KR20200059471A - Heat spreader and electronic device comprising the same - Google Patents

Abstract

Provided is a heat spreader and an electronic device including the same. The heat spreader includes: a first plate material composed of a thermal conductive plate material; and a second plate material facing the first plate material, and combined with the first plate material and composed of a thermal conductive plate material, wherein the first plate material includes at least one 1-1 cavity formed in an empty space, and at least one 1-2 cavity which is spaced apart from a first cavity and is formed in the empty space. The second plate is divided by a branch composed of a portion of the thermal conductive plate and includes at least a second cavity formed in the empty space. At least a portion of at least one of the 1-1 cavity and the 1-2 cavity overlaps each other on a vertical line with a branch defining the second cavity.

Description

Heat spreader and electronic device including the same {HEAT SPREADER AND ELECTRONIC DEVICE COMPRISING THE SAME}

The present invention relates to a heat spreader and an electronic device including the heat spreader that can improve the strength while effectively dissipating heat generated from an internal heat source such as an electric or electronic product to the outside.

Recently, the demand for electronic devices such as mobile devices, smart phones, and smart devices is rapidly increasing. If the heat inside the electronic device does not dissipate to the outside, the life of the parts inside the electronic device may be shortened or the electronic device may explode or cause a fire. There are cases where malfunctioning problems occur. In addition, in recent years, the technology development direction of smart phones and the trend of product launches are strengthening the packing by consumers' demands for waterproof and dustproof, making it increasingly difficult to dissipate the heat inside the electronic devices. There is a need for a technology that can effectively diverge outside.

In particular, the AP chip part that controls electronic devices generates heat and generates heat from the AP chip part more effectively to the outside of the electronic device. In this situation, a simple heat sink used is used. However, in the recent trend of electronic devices gradually miniaturizing and slimming, simple heat sinks are difficult to dissipate heat effectively while occupying a relatively large space, and heat pipes have a large number of bends due to the nature of the product in which the heat medium is injected. It is difficult to use because the movement is not smooth, there is a problem that does not exhibit effective heat dissipation performance, there is a problem that the heat dissipation function is lost if it is damaged by external shock or stamping. In addition, heat dissipation by a simple heat sink also has a problem that the heat dissipation effect is insufficient due to the limitation of the surface area.

Therefore, research on a heat dissipation device that occupies a small area and is easy to install, but which can maximize the heat dissipation effect in a compact and slim electronic device, is necessary.

Republic of Korea Patent Publication No. 10-2013-0043720 Republic of Korea Registered Patent Publication No. 10-1533782

The problem to be solved by the present invention is to provide a heat spreader capable of effectively dissipating heat to the outside while occupying a small area inside the electronic device.

In addition, the present invention is to provide a heat spreader that can be applied in various forms such as a curved portion, and can be freely applied in a miniaturized and slim electronic device.

In addition, it is to provide a heat spreader that is less likely to be damaged by external shocks or stamping, or to lose heat dissipation.

In addition, it is to provide a heat spreader that allows the heat of the heat source to be discharged through a uniform area.

In addition, it is to provide a heat spreader capable of effectively improving durability by preventing a decrease in strength while dissipating heat from a heat source through a uniform area.

In addition, it is to provide an electronic device including the heat spreader as described above.

The problems of the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

The heat spreader according to an embodiment of the present invention for solving the above problems is a first plate material composed of a thermally conductive plate material, and a first plate material facing the first plate material, coupled to the first plate material, and made of a thermally conductive plate material. Including a second plate, the first plate includes at least one first-first cavity formed of an empty space, and at least one first 1-2 cavity spaced apart from the first cavity and formed of an empty space, the second The plate material includes at least one second cavity divided by a branch and formed of a blank space formed as a part of the thermally conductive plate material, and at least a portion of at least one of the 1-1 cavity and the 1-2 cavity is It is characterized in that it overlaps each other on the vertical line with the branch that divides the second cavity.

In addition, the 1-1 cavity, the 1-2 cavity or the second cavity of the first plate may be characterized by consisting of at least two or more.

In addition, the first 1-2 cavities may be composed of two or more, and may be characterized in that the 1-1 cavities are disposed in a state interposed on a horizontal plane.

Further, the first 1-2 cavities may be composed of four or more, and may be characterized in that two or more cavities are opposed to each other in a state interposed on the horizontal plane.

