KR20190058107A - Mobile memory mounting test device - Google Patents

Abstract

The present invention relates to a component mounting test equipment for a mobile comprising: a mobile terminal, having an application processor which performs an arithmetic operation for operations, such as executing a component test application, and a touch panel for a user interface; a mobile memory attached and detached from an interface of the application processor when used as a main memory of the application processor; and a memory power supply unit adjusting a voltage level of driving power supplied to the mobile memory or an embedded multi-media card (EMMC) under the control of the component test application. Under the control of the component test application, a near illumination sensor, a CMOS image sensor (CIS) camera module, and the touch panel are tested with preset test patterns. Thus, a reliable compatibility test can be performed.

Description

[0001] The present invention relates to a mobile memory mounting test device,

The present invention relates to a component testing apparatus, and more particularly, to a component mounting test apparatus for a mobile device for compatibility test of a memory, a muscle tone sensor, a CIS (cmos image sensor) camera module, a touch panel, and an EMMC (Embedded MultiMediaCard) will be.

Unlike the conventional desktop PC, the mobile terminal has a resource constraint characteristic. In recent years, the development of electronic technologies such as multi-core and large-capacity flash memory have somewhat restrained the use of resources. However, in order to support faster computing speed and input / output speed, processor and memory are being operated based on high clock frequency. Recently developed applications have a high computational cycle and a lot of storage space. . There is a problem that the power consumption of the mobile terminal increases due to these demands.

Conventional integrity verification schemes have the advantage of always-on security monitoring, but operate on a short period basis to improve security reliability. The short - term verification operation is inadequate as a verification method for the trust state verification of the mobile terminal platform, because it acts as a main cause of the performance degradation and power consumption of the mobile terminal.

On the other hand, mobile terminals are being developed to achieve both low power and high performance,

Application processors (APs) and memory devices that can be applied to mobile terminals are also being developed to achieve both low power and high performance.

When an application processor (AP) to be applied to a mobile terminal is newly released, the memory manufacturers must perform a compatibility test with an application processor (AP). Here, the memory refers to random access memory devices such as SRAM, DRAM, SDRAM, DDR SDRAM, LPDDR SDRAM, SRAM, PRAM, RRAM, MRAM and the like.

That is, when a new application processor (AP) and a new memory are applied to a mobile terminal, a compatibility test should be performed between an application processor (AP) and a memory.

In addition, a compatibility test should be performed between an application processor (AP), a brightness level sensor, a CIS (cmos image sensor) camera module, a touch panel, and an EMMC (Embedded MultiMediaCard).

Therefore, a component mounting test device for mobile devices capable of performing a reliable compatibility test between an application processor (AP) and a memory, a muscle strength sensor, a CIS (cmos image sensor) camera module, a touch panel, and an EMMC (Embedded MultiMediaCard) Is required.

SUMMARY OF THE INVENTION The present invention has been proposed in order to solve the above-

Provides mobile component test equipment that can perform reliable compatibility test between application processor (AP) and memory, eye level sensor, CIS (cmos image sensor) camera module, touch panel and EMMC (Embedded MultiMediaCard) do.

According to an embodiment of the present invention, there is provided a mobile terminal including an application processor for performing a calculation operation for operations such as the execution of a part test application, and a touch panel for a user interface; A mobile memory detachably connected to an interface of the application processor when used as a main memory of the application processor; And a memory power supply unit for controlling a voltage level of driving power supplied to the mobile memory or an EMMC (Embedded MultiMediaCard) according to the control of the parts test application, A CIS (cmos image sensor) camera module, and a touch panel are tested with a preset test pattern.

Also, the mobile memory, the muscle tone sensor, the CIS (cmos image sensor) camera module, the touch panel and the EMMC (Embedded MultiMediaCard) can be detachably attached to the interface of the application processor through an interposer or a socket. So that they are connected to each other.

The memory power supply unit may be configured to control the voltage level of the driving power supplied to the mobile memory according to the control of the parts test application so that the data transfer rate between the application processor and the mobile memory is maintained constant The voltage level of the driving power source gradually increases within a predetermined range.

The memory power supply unit may be configured to control the voltage level of the driving power supplied to the mobile memory according to the control of the parts test application so that the data transfer rate between the application processor and the mobile memory is maintained constant The voltage level of the driving power source is gradually lowered within a predetermined range.

