KR20200078852A - Glass deposition apparatus - Google Patents

Abstract

Disclosed is a substrate deposition apparatus capable of reducing a footprint of the apparatus. The substrate deposition apparatus according to the present invention includes: a process chamber in which a deposition process is performed on a substrate; a source unit disposed inside the process chamber and provided with a spray nozzle spraying a deposition material to provide the deposition material to the substrate; a substrate transfer unit connected to the process chamber and transferring the substrate within the process chamber; and a shutter unit connected to the process chamber and having a cover unit which is moved in the direction crossing the transfer direction of the substrate by the substrate transfer unit to shield and open the spray nozzle from the substrate.

Description

Substrate deposition apparatus

The present invention relates to a substrate deposition apparatus, and relates to a substrate deposition apparatus for generating a thin film on a substrate by depositing an organic substance on the substrate.

With the rapid development of information and communication technologies and the expansion of the market, flat panel displays have been spotlighted as display devices.

The flat panel display device includes a liquid crystal display, a plasma display panel, and an organic light emitting diode display.

Among them, the organic light emitting diode display (OLED display), fast response speed, lower power consumption than conventional liquid crystal display (LCD), light weight, no need for a separate backlight (back light) device can be made ultra-thin, It has a very good advantage, such as high brightness, and is spotlighted as a next-generation display device.

The organic light emitting diode display (OLED display) can be divided into passive type PMOLED and active type AMOLED according to the driving method. In particular, AMOLED is a self-luminous display, which has the advantages of faster response speed, natural color, and less power consumption than conventional displays. In addition, when AMOLED is applied to a film, etc., rather than a substrate, it is possible to realize the technology of a flexible display.

Such an organic light emitting diode display (OLED display) is a product through a pattern formation process, an organic thin film deposition process, an etching process, an encapsulation process, and a bonding process for attaching a substrate on which an organic thin film is deposited and a substrate subjected to an encapsulation process. Can be produced.

The organic light emitting diode used in the organic light emitting diode display (OLED display) is coated with an anode film, an organic thin film, and a cathode film on a substrate in order, and an appropriate energy difference is formed in the organic thin film by applying a voltage between the anode and the cathode. It is a principle that it emits itself.

In other words, the injected electrons and holes recombine, and the remaining excitation energy is generated as light. At this time, since the wavelength of light generated according to the amount of the dopant of the organic material can be adjusted, full color can be realized.

1 is a structural diagram of an organic light emitting device.

As shown in this figure, the organic light emitting device has an anode, a hole injection layer, a hole transport layer, a light emitting layer, and a hole blocking layer on a substrate. layer), an electron transport layer, an electron injection layer, and a film such as a cathode are sequentially formed.

In this structure, ITO (Indium Tin Oxide) having small surface resistance and good permeability is mainly used as the anode. In addition, the organic thin film is formed of a multi-layer of a hole injection layer, a hole transport layer, a light emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer in order to increase luminous efficiency. Organic materials used as the light emitting layer include Alq3, TPD, PBD, m-MTDATA, TCTA, and the like. As the cathode, a LiF-Al metal film is used. In addition, since the organic thin film is very weak to moisture and oxygen in the air, an encapsulating film is formed on the top to increase the life time of the device.

To briefly summarize the organic light emitting device shown in FIG. 1, the organic light emitting device includes an anode, a cathode, and a light emitting layer interposed between the anode and the cathode, and when driven, holes are injected into the light emitting layer from the anode, and electrons Is injected into the light emitting layer from the cathode. Holes and electrons injected into the light-emitting layer are combined in the light-emitting layer to generate excitons, and these excitons emit light while transitioning from an excited state to a ground state.

The organic light emitting device may be divided into a single color or a full color organic light emitting device according to the color to be implemented. The full color organic light emitting device includes red (R), green (G) and three primary colors of light. A full color is realized by having a light emitting layer patterned for each blue (B).

Meanwhile, an evaporation process is required to make the organic light emitting device shown in FIG. 1, that is, to deposit a light emitting layer (organic substance) and an electrode layer (inorganic substance).

The evaporation process includes a feeding process in which a deposition material (also referred to as a raw material or an evaporation material) is filled in a source (also called an evaporation source), and a deposition material evaporated by a source on a substrate It can be broadly divided into a deposition process to deposit.

On the other hand, as OLED TVs are being mass-produced, the size of the substrate for organic light-emitting diodes is increasing, and in-line substrate deposition equipment is mainly used for TV (TV) evaporators. Is being used.

