KR20190073258A - Semiconductor light emitting device, universal mounting substrate, and method for manufacturing semiconductor light emitting device using the same - Google Patents

Abstract

Provided is a general-purpose mounting substrate capable of solving a problem of positional deviation of an LED chip or diffusion of an extra bonding material, and capable of coping with LED chips of different sizes. On the general-purpose mounting substrate, a mounting pad for bonding any one of a plurality of semiconductor light emitting elements of different sizes is formed. The mounting pad includes a first region, and a second region located inside the first region. The second region is partially continuous to the first region, and the outer periphery excluding the continuous portion is not in contact with the first region. The outer periphery of the second region is smaller than the outer periphery of the largest light emitting element among the plurality of light emitting elements, and has the same size as or is larger than the outer periphery of the secondly largest light emitting element. Since the region is fixed, the positional deviation of the LED chip is prevented. Further, the extra bonding material diffuses to the other region and accordingly, does not diffuse to the substrate side.

Description

TECHNICAL FIELD [0001] The present invention relates to a semiconductor light emitting device, a general-purpose mounting substrate, and a method of manufacturing a semiconductor light emitting device using the same.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor light emitting device in which a semiconductor light emitting element such as a light emitting diode (LED) is mounted on a substrate for mounting an element (hereinafter referred to as a mounting substrate) and a manufacturing method thereof.

A semiconductor light emitting device (hereinafter, also referred to as an LED chip) is bonded to a pad (mounting pad) for device mounting comprising a metal film formed on a surface of an insulating substrate with a bonding material, After bonding, a light emitting device packaged by a resin mold is widely used. In this type of light emitting device, it is preferable that the LED chip is bonded to the mounting pad from the front side by the bonding material in order to effectively diffuse the heat generated by the LED chip to the substrate side. In the bonding material supplied between the LED chip and the mounting pad If the amount is large, there is a problem that the molten bonding material diffuses or enters the periphery of the LED chip upon reflow. In order to solve such a problem, for example, it has been proposed to provide a protrusion on the outside of a portion where the LED chip of the mounting pad is bonded (Patent Document 1), and to provide a groove (Patent Document 2).

Patent Document 1: JP-A-2009-76524 Patent Document 2: JP-A-2012-109352

In the above-described conventional technology, since the projections and grooves provided on the mounting pads are determined according to the size of the LED chip, the size of the LED chip of different sizes It is necessary to prepare a mounting substrate every time. On the other hand, by using a mounting board provided with a mounting pad having a large area corresponding to the largest LED chip, it is possible to cope with LED chips of any size. When a small LED chip is bonded to such a large mounting pad, There is a case where the LED chip is shifted or rotated from a position where the LED chip is originally to be fixed by fluidization of the molten bonding material at low temperature. When the bonding material solidifies in this state, the LED chips are bonded in a misaligned state. When such a light emitting device is applied to a light source such as an illumination, there is a problem that optical design is difficult because the position of the light source is shifted.

It is an object of the present invention to provide a general-purpose mounting board capable of coping with LED chips of different sizes without the problem of positional deviation of LED chips and diffusion of extra bonding material, And a semiconductor light emitting device.

In order to solve the above problems, the semiconductor light emitting device of the present invention has a mounting pad of the mounting board having a plurality of mounting areas corresponding to the sizes of the plurality of LED chips. The plurality of mounting regions are arranged so that only a part of them is continuous by the notches or slits formed in the mounting pads.

That is, the semiconductor light emitting device of the present invention comprises a mounting substrate having a mounting pad made of a metal film, and a semiconductor light emitting element having a back surface bonded to the mounting pad by a bonding material made of a material having wettability to the metal film And the mounting pad has a first area and a second area located inwardly of the first area, the second area being partially continuous with the first area, Is not in contact with the first region.

Further, the semiconductor light emitting element is one of a plurality of light emitting elements of different sizes, and the outer periphery of the second region is smaller than the outer periphery of the largest light emitting element among the plurality of light emitting elements, Or greater than that.

According to the present invention, by arranging and bonding the LED chips to the mounting region corresponding to the size of the plurality of mounting regions of the mounting pads, the bonding material can be formed in a state where the wettability to the mounting pads and the space (For example, the material of the substrate), the diffusion is suppressed by staying in the mounting region where the LED chip is disposed. For this reason, the LED chips are arranged substantially in the shape of the mounting region, and there is no positional deviation. Even if there is an extra amount of bonding material, the bonding material is prevented from diffusing on a substrate other than the mounting pad because the continuous portion of the mounting region is diffused from the other mounting region.

