KR20200143664A - Reinforcement film - Google Patents

Abstract

The present application relates to a reinforcement film, a touch panel including the same, and an organic electronic device including the same, wherein the reinforcement film can complement the mechanical strength such as handling properties and processability while implementing a thinner touch panel.

Description

Reinforcement film {REINFORCEMENT FILM}

The present application relates to a reinforcing film, a touch panel including the same, and an organic electronic device including the same.

Touch sensors include Liquid Crystal Display, Field Emission Display (FED), Plasma Display Panel (PDP), Electroluminescence Device (EL), and electrophoretic display. It is a type of input device that is installed in an image display device such as, for example, a user presses (presses or touches) a touch panel while viewing the image display device to input predetermined information.

Touch sensors used in the above-described display device may be classified into an add-on type, an on-cell type, and an integrated type according to their structure. The top plate attachment type is a method of attaching the touch sensor to the top plate of the display device after separately manufacturing the display device and the touch sensor. The integrated upper plate is a method of directly forming elements constituting a touch sensor on the surface of an upper glass substrate of a display device. In the built-in type, a touch sensor is built into the display device to achieve a thinner display device and increase durability.

However, the upper plate-attached touch sensor has a structure in which the completed touch sensor is mounted on the display device, and has a thick thickness, and the brightness of the display device becomes dark, thereby reducing visibility. The built-in touch sensor has the advantage of solving the problems caused by the upper plate attachment type and the upper plate integral type touch sensor in that durability improvement and thickness reduction are possible. However, since the built-in touch sensor is formed on the thin film transistor array substrate, the design is complicated and the aperture ratio is lowered.

The on-cell type touch sensor has a structure in which a separate touch sensor is formed on the surface of the glass substrate of the display device, and because it shares the glass substrate, the thickness can be reduced compared to the top plate attachment type, but it still constitutes a touch sensor. There is a problem in that the total thickness is increased due to the touch driving electrode layer, the touch sensing electrode layer, and the insulating layer for insulating them.

The present application provides a reinforcing film capable of supplementing mechanical strength such as handling and processability while implementing a thinner touch panel.

The present application relates to a reinforcing film. The reinforcing film may be applied to, for example, a touch panel. In a specific example of the present application, the reinforcing film may be applied to an electrode of a touch panel, and may be applied to one surface of a substrate of the electrode. In this specification, the touch panel may be an add-on type, an on-cell type, or an integrated type touch panel described above, and in this specification, a touch panel has the same meaning as a touch sensor. Can be used as

An exemplary reinforcing film is formed on one surface of an electrode substrate for a touch panel, and may include a reinforcing resin having a glass transition temperature of 80° C. or higher after curing. In the above, the thickness of the electrode substrate may be in the range of 0.5 to 10 μm, 0.8 to 8.8 μm, 1 to 7.6 μm, 1.3 to 6.3 μm, or 1.8 to 4.9 μm. The present application provides a thin-film touch panel by adjusting the thickness range of the electrode substrate to the above range, and the mechanical strength that decreases according to the thickness of the touch panel can be compensated through the reinforcing film.

In the present specification, the term "thin-film touch panel" or "thin-film touch sensor" means that the thickness of the touch panel is thin, and specifically, it may mean that the thickness of the electrode substrate for the touch panel is within the aforementioned range.

In one example, the material of the electrode substrate is not limited as long as it can have the aforementioned thickness range. Conventionally, a cyclic olefin polymer (COP) was generally used as a material for an electrode substrate for a touch panel, but the material has a problem in that it is difficult to reduce the thickness of the substrate. In one example, the electrode substrate of the present application, as one of the materials that can satisfy the thickness range, may include a photocurable acrylic compound (Photo acryl, PAC), for example, includes an acrylic monomer and a photoinitiator can do.

In a specific example of the present application, the photocurable acrylic compound may include a photocurable acrylic copolymer resin of a (meth)acrylic acid ester monomer and/or a crosslinkable monomer. The electrode substrate for a touch panel is formed as a film for an electrode substrate by photocuring the photocurable acrylic copolymer resin, and the film is formed optically transparently and can be applied to a touch panel.

The (meth)acrylic acid ester monomer may be, for example, an alkyl (meth)acrylate, but is not limited thereto. The alkyl of the alkyl (meth)acrylate may be a straight chain, branched chain or cyclic C1-C30 alkyl, and specifically, C2-C25, C4-C23 or C6-C18 alkyl.

The (meth)acrylic acid ester monomer is specifically, methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylic Rate, t-butyl (meth)acrylate, sec-butyl (meth)acrylate, pentyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, 2-ethylbutyl (meth)acrylate, n-octyl It may include one selected from the group consisting of (meth)acrylate, isooctyl (meth)acrylate, isobornyl (meth)acrylate, isononyl (meth)acrylate, and combinations thereof.