The memory power supply unit may be configured to control the voltage level of the driving power supplied to the mobile memory according to the control of the parts test application so that the data transfer rate between the application processor and the mobile memory is maintained constant The driving voltage generating unit generates the driving voltage for pulsing between a maximum voltage value permitted and a minimum voltage value allowed for every predetermined period while keeping the voltage level of the driving power source constant.

The mobile component placement test apparatus according to the embodiment of the present invention includes:

Reliable compatibility testing can be performed between the application processor (AP) and the memory, eye level sensor, CIS (cmos image sensor) camera module, touch panel, and EMMC (Embedded MultiMediaCard).

1 is a block diagram of a component mounting test device 1 for a mobile device according to an embodiment of the present invention.
2 is a configuration diagram of the component mounting test device 1 for mobile
3 is an actual configuration diagram of the component mounting test device 1 for mobile

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, in order to facilitate a person skilled in the art to easily carry out the technical idea of the present invention.

1 is a block diagram of a mobile component mounting test apparatus 1 according to an embodiment of the present invention.

The mobile component mounting test apparatus 1 according to the present embodiment includes only a simple structure for clearly explaining the technical idea to be proposed.

1, a mobile component mounting test apparatus 1 includes a mobile terminal 100, a mobile memory 130, and a memory power supply unit 210.

The mobile terminal 100 includes an application processor 110, a security device 120, a storage 140, a ROM 150, and peripheral devices 160. Particularly, the peripheral devices 160 include a muscle level sensor 161, a CIS (cmos image sensor) camera module 162, a touch panel 163, and an EMMC (Embedded MultiMediaCard)

That is, the mobile terminal 100 may be a computer, a portable computer, an Ultra Mobile PC (UMPC), a workstation, a netbook, a PDA, a portable computer, a web tablet, a wireless phone A mobile phone, a smart phone, a digital camera, a digital audio recorder, a digital audio player, a digital picture recorder, A digital video player, a digital video player, a device capable of transmitting and receiving information in a wireless environment, at least one of various computing systems constituting a home network, In this embodiment, it is assumed that the terminal is a smart phone (mobile terminal) type terminal.

The detailed configuration and main operation of the mobile component mounting test apparatus 1 configured as described above will be described below.

In order to allow the mobile terminal 100 to operate normally, the mobile memory 130 must be mounted. In this embodiment, the mobile memory 130 is detachably mounted from the outside of the mobile terminal 100, (130) is connected to an interface compatible with the mobile terminal (100).

The application processor 110 of the mobile terminal 100 may control all operations of the mobile terminal 100. [ For example, the application processor 110 may perform computational operations for operations such as booting, integrity verification, application execution, etc. of the mobile terminal 100.

Illustratively, application processor 110 may include a Device Integrity Verifier (DIV). The terminal integrity verifier (DIV) executes system components that are loaded into memory 130 or accessed from memory 130, application files executed by application processor 110, applications The integrity values of the required system classes can be extracted and transmitted to the security device 120. [

As a more detailed example, the terminal integrity verifier (DIV) may extract integrity values of executable files, library files, system modules, system daemons, and the like. Illustratively, the terminal integrity verifier (DIV) may extract the integrity value by hashing the byte values of the verification target files. For example, the terminal integrity verification unit (DIV) may perform an integrity verification operation based on a booting step or an execution step of the mobile terminal 100 or based on another verification policy according to the verification target.

Illustratively, the terminal integrity verifier (DIV) may be implemented in software, hardware, or a combination thereof. In addition, the hardware may be an electrical / electronic circuit, a processor, a computer, an integrated circuit, integrated circuit cores, a microelectromechanical system (MEMS), passive components, or a combination thereof.

The software may be machine code, program instructions, firmware, embedded code, application software, or a combination thereof. The terminal integrity verifier (DIV), which is implemented in software, is stored in a cache memory in the application processor 110 and can be driven by the application processor 110.

The security device 120 may receive an integrity value from the terminal integrity verifier (DIV) of the application processor 110 and may perform integrity verification on the received integrity value. For example, security device 120 may include integrity-related data or key values for each verification target (e.g., system component, application, system class, etc.) used in mobile terminal 100.

The security device 120 receives an integrity value at the request of the terminal integrity verification unit (DIV), and performs an integrity verification operation based on the received integrity value and the related data. The security device 120 may transmit the verification result to the terminal integrity verification unit (DIV).

