KR20190083577A - Shield-layer of nanocable and manufacturing method thereof - Google Patents

Abstract

The present invention relates to an ultrafine cable. The ultrafine cable comprises: a core comprising one or more first conductor lines; an insulating layer covering the outer surface of the core; a second conductor layer covering the outer surface of the insulating layer; and a shield layer covering the surface of the second conductor layer. The shield layer includes a nanocarbon coating layer of 2 to 10μmthickness and an electroplating layer of 10 to 20μmthickness formed on the nanocarbon coating layer. According to the present invention, the electrical resistance characteristic is further improved.

Description

[0001] SHIELD-LAYER OF NANOCABLE AND MANUFACTURING METHOD THEREOF [0002]

The present invention relates to an ultrafine cable shield layer and a method of manufacturing the same.

2. Description of the Related Art Recently, miniaturization of medical devices such as endoscopes or portable multimedia devices has been progressing, and studies for miniaturization of cables and performance improvement of cables for driving them have been progressing actively. For example, Korean Patent No. 10-0910431 for a micro-coaxial cable having a diameter of 1 mm or less includes a center conductor made of two or more extra fine metal wires; An insulating layer surrounding the central conductor; A metal shielding layer surrounding the insulating layer in a transverse direction by two or more metal wires of a square shape; And a sheath surrounding the metal shielding layer; And the metal wire constituting the metal shielding layer is formed in a flat shape to reduce the thickness of the metal shielding layer, whereby the final wire diameter of the cable (the final wire diameter refers to the diameter of the cable including all of the center conductor and the insulating layer Quot; means the entire particle diameter).

On the other hand, due to the recent miniaturization of electronic devices and the like, the need for a cable having a final diameter of a few microns to several hundreds of micrometers and a diameter of a core of a core (center conductor) is increased as compared with a cable having a final final wire diameter of less than several millimeters In general, when the thickness of the conductive wire is reduced, there is a problem of performance deterioration in which the resistance is increased and the current intensity is decreased. Therefore, there is a limit in applying a cable having a thickness of several 탆 to several hundred 탆 to various application fields. Korean Patent No. 10-0910431 does not provide a solution for preventing the decrease in current intensity due to the increase in resistance due to the miniaturization of the cable, merely considering the shielding characteristic of the metal shielding layer.

On the other hand, carbon nanotubes have a wide range of conductivity, uniform and linear conductivity of 10 to 10 ⁷ Ω / □, excellent transparency and low reflectance, excellent physical properties such as excellent adhesion, durability, abrasion resistance and flexibility (10 Ω / □) to a very large number of sheet resistances (10 ⁷ Ω / □) as described above, and in particular, it is a nanomaterial that has been widely used in the form of a filler or the like when forming a transparent conductive film for an electrode material. ), It is possible to adjust the sheet resistance according to the application. Such carbon nanotubes may have affinity with polymers, for example, polyethylene terephthalate (PET), epoxy, polycarbonate, polyethylene glycol, polymethyl methacrylate, polyvinyl alcohol, etc. Sertan Yesil (Polymer Engineering & Science, Volume 51, Issue 7, Article first published online: 11 FEB 2011).

However, carbon nanotubes have a problem in that it is technically difficult to make the length of the cable in the form of a cable, and the process is complicated, so that it is difficult to apply the carbon nanotube to a conductor used in a conventional coaxial cable, despite the excellent physical and electrical properties as described above.

The present invention provides a method of manufacturing a semiconductor device comprising a core including a first conductor wire as a first conductor, an insulating layer on the core, a second conductor layer including a carbon nanotube as a second conductor on the insulating layer, layer structure including a nano-carbon coating layer formed of a nano-carbon material dispersion solution and an electrolytic plating layer formed by using an electrolytic plating method as the shield layer in the ultra-fine cable composed of a shield layer, And to provide a microfabricated cable having improved electric resistance characteristics and a method of manufacturing the same.

A core comprising at least one first conductor wire; An insulating layer covering the outer surface of the core; A second conductor layer covering an outer surface of the insulating layer; And a shield layer covering a surface of the second conductor layer; Wherein the shield layer comprises a nanocarbon coating layer having a thickness of 2 to 10 mu m and an electroplating layer having a thickness of 10 to 20 mu m formed on the nanocarbon coating layer.

