KR20200087624A - Film forming apparatus, manufacturing apparatus of electronic device, film forming method, and manufacturing method of electronic device - Google Patents

Abstract

The present invention relates to a film forming apparatus for depositing a film forming material on a substrate through a mask. The film forming apparatus includes: a vacuum container in which the inner space can be maintained in a vacuum; a substrate holding unit installed in the vacuum container and configured to hold a substrate; a mask support unit installed in the vacuum container and configured to support the mask; an alignment camera unit installed on the atmosphere side of the vacuum container and including an alignment camera for measuring a relative position between the substrate and the mask; and a film forming source installed in the vacuum container for receiving a film forming material and for granulating and discharging the film forming material.

Description

Film forming apparatus, electronic device manufacturing apparatus, film forming method, and electronic device manufacturing method {FILM FORMING APPARATUS, MANUFACTURING APPARATUS OF ELECTRONIC DEVICE, FILM FORMING METHOD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE}

The present invention relates to a film forming apparatus, an electronic device manufacturing apparatus, a film forming method, and an electronic device manufacturing method.

Organic EL display devices (organic EL displays), as well as smartphones, TVs, automobile displays, and VR HMDs (Virtual Reality Head Mount Display) are expanding its application fields, especially, displays used in VR HMDs In order to reduce dizziness of the user, it is required to form a pixel pattern with high precision.

In the manufacture of the organic EL display device, when forming an organic light emitting element (organic EL element; OLED) constituting the organic EL display device, the film-forming material emitted from the film-forming source of the film-forming device is formed through a mask on which a pixel pattern is formed. By forming into a film, an organic material layer or a metal layer is formed.

In such a film forming apparatus, in order to increase the film forming precision, the relative positions of the substrate and the mask are measured before the film forming process, and if the relative positions are misaligned, the substrate and/or the mask are relatively moved to adjust the position (alignment). do.

Measurement of the relative position of the substrate and the mask is performed by photographing the alignment marks formed on each of the substrate and the mask in the vacuum container, using an alignment camera provided on the upper (outer side) surface of the vacuum container.

Depending on the structure of the film forming apparatus, when the distance from the outer top surface of the vacuum container, which is the installation surface of the alignment camera, to the supporting position of the substrate/mask is long, the alignment camera fixed to the outer top surface of the vacuum container is an alignment mark of the substrate/mask. It becomes difficult to focus on, and this reduces the precision of alignment.

In addition, even when the thickness of the substrate processed by the film forming apparatus is changed, it is difficult to precisely focus on the alignment mark formed on the substrate/mask with the alignment camera fixed to the outer upper surface of the vacuum container, thereby deteriorating the precision of alignment. do.

An object of the present invention is to provide a film forming apparatus, an electronic device manufacturing apparatus, a film forming method, and a method for manufacturing an electronic device using the same, which can accurately measure the relative positions of the substrate and the mask using an alignment camera.

The film forming apparatus according to the first aspect of the present invention is a film forming apparatus for forming a film forming material through a mask on a substrate, a vacuum container in which an internal space can be maintained in a vacuum, and installed in the vacuum container, and holds the substrate It includes a substrate holding unit for supporting, a mask supporting unit installed in the vacuum container, a mask supporting unit for supporting a mask, and an alignment camera for measuring the relative positions of the substrate and the mask, installed on the atmospheric side of the vacuum container. It includes an alignment camera unit to be installed in the vacuum container, a film forming source for storing the film forming material and granulating and discharging the film forming material, wherein the alignment camera is installed to protrude inward of the vacuum container Is done.

An electronic device manufacturing apparatus according to a second aspect of the present invention includes a film forming apparatus according to the first aspect of the present invention, a mask stock device for accommodating a mask, and a transport device for transporting a substrate or a mask. Is done.

A film forming method according to a third aspect of the present invention is a film forming method for depositing a film-forming material through a mask on a substrate, the method comprising: bringing a mask into a vacuum container of a film-forming apparatus and bringing a substrate into the vacuum container; And, the step of holding the substrate in the substrate holding unit in the vacuum container, and is installed on the atmospheric side of the vacuum container, using an alignment camera installed to protrude into the inside of the vacuum container through the vacuum container, Measuring a relative position of the substrate and the mask, and moving the substrate holding unit by an alignment stage mechanism installed in the vacuum container based on the measured relative position, thereby determining the relative position of the substrate and the mask. And adjusting, the step of bringing the mask into close contact with the deposition surface of the substrate, and depositing the film-forming material granulated by the film-forming source in the vacuum container on the substrate through the mask. .

A method of manufacturing an electronic device according to a fourth aspect of the present invention is characterized in that the electronic device is manufactured using the film forming method according to the third aspect of the present invention.

According to the present invention, the alignment precision can be increased by arranging the alignment camera so that it enters the inside of the vacuum container from the atmospheric side of the vacuum container.

1 is a schematic view of a part of an apparatus for manufacturing an electronic device.
2 is a schematic view of a film forming apparatus according to an embodiment of the present invention.
3A is a schematic view showing the configuration of an alignment camera unit and a vacuum counter tube according to an embodiment of the present invention, and FIG. 3B is an enlarged view of a dotted circle portion of FIG. 3A.
4 is a schematic diagram showing an electronic device manufactured by a film forming method according to an embodiment of the present invention.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples are merely illustrative of preferred structures of the present invention, and the scope of the present invention is not limited to these structures. In addition, in the following description, the hardware configuration and software configuration of the apparatus, processing flow, manufacturing conditions, size, material, shape, etc. are intended to limit the scope of the present invention to this, unless otherwise specified. no.

The present invention can be applied to an apparatus for depositing various materials on the surface of a substrate to form a film, and can be suitably applied to an apparatus for forming a thin film (material layer) of a desired pattern by vacuum deposition.

As the material of the substrate, any material such as a semiconductor (for example, silicon), glass, a polymer material film, and metal can be selected. For example, the substrate is a silicon wafer or a substrate on which a film such as polyimide is laminated on a glass substrate. May be Moreover, arbitrary materials, such as an organic material and a metallic material (metal, metal oxide, etc.) can also be selected as a film-forming material.

