KR20190093184A - Organic light emitting display module and organic light emitting display device having the same - Google Patents

Abstract

An organic light emitting display module includes an active region, a pad region, and a boundary region between the active region and the pad region. Unlike the active region and the pad region, the boundary region does not include an inorganic layer and thus is less stressed when it is bent. The display panel pads and the touch sensing member pads of the pad region are formed at the same height without being stepped from each other. A dummy pad may be added to eliminate a step between the display panel pads and the touch sensing member pads. It is possible to reduce defects generated in a manufacturing process.

Description

ORGANIC LIGHT EMITTING DISPLAY MODULE AND ORGANIC LIGHT EMITTING DISPLAY DEVICE HAVING THE SAME}

The present invention relates to a display device, and to a display device in which a touch sensing member is integrated.

Various displays have been developed for use in multimedia devices such as televisions, mobile phones, tablet computers, navigation devices, game machines, and the like. Input devices of the display devices include a keyboard or a mouse. Also, recently, display devices include a touch sensing member as an input device.

An object of the present invention is to eliminate the step between the pad portion of the display panel and the pad portion of the touch sensing member, thereby reducing defects in the manufacturing process.

In addition, an object of the present invention is to improve reliability when a boundary region disposed between an active region and a pad region in a display panel is bent.

The organic light emitting display module includes a base layer, a first circuit layer, an element layer, an encapsulation layer, a plurality of touch electrodes, a second circuit layer, and a boundary layer. The base layer includes an active region, a pad region, and a boundary region between the active region and the pad region. The first circuit layer is disposed on the active region of the base layer and includes a plurality of inorganic layers and a first conductive pattern. The device layer includes an organic light emitting device disposed on the first circuit layer and generating light by an electrical signal provided from the first conductive pattern. The encapsulation layer is disposed on the device layer. The plurality of touch electrodes are disposed on the encapsulation layer. The second circuit layer is disposed on the pad region of the base layer and includes a plurality of inorganic layers and a second conductive pattern. The boundary layer is disposed on the boundary area of the base layer and includes an organic layer and a third conductive pattern electrically connecting the first conductive pad and the second conductive pad.

The plurality of inorganic layers of the first circuit layer include a first functional layer in contact with the base layer, and the plurality of inorganic layers of the second circuit layer include a second functional layer in contact with the base layer. can do.

The second conductive pattern may include a display panel pad and a touch sensing member pad. The display panel pad is disposed on the second functional layer and electrically connected to the first conductive pattern. The touch sensing member pad is disposed adjacent to the display panel pad on the second functional layer, electrically connected to the plurality of touch electrodes, and insulated from the first conductive pattern.

The display panel pad may include a lower display panel pad and an upper display panel pad disposed on the lower display panel pad and electrically connected to the lower display panel pad.

The touch sensing member pad may include a lower touch sensing member pad and an upper touch sensing member pad disposed on the lower touch sensing member pad.

The first conductive pattern may include a transistor including a control electrode, an input electrode, and an output electrode, and the input electrode, the output electrode, the lower display panel pad, and the lower touch sensing member pad may be disposed on the same layer. Can be.

The second conductive pattern may further include a dummy electrode disposed on the same layer as the control electrode.

The touch signal line may further include a touch signal line extending from at least one of the plurality of touch electrodes and contacting the upper touch sensing member pad.

The second circuit layer may further include a plurality of insulating layers disposed between the upper display panel pad and the lower display panel, and the plurality of insulating layers may be disposed between the upper touch sensing member pad and the lower touch panel. Can be.

The lower touch sensing member pad may be electrically isolated.

The lower touch sensing member pad may be electrically connected to the upper touch sensing member pad.

The upper display panel pad may contact the lower display panel pad, and the lower touch sensing member pad may contact the lower touch sensing pad.

The first functional layer and the second functional layer may each include a barrier layer and a buffer layer.

The display device may further include a driving circuit overlapping the pad area and controlling an electrical signal flow between the display panel pad and the first conductive pattern.

The first circuit layer may further include an organic layer disposed on the first conductive pattern, and the boundary layer may further include an organic layer disposed on the third conductive pattern.

The boundary region and the boundary layer of the base layer may be bent.

In an exemplary embodiment, the organic light emitting display device includes an organic light emitting display panel and a touch sensing member disposed on the organic light emitting display panel.

The organic light emitting display panel may include a base layer, a conductive pattern, an element layer, and an encapsulation layer. The base layer includes an active region, a pad region, and a boundary region between the active region and the pad region. The conductive pattern overlaps the active region, is disposed on the first inorganic layer, is formed in the LTPS process, and includes a display panel pad and a touch sensing member pad disposed adjacent to the display panel pad. The sensing member pad and the display panel pad receive electrical signals from the outside. The device layer includes an organic light emitting device disposed on the first circuit layer and generating light by the electrical signal provided from the conductive pattern. The encapsulation layer is disposed on the device layer.

The touch sensing member includes a plurality of touch electrodes and a plurality of touch signal lines. The plurality of touch electrodes are disposed on the encapsulation layer. The plurality of touch signal lines extend from the plurality of touch electrodes, are electrically connected to the conductive pattern, and a portion overlapping the boundary region is disposed between two organic layers.

An organic light emitting display device according to an embodiment of the present invention further includes a touch sensing pad and a printed circuit board electrically connected to the display panel pad, wherein the boundary area of the organic light emitting display panel and the touch sensing member is present. The portion overlapping with may be bent.

An organic light emitting display module according to an embodiment of the present invention includes a base layer, a first functional layer, a plurality of transistors, an element layer, an encapsulation layer, a plurality of touch electrodes, a second functional layer, a first display panel pad, and a first layer. A touch sensing member pad, a second display panel pad, a second touch sensing member pad, and a boundary layer are included.

The base layer includes an active region, a pad region, and a boundary region between the active region and the pad region. The first functional layer is disposed on the active region of the base layer and includes an inorganic material. The plurality of transistors are disposed on the first functional layer. The device layer includes an organic light emitting device that generates light by an electrical signal provided from at least one of the plurality of transistors. The encapsulation layer is disposed on the device layer and includes an organic material and an inorganic material. The plurality of touch electrodes are disposed on the encapsulation layer. The second functional layer is disposed on the pad region of the base layer and includes an inorganic material. The first display panel pad is disposed on the second functional layer and electrically connected to at least one of the plurality of transistors. The first touch sensing member pad is disposed adjacent to the first display panel pad on the second functional layer and insulated from the plurality of transistors. The second display panel pad is disposed on the first display panel pad and electrically connected to the first display panel pad. The second touch sensing member pad is disposed on the first touch sensing member pad and electrically connected to at least one of the plurality of touch electrodes. The boundary layer is disposed on the boundary region of the base layer and includes an organic material.

According to an embodiment of the present invention, the pad portion of the display panel and the pad portion of the touch sensing member may be disposed at the same height.

According to an embodiment of the present invention, the ductility of the bent portion of the display panel may be increased.

