KR20190136937A - Substrate holding apparatus, exposure apparatus, and article manufacturing method - Google Patents

Abstract

The present invention relates to a substrate holding apparatus, which comprises: a base with a gap; and a reflecting member disposed in the gap and configured to reflect light transmitted through the substrate to a substrate side, and to an exposure apparatus comprising the substrate holding apparatus.

Description

Substrate holding device, exposure device and article manufacturing method {SUBSTRATE HOLDING APPARATUS, EXPOSURE APPARATUS, AND ARTICLE MANUFACTURING METHOD}

The present disclosure relates to a substrate holding apparatus, an exposure apparatus and an article manufacturing method.

The exposure apparatus is used when manufacturing devices, such as a semiconductor device and a liquid crystal display element, using photolithography technique. The exposure apparatus projects the pattern of the mask onto the substrate through the projection optical system to transfer the pattern.

The manufacturing process of a device includes the process of apply | coating a resist to a board | substrate, the process of exposing a resist, transferring a pattern to a board | substrate, and the process of developing the board | substrate with which the pattern was transferred. In general, a process of applying a resist to a substrate and a process of developing a substrate onto which the pattern has been transferred are performed by a coater developer different from an exposure apparatus that exposes the resist to transfer the pattern onto the substrate.

In the manufacturing process of the device, the device is manufactured while transferring the substrate between these different devices. Each apparatus is provided with a substrate holding mechanism for holding the substrate by adsorption and delivering the substrate. The substrate holding mechanism generally includes a base holding mechanism and a substrate raising mechanism such as a lift pin for raising and lowering the substrate.

A gap is created between the base disposed below the substrate and the substrate raising mechanism. Thus, the substrate is provided with a region where the base and the substrate raising mechanism are arranged and a region where none of them are arranged.

It is also common to manufacture a device using the transparent substrate through which exposure light transmits these days. When exposing a transparent substrate, the exposure light which permeate | transmitted the board | substrate is reflected by a base or a board | substrate raising mechanism, and the resist apply | coated to the board | substrate is exposed to reflected light. The gap provided in the base causes a difference in the amount of light irradiated to the resist, and an exposure nonuniformity occurs on the substrate.

As a technique for reducing the above-mentioned exposure nonuniformity, Chinese Patent Application Laid-Open No. 105045048 discloses a configuration for limiting reflection of exposure light by providing an antireflection member in a gap under the substrate. Chinese Patent Application Laid-Open No. 105045048 discloses a problem in which exposure light incident on a gap under the substrate reduces the resist on the substrate as reflected light and causes an excessive exposure amount in a region on the substrate positioned on the gap. In order to reduce the exposure amount in the area on the substrate located on the gap, the substrate holding apparatus described in Chinese Patent Application Laid-Open No. 105045048 includes an antireflection member in the gap.

On the other hand, the inventor of the present application found that the exposure light incident on the gap between the lower part of the substrate proceeds to the lower part of the substrate holding apparatus and is attenuated, and most of the exposure light does not reach the resist on the substrate.

According to an aspect of the present invention, a substrate holding apparatus includes a base having a gap and configured to hold a substrate and a reflecting member disposed to reflect the light disposed in the gap and passing through the substrate toward the substrate. The reflectance of the reflective member with respect to the light transmitted through the substrate is higher than the reflectance of the base with respect to the light transmitted through the substrate.

Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings.