The present invention can be applied to a film deposition apparatus including a sputtering apparatus or a CVD (Chemical Vapor Deposition) apparatus, in addition to a vacuum deposition apparatus by heat evaporation. The technique of the present invention is specifically applicable to various electronic devices, such as semiconductor devices, magnetic devices, and electronic parts, and manufacturing devices such as optical parts. As a specific example of an electronic device, a light emitting element, a photoelectric conversion element, a touch panel, etc. are mentioned.

The present invention is particularly applicable to an organic light emitting element such as OLED or an organic photoelectric conversion element such as an organic thin film solar cell. In addition, the electronic device in the present invention includes a display device (e.g., organic EL display device) or a lighting device (e.g., organic EL lighting device) including a light-emitting element, and a sensor (e.g., organic CMOS) provided with a photoelectric conversion element. Image sensor).

<Electronic device manufacturing apparatus>

1 is a plan view schematically showing a configuration of a part of an apparatus for manufacturing an electronic device.

The manufacturing apparatus in FIG. 1 is used for manufacturing a display panel of an organic EL display device for VR HMD, for example. In the case of a display panel for VR HMD, for example, after forming a film for forming an organic EL device on a silicon wafer of a predetermined size, cut the silicon wafer along an area (scribe area) between the device formation areas It is manufactured from a plurality of small-sized panels.

The electronic device manufacturing apparatus according to the present embodiment generally includes a plurality of cluster apparatuses 1 and a relay apparatus that connects between the cluster apparatuses 1.

The cluster apparatus 1 is disposed in the center of the film forming apparatus 11 for processing (e.g., film forming) the substrate W, the mask stock device 12 for storing the mask M before and after use, and in the center thereof. It is provided with a transfer chamber 13 (conveying device). 1, the transfer chamber 13 is connected to each of the film-forming apparatus 11 and the mask stock apparatus 12, as shown in FIG.

In the transfer chamber 13, a transfer robot 14 for transporting the substrate W and the mask M is disposed. The transfer robot 14 may be, for example, a robot having a structure in which a robot hand for holding a substrate W or a mask M is mounted on a multi-joint arm.

In the film forming apparatus 11, the film forming material emitted from the film forming source is formed on the substrate W through the mask M. Transferring and receiving of the substrate W/mask M with the transfer robot 14, adjustment of the relative position of the substrate W and the mask M (alignment), fixing of the mask M and the substrate W, A series of film forming processes such as film forming are performed by the film forming apparatus 11.

In the manufacturing apparatus for manufacturing the organic EL display device, the film forming apparatus 11 may be divided into an organic film forming apparatus and a metal film forming apparatus according to the type of material to be formed, and the organic film forming apparatus deposits or deposits an organic material forming material. The film is formed on the substrate W by sputtering, and the metal film forming apparatus deposits the metal film forming material on the substrate W by vapor deposition or sputtering.

In a manufacturing apparatus for manufacturing an organic EL display device, which film arrangement device is disposed at which position may vary depending on the stacked structure of the organic EL device being manufactured, and a plurality of film formations for forming the film according to the stacked structure of the organic EL device. The device is deployed.

In the case of an organic EL device, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, and a cathode are usually stacked in this order on the substrate W on which the anode is formed. A film forming apparatus is disposed to sequentially form a film.

For example, in FIG. 1, the film forming apparatus 11a forms a hole injection layer (HIL) and/or a hole transport layer (HTL), and the film forming apparatuses 11b and 11f have a blue light emitting layer, and the film forming apparatus 11c has a red light emitting layer. For example, the film-forming devices 11d and 11e are disposed to form a green light-emitting layer, the film-forming device 11g is an electron transport layer (ETL) and/or an electron injection layer (EIL), and the film-forming devices 11h are to form a cathode metal film. In Figure 1, due to the nature of the material, the deposition rate of the blue light-emitting layer and the green light-emitting layer is slower than that of the red light-emitting layer, so that each of the blue light-emitting layer and the green light-emitting layer was formed in two film-forming devices to balance the processing speed. The invention is not limited to this, and may have other arrangement structures.

In the mask stock device 12, a new mask to be used in the film forming process in the film forming apparatus 11 and a used mask are divided and stored in a plurality of cassettes. The conveying robot 14 conveys the used mask from the film forming apparatus 11 to the cassette of the mask stock apparatus 12, and the new mask stored in another cassette of the mask stock apparatus 12 is formed into the film forming apparatus 11 To be returned.

The relay device connected between the plurality of cluster devices 1 includes a pass chamber 15 for transporting the substrate W between the cluster devices 1.

The transfer robot 14 of the transfer chamber 13 receives the substrate W from the upstream side pass chamber 15, and one of the film forming apparatuses 11 in the cluster apparatus 1 (for example, the film forming apparatus 11a) ). Further, the transfer robot 14 receives the substrate W on which the film forming process in the cluster device 1 is completed from one of the plurality of film forming devices 11 (for example, the film forming device 11e), and is connected to the downstream side. It is conveyed to the pass room 15.

In addition to the pass chamber 15, the relay device changes the direction of the buffer chamber (not shown) and the substrate W for absorbing the difference in the processing speed of the substrate W in the upstream and downstream cluster devices 1 It may further include a turning room (not shown) for. For example, the buffer chamber includes a substrate loading part for temporarily storing a plurality of substrates W, and the turning chamber includes a substrate rotating mechanism (for example, a rotating stage or a conveying robot) for rotating the substrate W 180 degrees. Through this, the direction of the substrate W is the same in the upstream cluster device and the downstream cluster device, and substrate processing is facilitated.

The pass chamber 15 according to an embodiment of the present invention may include a substrate loading part (not shown) or a substrate rotating mechanism for temporarily storing a plurality of substrates W. That is, the pass chamber 15 may also function as a buffer chamber or a turning chamber.

The film forming apparatus 11, the mask stock apparatus 12, the transfer chamber 13, etc. constituting the cluster apparatus 1 are maintained in a high vacuum state in the manufacturing process of the organic light emitting element. The pass chamber 15 of the relay device is usually maintained in a low vacuum state, but may be maintained in a high vacuum state as necessary.

The substrate W on which the deposition of a plurality of layers constituting the organic EL element is completed is conveyed by a sealing device (not shown) for sealing the organic EL element or a cutting device (not shown) for cutting the substrate to a predetermined panel size. do.

In this embodiment, the configuration of the electronic device manufacturing apparatus has been described with reference to FIG. 1, but the present invention is not limited thereto, and may have other types of devices or chambers, and arrangements between these devices or chambers may be different. have.

