KR20190108611A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

The substrate processing apparatus includes a liquid processing unit for supplying a processing liquid to the surface of the substrate in the processing chamber, a drying unit for drying the processing liquid on the substrate surface in the drying chamber, a main conveying unit for carrying the substrate into the processing chamber, and Local prevention unit which conveys a board | substrate from a process chamber to the said drying chamber, and a drying prevention fluid which supplies the drying prevention fluid which prevents drying of the processing liquid of the said substrate surface to the said substrate surface, while the board | substrate is conveyed by the said local conveyance unit. And a supply unit.

Description

Substrate processing apparatus and substrate processing method

This invention relates to the substrate processing apparatus and substrate processing method which dry after processing a board | substrate with a process liquid. Examples of the substrate to be processed include a semiconductor wafer, a substrate for a liquid crystal display, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, and a photo. Mask substrates, ceramic substrates, solar cell substrates, and the like.

In manufacturing processes, such as a semiconductor device, the substrate processing apparatus which processes a board | substrate with a process liquid is used. Such a substrate processing apparatus includes, for example, a processing unit for supplying a processing liquid to a substrate and then drying the substrate. A typical processing unit includes a spin chuck for holding and rotating a substrate, a chemical liquid nozzle for supplying a chemical liquid to the substrate, and a rinse liquid nozzle for supplying a rinse liquid to the substrate. Such a processing unit performs a chemical | medical solution process, a rinse process, and a spin drying process. In the chemical liquid process, the chemical liquid is supplied from the chemical liquid nozzle to the surface of the substrate being rotated by the spin chuck. In the rinse step, the supply of the chemical liquid is stopped, the rinse liquid is supplied from the rinse liquid nozzle to the surface of the substrate rotated by the spin chuck, and the chemical liquid on the substrate is replaced with the rinse liquid. In the spin drying step, the supply of the rinse liquid is stopped, the substrate is rotated at high speed by a spin chuck, and the rinse liquid on the substrate is removed.

DIW (deionized water), a typical rinse liquid, is a liquid with high surface tension. For this reason, when removing a rinse liquid in a spin drying process, there exists a possibility that the fine pattern on a board | substrate may collapse by surface tension.

Here, after replacing the chemical liquid on the substrate with DIW, a method of replacing the DIW on the substrate with IPA (isopropyl alcohol) having a lower surface tension and removing the IPA out of the substrate has been proposed. However, if the exclusion of IPA is carried out by spin drying, collapse of the fine pattern on the surface of the substrate may occur.

Here, after supplying IPA to a board | substrate, patent document 1 heats a board | substrate, and forms the vapor-phase film of IPA between a micropattern and above a micropattern, and supports the liquid film of IPA with this vapor phase film, and in this state A method of removing the IPA liquid film from the substrate is proposed.

Japanese Patent Application Laid-Open No. 2014-112652

The method of patent document 1 is the outstanding method which can remove IPA other than a board | substrate, without rotating a board | substrate, and can suppress collapse of the fine pattern on a board | substrate.

IPA is a liquid having a smaller surface tension than DIW, but the energy of the surface tension on the micropattern increases as long as the gas-liquid interface of the IPA is in contact with the micropattern. Here, by minimizing the time that the gas-liquid interface of the IPA comes into contact with the fine pattern, it is possible to more reliably suppress or prevent collapse of the fine pattern.

In order to remove a low surface tension liquid, such as IPA, from a substrate surface in an instant, this inventor arrange | positioned the board | substrate which has the liquid film of low surface tension liquid in the surface in the pressure reduction chamber, and examined the structure which pressure-reduces the atmospheric pressure in a pressure reduction chamber.

However, the processing chamber which performs the liquid treatment has a large volume in order to accommodate a large part such as a spin chuck, and it is very difficult to decompress such a large volume in an instant.

Therefore, it is necessary to prepare a small volume pressure reduction chamber separately from the processing chamber of a liquid processing unit, and therefore, the board | substrate which completed liquid processing needs to be conveyed to a pressure reduction chamber.

However, when carrying out such conveyance, it turned out that drying of the low surface tension liquid on a board | substrate will start in the middle of the conveyance, and also that the drying will generate nonuniformly in a board | substrate surface. For this reason, before reaching a pressure reduction chamber, the fine pattern on a board | substrate collapses.

Such a problem is not limited to the case where the reduced pressure drying is performed after the treatment with a low surface tension liquid liquid such as IPA, and when the drying process is difficult to be performed in the liquid treatment unit after the substrate treatment in the liquid treatment unit. It is a widely occurring problem.

One object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of satisfactorily carrying out the drying treatment of the substrate surface by transporting the substrate to the drying unit while maintaining the substrate surface state after the treatment in the liquid processing unit. .

One embodiment of the present invention is a substrate processing apparatus for supplying a low surface tension liquid to a substrate surface, and then excluding the low surface tension liquid from the substrate surface by a depressurization process while suppressing or preventing collapse of a pattern on the substrate surface. And a substrate processing method.

A substrate processing apparatus according to an embodiment of the present invention includes a liquid processing unit for supplying a processing liquid to a substrate surface in a processing chamber, a drying unit for drying the processing liquid on the substrate surface in a drying chamber, and a substrate loaded into the processing chamber. The main conveying unit, the local conveying unit which conveys a board | substrate from the said process chamber to the said drying chamber, and the dry prevention fluid which prevents drying of the process liquid on the said board | substrate surface, while the board | substrate is conveyed by the said local conveying unit, And an anti-drying fluid supply unit for supplying the surface.

According to this configuration, the substrate to be processed is carried into the processing chamber of the liquid processing unit by the main transport unit. In the liquid processing unit, the processing liquid is supplied to the substrate in the processing chamber, and the substrate is processed by the processing liquid. Then, a board | substrate is conveyed from a process chamber to a drying chamber, and the drying process for drying the process liquid of the substrate surface in a drying chamber is performed. The conveyance of the substrate from the processing chamber to the drying chamber is performed by a local conveying unit provided unlike the main conveying unit. Thereby, the influence of a process liquid on the main conveyance unit and the component or other board | substrate which may exist in the movable range of a main conveyance unit can be suppressed.

On the other hand, while being conveyed by the local conveyance unit, the drying prevention fluid which prevents drying of a process liquid is supplied to the surface of the board | substrate in this conveyance. Therefore, the substrate processed in the liquid processing unit is loaded into the drying chamber while the state after the processing is maintained and subjected to the drying processing by the drying unit. Thereby, drying to the state in which the board | substrate surface in the conveyance by a local conveyance unit is inadvertently and uncontrollable can be suppressed. That is, the drying process for removing the processing liquid from the surface of the substrate can be performed in a controlled environment in the drying chamber. Thereby, the bad influence to a board | substrate by inadvertent drying can be avoided, and drying of a board | substrate can be performed favorably.

In one embodiment of this invention, the said liquid processing unit contains the board | substrate holding unit which hold | maintains a board | substrate horizontally, and the process liquid discharge unit which discharges a process liquid to the board | substrate hold | maintained by the said board | substrate holding unit. The liquid processing unit may further include a substrate rotating unit that rotates the substrate held by the substrate holding unit around a rotation axis along the vertical direction.

In one embodiment of this invention, the said drying prevention fluid supply unit is equipped with the conveyance arm of the said local conveyance unit, and includes the nozzle which discharges a drying prevention fluid toward the board | substrate hold | maintained by the said conveyance arm.

According to this structure, since a drying prevention fluid is discharged toward a board | substrate from the nozzle provided in the conveyance arm of a local conveyance unit, a drying prevention fluid can be reliably supplied to the board | substrate surface during conveyance. Thereby, inadvertent drying of the surface of the board | substrate during conveyance by a local conveyance unit can be suppressed more reliably.

In one embodiment of this invention, the said substrate processing apparatus further includes the arm cooling unit which cools the conveyance arm of the said local conveyance unit below the temperature of the board | substrate at the time of conveyance (for example, below normal temperature).

By this structure, it can avoid that a board | substrate is heated during the conveyance by a local conveyance unit. Thereby, since evaporation of the process liquid on the substrate surface can be suppressed, careless drying of the substrate surface can be further suppressed.

In one embodiment of this invention, the said drying unit contains the pressure reduction unit which pressure-reduces the inside of the said drying chamber to lower pressure than atmospheric pressure. By this structure, the liquid component of the surface of a board | substrate can be evaporated by decompressing the inside of a drying chamber to lower pressure than atmospheric pressure by a pressure reduction unit, and drying of a board | substrate surface is achieved by this. Since drying of the substrate surface by pressure reduction is completed quickly (for example, in an instant), the drying process can be performed while suppressing the influence of the surface tension of the processing liquid on the pattern formed on the substrate, particularly the substrate surface.

In one embodiment of this invention, the said drying unit further includes the nozzle which supplies a drying prevention fluid to the board | substrate surface in the said drying chamber. In the drying chamber, the drying prevention fluid is supplied to the surface of the substrate, thereby avoiding inadvertent drying of the substrate surface before the drying treatment is started.

For example, when depressurizing the inside of a drying chamber, it is preferable to stop supply of a drying prevention fluid, and to advance depressurization in a drying chamber quickly. Thereby, the influence which the surface tension of a process liquid has on a board | substrate can be reduced more.

In one embodiment of this invention, the said drying unit contains the board | substrate heating unit which heats a board | substrate in the said drying chamber.

In one embodiment of this invention, the volume of the said drying chamber is smaller than the volume of the said processing chamber. By this structure, since the drying process (for example, reduced pressure drying process) in a drying chamber can be advanced quickly, a drying process time can be made shorter. As a result, the influence of the surface tension of the processing liquid on the substrate can be further reduced.

In one embodiment of this invention, a board | substrate holding unit is provided in the said drying chamber, and drying prevention fluid is supplied from the nozzle to the surface of the board | substrate hold | maintained by the said board | substrate holding unit.

In one embodiment of this invention, the said local conveyance unit is comprised so that a board | substrate may be conveyed along the conveyance path which passes through a local conveyance chamber, and the said drying chamber and the said local conveyance chamber are in communication.

