , induced electromotive force may be efficiently generated and leakage may be prevented. In some embodiments, the average thickness of the inductor line pattern part 311 may be greater than the width W ₃₁₁ of the inductor line pattern part 311.

In the stacked structure of the inductor element substrate 21, as described above, the inductor element substrate 21 includes a base substrate 100 and an inductor pattern 310 disposed on the base substrate 100, As illustrated, the inductor element substrate 21 may further include a partition wall pattern layer 620 and a sealing layer 700 disposed on the base substrate 100.

The partition wall pattern layer 620 may be filled with a liquid metal to provide a channel or a trench for forming the inductor pattern 310. That is, from a plan view, the partition wall pattern layer 620 may have a substantially inverse shape of the inductor pattern 310. The partition wall pattern layer 620 may have insulating properties. Further, a sealing layer 700 may be disposed on the inductor pattern 310 and the partition pattern layer 620. The sealing layer 700 has insulating properties and may seal the liquid metal of the inductor pattern 310.

Other descriptions of the partition wall pattern layer 620 and the sealing layer 700 have been described with reference to FIG. 4 and the like, and thus overlapping descriptions will be omitted.

FIG. 15 is a cross-sectional view of an inductor element substrate 22 according to another embodiment of the present invention, and is a cross-sectional view showing a position corresponding to that of FIG. 14.

Referring to FIG. 15, the inductor element substrate 22 according to the present embodiment includes a base substrate 110 and inductor patterns 311 and 312 disposed on the base substrate 110, but does not include a partition pattern layer. It is different from the inductor element substrate 21 according to the embodiment of FIG. 14 in that the upper surface of the base substrate 110 has a patterned structure.

The base substrate 110 may itself provide a channel for filling the liquid metal. An inductor line pattern part 311 and a pad pattern part 312 of an inductor pattern may be inserted into the channel of the base substrate 110. In this case, a portion protruding upward of the base substrate 110 may directly contact the sealing layer 700 or an adhesive layer (not shown) may be interposed therebetween.

16 is a cross-sectional view of an inductor element substrate 23 according to another embodiment of the present invention, and is a cross-sectional view showing a position corresponding to that of FIG. 14.

Referring to FIG. 16, the inductor element substrate 23 according to the present embodiment further includes a thickness control layer 655 interposed between the partition wall pattern layer 650 and the base substrate 100. This is different from the inductor element substrate 21 according to the example.

The thickness control layer 655 may have insulating properties. The material of the thickness control layer 655 may be the same as or different from the material of the partition pattern layer 650. The thickness control layer 655 may be a layer for controlling a difference in thickness between the inductor line pattern portion 331 and the pad pattern portion 332. Alternatively, the thickness control layer 655 may be a layer for providing structural stability in a composite passive device including a resistive element and an inductor element, as will be described later.

In an exemplary embodiment, the thickness control layer 655 may only partially overlap the inductor pattern. Specifically, the inductor line pattern portion 331 overlaps the thickness control layer 655 in the third direction (Z), but the pad pattern portion 332 at least partially overlaps the thickness control layer 655 and the third direction (Z). ) May not overlap.

The thickness control layer 655 and the partition wall pattern layer 650 may provide a channel for filling the liquid metal together. In this case, the inductor line pattern part 331 is disposed only in a channel provided by the partition wall pattern layer 650, and the pad pattern part 332 is provided in a channel provided by the thickness control layer 655 and the partition wall pattern layer 650. Can be placed.

That is, the thickness (T ₃₃₂₎ of the inductor line pattern portion 331. The thickness (T ₃₃₁₎ and the pad pattern portion 332 of the control by the layer 655 thickness may be different. For example, the maximum thickness T ₃₃₂ of the pad pattern portion 332 may be greater than the average thickness T ₃₃₁ of the inductor line pattern portion 331. The inventors of the present invention confirmed that the loss of induced electromotive force occurs when the thickness T ₃₃₁ of the inductor line pattern part 331 for generating the induced electromotive force is too large, and came to complete the present invention. On the other hand, the pad pattern part 332 needs to have a sufficient thickness because it performs electrical connection with external components.