Also disclosed herein is a method comprising: a) coating a core comprising at least one first conductor wire with an insulating layer; b) passing a core coated with an insulating layer through a second conductor-containing solution to form a second conductor layer on the outer surface of the insulating layer; c) passing the core having the second conductor layer formed thereon through a nano-carbon material dispersion solution to form a nano-carbon coating layer on the second conductor layer; And d) electroplating the core formed with the nano-carbon coating layer with an electrolytic plating solution to form an electroplating layer on the nano-carbon coating layer; The method comprising the steps of:

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a microfabricated cable according to a specific embodiment of the present invention will be described in detail.

Micro cable

As described above, according to one embodiment of the present invention, a core comprising at least one first conductor wire; An insulating layer covering the outer surface of the core; A second conductor layer covering an outer surface of the insulating layer; And a shield layer covering the surface of the second conductor layer, wherein the shield layer includes a nano-carbon coating layer having a thickness of 2 to 10 mu m and an electrolytic plating layer having a thickness of 10 to 20 mu m formed on the nano- , Ultrafine cable can be provided.

The present inventors have found that when a shield layer is composed of a nano carbon coating layer having a thickness of 2 to 10 μm and an electrolytic plating layer having a thickness of 10 to 20 μm formed on the nano carbon coating layer in the ultrafine cable, The present invention solves the problem of decreasing the current intensity and further improves the electric resistance characteristic through experiments.

First, the core may be formed by twisting a first conductor line or a plurality of first conductor lines. It is to be understood that the terms " first "or" second "used in the specification and claims throughout the specification are to be construed in an arbitrary order for the sake of clarity.

The first conductor wire according to an embodiment of the present invention constituting the core may be formed of at least one selected from the group consisting of copper, sodium, aluminum, magnesium, iron, nickel, cobalt, chromium, manganese, indium, tin, cadmium, , Platinum, and silver. Specifically, the first conductor wire may be an alloy using copper or copper.

On the other hand, the core having a diameter in the range of 0.01 to 1,000 占 퐉 may be used, but is not particularly limited. However, if it exceeds the range of 1,000 μm, ultrafine cable formation may be difficult. For example, it may be within the range of 0.1 mu m to 100 mu m.

Next, the insulating layer covering the outer surface of the core may be provided to increase the bonding force between the core and the second conductor layer described later. Specifically, the insulating layer material may include at least one selected from the group consisting of polyethylene terephthalate (PET), polyethylene, and polypropylene, but those commonly used in the art may be employed if necessary.

On the other hand, if the thickness of the insulating layer exceeds 100 탆, it may be difficult to form an ultrafine cable. If the thickness of the insulating layer is less than the above range, The electrical reliability may be lowered as the current decreases or the dielectric breakdown strength decreases.

Next, it is preferable that the second conductor layer covering the outer surface of the insulating layer is formed to include carbon nanotubes or graphene.

Graphene is a thin film-like nanomaterial in which six-ring carbon is repeatedly arranged in a honeycomb shape. It may be a single-layer graphene or a graphene sheet of about 50 or less layers laminated, To adjust the thickness of the second conductor layer. Further, in the case of graphene, transparency, conductivity, oxygen shielding effect and the like may be affected depending on the number of layers.

Carbon nanotubes are carbon isotopes of graphene, which can be seen as graphene cylindrically rolled, but in reality they are spirally twisted and are completely different from graphene nanomaterials. In the present invention, the carbon nanotubes may include a carbon nanotube network self-assembled on the outer surface of the insulating layer, but the present invention is not limited thereto.

Meanwhile, when the second conductor layer is a carbon nanotube or graphene, the carbon nanotube or graphene may be surface-modified. Specifically, the surface modification may be carried out by using a surface modification agent such as a hydroxyl group, a carboxyl group, a halogen group, an amino group, an amine group, an amide group, a thiol group, a nitro group, a ketone group, a sulfonic acid group, a phosphoric acid group, ), Polyethylene glycol (PEG), diglycidyl ether of bisphenol A (DGEBA), polyvinylpyrrolidone, polyaniline, polyacrylic acid and poly (4-styrenesulfonate) .

On the other hand, the second conductor layer may have a thickness of about 2 nm to 20 μm, and if it exceeds the thickness range, transparency, conductivity, oxygen shielding effect, and the like may be lowered.

