KR20190111573A - Laser Patterning Apparatus And Method Of Fabricating Organic Light Emitting Diode Display Device Using The Same - Google Patents

Abstract

According to the present invention, provided is a laser patterning device comprising: a light source part moving in a scanning direction and emitting a line type laser beam; a chamber disposed on an upper part of the light source part; an optical mask disposed in the chamber, and including a plurality of mask patterns selectively transmitting the laser beam; and a suction part disposed between a substrate mounted inside the chamber and the optical mask, moving in the scanning direction, and suctioning and exhausting an organic material removed from an organic material layer of the substrate by the laser beam. Therefore, the present invention is capable of increasing productivity and precision.

Description

Laser patterning device and manufacturing method of organic light emitting diode display device using the same {Laser Patterning Apparatus And Method Of Fabricating Organic Light Emitting Diode Display Device Using The Same}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser patterning device, and more particularly, to a laser patterning device for improving productivity and precision by scanning a thin film through an optical mask while scanning a line-type laser beam, and manufacturing an organic light emitting diode display device using the same. It is about a method.

The organic light emitting diode (OLED) display, one of the flat panel displays (FPDs), is a self-luminous type, so that a viewing angle and a contrast ratio are higher than those of a liquid crystal display (LCD). Because it is excellent and does not require backlight, it is possible to be light and thin and advantageous in terms of power consumption.

In addition, since it is possible to drive DC low voltage, fast response speed, and all solid, it is strong against external shock, wide use temperature range, and especially inexpensive in terms of manufacturing cost.

In addition, since the manufacturing process of the organic light emitting diode display device is all about deposition and encapsulation, the manufacturing process is very simple.

Meanwhile, the organic light emitting diode display includes a plurality of pixel regions each consisting of red, green, and sub-pixel regions, and each of the red, green, and blue pixel regions emits light. Diode is formed.

The light emitting diodes of the red, green, and blue subpixel regions each include a red, green, and blue light emitting material layer (EML), and the red, green, and blue light emitting material layers may be thermally deposited using a shadow mask. thermal evaporation).

A method of forming such a light emitting material layer will be described with reference to the drawings.

1 is a view for explaining a method of forming a light emitting material layer of a conventional light emitting diode display.

As shown in FIG. 1, the substrate 10 is disposed above the source 30 of the light emitting material, and a shadow mask 20 is disposed between the substrate 10 and the source 30. The mask 20 includes a blocking area 22 and an opening area 24.

When the source 30 vaporizes the light emitting material while the shadow mask 20 is aligned such that the opening area 22 corresponds to the red, green, and blue pixel areas (not shown) of the substrate, the light emitting material diffuses to form a shadow. Passing through the opening region 24 of the mask 20 is selectively formed in the red, green, and blue pixel region of the substrate.

In this case, the red, green, and blue light emitting material layers may be formed by using separate shadow masks, and when the red, green, and blue pixel areas have the same arrangement structure, the red light emitting material is used by using one shadow mask. After forming the layer, the same shadow mask may be sequentially shifted to form green and blue light emitting material layers.

The shadow mask 20 is formed by forming an opening region in a metal plate made of a metal such as an iron-nickel alloy or stainless steel. As the resolution of the organic light emitting diode display increases, there is a problem in manufacturing and using the shadow mask 20. Occurs.

That is, as the organic light emitting diode display becomes higher resolution, the area of each subpixel area in which the light emitting material layer is formed decreases, and as a result, the area of the opening area 24 of the shadow mask 20 also decreases.

For example, the width of the blocking region 22 of the shadow mask 20 used in the organic light emitting diode display device having a resolution of about 600 ppi (pixel per inch), about 800 ppi, and about 1200 ppi is about 18 μm, about 14 μm, The width of the opening area 24 is about 24 μm, about 16 μm, and about 10 μm, respectively, and as the resolution increases, the width of the opening area 24 of the shadow mask 20 decreases rapidly.