In addition, when defining that the heat spreader extends in a first direction having a relatively longer length on a horizontal plane and a second direction perpendicular to the first direction, the first and second cavities are the first direction in the first direction. Two or more are disposed on both sides of the 1-1 cavity, and the distance between adjacent 1-2 cavities is a position farther from the 1-1 cavity in contrast to the first width of a position closer to the 1-1 cavity. It can be characterized by the larger the second width of

In addition, when defining that the heat spreader extends in a first direction having a relatively longer length on a horizontal plane and a second direction perpendicular to the first direction, the first and second cavities are the first direction in the first direction. 2 or more are disposed on both sides of the 1-1 cavity, and the distance between adjacent 1-2 cavities may be characterized in that the width gradually increases from the closest position to the distant position in the 1-1 cavity. have

In addition, the second plate includes a first region in which the second cavity is formed, and the first region is an edge portion, a first branch formed extending from the edge portion, and a second portion formed extending from the first branch. Including a branch, the second cavity may be characterized by being divided by any two or more of the rim portion, the first branch and the second branch

In addition, at least a portion of at least one of the 1-1 cavity and the 1-2 cavity overlaps each other on the horizontal plane with the branch defining the second cavity, and the 1-1 cavity in the first plate and At least one or more of the thermally conductive plate partitioning the first and second cavities may be characterized in that they overlap each other on the horizontal plane.

In addition, the first plate and the second plate is further coupled to at least one surface of the third plate consisting of a heat-conducting plate, the surface of the third plate is the 1-1 cavity, the 1-2 It may be characterized in that it covers both the cavity and the second cavity.

An electronic device according to an embodiment of the present invention for solving the above problems is a circuit board, a heat source electrically connected to the circuit board, and a shielding unit formed to surround the heat source with the circuit board interposed therebetween. , A heat spreader disposed on the shielding unit, and a heat spreader disposed on the heat spreader and composed of a metal plate, wherein the heat spreader is the heat spreader, and the 1-1 cavity of the first plate material and the At least one of the 1-2 cavities is characterized in that it is located on the vertical line of the heat source.

In addition, a heat dissipating adhesive interposed between the shielding unit and the heat spreader to adhere them may further include a heat conductive heat dissipating tape.

In addition, a heat dissipation adhesive or a thermally conductive heat dissipation tape interposed between the heat spreader and the heat dissipation plate may be further included.

Details of other embodiments are included in the detailed description and drawings.

According to embodiments of the present invention has at least the following effects.

The heat spreader according to the present invention can more effectively dissipate heat from the inside of the electronic device to the outside while occupying a small area within the compact and slim electronic device.

In addition, even if there is a bend or the like inside the electronic device, it can be applied freely, and even if the heat spreader is partially damaged or the shape is changed due to external shock or stamping, the heat dissipation function is not lost.

In addition, it is possible to dissipate heat emitted from the heat source to the outside through a uniform area of the heat spreader.

In addition, it is possible to effectively improve durability by preventing heat from being deteriorated while dissipating heat from a heat source through a uniform area.

In addition, by including the heat spreader as described above, the electronic device according to the present invention can improve the durability while dissipating heat inside the electronic device more effectively and evenly to the outside.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the present specification.

1 is a schematic perspective view of a heat spreader according to an embodiment of the present invention.
FIG. 2 is a plan view of the heat spreader of FIG. 1.
3 is an exploded perspective view of the heat spreader of FIG. 1.
4 is a plan view of the first plate member of the heat spreader, and is a plan view schematically showing the direction of heat flow in the first plate member.
5 is a plan view of the second plate material of the heat spreader.
6 is a plan view of a first plate material for explaining the present invention in more detail.
7 is a plan view of a second plate material for explaining the present invention in more detail.
8 is a schematic perspective view of a heat spreader according to another embodiment of the present invention.
9 is a plan view of the heat spreader of FIG. 8.
10 is an exploded perspective view of the heat spreader of FIG. 8.
11 is a plan view for expressing the heat spreader of FIG. 8 in more detail.
12 is a cross-sectional view of the heat spreader of FIG. 11 taken along a-a '.
13 is a cross-sectional view of the heat spreader of FIG. 11 taken along b-b '.
14 to 20 are plan views of second plates according to another embodiment of the present invention.

