KR20210001647A - liquid drop dropping apparatus having head adjust part - Google Patents

liquid drop dropping apparatus having head adjust part Download PDF

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KR20210001647A
KR20210001647A KR1020190078033A KR20190078033A KR20210001647A KR 20210001647 A KR20210001647 A KR 20210001647A KR 1020190078033 A KR1020190078033 A KR 1020190078033A KR 20190078033 A KR20190078033 A KR 20190078033A KR 20210001647 A KR20210001647 A KR 20210001647A
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head
control unit
unit
inkjet
adjusting
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KR1020190078033A
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Korean (ko)
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KR102291007B1 (en
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양진우
성보람찬
김명진
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세메스 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ink Jet (AREA)
  • Coating Apparatus (AREA)

Abstract

The present invention relates to a droplet discharging device which facilitates positioning of a head to reduce management time and accurately drops droplets. To this end, the droplet discharging device comprises: an inkjet head dropping droplets; a head panel fixing the head; a guide unit coupled to the head panel and into which the head is inserted; and a location adjustment unit adjusting a location of the head. Therefore, according to the present invention, an alignment of the inkjet head is facilitated without causing interference depending on an alignment direction, thereby shortening maintenance time, and improving overall inkjet performance by performing the alignment with high precision.

Description

헤드 위치조절부를 구비한 액적 토출장치{liquid drop dropping apparatus having head adjust part}A liquid drop discharging apparatus having a head position adjusting part TECHNICAL FIELD

본 발명은 헤드 위치조절부를 구비한 액적 토출장치에 관한 것이며, 구체적으로 헤드의 위치조절을 용이하게 하여 관리시간을 줄이고 정밀하게 액적을 적하할 수 있게 하는 헤드 위치조절부를 구비한 액적 토출장치에 관한 것이다.The present invention relates to a droplet discharging device having a head position adjusting unit, and in particular, to a droplet discharging device having a head position adjusting unit that facilitates the position adjustment of the head to reduce management time and accurately drop droplets. will be.

LCD 등의 디스플레이 장치를 제조하기 위해서 배향막의 형성이나 UV잉크를 도포할 경우, 또는 기판상에 컬러필터를 도포할 경우 등 액적을 토출하기 위해 잉크젯 설비를 많이 이용하고 있다.In order to manufacture display devices such as LCDs, inkjet facilities are widely used to discharge droplets, such as forming an alignment layer, applying UV ink, or applying a color filter on a substrate.

이러한 잉크젯 설비는 액적을 토출하는 헤드, 상기 헤드로 액적을 공급하기 위한 잉크탱크 등을 갖추고 있는데, 그 중 노즐을 통해 액적을 분사하여 주는 헤드는 정확한 위치에 액적을 분사시켜야 하기 때문에 정밀하게 정렬될 필요가 있다.Such an inkjet facility is equipped with a head for discharging droplets, an ink tank for supplying droplets to the head, and among them, the head for ejecting droplets through a nozzle must be precisely aligned because droplets must be ejected at the correct position. There is a need.

특히, 최근에는 미세패턴으로 액적을 토출해야 하기 때문에 헤드정렬의 정밀도가 마이크로미터 단위의 오차범위만을 허용할 만큼 높은 수준의 정밀도가 요구되고 있다.In particular, in recent years, since droplets must be discharged in a fine pattern, a high level of precision is required so that the precision of head alignment allows only an error range in micrometer units.

도 1에 나타낸 종래기술에 의한 잉크젯 헤드 정렬장치(공개특허 제10-2018-0051858호)를 살펴보면, 헤드정렬장치(10)는 잉크젯 헤드가 서로 마주하는 모든 측면 각각에서 수용부와 잉크젯 헤드 사잉에 탄성력을 제공하는 스프링(23) 및 상기 잉크젯 헤드의 위치를 조절하도록 프레임의 폭 방향의 측면을 관통하여 잉크젯 헤드까지 연장되도록 구비되는 볼트(27,29)를 포함한다.Looking at the inkjet head alignment apparatus according to the prior art (Public Patent No. 10-2018-0051858) shown in FIG. 1, the head alignment apparatus 10 includes a receiving portion and an inkjet head between each side of the inkjet head facing each other. It includes a spring 23 providing an elastic force and bolts 27 and 29 provided to extend to the inkjet head by penetrating the side surface in the width direction of the frame to adjust the position of the inkjet head.