However, when the width of the opening area 24 of the shadow mask 20 is reduced, there is a problem that the alignment of the shadow mask 20 and the subpixel area exceeds the physical limit.

In order to use the shadow mask 20 in the high-resolution organic light emitting diode, the thickness of the metal plate constituting the blocking region 22 of the shadow mask 20 should be reduced.

For example, the thickness of the metal plate of the shadow mask 20 used in the organic light emitting diode display device having a resolution of about 600 ppi (pixel per inch), about 800 ppi, and about 1200 ppi is about 25 μm, about 18 μm, and about 12 μm, respectively. As the resolution increases, the thickness of the metal plate of the shadow mask 20 decreases rapidly.

However, when the thickness of the metal plate of the shadow mask 20 is reduced, the tensile force decreases, and as a result, when the shadow mask 20 is disposed by fixing the edge portion, sagging occurs due to gravity, thereby causing light emission. There is a problem that causes a defect of the material layer.

In addition, there is a limit in reducing the thickness of the metal plate of the shadow mask 20 due to the characteristics of the raw material, and there is a problem in that there is a limit in reducing the area of the opening region 24.

The present invention has been made to solve such a problem, and the laser patterning device and the organic light emitting diode using the same by omitting the shadow mask and improving productivity and precision by scanning and irradiating a line type laser beam and patterning the organic material layer An object of the present invention is to provide a method for manufacturing a display device.

In addition, the present invention, the laser patterning device to prevent contamination and defects by the organic material removed from the organic material layer by selectively removing and patterning the organic material layer with a line-type laser beam while scanning the suction unit together with the light source unit and Another object of the present invention is to provide a method of manufacturing an organic light emitting diode display device using the same.

In order to solve the above problems, the present invention, the light source unit for emitting a line-type laser beam; A chamber disposed above the light source unit; An optical mask disposed in the chamber and including a plurality of mask patterns for selectively transmitting the laser beam; A suction part disposed between the substrate mounted in the chamber and the optical mask, the suction part configured to suck and exhaust the organic material removed from the organic material layer of the substrate by the laser beam, the light source part and the suction part Provided are a mask and a laser patterning device that moves relative to the substrate.

The suction unit may include an opening disposed at a central portion to pass the laser beam; Is disposed on at least one side of the opening may include a suction port for sucking the organic material.

In addition, the opening and the suction port may each have a length corresponding to the laser beam.

The laser beam may have a wavelength of 500 nm or more, and the length of the laser beam may be 1/2 or more of the short side of the substrate.

The optical mask may have a size corresponding to that of the substrate, and the plurality of mask patterns may respectively include a blocking portion that blocks the laser beam, a transmission portion that transmits the laser beam, and a transmittance greater than the transmittance of the blocking portion. It may include at least one transflective portion having a small transmittance.

In addition, the separation distance between the substrate and the suction unit may vary according to the degree of vacuum of the chamber.

In addition, the optical mask and the substrate is fixed and the light source and the suction unit is moved at a speed synchronized with the scanning direction, or the light source and the suction unit is fixed and the optical mask and the substrate is synchronized in the opposite direction of the scanning direction Can move at a speed.

The laser patterning device may further include: an alignment unit to align the substrate and the optical mask; A first driving part which moves the suction part in the scanning direction; An exhaust unit configured to exhaust the organic material sucked into the suction unit; A heating unit for heating the suction unit; A vacuum unit for adjusting a pressure in the chamber; The light emitting unit may further include a second driving unit which moves the light source unit in the scanning direction.

In addition, the clocks of the first and second drivers may be generated from one clock generator.

The optical mask and the substrate may be disposed parallel to the horizontal plane and the laser beam may be irradiated in the vertical direction, or the optical mask and the substrate may be disposed parallel to the vertical plane and the laser beam may be irradiated in the horizontal direction.