Advantages and features of the present invention, and methods for achieving them will be clarified with reference to embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, and only the embodiments allow the disclosure of the present invention to be complete, and the ordinary knowledge in the technical field to which the present invention pertains. It is provided to fully inform the holder of the scope of the invention, and the invention is only defined by the scope of the claims. The same reference numerals refer to the same components throughout the specification. In the drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity of explanation.

The spatially relative terms "below", "beneath", "lower", "bottom side", "bottom", "above", "upper", " The "top surface", "upper side", and the like can be used to easily describe the correlation of one element or components with another element or components.

Although the first and second lights are used to describe various elements, it goes without saying that these elements are not limited by these terms. These terms are only used to distinguish one component from another component. Therefore, it goes without saying that the first component mentioned below may be the second component within the technical spirit of the present invention.

The accompanying drawings may be exaggerated somewhat for a more detailed description of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 is a schematic perspective view of a heat spreader according to an embodiment of the present invention, FIG. 2 is a plan view of the heat spreader of FIG. 1, and FIG. 3 is an exploded perspective view of the heat spreader of FIG. 1. It is.

Hereinafter, a heat spreader according to an exemplary embodiment of the present invention will be described with reference to FIGS. 1 to 3.

1 to 3, the heat spreader 1 is a first plate member 200 made of a thermally conductive plate member, and facing the first plate member 200, is coupled to the first plate member 200, and thermoelectric It includes a second plate 100 made of a conductive plate. The first plate 200 is at least one or more first-to-one cavities 210 formed of an empty space, and at least one or more first-to-one cavities 221 and 222 spaced apart from the first cavity 210 and formed into an empty space. , 223, 224, 225, 226, and the second plate 100 is at least one second cavity (110) divided by a branch (b) composed of a part of the thermally conductive plate and composed of an empty space , h), wherein at least a portion of at least one of the 1-1 cavity 210 and the 1-2 cavity (221, 222, 223, 224, 225, 226) is the second cavity 110, It characterized in that it overlaps each other on the vertical line with the branch (b) dividing h).

The first plate 200 is composed of a thermally conductive plate material, for example, copper, silver aluminum, graphite, carbon nanotubes, graphene, etc. may include a member having excellent thermal conductivity, and if the member is excellent in thermal conductivity It is not particularly limited to either. For example, among the thermally conductive members, the copper has a thermal conductivity of 400 W / (mK), and the aluminum has a very high thermal conductivity of 237 W / (mK). In addition, the thermally conductive plate material may be configured in a thin plate material type, for example, may have a thickness of 0.3 mm or less. In addition, when the thickness direction of the first plate 200 is referred to as a vertical direction, and the direction in which the plate material extends is a horizontal direction, it may have a shape that extends relatively long in a first direction among the horizontal directions. This will be described in more detail later with reference to the relationship with other components.

The second plate member 100 is composed of a thermally conductive plate member as the first plate member 200, and includes, for example, a member having excellent thermal conductivity such as copper, silver aluminum, graphite, carbon nanotubes, graphene, and the like. Can be. In addition, it may be made of the same material as the first plate 200, or may be applied differently by appropriately selecting one of the thermally conductive members as needed. In addition, the first plate 200 and the second plate 100 are disposed to face each other. Here, the meaning of facing each other is a state in which the faces and faces of the first plate 200 and the second plate 100 face each other (here, the meaning of the face and the face is the first plate 200 and the second plate 100) Although it includes several cavities to be described later, it may be considered to mean the surface of a thermally conductive plate that is assumed when there is no cavity), and the first plate 200 and the second plate 100 defined above are It can be said that it means a state in which the wide faces face each other in the thickness direction.

Both the first plate 200 and the second plate 100 have a thin thickness and a thin plate shape extending widely in the horizontal direction, and may be coupled to each other by surface welding or spot welding. Preferably, the surfaces of portions overlapping each other may be combined with each other by a kind of surface welding or spot welding that applies pressure and heat as a whole. In addition, a portion of the first plate 200 and the second plate 100, which will be described below, may be combined with only a portion of the surfaces, as necessary.

Meanwhile, FIG. 4 is a plan view of the first plate member 200 of the heat spreader of the present invention, and a plan view schematically showing the direction of heat (arrow) in the first plate member 200 is shown. A plan view of the two-plate material 100 is shown. In addition, FIG. 6 is a plan view of the first plate member 200 for explaining the present invention in more detail, and FIG. 7 is a plan view of the second plate member 100 for explaining the present invention in more detail. have.

