KR20200051324A - Sealing unit and apparatus for packaging a semiconductor device having the same - Google Patents

Abstract

The present invention provides a sealing unit capable of keeping the temperature of a blade uniform throughout. The sealing unit of a semiconductor device packaging apparatus seals multiple pockets by heat-sealing a cover tape on a carrier tape having the pockets. The sealing unit can include: a pair of blades having a disk shape and individually pressing both edges of the cover tape in the width direction while rotating; and heaters which are individually disposed inside or adjacent to the blades and configured to heat the blades such that the blades thermally compress the cover tape to the carrier tape.

Description

Sealing unit and apparatus for packaging a semiconductor device having the same}

The present invention relates to a sealing unit and a semiconductor device packaging device having the same, and a sealing unit for sealing a carrier tape and a cover tape and a semiconductor device packaging device having the same.

When the semiconductor device is inspected, the semiconductor device may be packaged using a carrier tape and a cover tape.

Specifically, after receiving the semiconductor element in a pocket formed on the carrier tape, the cover tape is heat-pressed to the carrier tape with a sealing unit to seal the pocket.

According to the prior art, the sealing unit includes a square-shaped blade equipped with a heater. The blade heat-presses the cover tape to the carrier tape while moving up and down along the vertical direction.

When the blade rises after heat-pressing the cover tape, vibration occurs in the cover tape due to the adhesive force between the blade and the cover tape. Due to the vibration, alignment of the cover tape and the carrier tape may be misaligned. Therefore, the cover tape may not be accurately thermocompressed to the carrier tape, or the pocket may not be sealed.

In addition, when the blade heat-presses the cover tape, an overlapping portion occurs. Therefore, the quality of the heat-pressing of the cover tape may be deteriorated, and the time required for heat-pressing the cover tape may be increased.

And, since the blade has a rectangular shape, it is difficult to maintain the temperature of the blade as a whole.

The present invention provides a sealing unit capable of thermally compressing a cover tape to a carrier tape without overlapping, preventing vibration of the cover tape during the thermocompression, and maintaining the blade temperature as a whole.

The present invention provides a semiconductor device packaging device having the sealing unit.

In a sealing unit for sealing the pockets by heat-pressing a cover tape on a carrier tape having a plurality of pockets according to the present invention, the sealing unit has a disc shape and rotates, and both edges in the width direction of the cover tape It may include a pair of blades for pressing each of the blades and heaters for heating the blades so that the blades are respectively disposed inside or adjacent to the blades, and the blades heat-press the cover tape to the carrier tape. .

According to one embodiment of the present invention, the blades are provided to have a width wider than the edge width of the carrier tape, and the heaters are provided with a plurality of heaters spaced apart from each other along the width direction of the carrier tape When the width of the carrier tape is changed, power may be selectively supplied to a heater at a position corresponding to an edge of the carrier tape among the heaters.

In the semiconductor device packaging apparatus according to the present invention, the carrier tape supply reel for supplying a carrier tape having pockets for storing semiconductor devices, and the carrier tape supplied from the carrier tape supply reel, each entrance of the pockets is upward. Sprockets conveying in one direction to face, a cover tape supply reel for supplying a cover tape to cover the pockets in which the semiconductor elements are housed, and the cover tape supplied from the cover tape supply reel on the carrier tape And a sealing unit that heat-presses to seal the pockets of the carrier tape and a carrier tape winding reel to wind the carrier tape sealed by the sealing unit, wherein the sealing unit has a disc shape and rotates the cover Both sides of the tape in the width direction And a pair of blades for pressing each of the blades, and heaters for heating the blades so that the blades are respectively heat-pressed to the carrier tape by placing the blades inside or adjacent to the blades. .

According to one embodiment of the present invention, the rotational speed of the blades is the rotational speed of the sprockets to prevent the transfer of the cover tape from being interrupted or delayed while the blades are thermally compressing the cover tape to the carrier tape. Can be the same as

According to one embodiment of the present invention, the blades are provided to have a width wider than the edge width of the carrier tape, and the heaters are provided with a plurality of heaters spaced apart from each other along the width direction of the carrier tape When the width of the carrier tape is changed, power may be selectively supplied to a heater at a position corresponding to an edge of the carrier tape among the heaters.

