KR20190106268A - The Electronic Device for Determining the State of the Display using at least one of the Pin - Google Patents

Abstract

According to various embodiments of the present invention, an electronic device includes a display panel, a display driver integrated circuit (DDI) which drives the display panel, a first connector which is connected to the DDI and includes a first display pin and a second display pin, the first display pin and the second display pin being connected, a substrate, a second connector which is connected to the substrate and coupled to the first connector and includes a first board pin and second board pin, one of the first board pin and the second board pin being connected to a resistor, and at least one processor mounted on the substrate and configured to determine at least one of a coupled state of the first connector and the second connector or a state of the DDI, based on a signal received from the first board pin or the second board pin.

Description

The Electronic Device for Determining the State of the Display using at least one of the Pin}

Various embodiments of the present disclosure relate to an electronic device for determining a state of a display using one or more designated pins.

Electronic devices such as smartphones and tablet PCs may output various contents (eg, texts or images) through a display. The display may display the contents by outputting light by a light emitting device. The display may be driven by a display driver IC (DDI). The display driving circuit can apply a driving signal to each pixel constituting the display.

The display may be connected to the main board (eg, the main PBA) through the flexible circuit board and the wiring unit on which the display driving circuit is mounted. When the first connector connected to the display and the second connector connected to the main board are coupled with each other, a signal for driving the display may be transmitted.

The electronic device according to the related art uses a separate sensing device to check a connection state when the first connector and the second connector are inserted (or incompletely coupled). In this case, there is a problem that it is difficult to immediately recognize the incomplete coupling state of the first connector and the second connector in the processor.

In addition, the electronic device according to the related art includes a crack detection circuit inside the display driving circuit, so that the crack detection circuit may operate as an antenna for radiating noise to the display by a high speed signal. In addition, in this case, when a crack occurs in the display driving circuit, there is a problem that the normal operation of the crack detection circuit is also impossible.

An electronic device according to various embodiments of the present disclosure may include a first display panel, a display driving circuit (DDI) for driving the display panel, a first driving pin connected to the display driving circuit, and including a first display pin and a second display pin. A connector, the first display pin and the second display pin connected to each other, a substrate, a second connector connected to the substrate, coupled to the first connector, and including a first board pin and a second board pin; One of the first board pin or the second board pin is connected to a resistor and includes a processor mounted to the substrate, the processor based on a signal received from the first board pin or the second board pin. The first connector and the second connector may be configured to determine a coupling state or a state of the display driving circuit.

The electronic device according to various embodiments of the present disclosure implements a simple sensing circuit in the connectors connecting the display driving circuit and the main board so that the processor can instantly recognize a state of incomplete insertion (incomplete coupling state) between the connectors. have.

An electronic device according to various embodiments of the present disclosure implements a crack detection circuit in the form of an open loop wiring in a display driving circuit and a connector, and detects a crack by a simple operation in a processor when a crack occurs in the display driving circuit. can do.

1 illustrates an electronic device according to various embodiments of the present disclosure.
2 is an exploded view of an electronic device according to various embodiments of the present disclosure.
3 illustrates a display panel according to various embodiments of the present disclosure.
4A is a cross-sectional view of an electronic device according to various embodiments of the present disclosure.
4B is a flowchart illustrating a method of recognizing a connection state of a connector or a state of a display driving circuit according to various embodiments of the present disclosure.
5A illustrates an example of configuring a sensing circuit by using a pull-up resistor of a second connector according to various embodiments of the present disclosure.
5B is a flowchart illustrating a method of recognizing a connection of a connector according to various embodiments of the present disclosure.
6 is a diagram illustrating a method of detecting a connection state between connectors using a pull-up resistor of a second connector according to various embodiments of the present disclosure.
7 is an exemplary diagram illustrating a sensing circuit using a pull-down resistor of a second connector according to various embodiments of the present disclosure.
8 is an exemplary diagram illustrating a sensing circuit using a pull-up resistor of a first connector according to various embodiments of the present disclosure.
9 illustrates an example of configuring a sensing circuit using a pull-down resistor of a first connector according to various embodiments of the present disclosure.
10 illustrates a crack detection structure of a display driving circuit according to various embodiments of the present disclosure.
11 is a block diagram of an electronic device in a network environment for determining a state of a display using one or more designated pins according to various embodiments of the present disclosure.
12 is a perspective view of a front side of a mobile electronic device according to one embodiment.
FIG. 13 is a perspective view of a rear surface of the electronic device of FIG. 12.
14 is an exploded perspective view of the electronic device of FIG. 12.

Hereinafter, various embodiments of the present disclosure will be described with reference to the accompanying drawings. However, this is not intended to limit the techniques described in this document to specific embodiments, and it should be understood to include various modifications, equivalents, and / or alternatives to the embodiments of this document. . In connection with the description of the drawings, similar reference numerals may be used for similar components.

In this document, expressions such as "have", "may have", "include", or "may contain" include the presence of a corresponding feature (e.g., numerical, functional, operational, or component such as a component). Does not exclude the presence of additional features.

In this document, expressions such as "A or B", "at least one of A or / and B", or "one or more of A or / and B" may include all possible combinations of items listed together. . For example, "A or B", "at least one of A and B", or "at least one of A or B" includes (1) at least one A, (2) at least one B, Or (3) both of cases including at least one A and at least one B.

Expressions such as "first," "second," "first," or "second," as used herein, may modify various components, regardless of order and / or importance, and may modify one component to another. It is used to distinguish a component and does not limit the components. For example, the first user device and the second user device may represent different user devices regardless of the order or importance. For example, without departing from the scope of rights described in this document, the first component may be called a second component, and similarly, the second component may be renamed to the first component.

One component (such as a first component) is "(functionally or communicatively) coupled with / to" to another component (such as a second component) or " When referred to as "connected to", it should be understood that any component may be directly connected to the other component or may be connected through another component (eg, a third component). On the other hand, when a component (e.g., a first component) is said to be "directly connected" or "directly connected" to another component (e.g., a second component), the component and the It may be understood that no other component (eg, a third component) exists between the other components.

The expression "configured to" used in this document is, for example, "suitable for", "having the capacity to" depending on the situation. It may be used interchangeably with "designed to", "adapted to", "made to", or "capable of". The term "configured to" may not necessarily mean only "specifically designed to" in hardware. Instead, in some situations, the expression "device configured to" may mean that the device "can" along with other devices or components. For example, the phrase “processor configured (or configured to) perform A, B, and C” may be implemented by executing a dedicated processor (eg, an embedded processor) to perform its operation, or one or more software programs stored in a memory device. It may mean a general-purpose processor (eg, a CPU or an application processor) capable of performing corresponding operations.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the scope of other embodiments. Singular expressions may include plural expressions unless the context clearly indicates otherwise. The terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by one of ordinary skill in the art. Among the terms used in this document, terms defined in the general dictionary may be interpreted as having the same or similar meaning as the meaning in the context of the related art, and ideally or excessively formal meanings are not clearly defined in this document. Not interpreted as In some cases, even if terms are defined in the specification, they may not be interpreted to exclude embodiments of the present disclosure.

An electronic device according to various embodiments of the present disclosure may include, for example, a smartphone, a tablet personal computer, a mobile phone, a video phone, an e-book reader, Desktop personal computer (PC), laptop personal computer (PC), netbook computer, workstation, server, personal digital assistant (PDA), portable multimedia player (PMP), MP3 player, mobile medical It may include at least one of a device, a camera, or a wearable device. According to various embodiments of the present disclosure, a wearable device may be an accessory type (eg, a watch, ring, bracelet, anklet, necklace, glasses, contact lens, or head-mounted-device (HMD)), a fabric, or a clothing type ( For example, it may include at least one of an electronic garment, a body attachment type (eg, a skin pad or a tattoo), or a living implantable type (eg, an implantable circuit).

Hereinafter, an electronic device according to various embodiments of the present disclosure will be described with reference to the accompanying drawings. In this document, the term user may refer to a person who uses an electronic device or a device (eg, an artificial intelligence electronic device) that uses an electronic device.

1 illustrates an electronic device according to various embodiments of the present disclosure.

Referring to FIG. 1, the electronic device 101 may include a display (or display module) 110, a housing (or a main body) 120, a display driver circuit (DDI) 130, and a processor 160. And a memory 170. In FIG. 1, the configuration required for driving the display 110 is illustrated, but is not limited thereto.

The display (or display module) 110 may output content such as text or an image. The display 110 may include a display panel or a touch panel therein. The display 110 may include a window cover (or glass cover, glass panel). The window cover may protect the display panel or the touch panel therein.

According to various embodiments of the present disclosure, a display panel (not shown) inside the display 110 may operate according to a signal provided from the display driving circuit 130. For example, the display panel (not shown) may control the light emitting device therein according to the source signal and the gate signal provided from the display driving circuit 130. Additional information regarding the operation of the display panel (not shown) may be provided through FIG. 3.

The housing (or body) 120 may fix the display 110 and may protect various configurations of the inside. The housing 120 may include a button, a sensor window, a speaker, a camera module, and the like outside.

