KR102092535B1 - Mobile Component mounting test device to analyze temperature changes using least square method in peripherals - Google Patents

Abstract

According to an embodiment of the present invention, provided is a mobile component mounting test device, which comprises: an application processor performing computational operations for operations such as execution of a component test application; a mobile terminal providing a touch panel for a user interface; a mobile memory detachably connected to an interface of the application processor when used as a main memory of the application processor; and at least one peripheral device controlled by the application processor and detachably connected to an interface of the application processor. The component test application detects the temperature change of the mobile memory and the peripheral device and uses the least square technique to analyze a detected amount of the temperature change.

Description

Mobile Component mounting test device to analyze temperature changes using least square method in peripherals}

The present invention relates to a component test apparatus, and more particularly, to a mobile component mounting test apparatus capable of accurately analyzing a change in temperature of a peripheral device using a least squares method.

Application processors (APs) and memory devices that can be applied to mobile terminals are being developed to achieve both low power and high performance.

When an application processor (AP) applied to a mobile terminal is newly released, memory manufacturers should perform compatibility testing with an application processor (AP). Here, the memory refers to random access memory devices such as SRAM, DRAM, SDRAM, DDR SDRAM, LPDDR SDRAM, SRAM, PRAM, RRAM, and MRAM.

That is, when a new application processor (AP) and a new memory are applied to the mobile terminal, a compatibility test must be performed between the application processor (AP) and the memory.

In addition, compatibility testing between an application processor (AP), a nearness sensor, a cmos image sensor (CIS) camera module, a touch panel, and an embedded multimedia card (EMMC) should be performed.

Therefore, there is a mobile component mounting test device that can perform reliable compatibility tests between an application processor (AP) and memory, a nearness sensor, a CIS (cmos image sensor) camera module, a touch panel, and an Embedded MultiMediaCard (EMMC). Is required.

On the other hand, when measuring the temperature change of the peripheral device in the mobile component mounting test device, based on the value of the temperature sensor, only the maximum temperature or the target temperature was reached and tested. That is, in the related art, it was difficult to directly check the temperature change trend, and thus it was difficult to analyze whether the temperature change trend was normal.

The present invention has been proposed to solve the above technical problem, between an application processor (Application Processor, AP) and memory, nearness sensor, CIS (cmos image sensor) camera module, touch panel, EMMC (Embedded MultiMediaCard) It provides a mobile component mounting test device that can conduct reliable compatibility testing and can check the temperature change of parts by applying the least squares method.

According to an embodiment of the present invention for solving the above problems, a mobile terminal having an application processor for performing arithmetic operations for operations such as execution of a component test application and a touch panel for a user interface; A mobile memory that is detachably connected to an interface of the application processor when used as the main memory of the application processor; And at least one peripheral device controlled by the application processor and connected detachably to an interface of the application processor, wherein the component test application detects a temperature change of the memory for the mobile device and the peripheral device, but the least square method Provided is a component mounting test device for mobile, characterized in that for analyzing the detected temperature change.

In addition, in the present invention, in the component test application, in calculating the amount of temperature change using the least squares method, the sum of squared errors (x ² ) is defined as in Equation 1,

<Equation 1>

If you define the function of f (x _i ) as the linear function y = y _true = ax + b (a and b are constants),

Equation 1 is defined by Equation 2 and Equation 3,

<Equation 2>

<Equation 3>

The process of calculating the constants a and b through Equation 4 and Equation 5 which reduces the error between the measured temperature data value (yi) and the value on the straight line (f (xi)) as much as possible proceeds.

<Equation 4>

<Equation 5>

It is characterized in that the calculated constants a and b are substituted into the primary function y = y _true = ax + b, and the temperature change amount is calculated through the slope of the primary function.

In addition, in the present invention, it characterized in that it further comprises a; temperature control unit disposed on at least one or more upper surfaces of the mobile memory and the peripheral device.

In addition, according to the present invention, characterized in that it further comprises a memory power supply for adjusting the voltage level of the driving power supplied to the mobile memory or EMMC (Embedded MultiMediaCard) under the control of the component test application.

In addition, in the present invention, it is characterized in that it further comprises a plurality of probes for sensing electromagnetic waves disposed around each corner of the mobile memory to sense the electromagnetic wave intensity in a three-dimensional space around the mobile memory.