For example, the electronic device manufacturing apparatus according to the embodiment of the present invention may be an inline type instead of the cluster type shown in FIG. 1. That is, the substrate W and the mask M may be mounted on a carrier, and a film may be formed while passing through a plurality of film forming apparatuses arranged in a row. Further, it may have a structure of a type combining a cluster type and an inline type. For example, the organic layer can be formed in a cluster type manufacturing apparatus, and the electrode layer (cathode layer) deposition process, sealing process, and cutting process may be performed in an inline type manufacturing apparatus.

Hereinafter, a specific configuration of the film forming apparatus 11 will be described.

<film forming device>

2 is a schematic diagram showing the configuration of a film forming apparatus 11 according to an embodiment of the present invention. In the following description, an XYZ orthogonal coordinate system using a vertical direction as the Z direction and a horizontal plane as the XY plane is used. In addition, the rotation angle around the X axis is indicated by θ _X , the rotation angle around the Y axis is indicated by θ _Y , and the rotation angle around the Z axis is indicated by θ _Z.

FIG. 2 shows an example of a film forming apparatus 11 in which a film forming material is evaporated or sublimed by heating to form a film on a substrate W through a mask M.

The film forming apparatus 11 is provided in a vacuum container 21 which is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas, and is provided in the vacuum container 21 to position the substrate W at least in the X direction, the Y direction, and θ. _The magnetic levitation stage mechanism 22 for adjusting in the _Z direction, the mask support unit 23 installed in the vacuum container 21 to support the mask M, and the substrate W provided in the vacuum container 21 It comprises a substrate adsorption means (24) for adsorbing and holding, and a film forming source (25) that is installed in a vacuum container (21) to receive the film forming material and to form and release it during film formation.

The film forming apparatus 11 according to an embodiment of the present invention may further include a magnetic force applying means 26 for bringing the mask M into close contact with the substrate W by magnetic force.

In the vacuum container 21 of the film forming apparatus 11 according to an embodiment of the present invention, the first vacuum container part 211 in which the magnetic levitation stage mechanism 22 is disposed and the second in which the film forming source 25 is disposed It includes a vacuum container portion 212. In the vacuum container 21, the internal space is maintained in a high vacuum state by, for example, a vacuum pump (not shown) connected to the second vacuum container unit 212.

In addition, a stretchable member 213 is installed between at least the first vacuum container portion 211 and the second vacuum container portion 212. The stretchable member 213 generates vibrations from the vacuum pump connected to the second vacuum container unit 212 or vibrations from the floor or floor on which the film forming apparatus 11 is installed through the second vacuum container unit 212. 1 Reduce the transmission to the vacuum container portion 211. The stretchable member 213 may be, for example, a bellows, but the present invention is not limited to this, and the transmission of vibration between the first vacuum container part 211 and the second vacuum container part 212 can be reduced. One other member may be used.

As described above, in the film forming apparatus 11 according to an embodiment of the present invention, the vacuum container 21 is divided into a plurality of container parts (eg, the first vacuum container part 211 and the second vacuum container part 212). , By providing the stretchable member 213 therebetween, it is possible to reduce transmission of external vibration to the first vacuum container portion 211 in which the magnetic levitation stage mechanism 22 is installed.

The vacuum container 21 further includes a reference plate 214 to which the magnetic levitation stage mechanism 22 is fixedly connected, and a reference plate support 215 for supporting the reference plate 214 to a predetermined height. According to an embodiment of the present invention, as shown in FIG. 2, a stretchable member 213 may be further provided between the reference plate 214 and the first vacuum container portion 211. Through this, it is possible to further reduce the transmission of external vibrations to the magnetic levitation stage mechanism 22 through the reference plate 214.

The vacuum container 21 also further includes a reference plate 214, that is, a vacuum counter tube 212 installed on the upper container wall of the vacuum container 21 (see FIG. 3A) so as to protrude inside the vacuum container 21. do. The alignment camera of the alignment camera unit 27, which will be described later, is arranged to be inserted into the atmospheric side of the vacuum counter 212. The specific structure of the vacuum correspondence tube 212 will be described later with reference to FIGS. 3A and 3B.

Vibration is transmitted from the floor or floor to the reference plate support 215 between the reference plate support 215 and the mounting platform 217 of the film forming apparatus 11 through the installation platform 217 of the film forming apparatus 11 from the floor or floor. A vibration damping unit 216 is installed to reduce that.

The magnetic levitation stage mechanism 22 is an alignment stage mechanism for aligning the substrate W and the mask M based on the relative positions of the substrate W and the mask M measured by the alignment camera unit 27. Is an example of That is, the magnetic levitation stage mechanism 22 is a stage mechanism for adjusting the position of the substrate W or the substrate adsorption means 24 by a magnetic levitation linear motor, preferably at least in the X direction, the Y direction, and the θ _Z direction. The position of the substrate W or the substrate adsorption means 24 in six directions, X direction, Y direction, Z direction, θ _X direction, θ _Y direction, and θ _Z direction is adjusted.

The magnetic levitation stage mechanism 22 includes a stage reference plate portion (first plate portion, 221) that functions as a stationary body, a fine movement stage plate portion (second plate portion, 222) that functions as a movable table, and a fine movement stage plate portion ( It includes a magnetic levitation unit 223 for moving and moving 222) relative to the stage reference plate portion 221.

More specifically, the magnetic levitation stage mechanism 22 uses a self-weight compensation magnet (not shown) to provide an levitation force having a size corresponding to gravity acting on the fine movement stage plate portion 222, thereby allowing the fine movement stage plate portion In the state where 222 is floated, the fine movement stage plate part 222 is moved in a predetermined direction, for example, in six degrees of freedom (X direction, Y direction, Z direction, θ _X direction) using a magnetic levitation linear motor (not shown). , θ _Y direction, θ _Z direction). At this time, the position of the fine movement stage plate portion 222 may be measured using a laser interferometer (not shown), and the measured position information is used to control the driving of the magnetic levitation linear motor.

The mask support unit 23 is a means for receiving and holding the mask M conveyed by the transport robot 14 provided in the transport chamber 13 and is also called a mask holder.

The mask support unit 23 is installed so as to be able to elevate at least in the vertical direction. Through this, the distance in the vertical direction between the substrate W and the mask M can be easily adjusted. As in one embodiment of the present invention, when the position of the substrate W is adjusted by the magnetic levitation stage mechanism 22, a motor (not shown) and a mask support unit 23 for supporting the mask M are provided. It is preferable to mechanically drive up and down by a ball screw/guide (not shown).

