KR20200049472A - Method of manufacturing flexible organic electro luminescence dispaly - Google Patents

Abstract

Provided is a manufacturing method of a flexible organic EL display which is difficult to deteriorate the manufacturing efficiency. The manufacturing method of the flexible organic EL display is related to in manufacturing a multi-layered stacked substrate (10) including a first stacked substrate (11) which a first glass layer (11A) and a first resin layer (11B) are stacked, and a second stacked substrate (12) which a second glass layer (12A) and a second region layer (12B) are stacked, wherein the first resin layer (11B) and the second resin layer (12B) are stacked to be opposite. The manufacturing method comprises a post-process which is a process after a process of stacking the first stacked substrate (11) and the second stacked substrate (12). The post-process includes a discharge unit forming process of forming a discharge unit for discharging foreign matters generated due to cutting at least one of the first resin layer (11B) and the second resin layer (12B), in at least one side of the first glass layer (11A) and the second glass layer (12A).

Description

Manufacturing method of flexible organic EL display {METHOD OF MANUFACTURING FLEXIBLE ORGANIC ELECTRO LUMINESCENCE DISPALY}

The present invention relates to a method for manufacturing a flexible organic EL display.

An organic electroluminescence (EL) display includes a light emitting device in which a light emitting layer, an electrode, and a substrate are stacked. In a flexible organic EL display, a flexible substrate is used for the substrate. In the manufacturing process of a flexible organic EL display, a resin layer is formed on the glass layer, and a light emitting layer or the like is formed on the resin layer (for example, Patent Document 1).

Japanese Patent Publication No. WO2011 / 030716

A novel structured light emitting device has been proposed. This light emitting device has a first resin layer and a second resin layer formed to face each other. A light emitting layer or the like is formed between the first resin layer and the second resin layer. Since the structure is different from that of the conventional light emitting device, there is a concern that the efficiency of manufacturing a light emitting device having a new structure may decrease.

It is an object of the present invention to provide a method for manufacturing a flexible organic EL display in which manufacturing efficiency is difficult to decrease.

The method for manufacturing a flexible organic EL display according to the present invention includes a plurality of laminated substrates in which a glass layer and a resin layer are stacked, and the plurality of laminated substrates is a first laminate in which a first glass layer and a first resin layer are stacked. A flexible organic EL display comprising a substrate and a second laminated substrate on which a second glass layer and a second resin layer are stacked, wherein the first resin layer and the second resin layer are stacked so as to face each other. As a manufacturing method of the, including the post-processing process which is a process after the process of laminating | stacking the said several laminated board | substrate, The said rear-end process is a process of the said resin layer in at least one said glass layer of the said several laminated board | substrate. It includes a discharge portion forming process for forming a discharge portion for discharging foreign matter generated with the cutting.

According to this manufacturing method, for example, gas generated when the resin layer is cut with a laser is discharged to the outside of the multi-layer laminated substrate through the discharge portion of the glass layer, and the quality of the resin layer may deteriorate due to the influence of the gas. Is reduced.

As an example of the manufacturing method of the flexible organic EL display, in the discharge portion forming step, the discharge portion is formed by cutting the glass layer or by scribing the glass layer.

In the case of cutting the glass layer, for example, in the case of cutting the resin layer with a laser, gas generated by irradiating the resin layer with a laser is discharged from the cut portion of the glass layer to the outside of the multilayer laminated substrate. When the glass layer is scribed, for example, when the resin layer is cut with a laser, after the glass layer is braked by a gas generated by irradiating the resin layer with a laser, the glass layer is cut from the cut portion of the multi-layer laminated substrate. Gas is discharged to the outside. It is less likely that the gas will affect the quality of the resin layer.

As an example of a method of manufacturing the flexible organic EL display, in the discharge portion forming step, the glass layer is cut by laser or dicing to form the discharge portion.

In this manufacturing method, the discharge portion is formed in the glass layer by a cutting method commonly used for cutting the glass layer. For example, existing devices may be useful.

As an example of a method of manufacturing the flexible organic EL display, in the discharge portion forming step, the glass layer is scribed by a scribing wheel to form the discharge portion.

In this manufacturing method, the discharge portion is formed as follows, for example. In the first example, the glass layer is scribed, and the discharge portion is formed by breaking the glass layer. In the second example, the glass layer is scribed, and the resin layer is cut with a laser in such a state, whereby the glass layer is braked by the gas generated in response to the laser irradiation to form a discharge portion.

As an example of a method for manufacturing the flexible organic EL display, in the discharge portion forming process, the glass layer is scribed so that a plurality of scribe lines intersect.

According to this manufacturing method, a relatively wide discharge portion is formed when the glass layer is braked at a portion where a plurality of scribes in the glass layer intersect. The discharging property of the foreign matter generated due to the cutting of the resin layer is improved.

As an example of the method for manufacturing the flexible organic EL display, the rear end process further includes a rear end cutting process for cutting at least one of the resin layers of the plurality of laminated substrates by laser after the forming of the discharge portion. do.

In this manufacturing method, since the resin layer is cut by a laser, the calorific value accompanying cutting is small, and the quality of the resin layer is hardly deteriorated.

As an example of a method of manufacturing the flexible organic EL display, in the discharge portion forming step, the discharge portion is formed on one side of the plurality of laminated substrates, and in the rear end cutting step, the glass layer in which the discharge portion is not formed. The laser is irradiated onto the resin layer.

In this manufacturing method, the laser is irradiated onto the resin layer without being affected by the discharge portion of the glass layer, and the resin layer is efficiently cut or scribed.

According to the present invention, the manufacturing efficiency of the flexible organic EL display is less likely to decrease.

1 is a cross-sectional view of a multi-layer laminated substrate according to the manufacturing method of the first embodiment.
FIG. 2 is a plan view of the multilayer laminated substrate of FIG. 1.
3 is a schematic view showing the configuration of a laser processing apparatus.
4 is a schematic view showing the configuration of a scribe processing apparatus.
5 is a flow chart showing the manufacturing method of the embodiment.
6 is a view showing a first example of the discharge portion forming process.
7 is a view showing a second example of the discharge portion forming process.
8 is a schematic view showing the configuration of a laser processing apparatus.
9 is a view showing an example of a peeling process.
10 is a cross-sectional view of a multi-layer laminated substrate according to the manufacturing method of the second embodiment.
11 is a cross-sectional view of a multilayer laminated substrate according to a manufacturing method of a modified example.

