KR20190061453A - Rigid flexible printed circuit board and the manufacturing method thereof - Google Patents

Abstract

Disclosed is a rigid flexible printed circuit board having a fine pattern formed thereon. According to an aspect of the present invention, the rigid flexible printed circuit board comprises: a flexible insulating unit including a flexible region and a rigid region; a first inner layer conductor pattern layer embedded in the flexible insulating unit to be exposed to one surface of the flexible insulating unit; a second inner layer conductor pattern layer including a seed metal foil, an electroless plating layer formed on the seed metal foil, and an electroplating layer formed on the electroless plating layer, and formed on the other surface of the flexible insulating unit; and a rigid insulating unit formed in the flexible insulating unit and arranged in the rigid region.

Description

TECHNICAL FIELD [0001] The present invention relates to a rigid flexible printed circuit board and a method of manufacturing the rigid flexible printed circuit board.

The present invention relates to a rigid flexible printed circuit board and a method of manufacturing a rigid flexible printed circuit board.

A flexible area is formed on the rigid flexible printed circuit board. Thus, in the case of a rigid flexible printed circuit board, unlike a typical rigid printed circuit board, it is possible to bend.

Such a rigid flexible printed circuit board is often used in electronic equipment such as a smart phone having a limited layout space.

In recent years, high-density and finer conductor patterns have been required in rigid flexible printed circuit boards as electronic devices have become more sophisticated.

Korean Patent Publication No. 10-2005-0029042 (published on October 13, 2006)

According to one embodiment of the present invention, a rigid flexible printed circuit board on which a fine pattern is formed can be provided.

According to another embodiment of the present invention, a rigid flexible printed circuit board with improved wiring density can be provided.

1 shows a rigid flexible printed circuit board according to a first embodiment of the present invention.
2 is an enlarged view of a portion A in Fig.
3 shows a rigid flexible printed circuit board according to a second embodiment of the present invention.
4 is an enlarged view of a portion B in Fig.
5 shows a rigid flexible printed circuit board according to a third embodiment of the present invention.
6 is a view showing a rigid flexible printed circuit board according to a fourth embodiment of the present invention.
7 shows a rigid flexible printed circuit board according to a fifth embodiment of the present invention.
FIGS. 8 to 23 are diagrams sequentially illustrating manufacturing steps for explaining a method of manufacturing a rigid flexible printed circuit board according to an embodiment of the present invention; FIGS.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof. In the specification, " on " means to be located above or below the object portion, and does not necessarily mean that the object is located on the upper side with respect to the gravitational direction.

In addition, the term " coupled " is used not only in the case of direct physical contact between the respective constituent elements in the contact relation between the constituent elements, but also means that other constituent elements are interposed between the constituent elements, Use them as a concept to cover each contact.

The sizes and thicknesses of the respective components shown in the drawings are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited to those shown in the drawings.

Hereinafter, embodiments of a rigid flexible printed circuit board and a method of manufacturing a rigid flexible printed circuit board according to the present invention will be described in detail with reference to the accompanying drawings, wherein like reference numerals refer to like or corresponding components Are denoted by the same reference numerals, and redundant description thereof will be omitted.

Rigid Flexible  Printed circuit board

1 to 7, the flexible region F and the rigid region R are partial regions of the rigid flexible printed circuit boards 1000, 2000, 3000, 4000 and 5000, respectively. However, The flexible portion F and the rigid region R which are the regions of the rigid flexible printed circuit boards 1000, 2000, 3000, 4000 and 5000 will be described.

That is, the flexible area (F) of the flexible insulation part means a part of the flexible insulation part corresponding to the flexible area (F) of the rigid flexible printed circuit board. Similarly, the term " rigid region R " of the flexible insulation portion refers to another portion of the flexible insulation portion corresponding to the rigid region R of the rigid flexible printed circuit board.

(First Example )

1 is a view showing a printed circuit board according to a first embodiment of the present invention. 2 is an enlarged view of a portion A in Fig.

1 and 2, a rigid flexible printed circuit board 1000 according to a first embodiment of the present invention includes a flexible insulating part 100, a first rigid insulating part 400, a second rigid insulating part 500 The first inner conductor pattern layer 10, the second inner conductor pattern layer 20, the inner layer via hole (IVH), the inner layer via (IV) and the coverlay (600).

The flexible insulation portion 100 includes a flexible region F and a rigid region R. [ Specifically, the flexible insulation portion 100 is formed integrally with the flexible region F and the rigid region R continuously.