Further, according to an embodiment of the present invention, the mask support unit 23 may be installed to be movable in the horizontal direction (ie, XYθ _Z direction). Through this, even if the mask M deviates from the field of view of the alignment camera of the alignment camera unit 27, it can be quickly moved into the field of view.

The mask support unit 23 further includes a mask pickup 231 for temporarily receiving the mask M carried into the vacuum container 21 by the transfer robot 14.

The mask pickup 231 is configured to be able to elevate relative to the mask support surface of the mask support unit 23. For example, as shown in FIG. 2, the mask pickup 231 may be configured to be elevated relative to the mask support surface of the mask support unit 23 by the mask pickup lift mechanism 232. The present invention is not limited to this, and as long as the mask support surfaces of the mask pickup 231 and the mask support unit 23 are relatively elevable, other configurations may be employed.

The mask pickup 231 receiving the mask M from the hand of the transport robot 14 descends relative to the mask support surface of the mask support unit 23 to lower the mask M to the mask support unit 23 Release. Conversely, when the used mask M is taken out, the mask M is lifted from the mask support surface of the mask support unit 23 so that the hand of the transport robot 14 can receive the mask M do.

The mask M has an opening pattern corresponding to the thin film pattern to be formed on the substrate W, and is supported by the mask support unit 23. For example, the mask M used to manufacture the organic EL display panel for VR HMD includes a fine metal mask, which is a metal mask formed with a fine opening pattern corresponding to the RGB pixel pattern of the light emitting layer of the organic EL element, And an open mask used to form a common layer (hole injection layer, hole transport layer, electron transport layer, electron injection layer, etc.) of the organic EL device.

The opening pattern of the mask M is defined by a blocking pattern that does not pass particles of the film-forming material.

The substrate adsorption means 24 is an example of a substrate holding unit for holding and supporting the substrate W. The substrate adsorption means 24 adsorbs and holds the substrate W as a film to be transported by the transport robot 14 installed in the transport chamber 13, and moves finely as a movable stand of the magnetic levitation stage mechanism 22. It is installed on the stage plate portion 222.

The substrate adsorption means 24 may be, for example, an electrostatic chuck having a structure in which an electric circuit such as a metal electrode is embedded in a dielectric/insulator (eg, ceramic material) matrix.

The electrostatic chuck as the substrate adsorption means 24 may be a Coulomb force type electrostatic chuck in which a relatively high-resistance dielectric is interposed between the electrode and the adsorption surface to be adsorbed by the Coulomb force between the electrode and the object to be adsorbed. A Johnson-Rabbeck type electrostatic chuck in which adsorption is performed by the Johnson Rabeck force generated between the adsorption surface of the dielectric and a adsorbent by interposing a dielectric material having a relatively low resistance between the adsorption surfaces may be used. An electrostatic chuck of the absorbing gradient type may be used.

When the object to be adsorbed is a conductor or a semiconductor (silicon wafer), it is preferable to use an electrostatic chuck of the Coulomb force type or an electrostatic chuck of the Johnson-Rabec force type, and when the object to be absorbed is an insulator such as glass, a gradient force type electrostatic It is preferred to use a chuck.

The electrostatic chuck may be formed of one plate or may have a plurality of subplates. In addition, even when it is formed of a single plate, a plurality of electrical circuits may be included therein, so that the electrostatic force may be different depending on the position in one plate.

Although not shown in FIG. 2, the film forming apparatus 11 is temporarily transferred before the substrate adsorption means 24 adsorbs and holds the substrate W carried into the vacuum container 21 by the transport robot 14. The substrate support unit that holds the substrate W may be further included. For example, the substrate support unit may be provided on the mask support unit 23 to have a separate substrate support surface, and may be installed to move up and down according to the elevation of the mask support unit 23.

In addition, although not shown in FIG. 2, by providing cooling means (eg, a cooling plate) for suppressing the temperature rise of the substrate W on the opposite side to the adsorption surface of the substrate adsorption means 24, on the substrate W You may make it the structure which suppresses the deterioration and deterioration of the deposited organic material.

The film forming source 25 is a crucible (not shown) in which the film forming material to be formed is stored on the substrate W, a heater (not shown) for heating the crucible, and a film forming until the evaporation rate from the film forming source 25 is constant. And a shutter (not shown) that prevents the material from scattering to the substrate W. The film forming source 25 may have various configurations according to uses, such as a point film forming source or a linear film forming source.

The film forming source 25 may include a plurality of crucibles for storing different film forming materials. In this configuration, a plurality of crucibles for storing different film forming materials may be movably provided to the film forming position so that the film forming material can be changed without opening the vacuum container 21 to the atmosphere.

The magnetic force applying means 26 is a means for pulling the mask M toward the substrate W side by means of magnetic force during the film forming process to be in close contact, and is provided to be vertically liftable. For example, the magnetic force applying means 26 may be composed of an electromagnet and/or a permanent magnet.

Although not shown in FIG. 2, the film forming apparatus 11 may include a film thickness monitor (not shown) and a film thickness calculation unit (not shown) for measuring the film thickness deposited on the substrate.

On the upper outer side (standby side) of the vacuum container 21, that is, on the reference plate 214, for lifting the mask pickup lifting mechanism 232 and the magnetic force applying means 26 for lifting the mask pickup 231 A magnetic force applying means elevating mechanism 261 or the like is installed. A mask support unit elevating mechanism (not shown) for elevating the mask support unit 23 may be provided on the reference plate 214, but the present invention is not limited thereto, for example, a mask support unit elevating mechanism (not shown). ) May be installed in the first vacuum container portion 211 on the lower atmospheric side.

The film forming apparatus 11 according to an embodiment of the present invention is an alignment camera for measuring the relative positions of the substrate W and the mask M by photographing the alignment marks formed on the substrate W and the mask M. An alignment camera unit 27 is further included.

The alignment camera unit 27 is installed on the upper outer side (atmospheric side) of the vacuum container 21, and more specifically, on the atmospheric side which is the upper side of the support plate 214, which functions as the upper container wall of the vacuum container 21. do. In particular, the alignment camera unit 27 according to an embodiment of the present invention is installed to protrude inside the vacuum container 21. The alignment camera unit 27 will be described in detail later with reference to FIGS. 3A and 3B.