In the in-line deposition apparatus according to the prior art, as shown in FIG. 2, it is disposed between the continuously moving substrate and the evaporation source 20 for spraying the deposition material, and is moved in the horizontal direction to evaporate the substrate. A horizontally movable source shutter portion 10 is provided that is shielded and opened relative to (20).

As shown in FIG. 2, as shown in FIG. 2, in order to open the substrate with respect to all the evaporation sources 20 by moving the horizontally movable source shutter unit 10 in a direction parallel to the transfer direction of the substrate, as shown in FIG. Since the movable source shutter unit 10 additionally requires an evacuation space to escape, there is a problem in that the footprint of the device increases.

As such, if the footprint of the device increases, the manufacturing cost of the device increases, and thus there is a problem in that productivity decreases.

Republic of Korea Registered Patent Publication No. 10-1848629, (2018.04.09.)

The problem to be solved by the present invention is to provide a substrate deposition apparatus capable of reducing the footprint of the apparatus.

According to an aspect of the present invention, a process chamber in which a deposition process for a substrate is performed; A source unit disposed inside the process chamber and provided with a spray nozzle for spraying the deposition material to provide a deposition material to the substrate; A substrate transfer unit connected to the process chamber and transferring the substrate within the process chamber; And a shutter unit connected to the process chamber, the shutter unit having a cover portion that is moved in a direction crossing the transfer direction of the substrate by the substrate transfer unit to shield and open the spray nozzle relative to the substrate. Can be provided.

The cover portion is disposed on the top of the source unit, and the shutter unit shields the spray nozzle against the substrate by moving the cover portion up/down in a direction approaching and spaced apart from the source unit. And an opening up/down driving shutter unit.

The source unit includes a first source module provided with the spray nozzle; A second source module spaced apart from the first source module and provided with the spray nozzle; And a third source module disposed between the first source module and the second source module, and provided with the spray nozzle.

The up/down driving shutter unit includes: a first shutter module that shields and opens the spray nozzle of the first source module relative to the substrate; A second shutter module that shields and opens the spray nozzle of the second source module relative to the substrate; And a third shutter module that shields and opens the spray nozzle of the third source module relative to the substrate.

The first shutter module may include a first cover portion positioned in an upper region of the first source module; And a first up/down movement actuator connected to the first cover portion and moving the first cover portion up/down in a direction approaching and spaced apart from the first source module. It may contain wealth.

The first up/down movement actuator portion includes: a first cylinder rod portion coupled to the first cover portion; And the first cylinder rod portion is connected to the relative movement, it may include a first cylinder body portion for moving up / down (up / down) to move the first cylinder rod portion.

The second shutter module may include a second lid part positioned in an upper region of the second source module; And a second up/down movement actuator connected to the second lid part and moving the second lid part up/down in a direction approaching and spaced apart from the second source module. It may contain wealth.

The second up/down (up/down) actuator portion for movement, the first cylinder rod portion coupled to the second cover portion; And the second cylinder rod portion is connected to the relative movement, it may include a second cylinder body portion for moving up / down (up / down) to move the second cylinder rod portion.

The third shutter module may include: a third lid part positioned in an upper region of the third source module; And a third up/down movement actuator connected to the third lid part and moving the third lid part up/down in a direction approaching and spaced apart from the third source module. It may contain wealth.

The third up/down movement actuator portion includes: a third cylinder rod portion coupled to the third cover portion; And the third cylinder rod portion is connected to the relative movement, and may include a third cylinder body portion for moving up/down (up/down) for moving the third cylinder rod portion.

The source unit includes: a source housing supporting the first to third source modules; And an angle limiting plate supported on the source housing and spaced apart from the injection nozzles of the first to third source modules to limit an injection angle of the deposition material injected from the injection nozzles.

The substrate transfer unit includes a carrier portion supporting the substrate; And a carrier transport part supporting the carrier part and transporting the carrier part.

The carrier transfer portion, a plurality of transfer rollers are disposed spaced apart from each other in contact with the carrier portion; Rotating shaft for a plurality of rollers that are connected to the transport rollers, to rotate the transport roller; And it is supported on the side wall of the process chamber and the rotating shaft for the roller is rotatably connected, it may include a seal to prevent the outside air from entering the interior of the process chamber.

The separation interval between the transfer rollers may be provided to be longer than the length of the width of the cover portion so that the cover portion can pass between the transfer rollers.

