KR101993314B1 - Layered-substrate including liquid metal, flexible filter element using the layered-substrate, and method of preparing the filter element - Google Patents

Abstract

Provided are a laminated substrate including liquid metal, a flexible filter element using the same, and a manufacturing method of the flexible filter element. The laminated substrate comprises: a first based on which a first contact hole is formed; a second base disposed on the other surface of the first base, having a second hole connected to the first contact hole, and having liquid permeability different from liquid permeability of the first base; a first metal pattern disposed on one surface of the first base; a second metal pattern disposed on the other surface of the second base; and a contact unit inserted into the first and second contact holes and electrically connecting the first and second metal patterns.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate laminate including a liquid metal, a flexible filter element using the same, and a method of manufacturing a filter element using the same. BACKGROUND ART < RTI ID = 0.0 >

The present invention relates to a substrate laminate including a liquid metal, a flexible filter element using the same and a method of manufacturing a flexible filter element, and more particularly, to a flexible substrate laminate for improving electrical connection between an inductor element and a capacitor element, And a method of manufacturing the flexible filter element.

Recently, various sensor devices are being developed due to the development of IoT technology. For example, a living body monitoring device attached to an animal such as a human is attached to a body surface to measure body fluid components, collect body temperature information, heartbeat information, position information, and other various information, Can be managed. As another example, a food safety monitoring device attached to a food can collect information on the history and quality of the food to ensure food stability and contribute to public health promotion.

Such a sensor device must satisfy various characteristics depending on the surface thereof. In the case of the above-described biomedical monitoring or food monitoring device, if the object surface to which the sensor device is attached is a curved surface and further the object surface is fluid, if the adhesion between the object surface and the sensor device is poor, have. Therefore, there is an urgent need to develop a technology for realizing a sensor device with complete flexibility.

Patent Document 1 (US 9,945,739 B2) discloses a pressure and temperature sensor using amorphous metal. Specifically, Patent Document 1 discloses a sensor device having a characteristic that is stretchable so that it can be used for electronic skin. Patent Document 1 discloses that a wiring of a device is formed using an amorphous metal and an alloy thereof in order to realize a flexible sensor. However, the sensor device of Patent Document 1 is limited to a degree of using a metal layer having improved flexibility, Or the wiring is broken if the wiring is completely folded.

Patent Document 2 (US Pat. No. 10,184,779 B2) discloses a stretchable electrode and a sensor sheet for use in stretchable sensors such as artificial muscles and medical materials such as artificial skin. Patent Document 2 teaches formation of an electrode body using fibers using multi-layer carbon nanotubes. However, even if a local electrode can be formed, the carbon nanotube of Patent Document 2 has an extremely difficult limit to form wiring and the like.

In addition, various attempts have been made to implement a flexible sensor device such as Patent Document 3 (US 8,826,747 B2), Patent Document 4 (US 2019-0003818 A1), and Patent Document 5 (US 2018-0192911 A1).

US registered patent US 9,945,739 B2 (Apr. 17, 2018). U.S. Pat. No. 10,184,779 B2 (Apr. 21, 2019). US registered patent US 8,826,747 B2 (2014.09.09.) US Published Patent US 2019-0003818 A1 (Mar. US Published Patent US 2018-0192911 A1 (Jul. 12, 2018).

On the other hand, an electronic device such as a sensor is constituted by an electronic circuit configured by using various active elements and passive elements. For example, the electronic device may include a filter element such as a high-pass filter (HPF) and / or a low-pass filter (LPF). In particular, in the case of a filter element for transmitting only a specific frequency band or blocking transmission, the stability of the wiring constituting the filter can be a very important factor. For example, when the wiring of the filter element is partially broken or deformed, the filter element does not exhibit stable characteristics, and furthermore, remarkable performance degradation of the entire electronic device such as the sensor device may occur.

Accordingly, an object of the present invention is to provide a substrate laminate capable of exhibiting flexibility. At the same time, it is an object of the present invention to provide a substrate laminate capable of improving the electrical connection between the upper metal pattern and the lower metal pattern to form a stable structure.

Another object of the present invention is to provide a filter element having excellent flexibility and improved electrical connection between upper and lower passive elements to form a stable structure.

Another problem to be solved by the present invention is to provide a method of manufacturing a filter element showing flexibility and improved electrical connection. It is another object of the present invention to provide a method of manufacturing a filter element having a simplified manufacturing process and a reduced manufacturing cost.

The present invention has been made in view of the above problems, and it is an object of the present invention to provide a method of manufacturing the same.

According to an aspect of the present invention, there is provided a substrate stack including: a first base having a first contact hole; A second base disposed on the other surface of the first base and having a second contact hole connected to the first contact hole, the second base having a liquid permeability different from that of the first base; A first metal pattern disposed on one surface of the first base; A second metal pattern disposed on the other surface of the second base; And a contact portion that is inserted into the first contact hole and the second contact hole and electrically connects the first metal pattern and the second metal pattern.

The first metal pattern and the second metal pattern may form an inductor element and a capacitor element, respectively.

The width of the first contact hole or the second contact hole may decrease from the second metal pattern side toward the first metal pattern side.

In addition, the second base may have a liquid permeability lower than that of the first base. Furthermore, the second base may have a greater strength than the first base.

The first base may include a first intrusion conductive portion which is located on an inner wall surface of the first contact hole, is filled with liquid metal, and contacts the contact portion.

The first metal pattern may include a first inductor contact pad portion and a second inductor contact pad portion spaced apart from each other and an inductor circuit pattern portion electrically connected to the first inductor contact pad portion and the second inductor contact pad portion. have.

In addition, the first base may further include a second immersion conductive portion located on a surface of the one surface of the first base and filled with liquid metal.

Here, the first intrusion conductive part may be in contact with the first inductor contact pad part so as not to overlap with the second inductor contact pad part and the inductor circuit pattern part.

In addition, the second intrusion conductive portion may be overlapped with the second inductor contact pad portion so as not to overlap with the first inductor contact pad portion and the inductor circuit pattern portion.

The maximum thickness of the first intrusion conductive portion may be 50% or less of the maximum thickness of the first base.

The first intrusion conductive portion and the second intrusion conductive portion may not touch the inductor circuit pattern portion.

In addition, the inductor circuit pattern portion may have a rounded shape at a plan view.

Further, the second base may not include the portion filled with the liquid metal.

The contact portion and the first intrusion conductive portion may form an electrical conduction region between the first metal pattern and the second metal pattern.

Here, the minimum width of the conductive region formed by the first contact hole and the first intrusion conductive portion may be larger than the minimum width of the second contact hole.

The first metal pattern and the second metal pattern each include a liquid metal in which conductive particles are dispersed, and the first and second intrusion conductive parts may not include the conductive particles.

Further, the first metal pattern and the second metal pattern may each have an inclined side surface.

In this case, the inclination angle formed by the first metal pattern may be larger than the inclination angle formed by the second metal pattern.

The minimum thickness of the first metal pattern may be smaller than the minimum thickness of the second metal pattern.

The substrate stack may include: a barrier rib pattern disposed on one surface of the first base to form a channel in which the first metal pattern is disposed; A reinforcing layer disposed on a side surface of the barrier rib pattern; A transmission barrier layer disposed on one side of the first base and disposed in the channel and contacting the first base and the first metal pattern, the first and second contact holes being arranged so as not to overlap with the first and second contact holes, A transparent barrier layer; A sealing layer disposed on the barrier rib pattern and having a hole overlapping the first contact hole and the second contact hole; And a cover member disposed on the hole of the sealing layer to cover the hole and to be in contact with the first metal pattern and not to overlap the transparent barrier layer.

According to another aspect of the present invention, there is provided a filter element comprising: a first base having liquid permeability; a first base having a first contact hole and at least partially containing a liquid metal; A second base having a liquid-impermeable property, the second base being disposed on the other surface of the first base, the second base having a second contact hole; A first passive element pattern disposed on the first base; And a second passive element pattern disposed on the second base, the second passive element pattern being electrically connected to the first passive element pattern through the first contact hole and the second contact hole.

The liquid metal filled in the first contact hole and the second contact hole and the liquid metal contained in the first base together can form an electrical path between the first passive element pattern and the second passive element pattern .

In the horizontal width of the electric path, the width at both ends in the vertical direction may be larger than the width in the vertical direction central portion.

According to another aspect of the present invention, there is provided a method of manufacturing a filter element, the method comprising the steps of: preparing a first pattern substrate having a first channel formed on a first surface thereof, Preparing a substrate; Preparing a second pattern substrate having a second channel formed on the other surface thereof, the method comprising the steps of: preparing a second pattern substrate including a second base having a liquid permeability lower than that of the first base and a higher strength than the first base; ; Disposing the second pattern substrate on the other surface of the first pattern substrate; And forming a contact hole from the second pattern substrate toward the first pattern substrate.