1A is a perspective view illustrating a first operation of a display device according to an exemplary embodiment of the present invention.
1B is a perspective view of a second operation of a display device according to an exemplary embodiment.
1C is a perspective view illustrating a third operation of a display device according to an embodiment of the present invention.
2A is a perspective view illustrating a first operation of a display device according to an exemplary embodiment of the present invention.
2B is a perspective view illustrating a second operation of the display device according to an exemplary embodiment.
3 is a cross-sectional view of a display device according to an exemplary embodiment of the present invention.
4 is a cross-sectional view of a display module according to an exemplary embodiment of the present invention.
5 is a plan view of an organic light emitting display panel according to an exemplary embodiment of the present invention.
6 is an equivalent circuit diagram of a pixel according to an exemplary embodiment of the present invention.
7 and 8 are partial cross-sectional views of an organic light emitting display panel according to an embodiment of the present invention.
9 is a plan view of a touch sensing member according to an embodiment of the present invention.
FIG. 10 is an enlarged view of AA of FIG. 9.
FIG. 11 is a cross-sectional view taken along line II ′ of FIG. 10.
FIG. 12 illustrates the display panel pads of FIG. 5 and the touch sensing member pads of FIG. 9.
FIG. 13A illustrates a cross section taken along line II-II ′ of FIG. 12.
FIG. 13B is a cross-sectional view taken along line III-III ′ of FIG. 12.
FIG. 13C illustrates a cross section taken along line IV-IV ′ of FIG. 12.
FIG. 14A illustrates a cross section taken along line II-II ′ of FIG. 12.
14B is a cross-sectional view taken along line III-III ′ of FIG. 12.
14C and 14D illustrate a cross section taken along line IV-IV ′ of FIG. 12.
15A is a cross-sectional view taken along line II-II ′ of FIG. 12.
FIG. 15B is a cross-sectional view taken along line III-III ′ of FIG. 12.
15C is a cross-sectional view taken along line IV-IV ′ of FIG. 12.
FIG. 16A illustrates a cross section taken along line II-II ′ of FIG. 12.
16B is a cross-sectional view taken along line III-III ′ of FIG. 12.
FIG. 16C illustrates a cross section taken along line IV-IV ′ of FIG. 12.
17A is a cross-sectional view taken along line II-II ′ of FIG. 12.
FIG. 17B illustrates a cross section taken along line III-III ′ of FIG. 12.
17C and 17D illustrate a cross section taken along line IV-IV ′ of FIG. 12.
18A is a cross-sectional view taken along line II-II ′ of FIG. 12.
18B is a cross-sectional view taken along line III-III ′ of FIG. 12.
FIG. 18C illustrates a cross section taken along line IV-IV ′ of FIG. 12.
19A is a cross-sectional view taken along line II-II ′ of FIG. 12.
19B is a cross-sectional view taken along line III-III ′ of FIG. 12.
19C is a cross-sectional view taken along line IV-IV ′ of FIG. 12.
FIG. 20A illustrates a cross section taken along line II-II ′ of FIG. 12.
20B is a cross-sectional view taken along line III-III ′ of FIG. 12.
20C is a cross-sectional view taken along line IV-IV ′ of FIG. 12.
FIG. 21A illustrates a cross section taken along line II-II ′ of FIG. 12.
FIG. 21B illustrates a cross section taken along line III-III ′ of FIG. 12.
FIG. 21C illustrates a cross section taken along line IV-IV ′ of FIG. 12.
22 and 23 are plan views illustrating a display module and a printed circuit board, respectively, according to an exemplary embodiment of the present invention.
24 illustrates a bent shape of the display module according to an exemplary embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present specification, when a component (or region, layer, portion, etc.) is referred to as being "on", "connected", or "coupled" to another component, it is placed directly on the other component / It can be connected / coupled or a third component can be arranged between them.

Like reference numerals refer to like elements. In addition, in the drawings, the thickness, ratio, and dimensions of the components are exaggerated for the effective description of the technical contents. "And / or" includes all one or more combinations that the associated configurations may define.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component. Singular expressions include plural expressions unless the context clearly indicates otherwise.

Also, terms such as "below", "below", "above", and "above" are used to describe the association of the components shown in the drawings. The terms are described in a relative concept based on the directions indicated in the drawings.

The terms "comprise" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described on the specification, and one or more other features, numbers, steps It is to be understood that the present invention does not exclude, in advance, the possibility of the presence or addition of any operation, component, part, or combination thereof.

1A is a perspective view illustrating a first operation of a display device DD according to an exemplary embodiment of the present invention. 1B is a perspective view illustrating a second operation of the display device DD according to an exemplary embodiment of the present invention. 1C is a perspective view of a third operation of the display device DD according to an exemplary embodiment of the present invention.

In the first operation mode, as illustrated in FIG. 1A, the display surface IS on which the image IM is displayed is parallel to the surface defined by the first direction axis DR1 and the second direction axis DR2. The third direction axis DR3 indicates the normal direction of the display surface IS, that is, the thickness direction of the display device DD. The front (or top) and back (or bottom) surfaces of the members are separated by the third direction axis DR3. However, a direction indicated by the first to third direction axes DR1, DR2, and DR3 may be converted to another direction as a relative concept. Hereinafter, the first to third directions refer to the same reference numerals in the directions indicated by the first to third direction axes DR1, DR2, and DR3, respectively. Although the flexible display is illustrated in the present embodiment, the present invention is not limited thereto. The display device DD according to the present embodiment may be a flat display device.

1A to 1C illustrate a foldable display as an example of the flexible display DD. 2A and 2B illustrate a foldable display as an example of the flexible display DD. However, the present invention may be a rollable flexible display device that is rolled up, and is not particularly limited. The flexible display device DD according to the present invention may be used in large electronic devices such as a television, a monitor, and the like, as well as small and medium electronic devices such as a mobile phone, a tablet, a car navigation device, a game machine, a smart watch, and the like.

As illustrated in FIG. 1A, the display surface IS of the flexible display device DD may include a plurality of regions. The flexible display device DD includes a display area DD-DA on which the image IM is displayed and a non-display area DD-NDA adjacent to the display area DD-DA. The non-display area DD-NDA is an area where no image is displayed. 1A illustrates a vase as an example of an image IM. For example, the display area DD-DA may have a rectangular shape. The non-display area DD-NDA may surround the display area DD-DA. However, the present invention is not limited thereto, and the shape of the display area DD-DA and the shape of the non-display area DD-NDA may be relatively designed.

The flexible display device DD may include a housing HS. The housing HS is disposed outside the flexible display device DD and may accommodate components therein. Hereinafter, for convenience of description, the housing HS is not illustrated or described separately.

As illustrated in FIGS. 1A to 1C, the display device DD may include a plurality of regions defined according to an operation type. The display device DD is configured to bend the bending area BA, the non-bending first non-bending area NBA1, and the second non-bending area NBA2 on the basis of the bending axis BX. It may include. As shown in FIG. 1B, the display device DD has an inner bending such that the display surface IS of the first non-bending area NBA1 and the display surface IS of the second non-bending area NBA2 face each other. -bending). As illustrated in FIG. 1C, the display device DD may be outer-bended so that the display surface IS is exposed to the outside.

In an exemplary embodiment, the display device DD may include a plurality of bending areas BA. In addition, the bending area BA may be defined to correspond to the form in which the user manipulates the display device DD. For example, unlike the FIGS. 1B and 1C, the bending area BA may be defined to be parallel to the first direction axis DR1, or may be defined in a diagonal direction. The area of the bending area BA is not fixed but may be determined according to the radius of curvature. In an embodiment of the present invention, the display device DD may be configured to repeat only the operation modes illustrated in FIGS. 1A and 1B.

2A is a perspective view illustrating a first operation of a display device according to an exemplary embodiment of the present invention. 2B is a perspective view illustrating a second operation of the display device according to an exemplary embodiment. 2A and 2B illustrate a display device in which a non-display area DD-NDA is folded as an example of the foldable display device DD. As described above, in the display device DD according to the present invention, the number of the bending area BA and the non-bending area NBA is not limited and the position of the bending area is not limited.

