KR20190135407A - Method of aligning chip part - Google Patents

Abstract

The present invention improves an alignment rate at the time of aligning a chip component so that the direction of an internal electrode faces the direction orthogonal to the bottom surface. An arranging method of the chip component made of a magnetic material and including an internal electrode parallel to a surface defined by the longitudinal direction and the width direction, wherein the chip component has a substantially rectangular parallelepiped shape with a dimension (L1) in the longitudinal direction longer than a dimension (W1) in the width direction and a dimension (T1) in the thickness direction, comprises: a process of accommodating the chip component in an accommodation space having the bottom surface, a first sidewall, a second sidewall, and a third sidewall wherein the distance between the opposing first sidewall and the second sidewall is equal to or more than the diagonal dimension of a surface defined by the width direction and the thickness direction of the chip component and is equal to or less than the dimension (L1); and a process of moving a magnet relative to the chip component accommodated in the accommodation space. The magnetization direction when the magnet is moved relative to the chip component is in a range of 0 to 90° with respect to the longitudinal direction of the chip component.

Description

Chip part alignment method {METHOD OF ALIGNING CHIP PART}

The present invention relates to a method of aligning chip components.

For a chip component having an internal electrode and having a substantially rectangular parallelepiped shape, a method of aligning the chip component such that the internal electrode faces a predetermined direction is known.

Patent Document 1 describes the direction of the internal electrode by moving the magnet in a direction parallel to the bottom surface of the pocket in a state where the chip component is accommodated in a concave pocket larger than the dimensions of the chip component in a plan view. A method of arranging in a direction orthogonal to a plane is described. That is, when the magnet is moved to the internal electrode by moving the magnet with respect to the chip component in which the flat inner electrode is parallel to the bottom surface of the pocket, the chip component is transversely reversed so that the direction of the inner electrode is changed to the bottom of the pocket. It is described in patent document 1 to align in the direction orthogonal to a surface.

Japanese Patent Laid-Open No. 2003-7574

However, in the alignment method of patent document 1, as shown in FIG. 1 and FIG. 2, the magnetization direction of the magnet with respect to the longitudinal direction of a chip component is set to 90 degrees. For this reason, the lateral conductivity of the chip component in which the direction of the internal electrodes is parallel to the bottom surface of the pocket is not so high, and there is room for improvement in order to improve the alignment ratio of the chip component.

This invention solves the said subject and an object of this invention is to provide the technique which can improve the alignment rate of a chip component.

Alignment method of the chip component of the present invention,

An internal electrode having a substantially rectangular parallelepiped shape whose length L1 in the longitudinal direction is longer than the dimension W1 in the width direction and the size T1 in the thickness direction, and is a magnetic material and parallel to the surface defined by the longitudinal direction and the width direction. As an alignment method of chip components, including

The first sidewall having a bottom surface, a first sidewall, a second sidewall facing the first sidewall, a third sidewall positioned between the surface along the first sidewall and the surface along the second sidewall, And the distance between the second side wall and the second side wall to accommodate the chip component in an accommodation space that is equal to or larger than the diagonal dimension of the surface defined by the width direction and the thickness direction of the chip component and is equal to or smaller than the dimension L1 in the longitudinal direction. Fair,

Moving the magnet relative to the chip component accommodated in the accommodation space, thereby aligning the chip component such that the direction of the internal electrode faces a direction orthogonal to the bottom surface;

The magnetization direction when the magnet is moved relative to the chip component is characterized in that it is in a range of 0 ° or more and less than 90 ° with respect to the length direction of the chip part.

The accommodation space may further include a fourth side wall facing the third side wall.

The accommodation space may be a recess provided in the substrate.

After accommodating the chip component in the accommodating space, further comprising a step of covering a lid to cover an upper portion of the accommodating space,

In the state which covered the said lid, the distance from the said bottom surface to the inner surface of the said lid may be more than the dimension of the diagonal of the surface prescribed | regulated by the said width direction and the said thickness direction of the said chip component.

In the state which covered the said lid, the distance from the said bottom surface to the inner surface of the said lid may be below the dimension L1 of the said longitudinal direction of the said chip component.

The relative movement direction of the magnet with respect to the chip component accommodated in the accommodation space may be in a direction of 0 ° or more and less than 90 ° with respect to the magnetization direction of the magnet.

