KR102434982B1 - Wiring board - Google Patents

Abstract

(Project) To provide a wiring board capable of suppressing inflow of a bonding material into a mounting area while maintaining a bonding area between a substrate and a frame.
(Solution) One aspect of the present disclosure is a wiring board comprising a metal substrate having a front surface and a back surface, and an insulating frame bonded to the surface of the substrate through a bonding layer made of a bonding material. The wiring board further includes a regulating portion constituted by grooves, protrusions, or a combination thereof arranged on the surface of the substrate. The surface of the substrate has a mounting area in which the mounting component is scheduled to be mounted. The regulating part is arrange|positioned in at least a part of the area|region between the mounting area and the frame body in planar view among the surfaces.

Description

wiring board {WIRING BOARD}

The present disclosure relates to a wiring board.

In order to improve the heat dissipation property of mounting components, such as a semiconductor element, the wiring board which attached the metal base material to the frame is known (refer patent document 1). The base material is joined to the frame through a bonding material such as brazing material.

At the time of bonding the frame and the base material, when the molten bonding material flows into a mounting area in which mounting components such as electronic components are to be mounted, the bonding material is hardened in the mounting area to form a step. This step causes insufficient bonding of the mounted part to the base material, or a mounting defect in which it is inclined. Poor mounting reduces the bonding strength, heat dissipation, and mounting position accuracy of mounted parts.

Therefore, in Patent Document 1, the inflow of the bonding material to the mounting area is suppressed by forming the step portion in the frame.

Patent Document 1: Japanese Patent Laid-Open No. 2015-204426

In the configuration in which the flow of the bonding material is suppressed by forming the step portion in the frame as described above, the bonding area between the substrate and the frame is reduced by the step portion. As a result, the airtightness of a joint part may fall.

An aspect of the present disclosure is to provide a wiring board capable of suppressing inflow of a bonding material into a mounting area while maintaining a bonding area between a substrate and a frame.

One aspect of the present disclosure is a wiring board comprising a metal substrate having a front surface and a back surface, and an insulating frame bonded to the surface of the substrate through a bonding layer made of a bonding material. The wiring board further includes a regulating portion constituted by grooves, protrusions, or a combination thereof arranged on the surface of the substrate. The surface of the substrate has a mounting area in which the mounting component is scheduled to be mounted. The regulating part is arrange|positioned in at least a part of the area|region between a mounting area and a frame body in planar view among the surfaces.

According to such a structure, the flow of the bonding material which forms a bonding layer at the time of bonding of a base material and a frame is regulated by a regulating part. Therefore, the inflow of the bonding material into the mounting area can be suppressed without reducing the bonding area between the substrate and the frame.

In one aspect of the present disclosure, a pedestal formed in a region on the surface of the base material inside the frame body and in a region different from the mounting area may be further provided. According to this configuration, a plurality of mounting parts can be three-dimensionally arranged at positions having different heights. Moreover, when the base is provided with a base on the surface, the base forms a projection on the surface of the base. When the substrate has protrusions on the surface, the flowing bonding material tends to flow into the mounting area along the outer edges of the protrusions. In this form, the above-described regulating portion functions even more effectively.

In one aspect of the present disclosure, the pedestal and the regulating unit may be formed integrally with the base material. According to such a structure, a pedestal and a regulating part can be formed easily. Moreover, since it can suppress that the flow of heat from a pedestal to a base material is inhibited, the heat dissipation property of the mounting component mounted on the pedestal can be improved.

In one aspect of this indication, you may arrange|position a regulating part in the area|region where a pedestal does not exist between a mounting area and a frame among the area|region between a mounting area and a frame. According to such a structure, while being able to suppress the inflow of the bonding material to a mounting area, the formation location of a regulating part can be reduced. Accordingly, it is possible to suppress unnecessary enlargement of the wiring board. Moreover, the number of processing steps with respect to the surface of a base material can be reduced.