Embodiments of the present invention includes a shutter unit having a cover portion that is moved in a direction crossing the transfer direction of the substrate to shield and open the spray nozzle of the source unit relative to the substrate, thereby reducing the footprint of the device. I can do it.

1 is a structural diagram of an organic light emitting device.
2 is a view schematically showing an in-line substrate deposition apparatus according to the prior art.
3 is a view showing a substrate deposition apparatus according to an embodiment of the present invention.
FIG. 4 is a view of the inside of the source unit of FIG. 3 viewed from the side.
5 is a view of the shutter unit of FIG. 3 as viewed from the top.
6 is a view showing a state in which the cover portion of FIG. 3 has opened the injection nozzle of the source unit.
7 is an enlarged cross-sectional view of part'A' of FIG. 3.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the contents described in the accompanying drawings, which illustrate preferred embodiments of the present invention.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. However, in describing the present invention, descriptions of functions or configurations already known will be omitted to clarify the gist of the present invention.

On the other hand, the substrate described below may be a substrate for an organic light emitting diode display (OLED display).

3 is a view showing a substrate deposition apparatus according to an embodiment of the present invention, FIG. 4 is a view of the inside of the source unit of FIG. 3 viewed from the side, and FIG. 5 is a view of the shutter unit of FIG. 3 from the top FIG. 6 is a view illustrating a state in which the cover units of FIG. 3 have opened the injection nozzle of the source unit, and FIG. 7 is an enlarged view of a cross section of'A' of FIG. 3. In FIG. 3, a state in which the cover portions shield the injection nozzle of the source unit is illustrated, and in FIG. 5, the carrier portion is omitted for convenience of illustration.

Substrate deposition apparatus according to this embodiment, as shown in FIGS. 3 to 7, the process chamber (CM) in which the deposition process for the substrate is performed therein, and disposed inside the process chamber (CM) and disposed on the substrate The source unit 110 is provided with an injection nozzle (N) for spraying the deposition material to provide the deposition material, and a substrate transfer unit 120 connected to the process chamber (CM) and transferring the substrate in the process chamber (CM) ), and is connected to the process chamber (CM) and moved in a direction crossing the transfer direction of the substrate by the substrate transfer unit 120 to cover and open the injection nozzle (N) with respect to the substrate (131a, 132a, It includes a shutter unit 130 having a (133a).

The process chamber (CM) will be described first. The process chamber CM forms a place where a deposition process for a substrate is performed. In the present embodiment, a horizontal upward deposition method in which a deposition process for a substrate is performed by a deposition material directed upward after the substrate is horizontally disposed is proposed. However, the scope of the present invention may also be applied to a deposition apparatus to which a vertical deposition method, which is deposited after vertically or obliquely arranged components such as a substrate and a mask (not shown), is disposed.

The interior of the process chamber CM forms a vacuum atmosphere so that the deposition process for the substrate can proceed reliably.

To this end, a vacuum pump (not shown) is connected to the lower portion of the process chamber CM as a means for maintaining the inside of the process chamber CM in a vacuum atmosphere. The vacuum pump (not shown) may be a so-called cryo pump. In addition, an entrance gate T through which the substrate enters and exits may be provided on the sidewall of the process chamber CM.

The source unit 110 is disposed inside the process chamber CM. The source unit 110 sprays the deposition material. In this embodiment, the source unit 110 sprays the deposition material in a fixed state at the corresponding position, and the substrate is deposited in an in-line manner in which it is moved in the process chamber (CM).

As shown in detail in FIG. 4, the source unit 110 is spaced apart from the first source module 111 and the first source module 111 provided with an injection nozzle N for spraying the evaporated deposition material. Is disposed and disposed between the second source module 112 and the first source module 111 and the second source module 112 provided with an injection nozzle N for spraying the evaporated deposition material, and evaporated injection The third source module 113 provided with the nozzle N, the source housing 114 supporting the first to third source modules 111, 112, and 113, and the source housing 114 supported by the first housing 1 to It includes an angle limiting plate 115 to be spaced apart from the injection nozzle (N) of the third source module (111, 112, 113) to limit the injection angle of the deposition material injected from the injection nozzle (N).

The first to third source modules 111, 112, and 113 are filled with a deposition material, and each of the first to third source modules 111, 112, and 113 evaporates the deposition material filled therein through heating. To be injected with each injection nozzle (N).

Detailed structures of the first to third source modules 111, 112, and 113 will be described later for convenience of explanation.