By this structure, conveyance of the board | substrate from a process chamber to a dry chamber is performed in a local conveyance chamber. Thereby, the influence of the process liquid of the surface of the board | substrate currently conveyed by a local conveyance unit can be put in a local conveyance chamber. Therefore, the influence of the processing liquid on the constituent parts of the main transfer unit and the other substrate processing apparatus can be suppressed.

In one embodiment of this invention, the said drying chamber has a carrying in opening in which a board | substrate is carried in by the said local conveyance unit, and the said local conveying unit has the lid unit which seals the said carrying in opening.

By this structure, a local conveyance unit can carry in a board | substrate from the carrying in opening of a drying chamber, and can also seal this carrying opening with a lid unit. Thereby, it is not necessary to prepare the opening / closing mechanism of carrying-in opening separately.

In one embodiment of this invention, the said local conveyance unit is equipped with the conveyance arm which conveys a board | substrate, and the said lid unit is provided in the said conveyance arm. By this structure, a carrying in opening can be sealed by a lid unit by the operation of conveying a board | substrate to a drying chamber with a conveyance arm.

In this case, a conveyance arm may play the role of the board | substrate holding unit which hold | maintains a board | substrate in a drying chamber. This eliminates the need to provide another substrate holding unit in the drying chamber. In particular, when the time required for the drying step is short, such as reduced pressure drying, the substrate can be omitted by holding the substrate with the transfer arm of the local transfer unit in the drying chamber. Time can be shortened and productivity can be improved.

In one embodiment of this invention, the said process liquid is a low surface tension liquid with smaller surface tension than water. By this structure, the influence on the board | substrate by the surface tension of a process liquid can be reduced. In addition, while preventing the drying of the low surface tension liquid, the substrate can be conveyed to the drying chamber by the local conveying unit to dry the low surface tension liquid in a controlled state in the drying chamber. Thereby, the influence on the board | substrate by the surface tension of low surface tension liquid can also be suppressed.

In one embodiment of this invention, the said drying prevention fluid contains the vapor or droplet (mist) of the said process liquid. In this structure, the density | concentration of the process liquid vapor in the atmosphere of a board | substrate surface is high during conveyance by a local conveyance unit. Thereby, evaporation of a process liquid can be suppressed effectively.

In one embodiment of this invention, the said process liquid contains the organic solvent, and the said drying prevention fluid contains the vapor or droplet (mist) of the organic solvent. Organic solvents are an example of low surface tension liquids having a lower surface tension than water. By terminating the treatment in the liquid treatment unit by treatment with an organic solvent, the influence of the surface tension on the surface of the substrate can be suppressed. And drying of the organic solvent on a board | substrate surface can be suppressed by supplying the surface or the vapor | steam of the organic solvent to the board | substrate surface during conveyance by a local conveyance unit.

The vapor or droplets of the organic solvent as the treatment liquid and the organic solvent as the drying prevention fluid are preferably composed of the same organic solvent, but may be other organic solvents.

In one embodiment of this invention, the said main conveyance unit is arrange | positioned at the main conveyance chamber, and the said local conveyance unit is arrange | positioned at the local conveyance chamber separated from the said main conveyance chamber. By this structure, since a drying prevention fluid (for example, vapor or droplet of an organic solvent) can be put in a local conveyance chamber, the influence of the drying prevention fluid on the board | substrate conveyed by a main conveyance unit can be suppressed.

A substrate processing method according to an embodiment of the present invention includes a liquid processing step of supplying a processing liquid to a surface of a substrate in a processing chamber, a drying step of drying the processing liquid of a substrate surface in a drying chamber, and a main conveying unit. The processing liquid on the surface of the substrate while the main conveying step of carrying the substrate into the processing chamber, the local conveying step of conveying the substrate from the processing chamber to the drying chamber by the local conveying unit, and the substrate being conveyed in the local conveying process. And a drying prevention fluid supplying step of supplying a drying prevention fluid that prevents drying of the substrate to the surface of the substrate.

In one embodiment of this substrate processing method, a drying prevention fluid is discharged toward the board | substrate hold | maintained by the said conveyance arm from the nozzle provided in the conveyance arm of the said local conveyance unit in the said drying prevention fluid supply process.

One embodiment of the said substrate processing method further includes the arm cooling process of cooling the conveyance arm of the said local conveyance unit below the temperature of the board | substrate at the time of conveyance.

In one embodiment of the said substrate processing method, the said drying process includes the pressure reduction process which pressure-reduces the inside of the said drying chamber to lower pressure than atmospheric pressure.

One embodiment of the substrate processing method further includes a step of supplying a drying prevention fluid to the substrate surface in the drying chamber prior to the drying step.

In one embodiment of the substrate processing method, the drying step includes a substrate heating step of heating the substrate in the drying chamber.

In one Embodiment of the said substrate processing method, the volume of the said drying chamber is smaller than the volume of the said processing chamber.

In one embodiment of the substrate processing method, the drying chamber has a carry-in opening through which the substrate is loaded by the local transfer unit, and the method includes a lid unit provided in the local transfer unit prior to the drying step. The process further includes the step of closing the carry-in opening.

In one embodiment of the substrate processing method, the treatment liquid is a low surface tension liquid having a smaller surface tension than water.

In one Embodiment of the said substrate processing method, the said drying prevention fluid contains the vapor or droplet of the said processing liquid.

In one embodiment of the substrate processing method, the treatment liquid contains an organic solvent, and the drying preventing fluid contains vapor or droplets of an organic solvent.

The above features can be combined in any combination.

The above or other objects, features, and effects in the present invention will be apparent from the following description of the embodiments with reference to the accompanying drawings.

1: A is a top view for demonstrating the structure of the substrate processing apparatus which concerns on 1st Embodiment of this invention.
FIG. 1B is a schematic elevation view for explaining the configuration of the substrate processing apparatus according to the first embodiment. FIG.
2 is a schematic cross-sectional view for illustrating a configuration example of a liquid processing unit included in the substrate processing apparatus.
3 is a schematic cross-sectional view for explaining a configuration example of a drying unit included in the substrate processing apparatus.
It is a figure for demonstrating the structural example of the local conveyance robot with which the said substrate processing apparatus was equipped.
5A is a schematic plan view for explaining the configuration of a substrate processing apparatus according to a second embodiment of the present invention.
FIG. 5B is a schematic elevation view for explaining the configuration of the substrate processing apparatus according to the second embodiment. FIG.
6A is a schematic plan view for explaining the configuration of a substrate processing apparatus according to a third embodiment of the present invention.
6B is an illustrative elevation view for explaining the configuration of the substrate processing apparatus according to the third embodiment.
7 is a schematic elevation view for explaining the configuration of the substrate processing apparatus according to the fourth embodiment of the present invention, and the configuration of one side of the main transport chamber is shown.
8 is a schematic plan view for explaining the configuration of a substrate processing apparatus according to a fifth embodiment of the present invention.
FIG. 9: is a figure for demonstrating the structure of the substrate processing apparatus which concerns on 6th Embodiment of this invention, and shows the structural example of a drying unit.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail with reference to an accompanying drawing.

1: A is a top view for demonstrating the structure of the substrate processing apparatus 1 which concerns on 1st Embodiment of this invention, and FIG. 1B is an elevation view. The substrate processing apparatus 1 includes a carrier holding unit 2, an indexer robot IR, and a plurality of liquid processing units M11 to M14 and M21 to M24 (collectively referred to as "liquid processing unit M") and , A plurality of drying units D11 to D14, D21 to D24 (collectively referred to as "drying unit (D)"), main transport robot (CR) and local transport robots L11 to LR14, LR21 to LR24 (collectively In this case, it is referred to as "local carrier robot LR." The main transport robot CR is an example of the main transport means, and the local transport robot LR is an example of the local transport means.

The carrier holding part 2 holds the carrier 3 which is a substrate container which holds a plurality of substrates W in a laminated state. In this embodiment, the carrier holding part 2 is comprised so that holding of the some carrier 3 is possible. The indexer robot IR accesses the carrier 3 held by the carrier holding unit 2 to take out the substrate W, and transfers the substrate W to and from the main transfer robot CR. .

In this embodiment, the plurality of liquid processing units M and the plurality of drying units D are arranged in three dimensions so as to form a plural layer structure (two layer structure in this embodiment). Specifically, as shown in FIG. 1A, in a plan view, the main transport robot CR is disposed in the main transport chamber 5 extending linearly from the carrier holding unit 2, and the main transport chamber CR is disposed. Two stacking unit groups G1 and G2 on both sides of (5); G3 and G4 are arrange | positioned along the main conveyance chamber 5. Thereby, four laminated unit groups G1-G4 are arrange | positioned around the main transport robot CR in planar view.

Four liquid processing units M11-M14, M21-M24 are arrange | positioned in the 1st layer S1 and the 2nd layer S2 of the substrate processing apparatus 1, and the substrate processing apparatus 1 has a total of eight The liquid processing unit M is provided. 1st layer S1 WHEREIN: Two liquid processing units M11 and M12 on both sides of the main conveyance chamber 5; M13 and M14 are arrange | positioned along the main conveyance chamber 5. Four drying units D11-D14 are arrange | positioned on these four liquid processing units M11-M14, respectively. Further, in the second layer S2, two liquid treatment units M21 and M22 on both sides of the main transport chamber 5; M23 and M24 are arrange | positioned along the main conveyance chamber 5. Four drying units D21-D24 are arrange | positioned on these four liquid processing units M21-M24, respectively. One liquid processing unit M and the drying unit D disposed thereon form a corresponding pair.

The stacking unit group G1 is configured by stacking the liquid processing unit M11, the drying unit D11, the liquid processing unit M21, and the drying unit D21 in order from the bottom. The stacking unit group G2 is configured by stacking the liquid processing unit M12, the drying unit D12, the liquid processing unit M22, and the drying unit D22 in order from the bottom. The stacking unit group G3 is configured by stacking the liquid processing unit M13, the drying unit D13, the liquid processing unit M23, and the drying unit D23 in order from the bottom. The stacking unit group G4 is configured by stacking the liquid processing unit M14, the drying unit D14, the liquid processing unit M24, and the drying unit D24 in order from the bottom.

