KR20200042859A - Image pickup apparatus with movable unit and control unit connected together by flexible boards - Google Patents

Abstract

The present invention relates to an imaging device for making a load on a movable unit almost uniform when displaced. The movable unit controlled by a control unit can be at least in a predetermined direction. A first flexible substrate has a first connection part connected to the movable unit, a first wiring part extending from the first connection part in a first direction different from an optical axis direction, and a second connection part disposed in an end part of the first wiring part and connected to the control unit. The second flexible substrate has a third connection part connected to the movable unit, a second wiring part extending from the third connection part in a second direction different from the optical axis direction, and a fourth connection part disposed in an end part of the second wiring part and connected to the control unit.

Description

An imaging device in which a movable unit and a control unit are connected together by a flexible board {IMAGE PICKUP APPARATUS WITH MOVABLE UNIT AND CONTROL UNIT CONNECTED TOGETHER BY FLEXIBLE BOARDS}

The present invention relates to an imaging device in which a displaceable movable unit and a control unit are connected together by a flexible substrate.

BACKGROUND ART Electronic devices such as an imaging device in which a movable unit and a control unit, which are displaceably supported by a fixed unit (support unit), and a control unit are connected together by a flexible substrate are conventionally known. For example, in an imaging device having a function of optically correcting blurring of a subject, the blurring of the subject is corrected by displacing a movable unit supporting the imaging element in a direction perpendicular to the optical axis with respect to the fixed unit. do.

A circuit board on which the imaging element is mounted is mounted on the movable unit, and electrical connection parts such as connectors are also mounted on the circuit board. A control unit that drives and controls the movable unit is mounted on a fixed unit such as a case that holds the movable unit, and electrical connection parts such as connectors are also mounted on the control board. The connector in the movable unit and the connector in the fixed unit are electrically connected together by a flexible board. By using the flexibility of this flexible substrate, the fixed unit and the movable unit are electrically connected together, and the movable unit is controlled by a control unit (Japanese Patent Publication No. 2010-192749).

A part of the wiring portion of the flexible substrate can be deformed according to the displacement of the movable unit. However, the reaction force generated by the deformation of the wiring portion acts as a load when driving the movable unit. Depending on the arrangement of the flexible substrate, the balance of the reaction force generated by deformation of the wiring portion may become uneven, and control when driving the movable unit may be complicated. For example, if the movable unit is displaced in a certain direction and a reaction force is generated in a direction orthogonal to the direction in which the movable unit is displaced, control regarding the direction orthogonal to the displacement direction is also required.

In recent years, with the improvement of functions such as high-resolution and high-speed continuous imaging of moving images of an imaging device, the power consumption of the imaging element and the number of connection signals continue to increase. For this reason, the width of the flexible substrate increases, and the load generated from the flexible substrate increases, making the above problem more serious.

In addition, it should be noted that in order to reduce the load, it is possible to reduce the amount of deformation per unit length by increasing the length of the flexible portion of the flexible substrate, thereby reducing the reaction force generated by the deformation. However, this is insufficient for the uniformity of the load, and also increases the space for accommodating the flexible substrate, which makes the imaging device large.

The present invention makes the load applied when the movable unit is displaced almost uniform.

Accordingly, the present invention, an imaging device for converting an optical image of a subject into an electrical signal; A movable unit which holds the imaging element and can be displaced in a direction different from the optical axis direction of the imaging optical system; A control unit having a circuit through which an imaging signal output from the imaging element is transmitted; A first flexible substrate electrically connecting the movable unit and the control unit to each other; And a second flexible substrate electrically connecting the movable unit and the control unit to each other, wherein the first flexible substrate comprises: a first connecting portion connected to the movable unit, and the first A first wiring portion extending in a first direction different from the optical axis direction, and a second connecting portion disposed at an end of the first wiring portion and connected to the control unit, The flexible substrate includes a third connecting portion connected to the movable unit, and a second wiring portion extending from the third connecting portion in a second direction different from the optical axis direction and opposite to the first direction. And a fourth connecting portion disposed at an end of the second wiring portion and connected to the control unit.

According to the present invention, the load applied when the movable unit is displaced is made almost uniform.

Other features of the present invention will become apparent from the description of the following embodiments (with reference to the accompanying drawings).

1A and 1B are perspective views of electronic devices.
Fig. 2 is an exploded perspective view of the main part of the imaging device viewed from the rear (photographer side).
3 is an exploded perspective view of the image blur correction unit.
4 is an exploded perspective view of the image blur correction unit.
5 is a front view showing the configuration of a third flexible substrate.
6 is a rear view of the movable unit to which the first and second flexible substrates are fixed.
7 is a view of the movable unit mounted on the control substrate as viewed from the rear.
8 is a view of the movable unit mounted on the control substrate as viewed from the rear.
9 is a perspective view of the image blur correction unit.
10 is a front view showing a wiring pattern disposed inside the control substrate.
11 is a rear view of the movable unit to which the first and second flexible substrates are fixed.
12 is a perspective view of the image blur correction unit.
13 is a rear view of the movable unit to which the first and second flexible substrates are fixed.
14 is a perspective view of the image blur correction unit.
15 is a side view of the image blur correction unit.
16 is a perspective view of an image blur correction unit in a comparative example.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1A and 1B are perspective views of electronic devices according to a first embodiment of the present invention. As an electronic device to which the present invention is applied, the imaging device 10 is illustrated. As the direction of the imaging device 10, the vertical direction, the front and rear, and the left and right directions are defined based on the direction viewed from the photographer (user). Therefore, FIG. 1A is a perspective view of the imaging device 10 viewed from the front (the subject side), and FIG. 1B is a perspective view of the imaging device 10 viewed from the rear (the photographer side). The imaging device 10 is covered with an exterior 10c that is a case made of a plurality of members. On the front side of the imaging device 10, a mount 10a is provided. An interchangeable lens (imaging optical system), not shown, can be mounted on the mount 10a. A wireless antenna 10b is built in the upper left end of the imaging device 10. The axis passing through the center of the mount 10a roughly corresponds to the imaging optical axis P.

2 is an exploded perspective view of the main part of the imaging device 10 seen from the rear (photographer side). 2, the exterior 10c and the like are not shown. In the drawings subsequent to FIG. 2, for easier understanding, elements necessary for the description of the present invention are shown, and elements not necessary for the description of the present invention are omitted to the extent possible.

The imaging device 10 has a control substrate 100 (control unit), an image blur correction unit 200, a shutter unit 300, and a base member 400. The image blur correction unit 200 is fixed to the base member 400 together with the shutter unit 300. The base member 400 and the control substrate 100 are fixed to the exterior 10c. In the image blur correction unit 200, the shutter unit 300 is held by the base member 400 on which the shutter unit 300 is mounted and fixed. In other words, the image blur correction unit 200 is provided with three screws 600a, 600b, 600c and three coil springs 500a, 500b, 500c to the optical axis P with respect to the base member 400 (FIG. 1A). It is supported displaceable in the direction. The operator can adjust the inclination of the light incident surface of the imaging element 230 (FIG. 3) with respect to the base member 400 by adjusting the amount to which the screws 600a, 600b, 600c are tightened. After the adjustment is completed, the screws 600a, 600b, 600c are glued and fixed to the fixing unit 200b (supporting unit) of the image blur correcting unit 200 to prevent looseness.