Hereinafter, with reference to Figures 4 to 7 will be described in more detail with respect to the relationship of the respective components of the first plate 200 and the second plate 100 of the present invention.

The first plate 200 is a 1-1 cavity 210 formed of an empty space, and a 1-2 cavity 221, 222, 223, 224, 225 spaced apart from the first cavity 210 and formed of an empty space. 226), the second plate 100 comprises a second cavity (110, h) divided by a branch (b) consisting of a portion of the thermally conductive plate and composed of an empty space, the first At least one of at least one of the -1 cavity 210 and the 1-2 cavity 221, 222, 223, 224, 225, 226 is the branch (b) partitioning the second cavity (110, h) And overlapping each other on a horizontal plane.

On the other hand, the meaning of the empty spaces constituting the first and second cavities of the first and second cavities 200 and the first and second cavities 200 and the second cavities 100 of the present invention described above and below is the meaning of this specification As shown in the drawings, it may mean an empty space completely pierced in the vertical direction, and, on the other hand, a part of the recessed state, that is, the thickness of the plate material becomes thinner than the thickness of the peripheral portion, so that other plate materials (first plate material) When the thickness of a part of a part becomes thinner to form a cavity, the relationship with the second plate or, if a part of a part of the second plate becomes thinner to form a cavity, the relationship with the first plate) It may be formed spaced apart at regular intervals.

The first plate 200 may be prevented from dissipating heat to the outside by concentrating a heat source of an electronic device, which will be described later, in one place through a heat spreader by the first-1 cavity 210 formed as an empty space. The 1-1 cavity 210 may be disposed on a vertical line with a heat source to be described later. As a result, the portion to which the most heat is transferred from the heat source is insulated by the 1-1 cavity 210 of the empty space, so that heat is scattered to the periphery and evenly distributed. However, if necessary, in addition to the 1-1 cavity 210, the 1-2 cavity 221, 222, 223, 224, 225, 226 of the periphery and a heat source may be arranged on a vertical line, which is required by a person skilled in the art. Although it may be appropriately changed according to the above, preferably, a heat source is preferably disposed on a vertical line of the 1-1 cavity 210.

In detail, if the portion that emits the most heat in the electronic device is the AP chip that controls the electronic device, the AP chip part becomes a hot spot due to the dissipation of a lot of heat, and the heat conduction Due to the nature, most of the heat transferred to the upper portion is forced to be concentrated at the top of the hot spot. However, if the 1-1 cavity 210 is formed in a portion located at the top of the hot spot as in the present invention, the air layer exists in the 1-1 cavity 210 portion, and in the case of the air layer, Compared to the thermally conductive member described, the thermal conductivity is considerably low at a level of 0.0.25 W / (mK), and the thermal conductivity is dispersed to other parts. Therefore, the heat of the hot spot portion is concentrated in one place and is not transmitted to the upper side, so that it can be evenly distributed around the 1-1 cavity 210.

The 1-1 cavity 210 may be substantially disposed at the center on the first plate 200. Thereby, heat can be evenly distributed in all directions up, down, left, and right on the horizontal cross section. The first and second cavities 221, 222, 223, 224, 225, and 226 are spaced apart from the first cavity 210 and formed as an empty space. As shown in FIG. 4, the first and second cavities 221, 222, 223, 224, 225, and 226 can be used to control the movement path of heat, and can be concentrated in a specific direction and quickly spread to the periphery. have. The first and second cavities (221, 222, 223, 224, 225, 226) are also formed by an empty space, whereby the thermal conductivity becomes relatively small compared to the portion where the thermally conductive plate is present, whereby the thermally conductive plate is present. You can make the heat spread partially. As a result, as illustrated in FIG. 4, heat can be rapidly spread to the S1 direction, the S2 direction, and the peripheral portion. That is, a path through which heat is transferred on the thermally conductive plate is made by the first and second cavities (221, 222, 223, 224, 225, 226) in preparation for the case where the thermally conductive plate is present everywhere, and heat is generated. It is possible to efficiently spread heat to the periphery by the path having a relatively good transfer efficiency.

For example, the 1-2 cavities 221, 222, 223, 224, 225, and 226 may be radially formed around the 1-1 cavity 210. Accordingly, heat can be well distributed radially to the periphery.