(Form for carrying out the invention)

(First embodiment)

A method of manufacturing a flexible organic EL display will be described with reference to the drawings. The flexible organic EL display is used in stationary devices and portable devices. Examples of stationary devices are personal computers and television receivers. Examples of portable devices are portable information terminals, wearable computers, and notebook personal computers. An example of a portable information terminal is a smart phone, a tablet, and a portable game machine. One example of a wearable computer is a head mounted display and a smart watch.

The flexible organic EL display has a light emitting device in which a light emitting layer, an electrode, and a substrate are stacked, a first protective film covering the light emitting device from one side, and a second protective film covering the light emitting device from the other side. Each of the first protective film and the second protective film is, for example, PET (polyethylene terephthalate). Further, one of the first protective film and the second protective film may be omitted. In the manufacturing process of the light emitting device, a plurality of light emitting devices are manufactured from a single multilayer laminated substrate 10 shown in FIG. 1.

The multi-layered laminated substrate 10 is produced in the middle of the production of a flexible organic EL display. The multilayer laminated substrate 10 includes a first laminated substrate 11 on which the first glass layer 11A and the first resin layer 11B are stacked, and a second glass layer 12A and the second resin layer 12B. This laminated second laminated substrate 12 is provided. The multilayer laminated substrate 10 is configured by stacking the first laminated substrate 11 and the second laminated substrate 12 so that the first resin layer 11B and the second resin layer 12B face each other. The multilayer laminated substrate 10 further includes a conductive layer 13. The conductive layer 13 is formed on the first resin layer 11B of the first laminated substrate 11, for example. The conductive layer 13 is sandwiched between the first resin layer 11B and the second resin layer 12B. The conductive layer 13 is formed of a member for an electronic device such as an organic light diode (OLED) or a thin film transistor (TFT). The first resin layer 11B, the conductive layer 13, and the second resin layer 12B constitute a light emitting device.

The first glass layer 11A of the first laminated substrate 11 and the second glass layer 12A of the second laminated substrate 12 are made of the same material and are formed in the same size. Although the composition of the 1st glass layer 11A and the 2nd glass layer 12A is not specifically limited, Glass of various compositions, such as glass containing alkali metal oxide, or alkali free glass, can be used, for example. . One example of a glass containing an alkali metal oxide is soda lime glass. In the present embodiment, alkali-free glass is used for the first glass layer 11A and the second glass layer 12A. Although the thickness of the 1st glass layer 11A and the 2nd glass layer 12A is not specifically limited respectively, It is preferable that it is about 0.5 mm, for example. The first glass layer 11A has a first plane 14A on which the first resin layer 11B is formed, and a second plane 14B paired with the first plane 14A. The second glass layer 12A has a first plane 15A on which the second resin layer 12B is formed, and a second plane 15B paired with the first plane 15A.

The first resin layer 11B of the first laminated substrate 11 and the second resin layer 12B of the second laminated substrate 12 are made of the same material and are formed in the same size. The composition of the 1st resin layer 11B and the 2nd resin layer 12B is not specifically limited, For example, polyimide (PI) can be used. Although the thickness of the 1st resin layer 11B and the 2nd resin layer 12B is not specifically limited, It is preferable that it is 10 micrometers or more and 30 micrometers or less, for example.

2 is a plan view of the multilayer laminated substrate 10.

The unit stacked substrate 20 is formed by cutting the multilayer stacked substrate 10 in a lattice shape along the cut scheduled portions 16 and 17 indicated by the broken line in FIG. 2. The size of the unit laminated substrate 20 when viewed from the plane corresponds to a predetermined size of the light emitting device when viewed from the plane.

At least one of a laser processing apparatus and a scribe processing apparatus is used for cutting of the multilayer laminated substrate 10. 3 is an example of the configuration of the laser processing apparatus, and FIG. 4 is an example of the configuration of the scribing processing apparatus. 3 and 4, the X-axis direction, the Y-axis direction, and the Z-axis direction are defined as shown in Figs. In addition, a dicing processing apparatus (not shown) may be used for cutting the first laminated substrate 11 and the second laminated substrate 12.

As shown in FIG. 3, the laser processing device 30 includes a laser device 31 for cutting the multilayer laminated substrate 10 and a machine for moving the multilayer laminated substrate 10 relative to the laser device 31. A driving system 32, a laser device 31, and a first control unit 33 for controlling the mechanical driving system 32 are provided.

The laser device 31 includes at least the first resin layer 11B, the second resin layer 12B, the first glass layer 11A, and the second glass layer 12A in the multilayer laminated substrate 10. Process 1 The laser device 31 has a laser oscillator 34 for irradiating laser light on the multilayer laminated substrate 10 and a transmission optical system 35 that transmits the laser light to the mechanical drive system 32. The laser oscillator 34 is, for example, a UV (Ultra Violet) laser or a CO ₂ laser. When the laser processing device 30 processes the first resin layer 11B and the second resin layer 12B, the laser oscillator 34 is a UV laser. When the laser processing apparatus 30 processes the first glass layer 11A and the second glass layer 12A, the laser oscillator 34 is a CO ₂ laser or a UV laser. The transmission optical system 35 is composed of, for example, a condenser lens, a plurality of mirrors, a prism, a beam expander, or the like. Further, the transmission optical system 35 has an X-axis direction movement mechanism for moving the laser irradiation head in which the laser oscillator 34 is incorporated, for example, in the X-axis direction. The laser light irradiated from the laser oscillator 34 is irradiated toward the multilayer laminated substrate 10 through the transmission optical system 35.

