KR20200143300A - Hybrid type wireless charging and receiving antenna device and manufacturing method for the same - Google Patents

Abstract

According to one embodiment of the present disclosure, disclosed are an antenna device, and a manufacturing device and a manufacturing method of the antenna device. According to one embodiment of the present disclosure, the antenna device comprises: a sheet for an antenna substrate to which a connecting PCB is attached; and an antenna pattern starting at one of the plurality of connection terminals of the connection PCB and ending at the other one of the plurality of connection terminals. The antenna pattern includes a plurality of wires serving as one line embedded in the sheet for an antenna substrate. The plurality of wires may include a bridge connecting the connection PCB to a point where winding is completed on the sheet for the antenna substrate.

Description

Hybrid type wireless charging and receiving antenna device and manufacturing method for the same}

The present invention relates to a hybrid wireless charging receiving antenna device and a method of manufacturing the same, and in particular, an embedding head module capable of rotating 360 degrees and a wire supply module synchronizing with the embedding head module to rotate and interlocking with one line on a substrate sheet. The present invention relates to a hybrid wireless charging receiving antenna device for manufacturing a wireless charging antenna by a hybrid process in which a plurality of wires are embedded in parallel to play a role and then a copper foil is bridged so that crossover does not occur at the end of the wire, and a manufacturing method thereof. .

In general, modern electronic devices are developing wireless charging technologies for electronic devices due to the evolution of wireless technology, and various methods are used to improve the communication efficiency between the transmitting module (Tx) and the receiving module (Rx) to implement this. Antennas have been developed and used. In particular, the demand for short-range wireless communication antennas is increasing rapidly due to the development of wireless technology, and methods of forming such short-range wireless communication antennas and wireless charging antennas are largely a method of manufacturing an antenna by dry and wet etching method and copper foil punching, In addition, there is a method of embedding in a substrate by using a copper wire, that is, a copper wire as a conductor of an antenna coil. Among them, the wet etching method is a method of forming an antenna pattern by corroding parts except for the antenna wire intended to be composed of strong acidic chemicals, so the initial cost is excessively high, causing environmental pollution or requiring a separate pollution prevention facility. Is done. On the other hand, the dry etching and copper foil punching methods have a shape similar to that of the wet etching method, but are a method that compensates for the disadvantages of wet etching, and are used in recent years because the antenna pattern is formed by a mechanical method. However, whether it is such an etching or punching copper foil bonding method, the use of an adhesive is essential to attach the antenna coil to the substrate during the manufacturing process, causing a problem in durability. In particular, the antenna coil is used to increase the efficiency between the transmitting and receiving antennas, such as wireless charging. In order to expand the surface of the (conductor), several layers of copper antennas are stacked to form a lamination.To stack several layers of copper antennas, a high-efficiency adhesive (film) is used to ensure that each layer is firmly attached. Will be used. At this time, there are disadvantages of loss of charging efficiency due to the adhesive, which is a dielectric material that impairs the efficiency between transmission and reception, and an increase in additional processes, defect rates, and production costs due to purchase of the adhesive. On the other hand, the method of embedding the copper wire in the substrate by using the copper wire as a conductor of the antenna coil has advantages in that it can increase the efficiency between transmission and reception because there is no material interfering between the layers and the simplicity of manufacture, whereas the surface area of the antenna conductor In order to increase the size, a thick wire can be used, but in this case, it is difficult to reduce the size of the electronic device.

Then, looking at an example of a method of manufacturing a conventional wireless charging antenna as described above with reference to FIG. 1, a first step (S100) of setting a circuit board and a copper foil using a cutting mechanism after the first step (S101) A second step (S102) of cutting the sheet into a set shape, and a third step of completing the antenna by applying an adhesive to the lower portion of the cut copper foil sheet after the second step (S102), and attaching it to a circuit board. It consists of (S103).

Here, in addition to the conventional antenna manufacturing method as described above, a method in which copper foil as in dry etching is punched using a punching tool rather than a physical/chemical cutting method, and then adhered to a substrate by applying an adhesive to the lower part is also widely used.