The mobile component mounting test apparatus according to an embodiment of the present invention is reliable between an application processor (AP) and memory, a nearness sensor, a cmos image sensor (CIS) camera module, a touch panel, and an Embedded MultiMediaCard (EMMC). Compatibility test can be conducted, and the least square method can be applied to check the temperature change of parts.

1 is a diagram showing a process of measuring a temperature change of a component using a least squares method.
2 is a graph showing a relationship between a measured value y _i and a function value f (x _i )
3 is a block diagram of a mobile component mounting test device 1
4 is an actual configuration diagram of a mobile component mounting test device 1
5 is a block diagram of a mobile component mounting test apparatus 1 according to an embodiment of the present invention
6 is a view showing the intensity of electromagnetic waves for each region scanned by the mobile component mounting test device 1

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings in order to describe in detail that a person skilled in the art to which the present invention pertains can easily implement the technical spirit of the present invention.

1 is a view showing a process of measuring the temperature change of the component using the least squares method.

Referring to FIG. 1, a component test application of a mobile terminal detects a temperature change of a mobile memory and a peripheral device, and a step (s10) of receiving a measured sensor value from a temperature sensor is performed.

Next, the component test application may detect the trend of the temperature change (s20) by applying the least squares method to the temperature values of the mobile memory and the peripheral device. That is, it is possible to check whether the operation is normal according to the temperature change amount (change trend) (s30).

That is, the measured temperature value is subdivided into a change amount in the last hour, a change amount in 30 minutes, and a change amount in 15 minutes using the least square method to calculate the change amount and detect and set the final temperature change amount in the calculated result. It is configured to give an alarm when it is out of the allowable range.

Method of Least Squares is a method of generating an appropriate sum of squares based on the measured value and processing the measurement result by obtaining the minimum value. It is a way to find the regularity of and express the correlation as a function.

That is, if there are measurement values y1, y2, y3, y4, ..., yn measured N times, and it can be estimated that the function y = f (x), the function that best fits the relationship between these measurements When y = f (x), the sum of the squared difference between the measured value y _i and the function value f (x) can be expressed as <Equation 1>.

<Equation 1>

The value of Equation 1 can be defined as the sum of the errors of the squared deviations, and it can be said that the least squares method is to obtain y = f (x) so that this value is minimum.

It can be seen that the graph of the straight line represents the distribution of the measured value best, and the slope of the straight line represents the change trend of the measured value.

2 is a graph showing the relationship between the measured value yi and the function value f (x _i ).

Referring to FIG. 2, when the function of f (x _i ) is expressed as y = ax + b, the deviation (y _i -y _true ) of the value (y _true ) and the measured value (y _i ) on this straight line is used. Thus, the sum of the errors of squared deviations (χ ² ) can be expressed as <Equation 2>.

<Equation 2>

Here, (y _true ) can be expressed as ax + b, which can be expressed as <Equation 3>.

<Equation 3>

Here, we need to find a and b that minimize the error between the measured data value (y _i ) and the value on the straight line (f (x _i )). The values of a and b at this time minimize the (χ ² ) value. It becomes the value to do.

In order to obtain the values of a and b that minimize the error, the partial derivatives of a and b must be 0. This can be expressed as <Equation 4>.

<Equation 4>

When a and b satisfying Equation 4 are calculated, it can be expressed as <Equation 5>.

<Equation 5>

The part test application can display the current temperature of each part, and if one part is selected, the current temperature, maximum temperature, average temperature, and minimum temperature are displayed. In addition, the trend of temperature change over time can be displayed in a graph form.

3 is a configuration diagram of a mobile component mounting test apparatus 1, and FIG. 4 is an actual configuration diagram of a mobile component mounting test apparatus 1.

3 and 4, peripheral devices 160 for instructing a compatibility test are provided in the form of a touch panel 163,

The mobile memory 130 and the non-volatile memory (flash memory, 130a) are formed in a detachable structure.

In addition, a roughness sensor, a cmos image sensor (CIS) camera module, a touch panel, and an EMMC (Embedded MultiMediaCard) are configured to be detachably attached to the interface of the application processor 110 through an interposer or socket.

That is, the main purpose of the mobile component mounting test apparatus 1 is to apply the least squares method to check the temperature change of the component.

