KR20200132824A - Multi-layered ceramic electronic component and method for manufacturing the same - Google Patents

Abstract

According to an embodiment of the present invention, a method of manufacturing a multilayer ceramic electronic component includes the steps of: preparing a ceramic green sheet; applying an internal electrode paste including a conductive powder on the ceramic green sheet to form the internal electrode pattern; laminating the ceramic green sheets on which the internal electrode patterns are formed to form a ceramic laminate; sintering the ceramic laminate to form a body including a dielectric layer and the internal electrode; and forming an electrode layer on the body and forming an external electrode by forming a conductive resin layer on the electrode layer, wherein the conductive powder includes a conductive metal and Sn, and the Sn content is 1.5wt% or more relative to the conductive metal. According to the present invention, by forming the internal electrode using the conductive powder containing Sn, it is possible to suppress the formation of crystallized carbon residue and suppress the breakage and agglomeration of the internal electrode without problems such as dispersibility.

Description

Multilayer ceramic electronic component and its manufacturing method {MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME}

The present invention relates to a multilayer ceramic electronic component and a method of manufacturing the same.

In general, an electronic component using a ceramic material such as a capacitor, an inductor, a piezoelectric element, a varistor or a thermistor has a body made of a ceramic material, an internal electrode formed inside the body, and an external electrode installed on the body surface to be connected to the internal electrode. .

Among the multilayer ceramic electronic components, the multilayer ceramic capacitor includes a plurality of stacked dielectric layers, internal electrodes disposed opposite to each other with one dielectric layer interposed therebetween, and external electrodes electrically connected to the internal electrodes.

Multilayer ceramic capacitors are widely used as parts of mobile communication devices such as computers, PDAs, and mobile phones due to the advantages of small size, high capacity, and easy mounting.

Recently, the industry's interest in electronic components is increasing, and high reliability and high withstand voltage characteristics are required for multilayer ceramic capacitors for the electronic industry used in automobiles or infotainment systems.

In order to secure high reliability and high withstand voltage characteristics, it is necessary to improve the connectivity of internal electrodes by suppressing breakage and aggregation of internal electrodes.

Conventionally, in order to solve problems such as electrode breakage and electrode aggregation, a method of delaying sintering of conductive powder by dispersing a common material (a ceramic material for delaying sintering of conductive powder) in an internal electrode paste has been developed. Local problems could occur depending on the dispersion state, and a large amount of common materials and organic matter had to be included in order to obtain a sufficient effect.

In addition, some of the organic materials used to achieve the sheet strength remain as malignant xanthan (crystallized residual carbon) when plasticized, causing problems such as aggregation of electrodes and non-uniform sintering of the dielectric layer.

Accordingly, there is a need to develop a method for suppressing the formation of malignant xanthan and improving the breakage and aggregation of internal electrodes without problems such as dispersibility.

One of the objectives of the present invention is to provide a method of manufacturing a multilayer ceramic electronic component having high reliability and high withstand voltage characteristics by suppressing the formation of malignant xanthan and suppressing breakage and aggregation of internal electrodes without problems such as dispersibility. .

According to an embodiment of the present invention, the step of preparing a ceramic green sheet; Forming an internal electrode pattern by applying a paste for internal electrodes including conductive powder on the ceramic green sheet; Laminating the ceramic green sheets on which the internal electrode patterns are formed to form a ceramic multilayer body; Firing the ceramic laminate to form a body including a dielectric layer and internal electrodes; And forming an external electrode by forming an electrode layer on the body and forming a conductive resin layer on the electrode layer, wherein the conductive powder contains a conductive metal and Sn, and the Sn content relative to the conductive metal is It provides a method of manufacturing a multilayer ceramic electronic component having 1.5wt% or more.

In addition, a multilayer ceramic electronic component manufactured by a method of manufacturing a multilayer ceramic electronic component according to an embodiment of the present invention, comprising: a body including a dielectric layer and an internal electrode; And an external electrode disposed on the body and including an electrode layer connected to the internal electrode and a conductive resin layer disposed on the electrode layer. Including, wherein the internal electrode includes a metal grain and a composite layer surrounding the metal grain, the composite layer provides a multilayer ceramic electronic component including Ni and Sn.