The source housing 114 supports the first to third source modules 111, 112, and 113. The source housing 114 forms the exterior of the source unit 110.

The angle limiting plate 115 is supported on the source housing 114. The angle limiting plate 115 is spaced apart from the injection nozzles N of the first to third source modules 111, 112, and 113 to limit the injection angle of the deposition material sprayed from the injection nozzle N.

In this embodiment, the angle limiting plate 115 is provided in a plate shape and limits the injection angle of the deposition material injected from the injection nozzle N by shielding the injection nozzle N from the lateral direction.

Meanwhile, the shutter unit 130 is connected to the process chamber CM. The shutter unit 130, the first to third source modules (111, 112, 113) by shielding and opening the ejection nozzles (N) of the substrate, the deposition material ejected from the ejection nozzle (N) substrate Or not.

In this embodiment, the shutter unit 130, the cover unit (131a, 132a, 133a) positioned between the source unit 110 and the substrate in the direction of approaching and spaced apart from the source unit 110 up / down (up /down) It is provided as an up/down driving shutter unit 130 that moves and shields and opens the spray nozzle N against the substrate.

As described above, the substrate deposition apparatus according to the present embodiment is moved in a direction crossing the transfer direction of the substrate and includes a shutter unit having cover portions 131a, 132a, and 133a for shielding and opening the spray nozzle N against the substrate. By including 130, unlike the substrate deposition apparatus according to the prior art of FIG. 2, there is no need to provide an evacuation space to be escaped by the horizontally movable source shutter unit 10, thereby reducing the footprint of the apparatus. .

When the up/down driving shutter unit 130 is described in detail, the up/down driving shutter unit 130, as shown in detail in FIGS. 3 to 6, The first shutter module 131 which shields and opens the spray nozzle N of the first source module 111 from the substrate, and the spray nozzle N of the second source module 112 is shielded and opened from the substrate It includes a second shutter module 132 and a third shutter module 133 for shielding and opening the injection nozzle N of the third source module 113 to the substrate.

In this way, the up/down driving shutter unit 130 according to the present embodiment shields the spray nozzles N of the first to third source modules 111, 112, and 113 against the substrate. And by opening and closing the first to third shutter modules 131, 132, and 133, individually shielding and opening the spray nozzles N of the first to third source modules 111, 112, and 113 against the substrate. I can do it.

The first shutter module 131 shields and opens the injection nozzle (N) of the first source module (111) relative to the substrate, so that the deposition material injected from the injection nozzle (N) of the first source module (111) is transferred to the substrate. Supply or not.

The first shutter module 131 is connected to the first lid part 131a and the first lid part 131a positioned in the upper region of the first source module 111, and the first lid part 131a is connected to the first lid part 131a. It includes a first up / down (up / down) actuator unit (131b, 131c) for moving up / down (up / down) in the direction of approaching and spaced apart from the first source module (111).

The first cover part 131a is located in the upper region of the first source module 111. The first cover portion 131a is provided in a plate shape. In this embodiment, the first cover portion 131a is provided in a long rectangular shape.

The first cover portion 131a is lowered in the direction of the injection nozzle (N) of the first source module 111 when shielding the injection nozzle (N) of the first source module 111, the angle as shown in FIG. It is disposed between the upper regions of the limiting plates 115.

The first up/down movement actuator parts 131b and 131c are connected to the first cover part 131a. The first up/down movement actuator parts 131b and 131c move up/down in a direction in which the first cover part 131a is approached and spaced apart from the first source module 111. ) Move. In this embodiment, the first up/down movement actuator parts 131b and 131c are provided in a pair and are respectively connected to both end regions of the first cover part 131a.

The first up/down movement actuator parts 131b and 131c include a first cylinder rod part 131b and a first cylinder rod part 131b coupled to the first cover part 131a. Relatively movable and includes a first cylinder body portion 131c that moves up/down to move the first cylinder rod portion 131b.

The first cylinder rod portion 131b is coupled to the first cover portion 131a and is movably connected to the first cylinder body portion 131c. In this embodiment, the first cylinder rod portion 131b penetrates the upper wall of the process chamber CM, and the distal end of the first cylinder rod portion 131b is coupled to the first cover portion 131a.

The first cylinder body portion 131c is supported on the upper wall of the process chamber CM. The first cylinder body portion 131c is connected to the first cylinder rod portion 131b to move the first cylinder rod portion 131b in the vertical direction.