The method of manufacturing the filter element may further include the steps of disposing a first sealing layer on the first pattern substrate after forming the contact hole; Disposing a second sealing layer on the second pattern substrate; Forming a hole in the first sealing layer so as to overlap with the contact hole; And filling the first channel, the contact hole, and the second channel with liquid metal through the holes of the first sealing layer.

The method of fabricating the filter element further comprises the step of partially penetrating the liquid metal into the first base after filling the liquid metal, further comprising the step of penetrating the liquid metal through the inner wall surface of the first contact hole can do.

The details of other embodiments are included in the detailed description.

According to the embodiments of the present invention, it is possible to provide a substrate laminate, a filter element, and a method of manufacturing a filter element having excellent flexibility and improved electrical connection between passive elements through a stable structure.

The effects according to the embodiments of the present invention are not limited by the contents exemplified above, and more various effects are included in the specification.

1 is an exploded perspective view of a filter element according to an embodiment of the present invention.
Fig. 2 is a diagram showing an equivalent circuit of the filter element of Fig. 1. Fig.
3 is a plan view of the inductor element of FIG.
4 is a top view of the capacitor element of Fig.
5 is a cross-sectional view taken along line Aa-Aa 'and Ab-Ab' in FIG.
6 is a cross-sectional view of a filter element according to another embodiment of the present invention.
7 is a cross-sectional view of a filter element according to another embodiment of the present invention.
8 to 10 are sectional views of a filter element according to still another embodiment of the present invention.
11 is an exploded perspective view of a filter element according to another embodiment of the present invention.
12 is a diagram showing an equivalent circuit of the filter element of Fig.
13 is an exploded perspective view of a filter element according to another embodiment of the present invention.
14 is a diagram showing an equivalent circuit of the filter element of Fig.
15 is a plan view of the capacitor element of Fig.
16 is a plan view of the inductor element of Fig.
FIG. 17 is a cross-sectional view cut along the lines Ba-Ba 'and Bb-Bb' in FIG.
18 is a cross-sectional view of a filter element according to another embodiment of the present invention.
19 to 28 are sectional views sequentially illustrating a method of manufacturing a filter element according to an embodiment of the present invention.
29 is a view showing the shape of the inductor element according to Production Example 1. [Fig.
30 is a diagram showing the characteristics of the inductor device of Production Example 1. Fig.
31 is a view showing a shape of a capacitor element according to Production Example 2. Fig.
32 is a diagram showing the characteristics of the capacitor element of Production Example 2;
33 is a view showing the shape of the inductor element according to Comparative Example 1. Fig.
34 is a view showing a shape of a capacitor element according to Comparative Example 2. Fig.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. However, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. To fully disclose the scope of the invention to a person skilled in the art, and the invention is only defined by the scope of the claims.

Spatially relative terms such as 'above', 'upper', 'on', 'below', 'beneath', 'lower' And can be used to easily describe one element or elements as well as other elements or components as shown. Spatially relative terms should be understood to include terms in different directions of the device in use, in addition to the directions shown in the figures. For example, when inverting an element shown in the figure, an element described as 'below or beneath' of another element may be placed 'above' another element. Thus, the exemplary term " below " may include both the downward and upward directions.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In this specification, 'and / or' include each and every combination of one or more of the mentioned items. Also, singular forms include plural forms unless the context clearly dictates otherwise. The terms 'comprises' and / or " comprising " used in the specification do not exclude the presence or addition of one or more other elements in addition to the stated element. The numerical range indicated by using " to " represents a numerical range including the values described before and after the lower limit and the upper limit, respectively. &Quot; Approximately " or " approximately " means a value or range of values within 20% of the value or numerical range described thereafter.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

In this specification, the first direction X means any direction in the plane, and the second direction Y means another direction that intersects the first direction X in the plane. In addition, the third direction Z means a direction perpendicular to the plane. Unless otherwise defined, 'plane' refers to the plane to which the first direction X and the second direction Y belong. In addition, unless otherwise defined, 'overlap' means overlap in the third direction Z at the plan view.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 is an exploded perspective view of a filter element 11 according to an embodiment of the present invention. 2 is a diagram showing an equivalent circuit of the filter element 11 of Fig. 3 is a plan view of the inductor element 11a of Fig. 4 is a plan view of the capacitor element 11b of Fig.

Referring to Figs. 1 to 4, the filter element 11 according to the present embodiment includes an inductor element 11a and a capacitor element 11b which are electrically connected to each other. The filter element 11 has a first input terminal IN1 connected to the inductor element 11a and a second input terminal IN2 and a first output terminal OUT1 and a second output terminal OUT2 connected to the capacitor element 11b OUT2 may be connected.

The inductor element 11a (inductor element) can be configured to generate an induced electromotive force when current flows. In an exemplary embodiment, the inductor element 11a may be implemented through the first metal pattern 201. [ The first metal pattern 201 may include a first inductor contact pad portion 221a and a second inductor contact pad portion 221b connected to the inductor circuit pattern portion 211 and the inductor circuit pattern portion 211. [ In addition, the first metal pattern 201 may include a liquid metal. That is, the first metal pattern 201 may be a liquid metal pattern formed using liquid metal.

At the plan view, the inductor circuit pattern portion 211 may be in a spiral shape. Specifically, the inductor circuit pattern portion 211 may have a screw shape increasing in distance from the spiral center. The inductor circuit pattern portion 211 can be formed using liquid metal. When a current flows in the inductor circuit pattern portion 211, an induced electromotive force can be generated in a spiral or annular line, and an inductor function can be performed through the induced electromotive force.

In addition, since the inductor circuit pattern portion 211 does not have an angular shape and forms a rounded line at a planar viewpoint, it is easy to form the inductor circuit pattern portion 211 using liquid metal. As described later, the inductor circuit pattern portion 211 can be formed by injecting the liquid metal into the channel. For example, when the inductor circuit pattern portion has a rounded shape as in the present embodiment, , The injection of the liquid metal is easy and the increase of the pressure inside the channel can be suppressed, so that a larger amount of the liquid metal can be injected. In addition, when the inductor circuit pattern portion has a plane-shaped angular shape, the pressure inside the channel increases to cause an unfilled region in the vicinity of the corner, or an unfilled region occurs in the middle of the line, A defect may occur that the line is opened.

The first inductor contact pad portion 221a may be located at one end of the inductor circuit pattern portion 211 forming the line and the second inductor contact pad portion 221b may be located at the other end of the inductor circuit pattern portion 211 forming the line. The first inductor contact pad portion 221a and the second inductor contact pad portion 221b may have a structure that is advantageous in electrical connection by being extended compared to the line width of the inductor circuit pattern portion 211. [ That is, the maximum width of the first inductor contact pad portion 221a and the second inductor contact pad portion 221b may be greater than the maximum width of the inductor circuit pattern portion 211. The first inductor contact pad portion 221a and / or the second inductor contact pad portion 221b may be connected to other components of the filter element 11, another element or an electrical line external to the filter element 11.

The first inductor contact pad portion 221a may be positioned substantially at the center of the spiral inductor circuit pattern portion 211. [ The first inductor contact pad portion 221a may be electrically connected to the capacitor element 11b to form a node that is short-circuited. In addition, the first inductor contact pad portion 221a may be electrically equivalent to the first output terminal OUT1 of the filter element 11, but the present invention is not limited thereto.

In addition, the second inductor contact pad portion 221b may be located outside the spiral inductor circuit pattern portion 211. The second inductor contact pad portion 221b may be electrically equivalent to the first input terminal IN1 of the filter element 11. [ The number of the second inductor contact pad portions 221b may be one or more, but the present invention is not limited thereto.

In addition, the capacitor element 11b (capacitor element) can be configured to accumulate the electrified charge using the electrostatic induction phenomenon. In an exemplary embodiment, the capacitor element 11b may be implemented through the second metal pattern 301. [ The second metal pattern 301 may include a first capacitor contact pad portion 321a and a second capacitor contact pad portion 321b connected to the capacitor circuit pattern portion 311 and the capacitor circuit pattern portion 311. [ In addition, the second metal pattern 301 may include a liquid metal. That is, the second metal pattern 301 may be a liquid metal pattern formed using liquid metal. The composition of the liquid metal forming the second metal pattern 301 may be substantially the same as the composition of the liquid metal forming the first metal pattern 201. [

At the plan view, the capacitor circuit pattern portion 311 may include two line patterns spaced apart from each other. For example, the capacitor circuit pattern portion 311 may include a first capacitor circuit pattern portion 311a and a second capacitor circuit pattern portion 311b which are spaced apart from each other. The first capacitor circuit pattern portion 311a and the second capacitor circuit pattern portion 311b may form one side and the other side of the capacitor element 11b, respectively.

