KR20200052591A - Carrier for substrate and chemical mechanical polishing apparatus comprising the same - Google Patents

Abstract

According to an embodiment of the present invention, a carrier for a substrate may comprise: a carrier head; a drive ring connected to the carrier head; an elastic pad ring connected to a lower side of the drive ring and including an elastic material; and a retainer ring connected to a lower side of the elastic pad ring and surrounding the outside of the substrate gripped by the carrier head.

Description

A substrate carrier and a substrate polishing apparatus comprising the same {CARRIER FOR SUBSTRATE AND CHEMICAL MECHANICAL POLISHING APPARATUS COMPRISING THE SAME}

The following embodiment relates to a substrate carrier and a substrate polishing apparatus including the same.

In the manufacture of semiconductor devices, a chemical mechanical polishing (CMP) operation including polishing, buffing, and cleaning is required. The semiconductor element is in the form of a multi-layer structure, and a transistor element having a diffusion region is formed on the substrate layer. In the substrate layer, connecting metal wires are patterned and electrically connected to transistor elements forming a functional element. As is known, the patterned conductive layer is insulated from other conductive layers with an insulating material such as silicon dioxide. As more metal layers and associated insulating layers are formed, the need to flatten the insulating material increases. Without flattening, the production of additional metal layers becomes substantially more difficult due to many variations in surface morphology. In addition, the metal wire pattern is formed of an insulating material, and metal CMP work removes excess metal.

The CMP operation physically polishes the surface of the substrate through a polishing pad. This process is performed by pressing the substrate against the polishing pad while the substrate is gripped through the substrate carrier. When the frictional force between the polishing process of the substrate and the substrate and the polishing pad is not uniform with respect to the entire surface of the substrate, a phenomenon of insufficient polishing or overpolishing may occur depending on the pressing force applied to each part of the substrate. On the other hand, since the polishing pad has elasticity, the pressing force applied to the substrate during polishing is non-uniform, resulting in a phenomenon that the substrate deviates from the supporting device. Therefore, the substrate carrier is provided with retainer ring supporting the edge region of the substrate. On the other hand, since the retainer ring is polished together in the polishing process of the substrate, the vibration caused by self-wear and the vibration generated in the substrate are transmitted to the substrate carrier. Since the vibration transmitted to the substrate carrier causes a pressure non-uniformity to the substrate, it is an important factor inhibiting the polishing uniformity of the substrate. Accordingly, there is a need for a method of reducing vibration transmitted to a substrate carrier between polishing processes of the substrate.

The above-described background technology is possessed or acquired by the inventor during the derivation process of the present invention, and is not necessarily a known technology disclosed to the general public before filing the present invention.

An object of one embodiment is to provide a substrate carrier and a substrate polishing apparatus including the same, which attenuates vibration transmitted from the retainer to the carrier head between polishing processes of the substrate.

An object of an embodiment is to provide a substrate carrier and a substrate polishing apparatus including the substrate carrier capable of reducing vibration generated by wear of the retainer itself.

A substrate carrier according to an embodiment includes a carrier head; A drive ring connected to the carrier head; An elastic pad ring connected to a lower side of the drive ring and including an elastic material; And a retainer ring connected to the lower side of the elastic pad ring and surrounding the outside of the substrate gripped by the carrier head.

In the process of polishing the substrate, the elastic pad ring may damp vibration transmitted from the retainer ring to the carrier head.

The drive ring, a central portion connected to the center of the carrier head; A support portion to which the elastic pad ring is connected to the lower side; And a connecting portion connecting the central portion and the supporting portion.

The elastic pad ring may wrap at least a portion of the outer surface of the support.

The elastic pad ring may include a protruding portion protruding toward the support portion, the support portion includes a depressed portion recessed inward, and the protruding portion and the depressed portion may be coupled to each other.

The protrusion may extend along an outer surface of the elastic pad ring or may extend from an inner surface or a central portion of the elastic pad ring.

The elastic pad ring may be fastened to the support portion, and the fastening portion of the elastic pad ring and the support portion may be formed in a shape corresponding to each other.

The connecting portion, a ring member including a hollow into which the central portion is inserted; And a plurality of connection bars extending radially from the ring member and connected to the support.