In this embodiment, the first cylinder body portion 131c prevents the outside air in the vacuum chamber from flowing into the inside of the vacuum chamber during the up/down movement process of the first cylinder rod portion 131b. A sealing structure (not shown) is provided.

The second shutter module 132 shields and opens the injection nozzle (N) of the second source module (112) from the injection nozzle (N) of the second source module (112) to deposit the deposited material onto the substrate. Supply or not.

The second shutter module 132 is connected to the second lid part 132a and the second lid part 132a located in the upper region of the second source module 112, and the second lid part 132a is connected. It includes a second up / down (up / down) actuator unit (132b, 132c) for moving up / down (up / down) in the direction to approach and spaced apart from the second source module (112).

The second cover part 132a is located in the upper region of the second source module 112. The second cover portion 132a is provided in a plate shape. In this embodiment, the second cover portion 132a is provided in a long rectangular shape.

The second cover portion 132a is lowered in the direction of the injection nozzle (N) of the second source module 112 when shielding the injection nozzle (N) of the second source module 112, the angle as shown in FIG. It is disposed between the upper regions of the limiting plates 115.

The second up/down movement actuator parts 132b and 132c are connected to the second cover part 132a. The second up/down movement actuator parts 132b and 132c move the second cover part 132a to the second source module 112 in an up/down direction. ) Move. In this embodiment, the second up/down movement actuator parts 132b and 132c are provided in a pair and are respectively connected to both end regions of the second cover part 132a.

The second up/down movement actuator parts 132b and 132c include a second cylinder rod part 132b and a second cylinder rod part 132b coupled to the second cover part 132a. It is connected to the relative movement and includes a second cylinder body portion 132c that moves up/down to move the second cylinder rod portion 132b.

The second cylinder rod portion 132b is coupled to the second cover portion 132a and is movably connected to the second cylinder body portion 132c. In this embodiment, the second cylinder rod portion 132b penetrates through holes (not shown) formed in the upper wall of the process chamber CM, and the distal end portion of the second cylinder rod portion 132b is the second cover portion 132a. Is coupled to.

The second cylinder body portion 132c is supported on the upper wall of the process chamber CM. The second cylinder body portion 132c is connected to the second cylinder rod portion 132b to move the second cylinder rod portion 132b in the vertical direction.

In this embodiment, the second cylinder body portion 132c prevents the outside air in the vacuum chamber from flowing into the inside of the vacuum chamber during the up/down movement process of the second cylinder rod portion 132b. A sealing structure (not shown) is provided.

The third shutter module 133 shields and opens the spray nozzle (N) of the third source module (113) from the spray nozzle (N) of the third source module (113) to the substrate. Supply or not.

The third shutter module 133 is connected to the third lid part 133a and the third lid part 133a positioned in the upper region of the third source module 113 and connects the third lid part 133a. It includes a third up / down (up / down) actuator unit (133b, 133c) for moving up / down (up / down) in the direction to approach and spaced apart from the third source module (113).

The third cover part 133a is located in the upper region of the third source module 113. The third cover portion 133a is provided in a plate shape. In this embodiment, the third cover portion 133a is provided in a long rectangular shape.

The third cover portion 133a is lowered in the direction of the injection nozzle (N) of the third source module 113 when shielding the injection nozzle (N) of the third source module 113, the angle as shown in FIG. It is disposed between the upper regions of the limiting plates 115.

The third up/down movement actuator parts 133b and 133c are connected to the third cover part 133a. The third up/down movement actuator parts 133b and 133c move up/down in a direction in which the third cover part 133a is approached and spaced apart from the third source module 113. ) Move. In this embodiment, the third up/down movement actuator parts 133b and 133c are provided in a pair and are respectively connected to both end regions of the third cover part 133a.

The third up/down movement actuator parts 133b and 133c include a third cylinder rod part 133b and a third cylinder rod part 133b coupled to the third cover part 133a. It is connected to the relative movement and includes a third cylinder body portion 133c that moves up/down to move the third cylinder rod portion 133b.

The third cylinder rod portion 133b is coupled to the third cover portion 133a and is movably connected to the third cylinder body portion 133c. In this embodiment, the third cylinder rod part 133b penetrates through holes (not shown) formed in the upper wall of the process chamber CM, and the distal end of the third cylinder rod part 133b is a third cover part 133a. Is coupled to.

The third cylinder body portion 133c is supported on the upper wall of the process chamber CM. The third cylinder body portion 133c is connected to the third cylinder rod portion 133b to move the third cylinder rod portion 133b in the vertical direction.