1 is a schematic view showing an exposure apparatus.
2A and 2B are schematic diagrams showing a substrate holding mechanism.
3 is a diagram illustrating a base included in the substrate holding mechanism according to the first exemplary embodiment.
4 is a diagram illustrating a base constituting the substrate holding mechanism according to the second exemplary embodiment.
FIG. 5 is a diagram showing a base constituting the substrate holding mechanism according to the third exemplary embodiment. FIG.
6A, 6B, and 6C are diagrams illustrating a base constituting the substrate holding mechanism according to the fourth exemplary embodiment.
7 is a schematic diagram showing a mechanism for generating exposure unevenness.
8 is a diagram illustrating a relationship between the transmittance of a photosensitive material and the wavelength of light.
It is a figure which shows the structure for reducing exposure nonuniformity.
10 is a schematic diagram showing a mechanism for reducing exposure unevenness.
11 is a diagram showing a relationship between the position of the reflective member and the shape factor k.
12A and 12B are diagrams showing diffuse reflectance and specular reflectance on the upper surface of the base, respectively.
13A and 13B are diagrams showing diffuse reflectance and specular reflectance on the upper surface of the substrate raising mechanism, respectively.
14A and 14B are diagrams showing diffuse reflectance and specular reflectance on the upper surface of the reflecting member, respectively.
It is a figure which shows the detail of a board | substrate holding mechanism.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings. The substrate holding apparatus according to the present invention is suitable for holding a transparent substrate such as a sapphire substrate and a glass substrate. The sapphire substrate can be used, for example, as a substrate for a light emitting diode (LED) element. The glass substrate can be used, for example, as a substrate for a liquid crystal panel.

1 is a schematic diagram illustrating a configuration of an exposure apparatus 1 according to an aspect of an exemplary embodiment. The exposure apparatus 1 is used to form a pattern on a substrate. The exposure apparatus 1 includes a light source device 100 including a light source 110, an illumination optical system 200 for illuminating the disc 310, and a disc stage 300 holding the disc 310. . The exposure apparatus 1 further includes a projection optical system 400 for projecting an image of the pattern of the original plate 310 onto the substrate 510 held on the substrate holding mechanism 500 (substrate stage or substrate holding apparatus). Include.

As the light source 110, a high pressure mercury lamp or excimer laser is used. As general exposure light, near ultraviolet light having a g-ray (having a wavelength of about 436 nm) and a wavelength region of 100 to 400 nm is used. For example, g- and i-rays of ultra-high pressure mercury lamps (having a wavelength of about 365 nm), KrF excimer laser light (having a wavelength of about 248 nm), ArF excimer laser light (about 193 nm). ), And F2 laser light (having a wavelength of about 157 nm).

Light irradiated from the light source 110 is guided to the disc 310 through the optical system 210 included in the illumination optical system 200. The projection optical system 400 including the optical system 410 and the aperture stop 420 projects the pattern of the original plate 310 onto the substrate 510 at a predetermined projection magnification. The substrate 510 is coated with a photosensitive material (resist) having sensitivity to light having a specific wavelength. When the image of the pattern of the original plate 310 is projected onto the resist, a latent image pattern is formed in the resist.

The board | substrate 510 is hold | maintained by the board | substrate holding mechanism 500 as a board | substrate holding apparatus. The substrate holding mechanism 500 holds the substrate 510 through vacuum adsorption or electrostatic adsorption using an adsorption pad (not shown). The structure of the board | substrate holding mechanism 500 is demonstrated in detail below.

The exposure apparatus 1 scans the original 310 and the substrate 510 synchronously in the scanning direction while scanning the original 310 and the substrate 510 according to the present exemplary embodiment, and the scanning exposure that transfers the pattern of the original 310 to the substrate 510. Device (scanner). In the following description, the vertical direction is defined as the Z axis direction, the scanning direction of the substrate 510 in the plane perpendicular to the Z axis direction is defined as the Y axis direction, and is perpendicular to the Z axis direction and the Y axis direction. The non-scanning direction as the direction is defined as the X axis direction.

The amount of light (exposure amount) projected on the substrate 510 by the projection optical system 400 is an important factor for determining the line width of the pattern. By exposing the resist on the substrate 510 at an appropriate exposure amount, it is possible to form a high precision pattern.

For example, when the same pattern is repeatedly formed in the pattern formation region on the substrate 510, it is preferable to expose the resist so that exposure unevenness does not occur in the entire area of the pattern formation region. By devising the configurations of the illumination optical system 200 and the projection optical system 400, the variation in the exposure amount projected on the substrate 510 can be reduced. However, when what is called flare light is irradiated to the resist on the substrate 510, non-uniformity in the amount of light incident on the resist may occur.

Among the light transmitted through the original plate 310, the light transmitted through the opening of the optical system 410 and the aperture stop 420 included in the projection optical system 400, which is irradiated to the resist on the substrate 510, is referred to as normal light. , Light other than normal light is referred to as flare light.