The first capacitor circuit pattern portion 311a and the second capacitor circuit pattern portion 311b may have a substantially S shape and may be spaced apart at regular intervals. As a result, the surface area of the area between the first capacitor circuit pattern portion 311a and the second capacitor circuit pattern portion 311b can be increased and the capacitor characteristics can be improved.

In addition, it is easy to form the capacitor circuit pattern portion 311 using liquid metal by forming the line of the capacitor circuit pattern portion 311 rounded to be approximately 'S' without having an angular shape at the plan view. The capacitor circuit pattern portion 311 can be formed by injecting the liquid metal into the channel as will be described later. For example, when the capacitor circuit pattern portion has a rounded shape as in the present embodiment, The injection of the liquid metal is easy and the increase of the pressure inside the channel can be suppressed, so that a larger amount of liquid metal can be injected. In addition, when the capacitor circuit pattern portion has a plane-shaped angular shape, the pressure inside the channel increases to cause an unfilled region in the vicinity of the edge, or an unfilled region in the middle of the line, A defect may occur that the line is opened.

The first capacitor contact pad portion 321a is located at one end of the first capacitor circuit pattern portion 311a forming each line and the second capacitor contact pad portion 311b is located at one end of the second capacitor circuit pattern portion 311b. 321b may be located. The first capacitor contact pad portion 321a and the second capacitor contact pad portion 321b may have a structure in which electrical connection is advantageous because they are extended compared to the line width of the capacitor circuit pattern portion 311, respectively. That is, the maximum width of the first capacitor contact pad portion 321a and the second capacitor contact pad portion 321b may be greater than the maximum width of the capacitor circuit pattern portion 311. The first capacitor contact pad portion 321a and / or the second capacitor contact pad portion 321b may be connected to other components of the filter element 11, to other elements external to the filter element 11, or to an electrical line.

In some embodiments, the second metal pattern 301 may further include a third capacitor contact pad portion 321c and a fourth capacitor contact pad portion 321d. The third capacitor contact pad portion 321c is electrically equivalent to the first capacitor contact pad portion 321a and the fourth capacitor contact pad portion 321d is electrically equivalent to the second capacitor contact pad portion 321b have.

The first capacitor contact pad portion 321a may be electrically connected to the above-described inductor element 11a to form a short-circuit node. In addition, the first capacitor contact pad portion 321a may be electrically connected to the third capacitor contact pad portion 321c. The first capacitor contact pad portion 321a and the third capacitor contact pad portion 321c may be electrically equivalent to the first output terminal OUT1 of the filter element 11 but the present invention is not limited thereto.

In addition, the second capacitor contact pad portion 321b may be electrically equivalent to the second input terminal IN2 of the filter element 11. In addition, the second capacitor contact pad portion 321b may be electrically connected to the fourth capacitor contact pad portion 321d. The fourth capacitor contact pad portion 321d may be electrically equivalent to the second output terminal OUT2, but the present invention is not limited thereto.

4 shows that the first capacitor contact pad portion 321a and the third capacitor contact pad portion 321c are spaced apart in the first direction X and the second capacitor contact pad portion 321b and the fourth capacitor contact pad portion 321b are spaced apart from each other in the first direction X. [ (Y) in the second direction (Y), the present invention is not limited thereto.

Hereinafter, the filter element 11 according to the present embodiment will be described in more detail with reference to FIG. 5 is a cross-sectional view taken along line Aa-Aa 'and Ab-Ab' in FIG. 5 is a sectional view showing the vicinity of the second inductor contact pad portion 221b and the second capacitor contact pad portion 321b on the left side of FIG. 5 is a cross-sectional view showing the vicinity of the first inductor contact pad portion 221a and the first capacitor contact pad portion 321a.

5, the filter element 11 according to the present embodiment includes a pattern substrate 101, a first metal pattern 201 disposed on one surface (reference upper surface in FIG. 5) of the pattern substrate 101, A second metal pattern 301 disposed on the other surface of the substrate 101 (refer to FIG. 5), and a contact portion 401 for conducting the first metal pattern 201 and the second metal pattern 301 A first sealing layer 751, and a second sealing layer 761, as shown in FIG. The filter element 11 according to the present embodiment may have a layered-substrate structure as shown in Fig.

The pattern substrate 101 may have a patterned structure of one side and the other side. For example, one surface of the pattern substrate 101 may have a first channel or a first trench, and the other surface of the pattern substrate 101 may have a second channel or a second trench.

In an exemplary embodiment, the pattern substrate 101 may include a first pattern substrate 501 and a second pattern substrate 601. The other surface (lower surface) of the first pattern substrate 501 and one surface (upper surface) of the second pattern substrate 601 may be disposed facing each other, or may be bonded to each other. In some embodiments, a bonding layer (not shown) may be disposed between the first pattern substrate 501 and the second pattern substrate 601.

The first pattern substrate 501 may include a first base 511 and a first barrier rib pattern 531 disposed on the first base 511. The first base 511 may be made of a flexible material having flexibility and / or stretchability. For example, the first base 511 may comprise paper, or may comprise a polymer resin such as polydimethylsiloxane or polyimide. In addition, the first base 511 may have micropores inside.

The first barrier rib pattern 531 may form a first channel for filling the first metal pattern 201. That is, at the plan view, the first barrier rib pattern 531 may be a pattern having a substantially inverted shape of the first metal pattern 201. The upper surface of the first base 511 which is not covered by the first barrier rib pattern 531 can be exposed. The first barrier rib pattern 531 may have insulating properties. For example, the first barrier rib pattern 531 may include a polymer material such as polyethyleneterephthalate, polymethylmethacrylate, and polycarbonate, but the present invention is not limited thereto no. In addition, the first barrier rib pattern 531 may have a larger hydrophobicity than the first base 511.

The inductor element 11a can be realized by the first metal pattern 201 as described above. The first metal pattern 201 includes an inductor circuit pattern portion 211 filled in the first channel of the first pattern substrate 501, a first inductor contact pad portion 221a and a second inductor contact pad portion 221b ). The first metal pattern 201 may include a liquid metal that maintains a liquid state at room temperature. The liquid metal may include gallium and indium, but the present invention is not limited thereto. The first metal pattern 201 may abut the first base 511.

A first sealing layer 751 may be disposed on the first metal pattern 201. The first sealing layer 751 has an insulating property and can seal the first metal pattern 201. The first sealing layer 751 may be made of the same or different material as the first barrier rib pattern 531. The first sealing layer 751 may have a greater hydrophobicity than the first base 511. [

Similarly, the second pattern substrate 601 may include a second base 611 and a second barrier rib pattern 631 disposed on the second base 611. The second base 611 may be made of a flexible material having flexibility and / or stretchability.

In an exemplary embodiment, the second base 611 may have a smaller liquid permeability than the first base 511. For example, the first base 511 may be liquid permeable, while the second base 611 may be liquid impermeable. In addition, the second base 611 may have a greater strength than the first base 511. For example, the second base 611 may include a polymer resin such as polyethylene terephthalate, polycarbonate, or polyacrylate.

The first metal pattern 201 located on the upper side forms the inductor element 11a and the second metal pattern 301 located on the lower side is formed on the upper side of the first base 511 and the second base 611, The liquid permeability and / or the strength of the first base 511 and the second base 611 in the case of forming the capacitor element 11b is determined by the electrical connection stability between the first metal pattern 201 and the second metal pattern 301 . ≪ / RTI >

The present inventors have found that when the filter element 11 is formed using a liquid metal and further the inductor element 11a and the capacitor element 11b are made conductive with liquid metal, The contact portion 401 is greatly influenced by the contact portion 11a compared to the contact portion 11a. The second base 611 for supporting the capacitor circuit pattern portion 311 having a more complicated structure than the inductor circuit pattern portion 211 is formed of a material having relatively higher strength than the first base 511, The formation of the capacitor H can be stabilized and the characteristics of the capacitor element 11b and further the filter element 11 can be improved. This will be described later in detail.

The second barrier rib pattern 631 may form a second channel for filling the second metal pattern 301. That is, at the plan view, the second barrier rib pattern 631 may be a pattern having a substantially inverted shape of the second metal pattern 301. The lower surface of the second base 611, which is not covered by the second barrier rib pattern 631, can be exposed. The second barrier rib pattern 631 may be formed of the same or different material as the first barrier rib pattern 531. In addition, the second barrier rib pattern 631 may have a larger hydrophobicity than the second base 611.

