KR20190053759A - 3-dimension photonics integrated circuits module - Google Patents

Abstract

According to the present invention, a three-dimensional optical integrated circuit module comprises: an optical integrated circuit chip structure; and an optical waveguide chip disposed on a side surface of the optical integrated circuit chip structure. The optical integrated circuit chip structure includes a lower optical integrated circuit chip and an upper optical integrated circuit chip provided on the lower optical integrated circuit chip, and the lower and upper optical integrated circuit chips are optically connected to each other by the optical waveguide chip.

Description

3-DIMENSION PHOTONICS INTEGRATED CIRCUITS MODULE [0002]

The present invention relates to a three-dimensional optical integrated circuit module.

BACKGROUND ART [0002] Demands for higher integration of semiconductor integrated circuits are increasing due to a rapid increase in the calculation capacity, portability, and data capacity of computers and smart phones. In order to meet these requirements, the density of the two-dimensional semiconductor chip is gradually increasing, but due to various factors, the degree of integration of the semiconductor circuit is not continuously increasing but saturating. Therefore, research is being conducted to integrate semiconductor chips in three dimensions.

Generally, this tendency is actively progressing in an electronic circuit chip. At the same time, photonic ICs (PICs) are also required, and there are ongoing trends toward integrating PICs in 3D.

SUMMARY OF THE INVENTION An object of the present invention is to provide a three-dimensional optical integrated circuit.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a three-dimensional optical integrated circuit module in which optical connection between a chip and a chip is easy.

However, the problem to be solved by the present invention is not limited to the above disclosure.

According to an aspect of the present invention, there is provided a three-dimensional optical integrated circuit module including: an optical integrated circuit chip structure; And an optical waveguide chip disposed on a side surface of the optical integrated circuit chip structure, wherein the optical integrated circuit chip structure comprises: a lower optical integrated circuit chip; And a top optical integrated circuit chip provided on the bottom optical integrated circuit chip, wherein the bottom and top optical integrated circuit chips can be optically connected to each other by the optical waveguide chip.

In exemplary embodiments, the optical waveguide chip may be arranged to intersect the lower optical integrated circuit chip or the upper optical integrated circuit chip.

In exemplary embodiments, the optical waveguide chip may be vertically disposed on the lower optical integrated circuit chip or the upper optical integrated circuit chip.

In exemplary embodiments, each of the optical waveguide chip, the top optical integrated circuit chip, and the bottom optical integrated circuit chip comprises: a substrate; And a horizontal optical waveguide extending in a direction parallel to an upper surface of the substrate, wherein the substrate of the optical waveguide chip is arranged to cross the substrate of the upper optical integrated circuit chip or the substrate of the lower optical integrated circuit chip .

In the exemplary embodiments, the substrate of the optical waveguide chip may be arranged to be perpendicular to the substrate of the upper optical integrated circuit chip or the substrate of the lower optical integrated circuit chip.

In the exemplary embodiments, the end surfaces of the horizontal optical waveguide in the optical waveguide chip are exposed at the side of the optical waveguide chip, and the both end faces of the horizontal optical waveguide in the optical waveguide chip And may contact the sides of the upper and lower optical integrated circuit chips, respectively.

In an exemplary embodiment, the end surface of the horizontal optical waveguide in the upper optical integrated circuit chip is exposed at the side of the upper optical integrated circuit chip, and the end surface of the horizontal optical waveguide in the lower optical integrated circuit chip Wherein both ends of the horizontal optical waveguide exposed at the side of the optical waveguide chip are exposed at the sides of the upper and lower optical integrated circuit chips, And may face the cross-sections of the horizontal optical waveguides.

In both exemplary embodiments, the both end faces of the horizontal optical waveguide exposed at the side of the optical waveguide chip are each exposed at the side faces of the upper and lower optical integrated circuit chips, As shown in FIG.

In the exemplary embodiments, the horizontal optical waveguide in the optical waveguide chip includes: a first portion extending in a first direction; a second portion extending in a second direction crossing the first direction from both ends of the first portion; 2 < / RTI > parts.