On the other hand, the present invention comprises the steps of forming a first anode, a first wiring and a second anode on the substrate; Forming a bank layer on the first anode, the first wiring, and the second anode to expose a center portion of each of the first anode, the first wiring, and the second anode; Forming an organic material layer over an entire surface of the substrate above the bank layer; While irradiating the light source portion and the suction portion of the laser patterning device relative to the optical mask and the substrate of the laser patterning device, the laser beam is irradiated to the organic material layer through the optical mask and the suction portion, and the first wiring Forming a light emitting material pattern having a first hole exposing the light emitting layer on the first and second anodes; A method of manufacturing an organic light emitting diode display device, the method comprising forming a cathode on an entire surface of the substrate above the light emitting material pattern.

The present invention has the effect of eliminating the use of a shadow mask and improving productivity and precision by scanning and irradiating a line type laser beam to pattern an organic material layer.

The present invention has the effect of preventing contamination and defects by the organic material removed from the organic material layer by selectively removing and patterning the organic material layer with a line type laser beam while scanning the suction part together with the light source part.

1 is a view for explaining a method of forming a light emitting material layer of a conventional light emitting diode display.
2 is a perspective view showing a laser patterning device according to a first embodiment of the present invention.
3 is a cross-sectional view showing a laser patterning device according to a first embodiment of the present invention.
4A to 4C are views for explaining a method of manufacturing an organic light emitting diode display device according to a first embodiment of the present invention.
5A to 5C are views for explaining a method of manufacturing an organic light emitting diode display device according to a second embodiment of the present invention.

Hereinafter, an organic light emitting diode display and a manufacturing method thereof according to the present invention will be described with reference to the accompanying drawings.

2 is a perspective view showing a laser patterning apparatus according to a first embodiment of the present invention, Figure 3 is a cross-sectional view showing a laser patterning apparatus according to a first embodiment of the present invention.

2 and 3, the laser patterning apparatus 110 according to the first embodiment of the present invention, the chamber 120, the optical mask 122, the suction unit 124, the light source unit 130, The alignment unit 132 includes a first driving unit 134, an exhaust unit 136, a heating unit 138, a vacuum unit 140, and a second driving unit 142.

The chamber 120 is connected to the vacuum unit 140, and the vacuum unit 140 may maintain the inside of the chamber 120 at various pressures.

For example, the inside of the chamber 120 may be maintained at a pressure of about 0.1torr to about 10torr in consideration of a mean free path of organic material removed from the organic material layer 162.

In addition, a carrier gas such as nitrogen (N 2) or an inert gas may be supplied into the chamber 120 to facilitate suction of the organic material removed from the organic material layer 162. In order to prevent the content of each of the water (H 2 O), oxygen (O 2), fluorine (F), chlorine (Cl) and sulfur (S) in the chamber 120 may be about 3 ppm or less.

The optical mask 122, the suction unit 124, and the substrate 150 are disposed inside the chamber 120, and the suction unit 124 is disposed above the optical mask 122, and the substrate 150 is disposed at the suction unit ( 124) may be disposed above.

The optical mask 122 includes first and second mask patterns MP1 and MP2 for selectively transmitting the laser beam LB, and the first and second mask patterns MP1 and MP2 are respectively cut off portions 122a. ), A first transmissive portion 122b having a higher transmittance than the blocking portion 122a, a transmissive portion having a higher transmittance than the second semi-transparent portion 122c and a second semi-transmissive portion 122c having a higher transmittance than the first semi-transmissive portion 122b. 122d).

For example, the blocking part 122a may have a transmittance of less than about 5% with respect to the laser beam LB, and the transmitting part 122d may have a transmittance of about 95% or more with respect to the laser beam LB, The first and second transflective parts 122b and 122c may each have a transmittance of about 5% to about 95%.

