KR102284419B1 - Reinforcement film - Google Patents

Abstract

The present application relates to a reinforcing film, a touch panel including the same, and an organic electronic device including the same, and provides a reinforcing film capable of supplementing mechanical strength such as handleability and processability while implementing thinning of the touch panel.

Description

REINFORCEMENT FILM

The present application relates to a reinforcing film, a touch panel including the same, and an organic electronic device including the same.

The touch sensor is a liquid crystal display device (Liquid Crystal Display), a field emission display device (FED), a plasma display panel (PDP), an electroluminescence device (EL), an electrophoretic display device. It is a type of input device installed in an image display device, such as a user, to input predetermined information by pressing (pressing or touching) a touch panel while viewing the image display device.

The touch sensor used in the above-described display device may be divided into an add-on type, an on-cell type, and an integrated type according to the structure thereof. The top plate attachment type is a method of attaching the touch sensor to the top plate of the display device after separately manufacturing the display device and the touch sensor. The integrated top plate is a method of directly forming elements constituting the touch sensor on the surface of the upper glass substrate of the display device. The built-in type is a method in which a touch sensor is embedded inside the display device to achieve thinness of the display device and increase durability.

However, the top plate-attached touch sensor has a problem in that the finished touch sensor is mounted on the display device, and the thickness is thick, and the brightness of the display device is darkened, thereby reducing visibility. The built-in touch sensor has an advantage in that it can solve the problems caused by the top plate-attached and top plate-integrated touch sensors in that durability and thinness can be improved. However, since the built-in touch sensor is formed on the thin film transistor array substrate, there is a problem in that the design is complicated and the aperture ratio is lowered.

The on-cell type touch sensor has a structure in which a separate touch sensor is formed on the surface of the glass substrate of the display device, and since the glass substrate is shared, the thickness can be reduced compared to that of the top plate attached type, but it is still There is a problem in that the overall thickness is increased due to the touch driving electrode layer, the touch sensing electrode layer, and an insulating layer for insulating them.

The present application provides a reinforcing film capable of supplementing mechanical strength such as handleability and processability while implementing thinning of the touch panel.

This application relates to a reinforcing film. The reinforcing film may be applied to, for example, a touch panel. In an embodiment of the present application, the reinforcing film may be applied to an electrode of a touch panel, and may be applied to one surface of a substrate of the electrode. In the present specification, the touch panel may be the aforementioned add-on type, on-cell type, or integrated type touch panel, and in this specification, the touch panel has the same meaning as the touch sensor. can be used as

An exemplary reinforcing film is formed on one surface of the electrode substrate for a touch panel, and may include a reinforcing resin having a glass transition temperature of 80° C. or higher after curing. The thickness of the electrode substrate may be in the range of 0.5 to 10 μm, 0.8 to 8.8 μm, 1 to 7.6 μm, 1.3 to 6.3 μm, or 1.8 to 4.9 μm. In the present application, by adjusting the thickness range of the electrode substrate to the above range, the reinforcing film can compensate for the mechanical strength that is lowered due to the reduction in thickness of the touch panel while providing a thin-film touch panel.

As used herein, the term "thin film touch panel" or "thin film touch sensor" means that the thickness of the touch panel is thin, and specifically, it may mean that the thickness of the electrode substrate for the touch panel is within the above-described range.

In one example, the material of the electrode substrate is not limited as long as it can have the aforementioned thickness range. Conventionally, a cyclic olefin polymer (COP) is generally used as a material for an electrode substrate for a touch panel, but the material has a problem in that it is difficult to reduce the thickness of the substrate. In one example, the electrode substrate of the present application is one of the materials that can satisfy the thickness range, and may include a photocurable acrylic compound (Photo acryl, PAC), for example, an acrylic monomer and a photoinitiator. can do.

In an embodiment of the present application, the photocurable acrylic compound may include a photocurable acrylic copolymer resin of a (meth)acrylic acid ester-based monomer and/or a crosslinkable monomer. The electrode substrate for the touch panel is formed as a film for an electrode substrate by photocuring the photocurable acrylic copolymer resin, and the film is optically transparent, so that it can be applied to a touch panel.

The (meth)acrylic acid ester monomer may be, for example, an alkyl (meth)acrylate, but is not limited thereto. The alkyl of the alkyl (meth)acrylate may be a straight-chain, branched or cyclic C1-C30 alkyl, specifically C2-C25, C4-C23 or C6-C18 alkyl having carbon atoms.

The (meth)acrylic acid ester monomer is, specifically, methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylic rate, t-butyl (meth)acrylate, sec-butyl (meth)acrylate, pentyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, 2-ethylbutyl (meth)acrylate, n-octyl It may include one selected from the group consisting of (meth)acrylate, isooctyl (meth)acrylate, isobornyl (meth)acrylate, isononyl (meth)acrylate, and combinations thereof.