The capacitor element 11b can be realized by the second metal pattern 301 as described above. The second metal pattern 301 has a capacitor circuit pattern portion (not shown in the sectional view) filled in the second channel of the second pattern substrate 601, a first capacitor contact pad portion 321a, and a second capacitor contact pad And may further include a third capacitor contact pad portion (not shown in the sectional view) and a fourth capacitor contact pad portion (not shown in the sectional view). The first capacitor contact pad portion 321a overlaps the first inductor contact pad portion 221a in the third direction Z and the second capacitor contact pad portion 321b overlaps the second inductor contact pad portion 221b Can be superposed in the third direction (Z). The capacitor circuit pattern portion 311 may be at least partially overlapped with the inductor circuit pattern portion 211 in the third direction Z. [ The second metal pattern 301 may comprise a liquid metal substantially in the same liquid phase as the first metal pattern 201. The second metal pattern 301 can abut the second base 611.

A second sealing layer 761 may be disposed on the second metal pattern 301. The second sealing layer 761 has an insulating property and can seal the second metal pattern 301. The second sealing layer 761 may be made of the same or different material as the second partition pattern 631. The second sealing layer 761 may have greater hydrophobicity than the second base 611.

The first base 511 and the second base 611 described above may have contact holes H passing therethrough. Specifically, the first base 511 may have a first contact hole, and the second base 611 may have a second contact hole. That is, the first contact hole and the second contact hole may be connected to each other to form the contact hole H. The widths of the first contact holes and the second contact holes may be substantially the same or different. The planar shape of the contact hole H may be substantially circular or polygonal, but the present invention is not limited thereto.

The contact portion 401 can be inserted and disposed in the first contact hole and the second contact hole. The contact portion 401 can electrically conduct the first metal pattern 201 and the second metal pattern 301, specifically, the first inductor contact pad portion 221a and the first capacitor contact pad portion 321a . In addition, the first inductor contact pad portion 221a, the contact portion 401, and the first capacitor contact pad portion 321a may not have a physical boundary with each other. Hereinafter, the term " contact portion 401 " used herein means a portion inserted and arranged in the contact hole H. [ The contact portion 401, the first inductor contact pad portion 221a and the second capacitor contact pad portion 321b may be electrically equivalent to the first output terminal OUT1 of the filter element 11. The contact portion 401 may include a liquid metal having substantially the same composition as the first metal pattern 201 and the second metal pattern 301.

The filter element 11 according to this embodiment is formed by using a passive element constituting the filter, for example, a line of the inductor element 11a and the capacitor element 11b by using a liquid metal for holding liquid at normal temperature, Lt; / RTI > Furthermore, even when the filter element 11 is completely folded, problems such as breakage of the line, occurrence of crack, and the like can be prevented in advance.

The second base 611 includes a first base 511 and a second base 611 having different liquid permeability and strength from each other and having a relatively high strength and a low liquid permeability, The characteristics of the filter element 11 can be improved by disposing the capacitor element 11b on the capacitor element 11b.

Hereinafter, a filter element according to another embodiment of the present invention will be described. However, a duplicate description of a filter element 11 substantially identical to or similar to the filter element 11 according to the above-described embodiment is omitted, which can be clearly understood by a person skilled in the art from the accompanying drawings will be. The same reference numerals are given to the same components.

6 is a cross-sectional view of a filter element 12 according to another embodiment of the present invention, which is a comparative sectional view showing a position corresponding to that of Fig. The filter element 12 according to this embodiment may have a substrate laminate structure as shown in Fig.

6, the filter element 12 according to the present embodiment includes a pattern substrate 102, a first metal pattern 201 and a second metal pattern 201 disposed on one surface and the other surface of the pattern substrate 102, respectively, 6) of the second pattern substrate 602 is formed with a patterned structure on one side (reference upper side in FIG. 6) of the first pattern substrate 502, And the second channel is formed with this patterned structure is different from the filter element 11 according to the embodiment shown in Fig. 5 and the like.

The first patterned substrate 502 can form a base itself. Similarly, the second pattern substrate 602 can form the base itself. In this case, the first pattern substrate 502 may have a higher liquid permeability than the second pattern substrate 602. For example, the first pattern substrate 502 may be liquid permeable and the second pattern substrate 602 may be liquid impermeable. In addition, the second pattern substrate 602 can have a higher strength than the first pattern substrate 502. [ The protruding pattern of the first pattern substrate 502 forming the first channel and the protruding pattern of the second pattern substrate 602 forming the second channel are formed by the first sealing layer 751 and the second sealing layer 761). ≪ / RTI >

The method of forming the first pattern substrate 502 and the second pattern substrate 602 is not particularly limited, but an imprint process can be used, for example. In some embodiments, the liquid metal forming the first metal pattern 201 may partially penetrate the protruding pattern of the first patterned substrate 502. The filter element 12 according to the present embodiment has the effect of omitting the step of forming a separate barrier rib pattern on the base.

7 is a cross-sectional view of a filter element 13 according to another embodiment of the present invention, which is a comparative sectional view showing a position corresponding to that of Fig. The filter element 13 according to this embodiment may have a substrate laminate structure as shown in Fig.

Referring to Fig. 7, the filter element 13 according to the present embodiment is different from the filter element 11 according to the embodiment shown in Fig. 5 and the like in that the width of the contact hole H changes.

In the exemplary embodiment, the contact hole H may be reduced in width from the lower second metal pattern 301 side toward the upper first metal pattern 201 side. That is, the contact hole H may be formed so that the width decreases from the capacitor element side to the inductor element side.

7 shows a state in which the first contact hole formed in the first base 513 and the inner wall of the second contact hole formed in the second base 613 are aligned and the width of the first contact hole and the second contact hole is reduced at a constant rate of change However, the present invention is not limited thereto. In another embodiment, either the first contact hole or the second contact hole may not be reduced in width. In another embodiment, the widths of the first contact holes and the second contact holes may be different, but the width reduction rate of the first contact holes and the width reduction rate of the second contact holes may be different.

In an exemplary embodiment, the inclination angle? ₁ formed by the first base 513 in contact with the contact hole H may be in the range of about 75 degrees to about 88 degrees, or about 78 degrees to about 85 degrees. If the inclination angle? ₁ is too small to be less than 75 degrees, the difference in width between the upper and lower ends of the contact portion 403 inserted into the contact hole H becomes excessively large, It may not be possible to perform the function as the filter element 13 due to the difference in sheet resistance of the contact portion 403 with respect to the current flowing to the contact portion 403. [ On the other hand, if the inclination angle? ₁ is excessively large, that is, if the inner wall of the contact hole H does not have a sufficient inclination, the following effect may not be achieved.

The present inventors have found that when the inductor element and the capacitor element are formed using the liquid metal and the second metal pattern 301 (capacitor element) is formed on the first metal pattern 201 (inductor element) The contact portion 403 has a larger influence than the contact portion 403. This may be due to the fact that the capacitor element must be constructed so as to accumulate sufficient charge on the basis of the electrostatic induction phenomenon, but it is not limited to any theory.

That is, the contact portion 403 for electrically connecting the first metal pattern 201 and the second metal pattern 301 is formed to have a larger width from the upper portion to the lower portion, so that the contact portion 403 and the second metal pattern 301, It is possible to improve the electrical connection between the electrodes 301. In other words, the contact area between the contact part 403 and the first metal pattern 201 is larger than the contact area between the contact part 403 and the second metal pattern 301, so that the cut-off characteristic of the filter element 13 Can be improved.

If the contact area between the contact part 403 and the first metal pattern 201 is excessively large, the sheet resistance due to the line width of the first metal pattern 201 and the change in sheet resistance formed by the contact part 403 The formation of the gradual induced electromotive force may be interrupted, and the characteristics as an inductor element may not be obtained properly. Therefore, the area of the contact portion 403 contacting the first metal pattern 201 forming the inductor element is maintained at a constant level, and the contact portion 403 forms a capacitor element It is possible to improve the electrical connection and the characteristics of the filter element 13 by increasing the area in contact with the second metal pattern 301. [

Although the present invention is not limited to this, the second base 613 may have a greater strength than the first base 513 when the contact hole H is formed using a drilling process, The contact hole H can be stably formed by forming the contact hole H from the base 613 side.

FIG. 8 is a cross-sectional view of a filter element 14 according to another embodiment of the present invention, and is a cross-sectional view showing a position corresponding to FIG. 5. The filter element 14 according to this embodiment may have a substrate laminate structure as shown in Fig.