The flexible insulating member 100 may include a flexible insulating layer 120 and an adhesive layer 110. The adhesive layer 110 bonds the flexible insulating layer 120 and a first inner layer conductor pattern layer 10 to be described later.

The adhesive layer 110 may include, but is not limited to, polyimide (PI).

The flexible insulating layer 120 may be formed of a polyimide (PI) film, but is not limited thereto. That is, any flexible electrical insulating material can be used as the flexible insulating layer 120 applied to the present embodiment without limitation.

The adhesive layer 110 and the flexible insulating layer 120 may be simultaneously formed of a flexible metal clad laminate such as a flexible copper clad laminate (FCCL) in which a metal foil is formed on only one side and a metal foil is not formed on the other side . Alternatively, the adhesive layer 110 and the flexible insulating layer 120 may be sequentially formed.

The first inner conductor pattern layer 10 is embedded in the flexible insulation part 100 so that one side thereof is exposed to one side of the flexible insulation part 100. Specifically, the first inner conductor pattern layer 10 is embedded in the adhesive layer 110, and one side of the first inner conductor pattern layer 10 is exposed to one side of the adhesive layer 110. Except for one surface of the first inner conductor pattern layer 10, is covered by the flexible insulating portion 100. [

The second inner conductor pattern layer 20 is formed on the first seed metal foil 21 and the first electroless plating layer 22 formed on the first seed metal foil 21 and the first inner metal conductor pattern layer 22 formed on the first electroless plating layer 22, And includes an electrolytic plating layer 23, and is formed on the other surface of the flexible insulating portion 100. The second inner conductor pattern layer 20 is protruded from the other surface of the flexible insulation part 100.

The first seed metal foil 21 may be formed by partially remaining the metal foil of the one-sided flexible metal laminate. The first electroless plating layer 22 functions as a power supply layer together with the first seed metal foil 21 in forming the first electroplating layer 23 by electrolytic plating. The first electroplating layer 23 is formed by electrolytic plating.

The inner layer vias IV are formed so as to penetrate the flexible insulating portion 100 to connect the first inner conductor pattern layer 10 and the second inner conductor pattern layer 20. Specifically, the inner layer via hole IVH is formed in the flexible insulating portion 100 so as to expose a part of the other surface of the first inner layer conductor pattern layer 10, and the inner layer via IV is formed in the inner layer via hole IVH, The first inner conductor pattern layer 10 and the second inner conductor pattern layer 20 may be connected to each other by the inner layer vias IV.

At this time, the first electroless plating layer 22 is formed on one surface of the first seed metal foil 21, the side surface of the inner layer via hole IVH, and the first inner layer conductor pattern layer 10 which is the bottom surface of the inner layer via hole IVH Respectively. 1 and 2, the first electroless plated layer 22 extends from the upper surface of the first seed metal foil 21 to the side wall of the inner layer via hole IVH and the bottom surface of the inner layer via hole IVH.

The inner layer vias (IV) may be formed by electrolytic plating. In this case, the inner layer vias IV and the first electroplating layer 23 may be formed by the same electrolytic plating process and integrally formed.

 The inner layer vias IV may be field vias filling the inner layer via holes IVH. However, this is merely an example. The inner layer vias IV may be formed in the form of a conformal via, unlike those shown in Figs. 1 and 2.

The inner layer vias IV may be formed in such a shape that the diameter decreases from one end of the inner layer conductor pattern layer 20 to the other end thereof formed on the first inner conductor pattern layer 10 side. That is, the inner layer vias IV may be formed in a tapered shape. However, since this is merely an example, the inner layer vias IV may be formed in a shape in which the diameter of one end and the diameter of the other end are the same.

The explanation on the diameter of the inner layer via IV is also applied to the inner layer via hole IVH in which the inner layer via IV is formed.

The first rigid insulation part 400 is formed on the other surface of the flexible insulation part 100. The second rigid insulating part 500 is formed on one surface of the flexible insulating part 100.

Each of the first rigid insulating part 400 and the second rigid insulating part 500 may have an opening part 700 formed in the flexible area F. [ The opening portion 700 is formed in the flexible region F of the flexible insulating portion 100 and the first inner conductor pattern layer 10 and the second inner conductor pattern layer 20 disposed in the flexible region F, Expose some of them.