The main transport robot CR can access the eight liquid processing units M in total to pass the substrate W, and can access the eight drying units D in total to take out the substrate W, In addition, the substrate W may be exchanged with the indexer robot IR.

In this embodiment, four local conveyance robots L are provided in 1st layer S1, and four are provided in 2nd layer S2. More specifically, in plan view, the first floor S1 includes two local transport robots LR11 and LR12 on each side of the main transport chamber 5; LR13 and LR14 are arrange | positioned. More specifically, on one side of the main transport chamber 5, one local transport robot LR11 is disposed between the carrier holding unit 2 and the liquid processing unit M11 in the first layer S1. The other local transfer robot LR12 is arrange | positioned at the edge part far from the carrier holding part 2. As shown in FIG. The same applies to the arrangement of the two local transfer robots LR13 and LR14 on the other side of the main transfer chamber 5. Four local transfer robots LR21 and LR22 in the second layer S2; LR23 and LR24 are arrange | positioned similarly. The local transfer robots LR11 to LR14 and LR21 to LR24 are disposed in the local transfer chambers C11 to C14 and C21 to C24 (collectively referred to as "local transfer chamber C"). The local conveyance chamber C forms the conveyance space partitioned so that it may separate (separately) from the main conveyance chamber 5.

In this way, one local transfer robot L is provided for each liquid processing unit M and the drying unit D. FIG. The local transfer robot LR takes out the board | substrate W after having been processed by the liquid processing unit M from the said liquid processing unit M, and conveys it to the corresponding drying unit D. FIG.

An operation example of the indexer robot IR, the main transport robot CR, and the local transport robot LR will be described schematically.

That is, the indexer robot IR takes out the unprocessed board | substrate W from either carrier 3, and passes it to the main conveyance robot CR. The main conveyance robot CR carries in the board | substrate W received from the indexer robot IR to any one liquid processing unit M. As shown in FIG. The liquid processing unit M executes a process for the loaded substrate W. FIG. The board | substrate W processed by the liquid processing unit M is carried out by the local transfer robot LR, and is conveyed to the drying unit D arrange | positioned immediately above it. The drying unit D dries the loaded substrate W. The board | substrate W after this drying process is carried out by main carrier robot CR. The main transfer robot CR passes the substrate W to the indexer robot IR. The indexer robot IR stores the passed substrate W in one of the carriers 3.

The indexer robot IR may pass the unprocessed board | substrate W to the main carrier robot CR, and may operate | move so as to receive the processed board | substrate W from the main carrier robot CR immediately before, immediately after, or simultaneously. Similarly, the main transfer robot CR may operate to receive the unprocessed substrate W from the indexer robot IR, and to pass the processed substrate W to the indexer robot IR immediately before, immediately after, or at the same time. . In addition, the main transfer robot CR may operate to carry the unprocessed board | substrate W into the liquid processing unit M, and to carry out the processed board | substrate W from the drying unit D immediately after or just before. .

As described above, one drying unit D corresponds to one liquid processing unit M in this embodiment. And the liquid processing unit M and the drying unit D are laminated | stacked. Moreover, one local conveyance robot LR is provided with respect to a pair of one liquid processing unit M and one drying unit D, and the local conveyance robot LR is such a liquid processing unit M ) And drying unit (D). The local conveyance robot LR carries out the board | substrate W processed by the liquid processing unit M from the liquid processing unit M, and conveys it to the drying unit D corresponding to the liquid processing unit M, It carries in to the drying unit D. Specifically, the local transfer robot LR carries the substrate W taken out of the liquid processing unit M in the vertical direction (more specifically, upward). The main transfer robot CR carries in the unprocessed board | substrate W to the liquid processing unit M, and carries out the processed board | substrate W from the drying unit D.

2 is a schematic cross-sectional view for illustrating a configuration example of the liquid processing unit M. FIG. The liquid processing unit M is provided with the processing chamber 11. In the processing chamber 11, the spin chuck 12 serving as the substrate holding means rotatable while holding the substrate W horizontally, the cup 13 surrounding the spin chuck 12, the chemical liquid nozzle 14, and the rinse. The liquid nozzle 15 and the organic solvent nozzle 16 are provided. The spin chuck 12 is rotated around the vertical axis of rotation 18 by a motor 17 which is an example of the substrate rotating means.

The chemical liquid pipe 21 is coupled to the chemical liquid nozzle 14. The chemical liquid valve 22 which opens and closes a chemical liquid passage is interposed in the middle of the chemical liquid piping 21. The chemical liquid is supplied to the chemical liquid pipe 21 from the chemical liquid supply source 23. The rinse liquid pipe 26 is coupled to the rinse liquid nozzle 15. The rinse liquid valve 27 which opens and closes the rinse liquid passage is interposed in the middle of the rinse liquid piping 26. The rinse liquid pipe 26 is supplied with a rinse liquid from the rinse liquid supply source 28. The rinse liquid is DIW (deionized water) in this embodiment. Of course, other rinse liquids, such as carbonated water, may be used.

The organic solvent pipe 31 is coupled to the organic solvent nozzle 16. In the middle of the organic solvent piping 31, the organic solvent valve 32 which opens and closes an organic solvent channel | path is interposed. The organic solvent pipe 31 is supplied with the organic solvent from the organic solvent supply source 33 in a liquid state. The organic solvent is an example of a low surface tension liquid having a smaller surface tension than the rinse liquid. As an organic solvent, IPA (isopropyl alcohol), HFE (hydrofluoro ether), etc. can be illustrated.

The board | substrate W of completion of the process by the board | substrate carrying-in opening 37 which the unprocessed board | substrate W is carried in by the main transport robot CR, and the local transport robot LR to the side walls 35 and 36 of the process chamber 11. The board | substrate carrying out opening 38 in which () is carried out is formed, respectively. Shutters 39 and 40 which open and close them are disposed in the substrate carrying opening 37 and the substrate carrying opening 38, respectively. The shutters 39 and 40 are opened and closed by the shutter drive units 41 and 42, respectively. The board | substrate carrying opening 37 is an opening which communicates the main conveyance chamber 5 and the process chamber 11, and is formed in the side wall 35 which divides the main conveyance chamber 5 and the process chamber 11. The substrate carrying-out opening 38 is an opening which communicates the process chamber 11 and the local conveyance chamber C, and is formed in the side wall 36 which divides the process chamber 11 and the local conveyance chamber C. As shown in FIG.

The operation of the liquid processing unit M will be described schematically.

When the main transport robot CR carries in the unprocessed substrate W, the shutter 39 opens the substrate loading opening 37. The hand HC (arm) of the main transfer robot CR holding the unprocessed substrate W enters the processing chamber 11 from the substrate loading opening 37 and enters the substrate W into the spin chuck 12. Pass The hand of the main transfer robot CR, which has passed the substrate W to the spin chuck 12, exits from the processing chamber 11 through the substrate loading opening 37. Thereafter, the shutter drive unit 41 drives the shutter 39 to close the substrate loading opening 37.

Subsequently, the spin chuck 12 is rotated by the motor 17, and the chemical liquid valve 22 is opened. Thereby, the chemical liquid is supplied to the surface of the substrate W in the rotating state, and the chemical liquid is widely spread over the entire surface of the substrate W by centrifugal force. In this way, the chemical | medical solution process which processes the board | substrate W with chemical liquid is performed. The supply of the chemical liquid is stopped by closing the chemical liquid valve 22, and the chemical liquid process ends.

After the chemical liquid process, the rinse liquid valve 27 opens while continuing the rotation of the spin chuck 12. Thereby, the rinse liquid is supplied to the surface of the board | substrate W of a rotating state. The rinse liquid spreads over the entire surface of the substrate W and replaces the chemical liquid on the surface of the substrate W. In this way the rinse process is carried out. By closing the rinse liquid valve 27, the supply of the rinse liquid is stopped, and the rinse step is completed.

The organic solvent valve 32A is opened after the end of the rinse step or immediately before the end of the rinse step. As a result, the first organic solvent is supplied to the substrate W surface. The spin chuck 12 is kept in rotation. Therefore, the organic solvent spreads over the entire surface of the substrate W to replace the rinse liquid on the surface of the substrate W. As shown in FIG. Thereafter, the rotational speed of the spin chuck 12 is reduced, whereby an organic solvent is accumulated on the surface of the substrate W to form a thick organic solvent liquid film 10 (organic solvent accumulation step). This accumulation state is maintained and rotation of the spin chuck 12 is stopped. The organic solvent is an example of a low surface tension liquid having a smaller surface tension than water.

Next, the shutter drive unit 42 drives the shutter 40 to open the substrate carrying opening 38. From this substrate carrying opening 38, the hand LH (arm) of the local transfer robot LR enters the processing chamber 11, receives the substrate W from the spin chuck 12, and receives the substrate carrying opening 38. ), The substrate W is carried out of the process chamber 11. At this time, the local conveyance robot LR conveys the board | substrate W to the drying unit D in the state which hold | maintained the organic-solvent film 10 on the surface of the board | substrate W.

3 is a schematic cross-sectional view for illustrating a configuration example of the drying unit D. FIG. The drying unit D has the pressure reduction drying chamber 51 (an example of a drying chamber) which consists of a pressure reduction chamber (vacuum chamber) which can be sealed. The volume of the pressure reduction drying chamber 51 is smaller than the volume of the processing chamber 11 of the liquid processing unit M, whereby the pressure reduction drying chamber 51 has a structure capable of efficiently depressurizing the internal space. The substrate holder 52 as a substrate holding unit holding the substrate W is disposed in the reduced pressure drying chamber 51. The board | substrate holder 52 is equipped with the heater 53 as a board | substrate heating unit, and the hotplate is comprised by this. A plurality of (three or more) lift pins 54 are disposed through the substrate holder 52. The lift pins 54 are moved up and down by the lift pin lift unit 55, thereby moving the substrate W up and down on the substrate holder 52.