However, in the manufacturing method of the conventional wireless charging antenna as described above, the manufacturing process of dry etching or punching method is the mainstream, and the manufacturing of such a dry etching and punching method is a solidly processed copper foil sheet antenna coil on the base film. Since a fine and elaborate process must be used to adhere properly, manufacturing costs have increased considerably. In addition, current loss occurs due to the effect of the dielectric properties of the adhesive due to the application of the adhesive between layers, as well as cutting thin sheets of 20 to 30 microns. Because it is a method of forming one antenna coil, it can be easily damaged by a small force, so the manufacturing process is very complicated, such as having to form a separate protective film to protect the antenna coil. Subsidiary materials also have a problem that manufacturing costs are considerably high because materials of high purity must be used.

In addition, the conventional method as described above requires a wider surface of the antenna coil in order to obtain a higher current during charging. When using a copper foil (including etching, punching) sheet as an antenna coil, stacking two or three layers It improves the area of the surface. At this time, since the antenna patterns formed between each layer must be accurately matched to reduce interference between antenna patterns, the lamination process is a very precise operation, and thus the process increases, and the defect rate also increases. This phenomenon has the disadvantage of requiring higher precision as the amount of power demand increases during wireless charging.

To improve this, the formation of a wireless charging antenna using a copper wire as an antenna coil is a method of widening the surface on one side, that is, up/down, as opposed to the stacking (up/down) direction pursued by the etching/punching copper foil sheet antenna. Instead, it suggests a way to widen the surface sideways on a plane. In other words, an antenna coil is formed in a plane similar to a flat shape so that a single conductor is formed by densely feeding several strands. At this time, the reason for using multiple strands of wire instead of using a flat copper wire is that when a flat copper wire is used to embed it in the substrate, the structure of the antenna pattern forms a square or a spiral spiral. It is not possible to guarantee a uniform thickness at the place where it is formed, and even in the case of a spiral, the inner and outer lengths are different from the center of the spiral. Due to this phenomenon, the inner side of the flat copper wire used as an antenna coil when forming a spiral antenna pattern Since the thickness of the outer side is different from each other, a certain effect cannot be obtained, a problem that it is not suitable as a material for forming an antenna coil for wireless charging using a flat copper wire has arisen.

Accordingly, the present invention was invented to solve the problems of the prior art as described above, and while rotating at a set angle with the wire supply module to which the embedding head module is interlocked, a plurality of wires are pulled in parallel and embedded on the substrate sheet without being entangled with each other. It is an object of the present invention to provide a hybrid wireless charging receiving antenna device and a method of manufacturing the same, which can significantly reduce antenna manufacturing cost as well as improving the efficiency of the antenna because it is formed to serve as a single line.

Another object of the present invention is to minimize an error in the manufacturing process due to an increase in the thickness of the overlapping portion because the bridge is processed with thin copper foil at the overlapping portion of the wire in the manufacturing process, and accordingly, the manufacturing yield of the antenna can be significantly improved. It is to provide a hybrid wireless charging receiving antenna device having a thin structure and a method of manufacturing the same.

In other words, the present invention as described above is a receiving antenna of the receiving unit among the transmitting unit (Transmitter Tx) and the receiving unit (Receiver Rx) constituting the wireless charging device in the wireless charging device using the wireless power transfer technology, 360 degrees It is equipped with a rotatable wire embedding head module and a wire supply module that rotates in synchronization with this embedding head module. After embedding a number of wires in parallel to serve as one line on the board sheet, cross over at the end of the wire. In the over section, the wires are double overlapped, so the total antenna thickness of this section = wire thickness x 2, but in order to improve the inconsistency with the recent trend of thinner electronic devices, the crossover section is placed at the beginning of the process. It is to provide a hybrid wireless charging receiving antenna device and a manufacturing method for manufacturing a hybrid wireless charging antenna using a copper foil thinner than a copper wire instead of the copper wire used as a bridge.

The present invention as described above is formed in the form of a box of a predetermined size, mounting a sheet for an antenna substrate on the upper upper plate of the body, and a base frame portion flowing back and forth along a guide rail installed at the lower end of the body;

A screw rod member that is installed at a certain distance in the upper and width directions at the center of the base frame and is coupled to the front and rear surfaces of the middle portion in a screw manner is a first transfer coupling between the first transfer plate member and the second transfer plate member. A central frame portion formed to be fastened to the member and the second transfer coupling member in a screw manner, respectively;

A plurality of embedding head structures installed at a predetermined distance from the first transfer plate member and simultaneously embedding a plurality of wires in parallel so as to act as one line while moving up, down, left, and right on the sheet for an antenna substrate flowing back and forth;

After embedding a plurality of wires in parallel on the antenna board sheet through the plurality of embedding head structures, a bridge is constructed with copper foil on the antenna board sheet after the multi-wire embedding process is completed through the copper foil bonding structure. A hybrid-type wireless charging receiving antenna device including a control panel panel that controls the process of manufacturing the wireless wire charging antenna in accordance with the procedure of a program set to weld the PCBs on the side of the antenna board sheet through the welding module structure. It characterized in that it provides.