종래기술은 상기 볼트를 조절하여 잉크젯 헤드를 x축 및 y축 방향으로 정렬하게 되는데, 상기 볼트는 잉크젯 헤드에 직접 접촉하여 움직이므로 마이크로미터 단위로 정렬하는 것이 매우 까다롭다.In the prior art, the inkjet head is aligned in the x-axis and y-axis directions by adjusting the bolt. Since the bolt moves in direct contact with the inkjet head, it is very difficult to align it in micrometer units.

또한, x축 및 y축을 각각 이동시켜 정렬할 때 서로 완전히 독립적이지 않고 x축 방향과 y축 방향이 서로 간섭을 일으켜 정밀한 정렬을 수행하기 어려운 문제점이 있다.Further, when the x-axis and y-axis are moved and aligned, they are not completely independent of each other, and the x-axis and y-axis directions interfere with each other, making it difficult to perform precise alignment.

본 발명은 상기한 문제점을 해결하기 위한 것이며, 구체적으로 잉크젯 헤드의 정렬을 용이하게 함과 동시에 정밀도를 높이기 위한 것이다.The present invention is to solve the above problems, and specifically, to facilitate alignment of ink jet heads and to increase precision at the same time.

또한, 정렬하고자 하는 방향이 서로 간섭을 일으키지 않아 정확하게 정렬시킬 수 있는 잉크젯 헤드 정렬장치 및 방법을 제공하기 위한 것이다.Further, it is to provide an inkjet head alignment apparatus and method capable of accurately aligning the directions to be aligned without causing interference with each other.

상기한 목적을 달성하기 위하여, 본 발명은 액적을 적하하는 잉크젯 헤드; 상기 헤드를 고정시키는 헤드패널; 상기 헤드패널에 결합되며, 상기 헤드가 삽입되는 가이드유닛; 상기 헤드의 위치를 조절하는 위치조절부를 포함하는 액적 토출장치를 제공한다.In order to achieve the above object, the present invention is an ink jet head for dropping droplets; A head panel fixing the head; A guide unit coupled to the head panel and into which the head is inserted; It provides a droplet discharge device including a position control unit for adjusting the position of the head.

상기 위치조절부는 일측면 방향으로 위치를 조절하는 평행조절부 및 고정축을 중심으로 회전각도를 조절하는 회전조절부를 포함할 수 있다.The position control unit may include a parallel control unit for adjusting a position in one side direction and a rotation control unit for adjusting a rotation angle about a fixed axis.

상기 가이드유닛은 중공을 통해 헤드가 삽입되어 헤드의 위치를 가이드하는 중앙프레임부; 상기 중앙프레임부와의 사이에 간극이 형성되어 상기 일측면 방향으로 이동가능하게 형성되는 평행조절프레임부; 상기 가이드유닛을 헤드패널에 고정시키는 고정프레임부를 포함하는 것이 바람직하다.The guide unit includes a central frame portion through which the head is inserted to guide the position of the head; A parallel adjustment frame portion formed to be movable in the direction of the one side by forming a gap between the central frame portion; It is preferable to include a fixing frame portion for fixing the guide unit to the head panel.

상기 위치조절부는 단면적이 변화되는 경사부가 형성된 조절유닛 및 상기 조절유닛의 경사부에 의해 탄성적으로 이동되는 이동유닛을 포함하는 것이 바람직하다.It is preferable that the position control unit includes an adjustment unit having an inclined portion having a change in cross-sectional area and a moving unit elastically moved by the inclined portion of the adjustment unit.

본 발명에 의하면, 정렬방향에 따라 서로 간섭을 일으키지 않아 잉크젯 헤드의 정렬을 용이하게 할 수 있어 정비시간을 단축시킬 수 있다.According to the present invention, since there is no interference with each other according to the alignment direction, it is possible to facilitate the alignment of the inkjet heads, thereby reducing maintenance time.

또한, 높은 정밀도로 정렬작업을 수행할 수 있어 전체적인 잉크젯의 성능을 향상시킬 수 있다.In addition, the alignment operation can be performed with high precision, so that the overall inkjet performance can be improved.