In one example, the crosslinkable monomer may mean a monomer further including a functional functional group as well as a copolymerizable functional group (eg, a carbon-carbon double bond) in the molecular structure. The crosslinkable functional group may be, for example, a hydroxy group, a carboxyl group, a nitrogen-containing functional group, or an epoxy group, but is not limited thereto.

In one embodiment, the photocurable acrylic copolymer resin contains 0.1 to 50 parts by weight, 3 to 45 parts by weight, 7 to 43 parts by weight, 8 to 38 parts by weight of the crosslinkable monomer based on 100 parts by weight of the (meth)acrylic acid ester monomer. Part, 10 to 25 parts by weight, or 12 to 23 parts by weight of a monomer component may be polymerized.

The crosslinkable monomer is, for example, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, 2-isocyanatoethyl (meth)acrylate, 3-isocyanatopropyl (meta )Acrylate, 4-isocyanatobutyl (meth)acrylate, (meth)acrylamide, N-vinyl pyrrolidone or N-vinyl caprolactam, or a combination thereof, but is not limited thereto. .

In one example, the photoinitiator may be used in an amount of about 0.01 to about 10 parts by weight based on 100 parts by weight of the photocurable acrylic copolymer resin, and the type of the photoinitiator is specially limited as long as it can initiate the polymerization reaction by light irradiation. It is not, for example, may include one selected from the group consisting of a benzoin-based initiator, a hydroxy ketone-based initiator, an amino ketone-based initiator, caprolactam, and combinations thereof.

In the specific example of the present application, the electrode substrate may be a substrate on which an electrode is formed. In one example, the electrode substrate may be a substrate on which a transparent electrode is formed. In the present specification, the term "transparent electrode" may mean an optically transparent electrode, and may mean an electrode having a light transmittance of 85% or more in a visible light region. In one example, the transparent electrode is made of indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), aluminum doped zinc oxide (AZO), or zinc tin oxide (ZTO). Can include.

In the embodiment of the present application, the reinforcing film has a thickness of 1 to 100 μm, 1.5 to 80 μm, 2 to 60 μm, 2.5 to 50 μm, 3 to 42 μm, 5 to 38 μm, 6 to 32 μm, 7 to 30 Μm, 8 to 28 µm, 9 to 25 µm, 11 to 23 µm, 12 to 21 µm, or 13 to 19 µm. The present application provides a thin electrode substrate by adjusting the thickness of the reinforcing film in the above range, and at the same time, it has excellent mechanical strength, so that process efficiency and convenience can be realized.

As described above, the reinforcing film of the present application may include a reinforcing resin. The reinforcing resin may be a resin having a glass transition temperature of 80°C or more, 85°C or more, 88°C or more, 91°C or more, 98°C or more, 105°C or more, or 110°C or more after curing, and the upper limit is not particularly limited, but 200 It may be °C. The material of the resin is not limited as long as it satisfies the glass transition temperature. The glass transition temperature may mean a glass transition temperature after curing the resin.

In the present specification, the glass transition temperature may be measured by a known method, for example, DSC (Differential Scanning Calorimetry) or DMA (Dynamic Mechanical Analysis). In one example, the measurement of the glass transition temperature (Tg) in the present specification can be obtained by performing DSC measurement under the following conditions.

Using a differential scanning calorimeter [RDC220 from SII,] about 10 mg of a sample was heated from 30° C. to 200° C. at a heating rate of 50° C./min in a nitrogen atmosphere, and maintained at that temperature for 10 minutes. It cooled to -100 degreeC again at a temperature-fall rate of 10 degreeC/min, and after holding at that temperature for 5 minutes, it heated up to 200 degreeC by 10 degreeC/min. The glass transition temperature (Tg) is detected in a form in which the DSC curve is bent due to a change in specific heat at the second temperature rise, and the baseline moves in parallel. From this bend, the temperature of the intersection of the tangent line of the low temperature baseline and the tangent line of the point at which the inclination becomes the maximum in the bent portion can be taken as the glass transition temperature Tg.

In one example, the reinforcing resin may be a curable resin. The specific type of curable resin that can be used in the present invention is not particularly limited, and for example, various thermosetting or photocurable resins known in the art may be used. The term "thermosetting resin" refers to a resin that can be cured through an appropriate application of heat or an aging process, and the term "photocurable resin" refers to a resin that can be cured by irradiation of electromagnetic waves. In addition, the curable resin may be a dual curable resin including both thermal and photocurable properties.

The kind of the reinforcing resin is not particularly limited, but a styrene resin, an olefin resin, a thermoplastic elastomer, a polyoxyalkylene resin, a polyester resin, a polyvinyl chloride resin, a polycarbonate resin, a polyphenylene sulfide resin , A polyamide resin, an acrylate resin, an epoxy resin, a silicone resin, a fluorine resin, or a mixture thereof.