Next, the ultrafine cable according to an embodiment of the present invention includes a shield layer covering the surface of the second conductor layer. Specifically, the shield layer includes a nano-carbon coating layer having a thickness of 2 to 10 탆, And an electroplating layer having a thickness of 10 to 20 占 퐉.

According to the prior art, it is known that a superfine cable includes a shield layer covering the outer surface of the second conductor layer and a jacket formed outside the shield layer, but the structure and material of the shield layer are specifically The present inventors have not specifically recognized that the problem of reducing the current intensity due to the increase in resistance due to the miniaturization of the wire diameter can be solved and the electrical resistance characteristic can be further improved by designing the shield layer structure and materials I did not.

However, according to the present invention, when the shield layer is composed of a two-layer structure of a nano carbon coating layer having a thickness of 2 to 10 μm and an electrolytic plating layer having a thickness of 10 to 20 μm formed on the nano carbon coating layer, Properties can be implemented.

Meanwhile, the outer diameter of the ultrafine cable according to an embodiment of the present invention having the above-described structure may be 140 to 180 탆.

How to make ultra-fine cable

According to another embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: a) coating a core comprising at least one first conductor line with an insulating layer; b) passing a core coated with an insulating layer through a second conductor-containing solution to form a second conductor layer on the outer surface of the insulating layer; c) passing the core having the second conductor layer formed thereon through a nano-carbon material dispersion solution to form a nano-carbon coating layer on the second conductor layer; And d) electroplating the core formed with the nano-carbon coating layer with an electrolytic plating solution to form an electroplating layer on the nano-carbon coating layer; The method comprising the steps of:

First, a core comprising at least one first conductor line is coated with an insulating layer (step a).

The first conductor line is as described above, and the core may be formed by stranding a plurality of first conductor wires, for example. On the other hand, the diameter of the core is as described above.

On the other hand, the insulation layer coating process can be performed by passing a core containing the first conductor line through the polymer-containing solution. Specifically, the core may be immersed several times in a reaction vessel containing a polymer-containing solution to form an insulating layer on the outer surface of the core. The polymer-containing solution includes a polymer and a solvent, The polymer in the solution may vary depending on the purpose of the insulating layer material, as described above. For example, the polymer may be at least one selected from the group consisting of polyethyleneterephthalate (PET), polyethylene, and polypropylene. On the other hand, the temperature of the polymer-containing solution can be specifically selected in consideration of the melting point of the polymer. Specifically, the temperature of the solution may be in the range of 150 to 400, but is not particularly limited.

Meanwhile, the thickness of the insulating layer formed through the insulating layer covering process is as described above.

Next, a core coated with an insulating layer is passed through the second conductor-containing solution to form a second conductor layer on the outer surface of the insulating layer (step b).

The second conductor layer forming process may be performed by passing a core coated with an insulating layer into a second conductor-containing solution. Specifically, the core coated with the insulating layer may be formed of a material containing a second conductor- And the second conductor layer may be formed on the outer surface of the insulating layer, and the second conductor-containing solution may be one in which the second conductor is dispersed in the solvent. Specifically, the solvent is selected from the group consisting of water, butylamine, hexylamine, triethylamine, pyridine, pyrazine, pyrrole, methylpyridine, methanol, ethanol, trifluoroethanol, propanol, isopropanol, terpineol, tetrahydrofuran, But are not limited to, 1,2-dichloroethane, 1,2-dichlorobenzene, chloroform, cyclohexanone, toluene, 1,4-dioxane, acetone, ethyl acetate, butyl acetate, methyl methacrylate, ethylene glycol, hexane, And may be at least one selected from the group consisting of dimethyl acetamide, dimethyl sulfoxide, methyl ethyl ketone, methyl isobutyl ketone, butyl cellosolve, butyl cellosolve acetate, and N-methyl-pyrrolidone. Meanwhile, the second conductor may be carbon nanotubes or graphenes, but is not particularly limited, and the carbon nanotubes or graphenes are as described above. Meanwhile, when the carbon nanotubes or graphenes are surface-modified as described above, when the surface-modified carbon nanotubes or graphenes are introduced into the second conductor layer, the insulating layer and the second conductor layer are strongly bonded So that it is possible to prevent the second conductor layer from peeling which may occur during the harness process. On the other hand, the carbon nanotube or graphene may be ball milled before mixing with the solvent.