In the control board 100, not only the control IC 101 for controlling the imaging signal, but also the connectors 102, 103, and 104 are mounted. In addition, various electronic components such as chip resistors, ceramic capacitors, inductors, and transistors are mounted on the control substrate 100 (not shown). The first flexible substrate 270a and the second flexible substrate 270b which are flexible printed circuit boards extending from the image blur correction unit 200 are connected to the connectors 102 and 103. Therefore, the control substrate 100 and the image blur correction unit 200 are electrically connected together. The connector 104 electrically connects the flexible printed circuit board (not shown) extending from the shutter unit 300 to the shutter unit 300.

3 and 4 are exploded perspective views of the image blur correction unit 200. The image blur correction unit 200 has a movable unit 200a and a fixed unit 200b. The movable unit 200a includes an imaging element 230. The fixing unit 200b is fixed to the base member 400. The movable unit 200a is supported by the fixing unit 200b so as to be displaceable in a plane direction orthogonal to the optical axis P. A function of optically correcting the image blur is realized by the movable unit 200a being displaced in a plane direction orthogonal to the optical axis P.

The fixing unit 200b is mainly composed of a front yoke 210, a base plate 250, and a rear yoke 260. The movable unit 200a is mainly composed of a sensor holder 220 and a third flexible substrate 240. The first flexible substrate 270a and the second flexible substrate 270b connect the movable unit 200a and the control substrate 100 together. The third flexible substrate 240 connects the sensor holder 220 and the control substrate 100 together. The first flexible substrate 270a, the second flexible substrate 270b, and the third flexible substrate 240 are all flexible printed circuit boards having flexibility.

An imaging element 230 is mounted on the imaging element substrate 231. The imaging element 230 converts the optical image of the subject into an electrical signal. The imaging element 230 and the imaging element substrate 231 are adhered and fixed to the sensor holder 220. In the sensor holder 220, a low-pass filter 221 is disposed in front of the imaging element 230. The low-pass filter 221 prevents infrared rays from entering and prevents color moire and the like. Three openings 223a, 223b, and 223c are formed in the sensor holder 220. Three coils 241a, 24lb, and 241c are mounted on the third flexible substrate 240 (FIG. 3). A third flexible substrate 240 is built in from the rear against the sensor holder 220 so as to fit the coils 241a, 24lb, and 241c into the openings 223a, 223b, and 223c, and is adhered and fixed.

Three ball seats 222a, 222b, and 222c are formed in the sensor holder 220 (FIG. 3). In the front yoke 210, ball seats 213a, 213b, and 213c are formed at positions facing the ball seats 222a, 222b, 222c (Fig. 4). The sensor holder 220 and the front yoke 210, to which the imaging element 230 and the imaging element substrate 231 are adhered and fixed, sandwich spheres 215a, 215b, 215c between opposing ball seats. Thus, the spheres 215a, 215b, 215c are supported.

In the front yoke 210, a magnet (not shown) is adhered and fixed at a position facing the sensor holder 220, and a sensor holder 220 is made of a ferromagnetic material (iron or the like) not shown at a position facing the magnet. The sheet produced is attached. When the front yoke 210 and the sensor holder 220 are brought into close proximity to each other until the distance between them reaches a predetermined distance, the sensor holder 220 is magnetically aspirated to the front yoke 210, so that the spheres 215a, 215b , 215c), it is held by the front yoke 210 so as to be displaceable in a plane direction perpendicular to the optical axis P.

Magnets 212a, 212b, 212c are attached to the front yoke 210 at positions facing coils 241a, 24lb, 241c (FIG. 4). Posts 211a, 21lb, and 211c are erected and installed on the base plate 250. One end of each of the posts 211a, 21lb, and 211c is pressed into the base plate 250. The front yoke 210 and the base plate 250 are joined together to fit the sensor holder 220.

In the base plate 250, openings 251a, 25lb, 251c are formed at different positions seen from the direction of the optical axis P, and magnets 261a, 26lb, 261c are fitted to these openings. When viewed in the direction of the optical axis P, the magnets 261a, 26lb, 261c are formed at substantially the same position as the corresponding coils 241a, 24lb, 241c and have the same shape. Moreover, the magnets 261a, 26lb, 261c are arranged at positions where the centers of the corresponding coils 241a, 24lb, 241c coincide.

The operator mounts the rear yoke 260 from the rear on the base plate 250 so that the magnets 261a, 26lb, and 261c fit into the openings 251a, 25lb, 251c. The rear yoke 260 and the base plate 250 are each made of ferromagnetic material. The operator can self-adsorb to each other simply by positioning the rear yokes 260 to which the magnets 261a, 26lb, and 261c are attached to the base plate 250 and contacting each other. Thus, the operator can join these two parts without using any additional adhesive material.

An opening 252 is also formed in the base plate 250. When the sensor holder 220 is sandwiched between the front yoke 210 and the base plate 250, the imaging element substrate 231 is exposed from the rear side from the opening 252. Connectors 232a and 232b are mounted on the imaging element substrate 231 (FIG. 4). The connector 271a is mounted on the first flexible substrate 270a, and the connector 27lb is mounted on the second flexible substrate 270b (FIG. 3). The operator embeds these flexible boards 270a and 270b into the imaging element substrate 231 from the rear through the opening 252, so that the connectors 232a and 271a are fitted together, and the connectors 232b and 27lb are inserted into each other. Fit. The connectors 232a, 232b and the connectors 271a, 27lb have the same relationship as the relationship between the plug connector and the receptacle connector having shapes that fit together.

Each of the first and second flexible substrates 270a and 270b has a long plate shape, and connectors 271a and 27lb are mounted at one end of each of the first and second flexible substrates 270a and 270b. It is done. Connectors 273 and 274 are mounted on the other ends of the first and second flexible substrates 270a and 270b in the wiring direction (longitudinal direction). The connector 273 is a relationship between a plug connector and a receptacle connector having a shape to fit each other, and has the same relationship as the connector 102 (Fig. 2) mounted on the control board 100. Similarly, this connector 274 is a relationship between a plug connector and a receptacle connector having a shape to fit each other, and has the same relationship as the connector 103 (Fig. 2) mounted on the control board 100.

5 is a front view of the third flexible substrate 240. As described above, the coils 241a, 24lb, and 241c are adhered and fixed to the third flexible substrate 240. On the third flexible substrate 240, solder lands 243a, 243b, 243c, 243d, 243e, and 243f for electrically connecting the coil windings are formed. The worker solders the winding start and winding end of the coil 241a to the soldering lands 243a and 243b. Similarly, the operator solders the winding start and winding end of the coil 24lb to the soldering lands 243c and 243d, and also solders the winding start and winding ends of the coil 241c to the soldering lands 243e and 243f. As a result of the soldering, each coil is electrically connected to the third flexible substrate 240.