3 is a cross-sectional view of a display device DD according to an exemplary embodiment of the present invention. 4 is a cross-sectional view of a display module DM according to an exemplary embodiment of the present invention. 3 illustrates a cross section defined by the second direction axis DR2 and a third direction axis DR3, and FIG. 4 illustrates a cross section defined by the first direction axis DR1 and the third direction axis DR3. It was.

As shown in Figure 3, The display device DD includes a protective film PM, a window WM, a display module DM, a first adhesive member AM1, and a second adhesive member AM2. The display module DM is disposed between the protective film PM and the window WM. The first adhesive member AM1 couples the display module DM and the protective film PM, and the second adhesive member AM2 couples the display module DM and the window WM. In one embodiment of the present invention, the first adhesive member AM1 and the second adhesive member AM2 may be omitted. Each of the protective film PM and the window WM may be continuously formed through a coating process.

The protective film PM protects the display module DM. The protective film PM provides a first outer surface OS-L exposed to the outside, and provides an adhesive surface AS1 adhered to the first adhesive member AM1. Hereinafter, the adhesive surface AS1 of the protective film PM is referred to as a first adhesive surface AS1 to distinguish it from the adhesive surface of another member. The protective film PM prevents external moisture from penetrating the display module DM and absorbs external shocks.

The protective film PM may include a plastic film as a base layer. Protective film (PM) is polyethersulphone (PES), polyacrylate (PAR, polyacrylate), polyetherimide (PEI), polyethylene naphthalate (PEN, polyethyelenen napthalate), polyethylene terephthalate (PET, polyethyeleneterepthalate), polyphenylene sulfide (PPS), polyallylate (polyallylate), polyimide (PI, polyimide), polycarbonate (PC, polycabonate), polyarylene ether sulfone (poly) It may include a plastic film including any one selected from the group consisting of a combination of these.

The material constituting the protective film PM is not limited to plastic resins, and may include an organic / inorganic composite material. The protective film PM may include a porous organic layer and an inorganic material filled in pores of the organic layer. The protective film PM may further include a functional layer formed on the plastic film. The functional layer may include a resin layer. The functional layer may be formed by a coating method.

The window WM may protect the display module DM from external shock and provide an input surface to the user. The window WM provides a second outer surface OS-U exposed to the outside, and provides an adhesive surface AS2 adhered to the second adhesive member AM2. The display surface IS illustrated in FIGS. 1A to 1C may be a second outer surface OS-U. Hereinafter, the adhesive surface AS2 of the window WM is referred to as a second adhesive surface AS2 to distinguish it from the adhesive surface of another member.

In the display device DD illustrated in FIGS. 2A and 2B, the window WM may not be disposed in the bending area BA. However, the present invention is not limited thereto, and in another exemplary embodiment, the window WM may be disposed in the bending area BA.

The display module DM includes an organic light emitting display panel DP and a touch sensing member TS which are integrally formed by a continuous process. The organic light emitting display panel DP generates an image IM (see FIG. 1A) corresponding to the input image data. The organic light emitting display panel DP provides a first display panel surface BS1 -L and a second display panel surface BS1 -U facing each other in the thickness direction DR3.

The touch sensing member TS obtains coordinate information of an external input. The touch sensing member TS may be directly disposed on the second display panel surfaces BS1 -U. In this embodiment, the touch sensing member TS may be manufactured by a continuous process with the organic light emitting display panel DP.

Although not separately illustrated, the display module DM according to an exemplary embodiment may further include an antireflection layer. The anti-reflection layer may include a color filter or a laminate structure of a conductive layer / dielectric layer / conductive layer or an optical member. The anti-reflective layer may reduce external light reflectance by absorbing, canceling, or polarizing light incident from the outside.

Each of the first adhesive member AM1 and the second adhesive member AM2 is an optically clear adhesive film (OCA) or an optically clear resin (OCR) or a pressure sensitive adhesive film (PSA). Adhesive film). Each of the first adhesive member AM1 and the second adhesive member AM2 includes a photocurable adhesive material or a thermosetting adhesive material, and the material is not particularly limited.

Although not separately illustrated, the display device DD may further include a frame structure that supports the functional layers to maintain the state shown in FIGS. 1A to 2B. The frame structure may comprise a joint structure or a hinge structure.

As shown in FIG. 4, the organic light emitting display panel DP includes a base layer SUB, a first circuit layer CL1, a light emitting element layer ELL, and a thin film encapsulation layer disposed on the base layer SUB. (TFE). The base layer SUB may include at least one plastic film. The base layer SUB is a flexible substrate and may include a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic composite substrate.

The first circuit layer CL1 may include a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer. The plurality of conductive layers of the first circuit layer CL1 may constitute a circuit portion of signal lines or pixels. The light emitting device layer ELL includes organic light emitting diodes OLED. The thin film encapsulation layer TFE seals the light emitting device layer ELL. The thin film encapsulation layer TFE includes at least two inorganic thin films and an organic thin film disposed therebetween. The thin film encapsulation layer TFE may protect the light emitting device layer ELL from foreign substances such as moisture and dust particles.

In one embodiment of the present invention, the touch sensing member TS may be a single layer type. That is, the touch sensing member TS may include a single conductive layer. Here, the single conductive layer means "one conductive layer divided into insulating layers." The stacked structure of the first metal layer / second metal layer / metal oxide layer corresponds to a single conductive layer, and the first metal layer / insulation layer / metal oxide layer corresponds to a double conductive layer.

A single conductive layer is patterned to form a plurality of touch electrodes and a plurality of touch signal lines. That is, the sensors of the touch sensing member TS are disposed on the same layer. The sensors may be disposed directly on the thin film encapsulation layer (TFE). In addition, a portion of each of the touch signal lines is disposed on the same layer as the sensors. A portion of each of the touch signal lines may be disposed on the first circuit layer CL1. Detailed description of the structure of the touch sensing member TS will be described later.

The touch signal lines and sensors may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, and graphene. The touch signal lines and sensors may comprise a metal layer, such as molybdenum, silver, titanium, copper, aluminum, or alloys thereof. The touch signal lines and the sensors may include the same material or different materials.

The display module DM according to the present exemplary embodiment includes a single layer type touch sensing member, thereby simplifying a structure of the display module DM including the multilayer type touch sensing member. Even when the display module DM is bent as shown in FIGS. 1B and 1C, stress generated in the touch sensing member TS is reduced. This is because the touch sensing member TS is slim.

5 is a plan view of an organic light emitting display panel DP according to an embodiment of the present invention. 6 is an equivalent circuit diagram of a pixel PX according to an exemplary embodiment of the present invention. 7 and 8 are partial cross-sectional views of an organic light emitting display panel DP according to an embodiment of the present invention.

As illustrated in FIG. 5, the organic light emitting display panel DP includes a display area DA and a non-display area NDA on a plane. The display area DA and the non-display area NDA of the organic light emitting display panel DP correspond to the display area DD-DA and the non-display area DD-NDA of the display device DD, respectively. The display area DA and the non-display area NDA of the organic light emitting display panel DP are not necessarily the same as the display area DD-DA and the non-display area DD-NDA of the display device DD. The display panel may be changed according to the structure / design of the organic light emitting display panel DP.

The organic light emitting display panel DP includes a plurality of signal lines SGL and a plurality of pixels PX. An area in which the plurality of pixels PX is disposed is defined as the display area DA. In the present embodiment, the non-display area NDA may be defined along the edge of the display area DA.