The mechanical drive system 32 is disposed to face the laser device 31 and the Z-axis direction. The mechanical drive system 32 is composed of a bed 36, a processing table 37, and a moving device 38. On the processing table 37, a multilayer laminated substrate 10 is placed. The moving device 38 moves the machining table 37 in the horizontal direction (X-axis direction and Y-axis direction) with respect to the bed 36. The moving device 38 is a known mechanism having a guide rail, a moving table, a motor, and the like.

The first control unit 33 has an arithmetic processing device that executes a predetermined control program. The arithmetic processing unit has, for example, a CPU (Central Processing Unit) or an MPU (Micro Processing Unit). The first control unit 33 may have one or a plurality of microcomputers. The first control unit 33 further has a storage unit. In the storage unit, information used for various control programs and various control processes is stored. The storage unit has, for example, a nonvolatile memory and a volatile memory. The first control unit 33 may be formed in the laser device 31, may be formed in the machine drive system 32, or may be formed separately from the laser device 31 and the machine drive system 32. When the first control unit 33 is formed separately from the laser device 31 and the mechanical drive system 32, the arrangement position of the first control unit 33 can be arbitrarily set.

As shown in FIG. 4, the scribe processing apparatus 40 is X on the multi-layer laminated substrate 10 as the scribing wheel 50 and the multi-layer laminated substrate 10 move relatively in the X-axis direction and the Y-axis direction. A scribe line along the axial direction and the Y-axis direction is formed. The scribing processing device 40 includes a processing device 41 for processing the multilayer laminated substrate 10, a transport device 42 for transporting the multilayer laminated substrate 10, a processing device 41 and a transport device It is equipped with the 2nd control part 43 which controls 42.

The conveying device 42 is composed of a pair of rails 44, a table 45, a straight drive device 46, a rotating device 47, and the like. The pair of rails 44 extend along the Y-axis direction. In the scribe processing apparatus 40 of Fig. 4, a pair of rails 44 are arranged on the base (not shown) of the scribing processing apparatus 40, and the table 45 is paired by the straight drive device 46. It reciprocates along the rail 44 of the table, and the table 45 is rotated around the central axis C by the rotation device 47. On the table 45, a multi-layer laminated substrate 10 is placed. An example of the straight drive device 46 has a feed screw device. The rotating device 47 has a motor serving as a driving source.

The processing device 41 is composed of a horizontal driving device 48, a vertical driving device 49, a scribing wheel 50, and the like. The scribing wheel 50 is attached to a holder unit for holding the scribing wheel 50. The holder unit is attached to a scribe head for holding the holder unit. The scribe head moves in the X-axis direction by the horizontal drive device 48, and moves in the Z-axis direction by the vertical drive device 49. As the scribing wheel 50 moves in the X-axis direction, a scribe line along the X-axis direction is formed on the multi-layer laminated substrate 10.

The scribing wheel 50 is rotatably supported by a pin (not shown) attached to the holder unit. Examples of materials constituting the scribing wheel 50 are sintered diamond (Poly Crystalline Diamond), cemented metal, single crystal diamond, and polycrystalline diamond.

The second control unit 43 has an arithmetic processing device that executes a predetermined control program. The arithmetic processing unit has, for example, a CPU or an MPU. The second control unit 43 may have one or a plurality of microcomputers. The second control unit 43 further has a storage unit. In the storage unit, information used for various control programs and various control processes is stored. The storage unit has, for example, a nonvolatile memory and a volatile memory. The 2nd control part 43 may be provided in the processing apparatus 41, may be provided in the conveying apparatus 42, or may be formed separately from the processing apparatus 41 and the conveying apparatus 42. When the second control part 43 is formed separately from the processing device 41 and the transfer device 42, the arrangement position of the second control part 43 can be set arbitrarily.

(Method of manufacturing flexible organic EL display)

Next, details of the manufacturing method of the flexible organic EL display will be described. 5 shows an example of a process of a method for manufacturing a flexible organic EL display.

In the method of manufacturing a flexible organic EL display, the first laminated substrate 11 and the second laminated substrate 12 are joined to produce a multilayer laminated substrate 10, and then the multilayer laminated substrate 10 is cut into a predetermined size to unit The laminated substrate 20 is manufactured. Next, the light emitting device is manufactured by removing the first glass layer 11A and the second glass layer 12A from the unit laminated substrate 20. Then, the first protective film and the second protective film are attached to the first resin layer 11B and the second resin layer 12B. Thus, a flexible organic EL display is produced.

As shown in FIG. 5, the manufacturing method of a flexible organic EL display includes a shearing step, which is a step prior to the step of laminating the first laminated substrate 11 and the second laminated substrate 12, It is divided into a rear end process, which is a process after the process of stacking the first laminated substrate 11 and the second laminated substrate 12. The shearing step includes a shearing laminating step. The shear lamination process is a process of manufacturing the first laminated substrate 11 and the second laminated substrate 12. The rear end step includes a rear end lamination step, a rear end step, and a peeling step. The back-end lamination process is a process of manufacturing the multi-layer laminated substrate 10 by laminating the first laminated substrate 11 and the second laminated substrate 12. In the post-processing step, the multi-layer laminated substrate 10 is cut along a predetermined cutting portion 16, 17 of the multi-layer laminated substrate 10, that is, by cutting the multi-layer laminated substrate 10 to a predetermined size. 20). In the peeling process, the first glass layer 11A and the first resin layer 11B are separated by laser lift off (LLO), and the second glass layer 12A and the second resin layer 12B are removed. It is a process of peeling. Hereinafter, the detail of each process is demonstrated.

In the shear lamination process, the first laminated substrate 11 is manufactured by forming the first resin layer 11B over the entire first plane 14A of the first glass layer 11A, and the second glass layer 12A The second laminated substrate 12 is manufactured by forming the second resin layer 12B over the entire first plane 15A of). Method of forming the first resin layer 11B in the first plane 14A of the first glass layer 11A, and second resin layer 12B in the first plane 15A of the second glass layer 12A ), Respectively, the method of applying a resin layer to the glass layer or the method of laminating the resin layer through the adhesive layer to the glass layer can be selected. In addition, as a method of fixing the resin layer to the glass layer, heat curing treatment or heating and pressing treatment by a pressing method can be selected.