The 1-1 cavity 210 and the 1-2 cavity 221, 222, 223, 224, 225, 226 of the first plate 200 may be characterized by consisting of at least two or more. have. Thereby, heat can be well distributed to the periphery. In addition, the first 1-2 cavity (221, 222, 223, 224, 225, 226) is composed of two or more, characterized in that arranged in a state interposed between the 1-1 cavity 210 on a horizontal plane Can be done with Accordingly, it is possible to uniformly distribute a large amount of heat from the heat source (hot spot) to the periphery of the 1-1 cavity 210. This is because the first and second cavities 221, 222, 223, 224, 225, and 226 are disposed with the 1-1 cavity 210 interposed therebetween, further heat is generated at a position close to the 1-1 cavity 210. This is to quickly spread to the periphery.

The first 1-2 cavities (221, 222, 223, 224, 225, 226) are composed of 4 or more, and each of the 1-1 cavities 210 is disposed on a horizontal plane, and two or more are disposed facing each other. It can be characterized by being. In addition, the 1-2 cavities 221, 222, 223, 224, 225, and 226 are based on the 1-1 cavity 210 with the 1-1 cavity 210 interposed on a horizontal plane. It can be formed symmetrically while facing each other. Accordingly, it is possible to distribute substantially the same amount of heat to both sides of the 1-1 cavity 210.

4 and 6, it can be defined that the heat spreader extends in a first direction (S1 and S2 directions) having a relatively longer length on a horizontal plane and a second direction perpendicular to the first direction. In this case, two or more first 1-2 cavities may be disposed on both sides of the first-1 cavity 210 in the first direction S1-S2. That is, two 1-2 cavities 221 and 222 on the lower side and two 1-2 cavities 223 and 224 on the upper side may be disposed based on the 1-1 cavity 210, respectively. They may be arranged spaced apart from each other, and they may also be symmetrical.

At this time, the distance between the first and second cavities adjacent to each other (between 221 and 222 in the drawing, between 223 and 224) is compared with the first width P1 at a position close to the first-1 cavity 210. It may be characterized in that the second width P2 at a position far from the 1-1 cavity 210 is larger. In addition, the distance between adjacent 1-2 cavities may be characterized in that the width gradually increases from the 1-1 cavity 210 to the distant location. Accordingly, in the vicinity of the 1-1 cavity 210, which is a hot spot where the heat of the heat source is transferred to the closest, a region in which a relatively narrow thermal conductive plate is present is created, and heat is rapidly transferred to the periphery through the thermal conductive plate. It can be transferred, and as the distance increases, the area of the thermally conductive plate is widened to increase the heat capacity, so that heat can be effectively transferred in a direction away from the hot spot.

Meanwhile, referring to FIGS. 5 and 7, the second plate 100 is at least one or more second cavities 110 and h divided by a branch (b) composed of a part of the thermally conductive plate and composed of an empty space. ). The second cavities 110 and h may be characterized by being composed of at least two or more. The second cavities 110 and h may be empty while being partitioned by a branch (b) composed of a part of the thermally conductive plate. The second cavities 110 and h are formed in plural as shown in FIGS. 5 and 7, and the branches (b) partitioning them may be in the form of a kind of net.

At least a portion of at least one of the 1-1 cavity 210 and the 1-2 cavity (221, 222, 223, 224, 225, 226) the branch partitioning the second cavity (110, h) (b) and overlap each other on the vertical line. The branch (b) is the first plate formed by the first-1 cavity 210 and the 1-2 cavity (221, 222, 223, 224, 225, 226) formed as an empty space in the first plate 200 The strength drop of 200 can be compensated. That is, the 1-1 cavity 210 and the 1-2 cavity 221, 222, 223 of the first plate 200 in which the branch (b) partitioning the second cavity 110, h is formed as an empty space, 224, 225, 226) and some overlap and some overlap with the other thermally conductive plates partitioning the 1-1 cavity 210 and the 1-2 cavity 221, 222, 223, 224, 225, 226 In the meantime, it is possible to prevent a decrease in strength, distortion, etc. formed on the first plate material 200. These are partially overlapped with the empty spaces of the 1-1 cavity 210 and the 1-2 cavity 221, 222, 223, 224, 225, 226, and the other portion is the thermally conductive plate of the remaining first plate 200 By being combined with, it is possible to perform a function of a skeleton capable of compensating for the weakening of the heat spreader without interfering with the heat transfer of the hot spot portion. Thereby, the durability of a heat spreader can be improved.