The connecting bar may include a curved portion.

The connection portion, which is located between the ring member and the support portion, may further include an intermediate ring member interconnecting the plurality of connection bars.

The drive ring may be integrally formed.

A substrate polishing apparatus according to an embodiment includes a polishing unit having a polishing pad; And a carrier head pressing the substrate against the polishing pad, a driving ring connected to a lower side of the carrier head, a retainer ring supporting the outside of the substrate gripped by the carrier head, and vibrations generated by the retainer ring absorbed. It may include; a substrate carrier including an elastic pad ring connecting the retainer ring and the drive ring.

The elastic pad ring may include a compressible elastic material.

The elastic padring may absorb vertical vibrations transmitted from the retainer ring to the carrier head during the polishing process of the substrate.

The elastic pad ring may absorb horizontal vibrations transmitted from the retainer ring to the carrier head during the polishing process of the substrate.

The elastic pad ring may absorb both vertical and horizontal vibrations transmitted from the retainer ring to the carrier head during the polishing process of the substrate.

The substrate carrier and the substrate polishing apparatus including the same according to an embodiment may attenuate vibration transmitted from the retainer to the carrier head between polishing processes of the substrate.

The substrate carrier and the substrate polishing apparatus including the same according to an embodiment may reduce vibration generated by wear of the retainer itself, thereby improving polishing uniformity of the substrate.

The effects of the substrate carrier and the substrate polishing apparatus including the same according to an embodiment are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

The following drawings attached to this specification are intended to illustrate one preferred embodiment of the present invention and serve to further understand the technical spirit of the present invention together with the detailed description of the present invention, so the present invention is limited to those described in those drawings. It should not be construed as limited.
1 is a schematic diagram of a substrate polishing apparatus according to an embodiment.
2 is a cross-sectional view of a substrate carrier according to an embodiment.
3 is a perspective view of a drive ring and an elastic pad ring according to an embodiment.
4 is a plan view of a driving ring according to an embodiment.
5 is a side cross-sectional view of a drive ring and an elastic pad ring according to an embodiment.
6 is a plan view of a driving ring according to an embodiment.
7 is a side cross-sectional view of a drive ring and an elastic pad ring according to an embodiment.
8 is a plan view of a driving ring according to an embodiment.
9 is a side cross-sectional view of a drive ring and an elastic pad ring according to an embodiment.

Hereinafter, embodiments will be described in detail through exemplary drawings. It should be noted that in adding reference numerals to the components of each drawing, the same components have the same reference numerals as possible even though they are displayed on different drawings. In addition, in describing the embodiments, when it is determined that detailed descriptions of related well-known configurations or functions interfere with understanding of the embodiments, detailed descriptions thereof will be omitted.

In addition, in describing the components of the embodiment, terms such as first, second, A, B, (a), (b), and the like can be used. These terms are only for distinguishing the component from other components, and the nature, order, or order of the component is not limited by the term. When a component is described as being "connected", "coupled" or "connected" to another component, that component may be directly connected to or connected to the other component, but another component between each component It should be understood that may be "connected", "coupled" or "connected".

Components included in any one embodiment and components including a common function will be described using the same name in other embodiments. Unless there is an objection to the contrary, the description described in any one embodiment may be applied to other embodiments, and a detailed description will be omitted in the overlapped range.

1 is a schematic diagram of a substrate polishing apparatus according to an embodiment.

Referring to FIG. 1, the substrate polishing apparatus 1 according to an embodiment may be used in the CMP process of the substrate W.

The substrate W may be a silicon wafer for manufacturing a semiconductor device. However, the type of the substrate W is not limited thereto. For example, the substrate W may include glass for a flat panel display device (FPD) such as a liquid crystal display (LCD) or a plasma display panel (PDP). Meanwhile, in the drawings, the substrate W is illustrated as having a circular shape, but this is only an example for convenience of description, and the shape of the substrate W is not limited thereto.

The substrate polishing apparatus 1 can polish the substrate W. The substrate polishing apparatus 1 may include a polishing unit 11 and a substrate carrier 10.