According to the present invention, by forming an internal electrode using a conductive powder containing Sn, there is an effect of suppressing the formation of malignant xanthan and suppressing the breakage and aggregation of the internal electrode without problems such as dispersibility.

1 is a schematic diagram of a conductive powder having a core-shell structure according to an embodiment of the present invention.
2 is a graph comparing heat shrinkage behavior according to a change in Sn content compared to a conductive metal.
3 is a schematic view of a ceramic green sheet on which an internal electrode pattern is formed.
4 is a schematic perspective view of a multilayer ceramic electronic component manufactured by a method of manufacturing a multilayer ceramic electronic component according to an exemplary embodiment of the present invention.
5 is a perspective view schematically showing the body of FIG. 4.
6 is a view showing a cross-section along line II′ of FIG. 4.
7 is an enlarged view of a portion P1 of FIG. 6.

Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention may be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. In addition, embodiments of the present invention are provided to more completely explain the present invention to a person skilled in the art. Accordingly, the shapes and sizes of elements in the drawings may be exaggerated for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

In addition, in the drawings, portions not related to the description are omitted in order to clearly describe the present invention, and the thickness is enlarged to clearly express several layers and regions, and components having the same function within the scope of the same idea are the same reference. Describe using symbols. Furthermore, throughout the specification, when a part "includes" a certain component, it means that other components may be further included rather than excluding other components unless otherwise stated.

In the drawings, an X direction may be defined as a second direction or a length direction, a Y direction may be defined as a third direction or a width direction, and a Z direction may be defined as a first direction, a stacking direction, or a thickness direction.

1 is a schematic diagram of a conductive powder having a core-shell structure according to an embodiment of the present invention.

2 is a graph comparing heat shrinkage behavior according to a change in Sn content compared to a conductive metal.

3 is a schematic view of a ceramic green sheet on which an internal electrode pattern is formed.

4 is a schematic perspective view of a multilayer ceramic electronic component manufactured by a method of manufacturing a multilayer ceramic electronic component according to an exemplary embodiment of the present invention.

5 is a perspective view schematically showing the body of FIG. 4.

6 is a view showing a cross-section along the line I-I of FIG. 4.

7 is an enlarged view of a portion P1 of FIG. 6.

Hereinafter, a method of manufacturing a multilayer ceramic electronic component according to an aspect of the present invention and a multilayer ceramic electronic component manufactured thereby will be described in detail with reference to FIGS. 1 to 7.

Method of manufacturing multilayer ceramic electronic components

A method of manufacturing a multilayer ceramic electronic component according to an aspect of the present invention includes: preparing a ceramic green sheet; Forming an internal electrode pattern by applying a paste for internal electrodes including conductive powder on the ceramic green sheet; Laminating the ceramic green sheets on which the internal electrode patterns are formed to form a ceramic multilayer body; Firing the ceramic laminate to form a body including a dielectric layer and internal electrodes; And forming an external electrode by forming an electrode layer on the body and forming a conductive resin layer on the electrode layer, wherein the conductive powder includes a conductive metal and Sn, and the Sn content relative to the conductive metal is It is more than 1.5wt%.

Steps to prepare a ceramic green sheet

A ceramic green sheet including ceramic powder is prepared.

The ceramic green sheet may be prepared by mixing ceramic powder, a binder, a solvent, and the like to prepare a slurry, and the slurry may be manufactured in a sheet form having a thickness of several µm by a doctor blade method. The ceramic green sheet may then be sintered to form one dielectric layer 111 as shown in FIG. 6.

Forming an internal electrode pattern

An internal electrode pattern is formed by applying a paste for internal electrodes including conductive powder on the ceramic green sheet. The conductive powder includes a conductive metal and Sn, and the Sn content is 1.5wt% or more relative to the conductive metal.

The internal electrode pattern may be formed by a screen printing method or a gravure printing method.

Due to the difference in sintering temperature between the internal electrode paste and the ceramic green sheet, various problems such as electrode breakage and electrode aggregation may occur. In particular, in order to secure high reliability and high withstand voltage characteristics, it is necessary to improve the connectivity of the internal electrodes by suppressing the breakage and aggregation of the internal electrodes.