In the subsequent stacking step, the first laminated substrate 11 that is not cut to a predetermined size and the second laminated substrate 12 that is not cut to a predetermined size are stacked. As an example, the first laminated substrate 11 and the second laminated substrate 12 are bonded, for example, through an adhesive layer SD. Thereby, the multilayer laminated substrate 10 is manufactured.

The post-processing step includes a discharge part forming process for forming a discharge part 18 for discharging gas on at least one of the first glass layer 11A and the second glass layer 12A, and a first resin layer ( 11B) and a rear end cutting step of cutting at least one of the second resin layer 12B. In a post-processing process, it is performed in the order of a discharge part formation process and a post-stage cutting process.

As an example, in the post-processing step, in the step of forming the discharge portion, the discharge portion is disposed on one side of the portion to be cut 16A of the first glass layer 11A and the portion to be cut 17A of the second glass layer 12A ( After forming 18), at least one of the cutting scheduled portion 16B of the first resin layer 11B and the cutting scheduled portion 17B of the second resin layer 12B is cut in the subsequent cutting step.

As an example, in the post-processing step, in the step of forming the discharge portion, the discharge portion is disposed on one side of the portion to be cut 16A of the first glass layer 11A and the portion to be cut 17A of the second glass layer 12A ( After forming 18), the resin layer corresponding to one of the first glass layer 11A and the second glass layer 12A is cut in the rear end cutting step. Next, in the discharge portion forming process, the discharge portion 18 is formed on the other side of the portion to be cut 16B of the first glass layer 11A and the portion to be cut 17B of the second glass layer 12A. Thereafter, in the subsequent cutting step, the resin layer corresponding to the other of the first glass layer 11A and the second glass layer 12A is cut.

As an example, in the post-processing step, in the discharge part forming process, after the discharge part 18 is formed in the 16A of the cut portion of the first glass layer 11A, the first resin layer ( 11B) and the second resin layer 12B are cut. For example, in the post-processing step, in the discharge part forming process, after the discharge part 18 is formed in the planned cutting part 17A of the second glass layer 12A, the first resin layer ( 11B) and the second resin layer 12B are cut. In addition, the processing of the 1st resin layer 11B and the 2nd resin layer 12B by a laser in a post-processing process replaces the 1st resin layer 11B and the 2nd resin layer 12B cutting. , The first resin layer 11B and the second resin layer 12B may be scribed.

In the discharge portion forming process, any one of the following first and second examples can be selected as a method of forming the discharge portion 18. In the first example, the discharge portion 18 is formed by cutting at least one of the first glass layer 11A and the second glass layer 12A. In the second example, grooves (scribe lines) are formed on at least one of the first glass layer 11A and the second glass layer 12A, and the discharge portion 18 is formed. Further, in the discharge portion forming step, the discharge portion 18 may be formed only in the first glass layer 11A, or the discharge portion 18 may be formed only in the second glass layer 12A.

In the process of forming the discharge portion of the first example, at least one of the portion to be cut 16A of the first glass layer 11A and the portion to be cut 17A of the second glass layer 12A is laser, diced, or Cut by brake. The cut portion of the cut scheduled portion 16A and the cut scheduled portion 17A forms the discharge portion 18. Fig. 6 shows a case in which the portion to be cut 17A of the second glass layer 12A is cut. The portion where the second glass layer 12A is cut in the portion to be cut 17A constitutes the discharge portion 18.

In the discharge example forming process of the second example, at least one of the first glass layer 11A and the second glass layer 12A is scribed by a scribing wheel 50 so that a plurality of scribe lines intersect. The intersection of the plurality of scribe lines forms a discharge portion 18 by scribing deeper than the other portions of the scribe line. 7 shows a case in which the first glass layer 11A is scribed so that the four scribe lines SL of the first glass layer 11A intersect. The intersection of the four scribe lines SL constitutes the discharge portion 18. Further, the discharge portion 18 may be formed by irradiating a laser so as to penetrate the glass layer on which the scribe line is formed at the intersection of the scribe line.

Further, at least one of the first glass layer 11A and the second glass layer 12A may be formed with a groove along a portion to be cut by a laser, so that the discharge portion 18 may be formed at an intersection of the portion to be cut. . This groove corresponds to a scribe line by the scribing wheel 50. The discharge portion 18 may be formed by irradiating a laser so that the grooved glass layer penetrates at the intersection of the portion to be cut.

In the subsequent cutting step, at least one of the first resin layer 11B and the second resin layer 12B is cut by a laser. The irradiation direction of the laser can be set arbitrarily. As an example, the first resin layer 11B and the second resin layer 12B may be irradiated with a laser in the same irradiation direction, and the irradiation direction of the laser with respect to the first resin layer 11B and the second resin layer ( The direction in which the laser is irradiated to 12B) may be in the opposite direction.

When the cutting scheduled portion 16A of the first glass layer 11A is scribed, the laser may be irradiated from the first glass layer 11A side toward the cutting scheduled portion 16B of the first resin layer 11B. , It may be irradiated from the side of the second glass layer 12A toward the portion to be cut 16B of the second resin layer 12B. When the part to be cut 17A of the second glass layer 12A is scribed, the laser may be irradiated from the side of the second glass layer 12A toward the part to be cut 17B of the second resin layer 12B. , You may irradiate from the 1st glass layer 11A side toward the cutting scheduled part 17B of the 1st resin layer 11B. In these cases, the cut scheduled portion 16B of the first resin layer 11B and the cut scheduled portion 17B of the second resin layer 12B in the order of the first resin layer 11B and the second resin layer 12B. ) May be cut, and in the order of the second resin layer 12B and the first resin layer 11B, the cut scheduled portion 16B of the first resin layer 11B and the cut scheduled portion of the second resin layer 12B. (17B) may be cut. In addition, from the viewpoint of irradiating the laser with a high precision to the portion to be cut of the resin layer, when the portion to be cut 16A of the first glass layer 11A is scribed, the laser is provided with the second glass layer 12A It is preferable to irradiate from the side toward the part to be cut 17B of the second resin layer 12B. When the cutting scheduled portion 17A of the second glass layer 12A is scribed, the laser is irradiated from the first glass layer 11A side toward the cutting scheduled portion 16B of the first resin layer 11B. desirable.