The polishing unit 11 can polish the surface to be polished of the substrate W. The polishing unit 11 may include a polishing platen 112 and a polishing pad 111.

A polishing pad 111 may be connected to the polishing platen 112. For example, a polishing pad 111 may be attached to the top of the polishing platen 112. The polishing platen 112 may polish the surface of the substrate W contacting the polishing pad 111 while rotating around an axis. The polishing platen 112 may adjust the position of the polishing pad 111 relative to the ground while moving in the vertical direction.

2 is a cross-sectional view of a substrate carrier according to an embodiment.

Referring to FIG. 2, the substrate carrier 10 can grip the substrate W. The substrate carrier 10 may chuck and grip the substrate W that needs to be polished, and move the gripped substrate W to the top of the polishing pad 111. The substrate carrier 10 can polish the substrate W by bringing the substrate W transferred to the top of the polishing pad 111 into contact with the polishing pad 111. The substrate carrier 10 may adjust the frictional force between the substrate W and the polishing pad 111 by pressing the substrate W in contact with the polishing pad 111. The substrate carrier 10 attenuates vibrations generated during the polishing process of the substrate W, thereby preventing the substrate W from deviating from the polishing position. The substrate carrier 10 may include a carrier head 101, a membrane 105, a retainer ring 104, a drive ring 102 and an elastic pad ring 103.

The carrier head 101 can adjust the position of the substrate W. The carrier head 101 receives power from the outside and can rotate around an axis perpendicular to the polishing pad 111 surface. The substrate W held by the rotation of the carrier head 101 may be polished while rotating in contact with the polishing pad 111.

The carrier head 101 can move the substrate W horizontally. For example, the carrier head 101 may translate in a first direction parallel to the surface of the polishing pad 111 and a second direction perpendicular to the first direction. Through the complex movement in the first direction and the second direction, the carrier head 101 can move the substrate W on a plane parallel to the polishing pad 111 surface. As a result, according to the horizontal movement of the carrier head 101, the substrate W may be transferred to the polishing position or removed from the polishing position.

The carrier head 101 can move the substrate W in the vertical direction. The carrier head 101 may move up and down for chucking / dechucking the substrate W, or may move up and down to contact the substrate W with the polishing pad.

The membrane 105 is connected to the carrier head 101 and may form a pressure chamber for applying pressure to the substrate W. Depending on the pressure fluctuation of the pressure chamber formed by the membrane 105, the pressure acting on the substrate W may be adjusted. For example, the substrate W may be strongly pressed against the polishing pad 111 through the pressure rise of the pressure chamber while the substrate W is in contact with the polishing pad 111. Membrane 105 may include a bottom plate and flaps.

The bottom plate can form the bottom of the pressure chamber. A substrate W may be positioned on the outer surface of the bottom plate. In other words, the substrate W can face the outer surface of the bottom plate in the gripped state. The bottom plate may have a size and shape corresponding to the substrate W. For example, the bottom plate may be formed in a circular shape. The bottom plate may be formed of a flexible material that can be stretched to act on the substrate W with the pressure applied to the pressure chamber. For example, when the pressure in the pressure chamber increases, the bottom plate may expand in the direction of the substrate W to press the substrate W in the direction of the polishing pad 111. On the other hand, when the pressure in the pressure chamber decreases, the bottom plate may contract in the opposite direction of the substrate W to pull the substrate W in the direction of the membrane 105.

The flaps can form sidewalls of the pressure chamber. The flap may be formed extending from the bottom plate to face the direction of the carrier head 101. The flap may have a ring shape with the center of the bottom plate as the origin. In other words, the flap may have a circular shape while the membrane 105 is viewed from the top. A plurality of flaps may be formed. The plurality of flaps may be formed in a ring shape having different radii based on the center of the bottom plate. Since the flaps adjacent to each other partition one pressure chamber, a plurality of pressure chambers may be formed on the substrate carrier 10 through the plurality of flaps. In this case, the size of each of the plurality of pressure chambers can be determined through the spacing between adjacent flaps that partition each pressure chamber.