The security device 120 and the application processor 110 can communicate based on a reliable communication channel or a secure channel. Illustratively, the communication channel may be an encrypted serial communication channel. In addition, the security device 120 may be provided in the form of a system-on-chip (SoC). The security device 120 may be embodied in one integrated circuit and implemented in the form of a single chip, a single module, or a single card. Illustratively, security device 120 may be included within application processor 110.

In addition, the security device 120 may be implemented with a minimum of hardware and software combinations required for integrity verification. For example, the security device 120 may be implemented as a computation processor for performing algorithms such as encryption, decryption, key management, hashing, and the like required for integrity verification.

The memory 130 may be used as an operating memory, a main memory, a buffer memory, or a cache memory of the mobile terminal 100 or the application processor 110. The memory 130 may include random access memory devices such as SRAM, DRAM, SDRAM, DDR SDRAM, LPDDR SDRAM, SRAM, PRAM, RRAM, MRAM,

The files used by the application processor 110 may be loaded into the memory 130 and the files stored in the memory 130 may be accessed by the application processor 110. The memory 130 may be the cache memory of the application processor 110.

The storage 140 may store information, data, or files used in the mobile terminal 100. For example, the storage 140 may store various data such as an application executable file used in the mobile terminal 100, a boot-loader, a kernel image, an operating system-operating file, and the like. By way of example, the storage 140 may comprise a large amount of non-volatile memory devices, such as hard disks, flash memory.

The ROM 150 may store various information or program codes required for the mobile terminal 100 to operate in the form of firmware. For example, the ROM 150 may include a boot control code required for the mobile terminal 100 to boot. Illustratively, the data or program code stored in ROM 150 may be unalterable data or program code, and may be integrity verified data or program code.

Peripheral devices 160 may include interfaces for inputting data or instructions to application processor 110 or outputting data to an external device. Illustratively, the peripheral devices 160 may include a user input interface such as a keyboard, a keypad, a button, a touch panel, a touch screen, a touch pad, a touch ball, a camera, a microphone, a gyroscope sensor, a vibration sensor, (Liquid Crystal Display), an OLED (Organic Light Emitting Diode) display, an AMOLED (Active Matrix OLED) display, an LED, a speaker, a motor and the like.

The peripheral devices 160 may also include devices such as a GPU, a GPS, a heart rate sensor, a camera, a communication module, a muscle tone sensor, a CIS (cmos image sensor) camera module, a touch panel, an EMMC (Embedded MultiMediaCard) .

Fig. 2 is a configuration diagram of the component mounting test device 1 for a mobile device, and Fig. 3 is an actual configuration diagram of the component mounting test device 1 for a mobile device.

2 and 3, peripheral devices 160 for commanding a compatibility test are provided in the form of a touch panel 163,

A mobile memory 130 and a non-volatile memory (flash memory) 130a can be detachably attached.

In addition, a muscle tone sensor, a CIS (cmos image sensor) camera module, a touch panel, and an EMMC (Embedded MultiMediaCard) are detachably attachable to an interface of the application processor 110 via an interposer or a socket.

That is, the main purpose of the mobile component mounting test apparatus 1 is to

When a new application processor (AP) and a new mobile memory are applied to the mobile terminal 100, an application processor (AP), a mobile memory 130, a muscle strength sensor 161, a CIS cmos image sensor) camera module 162, a touch panel 163, and an EMMC (Embedded MultiMediaCard)

Accordingly, an application processor (AP), a mobile memory 130, a degree of eye level sensor 161, a CIS (cmos image sensor) camera module 162, a touch panel 163, and an EMMC (Embedded MultiMediaCard) The mobile memory 130, the muscle tone sensor 161, the CIS (cmos image sensor) camera module 162, the touch panel 163, and the EMMC (Embedded MultiMediaCard) 164 can be used to perform a reliable compatibility test Respectively.

That is, the application processor 110 may be equipped with various types of mobile memory.

For example, if the application processor 110 is assumed to be "MTK6757" by Mediatech, the application processor 110 may be a mobile memory that meets the LPDDR4 (Low Power DDR4) standard and a LPDDR3 (Low Power DDR3) The mobile memory can be selectively applied.

