KR20190117150A - Manufacturing method and apparatus of pressure sensor automated for MEMS chip attachment process - Google Patents

Manufacturing method and apparatus of pressure sensor automated for MEMS chip attachment process Download PDF

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KR20190117150A
KR20190117150A KR1020180040303A KR20180040303A KR20190117150A KR 20190117150 A KR20190117150 A KR 20190117150A KR 1020180040303 A KR1020180040303 A KR 1020180040303A KR 20180040303 A KR20180040303 A KR 20180040303A KR 20190117150 A KR20190117150 A KR 20190117150A
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mems chip
pressure sensor
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KR102059521B1 (en
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노상수
이응안
김성결
김경훈
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대양전기공업 주식회사
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00158—Diaphragms, membranes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors

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  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

The present invention relates to a manufacturing method for a pressure sensor with an automated MEMS chip attaching process, and a manufacturing device for the same. The manufacturing method for a pressure sensor with the automated MEMS chip attaching process can remarkably reduce manufacturing time by largely shortening a manufacturing process of the pressure sensor. Also, in a process of attaching an accurate micro electro mechanical systems (MEMS) chip, the individual MEMS chip can be individually picked up in a bridge connecting multiple MEMS chips to each other. The MEMS chip picked up can be attached while position setting and position correction are performed by multiple inspection devices. So, the accurate MEMS chip can be attached. Moreover, the manufacturing method for a pressure sensor with the automated MEMS chip attaching process enables mass production by being automatized. Also, the manufacturing method for a pressure sensor with the automated MEMS chip attaching process can reduce manufacturing time and remarkably improve manufacturing yield.

Description

MEMS 칩 부착공정이 자동화된 압력센서 제조방법 및 제조장치 {Manufacturing method and apparatus of pressure sensor automated for MEMS chip attachment process}Manufacturing method and apparatus for automating MEMS chip attachment process {Manufacturing method and apparatus of pressure sensor automated for MEMS chip attachment process}

본 발명은 MEMS 칩 부착공정이 자동화된 압력센서 제조방법 및 제조장치에 관한 것으로, 더욱 구체적으로 설명하면, 압력센서의 제조공정이 대단히 단축되어 제조시간이 월등하게 절감되는 것은 물론이고 정밀한 MEMS(micro electro mechanical systems) 칩의 부착공정이 다수의 MEMS 칩을 서로 연결시키는 브릿지에서 개별 MEMS 칩을 개별적으로 픽업할 수가 있게 되고 픽업된 MEMS 칩을 다수의 검사장비에 의하여 위치설정 및 위치교정을 수행하면서 부착가능하게 되어 정밀한 MEMS 칩의 부착이 이루어지게 되며, 자동화가 가능하여 대량생산이 가능하게 되고 제조시간이 단축되고 제조수율이 월등하게 향상되는 것이 가능한 MEMS 칩 부착공정이 자동화된 압력센서 제조방법 및 제조장치에 관한 것이다.The present invention relates to a pressure sensor manufacturing method and a manufacturing apparatus of the automated MEMS chip attachment process, more specifically, the manufacturing process of the pressure sensor is greatly shortened, the manufacturing time is significantly reduced, as well as precise MEMS (micro electro mechanical systems) The chip attachment process allows individual MEMS chips to be picked up individually from a bridge that connects multiple MEMS chips to each other. It is possible to attach precise MEMS chip, and it is possible to make mass production by automation and to shorten manufacturing time and improve manufacturing yield. Relates to a device.

일반적으로, 센서는 압력센서와 온도센서 외에도 다양한 종류의 센서가 사용되고 있으며, 종래의 압력센서는 상부에 미세한 압력을 감지하게 하는 다이아프램이 형성된 압력센서본체와, 상기 압력센서본체의 다이아프램상에 부착되는 MEMS 칩을 포함하여 제조되고, 상기 MEMS 칩은 다이아프램상에 가해지는 압력에 대응한 변형량 또는 변형률(strain)을 통해서 압력을 계측하며, 다이아프램의 원형평면 위에 MEMS 칩이 설치되어 있고, MEMS 칩의 압력계측저항 각각의 길이 및 평면적 변화에 따른 전기적 저항변화를 감지하여 압력을 계측할 수 있다.In general, the sensor is used in addition to a pressure sensor and a temperature sensor, various types of sensors are used, and the conventional pressure sensor is a pressure sensor main body having a diaphragm for sensing a minute pressure on the upper side, and on the diaphragm of the pressure sensor body The MEMS chip is manufactured including an attached MEMS chip, and the MEMS chip measures pressure through a deformation amount or strain corresponding to the pressure applied to the diaphragm, and the MEMS chip is installed on a circular plane of the diaphragm. The pressure can be measured by detecting the change in electrical resistance according to the length and planar change of each pressure measuring resistor of the MEMS chip.

종래의 압력센서의 다이아프램 표면에 MEMS 칩을 부착시키는 공정은, MEMS 칩이 부착될 표면의 표면가공을 수행하고, 표면가공 처리된 상부면에 압력감지를 할 수 있는 위치에 특정 형상으로 인쇄(이를 '스크린 인쇄'라고 함)를 수행하고, 상기 스크린 인쇄된 부분에 압력측정소자를 부착시키고, 부착된 압력측정소자에 대한 소성 공정을 통해 압력센서를 제조하는 방식으로 수행하고 있다.In the process of attaching the MEMS chip to the diaphragm surface of the conventional pressure sensor, the surface of the surface to which the MEMS chip is to be attached is processed and printed in a specific shape at a position capable of detecting pressure on the upper surface of the processed surface ( This is called 'screen printing', and the pressure measuring device is attached to the screen printed part, and the pressure sensor is manufactured by firing the attached pressure measuring device.