The second conductor-containing solution may be one in which the second conductor is uniformly dispersed in a solvent using ultrasonic waves or a magnetic force. However, the second conductor-containing solution may be a solution of the second conductor- The amount of dispersion may be about 0.02 mg / mL to 0.5 mg / mL. If the dispersion amount is more than the above range, the thickness of the second conductor layer may not be uniform due to the lowering of dispersibility, and protrusions may be formed. On the other hand, the second conductor-containing solution may have a temperature of about room temperature to about 80 ° C.

The thickness of the second conductor layer formed through the second conductor layer forming process is as described above.

Next, the core formed with the second conductor layer is passed through a nano-carbon material dispersion solution to form a nano-carbon coating layer on the second conductor layer (step c).

As described above, in the present invention, the outer surface of the second conductor layer is covered with a shield layer, and the shield layer is formed of a nano-carbon coating layer having a thickness of 2 to 10 탆 and a 10 to 20 탆 thick electrolytic plating layer As shown in FIG.

Specifically, the nano-carbon coating layer may be formed by immersing the core in which the second conductor layer is formed in a nano-carbon coating solution or by coating a nano-carbon coating solution on the outer surface of the core.

The nano-carbon coating solution may be prepared by mixing one or more selected from ethanol, a mixture of dimethylformamide and isopropanol, or a mixture thereof, as a dispersion solvent, adding graphene, multi-walled carbon nanotubes, and single Wall carbon nanotubes may be produced by adding a metal nanoparticle precursor to a solution prepared by dispersing three kinds of wall carbon nanotubes.

Specifically, the thickness of the electromagnetic wave shielding layer formed of the metal nanoparticle precursor, graphene, multi-wall carbon nanotube, and single wall carbon nanotube in the nanocarbon coating solution may be in the range of 2 to 10 μm, , Multiwall carbon nanotubes, and single wall carbon nanotubes may be mixed and dispersed in a weight ratio of 1: 2.5 to 3.5: 4 to 5. Meanwhile, by including the graphene, the multi-walled carbon nanotube, and the single-walled carbon nanotube in the weight ratio range, it is possible to satisfy the electric resistance characteristic and the electromagnetic wave shielding property at the same time.

The metal nanoparticle precursor may be at least one metal ion selected from the group consisting of chromium (Cr), copper (Cu), gold (Au), palladium (Pd), nickel (Ni) . Meanwhile, the metal nanoparticle precursor may be included in the solvent in an amount of 20 to 35 parts by weight based on 100 parts by weight of a solution prepared by dispersing three kinds of graphene, multi-wall carbon nanotubes and single wall carbon nanotubes in the solvent. When the metal nanoparticle precursor is included in the above-mentioned weight range, it is possible to effectively disperse the metal nanoparticle precursor in the solution, thereby effectively increasing the electrical resistance characteristic. If it is less than the above range, it is difficult to effectively increase the electric resistance characteristic, and if it exceeds the above range, dispersion becomes difficult.

The core formed with the second conductor layer may be immersed in a nano-carbon coating solution, or a nano-carbon coating solution may be coated on the outer surface of the core, , And Intensity = 0.1 Mw / cm ² to form a nano-carbon coating layer.

Specifically, the thickness of the nano-carbon coating layer formed through the above-described process is 2 to 10 탆, and the nano-carbon coating layer has a structure in which metal nanoparticles are dispersed in the middle of the nano-carbon coating layer. Meanwhile, the size of the metal nanoparticles dispersed in the nanocarbon coating layer may be 10 to 40 nm. When the metal nanoparticles exceed the above range, there is a problem that dispersion in the solution is difficult. Even if the metal nanoparticles exceed the above range, the electrical conductivity does not greatly vary and the above range may be suitable from the viewpoint of economical efficiency.

Next, the core having the nano-carbon coating layer formed thereon is electroplated with an electroplating solution to form an electroplating layer on the nano-carbon coating layer (step d).

As described above, in the present invention, the outer surface of the second conductor layer is covered with a shield layer, and the shield layer is formed of a nano-carbon coating layer having a thickness of 2 to 10 탆 and a 10 to 20 탆 thick electrolytic plating layer As shown in FIG.

