KR20190138115A - lift pin assembly and bake unit with the assembly - Google Patents

Abstract

The present invention relates to a baking unit. According to one embodiment of the present invention, the baking unit includes: a housing having an upper body and a lower body providing a processing space in which process processing with respect to a substrate is performed; a heating plate provided on the processing space and having an upper surface on which the substrate is placed and pin holes; and a lift pin assembly for loading/unloading the substrate to/from the heating plate, wherein the lift pin assembly includes: lift pins positioned on the pin hole; and an airtight flange protruding from a side surface of the lift pin, coming in non-contact with an O-ring on the pin hole when the lift pin is moved into an unloading position, and coming in contact with the O-ring when being moved into a loading position.

Description

Lift pin assembly and bake unit with the assembly

The present invention relates to a substrate processing apparatus, and more particularly, to a baking apparatus for heat-treating a substrate in a vacuum state.

In order to manufacture a semiconductor device, various processes such as photography, etching, deposition, ion implantation, and cleaning are performed. Among them, the photo process is a process for forming a pattern and plays an important role in achieving high integration of semiconductor devices.

The photographing process is largely composed of an application process, an exposure process, and a developing process, and a baking process is performed before and after the exposure process. The baking process is a process of heat treating a substrate, and the substrate is placed on a heating plate, and the substrate is heat-treated through a heater provided inside the heating plate.

1 is a view showing a typical baking unit.

Referring to Figure 1, the baking unit is installed in the upper chamber and the lower chamber, the lower chamber to provide a space for performing the baking process therein, the heating plate for heating the substrate during the process, and to make the interior space in a vacuum state Exhaust lines;

The above-mentioned baking unit is provided with lift pins for loading and unloading the substrate, and an O-ring (sealing member) is installed in the lift pinhole of the heating plate to maintain the airtightness of the inner space when the lift pins are raised and lowered.

However, the O-ring has a problem in that it is difficult to maintain perfect airtightness as it is easily damaged by the splitting phenomenon caused by friction with the lift pin due to frequent up / down operations of the lift pins.

In particular, the heating plate is subjected to thermal deformation during the substrate heating process, the bending position of the lift pin is generated as the initial position of the lift pinhole formed in the heating plate is moved finely due to the thermal deformation of the heating plate.

Therefore, the lift pin is caused to bend deformation due to the displacement of the lift pin hole and the lift pin. Bending deformed lift pins locally press the O-ring to cause deformation of the O-ring, causing uneven wear and leakage.

The present invention seeks to provide a lift pin assembly and a baking device having the same, which can be kept airtight only during the process.

The present invention is to provide a lift pin assembly and a baking device having the same that can minimize the friction between the sealing member and the leaf pin.

The problem to be solved by the present invention is not limited thereto, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

According to an aspect of the invention, the lift pins located in the pinhole; And a pin driver for elevating the lift pins to an up position and a down position; The lift pin assembly may be provided that includes a hermetic flange that is in contact with the O-ring on the pinhole when moved to the up position and that is in contact with the O-ring when moved to the down position.

In addition, the hermetic flange may include a protrusion protruding in a ring shape on the bottom surface.

According to another aspect of the present invention, the processing of the substrate processing is progressing the housing having an upper body and a lower body to provide a processing space; A heating plate provided in the processing space and having a top surface and pinholes on which a substrate is placed; And a lift pin assembly for loading / unloading a substrate into / from the heating plate; The lift pin assembly includes lift pins located in the pinhole; And an airtight flange protruding from the side of the lift pin, the airtight flange being in contact with the O-ring on the pinhole when the lift pin is moved to the unloading position and contacting the O-ring when moved to the loading position. Can be.

In addition, the O-ring may be provided spaced apart from the lift pin.

In addition, the O-ring may have a cross-sectional shape that forms a “c” shape and one side is opened toward the lift pin.

In addition, the O-ring is supported by a support block located in the pinhole; And a closed end extending from the support in an inward direction of the pinhole and elastically contacting the hermetic flange.

In addition, a space may be provided between the support part and the sealing part.

In addition, the hermetic flange may be provided in a ring-shaped plate.

