KR20200110726A - Solar cell and solar cell module - Google Patents

Abstract

The present invention relates to a solar cell and a solar cell module, capable of improving photoelectric conversion efficiency and simplifying a manufacturing method. According to the present invention, the solar cell module includes: a first solar cell and a second solar cell, in which each of the first solar cell and the second solar cell includes a plurality of first electrodes formed on a rear surface of a semiconductor substrate, a plurality of second electrodes formed on the rear surface of the semiconductor substrate, a first auxiliary electrode connected to the first electrodes, a second auxiliary electrode connected to the second electrodes, and an insulating member disposed on rear surfaces of the first auxiliary electrode and the second auxiliary electrode, and one semiconductor substrate and one insulating member are connected to each other to form one individual integrated element; and an interconnector configured to electrically connect the first solar cell to the second solar cell. In addition, one example of a solar cell applicable to the solar cell module includes: a semiconductor substrate; a plurality of first electrodes formed on a rear surface of the semiconductor substrate; a plurality of second electrodes spaced apart from the first electrodes in parallel with the first electrodes on the rear surface of the semiconductor substrate; and an insulating member including a first auxiliary electrode connected to the first electrodes and a second auxiliary electrode connected to the second electrodes, wherein one insulating member and one semiconductor substrate are connected to each other to form one individual integrated element.

Description

Solar cell and solar cell module {SOLAR CELL AND SOLAR CELL MODULE}

The present invention relates to a solar cell and a solar cell module.

A typical solar cell includes a substrate made of semiconductors of different conductive types, such as a p-type and an n-type, and an emitter, and electrodes connected to the substrate and the emitter, respectively. At this time, a p-n junction is formed at the interface between the substrate and the emitter part.

In particular, research and development of a back-electrode solar cell in which an electrode is not formed on the light-receiving surface of a silicon substrate and an n-electrode and a p-electrode are formed only on the back surface of the silicon substrate is being conducted to increase the efficiency of the solar cell. A modular technology for electrically connecting a plurality of such back-electrode solar cell cells is also in progress.

Typical examples of the modules and technologies include a method of electrically connecting a plurality of solar cell cells with a metal interconnector and a method of electrically connecting a plurality of solar cells using a wiring board on which wiring is formed.

An object of the present invention is to provide a solar cell and a solar cell module capable of improving photoelectric conversion efficiency and simplifying a manufacturing method.

The solar cell module according to the present invention includes a plurality of first electrodes formed on the rear surface of the semiconductor substrate, a plurality of second electrodes formed on the rear surface of the semiconductor substrate, a first auxiliary electrode connected to the plurality of first electrodes, and a plurality of second electrodes. 2 A second auxiliary electrode connected to the electrode, and an insulating member disposed on the rear surface of the first auxiliary electrode and the second auxiliary electrode, and the semiconductor substrate and the insulating member are individually connected to form one integrated individual element. A first solar cell and a second solar cell; And an interconnector electrically connecting the first solar cell and the second solar cell to each other.

Here, the solar cell module includes: a front glass substrate positioned on the front surface of the cell string to which the first solar cell and the second solar cell are connected to each other by an interconnector; An upper encapsulant positioned between the front glass substrate and the cell string; A lower encapsulant positioned on the rear surface of the cell string; And a rear sheet positioned on the rear surface of the lower encapsulant.

Here, the interconnector may be spaced apart from the semiconductor substrate of the first solar cell or the semiconductor substrate of the second solar cell without overlapping, and the insulating members of each of the first solar cell and the second solar cell may overlap with the interconnector. In addition, the insulating member of the first solar cell and the insulating member of the second solar cell may be spaced apart from each other.

In addition, the insulating member of the first solar cell may not overlap with the semiconductor substrate of the second solar cell, and the insulating member of the second solar cell may not overlap with the semiconductor substrate of the first solar cell.

In each of the first and second solar cells herein, the area of the insulating member may be equal to or greater than the area of the semiconductor substrate, and may be less than twice the area of the semiconductor substrate. For example, in the insulating member, the length in the first direction, which is the length direction in which the first auxiliary electrode and the second auxiliary electrode extend, may be equal to or longer than the length of the semiconductor substrate in the first direction, or may be shorter than twice.

In addition, in each of the first solar cell and the second solar cell, each of the first auxiliary electrode and the second auxiliary electrode extends in a first direction, and crosses the first direction at an end of the first auxiliary electrode extending in the first direction. A first auxiliary electrode pad extending in a second direction may be further provided, and a second auxiliary electrode pad extending in a second direction may be further provided at an end of the second auxiliary electrode extending in the first direction.

In each of the first and second solar cells herein, each of the second auxiliary electrode pad and the first auxiliary electrode pad may include a first region where the semiconductor substrate overlaps and a second region where the semiconductor substrate does not overlap. have.

Here, the first auxiliary electrode pad included in the first solar cell and the second auxiliary electrode pad included in the second solar cell may be spaced apart from each other. In this case, the interconnector electrically connects the first auxiliary electrode pad of the first solar cell and the second auxiliary electrode pad of the second solar cell, or the first auxiliary electrode pad of the first solar cell and the second auxiliary electrode pad of the second solar cell. 2 The auxiliary electrode pad can be electrically connected.

More specifically, in each of the first solar cell and the second solar cell, the second region of the first auxiliary electrode pad and the second region of the second auxiliary electrode pad may overlap and be connected to the interconnector.

In this case, in each of the first solar cell and the second solar cell, the interconnector and the first auxiliary electrode pad, or the interconnector and the second auxiliary electrode pad may be electrically connected by a second conductive connector. However, the interconnector and the first auxiliary electrode pad, or ?使羔唜沽? The second auxiliary electrode pad may be electrically connected by direct physical contact.

In addition, irregularities may be formed on the front surface of the interconnector, and the thickness may not be uniform. Unlike this, the interconnector may have a uniform thickness and a zigzag shape.

In addition, the solar cell module includes a first cell string and a second cell string in which a plurality of solar cells forming one integrated individual element are connected in series in a first direction by an interconnector, and the first cell string A conductive ribbon connecting the and the second cell string in series in the second direction may be further included.

More specifically, the first auxiliary electrode pad of the last solar cell of the first cell string is connected to the second auxiliary electrode pad of the last solar cell of the second cell string through a conductive ribbon, or of the last solar cell of the first cell string. The second auxiliary electrode pad may be connected to the first auxiliary electrode pad of the last solar cell of the second cell string through a conductive ribbon.

In this case, in the last solar cell of the first cell string or the second cell string, the ribbon may be connected to the front surface of the first auxiliary electrode pad or the front surface of the second auxiliary electrode pad.

However, differently, in the last solar cell of the first cell string or the second cell string, the first auxiliary electrode pad or the second auxiliary electrode pad is formed to cover a portion of the rear surface of the insulating member, and the ribbon is a portion of the rear surface of the insulating member. It is also possible to be connected to the first auxiliary electrode pad or the second auxiliary electrode pad formed in the.

In addition, differently, the first auxiliary electrode pad or the second auxiliary electrode pad to which the ribbon is connected in the last solar cell of the first cell string or the second cell string further includes a portion longer than the length of the insulating member, It is also possible to connect the ribbon to the part.

In addition, differently, the last solar cell of the first cell string or the second cell string is a solar cell from which the insulating member is removed from the first solar cell and the second solar cell, and the first auxiliary electrode pad or the second auxiliary electrode pad of the last solar cell It is also possible to connect the ribbon on the back side of the auxiliary electrode pad.

In addition, an example of a solar cell applied to such a solar cell module includes a semiconductor substrate; A plurality of first electrodes formed on the rear surface of the semiconductor substrate; A plurality of second electrodes spaced apart from the plurality of first electrodes and formed in parallel on the rear surface of the semiconductor substrate; Including; an insulating member including a first auxiliary electrode connected to the plurality of first electrodes and a second auxiliary electrode connected to the plurality of second electrodes; Including, the insulating member and the semiconductor substrate are connected individually to form one integral type Individual devices are formed.

In each of the first and second solar cells herein, the area of the insulating member may be equal to or greater than the area of the semiconductor substrate, and may be less than twice the area of the semiconductor substrate. For example, in the insulating member, the length in the first direction, which is the length direction in which the first auxiliary electrode and the second auxiliary electrode extend, may be equal to or longer than the length of the semiconductor substrate in the first direction, or may be shorter than twice.

In this way, each of the first auxiliary electrode and the second auxiliary electrode extends in a first direction, and a first auxiliary electrode extending in a second direction crossing the first direction at an end of the first auxiliary electrode extending in the first direction. A pad may be further provided, and a second auxiliary electrode pad extending in the second direction may be further provided at an end of the second auxiliary electrode extending in the first direction.

In addition, the thickness of each of the first auxiliary electrode and the second auxiliary electrode may be thicker than the thickness of each of the plurality of first electrodes and the plurality of second electrodes.

Here, between the first electrode and the first auxiliary electrode, and between the second electrode and the second auxiliary electrode may be electrically connected to each other by a first conductive connecting material, and between the first electrode and the second electrode, and the first auxiliary electrode An insulating layer may be formed between the and the second auxiliary electrode.

As a specific example, each of the first auxiliary electrode and the second auxiliary electrode is formed in a plurality and extends in a first direction, and each of the plurality of first electrodes and the plurality of second electrodes extends in a first direction or a second direction. If present, at least a portion of each of the first auxiliary electrodes is connected by a first conductive connector at a portion overlapping the plurality of first electrodes, and at least a portion of each of the plurality of second auxiliary electrodes overlaps the plurality of second electrodes. It can be connected by a first conductive connector in the part.

In addition, as another example, each of the first auxiliary electrode and the second auxiliary electrode may be formed as a sheet electrode and may be located spaced apart from each other. In this case, one first auxiliary electrode and a plurality of The first electrodes are connected to each other by a first conductive connector at a portion overlapping each other, and one second auxiliary electrode and a plurality of second electrodes are connected to each other by a first conductive connector at a portion overlapping each other, 1 The auxiliary electrode and the plurality of second electrodes may be insulated from each other by an insulating layer in a portion overlapping each other, and one second auxiliary electrode and a plurality of second electrodes may be insulated from each other by an insulating layer in the overlapped portion. .

As described above, in the solar cell according to the present invention, the first auxiliary electrode and the second auxiliary electrode are formed relatively thickly on the rear surface of one semiconductor substrate, so that the efficiency, manufacturing process, and yield of the solar cell can be further improved.

In addition, the solar cell module according to the present invention can further simplify the manufacturing process of the solar cell module by using a solar cell in which a semiconductor substrate and an insulating member are individually connected to each other and formed as an integrated individual element. In case of defects of some solar cells, replacement may be facilitated, and thus the yield of the solar cell module may be further improved.

1 is a diagram for explaining an example of a solar cell module according to the present invention.
2 and 3 are diagrams for describing an example of a solar cell applicable to the solar cell module shown in FIG. 1.
4 to 7C are diagrams for explaining a first embodiment of a single integrated individual device in which a semiconductor substrate and an insulating member are separately formed in the solar cell module of FIG. 1.
8 to 10D are diagrams for explaining a second embodiment of a single integrated individual device in which a semiconductor substrate and an insulating member are formed separately in the solar cell module of FIG. 1.
11 to 13D are diagrams for explaining a third embodiment of an integrated individual device in which a semiconductor substrate and an insulating member are formed separately from each other in the solar cell module of FIG. 1.
14 to 16B are diagrams for explaining a fourth embodiment of a single integrated individual device in which a semiconductor substrate and an insulating member are formed separately in the solar cell module of FIG. 1.
17 to 19 are diagrams for explaining a first embodiment of a method of connecting a semiconductor substrate and an insulating member to form one integrated individual device in the solar cell module of FIG. 1.
20 to 22 are diagrams for explaining a second embodiment of a method of connecting a semiconductor substrate and an insulating member to form one integrated individual element in the solar cell module of FIG. 1.
23A to 24 are diagrams for explaining a structure in which each solar cell formed as an integrated individual element is connected to each other through an interconnector (IC) in the solar cell module shown in FIG. 1.
FIG. 25 is a diagram for explaining another example of a structure in which each solar cell formed as an integral individual element is connected to each other through an interconnector (IC) in the solar cell module shown in FIG. 1.
FIG. 26 is a diagram for explaining an interconnector (IC) according to a first embodiment in order to increase an optical gain in the solar cell module shown in FIG. 1.
FIG. 27 is a view for explaining an interconnector IC according to a second embodiment in order to cope with the expansion and contraction of thermal expansion and contraction of an insulating member while improving optical gain in the solar cell module shown in FIG. 1.
FIG. 28 is a diagram for describing an example of an overall plan structure of the solar cell module shown in FIG. 1.
29 to 31 are cross-sectional views taken along lines 29-29 of FIG. 28, and are diagrams for explaining first to third embodiments in which the structure of the last solar cell in the cell string is changed to connect the conductive ribbon. to be.
32A and 32B are diagrams illustrating a fourth embodiment in which an insulating member included in the last solar cell is removed from a cell string for connection of a conductive ribbon in the solar cell module according to FIG. 28.
33A and 33B are diagrams for explaining a fifth embodiment in which the structure of the last solar cell is not changed in the solar cell module according to FIG. 28.
34A to 34G are diagrams for explaining an example of a method of manufacturing a solar cell as an integrated individual device and a method of manufacturing a cell string according to the present invention.
35A to 35G are diagrams for explaining a first embodiment of a method of manufacturing the solar cell module shown in FIGS. 1 and 28.
36A and 36B are views for explaining a second embodiment of the method of manufacturing the solar cell module shown in FIGS. 1 and 28.
37A to 37G are diagrams for explaining a third embodiment of the method of manufacturing the solar cell module shown in FIGS. 1 and 28.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art can easily implement the embodiments of the present invention. However, the present invention may be implemented in various forms and is not limited to the embodiments described herein. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and similar reference numerals are given to similar parts throughout the specification.