In the above, examples of the styrene-based resin include styrene-ethylene-butadiene-styrene block copolymer (SEBS), styrene-isoprene-styrene block copolymer (SIS), acrylonitrile-butadiene-styrene block copolymer (ABS ), acrylonitrile-styrene-acrylate block copolymer (ASA), styrene-butadiene-styrene block copolymer (SBS), styrene-based homopolymer, or a mixture thereof may be exemplified. As the olefin-based resin, for example, a high-density polyethylene-based resin or elastomer, a low-density polyethylene-based resin or elastomer, a polypropylene-based resin or elastomer, or a mixture thereof may be exemplified. In addition, the olefin-based resin may be one or more homopolymers or copolymers selected from the group consisting of isobutylene, propylene, ethylene, 1-butene, 2-butene, isoprene and butadiene. As the elastomer, for example, an ester-based thermoplastic elastomer, an olefin-based elastomer, a silicone-based elastomer, an acrylic elastomer, or a mixture thereof may be used. Among them, polybutadiene resin or elastomer or polyisobutylene resin or elastomer may be used as the olefin-based thermoplastic elastomer. As the polyoxyalkylene resin, for example, a polyoxymethylene resin or an elastomer, a polyoxyethylene resin or an elastomer, or a mixture thereof may be exemplified. As the polyester resin, for example, a polyethylene terephthalate resin or an elastomer, a polybutylene terephthalate resin or an elastomer, or a mixture thereof may be exemplified. As the polyvinyl chloride-based resin, for example, polyvinylidene chloride may be exemplified. As the polyamide-based resin, for example, nylon may be exemplified. As the acrylate-based resin, for example, polybutyl (meth) acrylate may be exemplified. Examples of the epoxy type include bisphenol A type, bisphenol F type, bisphenol S type, and a bisphenol type such as a hydrogenated product thereof; Novolac types such as phenol novolak type and cresol novolak type; Nitrogen-containing cyclic types such as triglycidyl isocyanurate type and hydantoin type; Alicyclic type; Aliphatic type; Aromatic types such as naphthalene type and biphenyl type; Glycidyl types such as glycidyl ether type, glycidylamine type, and glycidyl ester type; Dicyclo types such as dicyclopentadiene type; Ester type; Ether ester type or a mixture thereof may be exemplified. As the silicone resin, for example, polydimethylsiloxane may be exemplified. In addition, the fluorine-based resin is polytrifluoroethylene resin or elastomer, polytetrafluoroethylene resin or elastomer, polychlorotrifluoroethylene resin or elastomer, polyhexafluoropropylene resin or elastomer, polyvinylidene fluoride, Polyvinyl fluoride, polyfluorinated ethylene propylene, or a mixture thereof may be exemplified. Meanwhile, the reinforcing resin may include a mixture of hydrocarbons, and the mixture of hydrocarbons may be, for example, hexatriacotane or paraffin.

The resins listed above may be grafted and used, for example, maleic anhydride, or the like, or copolymerized with other resins or elastomers listed or a monomer for preparing a resin or elastomer, or modified by other compounds to be used. May be. Examples of the other compound may include a carboxyl-terminated butadiene-acrylonitrile copolymer.

In the reinforcing film, the resin component may have a weight average molecular weight (Mw) capable of being molded into a film shape. For example, the resin may have a weight average molecular weight of about 100,000 to 2 million, 120,000 to 1.5 million, or 180,000 to 1 million. In the present specification, the term weight average molecular weight means a value converted to standard polystyrene measured by GPC (Gel Permeation Chromatograph). However, the resin component does not necessarily have the above-mentioned weight average molecular weight. For example, when the molecular weight of the resin component does not reach a level sufficient to form a film, a separate binder resin may be incorporated into the reinforcing resin composition.

In one example, the reinforcing resin may be an epoxy resin. In the present application, the reinforcing resin is a curable resin, which is aromatic or aliphatic; Alternatively, a linear or branched epoxy resin may be used. In one embodiment of the present invention, an epoxy resin containing two or more functional groups and having an epoxy equivalent of 180 g/eq to 1,000 g/eq may be used. By using an epoxy resin having an epoxy equivalent in the above range, properties such as adhesion performance and glass transition temperature of the cured product can be effectively maintained. Examples of such epoxy resins include cresol novolac epoxy resin, bisphenol A type epoxy resin, bisphenol A type novolac epoxy resin, phenol novolac epoxy resin, tetrafunctional epoxy resin, biphenyl type epoxy resin, triphenol methane type Epoxy resins, alkyl-modified triphenol methane epoxy resins, naphthalene-type epoxy resins, dicyclopentadiene-type epoxy resins, or dicyclopentadiene-modified phenol-type epoxy resins.