In one example, the crosslinkable monomer may refer to a monomer further including a functional functional group as well as a copolymerizable functional group (eg, carbon-carbon double bond) in a molecular structure. The crosslinkable functional group may be, for example, a hydroxyl group, a carboxyl group, a nitrogen-containing functional group, or an epoxy group, but is not limited thereto.

In one embodiment, the photocurable acrylic copolymer resin contains 0.1 to 50 parts by weight, 3 to 45 parts by weight, 7 to 43 parts by weight, 8 to 38 parts by weight of the crosslinking monomer based on 100 parts by weight of the (meth)acrylic acid ester-based monomer. Parts, 10 to 25 parts by weight, or 12 to 23 parts by weight of the monomer component may be polymerized.

The crosslinking monomer is, for example, hydroxypropyl (meth) acrylate, hydroxybutyl (meth) acrylate, 2-isocyanatoethyl (meth) acrylate, 3-isocyanatopropyl (meth) ) acrylate, 4-isocyanatobutyl (meth)acrylate, (meth)acrylamide, N-vinyl pyrrolidone or N-vinyl caprolactam, or a combination thereof, but is not limited thereto. .

In one example, the photoinitiator may be used in an amount of about 0.01 to about 10 parts by weight based on 100 parts by weight of the photocurable acrylic copolymer resin, and the type of the photoinitiator is particularly limited as long as it can initiate a polymerization reaction by light irradiation. and may include, for example, one selected from the group consisting of a benzoin-based initiator, a hydroxy ketone-based initiator, an amino ketone-based initiator, caprolactam, and combinations thereof.

In an embodiment of the present application, the electrode substrate may be a substrate on which an electrode is formed. In one example, the electrode substrate may be a substrate on which a transparent electrode is formed. As used herein, the term “transparent electrode” may refer to an optically transparent electrode, and may refer to an electrode having a light transmittance of 85% or more in a visible ray region. In one example, the transparent electrode is made of indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), aluminum zinc oxide (AZO, aluminum doped zinc oxide) or zinc tin oxide (ZTO). may include

In an embodiment of the present application, the reinforcing film has a thickness of 1 to 100 μm, 1.5 to 80 μm, 2 to 60 μm, 2.5 to 50 μm, 3 to 42 μm, 5 to 38 μm, 6 to 32 μm, 7 to 30 μm, 8 to 28 μm, 9 to 25 μm, 11 to 23 μm, 12 to 21 μm, or 13 to 19 μm. In the present application, by adjusting the thickness of the reinforcing film within the above range, it is possible to provide a thin electrode substrate and, at the same time, to implement the efficiency and convenience of the process due to excellent mechanical strength.

As described above, the reinforcing film of the present application may include a reinforcing resin. The reinforcing resin may be a resin having a glass transition temperature of 80 ℃ or more, 85 ℃ or more, 88 ℃ or more, 91 ℃ or more, 98 ℃ or more, 105 ℃ or more, or 110 ℃ or more after curing, and the upper limit is not particularly limited, but 200 °C. The material of the resin is not limited as long as it satisfies the glass transition temperature. The glass transition temperature may mean a glass transition temperature after curing the resin.

In the present specification, the glass transition temperature may be measured by a known method, for example, it may be measured using DSC (Differential Scanning Calorimetry) or DMA (Dynamic Mechanical Analysis). In one example, the measurement of the glass transition temperature (Tg) in the present specification can be obtained by performing DSC measurement under the following conditions.

Using a differential scanning calorimeter [RDC220 by SII Corporation], a sample of about 10 mg was heated from 30°C in a nitrogen atmosphere to 200°C at a heating rate of 50°C/min, and held at that temperature for 10 minutes. After cooling to -100°C at a temperature-fall rate of 10°C/min and holding at that temperature for 5 minutes, the temperature was raised to 200°C at a temperature increase rate of 10°C/min. The glass transition temperature (Tg) is sensed in a form in which the DSC curve is bent due to a change in specific heat at the time of the second temperature increase, and the baseline moves in parallel. From this bending, the temperature of the intersection of the tangent of the low-temperature baseline and the tangent to the point at which the slope is maximum in the bent portion can be defined as the glass transition temperature (Tg).

In one example, the reinforcing resin may be a curable resin. Specific types of the curable resin that can be used in the present invention are not particularly limited, and, for example, various thermosetting or photocurable resins known in this field may be used. The term “thermosetting resin” refers to a resin that can be cured through the application of appropriate heat or an aging process, and the term “photocurable resin” refers to a resin that can be cured by irradiation with electromagnetic waves. In addition, the curable resin may be a dual-curable resin including both thermosetting and photocuring characteristics.