Another feature of the present invention is a first process in which the control panel panel attaches the side PCB, which is a connection terminal, on a sheet for an antenna substrate coated with an adhesive at the lower end thereof by an adhesive supply device and then places it on the base frame. ;

A second process of simultaneously embedding a plurality of wires in parallel on the antenna substrate sheet by driving the plurality of embedding head structures by the control panel panel after the first process;

A third process of constructing a bridge with copper foil on the antenna substrate sheet for which the multi-wire embedding process is completed by the control panel panel driving the copper foil adhesive structure after the second process;

Hybrid-type wireless charging reception including a fourth step of completing the wireless charging antenna by welding the PCBs on the side, which is the connection terminal of the sheet for the antenna board on which the bridge construction has been completed by driving the welding module structure after the third step It is to provide a method of manufacturing an antenna device.

According to the present invention as described above, after having an embedding head module that can rotate 360 degrees and a wire supply module that rotates in synchronization with the embedding head module, and embeds a plurality of wires in parallel to serve as one line on the substrate sheet. By manufacturing a wireless charging antenna with a hybrid process that bridges copper foil to prevent crossover at the end of the wire, the embedding head module rotates at a set angle with the interlocking wire supply module, while pulling out a number of wires in parallel without tangling each other. Since it is buried on the substrate sheet and formed to serve as a single wire, there is an effect of improving the charging efficiency as an antenna for wireless charging and reducing the antenna manufacturing cost considerably.

In addition, the present invention as described above makes it possible to use a slimmer electronic device by processing the thickness of the overlapping part thin because the bridge is processed with thin copper foil at the part where the wire overlaps in the manufacturing process, and errors in the manufacturing process due to process increase There is also an effect that can be minimized, thereby significantly improving the manufacturing yield of the antenna.

1 is an explanatory diagram illustrating an example of a method of manufacturing a conventional wireless charging antenna.
Figure 2 is an explanatory diagram schematically illustrating the front of the hybrid wireless charging receiving antenna device according to the present invention.
Figure 3 is an explanatory view schematically illustrating a side of the hybrid wireless charging receiving antenna device according to the present invention.
4 is an explanatory diagram illustrating an example of an embedding head structure of the apparatus of the present invention.
5A is an explanatory diagram schematically illustrating a periphery of the embedding head structure of the apparatus of the present invention.
5B is an explanatory view schematically illustrating a peripheral portion of the copper foil bonding structure and the welding module structure of the present invention.
Figure 6 (ad) is an explanatory view for explaining in more detail the nozzle of the embedding head structure of the apparatus of the present invention.
7(ab) is an explanatory view illustrating a cross section of the nozzle of FIG. 6 in more detail.
Figure 8 is an explanatory diagram illustrating in more detail the welding module structure of the present invention.
9 is a flowchart of the present invention.
Figure 10 (ag) is an explanatory diagram more specifically explaining the manufacturing process of the hybrid-type wireless charging receiving antenna device according to the present invention.
11 is an explanatory diagram illustrating a process in which a plurality of wires are simultaneously embedded by an embedding head module in the manufacturing process of FIG. 10;

Since the present invention can apply various transformations and have various embodiments, specific embodiments are illustrated in the drawings and will be described in detail in the detailed description. However, this is not intended to limit the present invention to a specific embodiment, it is to be understood to include all conversions, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the present invention, when it is determined that a detailed description of a related known technology may obscure the subject matter of the present invention, a detailed description thereof will be omitted.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. These terms are used only for the purpose of distinguishing one component from another component.

The terms used in the present specification are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, actions, components, parts, or a combination thereof described in the specification, but one or more other features. It is to be understood that the presence or addition of elements or numbers, steps, actions, components, parts, or combinations thereof, does not preclude in advance.

In addition, in describing the present invention, when it is determined that a detailed description of a related known technology may unnecessarily obscure the subject matter of the present invention, a detailed description thereof will be omitted.

Hereinafter, embodiments of the present invention will be described in detail with reference to the related drawings.