In the third flexible substrate 240, hall elements 242a, 242b, and 242c are mounted inside the windings of the coils 241a, 24lb, and 241c. The third flexible substrate 240 has a connector terminal portion 244. The wiring pattern from each solder land and each hall element is disposed inside the third flexible substrate 240, and is connected to a connector terminal portion not shown. The connector terminal portion 244 is electrically connected to connectors mounted on the control board 100.

Thus, coils 241a, 24lb, 241c are disposed in a magnetic field environment formed of magnets 212a, 212b, 212c disposed on the front yoke 210 and magnets 261a, 26lb, 261c disposed on the rear yoke 260. . By passing an electric current through these coils, a Lorentz force is generated in each coil, and the force acts as a driving force that causes the sensor holder 220 to be displaced in a plane direction perpendicular to the optical axis P. The change in magnetic force caused by the sensor holder 220 moving relative to the magnets 212a, 212b, 212c by the Hall elements 242a, 242b, 242c mounted inside the coils 241a, 24lb, 241c. Is detected. Based on the detection result, the displacement amount in the plane direction orthogonal to the optical axis P of the movable unit 200a with respect to the fixed unit 200b is detected.

Now, a detailed configuration of the first and second flexible substrates 270a and 270b will be described. For convenience, according to the definition of the above direction, the coil 241c is located in the lower left and the coil 241a is located in the upper right with respect to the imaging element 230. In the control board 100 (FIG. 2), the connectors 102 and 104 are mounted on the bottom, and the connector 103 is mounted on the top. In the control board 100, the connectors 102, 103, and 104 are mounted on the rear side. In the imaging element substrate 231, the connectors 232a and 232b are mounted on the rear side.

In order to correct the image blur in the pitch direction, which is the direction of rotation about the left and right directions, the movable unit 200a translates in the vertical direction. In order to correct the image blur in the yaw direction, which is the direction of rotation in the vertical direction, the movable unit 200a is translated in the left-right direction (predetermined direction). In order to correct the image blur in the roll direction, which is the direction of rotation around the front-rear direction, the movable unit 200a rotates around an axis parallel to the front-rear direction.

6 to 9, the configuration of the first and second flexible substrates 270a and 270b will be described. 6 is a rear view of the movable unit 200a to which the first and second flexible substrates 270a and 270b are fixed. 7 and 8 are views showing the state in which the movable unit 200a is mounted on the control substrate 100 from the rear. In particular, Fig. 7 shows a state in which the connectors 273 and 274 of the first and second flexible boards 270a and 270b are not connected to the connectors 102 and 103 of the control board 100, and in Fig. 8, the connector 273 , And 274 are connected to the connectors 102 and 103. 9 is a perspective view of the image blur correction unit 200.

The connectors 271a and 27lb (FIG. 3) and the connectors 232a and 232b (FIG. 4) are connected to each other, so that the first and second flexible substrates 270a and 270b are electrically connected to the imaging element substrate 231, and also a connector. 271a and 27lb are fixed to the movable unit 200a.

The first and second flexible substrates 270a and 270b are divided into roughly three regions, that is, two rigid bodies (connecting portions) and one flexible portion (wiring portion) connecting the rigid bodies together. . The rigid body (connection part) has a rigidity by bonding an insulating reinforcement material such as glass epoxy resin to the flexible part (wiring part) with a thermosetting adhesive, and connectors are mounted on the surface of the flexible part (wiring part).

As shown in Fig. 6, the first flexible substrate 270a, in order from the side closest to the connector 271a (Fig. 3) in the wiring direction (longitudinal direction), is the first connecting portion 275a, the first It has a wiring part 276, and a second connecting part 278. The first wiring portion 276 extends downward (in the first direction) from the first connecting portion 275a. The connector 271a is disposed at the first connecting portion 275a, and the connector 273 is disposed at the second connecting portion 278.

The second flexible substrate 270b, in order from the side closest to the connector 27lb (Fig. 3) in the wiring direction (longitudinal direction), is the third connecting portion 275b, the second wiring portion 277, and the second It has 4 connecting parts 279. The second wiring portion 277 extends from the third connecting portion 275b upward (in the second direction) opposite to the lower side (the first direction). The connector 27lb is disposed at the third connecting portion 275b, and the connector 274 is disposed at the fourth connecting portion 279.

In the first connection portion 275a, the third connection portion 275b, the second connection portion 278, and the fourth connection portion 279, an insulating reinforcement material such as glass epoxy resin is used as a thermosetting adhesive to form a flexible portion (wiring portion) ) To give rigidity. The board-to-board connectors (connectors 271a, 27lb, 273, 274) are mounted on the surface opposite to the surface to which the reinforcing material is bonded at these connecting portions.

As shown in FIG. 6, in the wiring direction of the first flexible substrate 270a, the first wiring portion 276 is between the first connecting portion 275a and the second connecting portion 278. Are placed in the area. The first wiring portion 276 has flexibility and electrically connects the connectors 271a and 273 together. In the wiring direction of the second flexible substrate 270b, the second wiring portion 277 is disposed in an area between the third connecting portion 275b and the fourth connecting portion 279. The second wiring portion 277 has flexibility and electrically connects the connector 27lb and the connector 274 together.

As shown in Fig. 8, a first cut 107a is formed on the lower side (edge in the first direction) of the control substrate 100. A second cut portion 107b is formed on an upper side (edge in the second direction) of the control substrate 100. The first wiring portion 276 of the first flexible substrate 270a is wired through the first cutting portion 107a, and the second wiring portion 277 of the second flexible substrate 270b is made of It is wired through the cutting part 107b of 2. In other words, the first wiring portion 276 extends downward from the first connecting portion 275a, then curves backward, passes through the first cutting portion 107a, and extends upward. Then, the connector 273 is fitted to the connector 102. On the other hand, the second wiring portion 277 extends upward from the third connecting portion 275b, then curves backward, passes through the second cutting portion 107b, and extends downward. Then, the connector 274 is fitted to the connector 103.

The 2nd wiring part 277 and the 1st wiring part 276 are comprised so that wiring may be carried out in the way which surrounds the upper and lower parts of the control board 100. The 2nd wiring part 277 and the 1st wiring part 276 are routed to the two upper and lower routes which are the pitch direction of the phase blur vibration, ie, the translation direction of the movable unit 200a. By routing the second wiring unit 277 and the first wiring unit 276 in those directions, when moving the movable unit 200a in the right direction and when moving the movable unit 200a in the left direction , The load caused by the deformation of the first and second flexible substrates 270a and 270b can be brought closer to uniformity. Now, this will be described in comparison with a comparative example (Fig. 16).