The accommodation space is provided in a plurality of substrates,

The plurality of storage spaces may be arranged in a first direction parallel to the main surface of the substrate.

The plurality of accommodation spaces provided in a line in the first direction may be provided in plurality in a second direction orthogonal to the first direction while being parallel to the main surface of the substrate.

The chip component includes a plurality of the internal electrodes stacked in the thickness direction,

The plurality of internal electrodes may be exposed on the side surfaces of the chip components that face the width direction.

The bottom surface, the first sidewall, the second sidewall and the third sidewall may be formed of a nonmagnetic material.

You may perform the process of moving the said magnet relatively with respect to the said chip component in multiple times.

The movement speed at the time of relatively moving the magnet with respect to the chip component may be 100 mm / s or less.

According to the alignment method of the chip component of the present invention, the magnet is moved relative to the chip component so that the magnetization direction of the magnet with respect to the longitudinal direction of the chip component is in a range of 0 ° or more and less than 90 °. The rotation rate of the chip component not facing the direction perpendicular to the bottom surface is increased, and the alignment rate at which the direction of the internal electrodes is directed at the direction orthogonal to the bottom surface can be improved.

1 is a perspective view of a ceramic body constituting a multilayer ceramic capacitor.
2 is a view for explaining the dimensions of the diagonal of the surface defined by the width direction and the thickness direction of the ceramic body.
3 is a perspective view showing the shape of the first internal electrode disposed on the dielectric layer, and (b) is a perspective view showing the shape of the second internal electrode disposed on the dielectric layer.
4 is a plan view showing the shape of a pallet.
5: (a) is a top view which shows the shape of the recessed part provided in the pallet, and (b) is a side view of the recessed part in the state which covered the lid | cover.
6 is a plan view showing a state in which the magnet is moved in a direction parallel to the pallet from above the lid.
FIG. 7 is a view for explaining a process of rotating the ceramic body to orient the internal electrode by moving the magnet relative to the ceramic body.
8 is a cross-sectional view in the case of using a lid of a shape in which the inner surface portion located above the concave portion is recessed in the thickness direction with respect to another inner surface portion.

EMBODIMENT OF THE INVENTION Embodiment of this invention is shown to the following, and what characterizes this invention is demonstrated concretely.

First, the structure of the chip component to be aligned is explained. Here, as an example of a chip component, the ceramic body which comprises a multilayer ceramic capacitor is demonstrated.

(Ceramic body)

1 is a perspective view of a ceramic element 10 constituting a multilayer ceramic capacitor. The ceramic body 10 has a substantially rectangular parallelepiped shape as a whole.

Here, the direction parallel to the longest side of the ceramic element 10 which has a substantially rectangular parallelepiped shape is defined as the longitudinal direction L. As shown in FIG. In addition, the lamination direction of the internal electrodes 2 (2a, 2b), which will be described later, is defined as the thickness direction T, and the direction perpendicular to any of the longitudinal direction L and the thickness direction T is defined by the width direction W. Is defined as).

The ceramic body 10 has a first end face 11a and a second end face 11b facing in the longitudinal direction L, and a first main face 12a and a second main face facing in the thickness direction T. FIG. 12b and the 1st side surface 13a and the 2nd side surface 13b which face in the width direction W are provided.

The ceramic body 10 preferably has a round shape at the corners and the ridges. Here, the edge portion is a portion where three surfaces of the ceramic body 10 cross each other, and the ridge line portion is a portion where two surfaces of the ceramic body 10 cross each other. The above-mentioned "approximately rectangular parallelepiped shape" also includes the shape which rounded the edge part and the ridge part.

The dimension L1 of the longitudinal direction L of the ceramic body 10 is longer than the dimension W1 of the width direction W and the dimension T1 of the thickness direction T. As shown in FIG. That is, the relationship of L1> W1 and L1> T1 is established.

For example, the dimension L1 of the longitudinal direction L of the ceramic body 10 is 1.1 mm, the dimension W1 of the width direction W is 0.57 mm, and the dimension T1 of the thickness direction T. Is 0.57 mm. 2, the surface defined by the width direction W and the thickness direction T of the ceramic body 10, that is, the surface when the ceramic body 10 is viewed in the longitudinal direction L. The diagonal dimension D1 is 0.8 mm, for example.