FIG. 2 is an explanatory diagram schematically illustrating the front side of a hybrid wireless charging receiving antenna device according to the present invention, and FIG. 3 is an explanatory diagram schematically illustrating a side surface of a hybrid wireless charging receiving antenna device according to the present invention. 4 is an explanatory diagram illustrating an example of an embedding head structure of the device of the present invention, FIG. 5A is an explanatory diagram schematically illustrating a periphery of the embedding head structure of the device of the present invention, and FIG. 5B is a copper foil bonding of the present invention. It is an explanatory diagram schematically explaining the periphery of the structure and the welding module structure, and FIG. 6(ad) is an explanatory view more specifically explaining the nozzle of the embedding head structure of the apparatus of the present invention, and FIG. 7(ab) is 6 is an explanatory diagram illustrating a more detailed cross-section of the nozzle of FIG. 6, FIG. 8 is a more detailed explanatory diagram illustrating a welding module structure of the present invention, and FIG. 9 is a flowchart of the present invention, and FIG. (ag) is an explanatory diagram explaining in more detail the manufacturing process of the hybrid wireless charging receiving antenna device according to the present invention, and FIG. 11 is a plurality of wires simultaneously embedded by the embedding head module in the manufacturing process of FIG. It is an explanatory diagram explaining the process of becoming.

The hybrid-type wireless charging receiving antenna device according to the present invention is formed in a box shape of a certain size as shown in Figs. 2 and 3 and mounts an antenna substrate sheet 2 on the upper top plate 1 of the body, A base frame part 4 flowing back and forth along the guide rail 3 installed at the lower end of the body;

The first transfer plate member 6 is provided with a screw rod member 5A-B installed in the center of the base frame 4 at a certain distance in the upper and width directions and coupled to the front and rear surfaces of the middle part of the body in a screw manner. ) And a central frame portion 10 formed to be fastened to each of the first transfer coupling member 8 and the second transfer coupling member 9 of the second transfer plate member 7 in a screw manner;

A plurality of wires 11a-n to serve as one line while moving up, down, left, and right on the sheet 2 for an antenna substrate that is installed at a certain distance from the first transfer plate member 6 and flows back and forth. A plurality of embedding head structures 12 simultaneously embedding five wires in parallel;

The ends of the wires 11a-n of the antenna board sheet 2, which are installed at a certain distance from the second transfer plate member 7 and placed in the base frame 4 to complete the multi-wire embedding process A copper foil bonding structure 14 for bridge construction by bonding copper foil 13 so as not to crossover while moving from the top, bottom, left, and right;

The PCBs (15a-n) on the side of the antenna board sheet (2), which are installed at a certain distance from the second transfer plate member (7), are placed in the base frame (4), and are bridged by copper foil. A welding module structure 16 for welding with a laser beam while moving downward, left, and right;

After embedding a plurality of wires, for example, five wires 11a-e, in parallel on the antenna substrate sheet 2 through the plurality of embedding head structures 12, the multi-wires are embedded through the copper foil bonding structure 14 A bridge is constructed with copper foil 13 on the antenna substrate sheet 2 on which the process is completed, and the PCBs 15a-n on the side of the antenna substrate sheet 2 on which the bridge construction is completed are connected through the welding module structure 16. It is configured to include a control panel panel unit 17 for collectively controlling the process of manufacturing the wireless wire charging antenna according to the procedure of the program set to weld.

Further, in the embedding head structure 12, as shown in FIG. 4, a plurality of wires, which are drawn at a predetermined distance from the lower end of the body, are arranged in parallel according to the function control of the control panel panel unit 17. 360-degree rotatable embedding head module 18 embedded in the image,

It is coupled to the upper end of the embedding head module 18, and generates energy set at the shortest end of the embedding head module 18 through ultrasonic vibration according to the function control of the control panel panel 17, thereby forming the sheet 2 for the antenna board. An ultrasonic vibrator member 19 that instantly dissolves, and

A wire spool (20a-n) coupled to the upper end of the ultrasonic vibrator member 19 via bearings (21a-b) and supplying a plurality of, for example, five wires to the embedding head module (18), is at the upper end. It is formed and the body is configured in the form of a rotating disk, the wire supply rotating plate member 22 capable of rotating 360 degrees by interlocking with the embedding head module 18,

The rotating shaft 23 is coupled via a bearing (21a-b) coupled to the center of the wire supply rotating plate member 22, and the embedding head module 18 and the wire supply rotating plate are controlled under the function control of the control panel panel unit 17. An embedding rotary motor 24 that rotates the member 22 by a set rotation angle,

The embedding head structure 12 is coupled to the upper end of the embedding rotary motor 24 via a coupling fixing member 25 and fixed to the coupling fixing member 25 through pneumatic pressure under the function control of the control panel panel 17. It is configured to include an embedding pneumatic cylinder member 26 for flowing the body up and down.