In addition, when a new application processor (AP) and a new mobile memory are applied to the mobile terminal 100, an application processor (AP), a mobile memory 130, and a luminance sensor 161, This is to conduct a compatibility test between a cmos image sensor (CIS) camera module 162, a touch panel 163, and an EMMC (Embedded MultiMediaCard) 164.

Accordingly, between an application processor (AP) and a mobile memory 130, a nearness sensor 161, a cmos image sensor (CIS) camera module 162, a touch panel 163, and an embedded multimedia card (EMMC) 164 In order to perform a reliable compatibility test, the mobile memory 130, the nearness sensor 161, the CIS (cmos image sensor) camera module 162, the touch panel 163, and the EMMC (Embedded MultiMediaCard, 164) are Each is configured to be detachable.

That is, the application processor 110 may be equipped with various types of mobile memory.

For example, assuming that the application processor 110 is “MTK6757” of MediaTek, the application processor 110 satisfies the LPDDR4 (Low Power DDR4) specification and the mobile memory and the LPDDR3 (Low Power DDR3) specification. The mobile memory can be selectively applied.

Even if the mobile memory 130 satisfies the standards of DDR3 and DDR4, characteristics of each manufacturer may exist, so the mobile terminal 100 including the new application processor 110 is intended for mobile application to be applied before mass production. The mounting test of the memory 130 should be performed.

Therefore, in the mobile component mounting test apparatus 1 of the present embodiment, the mobile memory 130 and the non-volatile memory (flash memory, 130a) is an application processor through an interposer (Interposer, 131) or socket (Socket, 131). It is configured to be connected to the interface of (110).

For reference, this embodiment mainly describes a method for conducting the compatibility test of the mobile memory 130, but in the same way, various sizes, various specifications, and non-volatile memory (flash memory, 130a) and EMMC of various manufacturers (Embedded MultiMediaCard, 164) may be tested for compatibility.

As described above, the mobile component mounting test apparatus 1 includes a mobile terminal 100, a mobile memory 130, and a memory power supply unit 210.

The mobile terminal 100 includes an application processor 110 that performs arithmetic operations for operations such as execution of a component test application, and a touch panel 163 for a user interface.

The mobile memory 130 is used as the main memory of the application processor 110, and is detachably connected to the interface of the application processor 110. For example, the mobile memory 130 may be detachably connected to the interface of the application processor 110 through an interposer or socket.

The memory power supply unit 210 adjusts the voltage level of the driving power supplied to the mobile memory 130 under the control of the component test application.

The process of testing the mobile memory 130 is performed as follows.

The memory power supply unit 210 operates to adjust the voltage level of the driving power supplied to the mobile memory 130 under the control of the component test application.

The part test application can be stored in storage 140 or ROM 150,

When the mobile terminal 100 is booted, it is loaded into the mobile memory 130 and then accessed by the application processor 110 to perform a test operation.

Since the operation process of the part test application is displayed on the touch panel 163, a user may control the test process of the part test application through the touch panel 163 or change the test procedure.

5 is a block diagram of a component mounting test device 1 for a mobile according to an embodiment of the present invention.

The mobile component mounting test apparatus 1 according to the present embodiment includes only a simple configuration for clearly describing the technical idea to be proposed.

Referring to FIG. 5, the mobile component mounting test apparatus 1 includes a mobile terminal 100, a mobile memory 130, a memory power supply unit 210, a plurality of electromagnetic wave detection probes 220, And electromagnetic wave scanners (Near-field scanners 230).

Here, the mobile terminal 100 includes an application processor 110, an application processor (AP), a security device 120, a storage 140, a ROM 150, peripheral devices 160, and peripheral devices 170. It is configured by.

In order for the mobile terminal 100 to operate normally, the mobile memory 130 must be mounted. In this embodiment, the mobile memory 130 is mounted to be detachable from the outside of the mobile terminal 100, so that the mobile memory The 130 is configured to be connected to an interface compatible with the mobile terminal 100.

The mobile terminal 100 includes an application processor 110 that performs arithmetic operations for operations such as execution of a component test application, and a touch panel 163 for a user interface.

The mobile memory 130 is used as the main memory of the application processor 110, and is detachably connected to the interface of the application processor 110. For example, the mobile memory 130 may be detachably connected to the interface of the application processor 110 through an interposer or socket.

