KR20200076959A - Thermoelectric-based powder generation suppression trap - Google Patents

Abstract

The present invention relates to a trap for suppressing generation of powder based on a thermoelectric element. The trap comprises: a trap housing including a gas passage connected to a chamber; a cooling trap including a plate coupling a plurality of cooling fins inserted in a direction of the gas passage from the inside the trap housing and mounted on the trap housing and a cooling rod protrudingly coupled in an opposite direction of the plurality of cooling fins; a filter disposed inside the plurality of cooling fins; and a thermoelectric element heat sink coupled to the cooling rod through a through hole. Therefore, the present invention may effectively suppress and remove powder generated in a semiconductor and display process through cooling using the thermoelectric element.

Description

Powder generation suppression trap based on thermoelectric elements {THERMOELECTRIC-BASED POWDER GENERATION SUPPRESSION TRAP}

The present invention relates to a thermoelectric element-based powder generation suppression trap, and more specifically, a thermoelectric element-based powder capable of effectively suppressing and removing powder generated in a semiconductor and display process through cooling using a thermoelectric element. It relates to a production suppression trap.

In the process of manufacturing semiconductors and displays, gas or process products that have been processed are discharged through an exhaust device, which contains various impurities to form a powder. The powder thus produced has a problem in that it is not completely removed when it enters the vacuum pump. These problems significantly shorten the life of the vacuum pump and cause serious problems such as contaminating the working environment. In addition, there is a risk of fire and explosion due to the contact of powder with oxygen and moisture after the reorganization of the equipment. Currently, products such as heating jackets and filter traps are used to solve the problem of powder formation, which is a problem in semiconductor and display processes, but there is still room for problems such as fire hazard due to insufficient effect. Accordingly, there is a need to develop a product that greatly reduces the life of a vacuum pump in semiconductor and display manufacturing processes and facilitates the suppression and removal of powder formation that causes various and serious problems such as contamination of the working environment.

Korean Patent Publication No. 10-2012-0092401 (2012.08.21) Korean Registered Patent No. 10-1188024 (2012.09.26)

One embodiment of the present invention is to provide a powder-generating suppression trap based on a thermoelectric element capable of effectively suppressing and removing powder generated in a semiconductor and display process through cooling using a thermoelectric element.

An embodiment of the present invention generates a temperature deviation by rapidly cooling using a thermoelectric element, collects powder in a cooling trap through a temperature difference, and adds a filter to finally suppress and remove powder over two times. It is intended to provide a device-based powder generation suppression trap.

Among the embodiments, the thermoelectric element-based powder generation suppression trap includes a trap housing including a gas passage connected to a chamber, a plurality of cooling fins inserted in the direction of the gas passage inside the trap housing, and the trap housing A mounting plate, a cooling trap including a cooling rod protrudingly coupled in opposite directions of the plurality of cooling fins, a filter disposed inside the plurality of cooling fins, and a thermoelectric element heat sink coupled to the cooling rod through a through hole do.

The cooling trap may uniformly protrude the plurality of cooling fins along the circumferential direction of the plate.

The thermoelectric element heat sink may include a plurality of heat dissipation layers formed in layers in accordance with the through hole.

The thermoelectric element heat sink may include at least one thermoelectric element disposed on a lower surface to cool the cooling trap.

Among embodiments, the powder generation suppression trap based on the thermoelectric element is arranged with an air fan on one side of the thermoelectric element heat sink, and the opposite side is opened to surround the plurality of heat dissipation layers and the plurality of heat dissipation layers through the air fan. A fan bracket that provides cooling air therebetween may be further included.

The fan bracket may open the lower surface and form a through hole in the upper surface so that the cooling rod protrudes.

Among the embodiments, the powder generation suppression trap based on the thermoelectric element may further include a control trap for measuring the temperature at the center of the plurality of heat dissipation layers to increase or decrease the rotational speed of the air fan.

The disclosed technology can have the following effects. However, since a specific embodiment does not mean that all of the following effects should be included or only the following effects are included, the scope of rights of the disclosed technology should not be understood as being limited thereby.