Meanwhile, when the second plate 100 is described in more detail with reference to FIGS. 2, 5 and 7, the second plate 100 has a first region B in which the second cavities 110 and h are formed. ), Wherein the first region B includes a border portion L, a first branch formed from the border portion L, b1, b2, b3, and b4, and the first branch b1, b2 , b3, b4) and may include second branches (b5, b6, b7, b8) formed. In other words, the first branch (b1, b2, b3, b4) is formed by extending directly from the edge portion (L), the second branch (b5, b6, b7, b8) is the first branch (b1, b2) again , b3, b4). The second cavity 110 and h may be a part of the border portion L and an empty space partitioned by the first branches b1, b2, b3, and b4, and a portion of the border portion L and the second Can be partitioned by branches (b5, b6, b7, b8), or by the first branch (b1, b2, b3, b4) and the second branch (b5, b6, b7, b8), or both. have.

That is, the second cavity is divided by any two or more of the edge portion (L), the first branch (b1, b2, b3, b4) and the second branch (b5, b6, b7, b8) It can be characterized by. Accordingly, by holding the empty space formed in the first plate more tightly, the strength can be improved, and the durability of the heat spreader is reduced while maintaining the heat path formed by the 1-1 cavity and the 1-2 cavity. Can be prevented.

In addition, any one or more of the first branch (b1, b2, b3, b4) and the second branch (b5, b6, b7, b8) 1-1 of the first plate 200 formed of an empty space Cavities 210 and 1-2 cavities (221, 222, 223, 224, 225, 226) are partially overlapped and some are 1-1 cavities 210 and 1-2 cavities (221, 222, 223, 224, 225, 226) may be combined with the remaining thermally conductive plates overlapping on a vertical line. Thereby, the durability reduced by the empty space is supported and combined by two or more branches, thereby effectively compensating for the decrease in durability of the heat spreader.

In other words, at least a portion of at least one of the 1-1 cavity 210 and the 1-2 cavity 221, 222, 223, 224, 225, 226 partitions the second cavity 110, h The branch (b) to be overlapped with each other on a vertical line, the 1-1 cavity 210 and the 1-2 cavity (221, 222, 223, 224, 225, 226) in the first plate 200 It may be characterized in that at least one or more of the thermally conductive plates that partition the overlap with each other on the horizontal plane with the branch.

Meanwhile, FIG. 8 is a schematic perspective view of a heat spreader according to another embodiment of the present invention, and FIG. 9 is a plan view of the heat spreader of FIG. 8, and FIG. 10 is an exploded perspective view of the heat spreader of FIG. 8. Is shown. In addition, FIG. 11 is a plan view for expressing the heat spreader of FIG. 8 in more detail, and FIG. 12 is a cross-sectional view of the heat spreader of FIG. 11 cut along a-a ', and FIG. 13. A cross-sectional view of the heat spreader 11 cut along b-b 'is shown.

8 to 13, the heat spreader according to another embodiment of the present invention is coupled to at least one surface of the first plate 200 and the second plate 100 and a third plate made of a thermally conductive plate ( 300) may be further included. The surfaces of the third plate 300 include the 1-1 cavity 210, the 1-2 cavity 221, 222, 223, 224, 225, 226, and the second cavity 110, h. It can be characterized by covering all.

That is, the third plate 300 does not have a separate empty space, and may be in the form of a complete plate. Accordingly, it is possible to more effectively prevent the decrease in strength due to the empty space formed in the first plate member 200 or the second plate member 100. However, the present invention is not limited to this, and if necessary, the third plate is formed in the form of a cavity or a branch structure, such as the first plate or the second plate, to evenly heat the heat of a specific portion having a large heat source to the periphery. While spreading heat to dissipate heat, it is possible to improve durability through bonding with other plates.

In the drawing, the third plate 300 is illustrated as the third plate 300, the second plate 100, and the first plate 200 are sequentially disposed, but is not limited thereto, and the electronic device to be described later It may be appropriately disposed in consideration of the contact relationship with the shielding unit and the heat sink.