Conventionally, in order to solve problems such as electrode breakage and electrode aggregation, a method of delaying sintering of conductive powder by dispersing a common material (a ceramic material for delaying sintering of conductive powder) in an internal electrode paste has been developed. Local problems could occur depending on the dispersion state, and a large amount of common materials and organic matter had to be included in order to obtain a sufficient effect.

In addition, some of the organic materials used to achieve the sheet strength remain as malignant xanthan (crystallized residual carbon) when plasticized, causing problems such as agglomeration of electrodes and non-uniform sintering of the dielectric layer.

The conductive powder according to an embodiment of the present invention includes a conductive metal and Sn, and the Sn content relative to the conductive metal is 1.5 wt% or more, and since Sn is included in the conductive powder itself, sintering of the conductive powder can be performed regardless of dispersibility. It can be delayed evenly.

In addition, when a conductive powder containing no Sn is used, malignant xanthan (crystallized residual carbon) observed like a thread is generated on the electrode surface, causing problems such as agglomeration of electrodes and non-uniform sintering of the dielectric layer. However, according to an embodiment of the present invention, Sn may suppress the aggregation of conductive metals and suppress generation of malignant xanthan (crystallized residual carbon) due to the role of a catalyst for dehydrogenation of the conductive powder during calcination.

In addition, Sn is not well dissolved in the conductive powder, but it has good wettability with the conductive powder and has a low melting point. As shown in FIG. 7, Sn is crystal grains 121a and 122a of the internal electrodes 121 and 122 in the firing process. The growth of the crystal grains 121a and 122a can be suppressed by forming the composite layers 121b and 122b containing Ni and Sn by being concentrated on the surface of.

Accordingly, according to an embodiment of the present invention, a multilayer ceramic electronic component having high reliability and high withstand voltage characteristics and a multilayer ceramic electronic component having high reliability and high withstand voltage characteristics can be suppressed without problems such as dispersibility while suppressing the formation of malignant xanthan. A manufacturing method can be provided.

Figure 2 is a conductive powder that does not contain Sn (Comparative Example 1), a conductive powder with a Sn content of 0.2 wt% relative to a conductive metal (Comparative Example 2), and a conductive powder with a Sn content of 1.5 wt% in the coating layer compared to the conductive metal (P. This is a graph comparing the heat shrinkage behavior of Honor 1).

Referring to FIG. 2, it can be seen that as the Sn content relative to the conductive metal increases, the shrinkage initiation temperature increases. However, in the case of Comparative Example 2, the Sn content was less than 1.5 wt%, and the effect was insufficient because there was no significant difference in the shrinkage start temperature from Comparative Example 1 that does not contain Sn. On the other hand, in the case of Inventive Example 1 in which the Sn content was 1.5 wt% relative to the conductive metal, it can be seen that the shrinkage initiation temperature was significantly higher than in Comparative Example 1.

Therefore, it is preferable that the Sn content is 1.5 wt% or more compared to the conductive metal. Meanwhile, the upper limit of the Sn content relative to the conductive metal is not particularly limited, but may be 4.0 wt% or less.

At this time, Sn may be included in the conductive powder in the form of an alloy by forming an alloy with the conductive metal, or may be included in the conductive powder in a form coated on the surface of the conductive metal.

Referring to FIG. 1 for a form coated on the surface of the conductive metal, conductive powder has a core-shell structure 10, the conductive metal is included in the core 11, and Sn is the shell ( 12).

The shell 12 may be formed by an atomic layer deposition method.

Atomic Layer Deposition (ALD) is a technology that deposits a thin film or a protective film on the surface of a substrate during a semiconductor process. Unlike conventional deposition techniques that chemically coat a thin film, it is a technology that grows a thin film by stacking atomic layers one by one. The atomic layer deposition method has the advantage of excellent step-coverage, easy control of the thin film thickness, and formation of a uniform thin film.

By forming the shell 12 on the surface of the core 11 by an atomic layer deposition method, a dense and uniform Sn coating layer can be formed.