The thermoelectric element-based powder generation suppression trap according to an embodiment of the present invention can effectively suppress and remove powder generated in a semiconductor and display process through cooling using a thermoelectric element.

The thermoelectric element-based powder generation suppression trap according to an embodiment of the present invention can prevent and prevent problems such as environmental contamination in the process work by facilitating the suppression and removal of the powder generated in the semiconductor and display processes. Productivity can be improved by minimizing the cost of additional maintenance.

The powder generation suppression trap based on a thermoelectric element according to an embodiment of the present invention generates a temperature deviation by rapidly cooling using a thermoelectric element, captures powder in a cooling trap through a temperature difference, and finally adds a filter to add 2 Powder can be suppressed and removed over time.

1 is a view showing a powder generation suppression trap based on a thermoelectric element according to an embodiment of the present invention.
FIG. 2 is a photograph showing an embodiment of the powder generation suppression trap based on the thermoelectric element in FIG. 1.
3 is an exploded view of the thermoelectric element-based powder generation suppression trap in FIG. 1.
FIG. 4 is a view showing each configuration of the powder generation suppression trap based on the thermoelectric element in FIG. 3.
5 is a graph showing the effect of a powder generation suppression trap based on a thermoelectric element according to an embodiment.
6 is a photograph showing the actual effect of the powder generation suppression trap based on a thermoelectric element according to an embodiment.

Since the description of the present invention is merely an embodiment for structural or functional description, the scope of the present invention should not be interpreted as being limited by the embodiments described in the text. That is, since the embodiments can be variously changed and have various forms, it should be understood that the scope of the present invention includes equivalents capable of realizing technical ideas. In addition, the purpose or effect presented in the present invention does not mean that a specific embodiment should include all or only such an effect, and the scope of the present invention should not be understood as being limited thereby.

Meanwhile, the meaning of terms described in the present application should be understood as follows.

Terms such as "first" and "second" are for distinguishing one component from other components, and the scope of rights should not be limited by these terms. For example, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

When a component is said to be "connected" to another component, it may be understood that other components may exist in the middle, although it may be directly connected to the other component. On the other hand, when a component is said to be "directly connected" to another component, it should be understood that no other component exists in the middle. On the other hand, other expressions describing the relationship between the components, that is, "between" and "immediately between" or "adjacent to" and "directly neighboring to" should be interpreted similarly.

Singular expressions are to be understood as including plural expressions unless the context clearly indicates otherwise, and terms such as “comprises” or “have” are used features, numbers, steps, actions, components, parts or the like. It is to be understood that a combination is intended to be present, and should not be understood as pre-excluding the existence or addition possibility of one or more other features or numbers, steps, operations, components, parts or combinations thereof.

In each step, the identification code (for example, a, b, c, etc.) is used for convenience of explanation. The identification code does not describe the order of each step, and each step clearly identifies a specific order in context. Unless stated, it may occur in a different order than specified. That is, each step may occur in the same order as specified, may be performed substantially simultaneously, or may be performed in the reverse order.

The present invention can be embodied as computer readable code on a computer readable recording medium, and the computer readable recording medium includes all types of recording devices in which data readable by a computer system is stored. . Examples of computer-readable recording media include ROM, RAM, CD-ROM, magnetic tape, floppy disks, and optical data storage devices. In addition, the computer-readable recording medium can be distributed over network coupled computer systems so that the computer readable code is stored and executed in a distributed fashion.

All terms used herein have the same meaning as commonly understood by a person skilled in the art to which the present invention pertains, unless otherwise defined. The terms defined in the commonly used dictionary should be interpreted to be consistent with the meanings in the context of the related art, and cannot be interpreted as having ideal or excessively formal meanings unless explicitly defined in the present application.