The memory power supply unit 210 adjusts the voltage level of the driving power supplied to the mobile memory 130 under the control of the component test application.

The process of testing the mobile memory 130 is performed as follows.

The memory power supply unit 210 operates to adjust the voltage level of the driving power supplied to the mobile memory 130 under the control of the component test application.

The part test application can be stored in storage 140 or ROM 150,

When the mobile terminal 100 is booted, it is loaded into the mobile memory 130 and then accessed by the application processor 110 to perform a test operation.

Since the component test application is displayed on the touch panel 163, a user may control a test process of the component test application or change a test procedure through the touch panel 163.

-First test mode

The test process according to the first test mode of the component test application is performed as follows.

The component test application controls the application processor 110 to record data in all address areas of the mobile memory 130 and sequentially read the recorded data.

At this time, in a state in which the data transmission speed between the application processor 110 and the mobile memory 130 is kept constant, the memory power supply unit 210 has a predetermined voltage level of driving power supplied to the mobile memory 130. It works to increase gradually within the range of. For example, the driving voltage may gradually increase at a level between 1.0V and 1.2V.

The operation of the first test mode as described above is repeated for a predetermined number of times, and the test result, that is, whether the data is accurately written and read in each address area of the memory is displayed on the touch panel 163.

Since the temperature sensor is built in the mobile memory 130, the temperature change during the test process can also be displayed on the touch panel 163.

-Second test mode

The test process by the second test mode of the component test application is performed as follows.

The component test application controls the application processor 110 to record data in all address areas of the mobile memory 130 and sequentially read the recorded data.

At this time, in a state in which the data transmission speed between the application processor 110 and the mobile memory 130 is kept constant, the memory power supply unit 210 has a predetermined voltage level of driving power supplied to the mobile memory 130. It operates to descend gradually within the range of. For example, the driving voltage may gradually drop at a level between 1.0V and 1.2V.

The operation of the second test mode as described above is repeated for a predetermined number of times, and the test result, that is, whether the data is accurately written and read in each address area of the memory is displayed on the touch panel 163.

Since the temperature sensor is built in the mobile memory 130, the temperature change during the test process can also be displayed on the touch panel 163.

-Third test mode

The test process by the third test mode of the component test application is performed as follows.

The component test application controls the application processor 110 to record data in all address areas of the mobile memory 130 and sequentially read the recorded data.

In a state in which the data transmission speed between the application processor 110 and the mobile memory 130 is kept constant, the memory power supply unit 210 keeps the voltage level of the driving power supplied to the mobile memory 130 constant. do.

At this time, the memory power supply unit 210 may generate a driving voltage for pulsing between the maximum allowed voltage value and the lowest allowable voltage value at predetermined intervals, and supply it to the mobile memory 130. For example, the driving voltage may be periodically pulsed at a level between 0.8V and 1.4V. That is, the driving voltage is basically supplied to maintain 1.1V, but the driving voltage periodically pulsing at a level between 0.8V and 1.4V is supplied.

The operation of the third test mode as described above is repeated for a predetermined number of times, and the test result, that is, whether the data is accurately written and read in each address area of the memory is displayed on the touch panel 163.

Since the temperature sensor is built in the mobile memory 130, the temperature change during the test process can also be displayed on the touch panel 163.

-4th test mode

The test process by the fourth test mode of the component test application is performed as follows.

The component test application controls the application processor 110 to record data in all address areas of the mobile memory 130 and sequentially read the recorded data.

At this time, while increasing the data transmission speed while increasing the clock frequency between the application processor 110 and the mobile memory 130, the memory power supply unit 210 of the driving power supplied to the mobile memory 130 The voltage level operates to gradually increase within a predetermined range. For example, the driving voltage may gradually increase at a level between 1.0V and 1.2V.

The operation of the fourth test mode as described above is repeated for a predetermined number of times, and a test result, that is, whether or not data is accurately written and read in each address area of the memory is displayed on the touch panel 163.

Since the temperature sensor is built in the mobile memory 130, the temperature change during the test process can also be displayed on the touch panel 163.

-5th test mode

The test process by the fifth test mode of the component test application is performed as follows.

The component test application controls the application processor 110 to record data in all address areas of the mobile memory 130 and sequentially read the recorded data.

