KR20200138705A - Organic light emitting diode display - Google Patents

Abstract

Provided is an organic light emitting display device comprising: a substrate; an organic light emitting diode formed on the substrate; an encapsulated substrate formed on the organic light emitting diode; and an adhesive layer formed on the substrate to cover the organic light emitting diode, and bonding the substrate on which the organic light emitting diode is formed to the encapsulated substrate. The organic light emitting display device has excellent lifetime characteristics.

Description

Organic light emitting display device {ORGANIC LIGHT EMITTING DIODE DISPLAY}

It relates to an organic light emitting display device.

An organic light emitting diode display has a self-luminous characteristic, and unlike a liquid crystal display, it does not require a separate light source, and thus thickness and weight can be reduced. In addition, the organic light emitting diode display is drawing attention as a next-generation display device for portable electronic devices because it exhibits high quality characteristics such as low power consumption, high luminance, and high response speed.

The organic light emitting diode display includes a plurality of organic light emitting diodes having a hole injection electrode, an organic emission layer, and an electron injection electrode. Light is emitted by energy generated when excitons generated by the combination of electrons and holes in the organic emission layer fall from the excited state to the ground state, and the organic light emitting display device forms an image using this energy.

However, since the organic emission layer is sensitive to an external environment such as moisture or oxygen, when the organic emission layer is exposed to moisture and oxygen, there is a problem in that the quality of the organic light emitting display device is deteriorated. Therefore, in order to protect the organic light-emitting device and prevent moisture or oxygen from penetrating into the organic light-emitting layer, the encapsulation substrate is sealed and bonded on the display substrate on which the organic light-emitting device is formed through an additional sealing process, or a thick layer is protected on the organic light-emitting device. A layer was formed.

However, in order to completely prevent moisture or oxygen from penetrating into the organic emission layer in both the case of using the encapsulation substrate or forming the protective layer, the manufacturing process of the organic light emitting display device is complicated and the overall thickness of the organic light emitting display device is reduced. There was a difficulty in forming.

In one embodiment of the present invention, it is intended to provide an organic light emitting display device that effectively suppresses the penetration of moisture or oxygen, has a simple manufacturing process, and has improved yield.

In another embodiment of the present invention, a method of manufacturing the above organic light emitting display device is provided.

In one embodiment of the present invention, a substrate; An organic light-emitting device formed on the substrate; An encapsulation substrate formed on the organic light-emitting device; And an adhesive layer formed on the substrate to cover the organic light emitting device and bonding the substrate on which the organic light emitting device is formed to the encapsulation substrate.

The adhesive layer is formed by stacking at least one filling adhesive layer and at least one moisture absorption adhesive layer, for example, a first filling adhesive layer, a moisture absorption adhesive layer, and a second filling adhesive layer are sequentially stacked.

The hygroscopic adhesive layer is silica gel (SiO ₂ H ₂ O), alumino-silicate beads, montmorillonite, zeolite as a molecular sieve (zeolite: Na ₁₂ AlO ₃ SiO ₂ 12H ₂ O), activated carbon, alkali metal oxides, alkaline earth metal oxides, metal sulfates, metal halides, and metal perchlorates may contain at least one hygroscopic material selected from the group consisting of have.

The first filling adhesive layer and the second filling adhesive layer are each independently, and the filling adhesive layer is talc, silica, magnesium oxide, mica, montmorillonite, alumina, graphite, beryllium oxide, aluminum nitride, It may include at least one filling material selected from the group consisting of silicon carbide, mullite, and silicon.

The particle diameter of the hygroscopic material may be 10 nm to 20 μm.

The particle diameter of the filling material may be 10 nm to 20 μm.

The moisture absorbing material or the filling material may be a mesoporous type, a plate type, a spherical shape, a rod type, a fiber type, or a core-shell type type.

The adhesive layer may include a thermosetting resin or a photocurable resin.

The first filling adhesive layer, the moisture absorbing adhesive layer, and the second filling adhesive layer may be formed as one sheet in which the adhesive layer does not form an interlayer interface, including all of the same type of thermosetting resin or photocurable resin.

The first filling adhesive layer and the second filling adhesive layer, each independently, 100 parts by weight of a thermosetting resin or a photocurable resin; And 5 to 50 parts by weight of a filling material.

The hygroscopic adhesive layer may include 100 parts by weight of a thermosetting resin or a photocurable resin; And 5 to 50 parts by weight of a hygroscopic material.

The thickness of the adhesive layer may be 5um to 30um.

In the adhesive layer, a thickness ratio of the first filling adhesive layer, the moisture absorption adhesive layer, and the second filling adhesive layer may be 0.1 to 1.2: 0.1 to 1.2: 0.1 to 1.2.

In another embodiment of the present invention, forming an organic light emitting device on a substrate; Forming an adhesive layer by sequentially laminating a first filling adhesive layer, a moisture absorption adhesive layer, and a second filling adhesive layer: And bonding the organic light emitting device between the substrate and the encapsulation substrate through the adhesive layer. Provides a device manufacturing method.

In the method of manufacturing the OLED display, a first filling adhesive layer, a moisture absorption adhesive layer, and a second filling adhesive layer are formed by a roll to roll, roll to glass, press bonding or diaphragm process. It may include the step of forming the sequentially laminated adhesive layer.

In the method of manufacturing the organic light emitting display device, after forming the adhesive layer on the encapsulation substrate, a step of bonding with the substrate on which the organic light emitting element is formed by a lamination process, a press process, or a diaphragm process is performed. I can.

The organic light emitting display device has excellent lifespan characteristics.

1 is a schematic cross-sectional view of an organic light emitting diode display according to an exemplary embodiment of the present invention.
2 is a diagram schematically illustrating a method of manufacturing an adhesive layer that may be included in an organic light emitting display device according to another exemplary embodiment of the present invention.
3 is a schematic cross-sectional view of an organic light emitting diode display according to another exemplary embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art may easily implement the present invention. The present invention may be implemented in various different forms, and is not limited to the embodiments described herein.

In order to clearly describe the present invention, parts irrelevant to the description have been omitted, and the same reference numerals are assigned to the same or similar components throughout the specification.

In addition, the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, so the present invention is not necessarily limited to the illustrated bar.