<Occurrence of exposure nonuniformity>

The cause of exposure nonuniformity in the exposure apparatus will also be described below with reference to FIGS. 2A to 7. 2A shows a state where the substrate 510 is held by the substrate holding mechanism 500. 2B illustrates a state in which the substrate 510 is raised in the Z axis direction by the substrate raising mechanism 522. The board | substrate 510 is conveyed by board | substrate conveying apparatuses, such as a conveyance robot (not shown), in the state isolate | separated from the board | substrate holding mechanism 500 by the board | substrate raising mechanism 522.

Referring to FIG. 2A, the substrate holding mechanism 500 vacuum-adsorbs the substrate 510 by an adsorption pad (not shown) positioned between the base 521 and the substrate 510. Suction pads are disposed in the base 521. The method of holding the substrate 510 is not limited to vacuum adsorption. For example, the substrate 510 may be held through electrostatic adsorption. When exposing the substrate 510, the substrate 510 is held by the base 521 as shown in FIG. 2A.

The substrate raising mechanism 522 is movable in the Z axis direction. As shown in FIG. 2B, when the substrate 510 is separated from the base 521, the substrate raising mechanism 522 moves in the Z-axis direction to raise the substrate 510 upward in the Z-axis direction.

The substrate raising mechanism 522 includes a rising portion 522B that moves vertically in the Z axis direction and a contact portion 522C that contacts the substrate 510. The contact portion 522C has an upper surface 522A. Since contact 522C contacts substrate 510, the material of contact 522C indicates that contact 522C causes little damage to substrate 510 or hardly wears substrate 510 by contact. It is decided by considering. In general, the contact portion 522C is made of a resin material.

As shown in FIG. 2A, with the substrate 510 held by the base 521, a small gap is provided between the substrate 510 and the substrate raising mechanism 522. This gap prevents the substrate 510 from interfering with the substrate raising mechanism 522 and reduces the risk of the position of the substrate 510 changing in the Z-axis direction.

An arrangement relationship between the base 521 and the substrate raising mechanism 522 will be described below with reference to FIGS. 3 to 6C. 3 shows an example in which the base 521 constituting the substrate holding mechanism 500 is divided into eight substrate holding portions in the XY plane, and a gap is provided between adjacent substrate holding portions. The substrate holding portions 521a, 521b, 521c, and 521d are disposed on the plus side in the Y axis direction, and the substrate rising portions 522a, 522b, and 522c are disposed between the substrate holding portions 521a and 521b, respectively. It is disposed between the gaps 521b and 521c and between the substrate holding portions 521c and 521d. Further, the substrate holding portions 521e, 521f, 521g, and 521h are disposed on the minus side in the Y axis direction, and the substrate rising portions 522d, 522e, and 522f are placed between the substrate holding portions 521e and 521f, respectively, and the substrate. It is arranged in the gap between the holding portions 521f and 521g and between the substrate holding portions 521g and 521h. 3 shows an example in which the lift bar is arranged as the substrate riser.

4 shows a state in which the base 521 is divided into substrate holding portions 521a ', 521b', 521c ', and 521d'. The substrate holding portions 521a ', 521b', 521c ', and 521d' are provided with substrate rising portions 522a ', 522b', 522c ', and 522d', respectively. A substrate rising portion 522e 'is disposed in the gap between the substrate holding portions 521a' and 521b '. The substrate rising portion 522f 'is disposed in the gap between the substrate holding portions 521c' and 521d '. Each of these substrate rises shown in FIG. 4 is constituted by a lift bar.

Referring to FIG. 5, the base 521 is divided into substrate holding portions 521a ″, 521b ″, 521c ″, 521d ″, 521e ″, and 521f ″. Each of these substrate holding portions is provided with a through hole. Each through hole is provided with a lift pin as a substrate raising mechanism 522 that moves in the Z axis direction inside the through hole.