이러한 압력센서의 다이아프램 표면에 MEMS 칩을 부착시키는 종래의 공정을, 보다 상세하게 살펴보면, 표면가공 공정은 MEMS 칩이 부착될 다이아프램 표면을 미세 가공하여 표면을 미세한 수준에서 거칠게 하는 처리를 수행하여 접촉면적이 넓어지도록 가공하고, 다이아프램 표면의 미세 가공된 거친 표면을 세척시키는 방식으로 표면가공 공정을 수행하였다. Looking at the conventional process of attaching the MEMS chip to the diaphragm surface of the pressure sensor in more detail, the surface processing process is performed by processing the surface of the diaphragm to which the MEMS chip will be attached to finely roughen the surface at a fine level The surface treatment process was performed in such a manner that the contact area was widened and the micromachined rough surface of the diaphragm surface was washed.

또한, 스크린 인쇄를 하는 공정은 MEMS 칩이 부착될 거친 표면의 다이아프램 일부의 부분에 액상접착제를 인쇄하고, 인쇄된 액상접착제부로 이루어진 인쇄부의 표면을 300~800℃ 열을 10분 이상 가하여 액상접착제를 경화하기 위한 소성 공정을 수행한다.In addition, in the screen printing process, the liquid adhesive is printed on a part of the diaphragm of the rough surface to which the MEMS chip is to be attached, and the liquid adhesive is applied to the surface of the printing portion consisting of the printed liquid adhesive portion by applying heat of 300 to 800 ° C. for at least 10 minutes. Perform a firing process to cure.

스크린 인쇄된 부분에 MEMS 칩을 부착시키는 공정은, 먼저 건조된 액상접착제로 이루어진 스크린 인쇄부분의 표면에 오일을 발라서 인쇄부의 위에 배치될 MEMS 칩을 움직일 수 있게 하고, 별도의 접착제에 접착되고 별개로 분리되어 있는 다수의 MEMS 칩 중에서 1개의 MEMS 칩을 집어서 수작업으로 배치시키고, 확대경을 이용하여 정확하게 MEMS 칩이 배치되었는지를 확인하고 MEMS 칩의 위치가 정확하지 않을 경우에는 수작업으로 오일 위에 유동성이 있게 배치된 상기 MEMS 칩을 눌러서 이동을 시키면서 올바른 위치보정을 수행하는 방식으로 MEMS 칩의 위치교정을 수행하고 있다.The process of attaching the MEMS chip to the screen-printed part may first move the MEMS chip to be placed on the printing part by applying oil to the surface of the screen-printed part made of the dried liquid adhesive, Bonded to a separate adhesive and separated separately If one MEMS chip is picked up and placed manually among multiple MEMS chips, the magnifier is used to check whether the MEMS chip is placed correctly. If the position of the MEMS chip is not correct, The position correction of the MEMS chip is performed by performing the correct position correction while pressing and moving the MEMS chip which is fluidly disposed on the oil by hand.

이와 같이 MEMS 칩이 정확한 위치에 부착된 이후의 소성공정은, MEMS 칩이 부착된 다이아프램의 상기 접착제로된 인쇄부에 300~800℃ 열을 10분 이상 가하여 확고하게 MEMS 칩이 부착되도록 고온에 노출시켜 부착시키는 방식으로 수행되고 있다.The firing process after the MEMS chip is attached to the correct position is applied to the adhesive printing portion of the diaphragm to which the MEMS chip is attached, by applying heat of 300 to 800 ° C. or more for 10 minutes or more so that the MEMS chip is firmly attached. It is performed by exposing and attaching.

그러나, 이러한 종래의 압력센서의 다이아프램의 표면상에 MEMS 칩을 부착시키는 방식은, 다이아프램의 표면상에 거친 부착면을 형성하기 위하여 표면 미세 가공 처리를 수행하면서 다수의 압력센서를 동시에 처리하여야 하므로, 다수의 압력센서본체를 정렬시키고 거친 부착면에 반드시 세척을 통한 청소가 필요한 것은 물론이고, 인쇄부상에 MEMS 칩을 부착시키는 공정 또한 오일을 바르고 MEMS 칩을 배치하고 다시 위치교정을 위한 교정을 육안으로 조정하는 작업을 거치게 되고 액상질로 전이된 인쇄부상에 MEMS 칩을 확실하게 고정시킬 수 있도록 소성 공정을 실시하여야 하므로 많은 시간이 소요되어 비능률적이며 많은 비용이 소요되며, MEMS 칩을 스크린 인쇄부에 고정시키는 작업은 수작업으로 수행되므로 자동화가 이루어지기 않게 되어 MEMS 칩의 부착이 대단히 더디게 되어 대량생산을 위한 작업에는 한계가 있게 되는 문제점이 있었다. However, the method of attaching the MEMS chip on the surface of the diaphragm of such a conventional pressure sensor requires processing multiple pressure sensors simultaneously while performing surface micromachining to form a coarse attachment surface on the surface of the diaphragm. Therefore, it is not only necessary to align the pressure sensor bodies and clean the surface by applying cleaning to the rough surface, but also to attach the MEMS chip on the printing part, applying oil, placing the MEMS chip, and performing calibration for repositioning. It is time-consuming and inefficient and expensive because the firing process must be carried out so that the MEMS chip can be securely fixed on the printing part transferred to the liquid phase. The fixing work is performed by hand, so that automation is not performed. There is a problem in that the wear is very slow, there is a limit to the work for mass production.