1 is a side sectional view showing an embodiment of a semiconductor light emitting device.
2 is a top view illustrating a state in which LED chips of different sizes are mounted on the semiconductor light emitting device of FIG.
3 is a view showing a mounting pad portion of the general-purpose mounting board according to the first embodiment.
Fig. 4 is a view for explaining the mounting of the LED chip on the general-purpose mounting board according to the first embodiment. Fig. 4 (a) shows the large-chip mounting, and Fig.
5 is a flow chart for explaining a manufacturing method of the semiconductor light emitting device of the first embodiment.
6A to 6C are views showing a procedure for mounting a small chip on the general-purpose mounting board according to the first embodiment.
Figs. 7 (a) to 7 (c) are views showing a procedure for mounting a large chip on the general-purpose mounting board according to the first embodiment.
8 is a view showing a mounting pad portion of the general-purpose mounting board according to the second embodiment.
9A and 9B are views for explaining a supply portion of a bonding material when the LED chip is mounted on the general-purpose mounting board according to the second embodiment.
10A and 10B are views showing a modification of the general-purpose mounting board according to the second embodiment.
11 is a top view showing a mounting pad of the general-purpose mounting board according to the third embodiment.
12 is a top view showing a modification of the third embodiment.

Hereinafter, embodiments of the semiconductor light emitting device of the present invention will be described.

Fig. 1 shows an embodiment of a semiconductor light emitting device of the present invention. Such a semiconductor light emitting device includes a mounting substrate 10 and an LED chip 30 bonded to the mounting substrate 10 by a bonding material 20. Further, usually, the LED chip 30 is sealed with a sealing resin such as a translucent resin or a phosphor-containing resin. In the case of sealing with the sealing resin 50, a cylindrical wall member 60 for injecting the uncured sealing resin 50 and a reflection member having an inverted truncated cone shape on the inner surface are arranged along the outer periphery of the mounting substrate 10 Can be deployed.

The mounting substrate 10 is made of an insulating substrate such as a glass epoxy substrate or a ceramic multilayer substrate and a conductor wiring 11 made of a metal such as Au or Cu for feeding the LED chip 30 is formed. A mounting pad 13 for bonding the LED chip 30 to the end of the conductor wiring 11 is formed. The mounting pad 13 has a shape capable of mounting an LED chip of an arbitrary size among LED chips of a plurality of sizes instead of the LED chip 30 of a specific size. The specific configuration of the mounting pad will be described later. On the other hand, the conductor wirings 11 and the mounting pads 13 may be a multilayer film made of another metal in addition to a metal single layer film, and may be formed on an insulating substrate by any method such as photolithography, sputtering, .

The bonding material 20 joins the electrode surface of the LED chip 30 with the mounting pad 13 which is a metal and is made of a metal material that melts at a relatively low melting point such as a SnPb system, a SnAgCu system, an AuSn system, an SnZn system , ZnCu-based alloy, or the like can be used. Such a metal material has excellent wettability with respect to the mounting pad 13 made of metal at melting (melting point) and has low wettability to the insulating substrate. Therefore, when the metal material is dropped on the mounting pad 13, 13 on the mounting pad 13 without being diffused from the outer periphery of the LED chip 30 to the insulating substrate on the outer side thereof to suppress the movement of the LED chip 30 mounted thereon.

The LED chip 30 has a single-sided type having a structure in which a p-type semiconductor and an n-type semiconductor are bonded to each other and having both electrodes on one side and a double-sided type in which electrodes are formed on the front and back sides, respectively. In the present embodiment, any type can be employed. In the case of a single-sided type in which both electrodes are formed on the upper surface, it is preferable to form a metal film on the back side. 1 shows an example using a double-sided type in which an n-electrode is disposed on the back surface side and a p-electrode is disposed on the center of the upper surface side. The back surface of the mounting substrate 10, And the p electrode is wire-bonded to the conductor wiring 11 (electrode pad) of the mounting substrate 10 by the wire member 40 such as Ag. On the other hand, a compound semiconductor such as GaAs, GaP, AlGaInP, or InGaN is used as the semiconductor, although not limited thereto. The electrode is formed of a single layer film or a laminated film of Al, Ag, Au, Pd or the like.