In addition, the hermetic flange may further include a protruding portion contacting the O-ring on a bottom surface thereof.

In addition, the O-ring may have a circular cross-sectional shape.

In addition, the vacuum cleaner may further include a vacuum line provided inside the housing and configured to reduce the processing space.

In addition, the upper body may further include a lifting member for elevating the upper body so as to be spaced apart from or in close contact with the lower body.

The apparatus may further include a supply unit spraying a processing fluid to change the surface of the substrate to the hydrophobicity into the processing space.

According to another aspect of the invention, the substrate support member having a pinhole and the upper surface on which the substrate is placed; A lift pin positioned in the pinhole; A pin driver configured to move the lift pin up and down to a loading position of the substrate and an unloading position of the substrate; An O-ring mounted on the pin hole and shaped to be spaced apart from the lift pin; And an airtight flange installed on the lift pin and contacting the O-ring when the lift pin is moved to the unloading position and contacting the O-ring when moved to the loading position.

In addition, the O-ring may have a cross-sectional shape that forms a “c” shape and one side is opened toward the lift pin.

In addition, the O-ring is supported by a support block located in the pinhole; And a closed end extending from the support in an inward direction of the pinhole and elastically contacting the hermetic flange.

In addition, the substrate support member may further include a heating element for heating the substrate.

According to one embodiment of the present invention, the maintenance cost can be reduced and the airtightness can be improved by minimizing the crushing phenomenon caused by the friction between the O-ring and the lift pin.

The effects of the present invention are not limited to the above-described effects, and effects that are not mentioned will be clearly understood by those skilled in the art from the present specification and the accompanying drawings.

1 is a cross-sectional view showing a typical baking unit.
2 is a view of the substrate processing equipment from above.
3 is a view of the installation of FIG. 2 as viewed from the AA direction.
4 is a view of the installation of FIG. 2 seen in the BB direction.
5 is a view of the installation of FIG. 2 as viewed from the CC direction.
6 is a plan view illustrating a baking unit according to an exemplary embodiment of the present invention.
FIG. 7 is a side view illustrating the bake unit illustrated in FIG. 6.
8 is a cross-sectional view illustrating a heat treatment unit that performs the heat treatment process of FIG. 6.
9 is a perspective view showing the lift pin assembly in the heat treatment unit of FIG. 8.
10 is an enlarged cross-sectional view of the main portion showing a state in which the lift pin is moved to the up position.
11 is an enlarged cross-sectional view of the main portion showing a state in which the lift pin is moved to the down position.
12 is a view showing a state in which the positions of the lift pin and the pinhole are misaligned.
13 is a view showing a modification of the O-ring.
14 shows a variant of the hermetic flange in the lift pin assembly.

As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all transformations, equivalents, and substitutes included in the spirit and scope of the present invention. In the following description of the present invention, if it is determined that the detailed description of the related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present disclosure does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or combinations thereof.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, and in describing the present invention with reference to the accompanying drawings, the same or corresponding elements are denoted by the same reference numerals regardless of the reference numerals, and duplicates thereof. The description will be omitted.

2 to 5 are schematic views showing a substrate processing apparatus according to an embodiment of the present invention. 2 is a view of the substrate processing equipment from the top, FIG. 3 is a view of the equipment of FIG. 2 from the AA direction, FIG. 4 is a view of the equipment of FIG. 2 from the BB direction, and FIG. 5 is a facility of FIG. Is a view from the CC direction.

2 to 5, the substrate processing apparatus 1 includes a load port 100, an index module 200, a first buffer module 300, a coating and developing module 400, and a second buffer module 500. ), The pre-exposure processing module 600, and the interface module 700.

Load port 100, index module 200, first buffer module 300, coating and developing module 400, second buffer module 500, pre-exposure processing module 600, and interface module 700 Are sequentially arranged in one direction.

Hereinafter, the load port 100, the index module 200, the first buffer module 300, the coating and developing module 400, the second buffer module 500, the pre-exposure processing module 600, and the interface module ( The direction in which the 700 is disposed is called a first direction 12, and when viewed from the top, a direction perpendicular to the first direction 12 is called a second direction 14, and the first direction 12 and the second direction. A direction perpendicular to the direction 14 is referred to as a third direction 16.