According to one embodiment of the present invention, the semiconductor device packaging device has a disk shape, and is disposed to be rotatable below the respective blades, and the heated blades heat-press the cover tape and the carrier tape. When doing so may further include support units for supporting the lower surfaces of both edges in the width direction of the carrier tape.

According to one embodiment of the present invention, the semiconductor device packaging apparatus, the sprockets of the sprockets are respectively provided at a portion in contact with the carrier tape, and further includes a cleaning unit for removing foreign matter generated at the contact portion can do.

According to one embodiment of the present invention, the cleaning glass is formed along one direction on the lower surface of the cleaning unit, and extends to the receiving groove through the cleaning unit and the receiving groove for receiving the teeth, It includes a supply line for supplying gas to the receiving groove to separate the foreign matter from the contact area and an exhaust line extending through the cleaning unit to the receiving groove, and suctioning the separated foreign matter and discharging it to the outside. Can be.

In the sealing unit according to the present invention, since the blades of the disk shape rotate in line contact with the edges of the cover tape, the blades can heat-press the edges of the cover tape at a constant pressure, and the cover The tape can be thermocompressed without duplication. Therefore, it is possible to improve the thermal compression quality of the cover tape.

In the semiconductor device packaging apparatus according to the present invention, since the blades can rotate, the rotation speed of the blades can be adjusted to be the same as the rotation speed of the sprocket. Therefore, it is possible to prevent the blades from being stopped or delayed from being transferred to the cover tape to heat-press the cover tape.

In addition, since the blades heat-press the cover tape while the cover tape and the carrier tape are pressed, it is possible to minimize the carrier tape from shaking up and down. Therefore, it is possible to prevent the cover tape from being thermocompressed due to defects due to the shaking of the carrier tape.

In addition, the cover tape may be first matched to the carrier tape while the blades are in line contact with the carrier tape. Therefore, it is easy to secure the field of view of the operator, so the cover tape can be easily matched to the carrier tape.

On the other hand, the cleaning unit can quickly remove the foreign matter generated due to the contact of the carrier tape and the teeth of the sprocket. Therefore, it is possible to prevent the foreign material from contaminating the pockets of the carrier tape.

1 is a side view for explaining a semiconductor device packaging device according to an embodiment of the present invention.
2 is a cross-sectional view illustrating a sealing unit and a supporting unit according to an embodiment of the present invention shown in FIG. 1.
3 is a cross-sectional view for describing another example of the sealing unit shown in FIG. 2.
4 is a cross-sectional view for describing the cleaning unit illustrated in FIG. 1.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. The present invention can be applied to various changes and may have various forms, and specific embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to a specific disclosure form, and it should be understood that it includes all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing each drawing, similar reference numerals are used for similar components. In the accompanying drawings, the dimensions of the structures are shown to be enlarged than the actual for clarity of the present invention.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from other components. For example, the first component may be referred to as a second component without departing from the scope of the present invention, and similarly, the second component may be referred to as a first component.

Terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, terms such as “include” or “have” are intended to indicate the presence of features, numbers, steps, actions, elements, parts or combinations thereof described in the specification, but one or more other features. It should be understood that the existence or addition possibilities of fields or numbers, steps, actions, components, parts or combinations thereof are not excluded in advance.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person skilled in the art to which the present invention pertains. Terms, such as those defined in a commonly used dictionary, should be interpreted as having meanings consistent with meanings in the context of related technologies, and should not be interpreted as ideal or excessively formal meanings unless explicitly defined in the present application. Does not.

1 is a side view for explaining a semiconductor device packaging device according to an embodiment of the present invention, Figure 2 is a cross-sectional view for explaining the sealing unit and the support unit according to an embodiment of the present invention shown in Figure 1, 3 is a cross-sectional view for explaining another example of the sealing unit shown in FIG. 2, and FIG. 4 is a cross-sectional view for explaining the cleaning unit shown in FIG. 1.

1 to 4, the semiconductor device packaging apparatus 100 receives the normal semiconductor device 30 from the picker 20 and wraps it with a carrier tape 10 and a cover tape 14.

The semiconductor device packaging apparatus 100 includes a carrier tape supply reel 110, a sprocket 120, a cover tape supply reel 130, a sealing unit 140, a support unit 150, a carrier tape winding reel 160, It may include a cleaning unit 170.