Referring to FIG. 6A, the base 521 includes a base plate 521A and a plurality of substrate holding parts 521B disposed on the base plate 521A. A gap is provided between the adjacent substrate holding portions 521B. By arrange | positioning the board | substrate conveyance part 527 on which the board | substrate 510 is mounted, the board | substrate conveyance part 527 overlaps with the base 521, and the board | substrate 510 is hold | maintained by the base 521. As shown in FIG. The board | substrate conveyance part 527 is driven by the board | substrate conveyance apparatus 528 in the X-axis, a Y-axis, and a Z-axis direction as needed. The substrate 510 can be raised and lowered in the Z axis direction by raising and lowering the substrate carrier 527 in the Z axis direction while holding the substrate 510.

FIG. 6B shows a state where the substrate carrier 527 is superimposed on the base 521. FIG. 6C shows a state in which the substrate carrier 527 is superimposed on the base 521 as viewed from the Y axis direction. It turns out that the board | substrate conveyance part 527 is arrange | positioned in the clearance gap between the adjacent board | substrate holding parts 521B.

As described above, in the examples shown in FIGS. 6A, 6B, and 6C, the substrate 510 is raised and lowered by the substrate transfer part 527 instead of the substrate raising mechanism 522. As described above, the substrate raising mechanism 522 may be the lift bar type shown in FIGS. 3 and 4 or the lift pin type shown in FIG. 5. The substrate transfer part 527 may have a function of a substrate raising mechanism as shown in FIGS. 6A, 6B, and 6C. In any case, the substrate raising portion constituting the substrate raising mechanism 522 is disposed in the gap provided in the base 521. As described above with reference to FIGS. 3-6C, a gap is provided between the adjacent substrate holding portions 521B and between the substrate holding portions 521B and the substrate rising portion. Exposure light passing through these gaps causes exposure unevenness.

A mechanism for generating exposure nonuniformity will be described below with reference to FIG. 7. FIG. 7 shows a state in which a resist 511 applied to the substrate 510 is irradiated with exposure light. The light ray 10 incident on the resist 511 from the space above the base 521 passes through the resist 511 and the substrate 510 and is reflected by the upper surface 521A of the base 521. The light ray 12 incident on the resist 511 from the space above the substrate raising mechanism 522 passes through the resist 511 and the substrate 510 and is reflected by the upper portion of the substrate raising mechanism 522. On the other hand, the light rays 11 incident on the resist 511 from the upper portion of the gap between the base 521 and the substrate raising mechanism 522 pass through the resist 511 and the substrate 510.

The exposure light incident on the resist 511 is partially absorbed by the resist 511. The absorbance and the transmittance of light vary depending on the wavelength of the exposure light and the optical characteristics of the resist 511. The transmittance of exposure light to the resist 511 can be calculated as follows.

Assuming that the light is a one-dimensional plane wave propagating in the Z direction, the amplitude E (Z, t) of the plane wave at time t is

...(1)

...(One)

Where k represents a wave number and ω represents a frequency. When the complex refractive index N is used, the frequency ω is expressed as follows.

...(2)

...(2)

The amplitude E (Z, t) can be expressed by the following.

...(3)

... (3)

Since ω = 2πc / λ, the following is obtained.

...(4)

...(4)

The light energy I (Z, t) can be obtained based on the square of norm of amplitude E (Z, t) or the square of norm of amplitude E (Z, t). . Therefore, the light energy I (Z, t) is as follows.

...(5)

... (5)

Based on Formula 5, the light transmittance T is calculated as follows.

...(6)

... (6)

Light transmitted through the resist 511 at the transmittance T as calculated based on Equation (6) passes through the substrate 510 and reaches the top of the base 521 and the substrate raising mechanism 522. 8 shows the relationship between the wavelength and the transmittance of light in a particular resist 511. In an exposure apparatus using a mercury lamp, i-ray (having a wavelength of about 365 nm), h-ray (having a wavelength of about 405 nm), g-ray (having a wavelength of about 436 nm), etc., as exposure light, etc. This is used. 8 shows the transmittance (Ti) for i-rays, the transmittance (Th) for h-rays, and the transmittance (Tg) for g-rays. It can be seen that the values of the transmittances are different for each wavelength.