The plurality of signal lines SGL includes gate lines GL, data lines DL, a power line PL, and a control signal line CSL. The gate lines GL are respectively connected to the corresponding pixels PX of the plurality of pixels PX, and the data lines DL are respectively connected to the corresponding pixels PX of the plurality of pixels PX. do. The power line PL is connected to the plurality of pixels PX. The gate driving circuit DCV to which the gate lines GL are connected may be disposed at one side of the non-display area NDA. The control signal line CSL may provide control signals to the gate driving circuit DCV.

Some of the gate lines GL, the data lines DL, the power line PL, and the control signal line CSL are disposed on the same layer, and some are disposed on the other layer. When signal lines disposed on any one of the gate lines GL, the data lines DL, the power line PL, and the control signal line CSL are defined as the first signal line, Signal lines arranged in the layer may be defined as second signal lines. Signal lines arranged on another layer may be defined as third signal lines.

Each of the gate lines GL, the data lines DL, the power line PL, and the control signal line CSL may include lower pads PD-D connected to a signal wiring portion and an end of the signal wiring portion. Can be. The signal line part may be defined as a portion excluding the lower pads PD-D of each of the gate lines GL, the data lines DL, the power line PL, and the control signal line CSL.

 In an embodiment, the lower pads PD-D may include a lower display panel pad PD-DPD and a lower touch sensing member pad PD-TSD. The lower pads PD-D may be formed in the same process as transistors for driving the pixels PX. For example, transistors for driving the lower pads PD-D and the pixels PX may be formed in the same Low Temperature Polycrystaline Silicon (LTPS) process or Low Temperature Polycrystalline Oxide (LTPO) process.

In one embodiment of the present invention, the display panel pads PD-DP may include a control pad CSL-P, a data pad DL-P, and a power pad PL-P. Although not illustrated, the gate pad part may overlap the gate driving circuit DCV and be connected to the gate driving circuit DCV. Although not otherwise indicated, a portion of the non-display area NDA in which the control pad CSL-P, the data pad DL-P, and the power pad PL-P are aligned is defined as a pad area. As described later, the pads of the touch sensing member TS may be disposed adjacent to the pads of the organic light emitting display panel DP.

FIG. 6 exemplarily illustrates a pixel PX connected to one gate line GL, one data line DL, and a power line PL. The configuration of the pixel PX is not limited thereto and may be modified.

The pixel PX includes an organic light emitting diode OLED as a display element. The organic light emitting diode OLED may be a top emission diode or a bottom emission diode. The pixel PX is a circuit part for driving the organic light emitting diode OLED and includes a first transistor TFT1 or a switching transistor, a second transistor TFT2 or a driving transistor, and a capacitor CP. The organic light emitting diode OLED generates light by an electrical signal provided from the transistors TFT1 and TFT2.

The first transistor TFT1 outputs a data signal applied to the data line DL in response to a scan signal applied to the gate line GL. The capacitor CP charges a voltage corresponding to the data signal received from the first transistor TFT1.

The second transistor TFT2 is connected to the organic light emitting diode OLED. The second transistor TFT2 controls the driving current flowing through the organic light emitting diode OLED in response to the amount of charge stored in the capacitor CP. The organic light emitting diode OLED emits light during the turn-on period of the second transistor TFT2.

FIG. 7 is a cross-sectional view of a portion corresponding to the first transistor TFT1 and the capacitor CP of the equivalent circuit shown in FIG. 6. FIG. 8 is a cross-sectional view of a portion corresponding to the second transistor TFT2 and the organic light emitting diode OLED of the equivalent circuit shown in FIG. 6.

As shown in FIGS. 7 and 8, the first circuit layer CL1 is disposed on the base layer SUB. The semiconductor pattern AL1 (hereinafter referred to as a first semiconductor pattern) of the first transistor TFT1 and the semiconductor pattern AL2 (hereinafter referred to as a second semiconductor pattern) of the second transistor TFT2 are disposed on the base layer SUB. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 may be identically or differently selected from amorphous silicon, polysilicon, and metal oxide semiconductors.

The first circuit layer CL1 includes a first conductive pattern CD1 (see FIG. 12) and organic / inorganic layers BR, BL, 12, 14, and 16. The first conductive pattern CD1 (see FIG. 12) may include a first transistor TFT1, a second transistor TFT2, and electrodes E1 and E2. The organic / inorganic layers BR, BL, 12, 14, and 16 may include the functional layers BR and BF, the first insulating layer 12, the second insulating layer 14, and the third insulating layer 16. It may include.

The functional layers BR and BF may be disposed on one surface of the base layer SUB. The functional layers BR and BF include at least one of the barrier layer BR and the buffer layer BF. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 may be disposed on the barrier layer BR or the buffer layer BF.

The first insulating layer 12 covering the first semiconductor pattern AL1 and the second semiconductor pattern AL2 is disposed on the base layer SUB. The first insulating layer 12 includes an organic layer and / or an inorganic layer. In particular, the first insulating layer 12 may include a plurality of inorganic thin films. The plurality of inorganic thin films may include a silicon nitride layer and a silicon oxide layer.

The control electrode GE1 (hereinafter, first control electrode) of the first transistor TFT1 and the control electrode GE2 (hereinafter, second control electrode) of the second transistor TFT2 are disposed on the first insulating layer 12. do. The first electrode E1 of the capacitor CP is disposed on the first insulating layer 12. The first control electrode GE1, the second control electrode GE2, and the first electrode E1 may be manufactured according to the same photolithography process as the gate lines GL (see FIG. 5). In other words, the first electrode E1 may be made of the same material as the gate lines GL, have the same stacked structure, and may be disposed on the same layer.

The second insulating layer 14 covering the first control electrode GE1, the second control electrode GE2, and the first electrode E1 is disposed on the first insulating layer 12. The second insulating layer 14 includes an organic layer and / or an inorganic layer. In particular, the second insulating layer 14 may include a plurality of inorganic thin films. The plurality of inorganic thin films may include a silicon nitride layer and a silicon oxide layer.

Data lines DL (see FIG. 5) may be disposed on the second insulating layer 14. An input electrode SE1 (hereinafter, referred to as a first input electrode) and an output electrode DE1 (hereinafter, referred to as a first output electrode) of the first transistor TFT1 are disposed on the second insulating layer 14. An input electrode SE2 (hereinafter, referred to as a second input electrode) and an output electrode DE2 (hereinafter, referred to as a second output electrode) of the second transistor TFT2 are disposed on the second insulating layer 14. The first input electrode SE1 is branched from a corresponding data line among the data lines DL. The power line PL (see FIG. 5) may be disposed on the same layer as the data lines DL. The second input electrode SE2 may be branched from the power line PL.

The second electrode E2 of the capacitor CP is disposed on the second insulating layer 14. The second electrode E2 may be manufactured according to the same photolithography process as the data lines DL and the power line PL, may be made of the same material, have the same stacked structure, and may be disposed on the same layer. have.

The first input electrode SE1 and the first output electrode DE1 pass through the first through hole CH1 and the second through hole CH2 that pass through the first insulating layer 12 and the second insulating layer 14. The first semiconductor pattern AL1 is connected to each other through the first semiconductor pattern AL1. The first output electrode DE1 may be electrically connected to the first electrode E1. For example, the first output electrode DE1 may be connected to the first electrode E1 through a through hole (not shown) passing through the second insulating layer 14. The second input electrode SE2 and the second output electrode DE2 form a third through hole CH3 and a fourth through hole CH4 that pass through the first insulating layer 12 and the second insulating layer 14. The second semiconductor pattern AL2 is connected to each other through the second semiconductor pattern AL2. Meanwhile, in another embodiment of the present invention, the first transistor TFT1 and the second transistor TFT2 may be modified by a bottom gate structure.