The substrate W is moved in the state accommodated in the cassette 20. At this time, the cassette 20 has a structure that can be sealed from the outside. For example, as the cassette 20, a front open unified pod (FOUP) having a door in front may be used.

Hereinafter, the load port 100, the index module 200, the first buffer module 300, the coating and developing module 400, the second buffer module 500, the pre-exposure processing module 600, and the interface module ( 700 will be described in detail.

The load port 100 has a mounting table 120 on which a cassette 20 containing substrates W is placed. The mounting table 120 is provided in plural, and the mounting tables 200 are arranged in a line along the second direction 14. In FIG. 1 four mounting blocks 120 are provided.

The index module 200 transfers the substrate W between the cassette 20 placed on the mounting table 120 of the load port 100 and the first buffer module 300. The index module 200 has a frame 210, an index robot 220, and a guide rail 230. The frame 210 is generally provided in the shape of an empty rectangular parallelepiped, and is disposed between the load port 100 and the first buffer module 300. The frame 210 of the index module 200 may be provided at a height lower than that of the frame 310 of the first buffer module 300 described later. The index robot 220 and the guide rail 230 are disposed in the frame 210.

The index robot 220 drives four axes so that the hand 221 that directly handles the substrate W can be moved and rotated in the first direction 12, the second direction 14, and the third direction 16. This has a possible structure. Index robot 220 has a hand 221, an arm 222, a support 223, and a pedestal 224. The hand 221 is fixed to the arm 222. Arm 222 is provided in a stretchable and rotatable structure. The support 223 is disposed in the longitudinal direction along the third direction 16. Arm 222 is coupled to support 223 to be movable along support 223. The support 223 is fixedly coupled to the pedestal 224. The guide rail 230 is provided such that its longitudinal direction is disposed along the second direction 14. The pedestal 224 is coupled to the guide rail 230 to be linearly movable along the guide rail 230. In addition, although not shown, the frame 210 is further provided with a door opener for opening and closing the door of the cassette 20.

The first buffer module 300 has a frame 310, a first buffer 320, a second buffer 330, a cooling chamber 350, and a first buffer robot 360. The frame 310 is provided in the shape of an empty rectangular parallelepiped, and is disposed between the index module 200 and the application and development module 400. The first buffer 320, the second buffer 330, the cooling chamber 350, and the first buffer robot 360 are located in the frame 310. The cooling chamber 350, the second buffer 330, and the first buffer 320 are sequentially disposed along the third direction 16 from below. The first buffer 320 is located at a height corresponding to the coating module 401 of the coating and developing module 400 described later, and the second buffer 330 and the cooling chamber 350 are the coating and developing modules (described later). It is located at a height corresponding to the developing module 402 of 400. The first buffer robot 360 is positioned to be spaced apart from the second buffer 330, the cooling chamber 350, and the first buffer 320 in a second direction 14.

The first buffer 320 and the second buffer 330 temporarily store the plurality of substrates W, respectively. The second buffer 330 has a housing 331 and a plurality of supports 332. The supports 332 are disposed in the housing 331 and are spaced apart from each other along the third direction 16. One support W is placed on each support 332. In the housing 331, the index robot 220, the first buffer robot 360, and the developing unit robot 482 of the developing module 402, which will be described later, move the substrate W to the support 332 in the housing 331. It has openings (not shown) in the direction in which the index robot 220 is provided, the direction in which the first buffer robot 360 is provided, and the direction in which the developing unit robot 482 is provided so as to be able to carry in or take out. The first buffer 320 has a structure generally similar to that of the second buffer 330. However, the housing 321 of the first buffer 320 has an opening in the direction in which the first buffer robot 360 is provided and in the direction in which the applicator robot 432 located in the application module 401 described later is provided. The number of supports 322 provided in the first buffer 320 and the number of supports 332 provided in the second buffer 330 may be the same or different.

According to an example, the number of supports 332 provided in the second buffer 330 may be greater than the number of supports 322 provided in the first buffer 320.