The film forming apparatus 11 includes a control unit (not shown). The control unit has functions such as conveyance and alignment control of the substrate W/mask M and control of film formation. The control unit may also have a function of controlling the application of voltage to the electrostatic chuck.

The control unit can be configured by, for example, a computer having a processor, memory, storage, I/O, or the like. In this case, the function of the control unit is realized by the processor executing a program stored in the memory or storage. As a computer, a general-purpose personal computer may be used, or an embedded computer or a programmable logic controller (PLC) may be used. Alternatively, some or all of the functions of the control unit may be configured with a circuit such as an ASIC or an FPGA. Further, a control unit may be provided for each film forming apparatus, or one control unit may be configured to control a plurality of film forming apparatuses.

<Alignment camera unit>

Hereinafter, the alignment camera unit 27 according to an embodiment of the present invention will be described with reference to FIGS. 3A and 3B.

3A is a schematic cross-sectional view showing the configuration and arrangement of the alignment camera unit 27 according to an embodiment of the present invention, and is an enlarged view of a dotted circle portion of FIG. 3A of FIG. 3B.

3A and 3B, the alignment camera unit 27 includes an alignment camera 27a, a camera stage mechanism 27b, a vibration suppression stand 27c, and lighting means 27d.

The alignment camera 27a is a device for measuring the relative positions of the substrate W and the mask M by photographing the alignment marks of the substrate W and the mask M, respectively.

In this embodiment, the alignment camera 27a is a rough alignment camera used to roughly adjust the relative positions of the substrate W and the mask M, and the relative positions of the substrate W and the mask M. Includes a fine alignment camera used to adjust with high precision. The rough alignment camera has a relatively wide viewing angle and a low resolution, and the fine alignment camera has a relatively narrow viewing angle, but a high resolution camera. However, the present invention is not limited to this, for example, the alignment camera 27a may be a rough alignment camera or a fine alignment camera.

The rough alignment camera and the fine alignment camera are installed at positions corresponding to the alignment marks formed on the substrate W and the mask M. For example, the fine alignment camera may be installed such that four cameras form four corners of a rectangle, and the rough alignment camera may be installed in the center of two opposite sides of the rectangle. However, the present invention is not limited to this, and may have different numbers or arrangements depending on the positions of the alignment marks of the substrate W and the mask M.

According to the embodiment of the present invention, the alignment camera 27a is disposed on the outside side of the vacuum container 21 of the film forming apparatus 11, but through the vacuum container 21 to the inside of the vacuum container 21. It is installed to protrude. By installing the alignment camera 27a to enter the inside of the vacuum container 21, the substrate W and the mask M are relatively far from the reference plate 214 due to the intervening of the magnetic levitation stage mechanism 22. Even if supported apart, it is possible to accurately focus the alignment marks formed on the substrate W and the mask M.

To this end, the vacuum container 21 according to an embodiment of the present invention includes a vacuum counter 212 installed to protrude from the container wall 211 of the vacuum container 21 to the inside of the vacuum container 21. It is composed. However, the present embodiment is not limited to this, and may have a different structure as long as the alignment camera 27a can be arranged to protrude inside the vacuum container 21.

The vacuum-compatible container 212 protrudes into the inside of the vacuum container 21 through the container wall 211 of the vacuum container 21 (corresponding to the reference plate 214 in FIG. 2), and the top surface is opened. It may be a structure of a shape. The inside of the vacuum response tube 212 connected to the outside through the open upper surface corresponds to the atmospheric side. In addition, the alignment camera 27a is installed to be inserted into the atmospheric side of the vacuum counter 212. Thereby, the alignment camera 27a is installed so that at least a part thereof enters the inside of the vacuum container 21, that is, below the container wall 211.

In addition, the vacuum correspondence tube 212 has a sealing structure so that the inside of the vacuum container 21 can be maintained in a vacuum state. Therefore, the vacuum correspondence tube 212 encloses the alignment camera 27a disposed on the atmospheric side to seal the alignment camera 27a.

According to an embodiment of the present invention, the vacuum-corresponding tube 212 includes a side wall portion 212a installed on the container wall 211 of the vacuum container 21, and a front end portion installed on the lower end of the side wall portion 212a. (212b).

The side wall portion 212a is provided on the container wall 211 by a sealing material (not shown) so that the vacuum is not destroyed at a portion where the side wall portion 212a is connected to the container wall 211.

The tip portion 212b is formed of a transparent material so that the alignment marks of the substrate W and the mask M can be photographed with the alignment camera 27a inserted into the atmospheric side of the vacuum counter tube 212. For example, the tip portion 212b may be made of glass, but is not limited thereto.

The vacuum correspondence tube 212 may further include a connecting portion 212c connecting the side wall portion 212a and the tip portion 212b. The connection portion 212c vacuum-seals the connection portion between the side wall portion 212a and the tip portion 212b. The structure of the connection portion 212c illustrated in FIG. 3B is exemplary, and the connection portion 212c may have a different structure as long as the connection portion between the side wall portion 212a and the tip portion 212b can be vacuum sealed.

The position of the lower end (tip) of the vacuum correspondence tube 212, i.e., the tip portion 212b, is based on the depth of focus of the alignment camera 27a and the distance between the substrate W/mask M and the container wall 211. Can be appropriately determined.

For example, the tip of the vacuum counter 212 may be provided with a vacuum counter 212 so as to be positioned between the container wall 211 and the substrate adsorption means 24 (see FIG. 2). In particular, the tip end of the vacuum support tube 212 may be installed to come between the stage reference plate portion (first plate portion 221) and the fine moving stage plate portion (second plate portion, 222) (see FIG. 2). . According to this, since the alignment camera 27a protrudes inward of the vacuum container 21, it is possible to photograph the alignment mark of the substrate W/mask M at a position close to the substrate W/mask M. have.

On the other hand, the distance between the tip of the vacuum response tube 212 and the top surface of the substrate W adsorbed on the substrate absorption means 24 and the front end of the vacuum response tube 212 is the thickness of the magnetic force applying means 26 and the substrate It is desirable to position it so that it is larger than the sum of the thicknesses of the adsorption means 24.

The camera adjustment stage portion 27b is a means for connecting the alignment camera 27a to move the alignment camera 27a relative to the vacuum container 21.