The first rigid insulating portion 400 and the second rigid insulating portion 500 may be formed of a prepreg (PPG) containing an insulating resin such as an epoxy resin. Alternatively, the first rigid insulating portion 400 and the second rigid insulating portion 500 may be formed of an insulating film such as ABIN (Ajinomoto Build-up Film) including an insulating resin such as epoxy resin. Alternatively, the first rigid insulating portion 400 and the second rigid insulating portion 500 may be a photosensitive insulating layer including a photosensitive electric insulating resin.

The prepreg (PPG) may be of low-flow type, but is not limited thereto.

The first rigid insulating portion 400 and the second rigid insulating portion 500 may include a reinforcing material contained in the electrically insulating resin. The reinforcing material may be at least one of glass cloth, glass fiber, inorganic filler and organic filler. The reinforcing material can reinforce the rigidity of the first rigid insulating part 400 and the second rigid insulating part 500 and lower the thermal expansion coefficient.

As the inorganic filler, silica (SiO ₂ ), alumina (Al ₂ O ₃ ), silicon carbide (SiC), barium sulfate (BaSO ₄ ), talc, clay, mica powder, aluminum hydroxide (AlOH ₃ ), magnesium hydroxide OH) ₂ ), calcium carbonate (CaCO ₃ ), magnesium carbonate (MgCO ₃ ), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO ₃ ), barium titanate (BaTiO ₃ ) and calcium zirconate ₃ ) may be used.

The first outer conductor pattern layer 40 is formed in the first rigid insulating portion 400. The second outer conductor pattern layer 50 is formed on the second rigid insulating portion 500.

The first outer conductor pattern layer 40 is formed on the third seed metal foil 41 and the third electroless plating layer 42 formed on the third seed metal foil 41 and on the third electroless plating layer 42 formed on the third electroless plating layer 42. [ 3 electrolytic plating layer 43 as shown in FIG.

The second outer conductor pattern layer 50 is formed on the fourth seed metal foil 51 and the fourth electroless plating layer 52 formed on the fourth seed metal foil 51 and on the fourth electroless plating layer 52 formed on the fourth electroless plating layer 52. [ 4 electrolytic plating layer 53 as shown in Fig.

The outer layer vias BV may be formed in the first rigid insulating portion 400 to connect the first outer conductor pattern layer 40 and the second inner conductor pattern layer 20. The outer layer vias BV may be formed in the second rigid insulating portion 500 to connect the second outer conductor pattern layer 50 and the first inner conductor pattern layer 10.

At this time, the third electroless plating layer 42 formed on one surface of the third seed metal foil 41 may be formed to extend to the side wall of the outer layer via hole and the bottom surface of the outer layer via hole. The fourth electroless plating layer 52 formed on one surface of the fourth seed metal foil 51 may be formed to extend to the side wall of the outer layer via hole and the bottom surface of the outer layer via hole.

The outer layer vias BV formed in the first rigid insulating portion 400 may be formed integrally with the third electrolytic plating layer 43. The outer layer via BV formed in the second rigid insulating portion 500 may be formed integrally with the fourth electrolytic plating layer 43.

1, the first outer conductor pattern layer 40 and the outer layer vias BV formed on the first rigid insulating portion 400 are formed on the assumption that the first rigid insulating portion 400 is formed as one layer, Layer is formed, but this is merely an illustrative example. That is, the first rigid insulating portions 400 may be formed in plural and sequentially stacked. In this case, the first outer conductor pattern layer 40 and the outer layer vias BV may be formed of a plurality of layers corresponding to the number of the first rigid insulating portions 400. This description can be similarly applied to the second rigid insulating portion 500, the second outer conductor pattern layer 50 formed in the second rigid insulating portion 500, and the outer layer via BV.

The coverlay 600 is formed on both sides of the flexible insulating portion 100 and includes a first inner conductor pattern layer 10 disposed in the flexible area F and a second inner conductor pattern 60 disposed in the flexible area F. [ Covering the layer (20). That is, the coverlay 600 is formed on the flexible insulation portion 100 exposed by the opening portion 700, so that the first inner conductor pattern layer 10 and the second inner conductor conductor pattern 10, which are disposed in the flexible region F, Thereby protecting the layer 20.

The coverlay 600 may be formed as a single layer structure of a polyimide film or may be formed as a multi-layer structure such as a polyimide film formed on an adhesive layer and an adhesive layer.

The solder resist layer SR shown in Fig. 1 is composed of the first outer conductor pattern layer 40 and the second outer conductor pattern layer 50, which are the outermost conductor pattern layers of the rigid flexible printed circuit board 1000 according to the present embodiment The first rigid insulating portion 400 and the second rigid insulating portion 500 are formed to protect the first rigid insulating portion 400 and the second rigid insulating portion 500, respectively.

