KR20200006952A - 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 - Google Patents
반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 Download PDFInfo
- Publication number
- KR20200006952A KR20200006952A KR1020190084033A KR20190084033A KR20200006952A KR 20200006952 A KR20200006952 A KR 20200006952A KR 1020190084033 A KR1020190084033 A KR 1020190084033A KR 20190084033 A KR20190084033 A KR 20190084033A KR 20200006952 A KR20200006952 A KR 20200006952A
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- semiconductor light
- substrate
- emitting device
- electrode
- Prior art date
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Wire Bonding (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP20824051.5A EP3813120A4 (en) | 2018-07-11 | 2020-02-20 | DISPLAY DEVICE USING LIGHT-emitting semiconductor elements and method of manufacturing the same |
CN202080004745.9A CN112655091B (zh) | 2018-07-11 | 2020-02-20 | 使用半导体发光元件的显示装置及其制造方法 |
US17/254,683 US20220190220A1 (en) | 2018-07-11 | 2020-02-20 | Display device using a semiconductor light emitting device and manufacturing method thereof |
PCT/KR2020/002453 WO2021006450A1 (ko) | 2018-07-11 | 2020-02-20 | 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180080714 | 2018-07-11 | ||
KR20180080714 | 2018-07-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20200006952A true KR20200006952A (ko) | 2020-01-21 |
Family
ID=69369770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020190084033A KR20200006952A (ko) | 2018-07-11 | 2019-07-11 | 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20220190220A1 (zh) |
EP (1) | EP3813120A4 (zh) |
KR (1) | KR20200006952A (zh) |
CN (1) | CN112655091B (zh) |
WO (1) | WO2021006450A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021006450A1 (ko) * | 2018-07-11 | 2021-01-14 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 |
WO2021230402A1 (ko) * | 2020-05-14 | 2021-11-18 | 엘지전자 주식회사 | 반도체 발광소자 및 이를 포함하는 디스플레이 장치 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102934243B (zh) * | 2010-06-09 | 2018-08-31 | 迪睿合电子材料有限公司 | 光反射性各向异性导电浆料和发光装置 |
KR20130013515A (ko) * | 2011-07-28 | 2013-02-06 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
KR101476207B1 (ko) * | 2012-06-08 | 2014-12-24 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 |
KR101422037B1 (ko) * | 2012-09-04 | 2014-07-23 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 |
US20150249069A1 (en) * | 2012-09-25 | 2015-09-03 | Sharp Kabushiki Kaisha | Display device and method for manufacturing display device |
US9698134B2 (en) * | 2014-11-27 | 2017-07-04 | Sct Technology, Ltd. | Method for manufacturing a light emitted diode display |
KR102456740B1 (ko) * | 2015-12-11 | 2022-10-21 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 |
WO2017209437A1 (en) * | 2016-05-31 | 2017-12-07 | Lg Electronics Inc. | Display device using semiconductor light emitting device and fabrication method thereof |
WO2017217703A1 (en) * | 2016-06-13 | 2017-12-21 | Seoul Semiconductor Co., Ltd | Display apparatus and manufacturing method thereof |
US10340256B2 (en) * | 2016-09-14 | 2019-07-02 | Innolux Corporation | Display devices |
KR20180114439A (ko) * | 2017-04-10 | 2018-10-18 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 |
KR102435798B1 (ko) * | 2017-11-20 | 2022-08-25 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 |
US10193042B1 (en) * | 2017-12-27 | 2019-01-29 | Innolux Corporation | Display device |
KR20200006952A (ko) * | 2018-07-11 | 2020-01-21 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 |
-
2019
- 2019-07-11 KR KR1020190084033A patent/KR20200006952A/ko not_active Application Discontinuation
-
2020
- 2020-02-20 CN CN202080004745.9A patent/CN112655091B/zh active Active
- 2020-02-20 US US17/254,683 patent/US20220190220A1/en active Pending
- 2020-02-20 EP EP20824051.5A patent/EP3813120A4/en active Pending
- 2020-02-20 WO PCT/KR2020/002453 patent/WO2021006450A1/ko unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021006450A1 (ko) * | 2018-07-11 | 2021-01-14 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 |
WO2021230402A1 (ko) * | 2020-05-14 | 2021-11-18 | 엘지전자 주식회사 | 반도체 발광소자 및 이를 포함하는 디스플레이 장치 |
Also Published As
Publication number | Publication date |
---|---|
WO2021006450A1 (ko) | 2021-01-14 |
US20220190220A1 (en) | 2022-06-16 |
EP3813120A1 (en) | 2021-04-28 |
CN112655091B (zh) | 2023-07-21 |
CN112655091A (zh) | 2021-04-13 |
EP3813120A4 (en) | 2022-03-30 |
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Legal Events
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