More specifically, the camera adjustment stage portion 27b moves the alignment camera 27a at least in the vertical direction (Z-axis direction), that is, the direction from the container wall 211 of the vacuum container 21 toward the substrate adsorption means 24. And/or vice versa (eg, a direction perpendicular to the container wall 211). According to this, even if there is some variation in the thickness of the substrate W, the distance between the alignment camera 27a and the substrate W can be appropriately adjusted, so that the alignment mark of the substrate W can be accurately focused.

To this end, the camera adjustment stage portion 27b may include predetermined driving means capable of moving the alignment camera 27a in the vertical direction, such as a Z-axis actuator. However, the present invention is not limited to this, and the camera adjustment stage portion 27b has a direction in which the alignment camera 27a is parallel to the substrate W surface, that is, in the front-rear and/or left-right direction (X-axis and/or Y-axis direction). That is, the camera adjustment stage portion 27b may further include driving means such as an X-axis actuator and/or a Y-axis actuator.

The camera adjustment stage portion 27b can also adjust the posture of the alignment camera 27a. More specifically, the camera adjustment stage part 27b can change the angle which forms the alignment camera 27a with the container wall 211 of the vacuum container 21. To this end, the camera adjustment stage portion 27b may further include a rotating actuator capable of changing the standing angle of the alignment camera 27a with respect to the container wall 211. According to this, even if the vacuum container 21 is deformed during vacuum exhaust, and the alignment camera 27a is inclined with respect to the substrate W/mask M, the alignment camera 27a is the container wall of the vacuum container 21 The angle formed with 211 can be adjusted so that the alignment camera 27a faces the substrate W/mask M perpendicularly. As a result, it is possible to accurately focus on the alignment marks of the substrate W/mask M.

The vibration suppression stand 27c is provided between the camera adjustment stage portion 27b and the container wall 211 of the vacuum container 21, for example, the vacuum container 21. The vibration suppression stand 27c reduces vibration transmitted from the vacuum container 21 to the camera adjustment stage part 27b and the alignment camera 27a connected thereto. The vibration stand 27c may have various structures, for example, the vibration stand 27c is a support that is fixedly installed in the vacuum container 21, and a vibration control unit disposed between the support and the camera adjustment stage part 27b. It may include.

The lighting means 27d is disposed on the opposite side of the substrate adsorption means 24 (see FIG. 2) and/or the mask support unit 23 (see FIG. 2) with respect to the alignment camera 27a, so that the substrate W/mask It serves to illuminate the alignment mark of (M). The lighting means 27d is a substrate W, especially in a situation where the alignment camera 27a entering the inside of the vacuum container 21 is difficult to photograph the alignment marks of the substrate W/mask M. / It is possible to provide a sufficient amount of light to photograph the alignment mark of the mask (M).

<Alignment method>

Hereinafter, the alignment method which adjusts the relative position between the board|substrate W and the mask M using the magnetic levitation stage mechanism 22 of this invention is demonstrated.

First, the mask M and the substrate W are carried into the vacuum container 21 and supported by the mask support unit 23 and the substrate support unit, respectively.

The board|substrate W supported by the board|substrate support unit is moved toward the board|substrate adsorption means 24 provided in the fine movement stage plate part 222 of the magnetic levitation stage mechanism 22.

When the substrate W is sufficiently close to the substrate adsorption means 24, a substrate adsorption voltage is applied to the substrate adsorption means 24 to adsorb the substrate W to the substrate adsorption means 24 by electrostatic force. When adsorbing the substrate W to the substrate adsorption means 24, the entire surface of the substrate W may be simultaneously adsorbed on the entire adsorption surface of the substrate adsorption means 24, and among the plurality of regions of the substrate adsorption means 24 The substrate W may be adsorbed sequentially from one region to another region.

Subsequently, the control unit of the film forming apparatus 11 drives the mask support unit lifting mechanism to relatively approach the substrate adsorption means 24 and the mask support unit 23. At this time, the control unit adsorbs the substrate until the distance between the substrate W adsorbed on the substrate adsorption means 24 and the mask M supported by the mask support unit 23 becomes a preset rough alignment measurement distance. The means 24 and the mask support unit 23 are relatively approached (eg, the mask support unit 23 is raised).

When the distance between the substrate W and the mask M becomes a predetermined rough alignment measurement distance, the alignment marks of the substrate W and the mask M are captured by the rough alignment camera, and in the XYθ _Z direction. The relative positions of the substrate W and the mask M are measured, and based on this, the relative positional deviation between them is calculated.

The controller controls the fine movement stage plate portion 222 or the substrate based on the position of the fine movement stage plate portion 222 or the substrate adsorption means 24 measured by the laser interferometer and the relative positional displacement calculated by the rough alignment camera. The coordinates of the moving target position of the adsorption means 24 are calculated.

Based on the coordinates of the moving target position, while measuring the position of the fine moving stage plate portion 222 by a laser interferometer, the fine moving stage plate portion 222 or the substrate adsorption means 24 in the XYθ _Z direction by a magnetic levitation linear motor By driving to the moving target position, the relative positions of the substrate W and the mask M are adjusted. In the rough alignment, it has been described that the fine moving stage plate portion 222 is moved by a magnetic levitation linear motor, but the mask support unit 23 is XYθ _Z direction according to the size of the amount of displacement between the substrate W and the mask M By moving to, rough alignment may be performed.

When the rough alignment is completed, the mask support unit 23 is further raised by the mask support unit lifting mechanism so that the mask M reaches the fine alignment measurement position with respect to the substrate W.

When the mask M comes to the fine alignment measurement position with respect to the substrate W, the alignment marks of the substrate W and the mask M are photographed with a fine alignment camera to measure the relative displacement in the XYθ _Z direction. .

When the relative positional displacement of the substrate W and the mask M at the fine alignment measurement position is greater than a predetermined threshold, the mask M is lowered again, so that the substrate W and the mask M are separated from each other. , Based on the position of the fine moving stage plate portion 222 measured by the laser interferometer 32 and the relative positional displacement of the substrate W and the mask M, the moving target position of the fine moving stage plate portion 222 is determined. Calculate.

Based on the calculated moving target position, by measuring the position of the fine moving stage plate portion 222 with a laser interferometer, by driving the fine moving stage plate portion 222 to the moving target position in the XYθ _Z direction by a magnetic levitation linear motor , Adjust the relative positions of the substrate W and the mask M.