In the exemplary embodiments, the horizontal optical waveguide in the optical waveguide chip further includes a mirror region provided at intersections of the first portion and the second portions, wherein the light traveling along the first portion May be reflected in the mirror region and enter the second portion.

In exemplary embodiments, the upper and lower optical integrated circuit chips may include electronic circuits.

According to the concept of the present invention, a three-dimensional optical integrated circuit module in which optical connection between a chip and a chip is easy can be provided.

However, the effect of the present invention is not limited to the above disclosure.

1 is a perspective view of an optical waveguide chip according to exemplary embodiments of the present invention.
2 is a perspective view of a three-dimensional optical integrated circuit module according to exemplary embodiments of the present invention.
3 is a perspective view of a three-dimensional optical integrated circuit module according to exemplary embodiments of the present invention.
4 is a perspective view of a three-dimensional optical integrated circuit module according to exemplary embodiments of the present invention.
5 is a perspective view of an optical waveguide chip according to exemplary embodiments of the present invention.
6 is a perspective view of a three-dimensional optical integrated circuit module according to exemplary embodiments of the present invention.
7 is a perspective view of a three-dimensional optical integrated circuit module according to exemplary embodiments of the present invention.
8 is a perspective view of a three-dimensional optical integrated circuit module according to exemplary embodiments of the present invention.
Figs. 9 and 10 are perspective views of the optical integrated circuit chips of Fig.
11 is an exploded perspective view of a three-dimensional optical integrated circuit module according to exemplary embodiments of the present invention.

In order to fully understand the structure and effect of the technical idea of the present invention, preferred embodiments of the technical idea of the present invention will be described with reference to the accompanying drawings. However, the technical idea of the present invention is not limited to the embodiments described below, but may be implemented in various forms and various modifications may be made. It is to be understood by those skilled in the art that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

The same reference numerals denote the same elements throughout the specification. The embodiments described herein will be described with reference to a perspective view, a front view, a sectional view, and / or a conceptual diagram, which are ideal examples of the technical idea of the present invention. In the drawings, the thickness of the regions is exaggerated for an effective description of the technical content. Thus, the regions illustrated in the figures have schematic attributes, and the shapes of the regions illustrated in the figures are intended to illustrate specific types of regions of the elements and are not intended to limit the scope of the invention. Although various terms have been used in the various embodiments of the present disclosure to describe various elements, these elements should not be limited by these terms. These terms have only been used to distinguish one component from another. The embodiments described and exemplified herein also include their complementary embodiments.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. The terms "comprises" and / or "comprising" used in the specification do not exclude the presence or addition of one or more other elements.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of an optical waveguide chip according to exemplary embodiments of the present invention.

Referring to FIG. 1, a first optical waveguide chip 10 including a substrate 100, a first clad film 210, a second clad film 220, and a first horizontal optical waveguide 300 may be provided. have. The substrate 100 may comprise a semiconductor material. For example, the substrate 100 may be a silicon substrate.

The first clad film 210 may be provided on the substrate 100. The second clad film 220 may be provided on the first clad film 210. The first and second clad films 210 and 220 may include a dielectric material. For example, the first and second clad films 210 and 220 may comprise silicon oxide (e.g., SiO2 ₎ .

The first horizontal optical waveguide 300 may be disposed between the first clad layer 210 and the second clad layer 220. The first horizontal optical waveguide 300 may have a higher refractive index than the first and second clad films 210 and 220. For example, the first horizontal optical waveguide 300 may comprise silicon nitride (e.g., SiN) or silicon oxynitride (e.g., SiON).

The first horizontal optical waveguide 300 may be parallel to the substrate 100. The first horizontal optical waveguide 300 may include a first portion 310 and a second portion 320 extending in different directions parallel to the upper surface of the substrate 100. The first portion 310 may extend in a first direction D1 parallel to the top surface of the substrate 100 and the second portion 320 may extend in the first direction D1, In a second direction D2 parallel to the top surface of the substrate. For example, the first and second portions 310, 320 may be perpendicular to each other.