In this embodiment, the third cylinder body portion 133c prevents the outside air in the vacuum chamber from flowing into the inside of the vacuum chamber during the up/down movement process of the third cylinder rod portion 133b. A sealing structure (not shown) is provided.

Meanwhile, the substrate transfer unit 120 is connected to the process chamber CM. The substrate transfer unit 120 transfers the substrate in the process chamber CM.

Substrate transfer unit 120 according to this embodiment, as shown in detail in Figures 3 to 7 the carrier portion 121 for supporting the substrate, and the carrier portion 121 supports and transports the carrier portion 121 It includes a carrier transport unit 122.

The carrier portion 121 supports the substrate. The carrier portion 121 contacts the edge region of the substrate to support the substrate.

The carrier transfer part 122 supports the carrier part 121. The carrier transport unit 122 moves the carrier unit 121.

In the present embodiment, the carrier transport unit 122, a plurality of transport rollers 124 that are disposed spaced apart from each other with the carrier unit 121 in contact with each other, and a plurality of transport rollers 124 connected to the transport roller 124 and rotating the transport roller 124 Sealing shafts for the rollers 125 and the sidewalls of the process chamber CM, rotatably connected to the roller shafts 125, and preventing external air from flowing into the process chamber CM It includes a rotary drive unit (not shown) that is connected to the rotating shaft 125 for the roller 126 and the roller, the rotating shaft 125 for the roller.

The transfer roller 124 is in contact with the lower portion of the carrier portion 121 to move the carrier portion 121. 5, the transport rollers 124 are spaced apart from each other as shown in FIG. 5, and the transport rollers 124 are covered so that the cover parts 131a, 132a, and 133a can pass between the transport rollers 124. It is spaced apart at a separation interval G longer than the length of the width of (131a, 132a, 133a).

As described above, the transport rollers 124 of the present embodiment are spaced apart from each other at intervals G longer than the lengths of the widths of the cover parts 131a, 132a, and 133a, thereby increasing the cover parts 131a, 132a, and 133a. The cover portions 131a, 132a, and 133a are not interfered with during up/down.

The rotating shaft 125 for the rollers is connected to each of the transport rollers 124. The rotating shaft 125 for the rollers transmits rotational driving force to the transfer roller 124.

The sealing part 126 is supported on the side wall of the process chamber CM, and the rotating shaft 125 for rollers is rotatably connected. In this embodiment, the sealing part 126 prevents external air from flowing into the process chamber CM.

7, the sealing body 126 is coupled to a sidewall of the process chamber CM and the rotating shaft 125 for the roller is rotatably connected, and the rotating shaft for the roller (126) It includes a magnetic fluid (not shown) disposed between the outer peripheral surface of the 125 and the inner peripheral surface of the sealing body (126a).

Here, the magnetic fluid (not shown) is a fluid in which magnetic powder is stably dispersed in a liquid in a colloidal shape, and then a surfactant is added to prevent precipitation or aggregation, and this magnetic fluid (not shown) is used for the sealing body 126a and rollers. By forming an O-ring-like film between the rotating shafts 125, the outside air of the process chambers CM is prevented from flowing into the process chambers CM in a vacuum atmosphere by rotation of the rotating shafts 125 for rollers.

In this embodiment, as described above, a sealing mechanism using a magnetic fluid seal is used, but the scope of the present invention is not limited thereto, and various sealing mechanisms for maintaining a vacuum degree are used in the sealing unit 126 of the present embodiment. ).

The rotation driving unit (not shown) is connected to the rotation shaft 125 for rollers and supplies rotational driving force to the rotation shaft 125 for rollers.

Hereinafter, the structures of the first to third source modules 111, 112, and 113 described above will be described. All of the first to third source modules 111, 112, and 113 include a block housing (not shown) and a crucible (not shown) disposed in the block housing (not shown) and filled with a deposition material.

Looking at the structure, the block housing (not shown) forms the appearance of the equipment. The block housing (not shown) has a closed structure to protect the internal crucible (not shown) while preventing the temperature of the crucible (not shown) from falling.

The block housing (not shown) includes a lower cooling block (not shown) constituting a lower portion, a plurality of side cooling blocks (not shown) forming a side wall of the lower cooling block (not shown), a lower cooling block (not shown), and And an upper cooling block (not shown) forming an upper portion of the plurality of side cooling blocks (not shown).