The first buffer robot 360 transfers the substrate W between the first buffer 320 and the second buffer 330. The first buffer robot 360 has a hand 361, an arm 362, and a support 363. The hand 361 is fixed to the arm 362. The arm 362 is provided in a stretchable structure, allowing the hand 361 to move along the second direction 14. Arm 362 is coupled to support 363 so as to be linearly movable in a third direction 16 along support 363. The support 363 has a length extending from a position corresponding to the second buffer 330 to a position corresponding to the first buffer 320. The support 363 may be provided longer in the up or down direction. The first buffer robot 360 may simply be provided such that the hand 361 is only biaxially driven along the second direction 14 and the third direction 16.

The cooling chambers 350 respectively cool the substrate W. The cooling chamber 350 has a housing 351 and a cooling plate 352. The cooling plate 352 has an upper surface on which the substrate W is placed and cooling means 353 for cooling the substrate W. As shown in FIG. As the cooling means 353, various methods such as cooling by cooling water or cooling using a thermoelectric element may be used. In addition, the cooling chamber 350 may be provided with a lift pin assembly (not shown) that positions the substrate W on the cooling plate 352. The housing 351 has the index robot 220 so that the developing robot 482 provided to the index robot 220 and the developing module 402 to be described later can load or unload the substrate W to the cooling plate 352. The provided direction and developing part robot 482 has an opening (not shown) in the provided direction. In addition, the cooling chamber 350 may be provided with doors (not shown) for opening and closing the above-described opening.

The application and development module 400 performs a process of applying a photoresist on the substrate W before the exposure process and a process of developing the substrate W after the exposure process. The application and development module 400 has a generally rectangular parallelepiped shape. The application and development module 400 has an application module 401 and a development module 402. The application module 401 and the developing module 402 are arranged to partition into each other in layers. In one example, the application module 401 is located on top of the development module 402.

The application module 401 includes a process of applying a photoresist such as a photoresist to the substrate W and a heat treatment process such as heating and cooling the substrate W before and after the resist application process. The application module 401 has a resist application chamber 410, a bake unit 420, and a transfer chamber 430. The resist application chamber 410, the bake unit 420, and the transfer chamber 430 are sequentially disposed along the second direction 14. Accordingly, the resist coating chamber 410 and the baking unit 420 are positioned to be spaced apart from each other in the second direction 14 with the transfer chamber 430 interposed therebetween. A plurality of resist coating chambers 410 are provided, and a plurality of resist coating chambers 410 are provided in the first direction 12 and the third direction 16, respectively. In the figure, an example in which six resist application chambers 410 are provided is shown. A plurality of baking units 420 are provided in the first direction 12 and the third direction 16, respectively. 6 shows an example in which six bake units 420 are provided. However, the baking unit 420 may alternatively be provided in a larger number.

The transfer chamber 430 is positioned side by side in the first direction 12 with the first buffer 320 of the first buffer module 300. An applicator robot 432 and a guide rail 433 are positioned in the transfer chamber 430. The transfer chamber 430 has a generally rectangular shape. The applicator robot 432 includes the baking units 420, the resist application chambers 400, the first buffer 320 of the first buffer module 300, and the first of the second buffer module 500 described later. The substrate W is transferred between the cooling chambers 520. The guide rail 433 is disposed such that its longitudinal direction is parallel to the first direction 12. The guide rail 433 guides the applicator robot 432 to move linearly in the first direction 12. The applicator robot 432 has a hand 434, an arm 435, a support 436, and a pedestal 437. The hand 434 is fixed to the arm 435. Arm 435 is provided in a flexible structure to allow hand 434 to move in the horizontal direction. The support 436 is provided such that its longitudinal direction is disposed along the third direction 16. Arm 435 is coupled to support 436 so as to be linearly movable in third direction 16 along support 436. The support 436 is fixedly coupled to the pedestal 437, and the pedestal 437 is coupled to the guide rail 433 so as to be movable along the guide rail 433.