In addition, tuning may be performed on the inductor element substrate 23 and the composite passive element substrate including the same according to the present embodiment. For example, tuning may be performed by stretching, bending, or pressing as described above. In this case, the thickness of the liquid metal conductive pattern may affect the impedance change due to tuning. That is, the larger the thickness of the liquid metal conductive pattern, the more severe the distortion of the structure due to the external force may occur and the more the impedance change may occur. Therefore, although the present invention is not limited thereto, for example, when an inductor element and a resistance element are integrally formed on a single substrate to form a composite passive element, the inductor element is formed thinner than the resistance element to provide desired electrical characteristics. It can be easily tuned to match.

FIG. 17 is a cross-sectional view of an inductor device substrate 24 according to another embodiment of the present invention, and is a cross-sectional view showing a position corresponding to that of FIG. 14.

Referring to FIG. 17, the inductor line pattern portion 341 and the pad pattern portion 342 of the inductor patterns 341 and 342 of the inductor element substrate 24 according to the present embodiment have inclined side surfaces, respectively. It is different from the inductor element substrate 23 according to the embodiment of.

In an exemplary embodiment, a side surface of the partition wall pattern layer 660 has a partially reverse tapered shape, and a side surface of the inductor line pattern portion 341 and/or the pad pattern portion 342 has a tapered shape. It can have a slope. In this case, the side surface of the partition wall pattern layer 660 forming the upper end of the channel has a reverse slope, so that the liquid metal can be stably trapped.

In this embodiment, the width W ₃₄₁ of the inductor line pattern portion 341 means the width at the lower end, that is, the maximum width, and the separation distance D ₃₄₁ between the inductor line pattern portions ₃₄₁ is the separation distance at the lower end That is, it may mean the minimum separation distance. It is the same as described above that the width W ₃₄₁ of the inductor line pattern portion 341 is greater than the separation distance D ₃₄₁ .

In addition, the side inclination angle θ ₁ of the inductor line pattern part 341 may be different from the side inclination angle θ ₂ of the pad pattern part 342. For example, the side inclination angle θ ₁ of the inductor line pattern part 341 may be greater than the side inclination angle θ ₂ of the pad pattern part 342. 17 illustrates a case in which both the inductor line pattern portion 341 and the pad pattern portion 342 have an inclination angle of less than 90 degrees, but the inductor line pattern portion 341 has an inclination angle of about 90 degrees, and the pad pattern portion It will be understood by those of ordinary skill in the art that when 342 has an inclination angle of less than 90 degrees, it also falls within the scope of equivalent changes in this embodiment.

The pad pattern part 342 occupies a relatively large area compared to the inductor line pattern part 341 and may be a part that is electrically connected to other components outside the inductor element substrate 24. Therefore, a stable trap of liquid metal is very important, and by forming a relatively small side inclination angle of the pad pattern portion 342, stability of the structure and electrical connection with external components can be achieved.

The inductor line pattern portion 341 also has a predetermined side inclination angle and the necessity of stably trapping the liquid metal is the same as that of the pad pattern portion 342, but the inductor line pattern portion 341 is somewhat different from the pad pattern portion 342. Different properties are required. That is, the inductor line pattern portion 341 has a greater contribution to the flow of current than the pad pattern portion 342, and therefore, a difference in local sheet resistance may affect the electrical characteristics of the passive element.

For example, when the side inclination angle of the inductor line pattern portion 341 is too small, the difference between the width at the top and the bottom of the inductor line pattern portion 341 may increase, and resistance at the top and bottom of the line This can be localized. Therefore, it is advantageous that the side inclination angle θ ₁ of the inductor line pattern portion 341 is relatively larger than the side inclination angle θ ₂ of the pad pattern portion 342. In this respect, the side inclination angle θ ₁ of the inductor line pattern part 341 is about 80 degrees to 85 degrees, and the side inclination angle θ ₂ of the pad pattern part 342 is about 60 degrees to 84 degrees, or It may be about 70 degrees to 80 degrees.