In one aspect of the present disclosure, the regulating part may be in contact with a joint portion of the pedestal with the base material. According to this configuration, by suppressing the inflow of the bonding material into the joint portion of the pedestal, which is the outer edge of the protrusion, into which the flowing bonding material easily flows, the formation of fillets by the bonding material can be suppressed. Therefore, it is possible to more reliably suppress the mounting failure of the mounting parts.

In one aspect of the present disclosure, the mounting area may be continuously surrounded by the pedestal and the regulating unit. According to such a configuration, it is possible to more reliably suppress the inflow of the bonding material into the mounting area and the formation of fillets in the joint portion of the pedestal.

In one aspect of the present disclosure, the regulating part is constituted by at least a groove, and the depth of the groove may be 1/2 or less of the thickness of the substrate. According to such a configuration, a decrease in the heat dissipation property of the substrate and a decrease in the strength of the substrate can be suppressed.

In one aspect of this indication, the regulating part may be comprised with protrusion at least. According to this configuration, even when the amount of flow of the bonding material is large, the bonding material can be guided out of the mounting area.

In one aspect of this indication, while being formed in the frame, you may further provide the connection pad which is electrically connected with the mounting component. The height of the projection may be less than or equal to the height from the surface of the substrate to the formation position of the connection pad. According to this configuration, when connecting the mounting part and the connection pad formed on the frame, it is possible to suppress short circuiting of the connection means (eg, wire bond) in contact with the base material, while also reducing the workability at the time of connection. can also be suppressed.

In one aspect of the present disclosure, the frame may have ceramic as a main component (that is, a component contained in 90% by mass or more). According to such a structure, a semiconductor package with high heat resistance can be obtained.

In one aspect of this indication, the base material may be comprised by at least 1 of copper, a copper alloy, and a copper composite_body|complex. According to such a structure, the heat transfer property of a base material can be improved.

In one aspect of the present disclosure, a mounting component mounted in the mounting area may be further provided. According to such a structure, a highly reliable semiconductor package can be obtained.

Fig. 1A is a schematic plan view of a wiring board according to an embodiment, and Fig. 1B is a schematic cross-sectional view taken along line IB-IB in Fig. 1A.
Fig. 2A is a schematic plan view of a wiring board according to an embodiment different from Fig. 1A, and Fig. 2B is a schematic cross-sectional view taken along line IIB-IIB in Fig. 2A.
Fig. 3A is a schematic plan view of a wiring board according to an embodiment different from Figs. 1A and 2A, and Fig. 3B is a schematic cross-sectional view taken along line IIIB-IIIB of Fig. 3A.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment to which this indication was applied is described using drawings.

[One. first embodiment]

[1-1. composition]

The wiring board 1 shown in FIGS. 1A and 1B includes a base 2, a frame 3, a pedestal 4, a regulating part 5, a first mounting part 7 and a second mounting part ( 8) is provided.

<mentioned>

The substrate 2 is a metal plate having a front surface 2A and a rear surface 2B. The base material 2 functions as a heat dissipation member for the first mounting part 7 and the second mounting part 8 . The base material 2 may be comprised from a viewpoint of heat transfer property by at least one of copper, a copper alloy, and a copper composite_body|complex. Moreover, as a copper alloy, the alloy containing nickel, phosphorus, zinc, tin, aluminum, etc. while copper as a main component is mentioned. In addition, the "main component" means the component contained 90 mass % or more. Examples of the copper composite include a composite in which copper is impregnated in a porous body forming a skeleton of tungsten, and a composite having a multilayer structure in which copper and molybdenum are alternately stacked. In addition, the heat sink which has a heat radiation fin etc. may be attached to the back surface 2B of the base material 2 .

The substrate 2 has a mounting area 2C in which the second mounting component 8 is scheduled to be mounted among the surfaces 2A of the substrate 2 . The mounting area 2C is a region coincident with the outer edge of the second mounting part 8 when viewed in plan (ie, in a direction perpendicular to the direction in which the surface 2A is spread).