Meanwhile, the conductive powder may further include at least one selected from the group consisting of Cu, Ag, Pd, Pt, Rh, Ir, Ru, and alloys thereof.

In addition, the conductive powder may further include one or more selected from the group consisting of W, Mo, Cr, Co, and alloys thereof.

Since W, Mo, Cr, and Co have high melting points, they can play a role of further improving the effect of inhibiting the growth of crystal grains by Sn having a low melting point.

In addition, the internal electrode paste may additionally contain S of 300 ppm or less (excluding 0) compared to the content of the conductive powder.

In general, the conductive paste for internal electrodes may contain sulfur (S), which is a shrinkage retarding agent, but if the content is more than 300 ppm, there is a concern that a composite layer including Ni and Sn may be formed unevenly after firing.

Meanwhile, the conductive metal included in the conductive powder may be Ni powder having a higher melting point than that of Sn.

ceramic Laminate Forming steps

A ceramic multilayer body is formed by laminating ceramic green sheets having internal electrode patterns formed thereon.

At this time, it is possible to pressurize the ceramic laminate from the lamination direction and pressurize.

Next, the ceramic multilayer body can be cut into chips for each region corresponding to one capacitor.

In this case, it may be cut so that one end of the internal electrode pattern is alternately exposed through the side surface. Accordingly, as shown in FIG. 3, the ceramic green sheet (a) and the ceramic green sheet (S) in which the internal electrode pattern P1, which becomes the first internal electrode 121, is formed on the ceramic green sheet S after firing. ) After firing, ceramic green sheets b on which the internal electrode patterns P2 that become the second internal electrodes 122 are formed may be alternately stacked.

Body Forming steps

The ceramic laminate is fired to form a body including a dielectric layer and internal electrodes.

The firing process may be performed in a reducing atmosphere. In addition, the firing process may be performed by adjusting the temperature increase rate, but is not limited thereto, and the temperature increase rate may be 30°C/60s to 50°C/60s at 700°C or less.

Forming an external electrode

An electrode layer is formed on the body, and a conductive resin layer is formed on the electrode layer to form an external electrode. An electrode layer may be formed to cover the side of the body and to be electrically connected to the internal electrode exposed to the side of the body.

The electrode layer is formed by applying a paste containing at least one selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof, and a paste containing glass, and the conductive resin layer is formed by applying copper on the electrode layer. It can be formed by applying a paste containing at least one selected from the group consisting of (Cu), silver (Ag), nickel (Ni) and alloys thereof and a base resin.

Thereafter, a plating layer such as nickel or tin may be formed on the surface of the external electrode.

Multilayer Ceramic Electronic Components

The multilayer ceramic electronic component 100 manufactured by the method of manufacturing the multilayer ceramic electronic component according to the exemplary embodiment described above includes: a body 110 including a dielectric layer 111 and internal electrodes 121 and 122; And external electrodes 131 and 132 including electrode layers 131a and 132a disposed on the body 110 and connected to the internal electrodes 121 and 122 and conductive resin layers 131b and 132b disposed on the electrode layer. );, wherein the internal electrodes 121 and 122 include metal crystal grains 121a and 122a and composite layers 121b and 122b surrounding the metal crystal grains 121a and 122a, and the composite layer 121b, 122b) contains Ni and Sn.

In the body 110, dielectric layers 111 and internal electrodes 121 and 122 are alternately stacked.

There is no particular limitation on the specific shape of the body 110, but as shown, the body 110 may have a hexahedral shape or a similar shape. Due to the shrinkage of the ceramic powder included in the body 110 during the firing process, the body 110 may not have a hexahedral shape having a complete straight line, but may have a substantially hexahedral shape.

The body 110 is connected to the first and second surfaces (1, 2) facing each other in the thickness direction (Z direction), the first and second surfaces (1, 2), and is connected to each other in the width direction (Y direction). It is connected to the opposing third and fourth sides (3, 4), the first and second sides (1, 2), connected to the third and fourth sides (3, 4), and is connected to each other in the longitudinal direction (X direction). It may have opposing fifth and sixth surfaces 5 and 6.