The type of the reinforcing resin is not particularly limited, but a styrene-based resin, an olefin-based resin, a thermoplastic elastomer, a polyoxyalkylene-based resin, a polyester-based resin, a polyvinyl chloride-based resin, a polycarbonate-based resin, a polyphenylene sulfide-based resin , a polyamide-based resin, an acrylate-based resin, an epoxy-based resin, a silicone-based resin, a fluorine-based resin, or a mixture thereof.

In the above, as the styrene-based resin, for example, styrene-ethylene-butadiene-styrene block copolymer (SEBS), styrene-isoprene-styrene block copolymer (SIS), acrylonitrile-butadiene-styrene block copolymer (ABS) ), an acrylonitrile-styrene-acrylate block copolymer (ASA), a styrene-butadiene-styrene block copolymer (SBS), a styrene-based homopolymer, or a mixture thereof. As the olefin-based resin, for example, a high-density polyethylene-based resin or elastomer, a low-density polyethylene-based resin or elastomer, a polypropylene-based resin or elastomer, or a mixture thereof may be exemplified. In addition, the olefin-based resin may be at least one homopolymer or copolymer selected from the group consisting of isobutylene, propylene, ethylene, 1-butene, 2-butene, isoprene and butadiene. As the elastomer, for example, an ester-based thermoplastic elastomer, an olefin-based elastomer, a silicone-based elastomer, an acrylic elastomer, or a mixture thereof may be used. Among them, polybutadiene resin or elastomer or polyisobutylene resin or elastomer may be used as the olefinic thermoplastic elastomer. As the polyoxyalkylene-based resin, for example, a polyoxymethylene-based resin or elastomer, a polyoxyethylene-based resin or elastomer, or a mixture thereof may be exemplified. As the polyester-based resin, for example, polyethylene terephthalate-based resin or elastomer, polybutylene terephthalate-based resin or elastomer, or a mixture thereof may be exemplified. As the polyvinyl chloride-based resin, for example, polyvinylidene chloride may be exemplified. The polyamide-based resin may be, for example, nylon or the like. As the acrylate-based resin, for example, polybutyl (meth)acrylate may be exemplified. As said epoxy type, For example, bisphenol types, such as a bisphenol A type, a bisphenol F type, a bisphenol S type, and these hydrogenated substances; novolak types, such as a phenol novolak type and a cresol novolak type; nitrogen-containing cyclic types such as triglycidyl isocyanurate and hydantoin; alicyclic; aliphatic; Aromatic types, such as a naphthalene type and a biphenyl type; Glycidyl types, such as a glycidyl ether type, a glycidylamine type, and a glycidyl ester type; dicyclo types, such as a dicyclopentadiene type; ester type; An ether ester type or a mixture thereof may be exemplified. As the silicone-based resin, for example, polydimethylsiloxane may be exemplified. In addition, the fluorine-based resin, polytrifluoroethylene resin or elastomer, polytetrafluoroethylene resin or elastomer, polychlorotrifluoroethylene resin or elastomer, polyhexafluoropropylene resin or elastomer, polyvinylidene fluoride, polyvinyl fluoride, polyfluorinated ethylene propylene, or a mixture thereof may be exemplified. Meanwhile, the reinforcing resin may include a mixture of hydrocarbons, and the mixture of hydrocarbons may include, for example, hexatriacotane or paraffin.

The resins listed above may be used by grafting, for example, maleic anhydride, etc., may be used by copolymerization with other listed resins or elastomers or monomers for preparing resins or elastomers, and may be used after being modified with other compounds. may be Examples of the other compound include a carboxyl-terminated butadiene-acrylonitrile copolymer.

In the reinforcing film, the resin component may have a weight average molecular weight (Mw) that is capable of being molded into a film shape. For example, the resin may have a weight average molecular weight of about 100,000 to 2 million, 120,000 to 1.5 million, or 180,000 to 1 million. In the present specification, the term "weight average molecular weight" refers to a value converted to standard polystyrene measured by gel permeation chromatograph (GPC). However, the resin component does not necessarily have the above-mentioned weight average molecular weight. For example, when the molecular weight of the resin component does not reach a level sufficient to form a film, a separate binder resin may be blended into the reinforcing resin composition.

In one example, the reinforcing resin may be an epoxy resin. In the present application, the reinforcing resin is a curable resin, and may be aromatic or aliphatic; Alternatively, a straight-chain or branched-chain epoxy resin may be used. In one embodiment of the present invention, an epoxy resin containing two or more functional groups, having an epoxy equivalent of 180 g/eq to 1,000 g/eq, may be used. By using an epoxy resin having an epoxy equivalent in the above range, it is possible to effectively maintain properties such as adhesion performance and glass transition temperature of the cured product. Examples of such an epoxy resin include cresol novolac epoxy resin, bisphenol A type epoxy resin, bisphenol A type novolac epoxy resin, phenol novolak epoxy resin, tetrafunctional epoxy resin, biphenyl type epoxy resin, triphenol methane type One kind or a mixture of two or more kinds of an epoxy resin, an alkyl-modified triphenol methane epoxy resin, a naphthalene-type epoxy resin, a dicyclopentadiene-type epoxy resin, or a dicyclopentadiene-modified phenol-type epoxy resin is mentioned.