등록특허 제10-1806490호Patent Registration No. 10-1806490

본 발명의 목적은, 이러한 문제점을 해결하기 위한 것으로, 압력센서의 제조공정이 대단히 단축되어 제조시간이 월등하게 절감되는 것은 물론이고 정밀한 MEMS 칩의 부착공정이 다수의 MEMS 칩을 서로 연결시키는 브릿지에서 개별 MEMS 칩을 개별적으로 픽업할 수가 있게 되고 픽업된 MEMS 칩을 다수의 검사장비에 의하여 위치설정 및 위치교정을 수행하면서 부착가능하게 되어 정밀한 MEMS 칩의 부착이 이루어지게 되며, 자동화가 가능하여 대량생산이 가능하게 되고 제조시간이 단축되고 제조수율이 월등하게 향상되는 것이 가능한 MEMS 칩 부착공정이 자동화된 압력센서 제조방법 및 제조장치를 제공하는 것이다.An object of the present invention is to solve such a problem, and the manufacturing process of the pressure sensor is greatly shortened, which greatly reduces the manufacturing time, as well as the precise process of attaching the MEMS chip in a bridge connecting a plurality of MEMS chips to each other. Individual MEMS chips can be picked up individually, and the picked up MEMS chips can be attached while performing positioning and calibration by multiple inspection equipment, so that precise MEMS chips can be attached and automated. It is possible to provide a pressure sensor manufacturing method and apparatus for which the MEMS chip attaching process can be made possible, the manufacturing time can be shortened, and the manufacturing yield can be significantly improved.

본 발명의 이러한 목적은, 표면 미세 가공을 통하여 MEMS 칩이 부착될 표면을 거칠게 가공하고 표면가공이 종료되면 분사 및 석션을 통하여 이물질을 제거하는 부착표면가공 단계와, 표면이 가공된 부분을 마스크를 사용하여 접착제로 인쇄부를 인쇄하는 단계와, 웨이퍼 상의 브릿지로 연결된 다수의 MEMS 칩 중에서 부착시킬 MEMS 칩을 검사장비로 인식하고 상기 MEMS 칩을 픽업툴로 흡착시켜 분리와 함께 픽업툴에 흡착 시키고 흡착 고정된 MEMS 칩을 검사장비로 좌표를 확인하여 정렬보정을 실시하는 단계와, 검사장비로 인쇄부의 형상을 검사하고 인쇄부의 두께를 측정하고 인식된 인쇄부의 중심에 MEMS 칩을 배치하고 상기 MEMS 칩이 붙은 상태를 검사장비로 검사하는 단계와, 상기 MEMS 칩이 배치된 인쇄부를 300~800℃의 온도에서 10분 이상 가열하여 액상접착제 인쇄부를 고형화시키는 단계를 포함하는 본 발명에 따른 MEMS 칩 부착공정이 자동화된 압력센서의 제조방법에 의하여 달성된다. This object of the present invention, the surface processing step to remove the foreign matter through the injection and suction when the surface is finished rough machining the surface to which the MEMS chip is to be attached, and the surface is processed mask Printing the printing part with an adhesive, and recognizing the MEMS chip to be attached as a test equipment among a plurality of MEMS chips connected by a bridge on the wafer, and adsorbing the MEMS chip with a pickup tool, adsorbing the pickup tool with separation, and fixing the adsorption. Performing the alignment correction by checking the coordinates of the MEMS chip with the inspection equipment, inspecting the shape of the printing portion with the inspection equipment, measuring the thickness of the printing portion, and placing the MEMS chip in the center of the recognized printing portion. Inspecting the state with an inspection device, and heating the printed part on which the MEMS chip is disposed at a temperature of 300 to 800 ° C. for at least 10 minutes to form a liquid adhesive. The MEMS chip mounting process according to the invention, comprising the step of solidifying the print unit is achieved by the method for automated pressure sensor.

본 발명의 이러한 목적은, 압력센서본체의 다이아프램상에서 표면이 미세하게 거칠어지도록 하는 표면가공부와, 상기 표면이 미세하게 거칠어지도록 가공된 압력센서본체의 표면에 인쇄부를 형성하는 마스크처리부와, 인쇄된 압력센서본체를 턴테이블과, 다수의 MEMS 칩을 로딩시키는 웨이퍼로딩부와, 웨이퍼로딩부에서 개별 MEMS 칩을 픽업하여 분리절단하는 픽업툴부와, 상기 픽업툴부에서 이송된 MEMS 칩을 턴테이블상의 압력센서본체의 인쇄부에 검사장비를 통하여 배치하고, 상기 MEMS 칩이 스크린 인쇄부에 배치된 압력센서본체를 인쇄부가 상변화되게 소성 공정을 실시하는 상변화가공부를 포함하는 본 발명에 따른 MEMS 칩 부착공정이 자동화된 압력센서의 제조장치에 의하여 달성된다.The object of the present invention is to provide a surface processing unit for making the surface rough on the diaphragm of the pressure sensor body, and a mask processing unit for forming a printing unit on the surface of the pressure sensor body processed so that the surface is finely roughened; The pressure sensor main body includes a turntable, a wafer loading unit for loading a plurality of MEMS chips, a pickup tool unit for picking up and cutting individual MEMS chips from the wafer loading unit, and a MEMS chip transferred from the pickup tool unit for a pressure sensor main body on a turntable. The process of attaching the MEMS chip according to the present invention comprises a phase change processing unit for disposing the pressure sensor body disposed on the printing unit of the printing unit and the MEMS chip disposed on the screen printing unit to perform the firing process so that the printing unit phase changes. This is achieved by an automated pressure sensor manufacturing apparatus.