Here, the coupling fixing member 25 has an upper end of the body coupled to the pneumatic rod 27 of the embedding pneumatic cylinder member 26, as shown in FIGS. 4 and 5A, 5B, while the embedding rotary motor ( The upper end of 24) is coupled by screwing and is installed to flow with the entire body of the embedding head structure 12. Further, the embedding head module 18 has a plurality of insertion holes 28 into which the wires supplied from the wire spools 20a-e are inserted into the circumference of the side of the body as shown in FIG. 6(ad). , 5 are formed, and the cross section of the lowermost wire nozzle 29 of the embedding head module 18 is formed with holes 30a-n in the form of, for example, a pentagonal structure as shown in FIG. 7 (ab), The distance (A) between the hole (30a) and the hole (3b) is formed to be smaller than the diameter (R) of the hole. In the above description, five holes 30a-n have been described as having a pentagonal shape, but the number or shape of the holes 30a-n is not limited thereto, and may be implemented in various ways.

And on one side of the base frame part 4 and the central frame part 10, the moving trajectory of the embedding head module 18, the copper foil bonding structure 14 and the welding module structure 16 is detected. Alternatively, detection sensors 31a-n that detect detection points set by the control panel panel 17 and transmit them to the control panel panel 17 are respectively installed.

On the other hand, the copper foil bonding structure 14 has a plurality of vacuum adsorption nozzles 32 capable of adsorbing objects with a vacuum at the bottom of the body as shown in FIGS. 2 to 3 and 5B, and the control panel panel part According to the function control of (17), the multi-wire embedding process is completed, and the wire is moved up, down, left, and right from the end of the wire of the antenna board sheet (2), and the copper foil is attached to prevent crossover of the wire to construct a bridge. A copper foil bonding module 33 capable of rotating 360 degrees,

The copper foil bonding module 33 is coupled to the upper end of the copper foil bonding module 33 via a bonding fixing member 25 and fixed to the bonding fixing member 25 through pneumatic pressure under the function control of the control panel panel 17. It is configured to further include a copper foil pneumatic cylinder member 34 for flowing the body up and down.

Further, the welding module structure 16 includes the PCBs 15a-n on the side of the sheet 2 for the antenna board on which the bridge construction has been completed, as shown in FIGS. 3, 5B, and 8. A laser welding module 35 that can rotate 360 degrees for welding with a laser beam while moving,

The laser welding module 35 is coupled to the upper end of the laser welding module 35 via a welding fixing member 25 and fixed to the welding fixing member 25 through pneumatic pressure under the function control of the control panel panel 17. ) It is configured to further include a welding pneumatic cylinder member 36 to flow up and down the body.

In addition, a space is formed on one side of the side of the base frame part 4 to accommodate the antenna board sheet 2 or the plurality of side PCBs 15a-n or copper foil 13, and the side PCB 15a An adhesive supply device 37 is provided to apply an adhesive to the lower portion of -n) or to apply an adhesive to the lower portion of the copper foil 13.

On the other hand, the embedding head module 18 must be rotated according to the angle of the antenna format in order to form a closed loop pattern antenna by connecting multiple wires 11a-n in parallel. It can prevent twisting of the wire. On the other hand, the embedding head module 18 inserts the antenna wires 11a-n into the holes 30a-n formed inside the head, while the ultrasonic vibration transmitted from the ultrasonic vibrator member 19 is transmitted to the substrate 2 And forward and rotate motions. That is, when viewed from an angle above the substrate 2, a complex function of performing x y z motion + rotational motion is performed.

Here, the laser welding module 35, as shown in FIG. 8, for example, when welding through the laser nozzle 38, the wire 11a-n, the bridge (or copper foil), and the wire 11a-n A laser nozzle with a guide attached to the bottom of the laser nozzle so that welding can be completed in a state where the base material and the object to be welded are bonded to each other by irradiating a laser beam while lightly pressing the PCB (15a-n) with the welding head 39 38 is provided, at this time, the size of the lower end portion of the welding head 39 has a size of about 1.5 to 2.5 times the diameter of the antenna wire. At this time, the pressure to be pressed as described above is suitable if it is about 10kg ~ 25kg/㎠, and the substrate and the closing surface are surface treated so as not to be sharp.