In the present embodiment, since the second mounting component 8 is actually mounted in the mounting area 2C, the mounting area 2C completely overlaps the second mounting component 8 . The second mounting component 8 is joined to the mounting area 2C by, for example, a brazing material, a soft brazing material, a resin adhesive, or the like.

Moreover, 2 C of mounting areas are formed in the position pinched|interposed between the frame 3 and the pedestal 4 mentioned later in planar view. Moreover, while 2 C of mounting areas are spaced apart from the frame 3, it is arrange|positioned so that it may also be spaced apart from the pedestal 4.

<frame>

The frame 3 is an insulating member joined through the bonding layer 3A around the surface 2A of the base material 2 . The frame 3 is joined to the base 2 so as to surround the mounting area 2C and the pedestal 4 in a plan view.

In the present embodiment, the frame 3 is a laminate in which a plurality of insulating layers are stacked on top of each other. Moreover, wiring (not shown) is arrange|positioned in the frame 3 . The wiring is a wiring pattern disposed on the surface of the insulating layer, a conductor penetrating the insulating layer, and a connection pad 9 configured to be electrically connected to the mounting parts 7 and 8 when current is required to the mounting parts 7 and 8. ) and so on.

Although the material of the insulating layer of the frame 3 is not particularly limited, the main component of the frame 3 is ceramic from the viewpoint of heat resistance. Examples of the ceramic include alumina, berryria, aluminum nitride, boron nitride, silicon nitride, and glass. These ceramics can be used individually or in combination of 2 or more types.

The bonding layer 3A is formed by solidification of a bonding material having fluidity. As melting|fusing point of 3 A of bonding layers, 300 degreeC or more is preferable. As a bonding material which forms the bonding layer 3A, a brazing material, a soft soldering material, a resin adhesive etc. are mentioned, for example. Among these, a brazing material or a soft brazing material is preferable from a heat resistant viewpoint. A silver brazing material is illustrated as a brazing material. As the soft brazing material, a gold tin soft brazing material is exemplified.

<Stand>

The pedestal 4 is a metal site formed in a region inside the frame 3 of the surface 2A of the base 2 .

In this embodiment, the base 4 and the base 2 are comprised integrally. The pedestal 4 is constituted by making a part of the surface 2A of the base material 2 rise. In other words, the pedestal 4 is a portion having a larger thickness than other portions of the base 2 .

A first mounting part 7 is arranged on the pedestal 4 . The first mounting part 7 is joined to the surface of the pedestal 4 with, for example, a brazing material, a soft brazing material, a resin adhesive, or the like. Moreover, the pedestal 4 is arrange|positioned so that it may be spaced apart from the frame 3 .

＜Regulatory Department＞

The regulating part 5 is comprised by the groove|channel arrange|positioned on the surface 2A of the base material 2 . This groove is a site|part in which the thickness of the base material 2 became smaller than the other site|part.

The regulating part 5 is arrange|positioned in at least one part of the area|region between 2 C of mounting areas and the frame 3 in planar view among 2 A of surfaces of the base material 2. As shown in FIG. Specifically, the regulating part 5 is arranged in an annular shape so as to continuously surround the pedestal 4 and the mounting area 2C in a plan view. Moreover, the regulating part 5 extends parallel to the inner edge of the frame 3 in planar view. That is, the regulating part 5 is arrange|positioned at the position offset inward by a predetermined distance from the inner edge of the frame 3 .

The regulating unit 5 includes a first area A1 disposed on the opposite side to the pedestal 4 with the mounting area 2C interposed therebetween, and the mounting area 2C and the pedestal 4 in the opposite direction (in FIG. 1A ). It is arranged over the second area A2 and the third area A3 with the mounting area 2C interposed therebetween in a direction perpendicular to the left and right direction (the vertical direction in Fig. 1A). That is, the control part 5 is arrange|positioned in the area|region where the pedestal 4 does not exist between the mounting area 2C and the frame 3 .