The pressure reduction drying chamber 51 has a base part 511 and a movable lid part 512 which moves up and down with respect to the base part 511. The movable lid part 512 moves up and down with respect to the base part 511 by the lid part drive unit 56. The drying process space 50 is partitioned between the base part 511 and the movable lid part 512. The lower edge portion 58 of the movable lid portion 512 is formed along a plane along the upper surface 59 of the base portion 511. In the base portion 511, an O-ring 60 as a seal member is disposed at a position opposite to the lower edge portion 58 of the movable lid portion 512. The movable lid portion 512 is brought close to the base portion 511 and pressed tightly toward the base portion 511 to seal the gap between the movable lid portion 512 and the base portion 511 by the O-ring 60. . In this way, the closed drying processing space 50 is formed.

The exhaust pipe 62 is coupled to the base portion 511. The exhaust pipe 62 communicates with the drying processing space 50. The exhaust pipe 62 is connected to an exhaust unit 63 such as a vacuum pump. An exhaust valve 64 is interposed in the exhaust pipe 62. The exhaust unit 63 is an example of a decompression unit. By opening the exhaust valve 64 to drive the exhaust unit 63, the drying processing space 50 can be decompressed to atmospheric pressure lower than atmospheric pressure.

The movable lid portion 512 is provided with an organic solvent vapor nozzle 71 for introducing organic solvent vapor (organic solvent gas) as a drying prevention fluid into the drying processing space 50. An organic solvent pipe 72 is coupled to the organic solvent vapor nozzle 71. The organic solvent valve 73 is interposed in the middle of the organic solvent piping 72. The organic solvent pipe 72 is coupled to an organic solvent vapor supply 74 for supplying organic solvent vapor (organic solvent in gaseous state).

The organic solvent vapor source 74 is, for example, a temperature at which the tank 75 storing the liquid 80 of the organic solvent and the liquid 80 of the organic solvent in the tank 75 are temperature-controlled (specifically, heated). Control unit 76. The temperature control unit 76 includes, for example, a circulation pipe 77 and a pump 78 and a heater 79 interposed in the circulation pipe 77. The liquid 78 of the organic solvent in the tank 75 is pumped up by the pump 78, led to the circulation pipe 77, and heated by the heater 79, and then passes through the circulation pipe 77 to the tank 75. Is returned. The inlet of the organic solvent piping 72 is arrange | positioned in the tank 75 at the position higher than the liquid level of the liquid 80 of the organic solvent. Therefore, the organic solvent vapor which exists in the space on the organic solvent liquid level in the tank 75 is supplied to the organic solvent piping 72.

The carrier gas piping 82 may join the organic solvent piping 72 as needed. The carrier gas valve 83 is interposed in the carrier gas piping 82. The carrier gas piping 82 is connected to the carrier gas supply source 84 which supplies a carrier gas. As a carrier gas, nitrogen gas and other inert gas are suitable. The carrier gas assists the introduction of the organic solvent vapor supplied through the organic solvent pipe 72 into the drying treatment space 50. The organic solvent vapor source 74 preferably supplies steam of an organic solvent of the same kind as the organic solvent supplied from the liquid treatment unit M.

Instead of the structure which joins the carrier gas piping 82 to the organic solvent piping 72, as shown by the dashed-dotted line in FIG. 3, the carrier gas piping 82 is connected to the upper part of the tank 75, and a tank It is good also as a structure which directly supplies carrier gas (nitrogen gas etc.) to the upper space (space above liquid 80 upper limit liquid surface) in 75. In this case, the organic solvent vapor generated in the tank 75 is introduced into the organic solvent piping 72 together with the carrier gas.

The operation of the drying unit D will be described schematically.

The hand LH of the local transfer robot LR carries in the drying unit D the board | substrate W in the state in which the liquid film 10 of the organic solvent was formed in the surface. When the substrate W is loaded, the movable lid portion 512 is in an open position away from the base portion 511, whereby a substrate loading opening is formed between the movable lid portion 512 and the base portion 511. Is formed. At this time, the lift pin 54 is in a raised position where the distal end thereof is spaced upward from the surface of the substrate holder 52. In this state, the hand LH of the local transfer robot LR enters between the movable lid portion 512 and the base portion 511, and passes the substrate W to the lift pins 54. The lift pin 54 which passed the board | substrate W descends, and mounts the board | substrate W on the upper surface of the board | substrate holder 52. As shown in FIG.

On the other hand, the lid part drive unit 56 lowers the movable lid part 512, and presses the base part 511 firmly through the O-ring 60. As a result, the drying treatment space 50 becomes a sealed space. In addition, the exhaust valve 64 is opened, and the exhaust unit 63 is driven so that the atmosphere in the drying processing space 50 is exhausted, and the drying processing space 50 is depressurized.

In the period until the decompression of the drying process space 50 starts, the organic solvent valve 73 and the carrier gas valve 83 are opened, and the organic solvent vapor is discharged from the organic solvent vapor nozzle 71 in the drying process space 50. Steam is supplied. Thereby, evaporation of the organic solvent in the organic-solvent film 10 of the surface of the board | substrate W is suppressed, and drying before a pressure reduction start is suppressed. When the decompression of the drying process space 50 starts, the organic-solvent valve 73 and the carrier gas valve 83 are closed so that decompression may not be inhibited.

By decompression of the inside of the drying process space 50, the organic solvent on the surface of the board | substrate W evaporates in an instant, and the board | substrate W is dried by this. In addition, when the heater 53 is driven to heat the substrate holder 52, the substrate W is heated, and accordingly, drying of the substrate W is promoted.

After drying of the board | substrate W is complete | finished, the exhaust unit 63 is stopped and the inside of the drying process space 50 is pressurized to atmospheric pressure by opening the carrier gas valve 83 as needed. Thereafter, the lid drive unit 56 raises the movable lid 512 and is spaced apart from the base 511. In addition, the lift pin 54 is raised to lift the substrate W to a height away from the upper surface of the substrate holder 52. In this state, the hand HC of the main conveyance robot CR enters between the movable lid part 512 and the base part 511, and picks up the processed board | substrate W from the lift pin 54, It exits to the main conveyance room 5.

4 is a diagram for explaining a configuration example of the local transport robot LR. The local conveyance robot LR is arrange | positioned in the local conveyance room C. As shown in FIG. The local conveyance chamber C opposes the processing chamber 11 of the liquid processing unit M and the pressure reduction drying chamber 51 of the drying unit D arrange | positioned on the said processing chamber 11, and the pressure reduction drying chamber 51 is open. At that time, it communicates with the reduced pressure drying chamber 51.

The local transfer robot LR includes a hand LH (arm) for holding the substrate W and a hand drive unit 90 for driving the hand LH. The hand drive unit 90 moves the hand LH horizontally and vertically, and also rotates the hand LH around the vertical axis of rotation 89 as necessary. Thereby, the hand LH enters into the processing chamber 11 of the liquid processing unit M, receives the board | substrate W from the spin chuck 12, and conveys the board | substrate W to the drying unit D, The board | substrate W can be carried in into the dry pressure reduction chamber 51, it can be passed to the lift pin 54 (refer FIG. 3), and it can exit to the local conveyance chamber C after that.

Since the drying unit D is disposed on the liquid processing unit M, the local transfer robot LR carries out the substrate W from the liquid processing unit M, and then the hand LH is moved to the drying unit D. It operates to raise to the height of.

Of the substrate W held by the hand LH in the hand LH of the local transport robot LR (or a movable part where the relative position of the hand LH does not change significantly without the movement of the hand LH). The organic solvent gas nozzle 91 which supplies the organic solvent vapor | steam as a drying prevention fluid is arrange | positioned to the periphery (especially near the upper surface of the board | substrate W). The organic solvent gas nozzle 91 is connected to the organic solvent gas piping 92. An organic solvent gas valve 93 is interposed in the organic solvent gas pipe 92. The organic solvent gas pipe 92 is connected to the organic solvent gas supply source 94. The organic solvent gas supply source 94 preferably supplies steam (gas) of an organic solvent (for example, IPA) that is the same as the organic solvent supplied from the liquid treatment unit M. The organic solvent gas nozzle 91 or the like constitutes a drying prevention fluid supply unit.

By salting the organic solvent gas valve 93, the organic solvent gas can be supplied in the local transport chamber C, particularly in the vicinity of the substrate W held by the hand LH. Thereby, around the organic-solvent film 10 of the upper surface of the board | substrate W becomes an atmosphere with high density | concentration of organic solvent gas. For this reason, since the evaporation of the organic solvent which comprises the organic-solvent liquid film 10 is hard to advance, the drying unit D is carried out in the liquid processing unit M, keeping the organic-solvent liquid film 10 on the board | substrate W. ), The substrate W can be conveyed. In this embodiment, since the relative position of the organic-solvent gas nozzle 91 and the hand LH is kept substantially constant even if the hand LH moves, the circumference | surroundings of the board | substrate W also in the middle of conveyance by the hand LH. The organic solvent concentration in the space can be maintained at a stable and expensive value. Thereby, evaporation of the organic solvent can be suppressed or prevented more reliably.

The local transfer robot LR may further be provided with the hand cooling unit 97 (arm cooling unit) which cools the hand LH. The hand cooling unit 97 may be configured to circulate the coolant in the coolant passage 98 formed in the hand LH. Instead of the configuration having such a coolant passage 98, an electronic cooling element (not shown) that cools the hand LH may be provided. In addition, the hand cooling unit 97 may be configured to cool the cooling plate 99 provided in the local transport chamber (C). In this case, the hand LH contacts the cooling plate 99 in a period where the local transport robot LR does not hold the substrate W. As shown in FIG. Thereby, the hand LH is cooled in the non-operation period of the hand LH. Since the board | substrate W can be cooled during conveyance by conveying the board | substrate W by this cooled hand LH, evaporation of the organic solvent on the board | substrate W can be suppressed or prevented.