The degree of transmission of the laser beam LB varies depending on the blocking portions 122a, the first and second transflective portions 122b and 122c and the transmitting portion 122d of each of the first and second mask patterns MP1 and MP2. The shape of the organic pattern may be determined by the blocking part 122a and the transmitting part 122d, and the side slope (or side shape) of the organic pattern may be determined by the first and second transflective parts 122b and 122c.

In the first embodiment, the optical mask 122 includes the first and second mask patterns MP1 and MP2, and the first and second mask patterns MP1 and MP2 are the blocking portions 122a, the first and the second mask patterns, respectively. Although the example includes the second transflective parts 122b and 122c and the transmissive part 122d, in another embodiment, the optical mask 122 may include three or more multiple mask patterns of various sizes and various shapes. The plurality of mask patterns may each include three or more plurality of transflective parts.

In order to improve productivity, the optical mask 122 may have a size corresponding to the substrate 150. For example, the effective area of the optical mask 122 and the effective area of the substrate 150 may have a ratio of 1: 1. Can have.

The suction part 124 is connected to the first driving part 134, and the first driving part 134 moves the suction part 124 in the same scanning direction S as the light source part 130 emitting the laser beam LB. can be scanned.

For example, the first driving unit 134 may include a motor.

In addition, the suction part 124 has an opening 124a and a suction port 124b, the opening 124a is disposed at the center of the suction part 124, and the suction port 124b is at least one side of the opening 124a. The opening 124a and the suction port 124b may have the same length as the length L of the laser beam LB.

The opening 124a passes through the laser beam LB to the organic material layer 162. For example, the opening 124a may have a transmittance of about 95% or more with respect to the laser beam LB.

In order to prevent the organic material removed from the organic material layer 162 from being redeposited on the substrate 150 or the chamber 120, the suction port 124b sucks and exhausts the organic material removed from the organic material layer 162. can do.

To this end, the suction unit 124 may be connected to the exhaust unit 136, and the exhaust unit 136 may exhaust the removed organic material through the suction unit 124.

In order to prevent the organic material removed from the organic material layer 162 from being re-deposited on the inlet 124b, the inlet 124b is blocked, and the inlet 124 is connected to the heating unit 138, and the heating unit 138 may heat inlet 124b.

For example, inlet 124b may be heated to a temperature of about 200 degrees.

In this case, a pipe connecting the suction part 124 and the exhaust part 136 may also be connected to the heating part 138 and heated to prevent clogging by the organic material removed from the organic material layer 162.

The substrate 150 includes an organic material layer 162, and the organic material layer 162 is formed on the lower surface of the substrate 150 corresponding to the suction part 124, and vaporizes (evaporates) at about 200 degrees to about 400 degrees. ) Or can be sublimated.

For example, the organic material layer 162 may include at least one of a hole injection layer (HIL), a hole transport layer (HTL), a light emitting material layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL) of the organic light emitting diode. Can be.

Since the organic material of the organic material layer 162 is vaporized (evaporated) or sublimed by the irradiated laser beam LB, the organic material layer 162 is selectively removed by the laser beam LB to form an organic material pattern. Can be.

The separation distance G between the substrate 150 and the suction unit 124 may vary according to the degree of vacuum in the chamber 120. For example, the higher the degree of vacuum in the chamber 120, the higher the degree of vacuum in the chamber 120. The distance G between the suction unit 124 and the suction unit 124 may be increased, and the separation distance G between the substrate 150 and the suction unit 124 may be an average freedom of the organic material removed from the organic material layer 162. It may be about 1 to about 3 times the mean free path.

In addition, the substrate 150 may be connected to the alignment unit 132, and the alignment unit 132 may adjust the position of the substrate 150 to align the substrate 150 to the optical mask 122.

Here, the alignment unit 132 may compensate for an error due to the deformation and shrinkage difference between the optical mask 122 and the substrate 150.

In the first embodiment, the alignment unit 132 is connected to the substrate 150 as an example. In another embodiment, the alignment unit 132 is connected to the optical mask 122 and the position of the optical mask 122 is adjusted. It may be aligned to the substrate 150.