The ceramic body 10 includes a dielectric layer 1, a first internal electrode 2a, and a second internal electrode 2b. The first internal electrode 2a and the second internal electrode 2b are disposed in parallel with the surface defined by the longitudinal direction L and the width direction W of the ceramic element 10.

3 (a) is a perspective view showing the shape of the first internal electrode 2a disposed on the dielectric layer 1, and FIG. 3 (b) shows the shape of the second internal electrode 2b disposed on the dielectric layer 1. It is a perspective view showing a shape.

As shown in Fig. 3A, the first internal electrode 2a has a cross shape when viewed in plan view. A pair of opposite ends 21x and 21y of the first internal electrode 2a are drawn out and exposed to the first side surface 13a and the second side surface 13b of the ceramic element 10, respectively. .

As shown in Fig. 3B, the second internal electrode 2b has a rectangular shape in plan view. A pair of opposite ends 22x and 22y of the second internal electrode 2b are drawn out and exposed to the first end face 11a and the second end face 11b of the ceramic element 10, respectively.

The first internal electrodes 2a and the second internal electrodes 2b are alternately arranged in the thickness direction T with the dielectric layer 1 interposed therebetween. The capacitance is formed by opposing the first internal electrode 2a and the second internal electrode 2b with the dielectric layer 1 interposed therebetween, thereby functioning as a capacitor.

The first internal electrode 2a and the second internal electrode 2b contain, for example, metals such as Ni, Cu, Ag, Pd, and Au, alloys of Ag and Pd, and the like. The first internal electrode 2a and the second internal electrode 2b may further include dielectric particles having the same composition as the ceramic contained in the dielectric layer 1.

The dielectric layer 1 is made of, for example, a material mainly composed of a dielectric ceramic. Specific examples of the dielectric ceramic for example, may be mentioned, for _{example, BaTiO 3, CaTiO 3, SrTiO} 3, CaZrO 3 , etc. Subsidiary components, such as an Mn compound, an Mg compound, a Si compound, a Co compound, a Ni compound, and a rare earth compound, for example, may be added to the dielectric layer 1 suitably.

For example, a three-terminal multilayer ceramic capacitor can be formed using the ceramic body 10 having the above-described configuration. Such a three-terminal multilayer ceramic capacitor includes the ceramic body 10 described above, the first external electrode formed on the first end face 11a, the second external electrode formed on the second end face 11b, and the ceramic body. A band-shaped third external electrode formed on the first side surface 13a, the second side surface 13b, the first main surface 12a, and the second main surface 12b to circumscribe (10) is included.

The first external electrode is electrically connected to the second internal electrode 2b drawn out on the first end face 11a. The second external electrode is electrically connected to the second internal electrode 2b drawn out on the second end face 11b. In addition, the third external electrode is electrically connected to the first internal electrode 2a drawn to the first side surface 13a and the second side surface 13b.

(How to arrange chip parts)

The alignment method of chip components is demonstrated. Here, it demonstrates as a chip element which is the ceramic element 10 which has the structure mentioned above.

First, the pallet and pallet lid as a board | substrate with which the some recessed part was provided are prepared. The recess constitutes a receiving space in which the chip component is accommodated. The pallet and lid are made of, for example, non-magnetic Bakelite.

4 is a plan view showing the shape of the pallet 40. 5 (a) is a plan view showing the shape of the recess 41 provided in the pallet 40, and FIG. 5 (b) is a side view of the recess 41. FIG.5 (b) has shown the side view of the state which covered the lid 42 to the pallet 40. As shown in FIG.

The pallet 40 has a flat plate shape as a whole and includes a plurality of recesses 41. As shown in FIG. 4, the recessed part 41 is provided in plurality in parallel with the 1st direction (X-axis direction) parallel to the main surface of the flat pallet 40, and is also parallel with the main surface of the pallet 40. As shown in FIG. While plurally arranged along the second direction (Y-axis direction) perpendicular to the first direction. However, the number of the recessed parts 41 provided in the pallet 40 is not limited to the number shown in FIG.

The recessed part 41 is comprised by the bottom surface 41a, the 1st side wall 41b, the 2nd side wall 41c, the 3rd side wall 41d, and the 4th side wall 41e. The first side wall 41b and the second side wall 41c are provided at positions facing each other. The third side wall 41d and the fourth side wall 41e are provided at positions facing each other. The third sidewall 41d and the fourth sidewall 41e are orthogonal to the first sidewall 41b and the second sidewall 41c, respectively.