In the present application, an epoxy resin including a cyclic structure in a molecular structure may be used as the curable resin, and an epoxy resin including an aromatic group (eg, a phenyl group) may be used. When the epoxy resin contains an aromatic group, the cured product may have excellent thermal and chemical stability and low moisture absorption. Specific examples of the aromatic group-containing epoxy resin that can be used in the present invention include a biphenyl type epoxy resin, a dicyclopentadiene type epoxy resin, a naphthalene type epoxy resin, a dicyclopentadiene modified phenol type epoxy resin, a cresol type epoxy resin, It may be one or a mixture of two or more of a bisphenol-based epoxy resin, a xylok-based epoxy resin, a polyfunctional epoxy resin, a phenol novolac epoxy resin, a triphenolmethane-type epoxy resin, and an alkyl-modified triphenolmethane epoxy resin, but is limited thereto no.

In the present application, as the epoxy resin, a silane-modified epoxy resin or a silane-modified epoxy resin having an aromatic group may be used. As such, when an epoxy resin having a silane group structurally modified with silane is used, adhesion to a substrate can be maximized, and moisture barrier properties, durability, reliability, and the like can be improved. The specific kind of the epoxy resin that can be used in the present invention is not particularly limited, and such a resin can be easily obtained from, for example, a place of purchase such as Kukdo Chemical.

In an embodiment of the present application, the reinforcing film may include a polyfunctional acrylate as a polyfunctional active energy ray polymerizable compound depending on the type of resin.

In addition, in the embodiment of the present application, the reinforcing film may include an initiator or a curing agent depending on the type of resin.

For example, the reinforcing film may further comprise a radical initiator. The radical initiator may be a photoinitiator or a thermal initiator. The specific type of the photoinitiator may be appropriately selected in consideration of the curing rate and the possibility of yellowing. For example, benzoin-based, hydroxy ketone-based, amino ketone-based or phosphine oxide-based photoinitiators can be used, and specifically, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether , benzoin n-butyl ether, benzoin isobutyl ether, acetophenone, dimethyl anino acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2 -Hydroxy-2-methyl-1-phenylpropan-1one, 1-hydroxycyclohexylphenylketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propane-1- One, 4- (2-hydroxyethoxy) phenyl-2- (hydroxy-2-propyl) ketone, benzophenone, p-phenylbenzophenone, 4,4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methylanthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone, 2-aminoanthraquinone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-chlorothioxanthone, 2,4 -Dimethylthioxanthone, 2,4-diethylthioxanthone, benzyldimethylketal, acetophenone dimethylketal, p-dimethylaminobenzoic acid ester, oligo[2-hydroxy-2-methyl-1-[4-(1-methyl) vinyl) phenyl] propanone] and 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide.

The radical initiator may be included in an amount of 0.2 parts by weight to 20 parts by weight, 0.5 to 18 parts by weight, 1 to 15 parts by weight, or 2 parts by weight to 13 parts by weight based on 100 parts by weight of the reinforcing resin. The present application can effectively induce curing through this, and also prevent deterioration of physical properties of the reinforcing film due to components remaining after curing.

In one example, the reinforcing film may further include a curing agent. For example, the reinforcing film may further include a curing agent capable of reacting with the above-described resin component to form a cross-linked structure or the like.

An appropriate type of the curing agent may be selected and used according to the type of the resin component or the functional group included in the resin.

In one example, when the reinforcing resin is an epoxy resin, the curing agent is a curing agent for an epoxy resin known in the art, for example, an amine curing agent, an imidazole curing agent, a phenol curing agent, a phosphorus curing agent, or an acid anhydride curing agent. One or more than one type may be used, but the present invention is not limited thereto.

In one example, as the curing agent, an imidazole compound having a solid phase at room temperature and a melting point or decomposition temperature of 80° C. or higher may be used. Such compounds include, for example, 2-methyl imidazole, 2-heptadecyl imidazole, 2-phenyl imidazole, 2-phenyl-4-methyl imidazole or 1-cyanoethyl-2-phenyl imidazole, etc. This may be exemplified, but not limited thereto,

The content of the curing agent may be selected according to the composition of the composition, for example, the type or ratio of the reinforcing resin. For example, the curing agent may be included in an amount of 1 to 20 parts by weight, 1 to 10 parts by weight, or 1 to 5 parts by weight based on 100 parts by weight of the reinforcing resin. However, the weight ratio may be changed according to the type and ratio of the reinforcing resin or the functional group of the resin, or the crosslinking density to be implemented.

When the reinforcing resin is a resin that can be cured by irradiation with an active energy ray, as the initiator, for example, a cationic photopolymerization initiator can be used.