본 발명에 따른 MEMS 칩 부착공정이 자동화된 압력센서 제조방법 및 제조장치는, MEMS 칩이 부착될 표면을 미세하게 거칠게 가공하여 처리하고 표면 가공이 종료되면 분사 및 석션을 통하여 이물질을 제거하는 부착표면가공 단계와, 표면이 가공된 부분을 마스크를 사용하여 액상접착제로 인쇄부를 인쇄하는 단계와, 웨이퍼 상의 브릿지로 연결된 다수의 MEMS 칩 중에서 부착시킬 MEMS 칩을 검사장비로 인식하고 상기 MEMS 칩을 픽업툴로 흡착시켜 분리와 함께 흡착고정시키고 흡착고정된 MEMS 칩을 검사장비로 정렬검사를 실시하는 단계와, 검사장비로 인쇄부의 형상을 검사하고 상기 인쇄부의 두께를 측정하고 인식된 인쇄부의 중심에 MEMS 칩을 배치하고 상기 MEMS 칩이 붙은 상태를 검사장비로 검사하는 단계와, 상기 MEMS 칩이 배치된 인쇄부를 300~800℃의 온도에서 10분 이상 가열하여 액상접착제로 이루어진 인쇄부를 고형화시키는 단계를 포함하여, 압력센서의 제조공정이 대단히 단축되어 제조시간이 월등하게 절감되는 것은 물론이고 정밀한 MEMS 칩의 부착공정이 다수의 MEMS 칩을 서로 연결시키는 브릿지에서 개별 MEMS 칩을 개별적으로 픽업할 수가 있게 되고 픽업된 MEMS 칩을 다수의 검사장비에 의하여 위치설정 및 위치교정을 수행하면서 부착가능하게 되어 정밀한 MEMS 칩의 부착이 이루어지게 되며, 자동화가 가능하여 대량생산이 가능하게 되고 제조시간이 단축되고 제조수율이 월등하게 향상되는 것이 가능한 MEMS 칩 부착공정이 자동화된 우수한 효과가 있다.Pressure sensor manufacturing method and apparatus for automated MEMS chip attachment process according to the present invention, the surface to which the MEMS chip is to be attached to finely roughened processing, and when the surface processing is completed, the adhesion surface for removing foreign matter through the injection and suction Printing the printed part with the liquid adhesive using a mask on the machining step, the surface processed part, and recognizing the MEMS chip to be attached as a test equipment among a plurality of MEMS chips connected by bridges on the wafer as a test equipment and picking up the MEMS chip as a pickup tool. Adsorption, fixation, adsorption fixation and adsorption fixed MEMS chip with the inspection equipment, and the alignment test with the inspection equipment, inspecting the shape of the printing portion with the inspection equipment, measuring the thickness of the printing portion MEMS chip in the center of the recognized printing portion Arranging and inspecting the state in which the MEMS chip is attached by the inspection equipment, and a printing unit at which the MEMS chip is disposed at a temperature of 300 to 800 ° C. Including the step of solidifying the printing portion made of a liquid adhesive by heating for at least 10 minutes, the manufacturing process of the pressure sensor is greatly shortened, which greatly reduces the manufacturing time, as well as precisely attaching a plurality of MEMS chips The individual MEMS chips can be picked up individually from the bridges connected to each other, and the picked-up MEMS chips can be attached while performing positioning and calibration by a plurality of inspection equipments, so that precise MEMS chips can be attached. It is possible to mass-produce, shorten the manufacturing time and significantly improve the manufacturing yield of the MEMS chip attachment process has an excellent effect of automated.

도 1은 본 발명에 따른 MEMS 칩 부착공정이 자동화된 압력센서 제조방법의 공정이 개략적으로 도시된 공정도
도 2는 본 발명에 따른 MEMS 칩 부착공정이 자동화된 압력센서 제조방법을 수행하는 제조장치의 개략적인 평면도
도 3a, 3b, 3c, 3d는 본 발명에 따른 MEMS 칩 부착공정이 자동화된 압력센서 제조방법에서 각 검사장비로 확인되는 검사장비영상의 평면도
도 4a, 4b는 본 발명에 따른 MEMS 칩 부착공정이 자동화된 압력센서 제조방법에서 브릿지로 연결된 MEMS 칩들의 개략적인 평면도1 is a process diagram schematically showing the process of the pressure sensor manufacturing method automated MEMS chip attachment process according to the present invention
Figure 2 is a schematic plan view of a manufacturing apparatus for performing a pressure sensor manufacturing method automated MEMS chip attachment process according to the present invention
Figure 3a, 3b, 3c, 3d is a plan view of the inspection equipment image confirmed with each inspection equipment in the pressure sensor manufacturing method automated MEMS chip attachment process according to the present invention
4A and 4B are schematic plan views of MEMS chips connected by a bridge in a pressure sensor manufacturing method in which the MEMS chip attaching process according to the present invention is automated;

본 발명에 따른 MEMS 칩 부착공정이 자동화된 압력센서 제조방법은, 도 1에 도시된 바와 같이, MEMS 칩이 부착될 표면을 미세하게 거칠게 가공하고 표면 가공이 종료되면 분사 및 석션을 통하여 이물질을 제거하는 부착표면가공 단계와, 표면이 가공된 부분을 마스크를 사용하여 액상접착제로 인쇄부를 스크린 인쇄하는 단계와, 웨이퍼 상의 브릿지로 연결된 다수의 MEMS 칩 중에서 부착시킬 MEMS 칩을 상부 검사장비로 인식하고 상기 MEMS 칩을 픽업툴로 흡착시켜 분리와 함께 흡착고정시키고 흡착고정된 MEMS 칩을 검사장비로 정렬보정을 실시하는 단계와, 검사장비로 인쇄부의 형상을 검사하고 측정 장비로 상기 스크린 인쇄부의 두께를 측정하고 인식된 인쇄부의 중심에 MEMS 칩을 배치하는 단계와, 상기 MEMS 칩이 붙은 상태를 검사장비로 검사하는 단계와, 상기 MEMS 칩이 배치된 스크린 인쇄부를 300~800℃의 온도에서 10분 이상 가열하여 액상접착제로 이루어진 인쇄부를 액상질화시키는 단계를 포함한다.In the method of manufacturing a pressure sensor with an automated MEMS chip attachment process according to the present invention, as shown in FIG. 1, the surface on which the MEMS chip is to be attached is finely roughened and foreign substances are removed by spraying and suction when the surface processing is finished. The surface processing step of attaching, the step of screen-printing the printing portion with the liquid adhesive using the mask on the surface is processed, and the MEMS chip to be attached from among a plurality of MEMS chips connected by a bridge on the wafer to recognize the upper inspection equipment Adsorption and fixation of the MEMS chip with the pick-up tool, separation and adsorption and fixation of the fixed and fixed MEMS chip with the inspection equipment, and inspection of the shape of the printing portion with the inspection equipment and measurement of the thickness of the screen printing portion with the measurement equipment. And arranging the MEMS chip in the center of the recognized printing unit, inspecting the state where the MEMS chip is attached by the inspection equipment, and The MEMS chip is heated in the temperature of the screen printing unit 300 ~ 800 ℃ arrangement 10 min or more and a printing unit comprising a liquid nitride consisting of liquid adhesive.