In order to cool the board | substrate W hold | maintained by the hand LH efficiently, the hand LH may be comprised in the plate shape corresponding to the shape of the board | substrate W. As shown in FIG. Such a plate-shaped hand LH may have a notch running plate shape in which a notch for avoiding the chuck pins provided in the spin chuck 12 is formed around the spin chuck 12 and the substrate W. .

As shown in FIG. 4, instead of providing the organic solvent gas nozzle 91 in the hand LH, or in addition to the organic solvent gas nozzle 91, the organic solvent gas is supplied into the local transfer chamber C. 91 A of organic solvent gas nozzles (an example of a drying prevention fluid supply unit) may be arrange | positioned.

Instead of supplying the organic solvent vapor from the nozzles 91 and 91A, mists (droplets) of the organic solvent may be supplied from these nozzles.

As described above, according to this embodiment, the substrate W to be processed is carried into the processing chamber 11 of the liquid processing unit M by the main transfer robot CR. In the liquid processing unit M, the processing liquid is supplied to the substrate W in the processing chamber 11, and the substrate W is processed by the processing liquid. The processing liquid finally supplied from the liquid processing unit M to the substrate W is an organic solvent which is an example of a low surface tension liquid, and the substrate W after the treatment holds the organic solvent liquid film 10 on its surface. . This board | substrate W is conveyed from the processing chamber 11 to the drying chamber 51 by the local transfer robot LR, and the drying process for drying the organic solvent of the surface of the board | substrate W in the drying chamber 51 is performed. do.

The conveyance of the board | substrate W from the processing chamber 11 to the pressure reduction drying chamber 51 is performed by the local conveyance robot LR provided separately from the main conveyance robot CR. Thereby, influence of the organic solvent on the main conveyance robot CR and the component which may exist in the movable range, or another board | substrate W can be suppressed. In particular, it is possible to avoid the liquid of the organic solvent being caught by the main transport robot CR or the liquid on the substrate W to be scattered around the main transport robot CR.

While being conveyed by the local conveyance robot LR, the vapor of the organic solvent is supplied to the surface of the board | substrate W in the conveyance as a drying prevention fluid which prevents drying of the organic solvent. Therefore, the substrate W processed by the liquid processing unit M is carried into the decompression drying chamber 51 in a state after the processing, that is, in a state in which the organic solvent liquid film 10 is formed on the surface, and dried by the drying unit D. Receive processing. Thereby, drying in the inadvertently uncontrolled state of the surface of the board | substrate W in the conveyance by the local conveyance robot LR can be suppressed. That is, the drying process for removing an organic solvent from the surface of the board | substrate W can be performed in the adjusted environment in the pressure reduction drying chamber 51. FIG. Thereby, the bad influence to the board | substrate W by inadvertent drying can be avoided, and drying of the board | substrate W can be performed favorably.

The liquid processing unit M has the spin chuck 12 in the processing chamber 11, and its volume is relatively large. For this reason, it is not practical to decompress the space in the process chamber 11 and perform pressure reduction drying, and even if it is possible, it takes a long time to decompress the large volume of space. Then, since the surface tension of the organic solvent is relatively small since the pattern of the surface of the substrate W is subjected to surface tension from the organic solvent, the pattern of the surface of the substrate W is affected by the surface tension (specifically, May cause damage such as pattern collapse).

Here, in this embodiment, the board | substrate W after completion | finish of processing in the liquid processing unit M is carried in to the pressure reduction drying chamber 51 with smaller volume, and the pressure reduction drying process in the pressure reduction drying chamber 51 is performed. . Thereby, since the organic solvent on the surface of the board | substrate W can be dried in an instant, collapse of the pattern of the surface of the board | substrate W can be suppressed or prevented.

Moreover, in this embodiment, the organic solvent is located in the hand LH of the local transport robot LR or its vicinity (specifically, in any place of the transport arm containing the hand LH, or in the local transport chamber C). Gas nozzles 91 and 91A are arranged. The organic solvent gas is supplied from the organic solvent gas nozzles 91 and 91A to the surface of the board | substrate W conveyed by the local transfer robot LR. Thereby, inadvertent drying of the surface of the board | substrate W during conveyance by the local transfer robot LR can be suppressed more reliably.

Moreover, if the hand (carrying arm) of the local conveyance robot LR is cooled below normal temperature by the hand cooling unit 97, it can avoid that the board | substrate W warms during the conveyance by the local conveyance robot LR. have. Thereby, since evaporation of the organic solvent on the surface of the board | substrate W can be suppressed, inadvertent drying of the surface of the board | substrate W can be further suppressed.

Moreover, in this embodiment, the organic solvent vapor nozzle 71 which supplies the organic solvent vapor | steam to the surface of the board | substrate W is provided in the drying unit D. As shown in FIG. Thereby, in the pressure reduction drying chamber 51, it can avoid that inadvertent drying of the surface of the board | substrate W starts before pressure reduction drying process starts.

Moreover, in this embodiment, it is comprised so that the local conveyance robot LR may convey the board | substrate W along the conveyance path which passes through the local conveyance chamber C. As shown in FIG. Thereby, the influence of the organic solvent on the surface of the board | substrate W during conveyance is put in the local conveyance chamber C by the local conveyance robot LR. Therefore, the influence of the organic solvent on the component part of main substrate robot CR and other substrate processing apparatus 1 can be suppressed. In particular, in this embodiment, the main transport robot CR is disposed in the main transport chamber 5, and the local transport robot LR is disposed in the local transport chamber C spaced apart from the main transport chamber 5. have. Thereby, since it can suppress or prevent the vapor of the organic solvent from entering the main conveyance chamber 5, the influence of the organic solvent vapor on the board | substrate W conveyed by the main conveyance robot CR can be suppressed. .

FIG. 5: A is a schematic top view for demonstrating the structure of the substrate processing apparatus 1A which concerns on 2nd Embodiment of this invention, and FIG. 5B is an elevation view. 5A and 5B, the same reference numerals are attached to corresponding portions of the above-described parts of FIGS. 1A and 1B.

In this embodiment, the local conveyance chamber C is arrange | positioned between two laminated unit groups G1 and G2 arrange | positioned at one side of the main conveyance chamber 5 in plan view, and this local conveyance chamber C The local conveyance robot L is arrange | positioned at). Similarly, the local conveyance chamber C is arrange | positioned between two laminated unit groups G3 and G4 arrange | positioned at the other side of the main conveyance chamber 5, and the local conveyance robot LR in the local conveyance chamber C. This is arranged. The plurality of units constituting the stacking unit groups G1 to G4 and the stacked state thereof are the same as those in the first embodiment.

As in the case of the first embodiment, the main transport robot CR can access the eight liquid processing units M in total and pass the substrates W, and access the eight drying units D in total. The board | substrate W can be taken out and the board | substrate W can be exchanged with the indexer robot IR.

In this embodiment, two local conveyance robots LR are provided in the 1st layer S1, and two are provided in the 2nd layer S2. More specifically, in plan view, the local transport robots LR11 and LR12 are arranged on each side of the main transport chamber 5 in the first layer S1. More specifically, on one side of the main transport chamber 5, one local transport robot LR11 is disposed in the first layer S1 between the liquid processing units M11 and M12. Similarly, one local transfer robot L12 is disposed between the liquid processing units M13 and M14 on the other side of the main transfer chamber 5. Two local transfer robots LR21 and LR22 in the second layer S2 are similarly arranged. The local transfer robots LR11, LR12, LR21, and LR22 are disposed in the local transfer chambers C11, C12, C21, and C22, respectively. The local conveyance chamber C forms the conveyance space partitioned so that it may separate (separately) from the main conveyance chamber 5.

In the 1st layer S1, the local conveyance robot LR11 arrange | positioned at one side of the main conveyance chamber 5 is shared by two liquid processing units M11 and M12. That is, the local conveyance robot LR11 takes out the board | substrate W which completed the process in the liquid processing unit M11 near the carrier holding part 2, and conveys it to a vertical direction (more specifically upwards), It carries in to the drying unit D11 on the liquid processing unit M11. Moreover, the local transfer robot LR11 takes out the board | substrate W which completed the process in the liquid processing unit M12 far from the carrier holding part 2, and conveys it to a vertical direction (more specifically upwards), It carries in to the drying unit D12 on this liquid processing unit M12.

The local transfer robot LR11 moves the substrate W on the liquid processing unit M12 far from the carrier holding unit 2 to the substrate W after the processing in the liquid processing unit M11 near the carrier holding unit 2. You may convey to drying unit D12. Similarly, the local transfer robot LR11 moves the substrate W, which has finished processing in the liquid processing unit M12 far from the carrier holding unit 2, to the liquid processing unit M11 closer to the carrier holding unit 2. ) May be conveyed to the drying unit D11 above. More generalized, the local transfer robot LR11 has two liquid treatment units M11 and M12 disposed on one side of the main transfer chamber 5 in the first layer S1 and two drying units disposed thereon, respectively. The units D11 and D12 are accessible. And the board | substrate W which completed the process in one liquid processing unit M11, M12 is carried in by either of the two drying units D11, D12 by the local conveyance robot L11, and receives a pressure reduction drying process. .

The same applies to the operation of the local transfer robot LR12 disposed on the other side of the main transfer chamber 5 in the first layer S1. In other words, the local transfer robot LR12 is configured to be accessible to two liquid processing units M13 and M14 and two drying units D13 and D14. The same operation as that of the local transfer robot LR11 is performed.

The same applies to the operations of the local carrier robots LR21 and LR22 arranged on the second layer S2. That is, the local conveyance robot LR21 is comprised so that two liquid processing units M21 and M22 and two drying units D21 and D22 are accessible, and with respect to these, operation | movement similar to the local conveyance robot L11 is carried out. Is carried out. Moreover, the local conveyance robot LR22 is comprised so that two liquid processing units M23 and M24 and two drying units D23 and D24 are accessible, and operation | movement similar to local conveyance robot L11 with respect to these is carried out. Is carried out.