Referring to FIG. 8, the first base 514 of the filter element 14 according to the present embodiment includes a first immersion conductive portion 451 and / or a second immersion conductive portion 453, which partially contain liquid metal. Which is different from the filter element 13 according to the embodiment of Fig.

The first intrusion conductive portion 451 may be located on the inner wall surface of the first contact hole of the contact hole H, specifically, the first base 514. The first irritation conduction part 451 may be a part formed by partially invading or infiltrating the liquid metal into the first base 514. That is, the first intrusion conductive portion 451 refers to the portion of the first base 514 that has penetrated the liquid metal, and is distinguished from the other portion of the first base 514 that does not penetrate the liquid metal. The first irrigation conduction part 451 may have electrical conductivity due to the liquid metal penetrating through the pores of the first base 514 and the like.

The first intrusion conductive portion 451 is in contact with the first inductor contact pad portion 221a and overlaps with the first inductor contact pad portion 221a and can overlap with the first capacitor contact pad portion 321a. The first intrusion conductive portion 451 is electrically connected to the second inductor contact pad portion 221b, the inductor circuit pattern portion 211, the second capacitor contact pad portion 321b and the capacitor circuit pattern portion They may be formed so as not to overlap each other. In addition, the first intrusion conductive portion 451 may not touch the second inductor contact pad portion 221b and the inductor circuit pattern portion 211.

The first irritation conduction part 451 can contact the contact part 403. The first irritation conduction part 451 can form an electrical path together with the contact part 403. [ That is, the first intrusion conduction part 451 may form an electrical conduction region between the first metal pattern 201 and the second metal pattern 301 together with the contact part 403. In other words, the first intrusion conduction part 451 can function as an auxiliary conduction part.

In an exemplary embodiment, the minimum width W ₁ of the conductive region formed by the first contact hole and the first intrusion conductive portion 451 may be greater than the minimum width W ₂ of the second contact hole. As described above, the contact hole H is formed so that the width of the contact hole H increases from the first base 514 toward the second base 613, and the first immovable conductive portion 451 is formed only in the first base 514 The width in the horizontal direction (lateral direction) of the electrical conduction region may be greater than the width at the both ends in the vertical direction (longitudinal direction) at the central portion in the vertical direction. That is, when the vertical direction is taken as a reference, the width of the electric conduction region can be decreased and then increased again. It is possible to increase the contact area between the first metal pattern 201 and the electrical conduction region (i.e., the contact portion 403 and the first intrusion conduction portion 451) without increasing the width at the upper portion of the contact hole H And a stable electrical connection can be formed.

The filter element 14 according to the present embodiment is configured such that the first base 514 has liquid permeability while the second base 613 is configured to have liquid impermeability so that only the first base 514 has the first non- (451) can be formed. That is, as a non-limiting example, the second base 613 may include no liquid metal or a portion that has penetrated the liquid metal. Thereby, it is possible to easily form a structure in which the width of the electric conduction region increases or decreases with respect to the vertical direction.

Meanwhile, the first base 514 may further include a second intrusion conductive portion 453. The second intrusion conductive portion 453 may be located on one surface of the first base 514 (reference upper surface in FIG. 8), specifically, on the upper surface of the first base 514. The second irritation conduction part 453 may be a part formed by partially invading or penetrating the first base 514 with the liquid metal as in the case of the first irritation conduction part 451. In other words, the second intrusion conductive portion 453 refers to the portion of the first base 514 where the liquid metal has penetrated, and is distinguished from other portions of the first base 514 that have not penetrated the liquid metal. The second intrusion conductive portion 453 may have electrical conductivity due to the liquid metal penetrating through the pores of the first base 514.

The second intrusion conductive portion 453 is in contact with the second inductor contact pad portion 221b and overlaps with the second inductor contact pad portion 221b so as to overlap with the second capacitor contact pad portion 321b. On the other hand, the second intrusion conductive portion 453 is formed to overlap with the first inductor contact pad portion 221a, the inductor circuit pattern portion 211, the first capacitor contact pad portion 321a, and the capacitor circuit pattern portion (not shown) . Also, the second intrusion conductive portion 453 may not touch the first inductor contact pad portion 221a and the inductor circuit pattern portion 211.

The second inductive conduction part 453 may form an electrical path or an electrically conductive area together with the second inductor contact pad part 221b. In other words, the second intrusion conductive portion 453 can function as the second inductor contact pad portion. This can increase the width of the electrical conduction region with respect to the current flow direction. In particular, the second inductor contact pad portion 221b has a relatively large area compared to the inductor circuit pattern portion 211 and can be electrically connected to other external elements. Therefore, by extending the conduction region serving as the second inductor contact pad portion 221b, it is possible to increase the connectivity between the internal components of the filter element 14 or with other external components.

In some embodiments, the width of the second intrusion conductive portion 453 may be greater than the width of the second inductor contact pad portion 221b. The maximum thickness T ₄₅₃ of the second intrusion conductive portion 453 is about 50% or less, or about 40% or less, or about 30% or less of the maximum thickness T ₅₁₄ of the first base 514, Can be about 20% or less. When the thickness T ₄₅₃ of the second intrusion conductive portion 453 exceeds 50% of the thickness T ₅₁₄ of the first base 514, the current flowing through the second intrusion conductive portion 453 causes the second The metal pattern 301 may be electrically affected.

Unlike the case where the second intrusion conductive portion 453 is formed in the region overlapping the second inductor contact pad portion 221b, the liquid metal is electrically connected to the first base 514 in a region overlapping the inductor circuit pattern portion 211, It is possible that an infiltration conduction portion formed by infiltration into the blood vessel can not be formed. This can be controlled by using the widths of the second inductor contact pad portion 221b and the inductor circuit pattern portion 211. [ For example, the second inductor contact pad portion 221b may have a width sufficient to allow liquid metal to penetrate the first base 514, and the inductor circuit pattern portion 211 may be configured such that the liquid metal contacts the first base 514 ), But the present invention is not limited thereto.

9 is a cross-sectional view of a filter element 15 according to another embodiment of the present invention, which is a cross-sectional view showing a position corresponding to that of Fig. The filter element 15 according to this embodiment may have a substrate laminate structure such as that shown in Fig.

9, the side surface of the first metal pattern 205 and / or the second metal pattern 305 of the filter element 15 according to the present embodiment has an inclination angle, (14).

In an exemplary embodiment, the sides of the first inductor contact pad portion 225a and the second inductor contact pad portion 225b of the first metal pattern 205 may be inclined. In addition, the side surface of the inductor circuit pattern portion 215 may be inclined. The second inclination angle? ₂ formed by the first inductor contact pad portion 225a and the second inductor contact pad portion 225b may be the same as or different from the inclination angle formed by the inductor circuit pattern portion 215. [

On the other hand, the inner wall of the channel of the first partition pattern 535 disposed on the first base 514 may have a partially inverted slope. The liquid metal line of the first metal pattern 205 forming the inductor element of the filter element 15 according to the present embodiment may have a tapered shape. Accordingly, it is possible to stably trap the liquid metal that maintains the liquid state at room temperature. In particular, the first inductor contact pad portion 225a and / or the second inductor contact pad portion 225b, which are electrically connected to each other between the inductor element and the capacitor element or outside the filter element 15, And therefore, trapping the liquid metal that forms them stably is a very important factor in the characteristic implementation of the filter element 15.

On the other hand, the side surfaces of the first capacitor contact pad portion 325a and the second capacitor contact pad portion 325b of the second metal pattern 305 may be inclined. Although not shown in the sectional view, the side surface of the capacitor circuit pattern portion may have a slope. The third inclination angle? ₃ formed by the first capacitor contact pad portion 325a and the second capacitor contact pad portion 325b may be the same as or different from the inclination angle formed by the capacitor circuit pattern portion.

In some embodiments, the third inclination angle [theta] ₃ formed by the second metal pattern 305 may be smaller than the second inclination angle [theta] ₂ formed by the first metal pattern 205. [ As described above, the second metal pattern 305 can be configured to accumulate the charge charged by the pattern shape. In this case, the capacitance of the capacitor element may be proportional to the facing area of the terminals (e.g., adjacent lines). That is, the side inclination angle? ₃ of the second metal pattern 305 is relatively increased within a range that does not impair the electrical stability of the current flowing along the second metal pattern 305, thereby increasing the facing area between adjacent patterns It is effective. For example, the second inclination angle ₂ may be about 80 degrees to 85 degrees, and the third inclination angle ₃ may be about 60 degrees to 84 degrees. When the side inclination angle of the first metal pattern 205 and / or the second metal pattern 305 is less than 60 degrees, the sheet resistance at the upper and lower portions of the line can be locally different, and the filter element 15 ) Can not be fully implemented.