Even if the mobile memory 130 satisfies the specifications of DDR3 and DDR4, the mobile terminal 100 including the new application processor 110 can be used for a mobile application The mounting test of the memory 130 should be performed.

Therefore, in the mobile component mounting test apparatus 1 of the present embodiment, the mobile memory 130 and the nonvolatile memory (flash memory) 130a are connected to the application processor 130 via the interposer 131 or the socket 131, (110).

For reference, in this embodiment, a method of performing the compatibility test of the mobile memory 130 is mainly described. However, in the same manner, various sizes, various standards, nonvolatile memories (flash memories) 130a and EMMC (Embedded MultiMediaCard, 164) compatibility test.

In the present embodiment, the memory for mobile 130 uses a memory of the LPDDR4 standard that meets the standard as shown in Table 1.

- Memory specification

- Power
VDD1 = 1.70 ?? 1.95V; 1.8V nominal
VDD2 / VDDQ = 1.06? 1.17V; 1.10V nominal
- Frequency range
1600 ?? 10 MHz (data rate range: 3200 ?? 20 Mb / s / pin)
- 16n prefetch DDR architecture
- 2-channel partitioned architecture for low RD / WR energy and low average latency
- 8 internal banks per channel for concurrent operation
- Single-data-rate CMD / ADR entry
- Bidirectional / differential data strobe per byte lane
- Programmable READ and WRITE latencies (RL / WL)
- Programmable and on-the-fly burst lengths (BL = 16, 32)
- Directed per-bank refresh for concurrent bank operation and ease of command scheduling
- Up to 12.8 GB / s per die (2 channels x 6.4 GB / s)
- On-chip temperature sensor to control self refresh rate
- Partial-array self refresh (PASR)
- Selectable output drive strength (DS)
- Clock-stop capability
- Programmable VSSQ (ODT) termination

As described above, the mobile component mounting test apparatus 1 is configured to include the mobile terminal 100, the mobile memory 130, and the memory power supply unit 210.

The mobile terminal 100 includes an application processor 110 for performing arithmetic operations for operations such as component test application execution and a touch panel 163 for a user interface.

The mobile memory 130 is used as a main memory of the application processor 110 and is detachably connected to an interface of the application processor 110. [ For example, the mobile memory 130 may be detachably connected to an interface of the application processor 110 via an interposer or a socket.

The memory power supply unit 210 adjusts the voltage level of the driving power supplied to the memory 130 for mobile according to the control of the parts test application.

The procedure for testing the mobile memory 130 is as follows.

The memory power supply 210 operates to adjust the voltage level of the driving power supplied to the memory 130 for mobile according to the control of the parts test application.

The part test application may be stored in storage 140 or ROM 150,

When the mobile terminal 100 is booted, it is loaded into the mobile memory 130 and accessed by the application processor 110, and the test operation proceeds.

Since the operation process of the part test application is displayed on the touch panel 163, the user can control the test process of the part test application through the touch panel 163 or change the test procedure.

- First test mode

The test procedure by the first test mode of the component test application is as follows.

The part test application controls the application processor 110 to write data to all address areas of the mobile memory 130 and sequentially read the recorded data.

At this time, in a state in which the data transmission speed between the application processor 110 and the mobile memory 130 is kept constant, the memory power supply unit 210 determines that the voltage level of the driving power supplied to the mobile memory 130 is higher than Within the range of < / RTI > For example, the driving voltage may gradually rise at a level between 1.0V and 1.2V.

The operation of the first test mode as described above is repeated for a predetermined number of times, and the result of the test, that is, whether or not data is accurately recorded and read in each address area of the memory, is displayed on the touch panel 163.

Since the mobile memory 130 has a built-in temperature sensor, the temperature change during the test process can also be displayed on the touch panel 163.

- Second test mode

The test procedure by the second test mode of the part test application is as follows.

The part test application controls the application processor 110 to write data to all address areas of the mobile memory 130 and sequentially read the recorded data.

At this time, in a state in which the data transmission speed between the application processor 110 and the mobile memory 130 is kept constant, the memory power supply unit 210 determines that the voltage level of the driving power supplied to the mobile memory 130 is higher than In the range of < / RTI > For example, the driving voltage may gradually drop at a level between 1.0V and 1.2V.