When the laser is irradiated toward the second resin layer 12B from the second glass layer 12A side with the first glass layer 11A scribed, the laser cuts the second resin layer 12B. , The first resin layer 11B may be cut or the first resin layer 11B may be scribed. When the laser is irradiated from the side of the first glass layer 11A to the first resin layer 11B while the first glass layer 11A is scribed, the laser cuts the first resin layer 11B. , The second resin layer 12B may be cut or the second resin layer 12B may be scribed. When the laser is irradiated from the side of the first glass layer 11A toward the first resin layer 11B with the second glass layer 12A scribed, the laser cuts the first resin layer 11B. , The second resin layer 12B may be cut or the second resin layer 12B may be scribed. When the laser is irradiated from the side of the second glass layer 12A toward the second resin layer 12B with the second glass layer 12A scribed, the laser cuts the second resin layer 12B. , The first resin layer 11B may be cut or the first resin layer 11B may be scribed.

Gas is generated as the laser irradiates the first resin layer 11B and the second resin layer 12B. Since the gas is discharged to the outside of the multi-layer laminated substrate 10 through the discharge portion 18, it is suppressed that the gas remains inside the multi-layer laminated substrate 10. In addition, foreign substances such as debris generated during the processing of the first resin layer 11B and the second resin layer 12B are discharged to the outside of the multi-layer laminated substrate 10 through the discharge portion 18. For this reason, the 1st glass layer 11A, the 1st resin layer 11B, the 1st glass layer 11A, the 1st glass layer 11A, the 1st resin layer 11B, due to the gas retention inside the multilayer laminated substrate 10 and the pressure increase inside the multilayer laminated substrate 10 by foreign matter The deformation of the 2 resin layer 12B and the second glass layer 12A is suppressed.

When the 1st glass layer 11A and the 2nd glass layer 12A are cut in the process of forming the discharge part of a 1st example, a unit laminated substrate is cut by cutting the 1st resin layer 11B and the 2nd resin layer 12B 20 is produced. In the case of cutting one of the first glass layer 11A and the second glass layer 12A in the process of forming the discharge portion of the first example, after cutting the first resin layer 11B and the second resin layer 12B , The unit laminated substrate 20 is manufactured by cutting the other side of the first glass layer 11A and the second glass layer 12A.

When the scribe line SL is formed in each of the 1st glass layer 11A and the 2nd glass layer 12A in the process of forming a discharge part of a 2nd example, the 1st resin layer 11B and the 2nd resin layer ( After cutting 12B), the unit laminated substrate 20 is manufactured by breaking the first glass layer 11A and the second glass layer 12A. When the scribe line SL is formed in one of the 1st glass layer 11A and the 2nd glass layer 12A in the process of forming a discharge part of a 2nd example, the 1st resin layer 11B and the 2nd resin layer ( After cutting 12B), the other side of the first glass layer 11A and the second glass layer 12A is scribed, and the first glass layer 11A and the second glass layer 12A are braked to break the unit laminated substrate. 20 is produced. In addition, when the 1st resin layer 11B and the 2nd resin layer 12B are scribed, when the 1st glass layer 11A and the 2nd glass layer 12A break, the 1st resin layer 11B and The second resin layer 12B is also braked.

When cutting each of the glass layer and the resin layer with a laser, or when forming a scribe line with a laser in each of the glass layer and the resin layer, instead of the laser processing apparatus 30 shown in FIG. 3, FIG. The laser processing apparatus 30A shown in 8 is used. The laser processing device 30A has a different configuration of the laser device compared to the laser processing device 30. Hereinafter, different structures in the laser processing apparatus 30A will be described.

The laser device 31A of the laser processing device 30A includes a first laser oscillator 34A and a second laser oscillator 34B. The first laser oscillator 34A is a UV laser, and the second laser oscillator 34B is a CO ₂ laser. The laser beam irradiated from the first laser oscillator 34A and the laser beam irradiated from the second laser oscillator 34B are transmitted through the transmission optical system 35 to the first laminated substrate 11 and the second laminated substrate 12. Is investigated. In addition, the transmission optical system 35 may have a transmission optical system corresponding to the first laser oscillator 34A and a transmission optical system corresponding to the second laser oscillator 34B individually.

The 1st control part 33 is the 1st laser oscillator 34A and the 2nd laser oscillator according to the kind (process layer of glass or resin) of the object to be processed for the 1st laminated board 11 and the 2nd laminated board 12 Choose (34B). For example, the first control unit 33 determines the processing sequence of the glass layer and the resin layer, which are the types of objects to be processed, by the previously stored control program, and the first laser oscillator 34A and the second laser according to the determined processing sequence. Select the oscillator 34B.

In the peeling process, a laser lift-off device (not shown) is used. In this embodiment, a UV laser is used as the laser of the laser lift-off device. As shown in Fig. 9 (a), the first resin layer 11B and the first glass layer 11A are peeled by irradiating a laser from the first glass layer 11A side to the first resin layer 11B. When peeling the 1st glass layer 11A and the 1st resin layer 11B, a laser is irradiated to be orthogonal to the 2nd plane 14B of the 1st glass layer 11A. Next, as shown in Fig. 9 (b), the second resin layer 12B and the second glass layer 12A are irradiated by laser irradiation from the second glass layer 12A side to the second resin layer 12B. Peel off. In the case of peeling the second glass layer 12A and the second resin layer 12B, the laser is irradiated to be perpendicular to the second plane 15B of the second glass layer 12A. In addition, the order of peeling the 1st glass layer 11A and the 2nd glass layer 12A can be arbitrarily changed. For example, after peeling the 2nd resin layer 12B and the 2nd glass layer 12A, you may peel the 1st resin layer 11B and the 1st glass layer 11A.

After the first glass layer 11A and the second glass layer 12A are removed from the multilayer laminated substrate 10 (see Fig. 9 (c)), that is, after the production of the light emitting device, the first resin layer 11B is removed. A flexible organic EL display is produced by attaching the first protective film to cover and attaching the second protective film to cover the second resin layer 12B.