본 발명에서 사용되는 표면 가공 방법은, 예를 들어, 표면 가공은 가공면이 매우 섬세하고 정밀하다는 장점을 지니고, 또한, 국소부분에 대한 순간적인 가열이 가능하므로 열에 예민한 피가공물의 여타 부분에 손상을 입히지 않은 채 작업을 할 수 있다는 장점이 있는 것으로, 이러한 표면 미세 가공은 표면만을 거칠게 가공하므로서 손상이 없이 가공을 할 수 있게 되고, 표면 가공으로 발생된 이물질은 석션(Suction) 등을 통하여 용이하게 제거할 수가 있게 되는 것이다.The surface treatment method used in the present invention, for example, has the advantage that the surface treatment has a very fine and precise processing surface, and also allows instantaneous heating of the local part, thereby damaging other parts of the workpiece which are sensitive to heat. There is an advantage that the work can be done without coating, such surface micro-machining can be processed without damage by rough processing only the surface, foreign matter generated by the surface processing is easily through suction (Suction), etc. It can be removed.

본 발명에서 사용되는 액상접착제로 인쇄부를 형성하는 단계는 공지된 것과 동일한 방식으로 수행되므로 이에 대한 상세한 설명은 생략하나 종래와 다른 점은 인쇄된 부분을 소성과 같은 전처리를 수행하지 않고 본 발명에서는 인쇄된 인쇄부에 아무런 가공없이 바로 MEMS 칩을 부착하는 단계를 진행하게 되는 것이다.Forming the printing portion with the liquid adhesive used in the present invention is carried out in the same manner as known, so a detailed description thereof is omitted, but different from the prior art is printed in the present invention without performing a pre-treatment such as firing the printed portion The process of attaching the MEMS chip to the printed part without any processing is to proceed.

본 발명에서 상기 MEMS 칩을 부착하는 단계는 본 발명에 따른 MEMS 칩 부착공정이 자동화된 압력센서 제조장치를 이용하여 자동화가 가능하게 수행하게 되는 것이다.The step of attaching the MEMS chip in the present invention is that the MEMS chip attachment process according to the present invention is to be automated using an automated pressure sensor manufacturing apparatus.

상기 본 발명에 따른 MEMS 칩 부착공정이 자동화된 압력센서 제조장치(A)는, 도 2에 도시된 바와 같이, 압력센서본체(S)의 다이아프램(S1)상에 표면을 거칠게 하는 가공을 수행하는 표면가공부(1)와, 상기 표면 가공된 압력센서본체의 표면에 인쇄부(P)를 형성하는 마스크처리부(2)와, 인쇄된 압력센서본체(S)를 회동시키는 턴테이블(3)과, 다수의 MEMS 칩을 로딩시키는 웨이퍼로딩부(4)와, 웨이퍼로딩부에서 개별 MEMS 칩(M)을 픽업하여 분리절단하는 픽업툴부(5)와, 상기 픽업툴부(5)의 픽업헤드(51)에서 이송된 MEMS 칩(M)을 턴테이블(3)상의 압력센서본체(S)의 인쇄부(P)상에 복수의 검사장비(V1~V4)을 통하여 정확하게 배치하고 상기 MEMS 칩(M)이 배치된 압력센서본체(S)를 인쇄부(P)가 상변화되게 소성 공정을 실시하는 상변화가공부(6)를 포함한다.The pressure sensor manufacturing apparatus (A) in which the MEMS chip attaching process is automated according to the present invention, as shown in FIG. 2, performs a roughening process on the diaphragm (S1) of the pressure sensor body (S). A surface processing unit (1), a mask processing unit (2) for forming a printing unit (P) on the surface of the pressure sensor body, and a turntable (3) for rotating the printed pressure sensor body (S); A wafer loading section 4 for loading a plurality of MEMS chips, a pickup tool section 5 for picking up and cutting individual MEMS chips M from the wafer loading section, and a pickup head 51 of the pickup tool section 5; MEMS chip (M) transferred from the accurately placed on the printing portion (P) of the pressure sensor body (S) on the turntable (3) through a plurality of inspection equipment (V1 ~ V4) and the MEMS chip (M) is placed The pressure sensor body S includes a phase change processing part 6 which performs a firing process so that the printing part P is phase changed.

상기 MEMS 칩 부착공정이 자동화된 압력센서 제조장치(A)에는 복수의 검사장비(V1~V4)가 설치되어 있다.In the pressure sensor manufacturing apparatus A in which the MEMS chip attaching process is automated, a plurality of inspection equipment V1 to V4 are installed.

이와 같은 MEMS 칩(M)의 인쇄부(P)상에의 위치설정은, 도 3에 도시된 바와 같이, 제조장치(A)상에 설치된 복수의 검사장비(V1~V4)들을 통하여 수행되며, 제1 검사장비(V1)는 MEMS 칩(M)의 상면 좌표를 확인하고, 제2 검사장비(V2)는 MEMS 칩(M)의 하면 좌표를 확인하고, 제3 검사장비(V3)는 인쇄부(P)의 좌표를 확인하고, 제4 검사장비(V4)는 MEMS 칩(M)의 정상/불량 검사를 수행한다.Such positioning of the MEMS chip M on the printing unit P is performed through a plurality of inspection equipments V1 to V4 installed on the manufacturing apparatus A, as shown in FIG. The first inspection equipment V1 checks the upper surface coordinates of the MEMS chip M, the second inspection equipment V2 checks the lower surface coordinates of the MEMS chip M, and the third inspection equipment V3 is the printing unit. The coordinates of (P) are checked, and the fourth inspection equipment V4 performs a normal / bad inspection of the MEMS chip M.