An opening SRO is formed in the solder resist layer SR so as to expose at least a part of the first outer-layer conductor pattern layer 40 and / or the second outer-layer conductor pattern layer 50.

The solder resist layer SR may include, but is not limited to, a photosensitive insulating resin. When the solder resist layer SR includes a photosensitive insulating resin, the opening SRO may be formed by a photolithography process.

On the other hand, each of the first inner conductor pattern layer 10, the second inner conductor pattern layer 20, the first outer conductor pattern layer 40, and the second outer conductor pattern layer 50 may be formed of a via pad, , A power pattern, a ground pattern, and an external connection pad.

The first seed metal foil 21, the third seed metal foil 41, the fourth seed metal foil 51, the first electroless plating layer 22, the third electroless plating layer 22, The fourth electroless plating layer 52, the first electroplating layer 23, the third electroplating layer 43, the fourth electroplating layer 53, the inner layer vias IV and the outer layer vias And may include copper (Cu), silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), platinum (Pt) and the like excellent in electrical characteristics.

By doing so, the rigid flexible printed circuit board 1000 according to the present embodiment can finely form the first inner conductor pattern layer 10 and the second inner conductor pattern layer 20 formed in the flexible insulating portion 100 .

(Second Example )

3 is a view illustrating a printed circuit board according to a second embodiment of the present invention. 4 is an enlarged view of a portion B in Fig.

The rigid flexible printed circuit board 2000 according to the present embodiment and the printed circuit board 1000 according to the first embodiment of the present invention are compared with each other with reference to Figs. 1 to 4. In the first inner conductor pattern layer 10, And the second rigid insulating portion 500 are different.

Therefore, in describing the present embodiment, differences between the present embodiment and the first embodiment will be mainly described. The remaining configuration of the present embodiment can be applied as it is to the printed circuit board 1000 according to the first embodiment of the present invention.

Referring to FIGS. 3 and 4, grooves 800 are formed on one surface of the first inner conductor pattern layer 10. That is, a step is formed between one surface of the first inner conductor pattern layer 10 and one surface of the flexible insulating portion 100.

The grooves 800 are formed by the manufacturing method features of the present invention. 8 (C)) after the first inner conductor pattern layer 10 is formed on the ultra-thin metal layer (M2 in Fig. 8) of the carrier (Fig. 8C) and the flexible insulating layer 100 is laminated, . The carrier (C in Fig. 8) can be removed by separating the interface between the ultra-thin metal layer M2 and the carrier metal layer M1. Therefore, the ultra thin metal layer M2 of the carrier (C in Fig. 8) remains attached to one surface of the flexible insulating layer 100. [ The extreme thin metal layer M2 is removed by etching from one surface of the flexible insulating layer 100. If the extreme thin metal layer M2 and the first inner conductor pattern layer 10 contain the same metal, A part of the first inner conductor pattern layer 10 can be removed together with the etching solution for forming the first inner conductor pattern layer 10. As a result, a groove 800 is formed on one surface of the first inner conductor pattern layer 10.

The second rigid insulating part 500 is formed on one surface of the flexible insulating part 100 to fill the groove 800.

(Third Example )

5 is a view illustrating a printed circuit board according to a third embodiment of the present invention.

1, 2 and 5, the rigid flexible printed circuit board 3000 according to the present embodiment is compared with the printed circuit board 1000 according to the first embodiment of the present invention, The number of layers of the pattern layer and the inner layer vias is different.

That is, in this embodiment, a plurality of flexible insulation parts 100 and 200 are formed unlike the first embodiment of the present invention. Thus, a plurality of layers of the inner conductor pattern layers 10, 20, 30 and the inner layer vias IV1, IV2 are formed.

Specifically, in the case of this embodiment, the second flexible insulating portion 200 is formed in the first flexible insulating portion 100, and the third inner conductive pattern layer 300 is formed in the second flexible insulating portion 200 . The first inner layer via hole IVH1 and the first inner layer via IV1 are formed in the first flexible insulation portion 100 and the second inner layer via hole IVH2 and the second inner layer via hole IVH2 are formed in the second flexible insulation portion 200, The via IV2 is formed.