도 1은 종래기술에 의한 잉크젯 헤드 정렬장치를 나타내는 구성도;
도 2는 본 발명에 의한 액적 토출장치의 잉크젯 헤드의 구성을 나타내는 구성도;
도 3은 도 2에서 위쪽에서 바라본 잉크젯 헤드의 구성을 나타내는 구성도;
도 4는 도 3에서 위치조절부의 작동을 설명하기 위한 설명도;
도 5는 본 발명에 의한 가이드유닛의 구성을 나타내는 구성도.1 is a block diagram showing an inkjet head alignment apparatus according to the prior art;
Fig. 2 is a block diagram showing the configuration of an ink jet head of the droplet ejection apparatus according to the present invention;
3 is a configuration diagram showing the configuration of an inkjet head viewed from above in FIG. 2;
Figure 4 is an explanatory diagram for explaining the operation of the position control unit in Figure 3;
Figure 5 is a configuration diagram showing the configuration of the guide unit according to the present invention.

본 발명의 실시예의 구성 및 작용에 대하여 첨부한 도면을 참조하여 상세하게 설명한다.The configuration and operation of the embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2를 참조하면, 잉크젯 헤드(100)는 액정등이 저장되어 있는 탱크로부터 기판에 액정을 도포하는 역할을 한다. 상기 기판은 액정표시패널의 컬러필터기판 또는 박막트랜지스터 기판일 수 있으며, 액정은 컬러필터기판 또는 박막트랜지스터기판의 전면에 도포될 수 있다.Referring to FIG. 2, the inkjet head 100 serves to apply liquid crystal to a substrate from a tank in which a liquid crystal or the like is stored. The substrate may be a color filter substrate or a thin film transistor substrate of a liquid crystal display panel, and the liquid crystal may be applied to the entire surface of a color filter substrate or a thin film transistor substrate.

도 3은 도2의 위쪽(A)에서 바라본 도면이다. 이와 같이 본 실시예에 의한 잉크젯 헤드는 헤드패널(500)에 의하여 병렬적으로 복수 개가 일정 간격으로 배치될 수 있다.FIG. 3 is a view as viewed from above (A) of FIG. 2. As described above, a plurality of inkjet heads according to the present embodiment may be arranged in parallel by the head panel 500 at predetermined intervals.

상기 잉크젯 헤드(100)는 헤드패널(500)에 삽입되어 고정되며, 위치조절부에 의해 잉크젯 헤드의 위치가 세밀하게 조절될 수 있다.The inkjet head 100 is inserted into and fixed to the head panel 500, and the position of the inkjet head may be precisely adjusted by a position adjusting unit.

상기 위치조절부는 제1평행조절부(210), 제2평행조절부(220) 및 회전조절부(230)를 포함할 수 있다.The position control unit may include a first parallel control unit 210, a second parallel control unit 220, and a rotation control unit 230.

상기 제1평행조절부(210) 및 제2평행조절부(220)는 잉크젯 헤드를 좌우측면(X축) 방향으로 조절하는 역할을 하며, 상기 회전조절부(230)는 고정축(240;θ축)을 중심으로 잉크젯 헤드를 화살표 방향으로 회전시켜 조절하는 역할을 한다.The first and second parallel adjustment units 210 and 220 serve to adjust the inkjet head in the left and right side (X-axis) directions, and the rotation control unit 230 is a fixed shaft 240; θ. Axis) rotates the inkjet head in the direction of the arrow to adjust it.

구체적으로, 도 4를 참조하면, 상기 위치조절부는 조절유닛(400) 및 이동유닛(450)을 포함하여 구성된다.Specifically, referring to FIG. 4, the position control unit includes an adjustment unit 400 and a moving unit 450.

상기 조절유닛(400)은 이동유닛(450)에 삽입되며, 아래면에 경사부(410)가 형성된다. 상기 경사부(410)의 경사각도에 따라 조절되는 크기가 달라지므로 상기 경사부의 경사각도는 미세조절 범위에 따라 적절히 변형될 수 있다.The adjustment unit 400 is inserted into the moving unit 450, and an inclined portion 410 is formed on the lower surface thereof. Since the size to be adjusted according to the inclination angle of the inclined portion 410 is changed, the inclination angle of the inclined portion may be appropriately changed according to the fine adjustment range.

상기 이동유닛(450)은 상기 조절유닛(400)의 삽입정도에 따라 탄성적으로 변형이 된다. 즉, 상기 이동유닛(450)은 상기 조절유닛(400)의 경사부(410)에 접촉하여 경사부가 아래로 삽입될 수록 간격이 벌어지게 된다. 상기 조절유닛은 볼트형태로 구비될 수 있다.The moving unit 450 is elastically deformed according to the degree of insertion of the adjusting unit 400. That is, the moving unit 450 comes into contact with the inclined portion 410 of the adjusting unit 400 so that the gap becomes wider as the inclined portion is inserted downward. The control unit may be provided in a bolt shape.