The third insulating layer 16 covering the first input electrode SE1, the first output electrode DE1, the second input electrode SE2, and the second output electrode DE2 on the second insulating layer 14. ) Is placed. The third insulating layer 16 includes an organic layer and / or an inorganic layer. In particular, the third insulating layer 16 may include an organic material to provide a flat surface.

Any one of the first insulating layer 12, the second insulating layer 14, and the third insulating layer 16 may be omitted depending on the circuit structure of the pixel. Each of the second insulating layer 14 and the third insulating layer 16 may be defined as an interlayer insulating layer. The interlayer insulating layer is disposed between the conductive pattern disposed below and the conductive pattern disposed above the insulating layer to insulate the conductive patterns.

The first circuit layer CL1 includes dummy conductive patterns. The dummy conductive patterns are disposed on the same layer as the semiconductor patterns AL1 and AL2, the control electrodes GE1 and GE2, or the output electrodes DE1 and DE2. The dummy conductive patterns may be disposed in the non-display area NDA (see FIG. 5). Detailed description of the dummy conductive patterns will be described later.

The light emitting device layer ELL is disposed on the third insulating layer 16. The pixel defining layer PXL and the organic light emitting diode OLED are disposed on the third insulating layer 16. The anode AE is disposed on the third insulating layer 16. The anode AE is connected to the second output electrode DE2 through the fifth through hole CH5 penetrating the third insulating layer 16. The opening OP is defined in the pixel definition layer PXL. The opening OP of the pixel definition layer PXL exposes at least a portion of the anode AE.

The light emitting device layer ELL includes a light emitting area PXA and a non-light emitting area NPXA adjacent to the light emitting area PXA. The non-light emitting area NPXA may surround the light emitting area PXA. In the present embodiment, the emission region PXA is defined to correspond to the anode AE. However, the light emitting area PXA is not limited thereto, and the light emitting area PXA is sufficient to be defined as a region where light is generated. The emission area PXA may be defined to correspond to a partial area of the anode AE exposed by the opening OP.

The hole control layer HCL may be disposed in common in the light emitting area PXA and the non-light emitting area NPXA. Although not separately illustrated, a common layer such as the hole control layer HCL may be commonly formed in the plurality of pixels PX (see FIG. 5).

 The organic emission layer EML is disposed on the hole control layer HCL. The organic emission layer EML may be disposed only in a region corresponding to the opening OP. That is, the organic emission layer EML may be formed separately from each of the plurality of pixels PX.

The electronic control layer ECL is disposed on the organic emission layer EML. The cathode CE is disposed on the electronic control layer ECL. The cathode CE is commonly disposed in the plurality of pixels PX.

In the present exemplary embodiment, the patterned organic emission layer EML is illustrated as an example, but the organic emission layer EML may be commonly disposed on the plurality of pixels PX. In this case, the organic light emitting layer EML may generate white light. In addition, the organic light emitting layer EML may have a multilayer structure.

In this embodiment, the thin film encapsulation layer TFE directly covers the cathode CE. In one embodiment of the present invention, a capping layer covering the cathode CE may be further disposed. In this case, the thin film encapsulation layer TFE directly covers the capping layer. The thin film encapsulation layer TFE may include an organic layer including an organic material and an inorganic layer including an inorganic material.

9 is a plan view of a touch sensing member TS according to an embodiment of the present invention.

In this embodiment, a one-layer capacitive touch sensing member TS is exemplarily illustrated. The method may be driven in a self capping manner, and a method of driving the touch sensing member TS for obtaining coordinate information is not particularly limited. In addition, the structure of the touch sensing member TS is not limited to a one-layer, but may be a two-layer structure.

The touch sensing member TS may include first touch patterns TE1-1 to TE1-3, first touch signal lines SL1, second touch patterns TE2-1 to TE2-2, and 2 may include touch signal lines SL2 and pads on the touch sensing member pads PD-U.

The first touch patterns TE1-1 to TE1-3 extend in the first direction DR1 and are arranged in the second direction DR2. Each of the first touch patterns TE1-1 to TE1-3 may have a mesh shape in which a plurality of touch openings OP-TC are defined.

Each of the first touch patterns TE1-1 to TE1-3 includes a plurality of first sensing patterns SP1 and a plurality of first connection patterns CP1. The first sensing patterns SP1 are arranged in the first direction DR1. Each of the first connection patterns CP1 connects two adjacent first sensing patterns SP1 among the first sensing patterns SP1.

The first touch signal lines SL1 may also have a mesh shape. The first touch signal lines SL may have the same layer structure as the first touch patterns TE1-1 to TE1-3.

The second touch patterns TE2-1 to TE2-3 cross the first touch patterns TE1-1 to TE1-3. The second touch patterns TE2-1 to TE2-3 may be insulated from the first touch patterns TE1-1 to TE1-3 by the insulating patterns IL-P. The insulation patterns IL-P may include an inorganic material or an organic material. The inorganic material may include silicon oxide or silicon nitride. The organic material may include at least one of acrylic resin, methacryl resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, and perylene resin.

Each of the second touch patterns TE2-1 to TE2-3 may have a mesh shape in which a plurality of touch openings OP-TC are defined.

Each of the second touch patterns TE2-1 to TE2-3 includes a plurality of second sensing patterns SP2 and a plurality of second connection patterns CP2. The second sensing patterns SP2 are arranged in the second direction DR2. Each of the second connection patterns CP2 connects two second sensing patterns SP2 adjacent to the second sensing patterns SP2.

The second connection patterns CP2 have a bridge function. The insulating patterns IL-P are disposed on the first connection patterns CP1, and the second connection patterns CP2 are disposed on the insulating patterns IL-P.

The second touch signal lines SL2-1 to SL2-3 may also have a mesh shape. The second touch signal lines SL2-1 to SL2-3 may have the same layer structure as the second touch patterns TE2-1 to TE2-3.

The first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 are electrostatically coupled. As touch sensing signals are applied to the first touch patterns TE1-1 to TE1-3, capacitors are formed between the first sensing patterns SP1 and the second sensing patterns SP2.

In the present invention, the shapes of the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 are only an example and are not limited thereto. The connection patterns CP1 and CP2 may be defined as portions in which the first touch patterns TE1-1 through TE1-3 and the second touch patterns TE2-1 through TE2-3 intersect, and the sensing pattern The ones SP1 and SP2 are sufficient to be defined as non-overlapping portions of the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3. For example, each of the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 may have a bar shape having a predetermined width.

The pads PD-U on the touch sensing member pads may be disposed at ends of the first touch signal lines SL1 and the second touch signal lines SL2. The upper pads PD-U may include an upper display panel pad PD-DPU and an upper touch sensing member pad PD-TSU. The upper pads PD-U may include first touch patterns TE1-1 to TE1-3, first touch signal lines SL1, second touch patterns TE2-1 to TE2-2, and The second touch signal lines SL2 may be formed in the same process.

FIG. 10 is an enlarged view of AA of FIG. 9. FIG. 11 is a cross-sectional view taken along line II ′ of FIG. 10.

The display area DA includes a plurality of light emitting areas PXA and a non-light emitting area NPXA surrounding the plurality of light emitting areas PXA. The first sensing patterns SP1 may have a mesh shape overlapping the non-light emitting area NPXA. Although not separately illustrated, the second sensing patterns SP2 and the touch signal lines SL1 and SL2 may also have a mesh shape overlapping the non-light emitting area NPXA.