A mirror region 330 may be provided at the intersection of the first portion 310 and the second portion 320. The crossing portion may be a portion where the first horizontal optical waveguide 300 is bent. The mirror region 330 may be a side intersecting the side of the first portion 310 and the side of the second portion 320. For example, in a planar view, the mirror region 330 may be inclined 45 degrees from the side of the first portion 310 and the side of the second portion 320. The mirror region 330 reflects light traveling within the first portion 310 (or second portion 320) and provides the light to the second portion 320 (or first portion 310) can do. In other exemplary embodiments, the first and second portions 310 and 320 may be connected to each other by a curved waveguide (not shown).

Generally, optical connection of different optical integrated circuit chips can be achieved by a method of bonding the optical integrated circuit chips to each other. Since the direct bonding method of optical integrated circuit chips has a low degree of freedom in disposing the optical integrated circuit chips, it is difficult to form a three-dimensional optical integrated circuit module having a multilayer structure (i.e., a structure in which optical integrated circuit chips are stacked).

The first optical waveguide chip 10 according to the concept of the present invention can optically connect different optical integrated circuit chips (not shown) to each other. When the first optical waveguide chip 10 is used, the optical integrated circuit chips can be freely arranged. Therefore, a three-dimensional optical integrated circuit module having various structures can be provided.

2 is a perspective view of a three-dimensional optical integrated circuit module according to exemplary embodiments of the present invention. For brevity of description, substantially the same contents as those described with reference to Fig. 1 may not be described.

2, a three-dimensional optical integrated circuit module 1 including a second optical waveguide chip 11 and a first optical integrated circuit chip 20 may be provided. The second optical waveguide chip 11 may be provided on the first optical integrated circuit chip 20. [ The second optical waveguide chip 11 and the first optical integrated circuit chip 20 may be arranged to intersect with each other. For example, the first optical integrated circuit chip 20 may extend in the first direction D1, and the second optical waveguide chips 11 may extend in the third direction D3 intersecting the first direction D1. ). For example, the second optical waveguide chip 11 and the first optical integrated circuit chip 20 may be perpendicular to each other.

The second optical waveguide chip 11 may include a substrate 100, a first cladding layer 210, a second cladding layer 220, and a plurality of first horizontal optical waveguides 300. The substrate 100, the first clad film 210 and the second clad film 220 are formed on the substrate 100, the first clad film 210, and the second clad film 220 ). ≪ / RTI > Each of the plurality of first horizontal optical waveguides 300 may have substantially the same shape as the first horizontal optical waveguide 300 described with reference to FIG.

The plurality of first horizontal optical waveguides 300 may be spaced from each other in a direction parallel to the upper surface of the substrate 100. The first portions 310 of the plurality of first horizontal optical waveguides 300 may be parallel to each other. For example, the first portions 310 of the plurality of first horizontal optical waveguides 300 may extend in a third direction D3 parallel to the upper surface of the substrate 100. [ The second portions 320 of the plurality of first horizontal optical waveguides 300 may be parallel to each other. For example, the second portions 320 of the plurality of first horizontal optical waveguides 300 may extend in the second direction D2 parallel to the upper surface of the substrate 100 in the third direction D3. can do. Although a plurality of first horizontal optical waveguides 300 are shown as including two first horizontal optical waveguides 300, this is an exemplary one. In other exemplary embodiments, the plurality of first horizontal optical waveguides 300 may include three or more first horizontal optical waveguides 300.

The first optical integrated circuit chip 20 may include a substrate 1100, a passivation film 1200, a light emitting element 1300, and a light receiving element 1400. The substrate 1100 of the first optical integrated circuit chip 20 may be disposed to cross the substrate 100 of the second optical waveguide chip 11. [ For example, the substrate 1100 of the first optical integrated circuit chip 20 may extend in the first direction D1, and the substrate 100 of the second optical waveguide chip 11 may extend in the first direction D1 in the third direction D3. For example, the substrate 1100 of the first optical integrated circuit chip 20 and the substrate 100 of the second optical waveguide chip 11 may be perpendicular to each other.