Two local transfer robots LR11 and LR21 arranged on one side of the main transfer chamber 5 are arranged in two local transfer chambers C11 and C21 which overlap with each other in this embodiment in plan view. Similarly, the two local transfer robots LR12 and LR22 disposed on the other side of the main transfer chamber 5 are disposed in the two local transfer chambers C12 and C22, which overlap with each other in plan view in this embodiment, respectively. .

The two local transfer chambers C11, C21; C12, and C22 overlapping each other up and down may be one local transfer chamber. And one local transfer robot LR may be arrange | positioned in this one local transfer room C. As shown in FIG.

In this case, on one side of the main transfer chamber 5, the liquid holding unit M11, the drying unit D11, the liquid processing unit M21, and the drying unit on the carrier holding unit 2 side relative to the local transfer chamber C. The stacking unit group G1 in which the D21 is stacked in this order is located, and the liquid processing unit M12, the drying unit D12, the liquid processing unit M22, and the drying unit D22 are also located on the side far from the carrier holding unit 2. ) Is stacked in a stacking unit group G2. One local conveyance robot LR arrange | positioned in the local conveyance room C can access the eight units which comprise such a pair of stacking unit group G1 and G2 in total. In this case, the local transfer robot LR is a drying unit D11, D12, D21, D22, on which one substrate W whose processing is completed in any liquid processing units M11, M12, M21, and M22 is stacked. You may operate to carry into). Moreover, the local transfer robot LR is among the four drying units D11, D12, D21, D22 which can access the one board | substrate W which the process complete | finished in any liquid processing unit M11, M12, M21, M22. You may carry in to any one. Generally, productivity can be improved by carrying in the board | substrate W to the drying unit D which is not used for the process.

The other side of the main conveyance chamber 5 is also the same structure, and can operate the one local conveyance robot LR shared by two lamination unit groups G3 and G4 similarly.

As understood from the comparison of FIG. 1A and FIG. 5A, the area (footprint) of the substrate processing apparatus 1A can be made small by the structure of this embodiment.

FIG. 6A is a schematic plan view for explaining the configuration of the substrate processing apparatus 1B according to the third embodiment of the present invention, and FIG. 6B is an elevation view thereof. In the substrate processing apparatus 1B of this embodiment, the arrangement | positioning of a unit forms the three-layer structure containing 1st layer S1, 2nd layer S2, and 3rd layer S3.

In this embodiment, three laminated unit groups G11, G12, and G13 are arrange | positioned along the main conveyance chamber 5 at one side of the main conveyance chamber 5, when it sees from a plane. Three stacking unit groups G14, G15, and G16 are arranged along the main transport chamber 5 on the other side of the cross section.

The stacking unit group G11 is configured by stacking three liquid processing units M11, M21, and M31 in order from the bottom. The stacking unit group G13 is configured by stacking three liquid processing units M12, M22, and M32 in order from the bottom. The stacking unit group G12 disposed between the stacking unit groups G11 and G13 is configured by stacking six drying units D11, D12, D21, D22, D31, and D32 in order from the bottom. Local conveyance chambers C11, C21, and C31 are further laminated | stacked and arrange | positioned sequentially from the bottom, among the stacking unit groups G11 and G13, and local conveyance robots LR11, LR21, and LR31 are arrange | positioned, respectively, among them. It is. In this embodiment, the local conveyance chambers C11, C21, and C31 are arrange | positioned with respect to the lamination unit group G12 on the opposite side to the main conveyance chamber 5.

The stacking unit group G14 is configured by stacking three liquid processing units M13, M23, and M33 in order from the bottom. The stacking unit group G16 is configured by stacking three liquid processing units M14, M24, and M34 in order from the bottom. The stacking unit group G15 disposed between the stacking unit groups G14 and G16 is configured by stacking six drying units D13, D14, D23, D24, D33, and D34 in order from the bottom. Between the stacking unit groups G14 and G16, further, the local transfer chambers C12, C22, and C32 are stacked in order from the bottom, and among them, the local transfer robots LR12, LR22, and LR32 are arranged respectively. It is. In this embodiment, the local conveyance chambers C12, C22, and C32 are arrange | positioned with respect to the lamination unit group G15 on the opposite side to the main conveyance chamber 5.

When the structure of each layer is confirmed, in 1st layer S1, one side of the main conveyance chamber 5 is a pair of liquid processing units along the longitudinal direction in the planar view of the main conveyance chamber 5 ( M11 and M12 are arrange | positioned, and a pair of drying unit D11 and D12 and one local conveyance robot LR11 are arrange | positioned between these pair of liquid processing units M11 and M12. The pair of drying units D11 and D12 are stacked up and down in this embodiment. The drying units D11 and D12 are arranged at positions close to the main transfer chamber 5, and the local transfer robot LR11 is disposed on the side opposite to the main transfer chamber 5 with respect to the drying units D11 and D12. have.

Local conveyance robot LR11 is arrange | positioned in local conveyance room C11. The local transfer robot LR11 is accessible to the pair of liquid processing units M11 and M12 and the pair of drying units D11 and D12. Local transfer robot LR11 carries out the board | substrate W which completed the process in one liquid processing unit M11, M12, and carries in the board | substrate W to either one of a pair of drying unit D11, D12. To work.

In 1st layer S1, the unit arrangement | positioning on the other side of the main conveyance chamber 5 is also the same. That is, on the other side of the main conveyance chamber 5, a pair of liquid processing units M13 and M14 are arrange | positioned along the longitudinal direction in the plane view of the main conveyance chamber 5, This pair A pair of drying units D13 and D14 and one local conveyance robot L12 are arrange | positioned between the liquid processing units M13 and M14. The pair of drying units D13 and D14 are stacked up and down. Such drying units D13 and D14 are arranged at positions close to the main transport chamber 5, and the local transport chamber C12 is partitioned on the side opposite to the main transport chamber 5 with respect to the drying units D13 and D14. The local transfer robot LR12 is housed there.

The local transfer robot LR12 is accessible to the pair of liquid processing units M13 and M14 and the pair of drying units D13 and D14. Local transfer robot LR12 carries out the board | substrate W which completed the process in one liquid processing unit M13, M14, and carries in the board | substrate W to one of the pair of drying units D13 and D14. To work.

The same applies to the unit arrangement of the second layer S2 and the third layer S3 and the operation of the local transfer robot LR of each layer. The second layer S2 includes a pair of liquid processing units M21 and M22, a pair of drying units D21 and D22 and a local transfer robot LR21 disposed on one side of the main transfer chamber 5. And a pair of liquid processing units M23 and M24, a pair of drying units D23 and D24 and a local transfer robot LR22 disposed on the other side of the main transfer chamber 5. Include. The third layer S3 includes a pair of liquid processing units M31 and M32, a pair of drying units D31 and D32 and a local transfer robot LR31 disposed on one side of the main transfer chamber 5. And a pair of liquid processing units M33 and M34, a pair of drying units D33 and D34 and a local transfer robot LR32 disposed on the other side of the main transfer chamber 5. Include.

As described above, in this embodiment, the liquid processing unit M and the drying unit D are arranged in a plane (horizontal arrangement), whereby a large number of liquid processings are performed while suppressing the overall height of the substrate processing apparatus 1B. Unit M and drying unit D may be provided.

Three local transfer robots LR11, LR21, and LR31 disposed on one side of the main transfer chamber 5 are arranged in three local transfer chambers C11, C21, and C31 overlapping each other in this embodiment in plan view. Each is arranged. It is good also as one local conveyance chamber C which connected these three local conveyance chambers C11, C21, and C31 up and down. Moreover, you may arrange | position one local conveyance robot LR in this one local conveyance room C. As shown in FIG. In this case, the stacking unit group G11 in which three liquid processing units M11, M21, and M31 are stacked is located on the carrier holding part 2 side with respect to the local transport chamber C, and is located on the side far from the carrier holding part 2. And a stacking unit group G13 in which three liquid processing units M12, M22, and M32 are stacked, and six drying units D11, D12, D21, D22, D31, and D32 are provided on the main transport chamber 5 side. The stacked stacking unit group G12 is located. One local conveyance robot LR arrange | positioned in the local conveyance room C can access 12 units in total which comprise such three lamination | stacking unit groups G11-G13.

In this case, the local transfer robot LR may operate to carry in one drying substrate D, which is located in the same layer, on one substrate W after the processing is completed in any liquid processing unit M. FIG. In addition, the local transfer robot LR may carry in one of the six drying units D which can access the one board | substrate W which the process complete | finished in any liquid processing unit M. Generally, productivity can be improved by carrying in the board | substrate W to the drying unit D which is not used for the process. Of course, the same structure can also be provided with the opposite side of the main conveyance chamber 5.

As understood from the comparison of FIG. 1A and FIG. 6A, the area (footprint) of the substrate processing apparatus 1B can be reduced by the configuration of this embodiment. Moreover, as understood from the comparison of FIG. 5B, FIG. 6B, etc., by the structure of this embodiment, more units can be arrange | positioned in the space of the same height. In other words, the substrate processing apparatus of the same unit number can be comprised with a lower height.

7 is an illustrative elevation view for explaining the configuration of the substrate processing apparatus 1C according to the fourth embodiment of the present invention, and the configuration of one side of the main transport chamber is shown. A pair of laminated unit groups G21 and G22 are arrange | positioned at one side of the main conveyance chamber 5 (refer FIG. 5A etc.), and local conveyance robots LR1 and LR2 are arrange | positioned between them. In this example, one stacking unit group G21 is configured by stacking three liquid processing units M1, M2, and M3 in three layers. Another stacking unit group G22 includes one liquid processing unit M4 and four drying units D1 to D4 stacked in that order. The same structure is provided also in the opposite side of the main conveyance chamber 5. The main transport robot CR is accessible to four liquid processing units M1 to M4 and four drying units D1 to D4 disposed on one side of the main transport chamber 5, and further includes the main transport chamber 5. Four liquid treatment units and four drying units, which are likewise arranged on the opposite side).