Different pressures may be applied to the plurality of pressure chambers. The pressure of the corresponding pressure chamber may be applied to a portion of the substrate W facing the bottom of each pressure chamber. Thus, through individual pressure adjustment of the plurality of pressure chambers, each part of the substrate W can be locally pressed.

The retainer ring 104 may be connected to the carrier head 101 to surround the gripped substrate W. The retainer ring 104 can prevent the substrate W from deviating from the gripped position. For example, the retainer ring 104 serves to support the side surface of the substrate W so that the substrate W does not deviate from the substrate carrier 10 due to an external force generated during the polishing process of the substrate W. Can be.

The drive ring 102 may be connected to the carrier head 101. An elastic pad ring 103 may be connected to the lower side of the drive ring 102. A retainer ring 104 may be connected to the lower side of the elastic pad ring 103. The elastic pad ring 103 may attenuate vibration transmitted from the retainer ring 104 to the carrier head 101 during the polishing process of the substrate. Details will be described later.

The polishing process of the substrate W is performed by the substrate W contacting the polishing pad 111. Since the retainer ring 104 supports the periphery of the substrate W, it is brought into contact with the polishing pad together with the substrate W during the polishing process of the substrate W. Accordingly, the process of polishing the substrate W through the polishing pad 111 involves polishing and wear of the retainer ring 104. The retainer ring 104 deforms the polishing pad 111 by pressing the polishing pad 111, and controls the amount of polishing in the edge region of the substrate W according to the deformation.

On the other hand, in the polishing process through the contact of the substrate W and the polishing pad 111, vibration caused by stick slip or the like is generated. Since the retainer ring 104 is connected to the carrier head 101, vibration generated in the polishing process is transmitted to the carrier head 101 through the retainer ring 104, and consequently, the carrier head 101 between the polishing processes Support stability may be impaired. Since the decrease in the support stability of the carrier head 101 causes the phenomenon that the substrate W deviates from the substrate carrier 10 during the polishing process, minimizing the vibration phenomenon occurring in the polishing process is the substrate W It can be directly related to the polishing performance.

The drive ring 102 and the elastic pad ring 103 according to an embodiment may attenuate vibrations transmitted from the retainer ring 104 to the carrier head 101. Therefore, the polishing efficiency of the substrate W can be improved by improving the support stability of the carrier head 101 and reducing the vibration of the entire substrate carrier 10.

3 is a perspective view of a drive ring and an elastic pad ring according to an embodiment. 4 is a plan view of a driving ring according to an embodiment. 5 is a side cross-sectional view of a drive ring and an elastic pad ring according to an embodiment.

3 to 5, the driving ring 102 according to an embodiment may include a support portion 1021, a central portion 1023, and a connection portion 1022. The drive ring 102 may be integrally formed. Therefore, the productivity of the drive ring 102 can be improved.

The retainer ring 104 may be connected to the support portion 1021. The elastic pad ring 103 may be connected to the support portion 1021 on the lower side. The support portion 1021 may have a ring shape corresponding to the size and shape of the retainer ring 104 to facilitate connection of the retainer ring 104.

The central portion 1023 may be connected to the center of the carrier head 101. The central portion 1023 is connected to the rotation axis of the carrier head 101 so that it can rotate according to the rotation of the carrier head 101. The central portion 1023 may be connected to the carrier head 101 through a bearing.

The connection portion 1022 may connect the central portion 1023 and the support portion 1021. The connection portion 1022 may be formed in a structure capable of absorbing an impact from the support portion 1021 toward the central portion 1023. In other words, the connection portion 1022 may be formed in a structure for alleviating the impact in the horizontal direction.

The connection portion 1022 may include a ring member 10221 and a connection bar 10222.

The ring member 10221 may be connected to the central portion 1023. The ring member 10221 may include a hollow into which the central portion 1023 is inserted. The hollow formed in the ring member 10221 may be formed in a size corresponding to the diameter of the central portion 1023.

The connection bar 10222 may connect the ring member 10201 and the support portion 1021. One side of the connecting bar 10222 may be connected to the ring member 10201 and the other side to the support portion 1021. For example, the connecting bar 10222 may extend radially from the ring member 10221 toward the support portion 1021. A plurality of connection bars 10222 may be provided. The plurality of connection bars 10222 may be positioned at equal intervals.