In general, a powder trap (or cold trap) may mean a device that traps and removes specific impurities due to a difference in vapor pressure or solubility between a solid surface and a fluid by placing a low-temperature solid surface on a fluid path. In the equipment used for semiconductor or display (LCD) manufacturing, the finished gas or process product is connected to a scrubber through an exhaust device and discharged to the outside, and this gas contains various impurities. Impurities discharged inevitably in the manufacturing process have a fine powdery particle form. When these impurities are introduced into a vacuum pump connected to a vacuum pipe, it is almost impossible to remove them, greatly shortening the life of the vacuum pump and also contaminating the working environment. Cause problems in terms of Therefore, the present invention can protect the vacuum facility by trapping and removing these impurities contained in the gas by installing the thermoelectric element-based powder generation suppression trap 100 before the flow into the vacuum pump.

1 is a view showing a powder generation suppression trap based on a thermoelectric element according to an embodiment of the present invention, and FIG. 2 is a picture showing an embodiment of a powder generation suppression trap based on a thermoelectric element in FIG. 1, FIG. 3 Is an exploded view of the thermoelectric element-based powder production suppression trap in FIG. 1, and FIG. 4 is a diagram showing each configuration of the thermoelectric element-based powder production suppression trap in FIG. 3.

In one embodiment, the thermoelectric element-based powder generation suppression trap 100 may be installed on a discharge path of exhaust gas in a semiconductor or display manufacturing process. In one embodiment, the thermoelectric element-based powder generation suppression trap 100 may first filter the powder using a plurality of cooling fins and secondly filter through the filter. More specifically, the powder generation suppression trap 100 based on the thermoelectric element adopts a method of increasing the collection efficiency by using the principle of solidifying and forming a powder when the powder is below a normal temperature, and the temperature generated by rapidly cooling the thermoelectric element Due to the difference, the principle of collecting the powder in the cooling trap is used, and a filter can be added to filter the powder twice to prevent the powder from accumulating as much as possible.

1 to 4, the thermoelectric element-based powder generation suppression trap 100 includes a fan bracket 110, a thermoelectric element heat sink 120, an air fan 130, a cooling trap 140, and a filter 150. And a trap housing 160.

4A is a trap housing 160, FIG. 4B is a cooling trap 140, FIG. 4C is a thermoelectric heat sink 120, and FIG. 4D is a view showing the fan bracket 110. More specifically, Figure 4c1 is a view showing only the heat dissipation layer 122 of the thermoelectric heat sink 120, Figure 4c2 is a view showing at least one thermoelectric element 124 of the thermoelectric heat sink 120, Figure 4d1 is a fan bracket FIG. 4D2 is a view showing the air fan 130 coupled to the 110, and FIG. 4D2 is a view showing the through hole 114 of the fan bracket 110, the bracket body 112, and the vent 116.

The trap housing 160 may be implemented as a cylindrical structure including a gas passage 162 at the bottom and a flange 166 at the top. In one embodiment, the trap housing 160 may include a gas passage 162 connected to an exhaust gas discharge device of the semiconductor chamber to introduce exhaust gas at the bottom. The gas passage 162 may be embodied to have a diameter that can be accurately connected to the exhaust gas discharge device of the semiconductor chamber. The trap housing 160 extends from the gas passage 162 and is implemented with a diameter wider than that of the gas passage 162 so as to have a filter 150 and a cooling trap 140 therein, a cylindrical housing body 164 ). The trap housing 160 may include a flange 166 at the upper end of the housing body 164 corresponding to the opposite side of the gas passage 162. The flange 166 may determine its diameter equal to or slightly larger than the diameter of the plate 144 of the cooling trap 140. That is, the diameter of the flange 166 may be implemented with the same or suitable size that can be tightly coupled with the plate 144 to prevent the exhaust gas flowing through the gas passage 162 from leaking out.