도 4에 도시된 바와 같이, 상기 다수의 MEMS 칩(M)들은 브릿지(M1)에 의하여 서로 연결되어 있으며, 도 3a에 도시된 바와 같이, 먼저 웨이퍼상의 선택될 MEMS 칩(M)을 제1 검사장비(V1)로 인식하고, 픽업헤드(51)로 흡착하게 되면 흡착된 MEMS 칩(M)의 브릿지(M1)가 절단되면서 픽업헤드(51)에 흡착되고, 도 3b에 도시된 바와 같이, 흡착된 MEMS 칩(M)을 다시 제2 검사장비(V2)로 인식하고 정위치가 아닐 경우에는, 픽업툴부(5)의 픽업헤드(51)를 직선이동시키거나 회동가능하게 고정된 픽업헤드(51)를 회전시켜 정위치로 얼라인보정을 수행시킨다.As shown in FIG. 4, the plurality of MEMS chips M are connected to each other by a bridge M1, and as shown in FIG. 3A, first, a first inspection of the MEMS chip M to be selected on a wafer is performed. When recognized by the equipment (V1), and the adsorption by the pickup head 51, the bridge (M1) of the adsorbed MEMS chip (M) is cut and is adsorbed to the pickup head 51, as shown in Figure 3b, adsorption When the MEMS chip M is recognized as the second inspection equipment V2 again and is not in the correct position, the pickup head 51 of the pickup tool 5 may be linearly moved or rotatably fixed. Rotate) to align the alignment to the correct position.

이와 같이 제2 검사장비(V2)에 의하여 정위치로 얼라인보정이 수행된 것을 확인하고 픽업툴부(5)의 픽업헤드(51)로 MEMS 칩(M)을 인식된 인쇄부(P)상에 부착시키게 되는 것이다.In this way, it is confirmed that the alignment correction is performed in the correct position by the second inspection equipment V2, and the MEMS chip M is picked up by the pickup head 51 of the pickup tool unit 5 on the recognized printing unit P. Will be attached.

이 과정을 구체적으로 설명하면, 웨이퍼 상에 로딩된 다수의 MEMS 칩(M) 중에서 부착할 MEMS 칩(M)을 제1 검사장비(V1)로 인식하고 상기 MEMS 칩(M)을 픽업툴부(5)의 픽업헤드(51)로 흡착시키고 흡착된 MEMS 칩(M)을 일정거리를 이동시켜 제2 검사장비(V2)로 정렬보정을 실시하는 단계를 수행한다.In detail, the process recognizes the MEMS chip M to be attached among the plurality of MEMS chips M loaded on the wafer as the first inspection equipment V1 and identifies the MEMS chip M as a pickup tool unit 5. Adsorption is carried out by the pickup head 51 of the) and the alignment correction is performed by moving the adsorbed MEMS chip (M) by a predetermined distance to the second inspection equipment (V2).

이후, 턴테이블(3)상에 설치된 제3 검사장비(V3)로 액상접착제가 인쇄된 인쇄부(P)의 형상을 검사하고(도 3c에 도시됨), 픽업툴부(5)에 설치된 계측기로 상기 인쇄부(P)의 두께를 측정하고 인식된 스크린 인쇄부(P)의 중심에 픽업헤드(51)에 픽업된 MEMS 칩(M)을 배치하고, 도 3d에 도시된 바와 같이, 상기 MEMS 칩(M)이 붙은 상태를 제4 검사장비(V4)로 검사하는 단계를 포함한다. Subsequently, the shape of the printing unit P on which the liquid adhesive is printed is inspected by the third inspection equipment V3 installed on the turntable 3 (shown in FIG. 3C), and the measuring unit installed in the pickup tool unit 5 is used. The thickness of the printing unit P is measured, and the picked-up MEMS chip M is placed in the pickup head 51 at the center of the recognized screen printing unit P. As shown in FIG. 3D, the MEMS chip ( And inspecting the state where the M) is attached by the fourth inspection equipment V4.

상기 제4 검사장비(V4)가 검사하는 항목은, 액상접착제 표면의 중심부 위치에 MEMS 칩(M) 접착되어 있지 않은 상태, 즉 틀어져 있거나 파손 또는 액상접착제가 MEMS 칩(M)표면 위로 덮혀 정상상태와 다른 사항을 검사하여 이와 같은 사항에 해당되는 경우는 불량으로 보게 되는 것이다.The item to be inspected by the fourth inspection equipment V4 is not in the state where the MEMS chip (M) is adhered to the central position of the liquid adhesive surface, that is, it is twisted or damaged or the liquid adhesive is covered on the surface of the MEMS chip (M) and is in a normal state. Inspecting and other matters, if this is the case is considered bad.

상기 제4 검사장비(V4)에 의하여 불량여부가 판단되고 정상일 경우에는 후속단계로 진행되고, 불량일 경우에는 인접한 불량케이스(도시되지 않음)로 투입되게 되는 것이다.If it is determined by the fourth inspection equipment (V4) whether the failure is normal and proceeds to the next step, if the failure is to be put into the adjacent failure case (not shown).

이어서, 상기 MEMS 칩(M)이 배치된 인쇄부(15)를 갖는 압력센서본체(S)를 상변화가공부(6)내에서 300~800℃의 온도에서 10분 이상 가열하여 액상접착제로 이루어진 인쇄부를 고형화시키는 단계를 수행하여 본 발명에 따른 MEMS 칩 부착공정이 자동화된 압력센서의 제조방법이 종료되게 되는 것이다.Subsequently, the pressure sensor main body S having the printed portion 15 on which the MEMS chip M is disposed is heated in the phase change processing portion 6 at a temperature of 300 to 800 ° C. for at least 10 minutes to form a liquid adhesive. By performing the step of solidifying the printing unit MEMS chip attachment process according to the invention is to end the manufacturing method of the automated pressure sensor.