In this case, the length of the recess 41 is defined by a direction parallel to the longest side among the sides constituting the bottom surface of the recess 41, that is, a direction in which the third side wall 41d and the fourth side wall 41e face each other. It is called direction. Moreover, the width | variety of the recessed part 41 is a direction parallel to the shortest side among the sides which comprise the bottom surface of the recessed part, ie, the direction which the 1st side wall 41b and the 2nd side wall 41c oppose. It is called direction. In addition, the direction orthogonal to the bottom surface 41a is called the depth direction of the recessed part 41.

The dimension L2 of the longitudinal direction of the recessed part 41 is longer than the dimension W2 of the width direction, and the dimension T2 of the depth direction. That is, the relationship of L2> W2 and L2> T2 is established.

The dimension L2 of the longitudinal direction of the recessed part 41 is longer than the dimension L1 of the longitudinal direction L of the ceramic element 10. The dimension W2 of the width direction of the recessed part 41 is longer than the dimension W1 of the width direction W of the ceramic body 10, and the dimension T1 of the thickness direction T. As shown in FIG.

In addition, the dimension W2 of the width direction of the recessed part 41 is the diagonal dimension D1 of the surface prescribed | regulated by the width direction W and the thickness direction T of the ceramic element 10 (refer FIG. 2). ), But not more than the dimension L1 of the longitudinal direction L of the ceramic body 10.

In the state which covered the lid 42 on the pallet 40 so that the upper part of the recessed part 41 may be blocked, the distance from the bottom surface 41a of the recessed part 41 to the inner surface 42a of the lid 42 is a ceramic. It is more than the dimension D1 (refer FIG. 2) of the diagonal of the surface prescribed | regulated by the width direction W and the thickness direction T of the body 10. FIG. In this embodiment, as shown to FIG. 5 (b), the distance from the bottom surface 41a of the recessed part to the inner surface 42a of the lid 42 is the dimension of the depth direction of the recessed part 41 ( Same as T2).

In addition, in the state which covered the lid 42, the distance from the bottom surface 41a of the recessed part 41 to the inner surface 42a of the lid 42 is the dimension L1 of the longitudinal direction L of the ceramic element 10. )

The dimension of the ceramic element 10 is the dimension described above, that is, the dimension L1 in the longitudinal direction L is 1.1 mm, the dimension W1 in the width direction W is 0.57 mm, and the dimension in the thickness direction T ( When T1) is 0.57 mm, an example of the dimension of the recessed part 41 is as follows. That is, the dimension L2 of the longitudinal direction of the recessed part 41 is 1.3 mm, for example, and the dimension W2 of the width direction is 0.9 mm, for example. In addition, the dimension T2 of the depth direction of the recessed part 41, ie, the distance from the bottom face 41a of the recessed part 41 to the inner surface 42a of the lid 42 is 1.0 mm, for example.

The ceramic element 10 is thrown into the recessed part 41 of the prepared pallet 40. Since the dimensions of the ceramic body 10 and the recessed part 41 have the relationship described above, one of the first end face 11a and the second end face 11b of the ceramic body 10 put into the recessed part 41 It faces the 3rd side wall 41d of the recessed part 41, and the other side opposes the 4th side wall 41e.

Next, the lid 42 is disposed on the upper portion of the pallet 40 so as to cover the upper portion of the ceramic body 10 accommodated in the recess 41.

Subsequently, while the magnetization direction of the magnet with respect to the longitudinal direction L of the ceramic body 10 is in the range of 0 degree or more and less than 90 degree, a magnet is made relative to the ceramic body 10 accommodated in the recessed part 41. FIG. Move to. Here, in the method of "moving the magnet relative to the ceramic body 10", a method of moving the magnet without moving the pallet 40, a method of moving the pallet 40 without moving the magnet, a pallet ( There is a method of moving both 40) and the magnet. That is, the magnet may be moved relative to the ceramic element 10 by any of the three methods described above.

In this embodiment, the magnet is moved without moving the pallet 40. Specifically, as shown in FIG. 6, the magnet 50 is moved above the lid 42 in a direction parallel to the main surface of the flat pallet 40. The magnet 50 is moved to pass above the ceramic body 10 accommodated in all the recesses 41 of the pallet 40, respectively.