Meanwhile, FIGS. 14 to 20 are plan views of second plates according to various other embodiments of the present invention. 14 to 20, the first cavities 202, 203, 204, 205, 206, 207, and 208 of the present invention are in the form in which the branches are not completely connected and in a suspended form, or cavities of the same shape or the same size. It may be a repeating form.

On the other hand, without limitation, the heat spreader of the present invention further improves heat dissipation properties on one or both sides of the first plate, on one or both sides of the second plate, and / or on one or both sides of the third plate. In order to prevent the heat radiation material may be applied. The heat spreader of the present invention stacks and combines a thin sheet-like thermally conductive sheet, while forming a cavity immediately above the heat source to prevent heat from being concentrated, and heat from the hot spot immediately above the heat source to the periphery. Heat paths can be created to facilitate heat transfer so that heat transfer is easier. In addition, by connecting a plurality of thermally conductive plates to form a heat spreader, it is possible to manufacture freely even when there is a bend in the vertical direction or the horizontal direction, and there is very little risk of losing its function even by external impact or stamping. In addition, it is very easy to manufacture by combining the thermally conductive plate material.

Meanwhile, although not separately illustrated, the present invention provides an electronic device including a heat spreader according to various embodiments described above. The electronic device is a circuit board, a heat source electrically connected to the circuit board, a shielding unit formed to surround the heat source with the circuit board, a heat spreader disposed on the shielding unit, and the heat A heat spreader disposed on a spreader and comprising a heat sink made of a metal plate, wherein the heat spreader is the heat spreader of the present invention described in various embodiments, and the 1-1 cavity and the 1-2 cavity of the first plate material At least one of them is characterized in that located on the vertical line of the heat source.

The heat source is a portion that dissipates heat inside the electronic device, and may be, for example, an AP chip that controls the electronic device. Further, the circuit board may be an FPCB, a PCB, or the like electrically connected from a portion defined by the heat source. The shielding unit may be for protecting the heat source from external shocks or blocking electromagnetic waves.

Meanwhile, the heat sink performs a function of dissipating heat transferred from the heat spreader located at the bottom to the outside of the electronic device. The heat sink is formed of a material having a high thermal conductivity in the form of a plate material, which is well known in the art, and a detailed description thereof will be omitted.

Meanwhile, the first plate of the heat spreader is disposed on the shielding unit, and at least one of the first-1 cavity and the 1-2 cavity of the first plate is located on a vertical line of the heat source. It is characterized by. In other words, heat from the heat source is transferred from the first plate to the upper portion, and the first cavity is disposed in a vertical portion of the heat source with the most heat, so that the concentrated heat can spread to the periphery, and the first cavity Heat can be well transferred to the periphery by a path of heat formed by the surrounding second cavity.

In addition, it may include a heat dissipation adhesive or a heat-conducting heat-dissipating tape interposed between the second plate material of the heat spreader and the heat dissipation plate to adhere them. The heat dissipating adhesive is disposed between the heat sink and the second plate member to directly contact the heat sink and the second plate member to perform a heat transfer role therebetween, and may be referred to as a thermal interface material (TIM), for example. The heat dissipation adhesive may be a heat dissipation adhesive having excellent thermal conductivity or a heat dissipation tape, for example, a thermal conductivity of 2 W / (mk) to 5 W / (mk).

By connecting a heat spreader and a heat sink using a heat-radiating adhesive or heat-radiating tape having high thermal conductivity properties as described above, excellent heat dissipation can be realized by transferring heat to the heat sink with high heat transfer efficiency. For example, when using a heat dissipation adhesive, by coating the heat dissipation adhesive on the surface to be adhered to the heat spreader of the heat sink, by thermocompression bonding at a temperature of 80 ° C to 120 ° C, an empty space between the heat spreader and the heat sink 400 However, it is possible to prevent heat transfer loss by minimizing the formation of pores.

Meanwhile, the electronic device may include a heat dissipating adhesive interposed between the shielding unit and the first plate material of the heat spreader, or a heat dissipating tape having heat conductivity.

The heat dissipating adhesive may be formed of a conductive material having high heat transfer efficiency, and has elasticity, so as to increase the maximum contact area with the shielding unit. That is, the roughness of the upper surface of the shielding unit (the roughness of the upper surface may be high), and the heat transfer efficiency can be improved by compensating the roughness of the shielding unit while adhering between the first plate and the shielding unit by the heat-sensitive adhesive. The heat-sensitive adhesive is well known in the art, so a detailed description thereof will be omitted.