5, the distance between the first surface (1) and the second surface (2) is the body thickness (T), and the distance between the third surface (3) and the fourth surface (4) is the body length (L). ), the distance between the fifth surface 5 and the sixth surface 6 may be defined as the width W of the body.

The plurality of dielectric layers 111 forming the body 110 are in a fired state, and the boundary between the adjacent dielectric layers 111 can be integrated so that it is difficult to check without using a scanning electron microscope (SEM). have.

According to an embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient electrostatic capacity can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, or a strontium titanate-based material can be used.

The material forming the dielectric layer 111 may include various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc., in accordance with the object of the present invention, to powder such as barium titanate (BaTiO ₃ ).

In this case, the multilayer ceramic electronic component 100 according to an embodiment of the present invention is disposed inside the body 110 and disposed to face each other with the dielectric layer 111 interposed therebetween. ) And a second internal electrode 122, and a capacitive forming unit in which a capacity is formed, and a cover unit 112 formed above and below the capacitive forming unit.

The cover part 112 does not include the internal electrodes 121 and 122 and may include the same material as the dielectric layer 111. That is, the cover 112 may include a ceramic material, for example, a barium titanate-based material, a lead composite perovskite-based material, or a strontium titanate-based material.

The cover unit 112 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the capacitor forming unit in the upper and lower directions, and fundamentally, can play a role of preventing damage to the internal electrodes due to physical or chemical stress. have.

Next, the internal electrodes 121 and 122 are alternately stacked with the dielectric layers, and may include first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are alternately disposed to face each other with a dielectric layer 111 constituting the body 110 interposed therebetween, and the third and fourth surfaces 3 and 4 of the body 110 ) Can be exposed respectively.

In this case, the first and second internal electrodes 121 and 122 may be electrically separated from each other by a dielectric layer 111 disposed therebetween.

The conductive paste may be printed using a screen printing method or a gravure printing method, and the present invention is not limited thereto.

The internal electrodes 121 and 122 include metal grains 121a and 122a and composite layers 121b and 122b surrounding the metal grains 121a and 122a, and the composite layers 121b and 122b contain Ni and Sn. Include. The composite layers 121b and 122b including Ni and Sn may have a form that almost completely surrounds at least one metal crystal grain 121a and 122a.

The metal crystal grains 121a and 122a are polyhedra formed by regularly arranging metal atoms. The composite layers 121b and 122b containing Ni and Sn surround the metal crystal grains 121a and 122a. That is, the composite layers 121b and 122b containing Ni and Sn exist in the metal grain boundary. The composite layers 121b and 122b containing Ni and Sn suppress the growth of the metal crystal grains 121a and 122a to the outside, thereby suppressing the internal electrode disconnection phenomenon and suppressing the internal electrode aggregation phenomenon.

When the ratio of the length of the portion where the internal electrodes are formed to the total length of the internal electrodes 121 and 122 is defined as the connectivity (C) of the internal electrodes, the composite layers 121b and 122b containing Ni and Sn are metal By suppressing the growth of the crystal grains 121a and 122a to the outside, the internal electrodes 121 and 122 may satisfy 85%≦C.

The thickness of the composite layers 121b and 122b including Ni and Sn may be 1 to 15 nm.

When the thickness of the composite layers 121b and 122b containing Ni and Sn is less than 1 nm, the growth of metal grains to the outside may not be sufficiently suppressed, and when the thickness of the composite layers 121b and 122b containing Ni and Sn is less than 1 nm, the composite layer containing Ni and Sn ( Since the thicknesses of 121b and 122b) are not uniform, the effect of suppressing the growth of metal grains to the outside may be reduced.

The metal grains 121a and 122a may be Ni grains.

The external electrodes 131 and 132 are disposed on the body 110 and include electrode layers 131a and 132a connected to the internal electrodes 121 and 122 and conductive resin layers 131b and 132b disposed on the electrode layer. .

In this case, the external electrodes 131 and 132 may further include Ni plating layers 131c and 132c formed on the conductive resin layers 131b and 132b and Sn plating layers 131d and 132d formed on the Ni plating layer.