또한, 상기 이동유닛(450)에는 잉크젯 헤드가 연결되어 상기 이동유닛(450)이 이동함에 따라 잉크젯 헤드도 미세하게 움직이게 된다.In addition, an inkjet head is connected to the moving unit 450 so that the inkjet head finely moves as the moving unit 450 moves.

이러한 위치조절부의 구성은 제1평행조절부(210), 제2평행조절부(220) 및 회전조절부(230) 모두에 적용될 수 있다. The configuration of the position control unit may be applied to all of the first parallel control unit 210, the second parallel control unit 220, and the rotation control unit 230.

다만, 회전조절부(230)에 의한 이동유닛의 이동방향은 상기 제1평행조절부(210) 및 제2평행조절부(220)에 의한 이동방향과 수직으로 형성된다. 상기 회전조절부(230)에 의한 이동시에는 고정축(240)이 고정되어 있으므로 잉크젯 헤드는 고정축을 중심으로 회전이동을 하게 된다.However, the moving direction of the moving unit by the rotation adjusting part 230 is formed perpendicular to the moving direction of the first and second parallel adjusting parts 210 and 220. When moving by the rotation control unit 230, since the fixed shaft 240 is fixed, the inkjet head rotates around the fixed shaft.

한편, 본 실시예에서 잉크젯 헤드(100)의 정렬은 가이드유닛(300)을 통해서 이루어진다.Meanwhile, in this embodiment, the inkjet head 100 is aligned through the guide unit 300.

도 4를 참조하면, 상기 가이드유닛(300)은 알루미늄과 같은 가벼운 재질로 구비될 수 있으며, 잉크젯 헤드를 정렬할 때 평행조절부 및 회전조절부에 의한 이동방향을 가이드하며, 평행조절부 및 회전조절부에 의한 이동방향이 서로 간섭을 받지 않고 독립적으로 움직일 수 있도록 한다.Referring to Figure 4, the guide unit 300 may be provided with a light material such as aluminum, when aligning the inkjet head, guides the moving direction by the parallel control unit and the rotation control unit, parallel control unit and rotation The direction of movement by the adjusting part can move independently without being interfered with each other.

상기 가이드유닛(300)의 중앙부에는 중앙프레임부(370)가 형성되어 상기 중앙프레임부(370) 내부에 잉크젯 헤드(100)가 삽입될 수 있는 헤드삽입부(372)가 중공으로 형성되며, 상기 중앙프레임부의 양측면에는 평행조절프레임부(380)가 구비된다. 그리고, 가장 바깥으로는 가이드유닛을 헤드패널에 고정시킬 수 있는 고정프레임부(390)가 구비된다.A central frame portion 370 is formed in the central portion of the guide unit 300 and a head insertion portion 372 into which the inkjet head 100 can be inserted is formed in a hollow shape, and the Parallel adjustment frame portions 380 are provided on both sides of the central frame portion. Further, a fixing frame part 390 capable of fixing the guide unit to the head panel is provided on the outermost side.

상기 중앙프레임부 및 평행조절프레임부 사이에는 제1간극(350)이 형성되며, 상기 평행조절프레임부 및 고정프레임부 사이에는 제2간극(360)이 형성된다. A first gap 350 is formed between the central frame part and the parallel control frame part, and a second gap 360 is formed between the parallel control frame part and the fixed frame part.

상기 제1간극(350)은 상부 끝단부터 아래쪽으로 수직 방향으로 형성되며, 아래쪽은 일정 두께만큼 남겨두게 되어 중앙프레임부와 평행조절프레임부가 연결된다. 또한, 상기 제2간극(360)은 아래끝단부터 위쪽으로 수직 방향으로 형성되며, 뒤쪽은 일정 두께만큼 남겨두게 되어 평행조절프레임부와 고정프레임부가 연결된다.The first gap 350 is formed in a vertical direction from the top end to the bottom, and the bottom is left by a predetermined thickness, so that the central frame part and the parallel adjustment frame part are connected. In addition, the second gap 360 is formed in a vertical direction from the bottom end to the top, and the rear side is left by a certain thickness so that the parallel adjustment frame part and the fixed frame part are connected.