Hereinafter, the front surface may be one surface of a semiconductor substrate or a front glass substrate to which direct sunlight is incident, and the rear surface is a semiconductor substrate and a front glass substrate in which direct sunlight is not incident or reflected light other than direct sunlight is incident. It may be the opposite side of one side of.

Hereinafter, a solar cell and a solar cell module according to an embodiment of the present invention will be described with reference to the accompanying drawings.

1 is a view for explaining an example of a solar cell module according to the present invention.

As shown in Figure 1, the solar cell module according to the present invention includes a front glass substrate (FG), an upper encapsulant (EC1), a first solar cell (Cell-a) and a second solar cell (Cell-b). A plurality of solar cells including, an interconnector (IC) electrically connecting the first solar cell (Cell-a) and the second solar cell (Cell-b) to each other, a lower encapsulant (EC2), and a rear sheet (BS ) Can be included.

In FIG. 1, for illustration, while showing a partial cross-sectional view of a solar cell module, a front glass substrate (FG), an upper encapsulant (EC1), a plurality of solar cells, a lower encapsulant (EC2), and a rear sheet (BS) are Although shown to be spaced up and down, the constituent elements of the solar cell module may be integrated as a whole without spaces separated vertically between the constituent elements of the solar cell module by the laminating process.

Here, each of the plurality of solar cells including the first solar cell (Cell-a) and the second solar cell (Cell-b) is a plurality of first electrodes (C141) formed on the rear surface of the semiconductor substrate (110), a semiconductor A plurality of second electrodes C142 formed on the rear surface of the substrate 110, a first auxiliary electrode P141 connected to the plurality of first electrodes C141, and a second electrode connected to the plurality of second electrodes C142 And an insulating member 200 disposed on rear surfaces of the auxiliary electrode P142 and the first auxiliary electrode P141 and the second auxiliary electrode P142. A detailed description of this will be described later.

As such, each of the plurality of solar cells including the first solar cell (Cell-a) and the second solar cell (Cell-b) is connected to each of the semiconductor substrate 110 and the insulating member 200 in one piece. Individual elements can be formed.

That is, at least one of the plurality of solar cells, each of the first solar cell (Cell-a) and the second solar cell (Cell-b) can be connected by attaching only one semiconductor substrate 110 to one insulating member 200. Thus, each of the first solar cell (Cell-a) and the second solar cell (Cell-b) is formed as one individual element in which one insulating member 200 and one semiconductor substrate 110 are integrated. I can.

In addition, each of the first solar cell (Cell-a) and the second solar cell (Cell-b) forming one integrated individual device as described above may be electrically connected to each other by an interconnector (IC).

In addition, each of a plurality of solar cells including the first solar cell Cell-a and the second solar cell Cell-b may be connected to each other by an interconnector IC to form a cell string.

The detailed structure of each of the first solar cell (Cell-a) and the second solar cell (Cell-b), and one semiconductor substrate 110 are integrated into one insulating member 200 to form one individual device. For a detailed description of the structure of the cell string to which a plurality of solar cells are connected by an interconnector (IC), a front glass substrate (FG), an upper encapsulant (EC1), a lower encapsulant (EC2), and a rear sheet ( BS) will be described first.

1, the front glass substrate FG is on the front surface of the cell string to which the first solar cell (Cell-a) and the second solar cell (Cell-b) are connected to each other by an interconnector (IC). It can be located, and it has high transmittance and can be made of tempered glass or the like to prevent breakage. At this time, the tempered glass may be a low iron tempered glass having a low iron content, and although not shown, the inner surface may be embossed to increase the light scattering effect.

The upper encapsulant EC1 may be positioned between the front glass substrate FG and the cell string, and the lower encapsulant EC2 may be positioned between the rear surface of the cell string, that is, between the rear sheet BS and the cell string. .

The upper encapsulant EC1 and the lower encapsulant EC2 may be formed of a material that prevents corrosion of metal due to moisture penetration and protects the solar cell module 100 from impact.

As shown in FIG. 1, the upper encapsulant EC1 and the lower encapsulant EC2 are disposed on the front and rear surfaces of the plurality of solar cells, respectively, and the plurality of solar cells and the Can be integrated.

The upper encapsulant EC1 and the lower encapsulant EC2 may be made of ethylene vinyl acetate (EVA) or the like.

In addition, the rear sheet (BS) is located on the rear side of the lower encapsulant (EC2) in a sheet form, and can prevent moisture from penetrating into the rear surface of the solar cell module, and a glass substrate may be used instead of the rear sheet (BS). , When the rear sheet (BS) is used, the manufacturing cost and weight of the solar cell module can be further reduced.

In this way, when the rear sheet BS is formed in a sheet form, it may be made of an insulating material such as EP/PE/FP (fluoropolymer/polyeaster/fluoropolymer).

Hereinafter, detailed structures of each of the first solar cell (Cell-a) and the second solar cell (Cell-b) described above will be described.

2 and 3 are diagrams for describing an example of a solar cell applicable to the solar cell module shown in FIG. 1.

FIG. 2 is an example of a partial perspective view of a solar cell according to an exemplary embodiment of the present invention, and FIG. 3 is a cross-sectional view of the solar cell shown in FIG. 2 taken along line 3-3.

2 and 3, an example (1) of a solar cell according to the present invention is a semiconductor substrate 110, an anti-reflection film 130, an emitter part 121, a back surface field (BSF), 172, a plurality of first electrodes C141, a plurality of second electrodes C142, a first auxiliary electrode P141, a second auxiliary electrode P142, and an insulating member 200 may be provided.

Here, the anti-reflection film 130 and the rear electric field part 172 may be omitted, and are located between the anti-reflection film 130 and the semiconductor substrate 110 to which light is incident, and have the same conductivity as the semiconductor substrate 110. It is also possible to further include a front electric field portion, which is an impurity portion in which type impurities are contained in a higher concentration than the semiconductor substrate 110.

Hereinafter, as illustrated in FIGS. 2 and 3, the antireflection film 130 and the rear electric field part 172 will be described as an example.

The semiconductor substrate 110 may be a semiconductor substrate 110 made of silicon of a first conductivity type, for example, an n-type conductivity type. The semiconductor substrate 110 may be formed by doping a wafer formed of a silicon material with impurities of a first conductivity type.

The upper surface of the semiconductor substrate 110 is textured to have a textured surface that is an uneven surface. The anti-reflection layer 130 is positioned on the incident surface of the semiconductor substrate 110, may be formed of one or more layers, and may be formed of a hydrogenated silicon nitride film (SiNx:H). In addition, it is also possible to further form a front electric field part on the front surface of the semiconductor substrate 110.

The emitter unit 121 is located spaced apart from each other in the rear surface of the semiconductor substrate 110 facing the front surface, and extends in a direction parallel to each other. There may be a plurality of emitter units 121, and the plurality of emitter units 121 may be of a second conductivity type opposite to that of the semiconductor substrate 110.

The plurality of emitter units 121 may be formed by containing p-type impurities of a second conductivity type opposite to that of the crystalline silicon semiconductor substrate 110 in a high concentration through a diffusion process.

A plurality of rear electric field units 172 may be located inside the rear surface of the semiconductor substrate 110, are formed to be spaced apart in a direction parallel to the plurality of emitter units 121 and extend in the same direction as the plurality of emitter units 121 have. Accordingly, as shown in FIGS. 2 and 3, a plurality of emitter units 121 and a plurality of rear electric field units 172 are alternately positioned on the rear surface of the semiconductor substrate 110.

The plurality of rear electric field portions 172 are impurities in which the same conductivity type impurity as the semiconductor substrate 110 is contained in a higher concentration than the semiconductor substrate 110, for example, n++ portions. The plurality of rear electric field units 172 may be formed by containing impurities (n++) of the same conductivity type as those of the crystalline silicon semiconductor substrate 110 in a high concentration through a diffusion process.

The plurality of first electrodes C141 are physically and electrically connected to the plurality of emitter units 121, respectively, and extend along the plurality of emitter units 121.

Therefore, when the plurality of emitter units 121 are formed along the first direction, the plurality of first electrodes C141 may also be formed along the first direction, and the plurality of emitter units 121 are formed along the second direction. When formed, a plurality of first electrodes C141 may also be formed along the first direction.

In addition, the plurality of second electrodes C142 are physically and electrically connected to the semiconductor substrate 110 through the rear electric field unit 172, respectively, and extend along the plurality of rear electric field units 172.

Here, on the rear surface of the semiconductor substrate 110, the first electrode C141 and the second electrode C142 are physically spaced apart from each other and are electrically isolated.

Therefore, when the plurality of rear electric field units 172 are formed in the first direction, the plurality of second electrodes C142 may be formed in the first direction by being spaced apart from the plurality of first electrodes C141, and When the electric field part 172 is formed in the second direction, the plurality of second electrodes C142 may be formed in the second direction by being spaced apart from the plurality of first electrodes C141.

Accordingly, the first electrode C141 formed on the emitter part 121 collects charges, for example, holes, which have moved toward the emitter part 121, and the second electrode formed on the rear electric field part 172 ( C142) collects charges, for example, electrons that have moved toward the rear electric field unit 172.

The first auxiliary electrode P141 may be formed by being electrically connected to the rear surface of the plurality of first electrodes C141. The first auxiliary electrode P141 may be formed in plural or may be formed in the form of a single electrode.

Here, when a plurality of first auxiliary electrodes P141 are formed, the first auxiliary electrodes P141 may be formed in the same direction as the plurality of first electrodes C141 or may be formed in an intersecting direction.

The first auxiliary electrode P141 may be electrically connected to each other at a portion overlapping the first electrode C141.

The second auxiliary electrode P142 may be formed by being electrically connected to the rear surfaces of the plurality of second electrodes C142.

A plurality of such second auxiliary electrodes P142 may be formed, or may be formed in the form of one whole electrode.

Here, when a plurality of second auxiliary electrodes P142 are formed, the second auxiliary electrodes P142 may be formed in the same direction as the plurality of second electrodes C142 or may be formed in an intersecting direction.

As such, the second auxiliary electrodes P142 may be electrically connected to each other at a portion overlapping the second electrode C142.

The material of the first auxiliary electrode P141 and the second auxiliary electrode P142 may be formed of at least one of Cu, Au, Ag, and Al.

In addition, the above-described first auxiliary electrode P141 may be electrically connected to the first electrode C141 through the first conductive connector CA1, and the second auxiliary electrode P142 includes the first conductive connector CA1. Through it, it may be electrically connected to the second electrode C142.

The material of the first conductive connector CA1 is not particularly limited as long as it is a conductive material, but preferably a conductive material having a melting point formed at a relatively low temperature of 130°C to 250°C is sufficient, for example, a solder paste (solder paste), a conductive adhesive material containing metal particles, a carbon nano tube (CNT), conductive particles containing carbon, a wire, a needle, and the like may be used.

In addition, an insulating layer IL for preventing a short circuit may be positioned between the aforementioned first electrode C141 and the second electrode C142 and between the first auxiliary electrode P141 and the second auxiliary electrode P142. . The insulating layer IL may be an epoxy resin.

In addition, in FIGS. 2 and 3, only the case where the first electrode C141 and the first auxiliary electrode P141 overlap, and the second electrode C142 and the second auxiliary electrode P142 overlap. Differently, the first electrode C141 and the second auxiliary electrode P142 may overlap, and the second electrode C142 and the first auxiliary electrode P141 may overlap and be positioned. In this case, the insulating layer IL may be positioned between the first electrode C141 and the second auxiliary electrode P142 and between the second electrode C142 and the second auxiliary electrode P142 to prevent a short circuit. have.

In addition, FIGS. 2 and 3 illustrate a case in which a plurality of first auxiliary electrodes P141 and second auxiliary electrodes P142 are provided as an example, but differently, the first auxiliary electrode P141 and the second auxiliary electrode ( P142) may be formed as a single sheet electrode.

The first auxiliary electrode P141 and the second auxiliary electrode P142 are formed by a heat treatment process that applies heat and pressure between 130°C and 250°C to the first conductive connector CA1 without using a semiconductor manufacturing process. Can be.