The effects of this embodiment will be described.

(1-1) The post-processing step includes a discharge portion forming step of forming a discharge portion 18 on at least one of the first glass layer 11A and the second glass layer 12A. According to this manufacturing method, for example, gas generated when the first resin layer 11B and the second resin layer 12B are cut by a laser is discharged through the discharge portion 18 to the outside of the multi-layer laminated substrate 10. Since it is discharged to the furnace, the possibility that the quality of the first resin layer 11B and the second resin layer 12B decreases due to the influence of gas is reduced.

(1-2) In the discharge portion forming step, the discharge portion 18 is formed by cutting at least one of the first glass layer 11A and the second glass layer 12A. In this manufacturing method, when cutting at least one of the 1st glass layer 11A and the 2nd glass layer 12A, it is accompanied by irradiating a laser to the 1st resin layer 11B and the 2nd resin layer 12B. The generated gas is discharged from at least one cut portion of the first glass layer 11A and the second glass layer 12A to the outside of the multilayer laminated substrate 10. For this reason, there is less possibility that the gas affects the quality of the first resin layer 11B and the second resin layer 12B.

(1-3) In the discharge portion forming step, at least one of the first glass layer 11A and the second glass layer 12A is cut by laser or dicing to form the discharge portion 18. In this manufacturing method, the discharge portion 18 is formed on at least one of the first glass layer 11A and the second glass layer 12A by a cutting method generally used for cutting the glass layer. For this reason, for example, an existing device can be used.

(1-4) In the discharge part forming process, at least one of the first glass layer 11A and the second glass layer 12A is scribed so that the plurality of scribe lines SL intersect by the scribing wheel 50. do. According to this manufacturing method, the intersection where the scribe line SL intersects the glass layer by deepening the scribed depth as compared with other parts of the scribe line SL. For this reason, the intersection part where the scribe line SL intersects forms the discharge part 18. For this reason, for example, an existing device can be used.

(1-5) The rear end processing step includes a rear end cutting step in which at least one of the first resin layer 11B and the second resin layer 12B is cut by a laser after the discharge portion forming process. In this manufacturing method, since at least one of the first resin layer 11B and the second resin layer 12B is cut by a laser, the calorific value accompanying cutting is small, and the first resin layer 11B and the second water The quality of the formation layer 12B is difficult to deteriorate.

(1-6) In the discharge part forming process, the discharge part 18 is formed on one side of the first glass layer 11A and the second glass layer 12A, and in the rear end cutting process, the discharge part 18 is formed. The laser is applied to the resin layer corresponding to the other side of the first glass layer 11A and the second glass layer 12A through the other side of the first glass layer 11A and the second glass layer 12A, which are not being made. Investigate. In this manufacturing method, the first glass layer 11A and the second glass layer (without being influenced by one of the discharge portions 18 of the first glass layer 11A and the second glass layer 12A) The resin layer corresponding to the other side of 12A) is irradiated, and the resin layer is efficiently cut or scribed.

(1-7) The manufacturing method of the flexible organic EL display is a step subsequent to the step of laminating the first laminated substrate 11 and the second laminated substrate 12, and the multilayer laminated substrate 10 is predetermined. Cut to size. In this manufacturing method, since the first laminated substrate 11 and the second laminated substrate 12 are cut in the state of the laminated multilayer substrate 10, the lamination operation is simplified. For this reason, the manufacturing efficiency of the flexible organic EL display is unlikely to decrease.

(1-8) In the rear end cutting step, the first resin layer 11B and the second resin layer 12B are cut with a laser. For this reason, the calorific value at the time of cutting | disconnecting the 1st resin layer 11B and the 2nd resin layer 12B is small, and the quality of the 1st resin layer 11B and the 2nd resin layer 12B is hard to fall.

(Second embodiment)

The manufacturing method of the flexible organic EL display of 2nd Embodiment is demonstrated with reference to FIG. In this embodiment, the post-processing step is different compared with the first embodiment. In the following description, parts different from the first embodiment will be described in detail, and components of the multi-layer laminated substrate 10 common to the first embodiment are denoted by the same reference numerals, and the description is omitted.

In the discharge portion forming process, the portion to be cut 16A of the first glass layer 11A of the first laminated substrate 11 and the portion to be cut 17A of the second glass layer 12A of the second laminated substrate 12 ), A discharge portion 18 is formed by scribing at least one side. In one example, the discharge portion 18 is formed by laser or scribe.

In the discharge portion forming process of the present embodiment, the discharge portion 18 is formed on one of the planned cutting portion 16A of the first glass layer 11A and the planned cutting portion 17A of the second glass layer 12A. , The discharge portion 18 is not formed on the other side of the portion to be cut 16A of the first glass layer 11A and the portion to be cut 17A of the second glass layer 12A. In FIG. 10, the discharge portion 18 is formed in the portion to be cut 17A of the second glass layer 12A, and the discharge portion 18 is formed in the portion to be cut 16A of the first glass layer 11A. It shows an example that is not.

In the rear-end cutting process, at least one of the cutting scheduled portion 16B of the first resin layer 11B and the cutting scheduled portion 17B of the second resin layer 12B is cut by a laser, or the laser can be firstly cut. A scribe line is formed on at least one of the portion to be cut 16B of the base layer 11B and the portion to be cut 17B of the second resin layer 12B. In the present embodiment, in the subsequent cutting step, the output of the laser in the irradiation of the laser per one time to the first resin layer 11B and the second resin layer 12B is accelerated by the generation of gas at a predetermined temperature or higher. Set to more than the specified output. When it is set to a predetermined output or more, in the multi-layered laminated substrate 10 with the irradiation of the laser to the cutting scheduled portion 16B of the first resin layer 11B and the cutting scheduled portion 17B of the second resin layer 12B, The generated gas exerts a force that can break the glass layer on which the pretreatment has been applied to the glass layer.