As for the depth of the groove|channel which comprises the control part 5, 1/2 or less of the thickness of the base material 2 is preferable. When the groove is too deep, the volume of the base material 2 is reduced, and there is a fear that the heat dissipation property may be lowered or the strength may be lowered. In addition, a part of the groove|channel which comprises the control part 5 may overlap with the base 4 or the mounting area 2C (namely, the 2nd mounting component 8) in planar view.

Moreover, the regulating part 5 may be comprised by the protrusion which protrudes from 2 A of surfaces of the base material 2 . By protruding the regulating portion 5, the bonding material can be guided out of the mounting area 2C even when the amount of flow of the bonding material is large. In addition, the regulating part 5 may be comprised by the combination of a groove|channel and a projection.

The height of the projection constituting the regulating portion 5 is preferably equal to or less than the height from the surface 2A of the substrate 2 to the formation position of the connection pad 9 . If the projection is too high, when connecting the first mounting part 7 and the second mounting part 8 and the connection pad 9 formed on the frame 3, the connecting means (wire bond, etc., not shown) will contact the base material. While there is a fear of short-circuiting, there is a fear that the workability at the time of the connection may be reduced.

<Mounted parts>

Each of the first mounting component 7 and the second mounting component 8 is a component that generates heat by movement.

For example, an LED (light emitting diode) or LD (laser diode) may be used as the first mounting component 7 , and an optical wavelength conversion member having a phosphor as the second mounting component 8 . By this combination, a wiring board for a light source such as a headlamp, various lighting equipment, and a laser projector can be obtained.

The first mounting part 7 and the second mounting part 8 are directly mounted on the base 4 or the base 2 after the frame 3 is joined to the base 2 by the bonding layer 3A. do. Moreover, when electricity is required to each mounting component, it is electrically connected to the connection pad 9 of the said frame 3 by wire bonding, for example.

[1-2. effect]

According to the embodiment described in detail above, the following effects are obtained.

(1a) At the time of bonding the base material 2 and the frame 3, the flow of the bonding material which forms the bonding layer 3A is regulated by the regulating part 5. As shown in FIG. Therefore, the inflow of the bonding material into the mounting area 2C can be suppressed without reducing the bonding area between the base 2 and the frame 3 .

(1b) The regulating part 5 is arranged in an annular shape so as to continuously surround the pedestal 4 and the mounting area 2C in a plan view, thereby more reliably preventing the inflow of the bonding material into the mounting area 2C. can be suppressed Moreover, formation of the fillet in the joint part of the pedestal 4 can also be suppressed. Therefore, the mounting failure of the 2nd mounting component 8 can be suppressed more reliably.

(1c) Since the pedestal 4 forms a protrusion on the surface of the base material 2, and the flowing bonding material tends to flow into the mounting area along the outer edge of the protrusion, the regulating part 5 is further function effectively.

(1d) Since the base 4 and the regulating part 5 are integrally configured with the base 2 , the pedestal 4 and the regulating part 5 can be easily formed. Moreover, since it can suppress that the flow of heat from the pedestal 4 to the base material 2 is inhibited, the heat dissipation property of the 1st mounting component 7 mounted on the pedestal 4 can be improved.

[2. second embodiment]

[2-1. composition]

The wiring board 11 shown in FIGS. 2A and 2B includes a base 2, a frame 3, a pedestal 4, a regulating part 15, a first mounting part 7, and a second mounting part 8. do. The base 2, the frame 3, the pedestal 4, the first mounting part 7, and the second mounting part 8 are the same as the wiring board 1 in Fig. 1A, so they are given the same reference numerals and the description thereof is omitted. do.