In addition, in an exemplary embodiment, a side surface of the thickness control layer 665 forming a channel in which the pad pattern portion 342 is disposed may not have an inclination. In addition, in the pad area in which the pad pattern portion 342 is disposed, side surfaces of the partition wall pattern layer 660 and the thickness control layer 665 may be in a state in which they are not aligned. Accordingly, the upper surface of the thickness control layer 665 is partially exposed and may come into contact with the pad pattern portion 342.

18 is a plan view of an inductor composite device substrate 40 according to an embodiment of the present invention. 19 is a cross-sectional view taken along lines A-A', B-B', and C-C' of FIG. 18.

18 and 19, the composite passive device substrate according to the present embodiment may be an inductor composite device substrate 40 including an inductor device and a resistance device. Specifically, it may be an inductor composite device substrate 40 or an inductor composite device including the inductor region I and the resistive region R, and a pad pattern interposed therebetween.

In the stacked structure of the inductor composite device substrate 40, the inductor composite device substrate 40 includes a base substrate 100 and a liquid metal pattern layer 510 disposed on the base substrate 100, and a thickness control layer It may further include 635, a partition wall pattern layer 630 and a sealing layer 700.

The base substrate 100 is a space in which the liquid metal pattern layer 510 is disposed, and may provide a planar space to which the first direction X and the second direction Y belong. The material of the base substrate 100 is not particularly limited as long as it can stably support the liquid metal pattern layer 510, but may be made of, for example, a material having flexibility, elasticity, foldable and/or rollable properties. . For a specific example, the base substrate 100 may be made of a polymer resin such as polydimethylsiloxane (PDMS), polyacrylate, and polyimide. For another example, the base substrate 100 may be made of a material such as paper. In this case, the base substrate 100 may have a predetermined liquid permeability.

A liquid metal pattern layer 510 including a liquid metal may be disposed on the base substrate 100. The liquid metal may be a liquid metal having a complex composition including gallium and indium.

The liquid metal pattern layer 510 includes an inductor line pattern portion 511 positioned in an inductor, a resistance line pattern portion 513 positioned in a resistance region, and a pad pattern positioned in a pad region Pad. It may include a part 512. The inductor line pattern part 511, the resistance line pattern part 513, and the pad pattern part 512 may be located on the same layer. In addition, the inductor line pattern portion 511, the resistance line pattern portion 513, and the pad pattern portion 512 may be integrally formed without a physical boundary, and may be continuously filled with the same liquid metal.

As a non-limiting example, the inductor line pattern portion 511 and the resistance line pattern portion 513 are formed without a physical boundary, and may include liquid metals having different compositions. For example, the inductor line pattern part 511 is in a state filled with a liquid metal of a complex composition including gallium and indium, and the resistance line pattern part 513 is a nanoparticle that maintains a solid state at room temperature other than gallium and indium. It may further include. Since the liquid metal has a considerable viscosity, even if the inductor line pattern portion 511 and the resistance line pattern portion 513 are filled with liquid metals of different compositions, the state can be maintained. In this case, it goes without saying that the inductor line pattern portion 511 and the resistance line pattern portion 513 do not have a physical boundary.

18 illustrates a case in which the resistance pattern according to FIG. 2 and the like and the inductor pattern according to FIG. 12 are combined, but the present invention is not limited thereto. The planar shape, width, pitch, separation distance, and characteristics of the resistance line pattern portion 513 and the inductor line pattern portion 511 are the same as described in detail for each of the resistance element substrate and the inductor element substrate. Description is omitted.

Meanwhile, the thickness control layer 635 may be disposed on the base substrate 100. As described above, the thickness control layer 635 is made of an insulating material, and the maximum thickness of the thickness control layer 635 is less than the maximum thickness of the partition pattern layer 630.

The thickness control layer 635 may be partially disposed over the inductor region I, the resistance region R, and the pad region. Specifically, the thickness control layer 635 may be disposed on the entire surface of the inductor region I. On the other hand, the thickness control layer 635 is partially patterned to form a channel, and the channel may be at least partially located in the pad region and the resistance region R. That is, the thickness control layer 635 may completely overlap the inductor line pattern portion 511 and may at least partially non-overlap the pad pattern portion 512 and the resistance line pattern portion 513.