In addition, the size and thickness of each component shown in the drawings are arbitrarily exaggerated for convenience of description, so the present invention is not necessarily limited to the illustrated bar.

In the drawings, the thicknesses are enlarged to clearly express various layers and regions. And in the drawings, for convenience of description, the thickness of some layers and regions is exaggerated. When a part of a layer, film, region, plate, etc. is said to be "on" or "on" another part, this includes not only the case where the other part is "directly above" but also the case where there is another part in the middle. Conversely, when one part is "directly above" another part, it means that there is no other part in the middle.

Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 to 3.

1 is a cross-sectional view of an organic light emitting display device 100 according to an exemplary embodiment of the present invention.

Referring to FIG. 1, the organic light emitting display device 100 includes a first substrate 10, an organic light emitting device 20 formed on the first substrate 10, and a second light emitting device 20 formed on the organic light emitting device 20. It includes a substrate 40 and an adhesive layer 30 interposed between the first and second substrates 10 and 40. Hereinafter, the first substrate 10 is simply referred to as the substrate 10 and the second substrate 40 is referred to as the encapsulation substrate 40.

The organic light-emitting device 20 displays an image with an organic light-emitting layer (not shown) that emits light, and the driving circuit unit DC (shown in FIG. 3) drives the organic light-emitting device 20. The organic light-emitting device 70 and the driving circuit unit DC are not limited to the structure shown in FIG. 3, and according to the direction in which the organic light-emitting device 70 emits light and displays an image, experts in the relevant technical field can easily It can be formed into various structures within the range that can be modified.

In order to suppress the penetration of moisture or oxygen into the organic light-emitting layer, the upper portion of the organic light-emitting device 20 is sealed with the encapsulation substrate 40 via the adhesive layer 30. That is, the adhesive layer 30 is formed on the substrate 10 on which the organic light emitting element 20 is formed to cover the organic light emitting element 20, and the encapsulation substrate 40 is formed thereon again.

As the encapsulation substrate 40, a glass substrate or a transparent plastic substrate as an insulator is used, and when the encapsulation substrate is made of a transparent material, the encapsulation substrate 40 may be used in a front light emitting type.

The adhesive layer 30 includes a first adhesive layer 31 and 33 and a second adhesive layer 32, and the first adhesive layer 31 and 33 includes a first filling adhesive layer 31 and a second filling adhesive layer 33 do. The second adhesive layer 32 is a moisture absorbing adhesive layer, and may be referred to as a moisture absorbing adhesive layer 32 hereinafter. The adhesive layer 30 is formed by sequentially stacking the first filling adhesive layer 31, the moisture absorption adhesive layer 32, and the second filling adhesive layer 33. The first filling adhesive layer 31 and the second filling adhesive layer 33 contain a filling material, and the moisture absorption adhesive layer 32 contains a moisture absorption material.

The adhesive layer 30 bonds the substrate 10 on which the organic light-emitting device 20 is formed with the encapsulation substrate 40 and at the same time has a moisture absorbing/adsorption property and a barrier property against external moisture, thereby absorbing moisture from the outside. Since it contains a blocking filler material, it protects the organic light emitting device 20 from moisture and improves its lifespan.

The first filling adhesive layer 31, the moisture absorption adhesive layer 32, or the second filling adhesive layer 33 may be prepared from a composition obtained by mixing a thermosetting resin or a photocurable resin with a filling material or a moisture absorption material. The composition will be described later.

When the first filling adhesive layer 31, the moisture absorption adhesive layer 32, and the second filling adhesive layer 33 are all made from a composition containing the same kind of thermosetting resin or photocurable resin, the adhesive layer 30 is formed from the first filling adhesive layer 31 ), it may be formed as one sheet that does not form an interlayer interface between the moisture absorbing adhesive layer 32 and the second filling adhesive layer 33.

The moisture absorbing material that may be included in the moisture absorbing adhesive layer 32 may be any getter material that readily reacts with active gases such as moisture and oxygen so that the active gas does not harm the organic light-emitting device 20. For example, a desiccant, which is a type of getter material that removes moisture, can be used. These hygroscopic substances can be referred to as particles or mediators having properties capable of absorbing and adsorbing moisture and oxygen, and any kind of material having properties capable of absorbing and adsorbing moisture and oxygen can be used, and the type is limited. It doesn't work.

Hygroscopic substances are, for example, Silica gel (SiO ₂ H ₂ O), alumino-silicate beads, clay such as montmorillonite, zeolite as a molecular sieve: Na ₁₂ AlO ₃ SiO ₂ ·12H ₂ O), activated carbon, alkali metal oxide, alkaline earth metal oxide, metal sulfate, metal halide and metal perchlorate, or a combination of at least one thereof.

More specifically, the alkali metal oxide may be lithium oxide (Li ₂ O), sodium oxide (Na ₂ O), or potassium oxide (K ₂ O), and the alkaline earth metal oxide is barium oxide (BaO), calcium oxide (CaO), magnesium oxide (MgO), etc., and the metal sulfate is lithium sulfate (Li ₂ SO ₄ ), sodium sulfate (Na ₂ SO ₄ ), calcium sulfate (CaSO ₄ ), magnesium sulfate (MgSO ₄ ), cobalt sulfate (CoSO ₄ ), gallium sulfate (Ga ₂ (SO ₄ ) ₃ ), titanium sulfate (Ti(SO ₄ ) ₂ ), nickel sulfate (NiSO ₄ ), etc., and the metal halide is calcium chloride (CaCl ₂ ), chloride Magnesium (MgCl ₂ ), strontium chloride (SrCl ₂ ), yttrium chloride (YCl ₃ ), copper chloride (CuCl ₂ ), cesium fluoride (CsF), tantalum fluoride (TaF ₅ ), niobium fluoride (NbF ₅ ), bromination Lithium (LiBr), calcium bromide (CaBr ₂ ), cerium bromide (CeBr ₃ ), selenium bromide (SeBr ₄ ), vanadium bromide (VBr ₃ ), magnesium bromide (MgBr ₂ ), barium iodide (BaI ₂ ), magnesium iodide ( MgI ₂ ), and the like, and the metal perchlorate may be barium perchlorate (Ba(ClO ₄ ) ₂ ), magnesium perchlorate (Mg(ClO ₄ ) ₂ ), and the like, but is not limited thereto.