The substrate 1100 may comprise a semiconductor material. For example, the substrate 1100 may be a silicon substrate. An electronic circuit (not shown) may be provided on the upper surface of the substrate 1100. For example, on the upper surface of the substrate 1100, electronic elements (not shown) and electrical wires (not shown) for electrically connecting the electronic elements to each other may be provided.

A passivation film 1200 may be provided on the substrate 1100. [ The passivation film 1200 may include a dielectric material. For example, the passivation film 1200 may comprise silicon oxide (e.g., SiO2 ₎ .

The light emitting device 1300 may be disposed between the passivation film 1200 and the substrate 1100. The light emitting device 1300 can receive an electrical signal from the electronic circuit. The light emitting device 1300 may convert the electrical signal into an optical signal. For example, the light emitting device 1300 may include a vertical cavity surface-emitting laser (VCSEL). The light emitting device 1300 may provide the optical signal to the first horizontal optical waveguide 300 immediately adjacent to the light emitting device 1300.

The light receiving element 1400 may be disposed between the passivation film 1200 and the substrate 1100. [ The light receiving element 1400 may be spaced apart from the light emitting element 1300 in a direction parallel to the upper surface of the substrate 1100. [ For example, the light receiving element 1400 may be spaced apart in the second direction D2. The light receiving element 1400 can receive the optical signal from the horizontal optical waveguide 300 immediately adjacent to the light receiving element 1400. [ The light receiving element 1400 can convert the optical signal into an electrical signal. For example, the light receiving element 1400 may include a photodiode. The light receiving element 1400 may provide the electrical signal to the electronic circuit.

The first optical integrated circuit chip 20 according to the concept of the present invention can be optically connected to another optical integrated circuit chip (not shown) by the second optical waveguide chip 11. [ Accordingly, a three-dimensional optical integrated circuit module can be provided.

3 is a perspective view of a three-dimensional optical integrated circuit module according to exemplary embodiments of the present invention. For brevity of description, substantially the same contents as those described with reference to Figs. 1 and 2 may not be described.

3, a three-dimensional optical integrated circuit module 2 including a plurality of second optical waveguide chips 11 and a second optical integrated circuit chip 21 may be provided. A plurality of second optical waveguide chips 11 may be provided on the second optical integrated circuit chip 21. [ The plurality of second optical waveguide chips 11 and the second optical integrated circuit chip 21 may be arranged to intersect with each other. For example, the second optical integrated circuit chip 21 may extend in the first direction D1, and the plurality of second optical waveguide chips 11 may extend in the third direction crossing the first direction D1 (D3). For example, the plurality of second optical waveguide chips 11 and the second optical integrated circuit chip 21 may be perpendicular to each other. The plurality of second optical waveguide chips 11 may be arranged parallel to each other. For example, the plurality of second optical waveguide chips 11 extend in the second direction D2 intersecting the first and third directions D1 and D3, and are spaced apart from each other along the first direction D1. .

Each of the plurality of second optical waveguide chips 11 may include a substrate 100, a first clad film 210, a second clad film 220, and a plurality of first horizontal optical waveguides 300 have. The substrate 100, the first clad film 210 and the second clad film 220 are substantially the same as the substrate 100, the first clad film 210 and the second clad film 220 described with reference to FIG. . ≪ / RTI > Each of the plurality of first horizontal optical waveguides 300 may be substantially the same as the first optical waveguide 300 described with reference to FIG.

Although the plurality of second optical waveguide chips 11 are shown as including two second optical waveguide chips 11, this is an exemplary one. In other exemplary embodiments, the plurality of second optical waveguide chips 11 may include three or more second optical waveguide chips 11.

The second optical integrated circuit chip 21 may include a substrate 1100, a passivation film 1200, a plurality of light emitting elements 1300, and a plurality of light receiving elements 1400. Each of the substrate 1100, the passivation film 1200, each of the plurality of light emitting elements 1300, and each of the plurality of light receiving elements 1400 includes the substrate 1100, the passivation film 1200 ), The light emitting element 1300, and the light receiving element 1400, respectively.