이상과 같이 본 발명에 따른 MEMS 칩 부착공정이 자동화된 압력센서 제조방법 및 제조장치는, 압력센서의 제조공정에서 불필요한 공정이 생략되어 대단히 제조공정이 단축되어 제조시간이 월등하게 절감되는 것은 물론이고 정밀한 MEMS 칩의 부착공정이 다수의 MEMS 칩을 서로 연결시키는 브릿지에서 개별 MEMS 칩을 개별적으로 픽업할 수가 있게 되고 픽업된 MEMS 칩을 복수의 검사장비에 의하여 위치설정 및 위치교정을 수행하면서 부착가능하게 되어 정밀한 MEMS 칩의 부착이 이루어지게 되며, 자동화가 가능하여 대량생산이 가능하게 되고 제조시간이 단축되고 제조수율이 월등하게 향상되는 것이 가능하게 되는 것이다.As described above, the pressure sensor manufacturing method and manufacturing apparatus for the automated MEMS chip attaching process according to the present invention can be omitted by unnecessary steps in the manufacturing process of the pressure sensor, which greatly shortens the manufacturing process, thereby significantly reducing manufacturing time. Accurate MEMS chip attachment process enables individual MEMS chips to be picked up individually from a bridge that connects multiple MEMS chips to each other, and the picked up MEMS chips can be attached while performing positioning and calibration by a plurality of inspection equipment. As a result, the precise MEMS chip is attached, and automation is possible, so that mass production is possible, manufacturing time can be shortened, and manufacturing yield can be significantly improved.

본 발명에 따른 압력센서의 제조방법 및 제조장치는, 압력센서의 제조산업에서 동일한 방법을 반복적으로 수행하는 것이 가능하고 동일한 제품을 반복적으로 제조하는 것이 가능하다고 할 것이므로 산업상 이용가능성이 있는 발명이라고 할 것이다.The manufacturing method and the manufacturing apparatus of the pressure sensor according to the present invention, it is said that it is possible to perform the same method repeatedly in the manufacturing industry of the pressure sensor, and that it is possible to manufacture the same product repeatedly, so it is an invention that is industrially applicable. something to do.

S: 압력센서본체 S1: 다이아프램
M: MEMS 칩 M1: 브릿지
P: 인쇄부 V1~V4: 검사장비
1: 표면가공부 2: 마스크처리부
3: 턴테이블 4: 웨이퍼로딩부
5: 픽업툴부 51: 픽업헤드
6: 상변화가공부S: pressure sensor main body S1: diaphragm
M: MEMS chip M1: Bridge
P: Printing unit V1 ~ V4: Inspection equipment
1: surface processing part 2: mask processing part
3: turntable 4: wafer loading part
5: pickup tool portion 51: pickup head
6: Phase change processing department

Claims (5)