The description of the flexible insulation portion (100 in Fig. 1) in the first embodiment of the present invention can be applied to the second flexible insulation portion 200. [

The third inner conductor pattern layer 30 is formed on the second seed metal foil 31 and the second electroless plated layer 32 formed on the second seed metal foil 31 and the second inner metal conductor pattern layer 30 on the second electroless plated layer 32, And an electrolytic plating layer 33.

The description of the second inner conductor pattern layer (20 in FIG. 1) in the first embodiment of the present invention can be applied to the third inner conductor pattern layer 30.

The description of the inner layer via hole (IVH in Fig. 1) and the inner layer via IV in the first embodiment of the present invention can be applied to the second inner layer via hole IVH2 and the second inner layer via hole IV2.

(Fourth Example  And fifth Example )

6 is a view showing a printed circuit board according to a fourth embodiment of the present invention. 7 is a view illustrating a printed circuit board according to a fifth embodiment of the present invention.

A rigid flexible printed circuit board 4000 according to the fourth embodiment of the present invention and a rigid flexible printed circuit board 5000 according to the fifth embodiment of the present invention are described with reference to Figs. 1, 2, 6, and 7, The printed circuit board 1000 according to the first embodiment of the present invention is different from that of the first outer conductor pattern layer 40, the second outer conductor pattern layer 50 and the outer layer vias BV, Explained mainly. The description of the first embodiment of the present invention can be applied to the remaining configuration of the present embodiment as it is.

In the case of the rigid flexible printed circuit board 4000 according to the fourth embodiment of the present invention, the first outer conductor pattern layer 40, the second outer conductor pattern layer 50 and the outer layer vias BV are formed by the subtractive method Subtractive Process).

That is, each of the first outer conductor pattern layer 40 and the second outer conductor pattern layer 50 is formed by forming a first outer conductor pattern layer formed on each of the first rigid insulating portion 400 and the second rigid insulating portion 500 And selectively removing the metal layer for forming the first outer conductor pattern layer and the metal layer for forming the second outer layer conductor pattern layer.

Each of the first outer conductor pattern layer 40 and the second outer conductor pattern layer 50 is formed of a conductive material that is in contact with the first rigid insulating portion 400 and the second rigid insulating portion 500, And the cross-sectional area decreases along the direction toward the other end. That is, each of the first outer conductor pattern layer 40 and the second outer conductor pattern layer 50 may be formed in a tapered shape.

Each of the first outer conductor pattern layer 40 and the second outer conductor pattern layer 50 may be formed of copper (Cu), silver (Ag), palladium (Pd), aluminum (Al) Titanium (Ti), gold (Au), platinum (Pt), and the like.

The outer layer vias (BV) may be formed by plating. To this end, a third electroless plated layer 42 may be formed on the side wall and the bottom of the outer layer via hole formed in the first rigid insulating portion 400, and an inner wall of the outer layer via hole formed in the second rigid insulating portion 500 And a fourth electroless plating layer 52 may be formed on the bottom surface. Unlike the first embodiment of the present invention, in this embodiment, each of the third electroless plated layer 42 and the fourth electroless plated layer 52 is formed only on the side wall and the bottom surface of the outer layer via hole.

In the case of the rigid flexible printed circuit board 5000 according to the fifth embodiment of the present invention, the first outer conductor pattern layer 40, the second outer conductor pattern layer 50 and the outer layer vias (BV) (Semi Additive Process).

That is, in the present embodiment, the third electroless plating layer 42 and the fourth electroless plating layer 52 are different from the first embodiment in that the first rigid insulating portion 400 and the second rigid insulating portion 500 .

Rigid Flexible  Manufacturing method of printed circuit board

FIGS. 8 to 23 are views sequentially illustrating manufacturing steps to explain a method of manufacturing a rigid flexible printed circuit board according to an embodiment of the present invention.

8 to 23, a method of manufacturing a rigid flexible printed circuit board according to an embodiment of the present invention includes: forming a first inner conductor pattern layer on one side of a carrier; Forming a flexible insulating portion on one surface of the carrier so as to cover the first inner conductor pattern layer; Forming a second inner conductor pattern layer including a seed metal foil, an electroless plating layer and an electrolytic plating layer on the flexible insulating portion; Removing the carrier; And forming a rigid insulating portion having an open portion in the flexible insulating portion.

On the other hand, the flexible region F and the rigid region R are regions in a rigid flexible printed circuit board which is a final product manufactured by the manufacturing method according to the present embodiment, The flexible area F and the rigid area R, which are partial areas of the printed circuit board, will be described.

By way of example, the flexible region F and the rigid region R of the carrier C mean that the region corresponds to the flexible region F and the rigid region R of the rigid flexible printed circuit board use.