The cooling trap 140 combines a plurality of cooling fins 146 inserted in the direction of the gas passage 162 inside the trap housing 160 and the plate 144 mounted on the trap housing 160, a plurality of cooling A cooling rod 142 protrudingly coupled to the opposite direction of the pins 146 may be included. In one embodiment, the cooling trap 140 may be formed of a metal material having good heat transfer, and preferably may be formed of aluminum. In one embodiment, the plurality of cooling fins 146 may be coupled to the plate 144 through a thermally conductive thermosetting adhesive. More specifically, the plurality of cooling fins 146 may be evenly projected along the circumferential direction of the plate 144. The plate 144 may correspond to the cover of the trap housing 160, and when the trap housing 160 is completely covered, a plurality of cooling fins 146 protruding downwards are disposed in the housing body 164 of the trap housing 160. It can be placed inside. The cooling trap 140 may collect powder therein through a plurality of cooling fins 146. Cooling rod 142 is formed in a cylindrical shape at the center of the upper surface of the plate 144 may be formed to protrude a predetermined length in the upper direction. The cooling rod 142 may serve as an outlet through which the exhaust gas introduced through the gas passage 162 is discharged. More specifically, the cooling rod 142 may discharge the gas from which the powder has been removed to the outside through filtering of the filter 150 and the plurality of cooling fins 146.

The filter 150 may be disposed inside the plurality of cooling fins 146. The filter 150 is implemented in a cylindrical shape with its inside open up and down to filter the powder not filtered by the plurality of cooling fins 146. More specifically, the filter 150 has a thickness sufficient to filter the powder, and the radius of the filter 150 may be formed smaller than the circumference of the plurality of cooling fins 146. The height of the filter 150 may be formed equal to or smaller than the height of the housing body 164.

The thermoelectric element heat sink 120 may be coupled to the cooling rod 142 through a through hole. The thermoelectric element heat sink 120 may be coupled to the cooling rod 142 through a through hole to maintain a constant temperature of the cooling rod 142. In one embodiment, the thermoelectric element heat sink 120 may include a plurality of heat dissipation layers 122 formed in layers according to through holes. The thermoelectric element heat sink 120 may perform heat dissipation through a plurality of heat dissipation layers 122. In one embodiment, the thermoelectric element heat sink 120 may include at least one thermoelectric element 124 disposed on the lower surface to cool the cooling trap 140. Here, the thermoelectric element 124 is an element formed to have a temperature difference between both sides, and may mean an element capable of freely controlling the temperature of cooling and heating by a direct current. In one embodiment, the thermoelectric element 124 is disposed on the lower surface of the thermoelectric element heat sink 120 to absorb the surface in contact with the cooling trap 140 to maintain the temperature of the cooling trap 140 at a low temperature. In one embodiment, the thermoelectric element heat sink 120 may keep the temperature of the cooling rod 142 constant by performing heat dissipation in contact with the opposite surface causing heat generation of the thermoelectric element 124. In one embodiment, the thermoelectric element heat sink 120 may increase thermal efficiency and reduce heat loss by increasing the adhesion with the thermoelectric element 124.

The fan bracket 110 arranges the air fan 130 on one side of the thermoelectric heat sink 120 and opens the opposite side to surround the plurality of heat dissipation layers and cool air between the plurality of heat dissipation layers through the air fan 130. Can provide. The air fan 130 is fixed to the side of the thermoelectric element heat sink 120 through the fan bracket 110, and provides cooling air between the plurality of heat dissipation layers 122 through the vent 116 to perform heat dissipation smoothly can do. 1 to 4, the fan bracket 110 includes two air fans 130, but is not necessarily limited thereto, and the air fan 130 may be configured as at least one.

In one embodiment, the fan bracket 110 may open the lower surface and form a through hole 114 in the upper surface so that the cooling rod 142 protrudes. The fan bracket 110 may implement the size of the bracket body 112 to an appropriate size such that the thermoelectric element heat sink 120 can be provided therein. The fan bracket 110 forms a through-hole 114 at the center to protrude the cooling rod 142 to the outside, and the cooling rod 142 can smoothly filter out the filtered gas.

In one embodiment, the control trap (not shown) may increase or decrease the rotational speed of the air fan 130 by measuring the temperature in the center of the plurality of heat dissipation layers. For example, the control trap decreases the rotational speed of the air fan 130 when the temperature of the heat dissipation layers 122 is higher than a certain standard, and increases the rotational speed of the air fan 130 when it is lower than the predetermined standard. Can.