상기 제1간극 및 제2간극은 와이어 가공으로 형성될 수 있으며, 고정프레임부(390)에 의해 양측이 고정된 경우 잉크젯 헤드가 X축 방향으로 미세조절될 수 있는 간극을 형성한다. 즉, 잉크젯 헤드의 조절은 간극의 틈새만큼 조절이 가능하게 된다.The first gap and the second gap may be formed by wire processing, and when both sides are fixed by the fixing frame part 390, the inkjet head forms a gap that can be finely adjusted in the X-axis direction. That is, the inkjet head can be adjusted as much as the gap of the gap.

상기 고정프레임부(390)에는 결합공(392)이 형성되어 나사와 같은 결합부재에 의해 가이드유닛이 헤드패널에 고정될 수 있다.A coupling hole 392 is formed in the fixing frame portion 390 so that the guide unit may be fixed to the head panel by a coupling member such as a screw.

상기 중앙프레임부의 일측면에는 회전조절부(230)가 위치할 수 있는 회전조절부통공(330)이 형성되며, 타측면에는 고정축(240)이 위치할 수 있는 고정축통공(340)이 형성된다.One side of the central frame part has a rotation control part through hole 330 in which the rotation control part 230 can be located, and the other side has a fixed shaft through hole 340 in which the fixed shaft 240 can be located. do.

따라서, 이와 같은 가이드부에 의해 작업자는 위치조절부의 정확한 위치를 곧바로 파악할 수 있게 되어 용이하고 빠른 시간에 정렬작업을 마칠 수 있는 이점이 있다.Therefore, the operator can immediately grasp the exact position of the position control unit by means of such a guide unit, and thus there is an advantage in that it is possible to finish the alignment work in an easy and quick time.

다음으로, 본 발명에 의한 액적 토출장치를 이용한 헤드정렬방법에 대하여 설명한다.Next, a description will be given of a head alignment method using the droplet discharge device according to the present invention.

먼저, 복수 개의 잉크젯 헤드를 수용하는 헤드패널에 가이드유닛을 고정시킨다. 상기 가이드유닛은 양측면 끝단에 구비된 고정프레임부(390)를 통해 나사와 같은 결합부재를 통해 고정될 수 있다.First, the guide unit is fixed to a head panel accommodating a plurality of inkjet heads. The guide unit may be fixed through a coupling member such as a screw through the fixing frame portion 390 provided at both side ends.

가이드유닛이 고정되면 잉크젯 헤드를 헤드삽입부(372)를 통해 삽입한다. 그리고, 제2평행조절부(220)를 설치하고 고정시킨후, (210)를 설치한다. 또한, 제1평행조절부 또는 제2평행조절부를 조절하여 잉크젯 헤드의 x축 위치를 정밀하게 조절한다. 이때, 상기 잉크젯 헤드는 가이드유닛에 의해 x축 방향으로만 이동하게 되며 다른 방향으로는 움직일 수 없게 된다.When the guide unit is fixed, the inkjet head is inserted through the head insertion part 372. Then, after installing and fixing the second parallel adjustment unit 220, 210 is installed. In addition, the x-axis position of the inkjet head is precisely adjusted by adjusting the first parallelism control unit or the second parallelism control unit. At this time, the inkjet head moves only in the x-axis direction by the guide unit and cannot move in other directions.

x축 조절이 완료되면, 고정축(240) 및 회전조절부(230)를 설치하고 θ축 조절을 실시한다. When the x-axis adjustment is completed, the fixed shaft 240 and the rotation control unit 230 are installed, and the θ-axis is adjusted.

이와 같이, 본 발명에 의하면 잉크젯 헤드의 정렬을 용이하게 할 수 있으며, 정밀한 조절이 가능하여 액적 토출장치의 정비시간을 단축시키고 성능을 향상시킬 수 있는 이점이 있다.As described above, according to the present invention, alignment of the inkjet head can be facilitated and precise adjustment is possible, thereby shortening the maintenance time of the droplet ejection device and improving the performance.

상기에서는 본 발명의 실시예들을 참조하여 설명하였지만, 해당 기술 분야에서 통상의 지식을 가진 자라면 하기의 특허 청구범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다.Although the above has been described with reference to embodiments of the present invention, those of ordinary skill in the art can variously modify and modify the present invention within the scope not departing from the spirit and scope of the present invention described in the following claims. You will understand that you can change it.