The light source unit 130 emits a line-type laser beam LB using a light source and an optical unit. For example, the light source includes a source laser including a semiconductor laser such as a diode pump solid state (DPSS). The optical unit may emit a beam, and may process a source laser beam emitted from a light source including a homogenizer and a plurality of lenses to output a line type laser beam LB.

The rectangular line-shaped laser beam LB has a length L and a width W. The length L of the laser beam LB is 1/2 of the length D of the short side of the substrate 150. The width W of the laser beam LB may be about 200 μm or more.

When the laser beam LB is irradiated onto the organic material layer 162, the impact on the substrate 150 and the organic material layer 162 may be minimized and may be easily absorbed by the organic material layer 162 to sublimate the organic material. Alternatively, the laser beam LB may have a wavelength of about 500 nm or more, for example, the laser beam LB may be visible light or infrared light (IR).

In addition, the light source unit 130 may be connected to the second driving unit 142, and the second driving unit 134 may move the light source unit 130 in the same scan direction S as the suction unit 124.

For example, the second driving unit 142 may include a motor.

Here, in order to irradiate the line type laser beam LB to the organic material layer 162 properly, the first and second driving units 134 and 142 move the suction unit 124 and the light source unit 130 at a synchronized speed. For example, the clocks of the motors of the first and second drivers 134 and 142 may be generated from one clock generator.

In the first embodiment of the present invention, the organic mask layer 162 is fixed while the optical mask 122 and the substrate 150 are fixed and the light source unit 130 and the suction unit 124 are moved in the scanning direction S at a synchronized speed. In this case, it is not easy to move the light source unit 130 including the complicated optical system and the suction unit 124 connected to the pipe, or misalignment may occur during the movement.

In order to overcome this disadvantage, in another embodiment, the light source unit 130 including the complicated optical system and the suction unit 124 connected to the pipe are fixed and the optical mask 122 and the substrate 150 are scanned at a synchronous speed. The organic material layer 162 may be patterned while moving in the opposite direction to (S).

In the first embodiment of the present invention, the optical mask 122 and the substrate 150 are disposed parallel to the horizontal plane, and the organic material layer 162 is patterned by irradiating the laser beam LB in a vertical direction. As the footprint area of the laser patterning device 110 is increased, the construction cost of the manufacturing line may be increased.

In order to overcome this disadvantage, in another embodiment, the optical mask 122 and the substrate 150 may be disposed parallel to the vertical plane, and the organic material layer 162 may be patterned by irradiating the laser beam LB in a horizontal direction. .

As described above, in the laser patterning apparatus 110 according to the first embodiment of the present invention, the line type laser beam LB of the light source unit 130 is transferred through the optical mask 122 and the suction unit 124. By scanning and irradiating the organic material layer 162 of 150, the use of a shadow mask may be omitted and productivity and precision may be improved.

The laser beam LB is irradiated onto the organic material layer 162 while moving the light source unit 130 and the suction unit 124 at a synchronized speed, thereby preventing contamination and defects caused by the removed organic material.

A method of forming an organic material pattern using the laser patterning apparatus 110 will be described with reference to the drawings.

4A to 4C are diagrams for describing a method of manufacturing an organic light emitting diode display device according to a first embodiment of the present invention, which will be described with reference to FIGS. 2 and 3.

As shown in FIG. 4A, a first anode 252, a low potential wiring 254, a sensing wiring 256, and a second anode 258 are formed on the substrate 250.

Although not shown, the first and second anodes 252 and 258 are disposed in the first and second pixel regions, respectively, and the low potential wiring 254 and the sensing wiring 256 are disposed between the first and second pixel regions. Can be.

The first and second anodes 252 and 258 may be connected to the driving thin film transistors, respectively, to receive a current corresponding to the data voltage, and the low potential wiring 254 and the sensing wiring 256 may have a low potential. The voltage VSS may be transmitted.