Light reaching the top of the base 521 and the substrate raising mechanism 522 is reflected by the reflecting surface through the specular reflection and the diffuse reflection. Specular reflection refers to a reflection whose reflection angle is determined by the angle of light incident on the reflection surface. In specular reflection, the angle of incidence and the angle of reflection are generally the same. Diffuse reflection refers to reflection that does not depend on the angle of incidence of light incident on the reflective surface. In diffuse reflection, the intensity of light reflected at an angle [theta] with respect to the waterline from the reflective surface depends on cos [theta]. Diffuse reflection may be referred to as Lambert reflection.

Light reflected by the top surface of the base 521 and the substrate raising mechanism 522 through specular reflection or diffuse reflection passes through the substrate 510 and then enters the resist 511 as flared light. On the other hand, the light beam 11 shown in FIG. 7 enters the gap between the base 521 and the substrate raising mechanism 522. Most of the light rays 11 are attenuated without again entering the resist 511.

Therefore, an area on which the flare light is generated and an area on which the flare light is hardly generated are generated on the substrate 510. As described above, the flare light is generated in accordance with the reflection characteristics of the upper surfaces of the base 521 and the substrate raising mechanism 522, and thus, it is difficult to sufficiently reduce the flare light. Since different amounts of flare light are incident on the resist 511 for each region on the substrate 510, exposure unevenness will therefore occur.

<How to reduce exposure unevenness>

The method of reducing exposure nonuniformity is demonstrated below with reference to FIGS. 9-11. Referring to FIG. 9, the above-described exposure nonuniformity is reduced by disposing the reflective member 523 in the gap between the base 521 and the substrate raising mechanism 522. Configurations other than the reflective member 523 shown in FIG. 9 are similar to those shown in FIGS. 2A and 2B, and thus redundant description thereof will be omitted. The reflective member 523 is made of a resin material such as acrylic and Teflon® or a metal material such as aluminum. The metal material which surface-treated, such as plating, can also be used.

It is preferable to arrange the reflective member 523 at the same height as the upper surface of the base 521 or the substrate raising mechanism 522. However, since the gap between the upper surface of the base 521 and the upper surface of the substrate raising mechanism 522 is generally small, it is difficult to arrange the reflective member 523 in this gap. Therefore, the reflective member 523 is disposed in the region under the contact portion 522C of the substrate raising mechanism 522.

Hereinafter, with reference to FIG. 10, the mechanism which reduces exposure nonuniformity is demonstrated. Since the optical paths of the light beams 10 and 12 have been described above with reference to FIG. 7, redundant description thereof will be omitted. The light ray 11 passes through the resist 511 and the substrate 510, reaches the top surface 523A of the reflective member 523, and is reflected toward the substrate by the top surface 523A.

The upper surface 523A of the reflective member 523 is a diffuse reflective surface. Since the light beam 41 has a small reflection angle among the reflected light beams, the light beam 41 passes through the gap between the base 521 and the substrate raising mechanism 522 and reaches the resist 511 after passing through the substrate 510. do. On the other hand, among the reflected light beams 42 have a large reflection angle with respect to the waterline from the upper surface 523A. Therefore, the light rays 42 are irradiated to the sides of the base 521 and the substrate raising mechanism 522, and almost all of the light rays 42 are absorbed. As a result, most of the light rays 42 do not reach the resist 511.

As described above, since the reflective member 523 is disposed in the gap between the base 521 and the substrate raising mechanism 522, flare light also enters the resist 511 located above the gap. This configuration includes the amount of light reflected by the base 521 and reaching the first resist region on the base 521, and reflected by the reflecting member 523 and reaching the second resist region on the reflective member 523. To reduce the difference between the amount of light. In addition, this configuration includes the amount of light reflected by the substrate raising mechanism 522 and reaching the third resist region on the substrate raising mechanism 522, and reflected by the reflecting member 523 on the reflective member 523. The difference between the amounts of light reaching the second resist area is reduced.

As a result, the light amount distribution of the flare light irradiated to the resist 511 may be uniform to some extent. Referring to FIG. 9, the first resist region is a region 511A, the second resist region is a region 511B, and the third resist region is a region 511C.

However, as described above, not all of the exposure light incident on the reflective member 523 reaches the resist 511. Therefore, further design is needed to further reduce exposure unevenness.