The thickness control layer 635 and the partition wall pattern layer 630 may provide a channel for filling the liquid metal together. In this case, the inductor line pattern portion 511 is disposed only in a channel provided by the barrier rib pattern layer 630, and the pad pattern portion 512 and the resistance line pattern portion 513 are formed with a thickness control layer 635 and a barrier rib pattern layer. It may be disposed in a channel provided by 630.

That is, the thickness (T ₅₁₃₎ of the inductor line pattern portion 511. The thickness (T ₅₁₁₎ the thickness of the pad pattern portion (512) (T ₅₁₂₎ and the resistor line pattern portion 513 of the by controlling layer 635 thickness It can be different from. For example, the maximum thickness T ₅₁₂ of the pad pattern part 512 may be greater than the average thickness T ₅₁₁ of the inductor line pattern part 511. In addition, the average thickness T ₅₁₃ of the resistance line pattern portion 513 may be greater than the average thickness T ₅₁₁ of the inductor line pattern portion 511. In some embodiments, the average thickness T ₅₁₃ of the resistance line pattern part 513 may be substantially the same as the maximum thickness T ₅₁₂ of the pad pattern part 512.

As described above, the pad pattern part 512 needs to have a sufficient thickness because it performs electrical connection with external components. In addition, although the present invention is not limited thereto, when tuning the inductor composite device substrate 40 according to the present exemplary embodiment, the resistance line pattern portion 513 may have a sufficient thickness to facilitate tuning. On the other hand, in the case of the inductor line pattern part 511, the induced electromotive force is maximized by having a relatively small thickness. Furthermore, even if the deformation of expansion, bending, or pressing occurs in the resistance region R, the inductor line pattern of the inductor region I Structural distortion in the unit 511 can be minimized.

In other words, for example, when the inductor composite device substrate 40 is tuned to adjust the impedance, the inductor composite device substrate 40 is stretched, bent, or pressed, the structure of the inductor region I Compared to the degree of deformation, structural deformation of the resistance region R can be increased, and only the size of the resistance component can be variably changed while maintaining the reactance component. Therefore, there is an advantage in that adjustment to a desired impedance becomes easy.

FIG. 20 is a cross-sectional view of an inductor composite device substrate 41 according to another embodiment of the present invention, showing a position corresponding to that of FIG. 19.

Referring to FIG. 20, a side surface of the liquid metal pattern layer 520 of the inductor composite device substrate 41 according to the present embodiment has a partially inclined point. The inductor composite device substrate 40 according to the embodiment of FIG. Is different.

In an exemplary embodiment, a side surface of the pad pattern portion 522 may have a tapered slope. As described above, the liquid metal pattern layer 520 may be formed of a liquid metal that maintains a liquid state at room temperature. In this case, the side surface of the partition wall pattern layer 640 forming the upper end of the channel may have a reverse slope, thereby stably trapping the liquid metal.

The pad pattern portion 522 occupies a relatively large area compared to the inductor line pattern portion 521 and the resistance line pattern portion 523, and is electrically connected to other components outside the inductor composite device substrate 40 Can be Therefore, a stable trap of liquid metal is very important, and by forming a relatively small side inclination angle of the pad pattern portion 522, it is possible to achieve stability of the structure and stability of electrical connection with external components.

Further, a side surface of the inductor line pattern part 521 and a side surface of the resistance line pattern part 523 may have a larger inclination angle than a side surface of the pad pattern part 522. 20 illustrates a case where both the inductor line pattern part 521 and the resistance line pattern part 523 have an inclination angle of less than 90 degrees, but the side of the pad pattern part 522 has an inclination angle of less than 90 degrees. , It will be appreciated by those of ordinary skill in the art that when the inductor line pattern portion 521 and the resistance line pattern portion 523 each have an inclination angle of about 90 degrees, they are also within the range of equal changes in the present embodiment.