In addition, the external electrodes 131 and 132 may include a first external electrode 131 disposed on the third surface 3 of the body and a second external electrode 132 disposed on the fourth surface 4 of the body. I can.

The first external electrode 131 may include a first electrode layer 131a connected to the first internal electrode 121 and a first conductive resin layer 131b disposed on the first electrode layer 131a. .

The second external electrode 132 may include a second electrode layer 132a connected to the second internal electrode 122 and a second conductive resin layer 132b disposed on the second electrode layer 132a. .

The first external electrode 131 may further include a first Ni plating layer 131c disposed on the first conductive resin layer 131b and a first Sn plating layer 131d disposed on the first Ni plating layer. have.

The second external electrode 132 may further include a second Ni plating layer 132c disposed on the second conductive resin layer 132b and a second Sn plating layer 132d disposed on the second Ni plating layer. have.

The first and second external electrodes 131 and 132 may be electrically connected to the first and second internal electrodes 121 and 122, respectively, to form capacitance, and the second external electrode 132 is It may be connected to a different potential than the first external electrode 131.

The electrode layers 131a and 132a may include a conductive metal and glass.

The conductive metal used for the electrode layers 131a and 132a is not particularly limited as long as it is a material that can be electrically connected to the internal electrode to form a capacitance. For example, copper (Cu), silver (Ag), nickel ( Ni) and may be one or more selected from the group consisting of alloys thereof.

The electrode layers 131a and 132a may be formed by applying a conductive paste prepared by adding a glass frit to the conductive metal powder, followed by firing.

The conductive resin layers 131b and 132b are formed on the electrode layers 131a and 132a, and may be formed to completely cover the electrode layers 131a and 132a.

The conductive resin layers 131b and 132b may include a conductive metal and a base resin.

The base resin included in the conductive resin layers 131b and 132b is not particularly limited as long as it has bonding properties and shock absorbing properties, and can be mixed with conductive metal powder to make a paste, and may include, for example, an epoxy resin. .

The conductive metal included in the conductive resin layers 131b and 132b is not particularly limited as long as it is a material that can be electrically connected to the electrode layers 131a and 132a. For example, copper (Cu), silver (Ag), nickel ( Ni) and may include one or more selected from the group consisting of alloys thereof.

The Ni plating layers 131c and 132c are formed on the conductive resin layers 131b and 132b, and may be formed to completely cover the conductive resin layers 131b and 132b.

The Sn plating layers 131d and 132d are formed on the Ni plating layers 131c and 132c, and may be formed to completely cover the Ni plating layers 131c and 132c.

The Ni plating layers 131c and 132c and the Sn plating layers 131d and 132d serve to improve connectivity and mounting characteristics.

The external electrodes 131 and 132 are connected to the connection portion (C) disposed on the third surface (3) or the fourth surface (4) of the body and the first and second surfaces (1, 2) at the connection portion (C). It may include a band portion (B) extending to a part.

In this case, the band portion B may extend not only from the first and second surfaces 1 and 2, but also from the connection portion C to the fifth and sixth surfaces 5 and 6.

7 is an enlarged view of area P1 of FIG. 6.

Referring to FIG. 7, in the multilayer ceramic electronic component according to an embodiment of the present invention, a thickness td of the dielectric layer 111 and a thickness te of the internal electrodes 121 and 122 are td> 2* te can be satisfied.

That is, according to an embodiment of the present invention, the thickness td of the dielectric layer 111 is greater than twice the thickness te of the internal electrodes 121 and 122.

In general, for electronic components for high-voltage electrical equipment, a major issue is a reliability problem due to a decrease in insulation breakdown voltage in a high-voltage environment.

In the multilayer ceramic capacitor according to an embodiment of the present invention, the thickness td of the dielectric layer 111 is twice the thickness te of the internal electrodes 121 and 122 in order to prevent a decrease in the dielectric breakdown voltage under a high voltage environment. By making it larger, the dielectric breakdown voltage characteristic can be improved by increasing the thickness of the dielectric layer, which is the distance between internal electrodes.