The elastic pad ring 103 may attenuate vibrations transmitted from the retainer ring 104 to the carrier head 101 during the polishing process of the substrate. The elastic pad ring 103 may be disposed between the drive ring 102 and the retainer ring 104. In other words, the elastic pad ring 103 may be connected to the lower side of the drive ring 102, and the retainer ring 104 may be connected to the lower side of the elastic pad ring 103. The elastic pad ring 103 may include a compressible elastic material to absorb vibration. For example, the elastic pad ring 103 may include EPDM, fluorine rubber, nitrile rubber, urethane rubber, silicone rubber, or synthetic rubber with improved damping ability. The elastic pad ring 103 may include a material having a lower modulus of elasticity than the drive ring 102. The elastic pad ring 103 may be fastened to the support portion 1021. The fastening portions of the elastic pad ring 103 and the support portion 1021 may be formed in shapes corresponding to each other. For example, the elastic pad ring 103 may be formed in a ring shape. Meanwhile, the elastic pad ring 103 may be formed in a disc shape. The elastic pad ring 103 may be connected to the lower surface of the support portion 1021. For example, the elastic pad ring 103 may be adhered to the lower surface of the support portion 1021. Alternatively, the elastic pad ring 103 may be fastened to the support portion 1021 with a bolt or the like. According to such a structure, the elastic pad ring 103 may be compressed or elastically deformed by vibration generated in the polishing process, and thus absorb vibration. Therefore, the vibration generated in the retaining ring 104 in the polishing process is absorbed by the elastic pad ring 103 and may not be transmitted to the carrier head 101. In particular, the elastic pad ring 103 may be compressed between the retainer ring 104 and the drive ring 102 so that vibration in the vertical direction is absorbed. According to such a configuration, while simplifying the design to increase the productivity of the drive ring 102, it is possible to minimize the shock and vibration transmitted to the drive ring 102 by the elastic pad ring 103.

6 is a plan view of a driving ring according to an embodiment. 7 is a side cross-sectional view of a drive ring and an elastic pad ring according to an embodiment.

6 and 7, the driving ring 202 according to an embodiment may include a support portion 2021, a central portion 2023, and a connection portion 2022. The drive ring 202 may be integrally formed.

The connection portion 2022 may connect the central portion 2023 and the support portion 2021. The connection portion 2022 may be formed in a structure capable of absorbing an impact from the support portion 2021 toward the central portion 2023. In other words, the connecting portion 2022 may be formed in a structure for alleviating the impact in the horizontal direction.

The connection portion 2022 may include a ring member 20201 and a connection bar 20222.

The ring member 20201 may be connected to the central portion 2023. The ring member 20201 may include a hollow into which the central portion 2023 is inserted. The hollow formed in the ring member 20201 may be formed to have a size corresponding to the diameter of the central portion 2023.

The connection bar 20222 may connect the ring member 20201 and the support portion 2021. One side of the connecting bar 20222 may be connected to the ring member 20201 and the other side may be connected to the support portion 2021. The connecting bar 20222 extends radially from the ring member 2021 toward the support portion 2021, and may include a curved curved portion. In other words, the connecting bar 20222 may be formed in a curved shape. For example, the connection bar 20222 may include one curved portion, as shown in FIG. 6. The connecting bar 20222 may be formed as a curve including two or more curved portions. A plurality of connection bars 20222 may be provided. The plurality of connection bars 20222 may be positioned at equal intervals. The plurality of connecting bars 20222 may be arranged such that the curved portions face the same direction. According to such a structure, the connection portion 2022 may be compressed or deformed by a horizontal impact. Therefore, the connection portion 2022 can mitigate the horizontal impact transmitted to the drive ring 202. That is, the horizontal impact transmitted to the drive ring 202 in the polishing process is absorbed by the connection portion 2022 being compressed or deformed in the horizontal direction, and may not be transmitted to the carrier head.