As the cationic photopolymerization initiator, an onium salt or organometallic salt-based ionized cationic initiator or an organosilane or latent sulfonic acid-based or non-ionized cationic photopolymerization initiator may be used. Examples of the onium salt-based initiator include a diaryliodonium salt, a triarylsulfonium salt, or an aryldiazonium salt, and the initiation of an organometallic salt-based initiator As the zero, iron arene may be exemplified, and the organosilane-based initiator may include o-nitrobenzyl triaryl silyl ether, triaryl silyl peroxide, and the like. Alternatively, acyl silane may be exemplified, and the latent sulfuric acid-based initiator may include α-sulfonyloxy ketone or α-hydroxymethylbenzoin sulfonate, but is not limited thereto. .

In one example, as the cationic initiator, an ionized cationic photopolymerization initiator may be used.

In an embodiment of the present application, the reinforcing film may further include a silane coupling agent. The material of the silane coupling agent is not particularly limited, and gamma-glycidoxypropyl triethoxy silane, gamma-glycidoxypropyl trimethoxy silane, gamma-glycidoxypropyl methyldiethoxy silane, 3-mercaptopropyl Trimethoxy silane, vinyltrimethoxysilane, vinyltriethoxy silane, gamma-methacryloxypropyl trimethoxy silane, gamma-methacryloxy propyl triethoxy silane, gamma-aminopropyl trimethoxy silane, gamma- Aminopropyl triethoxy silane, 3-isocyanato propyl triethoxy silane, gamma-acetoacetatepropyl trimethoxysilane, gamma-acetoacetatepropyl triethoxy silane, beta-cyanoacetyl trimethoxy silane, beta -Cyanoacetyl triethoxy silane, acetoxyaceto trimethoxy silane, 3-methacryloxypropyl trimethoxysilane, 3-methacryloxy propyl triethoxysilane, 3-acryloxy propyl trimethoxysilane, 3 -acryloxy propyl triethoxysilane, 3-methacryloxy methyl triethoxysilane, 3-methacryloxy methyl trimethoxysilane, 3-acryloxy propyl methyldimethoxysilane, methacryloxy methyl methyldimethoxysilane, methacryloxy methyl methyldiethoxysilane, methacryloxy propyl methyldimethoxysilane, methacryloxy propyl methyldiethoxysilane, methacryloxy propyl dimethylmethoxysilane or methacryloxy propyl dimethylethoxysilane. The silane compound is, for example, 0.1 parts by weight to 10 parts by weight, 0.3 to 8 parts by weight, 0.7 parts by weight to 5 parts by weight, 0.8 parts by weight to 3 parts by weight, 0.9 parts by weight to 2.5 parts by weight based on 100 parts by weight of the reinforcing resin. It may be included in parts by weight, or 0.9 to 1.8 parts by weight. The silane compound may improve the adhesion and adhesion stability of the reinforcing film, improve heat resistance and moisture resistance, and also improve adhesion reliability even when left for a long time under severe conditions.

The reinforcing film of the present application may further include a binder resin. The binder resin may serve to improve moldability when the composition of the present application is molded into a film or sheet shape.

The type of binder resin that can be used in the present application is not particularly limited as long as it has compatibility with other components such as the aforementioned reinforcing resin component. Specific examples of the binder resin that can be used include, as a resin having a weight average molecular weight of 20,000 or more, a phenoxy resin, an acrylate resin, a high molecular weight epoxy resin, an ultra high molecular weight epoxy resin, a high polarity functional group-containing rubber, and a high polarity (high polarity) a functional group-containing reactive rubber, etc. or a mixture of two or more types, but is not limited thereto.

When the binder resin is included in the reinforcing film of the present application, the content thereof is not particularly limited as being controlled according to desired physical properties. For example, in the present invention, the binder resin, based on 100 parts by weight of the reinforcing resin, 20 parts by weight to 200 parts by weight, preferably 20 parts by weight to 150 parts by weight, more preferably 30 parts by weight to 100 parts by weight may be included in an amount. In the present invention, by controlling the content of the binder resin to 200 parts by weight or less, compatibility with each component constituting the reinforcing film can be effectively maintained.

In an embodiment of the present application, the reinforcing film may have an adhesive force of 1500 gf/inch to 5000 gf/inch or 1800 gf/inch to 3800 gf/inch with the electrode substrate. The adhesive strength may be measured by attaching a reinforcing film to the electrode substrate at a constant temperature and humidity condition using a roller at 1 inch, and then measuring a peeling rate of 300 mm/min and a peeling angle Peel of 180 degrees using a TA device. The measurement may be in accordance with ASTM D3330 standard.