At this time, while increasing the data transmission speed while increasing the clock frequency between the application processor 110 and the mobile memory 130, the memory power supply unit 210 of the driving power supplied to the mobile memory 130 The voltage level operates to gradually fall within a predetermined range. For example, the driving voltage may gradually drop at a level between 1.0V and 1.2V.

The operation of the fifth test mode as described above is repeated for a predetermined number of times, and the test result, that is, whether or not data is accurately written and read in each address area of the memory is displayed on the touch panel 163.

Since the temperature sensor is built in the mobile memory 130, the temperature change during the test process can also be displayed on the touch panel 163.

-6th test mode

The test process according to the sixth test mode of the component test application is performed as follows.

The component test application controls the application processor 110 to record data in all address areas of the mobile memory 130 and sequentially read the recorded data.

In the state of increasing the data transmission speed while increasing the clock frequency between the application processor 110 and the mobile memory 130, the memory power supply unit 210 is the voltage level of the driving power supplied to the mobile memory 130 Keep it constant.

At this time, the memory power supply unit 210 may generate a driving voltage for pulsing between the maximum allowed voltage value and the lowest allowable voltage value at predetermined intervals, and supply it to the mobile memory 130. For example, the driving voltage may be periodically pulsed at a level between 0.8V and 1.4V. That is, the driving voltage is basically supplied to maintain 1.1V, but the driving voltage periodically pulsing at a level between 0.8V and 1.4V is supplied.

The operation of the sixth test mode as described above is repeated for a predetermined number of times, and a test result, that is, whether or not data is accurately written and read in each address area of the memory is displayed on the touch panel 163.

Since the temperature sensor is built in the mobile memory 130, the temperature change during the test process can also be displayed on the touch panel 163.

As described above, the number of repetitions of the first to sixth test modes and the order in which the test modes proceed may be changed by the user.

On the other hand, although not shown in the drawing, a temperature control unit composed of a thermoelectric element may be disposed on the upper surface of the mobile memory 130.

The temperature controller may be configured to adjust the temperature under the control of the component test application and the application processor 110.

That is, the temperature control unit may perform an operation of overcooling or overheating the mobile memory 130 in connection with a test operation, rather than simply performing a role of cooling the mobile memory 130, and supercooling and overheating operations It may operate to repeat the process. At this time, a rotating fan may be attached to the upper portion of the temperature control unit to remove condensate that may occur due to a temperature difference.

Meanwhile, a difference occurs between the temperature value of the temperature sensor embedded in the mobile memory 130 and the temperature value of the temperature control unit. Therefore, the component test application can prevent a sudden temperature difference by controlling the temperature control unit so that the temperature value of the built-in temperature sensor and the temperature value of the temperature control unit remain within a preset value.

On the other hand, a plurality of probes for detecting electromagnetic waves 220 is disposed around each corner of the mobile memory 130 to detect electromagnetic wave strengths E and H in a three-dimensional space around the mobile memory 130.

That is, the component test application may store the electromagnetic wave data sensed by the plurality of electromagnetic wave detection probes 220 during the 1-1 to 6-1 test operations, and display the electromagnetic wave data on the touch panel 163.

Meanwhile, electromagnetic field scanners 230 may be additionally disposed on the lower surface of the mobile component mounting test device 1.

Electromagnetic wave scanners (Near-field scanners, 230) are disposed on the lower surface of the printed circuit board constituting the mobile component mounting test device 1, the application processor 110 mounted on the printed circuit board 110, the mobile memory 130 The surrounding electromagnetic waves can be detected.

For reference, the mobile terminal 100 includes an application processor 110 (AP; Application Processor), a security device 120, a storage 140, a ROM 150, and peripheral devices 160. In particular, the peripheral devices 160 include a nearness sensor 161, a cmos image sensor (CIS) camera module 162, a touch panel 163, and an embedded multimedia card (EMMC) 164.

That is, the mobile terminal 100 includes a computer, a portable computer, a UMPC (Ultra Mobile PC), a workstation, a net-book, a PDA, a portable computer, a web tablet, and a wireless phone. ), Mobile phone, smart phone, digital camera, digital audio recorder, digital audio player, digital picture recorder, Digital picture player, digital video recorder, digital video player, devices capable of transmitting and receiving information in a wireless environment, at least one of various computing systems that make up a home network It may include, in this embodiment, it is assumed that the terminal in the form of a smart phone (smart phone, mobile terminal) will be described.