The resist application chambers 410 all have the same structure. However, the types of photoresist used in each resist coating chamber 410 may be different from each other. As an example, a chemical amplification resist may be used as the photoresist. The resist coating chamber 410 applies a photo resist on the substrate W. As shown in FIG. The resist application chamber 410 has a housing 411, a support plate 412, and a nozzle 413. The housing 411 has a cup shape with an open top. The support plate 412 is located in the housing 411 and supports the substrate W. As shown in FIG. The support plate 412 is provided to be rotatable. The nozzle 413 supplies the photoresist onto the substrate W placed on the support plate 412. The nozzle 413 has a circular tubular shape and can supply the photoresist to the center of the substrate W. FIG. Optionally, the nozzle 413 has a length corresponding to the diameter of the substrate W, and the discharge port of the nozzle 413 may be provided as a slit. In addition, the resist coating chamber 410 may further be provided with a nozzle 414 for supplying a cleaning liquid such as deionized water to clean the surface of the substrate W to which the photoresist is applied.

The baking unit 420 heat-treats the substrate W. For example, the bake units 420 may be a prebake process or a photoresist that heats the substrate W to a predetermined temperature and removes organic matter or moisture from the surface of the substrate W before applying the photoresist. A soft bake process or the like performed after coating on W) is performed, and a cooling process for cooling the substrate W after each heating process is performed.

6 is a plan view illustrating a bake unit according to an exemplary embodiment of the present invention, FIG. 7 is a side view illustrating the bake unit illustrated in FIG. 6, and FIG. 8 is a cross-sectional view illustrating a heat treatment unit performing the heat treatment process of FIG. 6. to be.

6 to 8, the bake unit 420 may include a process chamber 423, a cooling plate 422, and a heat treatment unit 800.

The process chamber 423 provides a heat treatment space 421 therein. The process chamber 423 may be provided to have a cuboid shape. One side of the process chamber 423 is provided with a slot 424 for loading and unloading the substrate, the slot 424 is opened and closed by the shutter 425, the shutter 425 is driven by the shutter driver 426. .

The cooling plate 422 may cool the substrate heated by the heat treatment unit 800. The cooling plate 422 may be located in the heat treatment space 421. The cooling plate 422 may be provided in a circular plate shape. Inside the cooling plate 422 is provided cooling means such as cooling water or thermoelectric elements. For example, the cooling plate 422 may cool the heated substrate to room temperature.

The heat treatment unit 800 heat-treats the substrate. The heat treatment unit 800 may include a housing 860, a heating plate 810, a heating member 830, a lift pin assembly 840, and an exhaust member 870.

The heat treatment unit 800 may include a supply unit 809 for supplying a processing fluid for changing the surface of the substrate to hydrophobicity to the processing space. For example, in the heat treatment unit 800, an HDMS process of forming hexamethyldisilane (hereinafter referred to as HDMS) as an adhesion enhancer may be performed to increase the adhesion of the photoresist on the substrate. The HDMS process is performed with the processing space depressurized. For this purpose, maintaining the airtightness of the processing space becomes an important factor in improving the process quality.

The housing 860 provides a processing space 802 through which a heat treatment process of the substrate W proceeds. Housing 860 includes a lower body 862, an upper body 864, and a driver 868.

The lower body 862 may be provided in a cylindrical shape with an open upper side. The heating plate 810 and the heating member 830 are located in the lower body 862. The lower body 862 may include insulating covers to prevent thermal deformation of devices located around the heating plate 810.

The upper body 864 has a cylindrical shape with an open lower portion. The upper body 864 is combined with the lower body 862 to form a processing space 802 therein. Upper body 864 has a larger diameter than lower body 862. The upper body 864 is located above the lower body 862.

The upper body 864 is movable in the vertical direction by the elevating member 868. The upper body 864 is moved in the up and down direction and is movable to a lift (UP) position and a down (down) position. In this case, the upper body 864 that is lifted and positioned is spaced apart from the lower body 862, and the lowered position is a position where the upper body 864 is provided to contact the lower body 862. The elevating member 868 is controlled by the controller con.

The heating plate 810 is located in the processing space 802. The heating plate 810 is located at one side of the cooling plate 422. The heating plate 810 is provided in a circular plate shape. The top surface of the heating plate 810 serves as a support region on which the substrate W is placed.