The housing (or body) 120 may include a communication circuit, a display driving circuit 130, a processor 160, a memory 170, a printed circuit board (or a main board) necessary for driving the electronic device 101 therein, Alternatively, the battery may include various components such as a battery.

According to various embodiments of the present disclosure, the display driving circuit 130 may transmit an operation signal to a display panel (not shown) inside the display 110 according to a control signal or image data provided from the processor 160.

According to various embodiments of the present disclosure, the display driving circuit 130 may include a timing controller, a source driver, and a gate driver. The timing controller may generate a data control signal for controlling the operation timing of the source driver and a gate control signal for controlling the operation timing of the gate driver. The source driver and the gate driver respectively generate signals supplied to scan lines and data lines of a display panel (not shown) based on the source control signal and the gate control signal received from the timing controller. can do.

According to an embodiment of the present disclosure, the display driving circuit 130 may receive image data to be output in units of frames from the processor 160. The image data may be stored in the graphic memory inside the display driving circuit 130. The display driving circuit 130 may generate an image based on the image data stored in the graphic memory, and output the image by controlling the display panel.

According to an embodiment, the display driving circuit 130 may be mounted on a substrate connected to a display panel (not shown). When the substrate is bent and mounted on the electronic device 101, the display driving circuit 130 may move to the rear surface of the display panel (not shown). 1 illustrates a case in which the display driving circuit 130 is disposed on the rear surface of the active area of the display 110, but is not limited thereto. For example, the display driving circuit 130 may be disposed on the back side of the bezel area (part of the front housing) around the display 110. Additional information regarding the placement of the display driver circuit 130 may be provided through FIGS. 3 and 4A.

The processor 160 may perform various data processing and operations for driving the electronic device 101. For example, the processor 160 may transmit image data to be output through the display 110 to the display driving circuit 130. have.

According to various embodiments of the present disclosure, the processor 160 is based on a signal transmitted from a pin included in connectors connecting between the display driving circuit 130 and a main board (not shown) inside the electronic device 101. The connection state or the state of the display driving circuit 130 (eg, a normal state or a crack generation state) may be determined. Additional information regarding a method of detecting a connection state between the connectors or an abnormality of the display driving circuit 130 may be provided through FIGS. 5 to 10.

The memory 170 may store information necessary for the operation of the electronic device 101. For example, the memory 170 may store image data to be output through the display 110.

2 is an exploded view of an electronic device according to various embodiments of the present disclosure.

2, the electronic device 101 may include a display (or display module) 110, a first housing 140, a main board (or substrate) 150, a battery 155, and a second housing 180. Or may include a back cover 190. 2 is illustrative and is not limited thereto. For example, some components of the electronic device 101 may be added or omitted.

The display (or display module) 110 may output content such as text or an image. The display 110 may include a display panel (not shown) or a touch panel (not shown) therein. The display panel (not shown) inside the display 110 may operate according to a signal provided from the display driving circuit 130. The display 110 may include a first connector 210 connected to a display panel (not shown) (or to a display driving circuit 130) therein.

The display 110 may be composed of a plurality of layers. For example, the display 110 may have a form in which a window cover (or glass cover, glass panel), a touch panel, a display panel, and the like are sequentially stacked. Additional information regarding the configuration of the display 110 may be provided through FIGS. 3 and 4A.

The first housing 140 may be disposed between the display 110 and the main board 150. The first housing 140 may fix the display 110. At least a portion of the first housing 140 may be exposed to the side of the electronic device 101. At least a part of the first housing 140 may be implemented with a metallic material. The first housing 140 may mount a physical button (eg, a side volume button), a heat pipe, or the like.

The main board (eg, Main-PBA) 150 may mount various chips, modules, and devices required for the operation of the electronic device 101. For example, the main board 150 may be equipped with a communication circuit, a processor 160, a memory and the like and electrically connected to the main board 150.

According to various embodiments of the present disclosure, the main board (eg, Main-PBA) 150 may include a second connector 220 coupled to the first connector 210 of the display 110. When the first connector 210 and the second connector 220 are coupled, the processor 160 may transmit image data or a control signal to the display driving circuit 130.

According to various embodiments of the present disclosure, the electronic device 101 may include a sensing circuit for checking a connection state between the first connector 210 and the second connector 220. In an embodiment, the sensing circuit may be implemented as a pull-up resistor or a pull-down resistor connected to the first connector 210 or the second connector 220.

The processor 160 may detect a connection state between the first connector 210 and the second connector 220 based on the signal transmitted through the sensing circuit. Additional information regarding the sense circuit can be provided through FIGS. 5-9.

The battery 155 may supply power for driving the electronic device 101. The battery 155 may be charged through an external power source.

The second housing 180 may fix the main board (eg, Main-PBA) 150 and the battery 155. In addition, the second housing 180 may fix a module or a device disposed adjacent to a second surface (eg, a rear surface) of the electronic device 101. For example, the second housing 180 may fix a rear camera, an HMR sensor, or a speaker.

The back cover 190 may protect a second surface (eg, a rear surface) of the electronic device 101. The back cover 190 may be implemented through a metal or plastic material.

3 illustrates a display panel according to various embodiments of the present disclosure.

Referring to FIG. 3, the display panel 113 may include an active area 310 and a non-active area 320.

The display area (active area) 310 may be an area in which content such as an image or text is output. The display area 310 may include a light emitting element therein. The display area 310 may generate light according to a signal transmitted from the non-display area 320. For example, the display area 310 may include a light emitting element (eg, organic electroluminescence (EL)). The light emitting device may emit light according to an electrical signal. The organic EL may generate light when holes and electrons are injected from a cathode and an anode.

The non-active area 320 may be an area that transmits an electrical signal for driving the display area 310. The non-display area 320 may transmit a signal transmitted from the display driving circuit 130 to the display area 310. The non-display area 320 may surround the display area 310.

According to various embodiments of the present disclosure, the non-display area 320 may be covered by the BM area (the area masked so that the wiring and the like are not visible from the outside).

The substrate 330 may be connected to one end of the non-display area 320. The substrate 330 may mount the display driving circuit 130. The substrate 330 may electrically connect the non-display area 320 and the display driving circuit 130. In one embodiment, the substrate 330 may be implemented as a chip on film (COF) or a chip on plastic (COP). In another embodiment, the base of the display panel 113 may be an extended area.

The substrate 330 may be bent in the rear direction of the display panel 113. For example, the substrate 330 may be mounted inside the electronic device 101 with the I-I 'bent about its axis. According to an embodiment, when the substrate 330 is unfolded, the display driving circuit 130 may be in a state facing the same direction as the display area 310. When the substrate 330 is folded, the display driving circuit 130 may face a direction different from (or opposite to) the display area 310. However, the present invention is not limited thereto, and when the substrate 330 is folded according to the mounting form, the display driving circuit 130 may be disposed in the same direction as the display area 310.

The display driver circuit (DDI) 130 may be mounted on the substrate 330 and connected to the main board 150 inside the electronic device 101. The display driving circuit 130 may process a signal for driving the active region 310. For example, the display driving circuit 130 may process a timing signal, a gate signal, or a source signal for driving the active region 310.

According to an embodiment, when the display driving circuit 130 is mounted on the electronic device 101, the display driving circuit 130 may be disposed to face the back side of the display panel 113 (eg, the active region 310).

The wiring unit 340 may connect the display driving circuit 130 and the first connector 210. For example, the wiring unit 340 may transmit the image data or the control signal provided through the first connector 210 to the display driving circuit 130.

The first connector 210 may be coupled to the second connector 220 of the main board 150. The first connector 210 may have a shape corresponding to the second connector 220. For example, the first connector 210 may include the same number of pins having a pin arrangement that is symmetrical with the second connector 220.

According to an embodiment of the present disclosure, the first connector 210 may include a sensing circuit for reporting the connection state of the first connector 210 and the second connector 220 to the processor 160. For example, the sensing circuit may include a pull up resistor or a pull down resistor. Information regarding the sensing circuit may be provided through FIGS. 5 to 9.

4A is a cross-sectional view of an electronic device according to various embodiments of the present disclosure.

Referring to FIG. 4A, the electronic device 101 may include a window cover (or glass cover, glass panel) 111, a touch panel 112, a display panel 113, a blocking layer 117, and a display driving circuit 130. , The substrate 330, the wiring unit 340, the first connector 210, the second connector 220, the first housing 140, the main board 150, the second housing 180, and the like. have. In FIG. 4A, the configuration for driving the display of the electronic device 101 is illustrated, but is not limited thereto. Some configurations may be excluded or added.

The window cover (or glass cover, glass panel) 111 may protect the internal touch panel 112 or the display panel 113. The window cover 111 may transmit light generated by the display panel 113.

The touch panel 112 may detect a user's touch input. The change in the electrical signal according to the user's touch input may be transmitted to the processor 160 inside. The touch panel 112 may be implemented through an ITO film or a metal mesh. The touch panel 112 may be implemented by an add-on method, an in-cell method, or an on-cell method (eg, AP1S or Y-OCTA).