Silica gel is an amorphous silica made from sodium silicate and sulfuric acid. It exhibits an excellent adsorption amount of about 40 wt% based on the weight of water. It has a large adsorption capacity below about 25°C, and when the temperature increases, the adsorption capacity decreases to a similar degree to that of clay. Corrosive, non-degradable, non-water-soluble, easy to handle, inexpensive, and does not cause contamination problems, so it is used most widely.

Montmorillonite or montmorillonite is a natural product. It is an adsorbent made of magnesium aluminum silicate in the form of subbentonite through a drying process, and is usually in the form of beads. The ability is also inferior to silica gel, but it has the advantage of being the cheapest.

Zeolite has a micro-sphere structure of a crystal network structure and has a very large specific surface area of about 700 to about 800 m ² per gram, so that moisture can be transferred to the product in the package by increasing the temperature such as silica gel or clay. It has the advantage of not being released, but has the disadvantage of being relatively expensive.

Activated carbon has a very large specific surface area of about 200 to about 1200 m ² per gram, so it has excellent adsorption ability, but it has product contamination and is rarely used as a desiccant for general use.

Among alkaline earth metal oxides, calcium oxide is an annealed or recalcinated lime that has a moisture adsorption capacity of about 28.5 wt% or less, and has moisture adsorption capacity even at very low relative humidity. It is mainly used for dehumidifying food packaging.

Among the metal sulfates, calcium sulfate is commercially known as dryrite, and is manufactured by dehydrating gypsum, is chemically stable, is non-disintegrating, non-toxic, and non-corrosive, and does not release moisture once adsorbed even when the temperature rises. Although it has the advantage of not being used, it is mainly used only in a limited range because of the disadvantage that the moisture adsorption capacity is as low as about 10 wt%.

The filling material that can be used for the first filling adhesive layer 31 and the second filling adhesive layer 33 implements barrier properties against moisture. Any type may be used as long as it can act as a filler having barrier properties in the adhesive layer 30 of the filling material, and specific examples include talc, silica, magnesium oxide, mica, montmorillonite, alumina, It may be graphite, beryllium oxide, aluminum nitride, silicon carbide, mullite, silicon, or a combination thereof, but is not limited thereto. Such a filling material may be a synthetically produced particle or a rough stone processed particle.

The filling material contained in the resin composition for the filling adhesive layer of the first filling adhesive layer 31 and the second filling adhesive layer 33 is evenly dispersed inside the composition after curing, thereby dispersing the stress acting on the composition to strengthen the adhesive force. In addition, there is an effect of effectively blocking moisture that penetrates and diffuses into the composition so that moisture does not pass through the first filling adhesive layer 31 or the second filling adhesive layer 33 and diffuse toward the organic light-emitting device 20.

The particle diameter of the hygroscopic material may be about 10 nm to about 20 μm. For example, the moisture absorbing material may have an average particle diameter of about 10 nm to 100 nm.

The particle diameter of the filling material may be about 10 nm to about 20 μm. For example, the average particle diameter of the filling material may be about 10 nm to 100 nm. For another example, the average particle diameter of the filling material may be about 2um to 5um.

The moisture absorbing material or the filling material may be a mesoporous type, a plate type, a spherical shape, a rod type, a fiber type, a core-shell type, and the like, and are not limited thereto.

The first filling adhesive layer 31 or the second filling adhesive layer 33 may include 5 to 50 parts by weight of a hygroscopic material relative to 100 parts by weight of a thermosetting resin or a photocurable resin. When the filling material is included in an amount in the range of about 5 to about 50 parts by weight relative to 100 parts by weight of the thermosetting resin or photocurable resin, it is preferable in that a barrier property against moisture permeation can be improved.

The hygroscopic adhesive layer 32 may include about 5 to about 50 parts by weight of a hygroscopic material relative to 100 parts by weight of a thermosetting resin or a photocurable resin.

The thickness of the adhesive layer 30 may be about 5 um to about 50 um. For example, the thickness of the adhesive layer 30 may be 10um, 20um, or 30um. When the thickness of the adhesive layer 30 is within the above range, it may be advantageous in securing adhesive properties without being affected by a surface level difference.

The first filling adhesive layer 31, the moisture absorption adhesive layer 32, and the second filling adhesive layer 33 may have a thickness ratio of about 0.1 to about 1.2: about 0.1 to about 1.2: about 0.1 to about 1.2. For example, each layer can be made in a ratio of 1:1:1. When the thickness ratio is within the above range, it may be advantageous for securing adhesive properties without being affected by surface steps.

The organic light emitting display device 100 may improve the reliability of the organic light emitting element 20 by including the adhesive layer 30. When the material of the encapsulation substrate is not glass, moisture, etc., are mixed through the defective part of the pores formed by pin-holes and particles, and such moisture is absorbed or adsorbed in the moisture absorbing adhesive layer in the adhesive layer 30, or the filling adhesive layer The organic light-emitting device 20 can be protected by blocking at.

In general, a getter may be applied to the outer portion to protect the organic light-emitting device 20 from moisture mixed from the outside, and the organic light-emitting display device 100 can omit this, thereby shortening the process. I can. In addition, if the getter formation process is omitted, the getter line may not be formed in the outer portion, thereby securing a margin and reducing the bezel.

When the adhesive layer 30 is formed in a sandwich structure of the first filling adhesive layer 31, the moisture absorbing adhesive layer 32, and the second filling adhesive layer 33, the moisture absorbing adhesive layer 32 is transferred from the encapsulation substrate 40 to the organic light emitting device ( 20), while effectively blocking moisture mixed in the side, the filling adhesive layers 31 and 33 can adhere to the substrate 10, the organic light emitting device 20, the encapsulation substrate 40, and the like while maintaining the adhesive strength. That is, the adhesive layer 30 effectively blocks moisture mixed toward the organic light-emitting device 20 without reducing adhesive properties, thereby improving the reliability of the organic light-emitting device 20 and improving the lifespan.