The substrate 1100 of the second optical integrated circuit chip 21 may be disposed to cross the substrates 100 of the plurality of second optical waveguide chips 11. [ For example, the substrate 1100 of the second optical integrated circuit chip 21 may extend in the first direction D1, and the substrates 100 of the plurality of second optical waveguide chips 11 may extend to the third Direction D3. For example, the substrate 1100 of the second optical integrated circuit chip 21 and the substrates 100 of the second optical waveguide chips 11 may be perpendicular to each other.

The plurality of light emitting devices 1300 may be optically connected to the plurality of second optical waveguide chips 11, respectively. The plurality of light receiving elements 1400 may be optically connected to the plurality of second optical waveguide chips 11, respectively. Each of the plurality of light emitting devices 1300 converts an electrical signal transmitted from an electronic circuit (not shown) into an optical signal and transmits the optical signal to the first horizontal optical waveguide 300 immediately adjacent to the light emitting device 1300. [ As shown in FIG. Each of the plurality of light receiving elements 1400 converts an optical signal received from the first horizontal optical waveguide 300 immediately adjacent to the light receiving element 1400 into an electrical signal and provides the electrical signal to the electronic circuit have.

The second optical integrated circuit chip 21 according to the concept of the present invention can be optically connected to another optical integrated circuit chip (not shown) by the plurality of second optical waveguide chips 11. [ Accordingly, a three-dimensional optical integrated circuit module can be provided.

4 is a perspective view of a three-dimensional optical integrated circuit module according to exemplary embodiments of the present invention. For brevity of description, substantially the same contents as those described with reference to Figs. 1 and 2 may not be described.

Referring to Fig. 4, a three-dimensional optical integrated circuit module 3 including a plurality of third optical waveguide chips 12 and a third optical integrated circuit chip 22 may be provided. A plurality of third optical waveguide chips 12 may be provided on the third optical integrated circuit chip 22. [ The plurality of third optical waveguide chips 12 may be arranged to intersect with the third optical integrated circuit chip 22. For example, the third optical integrated circuit chip 22 may extend in the first direction D1, and the plurality of third optical waveguide chips 12 may extend in the third direction crossing the first direction D1 (D3). For example, the plurality of third optical waveguide chips 12 and the third optical integrated circuit chip 22 may be perpendicular to each other. The plurality of third optical waveguide chips 12 may be parallel to each other. For example, the plurality of third optical waveguide chips 12 extend in the second direction D2 intersecting the first and third directions D1 and D3 and are spaced apart from each other along the first direction D1. .

Each of the plurality of third optical waveguide chips 12 includes a substrate 100, a first clad film 210, a second clad film 220, a plurality of first horizontal optical waveguides 300, And two horizontal optical waveguides 301. [ The substrate 100, the first clad film 210 and the second clad film 220 are formed on the substrate 100, the first clad film 210, and the second clad film 220 ). ≪ / RTI > Each of the plurality of first horizontal optical waveguides 300 may be substantially the same as the first optical waveguide 300 described with reference to FIG.

The plurality of second horizontal optical waveguides 301 may be parallel to the respective substrates 100 of the plurality of third optical waveguide chips 12. For example, the plurality of second horizontal optical waveguides 301 may extend in the third direction D3. A plurality of second horizontal optical waveguides 301 may be disposed between the first clad layer 210 and the second clad layer 220. The plurality of second horizontal optical waveguides 301 may be spaced from each other along a direction parallel to the upper surface of the substrate 100 in each of the plurality of third optical waveguide chips 12. [ For example, the plurality of second horizontal optical waveguides 301 may be spaced from each other along the second direction D2 within each of the plurality of third optical waveguide chips 12. [

Although the plurality of third optical waveguide chips 12 are shown as including two third optical waveguide chips 12, this is exemplary. In other exemplary embodiments, the plurality of third optical waveguide chips 12 may include three or more third optical waveguide chips 12.

The third optical integrated circuit chip 22 may include a substrate 1100, a passivation film 1200, a plurality of light emitting elements 1300, and a plurality of light receiving elements 1400. Each of the substrate 1100, the passivation film 1200, each of the plurality of light emitting elements 1300, and each of the plurality of light receiving elements 1400 includes the substrate 1100, the passivation film 1200 ), The light emitting element 1300, and the light receiving element 1400, respectively.