The present exemplary embodiment further realizes further reduction in exposure unevenness by appropriately setting reflection characteristics such as reflectance on the respective reflective surfaces of the base 521, the substrate raising mechanism 522, and the reflective member 523. Hereinafter, a method of determining reflection characteristics will be described.

As mentioned above, the reflection characteristic of incident light changes with the shape of a reflective surface. When the reflecting surface has a shape factor k (0 <k <1) and the material constituting the reflecting surface has a reflectance R, the amount of light reaching the resist 511 after being reflected by the reflecting surface is a factor ( kR). The shape factor k has parameters such as the position of the reflective member 523 in the Z axis direction and the width w of the gap between the base 521 and the substrate raising mechanism 522, and performs optical analysis and optical simulation. Is determined through.

11 shows the relationship between the position of the reflective member 523 in the Z axis direction and the shape factor k. The horizontal axis shown in FIG. 11 represents the distance d in the Z-axis direction from the top surface 521A of the base 521 to the top surface 523A of the reflective member 523. When the distance d is 0, the height of the upper surface 521A of the base 521 and the height of the upper surface 523A of the reflective member 523 are the same. FIG. 11 shows that the shape factor k changes in accordance with the width w of the gap between the base 521 and the substrate raising mechanism 522. 11 also shows that as the width w increases, the shape factor k increases (because w1> w2) and the distance of the position of the reflective member 523 from the top surface 521A of the base 521 is increased. It shows that the shape factor k decreases with increasing.

The specular reflectance is defined by the percentage of the light quantity ratio of the specularly reflected light to the quantity of the light incident on the reflecting surface. The diffuse reflectance is defined by the percentage of the ratio of the amount of light of the diffusely reflected light in all directions except the specular light to the amount of light incident on the diffusely reflective surface. The shape factor k for the specularly reflected light and the shape factor k for the diffusely reflected light can be defined respectively.

The amount of light of the flare light depends on the coefficient TkR as the product of the above-described factor kR and the transmittance T of the resist 511. Ideally, by equalizing the factors kR of the base 521, the substrate raising mechanism 522, and the reflective member 523, the coefficients TkR in each region on the resist 511 can be made equal. have. Thereby, the nonuniformity of the exposure amount for each area | region of the resist 511 can be reduced, and as a result, an exposure nonuniformity can be reduced.

Regarding the specular reflectance R, the diffuse reflectance R ', the shape factor k for the specular reflectance, and the shape factor k' for the diffuse reflectance, the following formulas (7-1) and (7) The shape factor k of the reflective member 523 is adjusted to satisfy at least one of -2).

...(7-1)

... (7-1)

...(7-2)

... (7-2)

Referring to equations (7-1) and (7-2), the subscripts S, C, and l represent the parameters of the reflective member 523, the base 521, and the substrate raising mechanism 522, respectively. The subscript λ represents a parameter depending on the wavelength. Formulas (7-1) and (7-2) show that when the exposure light includes a plurality of wavelength components, the values relating to these parameters are added to each wavelength.

The exposure nonuniformity can be preferably reduced by adjusting the shape factors k and reflectances R and R 'so as to satisfy the equations (inequalities) 7-1 and (7-2). According to the verification by the inventor of the present application, when the reflective member 523 according to the present invention is not used, the numerical value of the left side of the inequality (7-1) and (7-2) becomes about 1.5 to 2.0%. okay.

In the present exemplary embodiment, the reflective member 523 is disposed in the gap between the base 521 and the substrate raising mechanism 522, but as shown in FIGS. 3 to 6C between the adjacent substrate holding portions 521B. The reflective member 523 can be arranged in the gap of the. This is because, even when the substrate raising mechanism 522 is not disposed between the adjacent substrate holding portions 521B, if a gap is generated between the adjacent substrate holding portions 521B, a problem similar to that described above may occur. to be.

Next, the specific example of the material which comprises the base 521, the board | substrate raising mechanism 522, and the reflective member 523 is demonstrated. Base 521 is made of a black ceramic material. The substrate raising mechanism 522 is made of a black resin material. Reflective member 523 is comprised of Teflon®.