The first filling adhesive layer 31, the moisture absorbing adhesive layer 32, and the second filling adhesive layer 33 may be prepared from a composition containing a filling material or a composition containing a moisture absorbing material, as described above. Such a first filling adhesive layer As described above, the composition for manufacturing the (31), the moisture absorbing adhesive layer 32 and the second filling adhesive layer 33 may include a thermosetting resin or a photocurable resin. In addition, the composition may contain additives such as a thermal curing agent, a curing accelerator, a coupling agent, a spacer, a photoacid generator, a radical initiator, or a combination thereof, as necessary, and further includes a solvent.

When the composition for manufacturing the first filling adhesive layer 31, the moisture absorbing adhesive layer 32 and the second filling adhesive layer 33 is made of a thermosetting resin composition, a thermosetting resin, a thermosetting agent, a curing accelerator, a coupling agent, an antioxidant and a solvent It may include, and further includes a hygroscopic material or a filling material in addition to this.

As said thermosetting resin, an epoxy resin is mentioned, for example. The epoxy resin may be exemplified by bisphenol-based, ortho-cresol novolac-based, polyfunctional epoxy, amine-based epoxy, heterocycle-containing epoxy, substituted epoxy, and naphthol-based epoxy, specifically, bisphenol A Type epoxy resin, bisphenol F type epoxy resin, hydrogenated bisphenol type epoxy resin, alicyclic epoxy resin, aromatic epoxy resin, novolak type, dicyclopentadiene type epoxy resin, etc., and the compounds having these epoxy groups are either alone or It can be mixed and used. As an epoxy resin, currently commercially available products include Epiclon 830-S, Epiclon EXA-830CRP, Epiclon EXA 850-S, Epiclon EXA-850CRP, Epiclon EXA-835LV, Yucca Shell Epoxy Co., Ltd.'s Epicoat 807, Epicoat 815, Epicoat 825, Epicoat 827, Epicoat 828, Epicoat 834, Chepicoat 1001, Epicoat 1004, Epicoat 1007, Epicoat 1009, Dow Chemical's DER-330 , DER-301, DER-361, Kukdo Chemical's YD-128 and YDF-170, and Kukdo Chemical's YDCN-500-1P, YDCN-500-4P, and YDCN-500-5P as the ortho cresol novolak system. , YDCN-500-7P, YDCN-500-80P, YDCN-500-90P, Japan Explosives Corporation's EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1025, EOCN-1027, etc. Polyfunctional epoxy resins include Yuka Shell Epoxy Co., Ltd. Epon 1031S, Chivas Specialty Chemical Co., Ltd. Araldito 0163, Naga Celsius Temperature Chemical Co., Ltd. Detacol EX-611, Detacol EX-614, Detacol EX-614B, Detacol EX -622, Detacol EX-512, Detacol EX-521, Detacol EX-421, Detacol EX-411, Detacol EX-321, etc. As amine-based epoxy resins, Yuka Shell Epoxy Co., Ltd. Epicoat 604, Dokdo YH-434 of Chemical Co., Ltd., TETRAD-X and TETRAD-C of Mitsubishi Gas Chemical Co., Ltd., ELM-120 of Sumitomo Chemical Co., Ltd., and the heterocycle-containing epoxy resin include PT-810 of Chiba Specialty Chemical Co., Ltd., substitution type. For epoxy, UCC's ERL-4234, ERL-4299, ERL-4221, ERL-4206, and naphthol-based epoxy are Epiclon HP-4032, Epiclon HP-4032D, Epiclon HP-4700, Epiclon of Japan Ink Chemical. Clone 4701, etc., and these can be used alone or in two or more It can be mixed and used. In order to obtain excellent film coating properties, phenoxy resin can be applied, and high molecular weight resins such as Epicoto 1256 from JER, PKHH from Inchem, and YP-70 from Totokasei can be applied.

The heat curing agent may be used as long as it can be used to heat cure the epoxy resin, and is not particularly limited. Specific examples include polyamine-based curing agents such as diethylenetriamine, triethylenetetramine, N-aminoethylpiperazine, diaminodiphenylmethane, and adipic acid dihydrazide; Acid anhydride curing agents such as phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, and methylnadic anhydride; Phenol novolak type curing agent; Polymercaptan curing agents such as trioxane tristyrene mercaptan; Tertiary amine compounds such as benzyldimethylamine and 2,4,6-tris(dimethylaminomethyl)phenol; Imidazole compounds, such as 2-methylimidazole, 2-ethyl-4-methylimidazole, and 1-benzyl-2-methylimidazole, etc. can be used. In addition, other solid dispersion type latent hardeners, latent hardeners enclosed in microcapsules, and the like can also be used.

When using an amine-based curing agent, preferably, the amine-based curing agent is an aliphatic amine, a modified aliphatic amine, an aromatic amine, a secondary amine or a tertiary amine, for example, benzyldimethylamine, triethanolamine , Triethylene tetramine, diethylenetriamine, triethyleneamine, dimethylaminoethanol, tri(dimethylaminomethyl)phenol, etc. can be used, and at the end groups -OH, -COOH, -SO ₃ H, -CONH ₂ , -CONHR (R represents an alkyl group), -CN(CN)NH ₂ , -SO ₃ NH ₂ , -SO ₃ NHR (R represents an alkyl group), or a curing agent having -SH can be used. R is a C1-C10 alkyl group, which means a linear or branched saturated hydrocarbon group having 1 to 10 carbon atoms, and is preferably a C1-C4 straight or branched chain alkyl group, specifically methyl, ethyl, n-propyl, isopropyl, Isobutyl, n-butyl and t-butyl and the like.