The shape of the LED chip 30 is not particularly limited, but generally, the shape of the LED chip 30 is a quadrangular shape. The size of the LED chip 30 is a rectangular shape as viewed from the top, and has a 1 mm edge, a 0.7 mm edge, a 0.5 mm edge, and the like. The semiconductor light emitting device of this embodiment uses a mounting substrate corresponding to LED chips of a plurality of sizes as a mounting substrate, and is not limited to a specific size, and any one of LED chips of a plurality of sizes can be used.

Fig. 2 shows a dotted line and a dashed line in a state in which any one of two sizes of the LED chips 30L and 30S is mounted. When mounting the LED chip 30L, the LED chip 30L is fixed in conformity with the outer contour of the mounting pad 13. When the LED chip 30S is mounted, the LED chip 30L is mounted inside the outer contour, Thereby fixing the chip 30S. In any case, the bonding material 20 supplied to the mounting pad 13 has a good wetting property at the time of melting to the mounting pad 13 and is insufficient for the insulating substrate, so that the bonding material 20 stays on the mounting pad 13, The outer contour of the LED chip 30L and the inner contour of the LED chip 30S are kept substantially aligned with each other by the curing of the bonding material.

Next, an embodiment of the mounting substrate 10 used in the above-described semiconductor light emitting device will be described. Here, specific examples of the mounting pads corresponding to the two LED chips, the large chip 30L and the small chip 30S having different sizes will be described as an example.

≪ First Embodiment >

As shown in Fig. 3, the mounting pad 13 of the mounting board 10 according to the present embodiment includes a first region 131 corresponding to a large chip and a second region 131 located inside the first region and corresponding to a small chip And a second region 132 (indicated by an oblique line). The mounting pad 13 has a shape obtained by cutting out a part of each of four sides of the quadrangle and the second area 132 is a region surrounded by the notch 135, 1 region 131. [ As shown in the figure, the first region 131 and the second region 132 are continuous at the four corners of the second region 132, and thus are not electrically interrupted, that is, they are integral. Through this continuous portion, the bonding material supplied to one region can be diffused toward the other region, and the diffusion of the bonding material due to the difference in wettability between the bonding pad and the bonding material of the insulating substrate can be prevented, .

The width W1 of the mounting pad 13, that is, the width W1 of the first region 131 is the same as the width of the large chip. Specifically, the width of the large chip is preferably about 10%. 4A, when the large chip 30L is mounted, the entire back surface excluding the portion corresponding to the cutout portion 135 is bonded to the entire surface of the mounting pad 13, The heat generated from the chip can be effectively dissipated through the mounting pad 13 and the heated molten bonding material 20 has fluidity so that even if the large chip 30L on the bonding material 20 moves, The range can be kept on the mounting pad, and displacement of the position can be suppressed.

The width W2 of the second region 132 is smaller than the width of the large chip and is equal to or smaller than the width of the small chip (FIG. 4 (b)). Specifically, it is preferable that W2 is about 10% of the width of the small chip. Thus, as in the case of the large chip, it is possible to make the heat dissipation from the chip good and to prevent displacement of the position at the time of bonding have. W1 is greater than W2, e.g., W1 is selected to be √2 times, or twice as wide as W2.

It is preferable that the width W3 of the notch 135 defining the outer circumference of the second area 132 is at least one-half the width W2 of the second area. When the width W3 is narrow, the effect of restricting the movement of the small chip due to the boundary between the second region 132 and the insulating substrate is reduced, and the portion (continuous portion) where the first region and the second region are connected is used So that the small chip is easily moved, that is, the position is easily shifted.

Only the width of one direction of the mounting pad has been described. It is preferable to design the same in the direction orthogonal to this direction as in the above-described W1 to W3.

3, the notch 135 has a rectangular shape. However, the notch 135 may have a slope or a curved shape as long as it satisfies the above-described conditions.

Next, a method of manufacturing a semiconductor light emitting device using the mounting substrate of the present embodiment will be described with reference to Figs. 5 to 7. Fig.

First, as a mounting substrate 10, a mounting substrate on which a predetermined conductor wiring 11 and a mounting pad 13 having the above-described shape are formed is prepared (S501). In accordance with the size of the LED chip to be mounted, a bonding material is supplied to a predetermined region on the mounting pad 13 (S502). In this state, the bonding material 20 is in the form of a paste including a binder, a flux, and the like in addition to a metallic material such as AuSn. The bonding material 20 can be supplied by coating or potting. In the case where the LED chip is a small chip 30S, As shown in FIG. 6 (a), is supplied into the inside contour of the mounting pad 13, that is, into the second region 132. The amount of the bonding material 20 to be supplied may be an amount capable of covering the back surface of the LED chip in a state where the bonding material is melted and diffused, and it is preferable that the amount of the bonding material 20 overflowing from the second region 132 is small. Since the amount of the bonding material can be known empirically depending on the size of the LED chip, it is appropriately supplied based on such experience.