압력센서본체(S)는 상부에 미세한 압력을 감지하게 하는 다이아프램(S1)이 형성되고, 상기 압력센서본체(S)의 다이아프램(S1)상의 원형평면 위에 부착되는 MEMS 칩은 다이아프램(S1)상에 가해지는 압력에 대응한 MEMS 칩의 압력계측저항 각각의 길이 및 평면적 변화에 따른 전기적 저항변화를 감지하여 압력을 계측하게 되는 압력센서를 제조하기 위한 MEMS 칩 부착공정이 자동화된 압력센서의 제조방법에 있어서,
MEMS 칩 부착공정이 자동화된 압력센서 제조방법은,
표면가공부를 통하여 MEMS 칩을 부착하는 다이아프램(S1) 표면을 거칠게 만들어 거칠기를 형성하는 부착표면 가공 단계와,
표면 가공된 상기 부착표면 부분을 액상접착제로 도포하는 단계와,
MEMS 칩을 픽업 툴로 그립하고 상기 부착표면의 액상접착제 도포영역에 자동으로 배치하는 단계를 포함하는 것을 특징으로 하는 MEMS 칩 부착공정이 자동화된 압력센서 제조방법.The pressure sensor body S has a diaphragm S1 formed thereon for sensing a minute pressure, and the MEMS chip attached to the circular plane on the diaphragm S1 of the pressure sensor body S is a diaphragm S1. Automated MEMS chip attachment process for manufacturing pressure sensor that measures pressure by detecting electric resistance change according to length and planar change of pressure measurement resistance of MEMS chip corresponding to pressure applied In the manufacturing method,
The pressure sensor manufacturing method of the automated MEMS chip attachment process,
An attachment surface machining step of roughening the surface of the diaphragm (S1) to which the MEMS chip is attached through the surface machining portion to form roughness,
Applying the surface treated adhesive surface portion with a liquid adhesive;
A method of manufacturing a pressure sensor with an automated MEMS chip attaching process, comprising the steps of: gripping a MEMS chip with a pick-up tool and automatically placing the MEMS chip in a liquid adhesive application region on the surface. 제1항에 있어서,
상기 MEMS 칩을 픽업 툴로 그립하는 과정에서 MEMS 칩을 검사장비로 인식하고, MEMS 칩을 정위치로 얼라인보정하는 것을 특징으로 하는 MEMS 칩 부착공정이 자동화된 압력센서 제조방법.The method of claim 1,
In the process of gripping the MEMS chip with a pick-up tool, the MEMS chip is recognized as an inspection device, and the MEMS chip attachment process is automated manufacturing a pressure sensor, characterized in that the correct alignment of the MEMS chip in place. 제1항에 있어서,
검사장비로 인쇄부의 형상을 검사하고 계측기로 상기 부착표면의 액상접착제 도포영역의 두께를 측정하고 인식된 부착표면의 액상접착제 도포영역의 중심에 MEMS 칩을 배치하는 단계와,
상기 MEMS 칩이 부착표면의 액상접착제 도포영역에 붙은 상태를 검사장비로 검사하는 단계를 포함하는 것을 특징으로 하는 MEMS 칩 부착공정이 자동화된 압력센서 제조방법.The method of claim 1,
Inspecting the shape of the printing portion with an inspection device, measuring the thickness of the liquid adhesive application region on the adhesion surface with a measuring instrument, and placing a MEMS chip in the center of the liquid adhesive application region on the recognized adhesion surface;
And a step of inspecting the state in which the MEMS chip is attached to the liquid adhesive application region on the adhesion surface by using an inspection device. 제1항에 있어서,
상기 MEMS 칩이 배치된 부착표면의 액상접착제 도포영역을 300~800℃의 온도에서 10분 이상 가열하여 액상접착제로 이루어진 도포영역을 고형화시키는 단계를 추가로 포함하는 것을 특징으로 하는 MEMS 칩 부착공정이 자동화된 압력센서 제조방법.The method of claim 1,
The MEMS chip attachment process further comprises the step of heating the liquid adhesive application region of the adhesion surface on which the MEMS chip is disposed at a temperature of 300 to 800 ° C. for at least 10 minutes to solidify the application region composed of the liquid adhesive. Automated pressure sensor manufacturing method. 압력센서본체(S)는 상부에 미세한 압력을 감지하게 하는 다이아프램(S1)이 형성되고, 상기 압력센서본체(S)의 다이아프램(S1)상의 원형평면 위에 부착되는 MEMS 칩은 다이아프램(S1)상에 가해지는 압력에 대응한 MEMS 칩의 압력계측저항 각각의 길이 및 평면적 변화에 따른 전기적 저항변화를 감지하여 압력을 계측하게 되는 압력센서를 제조하기 위한 MEMS 칩 부착공정이 자동화된 압력센서 제조장치에 있어서,
MEMS 칩 부착공정이 자동화된 압력센서의 제조장치는,
압력센서본체(S)의 다이아프램(S1)상에 표면 가공을 수행하는 표면가공부(1)와,
상기 표면 가공된 압력센서본체의 표면에 액상접착제를 도포하여 인쇄부(P)를 형성하는 마스크처리부(2)와,
인쇄된 압력센서본체(S)를 회동시키는 턴테이블(3)과,
다수의 MEMS 칩을 로딩시키는 웨이퍼로딩부(4)와,
상기 웨이퍼로딩부에서 개별 MEMS 칩(M)을 픽업하여 분리하는 픽업툴부(5)와,
상기 픽업툴부(5)의 픽업헤드(51)에서 이송된 MEMS 칩(M)을 턴테이블(3)상의 압력센서본체(S)의 인쇄부(P)상에 복수의 검사장비(V1~V4)를 통하여 정확하게 배치하고 상기 MEMS 칩(M)이 인쇄부(P)에 배치된 압력센서본체(S)를 인쇄부(P)가 상변화되게 소성 공정을 실시하는 상변화가공부(6)를 포함하는 것을 특징으로 하는 MEMS 칩 부착공정이 자동화된 압력센서 제조장치
The pressure sensor main body S is formed with a diaphragm S1 for sensing a minute pressure thereon, and the MEMS chip attached to the circular plane on the diaphragm S1 of the pressure sensor main body S has a diaphragm S1. Manufacturing of pressure sensor with automated MEMS chip attachment process for manufacturing pressure sensor that measures pressure by detecting electric resistance change according to length and planar change of pressure measurement resistance of MEMS chip corresponding to pressure In the apparatus,
The manufacturing device of the pressure sensor with automated MEMS chip attachment process,
Surface processing unit 1 for performing a surface treatment on the diaphragm (S1) of the pressure sensor body (S),
A mask processing unit 2 for forming a printing unit P by applying a liquid adhesive to the surface of the pressure sensor body processed;
A turntable 3 for rotating the printed pressure sensor body S,
A wafer loading unit 4 for loading a plurality of MEMS chips,
A pickup tool unit 5 for picking up and separating individual MEMS chips M from the wafer loading unit;
The MEMS chip M transferred from the pickup head 51 of the pickup tool part 5 is placed on the printing part P of the pressure sensor main body S on the turntable 3. The phase change processing part 6 which performs the baking process so that the printing part P may be phase-changed by the pressure sensor main body S arrange | positioned correctly and the said MEMS chip M is arrange | positioned in the printing part P is included. Automated pressure sensor manufacturing device characterized in that the MEMS chip attachment process
KR1020180040303A 2018-04-06 2018-04-06 Manufacturing method and apparatus of pressure sensor automated for MEMS chip attachment process KR102059521B1 (en)

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JPS6048300U (en) * 1983-09-09 1985-04-04 日立電子株式会社 Chip component mounting device with mounting inspection device
KR101288338B1 (en) 2012-02-10 2013-07-22 대양전기공업 주식회사 Pressure sensor manufacturing method using semiconductor pressure device and metal diapharm structure
KR101445123B1 (en) * 2013-01-31 2014-10-01 (주) 예스티 Apparatus for bonding chip on wafer precisely
KR101806490B1 (en) 2016-12-26 2017-12-07 주식회사 현대케피코 sensor element

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6048300U (en) * 1983-09-09 1985-04-04 日立電子株式会社 Chip component mounting device with mounting inspection device
KR101288338B1 (en) 2012-02-10 2013-07-22 대양전기공업 주식회사 Pressure sensor manufacturing method using semiconductor pressure device and metal diapharm structure
KR101445123B1 (en) * 2013-01-31 2014-10-01 (주) 예스티 Apparatus for bonding chip on wafer precisely
KR101806490B1 (en) 2016-12-26 2017-12-07 주식회사 현대케피코 sensor element

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