The display panel 113 may output light to display content such as text or an image. The display panel 113 may include a display area for outputting light through the light emitting element or a non-display area for transmitting a signal for driving the display area. The display panel 113 may output light according to a signal provided from the display driving circuit 130.

The blocking layer 117 may block an electrical signal or heat generated from the display panel 113 from moving to the rear surface of the display panel 113. The blocking layer 117 may be implemented through a metal sheet (eg, Cu sheet).

The substrate 330 may be bent in the rear direction of the display panel 113. The substrate 330 may mount the display driving circuit 130. In one embodiment, the substrate 330 may be implemented as a chip on film (COF) or a chip on plastic (COP). In another embodiment, the substrate 330 may be an area where the base of the display panel 113 is extended.

According to an embodiment, when the substrate 330 is folded, the display driving circuit 130 may face the back direction of the display panel 113. In this case, the blocking layer 117 and the substrate 330 may be disposed between the display panel 113 and the display driving circuit 130. However, the present invention is not limited thereto, and the display driving circuit 130 may be disposed between the blocking layer 117 and the substrate 330 or may be disposed at another portion.

The display driving circuit 130 may be mounted on the substrate 330. The display driving circuit 130 may process a signal for driving the display panel 113. For example, the display driving circuit 130 may process timing signals, gate signals, or source signals for driving the display panel 113.

The wiring unit (eg, M-FPC) 340 may connect the display driving circuit 130 and the first connector 210. For example, the wiring unit 340 may transmit the image data or the control signal provided through the first connector 210 to the display driving circuit 130. The wiring unit 340 may be fixed to the blocking layer 117 through the conductive tape 40. In various embodiments, the wiring unit 340 may include a ground region 345.

The first connector 210 may be coupled to the second connector 220 of the main board 150. The first connector 210 may have a shape corresponding to the second connector 220. For example, the first connector 210 may have a pin arrangement that is symmetrical with the second connector 220, and may include the same number of pins.

The second connector 220 may be coupled to the first connector 210 connected to the display driving circuit 130. The second connector 220 may have a shape corresponding to the first connector 210. For example, the second connector 220 may have a pin arrangement that is symmetrical with the first connector 210 and may include the same number of pins.

The first connector 210 and the second connector 220 may include a sensing circuit for sensing the connection state of the first connector 210 and the second connector 220 to the processor 160. For example, the sensing circuit may include a pull up resistor or a pull down resistor. Information regarding the sensing circuit may be provided through FIGS. 5 to 9.

The first housing 140 may be disposed between the display 110 and the main board 150. The display 110 and the main board 150 may be fixed.

The main board (eg, Main-PBA) 150 may mount various chips, modules, and devices required for the operation of the electronic device 101. For example, the main board (eg, Main-PBA) 150 may mount the processor 160. The main board (eg, Main-PBA) 150 may be connected to the sub board 151.

The second housing 180 may fix the main board (eg, Main-PBA) 150 and the battery 155.

4B is a flowchart illustrating a method of recognizing a connection state of a connector or a state of a display driving circuit according to various embodiments of the present disclosure.

4A and 4B, in operation 450, the processor 160 may receive a signal from a first pin (first board pin) of the second connector 220. For example, the signal may be a voltage value applied to the first board pin.

In operation 460, the processor 160 may determine at least one of a coupling state of the first connector 210 and the second connector 220 or a state of the display driving circuit 130 based on the received signal.

According to an embodiment of the present disclosure, the processor 160 may determine a coupling state of the first connector 210 and the second connector 220 based on the received signal. For example, when the first board pin of the connector 220 has a specified voltage value or more, the processor 160 determines the first connector 210 and the second connector 220 to be in an inserted state (incompletely coupled state). Can be. Alternatively, when the first board pin of the connector 220 has less than the voltage value, the processor 160 may determine that the first connector 210 and the second connector 220 are normally coupled.

According to another embodiment, the processor 160 may determine a state (eg, a normal state or a crack generation state) of the display driving circuit 130 based on the received signal. For example, the display driving circuit 130 may include a crack detection circuit (eg, an open loop wiring) therein. The processor 160 may determine a state (eg, a normal state or a crack generation state) of the display driving circuit 130 based on a signal received from a pin connected to the crack detection circuit among the pins of the second connector 220. .

5A illustrates an example of configuring a sensing circuit by using a pull-up resistor of a second connector according to various embodiments of the present disclosure. In FIG. 5, the first connector 210a and the second connector 220a each include first to sixty-fourth pins, but the present invention is not limited thereto.

Referring to FIG. 5A, the first connector 210a may be connected to the display driving circuit 130. The second connector 220a may be connected to the main board 150. The first connector 210a and the second connector 220a may have a pin arrangement that is symmetrical to each other, and may include a plurality of pins of the same number.

When the first connector 210a and the second connector 220a are coupled to each other, corresponding pins may be electrically connected to each other. For example, the first pin 210a-1 (first display pin) of the first connector 210a may be connected to the first pin 220a-1 (first board pin) of the second connector 220a. have. The 64 th pins 210a-64 (the second display pins) of the first connector 210a may be connected to the 64 th pins 220a-64 (the second board pins) of the second connector 220a.

The first connector 210a may include a plurality of pins (eg, first to sixty-fourth pins). At least some of the plurality of pins may transmit signals related to the display output. For example, at least some of the plurality of pins may transmit image data transferred from the processor 160 mounted on the main board 150 to the display driving circuit 130.

The first connector 210a may include first sub pins 510a disposed in the first direction A and second sub pins 510b disposed in the second direction B. Referring to FIG.

According to various embodiments of the present disclosure, one of the first sub-pins 510a and one of the second sub-pins 510b may be connected to each other. For example, the 64th pins 210a-64 of the first pin 210a-1 and the second sub pins 510b of the first sub pins 510a may be connected to each other.

The second connector 220a may include a plurality of pins (eg, first to sixty-fourth pins). At least some of the plurality of pins may transmit signals related to the display output. For example, at least some of the plurality of pins may transmit image data transferred from the processor 160 mounted on the main board 150 to the display driving circuit 130.

The second connector 220a may include third sub pins 520a disposed in the first direction A 'and fourth sub pins 520b disposed in the second direction B'.

According to various embodiments of the present disclosure, one of the third sub pins 520a may be connected to the pull-up resistor 221a and an input terminal (eg, AP GPIO) 161 of the processor 160. One of the fourth sub pins 520b may be connected to ground (parallel connection). For example, the first pin 220a-1 of the third sub pins 520a may be connected to the pull-up resistor 221a and the input terminal (eg, AP GPIO) 161 of the processor 160 (parallel connection). ). 64th pins 220a-64 of the fourth sub pins 520b may be connected to ground.

Additional information regarding the operation when the first connector 210a and the second connector 220a are coupled may be provided through FIG. 6.

In FIG. 5A, a case in which a sensing circuit is configured using the first pin and the sixty-fourth pin of the first connector 210a and the second connector 220a is exemplarily illustrated, but is not limited thereto. For example, the sensing circuit may be configured using the second pin and the 63rd pin of the first connector 210a and the second connector 220a. As another example, the sensing circuit may be configured using the third pin and the sixty-second pin of the first connector 210a and the second connector 220a. As another example, the sensing circuit may be configured using the fifth pin and the sixty pin of the first connector 210a and the second connector 220a.

5B is a flowchart illustrating a method of recognizing a connection of a connector according to various embodiments of the present disclosure.

5A and 5B, in operation 550, the processor 160 may measure a voltage applied to the first pin 220a-1 (first board pin) of the second connector 220a.

In operation 560, the processor 160 may determine whether the first pin 220a-1 has a voltage value greater than or equal to the voltage value specified by the pull-up resistor 221a. The voltage value may be determined by the VDD power supply and the pullup resistor 221a.

In operation 570, when the first pin 220a-1 has the voltage value or more, the processor 160 may determine the second connector 220a as an incomplete insertion state. When a separate connector is not connected to the second connector 220a or when the first connector 210a and the second connector 220a are incompletely coupled, the first pin 220a-1 may include a VDD power supply and a pullup resistor ( It may have a voltage value determined by 221a).

In operation 580, when the first pin 220a-1 has less than the voltage value, the processor 160 may determine the second connector 220a as a normal coupling state. When the first connector 210a and the second connector 220a are normally coupled, the first pin 220a-1 is connected to the 64th pin 220a-of the second connector 220a through the first connector 210a. 64) (second board pin). Since the 64 th pins 220a-64 are connected to the ground, the voltage value of the first pin 210a-1 may be zero.

According to various embodiments of the present disclosure, a method of recognizing a connection of a connector performed in an electronic device may include checking a voltage applied to a first board pin of a connector mounted on a board of the electronic device. Determining the connector to be in the inserted state when having a voltage value specified by a pull-up resistor connected to the first board pin, wherein the first board pin is disposed at a position symmetrical to the first board pin in the connector When connected to the second board pin, and has a voltage value less than, may include determining the connector in a normal coupling state.