In the present application, an epoxy resin including a cyclic structure in a molecular structure may be used as the curable resin, and an epoxy resin including an aromatic group (eg, a phenyl group) may be used. When the epoxy resin contains an aromatic group, the cured product may exhibit excellent thermal and chemical stability, and a low moisture absorption amount. Specific examples of the aromatic group-containing epoxy resin that can be used in the present invention include a biphenyl type epoxy resin, a dicyclopentadiene type epoxy resin, a naphthalene type epoxy resin, a dicyclopentadiene-modified phenol type epoxy resin, a cresol type epoxy resin, Bisphenol-based epoxy resin, xylog-based epoxy resin, polyfunctional epoxy resin, phenol novolac epoxy resin, triphenolmethane-type epoxy resin, and alkyl-modified triphenolmethane epoxy resin may be one or more mixtures, but is limited thereto. no.

In the present application, as the epoxy resin, a silane-modified epoxy resin or a silane-modified epoxy resin having an aromatic group may be used. When an epoxy resin modified with silane and structurally having a silane group is used as described above, adhesion to the substrate can be maximized, and moisture barrier properties, durability, and reliability can be improved. The specific type of the epoxy resin as described above that can be used in the present invention is not particularly limited, and such a resin can be easily obtained from a place of purchase such as, for example, Kukdo Chemical.

In the specific example of the present application, the reinforcing film is a polyfunctional active energy ray-polymerizable compound according to the type of resin, and may include a polyfunctional acrylate.

In addition, in the specific example of the present application, the reinforcing film may include an initiator or a curing agent according to the type of resin.

For example, the reinforcing film may further comprise a radical initiator. The radical initiator can be a photoinitiator or a thermal initiator. The specific type of the photoinitiator may be appropriately selected in consideration of the curing rate and the possibility of yellowing. For example, benzoin-based, hydroxy ketone-based, amino ketone-based, or phosphine oxide-based photoinitiators can be used, and specifically, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether , Benzoin n-butyl ether, benzoin isobutyl ether, acetophenone, dimethylanino acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2 -Hydroxy-2-methyl-1-phenylpropan-1one, 1-hydroxycyclohexylphenylketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propane-1- One, 4-(2-hydroxyethoxy)phenyl-2-(hydroxy-2-propyl)ketone, benzophenone, p-phenylbenzophenone, 4,4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methylanthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone, 2-aminoanthraquinone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-chlorothioxanthone, 2,4 -Dimethyl thioxanthone, 2,4-diethyl thioxanthone, benzyldimethyl ketal, acetophenone dimethyl ketal, p-dimethylamino benzoic acid ester, oligo[2-hydroxy-2-methyl-1-[4-(1-methyl Vinyl)phenyl]propanone] and 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, etc. can be used.

The radical initiator may be included in a ratio of 0.2 to 20 parts by weight, 0.5 to 18 parts by weight, 1 to 15 parts by weight, or 2 to 13 parts by weight based on 100 parts by weight of the reinforcing resin. The present application effectively induces curing through this, and also prevents deterioration of the physical properties of the reinforcing film due to residual components after curing.

In one example, the reinforcing film may further include a curing agent. For example, the reinforcing film may further include a curing agent capable of forming a crosslinked structure or the like by reacting with the aforementioned resin component.

An appropriate type of curing agent may be selected and used depending on the type of the resin component or the functional group contained in the resin.

In one example, when the reinforcing resin is an epoxy resin, the curing agent is a curing agent for an epoxy resin known in the art, for example, an amine curing agent, an imidazole curing agent, a phenol curing agent, a phosphorus curing agent, or an acid anhydride curing agent. One or more types may be used, but the present invention is not limited thereto.

In one example, as the curing agent, an imidazole compound having a solid state at room temperature and a melting point or decomposition temperature of 80° C. or higher may be used. Such compounds include, for example, 2-methyl imidazole, 2-heptadecyl imidazole, 2-phenyl imidazole, 2-phenyl-4-methyl imidazole, or 1-cyanoethyl-2-phenyl imidazole. This may be illustrated, but is not limited thereto,

The content of the curing agent may be selected according to the composition of the composition, for example, the type or ratio of the reinforcing resin. For example, the curing agent may be included in an amount of 1 to 20 parts by weight, 1 to 10 parts by weight, or 1 to 5 parts by weight, based on 100 parts by weight of the reinforcing resin. However, the weight ratio may be changed according to the type and ratio of the reinforcing resin or the functional group of the resin, or the crosslinking density to be implemented.

When the reinforcing resin is a resin that can be cured by irradiation with an active energy ray, as an initiator, for example, a cationic photopolymerization initiator may be used.