＜Regulatory Department＞

The regulating unit 15 includes a belt-shaped first portion 15A disposed on the opposite side to the pedestal 4 with the mounting area 2C interposed therebetween, and in the opposite direction between the mounting area 2C and the pedestal 4 . It has a belt-shaped second part 15B and a belt-shaped third part 15C which are arranged so as to sandwich the mounting area 2C in a direction perpendicular to each other.

The first part 15A is disposed so as to be spaced apart from the frame 3 and the mounting area 2C. The first portion 15A extends in a direction perpendicular to the opposing direction between the mounting area 2C and the pedestal 4 . In Fig. 2B, the first part 15A is constituted by protrusions, but the first part 15A may be constituted by grooves.

As for the 2nd part 15B and the 3rd part 15C, one edge part contact|connects 4 A of joint parts with the base material 2 of the pedestal 4, respectively. That is, the second part 15B and the third part 15C are separated from the pedestal 4 in the joint portion 4A of the pedestal 4 in the direction (that is, in FIG. 2A, the mounting area 2C and the pedestal ( 4) in a direction parallel to the opposite direction}. Each of the second portion 15B and the third portion 15C may be constituted by a groove or may be constituted by a projection.

The second part 15B and the third part 15C are not connected to the first part 15A. Therefore, in this embodiment, the area|region in which the regulating part 15 is not formed between 2 C of mounting areas and the frame 3 exists. That is, the mounting area 2C is discontinuously surrounded by the pedestal 4 and the regulating part 15 .

[2-2. effect]

According to the embodiment described in detail above, the following effects are obtained.

(2a) The joint portion of the pedestal 4, which is the outer edge of the protrusion through which the flowing bonding material easily flows, by the second portion 15B and the third portion 15C in contact with the joint portion 4A of the pedestal 4 By suppressing the inflow of the bonding material to (4A), the formation of fillets by the bonding material can be suppressed.

(2B) The frame 3 and the frame 3 on the opposite side to the pedestal 4 in the mounting area 2C by the first part 15A disposed on the opposite side to the pedestal 4 with the mounting area 2C interposed therebetween It can suppress that the bonding material which joins the base material 2 flows into 2 C of mounting areas. Moreover, in this embodiment, the bonding material which joins the frame 3 and the base material 2 on the side of the pedestal 4 in the mounting area 2C by the pedestal 4 flows into the mounting area 2C. is suppressed

(2c) In this embodiment, the regulating part 15 is arranged in the area|region where the pedestal does not exist between the mounting area 2C and the frame 3 among the area|region between the mounting area 2C and the frame 3 Thereby, while suppressing the inflow of the bonding material into the mounting area 2C, the formation location of the regulating part 15 can be reduced. Accordingly, it is possible to suppress the wiring board 11 from becoming unnecessarily large. Moreover, the number of processing steps with respect to the surface of the base material 2 can be reduced.

[3. third embodiment]

[3-1. composition]

The wiring board 21 shown in FIGS. 3A and 3B includes a base 2, a frame 3, a pedestal 4, a regulating part 25, a first mounting part 7, and a second mounting part 8. be prepared The base 2, the frame 3, the pedestal 4, the first mounting part 7, and the second mounting part 8 are the same as the wiring board 1 in Fig. 1A, so they are given the same reference numerals and the description thereof is omitted. do.

＜Regulatory Department＞

The regulating part 25 is perpendicular to the first area A1 disposed on the opposite side to the pedestal 4 with the mounting area 2C interposed therebetween, and the opposite direction between the mounting area 2C and the pedestal 4 . It is arrange|positioned over the 2nd area|region A2 and 3rd area|region A3 which sandwich the mounting area 2C in the direction.

Specifically, the regulating part 25 is arrange|positioned in the U-shape which both ends contact 4 A of joint parts with the base material 2 of the pedestal 4 . Accordingly, the mounting area 2C is continuously surrounded by the pedestal 4 and the regulating part 25 . Moreover, the regulating part 25 is arrange|positioned so that it may be spaced apart from the frame 3 . The regulating part 25 may be comprised by the groove|channel, and may be comprised by the projection.