The magnet 50 is, for example, a neodymium magnet. The magnet 50 shown in FIG. 6 has a rectangular shape in plan view, and the magnetization direction (magnetization direction) K is the width direction orthogonal to the longitudinal direction of the magnet 50.

As described above, when the magnet 50 is moved relative to the ceramic body 10, the magnetization direction K of the magnet 50 is 0 ° with respect to the longitudinal direction L of the ceramic body 10. It exists in the range below 90 degrees or more. That is, the angle θ between the longitudinal direction L of the ceramic body 10 and the magnetization direction K of the magnet 50 is 0 ° or more and less than 90 ° (see FIG. 6). 6, the angle (theta) when the longitudinal direction L of the ceramic body 10 is equal to the Y-axis direction is shown.

The relative movement direction of the magnet 50 with respect to the ceramic body 10 is made into the direction of 0 degrees or more and less than 90 degrees with respect to the magnetization direction K of the magnet 50. In this embodiment, the magnet 50 is moved in the Y-axis direction. When the longitudinal direction L of the ceramic body 10 coincides with the Y-axis direction, the angle between the moving direction of the magnet 50 and the magnetization direction K is the lengthwise direction of the ceramic body 10 described above ( It is equal to the angle θ between L) and the magnetization direction K of the magnet 50. On the other hand, it is preferable that the relative movement direction of the magnet 50 with respect to the ceramic element 10 is a direction along the main surface of the pallet 40 as a board | substrate.

In the present embodiment, by moving the magnet 50 relative to the ceramic element 10, the ceramic element 10 in which the direction of the internal electrode 2 is in a direction parallel to the bottom surface 41a of the recess 41. ) Is rotated so that the direction of the internal electrode 2 is aligned in the direction orthogonal to the bottom surface 41a of the recess 41. The direction of the internal electrode 2 is a direction parallel to the internal electrode 2 in the form of a plate.

That is, the magnet 50 is relatively moved with respect to the ceramic element 10 (see FIG. 7A) in which the direction of the internal electrode 2 is parallel to the bottom surface 41a of the recess 41. This causes the magnetic force lines of the magnet 50 to act on the internal electrode 2. The longitudinal direction L of the ceramic body 10 shown to Fig.7 (a) is a Y-axis direction.

By applying the magnetic force lines of the magnet 50 to the internal electrode 2, as shown in Fig. 7 (b), the ceramic element (see Fig. 7 (b)) has an axis in the direction parallel to the longitudinal direction L of the ceramic element 10 as the rotation axis. 10) rotate. As shown in FIG. 7C, the direction of the internal electrode 2 is aligned in the direction orthogonal to the bottom surface 41a of the recess 41.

According to the alignment method of the chip component in this embodiment, the magnetization direction K of the magnet 50 with respect to the longitudinal direction L of the ceramic element 10 which is a chip component will be in the range of 0 degrees or more and less than 90 degrees. Since the magnet 50 is relatively moved relative to the ceramic body 10, the rotation rate of the ceramic body 10 in which the direction of the internal electrode 2 is parallel to the bottom surface 41a of the recess 41 is increased. It can improve the sorting rate.

As mentioned above, the dimension W2 of the width direction of the recessed part 41 is the dimension D1 of the diagonal of the surface prescribed | regulated by the width direction W and the thickness direction T of the ceramic element 10 ( 2 or more, and below the dimension L1 of the longitudinal direction L of the ceramic element 10. FIG. Thereby, while preventing the ceramic body 10 from rotating with an axis orthogonal to the bottom surface 41a of the recess 41 as the rotation axis, the ceramic body 10 is made the axis of the longitudinal direction L of the ceramic body 10 as the rotation axis. 10 can be rotated.

In addition, since the recessed part 41 includes the first sidewall 41b, the second sidewall 41c, the third sidewall 41d, and the fourth sidewall 41e in addition to the bottom surface 41a, the ceramic body 10 Does not protrude to the outside in the direction parallel to the bottom surface 41a. Thereby, the magnet 50 can be relatively reciprocated with respect to the ceramic element 10, and an alignment rate can be improved as mentioned later.