As described above, in the rear end cutting step, the glass in which the scribe line (discharge portion 18) is formed in the cut scheduled portion 16A of the first glass layer 11A and the cut scheduled portion 17A of the second glass layer 12A is formed. The layer is braked with a gas generated in response to irradiation of the laser to the portion to be cut 16B of the first resin layer 11B and the portion to be cut 17B of the second resin layer 12B. Accordingly, the discharge unit 18 communicates with the inside and the outside of the multi-layered laminate substrate 10, so that the gas in the multi-layer laminate substrate 10 can be discharged to the outside of the multi-layer laminate substrate 10. .

As an example of the rear end cutting process, when the discharge portion 18 is formed in the portion to be cut 17A of the second glass layer 12A, the second resin layer 12B is cut from the second glass layer 12A side. The laser is irradiated to the predetermined portion 17B. The to-be-cut portion 17A of the second glass layer 12A is braked by the gas generated by the irradiation of the laser to the to-be-cut portion 17B of the second resin layer 12B. As an example, when the discharge portion 18 is formed in the portion to be cut 17A of the second glass layer 12A, the portion to be cut 16B of the first resin layer 11B from the side of the first glass layer 11A ), And then cut the portion to be cut 16B of the first resin layer 11B, then irradiate the laser to the portion to be cut 17B of the second resin layer 12B in the same irradiation direction. 2 The cut scheduled portion 17B of the resin layer 12B is cut, or the cut scheduled portion 17B of the second resin layer 12B is scribed. Cutting of the second glass layer 12A with a gas generated in response to laser irradiation on the cutting scheduled portion 16B of the first resin layer 11B and the cutting scheduled portion 17B of the second resin layer 12B The scheduled portion 17A is braked.

As an example of the rear-end cutting process, when the discharge portion 18 is formed in the portion to be cut 16A of the first glass layer 11A, the first resin layer 11B is cut from the first glass layer 11A side. The laser is irradiated to the predetermined portion 16B. The to-be-cut portion 16A of the first glass layer 11A is braked by the gas generated by the irradiation of the laser to the to-be-cut portion 16B of the first resin layer 11B. As an example, when the discharge portion 18 is formed in the portion to be cut 16A of the first glass layer 11A, the portion to be cut 17B of the second resin layer 12B from the second glass layer 12A side ), And then cut the portion to be cut 17B of the second resin layer 12B, then irradiate the laser to the portion to be cut 16B of the first resin layer 11B in the same irradiation direction. 1 The cut scheduled portion 16B of the resin layer 11B is cut or the cut scheduled portion 16B of the first resin layer 11B is scribed. Cutting of the first glass layer 11A with a gas generated by irradiation of the laser to the portion to be cut 17B of the second resin layer 12B and the portion to be cut 16B of the first resin layer 11B The scheduled portion 16A is braked.

In the rear end cutting step, the other of the first glass layer 11A and the second glass layer 12A where the discharge portion 18 is not formed is cut. As an example, in the post-cutting process, the other side of the first glass layer 11A and the second glass layer 12A is scribed by the laser processing apparatus 30 or the scribe processing apparatus 40, and then the first glass The other side of the layer 11A and the second glass layer 12A is braked along the scribe line. Thereby, the unit laminated substrate 20 is manufactured. When a scribe line is formed in one of the 1st resin layer 11B and the 2nd resin layer 12B, it brakes simultaneously when the 1st glass layer 11A and the 2nd glass layer 12A are braked. Thereby, the unit laminated substrate 20 is manufactured. In one example, in the subsequent cutting step, the other of the first glass layer 11A and the second glass layer 12A is cut by laser or dicing. When a scribe line is formed on one of the first resin layer 11B and the second resin layer 12B, after the other of the first glass layer 11A and the second glass layer 12A is cut, the first The other of the resin layer 11B and the second resin layer 12B is braked. Thereby, the unit laminated substrate 20 is manufactured.

The effects of this embodiment will be described.

(2-1) In the discharge portion forming step, the discharge portion 18 is disposed on at least one of the portion to be cut 16A of the first glass layer 11A and the portion to be cut 17A of the second glass layer 12A. To form. In the rear end cutting process, the glass layer on which the discharge portion 18 is formed is braked with a gas generated in response to laser irradiation on at least one of the first resin layer 11B and the second resin layer 12B. In this manufacturing method, the glass layer on which the discharge portion 18 is formed is cut along with the operation of cutting at least one of the first resin layer 11B and the second resin layer 12B by laser. For this reason, the labor for cutting the multilayer laminated substrate 10 is reduced, and the manufacturing efficiency of the flexible organic EL display is unlikely to decrease.

(2-2) In the rear end cutting step, the output of the laser in the irradiation of the laser per one time to the first resin layer 11B and the second resin layer 12B is accelerated by the generation of gas at a predetermined temperature or higher. Set to more than the specified output. In this manufacturing method, a relatively high temperature gas is generated with cutting of at least one of the first resin layer 11B and the second resin layer 12B by a laser, and the glass layer subjected to preliminary processing is subjected to gas. It brakes properly.

(2-3) In the discharge portion forming step, the discharge portion 18 is formed on one of the portion to be cut 16A of the first glass layer 11A and the portion to be cut 17A of the second glass layer 12A. Then, the discharge portion 18 is not formed on the other side of the portion to be cut 16A of the first glass layer 11A and the portion to be cut 17A of the second glass layer 12A. In this manufacturing method, only one of the first glass layer 11A and the second glass layer 12A is braked with gas. Compared to the case where both the first glass layer 11A and the second glass layer 12A are braked with gas, the states of the first glass layer 11A and the second glass layer 12A at the time of break are stable. .

(2-4) In the rear end cutting process, the laser is irradiated to the resin layer corresponding to the glass layer in which the discharge portion 18 is not formed, through the glass layer in which the discharge portion 18 is not formed. In this manufacturing method, since the laser is irradiated onto the resin layer corresponding to the glass layer on which the discharge portion 18 is not formed, without being affected by the portion to be processed of the pre-processed glass layer, the resin layer is efficiently The resin layer is cut or cut efficiently.