The heating member 830 heats the substrate W placed on the heating plate 810 to a predetermined temperature. The heating member 830 may include a plurality of heating elements. The heating member 830 may be located inside the heating plate 810. Each heating element may heat different regions of the heating plate 810. Different regions of the heating plate 810 are provided as heating zones heated by the respective heating elements. Each tongue is provided in one-to-one correspondence with the heating elements. For example, the heating member 830 may be a thermoelectric element or a hot wire or planar heating element.

The exhaust member 870 may include a guide member 872 and an exhaust pipe 874.

The guide member 872 is disposed to face the heating plate 810 and is spaced apart from the top inner wall and the side inner wall of the upper body 864. Accordingly, an upper space 804 above the guide member 872 and a lower space 806 below the guide member 872 may be formed in the processing space 802 of the housing 860. The lower space 806 may be an exhaust area through which gas flowing into the upper portion of the substrate and fumes generated from the substrate are exhausted.

The guide member 872 may be provided as a circular plate having an exhaust hole 873 formed at the center thereof, and the exhaust pipe 874 is connected to the exhaust hole 873 through the upper body 864. In addition, the size of the guide member 872 may be larger than that of the substrate. The guide member may be formed to be inclined downward from the center to the edge.

For reference, the processing space 802 may be depressurized by the exhaust member 870.

Referring to FIG. 8, a plurality of fin holes 812 are formed on an upper surface of the heating plate 810.

For example, three pin holes 812 may be provided. Each pin hole 812 is spaced apart along the circumferential direction of the heating plate 810. The pin holes 812 may be spaced apart from each other at equal intervals.

The sealing member may be installed in the pin hole 812. The sealing member may include an O-ring 890, a support block 898, and an O-ring holder 899.

The o-ring 890 may be provided spaced apart from the lift pin 842. For example, the o-ring 890 may have a cross-sectional shape that forms a “c” shape and opens one side toward the lift pin 842. More specifically, the O-ring 890 is formed by a support supported by the support block 898 located in the pinhole 812, extending from the support inwardly of the pinhole 812, and elastically contacting the airtight flange 846. It may include a closed end (894). The support portion includes a horizontal support end 892 and a vertical support end 893. A space 891 is provided between the horizontal support end 892 and the closing portion 894 of the support to enable the elastic movement of the closing end 894. A protruding protrusion 895 may be formed on an upper surface of the closed end 894 so as to improve contact with the hermetic flange 846.

9 is a perspective view showing the lift pin assembly.

8 and 9,

The lift pin assembly 840 may include lift pins 842 located in the pinhole 812 and a pin driver 844 to lift the lift pins 842 up and down.

The lift pin 842 is provided with an airtight flange 846. The hermetic flange 846 is provided to be in contact with the o-ring 890 on the pinhole 812 when the lift pin 842 is moved to the up position, and to contact the o-ring 890 when the lift pin 842 is moved to the down position. Can be.

FIG. 10 is a view showing a lift pin moved to an up position, and FIG. 11 is a view showing a lift pin moved to a down position.

As shown in Figs. 10 and 11, in the state in which the lift pin is moved to the up position, the airtight flange is in an O-ring-off state, and the airtight of the processing space 802 is released. In the state where the lift pin is moved to the down position (processing for substrate processing), the airtight flange is in contact with the O-ring, thereby maintaining the airtightness of the processing space.

In particular, in the present invention, since there is no direct contact with the O-ring during the up and down of the lift pin, the frictional wear of the O-ring is remarkably reduced, thereby extending the service life of the O-ring.

12 is a view showing a position shift state of the pinhole and the lift pin due to thermal deformation of the heating plate.

As shown in FIG. 12, heat deformation of the heating plate 810 occurs during substrate heating, and the initial position of the pinholes 812 formed in the heating plate 810 is minutely formed due to the heat deformation of the heating plate 810. As it moves, the positions of the pinhole 812 and the lift pin 842 are distorted. (C1 is the center of the pinhole and C2 is the center of the lift pin.)