Here, the multiple wires 11a-n are preferably formed in parallel with thin coils in order to increase the surface area while being thin, like an etched or punched copper foil antenna.

On the other hand, the base frame part 4 is coupled with a guide rail 3 installed at the lower end of the body, for example, a pineer gear member 40 that moves the body of the base frame part 4 back and forth while interlocking with a rake member. At this time, in the case of the base frame part 4, when the wire 11a-n embedding process is finished, the body moves to the opposite side based on the central frame part 10, so that the bridge construction and welding work through copper foil can be performed. There will be.

Next, a method for controlling the apparatus of the present invention having the above configuration will be described.

In the method of the present invention, as shown in Fig. 9, in the initial state (S1), the control panel panel is attached to the PCB as the connection terminal on the sheet for antenna board to which the adhesive has been applied to the lower end by the adhesive supply unit. A first step (S2) of placing on the base frame portion after;

A second step (S3) in which the control panel panel drives a plurality of embedding head structures after the first step (S2) to simultaneously embed a plurality of wires in parallel on the antenna board sheet;

A third process (S4) in which the control panel panel drives the copper foil adhesive structure after the second process (S3) to construct a bridge with copper foil on the antenna substrate sheet for which the multi-wire embedding process is completed;

Including a fourth process (S5) in which the control panel panel drives the welding module structure after the third process (S4) and welds the PCBs on the side, which are the connection terminals of the sheet for the antenna board, on which the bridge construction has been completed, to complete the wireless charging antenna. Is composed.

Here, looking at the manufacturing method of the present invention in more detail, in the first process (S2), wire embedding is possible by ultrasonic waves, for example, a sheet for an antenna substrate made of a material such as PVC, PET, Teslin ( After the sheet preparation step (refer to Fig. 10 (a)) and the sheet preparation step constituting 2), a hole is punched on the antenna substrate sheet 2 with a laser or a punching tool, and the hole is a wire 11a A hole punching step of punching a hole to have a diameter similar to the thickness of -n) (usually around 120 μm) (see Fig. 10(b)), and after the hole punching step, shown in Fig. 10(c). As shown in Fig. 10 (c), the adhesive is applied by driving an adhesive dispenser to the area where the terminal for connection between products to be charged (usually the PCB on the side) will be located by connecting to a mobile phone or wireless charging antenna (see Fig. 10(c)). It is configured to further include a pick & place step of supplying and attaching the PCB (15a-n), which is a terminal for connection, on the sheet 2 for the antenna substrate on which is applied.

In the second process (S3), the control panel panel unit 17 forms an antenna wire, for example, as shown in Figs. 10(d) and 11, by paralleling 5 wires at point A. After starting and forming section a, when reaching the point A', a plurality of embedding head modules 18 are driven to bite the antenna wires 11a-n and jump slightly higher than the thickness of the side PCB 15a-n. After placing the antenna wire (11a-n) on the side PCB (15a-n) (at this time, the antenna wire (11a-n) passes through the side PCB without embedding), then reaches the point B and A' After forming the antenna by descending to the height at the point, the antenna is formed by stopping the formation of the antenna at the point C. In this process, the control panel panel 17 flows the first transfer coupling member 8 of the first transfer plate member 6 screwed with the screw rod member 5A-B formed in the central frame portion 10. The embedding pneumatic cylinder member 26 coupled to the upper end of the embedding head module 18 flows up and down while the plurality of embedding head modules 18 coupled to the first transfer plate member 6 flow left and right. As described above, a plurality of wires are formed in parallel on the antenna board sheet 2 placed in the base frame part 4 flowing back and forth from the bottom thereof. At this time, as described above, as shown in FIG. 11, the plurality of embedding head modules 18 form, for example, five wires, and at the same time, the control panel panel 17 is an ultrasonic vibrator located at the top of the embedding head module 18. A wire emitted from the embedding head module 18 that drives the member 19 to generate energy set at the shortest end of the embedding head module 18 through ultrasonic vibration to instantly dissolve the sheet 2 for the antenna board. Will be landfilled.

Here, in each of the embedding head modules 18, for example, an antenna wire for simultaneously forming five wires 11a-n in parallel serves as one wire when finally buried.