The operation of the second test mode as described above is repeated for a predetermined number of times, and the result of the test, that is, whether or not the data is accurately recorded and read in each address area of the memory, is displayed on the touch panel 163.

Since the mobile memory 130 has a built-in temperature sensor, the temperature change during the test process can also be displayed on the touch panel 163.

- Third test mode

The test procedure by the third test mode of the parts test application is as follows.

The part test application controls the application processor 110 to write data to all address areas of the mobile memory 130 and sequentially read the recorded data.

The memory power supply unit 210 maintains the voltage level of the driving power supplied to the mobile memory 130 at a constant level while the data transmission speed between the application processor 110 and the mobile memory 130 is kept constant do.

At this time, the memory power supply unit 210 may generate a driving voltage for pulsing between a maximum allowable voltage value and an allowable minimum voltage value at predetermined intervals, and supply the driving voltage to the memory 130 for mobile. For example, the drive voltage can be pulsed periodically at a level between 0.8V and 1.4V. That is, the driving voltage is basically supplied so as to maintain 1.1 V, but the driving voltage is periodically pulsed at a level between 0.8 V and 1.4 V periodically.

The operation of the third test mode as described above is repeated for a predetermined number of times, and a test result, that is, whether or not data is accurately recorded and read in each address area of the memory is displayed on the touch panel 163.

Since the mobile memory 130 has a built-in temperature sensor, the temperature change during the test process can also be displayed on the touch panel 163.

- Fourth test mode

The test procedure by the fourth test mode of the parts test application is as follows.

The part test application controls the application processor 110 to write data to all address areas of the mobile memory 130 and sequentially read the recorded data.

At this time, in a state where the data transmission speed is gradually increased while increasing the clock frequency between the application processor 110 and the mobile memory 130, the memory power supply unit 210 supplies the driving power supplied to the mobile memory 130 And operates so that the voltage level gradually increases within a predetermined range. For example, the driving voltage may gradually rise at a level between 1.0V and 1.2V.

The operation of the fourth test mode as described above is repeated for a predetermined number of times, and the result of the test, that is, whether or not data is accurately recorded and read in each address area of the memory, is displayed on the touch panel 163.

Since the mobile memory 130 has a built-in temperature sensor, the temperature change during the test process can also be displayed on the touch panel 163.

- Fifth test mode

The test procedure by the fifth test mode of the parts test application is as follows.

The part test application controls the application processor 110 to write data to all address areas of the mobile memory 130 and sequentially read the recorded data.

At this time, in a state where the data transmission speed is gradually increased while increasing the clock frequency between the application processor 110 and the mobile memory 130, the memory power supply unit 210 supplies the driving power supplied to the mobile memory 130 And operates so that the voltage level gradually falls within a predetermined range. For example, the driving voltage may gradually drop at a level between 1.0V and 1.2V.

The operation of the fifth test mode as described above is repeated for a predetermined number of times, and the touch panel 163 displays whether the test result, that is, whether or not data is correctly written and read in each address area of the memory.

Since the mobile memory 130 has a built-in temperature sensor, the temperature change during the test process can also be displayed on the touch panel 163.

- Sixth test mode

The test procedure by the sixth test mode of the parts test application is as follows.

The part test application controls the application processor 110 to write data to all address areas of the mobile memory 130 and sequentially read the recorded data.

The memory power supply unit 210 supplies the voltage level of the driving power supplied to the mobile memory 130 in a state of increasing the data transmission speed while increasing the clock frequency between the application processor 110 and the mobile memory 130 ≪ / RTI >

At this time, the memory power supply unit 210 may generate a driving voltage for pulsing between a maximum allowable voltage value and an allowable minimum voltage value at predetermined intervals, and supply the driving voltage to the memory 130 for mobile. For example, the drive voltage can be pulsed periodically at a level between 0.8V and 1.4V. That is, the driving voltage is basically supplied so as to maintain 1.1 V, but the driving voltage is periodically pulsed at a level between 0.8 V and 1.4 V periodically.

The operation of the sixth test mode as described above is repeated for a predetermined number of times, and the result of the test, that is, whether or not data is accurately recorded and read in each address area of the memory, is displayed on the touch panel 163.

Since the mobile memory 130 has a built-in temperature sensor, the temperature change during the test process can also be displayed on the touch panel 163.

The number of repetitions of the first through sixth test modes and the order in which the respective test modes proceed as described above can be changed by user setting.