On the other hand, the inner wall of the channel of the second barrier rib pattern 635 disposed on the second base 613 may have a partially inverted slope like the first barrier rib pattern 535. This makes it possible to stably trap the liquid metal that maintains the liquid state at room temperature and to improve the electrical connection stability between the first capacitor contact pad portion 325a and / or the second capacitor contact pad portion 325b and other components .

10 is a cross-sectional view of a filter element 16 according to another embodiment of the present invention, which is a comparative cross-sectional view showing a position corresponding to that of Fig. The filter element 16 according to this embodiment may have a substrate laminate structure as shown in Fig.

10, the first pattern substrate 506 of the filter element 16 according to the present embodiment further includes a first reinforcing layer 556 and / or a permeation blocking layer 576, 606 are different from the filter element 15 according to the embodiment of FIG. 9 in that the second reinforcing layer 656 is further included.

The first reinforcing layer 556 may be disposed on the side of the inner wall of the channel formed by the first barrier rib pattern 536. The first reinforcing layer 556 may be a member for reinforcing the flow of liquid metal forming the first metal pattern 206. [ For example, the first stiffening layer 556 may comprise a material that is more hydrophobic than the first barrier rib pattern 536. The first reinforcing layer 556 may be formed on the first barrier rib pattern 536 through a deposition process or the like or may be formed by modifying the surface of the first barrier rib pattern 536 through a plasma process or the like. The first reinforcing layer 556 may be disposed on the upper surface as well as the side surfaces of the first barrier rib pattern 536.

Likewise, the second reinforcing layer 656 may be disposed on the side of the inner wall of the channel formed by the second partition pattern 636. [ The second reinforcing layer 656 may be a member for reinforcing the flow of liquid metal forming the second metal pattern 306. For example, the second stiffening layer 656 may comprise a material that is more hydrophobic than the second barrier rib pattern 636. The second reinforcing layer 656 may be formed through the same or different process as the first reinforcing layer 556.

In addition, the first base 516 may be provided with a transmission blocking layer 576. The permeation barrier layer 576 may be a member for preventing liquid metal liquid from invading or penetrating to the first base 516 side unintentionally. For example, the permeation barrier layer 576 may comprise a material having greater hydrophobicity and lower liquid permeability than the first base 516. The transmissive blocking layer 576 may be in contact with the first base 516 and the first metal pattern 206. As a non-limiting example, the second pattern substrate 606 may include no transparent barrier layer. In this case, the second metal pattern 306 may abut the second base 616.

The permeation barrier layer 576 may be disposed so as not to overlap the first inductor contact pad portion 226a while overlapping the inductor circuit pattern portion 216 and the second inductor contact pad portion 226b. The first inductor contact pad portion 226a may be electrically connected to the first capacitor contact pad portion 326a and the first intrusion conductive portion 451 may be formed in the vicinity of the contact hole H have. Therefore, the transmission blocking layer 576 may not be disposed in the region overlapping the first inductor contact pad portion 226a and the contact hole H.

In some embodiments, the first metal pattern 206 and the second metal pattern 306 may further include conductive particles (P) dispersed therein. The conductive particles (P) may be substantially uniformly dispersed in the liquid metal in a liquid state at room temperature. The conductive particles (P) can further improve the conductivity of the liquid metal.

As described above, the first irritation conduction part 451 may include liquid metal infiltrated into the first base 516. In this case, the composition of the liquid metal included in the first intrusion conductive portion 451 may be different from the composition of the liquid metal of the first metal pattern 206 and / or the second metal pattern 306. For example, the first metal pattern 206 and the second metal pattern 306 include the conductive particles P, while the first intrusion conductive portion 451 may not include the conductive particles P. [ 8, the composition of the liquid metal included in the second intrusion conductive portion is not limited to the first metal pattern (not shown) Or the composition of the liquid metal of the first metal pattern 206 and / or the second metal pattern 306.

In addition, the first sealing layer 756 may have a plurality of injection holes 757h. The injection hole 757h may overlap the first inductor contact pad portion 226a and / or the second inductor contact pad portion 226b. In particular, at least some of the plurality of injection holes 757h may overlap with the contact holes H. [ At least a portion of the plurality of injection holes 757h may overlap with the transmissive-blocking layer 576. The present invention is not limited thereto, but liquid metal can be injected through the injection hole 757h. As a non-limiting example, the second sealing layer 761 may be in a state where a hole is not formed.

A cover member 770 may be disposed on the injection hole 757h. The cover member 770 covers the injection hole 757h to prevent the liquid metal constituting the first metal pattern 206 and the second metal pattern 306 from flowing out. The cover member 770 can abut the first metal pattern 206.

In an exemplary embodiment, the minimum thickness T ₂₀₆ of the first metal pattern ₂₀₆ may be less than the minimum thickness T ₃₀₆ of the second metal pattern 306. As a non-limiting example, when the transmissive-blocking layer 576 is disposed on the first base 516, the minimum thickness T ₂₀₆ of the first metal pattern 206 is greater than the minimum thickness T _{206 of} the region overlapping the transmissive- It is to be understood that the present invention is not limited thereto.

As described above, the first metal pattern 206 may form an inductor element and the second metal pattern 306 may form a capacitor element. In this case, the thickness of the first metal pattern 206 is formed to be relatively small to prevent an unnecessary increase in thickness, and the second metal pattern 306 is formed relatively large to have a sufficient facing surface area between adjacent patterns, Can be improved.

11 is an exploded perspective view of a filter element 21 according to another embodiment of the present invention. 12 is a diagram showing an equivalent circuit of the filter element 21 in Fig.

11 and 12, the filter element 21 according to the present embodiment includes an inductor element 21a and a capacitor element 21b which are electrically connected to each other, Which is different from the filter element 11 according to the first embodiment.

The filter element 21 has a second input terminal IN2 and a second output terminal OUT2 connected to the inductor element 21a and a first input terminal IN1 to the capacitor element 21b, And a first output terminal OUT1 may be connected. The second input terminal IN2 and the second output terminal OUT2 may be electrically equivalent. The short-circuiting node between the inductor element 21a and the capacitor element 21b may be electrically equivalent to the first output terminal OUT1.

The filter element 21 according to the present embodiment includes the inductor element 21a located at the upper part and the capacitor element 21b located at the lower part in the same manner as the filter element 11 according to the embodiment of FIG. It is possible to realize a function as a high-pass filter element simply by changing the positions of the input terminal and the output terminal.

13 is an exploded perspective view of a filter element 31 according to another embodiment of the present invention. Fig. 14 is a diagram showing an equivalent circuit of the filter element 31 in Fig. 15 is a plan view of the capacitor element 31a of Fig. 16 is a plan view of the inductor element 31b of Fig. FIG. 17 is a cross-sectional view cut along the lines Ba-Ba 'and Bb-Bb' in FIG. Specifically, the left side of FIG. 17 is a sectional view showing the vicinity of the second capacitor contact pad portion 361b and the second inductor contact pad portion 261b. 17 is a cross-sectional view showing the vicinity of the first capacitor contact pad portion 361a and the first inductor contact pad portion 261a. The filter element 31 according to this embodiment may have a layered-substrate structure as shown in Fig.

13 to 17, the filter element 31 according to the present embodiment includes a capacitor element 31a and an inductor element 31b electrically connected to each other, and the capacitor element 31a has a first input terminal The first and second input terminals IN1 and IN1 and the first output terminal OUT1 are connected to each other and the second input terminal IN2 and the second output terminal OUT2 are connected to the inductor element 31b. Which is different from the filter element 11 according to the first embodiment.

The capacitor element 31a may be implemented through the second metal pattern 331. [ The second metal pattern 331 includes a first capacitor contact pad portion 361a connected to the capacitor circuit pattern portion 351 and the capacitor circuit pattern portion 351, a second capacitor contact pad portion 361b, Section 361c. The second metal pattern 331 may comprise a liquid metal. The capacitor circuit pattern portion 351 may include a first capacitor circuit pattern portion 351a and a second capacitor circuit pattern portion 351b spaced from each other. The first capacitor contact pad portion 361a is electrically connected to an inductor element 31b to form a shorting node and the second capacitor contact pad portion 361b is electrically equivalent to the first input terminal IN1 . In addition, the third capacitor contact pad portion 361c may be electrically equivalent to the first output terminal OUT1. The other capacitor elements 31a have been described above, so duplicate descriptions are omitted.