8 to 14 show that the process is performed on both sides of the carrier C, the manufacturing process will be described below with reference to one side of the carrier for convenience of explanation.

8 to 10, a first inner conductor pattern layer is formed on one side of the carrier.

The carrier C may be a conventional subsidiary material used for carrying out the coreless process. The carrier C may have a structure including a support member S, a carrier metal layer M1 formed on both surfaces of the support member, and an ultra-thin metal layer M2 formed on the carrier metal layer M1. Alternatively, the carrier C may be a structure including a support member, an ultra-thin metal layer, and a release layer interposed between the support member and the ultra-thin metal layer.

The carrier C used in the present embodiment includes a support member S, a carrier copper foil M1 formed on both sides of the support member S and an ultra-thin copper foil M2 formed on the carrier copper foil M1.

The first inner layer conductor pattern layer 10 is formed by forming a first plating resist pattern DF1 on one side of the carrier C and performing electrolytic copper plating using the ultra thin copper foil M1 as a power supply layer, (DF1).

The first plating resist pattern DF1 may be formed by laminating a dry film on one side of the carrier C and then performing a photolithography process.

After the formation of the first inner conductor pattern layer 10, the first plating resist pattern DF1 is removed from the carrier C.

Referring to FIG. 11, a flexible insulating portion is formed on one surface of the carrier so as to cover the first inner conductor pattern layer.

The flexible insulating member 100 can be formed at the same time by laminating a flexible insulating material including the adhesive layer 110 and the flexible insulating layer 120 formed on the adhesive layer 110 on the carrier C. [ The flexible insulating member 100 may be formed by first forming the adhesive layer 110 on one side of the carrier C and then bonding the flexible insulating layer 120 to the adhesive layer 110. [

11 to 14, a second inner conductor pattern layer including a first seed metal foil, a first electroless plating layer, and a first electrolytic plating layer is formed on the flexible insulating portion.

First, as shown in Fig. 11, the first seed metal foil 21 is formed on the other surface of the flexible insulation part 100

The first seed metal foil 21 can be formed simultaneously with the flexible insulating portion 100 by stacking the flexible metal laminate plate such as the flexible copper clad laminate (FCCL) on the carrier C. [ The first seed metal foil 21 may be formed on the flexible insulating portion 100 after the flexible insulating portion 100 is first formed on the carrier C since it is only an example.

12, an inner layer via hole IVH penetrating the first seed metal foil 21 and the flexible insulating portion 100 is processed to form a flexible insulation portion including the inner wall of the inner layer via hole IVH, The first electroless plating layer 22 is formed on the surface of the substrate 100.

The inner layer via hole (IVH) may be formed by a laser drill or a mechanical drill. The inner layer via hole (IVH) penetrates the flexible insulating portion (100) so as to expose at least a part of the other surface of the first inner layer conductor pattern layer (10).

The first electroless plating layer 22 may be formed through electroless copper plating.

13, a second plating resist pattern DF2 is formed on the first electroless plating layer 22, and an opening of the second plating resist pattern DF2 is formed on the first electroplating layer DF2 by electrolytic plating. (23).

The second plating resist pattern DF2 may be formed by laminating a dry film so as to cover the first electroless plating layer 22 and then performing a photolithography process.

Thereafter, as shown in Fig. 14, the second plating resist pattern DF2 is removed after the first electroplating layer 23 is formed.

15, the carrier is removed from the flexible insulation portion.

The carrier C is removed from the flexible insulating portion 100 by separation at the interface between the carrier copper foil M1 and the ultra-thin copper foil M2. Therefore, the ultra-thin copper foil M2 of the carrier C remains on one surface of the flexible insulating layer 100 in which the first inner conductor pattern layer 10 is embedded.

16, the ultra-thin copper foil and the exposed first seed metal foil and the first electroless plating layer are removed from the flexible insulating portion.

The ultra-thin copper foil M2, the first seed metal foil 21 and the first electroless plating layer 22 may be removed by flash etching or half etching or the like. One side of the first inner conductor pattern layer 10 is exposed to one side of the flexible insulation part 100 by removing the ultra-thin copper foil M2.

Meanwhile, in the process of removing the ultra-thin copper foil M2, a part of the first inner conductor pattern layer 300 may be formed of copper Can be removed together. That is, the groove (R in Fig. 4) described in the rigid flexible printed circuit board 2000 according to the second embodiment of the present invention can be formed in the present process.