12A and 12B show the diffuse reflectance and the specular reflectance at the top surface 521A of the base 521 made of a black ceramic material, respectively. 13A and 13B show the diffuse reflectance and the specular reflectance at the top surface 522A of the substrate raising mechanism 522 made of a black resin material, respectively. 14A and 14B show the diffuse reflectance and specular reflectance at the top surface 523A of the reflecting member 523 made of Teflon®, respectively.

As described above, the upper surface of the reflective member 523 is disposed below the upper surface of the base 521 and the upper surface of the substrate raising mechanism 522. Therefore, the shape factors ks and ks' of the reflective member 523 are smaller than the shape factors k of the base 521 and the substrate raising mechanism 522. Thus, the difference between the factor kR of the reflective member 523 and the factor kR of the base 521 and the substrate raising mechanism 522 is determined by using a material having a relatively high reflectance as the material of the reflective member 523. Is reduced. Thereby, exposure nonuniformity can be reduced.

For example, in the projection exposure apparatus in which the wavelength region of the exposure light is in the range of 350 to 450 nm, the reflectance changes in small amounts on the upper surfaces of the base 521, the substrate raising mechanism 522, and the reflective member 523 in the wavelength region. It is desirable to. When the reflectance changes significantly, the exposure dose distribution between i-ray (having a wavelength of about 365 nm) as the exposure light and g-ray (having a wavelength of about 436 nm) as the exposure light May change significantly. This indicates that the magnitude of the exposure nonuniformity changes depending on the wavelength of the exposure light, which is not preferable from the viewpoint of reducing the exposure nonuniformity.

The change in reflectance at the upper surface of each member can be reduced by using the material having the low reflectance in the above-described wavelength range as the material of the base 521, the substrate raising mechanism 522, and the reflecting member 523.

The materials constituting the base 521, the substrate raising mechanism 522, and the reflective member 523 are not limited to the materials shown in FIGS. 12A to 14B. For example, the base 521 may be made of aluminum having black anodized treatment or metal member having a diamond-like carbon (DLC) coating. The substrate raising mechanism 522 and the reflecting member 523 may be made of a resin material such as acrylic or a metal material having various types of coatings applied thereto.

<Adjusting the position of the reflecting member>

It is preferable to provide a position adjusting mechanism for adjusting the position of the reflective member 523 in the Z axis direction. The reflectance of the base 521, the substrate raising mechanism 522, and the reflecting member 523 is mainly determined by the material property values. However, the reflectance may change depending on manufacturing error. The reflectance may also vary depending on the properties of the resist 511, the wavelength of the exposure light, and the exposure process.

By driving the reflecting member 523 in the Z-axis direction, exposure unevenness that may occur due to variations in these reflectances can be reduced. Since the shape factor k changes by driving the reflective member 523 in the Z-axis direction, it is preferable to reduce the exposure unevenness by appropriately changing the values of the left sides of the inequalities (7-1) and (7-2) described above. It is possible.

Next, the board | substrate holding apparatus containing a position adjustment mechanism is demonstrated with reference to FIG. FIG. 15 shows a part of the configuration shown in FIG. 9, that is, the configuration of the position adjusting mechanism 524 with respect to the reflective member 523. As shown in FIG. 15, the reflective member 523 is disposed separately from the base 521 and the substrate raising mechanism 522. The reflective member 523 is driven by the position adjusting mechanism 524 and is movable in the Z axis direction.

The base 521 and the position adjustment mechanism 524 are attached to the upper portion of the upper plate 525 on the movable stage (not shown) that is movable in the X axis direction and the Y axis direction. The rising portion 522B constituting the substrate raising mechanism 522 penetrates through the top plate 525 and is driven along the guide 526 in the Z axis direction by an actuator (not shown). The position adjustment mechanism 524 is driven in the Z axis direction by an actuator (not shown) provided on the upper plate 525.

Another variant

An exemplary embodiment has been described above with the example of applying the substrate holding apparatus according to the present invention to a scanner as the exposure apparatus 1. In addition, the substrate holding apparatus of the present invention can also be applied to a stepper that projects the fixed pattern of the original plate 310 onto the substrate 510.