As the cationic photopolymerization initiator, an onium salt or an organometallic salt based ionized cationic initiator or an organosilane or latent sulfonic acid based or non-ionized cationic photopolymerization initiator may be used. Examples of the onium salt-based initiator include a diaryliodonium salt, a triarylsulfonium salt, or an aryldiazonium salt. Initiation of an organometallic salt series Examples of zero may be iron arene, and the like, and examples of the organosilane-based initiator include o-nitrobenzyl triaryl silyl ether, triaryl silyl peroxide. Alternatively, acyl silane may be exemplified, and the latent sulfuric acid-based initiator may include α-sulfonyloxy ketone or α-hydroxymethylbenzoin sulfonate, but is not limited thereto. .

In one example, as the cationic initiator, an ionized cationic photopolymerization initiator may be used.

In the embodiment of the present application, the reinforcing film may further include a silane coupling agent. The material of the silane coupling agent is not particularly limited, and gamma-glycidoxypropyl triethoxy silane, gamma-glycidoxypropyl trimethoxy silane, gamma-glycidoxypropyl methyldiethoxy silane, 3-mercaptopropyl Trimethoxy silane, vinyl trimethoxy silane, vinyl triethoxy silane, gamma-methacryloxypropyl trimethoxy silane, gamma-methacryloxy propyl triethoxy silane, gamma-aminopropyl trimethoxy silane, gamma- Aminopropyl triethoxy silane, 3-isocyanato propyl triethoxy silane, gamma-acetoacetatepropyl trimethoxysilane, gamma-acetoacetatepropyl triethoxy silane, beta-cyanoacetyl trimethoxy silane, beta -Cyanoacetyl triethoxy silane, acetoxyaceto trimethoxy silane, 3-methacryloxypropyl trimethoxysilane, 3-methacryloxy propyl triethoxysilane, 3-acryloxy propyl trimethoxysilane, 3 -Acryloxy propyl triethoxysilane, 3-methacryloxy methyl triethoxysilane, 3-methacryloxy methyl trimethoxysilane, 3-acryloxy propyl methyldimethoxysilane, methacryloxy methyl methyldimethoxysilane, Methacryloxy methyl methyldiethoxysilane, methacryloxy propyl methyldimethoxysilane, methacryloxy propyl methyldiethoxysilane, methacryloxy propyl dimethylmethoxysilane or methacryloxy propyl dimethylethoxysilane. The silane compound is, for example, 0.1 to 10 parts by weight, 0.3 to 8 parts by weight, 0.7 to 5 parts by weight, 0.8 to 3 parts by weight, 0.9 to 2.5 parts by weight based on 100 parts by weight of the reinforcing resin. It may be included in parts by weight, or 0.9 parts by weight to 1.8 parts by weight. The silane compound improves adhesion and adhesion stability of the reinforcing film, improves heat resistance and moisture resistance, and may also serve to improve adhesion reliability even when left to stand for a long time under severe conditions.

The reinforcing film of the present application may further include a binder resin. The binder resin may serve to improve moldability in the case of forming the composition of the present application into a film or sheet shape.

The type of binder resin that can be used in the present application is not particularly limited as long as it has compatibility with other components such as the aforementioned reinforcing resin component. Specific examples of the binder resin that can be used are resins having a weight average molecular weight of 20,000 or more, such as phenoxy resin, acrylate resin, high molecular weight epoxy resin, ultra high molecular weight epoxy resin, high polarity functional group-containing rubber, and high polarity. (high polarity) One kind or a mixture of two or more kinds, such as a reactive rubber containing a functional group, is not limited thereto.

When the binder resin is included in the reinforcing film of the present application, the content is not particularly limited as being adjusted according to the desired physical properties. For example, in the present invention, the binder resin, based on 100 parts by weight of the reinforcing resin, 20 parts by weight to 200 parts by weight, preferably 20 parts by weight to 150 parts by weight, more preferably 30 parts by weight to 100 parts by weight Can be included in quantity. By controlling the content of the binder resin to 200 parts by weight or less in the present invention, it is possible to effectively maintain compatibility with each component constituting the reinforcing film.

In a specific example of the present application, the reinforcing film may have an adhesive strength of 1500 gf/inch to 5000 gf/inch or 1800 gf/inch to 3800 gf/inch with the electrode substrate. The adhesive strength may be obtained by measuring a peel rate of 300 mm/min and a peel angle of 180 degrees by attaching a reinforcing film to the electrode substrate in a constant temperature and humidity condition by using a roller with 1 inch to the electrode substrate using a TA device. The measurement can be in accordance with ASTM D3330 standard specification.

In one example, the reinforcing film has a viscosity measured according to shear stress using an 8mm diameter stainless plate jig at any one of 5% strain before curing, a frequency of 1 Hz, and a temperature range of 20°C to 35°C. MPa·s or less, or 0.001 MPa·s to 1 MPa·s. The temperature range may be room temperature, for example, 25°C. In the present application, by controlling the viscosity before curing of the reinforcing film, adhesion to the electrode substrate and step filling properties are excellently implemented.