The elastic pad ring 203 may attenuate vibrations transmitted from the retainer ring to the carrier head 201 during polishing of the substrate. The elastic pad ring 203 may be disposed between the drive ring 202 and the retainer ring. The elastic pad ring 203 may be connected to the lower side of the drive ring 202. The elastic pad ring 203 may wrap at least a portion of the outer surface of the support portion 2021. The elastic pad ring 203 may include an extension portion 203a surrounding at least a portion of the lower surface and the outer surface of the support portion 2021. The extension portion 203a may be formed to extend such that the outer peripheral portion of the elastic pad ring 203 protrudes upward. The extension 203a may wrap the outer surface of the drive ring. The extension 203a may extend to a height corresponding to the top surface of the drive ring 202. According to this structure, the elastic pad ring 203 can absorb vibration in the horizontal direction by elastically deforming the extension portion 203a in the horizontal direction. In other words, due to the horizontal vibration occurring in the retaining in the polishing process, the extension portion 203a may be elastically deformed in the horizontal direction, thereby preventing transmission of the vertical vibration as well as the horizontal vibration to the carrier head. can do. Meanwhile, the contact portions of the elastic pad ring 203 and the drive ring 202 may be adhered to each other. Alternatively, the elastic pad ring 203 may be fastened to the support portion 2021 with a bolt or the like. According to such a structure, the bonding stability of the elastic pad ring 203 and the drive ring 202 may be improved.

8 is a plan view of a driving ring according to an embodiment. 9 is a side cross-sectional view of a drive ring and an elastic pad ring according to an embodiment.

8 and 9, the driving ring 302 according to an embodiment may include a support portion 3021, a central portion 3023, and a connection portion 3022. The drive ring 302 may be integrally formed.

The connection portion 3022 may connect the central portion 3023 and the support portion 3021. The connection portion 3022 may be formed in a structure capable of absorbing an impact from the support portion 3021 toward the center portion 3023. In other words, the connection portion 3022 may be formed in a structure for alleviating the impact in the horizontal direction.

The connection portion 3022 may include a ring member 30221, a connection bar 30222, and an intermediate ring member 30223.

The ring member 30201 may be connected to the center 3023. The ring member 30201 may include a hollow into which the central portion 3023 is inserted. The hollow formed in the ring member 30201 may be formed in a size corresponding to the diameter of the central portion 3023.

The connection bar 30222 may connect the ring member 30201 and the support portion 3021. One side of the connecting bar 30222 may be connected to the ring member 30201 and the other side to the support portion 3021. The connection bar 30222 may extend radially from the ring member 30221 toward the support portion 3021. The connection bar 30222 may be formed in a straight or curved shape. A plurality of connection bars 30222 may be provided. The plurality of connection bars 30202 may be positioned at equal intervals.

The intermediate ring member 30223 may interconnect a plurality of connecting bars 30222. For example, the intermediate ring member 30223 may interconnect the central portions of the plurality of connecting bars 30222. The intermediate ring member 30223 may be positioned between the ring member 30221 and the support 3021. The intermediate ring member 30223 may be formed in a ring shape. The radius of the intermediate ring member 30223 may be formed smaller than the radius of the support portion 3021 and larger than the radius of the ring member 30201. A plurality of intermediate ring members 30231 may be provided. The plurality of intermediate ring members 30223 may be arranged to interconnect different positions of the plurality of connection bars 30222. According to such a structure, the drive ring 302 can absorb a horizontal impact, but can secure high durability and stability.

The elastic pad ring 303 may attenuate vibration transmitted from the retainer ring to the carrier head 101 during the polishing process of the substrate. The elastic pad ring 303 may be disposed between the drive ring 302 and the retainer ring. The elastic pad ring 303 may be connected to the lower side of the drive ring 302. The elastic pad ring 303 may be formed in a structure that can be combined with the drive ring 302. The elastic pad ring 303 may include a projection 303b protruding toward the support portion 3031. The protrusion 303b may extend along the outer surface of the elastic pad ring 303. Alternatively, the protrusion 303b may extend from the inner surface or the central portion of the elastic pad ring 303. The support portion 3021 may include a recess portion 3021a that is recessed inward. The protruding portion 303b and the recessed portion 3021a may be coupled to each other. The recessed portion 3021a may be formed at a size and position corresponding to the protrusion 303b. Since the protrusion 303b is coupled to the depression 3021a, the elastic pad ring 303 and the drive ring 302 may be coupled to each other. Since the protrusion 303b is elastically deformed in the vertical or horizontal direction, the elastic pad ring 303 can absorb vibration in the vertical or horizontal direction. In other words, due to the vertical or horizontal vibration occurring in the retaining in the polishing process, the protrusion 303a may be elastically deformed in the vertical or horizontal direction, thereby preventing the vertical or horizontal vibration from being transmitted to the carrier head. Can be. Meanwhile, the contact portions of the elastic pad ring 203 and the drive ring 202 may be adhered to each other. Alternatively, the elastic pad ring 203 may be fastened to the support portion 2021 with a bolt or the like. According to such a structure, the bonding stability of the elastic pad ring 203 and the drive ring 202 may be improved.