In this example, two local transfer robots LR1 and LR2 are provided on one side of the main transfer chamber 5, and these are arranged in one local transfer chamber C. As shown in FIG. For example, the lower local transfer robot LR1 may be accessible to three liquid processing units M1, M2, and M4 and two drying units D1 and D2. The upper local transport robot LR2 may be accessible to two liquid processing units M2 and M3 and four drying units D1 to D4. These local transfer robots LR1 and LR2 operate to carry the substrate W after being processed in the liquid processing units M1 to M4 into any one of the drying units D1 to D4. The same structure is provided also in the opposite side of the main conveyance room 5, and the operation of two local conveyance robots is also the same.

8 is a schematic plan view for explaining the configuration of the substrate processing apparatus 1D according to the fifth embodiment of the present invention. In this embodiment, three stacking unit groups G31, G32, and G33 are provided. The first stacking unit group G31 is configured by stacking the liquid processing units M11, M21, and M31 in plural layers (three layers in this embodiment). The second stacking unit group G32 is opposed to the first stacking unit group G31 along the alignment direction of the carrier 3 in the carrier holding unit 2. This 2nd lamination unit group G32 is comprised by laminating | stacking liquid processing unit M12, M22, M32 in multiple layers. The third stacking unit group G33 is disposed between the first and second stacking unit groups G31 and G32. The 3rd lamination unit group G33 is comprised by laminating | stacking drying unit D1-D6 in multiple layers (6 layers in this embodiment), Comprising: Lamination unit group G12, G15 shown to FIG. 6A and 6B, and It has a similar configuration. The local conveyance chamber C is arrange | positioned on the opposite side to main conveyance robot CR about drying units D1-D6. Local conveyance robot LR is arrange | positioned in local conveyance room C. FIG. One local transfer robot LR may be provided in each floor corresponding to liquid processing units M11 and M12; M12 and M22; M31 and M32. In addition, one local transfer robot LR commonly used may be provided for the liquid processing unit M disposed on a plurality of layers (for example, all layers).

The main transfer robot CR is disposed in the main transfer chamber 5A. The main conveyance chamber 5 is partitioned between 1st-3rd lamination unit group G31-G33 and indexer robot IR. The water transfer of the substrate W between the indexer robot IR and the main transfer robot CR may be carried out through the substrate water supply unit 7 which temporarily holds the substrate W. As shown in FIG. The main transfer robot CR includes one liquid treatment included in the first or second stacked unit groups G31 and G32 for the unprocessed substrate W received from the indexer robot IR through the substrate water supply unit 7. Bring into the unit M. The substrate W after having been processed in the liquid processing unit M is carried out by the local transfer robot LR and carried in one of the drying units D1 to D6 accessible to the local transfer robot LR. . The substrate W after being processed in the drying unit D is taken out by the main transport robot CR and passed to the indexer robot IR through the substrate water supply unit 7.

FIG. 9: is a figure for demonstrating the structure of the substrate processing apparatus which concerns on 6th Embodiment of this invention, and shows the structural example of the drying unit D. As shown in FIG. This drying unit D has the pressure reduction drying chamber 111 which comprises a vacuum chamber. The exhaust pipe 112 is connected to the pressure reduction drying chamber 111. The exhaust pipe 112 is connected to an exhaust unit 113 such as a vacuum pump. An exhaust valve 110 is interposed in the exhaust pipe 112.

In the pressure reduction drying chamber 111, a substrate loading opening 114 for carrying in the substrate W is formed in the side wall 115. Moreover, the board | substrate carrying out opening 116 for carrying out the board | substrate W is formed in the side wall 117 in the pressure reduction drying chamber 111. A shutter 118 for opening and closing the substrate carrying opening 116 is provided, and the shutter 118 is driven by the shutter drive unit 119. The O-ring 120 as a seal member is provided on the surface of the shutter 118 that faces the reduced pressure drying chamber 111. The shutter 118 is pressed against the side wall 117 of the pressure reduction drying chamber 111, thereby sealing the substrate carrying opening 116 in an airtight manner through the O-ring 120. When the main transport robot CR carries out the processed substrate W by the drying unit D, the shutter drive unit 119 drives the shutter 118 to open the substrate transport opening 116. The hand HC of the main transport robot CR enters into this open substrate carrying out opening 116.

On the other hand, the substrate loading opening 114 is opened and closed by the lid member 125 provided in the hand LH of the local transfer robot LR. An O-ring 126 as a seal member is provided on a surface of the lid member 125 that faces the reduced pressure drying chamber 111. The local transfer robot LR carries the board | substrate W after having been processed by the liquid processing unit M into the pressure reduction drying chamber 111, and also the lid member 125 through the O-ring 126, and the pressure reduction drying chamber 111. ) Sidewall 115 is pressed firmly. Thereby, the board | substrate carrying opening 114 is airtightly closed.

An organic solvent vapor nozzle 71A for introducing an organic solvent vapor (organic solvent gas) as a drying prevention fluid is provided in a space in the reduced pressure drying chamber 111 in the ceiling surface of the pressure reduction drying chamber 111. This organic solvent vapor nozzle 71A can have the same structure as in the case of the drying unit shown in FIG. 3, and vapor of the organic solvent is supplied to the organic solvent vapor nozzle 71A. In FIG. 9, the same reference numerals are attached to the parts corresponding to the respective parts in FIG. 3, and description is omitted.

The outline of the operation of the drying unit D is as follows.

The local transfer robot LR carries in the board | substrate W to the pressure reduction drying chamber 111 in the state in which the board | substrate carrying out opening 116 was closed by the shutter 118. This board | substrate W is a board | substrate with the organic-solvent film 10 formed in the upper surface. The local transfer robot LR enters the hand LH into the decompression drying chamber 111, and also presses the lid member 125 against the outer surface of the side wall 115 of the decompression drying chamber 111 to open the substrate loading opening 114. Occupies. In this way, the inside of the pressure reduction drying chamber 111 becomes an airtight sealed space. In this state, the exhaust valve 110 is opened and the exhaust unit 113 is operated, whereby the space in the pressure reduction drying chamber 111 is reduced to a pressure lower than atmospheric pressure. As a result, the organic solvent liquid film 10 on the substrate W is quickly dried.

The organic solvent valve 73 and the carrier gas valve 83 open in the period until the decompression of the space in the reduced pressure drying chamber 111 starts, and the organic solvent is released from the organic solvent vapor nozzle 71 into the reduced pressure drying chamber 111. Steam is supplied. Thereby, evaporation of the organic solvent from the organic-solvent film 10 of the surface of the board | substrate W is suppressed, and drying before a pressure reduction start is suppressed. When the decompression in the decompression drying chamber 111 is started, the organic solvent valve 73 and the carrier gas valve 83 are closed so as not to inhibit the decompression.

In this way, when drying of the board | substrate W is complete | finished, the exhaust unit 113 will stop operation | movement and the carrier gas valve 83 will open as needed. Thereby, the space in the pressure reduction drying chamber 111 returns to atmospheric pressure. The shutter drive unit 119 then retracts the shutter 118 from the substrate carrying opening 116, thereby opening the substrate carrying opening 116. Thereafter, the main transport robot CR enters the hand HC into the decompression drying chamber 111, receives the dry processing completed substrate W from the hand LH of the local transport robot L, and releases the substrate. The substrate W is taken out from 116.

Thus, by providing the lid member 125 in the hand LH of the local transfer robot LR, the shutter drive mechanism for opening and closing the board | substrate carrying opening 114 can be abbreviate | omitted. Moreover, since holding of the board | substrate W in the pressure reduction drying chamber 111 can be performed by the hand LH of the local transfer robot LR, it is not necessary to provide a board | substrate holding mechanism in the pressure reduction drying chamber 111. Moreover, as shown in FIG. Since drying of the organic solvent by pressure reduction can be performed in an instant, there is no fear that a great influence on productivity may occur due to holding of the substrate W during the drying process by the hand LH of the local transfer robot LR.

Moreover, the board | substrate carrying-in opening 114 can be sealed by the lid member 125 by the operation | movement which conveys the board | substrate W to the pressure reduction drying chamber 111 by the hand LH, and the pressure reduction drying chamber 111 as it is. The board | substrate W can be hold | maintained in it, and a pressure reduction drying process can be performed. Therefore, since the operation | movement only for opening and closing of the board | substrate carrying-in opening 114, and the operation | movement operation of the board | substrate W can be omitted, the required time of the whole process can be shortened and productivity can be improved.

Moreover, also in the drying unit D of this form, you may be set as the structure which heats the board | substrate W by providing the heater 53 as shown in FIG.

As mentioned above, although embodiment of this invention was described, this invention can be implemented in another form.

As shown by a dashed-dotted line in FIG. 2, the liquid processing unit M may have a blocking plate 19 having an opposing surface 19a opposite to the upper surface of the substrate W held by the spin chuck 12. do. In this case, the blocking plate 19 is moved upward and downward above the spin chuck 12 to move the blocking plate 19 closer to the upper surface of the substrate W or to move away from the upper surface of the substrate W. Preferably, a unit is provided. For example, by performing the rinsing step or performing the organic solvent accumulation step with the blocking plate 19 approaching the upper surface of the substrate W, droplets or mists protruding from the surroundings are formed on the upper surface of the substrate W. FIG. Attachment can be suppressed or prevented. In this case, the rinse liquid nozzle 15 and the organic solvent nozzle 16 are integrated in the blocking plate 19, for example, in the vicinity of the center of the opposite surface 19a of the blocking plate 19. It is preferable to arrange | position so that a liquid may be discharged toward the center.

In addition, the liquid processing unit M may further include a substrate cooling unit that cools the substrate W. FIG. The substrate cooling unit may include, for example, a cold temperature plate 20 (see FIG. 2) provided to face the lower surface of the substrate W held by the spin chuck 12. The plate drive unit which approaches / separates the cold plate from the lower surface of the board | substrate W may be further provided. The cold / hot plate may be a plate in which a refrigerant passage through which the refrigerant flows. Moreover, the cold plate may be equipped with the electronic cooling element. The substrate cooling unit cools the substrate to a temperature below the dew point of the organic solvent, and suppresses or prevents evaporation of the organic solvent on the surface of the substrate W. That is, the substrate cooling unit preferably maintains the substrate W at a temperature below the dew point of the organic solvent in the period until the substrate W processed in the organic solvent treatment step is taken out from the liquid processing unit M. Do. Instead of providing such a substrate cooling unit, the entire processing chamber 11 of the liquid processing unit M may be cooled, and the atmosphere in the processing chamber 11 may be cooled below the dew point of the organic solvent.