In the case of using an imidazole-based curing agent, imidazole, isoimidazole, 2-methyl imidisol, 2-ethyl-4-methylimidisol, 2,4-dimethylimidisol, butylimidisol, 2-heptade Senyl-4-methylimidisol, 2-methylimidisol, 2-undesenylimidisol, 1-vinyl-2-methylimidisol, 2-n-heptadecylimidisol, 2-undecyl Midisol, 2-heptadecylimidisol, 2-phenylimidisol, 1-benzyl-2-methylimidisol, 1-propyl-2-methylimidisol, 1-cyanoethyl-2-methyl Midisol, 1-cyanoethyl-2-ethyl-4-methylimidisol, 1-cyanoethyl-2-undecylimidisol, 1-cyanoethyl-2-phenylimidisol, 1-gu Anaminoethyl-2-methylimidisol, adduct product of imidazole and methylimidisol, adduct product of imidazole and trimellitic acid, 2-n-heptadecyl-4-methylimidisol, phenylimidisol , Benzylimidisol, 2-methyl-4,5-diphenylimidisol, 2,3,5-triphenylimidisol, 2-styrylimidisol, 1-(dodecylbenzyl)-2- Methylimidisol, 2-(2-hydroxyl-4-t-butylphenyl)-4,5-diphenylimidisol, 2-(2-methoxyphenyl)-4,5-diphenylimidisol ,2-(3-hydroxyphenyl)-4,5-diphenylimidisol, 2-(p-dimethyl-aminophenyl)-4,5-diphenylimidisol, 2-(2-hydroxyphenyl )-4,5-diphenylimidisol, di(4,5-diphenyl-2-imidisol)-benzene-1,4, 2-naphthyl-4,5-diphenylimidisol, 1- Benzyl-2-methylimidisol, 2-p-methoxystyrylimidisol, and the like can be used.

The acid anhydride curing agent is an epoxy resin, and is suitable when a hybrid epoxy resin containing siloxane is used.

Preferably, the acid anhydride as the curing agent is phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methylnadic anhydride, nadic anhydride, glutaric anhydride. Anhydride, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride or 5-(2,5-dioxotetrahydro)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride.

As the curing accelerator, a quaternary ammonium salt, a quaternary sulfonium salt, various metal salts, imidazole, tertiary amine, and the like can be used. Specific examples include tetramethyl ammonium bromide, tetrabutylammonium bromide as the quaternary ammonium salt, tetraphenyl phosphonium bromide, tetrabutylphosphonium bromide as the quaternary sulfonium salt, and zinc octylate and tin octylate as the metal salt, and imidazole as Examples of tertiary amines such as 1-benzyl-2-methyl imidazole, 1-benzyl-2-phenyl imidazole, and 2-ethyl-4-methyl imidazole include benzyl dimethyl amine.

Boron-based hardening accelerators include phenyl boronic acid, 4-methylphenylboronic acid, 4-methoxyphenyl boronic acid, and 4-trifluorome. 4-trifluoromethoxyphenyl boronic acid, 4-tert-butoxyphenyl boronic acid, 3-fluoro-4-methoxyphenyl boronic acid (3-fluoro -4-methoxyphenyl boronic acid), pyridinetriphenylborane, 2-ethyl-4-methyl imidazolium tetraphenylborate, 1,8-diazabicyclo[ 5.4.0]undecene-7-tetraphenylborate (1,8-diazabicyclo[5.4.0]undecene-7-tetraphenylborate), 1,5-diazabicyclo[4.3.0]nonene-5-tetraphenylborate (1,5-diazabicyclo[4.3.0]nonene-5-tetraphenylborate), lithium triphenyl (n-butyl) borate, etc., and the imidazole-based hardening accelerator is 2- 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole -4-methylimidazole), 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole (1 -benzyl-2-phenylimidazole), 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyano Ethyl-2-e Tyl-4-methylimidazole (1-cyanoethyl-2-ethyl-4-methylimid azole), 1-cyanoethyl-2-undecylimidazole (1-cyanoethyl-2-undecylimidazole), 1-cyano Ethyl-2-phenylimidazole (1-cyanoethyl-2-phenylimidazole), 1-cyanoethyl-2-undecylimidazolium trimellitate (1-cyanoethyl-2-undecylimidazolium-trimellitate), 1-cyano Ethyl-2-phenylimidazolium trimellitate (1-cyanoethyl-2-phenylimidazolium-trimellitate), 2,4-diamino-6[2'-methylimidazoyl-(1')-ethyl-s-tri Azine (2,4-diamino-6-[2'-methylimidazoly-(1')]-ethyl-s-triazine), 2,4-diamino-6-[2'-undecylimidazoyl-(1 ')]-Ethyl-s-triazine (2,4-diamino-6-[2'-undecylimidazoly-(1')]-ethyl-s-triazine), 2,4-diamino-6-[2' -Ethyl-4'-methylimidazoyl-(1')]-ethyl-s-triazine (2,4-diamino-6-[2'-ethyl-4'-methylimidazoly-(1')]-ethyl -striazine), 2,4-diamino-6-[2'-methylimidazoli-(1')]-ethyl-s-triazine isocyanuric acid derivative dihydrate (2,4-diamino-6- [2'-methylimidazoly-(1')]-ethyl-s-triazine isocyanuric acid adduct dihydrate), 2-phenylimidazole isocyanuric acid adduct, 2-methylimidazole iso Cyanuric acid derivative dihydrate (2-methylimidazole isocyanuric acid adduct dihydrate), 2-phenyl-4,5-dihydroxymethylimidazole (2-phenyl-4,5-dihydroxymethylimidazole), 2-phenyl-4-methyl -5-hydroxymethylimidazole (2-pheny l-4-methyl-5-hydroxymethylimidazole), 2,3-dihyro-1H-pyrrolo[1,2-a]benzimidazole), 2,3-dihyro-1H-pyrrolo[1,2-a]benzimidazole ), 4,4'-methylene bis (2-ethyl-5-methylimidazole (4,4'-methylene bis (2-ethyl-5-methylimidazole), 2-methylimidazoline), 2-phenylimidazoline, 2,4-diamino-6-vinyl-1,3,5-triazine (2,4-diamino-6-vinyl-1,3,5-triazine) , 2,4-diamino-6-vinyl-1,3,5-triazine isocyanuric acid adduct, 2, 4-diamino-6-methacryloyloxylethyl-1,3,5-triazine isocyanuric acid derivative (2,4-diamino-6-methacryloyloxylethyl-1,3,5-triazineisocyanuric acid adduct), 1- (2-cyanoethyl)-2-ethyl-4-methylimidazole (1-(2-cyanoethyl)-2-ethyl-4-methylimidazole), 1-cyanoethyl-2-methylimidazole (1 -cyanoethyl-2-methylimidazole), 1-(2-cyanoethyl)2-phenyl-4,5-di(cyanoethoxymethyl)imidazole (1-(2-cyanoethyl)2-phenyl-4,5 -di-(cyanoethoxymethyl)imidazole), 1-acetyl-2-phenylhydrazine, 2-ethyl-4-methylimidazoline,2- Benzyl-4-methyldiimidazoline (2-benzyl-4-methyl dimidazoline), 2-ethyl imidazoline, 2-phenyl imidazole (2-pheny imidazole), 2-phenyl-4 ,5-dihydroxymethylimidazole (2-phenyl-4,5-dihydroxymethylimid azole), melamine, dicyandiamide, and the like, and these may be used alone or in combination of two or more.