The bank layer 260 is formed on the first anode 252, the low potential wiring 254, the sensing wiring 256, and the second anode 258, and the bank layer 260 is the first anode 252. The edges of the low potential wiring 254, the sensing wiring 256, and the second anode 258 respectively cover the first anode 252, the low potential wiring 254, the sensing wiring 256, and the second anode 258. Each center can be exposed.

An organic material layer 262 is formed on the entire surface of the substrate 250 on the bank layer 260, and the organic material layer 262 is exposed through the upper portion of the bank layer 260 and the bank layer 260. 252, the low potential wiring 254, the sensing wiring 256, and the second anode 258.

The organic material layer 262 may include at least one of a hole injection material, a hole transport material, a light emitting material, an electron transport material, an electron injection material. In the first embodiment, the organic material layer 262 includes a light emitting material. This will be described as an example.

As shown in FIG. 4B, the organic material layer 262 is patterned by using the laser patterning apparatus 110. The light source unit 130 is moved while moving the light source unit 130 and the suction unit 122 in the scanning direction S. FIG. The laser beam LB may be irradiated onto the organic material layer 262 through the optical mask 122 and the suction part 124.

The laser beam LB selectively passes through the optical mask 122. The laser beam LB is completely absorbed by the blocking portion 122a of the optical mask 122 and passes through the transmission portion 122d of the optical mask 122. It may pass through as it is, and may partially pass through the first and second transflective parts 122b and 122c of the optical mask 122.

Accordingly, the organic material layer 262 corresponding to the first and second transflective portions 122b and 122c and the transmissive portion 122d of the optical mask 122 is sublimed or evaporated by the laser beam LB to be selectively removed. Can be.

In this case, the removed organic material OM is prevented from being contaminated by the substrate 250 and the chamber 120 by the organic material OM removed by being exhausted through the suction unit 124.

As shown in FIG. 4C, the organic material layer 262 corresponding to the low potential wiring 254 and the sensing wiring 256 is selectively removed by the laser beam LB, thereby causing the low potential wiring 254 and the sensing. A light emitting material pattern 268 having first and second holes 264 and 266 exposing the wiring 256, respectively, is formed on the first and second anodes 252 and 258.

A cathode 270 is formed on the entire surface of the substrate 250 on the light emitting material pattern 268. The cathode 270 is connected to the low potential wiring through the first and second holes 264 and 266 of the light emitting material pattern 268. 254 and the sensing wiring 256.

The first anode 252, the light emitting material pattern 268, and the cathode 270 constitute the first light emitting diode of the first pixel area, and the second anode 252, the light emitting material pattern 268, and the cathode 270 are formed. May constitute a second light emitting diode of the second pixel region.

As described above, in the method of manufacturing the organic light emitting diode display device using the laser patterning device 110 according to the first embodiment of the present invention, by selectively removing the organic material layer 262 using the laser beam LB. The light emitting material pattern 268 exposing the low potential wiring 254 and the sensing wiring 256 may be formed on the first and second anodes 252 and 258.

In this case, by scanning and irradiating the organic material layer 262 with the line type laser beam LB of the light source unit 130 through the optical mask 122 and the suction unit 124, the use of the shadow mask is omitted and productivity and precision are improved. Can be improved.

The laser beam LB is irradiated onto the organic material layer 262 while moving the light source unit 130 and the suction unit 124 at a synchronized speed, thereby preventing contamination and defects caused by the removed organic material.

5A to 5C are diagrams for describing a method of manufacturing an organic light emitting diode display according to a second exemplary embodiment of the present invention, which will be described with reference to FIGS. 2 and 3.

As shown in FIG. 5A, a first anode 352, a low potential wiring 354, a sensing wiring 356, and a second anode 358 are formed on the substrate 350.

Although not shown, the first and second anodes 352 and 358 are disposed in the first and second pixel regions, respectively, and the low potential wiring 354 and the sensing wiring 356 are disposed between the first and second pixel regions. Can be.