16 is a perspective view of an image blur correction unit 800 in a comparative example. The image blur correction unit 800 has one flexible substrate 870 instead of the first and second flexible substrates 270a and 270b as compared to the image blur correction unit 200 (FIG. 9), and instead of the imaging element substrate 231, the imaging element substrate 831. The flexible substrate 870 corresponds to the combination of the first and second flexible substrates 270a and 270b. The flexible substrate 870 has a connection portion 875, a wiring portion 876, and a connection portion 878. Connectors are connected to the connector 875 of the imaging element substrate 831 (corresponding to connectors 232a and 232b), and connected to connectors 878 of connectors (corresponding to connectors 102 and 103) of the control board 100. Connectors are mounted. In the image blur correction unit 200 (Fig. 9), the first wiring portion 276 and the second wiring portion 277 extend in opposite directions in the vertical direction. On the other hand, in the comparative example, the wiring portion 876 of the flexible substrate 870 extends only in one direction downward from the connector connected to the imaging element substrate 831.

Now, control of the load generated by deformation of each flexible substrate and the movable unit 200a will be described. Consider the case where the movable unit 200a moves to the left. In this embodiment, when the movable unit 200a moves to the left, the forces Ｆｘ and 의 in the right direction are generated as reaction forces generated by the first and second flexible substrates 270a and 270b, respectively. As for the up-down direction, a force Ｆyara upward as a reaction force of the first flexible substrate 270a and a force Ｆy downward downward as a reaction force of the second flexible substrate 270b are generated.

However, since the first and second flexible substrates 270a and 270b are routed separately to the two roots in the up and down directions, the magnitudes of the force? Y and the force? Y are almost the same. Therefore, it is possible to balance the load in the vertical direction. Therefore, the loads of the first and second flexible substrates 270a and 270b occur substantially only in the right direction, and their magnitudes are the sum of the forces Ｆｘa and Ｆｘｂ. Since the load in the vertical direction becomes almost zero, the movable unit 200a can be easily controlled because it needs to be driven and controlled only in the left and right directions.

On the other hand, in the comparative example (Fig. 16), when the movable unit 200a is moved to the left, a force in the right direction is generated as a reaction force generated by the flexible substrate 870. Force Ｆy occurs in the downward direction. Since the wiring portion 876 is routed only in one direction, the combination of the force and force Ｆy acts on the movable unit 200a. Therefore, since the movement of the movable unit 200a is required not only for driving control in the left and right directions, but also in the vertical direction, it becomes complicated to control the movement of the movable unit 200a. Specifically, by passing a current through the coil 241c of the movable unit 200a, a Lorentz force is generated in the coil 241c to generate upward thrust Ry for canceling the reaction force of the flexible substrate 870. Need to do.

Since the movable unit 200a receives the force of the flexible substrate 870 at a lower position away from the optical axis P, a rotational moment around an axis parallel to the optical axis P acts on the movable unit 200a. Therefore, it is necessary to prevent the rotation of the movable unit 200a by controlling the magnitude of the propulsive force Rpa and Rv by differentizing the Lorentz force generated in the coils 241a and 24lb. Also in this regard, there is a possibility that the movement control of the movable unit 200a is complicated.

In addition, according to the comparative example, the magnets and coils required to control the movable unit 200a with high precision increase, resulting in the enlargement of the imaging device 10, and the power consumption required for control will also increase. In this embodiment, the first and second flexible substrates 270a and 270b are routed to two opposite routes, which contributes to miniaturization of the imaging device 10 and reduction of power consumption.

As shown in FIG. 6, in the wiring direction of the first flexible substrate 270a, the first wiring portion 276 is separated from the boundary between the first wiring portion 276 and the first connecting portion 275a. It is assumed that the length to the boundary with the second connecting portion 278 is the length L1 of the first wiring portion 276. In the wiring direction of the second flexible substrate 270b, from the boundary between the second wiring portion 277 and the third connecting portion 275b, the second wiring portion 277 and the fourth connecting portion 279 Let the length to the boundary be the length L2 of the 2nd wiring part 277. In the vertical direction, the length from the optical axis P to the boundary between the first connecting portion 275a and the first wiring portion 276 is L3, and the optical axis P to the third connecting portion 275b and the second wiring portion. The length to the boundary with (277) is called L4. In the left-right direction, the width of the first wiring portion 276 is called W1, and the width of the second wiring portion 277 is called W2.

In order to make the loads caused by the deformation of the first and second flexible substrates 270a and 270b more uniform, it is preferable that the lengths L1 and L2 are about the same length and that the lengths L3 and L4 are approximately the same. In addition, it is preferable that the width W1 and the width W2 are approximately the same. At least, it is preferable that the first wiring portion 276 of the first flexible substrate 270a and the second wiring portion 277 of the second flexible substrate 270b have substantially the same length and width. By doing this, the load caused by the deformation of the first and second flexible substrates 270a and 270b can be made more uniform, further contributing to miniaturization of the imaging device 10 and reduction of power consumption.

8 is a diagram of an initial state in which the movable unit 200a is not displaced. In this initial state, the distance between the first wiring portion 276 and the first cutting portion 107a in the left-right direction is referred to as X1 on the left side and X2 on the right side. In other words, the width of the cut portion in the left-right direction of the first cut portion 107a is the width + X1 + X2 of the first wiring portion 276. On the other hand, the distance between the position of the first cut portion 107a in the depth direction and the lowermost end of the curved inner surface of the first wiring portion 276 is referred to as Y1. The distance between the bottom position of the outermost shape of the control substrate 100 and the bottom position of the first cut portion 107a is set to Y2.

Even if the movable unit 200a is displaced as much as possible with respect to the fixed unit 200b, the first wiring portion 276 does not contact the left and right edges of the first cut portion 107a and the upper edge, so that the gap X1 , X2, Y1 are set. Even when the movable unit 200a is displaced as much as possible with respect to the fixed unit 200b, since the first wiring portion 276 does not protrude from the first cutting portion 107a, it fits in the outermost shape of the control substrate 100 Interval Y2 is set.

First, in order to correct the image blur in the yaw direction, the movable unit 200a is translated in the left and right directions. The interval X1 is set to a value greater than the maximum amount of translational movement of the movable unit 200a to the left from the state where the center of the movable unit 200a corresponds to the optical axis P (initial state). The interval X2 is set to a value greater than the maximum amount of translational movement in the right direction of the movable unit 200a from the initial state. In order to correct the image blur in the pitch direction, the movable unit 200a is translated in the vertical direction. The interval Y1 is set to a value greater than the maximum amount of translational movement in the upward direction of the movable unit 200a from the initial state. The interval Y2 is set to a value greater than the maximum amount of translational movement in the downward direction of the movable unit 200a from the initial state.

The positional relationship between the second cutting portion 107b and the second wiring portion 277 is also determined similarly to the positional relationship between the first cutting portion 107a and the first wiring portion 276. Therefore, even when the movable unit 200a is displaced as much as possible with respect to the fixed unit 200b, the second wiring portion 277 does not contact the left and right edges of the second cut portion 107b and the lower edge. In addition, even when the movable unit 200a is displaced as much as possible with respect to the fixed unit 200b, since the second wiring portion 277 does not protrude from the second cutting portion 107b, the outermost shape of the control substrate 100 Is put on.

Next, a wiring pattern disposed inside the imaging device 10 will be described with reference to Figs. 10 is a front view showing a wiring pattern disposed inside the control substrate 100.