Further, if necessary, the position and/or posture of the rough alignment camera and/or the fine alignment camera may be adjusted during or before and after performing the rough alignment and/or fine alignment. For example, the rough alignment camera and/or the fine alignment camera may be moved in the Y-axis direction so that the substrate W is positioned at an appropriate focal position with respect to the rough alignment camera and/or the fine alignment camera. In addition, when the rough alignment camera and/or the fine alignment camera do not face perpendicularly to the substrate W, the tilt of the rough alignment camera and/or the fine alignment camera relative to the container wall may be adjusted.

This process is repeated until the relative positional displacement of the substrate W and the mask M becomes smaller than a predetermined threshold.

When the relative positional displacement of the substrate W and the mask M is smaller than a predetermined threshold, the deposition position where the film forming surface of the substrate W adsorbed by the substrate adsorption means 24 contacts the top surface of the mask M The mask support unit 23 is raised as much as possible.

When the substrate W reaches the deposition position where the mask M is in contact with the substrate W, the magnetic force applying means 26 is lowered and the mask M is pulled over the substrate W, thereby causing the substrate W and the mask M to move. To close.

In this process, in order to check whether a displacement in the XYθ _Z direction between the substrate W and the mask M has occurred, the relative position of the substrate W and the mask M is measured using a fine alignment camera. When the amount of displacement of the measured relative position is greater than or equal to a predetermined threshold, the substrate W and the mask M are separated from each other by a predetermined distance (for example, the mask support unit 23 is lowered), and then the substrate W and the mask Adjust the relative position of (M) and repeat the same process.

In the state where the substrate W and the mask M are located at the deposition position, if the relative position misalignment between the substrate W and the mask M is smaller than a predetermined threshold, the alignment process is terminated and the film forming process is started.

<Deposition method>

Hereinafter, a film forming method employing an alignment method according to an embodiment of the present invention will be described.

In the state in which the mask M is supported by the mask support unit 23 in the vacuum container 21, the substrate W is transported by the transport robot 14 of the transport chamber 13 to the vacuum container of the film forming apparatus 11 ( 21) It is brought in.

The hand of the transfer robot 14 that has entered the vacuum container 21 places the substrate W on the support portion of the substrate support unit.

After the substrate support unit sufficiently approaches or contacts the substrate adsorption means 24, the substrate adsorption voltage is applied to the substrate adsorption means 24 to adsorb the substrate W.

In the state where the substrate W is adsorbed to the substrate adsorption means 24, an alignment process is performed according to the alignment method according to the present embodiment described above.

By the alignment method of this embodiment, when the relative positional shift amount between the substrate W and the mask M becomes smaller than a predetermined threshold, the shutter of the film forming source 25 is opened and the film forming material is transferred to the substrate W through the mask. Tabernacle.

After being formed to a desired thickness, the mask M is removed by raising the magnetic force applying means 26, and the mask support unit 23 is lowered.

Subsequently, the hand of the transfer robot 14 enters the vacuum container 21 of the film forming apparatus 11 and applies a substrate separation voltage of zero or reverse polarity to the electrode portion of the substrate adsorption means 24, thereby (W) is separated from the substrate adsorption means (24). The separated substrate is carried out from the vacuum container 21 by the transfer robot 14.

In the above description, the film forming apparatus 11 is configured as a so-called up-deposition method (Depo-up), in which the film is formed while the film forming surface of the substrate W is facing downward in the vertical direction, but the present invention is not limited thereto. Alternatively, the substrate W may be arranged in a state perpendicular to the side surface of the vacuum container 21, and the film may be formed in a state where the film forming surface of the substrate W is parallel to the gravitational direction.

<Method of manufacturing an electronic device>

Next, an example of a method of manufacturing an electronic device using the film forming apparatus of this embodiment will be described. Hereinafter, the configuration and manufacturing method of the organic EL display device will be exemplified as an example of an electronic device.

First, an organic EL display device to be manufactured will be described. Fig. 4(a) shows the overall view of the organic EL display device 60, and Fig. 4(b) shows the cross-sectional structure of one pixel.

As shown in Fig. 4A, a plurality of pixels 62 having a plurality of light emitting elements are arranged in a matrix form in the display area 61 of the organic EL display device 60. Details will be described later, but each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. In addition, the pixel referred to here refers to a minimum unit that enables a desired color display in the display area 61. In the case of the organic EL display device according to the present embodiment, the pixel 62 is constituted by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B showing different light emission. It is done. The pixel 62 is often composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may be a combination of a yellow light-emitting element, a cyan light-emitting element, or a white light-emitting element. no.

FIG. 4(b) is a partial cross-sectional schematic view taken along line A-B in FIG. 4(a). The pixel 62 has an organic EL element having an anode 64, a hole transport layer 65, a light emitting layer 66R, 66G, and 66B, an electron transport layer 67, and a cathode 68 on the substrate 63. . Among these, the hole transport layer 65, the light emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to the organic layer. In the present embodiment, the light emitting layer 66R is an organic EL layer emitting red, the light emitting layer 66G is an organic EL layer emitting green, and the light emitting layer 66B is an organic EL layer emitting blue. The light emitting layers 66R, 66G, and 66B are formed in a pattern corresponding to light emitting elements (sometimes called organic EL elements) emitting red, green, and blue, respectively. In addition, the anode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the cathode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. In addition, in order to prevent the anode 64 and the cathode 68 from being shorted by a foreign material, an insulating layer 69 is provided between the anode 64. In addition, since the organic EL layer is deteriorated by moisture or oxygen, a protective layer 70 for protecting the organic EL element from moisture and oxygen is provided.

In FIG. 4(b), the hole transport layer 65 or the electron transport layer 67 is shown as one layer, but depending on the structure of the organic EL display device, it may be formed of a plurality of layers including a hole block layer or an electron block layer. It might be. Further, between the anode 64 and the hole transport layer 65, a hole injection layer having an energy band structure capable of smoothly injecting holes from the anode 64 into the hole transport layer 65 may be formed. . Likewise, an electron injection layer may be formed between the cathode 68 and the electron transport layer 67.

Next, an example of a method of manufacturing an organic EL display device will be specifically described.

First, a substrate 63 on which a circuit (not shown) and an anode 64 for driving the organic EL display device are formed is prepared.