The first sensing pattern SP1 includes a plurality of vertical portions SP1 -C extending in the first direction DR1 and a plurality of horizontal portions SP1 -L extending in the second direction DR2. . The plurality of vertical parts SP1 -C and the plurality of horizontal parts SP1-L may be defined as mesh lines. The line width of the mesh line may be several microns.

The plurality of vertical portions SP1 -C and the plurality of horizontal portions SP1 -L are connected to each other to form a plurality of touch openings TS-OP. Although the touch openings TS-OP correspond to the emission areas PXA in one-to-one correspondence, the touch openings TS-OP are not limited thereto. One touch opening TS-OP may correspond to two or more light emitting regions PXA. 10 and 11 illustrate mesh lines exposed to the outside, the display module DM (see FIG. 4) may further include an insulating layer disposed on the thin film encapsulation layer TFE to cover the mesh lines.

FIG. 12 illustrates the display panel pads PD-DP of FIG. 5 and the touch sensing member pads PD-TS of FIG. 9. The display module DM may be divided into an active area AR-ACV, a pad area AR-PD, and a boundary area AR-BD between the active area AR-ACV and the pad area AR-PD. Can be.

In the active area AR-ACV, the display module DM includes the first conductive pattern CD1. In the pad area AR-PD, the display module DM includes a second conductive pattern CD2. In the boundary area AR-BD, the display module DM includes a third conductive pattern CD3. The first to third conductive patterns CD1 to CD3 are patterns for conducting electrical signals for driving the display panel DP or the touch sensing member TS, respectively, and may include metal.

The display panel pads PD-DP and the touch sensing member pads PD-TS may be adjacent to each other. In addition, the display panel pads PD-DP and the touch sensing member pads PD-TS may be arranged side by side. However, the present invention is not limited thereto, and the separation distances of the display panel pads PD-DP and the touch sensing member pads PD-TS may be changed as necessary and may not be disposed side by side.

FIG. 13A illustrates a cross section taken along line II-II ′ of FIG. 12. FIG. 13B is a cross-sectional view taken along line III-III ′ of FIG. 12. FIG. 13C illustrates a cross section taken along line IV-IV ′ of FIG. 12. 13A-13C illustrate one embodiment of the present invention.

Touch sensing member pad Touch sensing member pad Touch sensing member pad Referring to FIG. 13A, the base layer SUB may include an active region AR-ACV, a pad region AR-PD, and an active region AR-ACV. The boundary area AR-BD between the areas AR-PD is included.

In an exemplary embodiment, the active area AR-ACV, the pad area AR-PD, and the boundary area AR-BD are based on the display panel DP, and the active area AR-ACV emits light. The pad region AR-PD includes a display panel pads PD-DP and touch sensing member pads PD-TS that receive a signal from a printed circuit board. The boundary area AR-BD may be an area between the active area AR-ACV and the pad area AR-PD.

Circuit layers CL1 and CL2 are disposed on the base layer SUB. The circuit layers CL1 and CL2 include a first circuit layer CL1 and a second circuit layer CL2. The first circuit layer CL1 is disposed on the active region AR-ACV of the base layer SUB. The second circuit layer CL2 is disposed on the pad area AR-PD of the base layer SUB.

The light emitting element layer ELL and the thin film encapsulation layer TFE are disposed on the first circuit layer CL1. The first circuit layer CL1 and the second circuit layer CL2 may include functional layers BR and BF, respectively. For convenience, those included in the first circuit layer CL1 among the functional layers BR and BF may be referred to as first functional layers, and those included in the second circuit layer CL2 may be referred to as second functional layers.

Since the first circuit layer CL1, the light emitting device layer ELL, and the thin film encapsulation layer TFE have been described with reference to FIGS. 7 and 8, a detailed description thereof will be omitted.

The touch sensing member TS may be disposed on the thin film encapsulation layer TFE. The touch sensing member TS includes a touch inorganic layer IL-T, an insulation pattern IL-P, a plurality of touch electrodes, and a touch protective layer PVX on a cross section. The touch inorganic layer IL-T and the insulation pattern IL-P may each include an inorganic material. The touch protection layer PVX may include an organic material.

Referring to FIG. 9, the plurality of touch electrodes may include first touch patterns TE1-1 to TE1-3, first touch signal lines SL1, and second touch patterns TE2-1 to TE2-2. Second touch signal lines SL2 may be formed.

The second circuit layer CL2 may include a second conductive pattern CD2 (see FIG. 12) and organic / inorganic layers BR, BL, 12, 14, and 16. The second conductive pattern CD2 may include the display panel pad PD-DP and the touch sensing member pad PD-TS. The organic / inorganic layers BR, BL, 12, 14, and 16 may include the second functional layer BR and BF, the first insulating layer 12, the second insulating layer 14, and the third insulating layer 16. ) May be included.

The display panel pad PD-DP may be disposed on the second functional layer and electrically connected to the first circuit layer CL1. At least one of the first insulating layer 12 and the second insulating layer 14 may be disposed between the display panel pad PD-DP and the second functional layer.

The display panel pad PD-DP may include a lower display panel pad PD-DPD and an upper display panel pad PD-DPU. The lower display panel pad PD-DPD is electrically connected to the first conductive pattern CD1 by the third conductive pattern CD3. The upper display panel pad PD-DPU is disposed on the lower display panel pad PD-DPD and electrically connected to the lower display panel pad PD-DPD. Therefore, an electrical signal applied to the upper display panel pad PD-DPU is applied to the first conductive pattern CD1 of the first circuit layer CL1 through the lower display panel pad PD-DPD.

The boundary layer BDL is disposed on the boundary area AR-BD of the base layer SUB. The boundary layer BDL may include the organic layer OG and the third conductive pattern CD3. The organic layer OG contacts the base layer SUB, and the organic layer OG may be disposed between the first circuit layer CL1 and the second circuit layer CL2. More specifically, the organic layer OG may be disposed between the first functional layer and the second functional layer.

The boundary layer BDL does not include an inorganic layer including an inorganic material unlike the adjacent first circuit layer CL1 and the second circuit layer CL2. Accordingly, the flexibility of the boundary layer BDL is improved, and a portion of the display panel DP overlapping the boundary area AR-BD can be bent.

An organic layer may be further disposed on the third conductive pattern CD3. The organic layer disposed on the third conductive pattern CD3 may be formed in a process such as the third insulating layer 16 or the pixel definition layer PXL.

The third conductive pattern CD3 may be formed in the same process as the lower display panel pad PD-DPD. However, the present invention is not limited thereto, and the third conductive pattern CD3 may be electrically connected to the lower display panel pad PD-DPD formed through a separate process.

Referring to FIG. 13B, unlike in FIG. 13A, the touch signal line SL2 of the touch sensing member TS is electrically connected to the third conductive pattern CD3 in the active region AR-ACV. In the pad area AR-PD, the third conductive pattern CD3 is electrically connected to the upper touch sensing member pad PD-TSU. In this case, the third conductive pattern CD3 may be electrically insulated from the lower touch sensing member pad PD-TSD.

9 and 13B, the touch sensing member TS may include first touch patterns TE1-1 to TE1-3 and second touch patterns TE2-1 disposed in the active area AR-ACV. To TE2-2), the touch sensing member pad PD-TS disposed in the pad area AR-PD, and the touch patterns TE1-1 to TE1-3 and TE2-1 to TE2-2 and touch sensing. The touch signal lines SL1 and SL2 electrically connect the member pads PD-TS.