[3-2. effect]

According to the embodiment described in detail above, the following effects are obtained.

(3a) By using the pedestal 4 and the regulating part 25 to surround the mounting area 2C, the inflow of the bonding material into the mounting area 2C can be suppressed. In addition, since both ends of the regulating part 25 are in contact with the joint portion 4A of the base 4 with the base material 2, the formation of fillets in the joint portion 4A of the base 4 can be suppressed. have.

[4. other embodiment]

As mentioned above, although embodiment of this indication was described, it cannot be overemphasized that this indication can employ|adopt various forms without being limited to the said embodiment.

(4a) The wiring boards 1, 11, and 21 of the above embodiment may include a plurality of pedestals (4). Conversely, the wiring boards 1 , 11 , and 21 may not necessarily include the pedestal 4 . Moreover, the base material 2 may have several mounting areas 2C.

(4b) In the wiring boards 1, 11, and 21 of the above embodiment, the pedestal 4 does not necessarily have to be formed integrally with the base 2 . For example, the base 4 may be joined to the base material 2 with a bonding material. Similarly, the projections constituting the regulating portions 5 , 15 , and 25 may not necessarily be formed integrally with the base material 2 . In addition, when the base 4 is prepared as a member separate from the base 2 and the base 4 and the base 2 are joined, the material of the base 4 is the same as or different from that of the base 2 . may be formed. When the base 4 and the base 2 are formed of different materials, the material of the base 4 is excellent in heat dissipation such as, for example, aluminum nitride, alumina, copper, copper alloy, copper composite, aluminum, or iron-nickel alloy. material is preferred.

(4c) In the wiring boards 1, 11, and 21 of the above embodiment, the mounting area 2C is always surrounded by the regulating part 5 or the combination of the pedestal 4 and the regulating parts 15 and 25. it's okay not to be For example, in the wiring board 11 of Fig. 2A, the regulating portion 15 may have only one of the first portion 15A, the second portion 15B, and the third portion 15C.

(4d) The wiring boards 1, 11, and 21 of the above embodiment may not include at least one of the first mounting component 7 and the second mounting component 8. As shown in FIG. That is, the present disclosure is a concept including a wiring board before some or all of the mounting components among a plurality of mounting components mounted on the wiring board are mounted.

(4e) The function of one component in the above embodiment may be dispersed as a plurality of components, or the functions of a plurality of components may be integrated into one component. In addition, you may abbreviate|omit a part of the structure of the said embodiment. Moreover, at least a part of the structure of the said embodiment may be added or substituted with respect to the structure of another said embodiment. In addition, all the forms included in the technical thought specified from the wording of a claim are embodiment of this indication.

[5. Example]

Below, the content of the test performed in order to confirm the effect of this indication, and its evaluation are demonstrated.

<Example 1>

The frame 3 was brazed to the base 2 (average thickness of the portions excluding the protrusions of 500 mu m) formed with the regulating portions 25 in Fig. 3A as protrusions. It was 20 micrometers when the thickness of the fillet formed in the joint part of the pedestal 4 with a brazing material was measured. In addition, the inflow of the brazing material (that is, the bonding material) to the mounting area 2C was not confirmed.

<Comparative Example 1>

The frame 3 was soldered to the base 2 (thickness is the same as in Example 1) on which the regulating part 25 of Fig. 3A was not formed. It was 51 micrometers when the thickness of the fillet formed in the joint part of the pedestal 4 with a brazing material was measured. Further, in the mounting area 2C, a brazing material (ie, a bonding material) flowed in from the side opposite to the pedestal 4, and a step difference of 10 µm was confirmed in the mounting area 2C.

<Consideration>

From the result of Example 1 and the comparative example 1, it was shown that formation of the fillet in the joint part of the pedestal 4 can be suppressed by the control part 25. Moreover, it was shown that it can suppress that a bonding material flows into 2 C of mounting areas.