The first flexible substrate 270a is formed with a high-speed transmission wiring that is electrically connected from the connector 271a (FIG. 3) to the connector 273 (FIG. 6) through the first wiring unit 276. This high-speed transmission wiring is a pair of two signal lines using, for example, a transmission method such as Low Voltage Differential Signaling (LDBS). The imaging device 10 transmits an imaging signal between the imaging element 230 and the control substrate 100 using this high-speed transmission wiring, thereby supporting high-speed transmission of the imaging signal. In addition to the high-speed transmission wiring, the first flexible substrate 270a is also provided with ground wiring, wiring required for the imaging element 230, and the like.

The second flexible substrate 270b is formed with a power supply wiring that is electrically connected from the connector 27lb (Fig. 3) to the connector 274 (Fig. 6) through the second wiring portion 277. In addition to the power supply wiring, ground wiring, wiring required for the imaging element 230, and the like are also wired to the second flexible substrate 270b. In this embodiment, the differential transmission wiring is employed as the high-speed transmission wiring provided in the first wiring unit 276. Connectors 273 and 274 are configured to have two lines of signal terminals parallel to each other, such as connectors 271a and 27lb.

The first and second flexible substrates 270a and 270b have a multi-layer structure, and in this embodiment, a two-layer structure. Connectors 273 and 274 are mounted on the surfaces opposite to the surfaces on which the connectors 271a and 27lb are mounted on the first and second flexible boards 270a and 270b. The high-speed transmission wiring extends from the signal terminal line of connector 271a, and is electrically connected to one of two parallel signal terminal lines of connector 273, which are arranged rearward as viewed from connector 271a. Specifically, after passing through the rear surface of the connector 273 mounting surface, the high-speed transmission wiring is electrically connected to a transmission path wired to the mounting surface of the connector 273 through a through hole, and viewed from the connector 271a. It connects with the signal terminal arrange | positioned at the rear terminal line.

As shown in Fig. 10, on the upper right side of the connector 102 mounted on the control board 100, a control IC 101 that forms a rectangular package outer shape is mounted. A plurality of signal terminals are formed on the control IC 101, and these signal terminals are soldered to the control substrate 100 to be bonded and electrically connected to the control substrate 100. The control IC 101 is a circuit through which an imaging signal output from the imaging element 230 is transmitted. As the high-speed transmission wiring 105 that is electrically connected from the connector 102 to a part of the signal terminal of the control IC 101, three pairs of differential transmission wirings are provided. The high-speed transmission wiring 105 is electrically connected to the high-speed transmission wiring provided inside the first flexible substrate 270a through connectors 273 and 102. The high-speed transmission wiring 105 forms a differential transmission path similar to the high-speed transmission wiring provided on the first flexible substrate 270a. In addition to the high-speed transmission wiring 105, various signal wirings and ground wirings are provided on the control board 100, but are omitted in FIG.

Generally, in a high-speed transmission path, when a plurality of electrical signals requiring synchronization are transmitted, the appearance wiring is such that the length of each of the wirings through which the plurality of electrical signals are transmitted is the same so that the difference in delay time due to the wiring is sufficiently small. It is desirable to do. Further, it is preferable that the signal line is designed as short as possible so as not to be affected by noise or the like. In order to shorten the route from the image blur correction unit 200 to the control IC 101 mounted on the control board 100, the connector 102 of the control board 100 and the control IC 101 are disposed as close as possible to each other. It is preferred. The control IC 101 may be disposed on the left or right side of the connector 102 of the control board 100, which can further shorten the wiring length of the high-speed transmission wiring.

Also, in a high-speed transmission line, electromagnetic noise may occur from the high-speed transmission wiring. Since the high-speed transmission wiring is provided on the first flexible substrate 270a, electromagnetic noise is mainly generated from the connector 271a mounted on the first connection portion 275a, and the connector 273 mounted on the second connection portion 278. Occurs. When electromagnetic noise is generated, electromagnetic noise propagates in the imaging device 10 and affects the wireless antenna 10b (FIGS. 1A and 1B) embedded in the imaging device 10, thereby deteriorating wireless performance. .

As described above, the wireless antenna 10b is disposed near the exterior 10c at the left end of the upper portion of the imaging device 10. In this embodiment, the first flexible substrate 270a, which generates more electromagnetic noise than the second flexible substrate 270b, is disposed on the side (right) far from the placement position of the wireless antenna 10b. In other words, the placement position of the connector 102 is away from the wireless antenna 10b. In addition, with respect to the first flexible substrate 270a, the first wiring portion 276 is extended to the lower side of the control substrate 100 and then curved back, so that the connector 273 is connected to the connector 102. Accordingly, the influence on the wireless antenna 10b can be reduced.

Note that when considering the distance from the wireless antenna 10b, when it is difficult to compare the positions of the first flexible substrate 270a and the second flexible substrate 270b, the center positions of both may be compared. Should be. Alternatively, assuming that the first flexible substrate 270a generates more electromagnetic noise than the second flexible substrate 270b, when considering the distance from the wireless antenna 10b, it must be established in the assembled state. As conditions, at least one of the following conditions may be employed. The above conditions include the condition that "the connector 273 is further away from the wireless antenna 10b than the connector 274" and the condition that "the connector 271a is further away from the connector 27lb wireless antenna 10b". The above conditions also include, "The first flexible substrate 270a is a control substrate located farther away from the wireless antenna 10b than the other sides of the control substrate 100, compared to the second flexible substrate 270b. The condition is that it is deployed via one side of (100).

The control substrate 100 has a multi-layered structure. As the control substrate 100, for example, a build-up substrate formed by stacking build-up layers on both sides of a plurality of core layers, or all the laminates may have a connection structure using interlayer vias. The ANN-LABAER substrate is employed. The high-speed transmission wiring 105 is configured such that the wiring extends from the signal terminal line of the connector 102 to the surface layer of the control board 100 and is directly connected to some of the signal terminals of the control IC 101. In order to stack a plurality of conductor layers while making the thickness of the substrate of the control substrate 100 relatively thin, the clearance between adjacent conductor layers becomes closer. When such a structure is employed, when a high-speed transmission path is wired to a layer, only the ground plane is formed in areas overlapping the high-speed transmission path when projected onto the plane on both sides of the conductor layer adjacent to the layer. Alternatively, by taking measures such as etching removal of all or part of the conductor layer, the impedance of the high-speed transmission path can be appropriately controlled.

This measure limits the wiring of the substrate by occupying a certain amount of area of the conductor layer. Since the control IC 101 is an IC that controls the imaging signal, and many signal lines and power lines are connected to the signal terminals of the control IC 101, the wiring density of the region overlapping the control IC 101 is often very high. . By installing the high-speed transmission wiring 105 using the surface layer of the control substrate 100, measures to keep the high-speed transmission path constant constant need only be taken for one conductive layer, which is one inner layer. Increase the flexibility of the substrate wiring.