In one example, the reinforcing film may have a tensile modulus of 2 MPa to 3 GPa or 5 MPa to 2 GPa at any one of 90°C to 180°C. The measurement temperature is not particularly limited, but may be 120°C. The tensile modulus may be measured under conditions of 0.1 strain, 1Hz frequency, and 3°C/min ramp up for the sample using a DMA (Dynamic Mechanical Analysis) device. The present application implements durability reliability and stability in a high-temperature process of manufacturing a touch panel by adjusting the elastic modulus at a high temperature of the reinforcing film within the above range.

The reinforcing film of the present application may also have a dielectric constant of 4.0 or less. The lower limit of the dielectric constant is not particularly limited, and may be 0.01, and may be, for example, 0.05 to 3.5. For the dielectric constant, after contacting the electrodes on both sides of the reinforcing film, the test frequency was adjusted to 1 kHz to 1 mHz using an Agilent Technologies E4980A LCR meter, and the electrode diameter was 5 mm. Measured. The measurement can be measured according to the ASTM D150 standard. In the present application, the reinforcing film having a low dielectric constant may be useful for application to a touch panel due to increased sensitivity to a touch.

The reinforcing film of the present application may also have excellent optical properties. For example, the reinforcing film may have a light transmittance of 85% or more in a visible light region. The upper limit of the light transmittance is not particularly limited, but may be 100% or 99%. In the present specification, light transmittance may be measured by irradiating light having a wavelength range of 550 nm, for example. In addition, the reinforcing film may have a low haze value. In one example, the reinforcing film may have a haze of 5% or less or 3% or less. The lower limit of the haze value is not particularly limited, and may be 0% or 0.01%. The haze can be measured according to the JIS K 7105 standard.

In one example, the reinforcing film of the present application has a thickness (P) ratio (P/R) of the electrode substrate to the thickness (R) of the reinforcing film (P/R) of 0.01 to 0.5 in relation to the electrode substrate to which the reinforcing film is applied. , 0.05 to 0.44, 0.08 to 0.38, 0.1 to 0.32, or 0.12 to 0.28. According to the present application, by adjusting the thickness ratio, the thickness of the electrode substrate is sufficiently thin to achieve a thinner touch panel, while satisfying a ratio capable of implementing both mechanical properties.

The present application also relates to a touch panel. The touch panel may be a thin film touch sensor. As described above, the touch panel of the present application may be an add-on type, an on-cell type, or an integrated type touch panel. In one example, the touch panel May be an on-cell type thin-film touch sensor.

An exemplary touch panel, as illustrated in FIG. 1, includes an electrode substrate 13 for a touch panel; And the above-described reinforcing film 11 formed on one surface of the electrode substrate 13. The touch panel may further include an electrode 14 formed on the other surface of the electrode substrate 13. In the present application, the electrode substrate may have a thickness in the range of 0.5 to 10 μm, and may include a photocurable acrylic compound.

The touch panel of the present application may further include a glass substrate formed on the electrode. In addition, the touch panel may further include functional layers between the glass substrate and the electrode or between the electrode and the electrode substrate. Examples of the functional layer include, but are not limited to, a curl relaxation layer, a moisture barrier layer, and an insulating layer.

The curl relief layer may be added as needed, and may be applied between, for example, an encapsulation film and a reinforcing film. When the film or the touch panel is manufactured, the curl may mean a phenomenon in which the corners and vertices are lifted more than the center of the film. In one example, the curl relief layer may be a polymer layer. The present application may implement an effect of reducing curl by additionally including a polymer layer between the reinforcing film and the encapsulation film. The curl relaxation layer may include, for example, a cyclic olefin copolymer (COP film) or polyethylene terephthalate (PET film).

In the specific example of the present application, the reinforcing film may be directly attached to the electrode substrate, but is not limited thereto. The term "direct attachment" may mean that there is no separate layer between the reinforcing film and the electrode substrate.

The present application also relates to an organic electronic device. In the present specification, the term ``organic electronic device'' refers to an article or device having a structure including an organic material layer that generates an exchange of electric charges using holes and electrons between a pair of electrodes facing each other. Examples include, but are not limited to, a photovoltaic device, a rectifier, a transmitter, and an organic light-emitting diode (OLED). In one example of the present application, the organic electronic device may be an OLED.

An exemplary organic electronic device, as shown in FIG. 2, includes a substrate 21; An organic electronic device 22 formed on the substrate 21; An encapsulation film 12 sealing the entire surface of the organic electronic device 22; And it may include the above-described reinforcing film 11 formed on the encapsulation film.