When the LED chip is the large chip 30L, as shown in FIG. 7A, the inside of the inside contour of the mounting pad 13, that is, the inside of the second region 132, To the first region (131). In this embodiment, since the outer region is divided into four corners of the second region 132, the bonding material 20 is supplied to each of the four regions. The supply amount of the bonding material 20 is an amount sufficient to cover the back surface of the LED chip, and is such an amount as not to diffuse outwardly from the first region. 7A, the bonding material is supplied to both the first region and the second region. Since the first region and the second region are continuous at the four corners of the second region, A larger amount of the bonding material 20 is supplied to the second region 132 than in the case of the small chip and the bonding material 20 that moves from the second region 132 to the first region 131 Accordingly, it is also possible to join the portion of the LED chip on the first region.

Subsequently, the LED chip is arranged on the mounting pad (S503). 7B) along the outline of the second region 132 (FIG. 6B) and the large chip 30L along the outline of the first region 131 (FIG. 7B) , Then release the LED chip. The LED chip 30 is temporarily fixed on the mounting substrate by the bonding material 20 and the mounting substrate 10 is put in the reflow furnace and heated for a predetermined time and then the bonding material 20 is cured to form the LED chip 30 (S504). The bonding material 20 is melted and has fluidity due to the heating at the time of reflow. The wettability of the bonding material 20 is lower than that of the mounting pad 13 made of a metal material, The bonding material 20 is hardly diffused from the mounting pad 13 to the outside (on the insulating substrate side). Therefore, the small chip 30S disposed inside the mounting pad 13 is limited in the moving range to the inside of the outer periphery of the second region 132 defined by the cutout portion of the mounting pad 13. [ As a result, the bonding material 20 is fixed and bonded on the second region 132 as the bonding material 20 is cured (Fig. 6 (c), Fig. 7 (c)). The small chip 30S is mounted within the outline of the second region 132 while the large chip 30L is mounted while covering the notch portion within the outside outline of the first region 131. [

Thereafter, an electrode (not shown) provided on the upper side of the LED chip is wire-bonded to the electrode pad of the mounting substrate 10 (S505), and the LED chip after wire bonding is sealed with a light- ) Is similar to that of the conventional semiconductor light emitting device.

According to the present embodiment, the mounting pad having the area corresponding to the large chip is formed by cutting out each side of the square, and the area corresponding to the small chip surrounded by the notch is provided inside, It is possible to provide a general-purpose mounting board capable of coping with a chip. By using such a mounting substrate, there is provided a semiconductor light emitting device having a structure in which the position deviation of the LED chip is not deviated and the heat emitted by the LED chip is easily dissipated.

On the other hand, in the embodiment described above, the case of using the double-sided type in which one electrode is provided on the back surface and the other electrode is provided on the upper surface is used as the LED chip, but the LED chip in which both electrodes are arranged on the upper surface is also applicable.

In the above embodiments, a single LED chip is mounted on an insulating substrate, but a plurality of LED chips may be mounted. In this case, a mounting substrate on which a plurality of mounting pads are formed on an insulating substrate is prepared. The case where at least one of the plurality of mounting pads is a general-purpose mounting pad is also included in the present embodiment.

≪ Second Embodiment >

In the first embodiment, the notches are provided in the mounting pads, and the outer periphery of the second area corresponding to the small chip is defined by the notches. In this embodiment, however, a slit is formed between the first area and the second area do. The structure of the mounting substrate of the present embodiment and the structure of the semiconductor light emitting device using the same is the same as that of the first embodiment described above, and therefore only the mounting pads of the mounting substrate, which is a feature of this embodiment, will be described below.

The mounting pad 130 of the present embodiment has a rectangular shape as shown in Fig. 8, and four slits 137 are formed on the inner side along four sides thereof. An inner region defined by four slits 137 (an area indicated by an oblique line) is a second region 132 for the small chip and a first region 131 for which the outer region corresponds to a large chip. Also in this embodiment, the first region 131 and the second region 132 are continuous by the portion where the slit is not provided, thereby maintaining electrical integrity, and diffusion of the bonding material through the continuous portion is allowed do.