In addition, although not shown in FIGS. 2 and 3, a first auxiliary electrode pad PP141 for serial connection of a solar cell may be electrically connected to the end of the first auxiliary electrode P141 to be formed, and the second A second auxiliary electrode pad PP142 for serial connection of solar cells may be electrically connected to an end of the auxiliary electrode P142 to be formed. The material and thickness of the first auxiliary electrode pad PP141 and the second auxiliary electrode pad PP142 may be the same as those of the first auxiliary electrode P141 and the second auxiliary electrode P142.

The insulating member 200 may be disposed on the rear surfaces of the first auxiliary electrode P141 and the second auxiliary electrode P142.

The material of the insulating member 200 is not particularly limited as long as it is an insulating material, but it may be preferable that a relatively melting point is higher than that of the first conductive connector CA1. For example, the melting point of the insulating member 200 is 300 It may be formed of an insulating material that is higher than ℃ ℃. More specifically, as an example, it may be formed by including at least one material of polyimide, epoxy-glass, polyester, and BT (bismaleimide triazine) resin having heat resistance to high temperatures.

The insulating member 200 may be formed in the form of a flexible film or may be formed in the form of a non-flexible and rigid plate.

In the solar cell according to the present invention, the insulating member 200 and the semiconductor substrate 110 may be individually connected to each other to form one individual device. That is, the semiconductor substrate 110 attached to and connected to one insulating member 200 may be one, and one insulating member 200 and one semiconductor substrate 110 are attached to each other to form an integral individual It can be formed as a device to form one solar cell.

More specifically, by a process of attaching one insulating member 200 and one semiconductor substrate 110 to each other to form a single integrated individual element, a plurality of layers formed on the rear surface of one semiconductor substrate 110 Each of the first electrode C141 and the plurality of second electrodes C142 is attached to the first auxiliary electrode P141 and the second auxiliary electrode P142 formed on the front surface of one insulating member 200 to be electrically connected to each other. I can. A more detailed description of this will be described later.

In the solar cell according to the present invention, the thickness T2 of each of the first auxiliary electrode P141 and the second auxiliary electrode P142 is the thickness T1 of each of the first electrode C141 and the second electrode C142 Can be greater than ). For example, the thickness T2 of each of the first auxiliary electrode P141 and the second auxiliary electrode P142 may be formed between 10 μm and 900 μm.

Here, increasing the thickness T2 of each of the first auxiliary electrode P141 and the second auxiliary electrode P142 greater than 10 μm is to secure an appropriate minimum resistance, and smaller than 900 μm secures an appropriate minimum resistance. This is to reduce the manufacturing cost by not being formed to a thickness more than necessary in one state.

In this way, by making the thickness (T2) of the first auxiliary electrode (P141) and the second auxiliary electrode (P142) larger than the thickness (T1) of each of the first electrode (C141) and the second electrode (C142), solar cell manufacturing The process time can be further shortened, and the thermal expansion stress on the substrate can be further reduced than that of directly forming the first electrode C141 and the second electrode C142 on the rear surface of the semiconductor substrate 110, so that the solar cell Can further improve the efficiency of.

More specifically, it is as follows.

In general, the emitter unit formed on the rear surface of the semiconductor substrate, the rear electric field unit, the first electrode connected to the emitter unit, and the second electrode connected to the rear electric field unit may be formed by a semiconductor process. Among these semiconductor processes, The first electrode and the second electrode are in direct contact with or very close to the rear surface of the semiconductor substrate, and may be formed mainly by plating, PVD deposition, or high-temperature heat treatment.

In this case, in order to ensure the resistance of the first electrode and the second electrode sufficiently low, the thickness of the first electrode and the second electrode must be formed sufficiently thick.

However, when the thickness of the first electrode and the second electrode is formed to be thick, the coefficient of thermal expansion of the first electrode and the second electrode including the conductive metal material may be excessively greater than that of the semiconductor substrate 110.

Therefore, during the process of forming the first electrode and the second electrode on the rear surface of the semiconductor substrate 110 by a high-temperature heat treatment process, when the first electrode and the second electrode contract, the semiconductor substrate 110 does not withstand the thermal expansion stress. As a result, the possibility of occurrence of a fracture or crack in the semiconductor substrate 110 increases, and thus, a yield of a solar cell manufacturing process may decrease or efficiency of a solar cell may decrease.

In addition, when the first electrode or the second electrode is formed by plating or PVD deposition, the growth rate of the first electrode or the second electrode is very small, and the manufacturing process time of the solar cell may be excessively increased.

However, in the solar cell 1 according to the present invention, in the state in which the first electrode C141 and the second electrode C142 are formed with a relatively small thickness T1 on the rear surface of the semiconductor substrate 110, the insulating member ( After positioning the first auxiliary electrode P141 and the second auxiliary electrode P142 formed with a relatively large thickness T2 on the front surface of 200) to overlap the first electrode C141 and the second electrode C142, It is a heat treatment process that applies relatively low heat and pressure between 130°C and 250°C to the first conductive connector CA1. One insulating member 200 and one semiconductor substrate 110 are attached to each other to form an integrated individual element. Since it can be formed, it is possible to prevent the occurrence of cracks or cracks in the semiconductor substrate 110, and at the same time, the resistance of the electrode formed on the rear surface of the semiconductor substrate 110 can be greatly reduced.

In addition, the solar cell 1 according to the present invention has a relatively small thickness T1 of the first electrode C141 and the second electrode C142, thereby minimizing a semiconductor manufacturing process time with a relatively long process time. In addition, the first electrode C141 and the first auxiliary electrode P141, and the second electrode C142 and the second auxiliary electrode P142 can be connected to each other in a single heat treatment process, so that the manufacturing process time of the solar cell Can be shorter.

In this case, when the insulating member 200 adheres the first auxiliary electrode P141 and the second auxiliary electrode P142 to the first electrode C141 and the second electrode C142 formed on the rear surface of the semiconductor substrate 110 , It plays a role in helping the process more easily.

That is, the insulating member 200 in which the first auxiliary electrode P141 and the second auxiliary electrode P142 are formed on the rear surface of the semiconductor substrate 110 on which the first electrode C141 and the second electrode C142 are formed in a semiconductor manufacturing process. When connecting by attaching the front surface of ), the insulating member 200 may help the alignment process or the bonding process more easily.

Holes collected through the first auxiliary electrode P141 and electrons collected through the second auxiliary electrode P142 in the solar cell 1 according to the present invention manufactured in this way are external devices through an external circuit device. It can be used as an electric power.

As described above, the operation of the solar cell of the rear junction structure is as follows.

When light is irradiated to the solar cell 1, passes through the antireflection film 130, and is incident on the semiconductor substrate 110, electron-hole pairs are generated in the semiconductor substrate 110 by light energy.

These electron-hole pairs are separated from each other by the pn junction of the semiconductor substrate 110 and the emitter part 121, so that the holes move toward the plurality of emitter parts 121 having a p-type conductivity type, and the electrons are n-type. It moves toward the plurality of rear electric field units 172 having a conductivity type, and is collected by the first auxiliary electrode P141 and the second auxiliary electrode P142, respectively. When the first auxiliary electrode P141 and the second auxiliary electrode P142 are connected to each other with a conductive line, a current flows, which is used as power from the outside.

Until now, the case where the semiconductor substrate 110 is a single crystal silicon semiconductor substrate 110 and the emitter unit 121 and the rear electric field unit 172 are formed through a diffusion process has been described as an example.

However, differently, the emitter unit 121 and the rear electric field unit 172 are rear junction hybrid solar cells formed of amorphous silicon material, or the emitter unit 121 is located on the front surface of the semiconductor substrate 110, The present invention can be applied equally to a solar cell having an MWT structure connected to the first electrode C141 formed on the rear surface of the semiconductor substrate 110 through a plurality of via holes formed.

Hereinafter, various embodiments in which one semiconductor substrate 110 and one insulating member 200 are integrally connected to each other and formed as one individual element will be described.

4 to 7C are diagrams for explaining a first embodiment of a single integrated individual device in which a semiconductor substrate and an insulating member are separately formed in the solar cell module of FIG. 1.

4A is a diagram for explaining an example of the semiconductor substrate 110 on which the first electrode C141 and the second electrode C142 are disposed on the rear surface, and FIG. 4B is ) To 4(b)-4(b), and FIG. 4(c) shows the insulating member 200 in which the first auxiliary electrode P141 and the second auxiliary electrode P142 are disposed on the front surface. It is a diagram for explaining an example, and (d) of FIG. 4 is a cross-sectional view taken along lines 4(d)-4(d) in FIG. 4(c).

The solar cell illustrated in FIGS. 4 to 7C may be applied to the solar cell described above. In addition, in addition, any solar cell may be applied to a solar cell in which the first electrode C141 and the second electrode C142 are positioned on the rear surface of the semiconductor substrate 110.

A front surface of one insulating member 200 as shown in FIGS. 4C and 4D is on the rear surface of one semiconductor substrate 110 as shown in FIGS. 4A and 4B. By being attached and connected, the solar cell according to the present invention can form one integral individual element.

At this time, as shown in (a) and (b) of FIG. 4, a plurality of first electrodes C141 and a plurality of second electrodes C142 are spaced apart from each other on the rear surface of the semiconductor substrate 110 to be in the first direction. It can be formed as long as (x).

Here, a case where the widths WC142 of the first electrode C141 and the second electrode C142 are the same is illustrated as an example, but differently, the widths WC142 of the first electrode C141 and the second electrode C142 ) May be formed differently.

In addition, a plurality of first electrodes C141 and a plurality of second electrodes C142 are spaced apart from each other on the front surface of the insulating member 200 according to the present invention, as shown in FIGS. 4C and 4D. It can be formed to be elongated in the first direction (x).

In addition, a first auxiliary electrode pad PP141 extending in the second direction is further provided at ends of the plurality of first auxiliary electrodes P141 formed in the first direction x on the front surface of the insulating member 200, 1 The auxiliary electrode pad PP141 may be connected to ends of the plurality of first auxiliary electrodes P141.

In addition, a second auxiliary electrode pad PP142 extending in the second direction is further provided at ends of the plurality of second auxiliary electrodes P142 formed in the first direction x on the front surface of the insulating member 200, 2 The auxiliary electrode pad PP142 may be connected to ends of the plurality of second auxiliary electrodes P142.

Here, an end of each of the first auxiliary electrode pad PP141 and the second auxiliary electrode pad PP142 in the first direction x is illustrated in FIG. 4C, for example, an insulating member 200 ) Can be formed to the end. However, it is not necessarily limited thereto, and unlike FIG. 4(c), the ends of the first auxiliary electrode pad PP141 and the second auxiliary electrode pad PP142 in the first direction x are insulating It is also possible to be formed to protrude more than the end of the member 200.

In addition, in the second to fourth embodiments of the following semiconductor substrate 110 and the insulating member 200 of one integrated individual element formed separately, respectively, for convenience of explanation, the first auxiliary electrode pad PP141 and the second 2 A case where each end of the auxiliary electrode pad PP142 is formed to the end of the insulating member 200 has been described as an example, but as described above, the first auxiliary electrode pad PP141 is also used in the second to fourth embodiments. And ends of each of the second auxiliary electrode pads PP142 may be formed to protrude more than the ends of the insulating member 200.

In addition, a case in which ends of each of the first auxiliary electrode pad PP141 and the second auxiliary electrode pad PP142 are formed to protrude more than the ends of the insulating member 200 will be described in more detail with reference to FIG. 24.

Here, the first auxiliary electrode P141 and the second auxiliary electrode pad PP142 may be spaced apart from each other, and the second auxiliary electrode P142 and the first auxiliary electrode pad PP141 may be spaced apart from each other.

Therefore, the first auxiliary electrode P141 and the first auxiliary electrode pad PP141 formed on the front surface of the insulating member 200 form a comb shape, and the second auxiliary electrode P142 and the second auxiliary electrode pad are formed. The electrode pad PP142 may have a shape in which two combs face each other while forming another comb shape.

Therefore, on the front surface of the insulating member 200, the first auxiliary electrode pad PP141 is formed in the second direction y at one end of the both ends in the first direction x, and the second auxiliary electrode pad at the other end. PP142) may be formed in the second direction (y), respectively. An interconnector (IC) for connecting solar cells to each other is electrically connected to the first auxiliary electrode pad (PP141) and the second auxiliary electrode pad (PP142), or cell strings in which a plurality of solar cells are connected in series are connected to each other. The ribbon for this can be electrically connected.

The thickness T2 of each of the first and second auxiliary electrodes P141 and P142 may be thicker than the thickness T1 of each of the plurality of second electrodes C142 and the plurality of first electrodes C141. have.

In addition, the thickness of each of the first auxiliary electrode pad PP141 and the second auxiliary electrode pad PP142 may be the same as or different from the thickness T2 of each of the first auxiliary electrode P141 and the second auxiliary electrode P142. . Hereinafter, a case of the same thickness will be described as an example.

In addition, in the solar cell according to the present invention, the front surface of one insulating member 200 is attached to and connected to the rear surface of one semiconductor substrate 110, thereby forming one integrated individual element. That is, the insulating member 200 and the semiconductor substrate 110 may be coupled or attached 1:1.