Examples of the coupling agent include a silane coupling agent, a titanate coupling agent, an aluminate coupling agent, and a silicone compound, and these coupling agents may be used alone or in combination. When the coupling agent is included, it has the effect of improving the adhesion of the resin composition and reducing the viscosity, and is about 0.001 to about 5 parts by weight, preferably about 0.01 to about 3 parts by weight based on 100 parts by weight of the thermosetting resin in the thermosetting resin composition. It is recommended to be included in parts by weight.

The silane coupling agent functions as an adhesion promoter to improve adhesion between the surface of inorganic materials such as silica and resins in the composition. As the silane coupling agent, an epoxy-containing silane or a mercapto-containing silane may be used. As the epoxy-containing agent, 2-(3,4 epoxy cyclohexyl)-ethyltrimethoxysilane, 3-glycidoxytrime There are oxysilane, 3-glycidoxypropyltriethoxysilane, and 3-glycidoxypropyltriethoxysilane, which contain an amine group, and N-2 (aminoethyl) 3-amitopropylmethyldimethoxysilane, N -2(aminoethyl)3-aminopropyltrimethoxysilane, N-2(aminoethyl)3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3 -Triethoxysili-N-(1,3-dimethylbutylidene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, and containing mercapto, 3-mercaptopropylmethyldimethoxy Silane, 3-mercaptopropyltriethoxysilane, and 3-isocyanate propyltriethoxysilane containing isocyanate may be exemplified, and may be used alone or in combination of two or more.

The antioxidant is intended to further improve the heat resistance stability of the cured product by preventing oxidation deterioration during thermal curing of the thermosetting resin composition. As the antioxidant, a phenol-based, sulfur-based, phosphorus-based antioxidant, or the like can be used. Specific examples include phenolic antioxidants such as dibutyl hydroxytoluene and 2,6-di-tetra-butyl-p-cresol (hereinafter referred to as BHT), sulfur-based antioxidants such as mercaptopropionic acid derivatives, and triphenylphosphite. And phosphorus antioxidants such as 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (hereinafter, HCA), and the like, and the antioxidants alone or in combination of two or more The thermosetting resin composition may be used in an amount of about 0.001 to about 5 parts by weight, preferably about 0.01 to about 0.5 parts by weight, based on 100 parts by weight of the thermosetting resin.

When the composition for manufacturing the first filling adhesive layer 31, the moisture absorbing adhesive layer 32 and the second filling adhesive layer 33 is prepared with a photocurable resin composition, a photocurable epoxy resin, a photoinitiator, a coupling agent, a spacer, a photoacid generator, a radical A generator and a solvent may be included, and a filler material or a moisture absorbing material may be further included therein.

As the photocurable epoxy resin applicable to the photocurable resin composition, a universally used aromatic epoxy resin, an alicyclic epoxy resin, or a mixture thereof may be used. As the aromatic epoxy resin, biphenyl type, bisphenol A type, bisphenol F type, phenol novolak type, dicyclopentadiene type, epoxy resin, etc. may be used, and a mixture thereof may be used.

The photoinitiator is not particularly limited as long as it can cure the epoxy resin by light. Specific examples of the photoinitiator include aromatic diazonium salts, aromatic sulfonium salts, aromatic iodine aluminum salts, aromatic sulfonium aluminum salts, metallocene compounds, and iron array compounds. Preferably, an aromatic sulfonium salt may be used, and specific examples thereof include an aromatic sulfonium hexafluoro phosphate compound and an aromatic sulfonium hexafluoro antimonate compound.

The coupling agent may be used alone or in combination with a silane-based or titanium-based coupling agent and a silicone compound. Preferably, a silane coupling agent containing alkoxysilane and diglycidyl ether in one molecule is good.

The spacer is not particularly limited as long as it is capable of maintaining a constant thickness of the panel after curing, and it is preferable to maintain the thickness of the panel at about 5 to 50 um, preferably about 5 to 25 um. The shape of the spacer may be a spherical shape or a log shape, and the shape of the spacer is not particularly limited as long as the thickness of the panel can be kept constant.

The photoacid generator is not particularly limited as long as it is capable of generating Lewis acid or Bronsted acid by exposure, and sulfide salt compounds such as organic technology phonic acid, and onium compounds such as onium salt may be used. Preferably, phthalimido trifluoromethanesulfonate, dinitrobenzyltosylate, n-decyldisulfone, naphthylimidotrifluoromethanesulfonate, diphenyl iodo salt, hexafluorophosphate, diphenyl iodo salt, hexafluoro Loarsenate, diphenyliodosate, hexafluoroantimonate, diphenylparamethoxyphenylsulfonium triflate, diphenylparatoluenylsulfonium triflate, diphenylparaisobutylphenylsulfonium triflate, triphenyl Sulfonium hexafluoro arsenate, triphenylsulfonium hexafluoro antimonate, triphenylsulfonium triflate, dibutylnaphthylsulfonium triflate, and mixtures thereof can be used.

The radical initiator may be used with a photoacid generator, and the radical polymerization initiator used in the curable resin composition is a radical photopolymerization initiator that generates radicals by decomposing by electromagnetic energy rays such as UV rays, or decomposed by heat. It may be a thermally decomposable radical polymerization initiator that generates radicals. Examples of the radical photopolymerization initiator include acetophenone derivatives such as 2-hydroxy-2-methylpropiophenone and 1-hydroxycyclohexyl phenyl ketone; Acylphosphine oxide derivatives such as bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide; And type I alpha cleavage initiators such as benzoin methyl ether and benzoin ether derivatives such as benzoin ethyl ether. Representative commercially available radical photoinitiators include IRGACURE 651, IRGACURE 184, IRGACURE 907, DAROCUR 1173 and IRGACURE 819 manufactured by Ciba Speciality Chemical. Type II photoinitiators can also be used, and compounds such as benzophenone, isopropylthioxanthone, and anthroquinone are exemplified. Various substituted derivatives of these basic compounds can also be used. As thermally decomposable radical polymerization initiators, 1,1,3,3-tetramethylbutylperoxy-2-ethyl-hexanoate, 1,1-bis(t-butylperoxy)cyclohexane, 1,1 -Bis(t-butylperoxy)cyclo-dodecane, di-t-butylperoxyisophthalate, t-butylperoxybenzoate, dicumylperoxide, t-butylcumylperoxide, 2,5-dimethyl-2 Peroxides such as ,5-di(t-butylperoxy)hexane, 2,5-dimethyl-2,5-di(t-butylperoxy)-3-hexine and cumene hydroperoxide. The amount of the radical polymerization initiator is an effective amount, for example, in the range of about 0.01 to about 5 parts by weight based on 100 parts by weight of the photocurable resin in the photocurable resin composition.