For reference, the part test application can also conduct the test in the same manner as the first to sixth test modes in the EMMC (Embedded MultiMediaCard) 164.

Although not shown in the drawing, the upper surface of the mobile memory 130, the muscle tone level sensor 161, the CIS (cmos image sensor) camera module 162, the touch panel 163, and the EMMC (Embedded MultiMediaCard) A thermostat may be disposed at each of the thermostats.

The temperature regulator may be configured to regulate the temperature according to the control of the component test application and application processor 110.

That is, the temperature controller merely functions to cool the mobile memory 130, the muscle tone sensor 161, the CIS (cmos image sensor) camera module 162, the touch panel 163, and the EMMC (Embedded MultiMediaCard) A touch panel 163, and an EMMC (Embedded MultiMediaCard) 164 in cooperation with the test operation, in addition to the mobile memory 130, the muscle tone sensor 161, the CIS (cmos image sensor) camera module 162, Supercooling, or overheating, and may be operated to repeatedly perform the supercooling and overheating operations. At this time, a rotating fan may be attached to the upper part of the temperature control part to remove condensate that may be generated due to the temperature difference.

On the other hand, the temperature value of the temperature sensor built in the mobile memory 130, the EMMC (Embedded MultiMediaCard) 164, and the temperature value of the temperature control unit differ. Therefore, the component test application can prevent the sudden temperature difference by controlling the temperature control unit so that the temperature value of the built-in temperature sensor and the temperature value of the temperature control unit are kept within a predetermined value.

The part test application verifies that the distance recognition resolution of the muscle tone sensor 161 can be measured within 5 mm to 10 mm and tests the defective pixel of the CIS (cmos image sensor) camera module 162. Further, the part test application verifies the recognition accuracy by measuring the capacitance test of the touch panel 163 in units of 50 mV.

The mobile component placement test apparatus according to the embodiment of the present invention includes:

A reliable compatibility test is performed between the application processor (AP) and the memory, the muscle tone sensor 161, the CIS (cmos image sensor) camera module 162, the touch panel 163, and the EMMC (Embedded MultiMediaCard) You can proceed.

Thus, those skilled in the art will appreciate that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the embodiments described above are to be considered in all respects only as illustrative and not restrictive. The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

110: Application processor
120: Security device
130: Memory for mobile
140: Storage
150: ROM
160: peripheral devices
161: Myosity sensor
162: CIS (cmos image sensor) camera module
163: Touch panel
164: Embedded MultiMediaCard (EMMC)

Claims (5)

An application processor for performing an arithmetic operation for operations such as executing a part test application, and a mobile terminal having a touch panel for a user interface;
A mobile memory detachably connected to an interface of the application processor when used as a main memory of the application processor; And
And a memory power supply unit for adjusting a voltage level of driving power supplied to the mobile memory or the EMMC (Embedded MultiMediaCard) according to the control of the parts test application,
Wherein the module is tested with a preset test pattern in accordance with the control of the parts test application, such as a muscle strength sensor, a CIS (cmos image sensor) camera module, and a touch panel.
The method according to claim 1,
The mobile memory, the muscle tone sensor, the CIS (cmos image sensor) camera module, the touch panel and the EMMC (Embedded MultiMediaCard) are connected to the interface of the application processor via the interposer or the socket, Wherein the first and second test leads are connected to each other.
The method according to claim 1,
The memory power supply unit includes:
Wherein, in adjusting the voltage level of the driving power supplied to the mobile memory according to the control of the parts test application,
Wherein the voltage level of the driving power source is gradually increased within a predetermined range in a state where a data transmission speed between the application processor and the mobile memory is kept constant.
The method according to claim 1,
The memory power supply unit includes:
Wherein, in adjusting the voltage level of the driving power supplied to the mobile memory according to the control of the parts test application,
Wherein the voltage level of the driving power source is gradually lowered within a predetermined range in a state where a data transmission rate between the application processor and the mobile memory is kept constant.
The method according to claim 1,
The memory power supply unit includes:
Wherein, in adjusting the voltage level of the driving power supplied to the mobile memory according to the control of the parts test application,
Wherein a voltage level of the driving power source is kept constant while a data transmission speed between the application processor and the mobile memory is kept constant, Wherein the driving voltage generation unit generates the driving voltage for the mobile device.

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