In addition, by covering the lid 42 so as to prevent the upper portion of the recess 41 of the pallet 40, the ceramic body 10 can be prevented from protruding out. In the state which covered the lid 42, the distance from the bottom surface 41a of the recessed part 41 to the inner surface of the lid 42 is based on the width direction W and the thickness direction T of the ceramic element 10. Since it is larger than the diagonal dimension D1 of the surface prescribed | regulated, the ceramic element 10 can be rotated by making the axis | shaft of the longitudinal direction L of the ceramic element 10 into a rotating shaft also in the state which covered the lid 42. FIG.

In addition, since the distance from the bottom surface 41a of the recessed part 41 to the inner surface of the lid 42 in the state which covered the lid 42 is below the dimension L1 of the longitudinal direction L of the ceramic element 10, With the first end face 11a or the second end face 11b facing down, the ceramic body 10 can be prevented from standing.

As described above, in the chip component alignment method according to the present embodiment, the relative moving direction of the magnet 50 with respect to the ceramic element 10 accommodated in the recess 41 is the magnetization direction K of the magnet 50. It is a direction of 0 degrees or more and less than 90 degrees with respect to). When the relative movement direction of the magnet 50 is set to 90 ° with respect to the magnetization direction K of the magnet 50, the rotation rate of the ceramic element 10 is lowered, so that the magnet 50 is rotated in the magnetization direction K of the magnet 50. By setting it as the direction of 0 degrees or more and less than 90 degrees with respect to, the rotation rate of the ceramic element 10 can be improved and an alignment rate can be improved.

(Example 1)

The plurality of ceramic bodies 10 having a length L of 1.1 mm, a width W of 0.57 mm, and a thickness T of 0.57 mm are prepared. did. The dimension D1 of the surface defined by the width direction W and the thickness direction T of this multilayer ceramic capacitor is about 0.8 mm.

Moreover, the pallet including the plurality of recessed parts whose length L2 is 1.3 mm, the dimension W2 of the width direction is 0.9 mm, and the dimension T2 of the depth direction of the recessed part 41 is 1.0 mm was prepared.

And after putting a laminated ceramic capacitor into the some recessed part of a pallet, the lid was covered.

Thereafter, the neodymium magnet (hereinafter, simply referred to as a magnet) prepared in advance was moved in a direction parallel to the flat pallet on the upper side of the lid. The magnet has a rectangular parallelepiped shape of 240 mm in length, 20 mm in width and 15 mm in height. The magnet was moved at a speed of 100 mm / s at a position 15 mm from the surface where the pallet and the lid were in contact. The moving direction of the magnet was in the same direction as the magnetizing direction.

In this case, the 546 ceramic bodies introduced into the recess of the pallet are subjected to an object, and the direction of the internal electrodes of the ceramic body is changed by changing the angle θ between the longitudinal direction L of the ceramic body and the magnetization direction K of the magnet. The alignment rate aligned in the direction orthogonal to the bottom surface of the recess was investigated.

Since the dimension W1 in the width direction W of the ceramic element is the same as the dimension T1 in the thickness direction, when the ceramic element is placed in the recess of the pallet, the direction of the internal electrodes is parallel to the bottom surface of the recess. The probability of becoming a direction and the probability of becoming a direction orthogonal to the bottom surface of the recess are the same. Therefore, the alignment rate in the state which put the ceramic body into the recessed part of a pallet is 50%.

Table 1 shows the relationship between the angle θ and the alignment rate between the longitudinal direction L of the ceramic body and the magnetization direction K of the magnet. The alignment rate was performed three times to calculate the alignment rate after the magnet was moved once relative to the pallet, and the alignment rate was the average of three alignment rates.

As shown in Table 1, as the angle θ between the longitudinal direction L of the ceramic body and the magnetization direction K of the magnet was closer to 0 °, the alignment ratio was higher. In this embodiment, when the angle [theta] is 5 [deg.], The alignment rate is 100%, and the alignment rate is the highest. Moreover, when the said angle (theta) was 60 degrees or more, the alignment rate became 85% or more.

As shown in Table 1, when the said angle (theta) was 90 degrees, the alignment rate became less than 80%, and the alignment rate became the lowest. This is presumably because when the angle θ is 90 °, almost the same magnetic force acts on both ends of the longitudinal direction L of the ceramic element, and rotational force is less likely to occur.