Solvents that can be used in the composition for preparing the first filling adhesive layer 31, the moisture absorption adhesive layer 32 and the second filling adhesive layer 33 are methyl ethyl ketone (MEK), tetrahydrofuran (THF), toluene, etc., and form a film Any solvent capable of preparing the crude solution for the following is not particularly limited, and one or multiple solvents may be mixed and used to obtain excellent coating properties.

The first filling adhesive layer 31, the moisture absorbing adhesive layer 32, and the second filling adhesive layer 33 were applied to the base film 111 and 112, dried to form a sheet, and then laminated to form an adhesive layer 30. It may be manufactured, and the manufacturing method is not particularly limited, and may be variously manufactured according to a known method. If the properties can be realized by forming a sheet, it may be prepared in a gel or solid state in an uncured state, or may be prepared in a liquid state for post-treatment. The lamination method of forming an adhesive layer by laminating the respective prepared moisture absorbing adhesive sheet and the filling adhesive sheet may be performed according to a known method, and is not limited to a specific method. For example, by sequentially laminating a moisture-absorbing adhesive sheet, a filling adhesive sheet, and a moisture-absorbing adhesive sheet by a roll to roll, roll to glass, press bonding or diaphragm process, the adhesive layer ( 30) can be prepared so that each sheet forms a moisture absorbing adhesive layer or a filling adhesive layer.

2 is a schematic diagram showing a method of forming an adhesive layer 130 according to another embodiment. First, a moisture absorbing adhesive sheet is formed by applying a composition for forming a moisture absorbing adhesive layer including a moisture absorbing material on the base film 111. On the other hand, a filling adhesive sheet is formed by applying a filling adhesive layer-forming composition including a filling material to the other base film 112. The hygroscopic adhesive sheet and the filling adhesive sheet prepared as described above are laminated. The laminated moisture-absorbing adhesive sheet and filling adhesive sheet are laminated by a roll to roll, roll to glass, press bonding or diaphragm process to prepare the adhesive layer 130.

In this way, by using the adhesive layer 130 as one integral sheet, it is possible to obtain a process advantage and a structural advantage.

3 is a cross-sectional view illustrating an organic light emitting diode display 200 manufactured using the adhesive layer 130 manufactured as in FIG. 2.

In the organic light-emitting display device 200 of FIG. 3, a driving circuit unit DC and an organic light-emitting device 120 are formed on a substrate 110. The driving circuit unit DC drives the organic light emitting element 120. The organic light-emitting device 120 and the driving circuit unit DC are not limited to the structure shown in FIG. 3, and experts in the relevant technical field can easily It can be formed into various structures within the range that can be modified. For example, it can be manufactured by forming the adhesive layer 130 on a TFT substrate. The substrate 110 on which the organic light emitting device 120 is formed and the encapsulation substrate 140 are bonded together using the adhesive layer 130 prepared as in FIG. 2. The bonding method may be performed according to a known method and is not limited to a specific method, and a specific example may be a lamination process, a press process, or a diaphragm process.

In another embodiment of the present invention, forming an organic light emitting device on a substrate; Forming an adhesive layer by sequentially laminating a first filling adhesive layer, a filling adhesive layer, and a second filling adhesive layer: and bonding the organic light-emitting device to the substrate and the encapsulation substrate via the adhesive layer. Provides a device manufacturing method.

The present invention will be described in more detail through the following examples. However, the following examples are for illustrative purposes only and do not limit the scope of the present invention.

Example

Example 1

Epoxy resin EXA-835LV (Japan Ink Co., Ltd.) 30 parts by weight, phenoxy resin Epicoat-1256 (Japan Epoxy Co., Ltd.) 45 parts by weight, heat curing agent C11Z-CNS (Shikoku) 5 parts by weight, CaO (UBE) ( Particle diameter: about 1 to 2 um) 20 parts by weight and 100 parts by weight of an organic solvent MEK were mixed to prepare a composition for a moisture-absorbing adhesive layer, and then applied to a base film of PET at 20 μm to prepare a moisture-absorbing adhesive sheet.

On the other hand, 30 parts by weight of epoxy resin EXA-835LV (Japan Ink), 45 parts by weight of phenoxy resin Epicoat-1256 (Japan Epoxy), 5 parts by weight of thermal curing agent C11Z-CNS (Shikoku), Talc D- 1000 (Nippon talc company) (particle diameter: about 1 to 2 um) 15 parts by weight, silane coupling agent KBM-403 (Shin-Etsu Corporation), organic solvent MEK 100 parts by weight to prepare a composition for a filling adhesive layer, and then on the base film of PET A filling adhesive sheet was prepared by applying at 20um.

The moisture absorbing adhesive sheet and the filling adhesive sheet formed on each of the PET substrate films are laminated and laminated through a laminating process, and the PET substrate film on the filling adhesive sheet side is removed. The moisture-absorbing adhesive sheet formed on the PET base film is re-laminated on the surface of the filled-adhesive sheet exposed after the PET base film has been removed, and laminated in a laminating process to form an adhesive layer laminated with three layers of a moisture-absorbing adhesive layer-filling adhesive layer-absorbing adhesive layer, and PET Remove the base film.

On the other hand, an organic light-emitting device was formed on a glass substrate, and the prepared adhesive layer was interposed between the glass encapsulation substrates to cover the organic light-emitting device, and bonded with a diaphragm at a pressure of 60 Kpa to manufacture an organic light-emitting display.