Nevertheless, in the present invention, the lift pin is spaced apart from the O-ring during the up-down movement, thereby minimizing bending deformation, and the airtight flange stably contacts the O-ring in the state where the lift pin is moved to the down position (processing for substrate processing). Thus, the processing space can be kept confidential.

13 is a view showing a modification of the O-ring.

As shown in FIG. 13, the O-ring 890a may be provided in a circular cross-sectional shape, and the inner side of the O-ring 890a may be spaced apart from the lift pin 842.

14 is a view showing a modification of the hermetic flange.

As shown in Figure 14, the bottom of the airtight flange 846 may be provided with a projection 847 in the form of a ring for improving the contact with the O-ring.

The foregoing detailed description illustrates the present invention. In addition, the above-mentioned contents show preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications may be made within the scope of the concept of the invention disclosed in the present specification, the scope equivalent to the disclosures described above, and / or the skill or knowledge in the art. The described embodiments illustrate the best state for implementing the technical idea of the present invention, and various modifications required in the specific fields and applications of the present invention are possible. Thus, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

10: substrate processing apparatus
100 processing container
200: substrate support unit
260: heat insulation member
280: heating unit
300: processing liquid supply unit
600: lifting unit

Claims (17)

Lift pins located in the pinhole; And
A pin drive for elevating the lift pins to an up position and a down position;
The lift pin
And an airtight flange in contact with the O-ring on the pinhole when moved to the up position and in contact with the O-ring when moved to the down position. The method of claim 1,
The hermetic flange
Lift pin assembly comprising a projection protruding in the form of a ring on the bottom. A process having an upper body and a lower body for providing a processing space, wherein processing of the substrate is performed;
A heating plate provided in the processing space and having a top surface and pinholes on which a substrate is placed; And
A lift pin assembly for loading / unloading a substrate into / from the heating plate;
The lift pin assembly
Lift pins positioned in the pinhole; And
And an airtight flange protruding from a side surface of the lift pin and contacting the O-ring on the pinhole when the lift pin is moved to the unloading position and contacting the O-ring when moved to the loading position. The method of claim 3,
The o-ring is provided to be spaced apart from the lift pin. The method according to claim 3 or 4,
The O-ring is
Baking apparatus having a cross-sectional shape forming a "c" shape and one side opening toward the lift pin. The method according to claim 3 or 4,
The O-ring is
A support part supported by a support block positioned in the pinhole; And
And a closed end extending from the support in an inward direction of the pinhole and elastically contacting the hermetic flange. The method of claim 6,
The baking apparatus which has a space between the said support part and the said sealing part. The method of claim 3,
The hermetic flange
Bake device provided in a ring-shaped plate. The method of claim 3,
The hermetic flange
Baking apparatus further comprises a protrusion on the bottom contact with the O-ring. The method of claim 3,
The O-ring is
Baking apparatus having a circular cross-sectional shape. The method of claim 3,
And a vacuum line provided inside the housing and configured to depressurize the processing space. The method of claim 3,
And an elevating member for elevating the upper body such that the upper body is spaced apart from or in close contact with the lower body. The method of claim 3,
And a supply unit for injecting a processing fluid for converting the substrate surface into hydrophobicity into the processing space. A substrate support member having an upper surface on which the substrate is placed and pinholes;
A lift pin positioned in the pinhole;
A pin driver configured to move the lift pin up and down to a loading position of the substrate and an unloading position of the substrate;
An O-ring mounted on the pin hole and shaped to be spaced apart from the lift pin; And
And an airtight flange mounted to the lift pin, the airtight flange being in contact with the O-ring when the lift pin is moved to the unloading position and contacting the O-ring when moved to the loading position. The method of claim 14,
The O-ring is
A substrate processing apparatus having a cross-sectional shape forming a "c" shape and opening one side toward the lift pin. The method of claim 15,
The O-ring is
A support part supported by a support block positioned in the pinhole; And
And an airtight end extending from the support in an inward direction of the pinhole and elastically contacting the hermetic flange. The method of claim 14,
The substrate support member further comprises a heating element for heating the substrate.

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