The touch sensing member pad PD-TS may include a lower touch sensing member pad PD-TSD and an upper touch sensing member pad PD-TSU. The upper touch sensing member pad PD-TSU is connected to the touch patterns TE1-1 through TE1-3 and TE2-1 through TE2-2 by the touch signal lines SL1 and SL2 and the third conductive pattern CD3. Electrically connected. That is, the upper touch sensing member pad PD-TSU is electrically connected to the sensing patterns SP1 by the touch signal lines SL1 and SL2 and the third conductive pattern CD3.

The lower touch sensing member pad PD-TSD may be electrically insulated from the upper touch sensing member pad PD-TSU. However, the present invention is not limited thereto, and in another exemplary embodiment, the lower touch sensing member pad PD-TSD may be electrically connected to the upper touch sensing member pad PD-TSU.

The upper touch sensing member pad PD-TSU is disposed on the lower touch sensing member pad PD-TSD. The height of the upper touch sensing member pad PD-TSU may be increased by the thickness of the lower touch sensing member pad PD-TSD.

Unlike the third conductive pattern CD3 of FIG. 13, the third conductive pattern CD3 in FIG. 13B is not electrically connected to the first conductive pattern CD1. However, the present invention is not limited thereto, and the third conductive pattern CD3 and the first conductive pattern CD1 of FIG. 14 may be electrically connected as necessary.

In FIG. 13B, descriptions of other components are substantially the same as those described in FIG. 13A, and thus the descriptions thereof will be omitted.

The length HH1 measured from the base layer SUB to the upper display panel pad PD-DPU is substantially the same as the length HH2 measured from the base layer SUB to the upper touch sensing member pad PD-TSU. Do.

Although not shown, in another embodiment of the present invention, at least one of the touch inorganic layer IL-T and the insulating patterns IL-P may also be disposed in the boundary area AR-BD. That is, in this case, at least one of the touch inorganic layer IL-T and the insulating patterns IL-P may be disposed in the active area AR-ACV, the pad area AR-PD, and the boundary area AR-BD. It is placed throughout.

Referring to FIG. 13C, the upper display panel pad PD-DPU and the upper touch sensing member pad PD-TSU are disposed on the same layer. The upper display panel pad PD-DPU may be electrically connected to the lower display panel pad PD-DPD through the sixth through hole CH6. Although not shown, a dummy electrode may be disposed on the first insulating layer 12.

Therefore, in the process of attaching the printed circuit board to the display panel pad PD-DP and the touch sensing member pad PD-TS, the height of the display panel pad PD-DP and the touch sensing member pad PD-TS is high. The pressure applied to the pads PD-DP and PD-TS is made constant by the difference. As a result, defects occurring in the process of attaching the printed circuit board can be prevented. In addition, durability of the stress applied from the outside may be improved according to an operation process of the flexible display device DD.

14A is a cross-sectional view taken along line II-II ′ of FIG. 12. 14B is a cross-sectional view taken along line III-III ′ of FIG. 12. 14C and 14D show cross sections taken along the line IV-IV ′ of FIG. 12, respectively. 14A-14D illustrate one embodiment of the present invention.

The description of FIG. 14A is substantially the same as the description of FIG. 13A, and thus will be omitted.

14B and 14C, the upper touch sensing member pad PD-TSU may be electrically connected to the lower touch sensing member pad PD-TSD and the seventh through hole CH7.

14D illustrates that the widths of the sixth through hole CH6 and the seventh through hole CH7 are larger than those of FIG. 14C, and thus the structures of the display panel pad PD-DP and the touch sensing member pad PD-TS are modified. It is shown.

The descriptions of other components are substantially the same as those described with reference to FIGS. 13A to 13C, and thus the descriptions thereof will be omitted.

15A is a cross-sectional view taken along line II-II ′ of FIG. 12. FIG. 15B is a cross-sectional view taken along line III-III ′ of FIG. 12. 15C is a cross-sectional view taken along line IV-IV ′ of FIG. 12. 15A-15C illustrate one embodiment of the present invention.

15A and 15C, the upper display panel pad PD-DPU contacts the lower display panel pad PD-DPD. 15B and 15C, the upper touch sensing member pad PD-TSU contacts the lower touch sensing member pad PD-TSD.

The descriptions of other components are substantially the same as those described with reference to FIGS. 13A to 13C, and thus the descriptions thereof will be omitted.

FIG. 16A illustrates a cross section taken along line II-II ′ of FIG. 12. 16B is a cross-sectional view taken along line III-III ′ of FIG. 12. FIG. 16C illustrates a cross section taken along line IV-IV ′ of FIG. 12. 16A-16C illustrate one embodiment of the present invention.

Unlike the third conductive pattern CD3 described above, the third conductive pattern CD3 shown in FIGS. 16A and 16B may be the first conductive pattern through the electrodes GE3 formed in the same process as the control electrodes GE1 and GE2. Is electrically connected to (CDP1).

In addition, descriptions of other components in FIGS. 16A and 16C are substantially the same as those described with reference to FIGS. 13A and 13B, and thus the descriptions thereof will be omitted. The description of FIG. 16C is substantially the same as the description of FIG. 13C, and thus will be omitted.

17A is a cross-sectional view taken along line II-II ′ of FIG. 12. FIG. 17B illustrates a cross section taken along line III-III ′ of FIG. 12. 17C and 17D illustrate a cross section taken along line IV-IV ′ of FIG. 12. 17A-17D illustrate one embodiment of the present invention.

17A and 17B, the third conductive pattern CD3 is electrically connected to the first conductive pattern CD1 through the electrode GE3 formed in the same process as the control electrodes GE1 and GE2.

The descriptions of the other elements shown in FIGS. 17A and 17B are substantially the same as those described with reference to FIGS. 14A and 14B, and thus will be omitted. The description of FIGS. 17C and 17D is substantially the same as the description of FIGS. 14C and 14D, and thus will be omitted.

18A is a cross-sectional view taken along line II-II ′ of FIG. 12. 18B is a cross-sectional view taken along line III-III ′ of FIG. 12. FIG. 18C illustrates a cross section taken along line IV-IV ′ of FIG. 12. 18A-18C illustrate one embodiment of the present invention.

The third conductive pattern CD3 shown in FIGS. 18A and 18B is electrically connected to the first conductive pattern CD1 through the electrode GE3 formed in the same process as the control electrodes GE1 and GE2.

The descriptions of the other elements shown in FIGS. 18A and 18B are substantially the same as those described with reference to FIGS. 15A and 15B, and thus will be omitted. The description of FIG. 18C is substantially the same as the description of FIG. 15C, and thus will be omitted.

19A is a cross-sectional view taken along line II-II ′ of FIG. 12. 19B is a cross-sectional view taken along line III-III ′ of FIG. 12. 19C is a cross-sectional view taken along line IV-IV ′ of FIG. 12. 19A-19C illustrate one embodiment of the present invention.

19A and 19C, the display panel pad PD-DP has a single layer structure. 19B and 19C, the touch sensing member pad PD-TS has a single layer structure.

The descriptions of other components are substantially the same as those described with reference to FIGS. 13A to 13C, and thus the descriptions thereof will be omitted.

FIG. 20A illustrates a cross section taken along line II-II ′ of FIG. 12. 20B is a cross-sectional view taken along line III-III ′ of FIG. 12. 20C is a cross-sectional view taken along line IV-IV ′ of FIG. 12. 20A-20C illustrate one embodiment of the present invention.