In one example, the reinforcing film has a viscosity measured according to shear stress using a stainless plate jig of 8mm diameter at any one of a 5% strain, a frequency of 1Hz, and a temperature range of 20°C to 35°C before curing. MPa·s or less or in the range of 0.001 MPa·s to 1 MPa·s. The temperature range may be room temperature, for example, may be 25 ℃. In the present application, by controlling the viscosity of the reinforcing film before curing, the adhesion to the electrode substrate and the step filling characteristics are excellently realized.

In one example, the reinforcing film may have a tensile modulus in any one of a temperature range of 90°C to 180°C in a range of 2 MPa to 3 GPa or 5 MPa to 2 GPa. The measurement temperature is not particularly limited, but may be 120°C. The tensile modulus may be measured using a DMA (Dynamic Mechanical Analysis) device under conditions of 0.1 strain, 1 Hz frequency, and 3° C./min ramp up for the sample. The present application implements durability reliability and stability in a high-temperature process of manufacturing a touch panel by adjusting the elastic modulus at high temperature of the reinforcing film within the above range.

The reinforcing film of the present application may also have a dielectric constant of 4.0 or less. The lower limit of the dielectric constant is not particularly limited and may be 0.01, for example, 0.05 to 3.5. The dielectric constant was adjusted to 1 kHz to 1 mHz using an Agilent Technologies E4980A LCR meter device after contacting the electrodes on both sides of the reinforcing film, and the electrode diameter was 5 mm. measured. The measurement may be performed according to the ASTM D150 standard specification. In the present application, the reinforcing film having a low dielectric constant may be useful to be applied to a touch panel because the sensitivity to touch is increased.

The reinforcing film of the present application may also have excellent optical properties. For example, the reinforcing film may have a light transmittance of 85% or more in a visible light region. The upper limit of the light transmittance is not particularly limited, but may be 100% or 99%. In the present specification, light transmittance may be measured, for example, by irradiating light having a wavelength range of 550 nm. In addition, the reinforcing film may have a low haze value. In one example, the reinforcing film may have a haze of 5% or less or 3% or less. The lower limit of the haze value is not particularly limited, and may be 0% or 0.01%. The haze may be measured according to the JIS K 7105 standard.

In one example, the reinforcing film of the present application has a thickness (P) ratio (P/R) of 0.01 to 0.5 of the thickness (P) of the electrode substrate to the thickness (R) of the reinforcing film in relation to the electrode substrate to which the reinforcing film is applied. , 0.05 to 0.44, 0.08 to 0.38, 0.1 to 0.32 or 0.12 to 0.28. In the present application, by adjusting the thickness ratio, the thickness of the electrode substrate can be made thin enough to realize thinness of the touch panel, while satisfying the ratio of realizing mechanical properties together.

This application also relates to a touch panel. The touch panel may be a thin film touch sensor. As described above, the touch panel of the present application may be an add-on type, an on-cell type, or an integrated type touch panel, and in one example, the touch panel may be an on-cell type thin film touch sensor.

An exemplary touch panel includes, as shown in FIG. 1 , an electrode substrate 13 for a touch panel; and the aforementioned reinforcing film 11 formed on one surface of the electrode substrate 13 . The touch panel may further include an electrode 14 formed on the other surface of the electrode substrate 13 . In the present application, the electrode substrate may have a thickness in the range of 0.5 to 10 μm, and may include a photocurable acrylic compound.

The touch panel of the present application may further include a glass substrate formed on the electrode. In addition, the touch panel may further include functional layers between the glass substrate and the electrode or between the electrode and the electrode substrate. Examples of the functional layer include, but are not limited to, a curl alleviation layer, a moisture barrier layer, an insulating layer, and the like.

The curl relief layer may be added as necessary, for example, may be applied between the encapsulation film and the reinforcing film. The curl, when a film or a touch panel is manufactured, may refer to a phenomenon in which corners and vertices are lifted from the center of the film. In one example, the curl relief layer may be a polymer layer. In the present application, by additionally including a polymer layer between the reinforcing film and the encapsulation film, the effect of alleviating curl can be realized. The curl relief layer may include, for example, a cyclic olefin copolymer (COP film) or polyethylene terephthalate (PET film).

In the embodiment of the present application, the reinforcing film may be directly attached to the electrode substrate, but is not limited thereto. The term “direct attachment” may mean that there is no separate layer between the reinforcing film and the electrode substrate.

The present application also relates to an organic electronic device. As used herein, the term "organic electronic device" refers to an article or device having a structure including an organic material layer that generates an exchange of electric charges between a pair of opposite electrodes by using holes and electrons, for example, may include, but are not limited to, a photovoltaic device, a rectifier, a transmitter, and an organic light emitting diode (OLED). In one example of the present application, the organic electronic device may be an OLED.

An exemplary organic electronic device includes, as shown in FIG. 2 , a substrate 21; an organic electronic device 22 formed on the substrate 21; an encapsulation film 12 for sealing the entire surface of the organic electronic device 22; and the aforementioned reinforcing film 11 formed on the encapsulation film.