That is, as in the present embodiment, the magnet is relatively to the ceramic body in a state where the angle θ between the longitudinal direction L of the ceramic body and the magnetization direction K of the magnet is set to 0 ° or more and less than 90 °. By moving, the alignment rate which makes the direction of an internal electrode orientate in the direction orthogonal to the bottom surface of a recessed part can be improved.

In particular, since the alignment rate can be 85% or more by setting the angle θ between the longitudinal direction L of the ceramic body and the magnetization direction K of the magnet to be 0 ° or more and 60 ° or less, it is preferable.

(Example 2)

By changing the moving speed V when moving the magnet relative to the pallet, the alignment rate at which the direction of the internal electrodes of the ceramic element is aligned in the direction orthogonal to the bottom surface of the recess was investigated. The sizes of the ceramic body and the pallet are the same as those in the first embodiment. However, angle (theta) between the longitudinal direction L of a ceramic element, and the magnetization direction K of a magnet was 1 degree.

Table 2 shows the relationship between the moving speed V and the alignment rate of the magnet. As for the alignment rate, similarly to Example 1, three steps of calculating the alignment rate after moving the magnet relative to the pallet one time were carried out three times, and the alignment rate was set to the average value of three alignment rates.

As shown in Table 2, although the moving speed V of the magnet was changed to 67.5 mm / s, 85 mm / s, and 112.5 mm / s, the alignment ratios were all higher than 90%. In particular, when the moving speed V of the magnet is 100 mm / s or less, the alignment rate is higher than that when the moving speed V is less than 100 mm / s. Therefore, the moving speed when the magnet is relatively moved with respect to the ceramic body It is preferable to make V 100 mm / s or less.

Moreover, the alignment rate at the time of moving the magnet relatively N times with respect to the pallet was made with the moving speed V of a magnet being 112.5 mm / s. Table 3 shows the relationship between the number N of magnet movements and the alignment rate.

As shown in Table 3, when the number of movements of the magnet N was 1, the alignment rate was 96.5%, and as the number N of moving the magnets relative to the pallet increased, the alignment rate became higher and approached 100%. That is, as the number N of moving the magnet relative to the pallet increases, the alignment rate is improved. Further, even if the number N of moving the magnet relative to the pallet increases, the ceramic element whose direction of the internal electrode coincides with the direction perpendicular to the bottom surface of the recess rotates, so that the direction of the internal electrode is parallel to the bottom surface of the recess. It is unlikely to be in one direction.

The present invention is not limited to the above embodiment, and various applications and modifications can be made within the scope of the present invention.

For example, the configuration of the chip component, which is the object to be aligned in the direction orthogonal to the bottom surface of the recess, is not limited to the configuration shown in FIG. For example, the chip component to be aligned may be a chip component before firing or a chip component having an external electrode, for example, a multilayer ceramic capacitor.

In the above-described embodiment, in order to move the magnet 50 relative to the ceramic body 10 relatively, the magnet 50 is not moved without moving the pallet 40 in which the ceramic body 10 is accommodated in the recess 41. It was explained as moving. However, the pallet 40 may be moved without moving the magnet 50, or both the pallet 40 and the magnet 50 may be moved.

In the above-mentioned embodiment, the accommodating space of a chip component is concave comprised by the bottom surface 41a, the 1st side wall 41b, the 2nd side wall 41c, the 3rd side wall 41d, and the 4th side wall 41e. It demonstrated as a part 41. However, the accommodation space should have at least a bottom face, a first side wall, a second side wall and a third side wall. For example, the storage space may be formed by arranging the pillar which forms a 1st side wall, the pillar which forms a 2nd side wall, and the pillar which forms a 3rd side wall on the bottom surface.

In addition, in the above-described embodiment, the third sidewall 41d is provided in the form orthogonal to the first sidewall 41b and the second sidewall 41c, but at least the surface along the first sidewall 41b and the second sidewall What is necessary is just to position between the surfaces along 41c. Here, the "surface along the first sidewall 41b" includes not only the surface of the first sidewall 41b but also an extended shaving of the surface of the first sidewall 41b. The same applies to the "side along the second sidewall 41c". In that case, the surfaces of the first sidewall 41b, the second sidewall 41c, and the third sidewall 41d need not be flat. However, like the above-mentioned embodiment, it is preferable that the 3rd side wall 41d is provided in the aspect orthogonal to the 1st side wall 41b and the 2nd side wall 41c.