5 is a graph showing the effect of the thermoelectric element-based powder generation suppression trap according to an embodiment, and FIG. 6 is a photograph showing the actual effect of the thermoelectric element-based powder production suppression trap according to an embodiment.

5A shows the process of generating powder in the vacuum pump before the installation of the thermoelectric element-based powder generation suppression trap 100 (top), the change in vibration from the semiconductor chamber to the scrubber (center), and the temperature change from the semiconductor chamber to the scrubber (bottom). 5B is a graph showing the process of generating powder in a vacuum pump after installation of the thermoelectric element-based powder generation suppression trap 100 (above), from the semiconductor chamber to the scrubber (middle) and from the semiconductor chamber to the scrubber This graph shows the temperature change (below).

In FIG. 5A, it can be seen that before the installation of the thermoelectric element-based powder generation suppression trap 100, the generation of solid powder in the vacuum pump is inevitable as the temperature decreases and the pressure rises during the flow of exhaust gas. However, in FIG. 5B, according to the installation of the thermoelectric element-based powder generation suppression trap 100, the temperature and pressure conditions inside the vacuum pump were previously implemented to suppress the generation of solid powder in the vacuum pump.

FIG. 6A is a photograph showing a state in which powder is accumulated in a vacuum pump pipe and a rotor before installation of the thermoelectric element-based powder production suppression trap 100, and FIG. 6B is a plurality of thermoelectric element-based powder production suppression traps 100 after installation. This is a picture showing the residual of the powder after the 1st and 2nd filtering through the cooling fins and the filter. The powder generation suppression trap 100 based on the thermoelectric element according to the present invention can effectively suppress powder production by mixing and applying the advantages of the filter method and the advantages of the cooling fin method, and is required for maintenance by using the thermoelectric element. Costs can be minimized.

Although described above with reference to preferred embodiments of the present invention, those skilled in the art variously modify and change the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. You can understand that you can.

100: thermoelectric element-based powder generation suppression trap
110: fan bracket 120: thermoelectric heat sink
112: bracket body
114: through hole
116: vent
122: heat dissipation layer 124: thermoelectric element
130: air fan 140: cooling trap
142: cooling rod
144: plate
146: a plurality of cooling fins
150: filter 160: trap housing
162: gas passage
164: housing body
166: flange

Claims (7)

A trap housing including a gas passage connected to the chamber;
A cooling trap including a plurality of cooling fins inserted in the direction of the gas passage inside the trap housing, a plate mounted on the trap housing, and a cooling rod protrudingly coupled in opposite directions of the plurality of cooling fins;
A filter disposed inside the plurality of cooling fins; And
A thermoelectric element-based powder generation suppression trap comprising a thermoelectric element heat sink coupled to the cooling rod through a through hole.
The method of claim 1, wherein the cooling trap
The thermoelectric element-based powder generation suppression trap, characterized in that the plurality of cooling fins are evenly projected along the circumferential direction of the plate.
The method of claim 1, wherein the thermoelectric element heat sink
A thermoelectric element-based powder generation suppression trap comprising a plurality of heat dissipation layers formed in a layer in accordance with the through hole.
The method of claim 3, wherein the thermoelectric element heat sink
A thermoelectric element-based powder generation suppression trap comprising at least one thermoelectric element disposed on a lower surface to cool the cooling trap.
According to claim 4,
An air fan is arranged on one side of the heat sink of the thermoelectric element, and the opposite side is opened to cover the plurality of heat dissipation layers and further include a fan bracket that provides cooling air between the plurality of heat dissipation layers through the air fan. Powder generation suppression trap based on thermoelectric elements.
The fan bracket of claim 5,
A thermoelectric element-based powder generation suppression trap, characterized in that the lower surface is opened and a through hole is formed in the upper surface to protrude the cooling rod.
The method of claim 5,
The thermoelectric element-based powder generation suppression trap further comprising a control trap for measuring the temperature in the center of the plurality of heat radiation layers to increase or decrease the rotational speed of the air fan.

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