In addition, the liquid treatment unit M is provided with a drying prevention fluid (eg, vapor or mist of organic solvent) on the surface of the substrate W in order to suppress or prevent evaporation of the organic solvent on the surface of the substrate W. You may be provided with the drying prevention fluid supply unit to supply to. The anti-drying fluid supply unit supplies the anti-drying fluid to the nozzle 130 (see FIG. 2) that discharges the anti-drying fluid toward the surface of the substrate W held by the spin chuck 12, and to the nozzle 130. It is preferable that the pipe 131 to be included, and the valve 132 interposed in the pipe 131. The pipe 131 is connected to the anti-drying fluid source 133. The nozzle 130 may be integrated in the above-described blocking plate 19 or may be a moving nozzle which is movable between the processing position above the substrate W and the evacuation position withdrawn from above the substrate W. FIG.

Moreover, in the above-mentioned embodiment, although the organic-solvent liquid film 10 is formed in the surface of the board | substrate W in the liquid processing unit M, formation of the organic-solvent liquid film 10 is performed by the drying unit D. You may also More specifically, in the liquid processing unit M, the process is finished in a state where the upper surface of the substrate W is wet with the rinse liquid. The substrate W in the wet state with the rinse liquid is transferred to the drying unit D by the local transfer robot LR. In the drying unit D, the organic solvent is supplied to the rinse liquid on the upper surface of the substrate W to promote the evaporation of the rinse liquid. In this case, as shown in FIG. 3, it is preferable to incorporate the cooling unit 53C as a substrate cooling unit in the board | substrate holder 52, and to comprise the board | substrate holder 52 as a temperature control plate. The cooling unit 53C may have a refrigerant passage passing through the substrate holder 52 or may have an electronic cooling element. For example, the substrate W is cooled (preferably cooled to a temperature below the dew point of the organic solvent) by the cooling unit 53C, while vapor or mist of the organic solvent is formed on the surface of the substrate W ( Droplets) are supplied. Thereby, an organic solvent mixes with the rinse liquid of the surface of the board | substrate W, and the rinse liquid of the surface of the board | substrate W becomes easy to evaporate. Thereafter, the supply of the organic solvent is stopped, and the surroundings of the substrate W are placed in a reduced pressure atmosphere, whereby the liquid component on the surface of the substrate W can be dried in an instant. At the time of this drying, it is preferable to operate 53C of cooling units, to drive the heater 53, and to use the heating of the board | substrate W together. In order to suppress or prevent evaporation of the rinse liquid on the surface of the substrate W during conveyance by the local transfer robot LR, the surface of the substrate W during the conveyance may be vaporized with a rinse liquid (eg Water vapor) or mist (droplets) is supplied.

In 1st-4th embodiment mentioned above, the board | substrate water supply unit which temporarily holds the board | substrate W is arrange | positioned between the indexer robot IR and the main carrier robot CR, and 5th embodiment (FIG. 8) And the substrate transfer therebetween.

This application corresponds to Japanese Patent Application No. 2017-058059, filed with the Japan Patent Office on March 23, 2017, and all the disclosures of this application are incorporated herein by reference.

Although embodiment of this invention was described in detail, these are only the specific examples used in order to clarify the technical content of this invention, This invention is not limited to this specific example and should not be interpreted, The scope of the present invention is attached It is only limited by the claims.

W board
IR indexer robot
S1 first layer
S2 second layer
S3 third layer
M, M1-M4, M11-M14, M21-M24, M31-M34 Liquid Treatment Unit
D, D1-D6, D11-D14, D21-D24, D31-D34 Drying Unit
LR, LR1, LR2, LR11-LR14, LR21-LR24, LR31, LR32 Local Carrier Robot
Hand of LH Local Carrier Robot
C, C11-C14, C21-C24 Local Return Office
G1-G4, G11-G16, G21, G22, G31-G33 Stacking Unit Group
CR main bounce robot
HC main transfer robot's hand
1, 1A, 1B, 1C, 1D Substrate Processing Unit
2 carrier holder
3 carrier
5, 5A main return room
7 board transfer unit
10 organic solvent film
11 treatment rooms
12 spin chuck
14 Chemical Nozzle
15 Rinse Liquid Nozzle
16 Solvent Nozzle
17 motor
19 blocking plate
37 substrate loading opening
38 substrate export opening
39, 40 shutter
50 drying treatment spaces
51 vacuum drying chamber
52 board holder
53 heater
54 lift pins
56 lid drive unit
63 exhaust unit
71, 71A Organic Solvent Vapor Nozzles
90 hand drive unit
91, 91A Organic Solvent Gas Nozzles
97 Hand Cooling Unit
98 refrigerant passage
99 cooling plate
111 vacuum drying chamber
113 exhaust unit
114 substrate loading opening
116 substrate export opening
118 shutter
125 lid member

Claims (25)

A liquid processing unit for supplying a processing liquid to the substrate surface in the processing chamber;
A drying unit for drying the processing liquid on the substrate surface in a drying chamber;
A main transport unit for carrying a substrate into the processing chamber,
A local conveying unit for conveying a substrate from the processing chamber to the drying chamber;
And a drying prevention fluid supply unit for supplying a drying prevention fluid that prevents drying of the processing liquid on the substrate surface to the substrate surface while the substrate is being conveyed by the local transfer unit. The method according to claim 1,
The drying prevention fluid supply unit,
The substrate processing apparatus provided with the conveyance arm of the said local conveyance unit, Comprising: The nozzle which discharges a drying prevention fluid toward the board | substrate hold | maintained by the said conveyance arm. The method according to claim 1 or 2,
The substrate processing apparatus further including the arm cooling unit which cools the conveyance arm of the said local conveyance unit below the temperature of the board | substrate at the time of conveyance. The method according to any one of claims 1 to 3,
The drying unit,
And a decompression unit for depressurizing the inside of the drying chamber to a pressure lower than atmospheric pressure. The method according to any one of claims 1 to 4,
The substrate processing apparatus of the said drying unit further includes the nozzle which supplies a drying prevention fluid to the surface of a board | substrate in the said drying chamber. The method according to any one of claims 1 to 5,
The substrate processing apparatus in which the said drying unit contains the board | substrate heating unit which heats a board | substrate in the said drying chamber. The method according to any one of claims 1 to 6,
And a volume of the drying chamber is smaller than that of the processing chamber. The method according to any one of claims 1 to 7,
The said local conveyance unit is comprised so that a board | substrate may be conveyed along the conveyance path which passes through a local conveyance chamber,
The substrate processing apparatus in which the said drying chamber and the said local conveyance chamber communicate. The method according to any one of claims 1 to 8,
The drying chamber has a carry-in opening through which a substrate is loaded by the local transfer unit,
The substrate processing apparatus in which the said local conveyance unit has the lid unit which seals the said carrying in opening. The method according to claim 9,
The said local conveyance unit is equipped with the conveyance arm which conveys a board | substrate,
The substrate processing apparatus in which the said lid unit is provided in the said conveyance arm. The method according to any one of claims 1 to 10,
The said processing liquid is a low surface tension liquid whose surface tension is smaller than water. The method according to any one of claims 1 to 11,
The substrate processing apparatus of the said drying prevention fluid contains the vapor or the droplet of the said processing liquid. The method according to any one of claims 1 to 12,
The treatment liquid contains an organic solvent,
And the drying prevention fluid comprises vapor or droplets of an organic solvent. The method according to any one of claims 1 to 13,
The main conveying unit is arranged in the main conveying chamber,
The said local conveyance unit is arrange | positioned in the local conveyance chamber spaced apart from the said main conveyance chamber. A liquid treatment step of supplying the treatment liquid to the substrate surface in the treatment chamber;
A drying step of drying the processing liquid on the substrate surface in a drying chamber,
A main transport step of bringing a substrate into the processing chamber by a main transport unit,
A local conveying step of conveying a substrate from the processing chamber to the drying chamber by a local conveying unit;
And a drying preventing fluid supplying step of supplying a drying preventing fluid that prevents drying of the processing liquid on the substrate surface to the substrate surface while the substrate is being conveyed in the local conveying step. The method according to claim 15,
In the drying prevention fluid supply process,
The substrate processing method which discharges a drying prevention fluid toward the board | substrate hold | maintained by the said conveyance arm from the nozzle with which the conveyance arm of the said local conveyance unit was equipped. The method according to claim 15 or 16,
The substrate processing method of further including the arm cooling process of cooling the conveyance arm of the said local conveyance unit below the temperature of the board | substrate at the time of conveyance. The method according to any one of claims 15 to 17,
The drying process,
And a pressure reduction step of reducing the pressure inside the drying chamber to a lower pressure than atmospheric pressure. The method according to any one of claims 15 to 18,
Prior to the drying step, further comprising the step of supplying a drying prevention fluid to the substrate surface in the drying chamber. The method according to any one of claims 15 to 19,
The substrate processing method of the said drying process including the substrate heating process of heating a board | substrate in the said drying chamber. The method according to any one of claims 15 to 20,
And a volume of the drying chamber is smaller than that of the processing chamber. The method according to any one of claims 15 to 21,
The drying chamber has a carry-in opening through which a substrate is loaded by the local transfer unit,
Prior to the drying step, further comprising a step of closing the carry-in opening by a lid unit provided in the local conveying unit. The method according to any one of claims 15 to 22,
The said processing liquid is a low surface tension liquid whose surface tension is smaller than water. The method according to any one of claims 15 to 23,
The said anti-drying fluid contains the vapor or the droplet of the said processing liquid. The substrate processing method. The method according to any one of claims 15 to 24,
The treatment liquid contains an organic solvent,
And the drying preventing fluid comprises vapor or droplets of an organic solvent.

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