In addition, the first and second anodes 352 and 358 may be connected to the driving thin film transistors, respectively, to receive a current corresponding to the data voltage, and the low potential wiring 354 and the sensing wiring 356 may have a low potential. The voltage VSS may be transmitted.

The bank layer 360 is formed on the first anode 352, the low potential wiring 354, the sensing wiring 356, and the second anode 358, and the bank layer 360 is formed on the first anode 352. The edges of the low potential wiring 354, the sensing wiring 356, and the second anode 358 respectively cover the edges of the first anode 352, the low potential wiring 354, the sensing wiring 356, and the second anode 358. Each center can be exposed.

A first organic material layer 362 is formed on the entire surface of the substrate 350 on the bank layer 360, and the first organic material layer 362 is exposed through the bank layer 360 and the bank layer 360. The first anode 352, the low potential wiring 354, the sensing wiring 356, and the second anode 358 are formed on the upper portion.

The first organic material layer 362 may include at least one of a hole injection material, a hole transport material, a light emitting material, an electron transport material, and an electron injection material. In the second embodiment, the first organic material layer 362 is It will be described taking as an example including a light emitting material.

As shown in FIG. 5B, the first organic material layer 362 is patterned by using the laser patterning apparatus 110. The light source unit 130 and the suction unit 122 are moved in the scanning direction S while the light source unit is moved. The laser beam LB 130 may be irradiated to the first organic material layer 362 through the optical mask 122 and the suction part 124.

The laser beam LB selectively passes through the optical mask 122. The laser beam LB is completely absorbed by the blocking portion 122a of the optical mask 122 and passes through the transmission portion 122d of the optical mask 122. It may pass through as it is, and may partially pass through the first and second transflective parts 122b and 122c of the optical mask 122.

Accordingly, the first and second transflective parts 122b and 122c and the first organic material layer 362 corresponding to the transmissive part 122d of the optical mask 122 are sublimed or evaporated by the laser beam LB to selectively Can be removed.

In this case, the removed organic material OM is exhausted through the suction unit 124 to prevent contamination of the substrate 350 and the chamber 120 by the removed organic material (OM),

As illustrated in FIG. 5C, the hole 364 that selectively exposes the first anode 352 by selectively removing the first organic material layer 362 corresponding to the first anode 352 by the laser beam LB. The first light emitting material pattern 366 having the λ is formed on the low potential wiring 354, the sensing wiring 356, and the second anode 358.

A second organic material layer 368 is formed on the first light emitting material pattern 366, and the second organic material layer 368 is formed through the holes 364 of the first light emitting material pattern 366. 32).

 Although not shown, similarly to FIG. 4B, the second organic material layer 368 and the first organic material layer corresponding to the low potential wiring 354 and the sensing wiring 356 are then formed using the laser patterning device 110 ( 362 to selectively remove the second light emitting material pattern having the first and second holes exposing the low potential wiring 354 and the sensing wiring 356, respectively, on the first and second anodes 352 and 358. Can be formed on.

The low potential wiring 354 and the sensing wiring 356 are formed on the entire surface of the substrate 350 on the second light emitting material pattern through the first and second holes of the second light emitting material pattern and the first light emitting material pattern 368. A cathode in contact with the can be formed.

The first anode 352, the second light emitting material pattern, and the cathode constitute a first light emitting diode having a single layer structure of the first pixel region, and the second anode 358, the first light emitting material pattern 366, and the second The light emitting material pattern and the cathode may constitute a second light emitting diode having a tandem of a second pixel region.

As described above, in the method of manufacturing the organic light emitting diode display device using the laser patterning device 110 according to the second embodiment of the present invention, the first and second organic material layers 362 and 368 using the laser beam LB. ) Is selectively removed to form a first light emitting material pattern 366 and a second light emitting material pattern exposing the low potential wiring 354 and the sensing wiring 356 on the second anode 358, and then the low potential A second light emitting material pattern exposing the wiring 354 and the sensing wiring 356 may be formed on the first anode 352.