The width w1 of the first region, the width w2 of the second region, and the length L of the slit of the mounting pad 130 are the same as those of the first region W1 corresponds to the width of the large chip, and w2 corresponds to the width of the small chip. The width W2 of the first region, the width W2 of the second region, and the width W3 of the notch. Further, it is preferable that the length L of the slit is 1/2 or more of w2. Accordingly, even when the small chip is mounted, the movement of the small chip by the molten bonding material is inhibited, and a semiconductor light emitting device free from positional deviation of the chip can be obtained.

Furthermore, in the mounting board according to the present embodiment, when the large chip is mounted on the mounting board according to the first embodiment, the area where the back surface thereof is bonded to the mounting board is large, so that heat is subtracted from the LED chip.

The method of manufacturing the semiconductor light emitting device using the mounting substrate of the present embodiment is also the same as that of the first embodiment. In the case of mounting a small chip, the second region 132, as shown in FIG. 9A, And the small chips are fixed to the second region 132 by spreading the bonding material in the entirety of the second region 132 by melting the bonding material with the heat at the time of reflow. At this time, due to the difference in wettability, the bonding material is restricted from moving toward the insulating substrate exposed by the slit 137, and the flow range is limited, so that the small chip mounted thereon also overflows from the second region 132 And is fixed to the second region 132. [

9 (b), when the bonding material 20 is bonded to the region along the slit 137 of the second region 132 and the first region 131 or to the four corners of the first region 131, And the bonding material is melted by the heat at the time of reflow and spread over the first region 131 and the second region 132 to fix the large chip so as to cover the entire mounting pad.

According to the present embodiment, it is possible to correspond to a plurality of LED chips of a plurality of sizes by providing a slit on the inner side of the first region of the size corresponding to the large chip and providing a second region defined by the outer periphery of the slit, In any case, it is possible to obtain a semiconductor light emitting device which is free from positional deviation of the LED chip and is excellent in heat dissipation.

As in the first embodiment, this embodiment can be applied not only to a single chip but also to a semiconductor light emitting device of a plurality of chips.

≪ Modification of Second Embodiment >

In the second embodiment, one slit is provided along each of the four sides of the mounting pad. However, the shape and arrangement of the slits ensure the continuity between the first and second areas, and the outer circumference of the second area is defined It is not limited to the one shown in Fig. 8, and various modifications are possible.

10 (a) and 10 (b) show modified examples. 10A is an example in which slits formed in parallel to the four sides of the mounting pad 130A are composed of a plurality of slits 137A. Here, one slit of the second embodiment is divided into two slits, but the number of divisions is not limited to two, and may be larger than that, and the slits of all four sides need not be the same. For example, the slit in the longitudinal direction may be one slit, and the slit in the lateral direction may be constituted by a plurality of slits.

10 (b), the slits are L-shaped. In the illustrated example, four slits 137B are disposed inside the four corners of the mounting pad 130B. In this modified example as well, it is possible to make various modifications such as disposing a linear slit between the two L-shaped slits 137B.

The same effects as in the second embodiment can be obtained also in the mounting boards of these modified examples.

≪ Third Embodiment >

In the first and second embodiments, a mounting substrate corresponding to two types of LED chips, i.e., a small chip and a large chip, has been described, but the mounting substrate of the present embodiment is applicable to three or more LED chips of different sizes will be.

11 shows an example of a mounting pad 1300 corresponding to three kinds of large chip, middle chip and small chip. As shown in the drawing, such a mounting board 1300 has a shape similar to that of the mounting pad 13 of the first embodiment in which the notch 135 is provided at four sides of a quadrangle. In the mounting pad 1300 of the first embodiment, Four slits 137 are formed along the outer periphery of the region 132 surrounded by the dotted line in the region corresponding to the second region of the pixel region 13 ). That is, the region sandwiched between the one dot chain line and the dotted line is the second region. The first region 131, the second region 132, and the third region 133 each correspond to a large chip, a middle chip, and a small chip, respectively.

The first region 131, the second region 132, and the third region 133 are electrically connected to each other, and the presence of the slits 137 and the cutouts 135 defining the respective regions , The LED chip can be prevented from moving when the LED chip of a size corresponding to each region is bonded through the bonding material, thereby making it possible to manufacture a semiconductor light emitting device free from positional deviation. Further, by supplying the appropriate amount of the bonding material, since almost the entire back surface of the LED chip is bonded to the mounting pads, good heat extraction can be obtained, and thermal deterioration of the semiconductor light emitting device can be prevented.

In the present embodiment, the shape of the slit 137 can be changed in the same manner as the modification of the second embodiment. As shown in Fig. 12, it is also possible to realize the three regions by combining the slit 137 and the cutout portion 135. Fig.