Here, the insulating member 200 according to the present invention may not overlap with the semiconductor substrate 110 of another adjacent solar cell.

Accordingly, when a plurality of solar cells are connected to each other, the insulating member 200 included in each solar cell may be formed to be spaced apart without overlapping with other adjacent solar cells.

As described above, in the solar cell according to the present invention, only one insulating member 200 is coupled to one semiconductor substrate 110 to form one integrated individual element, thereby making the solar cell module manufacturing process easier, Even if the semiconductor substrate 110 included in any one solar cell is damaged or defective during the solar cell module manufacturing process, only the solar cell formed as an integrated individual element can be replaced, and the process yield can be further improved. have.

In addition, as described above, the solar cell formed of one integrated individual element can minimize thermal expansion stress applied to the semiconductor substrate 110 when manufacturing a solar cell or a solar cell module.

* For this purpose, the area of the insulating member 200 may be equal to or larger than the area of the semiconductor substrate 110 and may be smaller than twice the area of the semiconductor substrate 110.

For example, in the insulating member 200, the length (lx200) in the first direction x, which is the length direction in which the first auxiliary electrode P141 and the second auxiliary electrode P142 extend, is the first of the semiconductor substrate 110 It may be equal to or longer than the length (lx110) of the direction (x) and may be shorter than twice.

In addition, in a range in which the area of the insulating member 200 is equal to or greater than the area of the semiconductor substrate 110 and less than twice the area of the semiconductor substrate 110, the length of the insulating member 200 in the second direction y (ly200) may also be equal to or longer than the length ly110 of the semiconductor substrate 110 in the second direction y, and may be shorter than twice.

Here, by making the area of the insulating member 200 equal to or larger than the area of the semiconductor substrate 110, the interconnector IC may be attached to the front surface of the insulating member 200 when connecting the solar cell and the solar cell. You can secure enough area.

In addition, by making the area of the insulating member 200 smaller than twice the area of the semiconductor substrate 110, the first auxiliary electrode P141 and the second auxiliary electrode P142 formed on the front surface of the insulating member 200 are semiconductor When attaching to the first electrode C141 and the second electrode C142 formed on the rear surface of the substrate 110, the thermal expansion stress applied to the semiconductor substrate 110 may be minimized.

For example, when the area of the insulating member 200 is excessively large, the length of the insulating member 200 in the plane direction (lx200 or ly200) may increase. In this case, when heat treatment is performed to attach the insulating member 200 to the rear surface of the semiconductor substrate 110, the expansion and contraction length of the insulating member 200 is excessive than the expansion and contraction length of the semiconductor substrate 110. Can be lengthened. Accordingly, the semiconductor substrate 110 may receive a relatively large thermal expansion stress, and cracks may occur. As described above, if the area of the insulating member 200 is set to be less than twice the area of the semiconductor substrate 110 , The thermal expansion stress received by the semiconductor substrate 110 may be lowered.

To this end, for example, while the area of the insulating member 200 is less than twice the area of the semiconductor substrate 110, the first auxiliary electrode P141 and the second auxiliary electrode P142 are formed in the insulating member 200. The length (lx200) of the first direction (x), which is the same as the length direction, may be formed longer than the length (lx110) of the first direction (x) of the semiconductor substrate 110, and in the insulating member 200, the first direction ( The length ly200 of the second direction y intersecting with x) may be equal to or longer than the length ly110 of the second direction y of the semiconductor substrate 110.

The rear surface of the semiconductor substrate 110 and the front surface of the insulating member 200 are attached to each other, so that the first electrode C141 and the first auxiliary electrode P141 are connected to each other, and the second electrode C142 and the second electrode are connected to each other. The auxiliary electrodes P142 may be connected to each other.

5 is a first auxiliary electrode P141 and a first auxiliary electrode pad PP141, and a second auxiliary electrode P142 and a second auxiliary electrode pad PP142 on the rear surface of the semiconductor substrate 110 shown in FIG. 4. This is a view as viewed from the back side of the semiconductor substrate 110. In FIG. 5, illustration of the insulating member 200 is omitted for convenience of description.

As shown in FIG. 5, the first electrode C141 and the first auxiliary electrode P141 may be connected and connected by overlapping each other in the first direction x on the rear surface of the substrate, and the second electrode C142 And the second auxiliary electrode P142 may also be connected and connected by overlapping each other in the first direction x.

At this time, each of the first auxiliary electrode pad PP141 and the second auxiliary electrode pad PP142 overlaps the first regions PP141-S1 and PP142-S1 overlapping the semiconductor substrate 110 and the semiconductor substrate 110. It may include a second area (PP141-S2, PP142-S2) that is not.

Herein, the first region PP141-S1 of the first auxiliary electrode pad PP141 may be connected to the plurality of first auxiliary electrodes P141, and the second region PP141-S2 may be connected to the interconnector IC. In order to secure an existing space, it may be exposed outside without overlapping with the semiconductor substrate 110. In addition, the first region PP142-S1 of the second auxiliary electrode pad PP142 may be connected to the plurality of second auxiliary electrodes P142, and the second region PP142-S2 may be connected to the interconnector IC. In order to secure an existing space, it may be exposed outside without overlapping with the semiconductor substrate 110.

Each of the first auxiliary electrode pad PP141 and the second auxiliary electrode pad PP142 according to the present invention includes second regions PP141-S2 and PP142-S2, so that the interconnector IC can be more easily connected. In addition, when the interconnector IC is connected to a solar cell, thermal expansion stress on the semiconductor substrate 110 may be minimized.

6 is a front view showing an insulating member 200 is added in the structure shown in FIG. 5, and FIG. 7A is a cross-sectional view of a line 7a-7a in the second direction y in FIG. 6 , FIG. 7B shows a cross-section of the line 7b-7b in the first direction x so that it overlaps the second auxiliary electrode P142 in 6, and FIG. 7C shows the first auxiliary electrode P141 in FIG. It shows a cross section of the 7c-7c line in one direction (x).

As shown in FIG. 6, one semiconductor substrate 110 may be completely overlapped with one insulating member 200 to form one solar cell individual element, and the first auxiliary electrode pad PP141 and the second In each of the auxiliary electrode pads PP142, second regions PP141-S2 and PP142-S2 that do not overlap with the semiconductor substrate 110 may be exposed to the outside of the semiconductor substrate 110, and the second regions PP141- S2, PP142-S2) can be connected to the interconnector (IC).

At this time, as shown in FIG. 7A, the first electrode C141 formed on the rear surface of the semiconductor substrate 110 and the first auxiliary electrode P141 formed on the front surface of the insulating member 200 overlap each other, and have a first conductivity. It may be electrically connected to each other by the connector (CA1).

In addition, the second electrode C142 formed on the rear surface of the semiconductor substrate 110 and the second auxiliary electrode P142 formed on the front surface of the insulating member 200 also overlap each other, and are electrically connected to each other by the first conductive connector CA1. Can be connected to.

In addition, the insulating layer IL may be filled in a space spaced apart from each other between the first electrode C141 and the second electrode C142, and a separation between the first auxiliary electrode P141 and the second auxiliary electrode P142 The insulating layer IL may also be filled in the space.

In addition, as shown in FIG. 7B, the insulating layer IL may also be filled in the spaced apart space between the second auxiliary electrode P142 and the pad of the first electrode C141. As shown in FIG. The insulating layer IL may also be filled in a space spaced apart between the first auxiliary electrode P141 and the second electrode C142 pad.

Until now, the first electrode C141 and the second electrode C142 formed on the semiconductor substrate 110 overlap the first auxiliary electrode P141 and the second auxiliary electrode P142 formed on the insulating member 200 in a parallel direction. A case of being connected and connected has been described, but the first electrode C141 and the second electrode C142 formed on the semiconductor substrate 110 are the first auxiliary electrode P141 and the second auxiliary electrode formed on the insulating member 200. P142) may be overlapped and connected in a direction crossing. This will be described as follows.

8 to 10D are diagrams for explaining a second embodiment of a single integrated individual device in which a semiconductor substrate and an insulating member are formed separately in the solar cell module of FIG. 1.

In FIGS. 8 to 10D, descriptions of the same contents as described above are omitted, and only other parts are described.

FIG. 9 is a plan view of a solar cell formed as an integral individual element by attaching an insulating member 200 to the rear surface of the semiconductor substrate 110 shown in FIG. 8, and FIG. 10A is a second electrode C142 shown in FIG. ) Shows a cross-section of the line 10a-10a in the second direction y so as to overlap with the line 10b-10b in the second direction y so as to overlap the first electrode C141 shown in FIG. 9 FIG. 10C is a cross-sectional view of a line 10c-10c in the first direction x so as to overlap with the second auxiliary electrode P142 shown in FIG. 9, and FIG. 10D is shown in FIG. A cross section of the 10d-10d line is shown in the first direction x so as to overlap the first auxiliary electrode P141.

According to the present invention, a solar cell in which the semiconductor substrate 110 and the insulating member 200 are individually connected to each other to form an integrated individual element is a first electrode C141 as shown in FIG. 8A. ) And the second electrode C142 on the rear surface of the semiconductor substrate 110 formed in the second direction y, as shown in FIG. 8B, the first auxiliary electrode P141 and the second auxiliary electrode It may be formed by attaching the entire surface of the insulating member 200 in which P142 is formed in the first direction x.

When connected in this way, as shown in FIG. 9, when viewed from the front of the semiconductor substrate 110, the first electrode C141, the first auxiliary electrode P141, the second electrode C142, and the second auxiliary electrode (P142) may form a lattice shape.

At this time, as shown in FIG. 10A, the second electrode C142 extending in the second direction y and the second auxiliary electrode P142 extending in the first direction x cross each other and overlap each other. Silver may be connected to each other by the first conductive connector CA1, and a portion where the second electrode C142 and the first auxiliary electrode P141 cross and overlap each other may be insulated from each other by filling the insulating layer IL.

In addition, as shown in FIG. 10B, a portion where the first electrode C141 extending in the second direction y and the first auxiliary electrode P141 extending in the first direction x cross each other and overlap each other. They may be connected to each other by the first conductive connector CA1, and a portion where the first electrode C141 and the second auxiliary electrode P142 cross and overlap each other may be insulated from each other by filling the insulating layer IL.

In addition, as shown in FIG. 10C, the insulating layer IL may be filled in the spaced apart space between the second auxiliary electrode P142 and the first auxiliary electrode pad PP141, and the second auxiliary electrode pad PP142. A second area that does not overlap with the semiconductor substrate 110 may be exposed to the outside. .

In addition, as shown in FIG. 10D, the insulating layer IL may also be filled in a space spaced apart between the first auxiliary electrode P141 and the second auxiliary electrode pad PP142, and the first auxiliary electrode pad PP141. A second area that does not overlap with the semiconductor substrate 110 may be exposed to the outside.

11 to 13D are diagrams for explaining a third embodiment of an integrated individual device in which a semiconductor substrate and an insulating member are formed separately from each other in the solar cell module of FIG. 1.

In FIGS. 11 to 13D, descriptions of the same contents as described above are omitted, and only other parts are described.

Here, FIGS. 11A and 11B illustrate a case in which the first electrode C141 and the second electrode C142 are formed in the first direction x on the rear surface of the semiconductor substrate 110, and FIG. 11(c) and (d) illustrate a case in which the first auxiliary electrode P141 and the second auxiliary electrode P142 are formed as a shelt electrode on the front surface of the insulating member 200.

12 is a plan view of a shape in which an insulating member 200 is attached to the rear surface of the semiconductor substrate 110 shown in FIG. 11, and FIG. 13A is a second direction y so as to overlap the second auxiliary electrode P142 in FIG. 12. ) Shows a cross-section of line 13a-13a, and FIG. 13b shows a cross-section of line 13b-13b in a second direction y so as to overlap with the first auxiliary electrode P141 in FIG. 12, and FIG. In FIG. 12, a cross section of the line 13c-13c is shown in the first direction (x) so as to overlap with the second electrode C142, and FIG. 13D is the first direction (x) so as to overlap the first electrode C141 in FIG. ) Shows a cross section of the line 13d-13d.

According to the present invention, a solar cell in which the semiconductor substrate 110 and the insulating member 200 are individually connected to each other to form an integrated individual element is a first electrode C141 as shown in FIG. 11A. ) And the second electrode C142 on the rear surface of the semiconductor substrate 110 formed in the first direction x, as shown in FIG. 11B, the first auxiliary electrode P141 and the second auxiliary electrode (P142) may be formed by attaching the entire surface of the insulating member 200 formed as one conductive electrode along the second direction y.

In this case, each of the first auxiliary electrode P141 and the second auxiliary electrode P142 may be positioned in the center of the insulating member 200 in parallel with the second direction y and spaced apart from each other by a GP1 interval.

Specifically, when attaching the insulating member 200 to the semiconductor substrate 110, among the portions of the first electrode C141 and the second electrode C142 overlapping the first auxiliary electrode P141 in FIG. A first conductive connector CA1 is applied on the first electrode C141, an insulating layer IL is applied on the second electrode C142, and the first electrode C141 overlaps the second auxiliary electrode P142 and Among the portions of the second electrode C142, in a state in which the first conductive connector CA1 is applied on the second electrode C142 and the insulating layer IL is applied on the first electrode C141, the insulating member 200 ) May be attached to the semiconductor substrate 110.