6 is a diagram illustrating a method of detecting a connection state between connectors using a pull-up resistor of a second connector according to various embodiments of the present disclosure.

5A and 6, the processor 160 and the first connector 210a are based on a signal transmitted from the first pin 220a-1 of the second connector 220a connected to the pull-up resistor 221a. The coupling state of the second connector 220a may be recognized.

The first pin 220a-1 may be connected to the pull-up resistor 221a and the input terminal (eg, AP GPIO) 161 of the processor 160 (parallel connection). The sixty-fourth pins 220a-64 may be connected to ground.

In the first state (normally coupled state) 601 in which the first connector 210a and the second connector 220a are normally connected, the first pin 210a-1 of the first connector 210a is connected to the second connector 220a. ) May be connected to the first pin 220a-1. In addition, the 64 th pins 210a-64 of the first connector 210a may be connected to the 64 th pins 220a-64 of the second connector 220a.

When the first pins 210a-1 and the 64th pins 210a-64 of the first connector 210a are connected to each other, the first pins 220a-1 of the second connector 220a are connected to the second connector 220a. ) May be in a state of being connected to the 64 th pins 220a-64. Accordingly, the input terminal 161 of the processor 160 may be in a digital low state regardless of the pull-up resistor 221a.

In a second state in which the first connector 210a and the second connector 220a are abnormally connected (insertion state, incompletely coupled state) 602, the first pin 210a-1 of the first connector 210a is connected to the first state. The second pins 220a-1 of the connector 220a may not be connected to each other. In addition, the 64 th pins 210a-64 of the first connector 210a may not be connected to the 64 th pins 220a-64 of the second connector 220a.

When the first pin 210a-1 of the first connector 210a is not connected to the first pin 220a-1 of the second connector 220a, the input terminal 161 of the processor 160 is a pull-up resistor. 221a may indicate a digital high state.

The first pins 210a-1 of the first connector 210a are connected to each other with the first pins 220a-1 of the second connector 220a and the 64th pins 210a-64 of the first connector 210a. ) Is not connected to the 64th pins 220a-64 of the second connector 220a, the input terminal 161 of the processor 160 may be in a digital high state by the pull-up resistor 221a.

7 is an exemplary diagram illustrating a sensing circuit using a pull-down resistor of a second connector according to various embodiments of the present disclosure.

Referring to FIG. 7, the first connector 210b may be connected to the display driving circuit 130. The second connector 220b may be connected to the main board 150. The first connector 210b and the second connector 220b may have a pin arrangement that is symmetrical with each other, and may include a plurality of pins of the same number.

When the first connector 210b and the second connector 220b are coupled to each other, corresponding pins may be electrically connected to each other. For example, the first pin 210b-1 of the first connector 210b may be connected to the first pin 220b-1 of the second connector 220b. The 64 th pins 210b-64 of the first connector 210b may be connected to the 64 th pins 220b-64 of the second connector 220b.

The first connector 210b may include a plurality of pins (eg, first to sixty-fourth pins). The first connector 210b may include first sub pins 510a disposed in the first direction A and second sub pins 510b disposed in the second direction B. Referring to FIG.

According to various embodiments of the present disclosure, one of the first sub-pins 510a and one of the second sub-pins 510b may be connected to each other. For example, the 64 th pins 210b-64 of the first pin 210b-1 and the second sub pins 510b of the first sub pins 510a may be connected to each other. In an embodiment, the first fins 210b-1 and the 64 th fins 210b-64 may be connected to each other and may be connected to ground.

The second connector 220b may include a plurality of pins (eg, first to sixty-fourth pins). The second connector 220b may include third sub pins 520a disposed in the first direction A 'and fourth sub pins 520b disposed in the second direction B'.

According to various embodiments of the present disclosure, one of the third sub pins 520a may be connected to the pull-down resistor 221b and an input terminal (eg, AP GPIO) 161 of the processor 160 (parallel connection). One pin of the fourth sub pins 520b may be connected to a power source. For example, the first pin 220b-1 of the third sub pins 520a may be connected to the pull-down resistor 221b and the input terminal (eg, AP GPIO) 161 of the processor 160 (parallel connection). ). The 64 th pins 220b-64 of the fourth sub pins 520b may be connected to a power source.

In a first state in which the first connector 210b and the second connector 220b are normally connected, the first pin 210b-1 of the first connector 210b is the first pin 220b− of the second connector 220b. 1) and can be connected to each other. In addition, the 64 th pins 210b-64 of the first connector 210b may be connected to the 64 th pins 220b-64 of the second connector 220b.

In the first state, when the first pin 210b-1 and the 64th pins 210b-64 of the first connector 210b are connected to each other, the first pin 220b-1 of the second connector 220b May be in a state of being connected to the 64 th pins 220b-64 of the second connector 220b. Accordingly, the input terminal 161 of the processor 160 may be in a digital high state regardless of the pull-down resistor 221b.

In a second state in which the first connector 210b and the second connector 220b are abnormally connected, the first pin 210b-1 of the first connector 210b is the first pin 220b of the second connector 220b. -1) and may not be connected to each other. In addition, the 64 th pins 210b-64 of the first connector 210b may not be connected to the 64 th pins 220b-64 of the second connector 220b.

In the second state, when the first pin 210b-1 of the first connector 210b is not connected to the first pin 220b-1 of the second connector 220b, the input terminal of the processor 160 is provided. 161 may be in a digital low state by the pull-down resistor 221b and ground.

The first pins 210b-1 of the first connector 210b are connected to each other with the first pins 220b-1 of the second connector 220b and the 64th pins 210b-64 of the first connector 210b. ) Is not connected to the 64th pins 220b-64 of the second connector 220b, the input terminal 161 of the processor 160 may be in a digital low state by the pull-down resistor 221b.

In FIG. 7A, a case in which a sensing circuit is configured using the first pin and the sixty-fourth pin of the first connector 210b and the second connector 220b is exemplarily illustrated, but is not limited thereto. For example, the sensing circuit may be configured using the second pin and the 63rd pin of the first connector 210b and the second connector 220b. As another example, the sensing circuit may be configured using the third pin and the sixty-second pin of the first connector 210b and the second connector 220b. As another example, the sensing circuit may be configured using the fifth pin and the sixty pin of the first connector 210b and the second connector 220b.

7B is a diagram illustrating a method of detecting a connection state between connectors using a pull-down resistor of a second connector according to various embodiments of the present disclosure.

7A and 7B, the processor 160 may be connected to the first connector 210b based on a signal transmitted from the first pin 220b-1 of the second connector 220b connected to the pull-down resistor 221b. The coupling state of the second connector 220b may be recognized.

The first pin 220b-1 may be connected to the pull-down resistor 221b and the input terminal (eg, AP GPIO) 161 of the processor 160 (parallel connection). The sixty-fourth pins 220b-64 may be connected to a power source. The pull-down resistor 221b may be connected between the first pin 220b-1 and the ground.

In the first state (normally coupled state) 701 where the first connector 210b and the second connector 220b are normally connected, the first pin 210b-1 of the first connector 210b is connected to the second connector 220b. ) May be connected to the first pin 220b-1. In addition, the 64 th pins 210b-64 of the first connector 210b may be connected to the 64 th pins 220b-64 of the second connector 220b.

When the first pin 210b-1 and the 64 th pin 210b-64 of the first connector 210b are connected to each other, the first pin 220b-1 of the second connector 220b is connected to the second connector 220b. ) May be in a state of being connected to the 64 th pins 220b-64. Accordingly, the input terminal 161 of the processor 160 may be in a digital high state regardless of the pull-down resistor 221b.

In a second state in which the first connector 210b and the second connector 220b are abnormally connected (inserted state, incompletely coupled state) 702, the first pin 210b-1 of the first connector 210b is formed in a second state. The second pins 220b-1 of the connector 220b may not be connected to each other. In addition, the 64 th pins 210b-64 of the first connector 210b may not be connected to the 64 th pins 220b-64 of the second connector 220b.

When the first pin 210b-1 of the first connector 210b is not connected to the first pin 220b-1 of the second connector 220b, the input terminal 161 of the processor 160 may have a pull-down resistor. 221b may be a digital low state.

The first pins 210b-1 of the first connector 210b are connected to each other with the first pins 220b-1 of the second connector 220b and the 64th pins 210b-64 of the first connector 210b. ) Is not connected to the 64th pins 220b-64 of the second connector 220b, the input terminal 161 of the processor 160 may be in a digital low state by the pull-down resistor 221b.

8 is an exemplary diagram illustrating a sensing circuit using a pull-up resistor of a first connector according to various embodiments of the present disclosure.

Referring to FIG. 8, the first connector 210c may be connected to the display driving circuit 130. The second connector 220c may be connected to the main board 150. The first connector 210c and the second connector 220c may have a pin arrangement that is symmetrical with each other, and may include a plurality of pins of the same number.

When the first connector 210c and the second connector 220c are coupled to each other, corresponding pins may be electrically connected to each other. For example, the first pin 210c-1 of the first connector 210c may be connected to the first pin 220c-1 of the second connector 220c. The 64 th pins 210c-64 of the first connector 210c may be connected to the 64 th pins 220c-64 of the second connector 220c.