20A and 20C, the display panel pad PD-DP has a single layer structure. 20B and 20C, the touch sensing member pad PD-TS has a single layer structure.

Descriptions of other components are substantially the same as those described with reference to FIGS. 20A to 20C, and thus the descriptions thereof will be omitted.

As shown in FIGS. 19A to 19C and 20A to 20C, the display panel pad PD-DP and the touch sensing member pad PD-TS are formed at the same height as a single layer structure to be generated in the manufacturing process. It can reduce the possible defects.

FIG. 21A illustrates a cross section taken along line II-II ′ of FIG. 12. FIG. 21B illustrates a cross section taken along line III-III ′ of FIG. 12. FIG. 21C illustrates a cross section taken along line IV-IV ′ of FIG. 12. 21A-21C illustrate one embodiment of the present invention.

The second conductive pattern CD2 may include a dummy electrode ET-D, a display panel pad PD-DP, and a touch sensing member pad PD-TS.

The dummy electrode ET-D may include the same material as the control electrode GE2 of the first circuit layer CL1. The dummy electrode ET-D may be formed by the same process as the control electrode GE2. The dummy electrode ET-D is insulated from other electrodes, and serves to adjust the height of the display panel pad PD-DP in the pad region AR-PD.

Descriptions of other components are substantially the same as those described with reference to FIGS. 13A through 13B, and thus the descriptions thereof will be omitted.

Touch sensing member pad touch sensing member pad touch sensing member pad touch sensing member pad touch sensing member pad touch sensing member pad touch sensing member pad

22 and 23 illustrate a display module DM and a printed circuit board PCB and PBC-1 according to an embodiment of the present invention, respectively.

Referring to FIG. 22, the pads PD-TS and PD-DP of the display module DM are electrically connected to the pads PD-PCB of the printed circuit board PCB. An integrated circuit DIC may be disposed on a printed circuit board PCB. The integrated circuit (DIC) may be formed by a chip on flexible printed circuit (COF) method. The integrated circuit DIC may transmit / receive the display module DM and data information through the pads PD-PCB, PD-TS, and PD-DP.

Referring to FIG. 23, the integrated circuit DIC-1 may be disposed on the pad area AR-PD of the display module DM. In this case, the integrated circuit DIC-1 may be formed by a chip on plastic (COP) method.

In FIG. 23, although the touch signal lines SL1 and SL2 are not connected to the integrated circuit DIC-1, the touch signal lines SL1 and SL2 are not limited thereto. In an embodiment, the touch signal lines SL1 and SL2 may have a structure connected to the integrated circuit DIC-1.

24 is a view illustrating a bent shape of the display module DM according to an exemplary embodiment of the present invention. Referring to FIG. 24, the display module DM may be bent based on the boundary area AR-BD. As described above, since the boundary area AR-BD of the display module DM includes only the organic material layer without the inorganic material layer, the boundary area AR-BD may have sufficient flexibility to bend.

Although described with reference to the embodiments, those skilled in the art can understand that the present invention can be variously modified and changed without departing from the spirit and scope of the invention described in the claims below. There will be. In addition, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, and all technical ideas within the scope of the following claims and equivalents thereof should be interpreted as being included in the scope of the present invention. .

DD: flexible display DM: display module
DP: organic light emitting display panel TS: touch sensing member
AR-ACV: Active Area AR-BD: Border Area
AR-PD: Pad Region CL1: First Circuit Layer
CL2: second circuit layer

Claims (18)

A display panel including a base layer, a circuit layer disposed on the base layer, a display element layer disposed on the circuit layer, and an encapsulation layer disposed on the display element layer; And
A touch sensing member formed on the encapsulation layer, the touch sensing member including a conductive pattern and a first insulating layer disposed on the encapsulation layer and overlapping the conductive pattern;
The circuit layer,
A first lower pad electrically connected to the display element layer and disposed on the base layer;
A second lower pad spaced apart from the first lower pad in a plane and disposed on the base layer;
A first upper pad disposed on the first lower pad;
A second upper pad electrically connected to the conductive pattern and disposed on the second lower pad; And
A second insulating layer disposed between the first lower pad and the first upper pad and between the second lower pad and the second upper pad,
The first upper pad is electrically connected to the first lower pad. According to claim 1,
The first lower pad is electrically connected to the first upper pad through a first contact hole defined in the second insulating layer.
And the second lower pad is electrically connected to the second upper pad through a second contact hole defined in the second insulating layer. According to claim 1,
The first lower pad and the second lower pad are disposed on the same layer, and the first upper pad and the second upper pad are disposed on the same layer. According to claim 1,
And the second lower pad is a floating electrode. According to claim 1,
The first insulating layer and the second insulating layer are disposed on the encapsulation layer and the base layer by the same process. The method of claim 5,
The first insulating layer and the second insulating layer has a unitary shape. The method of claim 5,
The first upper pad and the second upper pad are disposed on the second insulating layer by the same process as the conductive pattern. According to claim 1,
And a separation distance between the base layer and the first upper pad and a distance between the base layer and the second upper pad in the thickness direction of the display panel. According to claim 1,
The display panel defines a display area and a pad area,
The first lower pad, the second lower pad, the first upper pad, and the second upper pad overlap the pad area. The method of claim 9,
The base layer further defines a bending area overlapping between the display area and the pad area and bent along a bending axis.
The first insulating layer and the second insulating layer are non-overlapping in the bending area. The method of claim 10,
The circuit layer further includes an organic layer overlapping the banding region and disposed on the base layer,
The organic layer is directly disposed on the base layer. According to claim 1,
The display panel further includes a driving chip electrically connected to the circuit layer and disposed on the base layer.
The driving chip is non-overlapping on each of the first lower pad, the second lower pad, the first upper pad, and the second upper pad. According to claim 1,
The first insulating layer includes a plurality of sub insulating layers,
And a second insulating layer on the base layer by the same process as any one of the sub insulating layers. According to claim 1,
The circuit layer further includes a transistor disposed on the base layer and including a source, a second electrode, and a control electrode.
The first electrode, the second electrode, the first lower pad, and the second lower pad are disposed on the same layer. According to claim 1,
The touch sensing member further includes a sensing signal line electrically connecting the second upper pad and the conductive pattern. A display panel including a base layer, a plurality of pads disposed on the base layer, a driving chip disposed on the base layer, a light emitting element disposed on the base layer, and an encapsulation layer encapsulating the light emitting element; And
A touch sensing member formed on the encapsulation layer and including a conductive pattern and an insulating layer overlapping the conductive pattern and disposed on the encapsulation layer,
The plurality of pads may be arranged along one direction, and include touch sensing member pads spaced apart from one direction with display panel pads and the display panel pads interposed therebetween.
Each of the display panel pads may include a first lower pad disposed on the base layer and a first upper pad disposed on the first lower pad.
Each of the touch sensing member pads includes a second lower pad spaced apart from the first lower pad in a plane, and a second upper pad disposed on the second lower pad.
The insulating layer is disposed between the first lower pad and the first upper pad and between the second lower pad and the second upper pad, wherein the first upper pad is electrically connected to the first lower pad. Device. The method of claim 16,
A circuit board electrically connected to the pads;
And the circuit board is connected to the display panel pads and the touch sensing member pads by the same process. The method of claim 16,
The display panel defines a display area overlapping the light emitting device and a pad area overlapping the pads and the driving chip.
The driving chip is closer to the display area than the pads.

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