When the thickness td of the dielectric layer 111 is less than twice the thickness te of the internal electrodes 121 and 122, the dielectric layer, which is the distance between the internal electrodes, is thin, and thus the dielectric breakdown voltage may decrease.

The thickness (te) of the internal electrode may be less than 1 μm, and the thickness (td) of the dielectric layer may be less than 2.8 μm, but is not limited thereto.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is intended to be limited by the appended claims. Therefore, various types of substitutions, modifications and changes will be possible by those of ordinary skill in the art within the scope not departing from the technical spirit of the present invention described in the claims, and this also belongs to the scope of the present invention something to do.

100: multilayer ceramic electronic component
110: body
111: dielectric layer
112: cover
121, 122: internal electrode
121a, 122a: metal grains
121b, 122b: composite layer
131, 132: external electrode
131a, 132a: electrode layer
131b, 132b: conductive resin layer

Claims (18)

A body including a dielectric layer and an internal electrode; And
An external electrode disposed on the body and including an electrode layer connected to the internal electrode and a conductive resin layer disposed on the electrode layer; Including,
The internal electrode includes a plurality of metal grains and a composite layer,
The composite layer includes Sn, and is disposed at a grain boundary between the plurality of metal grains.
Multilayer ceramic electronic components.
The method of claim 1,
The composite layer is additionally disposed at the boundary between the metal grains and the dielectric layer
Multilayer ceramic electronic components.
The method of claim 1,
The composite layer is disposed to surround at least one of the plurality of metal grains
Multilayer ceramic electronic components.
The method of claim 1,
The internal electrode is formed of a conductive paste for internal electrodes containing Ni and Sn,
The content of Sn contained in the conductive paste for internal electrodes is 1.5wt% or more compared to Ni
Multilayer ceramic electronic components.
The method of claim 1,
The thickness of the composite layer is 1 ~ 15nm
Multilayer ceramic electronic components.
The method of claim 1,
The metal grains are Ni grains
Multilayer ceramic electronic components.
The method of claim 1,
The internal electrode satisfies 85%≤C when the ratio of the length of the portion where the internal electrode is formed to the total length of the internal electrode is defined as the connectivity (C) of the internal electrode.
Multilayer ceramic electronic components.
The method of claim 1,
The electrode layer includes at least one selected from the group consisting of Cu, Ag, Ni, and alloys thereof and glass,
The conductive resin layer comprises at least one selected from the group consisting of Cu, Ag, Ni, and alloys thereof and a base resin.
Multilayer ceramic electronic components.
The method of claim 1,
The thickness of the internal electrode is less than 1 ㎛, the thickness of the dielectric layer is less than 2.8 ㎛
Multilayer ceramic electronic components.
The method of claim 1,
The thickness of the internal electrode is less than 1 μm
Multilayer ceramic electronic components.
The method of claim 1,
The thickness of the dielectric layer is less than 2.8 ㎛
Multilayer ceramic electronic components.
The method of claim 1,
When defining the thickness of the internal electrode as te and the thickness of the dielectric layer as td, satisfying td> 2*te
Multilayer ceramic electronic components.
The method of claim 1,
The composite layer further comprises Ni
Multilayer ceramic electronic components.
The method of claim 1,
The internal electrode contains Ni and Sn, and the Sn content contained in the internal electrode is 1.5wt% or more compared to the Ni content contained in the internal electrode.
Multilayer ceramic electronic components.
A body including a dielectric layer and an internal electrode; And
An external electrode disposed on the body and including an electrode layer connected to the internal electrode and a conductive resin layer disposed on the electrode layer; Including,
The internal electrode includes a plurality of metal grains and a composite layer,
The composite layer includes Sn, and is disposed at the boundary between the metal grains and the dielectric layer.
Multilayer ceramic electronic components.
The method of claim 15,
The thickness of the internal electrode is less than 1 μm
Multilayer ceramic electronic components.
The method of claim 15,
The thickness of the dielectric layer is less than 2.8 ㎛
Multilayer ceramic electronic components.
The method of claim 15,
The thickness of the internal electrode is less than 1 ㎛, the thickness of the dielectric layer is less than 2.8 ㎛
Multilayer ceramic electronic components.

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