Article manufacturing method

The method of manufacturing an article (for example, a semiconductor integrated circuit element and a liquid crystal display element) using the above-mentioned exposure apparatus is demonstrated. The article manufacturing method includes a process of irradiating exposure light to a substrate held using a substrate holding apparatus according to an exemplary embodiment to form a pattern, and a process of processing (developing and etching) the substrate on which the pattern is formed. do. Exposure unevenness can be effectively reduced using the substrate holding apparatus according to the present invention. As a result, the accuracy of forming the pattern on the substrate can be improved.

Compared with the conventional method, the present article manufacturing method is advantageous in at least one of the performance, quality, productivity and production cost of the article. The exposure apparatus described above can provide articles such as high definition devices (eg, semiconductor integrated circuit elements and liquid crystal display elements).

Although the invention has been described in detail based on the exemplary embodiments described above, the invention is not limited to this and may be modified in various ways within the scope of the appended claims.

While the invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass the structures and functions equivalent to all such modifications.

Claims (14)

Substrate holding device,
A base having a gap and configured to hold a substrate;
A reflecting member disposed in the gap and configured to reflect light passing through the substrate toward the substrate,
And a reflectance of the reflective member with respect to light transmitted through the substrate is higher than a reflectance of the base with respect to light transmitted through the substrate. The method of claim 1,
And a diffuse reflectance of the reflecting member for light passing through the substrate is higher than a diffuse reflectance of the base for light passing through the substrate. The method of claim 1,
And the specular reflectance of the reflective member relative to the light transmitted through the substrate is higher than the specular reflectance of the base relative to the light transmitted through the substrate. The method of claim 1,
A resist is coated on the substrate,
The reflective member reduces the difference between the amount of light that is reflected by the base and reaches the first resist region on the base and the amount of light that is reflected by the reflective member and reaches the second resist region on the reflective member. And a substrate holding device. The method of claim 1,
And the reflective member is disposed below an upper surface of the base. The method of claim 1,
And the reflective member is movable in the vertical direction. The method of claim 6,
And a adjusting mechanism configured to move the reflective member in the vertical direction. The method of claim 1,
And the base has a through hole, and the reflective member is disposed inside the through hole. The method of claim 1,
A raising mechanism configured to raise and lower the substrate in a vertical direction,
And the reflective member is disposed in a gap between the base and the lift mechanism. The method of claim 9,
The reflector of the said reflection member with respect to the light which permeate | transmitted the said board | substrate is a board | substrate holding apparatus higher than the reflectance of the said raise mechanism or the conveyance member which conveys the said board | substrate. The method of claim 10,
A resist material is coated on the substrate,
The reflecting member includes a light amount reflected by the reflecting member and reaching a second resist region on the reflecting member and a third resist region reflecting by the raising mechanism or the conveying member and on the raising mechanism or the conveying member. A substrate holding apparatus, arranged to reduce a difference between the amounts of light reaching the target. The method of claim 1,
The base includes a plurality of substrate holding portion for holding the substrate,
And the reflective member is disposed in a gap between the plurality of substrate holding portions. Exposure device,
A substrate holding apparatus including a base having a gap and configured to hold a substrate, and a reflecting member disposed in the gap and configured to reflect light passing through the substrate to the substrate side,
The exposure apparatus transfers the pattern of the original plate onto the substrate using exposure light while the substrate having the property of transmitting exposure light is held by the substrate holding apparatus.
And a reflectance of the reflecting member with respect to light passing through the substrate is higher than a reflectance of the base with respect to light passing through the substrate. Is a method of making an article,
Exposing the substrate using an exposure apparatus that transfers the pattern of the original onto the substrate using exposure light;
Developing the exposed substrate;
The exposure apparatus,
A substrate holding apparatus including a base having a gap and configured to hold a substrate, and a reflecting member disposed in the gap and configured to reflect light passing through the substrate to the substrate side,
The exposure apparatus transfers the pattern of the original plate onto the substrate using exposure light while the substrate having the property of transmitting exposure light is held by the substrate holding apparatus.
And the reflectance of the reflective member to light passing through the substrate is higher than the reflectance of the base to light passing through the substrate.

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