The carrier tape supply reel 110 supplies the carrier tape 10. The carrier tape 10 is formed with pockets 12 for accommodating the semiconductor element 30. The pockets 12 may be arranged in a line along the length direction of the carrier tape 10. In addition, the carrier tape 10 may have transfer holes (not shown) arranged in a line along the longitudinal direction at one edge.

The carrier tape supply reel 110 may be released as it rotates while the carrier tape 10 is wound and supplied to the sprockets 120. At this time, the carrier tape supply reel 110 may rotate by the force that the sprockets 120 transfer the carrier tape 10.

The sprockets 120 are arranged along the length direction of the carrier tape 10. The sprockets 120 transfer the carrier tape 10 supplied from the carrier tape supply reel 110 in one direction with each inlet of the pockets 12 facing upward.

The sprockets 120 are rotated by separate rotating motors and have a number of teeth along the perimeter. The sprockets 120 transport the carrier tape 10 while rotating with the teeth fitted in the transport holes of the carrier tape 10.

In order for the sprockets 120 to stably transport the carrier tape 10, the sprockets 120 are provided between the carrier tape supply reel 110 and the sealing unit 140 and the carrier tape winding reel 160. Each can be arranged.

On the other hand, although not shown, the carrier tape 10 conveyed by the sprockets 120 may be guided by a pair of guide rails. Therefore, the carrier tape 10 can be transported stably.

 When the width of the carrier tape 10 is changed, the gap between the guide rails can be adjusted by a separate gap adjusting mechanism. The gap adjusting mechanism may include a rotating motor and a ball screw for converting rotational motion of the rotating motor into linear motion, or may include a linear motor or a cylinder.

While the carrier tape 10 is being transported by the sprockets 120, the second inspection pickers 20 receive the normal semiconductor elements 30 into the pockets 12 of the carrier tape 10. can do.

The cover tape supply reel 130 is loosened and supplied as the cover tape 14 is rotated in a wound state. The cover tape supply reel 130 may be rotated by a separate driving mechanism such as a motor. The cover tape 14 supplied by the cover tape supply reel 130 covers the pocket 12 of the carrier tape 10 that houses the semiconductor element 30.

The sealing unit 140 adheres the cover tape 14 supplied from the cover tape supply reel 130 on the carrier tape 10 to seal the pockets 14 of the carrier tape 10. .

The sealing unit 140 may include blades 142 and heaters 144.

The blades 142 are disposed on both side edges of the cover tape 14 in the width direction. Each of the blades 140 has a disc shape.

Each of the blades 142 may be moved up and down in the vertical direction by the elevation driving unit, and may be rotated by the rotation driving unit. As the blade 142 moves up and down, it may contact the edge of the cover tape 14 or may be spaced apart from the edge. In addition, the blade 142 may rotate in contact with the edge of the cover tape 14.

The heaters 144 are provided inside each of the blades 142 or on one side of the blades 142. The heaters 144 may be fixed to the blades 142, or may be spaced apart from the blades 142. The heaters 144 heat the respective blades 142.

The cover tape 14 is thermally compressed to the carrier tape 10 by rotating the blades 142 in contact with the edge of the cover tape 14 while being heated by the respective heaters 144. Can be.

When the width of the carrier tape 10 is changed, the spacing between the sealing units 140 may be varied by a separate adjustment mechanism to match the width of the carrier tape 10.

Meanwhile, as illustrated in FIG. 30, the sealing units 140 are arranged to be spaced apart from each other along the width direction of the carrier tape 10 inside the blade 142 and the blade 142 having a cylindrical shape. It may include a heater 144. At this time, the heaters 144 may be selectively provided with power.

When the width of the carrier tape 10 is changed, the power is supplied to the heater 144 at a position corresponding to the edge of the carrier tape 10. When the portion corresponding to the edge of the carrier tape 10 in the blade 142 is heated by the heater 144, the cover tape 14 is opened to the carrier tape 10 with the blade 142. Can be compressed.

Even if the width of the carrier tape 10 is changed, there is no need to adjust the spacing between the sealing units 140. Since a separate adjustment mechanism for adjusting the spacing between the sealing units 140 is unnecessary, the configuration of the sealing units 140 can be simplified.

Since the blades 142 in the disk shape rotate in line contact with the edges of the cover tape 14, the blades 142 can heat-press the edges of the cover tape 14 at a constant pressure. , The cover tape 14 can be thermally compressed without overlapping. Therefore, it is possible to improve the thermocompression quality of the cover tape 14.