On the other hand, in the second process (S3), the control panel panel 17 has the embedding head module 18 at the same angle according to the rotation direction of the antenna wires 11a-n as shown in FIG. 10(e). When it rotates, that is, when the antenna is formed by one turn, each of the embedding head modules 18 also rotates by 360 degrees, which is one turn. That is, the control panel panel 17 drives the embedding rotation motor 24 to rotate the plurality of embedding head modules 18 by 360 degrees according to the rotation direction of the antenna wire to form an antenna wire. At the same time, the embedding head The wire supply rotating plate member 22 located on the upper end of the module 18 is also interlocked with the embedding head module 18 to rotate 360 degrees to release the wire from the wire spools 20a-n. Therefore, as described above, since the embedding head module 18 and the wire supply rotating plate member 22 simultaneously rotate 360 degrees to form the antenna wires 11a-n once, the antenna wires 11a-n are circular. Even if it is embedded in the antenna substrate sheet 2, there is no phenomenon that the wires 11a-n overlap or twist. And when the embedding head module 18 rotates 360 degrees and completes the embedding of the antenna wire like a circle, the control panel panel 17 stops driving the embedding head module 18 and stops the embedding head module ( The cutting knife (not shown) attached to the axis (not shown) of 18) comes down, cuts the ends of the antenna wires 11a-n, and then moves the embedding head module 18 to the start position of the next process. .

Meanwhile, in the third process (S4), the control panel panel 17 is a second transfer plate screwed with a screw rod member 5A-B formed on the central frame 10 as shown in FIG. 5B. By flowing the second transfer coupling member 9 of the member 7, the copper foil bonding module 33 coupled to the second transfer plate member 7 flows left and right, and is coupled to the upper end of the copper foil bonding module 33 The copper foil pneumatic cylinder member 34 is moved up and down to adsorb the copper foil 13 transferred to the set position through the vacuum adsorption nozzle 32 located at the bottom of the copper foil bonding module 33. The wires 11a-n are moved onto the antenna board sheet 2 placed in the flowing base frame part 4, and then at the ends of the wires of the antenna board sheet 2 after the multi-wire embedding process is completed. As shown in Fig. 10 (f) to prevent crossover, the copper foil 13 is bonded to form a bridge. When explaining the process of constructing the bridge using the copper foil 13 in more detail, the copper foil bonding module 33 includes a point C and a side PCB terminal a point and a bridge as shown in FIG. 10(f). (Or copper foil) is formed and connected. At this time, the bridge is made of a thin copper foil 13 having a thickness of about 33 µm, but the width is constructed so that a sufficient current can pass so that the amount of current generated by the antenna is not lost. In addition, an adhesive must be applied to the lower portion of the copper foil 13 used as the bridge, but the portion connected to the point C and the side PCB terminal a is formed by a punching method in a state where the adhesive is not applied.

Furthermore, in the fourth process (S5), the control panel panel unit 17 drives the welding module structure 16 as shown in FIG. 5B to drive the PCBs on the side that are the connection terminals of the antenna board sheet for which the bridge construction has been completed. The wireless charging antenna is completed by welding. That is, the control panel panel part 17 flows the second transfer coupling member 9 of the second transfer plate member 7 screwed with the screw rod member 5A-B formed in the central frame part 10 Laser welding by moving the welding pneumatic cylinder member 36 coupled to the upper end of the laser welding module 35 up and down while moving the laser welding module 35 coupled to the second transfer plate member 7 left and right The wireless charging antenna is completed by welding the PCBs (15a-n), which are the connection terminals of the antenna board sheet (2) for bridge construction, located at the bottom of the module (35). That is, after the antenna wire forming process and the bridge construction process are completed, the welding process is performed by laser compression at point B, point C, and terminal a, as shown in Fig. 10(g). The wireless charging antenna is completed by welding on the PCB (15a-n).

On the other hand, the antenna completed through the above process further undergoes a process of burying the wire in the substrate, which is a process of lowering the overall thickness and making the antenna wire and antenna firmly attached. , The antenna before this revolution is buried in the substrate about 30-50% from the surface of the substrate. At this time, in order to more solidly integrate the various parts of the antenna, such as the antenna wire, the side PCB, and the bridge, a compression process accompanied by heat and pressure is further performed. At this time, heat, pressure, and time vary depending on the material. In the case of PVC material, the pressure is 50 ~ 100 bar, the temperature is about 140 degrees, and the time is about 20 ~ 25 minutes, but this can be adjusted according to the condition of the product and is not limited to a certain value. Does not. However, use a flat compressor so that constant heat and pressure can be transferred to the entire part.