The first connector 210c may include a plurality of pins (eg, first to sixty-fourth pins). The first connector 210c may include first sub pins 510a disposed in the first direction A and second sub pins 510b disposed in the second direction B. Referring to FIG.

According to various embodiments of the present disclosure, one of the first sub pins 510a may be connected to the pull-up resistor 211c and an input terminal (eg, AP GPIO) 161 of the processor 160 (parallel connection). One pin of the second sub pins 510b may be connected to a ground. For example, the first pin 210c-1 of the first sub pins 510a may be connected to the pull-up resistor 211c and the input terminal (eg, AP GPIO) 161 of the processor 160 (parallel connection). ). The 64 th pins 210c-64 of the second sub pins 510b may be connected to ground.

The second connector 220c may include a plurality of pins (eg, first to sixty-fourth pins). The second connector 220c may include third sub pins 520a disposed in the first direction A 'and fourth sub pins 520b disposed in the second direction B'.

According to various embodiments of the present disclosure, one of the third sub pins 520a and one of the second sub pins 520b may be connected to each other. For example, the 64 th pins 220c-64 of the first pin 220c-1 and the second sub pins 520b of the first sub pins 520a may be connected to each other. In an embodiment, the first fins 220c-1 and the 64 th fins 220c-64 may be connected to each other and may be connected to ground.

In a first state in which the first connector 210c and the second connector 220c are normally connected, the first pin 210c-1 of the first connector 210c is the first pin 220c-of the second connector 220c. 1) and can be connected to each other. In addition, the 64 th pins 210c-64 of the first connector 210c may be connected to the 64 th pins 220c-64 of the second connector 220c.

In the first state, when the first pins 220c-1 and the 64th pins 220c-64 of the second connector 220c are connected to each other, the first pins 210c-1 of the first connector 210c are connected to each other. May be in a state of being connected to the 64 th pins 210c-64 of the first connector 210c. Accordingly, the input terminal 161 of the processor 160 may be in a digital low state, regardless of the pull-up resistor 211c.

In a second state in which the first connector 210c and the second connector 220c are abnormally connected, the first pin 210c-1 of the first connector 210c is the first pin 220c of the second connector 220c. -1) and may not be connected to each other. In addition, the 64 th pins 210c-64 of the first connector 210c may not be connected to the 64 th pins 220c-64 of the second connector 220c.

In the second state, when the first pin 210c-1 of the first connector 210c is not connected to the first pin 220c-1 of the second connector 220c, the input terminal of the processor 160 is provided. 161 may be in a digital high state by the pull-up resistor 211c and the power supply VDD.

The first pins 210c-1 of the first connector 210c are connected to each other with the first pins 220c-1 of the second connector 220c, and the 64th pins 210c-64 of the first connector 210c are connected to each other. ) Is not connected to the 64th pins 220c-64 of the second connector 220c, the input terminal 161 of the processor 160 is connected to the digital high by the pullup resistor 211c and the power supply VDD. May be in a state.

In FIG. 8, a case in which a sensing circuit is configured by using the first pin and the sixty-fourth pin of the first connector 210c and the second connector 220c is exemplarily illustrated, but is not limited thereto. For example, the sensing circuit may be configured using the second pin and the 63rd pin of the first connector 210c and the second connector 220c. As another example, the sensing circuit may be configured using the third pin and the sixty-second pin of the first connector 210c and the second connector 220c. As another example, the sensing circuit may be configured using the fifth pin and the sixty pin of the first connector 210c and the second connector 220c.

9 illustrates an example of configuring a sensing circuit using a pull-down resistor of a first connector according to various embodiments of the present disclosure.

Referring to FIG. 9, the first connector 210d may be connected to the display driving circuit 130. The second connector 220d may be connected to the main board 150. The first connector 210d and the second connector 220d may have a pin arrangement that is symmetrical with each other, and may include a plurality of pins of the same number.

When the first connector 210d and the second connector 220d are coupled to each other, corresponding pins may be electrically connected to each other. For example, the first pin 210d-1 of the first connector 210d may be connected to the first pin 220d-1 of the second connector 220d. The 64 th pins 210d-64 of the first connector 210d may be connected to the 64 th pins 220d-64 of the second connector 220d.

The first connector 210d may include a plurality of pins (eg, first to sixty-fourth pins). The first connector 210d may include first sub pins 510a disposed in the first direction A and second sub pins 510b disposed in the second direction B. Referring to FIG.

According to various embodiments of the present disclosure, one of the first sub pins 510a may be connected to a pull-down resistor 211d and an input terminal (eg, AP GPIO) 161 of the processor 160 (parallel connection). One pin of the second sub pins 510b may be connected to a power source. For example, the first pin 210d-1 of the first sub pins 510a may be connected to the pull-down resistor 211d and the input terminal (eg, AP GPIO) 161 of the processor 160 (parallel connection). ). The 64 th pins 210d-64 of the second sub pins 510b may be connected to a power source.

The second connector 220d may include a plurality of pins (eg, first to sixty-fourth pins). The second connector 220d may include third sub pins 520a disposed in the first direction A 'and fourth sub pins 520b disposed in the second direction B'.

According to various embodiments of the present disclosure, one of the third sub pins 520a and one of the second sub pins 520b may be connected to each other. For example, the 64 th pins 220d-64 of the first pin 220d-1 and the second sub pins 520b of the first sub pins 520a may be connected to each other. In an embodiment, the first pin 220d-1 and the 64th pin 220d-64 may be connected to each other and may be connected to ground.

In a first state in which the first connector 210d and the second connector 220d are normally connected, the first pin 210d-1 of the first connector 210d is the first pin 220d− of the second connector 220d. 1) and can be connected to each other. Also, the 64 th pins 210d-64 of the first connector 210d may be connected to the 64 th pins 220d-64 of the second connector 220d.

In the first state, when the first pins 220d-1 and the 64th pins 220d-64 of the second connector 220d are connected to each other, the first pins 210d-1 of the first connector 210d are connected to each other. May be in a state of being connected to the 64 th pins 210d-64 of the first connector 210d. Accordingly, the input terminal 161 of the processor 160 may be in a digital high state regardless of the pull-down resistor 211d.

In a second state in which the first connector 210d and the second connector 220d are abnormally connected, the first pin 210d-1 of the first connector 210d is the first pin 220d of the second connector 220d. -1) and may not be connected to each other. In addition, the 64 th pins 210d-64 of the first connector 210d may not be connected to the 64 th pins 220d-64 of the second connector 220d.

In the second state, when the first pin 210d-1 of the first connector 210d is not connected to the first pin 220d-1 of the second connector 220d, the input terminal of the processor 160 is provided. 161 may be in a digital low state by the pull-down resistor 211d and ground.

The first pins 210d-1 of the first connector 210d are connected to each other with the first pins 220d-1 of the second connector 220d, and the 64th pins 210d-64 of the first connector 210d are connected to each other. ) Is not connected to the 64th pins 220d-64 of the second connector 220d, the input terminal 161 of the processor 160 may be in a digital low state by the pull-down resistor 211d and ground. have.

In FIG. 9, a case in which a sensing circuit is configured by using the first pin and the sixty-fourth pin of the first connector 210d and the second connector 220d is exemplarily illustrated, but is not limited thereto. For example, the sensing circuit may be configured using the second pin and the 63rd pin of the first connector 210d and the second connector 220d. As another example, the sensing circuit may be configured using the third pin and the sixty-second pin of the first connector 210d and the second connector 220d. As another example, the sensing circuit may be configured using the fifth pin and the sixty pin of the first connector 210d and the second connector 220d.

10 illustrates a crack detection structure of a display driving circuit according to various embodiments of the present disclosure.

Referring to FIG. 10, the display panel 1015 may include an active area 1021 and a non-active area 1022. The functions or operations of the display area 1021 and the non-display area 1022 may be the same as or similar to those of the display area 310 and the non-display area 320 of FIG. 3.

The substrate 1023 may be connected to one end of the non-display area 1022. The substrate 1023 may mount the display driving circuit 1030. The substrate 1023 may electrically connect the non-display area 1022 and the display driving circuit 1030.

When the substrate 1023 is unfolded, the display driving circuit 1030 may be in a state facing the same direction as the display area 1021. When the substrate 1023 is folded, the display driving circuit 1030 may face a direction different from (or opposite to) the display area 1021.

The display driver circuit (DDI) 1030 may be mounted on the substrate 1023 and connected to a main board inside the electronic device. The display driving circuit 1030 may process a signal for driving the active region 1021. For example, the display driving circuit 1030 may process a timing signal, a gate signal, a source signal, or the like for driving the active region 1021.

The wiring unit 1024 may connect the display driving circuit 1030 and the first connector 1050. For example, the wiring unit 1024 may transmit image data or a control signal provided through the first connector 1050 to the display driving circuit 1030.