The inductor line pattern portion 521 and the resistance line pattern portion 523 also have a predetermined side inclination angle and the necessity of stably trapping the liquid metal is the same as that of the pad pattern portion 522, but the inductor line pattern portion 521 and The resistance line pattern portion 523 is required to have slightly different characteristics from the pad pattern portion 522. That is, the inductor line pattern part 521 and the resistance line pattern part 523 have a relatively greater degree of contributing to the flow of current, and a difference in local sheet resistance may affect the electrical characteristics of the passive element.

For example, when the side inclination angles of the inductor line pattern part 521 and the resistance line pattern part 523 are too small, the difference between the width at the top and the bottom of the line may increase, and at the top and bottom of the line The resistance of may be locally different. In this respect, the side inclination angle θ ₁ of the inductor line pattern part 521 and the side inclination angle θ ₃ of the resistance line pattern part 523 are about 80 to 85 degrees, respectively, and the pad pattern part 522 The side inclination angle (θ ₂ ) of may be about 60 degrees to 84 degrees, or about 70 degrees to 80 degrees.

On the other hand, the side of the barrier pattern layer 640 of the resistance region R and the side of the thickness control layer 645 are aligned, but the side of the barrier pattern layer 640 and the side of the thickness control layer 645 in the pad area are Not aligned is the same as described above.

In some embodiments, the side inclination angle θ ₃ of the resistance line pattern part 523 may be greater than or equal to the side inclination angle θ ₁ of the inductor line pattern part 521. Although the present invention is not limited thereto, when the side inclination angle is small, the deformation of the structure may be relatively small when the inductor composite device substrate 41 is partially stretched, bent, or pressed. Therefore, by making the inclination angle θ ₁ of the inductor line pattern part 521 smaller than the inclination angle θ ₃ of the resistance line pattern part 523, there is an effect of further improving tuning stability.

Hereinafter, a method of manufacturing the inductor composite device substrate 41 according to the embodiment of FIG. 20 will be described.

21 to 24 are cross-sectional views illustrating a method of manufacturing an inductor composite device substrate according to an embodiment of the present invention.

First, referring to FIG. 21, a thickness control layer 645 is disposed on the base substrate 100. The thickness control layer 645 may be partially patterned to form the first channel. Although not expressed in a plan view, the first channel may include a zigzag-shaped channel region (ie, a resistance channel region) and a pad channel at a plan view. That is, the first channel may be located in the resistance region.

Since the base substrate 100 and the thickness control layer 645 have been described in detail above, overlapping descriptions will be omitted.

Subsequently, referring to FIG. 22 further, the partition wall pattern layer 640 is disposed on the thickness control layer 645. The partition wall pattern layer 640 may be directly disposed on the thickness control layer 645. In addition, the partition wall pattern layer 640 may be disposed so as not to contact the base substrate 100. The barrier rib pattern layer 640 may form a second channel. The side surface of the barrier rib pattern layer 640 may have a reverse slope of an inverted tapered shape. Although not shown in a plan view, the second channel may include a zigzag-shaped channel region (ie, a resistance channel region), a helical channel region (ie, an inductor channel region), and a pad channel at a plan view. That is, the second channel may be located in the resistance region and the inductor region. In some embodiments, the inductor channel region may be rounded in plan.

Since the partition wall pattern layer 640 has been described in detail above, overlapping descriptions will be omitted.

Subsequently, referring to FIG. 23 further, a sealing layer 700 is disposed on the partition pattern layer 640. Although not shown in the drawings, an adhesive layer (not shown) may be interposed between the partition pattern layer 640 and the sealing layer 700.

The space surrounded by the base substrate 100, the thickness control layer 645, the partition wall pattern layer 640, and the sealing layer 700 may be empty. That is, the first channel formed by the thickness control layer 645 and the second channel formed by the partition wall pattern layer 640 may form an empty inner space together.

In more detail, the first channel may be connected to the pad channel region and the resistance channel region, but not to the inductor channel region. The second channel may be connected to all of the pad channel region, the resistance channel region, and the inductor channel region.