In addition, the organic electronic device of the present application includes a substrate 21; an organic electronic device 22 formed on the substrate 21; an encapsulation film 12 for sealing the entire surface of the organic electronic device 22; and the aforementioned touch panel formed on the encapsulation film. The touch panel may include an electrode substrate and a reinforcing film, and may be included in the organic electronic device such that the reinforcing film of the touch panel faces the organic electronic device.

In one example, the reinforcing film may have an adhesive force of 1500 gf/inch to 5000 gf/inch with the encapsulation film. The adhesive force may be measured by attaching a reinforcing film to the encapsulation film at 1 inch using a roller under constant temperature and humidity conditions, and then measuring a peeling rate of 300 mm/min and a peeling rate of 180 degrees using a TA device. The measurement may be in accordance with ASTM D3330 standard.

In addition, in the embodiment of the present application, the reinforcing film of the present application has a thickness (E) ratio (E/R) of the encapsulation film to the thickness (R) of the reinforcing film in relation to the encapsulation film present on one surface of the reinforcing film. may be in the range of 0.1 to 10.0, 0.5 to 8.0, 0.8 to 7.0, 1.0 to 6.0, 1.1 to 5.0, 1.3 to 4.8, 1.5 to 4.7, 1.7 to 4.3, 1.9 to 4.1, 2.1 to 3.9 or 2.3 to 3.8. In the present application, by controlling the thickness ratio, while sufficiently blocking external factors penetrating into the organic electronic device, it is possible to satisfy the ratio of realizing thinning of the organic electronic device.

In one example, the encapsulation film may be an encapsulant that encapsulates both the front surface, for example, the top and side surfaces of the organic electronic device. The encapsulation film may include an encapsulation layer containing a pressure-sensitive adhesive composition or an adhesive composition in a crosslinked state. In addition, the organic electronic device may be formed such that the encapsulation layer contacts the front surface of the organic electronic device.

In the above, the organic electronic device may be, for example, an organic light emitting device.

In the embodiment of the present application, the reinforcing film may be stably formed irrespective of the shape of the organic electronic device such as top emission or bottom emission. In particular, the reinforcing film has excellent optical properties in that it can be applied to a top emission type organic electronic device. Accordingly, in one example, the reinforcing film may not include a metal layer made of a metal material.

In addition, the reinforcing film of the present application, unlike the encapsulation film, is applied to the electrode substrate side to supplement the thickness reduction and mechanical strength of the touch panel. Accordingly, as shown in FIG. 2 , the reinforcing film is disposed on the side of the organic electronic device to be distinguished from the encapsulation film whose main purpose is moisture barrier properties, and in one example, the reinforcing film is It may not contain a moisture absorbent.

The present invention also relates to a method for manufacturing an organic electronic device. The organic electronic device may be manufactured using, for example, the reinforcing film.

For manufacturing the organic electronic device, for example, applying the above-described encapsulation film to a substrate having an organic electronic device formed thereon so as to cover the organic electronic device; and applying the aforementioned reinforcing film or the aforementioned touch panel on the encapsulation film.

The manufacturing method is not limited thereto, and may include using an integrated film to which the encapsulation film and the reinforcing film are attached. That is, the integrated film including the encapsulation film and the reinforcing film may be applied so that the encapsulation film completely encapsulates the organic electronic device on the organic electronic device. Alternatively, the touch panel to which the integrated film is applied may be applied to encapsulate the entire surface of the organic electronic device.

The reinforcing film of the present application provides a touch panel and an organic electronic device having excellent mechanical strength such as handleability and processability while realizing a thin touch panel.

1 is a cross-sectional view illustrating a touch panel according to an example of the present application.
2 is a cross-sectional view illustrating an organic electronic device according to an example of the present application.

Hereinafter, the present invention will be described in more detail through Examples according to the present invention and Comparative Examples not according to the present invention, but the scope of the present invention is not limited by the Examples presented below.

Example 1

Preparation of reinforcing film solution

Silane-modified epoxy resin (KSR-177, Kukdo Chemical), BPA epoxy resin (KSR-277HMC70) and phenoxy resin (YP-50EK, Dongdo Hwaseong) were added to the reactor at room temperature in a weight ratio of 35:33:30, respectively, and , diluted with methyl ethyl ketone. Thereafter, the inside of the reactor was replaced with nitrogen, and the prepared solution was homogenized. After adding 1.2 g of a cationic photoinitiator and 0.8 g of a silane coupling agent to the homogenized solution, a reinforcing film solution was prepared by high-speed stirring for 1 hour.

Preparation of reinforcing film

The prepared solution was applied to the release surface of the release PET and dried in an oven at 100° C. for 15 minutes to form a reinforcing layer with a thickness of 15 μm.