The first connector 1050 may be coupled to a second connector of the main mode inside the electronic device. The first connector 1050 may have a shape corresponding to the second connector. For example, the first connector 1050 may include a plurality of pins of the same number, having a pin arrangement that is symmetrical with the second connector.

According to various embodiments of the present disclosure, the display driving circuit 1030, the wiring unit 1024, and the first connector 1050 may be configured by a processor inside the electronic device, such as a normal state or a crack generation state. May include a crack detection circuit 1035.

The crack detection circuit 1035 may include a first pin 1051 of the plurality of pins included in the first connector 1050, a portion of the wiring unit 1024, an interior of the display driving circuit 1030, and a wiring unit 1024. It may be in the form of an open loop wiring connecting the other part and the second pin 1052.

In the cross-sectional view of II-II ', the crack sensing circuit 1035 may be routed in the upper layer of the display drive circuit 1030. The upper layer may be a top layer in a direction (A direction) toward the display area 1021 of the display panel 1015 in a state where the substrate 1023 is unfolded.

In a state where the substrate 1023 is folded, the upper layer may face in a direction opposite to the direction toward the display area 1021 (B direction).

When the crack detection circuit is formed inside the display driving circuit 1030 irrespective of the first connector 1050 and the wiring unit 1024, the crack detection circuit operates as an antenna that radiates noise to the display panel 1015 by a high speed signal. can do. In addition, as a crack occurs in the display driving circuit 1030, the crack detection circuit may not be able to operate normally.

On the other hand, when the crack detection circuit 1035 is formed using the first connector 1050 and the wiring unit 1024, the possibility of operating as an antenna radiating noise to the display panel 1015 by a high speed signal can be reduced. have. In addition, even when a crack occurs in the display driving circuit 1030, the crack detection circuit 1035 may operate normally.

11 is a block diagram of an electronic device 2001 in a network environment 2000 for determining a state of a display using one or more designated pins, according to various embodiments.

Referring to FIG. 11, in the network environment 2000, the electronic device 2001 (eg, the electronic device 101 of FIG. 1) is connected to the electronic device 2002 through the first network 2098 (eg, near field communication). Communication with the electronic device 2004 or the server 2008 through the second network 2099 (eg, long distance wireless communication). According to an embodiment of the present disclosure, the electronic device 2001 may communicate with the electronic device 2004 through the server 2008. According to an embodiment, the electronic device 2001 may include a processor 2020, a memory 2030, an input device 2050, an audio output device 2055, a display device 2060, an audio module 2070, and a sensor module. 2076, interface 2077, haptic module 2079, camera module 2080, power management module 2088, battery 2089, communication module 2090, subscriber identification module 2096, and antenna module 2097 ) May be included. In some embodiments, at least one of the components (for example, the display device 2060 or the camera module 2080) may be omitted or another component may be added to the electronic device 2001. In some embodiments, some components, such as, for example, in the case of a sensor module 2076 (eg, fingerprint sensor, iris sensor, or illuminance sensor) embedded in the display device 2060 (eg, display), It can be integrated.

The processor 2020 may drive at least one other component (eg, hardware or software component) of the electronic device 2001 connected to the processor 2020, for example, by driving software (eg, a program 2040). It can control and perform various data processing and operations. The processor 2020 loads and processes the command or data received from another component (eg, the sensor module 2076 or the communication module 2090) into the volatile memory 2032, and processes the resulting data into the nonvolatile memory 2034. Can be stored in According to one embodiment, the processor 2020 operates independently of the main processor 2021 (eg, central processing unit or application processor), and additionally or alternatively, uses less power than the main processor 2021, Or a coprocessor 2023 (eg, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor) specialized for the designated function. Here, the coprocessor 2023 may be operated separately from the main processor 2021 or embedded.

 In such a case, the coprocessor 2023 may, for example, replace the main processor 2021 while the main processor 2021 is in an inactive (eg, sleep) state, or the main processor 2021 is active (eg At least one of the components of the electronic device 2001 (eg, the display device 2060, the sensor module 2076, or the communication module) together with the main processor 2021 while in the application execution state. 2090) and at least some of the functions or states associated with it. According to one embodiment, the coprocessor 2023 (eg, image signal processor or communication processor) is implemented as some component of another functionally related component (eg, camera module 2080 or communication module 2090). Can be. The memory 2030 may include various data used by at least one component of the electronic device 2001 (eg, the processor 2020 or the sensor module 2076), for example, software (eg, the program 2040). ), And input data or output data for a command related thereto. The memory 2030 may include a volatile memory 2032 or a nonvolatile memory 2034.

The program 2040 is software stored in the memory 2030, and may include, for example, an operating system 2042, middleware 2044, or an application 2046.

The input device 2050 is a device for receiving an instruction or data to be used for a component of the electronic device 2001 (for example, the processor 2020) from the outside of the electronic device 2001 (for example, a user). For example, it may include a microphone, a mouse, or a keyboard.

The sound output device 2055 is a device for outputting a sound signal to the outside of the electronic device 2001. For example, the sound output device 2055 may include a speaker used for general purposes such as multimedia playback or recording playback, and a receiver used only for receiving a call. It may include. According to one embodiment, the receiver may be formed integrally or separately from the speaker.

The display device 2060 (eg, the display 110 of FIG. 1) is a device for visually providing information to a user of the electronic device 2001. For example, the display device 2060 may include a display, a hologram device, or a projector and the device. It may include a control circuit for controlling. According to an embodiment of the present disclosure, the display device 2060 may include a pressure sensor capable of measuring the intensity of the pressure on the touch circuitry or the touch.

The audio module 2070 may bidirectionally convert sound and electric signals. According to an embodiment of the present disclosure, the audio module 2070 acquires sound through the input device 2050, or an external electronic device (for example, wired or wirelessly connected to the sound output device 2055 or the electronic device 2001). Sound may be output through the electronic device 2002 (eg, a speaker or a headphone).

The sensor module 2076 may generate an electrical signal or data value corresponding to an operating state (eg, power or temperature) inside the electronic device 2001 or an external environmental state. The sensor module 2076 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, Or an illumination sensor.

The interface 2077 may support a specified protocol that may be connected to an external electronic device (for example, the electronic device 2002) by wire or wirelessly. According to an embodiment of the present disclosure, the interface 2077 may include a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 2078 may be a connector for physically connecting the electronic device 2001 and an external electronic device (eg, the electronic device 2002), for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector. (Eg, headphone connector).

The haptic module 2079 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinetic senses. The haptic module 2079 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 2080 may capture still images and videos. According to an embodiment of the present disclosure, the camera module 2080 may include one or more lenses, an image sensor, an image signal processor, or a flash.

The power management module 2088 is a module for managing power supplied to the electronic device 2001 and may be configured, for example, as at least part of a power management integrated circuit (PMIC).

The battery 2089 is a device for supplying power to at least one component of the electronic device 2001 and may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 2090 may establish a wired or wireless communication channel between the electronic device 2001 and an external electronic device (eg, the electronic device 2002, the electronic device 2004, or the server 2008), and the established communication channel. It can support to perform communication through. The communication module 2090 may include one or more communication processors that support wired communication or wireless communication that operate independently of the processor 2020 (eg, an application processor). According to an embodiment, the communication module 2090 may be a wireless communication module 2092 (eg, a cellular communication module, a near field communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 2094 (eg, A local area network (LAN) communication module, or a power line communication module, comprising a local area network such as a first network 2098 (eg, Bluetooth, WiFi direct, or infrared data association) using a corresponding communication module. Communication with an external electronic device via a communication network) or a second network 2099 (eg, a telecommunication network such as a cellular network, the Internet, or a computer network (eg, a LAN or a WAN)). The various types of communication modules 2090 described above may be implemented as one chip or each separate chip.

According to an embodiment of the present disclosure, the wireless communication module 2092 may distinguish and authenticate the electronic device 2001 in a communication network by using user information stored in the subscriber identification module 2096.

The antenna module 2097 may include one or more antennas for transmitting or receiving signals or power from the outside. According to an exemplary embodiment, the communication module 2090 (for example, the wireless communication module 2092) may transmit a signal to or receive a signal from an external electronic device through an antenna suitable for a communication method.

Some of the components are connected to each other via a communication method between peripheral devices (eg, a bus, a general purpose input / output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)). (E.g. commands or data) can be exchanged with each other.

 According to an embodiment of the present disclosure, the command or data may be transmitted or received between the electronic device 2001 and the external electronic device 2004 through the server 2008 connected to the second network 2099. Each of the electronic devices 2002 and 2004 may be the same or different type of device as the electronic device 2001. According to an embodiment of the present disclosure, all or part of operations executed in the electronic device 2001 may be executed in another or a plurality of external electronic devices. According to an embodiment of the present disclosure, when the electronic device 2001 is to perform a function or service automatically or by request, the electronic device 2001 may instead or additionally execute the function or service by itself. At least some associated functions may be requested to the external electronic device. Upon receiving the request, the external electronic device may execute the requested function or additional function and transmit the result to the electronic device 2001. The electronic device 2001 may process the received result as it is or additionally to provide the requested function or service. To this end, for example, cloud computing, distributed computing, or client-server computing technology may be used.