Referring to Fig. 17, a coverlay is formed and a first rigid insulating portion and a second rigid insulating portion are formed.

After the ultra thin copper foil M2 is removed from the flexible insulation portion 100, the coverlay 600 is formed in the flexible region F of the flexible insulation portion 100, respectively. That is, the coverlay 600 is formed in a portion of the first inner conductor pattern layer 10 disposed in the flexible region F and a portion of the second inner conductor pattern layer 20 formed in the flexible region F, respectively .

The openings 700 corresponding to the flexible region F are formed so that the first rigid insulating portion 400 and the second rigid insulating portion 500 are formed only in the rigid region R of the flexible insulating portion 100.

The first rigid insulating part 400, the second rigid insulating part 500 and the opening part 700 are formed by laminating a hard insulating material having a cavity corresponding to the opening part 700 in advance on the flexible insulating part 100 Or by laminating the hard insulating material on the flexible insulating portion 100 and then processing the opening portion 700 in the flexible region F of the hard insulating material.

The first rigid insulating portion 400 and the third seed metal foil 41 are formed on the other surface of the flexible insulating portion 100 at the same time by using a material having a metal foil formed on only one side of the rigid insulating layer such as RCC (Resin Coated Copper) . The second rigid insulating portion 500 and the fourth seed metal foil 51 may be simultaneously formed on one surface of the flexible insulating portion 100 by using the above-described material.

Referring to Fig. 18, an outer layer via hole passing through the third seed metal foil and the first rigid insulating portion is processed.

The outer layer via hole (BVH) may be formed by a laser drill or a mechanical drill. The outer layer via hole (BVH) formed in the first rigid insulating portion (400) penetrates the first rigid insulating portion (400) so as to expose at least a part of the second inner conductor pattern layer (20).

The outer layer via hole (BVH) may expose at least a part of the first inner conductor pattern layer 10 through the fourth seed metal foil 51 and the second rigid insulating part 500.

19, the third electroless plating layer 42 and the fourth electroless plating layer 42 are formed on the surfaces of the first rigid insulating portion 400 and the second rigid insulating portion 500 including the inner wall of the outer layer via hole BVH, A plating layer 52 is formed.

The third electroless plating layer 42 and the fourth electroless plating layer 52 may be simultaneously formed through the same electroless plating process.

20, a third plating resist pattern DF3 and a fourth plating resist pattern DF4 are formed on the third electroless plating layer 42 and the fourth electroless plating layer 52, respectively.

Each of the third plating resist pattern DF3 and the fourth plating resist pattern DF4 is formed by laminating a dry film so as to cover the third electroless plating layer 42 and the fourth electroless plating layer 52 and then performing a photolithography process . ≪ / RTI >

21, a third electroplating layer 43 and a fourth electroplating layer 53 are formed in the openings of the third plating resist pattern DF3 and the fourth plating resist pattern DF4, respectively.

The third electroplating layer 43 and the fourth electroplating layer 53 may be simultaneously formed through the same electroplating process. However, since this is only an example, the third electroplating layer 43 and the fourth electroplating layer 53 may be formed in different electrolytic plating processes depending on design requirements and the like.

22, after removing the third plating resist pattern DF3 and the fourth plating resist pattern DF4, the third seed metal foil 41, the third electroless plating layer 42, the fourth seed metal foil 51, And the portions of the fourth electroless plating layer 52 that are not covered by the third electroplating layer 43 and the fourth electroplating layer 53 are removed.

The exposed third seed metal foil 41, the third electroless plating layer 42, the fourth seed metal foil 51 and the fourth electroless plating layer 52 may be removed by flash etching, half etching, or the like.

23, an opening (not shown) is formed in each of the first rigid insulating portion 400 and the second rigid insulating portion 500 so as to cover each of the first outer conductive pattern layer 40 and the second outer conductive pattern layer 50 SRO) is formed on the solder resist layer SR.

The solder resist layer SR and the opening SRO can be formed by laminating a photosensitive solder resist film to the first rigid insulating portion 400 and the second rigid insulating portion 500 respectively and performing a photolithography process have.