Example 2

In Example 1, an organic light emitting diode display was manufactured according to the same method, except that 25 parts by weight of CaO and 20 parts by weight of Talc were used.

Example 3

In Example 1, an organic light-emitting display device was manufactured according to the same method except that 30 parts by weight of CaO and 25 parts by weight of Talc were used.

Comparative Example 1

In Example 1, an organic light emitting display device was manufactured by fabricating an adhesive layer composed of only the filling adhesive layer except for the moisture absorption adhesive layer to have the same thickness.

Experimental Example 1: Life test

The organic light emitting display device manufactured in Examples 1 to 3 and Comparative Example 1 was placed in an 85° C. 85% RH (relative humidity) chamber (TH-TG_Jeotech) and observed the light emitting part over time to measure the time until the occurrence of dark spots As described in Table 1 below.

Experimental Example 2: Water permeability

Water permeability (WVTR: Water vapot transmission rate) was measured for the adhesive layers in the form of films prepared in Examples 1 to 3 and Comparative Example 1 (measuring instrument: permatran3/33ma manufactured by mocon).

Experimental Example 3: Adhesive Strength

For the adhesive layers prepared in Examples 1 to 3 and Comparative Example 1, two specimens were stacked and bonded in a cross shape, and then the strength for detaching both specimens was measured using UTM (Instron model-5900). The adhesive strength was measured.

Example 1 Example 2 Example 3 Comparative Example 1 WVTR
(g/m ² ) 8 7 5 10 Adhesive strength
(kgf/cm ² ) 23 23 23 23 Dark spot occurrence time
(time) 1,756 1,986 2,135 856

Although the present invention has been described through preferred embodiments as described above, the present invention is not limited thereto, and various modifications and variations are possible without departing from the concept and scope of the following claims. Those in the field of technology to which it belongs will understand easily.

10: substrate 20: organic light emitting device
30: adhesive layer 31: first filling adhesive layer
32: moisture absorption adhesive layer 33: second filling adhesive layer
40: encapsulation substrate 100: organic light emitting display device
110: substrate 111: base film
112: base film 120: organic light emitting element
131: filling adhesive layer 132: moisture absorption adhesive layer
140: encapsulation substrate 200: organic light emitting display device

Claims (14)

A first substrate;
An organic light emitting device formed on the first substrate;
A second substrate formed on the organic light emitting device; And
An adhesive layer formed on the first substrate to cover the organic light-emitting device and bond the first substrate on which the organic light-emitting device is formed to the second substrate
Including,
The adhesive layer is a thermosetting resin or a photocurable resin; And
Including a hygroscopic material dispersed in the thermosetting resin or the photocurable resin,
The particle diameter of the hygroscopic material is 10nm to 20㎛
Organic light emitting display device.
The method of claim 1,
The hygroscopic material is silica gel (SiO ₂ H ₂ O), alumino-silicate beads, montmorillonite, zeolite as a molecular sieve (zeolite: Na ₁₂ AlO ₃ SiO ₂ ·12H ₂ O), activated carbon (activated carbon), alkali metal oxide, alkaline earth metal oxide, metal sulfate, metal halide, and at least one selected from the group consisting of metal perchlorate.
The method of claim 1,
The moisture absorbing material is a mesoporous type, a plate type, a sphere, a rod type, a fiber type, or a core-shell type organic light-emitting display device.
The method of claim 1,
The thickness of the adhesive layer is 5 um to 50 um.
The method of claim 1,
Based on 100 parts by weight of the thermosetting resin or photocurable resin,
The organic light-emitting display device includes 5 to 50 parts by weight of the moisture absorbing material.
A first substrate;
An organic light emitting device formed on the first substrate; A second substrate formed on the organic light emitting device; And
A barrier layer formed on the first substrate to cover the organic light emitting device, and disposed between the first substrate and the second substrate on which the organic light emitting device is formed,
The barrier layer may be a thermosetting resin or a photocurable resin; And
Including a hygroscopic material dispersed in the thermosetting resin or the photocurable resin,
The organic light emitting display device having a particle diameter of the hygroscopic material is 10 nm to 20 μm.
The method of claim 6,
The hygroscopic material is silica gel (SiO ₂ H ₂ O), alumino-silicate beads, montmorillonite, zeolite as a molecular sieve (zeolite: Na ₁₂ AlO ₃ SiO ₂ ·12H ₂ O), activated carbon (activated carbon), alkali metal oxide, alkaline earth metal oxide, metal sulfate, metal halide, and at least one selected from the group consisting of metal perchlorate.
The method of claim 6,
The moisture absorbing material is a mesoporous type, a plate type, a sphere, a rod type, a fiber type, or a core-shell type organic light-emitting display device.
The method of claim 6,
The thickness of the barrier layer is 5 um to 50 um.
The method of claim 6,
Based on 100 parts by weight of the thermosetting resin or photocurable resin,
The organic light-emitting display device includes 5 to 50 parts by weight of the moisture absorbing material.
A first substrate;
An organic light emitting device formed on the first substrate;
A second substrate formed on the organic light emitting device;
And a barrier layer formed on the first substrate to cover the organic light emitting device and disposed between the first substrate and the second substrate on which the organic light emitting device is formed,
The barrier layer is
100 parts by weight of a thermosetting resin or a photocurable resin; And
Including 5 to 50 parts by weight of a hygroscopic material containing calcium oxide (CaO),
The particle diameter of the hygroscopic material is 10nm to 20㎛
Organic light emitting display device.
The method of claim 11,
The moisture absorbing material is a mesoporous type, a plate type, a sphere, a rod type, a fiber type, or a core-shell type organic light-emitting display device.
The method of claim 11,
The thickness of the barrier layer is 5 um to 50 um.
Board;
An organic light-emitting device formed on the substrate;
An encapsulation substrate formed on the organic light-emitting device; And
It is formed on the substrate and covers the organic light emitting device and includes at least one filling layer disposed between the substrate and the encapsulation substrate,
The filling layer,
100 parts by weight of a thermosetting resin or a photocurable resin; And
Including 5 to 50 parts by weight of a hygroscopic substance,
The particle diameter of the hygroscopic material is 10nm to 20㎛
Organic light emitting display device.

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