12 and 13, an electronic device 2100 (eg, the electronic device 101 of FIG. 1) according to an embodiment may include a first surface (or front surface) 2110A (first direction 11). Facing side), second side (or rear side) 2110B (side facing second direction 12), and side 2110C surrounding the space between first side 2110A and second side 2110B And a housing 2110 that includes a (facing to one of the third directions 13, 14, 15, or 16). In another embodiment (not shown), the housing may refer to a structure that forms some of the first side 2110A, second side 2110B, and side surfaces 2110C of FIG. 12. According to one embodiment, the first side 2110A may be formed by a front plate 2102 (eg, a glass plate comprising various coating layers, or a polymer plate) that is at least partially substantially transparent. The second side 2110B may be formed by a substantially opaque back plate 2111. The back plate 2111 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. Can be. The side 2110C is coupled to the front plate 2102 and the back plate 2111 and may be formed by a side bezel structure (or “side member”) 2118 that includes metal and / or polymer. In some embodiments, back plate 2111 and side bezel structure 2118 may be integrally formed and include the same material (eg, a metal material such as aluminum).

In the illustrated embodiment, the front plate 2102 has two first regions 2110D extending seamlessly from the first side 2110A toward the rear plate 2111, the front plate 2110D. It may be included at both ends of the long edge (2102). In the illustrated embodiment (see FIG. 13), the back plate 2111 is a long edge of two second regions 2110E extending seamlessly from the second face 2110B towards the front plate 2102. It can be included at both ends. In some embodiments, the front plate 2102 (or the back plate 2111) may include only one of the first regions 2110D (or the second regions 2110E). In another embodiment, some of the first regions 2110D or the second regions 2110E may not be included. In the above embodiments, when viewed from the side of the electronic device 2100, the side bezel structure 2118 may be formed on the side that does not include the first region 2110D or the second region 2110E. It may have a first thickness (or width), and may have a second thickness thinner than the first thickness on the side surface including the first region 2110D or the second region 2110E.

According to an embodiment, the electronic device 2100 may include a display 2101, an audio module 2103, 2107, and 2114, a sensor module 2104, 2116, and 2119, a camera module 2105, 2112, and 2113 and a key input. The device 2117 may include at least one of the light emitting device 2106, the pen input device 2120, and the connector holes 2108 and 2109. In some embodiments, the electronic device 2100 may omit at least one of the components (for example, the key input device 2117 or the light emitting device 2106) or may further include other components.

Display 2101 may be exposed through, for example, a substantial portion of front plate 2102. In some embodiments, at least a portion of the display 2101 may be exposed through the first surface 2110A and the front plate 2102 forming the first area 2110D of the side surface 2110C. In some embodiments, the edges of the display 2101 may be formed approximately the same as the adjacent outer shape of the front plate 2102. In another embodiment (not shown), the distance between the outer side of the display 2101 and the outer side of the front plate 2102 may be formed substantially the same in order to expand the area where the display 2101 is exposed.

In another embodiment (not shown), a recess or opening is formed in a portion of the screen display area of the display 2101 (eg, the display 110 of FIG. 1), and the recess or the opening is opened. ) May include at least one of an audio module 2114, a sensor module 2104, a camera module 2105, and a light emitting device 2106. In another embodiment (not shown), an audio module 2114, a sensor module 2104, a camera module 2105, a fingerprint sensor 2116, and a light emitting element 2106 are located behind the screen display area of the display 2101. It may include at least one of). In another embodiment (not shown), the display 2101 is coupled or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer for detecting a magnetic field stylus pen. Can be arranged. In some embodiments, at least a portion of the sensor modules 2104, 2119, and / or at least a portion of the key input device 2117 may be located in the first region 2110D and / or the second region 2110E. Can be arranged.

The audio modules 2103, 2107, and 2114 may include a microphone hole 2103 and a speaker hole 2107 and 2114. The microphone hole 2103 may include a microphone for acquiring an external sound, and in some embodiments, a plurality of microphones may be disposed to detect a direction of the sound. The speaker holes 2107 and 2114 may include an external speaker hole 2107 and a receiver receiver hole 2114 for a call. In some embodiments, the speaker holes 2107 and 2114 and the microphone hole 2103 may be implemented as one hole, or a speaker may be included without the speaker holes 2107 and 2114 (eg, a piezo speaker).

The sensor modules 2104, 2116, and 2119 may generate an electrical signal or data value corresponding to an operating state inside the electronic device 2100 or an external environment state. The sensor modules 2104, 2116, 2119 may be, for example, a first sensor module 2104 (eg, proximity sensor) and / or a second sensor module (eg, disposed on the first face 2110A of the housing 2110). Not shown) (eg, fingerprint sensor), and / or third sensor module 2119 (eg, HRM sensor) and / or fourth sensor module 2116 disposed on the second side 2110B of the housing 2110. ) (Eg, fingerprint sensor). The fingerprint sensor may be disposed on the second surface 2110B as well as the first surface 2110A (eg, the display 2101) of the housing 2110. The electronic device 2100 may include a sensor module (not shown), for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor or an illuminance sensor 2104.

The camera modules 2105, 2112, and 2113 are the first camera device 2105 disposed on the first surface 2110A of the electronic device 2100, and the second camera device 2112 disposed on the second surface 2110B. ) And / or flash 2113. The camera modules 2105 and 2112 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 2113 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 2100.

The key input device 2117 may be disposed on the side surface 2110C of the housing 2110. In another embodiment, the electronic device 2100 may not include some or all of the above mentioned key input devices 2117 and the non-included key input device 2117 may be a soft key or the like on the display 2101. It may be implemented in other forms. In some embodiments, the key input device may include a sensor module 2116 disposed on the second side 2110B of the housing 2110.

The light emitting element 2106 may be disposed, for example, on the first surface 2110A of the housing 2110. The light emitting element 2106 may provide, for example, state information of the electronic device 2100 in the form of light. In another embodiment, the light emitting element 2106 may provide a light source that is linked to the operation of the camera module 2105, for example. The light emitting element 2106 may include, for example, an LED, an IR LED, and a xenon lamp.

The connector holes 2108 and 2109 may include a first connector hole 2108 that may receive a connector (eg, a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or an external electronic device. And a second connector hole (eg, an earphone jack) 2109 that can accommodate a connector for transmitting and receiving audio signals.

The pen input device 2120 (eg, a stylus pen) may be inserted into or removed from the housing 2110 through a hole 2121 formed at a side of the housing 2110, and may be easily removed. It may include a button for enabling. The pen input device 2120 may include a separate resonant circuit to interlock with an electromagnetic induction panel 2390 (eg, a digitizer) included in the electronic device 2100. The pen input device 2120 may include an electro-magnetic resonance (EMR) method, an active electrical stylus (AES), and an electric coupled resonance (ECR) method.

Referring to FIG. 14, the electronic device 2300 (eg, the electronic device 101 of FIG. 1) includes a side bezel structure 2310, a first support member 2311 (eg, a bracket), and a front plate 2320. , Display 2330 (eg, display 110 of FIG. 1), electromagnetic induction panel 2390, printed circuit board 2340, battery 2350, second support member 2360 (eg, rear case) , An antenna 2370, a pen input device 2120, and a back plate 2380. In some embodiments, the electronic device 2300 may omit at least one of the components (eg, the first support member 2311 or the second support member 2360) or may further include other components. . At least one of the components of the electronic device 2300 may be the same as or similar to at least one of the components of the electronic device 2100 of FIG. 12 or 13, and overlapping descriptions thereof will be omitted below.

The electromagnetic induction panel 2390 (eg, a digitizer) may be a panel for sensing an input of the pen input device 2120. For example, the electromagnetic induction panel 2390 may include a printed circuit board (PCB) (eg, a flexible printed circuit board (FPCB)) and a shielding sheet. The shielding sheet may prevent interference between the components by electromagnetic fields generated from components included in the electronic device 2100 (eg, a display module, a printed circuit board, an electromagnetic induction panel, etc.). The shielding sheet can block the electromagnetic field generated from the components, so that the input from the pen input device 2120 can be accurately transmitted to the coil included in the electromagnetic induction panel 2240. According to various embodiments of the present disclosure, the electromagnetic induction panel 2240 may include an opening formed in at least a partial region corresponding to the biometric sensor mounted in the electronic device 2100.

The first support member 2311 may be disposed inside the electronic device 2300 to be connected to the side bezel structure 2310 or may be integrally formed with the side bezel structure 2310. The first support member 2311 may be formed of, for example, a metal material and / or a non-metal (eg polymer) material. In the first support member 2311, the display 2330 may be coupled to one surface thereof, and the printed circuit board 2340 may be coupled to the other surface thereof. The printed circuit board 2340 may be equipped with a processor, a memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

The memory may include, for example, volatile memory or nonvolatile memory.

The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device 2300 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

The battery 2350 is a device for supplying power to at least one component of the electronic device 2300, and may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell. . At least a portion of the battery 2350 may be disposed, for example, on substantially the same plane as the printed circuit board 2340. The battery 2350 may be integrally disposed in the electronic device 2300, or may be detachably attached to the electronic device 2300.