An acrylic resin is spin-coated on the substrate 63 on which the anode 64 is formed, and the insulating layer 69 is formed by patterning the acrylic resin to form an opening in a portion where the anode 64 is formed by lithography. This opening corresponds to a light emitting region in which the light emitting element actually emits light.

The substrate 63 on which the insulating layer 69 is patterned is carried into the first organic material film forming apparatus and holds the substrate with an electrostatic chuck, and the hole transport layer 65 is formed as a common layer on the anode 64 of the display area do. The hole transport layer 65 is formed by vacuum deposition. In practice, since the hole transport layer 65 is formed to have a larger size than the display area 61, a high-precision mask is not required.

Next, the substrate 63 formed up to the hole transport layer 65 is carried into the second organic material film forming apparatus and held by an electrostatic chuck. Alignment of the substrate and the mask is performed, and a light emitting layer 66R emitting red color is formed on a portion where the element emitting red color of the substrate 63 is disposed.

Similar to the film formation of the light emitting layer 66R, a green light emitting layer 66G is formed by a third organic material film forming apparatus, and further, a blue light emitting layer 66B is formed by a fourth organic material film forming apparatus. After the film formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed over the entire display area 61 by the fifth organic material film forming apparatus. The electron transport layer 67 is formed as a common layer for the three color light emitting layers 66R, 66G, and 66B.

The substrate formed up to the electron transport layer 67 is moved to a metal film forming apparatus to form the cathode 68. At this time, the metal material film forming apparatus may be a heating evaporation film forming device or a sputtering film forming device.

According to the present invention, even if the distance between the upper surface of the vacuum container 21 and the substrate/mask is increased by installing the alignment camera so as to protrude inside the vacuum container 21, it is possible to focus on the substrate/mask. In addition, the alignment precision can be further increased by providing the alignment camera so that its position and posture can be adjusted.

Then, the protective layer 70 is formed by moving to a plasma CVD apparatus to complete the organic EL display device 60.

The light emitting layer made of an organic EL material is exposed to an atmosphere containing moisture or oxygen from when the substrate 63 on which the insulating layer 69 is patterned is brought into the film forming apparatus until the film formation of the protective layer 70 is completed. There is a risk of deterioration by moisture or oxygen. Therefore, in this example, the substrate is brought in and out between the film forming apparatuses in a vacuum atmosphere or an inert gas atmosphere.

The above embodiment shows an example of the present invention, and the present invention is not limited to the configuration of the above embodiment, and may be appropriately modified within the scope of the technical idea.

11: film forming apparatus
21: vacuum container
22: magnetic levitation stage mechanism
23: mask support unit
24: substrate adsorption means
25: Tabernacle
26: means for applying magnetism
27: alignment camera unit

Claims (15)

A film forming apparatus for forming a film forming material through a mask on a substrate,
A vacuum container in which the internal space can be maintained in a vacuum,
It is installed in the vacuum container, the substrate holding unit for holding the substrate,
It is installed in the vacuum container, a mask support unit for supporting the mask,
The alignment camera unit is installed on the atmospheric side of the vacuum container, and includes an alignment camera for measuring the relative position of the substrate and the mask.
It is installed in the vacuum container, a film forming source for storing the film forming material and granulating and discharging the film forming material
Includes,
The alignment camera is a film forming apparatus, characterized in that installed to protrude inward of the vacuum vessel.
The vacuum container according to claim 1, wherein the vacuum container includes a vacuum counter that is installed on the container wall so as to protrude from the container wall of the vacuum container to the inside of the vacuum container.
The alignment camera, the film forming apparatus, characterized in that arranged to be inserted into the atmospheric side of the vacuum-compatible tube.
The film forming apparatus according to claim 2, wherein the vacuum-corresponding tube is provided so that its tip is positioned between the container wall of the vacuum container and the substrate holding unit.
According to claim 3,
Further comprising an alignment stage mechanism for adjusting the position of the substrate holding unit,
The alignment stage mechanism includes a first plate portion installed to be fixed to the vacuum container and a second plate portion movably installed relative to the first plate portion,
The vacuum-corresponding tube, the film forming apparatus, characterized in that the tip is provided to come between the first plate portion and the second plate portion.
According to claim 2,
The vacuum-corresponding tube, the film-forming apparatus, characterized in that it comprises a side wall portion provided on the container wall of the vacuum container, and a tip portion made of a transparent material.
The film forming apparatus according to claim 5, wherein the vacuum-corresponding tube further comprises a connecting portion connecting the side wall portion and the tip portion, and the connecting portion vacuum-seals the side wall portion and the tip portion.
The film forming apparatus according to claim 1, wherein the alignment camera unit further comprises a camera adjustment stage unit capable of moving the alignment camera relative to the vacuum container.
The film forming apparatus according to claim 7, wherein the camera adjustment stage unit can move the alignment camera in a direction from the container wall of the vacuum container toward the substrate holding unit.
The film forming apparatus according to claim 7, wherein the camera adjustment stage unit is capable of changing an angle that the alignment camera makes with the container wall of the vacuum container.
The film forming apparatus according to claim 7, wherein the alignment camera unit further comprises a vibration control unit provided between the camera adjustment stage unit and the vacuum container.
The film forming apparatus according to claim 1, wherein the alignment camera unit further comprises an illumination means installed on the opposite side of the substrate holding unit with respect to the alignment camera.
The film forming apparatus according to claim 1, wherein the substrate is a silicon wafer.
The film forming apparatus of any one of claims 1 to 12,
A mask stock device for storing a mask,
A transport device for transporting a substrate or mask
Electronic device manufacturing apparatus comprising a.
A film forming method for forming a film forming material through a mask on a substrate,
Bringing the mask into the vacuum container of the film forming apparatus,
Bringing the substrate into the vacuum container,
Holding the substrate on a substrate holding unit in the vacuum container;
Measuring an relative position of the substrate and the mask by using an alignment camera installed on the atmospheric side of the vacuum container and installed to protrude inward of the vacuum container through the vacuum container;
Adjusting the relative position of the substrate and the mask by moving the substrate holding unit by an alignment stage mechanism installed in the vacuum container based on the measured relative position,
Adhering the mask to the film-forming surface of the substrate,
Forming a film-forming material granulated by a film-forming source in the vacuum container on the substrate through the mask;
The deposition method characterized in that it comprises.
An electronic device manufacturing method comprising manufacturing an electronic device using the film-forming method according to claim 14.

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