According to this embodiment, the first wiring portion 276 of the first flexible substrate 270a extends downward (first direction) orthogonal to the photographing optical axis P from the first connecting portion 275a. . On the other hand, the second wiring portion 277 of the second flexible substrate 270b is orthogonal to the imaging optical axis P from the third connecting portion 275b and opposite to the downward direction (first direction). 2). In other words, since the first wiring unit 276 and the second wiring unit 277 extend in opposite directions in the vertical direction, the load on the movable unit 200a is displaced when the movable unit 200a is displaced. It can be made almost uniform.

For this reason, movement control of the movable unit 200a is not complicated, and power consumption is also reduced. In addition, since it is not necessary to design the first and second flexible substrates 270a and 270b so that the deformation amount per unit length is excessively small, the imaging device 10 is miniaturized.

Moreover, the 1st cut part 107a and the 2nd cut part 107b respectively formed in the lower side and the upper side of the control board 100 are the 1st wiring part 276 and the 2nd wiring part. (277) has passed. Even when the movable unit 200a is displaced as much as possible, the first wiring portion 276 and the second wiring portion 277 do not contact the first cutting portion 107a and the second cutting portion 107b, When the movable unit 200a is displaced, it is avoided that an unexpected load acts on the movable unit 200a.

Also, even when the movable unit 200a is displaced as much as possible, the first wiring portion 276 and the second wiring portion 277 do not protrude from the first cutting portion 107a and the second cutting portion 107b. Without being fitted to the outermost shape of the control substrate 100. Accordingly, the control substrate 100 and the exterior 10c can be designed so that only a small gap remains therebetween, which contributes to the miniaturization of the imaging device 10.

In addition, since the first flexible substrate 270a, which generates more electromagnetic noise than the second flexible substrate 270b, is disposed far away from the wireless antenna 10b, the degradation of wireless performance is avoided.

In order to make the magnitudes of the reaction forces generated by the first flexible substrate 270a and the second flexible substrate 270b approximately equal, the thicknesses of the first wiring portion 276 and the second wiring portion 277 and those From the viewpoint of the bending stiffness including the length and width of the reaction force may be determined. For example, the thickness of the wiring paths of the first and second flexible substrates 270a and 270b are individually designed, and the thickness of the second flexible substrate 270b is increased under the condition that the cross-sectional area is fixed. You can also reduce the width. Accordingly, the load of the second flexible substrate 270b is made equal to the first flexible substrate 270a. For this reason, it is possible to change the width without changing the maximum rated current value of the second flexible substrate 270b.

Note that the connector 103 is disposed on the upper left side of the connector 102 (FIG. 2), but may be disposed on the upper right side of the connector 102. The connector 102 is disposed below the control board 100 so as to be separated from the wireless antenna 10b, but depending on the position of the wireless antenna 10b, the connector 102 is in the vertical direction or the horizontal direction from the wireless antenna 10b. It may be placed away. Accordingly, the positions of the connectors 102 and 103 can be changed in various ways.

It should be noted that the first and second flexible substrates 270a and 270b and the third flexible substrate 240 need not be configured as separate units, but may be configured as an integral unit.

In FIG. 10, it should be noted that although signal terminals are arranged at substantially regular and regular intervals with respect to the package side of the control IC 101, the signal terminals of the package must not necessarily be arranged as shown in FIG.

  The signal terminals may be arranged so that the signal terminals can be connected to the surface wiring of the control board 100, or may be arranged irregularly. In addition, a plug connector and a receptacle connector are not necessarily employed as parts for connecting the boards together. Instead of the connectors 273 and 274 of the first and second flexible boards 270a and 270b, connector terminal portions are formed, and a connector compatible with the connector terminal portions may be mounted on the control board 100. It should be noted that the connectors 232a and 232b (Fig. 4) and the connectors 271a and 27lb (Fig. 3) are not plural, and the present invention is not limited to this. For example, a plurality of connectors are mounted on each of the first and second flexible substrates 270a and 270b, a plurality of connectors are mounted on the imaging element substrate 231, and corresponding connectors of the mounted connectors are You may connect with each other.

From the viewpoint of uniformizing the load on the movable unit 200a, the image blur correction unit 200 may be rotated 90 degrees, so that the first wiring unit 276 and the second wiring unit 277 are in the left-right direction. Therefore, it should be noted that they extend in opposite directions.

The second embodiment of the present invention is the same as the first embodiment except for the configuration of the first and second flexible substrates and the configuration of the rear yoke. A second embodiment will be described with reference to Figs. For components such as those in the first embodiment, the same reference numerals are used, and detailed descriptions thereof are omitted.

11 is a rear view of the movable unit 200a to which the first and second flexible substrates are fixed. 12 is a perspective view of the image blur correction unit 700. The image blur correction unit 700 corresponding to the image blur correction unit 200 corresponds to the first flexible substrate 270a and the second flexible substrate 270b, respectively, and the first flexible substrate 770a and the second flexible It has a substrate 770b. The image blur correction unit 700 has a rear yoke 265 corresponding to the rear yoke 260. The rear yoke 265 has a flat plate shape, and its outer shape is a U-shaped square seen from the direction of the optical axis P.

The 1st flexible board | substrate 770a is the 1st connection part 775a, the wiring part 776, the wiring part 780, in order from the side closest to the connector 271a (FIG. 3) in a wiring direction (longitudinal direction). And a second connection portion 782. The connector 271a is disposed at the first connecting portion 775a, and the connector 273 is disposed at the second connecting portion 782. Compared to the first flexible substrate 270a, the first connection portion 775a corresponds to the first connection portion 275a, and the wiring portion 776 and the wiring portion 780 correspond to the first wiring portion 276. , The second connection portion 782 corresponds to the second connection portion 278.

The 2nd flexible board | substrate 770b is the 3rd connection part 775b, the wiring part 777, the wiring part 781, in order from the side closest to the connector 27lb (FIG. 3) in a wiring direction (longitudinal direction), And a fourth connection portion 783. The third connecting portion 775b corresponds to the third connecting portion 275b, the wiring portion 777 and the wiring portion 781 correspond to the second wiring portion 277, and the fourth connecting portion 783 is the fourth Corresponds to the connection portion 279.

The wiring portion 776 of the first flexible substrate 770a extends upward from the first connecting portion 775a orthogonal to the imaging optical axis P. The wiring portion 777 of the second flexible substrate 770b extends downward from the third connecting portion 775b orthogonal to the imaging optical axis P and opposite to the upper side.

The wiring which is electrically connected to the first flexible substrate 770a from the connector 271a mounted on the first connection portion 775a to the connector 273 mounted on the second connection portion 782 through the wiring portion 776 and the wiring portion 780. A furnace is formed. The wiring which is electrically connected to the second flexible substrate 770b from the connector 27lb mounted on the third connecting portion 775b to the connector 274 mounted on the fourth connecting portion 783 through the wiring portion 777 and the wiring portion 781 A furnace is formed.