In this way, a plane of the insulating member 200 attached to the semiconductor substrate 110 is shown in FIG. 12.

* Here, as shown in FIG. 13A, in a portion overlapping with the second auxiliary electrode P142, the second auxiliary electrode P142 and the second electrode C142 are electrically connected to each other by the first conductive connector CA1. It is connected, and the second auxiliary electrode P142 and the first electrode C141 may be insulated from each other by the insulating layer IL.

In addition, as shown in FIG. 13B, in a portion overlapping with the first auxiliary electrode P141, the first auxiliary electrode P141 and the first electrode C141 are electrically connected to each other by a first conductive connector CA1. In addition, the first auxiliary electrode P141 and the second electrode C142 may be insulated from each other by the insulating layer IL.

In addition, looking at the cross-section in the first direction (x), as shown in FIG. 13C, the portion of the second electrode C142 extending in the first direction (x) overlapping the second auxiliary electrode P142 is 1 A portion that is electrically connected to the second auxiliary electrode P142 by the conductive connector CA1 and overlaps the first auxiliary electrode P141 is to be insulated from the first auxiliary electrode P141 by the insulating layer IL. I can.

In addition, as shown in FIG. 13D, a portion of the first electrode C141 extending in the first direction x and overlapping the first auxiliary electrode P141 is first assisted by the first conductive connector CA1. A portion electrically connected to the electrode P141 and overlapping the second auxiliary electrode P142 may be insulated from the first auxiliary electrode P141 by the insulating layer IL.

In this case, the insulating layer IL may also be formed between the first auxiliary electrode P141 and the second auxiliary electrode P142.

14 to 16B are diagrams for explaining a fourth embodiment of a single integrated individual device in which a semiconductor substrate and an insulating member are formed separately in the solar cell module of FIG. 1.

In FIGS. 14 to 16B, descriptions of the same contents as described above are omitted, and only other parts are described.

Here, FIGS. 14A and 14B illustrate a case in which the first electrode C141 and the second electrode C142 are formed in the second direction y on the rear surface of the semiconductor substrate 110, and FIG. In (c) and (d) of 14, each of the first auxiliary electrode P141 and the second auxiliary electrode P142 on the front surface of the insulating member 200 is in the first direction (x) as a shelt electrode. It shows the case formed.

FIG. 15 is a plan view of an insulating member 200 attached to the rear surface of the semiconductor substrate 110 shown in FIG. 14, and FIG. 16A is a first direction (x) so as to overlap with the second auxiliary electrode P142 in FIG. 15. ) Shows a cross-section of the line 16a-16a along the line, and FIG. 16B is a cross-sectional view of the line 16b-16b along the first direction x so as to overlap the first auxiliary electrode P141 in FIG. 15.

As shown in FIGS. 14A and 14B, a first electrode C141 and a second electrode C142 may be formed on the rear surface of the semiconductor substrate 110 in the second direction y, The first electrode C141 and the second electrode C142 formed in the second direction y, as shown in (c) and (d) of Fig. 14, one cylinder along the first direction (x). It may be connected to cross the first auxiliary electrode P141 and the second auxiliary electrode P142 formed as electrodes.

According to the present invention, a solar cell in which the semiconductor substrate 110 and the insulating member 200 are individually connected to form one integrated individual device is provided as shown in FIGS. 14A and 14B. On the rear surface of the semiconductor substrate 110 in which the first electrode C141 and the second electrode C142 are formed in the second direction y, as shown in FIGS. 14C and 14D, a first auxiliary electrode The entire surface of the insulating member 200 in which the P141 and the second auxiliary electrode P142 are formed as a single current electrode may be attached along the first direction x to be formed.

In this case, each of the first auxiliary electrode P141 and the second auxiliary electrode P142 may be positioned along the center of the insulating member 200 in parallel with the first direction x and spaced apart from each other by a GP2 interval.

Specifically, when attaching the insulating member 200 to the semiconductor substrate 110, the first electrode C141 and the second electrode C141 overlapping with the first auxiliary electrode P141 extending in the first direction x in FIG. 15 Among the portions of the electrode C142, a first conductive connector CA1 is applied on the first electrode C141, an insulating layer IL is applied on the second electrode C142, and extends in the first direction x. Among the portions of the first electrode C141 and the second electrode C142 overlapping with the second auxiliary electrode P142, a first conductive connector CA1 is applied on the second electrode C142, and the first electrode ( The insulating member 200 may be attached to the semiconductor substrate 110 while the insulating layer IL is applied over the C141.

As described above, a plan view of the insulating member 200 attached to the semiconductor substrate 110 is shown in FIG. 15.

Therefore, as shown in FIG. 16A, in the portion overlapping the second auxiliary electrode P142, the second auxiliary electrode P142 and the second electrode C142 are electrically connected to each other by the first conductive connector CA1. Also, the second auxiliary electrode P142 and the first electrode C141 may be insulated from each other by the insulating layer IL.

In addition, as shown in FIG. 16B, in a portion overlapping with the first auxiliary electrode P141, the first auxiliary electrode P141 and the first electrode C141 are electrically connected to each other by a first conductive connector CA1. In addition, the first auxiliary electrode P141 and the second electrode C142 may be insulated from each other by the insulating layer IL.

As described above, as shown in FIGS. 11 to 16B, when each of the first auxiliary electrode P141 and the second auxiliary electrode P142 is formed as a single current electrode, precise alignment is not required, and alignment Because it is very easy to match, it is possible to further shorten the manufacturing time of the solar cell.

A method of connecting the semiconductor substrate 110 and the insulating member 200 to each other through the first conductive connector CA1 will be described. To this end, a first embodiment of one individual element formed by connecting one semiconductor substrate 110 and one insulating member 200 will be described as an example.

17 to 19 are diagrams for explaining a first embodiment of a method of connecting a semiconductor substrate and an insulating member to form one integrated individual device in the solar cell module of FIG. 1.

FIG. 17A is a case where the first conductive connector CA1 is applied on the first electrode C141 and the second electrode C142 of the semiconductor substrate 110, and FIG. 17B is It is a cross section along the lines 17(b)-17(b) from (a).

According to the present invention, a method of forming a solar cell formed of a single integrated individual element in which the semiconductor substrate 110 and the insulating member 200 are individually connected to each other is as follows.

First, as shown in (a) and (b) of FIG. 17, an insulating layer IL is formed between the first electrode C141 and the second electrode C142 formed to be spaced apart from each other in the first direction x. The insulating material IL' to be formed may be applied, and a first conductive connecting material CA1' for forming the first conductive connecting material CA1 may be applied on the rear surfaces of each of the first electrode C141 and the second electrode C142. ) May be spaced apart in the first direction (x) so that a plurality of them may be arranged. However, unlike shown, the first conductive connection material CA1 ′ may be continuously applied to the rear surfaces of the first electrode C141 and the second electrode C142 without being separated from each other.

In this case, the first conductive connection material CA1 ′ may be a ball type or a stud type, and may include at least one of Sn, Cu, Ag, and Bi, and as an example, solder It can be formed into balls.

In this case, the diameter RCA1 ′ of the first conductive connection material CA1 ′ may be smaller than the width WC141 of the first electrode C141 or the width WC142 of the second electrode C142, for example, 1 The diameter RCA1' of the conductive connection material CA1' may range from 5% to 95% of the width WC141 of the first electrode C141 or the width WC142 of the second electrode C142, and It may be formed with a diameter between 5㎛ ~ 100㎛.

Here, the melting point of the first conductive connection material CA1 ′ may be lower than the melting point of the insulating member 200. For example, if the melting point of the first conductive connection material CA1 ′ is between 130°C and 250°C, the melting point of the insulating member 200 may be higher, and for example, 300°C or higher.

In addition, the insulating material IL' applied between the first electrode C141 and the second electrode C142 may be an epoxy resin. The melting point of the insulating material IL' may be equal to or lower than the melting point of the first conductive connection material CA1'.

18, the first electrode C141 and the first auxiliary electrode P141 are formed on the rear surface of the semiconductor substrate 110 on which the insulating material IL' and the first conductive connection material CA1' are formed as described above. A soldering process for attaching the front surface of the insulating member 200 on the rear surface of the semiconductor substrate 110 by aligning the second electrode C142 and the second auxiliary electrode P142 to overlap each other. Can be done.

In such a soldering process, while a heat treatment process between 130°C and 250°C is performed on the insulating member 200, a pressing process of applying an appropriate pressure may be applied in parallel.

In this case, the heat treatment process may be performed in a state in which high-temperature air is continuously applied to the first conductive connection material CA1 ′, or the semiconductor substrate 110 is placed on a plate to which the above-described temperature is applied. .

Accordingly, as illustrated in FIG. 19, the first conductive connection material CA1 ′ is widely spread between the first electrode C141 and the first auxiliary electrode P141 by the soldering process, and the first electrode C141 ) And the first auxiliary electrode P141 may be formed with a first conductive connector CA1. In addition, the second electrode C142 and the second auxiliary electrode P142 may be similarly connected.

In addition, the insulating material IL' fills the empty spaces between the first electrode C141 and the second electrode C142, and the first auxiliary electrode P141 and the second auxiliary electrode P142 by a soldering process. An insulating layer IL may be formed.

This method can minimize thermal expansion stress on the semiconductor substrate 110 when forming the first auxiliary electrode P141 and the second auxiliary electrode P142 on the rear surface of the semiconductor substrate 110, Since the electrode of 110) can be formed thicker, the resistance of the electrode can be minimized. Accordingly, the short-circuit current can be further improved.

20 to 22 are diagrams for explaining a second embodiment of a method of connecting a semiconductor substrate and an insulating member to form one integrated individual element in the solar cell module of FIG. 1.

Unlike the previous method, as shown in FIG. 20, a conductive adhesive layer PCA1 + BIL may be used to form the first conductive connector CA1.

Specifically, the conductive adhesive layer (PCA1 + BIL) may be formed of a plurality of conductive metal particles (PCA1) distributed in the base (BIL) of the insulating material. The size or diameter of the conductive metal particles PCA1 (RPCA1) may be smaller than the distance between the first electrode C141 and the second electrode C142, and/or the first auxiliary electrode P141 and the second electrode. It may be smaller than the interval between the auxiliary electrodes P142. As an example, the diameter (RPCA1) of the conductive metal particles PCA1 is the distance DCE between the first electrode C141 and the second electrode C142 or the first auxiliary electrode P141 and the second auxiliary electrode P142 It may be formed between approximately 5% to 50% of the interval between. However, it is not necessarily limited thereto.

The conductive adhesive layer PCA1+BIL may be applied on the first electrode C141 and the second electrode C142 formed on the rear surface of the semiconductor substrate 110 as illustrated in FIG. 20.

Thereafter, as shown in FIG. 21, the first auxiliary electrode P141 and the second auxiliary electrode P142 formed on the front surface of the insulating member 200 are overlapped with the first electrode C141 and the second electrode C142. The insulating member 200 may be attached to the rear surface of the semiconductor substrate 110 by aligning as possible and applying appropriate pressure and heat. At this time, the temperature of the applied heat may be lower than the above-described 130 ℃ ~ 250 ℃.

Accordingly, as shown in FIG. 22, a plurality of parts overlapping the first electrode C141 and the first auxiliary electrode P141 and the overlapping portion of the second electrode C142 and the second auxiliary electrode P142 The conductive metal particles (PCA1) are in close contact with each other to form the first conductive connector (CA1), and in the non-overlapping part, the conductive metal particles (PCA1) are separated from each other within the base of the insulating material (BIL). (IL) can be formed.

Until now, only various structures in which the semiconductor substrate 110 and the insulating member 200 are connected individually, and a method of connecting the semiconductor substrate 110 and the insulating member 200, respectively, have been described. A structure and method in which four solar cells are connected to each other through an interconnector (IC) will be described.

23A to 24 are diagrams for explaining an example of a structure in which each solar cell formed as an integrated individual element is connected to each other through an interconnector (IC) in the solar cell module shown in FIG. 1.

Here, FIG. 23A is a diagram for explaining a first embodiment of a cell string structure in which each solar cell formed as an integral individual element is connected to each other through an interconnector (IC), and FIG. 23B is a second embodiment. It is a diagram for explaining an example, and FIG. 24 is a shape as viewed from the front and the rear when each solar cell formed as an integrated individual element is connected by an interconnector (IC), and FIG. 24 (a) is Front, (b) is the shape viewed from the rear.

First, any one of the aforementioned solar cells may be applied to the first solar cell Cell-a and the second solar cell Cell-b applied to the solar cell module according to the present invention.

Accordingly, each of the first solar cell (Cell-a) and the second solar cell (Cell-b) shown in FIGS. 23A to 24, although some are not shown, the semiconductor substrate 110 and the emitter unit 121 , The rear electric field 172, the first electrode C141 and the second electrode C142, the first auxiliary electrode P141 and the second auxiliary electrode P142, the first auxiliary electrode pad PP141 and the second auxiliary An electrode pad PP142 and an insulating member 200 may be included.