Meanwhile, the driving ring and the elastic pad ring described through the above embodiments may be variously combined. That is, the above embodiments do not limit the combination of the shape of the drive ring and the elastic pad ring and the connection relationship.

Although the embodiments have been described by the limited drawings as described above, a person skilled in the art can make various modifications and variations from the above description. For example, the described techniques may be performed in a different order than the described method, and / or components such as the structure, device, etc. described may be combined or combined in a different form from the described method, or may be applied to other components or equivalents. Even if replaced or substituted by, appropriate results can be achieved.

1: Substrate polishing device
11: polishing unit
10: substrate carrier
101: carrier head
102: drive ring
103: elastic pad ring
104: retainer
105: membrane
W: Substrate

Claims (16)

Carrier head;
A drive ring connected to the carrier head;
An elastic pad ring connected to a lower side of the drive ring and including an elastic material; And
And a retainer ring connected to a lower side of the elastic pad ring and surrounding the outside of the substrate gripped by the carrier head. According to claim 1,
In the polishing process of the substrate, the elastic pad ring attenuates vibration transmitted from the retainer ring to the carrier head. According to claim 1,
The drive ring,
A central portion connected to the center of the carrier head;
A support portion to which the elastic pad ring is connected to the lower side; And
And a connecting portion connecting the central portion and the supporting portion. According to claim 3,
The elastic pad ring surrounds at least a portion of the outer surface of the support, the substrate carrier. According to claim 3,
The elastic pad ring includes a protrusion protruding toward the support portion,
The support portion includes a depression that is recessed inward,
The protruding portion and the recessed portion can be coupled to each other, the substrate carrier. The method of claim 5,
The protrusion extends along an outer surface of the elastic pad ring or extends from an inner surface or a central portion of the elastic pad ring. The method according to any one of claims 3 to 6,
The elastic pad ring can be fastened to the support, and the fastening portion of the elastic pad ring and the support is formed in a shape corresponding to each other. According to claim 3,
The connecting portion,
A ring member including a hollow into which the center portion is inserted; And
A substrate carrier comprising a plurality of connecting bars extending radially from the ring member and connected to the support. The method of claim 8,
The connection bar includes a curved curved portion, the substrate carrier. The method of claim 8,
The connecting portion,
A substrate carrier positioned between the ring member and the support, and further comprising an intermediate ring member interconnecting the plurality of connection bars. According to claim 1,
The drive ring is formed integrally, a substrate carrier. A polishing unit having a polishing pad; And
The carrier head pressing the substrate against the polishing pad, the drive ring connected to the lower side of the carrier head, the retainer ring supporting the outside of the substrate held by the carrier head, and the vibration generated in the retainer ring so as to be absorbed A substrate carrier including an elastic pad ring connecting the retainer ring and the drive ring;
A substrate polishing apparatus comprising a. The method of claim 12,
The elastic pad ring comprises a compressible elastic material, the substrate polishing apparatus. The method of claim 12,
The elastic pad ring absorbs vertical vibrations transmitted from the retainer ring to the carrier head during the polishing process of the substrate. The method of claim 12,
The elastic pad ring absorbs horizontal vibrations transmitted from the retainer ring to the carrier head during the polishing process of the substrate. The method of claim 12,
The elastic pad ring absorbs both vertical and horizontal vibrations transmitted from the retainer ring to the carrier head during polishing of the substrate.

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