Although the embodiments of the semiconductor light emitting device and the mounting substrate used in the semiconductor light emitting device of the present invention have been described above, the drawings used in the description of each embodiment are merely examples, and the structure of the semiconductor light emitting device, the type and shape of the LED chip, And the present invention can be applied to a known structure or type.

10: mounting board
11: Conductor wiring
13: Mounting pad
20: Bonding material
30: LED chip (semiconductor light emitting element)
30L: Large chip
30S: Small chip
31: electrode (metal film)
40: wire rod
50: sealing resin
60: Wall material
130: mounting pad
130A: mounting pad
130B: Mounting pad
131: first region
132: second area
133: third region
135:
137: slit
137A: Slit
137B: Slit
1300: mounting pad

Claims (14)

A semiconductor light emitting device comprising a mounting substrate having a mounting pad made of a metal film and a back surface bonded to the mounting pad by a bonding material made of a material having wettability to the metal film,
Wherein the mounting pad has a first region and a second region located inwardly of the first region, the second region being partially continuous with the first region, And the first region does not contact the first region. The method according to claim 1,
Wherein the semiconductor light emitting element is one of a plurality of light emitting elements having different sizes and the outer periphery of the second region is smaller than the outer periphery of the largest light emitting element among the plurality of light emitting elements, Wherein the semiconductor light emitting device has a size equal to or larger than that of the outer periphery. 3. The method according to claim 1 or 2,
Wherein the outer periphery of the first region is surrounded by a notch formed in the first region or a slit formed between the first region and the second region. 3. The method according to claim 1 or 2,
Wherein the mounting pad has a shape in which each of the four sides of the quadrangular shape is cut away from the top face and the second region is a region surrounded by four notches. 5. The method of claim 4,
Wherein a width of the cutout in a direction parallel to the four sides is equal to or larger than a half of a width of the second region in the same direction. 3. The method according to claim 1 or 2,
The mounting pad has a rectangular shape as viewed from the top,
Wherein the slit has a slit parallel to a side of the rectangle between the first region and the second region, and the second region is a region surrounded by the slit. The method according to claim 6,
Wherein a width of the slit in a direction parallel to the sides of the rectangle is equal to or larger than a half of a width of the second region in the same direction. The method according to claim 1,
Wherein a size of the outer periphery of the semiconductor light emitting element is equal to or smaller than a size of the outer periphery of the second region. The method according to claim 1,
Wherein a size of an outer periphery of the semiconductor light emitting element is equal to or smaller than a size of an outer periphery of the first region and larger than a size of the outer periphery of the second region. The method according to claim 1,
The bonding material is provided inside the second region,
Wherein the semiconductor light emitting device is equal to or smaller than an outer periphery of the second region. The method according to claim 1,
The bonding material is provided so as to be diffused to the first region and the second region,
Wherein the semiconductor light emitting element is larger than an outer periphery of the second region and is equal to or smaller than an outer periphery of the first region. There is provided a general-purpose mounting board provided with mounting pads for bonding any of a plurality of semiconductor light-
Wherein the mounting pad has a first region and a second region located inwardly of the first region, the second region being partially continuous to the first region, The outer periphery of the second region is smaller than the outer periphery of the largest light emitting element among the plurality of light emitting elements and is equal to or larger than the outer periphery of the second largest light emitting element To be mounted. A method of manufacturing a semiconductor light emitting device according to claim 8, wherein the electrode surface of a semiconductor light emitting element having an electrode surface on its back surface is bonded to the mounting pad by a bonding material on a mounting substrate on which a mounting pad is formed,
The method comprising the steps of: preparing the general-purpose mounting board according to claim 12 as the mounting board;
Supplying the bonding material in an amount sufficient to cover the electrode surface to the second region of the mounting pad and mounting the electrode surface of the semiconductor element;
And heating the bonding material to bond the electrode surface and the mounting pad by the bonding material diffused in the second region. A method of manufacturing a semiconductor light emitting device according to claim 9, wherein the electrode surface of a semiconductor light emitting element having an electrode surface on its back surface is bonded to the mounting pad by a bonding material on a mounting substrate on which a mounting pad is formed,
The method comprising the steps of: preparing the general-purpose mounting board according to claim 12 as the mounting board;
Supplying the bonding material in an amount sufficient to cover the electrode surface to the second region and the first region of the mounting pad and mounting the electrode surface of the semiconductor element;
And bonding the electrode surface and the mounting pad by a bonding material.

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