In addition, the inductor element 31b may be implemented through the first metal pattern 231. [ The first metal pattern 231 includes a first inductor contact pad portion 261a connected to the inductor circuit pattern portion 251 and the inductor circuit pattern portion 251, a second inductor contact pad portion 261b, And a portion 261c. The first metal pattern 231 may comprise a liquid metal. The first inductor contact pad portion 261a is electrically connected to the capacitor element 31a to form a shorting node and the second inductor contact pad portion 261b is electrically equivalent to the second input terminal IN2 . In addition, the third inductor contact pad portion 261c may be electrically equivalent to the second output terminal OUT2.

On the other hand, in the cross-sectional view, the filter element 31 includes a pattern substrate 107, a second metal pattern 331 disposed on one surface (reference upper surface in FIG. 17) of the pattern substrate 107, The first metal pattern 231 disposed on the first metal pattern 231 and the contact portion 407 electrically connecting the first metal pattern 231 and the second metal pattern 331. Further, it may further include a first sealing layer 751 and a second sealing layer 761.

The pattern substrate 107 may include a second pattern substrate 607 disposed on the upper side and a first pattern substrate 507 disposed on the lower side. The second pattern substrate 607 includes a second base pattern 617 and a second partition pattern 637 disposed on the second base 617. The first pattern substrate 507 includes a first base 517, And a first barrier rib pattern 537 disposed on the first base 517. In some embodiments, the first base 517 may include a first intrusion conduction portion 461 and a second intrusion conduction portion 463 that partially contain a liquid metal. The first intrusion conductive portion 461 may form an electric conduction region together with the contact portion 407.

In the exemplary embodiment, the contact hole or the contact portion 407 may be reduced in width from the second metal pattern 331 on the upper side to the first metal pattern 231 on the lower side. That is, the contact hole and the contact portion 407 can be formed so that the width decreases from the capacitor element 31a side toward the inductor element 31b side.

The filter element 31 according to the present embodiment is configured to change the upper and lower portions of the filter element 14 according to the embodiment of Fig. 8 and change the function of the filter element 31 by changing the input terminal and / There is an effect that can be done. The detailed description of the filter element 31 has already been described above with reference to Fig. 8, so that a duplicate description will be omitted.

FIG. 18 is a cross-sectional view of a filter element 32 according to another embodiment of the present invention, which is a comparative sectional view showing a position corresponding to FIG. 17. FIG. The filter element 32 according to this embodiment may have a substrate laminate structure as shown in Fig.

18, the side surface of the first metal pattern 232 and / or the second metal pattern 332 of the filter element 32 according to the present embodiment has an inclination angle, Which is different from the device 31.

The side surfaces of the first inductor contact pad portion 262a and the second inductor contact pad portion 262b of the first metal pattern 232 may form a fourth inclination angle? ₄ . In addition, the side surface of the inductor circuit pattern portion 252 can have an inclination. On the other hand, the inner wall of the channel of the first partition pattern 538 disposed on the first base 517 may have a partially inverted slope.

The side surfaces of the first capacitor contact pad portion 362a and the second capacitor contact pad portion 362b of the second metal pattern 332 may form a fifth inclination angle? ₅ . Although not shown in cross-section, the side of the capacitor circuit pattern portion may have an inclination. On the other hand, the inner wall of the channel of the second partition pattern 638 disposed on the second base 617 may have a partially inverted slope.

In an exemplary embodiment, the fifth inclined angle (θ ₅₎ of the second metal pattern 332 is formed may be smaller than a fourth angle of inclination (θ ₄₎ of the first metal pattern 232 is formed. The lateral inclination angle [theta] ₅ of the second metal pattern 332 forming the capacitor element is relatively increased to improve the characteristics of the capacitor element. For example, the fourth inclination angle? ₄ may be about 80 to 85 degrees, and the fifth inclination angle? ₅ may be about 60 to 84 degrees.

Hereinafter, a method of manufacturing a filter element according to an embodiment of the present invention will be described in detail. 19 to 28 are sectional views sequentially illustrating a method of manufacturing a filter element according to an embodiment of the present invention. Hereinafter, the method of manufacturing the filter element according to the embodiment of FIG. 10 will be described with reference to FIGS. 19 to 28, but the present invention is not limited thereto. The method of manufacturing the filter element according to the present invention can be clearly understood.

Referring first to FIG. 19, a transmission blocking layer 576 is formed on a first base 516. The method of forming the transparent barrier layer 576 is not particularly limited, but a photoresist process, an etching process, a deposition process, or the like can be used. The shape and function of the transmissive-blocking layer 576 have been described above, so that duplicate descriptions are omitted.

Next, referring to FIG. 20, a first barrier rib pattern 536 is formed on the first base 516. The transmissive barrier layer 576 may be located only in a part of the channel formed by the first barrier rib pattern 536 and may not be located in another area. The first barrier rib pattern 536 may form a channel or a trench. The first barrier rib pattern 536 may be formed by a photoresist process, an etching process, a deposition process, or the like. The shape and function of the first barrier rib pattern 536 are the same as those described above, so that duplicate descriptions are omitted. The present invention is not limited thereto. However, when the first barrier rib pattern 536 has an inverted inclination as in the present embodiment, the formation of the first barrier rib pattern 536 is facilitated by first forming the transmissive barrier layer 576 .

Next, referring to FIG. 21, a first reinforcing layer 556 is formed on the first barrier rib pattern 536 to prepare a first pattern substrate 506. The first reinforcing layer 556 may be disposed on the side surfaces and the upper surface of the first barrier rib pattern 536. Since the shape and function of the first reinforcing layer 556 have been described above, the duplicated description will be omitted.

22, a second pattern substrate 606 having a second partition pattern 636 and a second reinforcement layer 656 disposed on a second base 616 is prepared. The second base 616 may be made of a material having a lower liquid permeability and higher strength than the first base 516. For example, the first base 516 may be liquid permeable and the second base 616 may be liquid impermeable. The other portions of the second base 616, the second barrier rib pattern 636, and the second reinforcing layer 656 are the same as those described above.

23, the other surface (reference surface in FIG. 23) of the first pattern substrate 506 and the other surface (reference upper surface in FIG. 23) of the second pattern substrate 606 face each other. The first base 516 of the first pattern substrate 506 and the second base 616 of the second pattern substrate 606 can be in contact with each other.

24, a contact hole H is formed by using a perforated member S. The contact hole H may be formed at a position not overlapping the first barrier rib pattern 536 and the second barrier rib pattern 636.

In the exemplary embodiment, the formation of the contact hole H using the perforated member S may be performed in the direction from the second pattern substrate 606 side to the first pattern substrate 506 side. As described above, the second base 616 may have a high strength of the first base 516. [ Accordingly, by performing the punching process from the side of the second base 616 toward the side of the first base 516, the contact hole H having a stable structure can be formed. In addition, a structure in which the width of the second contact hole of the second base 616 is larger than the width of the first contact hole of the first base 516 can be easily formed.

FIG. 24 illustrates a case where the contact hole H is formed through a drilling process or the like, but the present invention is not limited thereto, and a laser or the like may be used.

25, a first sealing layer 751 is disposed on the first pattern substrate 506, and a second sealing layer 761 is disposed on the second pattern substrate 606. Next, referring to FIG. The first sealing layer 751 and the second sealing layer 761 may be bonded to the first pattern substrate 506 and the second pattern substrate 606, respectively. Accordingly, an air gap AG may be formed between the first sealing layer 751 and the second sealing layer 761. The channel of the first pattern substrate 506, the channel of the second pattern substrate 606, and the contact hole may be filled with air. That is, in this step, the inside can be blocked from the outside by the first sealing layer 751 and the second sealing layer 761.

26, an injection hole 757h is formed in the first sealing layer 756 and the first channel of the first pattern substrate 506, the contact hole H and the second channel of the first pattern substrate 506 are formed through the injection hole 757h. The liquid metal is injected into the second channel of the second pattern substrate 606. The liquid metal filled in the first channel forms a first metal pattern 206 and the liquid metal filled in the second channel forms a second metal pattern 306. In addition, the liquid metal filled in the contact hole H can form the contact portion 406. In some embodiments, the liquid metal forming the first metal pattern 206, the contact portion 406, and the second metal pattern 306 may further include conductive particles (P) dispersed therein.

According to the manufacturing method of the filter element according to this embodiment, the liquid metal is injected through the injection hole 757h of the first sealing layer 756 so that the first channel, the contact hole H, The problem that the liquid metal is not completely filled can be suppressed. When the width of the contact hole decreases from the second base 616 toward the first base 516 side as in the present embodiment, the liquid metal from the second sealing layer 761 side, The liquid metal having a high viscosity may not pass through the contact hole H smoothly. That is, filling of the liquid metal can be smoothly performed by filling the liquid metal from the upper portion where the first contact hole having a relatively narrow width is located.