1 - wiring board 2 - substrate
2A - surface 2B - back surface
2C - Mounting Area 3 - Frame
3A - Bonding Layer 4 - Pedestal
4A - Joint part 5 - Regulatory part
7 - First Mounting Part 8 - Second Mounting Part
11 - wiring board 15 - regulation part
15A - Part 1 15B - Part 2
15C - Part 3 21 - Wiring boards
25 - Regulatory Department

Claims (13)

A wiring board comprising: a metal substrate having a front surface and a back surface; and an insulating frame bonded to the surface of the substrate through a bonding layer made of a bonding material,
Further comprising a regulating portion constituted by a groove disposed on the surface of the substrate,
The surface of the substrate has a mounting area in which mounting parts are scheduled,
and the regulating portion is disposed on at least a portion of the surface of the region between the mounting area and the frame in a plan view.
The method according to claim 1,
A wiring board further comprising a pedestal formed in a region of the surface of the base material that is inner than the frame body and in a region different from the mounting area.
delete A wiring board comprising: a metal substrate having a front surface and a back surface; and an insulating frame bonded to the surface of the substrate through a bonding layer made of a bonding material,
Further comprising a regulating portion constituted by a groove, a projection, or a combination thereof arranged on the surface of the substrate,
The surface of the substrate has a mounting area in which mounting parts are scheduled,
The regulating part is disposed on at least a part of a region between the mounting area and the frame body in a plan view among the surfaces,
and a pedestal formed in a region inside the frame of the surface of the substrate and in a region different from the mounting area,
and the regulating portion is disposed in a region between the mounting area and the frame in which the pedestal does not exist among the regions between the mounting area and the frame.
A wiring board comprising: a metal substrate having a front surface and a back surface; and an insulating frame bonded to the surface of the substrate through a bonding layer made of a bonding material,
Further comprising a regulating portion constituted by a groove, a projection, or a combination thereof arranged on the surface of the substrate,
The surface of the substrate has a mounting area in which mounting parts are scheduled,
The regulating part is disposed on at least a part of a region between the mounting area and the frame body in a plan view among the surfaces,
and a pedestal formed in a region inside the frame of the surface of the substrate and in a region different from the mounting area,
The regulating part is in contact with a joint portion of the pedestal with the base material.
6. The method of claim 5,
The mounting area is continuously surrounded by the pedestal and the regulating part.
A wiring board comprising: a metal substrate having a front surface and a back surface; and an insulating frame bonded to the surface of the substrate through a bonding layer made of a bonding material,
Further comprising a regulating portion constituted by a groove, a projection, or a combination thereof arranged on the surface of the substrate,
The surface of the substrate has a mounting area in which mounting parts are scheduled,
The regulating part is disposed on at least a part of a region between the mounting area and the frame body in a plan view among the surfaces,
and a pedestal formed in a region inside the frame of the surface of the substrate and in a region different from the mounting area,
The regulating part is composed of at least the groove, and the depth of the groove is 1/2 or less of the thickness of the substrate.
8. The method according to any one of claims 4, 5 or 7,
The regulating part is a wiring board comprising at least the protrusion.
9. The method of claim 8,
A connection pad formed on the frame and electrically connected to the mounting part is further provided,
The height of the protrusion is equal to or less than a height from the surface of the substrate to the formation position of the connection pad.
8. The method according to any one of claims 1, 4, 5 or 7,
The frame is a wiring board having a ceramic content of 90% by mass or more.
8. The method according to any one of claims 1, 4, 5 or 7,
The substrate is a wiring board composed of at least one of copper, a copper alloy, and a copper composite.
8. The method according to any one of claims 1, 4, 5 or 7,
The wiring board further comprising the mounting component mounted in the mounting area.
8. The method according to any one of claims 2, 4, 5, 6 or 7,
The pedestal and the regulating part are configured integrally with the substrate.

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