The antenna 2370 may be disposed between the back plate 2380 and the battery 2350. Antenna 2370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 2370 may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In another embodiment, the antenna structure may be formed by some or a combination of the side bezel structure 2310 and / or the first support member 2311.

An electronic device according to various embodiments of the present disclosure may include a first connector connected to a display panel, a display driving circuit (DDI) for driving the display panel, the display driving circuit, and including a first display pin and a second display pin. A second connector (the first display pin and the second display pin connected to each other), a substrate, a second connector connected to the substrate, coupled to the first connector, and including a first board pin and a second board pin A board pin or one of the second board pins is connected to a resistor), and a processor mounted to the substrate, the processor based on a signal received from the first board pin or the second board pin. The coupling state of the first connector and the second connector or the state of the display driving circuit may be set.

According to various embodiments of the present disclosure, the first display pin of the first connector is disposed at a position corresponding to the first board pin of the second connector, and the second display pin of the first connector is the second of the second connector. It may be disposed at a position corresponding to the board pin.

According to various embodiments of the present disclosure, the resistor may include a pull-up resistor connected between a power supply and the board pin.

According to various embodiments of the present disclosure, the processor may determine a state of a board pin to which the pull-up resistor is connected, and when the board pin is in a high state, determine the states of the first connector and the second connector as an incomplete coupling state. have.

According to various embodiments of the present disclosure, the processor may check a state of a board pin to which the pull-up resistor is connected, and when the board pin is in a low state, the processor may determine a state of coupling between the first connector and the second connector.

According to various embodiments of the present disclosure, the resistor may include a pull-down resistor connected between the board pin and the ground.

According to various embodiments of the present disclosure, the processor may check a state of a board pin to which the pull-down resistor is connected, and when the board pin is in a low state, the processor may determine a state of the first connector and the second connector as an incomplete coupling state. .

According to various embodiments of the present disclosure, the processor may check a state of a board pin to which the pull-down resistor is connected, and when the board pin is in a high state, determine the state of the first connector and the second connector as a coupled state.

According to various embodiments of the present disclosure, the first board pin may be disposed in a first direction, and the second board pin may be disposed in a second direction opposite to the first direction.

According to various embodiments of the present disclosure, the electronic device may further include an open loop wire connecting one end of the first display pin and the display driving circuit and connecting the other end of the display driving circuit to the second display pin. The open loop wiring may connect the one end and the other end in the display driving circuit.

According to various embodiments of the present disclosure, when the display driving circuit is mounted on the electronic device, the open loop wiring may be arranged in a direction opposite to a direction in which an active area of the display faces among the inner surfaces of the display driving circuit. It may be disposed adjacent to the face.

An electronic device according to various embodiments of the present disclosure may include a first connector connected to a display panel, a display driving circuit (DDI) for driving the display panel, the display driving circuit, and including a first display pin and a second display pin. One of the first display pin or one of the second display pins is connected to a resistor), a substrate, a second connector coupled to the substrate, coupled to the first connector, the second connector including a first board pin and a second board pin A first board pin and the second board pin are connected to each other), and a processor mounted to the substrate, the processor based on a signal received from the first display pin or the second display pin. The coupling state of the connector and the second connector or the state of the display driving circuit may be set.

According to various embodiments of the present disclosure, the first display pin may be disposed in a first direction, and the second display pin may be disposed in a second direction opposite to the first direction.

According to various embodiments of the present disclosure, the resistor may include a pull-up resistor connected between a power supply and the display pin. The processor may check a state of a display pin to which the pull-up resistor is connected, and when the display pin is in a high state, determine a state of the first connector and the second connector as an incomplete coupling state. The processor may check a state of a display pin to which the pull-up resistor is connected, and when the display pin is in a low state, determine the state of the first connector and the second connector as a coupled state.

According to various embodiments of the present disclosure, the resistor may include a pull-down resistor connected between the display pin and the ground. The processor may check a state of a display pin to which the pull-down resistor is connected, and when the display pin is in a low state, determine a state of the first connector and the second connector as an incomplete coupling state. The processor may determine a state of a display pin to which the pull-down resistor is connected, and when the display pin is in a high state, determine the state of the first connector and the second connector as a coupled state.

Each component (for example, a module or a program) according to various embodiments may be composed of a singular or plural number of objects, and some of the above-described subcomponents may be omitted, or other subcomponents may vary. It may be further included in the embodiment. Alternatively or additionally, some components (eg, modules or programs) may be integrated into one entity to perform the same or similar functions performed by each corresponding component prior to integration. According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, repeatedly, or heuristically, or at least some operations may be executed in a different order, omitted, or another operation may be added. Can be.

Claims (20)

In an electronic device,
Display panel;
A display driving circuit (DDI) for driving the display panel;
A first connector connected to the display driving circuit, the first connector comprising a first display pin and a second display pin, the first display pin and the second display pin connected to each other;
Board;
A second connector coupled to the substrate, coupled to the first connector, the second connector comprising a first board pin and a second board pin, the first board pin or the second board pin connected to a resistor; And
A processor mounted to the substrate;
The processor is
And determine at least one of a coupling state of the first connector and the second connector or a state of the display driving circuit based on a signal received from the first board pin or the second board pin. The display device of claim 1, wherein the first display pin of the first connector is
Disposed at a position corresponding to the first board pin of the second connector,
The second display pin of the first connector is
The electronic device is disposed in a position corresponding to the second board pin of the second connector. The method of claim 1, wherein the resistance is
And a pullup resistor coupled between a power supply and the board pin. The processor of claim 3, wherein the processor comprises:
Check the state of the board pin to which the pull-up resistor is connected;
And when the board pin is in a high state, determining the states of the first connector and the second connector as an incompletely coupled state. 4. The processor of claim 3, wherein the processor is
Check the state of the board pin to which the pull-up resistor is connected;
And when the board pin is in a low state, determining a state of the first connector and the second connector as a coupled state. The method of claim 1, wherein the resistance is
And a pull-down resistor connected between the board pins and ground. The processor of claim 6, wherein the processor is
Check the state of the board pin connected to the pull-down resistor,
And determining that the state of the first connector and the second connector is incompletely coupled when the board pin is in a low state. The processor of claim 6, wherein the processor is
Check the state of the board pin connected to the pull-down resistor
And when the board pin is in a high state, determining a state of the first connector and the second connector as a coupled state. The method of claim 1, wherein the first board pin is disposed in a first direction,
The second board pin is disposed in a second direction opposite to the first direction. The method of claim 1,
An open loop wiring connecting one end of the first display pin and the display driving circuit and connecting the other end of the display driving circuit to the second display pin;
And the open loop wiring connects the one end and the other end in the display driving circuit. The method of claim 1, wherein the open loop wiring is
When the display driving circuit is mounted on the electronic device, the electronic device is disposed to be adjacent to a surface in a direction opposite to a direction in which an active area of the display is directed among the inner surfaces of the display driving circuit. In an electronic device,
Display panel;
A display driving circuit (DDI) for driving the display panel;
A first connector comprising a first display pin and a second display pin, one of the first display pin or the second display pin is connected to a resistor;
Board;
A second connector coupled to the substrate, coupled to the first connector, the second connector comprising a first board pin and a second board pin, the first board pin and the second board pin connected to each other; And
A processor mounted to the substrate;
The processor is
And determine at least one of a coupling state of the first connector and the second connector or a state of the display driving circuit based on a signal received from the first display pin or the second display pin. The method of claim 12,
The first display pin is disposed in the first direction,
The second display pin is disposed in a second direction opposite to the first direction. The method of claim 12, wherein the resistance is
And a pull-up resistor coupled between a power supply and the display pin. 15. The system of claim 14, wherein said processor is
Check the state of the display pin to which the pull-up resistor is connected;
And determining the state of the first connector and the second connector as an incomplete coupling state when the display pin is in a high state. 15. The system of claim 14, wherein said processor is
Check the state of the display pin to which the pull-up resistor is connected;
And determining the state of the first connector and the second connector as a coupled state when the display pin is in a low state. The method of claim 12, wherein the resistance is
And a pull-down resistor coupled between the display pins and ground. 18. The system of claim 17, wherein the processor is
Check the state of the display pin to which the pull-down resistor is connected;
And determining the state of the first connector and the second connector as an incomplete coupling state when the display pin is in a low state. 18. The system of claim 17, wherein the processor is
Check the state of the display pin to which the pull-down resistor is connected;
And determining the state of the first connector and the second connector as a coupled state when the display pin is in a high state. A method for recognizing a connection of a connector performed in an electronic device,
Checking a voltage applied to a first board pin of a connector mounted on a board of the electronic device;
When the first board pin has a voltage value specified by the pull-up resistor connected to the first board pin or more, determining the connector to be in a shovel state;
Determining the connector to be in a normally coupled state when the first board pin is connected to a second board pin disposed at a position symmetrical to the first board pin in the connector and has a voltage value less than the first board pin; How to include.

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