In order for the mobile terminal 100 to operate normally, the mobile memory 130 must be mounted. In this embodiment, the mobile memory 130 is mounted to be detachable from the outside of the mobile terminal 100, so that the mobile memory The 130 is configured to be connected to an interface compatible with the mobile terminal 100.

The application processor 110 of the mobile terminal 100 may control various operations of the mobile terminal 100. For example, the application processor 110 may perform arithmetic operations for operations such as booting, integrity verification, and application execution of the mobile terminal 100.

For example, the application processor 110 may include a device integrity verifier (DIV). The terminal integrity verification unit (DIV) loads the memory 130 or accesses from the memory 130, system components, application files executed by the application processor 110, and executes the application. The integrity values of required system classes may be extracted and transmitted to the security device 120.

As a more detailed example, the terminal integrity verification unit (DIV) may extract integrity values such as executable files, library files, system modules, and system daemons. For example, the terminal integrity verification unit (DIV) may extract the integrity value by hashing the byte values of the files to be verified. For example, the terminal integrity verification unit (DIV) may perform an integrity verification operation based on a different verification policy according to a booting step or an execution step of the mobile terminal 100 or a verification target.

For example, the terminal integrity verification unit (DIV) may be implemented in the form of software, hardware, or a combination thereof. Further, the hardware may be an electrical / electronic circuit, a processor, a computer, an integrated circuit, integrated circuit cores, a microelectromechanical system (MEMS), passive elements, or a combination thereof.

The software can be machine code, program instructions, firmware, embedded code, application software, or a combination thereof. The terminal integrity verification unit (DIV) implemented in software form is stored in a cache memory in the application processor 110 and may be driven by the application processor 110.

The security device 120 may receive an integrity value from the terminal integrity verification unit (DIV) of the application processor 110 and perform integrity verification on the received integrity value. For example, the security device 120 may include integrity-related data or key values for each verification target (eg, system component, application, system class, etc.) used in the mobile terminal 100.

The security device 120 receives the integrity value according to the request of the terminal integrity verification unit (DIV), and performs an integrity verification operation based on the received integrity value and related data. The security device 120 may transmit the verification result to the terminal integrity verification unit (DIV).

The security device 120 and the application processor 110 may communicate based on a communication channel or a secure channel in which reliability is guaranteed. Illustratively, the communication channel may be an encrypted serial communication channel. In addition, the security device 120 may be provided in the form of a system-on-chip (SoC). The security device 120 is embedded in one integrated circuit and may be implemented in the form of one chip, one module, or one card. For example, the security device 120 may be included in the application processor 110.

In addition, the security device 120 may be implemented with a combination of minimum hardware and software required for integrity verification. For example, the security device 120 may be implemented as a computational processor for performing algorithms such as encryption, decryption, key management, hash, and the like, required for integrity verification.

The memory 130 may be used as an operating memory, main memory, buffer memory, or cache memory of the mobile terminal 100 or the application processor 110. The memory 130 may include random access memory devices such as SRAM, DRAM, SDRAM, DDR SDRAM, LPDDR SDRAM, SRAM, PRAM, RRAM, and MRAM.

Files used by the application processor 110 are loaded into the memory 130, and files stored in the memory 130 can be accessed by the application processor 110. The memory 130 may be a cache memory of the application processor 110.

The storage 140 may store information, data, or files used in the mobile terminal 100. For example, the storage 140 may store various data such as an application executable file used in the mobile terminal 100, a boot-loader, a kernel image, an operating system driving file, and the like. For example, the storage 140 may include large-capacity nonvolatile memory devices such as hard disks and flash memories.

The ROM 150 may store various information or program codes required for the mobile terminal 100 to operate in the form of firmware. For example, the ROM 150 may include a boot control code required for the mobile terminal 100 to boot. For example, the data or program code stored in the ROM 150 is immutable data or program code, and may be data or program code whose integrity has been verified.