The substrate 1100 of the third optical integrated circuit chip 22 may be disposed to cross the substrates 100 of the plurality of third optical waveguide chips 12. [ For example, the substrate 1100 of the third optical integrated circuit chip 22 may extend in the first direction D1, and the substrates 100 of the plurality of third optical waveguide chips 12 may extend to the third Direction D3. For example, the substrate 1100 of the third optical integrated circuit chip 22 and the substrates 100 of the third optical waveguide chips 12 may be perpendicular to each other.

The plurality of light emitting devices 1300 may be optically connected to a plurality of third optical waveguide chips 12, respectively. Each of the plurality of light emitting devices 1300 converts an electrical signal transmitted from an electronic circuit (not shown) into an optical signal and outputs the optical signal to the first and second horizontal optical waveguides (300, 310).

The plurality of light receiving elements 1400 may be optically connected to the plurality of third optical waveguide chips 12, respectively. Each of the plurality of light receiving elements 1400 converts an optical signal received from the first horizontal optical waveguide 300 immediately adjacent to the light receiving element 1400 into an electrical signal and provides the electrical signal to the electronic circuit have.

The third optical integrated circuit chip 22 according to the concept of the present invention can be optically connected to another optical integrated circuit chip (not shown) by the plurality of third optical waveguide chips 12. [ Accordingly, a three-dimensional optical integrated circuit module can be provided.

5 is a perspective view of an optical waveguide chip according to exemplary embodiments of the present invention. For brevity of description, substantially the same contents as those described with reference to Fig. 1 may not be described.

5, a fourth optical waveguide chip 13 including a substrate 100, a first clad film 210, a second clad film 220, and a third horizontal optical waveguide 302 may be provided. have. The substrate 100, the first clad film 210 and the second clad film 220 are formed on the substrate 100, the first clad film 210, and the second clad film 220 ). ≪ / RTI >

The third horizontal optical waveguide 302 may be disposed between the first and second clad films 210 and 220. The third horizontal optical waveguide 302 may have a larger refractive index than the first and second clad films 210 and 220. For example, the third horizontal optical waveguide 302 may comprise silicon nitride (e.g., SiN) or silicon oxynitride (e.g., SiON).

The third horizontal optical waveguide 302 may be parallel to the substrate 100. The third horizontal optical waveguide 302 may include a pair of first portions 310 and a second portion 320 extending in different directions parallel to the upper surface of the substrate 100. A pair of first portions 310 may extend from both ends of the second portion 320 in a first direction D1. The second portion 320 may extend in a second direction D2 parallel to the top surface of the substrate 100 in the first direction D1. For example, the first and second portions 310, 320 may be perpendicular to each other. The end surfaces of the third horizontal optical waveguide 302 can be exposed at one side of the third optical waveguide chip 13. [

Mirror areas 330 may be provided at intersections of a first portion 310 and a second portion 320 of the pair. Each of the mirror areas 330 may be substantially the same as the mirror area 330 described with reference to FIG.

6 is a perspective view of a three-dimensional optical integrated circuit module according to exemplary embodiments of the present invention. For brevity of description, substantially the same contents as those described with reference to Figs. 1, 2, and 5 may not be described.

Referring to FIG. 6, a three-dimensional optical integrated circuit module 4 including a plurality of fourth optical waveguide chips 13 and a fourth optical integrated circuit chip 23 may be provided. A plurality of fourth optical waveguide chips 13 may be provided on the fourth optical integrated circuit chip 23. [ The plurality of fourth optical waveguide chips 13 may be disposed so as to intersect with the fourth optical integrated circuit chip 23. For example, the fourth optical integrated circuit chip 23 may extend in the first direction D1, and the plurality of fourth optical waveguide chips 13 may extend in the third direction crossing the first direction D1 (D3). For example, the plurality of fourth optical waveguide chips 13 and the fourth optical integrated circuit chip 23 may be perpendicular to each other. The plurality of fourth optical waveguide chips 13 may be parallel to each other. For example, the plurality of fourth optical waveguide chips 13 extend in the second direction D2 intersecting the first and third directions D1 and D3 and are spaced apart from each other along the first direction D1. .