In addition, the organic electronic device of the present application includes a substrate 21; An organic electronic device 22 formed on the substrate 21; An encapsulation film 12 sealing the entire surface of the organic electronic device 22; And the above-described touch panel formed on the encapsulation film. The touch panel may include an electrode substrate and a reinforcing film, and may be included in the organic electronic device so that the reinforcing film of the touch panel faces the organic electronic device.

In one example, the reinforcing film may have an adhesive force of 1500 gf/inch to 5000 gf/inch with the encapsulation film. The adhesion may be obtained by attaching a reinforcing film to the encapsulation film at a constant temperature and humidity using a roller at 1 inch, and then measuring a peel rate of 300 mm/min and a peel at 180 degrees using a TA device. The measurement can be in accordance with ASTM D3330 standard specification.

In addition, in a specific example of the present application, the reinforcing film of the present application is a ratio of the thickness (E) of the encapsulation film to the thickness (R) of the reinforcing film (E/R) in relation to the encapsulation film present on one side of the reinforcing film. May be in the range of 0.1 to 10.0, 0.5 to 8.0, 0.8 to 7.0, 1.0 to 6.0, 1.1 to 5.0, 1.3 to 4.8, 1.5 to 4.7, 1.7 to 4.3, 1.9 to 4.1, 2.1 to 3.9, or 2.3 to 3.8. According to the present application, by adjusting the thickness ratio, it is possible to sufficiently block external factors penetrating into the organic electronic device while satisfying a ratio capable of implementing a thinner organic electronic device.

In one example, the encapsulation film may be an encapsulant encapsulating both the front surface, for example, the upper and the side surfaces of the organic electronic device. The encapsulation film may include an encapsulation layer containing an adhesive composition or an adhesive composition in a crosslinked state. In addition, an organic electronic device may be formed such that the encapsulation layer contacts the entire surface of the organic electronic device.

In the above, the organic electronic device may be, for example, an organic light emitting device.

In the specific example of the present application, the reinforcing film may be stably formed irrespective of the shape of an organic electronic device such as top emission or bottom emission. In particular, the reinforcing film has excellent optical properties in that it can be applied to a top emission type organic electronic device. Accordingly, in one example, the reinforcing film may not include a metal layer made of a metal material.

In addition, the reinforcing film of the present application is applied to the electrode substrate side, unlike the encapsulation film, to supplement the thickness and mechanical strength of the touch panel. Accordingly, the reinforcing film, as shown in FIG. 2, is disposed on the side of the organic electronic device to be distinguished from the encapsulation film whose main purpose is moisture barrier. In one example, the reinforcing film is a metal oxide. May not contain moisture adsorbent.

Further, the present invention relates to a method of manufacturing an organic electronic device. The organic electronic device may be manufactured using, for example, the reinforcing film.

In order to manufacture the organic electronic device, for example, applying the above-described encapsulation film to a substrate having an organic electronic device formed thereon to cover the organic electronic device; And applying the aforementioned reinforcing film or the aforementioned touch panel on the encapsulation film.

The manufacturing method is not limited thereto, and may include using an integral film to which the encapsulation film and the reinforcing film are attached. That is, the integrated film including the encapsulation film and the reinforcing film may be applied on the organic electronic device so that the encapsulation film completely encapsulates the organic electronic device. Alternatively, the touch panel to which the integrated film is applied may be applied to encapsulate the entire surface of the organic electronic device.

The reinforcing film of the present application provides a touch panel and an organic electronic device having excellent mechanical strength, such as handling and processability, while implementing a thinner touch panel.

1 is a cross-sectional view illustrating a touch panel according to an example of the present application.
2 is a cross-sectional view illustrating an organic electronic device according to an example of the present application.

Hereinafter, the present invention will be described in more detail through examples according to the present invention and comparative examples not according to the present invention, but the scope of the present invention is not limited by the examples presented below.

Example 1

Preparation of reinforcing film solution

At room temperature, silane-modified epoxy resin (KSR-177, Kukdo Chemical), BPA epoxy resin (KSR-277HMC70) and phenoxy resin (YP-50EK, Dongdo Chemical) were added in a weight ratio of 35:33:30, respectively. , And diluted with methyl ethyl ketone. Then, the inside of the reactor was replaced with nitrogen, and the prepared solution was homogenized. After adding 1.2 g of a cationic photoinitiator and 0.8 g of a silane coupling agent to the homogenized solution, a reinforcing film solution was prepared by stirring at high speed for 1 hour.

Preparation of reinforcing film

The prepared solution was applied to the release surface of the release PET and dried in an oven at 100° C. for 15 minutes to form a reinforcing layer having a thickness of 15 μm.