The first fixing portion 778 is formed in the middle of the wiring portion between the first connecting portion 775a and the second connecting portion 782 in the wiring direction of the first flexible substrate 770a. . In other words, the first fixing portion 778 is provided between the wiring portion 776 and the wiring portion 780 and is fixed to the rear yoke 265. On the other hand, a second fixing portion 779 is formed in the middle of the wiring portion between the third connecting portion 775b and the fourth connecting portion 783 in the wiring direction of the second flexible substrate 770b. It is done. In other words, the second fixing portion 779 is provided between the wiring portion 777 and the wiring portion 781 and is fixed to the rear yoke 265. In the first fixing portion 778 and the second fixing portion 779, holes for aligning the rear yoke 265 are formed. The operator uses the jig or the like to position the first and second fixing parts 778 and 779 with respect to the corresponding holes of the rear yoke 265, and then fixes them to the rear yoke 265. Since the first and second fixing portions 778 and 779 are fixed to the rear yoke 265, the positions of the first and second fixing portions 778 and 779 and the first and second fixing portions 778 and The area on the second connection portion 782 side of the 779) and the region on the fourth connection portion 783 side are not displaced.

The wiring portion 776 is bent a predetermined amount, and in this state, the first fixing portion 778 is fixed to the rear yoke 265 to keep the wiring portion 776 bent. Similarly, the wiring portion 777 is bent a predetermined amount, and in this state, the second fixing portion 779 is fixed to the rear yoke 265 to keep the wiring portion 777 bent. The amount of bending of the wiring portions 776 and 777 may remain in a predetermined amount of bending without increasing the wiring portions 776 and 777 when the movable unit 200a is displaced at a position farthest from the optical axis P.

In the left-right direction, the distance between the wiring portion 776 and the wiring portion 777 is equal to or greater than the maximum amount of translational movement in the left-right direction of the movable unit 200a. This prevents the wiring portion 776 and the wiring portion 777 from interfering with each other and affecting the load during image blur correction.

As described above, the wiring portion 776 and the wiring portion 777 are routed to the upper and lower 2 routes, which are the translation directions of the movable unit 200a. Therefore, as in the first embodiment, when the movable unit 200a is moved in the right direction and in the left direction, the load generated by the deformation of the first and second flexible substrates 770a and 770b is reduced. You can do almost the same. Further, when the movable unit 200a is moved upward and downward, the load generated by the deformation of the first and second flexible substrates 770a and 770b can be made substantially uniform.

The length from the boundary between the first connecting portion 775a and the wiring portion 776 to the first fixing portion 778 is L5. The length from the boundary between the third connecting portion 775b and the wiring portion 777 to the second fixing portion 779 is L6. The length from the optical axis P to the boundary between the first connecting portion 775a and the wiring portion 776 is L7, and the length from the optical axis P to the boundary between the third connecting portion 775b and the wiring portion 777 is L8. The width of the wiring portion 776 in the left-right direction is set to W3, and the width of the wiring portion 777 is set to W4, respectively.

In order to make the loads caused by the deformation of the first and second flexible substrates 770a and 770b more uniform, it is preferable that the lengths L5 and L6 are approximately the same length and the lengths L7 and L8 are approximately the same length. Do. It is also preferable that the widths W3 and W4 are approximately the same length. At least, it is preferable that the wiring portion 776 and the wiring portion 777 have substantially the same length and width. Accordingly, the load caused by the deformation of the first and second flexible substrates 770a and 770b is made to be almost the same, further contributing to miniaturization of the imaging device 10 and reduction of power consumption.

According to this embodiment, the wiring portion 776 and the wiring portion 777 extend in opposite directions in the vertical direction. Therefore, from the viewpoint of making the load applied when the movable unit 200a displaces almost uniform, the same effect as in the first embodiment can be obtained.

Further, the wiring portion 776 and the wiring portion 777 are mainly bent, and the region on the second connection portion 782 side of the fixing portions 778 and 779 and the region on the fourth connection portion 783 side are hardly bent. Therefore, it is not necessary to form the cutting portions 107a and 107b of the control substrate 100 with margin taking into account the maximum displacement of the movable unit 200a. This is also advantageous for increasing the substrate area of the control substrate 100, making the length of the high-speed transmission path wired inside the first flexible substrate 770a the same, and forming the wiring portion 780 in an appropriate shape. Therefore, it is possible to improve the flexibility of the arrangement and wiring of the control substrate 100 while ensuring high transmission quality of the high-speed transmission path.

It should be noted that the first fixing portion 778 and the second fixing portion 779 are not directly fixed to the rear yoke 265, but may be fixed through separate holding members or the like. In this case, the retaining member may have a cylindrical positioning portion, and the positioning portion is fitted into the holes formed in the first and second fixing portions 778 and 779.

It should be noted that the load caused by deformation may be reduced in the wiring portions 776 and 777, for example, by forming slits in a direction parallel to the wiring path. It is advantageous to control the image blur correction unit 700 with high precision.

The third embodiment of the present invention is the same as the second embodiment except for the configuration of the first and second flexible substrates. This embodiment will be described with reference to Figs. For the same components as the imaging device 10 according to the second embodiment, the same reference numerals are designated, and detailed description thereof is omitted. At this time, some reference numerals are omitted in FIGS. 13, 14, and 15.

13 is a rear view of the movable unit 200a to which the first and second flexible substrates are fixed. 14 is a perspective view of the image blur correction unit. Fig. 15 is a side view of the image blur correction unit in Fig. 14 seen from the left direction.

The image blur correction unit 900 corresponds to the image blur correction unit 700. As shown in FIG. 13, the image blur correction unit 900 has a first flexible substrate 970a and a second flexible substrate 970b, respectively, corresponding to the first flexible substrate 770a and the second flexible substrate 770b. Compared to the first flexible substrate 770a, the wiring portion 976 and the first connecting portion 975a of the first flexible substrate 970a respectively correspond to the wiring portion 776 and the first connecting portion 775a. Compared with the second flexible substrate 770b, the wiring portion 977 and the third connecting portion 975b of the second flexible substrate 970b correspond to the wiring portion 777 and the third connecting portion 775b, respectively.

The connector 271a is disposed on the first connecting portion 975a, and the connector 27lb is disposed on the third connecting portion 975b. The first connection portion 975a of the first flexible substrate 970a and the third connection portion 975b of the second flexible substrate 970b are enlarged due to wiring routing and viewed from the rear (optical axis direction) Sometimes they may overlap each other. When the first connecting portion 975a and the third connecting portion 975b overlap with each other, as described later, it is necessary to shift the arrangement positions of both in the direction parallel to the imaging optical axis P.

In this embodiment, for example, by setting the height (thickness) of the connector 271a higher than the connector 27lb, both the first connection portion 975a and the third connection portion 975b can be arranged. Therefore, in the optical axis direction, the third connecting portion 975b is farther away from the control substrate 100 than the first connecting portion 975a (closer to the movable unit 200a). Meanwhile, as illustrated in FIG. 15, an obstacle 990 may be disposed between the control substrate 100 and the image blur correction unit 200. In FIG. 14, the obstruction object 990 is omitted for simplicity of explanation. The obstacle 990 is, for example, a member having functions such as heat dissipation of the control substrate 100.