Each of the plurality of fourth optical waveguide chips 13 may include a substrate 100, a first clad film 210, a second clad film 220, and a plurality of third horizontal optical waveguides 302 have. The substrate 100, the first clad film 210 and the second clad film 220 are formed on the substrate 100, the first clad film 210, and the second clad film 220 ). ≪ / RTI >

The plurality of third horizontal optical waveguides 302 may be spaced from each other in a direction parallel to the upper surface of the substrate 100. Each of the plurality of third horizontal optical waveguides 302 may be substantially the same as the third horizontal optical waveguide 302 described with reference to FIG. The plurality of third horizontal optical waveguides 302 is shown as including two third horizontal optical waveguides 302, but this is exemplary. In other exemplary embodiments, the plurality of third horizontal optical waveguides 302 may include three or more third horizontal optical waveguides 302.

Although the plurality of fourth optical waveguide chips 13 are shown as including two fourth optical waveguide chips 13, this is an exemplary one. In other exemplary embodiments, the plurality of fourth optical waveguide chips 13 may include three or more fourth optical waveguide chips 13.

The fourth optical integrated circuit chip 23 may include a substrate 1100, a passivation film 1200, a plurality of light emitting elements 1300, and a plurality of light receiving elements 1400. Each of the substrate 1100, the passivation film 1200, each of the plurality of light emitting elements 1300, and each of the plurality of light receiving elements 1400 includes the substrate 1100, the passivation film 1200 ), The light emitting element 1300, and the light receiving element 1400, respectively.

The substrate 1100 of the fourth optical integrated circuit chip 23 may be disposed to cross the substrate 100 of the fourth optical waveguide chip 13. [ For example, the substrate 1100 of the fourth optical integrated circuit chip 23 may extend in the first direction D1, and the substrate 100 of the fourth optical waveguide chip 13 may extend in the third direction D3 ). For example, the substrate 1100 of the fourth optical integrated circuit chip 23 and the substrate 100 of the fourth optical waveguide chip 13 may be perpendicular to each other.

Electronic circuits (not shown) may be provided on the substrate 1100 of the fourth optical integrated circuit chip 23. In the exemplary embodiments, each of the electronic circuits may be electrically connected to the light emitting element 1300 and the light receiving element 1400. . Each of the light emitting devices 1300 converts an electrical signal transmitted from an electronic circuit into an optical signal and provides the optical signal to a third horizontal optical waveguide 302 immediately adjacent to each of the plurality of light emitting devices 1300 can do. Each of the plurality of light receiving elements 1400 can convert the optical signal received from the third horizontal optical waveguide 302 immediately adjacent to the light receiving element 1400 into an electrical signal and provide the electrical signal to the electronic circuit have.

The light emitting and receiving elements 1300 and 1400 in the fourth optical integrated circuit chip 23 according to the concept of the present invention can be optically connected to each other by the plurality of fourth optical waveguide chips 13. [ Accordingly, a three-dimensional optical integrated circuit module can be provided.

7 is an exploded perspective view of a three-dimensional optical integrated circuit module according to exemplary embodiments of the present invention. For brevity of description, substantially the same contents as those described with reference to Figs. 4 and 5 may not be described.

4, 5, and 7, a three-dimensional optical integrated circuit module 5 including a plurality of fourth optical waveguide chips 13 and a three-dimensional optical integrated circuit module 3 may be provided . Each of the plurality of fourth optical waveguide chips 13 may be substantially the same as the fourth optical waveguide chip 13 described with reference to Fig. The three-dimensional optical integrated circuit module 3 may be substantially the same as the three-dimensional optical integrated circuit module 3 described with reference to Fig.