The peripheral devices 160 may include interfaces that input data or instructions to the application processor 110 or output data to an external device. For example, the peripheral devices 160 may be a user input interface such as a keyboard, keypad, button, touch panel, touch screen, touch pad, touch ball, camera, microphone, gyroscope sensor, vibration sensor, piezoelectric element, or LCD. It may include user output interfaces such as (Liquid Crystal Display), OLED (Organic Light Emitting Diode) display, AMOLED (Active Matrix OLED) display, LED, speaker, motor, and the like.

In addition, the peripheral devices 160 include devices such as a graphic computing unit (GPU), GPS, heart rate sensor, camera, communication module, nearness sensor, cmos image sensor (CIS) camera module, touch panel, and embedded multimedia card (EMMC). It can contain.

6 is a view showing the intensity of electromagnetic waves for each region scanned by the mobile component mounting test device 1.

Referring to FIG. 6, the intensity (E, H) of electromagnetic waves for each area of the printed circuit board constituting the mobile component mounting test apparatus 1 is displayed, and the intensity of electromagnetic waves for each color is displayed on the touch panel 163. Can be displayed.

As a result, while the compatibility test of the mobile memory 130 is performed, the electromagnetic waves E and H around the application processor 110 and the mobile memory 130 may be measured and referred to as a factor of the memory compatibility test.

In particular, compatibility testing may be performed while testing while changing at least one of a data transmission speed, a voltage level of a driving voltage, and a clock frequency based on the intensity of electromagnetic waves E and H around the mobile memory 130.

The mobile component mounting test apparatus according to an embodiment of the present invention is reliable between an application processor (AP) and memory, a nearness sensor, a cmos image sensor (CIS) camera module, a touch panel, and an Embedded MultiMediaCard (EMMC). Compatibility test can be conducted, and the least square method can be applied to check the temperature change of parts.

As such, those skilled in the art to which the present invention pertains will appreciate that the present invention may be implemented in other specific forms without changing its technical spirit or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. The scope of the present invention is indicated by the following claims rather than the above detailed description, and it should be interpreted that all changes or modifications derived from the meaning and scope of the claims and equivalent concepts are included in the scope of the present invention. do.

110: application processor
120: security device
130: mobile memory
140: storage
150: ROM
160: peripheral devices
161: nearness sensor
162: CIS (cmos image sensor) camera module
163: touch panel
164: EMMC (Embedded MultiMediaCard)

Claims (5)

A mobile terminal having an application processor for performing arithmetic operations for operations such as execution of a component test application and a touch panel for a user interface;
A mobile memory that is detachably connected to an interface of the application processor when used as the main memory of the application processor;
A memory power supply for adjusting a voltage level of a driving power supplied to the mobile memory or an embedded multimedia card (EMMC) under the control of the component test application; And
It includes; at least one peripheral device controlled by the application processor and connected detachably to an interface of the application processor;
The component test application detects the temperature change of the mobile memory and the peripheral device, and analyzes the detected temperature change amount using the least squares method,
In testing the peripheral device with a preset test pattern under the control of the component test application, the component test application is loaded into the mobile memory at boot time and then accessed by the application processor to perform a test operation. The operation process of the component test application is displayed on the touch panel and the test operation is controlled by the operation of the touch panel,
A temperature control unit composed of a thermoelectric element is disposed on an upper surface of any one of the mobile memory and the peripheral device, and the temperature control unit controls the temperature according to the control of the component test application, but is supercooled or overheated in connection with a test operation. Mobile component mounting test device characterized in that the.
According to claim 1,
The parts testing application,
In calculating the amount of temperature change using the least squares method,
Define the sum of errors (x ² ) of the squared deviation as in Equation 1,
<Equation 1>

If you define the function of f (x _i ) as the linear function y = y _true = ax + b (a and b are constants),
Equation 1 is defined by Equation 2 and Equation 3,

<Equation 2>

<Equation 3>

The process of calculating the constants a and b through Equation 4 and Equation 5 which reduces the error between the measured temperature data value (yi) and the value on the straight line (f (xi)) as much as possible proceeds.

<Equation 4>

<Equation 5>

Substituting the calculated constants a and b into the primary function y = y _true = ax + b, the mobile component mounting test device, characterized in that for calculating the temperature change through the slope of the primary function.
delete delete According to claim 1,
And a plurality of probes for detecting electromagnetic waves in a three-dimensional space around the mobile memory, which are disposed around each edge of the mobile memory, and further include a mobile component mounting test device.

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