A cooling water flow path (not shown) through which cooling water flows is formed in a lower cooling block (not shown), a plurality of side cooling blocks (not shown), and an upper cooling block (not shown) for process control or to end the process.

A heating block (not shown) for heating a crucible (not shown) is provided on the inner wall of the block housing (not shown), especially the inner wall of the side cooling block (not shown). Heating blocks (not shown, structures such as reflectors or ceramics are provided in the periphery, but are omitted.

A heater (not shown) may be mounted on the heating block (not shown). The heater (not shown) applied to this embodiment uses a resistance heating method of applying voltage and current to a high temperature metal wire such as tungsten or tantalum. At this time, since the temperature of the high temperature metal wire exceeds 1000°C, the high temperature metal wire may be applied in a nude type exposed to the outside.

Crucible (not shown) is a structure called crucible and evaporates the deposited material filled therein under the action of the above-described heater (not shown) to spray it onto the substrate.

Such a crucible (not shown) includes a crucible body (not shown) filled with a deposition material and a crucible cover (not shown) coupled to an upper portion of the crucible body (not shown).

A plurality of spray nozzles N are formed on the crucible cover (not shown) in which deposition materials in the crucible body (not shown) are sprayed onto the substrate. Inside the injection nozzle (N), a plug (not shown) for injection of a deposition material is provided. It is preferable that a detachable structure is applied to the plug (not shown).

An inner plate (not shown) in which a plurality of through holes (not shown) are formed is provided in the crucible body (not shown). The inner plate (not shown) controls the amount and direction of the deposited material.

On the lower cooling block (not shown) forming the lower portion of the block housing (not shown), a crucible pedestal (not shown) is provided to support and support a lower portion of the crucible (not shown) at the corresponding position.

Structural stability according to the support of the crucible (not shown) at high temperatures because it supports the crucible (not shown) from the bottom through the crucible pedestal (not shown) disposed on the lower cooling block (not shown) Can be secured.

Hereinafter, the operation of the substrate deposition apparatus according to the present embodiment will be described with reference to FIGS. 3 to 6 mainly with an up/down driving shutter unit 130.

Referring to the case in which the deposition material sprayed from the first source module 111 is shielded against the substrate, the first up/down movement actuator parts 131b and 131c move the first cover part 131a. By descending, as shown in FIGS. 3 and 4, the first cover part 131a is positioned between the first source module 111 and the substrate. When the first cover portion 131a is lowered, the substrate is not located in the descending path of the first cover portion 131a, so that the drop of the first cover portion 131a does not interfere with the substrate.

Referring to the case in which the deposition material injected from the injection nozzle N of the first source module 111 is opened to the substrate, the second up/down movement actuator units 132b and 132c are first As the cover portion 131a is raised, the first cover portion 131a is positioned in the upper region of the substrate as shown in FIG. 6.

As in the case of shielding the deposition material injected from the first source module 111 to the substrate, the substrate is not located in the descending path of the first cover portion 131a when the first cover portion 131a is raised. In the process of raising the first cover part 131a, the first cover part 131a does not interfere with the substrate.

That is, the substrate transfer unit 120 moves the substrate to up/down the first lid part 131a in a state where the substrate is not positioned in the upper region of the first source module 111, thereby removing the substrate. 1 During the up/down process of the cover portion 131a, the first cover portion 131a does not hit the substrate.

The second cover part 132a and the third cover part 133a are also up/down in the same manner as the first cover part 131a described above, so that the second source module 112 and the third source module are up/down. The deposition material injected from the injection nozzle N of 113 is shielded and opened to the substrate.

As described above, the substrate deposition apparatus according to the present embodiment is moved in a direction crossing the transfer direction of the substrate to cover and open the injection nozzles N of the source unit 110 with respect to the substrate 131a, 132a, 133a By including the up / down (up / down) driving shutter unit 130 having a, unlike the substrate deposition apparatus according to the prior art of Fig. 2, a horizontally movable source shutter unit 10 provides an escape space to escape There is no need to do so, reducing the footprint of the device.

The present embodiment has been described in detail with reference to the drawings, but the scope of rights of the present embodiment is not limited to the drawings and description.

As described above, the present invention is not limited to the described embodiments, and it is obvious to those skilled in the art that various modifications and variations can be made without departing from the spirit and scope of the present invention. Therefore, such modifications or variations will have to belong to the claims of the present invention.