By doing so, the rigid flexible printed circuit board 1000 according to the first embodiment of the present invention can be manufactured.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

10: first inner layer conductor pattern layer
20: second inner layer conductor pattern layer
30: Third inner layer conductor pattern layer
40: First outer layer conductor pattern layer
50: second outer layer conductor pattern layer
21, 31, 41, 51: seed metal foil
22, 32, 42, 52: electroless plating layer
23, 33, 43, 53: Electroplating layer
100, 200: Flexible insulation part
110, 210: adhesive layer
120, 220: Flexible insulation layer
400, 500: Rigid insulating portion
600: Cover Ray
700: opening portion
800: Home
R: Rigid region
F: Flexible area
IV, IV1, IV2: inner layer vias
IVH, IVH1, IVH2: Inner layer via hole
BV: outer layer vias
BVH: outer layer via hole
SR: solder resist layer
SRO: opening
C: Carrier
S: Support member
M1: carrier metal layer
M2: ultra-thin metal layer
DF1, DF2, DF3, DF4: plating resist pattern
1000, 2000, 3000, 4000, 5000: rigid flexible printed circuit board

Claims (14)

A flexible insulation portion including a flexible region and a rigid region;
A first inner conductor pattern layer embedded in the flexible insulation portion and having one surface exposed to one surface of the flexible insulation portion;
A second inner conductor pattern layer including a seed metal foil, an electroless plating layer formed on the seed metal foil, and an electrolytic plating layer formed on the electroless plating layer, the second inner conductor pattern layer being formed on the other surface of the flexible insulation part; And
And a rigid insulating portion formed in the flexible insulating portion and disposed in the rigid region.
The method according to claim 1,
Wherein the flexible insulating portion comprises:
An adhesive layer for exposing one surface of the first inner conductor pattern layer on one side and
And a flexible insulating layer formed on the other surface of the adhesive layer.
The method according to claim 1,
Wherein a groove is formed on one surface of the first inner conductor pattern layer.
The method according to claim 1,
Wherein the seed metal foil comprises copper (Cu).
The method according to claim 1,
A coverlay formed on both sides of the flexible insulation portion and covering the first inner conductor pattern layer disposed in the flexible region and the second inner conductor pattern layer disposed in the flexible region;
Further comprising: a rigid flexible printed circuit board.
The method according to claim 1,
An inner layer via hole formed in the flexible insulating portion; And
An inner layer via formed in the innerlayer via hole to connect the first inner conductor pattern layer and the second inner conductor pattern layer;
Further comprising: a rigid flexible printed circuit board.
The method according to claim 6,
Wherein the electroless plated layer extends to an inner wall of the inner layer via hole.
The method according to claim 1,
Wherein the flexible insulator and the second inner conductor pattern layer are each formed in a plurality of ridged flexible printed circuit boards.
A flexible insulating portion including an adhesive layer and a flexible insulating layer formed on the adhesive layer;
A first inner conductor pattern layer embedded in the flexible insulation portion and having one surface exposed to one surface of the flexible insulation portion;
A second inner conductor pattern layer including a seed metal foil, an electroless plating layer formed on the seed metal foil, and an electrolytic plating layer formed on the electroless plating layer, the second inner conductor pattern layer being formed on the other surface of the flexible insulation part;
A rigid insulating portion formed on the flexible insulating portion to cover the first inner conductor pattern layer and / or the second inner conductor pattern layer; And
An opening formed in the rigid insulating portion to expose a part of the flexible insulation portion;
Wherein the rigid flexible printed circuit board comprises a rigid flexible printed circuit board.
Forming a first inner conductor pattern layer on one side of the carrier;
Forming a flexible insulating portion on one side of the carrier to cover the first inner conductor pattern layer;
Forming a second inner conductor pattern layer including a seed metal foil, an electroless plating layer, and an electrolytic plating layer on the flexible insulation portion;
Removing the carrier; And
Forming a rigid insulation portion having an opening in the flexible insulation portion;
Wherein the rigid flexible printed circuit board comprises a rigid flexible printed circuit board.
11. The method of claim 10,
Wherein the flexible insulating portion comprises:
An adhesive layer for embedding the first inner conductor pattern layer and
And a flexible insulating layer formed on the adhesive layer.
11. The method of claim 10,
Wherein the first inner conductor pattern layer comprises a first conductor layer,
Wherein the carrier is formed by performing a plating process on one surface of the carrier.
11. The method of claim 10,
Wherein the flexible insulating portion and the seed metal foil are made of a metal,
Wherein the flexible copper-clad laminate is laminated on one side of the carrier.
14. The method of claim 13,
The step of forming the second inner conductor pattern layer may include:
Forming the electroless plating layer on the seed metal foil,
Forming a plating resist pattern on the electroless plating layer, and
And forming the electroplated layer on the opening of the plating resist pattern.

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