Subsequently, referring to FIG. 24 further, a liquid metal pattern layer 520 is formed by injecting or filling a liquid metal into the empty first and second channels. In an exemplary embodiment, all of the inductor channel region, the pad channel region, and the resistance channel region may be filled through a single liquid metal injection process. The liquid metal filled in the inductor channel region forms the inductor line pattern part 521, the liquid metal filled in the pad channel region forms the pad pattern part 522, and the liquid metal filled in the resistance channel region forms a resistance. The line pattern portion 523 may be formed.

As a non-limiting example, the inductor line pattern portion 521 and the resistance line pattern portion 523 are formed without a physical boundary, and may include liquid metals having different compositions. For example, unlike the inductor line pattern portion 521, the resistance line pattern portion 523 may be formed of a liquid metal in which nanoparticles maintaining a solid state at room temperature are suspended. In this case, a filling process may be performed from the inductor line pattern portion 521 side, and a filling process may be performed from the resistance line pattern portion 523 side. The filling process on both sides may be performed simultaneously or sequentially. Since the liquid metal has a considerable viscosity, even if the inductor line pattern portion 521 and the resistance line pattern portion 523 are filled with liquid metals of different compositions, the state can be maintained.

The inductor composite device substrate manufactured through the method of manufacturing the inductor composite device substrate according to the present exemplary embodiment has excellent electrical characteristics by stably maintaining the liquid metal pattern layer 520 maintaining a liquid state at room temperature. In addition, when tuning the inductor composite device substrate, structural deformation applied to the resistance line pattern part 523 can be minimized while minimizing structural deformation applied to the inductor line pattern part 521, thereby enabling efficient impedance control. There is.

Hereinafter, the present invention will be described in more detail with reference to Preparation Examples and Experimental Examples.

[Production Example 1-1]

A resistive element substrate having a shape as shown in FIG. 1 was manufactured. And the image is shown in Figure 25.

As the liquid metal, a mixed composition of gallium and indium was used. The laminated structure was configured as shown in FIG. 7. Paper was used as the base substrate.

[Production Example 1-2]

A resistive element substrate having a shape as shown in FIG. 2 was manufactured. And the image is shown in Figure 26. It was prepared in the same manner as in Preparation Example 1-1, except that the planar shape was different.

[Production Example 2-1]

An inductor element substrate having a shape as shown in FIG. 11 was manufactured. And the image is shown in Figure 27.

As the liquid metal, a mixed composition of gallium and indium was used. The laminated structure was configured as shown in FIG. 17. Paper was used as the base substrate.

[Production Example 2-2]

An inductor element substrate having a shape as shown in FIG. 12 was manufactured. And the image is shown in Figure 28. It was prepared in the same manner as in Preparation Example 2-1, except that the planar shape was different.

[Experimental Example]

The properties of the inductor element substrate prepared in Preparation Example 2-2 were measured and shown in FIG. 29. Referring to FIG. 29, it can be seen that the inductor element substrate using the liquid metal according to the present invention exhibits an inductance of 1.63 μH and is sufficient to function as an inductor element.

The embodiments of the present invention have been described above, but these are only examples and do not limit the present invention, and those of ordinary skill in the field to which the present invention pertains should not depart from the essential characteristics of the embodiments of the present invention. It will be appreciated that various modifications and applications not illustrated above are possible. Therefore, the scope of the present invention should be understood to include modifications, equivalents, or substitutes of the technical idea exemplified above. For example, each component specifically shown in the embodiment of the present invention can be modified and implemented. And differences related to these modifications and applications should be construed as being included in the scope of the present invention defined in the appended claims.

40: inductor composite device substrate
100: base substrate
510: liquid metal pattern layer
511: inductor line pattern portion
512: pad pattern part
513: resistance line pattern portion
630: bulkhead pattern layer
635: thickness control layer
700: sealing layer

Claims (1)

A flexible inductor composite device substrate in which a resistance pattern and an inductor pattern are continuously formed on a flexible substrate using a liquid metal.

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