110: source unit 111: first source module
112: second source module 113: third source module
114: source housing 115: angle limit plate
120: substrate transfer unit 121: carrier portion
122: carrier transfer unit 124: transfer roller
125: roller rotating shaft 126: sealing portion
130: shutter unit 131: first shutter module
131a: first cover portion 131b: first cylinder rod portion
131c: first cylinder body 132: second shutter module
132a: second cover portion 132b: second cylinder rod portion
132c: second cylinder body portion 133: third shutter module
133a: third cover portion 133b: third cylinder rod portion
133c: third cylinder body CM: process chamber
N: spray nozzle

Claims (13)

A process chamber in which a deposition process for the substrate is performed;
A source unit disposed inside the process chamber and provided with a spray nozzle for spraying the deposition material to provide a deposition material to the substrate;
A substrate transfer unit connected to the process chamber and transferring the substrate within the process chamber; And
A substrate deposition apparatus comprising a shutter unit connected to the process chamber, the shutter unit having a cover portion that is moved in a direction crossing the transfer direction of the substrate by the substrate transfer unit to shield and open the spray nozzle relative to the substrate. According to claim 1,
The cover portion is disposed on the top of the source unit,
The shutter unit,
And an up/down driving shutter unit that moves the cover unit up/down in a direction close to and away from the source unit to shield and open the spray nozzle relative to the substrate. Substrate deposition device. According to claim 2,
The source unit,
A first source module provided with the spray nozzle;
A second source module spaced apart from the first source module and provided with the spray nozzle; And
It is disposed between the first source module and the second source module, and includes a third source module provided with the injection nozzle,
The up/down driving type shutter unit,
A first shutter module that shields and opens the spray nozzle of the first source module relative to the substrate;
A second shutter module that shields and opens the spray nozzle of the second source module relative to the substrate; And
And a third shutter module that shields and opens the spray nozzle of the third source module relative to the substrate. According to claim 3,
The first shutter module,
A first cover portion positioned in an upper region of the first source module; And
A first up/down movement actuator part connected to the first cover part and moving the first cover part up/down in a direction approaching and spaced apart from the first source module A substrate deposition apparatus comprising. According to claim 4,
The first up / down (up / down) actuator unit for movement,
A first cylinder rod part coupled to the first cover part; And
The first cylinder rod portion is connected to the relative movement, the substrate deposition apparatus including a first cylinder body portion to move up / down (up / down) to move the first cylinder rod portion. According to claim 3,
The second shutter module,
A second cover part positioned in an upper region of the second source module; And
A second up/down movement actuator part connected to the second cover part and moving the second cover part up/down in a direction approaching and spaced apart from the second source module A substrate deposition apparatus comprising. The method of claim 6,
The second up / down (up / down) actuator unit for movement,
A first cylinder rod part coupled to the second cover part; And
The second cylinder rod portion is connected to the relative movement, the substrate deposition apparatus including a second cylinder body portion to move up / down (up / down) to move the second cylinder rod portion. According to claim 3,
The third shutter module,
A third cover part positioned in an upper region of the third source module; And
A third up/down movement actuator unit connected to the third lid unit and moving the third lid unit up/down in a direction approaching and spaced apart from the third source module A substrate deposition apparatus comprising. The method of claim 8,
The third up / down (up / down) actuator unit for movement,
A third cylinder rod part coupled to the third cover part; And
The third cylinder rod portion is connected to the relative movement, the substrate deposition apparatus including a third cylinder body portion for moving up / down (up / down) to move the third cylinder rod portion. According to claim 1,
The source unit,
A source housing supporting the first to third source modules; And
The substrate deposition apparatus is supported on the source housing, and further comprising an angle limiting plate that is spaced apart from the injection nozzles of the first to third source modules to limit an injection angle of the deposition material injected from the injection nozzle. The method of claim 1
The substrate transfer unit,
A carrier portion supporting the substrate; And
A substrate deposition apparatus that supports the carrier portion and includes a carrier transfer portion for transporting the carrier portion. The method of claim 1
The carrier transfer unit,
A plurality of transport rollers which are in contact with the carrier part and are spaced apart from each other;
Rotating shaft for a plurality of rollers that are connected to the transport rollers, to rotate the transport roller;
A substrate deposition apparatus including a sealing part supported on a sidewall of the process chamber and rotatably connected to the rotating shaft for rollers, and preventing external air from flowing into the process chamber. The method of claim 12
The separation distance between the transfer rollers, the substrate deposition apparatus characterized in that the cover portion is provided to be longer than the length of the width of the cover portion, so as to pass between the transfer rollers.

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