In the above-mentioned embodiment, the distance from the bottom surface 41a of the recessed part 41 to the inner surface 42a of the lid 42 is the same as the dimension T2 of the depth direction of the recessed part 41, but may differ. For example, as for the lid 42A shown in FIG. 8, the part 421 located above the recessed part 41 in its inner surface is dug in the thickness direction of the lid 42A compared with the other part 422. have. Therefore, the distance T3 from the bottom surface 41a of the recessed part 41 to the inner surface of the lid 42 is longer than the dimension T2 of the depth direction of the recessed part 41.

In the above-described embodiment, as illustrated in FIG. 6, the magnet 50 is moved in a direction parallel to the flat pallet 40 above the lid 42, but the pallet 40 is lowered. In this case, the magnet 50 may be moved in a direction parallel to the flat pallet 40.

1: dielectric layer 2a: first internal electrode
2b: second internal electrode 10: ceramic body
11a: first cross section 11b: second cross section
12a: first principal plane 12b: second principal plane
13a: first side 13b: second side
40: pallet 41: recess
41a: bottom surface of recessed portion 41b: first side wall
41c: second sidewall 41d: third sidewall
41e: fourth side wall 42: lid
50: magnet

Claims (12)

The length L1 in the longitudinal direction has a rectangular parallelepiped shape which is longer than the width W1 in the width direction and the size T1 in the thickness direction, and is a magnetic material that is parallel to the surface defined by the length direction and the width direction. As an alignment method of the chip component included,
The first sidewall having a bottom surface, a first sidewall, a second sidewall facing the first sidewall, and a third sidewall positioned between the surface along the first sidewall and the surface along the second sidewall; The chip component in a receiving space having a distance between the second sidewall and the second side wall being equal to or larger than the diagonal dimension D1 of the surface defined by the width direction and the thickness direction of the chip component, or less than the dimension L1 in the longitudinal direction. To accommodate the process,
Moving the magnet relative to the chip component accommodated in the accommodation space, thereby aligning the chip component such that the direction of the internal electrode faces a direction orthogonal to the bottom surface;
The magnetization direction at the time of moving the said magnet relatively with respect to the said chip component is a range of 0 degree or more and less than 90 degree with respect to the said longitudinal direction of the said chip component. The method of claim 1,
And the receiving space further comprises a fourth side wall facing the third side wall. The method according to claim 1 or 2,
And the accommodation space is a recess provided in the substrate. The method according to claim 1 or 2,
After accommodating the chip component in the accommodating space, further comprising a step of covering a lid to cover an upper portion of the accommodating space,
In the state which covered the said lid, the distance from the said bottom surface to the inner surface of the said lid is more than the dimension of the diagonal of the surface prescribed | regulated by the said width direction and the said thickness direction of the said chip component, The alignment method of the chip component characterized by the above-mentioned. The method of claim 4, wherein
In the state that the lid is covered, the distance from the bottom surface to the inner surface of the lid is less than the dimension (L1) in the longitudinal direction of the chip component. The method according to claim 1 or 2,
The direction of movement of the magnet relative to the chip component accommodated in the accommodating space is a direction of 0 ° or more and less than 90 ° with respect to the magnetization direction of the magnet. The method according to claim 1 or 2,
The accommodation space is provided in a plurality of substrates,
A plurality of said accommodating spaces are arranged in the 1st direction parallel to the main surface of the said board | substrate, The alignment method of the chip component characterized by the above-mentioned. The method of claim 7, wherein
And the plurality of accommodating spaces arranged in a line in the first direction are provided in a plurality of lines in a second direction perpendicular to the first direction while being parallel to the main surface of the substrate. The method according to claim 1 or 2,
The chip component includes a plurality of internal electrodes stacked in the thickness direction.
And a plurality of internal electrodes are exposed on side surfaces of the chip components, which are faces opposite to the width direction of the chip components. The method according to claim 1 or 2,
And said bottom surface, said first side wall, said second side wall and said third side wall are made of a non-magnetic material. The method according to claim 1 or 2,
And a step of moving the magnet relative to the chip component a plurality of times. The method according to claim 1 or 2,
And a moving speed when the magnet is relatively moved with respect to the chip component is 100 mm / s or less.

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