On the other hand, the heat spreader of the present invention can appropriately deform the thickness or area of the first plate material, the second plate material, and / or the third plate material, if necessary, and can also bend in the horizontal direction, and the shape thereof. It can be freely modified to suit the internal structure of the electronic device to which it is applied.

The embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and may be manufactured in various different forms, and having ordinary knowledge in the technical field to which the present invention pertains. It will be understood by those skilled in the art that other specific forms may be practiced without changing the technical spirit or essential features of the present invention. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

1, 2: Heat spreader
100, 102, 103, 104, 105, 106, 107, 108: Second plate
200: first plate
210: cavity 1-1
221, 222, 223, 224, 225, 226: cavity 1-2
110, h: second cavity
b: branch
L: Border
300: third plate

Claims (12)

A first plate composed of a thermally conductive plate; And
The second plate member facing the first plate member and combined with the first plate member and composed of a thermally conductive plate member.
The first plate includes at least one first-1 cavity formed of an empty space, and at least one first 1-2 cavity spaced apart from the first cavity and formed of an empty space,
The second plate includes at least one second cavity divided by a branch composed of a part of the thermally conductive plate and composed of an empty space,
At least a portion of at least one of the 1-1 cavity and the 1-2 cavity, the heat spreader, characterized in that overlap with each other on the vertical line and the branch defining the second cavity. According to claim 1,
The heat spreader according to claim 1, wherein the 1-1 cavity, the 1-2 cavity, or the second cavity of the first plate is composed of at least two or more. According to claim 2,
The first 1-2 cavity is composed of two or more, and the heat spreader, characterized in that disposed in the state interposed on the horizontal plane 1-1. According to claim 3,
The first 1-2 cavity is composed of four or more, and the heat spreader, characterized in that two or more are disposed to face each of the 1-1 cavity on a horizontal plane. The method of claim 4,
When defining that the heat spreader extends in a first direction relatively longer in length on a horizontal plane and in a second direction perpendicular to the first direction,
Two or more of the first 1-2 cavities are disposed on both sides of the first-1 cavity in the first direction,
The distance between adjacent first and second cavities is greater than that of the first width of the position close to the 1-1 cavity, characterized in that the second width of the distant position of the 1-1 cavity is larger. The method of claim 4,
When defining that the heat spreader extends in a first direction relatively longer in length on a horizontal plane and in a second direction perpendicular to the first direction,
Two or more of the first 1-2 cavities are disposed on both sides of the first-1 cavity in the first direction,
The distance between adjacent 1-2 cavities is a heat spreader, characterized in that the width gradually increases from the closest position to the distant position in the 1-1 cavity. According to claim 1,
The second plate includes a first region in which the second cavity is formed,
The first region includes an edge portion, a first branch formed extending from the edge portion, and a second branch formed extending from the first branch,
The second cavity is a heat spreader, characterized in that divided by any two or more of the edge portion, the first branch and the second branch. According to claim 1,
At least a portion of at least one of the 1-1 cavity and the 1-2 cavity overlaps each other on a horizontal plane with the branch defining the second cavity,
A heat spreader, characterized in that at least one or more of the thermally conductive plate partitioning the 1-1 cavity and the 1-2 cavity in the first plate overlaps each other on the horizontal plane with the branch. According to claim 1,
The first plate and the third plate is coupled to at least one surface of the second plate and further comprises a third plate made of a thermally conductive plate,
The surface of the third plate is a heat spreader characterized in that it covers both the 1-1 cavity, the 1-2 cavity and the second cavity. Circuit board;
A heat source electrically connected to the circuit board;
A shielding unit interposed between the heat source and the circuit board to shield the heat source;
A heat spreader disposed on the shielding unit; And
The heat spreader disposed on the heat spreader and composed of a metal plate; includes,
The heat spreader is the heat spreader of any one of claims 1 to 9,
At least one of the 1-1 cavity and the 1-2 cavity of the first plate is an electronic device, characterized in that located on the vertical line of the heat source. The method of claim 10,
An electronic device further comprising a heat dissipating adhesive or a thermally conductive heat dissipating tape interposed between the shielding unit and the heat spreader to adhere them. The method of claim 10,
An electronic device further comprising a heat-radiating adhesive or a heat-conducting heat-radiating tape interposed between the heat spreader and the heat sink to adhere them.

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