Specifically, the electroplating layer forming process includes: providing a negative electrode to a core having the nano-carbon coating layer formed thereon, applying a positive electrode to the metal plate, and applying an electric current between the metal plate and the nano- To form a plating layer. Specifically, the electrolytic plating solution employs those generally used in the art, for example, one containing at least one of a sulfide system, a chloride system, and a nitride system metal salt is used As the solvent, an aqueous solvent can be used, but it is not particularly limited.

The metal plate used in the process of forming the electroplating layer may be a transition metal. Specifically, the metal plate may be formed of platinum (Pt), copper (Cu), nickel (Ni), silver (Ag), iron (Fe) ), One selected from the group consisting of aluminum (Al), cobalt (Co), ruthenium (Ru), and zinc (Zn), more specifically, one kind of material selected from the group consisting of copper, Lt; / RTI >

Meanwhile, in the electroplating layer forming process according to an embodiment of the present invention, the plating current density in the electroplating solution may be in the range of 50 to 70 mA / cm ² , and the current may be applied in the range of 600 to 900 seconds. Specifically, in the case of the present invention, the electrolytic plating process should be performed within the current density and time range to achieve the desired electroplating layer thickness of 10 to 20 μm. If the current density is lower than the above-mentioned current density and the time range, it is difficult to achieve the desired electroplating layer thickness. If it exceeds the above range, the amount of metal may be excessively increased and the thickness becomes excessively thick, making it difficult to form an ultrafine cable.

As described above, according to the present invention, it is possible to provide a semiconductor device including a core including a first conductor wire as a first conductor, an insulating layer on the core, a second conductor layer including a carbon nanotube as a second conductor on the insulating layer, Layered structure including a nano-carbon coating layer formed of a nano-carbon material dispersion solution and an electrolytic plating layer formed using an electrolytic plating method as the shield layer in the ultra-fine cable composed of a shield layer , It is possible to solve the problem of decreasing the current intensity due to the increase in resistance due to the miniaturization of the wire diameter and to provide a microfibre cable having an improved electric resistance characteristic.

Claims (7)

A core comprising at least one first conductor wire;
An insulating layer covering the outer surface of the core;
A second conductor layer covering an outer surface of the insulating layer; And
A shield layer covering the surface of the second conductor layer; / RTI >
Wherein the shield layer comprises a nanocarbon coating layer having a thickness of 2 to 10 mu m and an electroplating layer having a thickness of 10 to 20 mu m formed on the nanocarbon coating layer. The method according to claim 1,
Wherein the ultrafine cable has an outer diameter of 140 to 180 mu m. a) coating a core comprising at least one first conductor wire with an insulating layer;
b) passing a core coated with an insulating layer through a second conductor-containing solution to form a second conductor layer on the outer surface of the insulating layer;
c) passing the core having the second conductor layer formed thereon through a nano-carbon material dispersion solution to form a nano-carbon coating layer on the second conductor layer; And
d) electroplating the core having the nano-carbon coating layer formed thereon with an electrolytic plating solution to form an electroplating layer on the nano-carbon coating layer; Wherein the microfibre cable comprises at least one fiber. The method of claim 3,
Wherein the nano-carbon material dispersion solution of step (c) comprises a metal nanoparticle precursor, a graphene, a multi-wall carbon nanotube, a single-wall carbon nanotube, and a solvent. The method of claim 3,
Wherein step c is in the second conductor layer is applied to the nano-carbon coating solution to the core outer surface to immersion of the core is formed of carbon nano-coating or solution, then, λ = 360㎚, Intensity = 0.1Mw / cm 2 UV conditions Wherein the ultrafine cable is produced by the method. The method of claim 3,
The metal nanoparticles are dispersed in the nanocarbon coating layer formed in step (c)
Wherein the size of the metal nanoparticles is 10 to 40 nm. The method of claim 3,
In the step (d), a negative electrode is applied to a core in which a nano-carbon coating layer is formed in an electrolytic plating solution,
A positive electrode is provided to a transition metal plate selected from the group consisting of copper, nickel and iron,
The transition metal sheet and the nano-carbon coating layer by applying a current to a plating current density of 50 to 70 mA / cm ² for 600 to 900 seconds between the formed electrolytic core having a thickness of 10 to 20㎛ to form a plating layer, method of producing ultra-fine cables.