In addition, each of the second auxiliary electrode pads PP142 and the first auxiliary electrode pads PP141 provided in each solar cell has a first region where the semiconductor substrate 110 overlaps, and the semiconductor substrate 110 does not overlap. It may include a second area.

In addition, all the solar cell structures described above can be applied as needed, and a detailed description thereof will be omitted since it has already been described.

As described above, each of the first solar cell (Cell-a) and the second solar cell (Cell-b) applied to the solar cell module according to the present invention includes one insulating member 200 and a semiconductor substrate 110, respectively. It can be connected to and formed as an integral individual element.

Accordingly, compared to a structure in which several semiconductor substrates 110 are attached to one insulating member 200, the present invention provides a corresponding solar cell even if any one solar cell is damaged or defective during the solar cell module manufacturing process. Since only the battery can be replaced, the process yield can be further improved.

In addition, it is possible to easily form a solar cell module without limiting the size of the front glass substrate (FG).

Here, the insulating member 200 of the first solar cell Cell-a does not overlap with the semiconductor substrate 110 of the second solar cell Cell-b, and the insulating member 200 of the second solar cell Cell-b 200 may not overlap with the semiconductor substrate 110 of the first solar cell Cell-a.

Accordingly, the first auxiliary electrode pad PP141 included in the first solar cell Cell-a and the second auxiliary electrode pad PP142 included in the second solar cell Cell-b may be spaced apart from each other.

The solar cell modules in which the first solar cell Cell-a and the second solar cell Cell-b are connected to each other may be connected to each other through an interconnector IC as shown in FIG. 23A.

That is, the interconnector IC electrically connects the second auxiliary electrode pad PP142 of the first solar cell Cell-a and the first auxiliary electrode pad PP141 of the second solar cell Cell-b. Alternatively, the first auxiliary electrode pad PP141 of the first solar cell Cell-a and the second auxiliary electrode pad PP142 of the second solar cell Cell-b may be electrically connected.

As a specific example, the insulating member 200 of each of the first solar cell (Cell-a) and the second solar cell (Cell-b) is overlapped with the interconnector (IC), the interconnector (IC) is a first solar cell The first auxiliary electrode exposed to the outside of the semiconductor substrate 110 of the first solar cell Cell-a among the regions of the first auxiliary electrode pad PP141 formed at one end of the insulating member 200 of (Cell-a) One end of the second auxiliary electrode pad PP142 formed on the other end of the insulating member 200 of the second solar cell Cell-b is connected to one end overlapping the second region PP141-S2 of the pad PP141. Among the regions, the other end may be connected to the second region PP142-S2 of the second auxiliary electrode pad PP142 exposed outside the semiconductor substrate 110 of the second solar cell Cell-b.

In this case, as shown in FIG. 23A, the interconnector IC and the first auxiliary electrode pad PP141, or the interconnector IC and the second auxiliary electrode pad PP142 are formed by a second conductive connector CA2. Can be electrically connected. Here, the second conductive connector CA2 may be connected with the same material as the first conductive connector CA1 described above. Here, the interconnector IC may be formed of a conductive metal, and for example, may be formed of at least one of Cu, Au, Ag, or Al. In addition, the second conductive connector CA2 may be formed of the same material as the first conductive connector CA1 described above.

Alternatively, unlike FIG. 23A, as shown in FIG. 23B, as shown in FIG. 23B, the interconnector IC and the first auxiliary electrode pad PP141, or the interconnector IC and the second auxiliary electrode pad PP142 May be electrically connected by direct physical contact with heat and pressure, without a separate second conductive connector CA2.

In addition, as shown in FIGS. 23A and 23B, between the interconnector IC and the semiconductor substrate 110 of the first solar cell Cell-a or between the interconnector IC and the second solar cell Cell-b ) Between the semiconductor substrates 110 may be spaced apart from each other. However, this is not essential, and it is possible to form the interconnector IC and the semiconductor substrate 110 without being spaced apart.

However, when the interconnector (IC) and the semiconductor substrate 110 are spaced apart, the thermal expansion stress on the semiconductor substrate 110 can be minimized, and through the interconnector (IC), optical gain of the solar cell module (optical gain) Since gain) can be further increased, a case where the interconnector IC and the semiconductor substrate 110 are spaced apart will be described as an example.

When the interconnector (IC) and the semiconductor substrate 110 are spaced apart, as shown in FIGS. 23A to 24, the solar cell module according to the present invention includes an interconnector (IC) and a first solar cell (Cell-a). ) Is spaced apart by a first gap (GSI1), and between the interconnector (IC) and the semiconductor substrate 110 of the second solar cell (Cell-b) by a second gap (GSI2) Can be.

In addition, the interconnector IC may overlap the insulating member 200 of the first solar cell Cell-a and the insulating member 200 of the second solar cell Cell-b.

Therefore, when the first solar cell (Cell-a) and the second solar cell (Cell-b) are viewed from the front, as shown in Fig. 24A, the interconnector IC is the first solar cell ( Cell-a) and the second solar cell (Cell-b) may be attached to the front surface of the insulating member 200, when viewed from the rear, part of both ends of the interconnector (IC) is the first solar cell (Cell- a) and the insulating member 200 of the second solar cell Cell-b may be overlapped and covered.

Accordingly, without directly connecting the interconnector IC to the semiconductor substrate 110 of the first solar cell Cell-a and the second solar cell Cell-b, the semiconductor substrate ( 110), so when connecting the interconnector (IC) and the first solar cell (Cell-a) or the interconnector (IC) and the second solar cell (Cell-b), the semiconductor Since it is not necessary to directly apply heat to the substrate 110, the thermal expansion stress on the semiconductor substrate 110 of each solar cell can be minimized.

In addition, since the distance between the first solar cell Cell-a and the second solar cell Cell-b can be set more freely, it is possible to be more free from restrictions depending on the size of the solar cell module.

In addition, the light incident between the semiconductor substrate 110 of the first solar cell (Cell-a) and the semiconductor substrate 110 of the second solar cell (Cell-b) is reflected, and the reflected light is a front glass substrate (FG). ) Again to be incident on the semiconductor substrate 110 of the first solar cell (Cell-a) and the semiconductor substrate 110 of the second solar cell (Cell-b), thereby further increasing the optical gain. I can. Accordingly, the efficiency of the solar cell can be further increased.

Here, the first gap (GSI1) between the semiconductor substrate 110 of the first solar cell (Cell-a) and the interconnector (IC) and the semiconductor substrate 110 and the interconnector of the second solar cell (Cell-b) The second interval GSI2 between (IC) may be the same or different from each other, and the width of the second region PP141-S2 of the first auxiliary electrode pad PP141 exposed outside of each semiconductor substrate 110, or It may be freely set according to the size of the width of the second region PP142-S2 of the second auxiliary electrode pad PP142.

23A to 24 illustrate that the interconnector IC is connected to the front surfaces of the first auxiliary electrode pad PP141 and the second auxiliary electrode pad PP142 as an example, but the interconnector IC is the first It may be connected to the rear surface of the auxiliary electrode pad PP141 and the second auxiliary electrode pad PP142.

FIG. 25 is a diagram for explaining another example of a structure in which each solar cell formed as an integral individual element is connected to each other through an interconnector (IC) in the solar cell module shown in FIG. 1.

As shown in FIG. 25, the interconnector IC may be connected to the rear surfaces of the first auxiliary electrode pad PP141 and the second auxiliary electrode pad PP142.

At this time, the solar cell applied to the solar cell module shown in FIG. 1 is a first auxiliary electrode pad PP141 and a second auxiliary electrode pad PP142 as illustrated in FIG. 25, as briefly described above in FIG. 4. The end of each of the first direction (x) may be formed to protrude more than the end of the insulating member 200 may be applied.

In this way, as the ends of each of the first auxiliary electrode pad PP141 and the second auxiliary electrode pad PP142 are formed to protrude more than the ends of the insulating member 200, the first auxiliary electrode pad PP141 and the second auxiliary electrode pad PP141 The rear surface of the auxiliary electrode pad PP142 may be exposed to the outside, and accordingly, the interconnector IC may be connected to the rear surfaces of the first auxiliary electrode pad PP141 and the second auxiliary electrode pad PP142.

In this case, when the interconnector IC is connected to the rear surfaces of the first auxiliary electrode pad PP141 and the second auxiliary electrode pad PP142, even if the second conductive connector CA2 is undesirably spread out, the second There is no fear that the first auxiliary electrode pad PP141 and the second auxiliary electrode P142 are shorted to each other or the second auxiliary electrode pad PP142 and the first auxiliary electrode P141 are shorted to each other by the conductive connector CA2. In this way, the manufacturing process of the solar cell module can be made easier, and the process yield can be further improved. As such, the ends of each of the first auxiliary electrode pad PP141 and the second auxiliary electrode pad PP142 are The structure protruding more than the end of the insulating member 200 may be formed by integrally attaching the insulating member 200 to the semiconductor substrate 110 and then removing the end of the insulating member 200.

In FIGS. 23A to 25, a case in which the front surface of the interconnector IC has a flat surface has been described as an example, but the front surface of the interconnector IC may have irregularities.

FIG. 26 is a diagram illustrating an interconnector (IC) according to the first embodiment in order to increase an optical gain in the solar cell module shown in FIG. 1.

As shown in FIG. 26, irregularities are formed on the front surface of the interconnector ICA according to the first embodiment, and the thickness may not be uniform. Accordingly, light incident into the space between the first solar cell (Cell-a) and the second solar cell (Cell-b) through the front glass substrate (FG) of the solar cell module is transmitted to the front surface of the interconnector (ICA). It is reflected by the irregularities provided in the front glass substrate FG and the first solar cell (Cell-a) and the second solar cell (Cell-b) to be incident on the semiconductor substrate 110 again.

Accordingly, power can be generated even from light incident into the spaced space between the first solar cell (Cell-a) and the second solar cell (Cell-b), further improving the photoelectric conversion efficiency of the solar cell module. I can make it.

FIG. 27 is a view for explaining an interconnector IC according to a second embodiment in order to cope with the expansion and contraction of thermal expansion and contraction of an insulating member while improving optical gain in the solar cell module shown in FIG. 1.

As shown in FIG. 27, the cross-section of the interconnector ICB according to the second embodiment of the present invention may have a zigzag shape, and at this time, the cross-sectional thickness of the interconnector IC may be uniform. .

In this case, the interconnector ICB according to the second embodiment of the present invention includes not only the reflective function described in FIG. 26 but also the insulating member of the first solar cell Cell-a and the second solar cell Cell-b. 200) can respond to thermal expansion and expansion and contraction due to thermal contraction.

Specifically, the temperature inside the solar cell module rises while the solar cell module is operating, so that the insulating member 200 of the first solar cell (Cell-a) and the second solar cell (Cell-b) is moved in the first direction (x ) To thermally expand or contract.

Therefore, the spaced apart distance between the insulating member 200 of the first solar cell (Cell-a) and the insulating member 200 of the second solar cell (Cell-b) may be reduced or increased. In this case, FIG. The interconnector IC as shown in Fig. 27 has a length corresponding to the expansion and contraction of the insulating member 200 of the first solar cell Cell-a and the insulating member 200 of the second solar cell Cell-b. It may increase or decrease in the first direction x. Accordingly, the durability of the solar cell module can be further improved.

FIG. 28 is a diagram for describing an example of an overall plan structure of the solar cell module shown in FIG. 1.

As shown in (a) of FIG. 28, in the solar cell module according to the present invention, each of a plurality of solar cells formed of one integrated individual element by connecting the semiconductor substrate 110 and the insulating member 200 separately Cell strings connected in series in the first direction x may be disposed on the rear surface of the front glass substrate FG.

Specifically, the front surface of each semiconductor substrate 110 included in the plurality of cell strings ST-1, ST-2, and ST-3 is disposed to face the rear surface of the front glass substrate FG, and an insulating member ( 200) may be disposed to face in a direction opposite to the front glass substrate FG.

In addition, as shown in (b) of FIG. 28, such a cell string may include a first cell string ST-1 and a second cell string ST-2, and the front glass substrate FG Can be placed over the front of

Here, the solar cell module according to the present invention connects the first cell string ST-1 and the second cell string ST-2 extending in the first direction x in series in the second direction y. Conductive ribbons RB1 and RB2 may be further included.

As a specific example, in (b) of FIG. 28, the first conductive ribbon RB1 formed in the second direction y is the first conductive ribbon included in the last solar cell Cell-a of the first cell string ST-1. The first auxiliary electrode pad PP141 and the second auxiliary electrode pad PP142 included in the last solar cell Cell-e of the second cell string ST-2 may be connected to each other.

The second conductive ribbon RB2 includes the first auxiliary electrode pad PP141 included in the last solar cell Cell-h opposite the second cell string ST-2 and the last solar cell Cell- The second auxiliary electrode pads PP142 included in l) may be connected to each other.