100 : 잉크젯 헤드 210 : 제1평행조절부
220 : 제2평행조절부 230 : 회전조절부
240 : 고정축 300 : 가이드유닛
350 : 제1간극 360 : 제2간극
370 : 중앙프레임부 380 : 평행조절프레임부
390 : 고정프레임부 500 : 헤드패널100: inkjet head 210: first parallel control unit
220: second parallel control unit 230: rotation control unit
240: fixed shaft 300: guide unit
350: first gap 360: second gap
370: central frame portion 380: parallel adjustment frame portion
390: fixed frame part 500: head panel

Claims (4)

액적을 토출시키는 잉크젯 헤드;
상기 헤드를 고정시키는 헤드패널;
상기 헤드패널에 결합되며, 상기 헤드가 삽입되는 가이드유닛;
상기 헤드의 위치를 조절하는 위치조절부를 포함하는 액적 토출장치.
An ink jet head for discharging droplets;
A head panel fixing the head;
A guide unit coupled to the head panel and into which the head is inserted;
A droplet discharge device comprising a position control unit for adjusting the position of the head.
 제1항에 있어서,
상기 위치조절부는 일측면 방향으로 위치를 조절하는 평행조절부 및 고정축을 중심으로 회전각도를 조절하는 회전조절부를 포함하는 것을 특징으로 하는 액적 토출장치.
The method of claim 1,
The position control unit, characterized in that it comprises a parallel control unit for adjusting the position in one side direction and a rotation control unit for adjusting a rotation angle about a fixed axis.
 제2항에 있어서,
상기 가이드유닛은 중공을 통해 헤드가 삽입되어 헤드의 위치를 가이드하는 중앙프레임부;
상기 중앙프레임부와의 사이에 간극이 형성되어 상기 일측면 방향으로 이동가능하게 형성되는 평행조절프레임부;
상기 가이드유닛을 헤드패널에 고정시키는 고정프레임부를 포함하는 것을 특징으로 하는 액적 토출장치.
The method of claim 2,
The guide unit includes a central frame portion through which the head is inserted to guide the position of the head;
A parallel adjustment frame portion formed to be movable in the direction of the one side by forming a gap between the central frame portion;
And a fixed frame portion fixing the guide unit to the head panel.
 제1항에 있어서,
상기 위치조절부는 단면적이 변화되는 경사부가 형성된 조절유닛 및
상기 조절유닛의 경사부에 의해 탄성적으로 이동되는 이동유닛을 포함하는 것을 특징으로 하는 액적 토출장치.The method of claim 1,
The position control unit includes an adjustment unit having an inclined portion having a cross-sectional area change
And a moving unit that is elastically moved by the inclined portion of the control unit.
KR1020190078033A 2019-06-28 2019-06-28 liquid drop dropping apparatus having head adjust part KR102291007B1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100863244B1 (en) * 2004-10-07 2008-10-15 삼성전자주식회사 An inkjet head mount unit and an inkjet printing apparatus using the same
JP2013252724A (en) * 2013-09-27 2013-12-19 Ricoh Co Ltd Liquid droplet ejection head unit replacement method, method of adjusting position of liquid droplet ejection head, and tool for adjusting position of liquid droplet ejection head
KR20180051858A (en) * 2016-11-09 2018-05-17 세메스 주식회사 Apparatus for aligning inkjet head and Apparatus for Droplet Formation having the same
JP2018079582A (en) * 2016-11-14 2018-05-24 富士フイルム株式会社 Liquid discharge head, liquid discharge head adjusting system, and liquid discharge head adjusting method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100863244B1 (en) * 2004-10-07 2008-10-15 삼성전자주식회사 An inkjet head mount unit and an inkjet printing apparatus using the same
JP2013252724A (en) * 2013-09-27 2013-12-19 Ricoh Co Ltd Liquid droplet ejection head unit replacement method, method of adjusting position of liquid droplet ejection head, and tool for adjusting position of liquid droplet ejection head
KR20180051858A (en) * 2016-11-09 2018-05-17 세메스 주식회사 Apparatus for aligning inkjet head and Apparatus for Droplet Formation having the same
JP2018079582A (en) * 2016-11-14 2018-05-24 富士フイルム株式会社 Liquid discharge head, liquid discharge head adjusting system, and liquid discharge head adjusting method

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