In addition, since the blades 142 can rotate, the rotational speed of the blades 142 can be adjusted to be the same as the rotational speed of the sprocket 120. Therefore, it is possible to prevent the blades 142 from stopping or delaying the transfer of the cover tape 14 to heat-press the cover tape 14.

Since the blades 142 heat-press the cover tape 14 while the cover tape 14 and the carrier tape 10 are pressed, the carrier tape 10 is minimized to be shaken up and down. Can be. Accordingly, it is possible to prevent the cover tape 14 from being thermocompressed due to a defect due to the shaking of the carrier tape 10.

In addition, the cover tape 14 may be first matched to the carrier tape 14 while the blades 142 are in line contact with the carrier tape 10. Therefore, it is easy to secure the field of view of the operator, so the cover tape 14 can be easily matched to the carrier tape 14.

The support units 150 are respectively disposed on both side edges in the width direction of the carrier tape 10. At this time, each of the support units 150 may be positioned vertically below each of the blades 142. Each of the support units 150 has a disc shape.

Each of the support units 150 may be moved up and down along the vertical direction by the lifting driving unit and rotated by the rotating driving unit. As the support units 150 are elevated, they may contact the edge of the lower surface of the carrier tape 10 or may be spaced apart from the edge. In addition, the support units 150 may rotate in contact with an edge of the lower surface of the carrier tape 10.

When the blades 142 heat-press the cover tape 14 in a state where the cover tape 14 and the carrier tape 10 are pressed, the support units 150 are provided with the carrier tape 10 ) Supports the edge of the lower surface. Therefore, the cover tape 14 can be stably thermocompressed to the carrier tape 10.

When the width of the carrier tape 10 is changed, the spacing between the support members 300 may be varied by a separate adjustment mechanism to match the width of the change of the carrier tape 10.

Since the support units 150 in the disk shape rotate in line contact with the carrier tape 10, friction between the support units 150 and the carrier tape 10 can be minimized.

In addition, the rotation speed of the support units 150 can be adjusted to be the same as the rotation speed of the blades 142 and the rotation speed of the sprocket 120. Therefore, it is possible to prevent the transport of the carrier tape 10 from being stopped or delayed by the support units 150.

Meanwhile, the support units 150 may have a flat plate shape rather than the original plate shape.

The carrier tape winding reel 160 winds the carrier tape 10 sealed by the sealing unit 140. The sealed carrier tape 10 may be wound while rotating by a separate driving unit of the carrier tape winding reel 160.

The cleaning units 170 are respectively provided at portions where the teeth of the sprockets 120 contact the carrier tape 10. Each of the cleaning units 170 may have a substantially cylindrical or hexahedral shape.

The cleaning unit 170 may include a receiving groove 172, a supply line 174 and a discharge line 176.

The receiving groove 172 is formed along one direction on the lower surface of the cleaning unit 170. The receiving groove 172 accommodates the teeth of the sprocket 120.

The supply line 174 passes through the cleaning unit 170 and extends to the receiving groove 172. A gas such as air or an inert gas may be supplied to the receiving groove 172 through the supply line 174.

Even if a foreign material is generated due to contact between the teeth and the carrier tape 10, the foreign material may be separated from the teeth and the carrier tape 10 by supplying the gas.

The discharge line 176 penetrates through the cleaning unit 170 and extends to the receiving groove 172. The foreign matter separated from the teeth and the carrier tape 10 through the discharge line 176 may be discharged from the receiving groove 172 to the outside.

The cleaning unit 170 may quickly remove the foreign material generated due to the contact of the teeth and the carrier tape 10 of the sprocket 120. Therefore, it is possible to prevent the foreign material from contaminating the pockets 14 of the carrier tape 10.

The semiconductor device packaging device 100 may further include a first vision 180 and a second vision 190.

The first vision 180 is disposed between the position where the semiconductor elements 30 are accommodated in the pockets 12 of the carrier tape 10 and the cover tape winding reel 130. The first vision 180 inspects the state of the carrier tape 10 that houses the semiconductor element 30.

Specifically, the first vision 180 photographs an upper portion of the carrier tape 10 housing the semiconductor element 30, and based on the captured image, the semiconductor element stored in the pocket 12 It is possible to check whether the 30 is turned upside down, whether the empty pocket 12 is inclined, and whether the pocket 12 is inclined.