The wiring portion 977 of the second flexible substrate 970b has a curved portion 977R and passes between the third connection portion 975b and the obstacle 990 and extends toward the control substrate 100. The wiring portion 976 of the first flexible substrate 970a has a curved portion 976R and passes between the first connection portion 975a and the obstacle 990 and extends toward the control substrate 100. Here, the distance between the third connecting portion 975b and the obstacle 990 is longer than the distance between the first connecting portion 975a and the obstacle 990. The radius of curvature of the curved portion 977R of the wiring portion 977 is larger than the radius of curvature of the curved portion 976R of the wiring portion 976.

Here, the thicknesses of the first and second flexible substrates 970a and 970b are preferably approximately the same, but since the second flexible substrate 970b is a power supply wiring, the thickness may be designed to be thick. In this embodiment, it is said that the second flexible substrate 970b is thicker than the first flexible substrate 970a.

When the obstacle 990 and the image blur correction unit 200 are positioned close to each other, the first and second flexible substrates 970a and 970b contact the obstacle 990 when the movable unit 200a is operated. There is a possibility that it may work. In addition, since the second flexible substrate 970b, which is thicker than the first flexible substrate 970a, is harder to deform than the second flexible substrate 970b, the first and second flexible substrates 970a and 970 ' The load on the load will not be the same.

However, since the distance from the third connecting portion 975b in the optical axis direction to the obstacle 990 is longer than the distance from the first connecting portion 975a in the optical axis direction to the obstacle 990, the curved portion 977R It is possible to design the radius of curvature larger than the radius of curvature of the curved portion 976R. Accordingly, it is possible to make the reaction forces generated by the deformations of the respective wiring portions 976 and 977 almost the same.

According to this embodiment, when the movable unit 200a is displaced, the same effects as those of the first and second embodiments are obtained from the viewpoint of making loads applied to the first and second flexible substrates 970a and 970b substantially the same. Can be obtained.

In addition, since the first connecting portion 975a and the third connecting portion 975b overlap each other, even if the areas of the first and third connecting portions 975a and 975b are designed to be large, in a direction perpendicular to the optical axis direction Secure sufficient installation space.

Further, since the third connecting portion 975b is farther away from the control substrate 100 than the first connecting portion 975a, the radius of curvature of the curved portion 977R is larger than that of the curved portion 976R. Therefore, even when the second flexible substrate 970b is thicker than the first flexible substrate 970a, it is possible to make the reaction forces generated by the deformation of the respective wiring portions 976 and 977 almost the same.

It should be noted that, in the present embodiment, the positions of the first and third connecting portions 975a and 975b in the optical axis direction are different by changing the height (thickness) of the connector 271a and the connector 27lb. However, the present invention is not limited to this, and the heights (thicknesses) of the connectors 232a and 232b mounted on the imaging element substrate 231 may be different. Alternatively, the height (thickness) of the connector 271a and the connector 27lb may be different, or the height (thickness) of the connector 232a and the connector 232b may be different.

It should be noted that from the viewpoint of balancing the load, it is desirable to make the placement position of the thicker connection portion of the first and second flexible substrates 970a and 970b further away from the control substrate 100. Therefore, the arrangement position of the connecting portion and the thickness of the flexible substrate may be reversed from the relationship exemplified in this embodiment.

It should be noted that, in the present embodiment, the arrangement position of the connecting portion and the thickness of the flexible substrate may also be applied to the first embodiment.

It should be noted that the present invention may be applied not only to an imaging device such as a camera, but also to various electronic devices in which a movable support unit and a control board are connected together through a flexible board. Moreover, in the case where the present invention is applied to a camera, the camera may be an integral lens.

Other Examples

Although the invention has been described with reference to embodiments, it will be appreciated that the invention is not limited to the disclosed embodiments. The scope of the claims below should be interpreted broadly to cover all modifications and equivalent structures and functions. Some of the above embodiments may be used in appropriate combination.

This application claims the advantages of Japanese Patent Application No. 2018-195149 filed on October 16, 2018 and Japanese Patent Application No. 2019-117500 filed on June 25, 2019, incorporated herein by reference in its entirety. do.

Claims (12)

An imaging element that converts the optical image of the subject into an electrical signal;
A movable unit which holds the imaging element and can be displaced in a direction different from the optical axis direction of the imaging optical system;
A control unit having a circuit through which an imaging signal output from the imaging element is transmitted;
A first flexible substrate electrically connecting the movable unit and the control unit to each other; And
An imaging device comprising a second flexible substrate electrically connecting the movable unit and the control unit to each other,
The first flexible substrate includes a first connecting portion connected to the movable unit, a first wiring portion extending from the first connecting portion in a first direction different from the optical axis direction, and the first connecting portion. A second connecting portion disposed at the end of the wiring portion and connected to the control unit,
The second flexible substrate includes a third connecting portion connected to the movable unit, and a second extending from the third connecting portion in a second direction different from the optical axis direction and opposite to the first direction. And a fourth connecting portion disposed at an end of the second wiring portion and connected to the control unit.
According to claim 1,
The control unit includes a first cutout formed at the edge of the control unit in the first direction, and a second cutout formed at the edge of the control unit in the second direction,
The first wiring portion of the first flexible substrate is routed through the first cut portion,
The second wiring portion of the second flexible substrate is routed through the second cutting portion,
When the movable unit is displaced as much as possible, the first wiring portion of the first flexible substrate does not contact the first cutting portion, and the second wiring portion of the second flexible substrate is the second wiring portion. An imaging device that does not contact the cut portion.
According to claim 2,
When the movable unit is displaced as much as possible, the first wiring portion of the first flexible substrate and the second wiring portion of the second flexible substrate are both fitted to the outermost shape of the control unit. Device.
According to claim 1,
The intermediate position in the wiring direction of the first wiring portion of the first flexible substrate and the intermediate position in the wiring direction of the second wiring portion of the second flexible substrate respectively support the movable unit. An imaging device that is fixed with respect to a supporting unit or a member fixed to the supporting unit.
According to claim 1,
Of the first flexible substrate and the second flexible substrate, an image generating device in which the generation of electromagnetic noise is more distant from the installation position of the wireless antenna.
According to claim 1,
The first flexible substrate is provided with a differential transmission wiring,
The second flexible substrate is provided with a power supply wiring, the imaging device.
According to claim 1,
The imaging device, wherein the first wiring portion of the first flexible substrate and the second wiring portion of the second flexible substrate have substantially the same length and width.
The method of claim 4,
The area from the first connecting portion to the intermediate position in the wiring direction of the first flexible substrate, and the area from the third connecting portion to the intermediate position in the wiring direction of the second flexible substrate. Silver, the imaging device of which length and width are substantially the same.
According to claim 1,
The imaging device, when viewed in a direction parallel to the optical axis, partially overlaps the first connecting portion and the third connecting portion.
The method of claim 9,
In the direction parallel to the optical axis, the third connecting portion is farther away from the control unit than the first connecting portion,
The imaging device, wherein the second flexible substrate is thicker than the first flexible substrate.
The method of claim 10,
The first flexible substrate is provided with a differential transmission wiring,
The second flexible substrate is provided with a power supply wiring, the imaging device.
According to claim 1,
The control unit has a function of optically correcting blurring of a subject by displacing the movable unit in a direction different from the optical axis.

Images