27, a cover member 770 is disposed on the injection hole 757h to seal the liquid metal. The cover member 770 is disposed so as to overlap with the injection hole 757h so that the first metal pattern 206, the contact portion 406 and the second metal pattern 306 in a liquid state at normal temperature can be held and preserved.

28, a first intrusion conductive portion 451 is formed. The first inductive conductive portion 451 may be formed by penetrating the first inductor contact pad portion 226a or the liquid metal near the contact portion 406 toward the first base 516 side as described above. The formation of the first intrusion conductive portion 451 may be performed by stretching or compressing the substrate laminate prepared according to Fig. 27, but the present invention is not limited thereto.

According to the method of manufacturing a filter element according to the present embodiment, the contact hole H is formed to have an increased width from the inductor element side toward the capacitor element side, thereby improving the electrical characteristics of the capacitor element and further improving the cut- . The first intrusion conductive portion 451 located on the inner surface of the contact hole H may be formed so that the electrical connection between the first metal pattern 206 and the second metal pattern 306 .

Hereinafter, the present invention will be described in more detail with reference to Production Examples and Comparative Examples.

≪ Preparation Example 1: Production of an inductor device >

An inductor element having a shape as shown in Fig. 29 was manufactured. As a liquid metal, a mixed composition of gallium and indium was used. The cross-sectional shape of the inductor can be clearly understood by those skilled in the art from the accompanying drawings. The first base used paper material having a predetermined transmittance.

The characteristics of the inductor element were measured and shown in Fig. Referring to FIG. 30, it can be seen that the inductor element according to Production Example 1 exhibits an inductance of 1.63 μH.

≪ Preparation Example 2: Preparation of capacitor element >

A capacitor element having a shape as shown in Fig. 31 was manufactured. As a liquid metal, a mixed composition of gallium and indium was used. The cross-sectional shape of the capacitor will be clearly understood by those skilled in the art from the accompanying drawings. The second base used a paper material having a predetermined transmittance.

The characteristics of the capacitor element were measured and shown in FIG. Referring to FIG. 32, it can be seen that the capacitor element according to Production Example 2 exhibits a capacitance of 13.6 pF.

≪ Comparative Example 1: Fabrication of Comparative Inductor Element >

An inductor device was manufactured in the same manner as in Production Example 1, except that the shape of the inductor device was modified as shown in Fig. However, in the liquid metal injection process, there is a problem that the liquid metal is not completely filled in the angled pattern portion. In addition, it was confirmed that the pattern was destroyed due to the excessive increase of the pressure in the channel even though there was an unfilled region in the inside, and the leakage of liquid metal occurred.

≪ Comparative Example 2: Fabrication of comparative capacitor element >

A capacitor element was manufactured in the same manner as in Production Example 2, except that the shape of the capacitor element was modified as shown in Fig. However, in the liquid metal injection process, there is a problem that the liquid metal is not completely filled in the angled pattern portion. In addition, it was confirmed that the pattern was destroyed due to the excessive increase of the pressure in the channel even though there was an unfilled region in the inside, and the leakage of liquid metal occurred.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but many variations and modifications may be made without departing from the spirit and scope of the invention. It will be appreciated that many variations and applications not illustrated above are possible. For example, each component specifically shown in the embodiments of the present invention can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

11: Filter element
11a: Inductor element
11b: Capacitor element
101: pattern substrate
201: first metal pattern
301: second metal pattern
501: first pattern substrate
511: first base
531: first barrier rib pattern
601: second pattern substrate
611: Second base
631: second barrier rib pattern
751: first sealing layer
761: second sealing layer
H: Contact hole

Claims (17)

A first base on which a first contact hole is formed;
A second base disposed on the other surface of the first base and having a second contact hole connected to the first contact hole and having a liquid permeability lower than that of the first base;
A first metal pattern disposed on one surface of the first base;
A second metal pattern disposed on the other surface of the second base; And
And a contact portion inserted in the first contact hole and the second contact hole and electrically connecting the first metal pattern and the second metal pattern. The method according to claim 1,
Wherein the first metal pattern and the second metal pattern each form an inductor element and a capacitor element,
Wherein the width of the first contact hole or the second contact hole decreases from the second metal pattern side toward the first metal pattern side. delete The method according to claim 1,
And the second base has a greater strength than the first base. The method according to claim 1,
Wherein the first base includes a first intrusion conductive portion which is located on an inner wall surface of the first contact hole and is filled with liquid metal and abuts against the contact portion. 6. The method of claim 5,
The first metal pattern includes a first inductor contact pad portion and a second inductor contact pad portion spaced apart from each other and an inductor circuit pattern portion electrically connected to the first inductor contact pad portion and the second inductor contact pad portion,
Wherein the first base further includes a second intrusion conductive part located on a surface of the one surface of the first base and formed by filling liquid metal,
Wherein the first inductive conductive part overlaps the first inductor contact pad part and overlaps the first inductive contact pad part without overlapping the second inductor contact pad part and the inductor circuit pattern part,
Wherein the second inductive conductive portion overlaps the second inductor contact pad portion to overlap the first inductor contact pad portion and the inductor circuit pattern portion. The method according to claim 6,
Wherein the maximum thickness of the first intrusion conductive portion is 50% or less of the maximum thickness of the first base. The method according to claim 6,
The first and second intrusion conductive parts are not in contact with the inductor circuit pattern part,
Wherein the inductor circuit pattern portion has a rounded shape at a plan view,
Wherein the second base does not include a portion filled with liquid metal. The method according to claim 6,
The contact portion and the first intrusion conductive portion together form an electrical conduction region between the first metal pattern and the second metal pattern,
Wherein a minimum width of the conductive region formed by the first contact hole and the first intrusion conductive portion is larger than a minimum width of the second contact hole. 10. The method of claim 9,
Wherein the first metal pattern and the second metal pattern each include a liquid metal in which conductive particles are dispersed,
Wherein the first intrusion conductive portion and the second intrusion conductive portion do not include the conductive particles. 10. The method of claim 9,
Wherein the first metal pattern and the second metal pattern each have an inclined side surface,
Wherein the inclination angle formed by the first metal pattern is larger than the inclination angle formed by the second metal pattern,
Wherein the minimum thickness of the first metal pattern is less than the minimum thickness of the second metal pattern. The method according to claim 1,
A barrier pattern disposed on one surface of the first base to form a channel in which the first metal pattern is disposed;
A reinforcing layer disposed on a side surface of the barrier rib pattern;
A transmission barrier layer disposed on one side of the first base and disposed in the channel and contacting the first base and the first metal pattern, the first and second contact holes being arranged so as not to overlap with the first and second contact holes, A transparent barrier layer;
A sealing layer disposed on the barrier rib pattern and having a hole overlapping the first contact hole and the second contact hole; And
And a cover member disposed on the hole of the sealing layer to cover the hole and to be in contact with the first metal pattern and not to overlap the transparent barrier layer. 1. A first base having liquid permeability, comprising: a first base having a first contact hole and at least partially containing a liquid metal;
A second base having a liquid-impermeable property, the second base being disposed on the other surface of the first base, the second base having a second contact hole;
A first passive element pattern disposed on the first base; And
And a second passive element pattern disposed on the second base, the second passive element pattern being electrically connected to the first passive element pattern through the first contact hole and the second contact hole. 14. The method of claim 13,
The liquid metal filled in the first contact hole and the second contact hole and the liquid metal contained in the first base together form an electrical path between the first passive element pattern and the second passive element pattern,
Wherein the width in the horizontal direction of the electrical passage is larger than the width in the vertical direction center portion at both ends in the vertical direction. Preparing a first pattern substrate having a first channel formed on one surface thereof, the method comprising: preparing a first pattern substrate including a first base;
Preparing a second pattern substrate having a second channel formed on the other surface thereof, the method comprising the steps of: preparing a second pattern substrate including a second base having a liquid permeability lower than that of the first base and a higher strength than the first base; ;
Disposing the second pattern substrate on the other surface of the first pattern substrate; And
And forming a contact hole from the second pattern substrate toward the first pattern substrate. 16. The method of claim 15,
After forming the contact hole,
Disposing a first sealing layer on the first pattern substrate;
Disposing a second sealing layer on the second pattern substrate;
Forming a hole in the first sealing layer so as to overlap with the contact hole; And
Filling the first channel, the contact hole, and the second channel with a liquid metal through a hole in the first sealing layer. 17. The method of claim 16,
After filling the liquid metal,
Permeating the liquid metal partially into the first base, further comprising the step of penetrating the liquid metal through the inner wall surface of the contact hole.

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