In this case, by scanning and irradiating the organic material layer 262 with the line type laser beam LB of the light source unit 130 through the optical mask 122 and the suction unit 124, the use of the shadow mask is omitted and productivity and precision are improved. Can be improved.

The laser beam LB is irradiated onto the organic material layer 262 while moving the light source unit 130 and the suction unit 124 at a synchronized speed, thereby preventing contamination and defects caused by the removed organic material.

Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art various modifications and changes of the present invention without departing from the spirit and scope of the present invention described in the claims below I can understand that you can.

110: laser patterning device 120: chamber
122: optical mask 124: suction part
130: light source unit 132: alignment unit
134: first driving unit 136: exhaust unit
138: heating section 140: vacuum section
142: second drive unit

Claims (11)

A light source unit emitting a line type laser beam;
A chamber disposed above the light source;
An optical mask disposed in the chamber and including a plurality of mask patterns for selectively transmitting the laser beam;
A suction part disposed between the substrate mounted in the chamber and the optical mask and sucking and exhausting the organic material removed from the organic material layer of the substrate by the laser beam;
Including,
And the light source unit and the suction unit move relative to the optical mask and the substrate.
The method of claim 1,
The suction unit,
An opening disposed at a central portion to pass the laser beam;
A suction port disposed at at least one side of the opening to suck the organic material
Laser patterning device comprising a.
The method of claim 2,
And the openings and the suction holes each have a length corresponding to the laser beam.
The method of claim 1,
The laser beam has a wavelength of 500nm or more,
And a laser patterning device having a length of at least 1/2 of a short side of the substrate.
The method of claim 1,
The optical mask has a size corresponding to the substrate,
Each of the plurality of mask patterns includes a blocking portion blocking the laser beam, a transmitting portion transmitting the laser beam, and at least one transflective portion having a transmittance greater than a transmittance of the blocking portion and less than that of the transmitting portion. .
The method of claim 1,
The distance between the substrate and the suction unit is a laser patterning device that varies according to the vacuum degree of the chamber.
The method of claim 1,
The optical mask and the substrate are fixed and the light source unit and the suction unit move at a speed synchronized in the scanning direction,
And the light source unit and the suction unit are fixed, and the optical mask and the substrate move at a speed synchronized in a direction opposite to the scanning direction.
The method of claim 7, wherein
An alignment unit for aligning the substrate and the optical mask;
A first driving part which moves the suction part in the scanning direction;
An exhaust unit configured to exhaust the organic material sucked into the suction unit;
A heating unit for heating the suction unit;
A vacuum unit for adjusting a pressure in the chamber;
A second driving unit which moves the light source unit in the scanning direction
Laser patterning device further comprising.
The method of claim 8,
And the clocks of the first and second drivers are generated from one clock generator.
The method of claim 1,
The optical mask and the substrate are disposed parallel to the horizontal plane and the laser beam is irradiated in the vertical direction,
And the optical mask and the substrate are arranged parallel to a vertical plane and the laser beam is irradiated in a horizontal direction.
Forming a first anode, a first wiring, and a second anode on the substrate;
Forming a bank layer on the first anode, the first wiring, and the second anode to expose a center portion of each of the first anode, the first wiring, and the second anode;
Forming an organic material layer over an entire surface of the substrate above the bank layer;
While irradiating the light source portion and the suction portion of the laser patterning device relative to the optical mask and the substrate of the laser patterning device, the laser beam is irradiated to the organic material layer through the optical mask and the suction portion, and the first wiring Forming a light emitting material pattern having a first hole exposing the light emitting layer on the first and second anodes;
Forming a cathode on an entire surface of the substrate above the light emitting material pattern;
Method of manufacturing an organic light emitting diode display device comprising a.

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