The second vision 190 is disposed between the sealing unit 140 and the carrier tape winding reel 160 and is located above the sealed carrier tape 10. The second vision 190 inspects the state of the carrier tape 10 sealed by the sealing unit 140.

Specifically, the second vision 190 photographs the sealed carrier tape 10 and may check the sealing state of the carrier tape 10 based on the captured image.

The carrier tape winding reel 160, on which the sealed carrier tape 10 is wound, may be transported by the ceiling transporting device in a storage container such as a carrier.

As described above, the sealing unit and the semiconductor device packaging device having the same according to the present invention can heat-press the cover tape to the carrier tape to quickly and accurately pack the semiconductor device. Therefore, it is possible to improve the efficiency and reliability of the semiconductor device packaging process.

Although described above with reference to the preferred embodiments of the present invention, those skilled in the art may variously modify and change the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. You will understand that you can.

100: semiconductor device packaging device 110: carrier tape supply reel
120: sprocket 130: cover tape supply reel
140: sealing unit 150: support unit
160: carrier tape reel 170: cleaning unit
180: first vision 190: second vision
10: carrier tape 12: pocket
14: cover tape 20: picker
30: semiconductor device

Claims (8)

A sealing unit for sealing the pockets by heat-pressing a cover tape on a carrier tape having a plurality of pockets,
The sealing unit,
A pair of blades having a disc shape and pressing each of both edges in the width direction of the cover tape while rotating; And
Sealing unit, characterized in that it is arranged to be inside or adjacent to the blades of the blades, and the blades heat the blades to heat-press the cover tape to the carrier tape. According to claim 1, The blades are provided to have a width wider than the edge width of the carrier tape,
The heaters are provided with a plurality of spaced apart from each other along the width direction of the carrier tape in each of the blades,
When the width of the carrier tape is changed, the sealing unit, characterized in that to selectively supply power to the heater at a position corresponding to the edge of the carrier tape among the heaters. A carrier tape supply reel for supplying a carrier tape with pockets for housing semiconductor elements;
Sprockets for transferring the carrier tape supplied from the carrier tape supply reel in one direction such that each inlet of the pockets faces upward;
A cover tape supply reel supplying a cover tape to cover the pockets in which the semiconductor elements are housed;
A sealing unit that heat-presses the cover tape supplied from the cover tape supply reel onto the carrier tape to seal the pockets of the carrier tape; And
A carrier tape winding reel for winding the carrier tape sealed by the sealing unit,
The sealing unit,
A pair of blades having a disc shape and pressing each of both edges in the width direction of the cover tape while rotating; And
A semiconductor device packaging device, each of which is disposed inside or adjacent to the blades, and includes heaters for heating the blades so that the blades thermally compress the cover tape to the carrier tape. The rotational speed of the blades is the same as the rotational speed of the sprockets according to claim 3, to prevent the transfer of the cover tape from being interrupted or delayed while the blades are thermally compressing the cover tape to the carrier tape. Semiconductor device packaging device. According to claim 3, The blades are provided to have a wider width than the edge width of the carrier tape,
The heaters are provided with a plurality of spaced apart from each other along the width direction of the carrier tape in each of the blades,
When the width of the carrier tape is changed, a semiconductor device packaging device, characterized in that to selectively supply power to a heater corresponding to the edge of the carrier tape among the heaters. According to claim 3, which has a disc shape, is arranged to be rotatable vertically below each of the blades, and the heated blades of both edges in the width direction of the carrier tape when the cover tape and the carrier tape are thermocompressed. A semiconductor device packaging device further comprising support units for supporting the lower surface. 4. The semiconductor device packaging device according to claim 3, wherein the sprockets of the sprockets are respectively provided at a portion in contact with the carrier tape, and further comprising a cleaning unit for removing foreign substances generated at the contact portion. According to claim 7, The cleaning glass,
A receiving groove formed along a direction on a lower surface of the cleaning unit and accommodating the teeth;
A supply line extending through the cleaning unit to the receiving groove, and supplying gas to the receiving groove to separate the foreign matter from the contact portion; And
And a discharge line that penetrates through the cleaning unit and extends to the receiving groove, and discharges the separated foreign matter and discharges it to the outside.

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