In addition, during the above process, the punching process is performed using a punching mold in accordance with the product standard on the completed antenna sheet.

1: top plate 2: sheet for antenna board
3: guide rail 4: base frame part
5A-B: screw rod member 6: first transfer plate member
7: second transfer plate member 8: first transfer coupling member
9: second transfer coupling member 10: central frame portion
11a-n: wire 12: embedding head structure
13: copper foil 14: copper foil adhesive structure
15a-n: side PCB 16: welding module structure
17: control panel panel 18: embedding head module
19: ultrasonic vibrator member 20a-n: wire spool
21a-b: bearing 22: wire supply rotating plate member
23: rotary shaft 24: embedding rotary motor
25: coupling fixing member 26: embedding pneumatic cylinder member
27: pneumatic rod 28: insertion hole
29: wire nozzle 30a-n: hole
31a-n: detection sensor 32: vacuum suction nozzle
33: copper foil bonding module 34: copper foil pneumatic cylinder member
35: laser welding module 36: welding pneumatic cylinder member
37: adhesive supply unit 38: laser nozzle
39: welding head 40: pinion gear member

Claims (14)

A base frame on which an antenna substrate sheet is mounted,
A central frame disposed above the center of the base frame,
An embedding head structure coupled to the central frame and simultaneously embedding a plurality of wires in parallel in the antenna substrate sheet,
A welding module structure that is coupled to the central frame and welds an antenna pattern formed including the plurality of wires to a connecting PCB,
An antenna manufacturing apparatus comprising a copper foil adhesive structure for constructing a bridge connecting the ends of the plurality of wires and the connection PCB. The method of claim 1,
The bridge is made of a copper foil or a composite comprising at least copper foil, an antenna manufacturing apparatus. The method of claim 1,
The embedding head structure,
An embedding head module for discharging the plurality of wires,
An antenna manufacturing apparatus comprising an ultrasonic vibrator member coupled to an upper portion of the embedding head module to generate predetermined energy through ultrasonic vibration to melt the antenna substrate sheet. The method of claim 3,
The embedding head structure,
A plurality of wires pulls for supplying each of the plurality of wires are formed at an upper end, and further comprising a wire supply rotating plate member configured to be rotatable. Embedding a plurality of wires in parallel on the antenna substrate sheet at the same time,
Constructing a bridge connecting the ends of the plurality of wires and the connection PCB,
Welding start ends of the plurality of wires and both ends of the bridge
Containing, an antenna device manufacturing method. The method of claim 5,
Before any one of the embedding, constructing the bridge, and welding,
Attaching the connection PCB to the antenna substrate sheet
The method of manufacturing an antenna device further comprising a. The method of claim 6,
Before the embedding step,
Forming one or more openings in the antenna substrate sheet
The method of manufacturing an antenna device further comprising a. The method of claim 7,
At least one of the plurality of connection terminals of the connection PCB is located in the one or more openings. A sheet for an antenna board with a connecting PCB attached,
An antenna device including an antenna pattern starting at one of the plurality of connection terminals of the connection PCB and ending at the other one of the plurality of connection terminals,
The antenna pattern includes a plurality of wires serving as one line embedded in the antenna substrate sheet, and a bridge connecting the connection PCB to a point at which the plurality of wires are wound on the antenna substrate sheet, Antenna device. The method of claim 9,
The bridge is made of a copper foil or a composite containing at least copper foil, the antenna device. The method of claim 10,
One or more openings are formed in the antenna substrate sheet, and at least one of a plurality of connection terminals of the connection PCB is located in the one or more openings. The method of claim 11,
The positions of the start ends of the plurality of wires and the positions of both ends of the bridge are welded. A sheet for an antenna board with a connecting PCB attached,
An antenna device including an antenna pattern starting at one of the plurality of connection terminals of the connection PCB and ending at the other one of the plurality of connection terminals,
The antenna pattern is made of a plurality of wires serving as one line embedded in the sheet for the antenna substrate, and the start ends of the plurality of wires are welded at the position of terminal 1 of the connection PCB, and the plurality of wires The antenna device, wherein the point where the winding is completed on the sheet for the antenna substrate is welded at the position of terminal 2 of the connection PCB. The method of claim 13,
One or more openings are formed in the antenna substrate sheet, and at least one of a plurality of connection terminals of the connection PCB is located in the one or more openings.

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