Manufacturing of touch panel

A touch panel was manufactured by attaching the reinforcing film to the substrate (photo acryl, 3 μm thick) of the transparent electrode (ITO) of the touch panel. Physical properties were measured for a sample irradiated with 2 J/cm ² ultraviolet rays on the side of the reinforcing film of the manufactured touch panel.

Example 2

At room temperature, cyclic epoxy resin (Celloxide 2021P, Daicel), hydrogenated BPA epoxy resin (ST3000, Kukdo Chemical), and phenoxy resin (YP-50EK, Dongdo Hwaseong) were added in a weight ratio of 35:33:30, respectively, A reinforcing film and a touch panel were manufactured in the same manner as in Example 1, except that it was diluted with methyl ethyl ketone.

Comparative Example 1

A touch panel was manufactured by forming a transparent electrode (ITO) of a touch panel and a photo acryl of the electrode without attaching a reinforcing film.

Comparative Example 2

65 g of a rubber resin (PIB B50, BASF) and 5 g of maleic anhydride grafted styrene-ethylene-butadiene-styrene block copolymer (MA-SEBS, brand name: FG-1901X, manufacturer: Kraton) were added to the reactor at room temperature. , Except that 30 g of hydrogenated dicyclopentadiene resin (softening point 125°C) was added as a tackifier, and then diluted with toluene to a solid content of about 20% by weight, to prepare a reinforcing film solution. A reinforcing film and a touch panel were manufactured in the same manner.

Experimental Example 1-Checking the presence or absence of cracks in the touch panel (25°C 10R bending test)

For the touch panels manufactured in Examples and Comparative Examples, when the touch panel was folded once with a radius of curvature of 10R (10mm) at 25°C, the presence or absence of cracks in the touch panel was visually observed. If no crack occurred at all, it was classified as good.

Experimental Example 2-Checking the presence or absence of cracks in the touch panel (120°C pressing test)

For the touch panel manufactured in Examples and Comparative Examples, when pressure is applied to the touch panel at 1 MPa using a 10 mm x 3 mm square jig at 120° C. to the edge of the touch panel, a crack occurs in the touch panel on the touch panel. The presence or absence was observed with the naked eye. If no crack occurred at all, it was classified as good.

Tg (℃) 25℃ 10R bending test 120℃ pressing test Example 1 110 Good Good Example 2 120 Good Good Comparative Example 1 - Cracking Cracking Comparative Example 2 -30 Cracking Cracking

11: reinforcing film
12: bag film
13: electrode substrate
14: electrode
21: substrate
22: organic electronic device

Claims (16)

Board; An organic electronic device formed on the substrate; An encapsulation film for sealing the entire surface of the organic electronic device; And a touch panel formed on the encapsulation film,
The touch panel may include an electrode substrate for a touch panel; And a reinforcing film formed on one surface of the electrode substrate,
The reinforcing film is an organic electronic device comprising a reinforcing resin having a glass transition temperature of 80° C. or higher after curing. The organic electronic device of claim 1, wherein the electrode substrate for a touch panel has a thickness of 0.5 to 10 μm. The organic electronic device of claim 1, wherein the electrode substrate for a touch panel includes a photocurable acrylic compound. The organic electronic device of claim 1, wherein the electrode substrate for a touch panel is a substrate on which a transparent electrode is formed. The organic electronic device of claim 4, wherein the transparent electrode comprises indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), aluminum zinc oxide (AZO), or zinc tin oxide (ZTO). . The organic electronic device of claim 1, wherein the thickness of the reinforcing film is in the range of 1 to 100 μm. The organic electronic device of claim 1, wherein the glass transition temperature after curing of the reinforcing resin is in the range of 80°C to 200°C. The organic electronic device according to claim 1, wherein the reinforcing resin is a thermosetting resin, a photocurable resin, or a dual curable resin. The method of claim 1, wherein the reinforcing resin is a styrene resin, an olefin resin, a thermoplastic elastomer, a polyoxyalkylene resin, a polyester resin, a polyvinyl chloride resin, a polycarbonate resin, a polyphenylene sulfide resin, and a poly An organic electronic device comprising an amide resin, an acrylate resin, an epoxy resin, a silicone resin, a fluorine resin, or a mixture thereof. The organic electronic device of claim 1, wherein the reinforcing resin comprises an epoxy resin having a cyclic structure in the molecular structure. The organic electronic device of claim 1, wherein the reinforcing film further comprises an initiator or a curing agent. The organic electronic device of claim 1, wherein the reinforcing film further comprises a binder resin. The organic electronic device of claim 12, wherein the binder resin has a weight average molecular weight of 20,000 or more. The organic electronic device of claim 1, wherein the reinforcing film further comprises a silane coupling agent. The organic electronic device of claim 1, wherein the touch panel is an On-cell type thin film touch sensor. The organic electronic device of claim 1, further comprising an electrode formed on the other surface of the electrode substrate for a touch panel.

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