Manufacture of touch panel

A touch panel was manufactured by attaching the reinforcing film to the substrate (photo acryl, 3 μm thick) side of the transparent electrode (ITO) of the touch panel. The physical properties of the sample ^{irradiated with 2 J/cm 2} of ultraviolet rays to the side of the reinforcing film of the prepared touch panel are measured.

Example 2

At room temperature, a cyclic epoxy resin (Celloxide 2021P, Daicel), a hydrogenated BPA epoxy resin (ST3000, Kukdo Chemical) and a phenoxy resin (YP-50EK, Dongdo Hwaseong) were added in a weight ratio of 35:33:30, respectively, A reinforcing film and a touch panel were prepared in the same manner as in Example 1, except for dilution with methyl ethyl ketone.

Comparative Example 1

A touch panel was manufactured by forming a transparent electrode (ITO) of the touch panel and a substrate (photo acryl) of the electrode without attaching a reinforcing film.

Comparative Example 2

At room temperature, 65 g of a rubber-based resin (PIB B50, BASF) and 5 g of a maleic anhydride-grafted styrene-ethylene-butadiene-styrene block copolymer (MA-SEBS, trade name: FG-1901X, manufacturer: Kraton) were put into a reactor at room temperature, and , as a tackifier, 30 g of a hydrogenated dicyclopentadiene-based resin (softening point of 125° C.) was added, and then diluted with toluene to give a solid content of about 20 wt% to prepare a reinforcing film solution. A reinforcing film and a touch panel were prepared in the same manner.

Experimental Example 1 - Check the presence of cracks in the touch panel (25℃ 10R bending test)

For the touch panels manufactured in Examples and Comparative Examples, when the touch panel was folded once with a radius of curvature of 10R (10 mm) at 25° C., the presence or absence of cracks in the touch panel was visually observed. When cracks did not occur at all, it was classified as good.

Experimental Example 2 - Check the presence of cracks in the touch panel (120℃ press test)

For the touch panels manufactured in Examples and Comparative Examples, when pressure was applied at 1 MPa using a 10 mm x 3 mm square jig at 120° C. with respect to the edge of the touch panel, cracks occurred in the touch panel on the touch panel The presence or absence was visually observed. When cracks did not occur at all, it was classified as good.

Tg (℃) 25℃ 10R bending test 120℃ press test Example 1 110 Good Good Example 2 120 Good Good Comparative Example 1 - cracking cracking Comparative Example 2 -30 cracking cracking

11: Reinforcement film
12: encapsulation film
13: electrode substrate
14: electrode
21: substrate
22: organic electronic device

Claims (16)

Board; an organic electronic device formed on the substrate; an encapsulation film encapsulating the entire surface of the organic electronic device; and a touch panel formed on the encapsulation film,
The touch panel may include an electrode substrate for a touch panel; a reinforcing film formed on one surface of the electrode substrate; and an electrode formed on the other surface of the electrode substrate,
The reinforcing film of the touch panel is included to face the organic electronic device,
The reinforcing film includes a reinforcing resin having a glass transition temperature of 80° C. or higher after curing,
The reinforcing resin is a styrene-based resin, an olefin-based resin, a thermoplastic elastomer, a polyoxyalkylene-based resin, a polyester-based resin, a polyvinyl chloride-based resin, a polycarbonate-based resin, a polyphenylene sulfide-based resin, a polyamide-based resin, acrylic An organic electronic device comprising a rate-based resin, an epoxy-based resin, a silicone-based resin, a fluorine-based resin, or a mixture thereof. The organic electronic device of claim 1 , wherein the electrode substrate for a touch panel has a thickness in a range of 0.5 to 10 μm. The organic electronic device of claim 1 , wherein the electrode substrate for a touch panel includes a photocurable acrylic compound. The organic electronic device of claim 1 , wherein the electrode substrate for a touch panel is a substrate on which a transparent electrode is formed. The organic electronic device of claim 4 , wherein the transparent electrode comprises indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), aluminum zinc oxide (AZO), or zinc tin oxide (ZTO). . The organic electronic device according to claim 1, wherein the thickness of the reinforcing film is in the range of 1 to 100 μm. The organic electronic device according to claim 1, wherein the glass transition temperature after curing of the reinforcing resin is in the range of 80°C to 200°C. delete delete The organic electronic device according to claim 1, wherein the reinforcing resin comprises an epoxy resin having a cyclic structure in its molecular structure. The organic electronic device of claim 1 , wherein the reinforcing film further comprises an initiator or a curing agent. The organic electronic device of claim 1 , wherein the reinforcing film further comprises a binder resin. The organic electronic device of claim 12 , wherein the binder resin has a weight average molecular weight of 20,000 or more. The organic electronic device of claim 1 , wherein the reinforcing film further comprises a silane coupling agent. The organic electronic device of claim 1 , wherein the touch panel is an on-cell type thin film touch sensor. delete

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