(2-5) In the rear-end cutting process, after cutting the 1st resin layer 11B and the 2nd resin layer 12B with a laser, the glass layer in which the discharge part 18 was not formed is cut. In this manufacturing method, the first resin layer 11B and the second water can be held in a state where the first resin layer 11B and the second resin layer 12B are supported by the glass layer on which the discharge portion 18 is not formed. The formation layer 12B is cut by a laser. For this reason, the state of the 1st resin layer 11B and the 2nd resin layer 12B at the time of cutting is stable.

(Modified example)

Each of the above-described embodiments is an example of a form that can take the manufacturing method of the flexible organic EL display according to the present disclosure, and is not intended to limit the form. The method for manufacturing a flexible organic EL display according to the present disclosure can take a form different from the form illustrated in each embodiment. An example thereof is a form in which a part of the configuration of each embodiment is replaced, changed, or omitted, or a new configuration is added to each embodiment. In the following modified examples, parts common to those of the respective embodiments are given the same reference numerals as those of the respective embodiments, and descriptions thereof are omitted.

In the first embodiment, in the post-cutting step, the output of the laser in the irradiation of the laser per one time to the first resin layer 11B and the second resin layer 12B is generated at a temperature higher than a predetermined temperature. The first resin layer 11B and the second resin layer 12B may be cut by setting a value below the suppressed predetermined output and irradiating the laser multiple times. According to this manufacturing method, when a laser is irradiated to the 1st resin layer 11B and the 2nd resin layer 12B, high-temperature gas is hard to generate | occur | produce, and the 1st glass layer 11A and the 1st glass layer are influenced by gas. 2 The fear that the quality of the glass layer 12A, the first resin layer 11B, and the second resin layer 12B will decrease is further reduced.

In the above modification, in the case of cutting the first resin layer 11B and the second resin layer 12B by irradiation of a plurality of lasers, instead of or in addition to setting the laser below a predetermined output, a constant You may cut | disconnect the 1st resin layer 11B and the 2nd resin layer 12B by irradiating a laser to the 1st resin layer 11B and the 2nd resin layer 12B several times over time. In this manufacturing method, the laser is irradiated to one of the first resin layer 11B and the second resin layer 12B, the laser irradiation is temporarily stopped, and after a certain time has elapsed, the first resin layer 11B ) And one of the second resin layers 12B is irradiated, and the interruption of irradiation of these lasers and temporary irradiation is repeated multiple times. The same applies to the case where the laser is irradiated to the other of the first resin layer 11B and the second resin layer 12B. The gas generated upon irradiation of the laser to the first resin layer 11B and the second resin layer 12B is cooled when the laser irradiation is temporarily stopped, and the first glass layer ( 11A), the possibility that the quality of the 2nd glass layer 12A, the 1st resin layer 11B, and the 2nd resin layer 12B will fall is further reduced.

In the first embodiment, the place where the discharge portion 18 in the multi-layered laminated substrate 10 is formed is the cut scheduled portion 16 and the second laminated substrate 12 of the first laminated substrate 11. It is not limited to the cutting scheduled portion 17 of the. For example, as shown in FIG. 2, in the multi-layer laminated substrate 10, a discharge portion 18 may be formed in a portion between adjacent unit laminated substrates 20.

In each embodiment, in the step of cutting the back end, when the first resin layer 11B and the second resin layer 12B are cut, the cutting scheduled portion 16B and the second number of the first resin layer 11B A suction mechanism 60 may be formed which sucks the gas generated in response to the irradiation of the laser with respect to the portion to be cut 17B of the formation layer 12B. As shown in FIG. 11, the suction mechanism 60 is configured to suck gas through the main surface 10A of the multilayer laminated substrate 10. As shown in FIG. One example of the suction mechanism 60 has an intake fan. The suction mechanism 60 sucks air in the main surface 10A of the multi-layer laminated substrate 10 by driving the intake fan. In this case, gas generated in the multilayer laminated substrate 10 is discharged to the outside of the multilayer laminated substrate 10 through the main surface 10A.

In each embodiment, instead of forming the conductive layer 13 on the first laminated substrate 11 or in addition to forming the conductive layer 13 on the first laminated substrate 11, the second stacking The conductive layer 13 may be formed on the substrate 12.

10: multilayer laminated substrate
11: first laminated substrate
11A: first glass layer
11B: 1st resin layer
12: second laminated substrate
12A: second glass layer
12B: Second resin layer
18: outlet
50: scribing wheel
SL: scribe line

Claims (7)

A plurality of laminated substrates having a glass layer and a resin layer laminated thereon is provided. The plurality of laminated substrates include a first laminated substrate on which a first glass layer and a first resin layer are stacked, and a second glass layer and a second resin layer. A method of manufacturing a flexible organic EL display comprising a stacked second laminated substrate, and the first resin layer and the second resin layer stacked so as to face each other.
And a rear end process, which is a process after the step of stacking the plurality of laminated substrates,
The post-processing step includes manufacturing a flexible organic EL display including a discharge portion forming process for forming a discharge portion for discharging foreign substances generated by cutting of the resin layer in at least one of the glass layers of the plurality of laminated substrates. Way. According to claim 1,
In the step of forming the discharge portion, a method of manufacturing a flexible organic EL display by forming the discharge portion by cutting the glass layer or by scribing the glass layer. According to claim 2,
In the discharge portion forming step, a method of manufacturing a flexible organic EL display by cutting the glass layer by laser or dicing to form the discharge portion. According to claim 2,
In the discharge portion forming step, a method of manufacturing a flexible organic EL display by scribing the glass layer by a scribing wheel to form the discharge portion. The method of claim 4,
In the discharge portion forming step, a method of manufacturing a flexible organic EL display that scribes the glass layer such that a plurality of scribe lines intersect. The method according to any one of claims 1 to 5,
The rear end step further comprises a rear end cutting step of cutting at least one of the resin layers of the plurality of laminated substrates with a laser after the discharge part forming step. The method of claim 6,
In the discharge portion forming step, the discharge portion is formed on one side of the plurality of laminated substrates,
In the rear end cutting step, a method of manufacturing a flexible organic EL display irradiating a laser to the resin layer through the glass layer in which the discharge portion is not formed.

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