At this time, as shown in (a) of FIG. 28, since each cell string is disposed so that the semiconductor substrate 110 faces the front glass substrate FG, the first auxiliary electrode pad formed on the front surface of the insulating member 200 (PP141) or the second auxiliary electrode pad (PP142) may not be visible, and thus, the manufacturing process of the solar cell module may be relatively difficult.

However, in the present invention, some structures such as the first auxiliary electrode pad PP141, the second auxiliary electrode pad PP142, or the insulating member 200 included at the end of the cell string are changed, , It is possible to connect the conductive ribbons RB1 and RB2 more easily.

Hereinafter, a structure of the last solar cell in which a plurality of cell strings ST-1, ST-2, and ST-3 can be more easily connected with a conductive ribbon will be described.

29 to 31 are cross-sectional views taken along lines 29-29 of FIG. 28, and are diagrams for explaining first to third embodiments in which the structure of the last solar cell in the cell string is changed to connect the conductive ribbon. to be.

According to the present invention, a first embodiment in which a plurality of cell strings ST-1, ST-2, and ST-3 are connected to each other through ribbons RB1 and RB2 is shown in FIG. 29.

The solar cell positioned at the end of each of the cell strings ST-1, ST-2, and ST-3 includes the insulating member 200 overlapping the first auxiliary electrode pad PP141 or the second auxiliary electrode pad PP142. A portion of the area may include a folded portion 200' such that the first auxiliary electrode pad PP141 or the second auxiliary electrode pad PP142 is exposed, and the conductive ribbon is exposed by folding the insulating member 200 as described above. It may be attached to a portion of the first auxiliary electrode pad PP141 or the second auxiliary electrode pad PP142 to be formed.

As an example, as shown in FIG. 29, in the solar cell Cell-a positioned at the end of the first cell string ST-1, the insulating member 200 overlapping the second auxiliary electrode pad PP142. When the part WST1 of) is separated and folded, the rear part WST1 of the second auxiliary electrode pad PP142 may be exposed to the outside.

In this way, the first conductive ribbon RB1 can be easily connected to the area where the rear portion WST1 of the second auxiliary electrode pad PP142 is exposed to the outside. In addition, the solar cell Cell-e positioned at the end of the second cell string ST-2 in FIG. 28 may also have a structure in which a rear portion of the first auxiliary electrode pad PP141 is exposed to the outside.

Here, the width WST1 of the exposed rear portion of the second auxiliary electrode pad PP142 may be the same as the width WST1 of the folded portion of the insulating member 200. In addition, as shown in FIG. 29, the width WST1 of the exposed rear portion of the second auxiliary electrode pad PP142 may be the same as the width WRB1 of the ribbon RB1. However, the present invention is not limited thereto, and the width WRB1 of the ribbon RB1 may be larger or smaller than the width WST1 of the exposed rear portion of the second auxiliary electrode pad PP142.

In addition, the second embodiment in which the structure of the last solar cell in each cell string is changed to facilitate connection of the conductive ribbon is as follows.

In FIG. 28, the first auxiliary electrode pad PP141 or the second auxiliary electrode pad PP142 included in the last solar cell of each cell string ST-1, ST-2, and ST-3 is an insulating member 200 A portion extending to cover a portion of the rear surface of the insulating member 200 may be further included, and conductive ribbons RB1 and RB2 on the first auxiliary electrode pad PP141 or the second auxiliary electrode pad PP142 formed at the rear portion of the insulating member 200 Can be connected.

As an example, as shown in FIG. 30, the last solar cell Cell-a of the first cell string ST-1 has an insulating member facing the front glass substrate FG. In addition to the first portion PP142-1 formed on the front surface of 200), the second portion PP142-2 formed on the side surface of the insulating member 200 and the second portion PP142-2 formed on the side surface of the insulating member 200 It may further have three parts (PP142-3).

Accordingly, even if the last solar cell Cell-a of the first cell string ST-1 is disposed so that the front surface of the insulating member 200 faces the front glass substrate FG, a portion of the rear surface of the insulating member 200 Since the third portion PP142-3 of the second auxiliary electrode pad PP142 is exposed at WST2, the ribbon RB1 can be easily connected to the exposed third portion PP142-3.

In addition, the third embodiment in which the structure of the last solar cell in each cell string is changed in order to facilitate connection of the conductive ribbon is as follows.

In FIG. 28, the first auxiliary electrode pad PP141 or the second auxiliary electrode pad PP142 included in the last solar cell of each cell string ST-1, ST-2, and ST-3 is an insulating member 200 The ribbons RB1 and RB2 may further include portions of the first auxiliary electrode pad PP141 or the second auxiliary electrode pad PP142 formed longer than the length of the insulating member 200 Can be connected to

For example, as illustrated in FIG. 31, in the last solar cell Cell-a of the first cell string ST-1, a partial region of the insulating member 200 overlapping the second auxiliary electrode P142 ( By removing the WST3), the first auxiliary electrode pad PP141 or the second auxiliary electrode pad PP142 may be formed to be longer than the length of the insulating member 200.

Here, a method of removing the partial region WST3 of the insulating member 200 is as follows.

In the process of manufacturing a solar cell, an insulating member 200 overlapping with the first auxiliary electrode pad PP141 or the second auxiliary electrode pad PP142 of the selected solar cell by randomly selecting a solar cell to be disposed at the end of the cell string ) The end (WST3) of the local high-temperature heat treatment (for example, a laser may be used) to expose the rear portion (WST3) of the first auxiliary electrode pad (PP141) or the second auxiliary electrode pad (PP142). can do.

In this way, by configuring the solar cell in which the rear portion WST3 of the first auxiliary electrode pad PP141 or the second auxiliary electrode pad PP142 is exposed as the last solar cell of each cell string, the first auxiliary electrode pad PP141 ) Or the ribbons RB1 and RB2 are easily connected to the portion WST3 where the rear surface of the second auxiliary electrode pad PP142 is exposed, so that each cell string may be connected in series.

32A and 32B are diagrams illustrating a fourth embodiment in which an insulating member included in the last solar cell is removed from a cell string for connection of a conductive ribbon in the solar cell module according to FIG. 28.

As shown in FIG. 32A, in the fourth embodiment in which the structure of the last solar cell is changed, the last solar cell of each cell string may be a solar cell from which the insulating member 200 is removed, unlike the solar cell described above.

Therefore, since the last solar cell in each cell string does not have the insulating member 200, the rear surface of the first auxiliary electrode pad PP141 or the second auxiliary electrode pad PP142 may be exposed to the outside, and the ribbons RB1 and RB2 ) Is attached to the rear surface of the exposed first auxiliary electrode pad PP141 or the second auxiliary electrode pad PP142, so that each cell string can be connected in series.

Specifically, as shown in (a) of FIG. 32A, the insulating member 200 may be removed from the last solar cell of each cell string according to the present invention. In this case, when the last solar cell of the cell string is disposed on the front glass substrate FG, as shown in FIG. 32A(b), the last solar cell is as shown in FIG. 32B showing a cross section along the line 32b-32b, The second auxiliary electrode pad PP142 or the rear surface of the first auxiliary electrode pad PP141 facing the front glass substrate FG may be exposed as it is.

In this case, the rear surface of the second auxiliary electrode pad PP142 exposed from the last solar cell of each string and the rear surface of the first auxiliary electrode pad PP141 may be easily connected to each other by the ribbons RB1 and RB2.

Until now, in order to facilitate the connection of the ribbon, some structures have been made so that at least a portion of the rear surface of the first auxiliary electrode pad PP141 or the second auxiliary electrode pad PP142 included in the last solar cell of each cell string is exposed. Although the case of the change has been described as an example, unlike this, the ribbon can be more easily connected by changing the manufacturing method of the solar cell module without changing the structure of the last solar cell at all.

As such, an example in which the structure of the last solar cell is not changed at all is as follows.

33A and 33B are diagrams for explaining a fifth embodiment in which the structure of the last solar cell is not changed in the solar cell module according to FIG. 28.

33A, in the last solar cell of each cell string, the rear surface of the first auxiliary electrode pad PP141 or the second auxiliary electrode pad PP142 is not exposed. 2 When the ribbons RB1 and RB2 are connected to the front of the auxiliary electrode pad PP142, the plurality of cell strings ST-1, ST-2, and ST-3 are arranged on the front glass substrate FG. When viewed from the rear, the ribbons RB1 and RB2 are covered by the insulating member 200 of the last solar cell of each cell string.

Accordingly, looking at a cross section along the line 33b-33b in FIG. 33a, as shown in FIG. 33b, the ribbons RB1 and RB2 are between the front surface of the second auxiliary electrode pad PP142 and the rear surface of the front glass substrate FG. Can be located in A method of forming such a structure will be described later in the second and third embodiments of the solar cell module manufacturing method.

So far, the structure of the solar cell and the solar cell module according to the present invention has been described. Hereinafter, a method of manufacturing such a solar cell and a solar cell module will be described.

34A to 34G are diagrams for explaining an example of a method of manufacturing a solar cell as an integrated individual device and a method of manufacturing a cell string according to the present invention.

First, as shown in (a) and (b) of FIG. 34A, a first electrode C141 and a second electrode C142 may be formed on the rear surface of the semiconductor substrate 110 through a semiconductor manufacturing process. .

Here, the method of manufacturing the emitter part 121, the rear electric field part 172, and the antireflection film 130 formed on the semiconductor substrate 110 is not particularly limited, and the structure is as previously described in FIGS. 2 to 6 It is the same, so it is omitted.

Next, the rear surface of one semiconductor substrate 110 on which the first electrode C141 and the second electrode C142 are formed is replaced with one insulating member 200 on which the first auxiliary electrode P141 and the second auxiliary electrode P142 are formed. ), as shown in FIG. 34B, the front surface of the semiconductor substrate 110 faces downward, and then the first electrode C141 and the second electrode C142 respectively have a first A conductive connector CA1 may be applied, and an insulating layer IL may be applied on the rear surface of the semiconductor substrate 110 exposed by being spaced apart from the first electrode C141 and the second electrode C142. However, the process of forming the first conductive connecting material and the insulating layer is not limited thereto and may be changed.

Here, as shown in FIG. 34B, the insulating layer IL may be applied higher than the height of the first conductive connector CA1.

Next, as shown in FIG. 34C, in a state in which the first auxiliary electrode P141 and the second auxiliary electrode P142 formed on the insulating member 200 overlap each other, in the direction of the arrow through a pressing and heating process. The front surface of the insulating member 200 may be attached on the rear surface of the semiconductor substrate 110.

Accordingly, as shown in FIG. 34D, the semiconductor substrate 110 and the insulating member 200 are individually connected to each other to manufacture a solar cell formed as an integrated individual device.

Thereafter, in order to connect a plurality of solar cells formed as an integrated individual device to each other by an interconnector (IC), as shown in FIG. 34D, the front surfaces of the semiconductor substrate 110 and the insulating member 200 face upward. Can be arranged to do so.

That is, after the process according to FIG. 34C, as shown in FIG. 34D, the solar cell formed by bonding the semiconductor substrate 110 and the insulating member 200 may be turned over.

Thereafter, as shown in FIG. 34E, the first auxiliary electrode pad PP141 and the second auxiliary electrode pad PP142 exposed outside the semiconductor substrate 110 in each of a plurality of solar cells formed as one integrated individual element A second conductive connector CA2 may be applied on the entire surface of the second region.

Next, in a state in which a plurality of solar cells formed as an integrated individual element are arranged in the first direction (x) so as to be adjacent to each other in series, the interconnector (IC) is attached in the direction of the arrow along with an appropriate pressing and heating process. As shown in FIG. 34F, the first auxiliary electrode pad PP141 and the second auxiliary electrode pad PP142 of each of the plurality of solar cells may be connected to each other.

By repeating such a process, as shown in FIG. 34G, a cell string ST in which a plurality of solar cells formed of one integrated individual element are connected in series may be formed.

Looking at the cell string ST from the front, as shown in (a) of FIG. 34G, the first auxiliary electrode pad PP141 of each solar cell (Cell-a to Cell-d) along with the interconnector (IC) The second auxiliary electrode pad PP142 may be exposed, and when the cell string ST is viewed from the rear side, as shown in (b) of FIG. 34G, the first auxiliary electrode pad PP141 and the second auxiliary electrode pad PP142 May be covered by the insulating member 200.

Here, if, considering connecting the two cell strings ST in series with the ribbons RB1 and RB2, the last solar cells Cell-a and Cell-d of the cell string ST are described in FIG. If configured as described above, in one of the last solar cells on both sides of the cell string ST (Cell-a), the third portion (PP142-3) of the second auxiliary electrode pad (PP142) is formed on the rear surface of the insulating member 200 As for the other cell-d, the third portion PP141-3 of the first auxiliary electrode pad PP141 may be formed on a portion of the rear surface of the insulating member 200.

In the method of manufacturing the cell string ST here, the second embodiment of the last solar cell of the cell string is described as an example, but in addition to the first embodiment, the third to fifth embodiments can be applied in the same manner. However, the structure of the last solar cell of the cell string may be configured as a solar cell according to each embodiment.

Hereinafter, various embodiments of a method of manufacturing a solar cell module will be described.

35A to 35G are diagrams for explaining a first embodiment of a method of manufacturing the solar cell module shown in FIGS. 1 and 28.

The first embodiment of the method for manufacturing a solar cell module according to the present invention is, first, as shown in FIG. 35A, in a state in which the front glass substrate FG is disposed, and an upper encapsulant on the rear surface of the front glass substrate FG. (EC1) can be applied.

Thereafter, as shown in FIG. 35B, the cell string described in FIG. 34G may be disposed on the upper encapsulant EC1. In this case, as shown in FIG. 35B, the front surfaces of the semiconductor substrate 110 of the first solar cell Cell-a and the second solar cell Cell-b included in the cell string are formed of the front glass substrate FG. It can be placed facing the back.

Accordingly, as shown in FIG. 35C, the plurality of cell strings ST-1, ST-2, and ST-3 disposed on the rear surface of the front glass substrate FG are disposed in an upside down state, and the insulating member 200 ) Can be arranged so that the back of the face is upward.

Accordingly, as shown in FIGS. 35C and 35D, the first auxiliary formed on the rear surface of the insulating member 200 in the solar cell positioned at the end of each cell string ST-1, ST-2, and ST-3 The electrode pad PP141 or the third portions PP142-3 and PP141-3 of the second auxiliary electrode pad PP142 may be exposed to the outside.

Thereafter, as shown in FIG. 35E, in the last solar cell of the plurality of cell strings ST-1, ST-2, and ST-3, the third portion PP142-3 of the second auxiliary electrode pad PP142 and The third portion PP141-3 of the first auxiliary electrode pad PP141 may be connected to the ribbons RB1 and RB2.

Thereafter, as shown in FIG. 35F, in a state in which the cell string ST is connected by ribbons RB1 and RB2, the lower encapsulant EC2 and the rear sheet BS are disposed on the rear surface of the cell string, and then laminated. Through the process, as shown in Figure 35g, it is possible to manufacture a solar cell module. In this case, during the laminating process, the upper encapsulant EC1 and the lower encapsulant EC2 may fill the spaced space between each solar cell and between each cell string.

Until now, a method of manufacturing a solar cell in which the ribbons RB1 and RB2 are connected on the rear surface of the insulating member 200 included in the last solar cell has been described, but differently, the ribbons RB1 and RB2 are included in the last solar cell. It may be connected on the front surface of the insulating member 200.

36A and 36B are views for explaining a second embodiment of the method of manufacturing the solar cell module shown in FIGS. 1 and 28.

The second embodiment of the method for manufacturing a solar cell module according to the present invention is first, as shown in FIG. 36A in a state in which the upper encapsulant EC1 is applied on the rear surface of the front glass substrate FG, as in step 35a. As described above, ribbons RB1 and RB2 connecting the cell strings ST-1, ST-2, and ST-3 to each other may be first disposed on the upper encapsulant EC1.

At this time, the positions where the ribbons RB1 and RB2 are disposed are the first auxiliary electrode pad PP141 or the second auxiliary electrode pad included in the last solar cell in each cell string ST-1, ST-2, and ST-3. It may be a position overlapping with (PP142).

Thereafter, as shown in FIG. 36B, a first auxiliary electrode pad PP141 or a second auxiliary electrode pad PP142 included in the last solar cell in each cell string ST-1, ST-2, and ST-3 Can be arranged so as to overlap the ribbons RB1 and RB2.

Subsequent steps are the same as those described in FIGS. 35G and 35G, and thus will be omitted. In this case, in order to connect the plurality of cell strings ST-1, ST-2, and ST-3 through the ribbons RB1 and RB2, the plurality of cell strings ST-1, ST-2, and ST- It is not necessary to separately manufacture the solar cell positioned at the end of 3), and thus the manufacturing process of the solar cell and the solar cell module can be further simplified.

Until now, a method of manufacturing a solar cell module by placing the front glass substrate (FG) first, and then placing the cell strings (ST-1, ST-2, ST-3) on the rear surface of the front glass substrate (FG) Although described, differently, in a state in which the rear sheet BS and the lower encapsulant EC2 are disposed first, the cell strings ST-1, ST-2, and ST-3 may be disposed so that the front surfaces thereof are on top. This will be described in more detail as follows.

37A to 37G are diagrams for explaining a third embodiment of the method of manufacturing the solar cell module shown in FIGS. 1 and 28.

In the following solar cell module manufacturing method, a case in which the rear sheet BS is formed in a sheet form will be described as an example. However, the same method may be applied even when the rear sheet BS is in the form of a plate.

In the third embodiment of the solar cell module manufacturing method, first, as shown in FIG. 37A, a lower encapsulant EC2 is applied to the front surface of the rear sheet BS in a state in which the rear sheet BS is first disposed. can do.

Thereafter, as shown in FIGS. 37B and 37C, the front surface of the semiconductor substrate 110 of the solar cell included in each of the cell strings ST-1, ST-2, and ST-3 may be disposed upward. .

Accordingly, as shown in FIG. 37B, in the plurality of solar cells included in each of the cell strings ST-1, ST-2, and ST-3, the front surfaces of the semiconductor substrate 110 and the insulating member 200 As they are exposed, the second region of the first auxiliary electrode pad PP141 and the second auxiliary electrode pad PP142 of the last solar cell included in each of the cell strings ST-1, ST-2, and ST-3 is also naturally It can be exposed to the outside.

Accordingly, the second auxiliary electrode pad PP142 of the last solar cell Cell-a of the first cell string ST-1 and the first of the last solar cell Cell-e of the second cell string ST-2 2 The auxiliary electrode pad PP142 may be naturally exposed to the outside.

Accordingly, as shown in FIG. 37D, the first auxiliary electrode pad PP141 and the second auxiliary electrode exposed to the outside from the solar cell included at the end of each cell string ST-1, ST-2, and ST-3 The electrode pads PP142 may be easily connected through the ribbon RB1.

In this case, a cross section of the last solar cell of the first string to which the ribbons RB1 and RB2 are connected may be as shown in FIG. 37E.

Next, as shown in Figure 37f, the ribbon (RB1, RB2) and the upper encapsulant (EC1) was applied on the front surface of each of the cell strings (ST-1, ST-2, ST-3), as shown in Figure 37g, the front glass After the substrate FG is disposed on the upper encapsulant EC1, the solar cell module may be completed through a laminating process.

As described above, in the solar cell module manufacturing method according to the third exemplary embodiment, the first auxiliary electrode pad PP141 and the second auxiliary electrode pad in each of the cell strings ST-1, ST-2, and ST-3 during the manufacturing process. Since the PP142) is exposed to the outside, it is easy to connect the ribbons RB1 and RB2, thereby making the manufacturing process of the solar cell module easier.

The above description is merely illustrative of the technical idea of the present invention, and those of ordinary skill in the technical field to which the present invention belongs can make various modifications, changes, and substitutions within the scope not departing from the essential characteristics of the present invention. will be. Accordingly, the embodiments disclosed in the present invention and the accompanying drawings are not intended to limit the technical idea of the present invention, but to explain, and the scope of the technical idea of the present invention is not limited by these embodiments and the accompanying drawings. . The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the present invention.

Claims (21)

A plurality of first electrodes formed on a back surface of a semiconductor substrate, a plurality of second electrodes formed in parallel with the first electrode on the rear surface of the semiconductor substrate, and formed on a front surface of an insulating member, A first auxiliary electrode connected to the plurality of first electrodes, and a second auxiliary electrode formed on the front surface of the insulating member and connected to the plurality of second electrodes, wherein the semiconductor substrate and the insulating member are each A first solar cell and a second solar cell connected individually to form one integrated individual element; And
Including; an interconnector electrically connecting the first solar cell and the second solar cell to each other,
The thickness of the first auxiliary electrode and the second auxiliary electrode is formed larger than the thickness of each of the first electrode and the second electrode,
The first auxiliary electrode of the first solar cell and the second auxiliary electrode of the second solar cell protrude to a region between the semiconductor substrate of the first solar cell and the semiconductor substrate of the second solar cell, and the Includes an area overlapped and connected to the interconnector,
The interconnector includes the semiconductor substrate of the first solar cell and the semiconductor of the second solar cell so as not to overlap with the semiconductor substrate of the first solar cell and the semiconductor substrate of the second solar cell when viewed from the front. Placed between the substrates,
A solar cell module in which the insulating member of the first solar cell and the insulating member of the second solar cell are spaced apart from each other between the first solar cell and the second solar cell. The method of claim 1,
The solar cell module
A front glass substrate positioned on the front surface of a cell string to which the first solar cell and the second solar cell are connected to each other by the interconnector;
An upper encapsulant positioned between the front glass substrate and the cell string;
A lower encapsulant positioned on the rear surface of the cell string; And
The solar cell module further comprising a; a rear sheet positioned on the rear surface of the lower encapsulant. The method of claim 1,
The interconnector is
A solar cell module spaced apart from the semiconductor substrate of the first solar cell or the semiconductor substrate of the second solar cell. The method of claim 1,
The insulating member of each of the first solar cell and the second solar cell overlaps the interconnector with each other. The method of claim 1,
The insulating member of the first solar cell does not overlap the semiconductor substrate of the second solar cell,
The solar cell module in which the insulating member of the second solar cell does not overlap with the semiconductor substrate of the first solar cell. The method of claim 1,
In each of the first solar cell and the second solar cell,
The area of the insulating member is equal to or larger than the area of the semiconductor substrate, and smaller than twice the area of the semiconductor substrate. The method of claim 1,
In each of the first solar cell and the second solar cell,
The first auxiliary electrode and the second auxiliary electrode extend oppositely in a first direction, which is a direction in which the first solar cell and the second solar cell are arranged,
The first auxiliary electrode further includes a first auxiliary electrode pad extending in a second direction crossing the first direction at an end extending in the first direction,
The second auxiliary electrode further includes a second auxiliary electrode pad extending in the second direction at an end extending in the first direction. The method of claim 7,
In each of the first solar cell and the second solar cell,
Each of the second auxiliary electrode pad and the first auxiliary electrode pad includes a first region where the semiconductor substrate overlaps and a second region where the semiconductor substrate does not overlap. The method of claim 7,
The first auxiliary electrode pad included in the first solar cell and the second auxiliary electrode pad included in the second solar cell are spaced apart from each other,
A solar cell module in which an interval between the first auxiliary electrode pad and the second auxiliary electrode pad is smaller than a width of the interconnector. The method of claim 8,
The interconnector is
Electrically connecting the first auxiliary electrode pad of the first solar cell and the second auxiliary electrode pad of the second solar cell, or
A solar cell module electrically connecting the second auxiliary electrode pad of the first solar cell and the first auxiliary electrode pad of the second solar cell. The method of claim 10,
In each of the first solar cell and the second solar cell,
A solar cell module in which the second area of the first auxiliary electrode pad and the second area of the second auxiliary electrode pad are connected by overlapping the interconnector. The method of claim 11,
In each of the first solar cell and the second solar cell,
The solar cell module is electrically connected between the interconnector and the first auxiliary electrode pad, or the interconnector and the second auxiliary electrode pad by a second conductive connector. The method of claim 11,
The solar cell module is electrically connected to the interconnector and the first auxiliary electrode pad, or the interconnector and the second auxiliary electrode pad by direct physical contact. The method of claim 1,
A solar cell module having irregularities formed on the front surface of the interconnector and having a non-uniform thickness. The method of claim 1,
The interconnector is a solar cell module having a uniform thickness and a zigzag shape. The method of claim 7,
The solar cell module
Each of a plurality of solar cells forming the one integrated individual element includes a first cell string and a second cell string connected in series in a first direction by the interconnector,
The solar cell module further comprising a conductive ribbon connecting the first cell string and the second cell string in series in a second direction. The method of claim 16,
The first auxiliary electrode pad of the last solar cell of the first cell string is connected to the second auxiliary electrode pad of the last solar cell of the second cell string through the conductive ribbon, or
The second auxiliary electrode pad of the last solar cell of the first cell string is connected to the first auxiliary electrode pad of the last solar cell of the second cell string through the conductive ribbon. The method of claim 17,
A solar cell module in which the ribbon is connected to the front surface of the first auxiliary electrode pad or the front surface of the second auxiliary electrode pad in the last solar cell of the first cell string or the second cell string. The method of claim 17,
In the first cell string or the last solar cell of the second cell string, the first auxiliary electrode pad or the second auxiliary electrode pad is formed to cover a part of the rear surface of the insulating member,
The ribbon is connected to the first auxiliary electrode pad or the second auxiliary electrode pad formed on a portion of the rear surface of the insulating member. The method of claim 17,
The first auxiliary electrode pad or the second auxiliary electrode pad to which the ribbon is connected in the last solar cell of the first cell string or the second cell string further includes a portion longer than the length of the insulating member, and the The solar cell module to which the ribbon is connected to the longer part. The method of claim 17,
The last solar cell of the first cell string or the second cell string is a solar cell from which the insulating member is removed from the first solar cell and the second solar cell,
A solar cell module in which the ribbon is connected on the rear surface of the first auxiliary electrode pad or the second auxiliary electrode pad of the last solar cell.

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