5) of each of the plurality of fourth optical waveguide chips 13 is connected to the first and second horizontal optical waveguides 300, 300 of FIG. 4 in the three-dimensional optical integrated circuit module 3, Lt; RTI ID = 0.0 > 301 < / RTI > For example, the third horizontal optical waveguide (302 in FIG. 5) may be in direct contact with the first and second horizontal optical waveguides (300 and 301 in FIG. 4). 5) 302 of each of the plurality of fourth optical waveguide chips 13 is connected to the first horizontal optical waveguide (FIG. 5) immediately adjacent to the third horizontal optical waveguide (302 of FIG. 5) (300 in Fig. 4) or the second horizontal optical waveguide (301 in Fig. 4).

The light emitting and receiving elements 1300 and 1400 in the three-dimensional optical integrated circuit module 3 according to the concept of the present invention can be optically connected to each other by the plurality of fourth optical waveguide chips 13. [ Accordingly, a three-dimensional optical integrated circuit module can be provided.

8 is an exploded perspective view of a three-dimensional optical integrated circuit module according to exemplary embodiments of the present invention. Figs. 9 and 10 are perspective views of the optical integrated circuit chips of Fig. For brevity of description, substantially the same contents as those described with reference to Figs. 1, 2, 4, and 5 may not be described.

8, a plurality of fourth optical waveguide chips 13, a plurality of fifth optical waveguide chips 14, a plurality of fifth optical integrated circuit chips 24, and a plurality of sixth optical integrated circuit chips ( Dimensional optical integrated circuit module 6 including the three-dimensional optical integrated circuit module 25 may be provided. A plurality of fourth and fifth optical waveguide chips 13 and 14 may be provided on the sides of the plurality of fifth and sixth optical integrated circuit chips 24 and 25. [ The plurality of fourth and fifth optical waveguide chips 13 and 14 may be disposed so as to intersect with the plurality of fifth and sixth optical integrated circuit chips 24 and 25. [ For example, the fourth and fifth optical waveguide chips 13 and 14 may extend in the third direction D3, and the plurality of fifth and sixth optical integrated circuit chips 24 and 25 may extend in the third direction D3. And may extend in a second direction D2 that intersects the third direction D3. For example, the plurality of fourth and fifth optical waveguide chips 13 and 14 and the plurality of fifth and sixth optical integrated circuit chips 24 and 25 may be perpendicular to each other.

Each of the plurality of fourth optical waveguide chips 13 may be substantially the same as the fourth optical waveguide chip 13 (FIG. 5) described with reference to FIG.

The plurality of fifth optical waveguide chips 14 may include a substrate 100, a first clad film 210, a second clad film 220, and a second horizontal optical waveguide 301. The substrate 100, the first clad film 210 and the second clad film 220 are formed on the substrate 100, the first clad film 210, and the second clad film 220 ). ≪ / RTI > The second horizontal optical waveguide 301 may be substantially the same as the second horizontal optical waveguide 301 (FIG. 4) described with reference to FIG.

9, the fifth optical integrated circuit chip 24 includes a substrate 2100, a first clad film 2210, a second clad film 2220, a plurality of horizontal optical waveguides 303, Device 410, a plurality of second optical devices 420, and a third optical device 430. The substrate 2100, the first clad film 2210, and the second clad film 2220 are formed on the substrate (100 in FIG. 1), the first clad film (210 in FIG. 1) 2 clad film (220 in FIG. 1).

A plurality of horizontal optical waveguides 303 may be disposed between the first clad film 2210 and the second clad film 2220. The plurality of horizontal optical waveguides 303 may extend in a direction parallel to the upper surface of the substrate 2100. The plurality of horizontal optical waveguides 303 may have a larger refractive index than the first and second clad films 2210 and 2220. For example, the plurality of horizontal optical waveguides 303 may include silicon nitride (e.g., SiN) or silicon oxynitride (e.g., SiON). A section of a part of the plurality of horizontal optical waveguides 303 may be exposed at the side of the fifth optical integrated circuit chip 24. [

The first optical element 410, the plurality of second optical elements 420, and the third optical element 430 may be different optical elements. For example, the first optical element 410, the plurality of second optical elements 420, and the third optical element 430 may each be a Demultiplex (DEMUX), an optical modulator, a Multiplex , MUX). In the exemplary embodiments, the plurality of second optical elements 420 may modulate the lights in different modes. The first optical element 410 and the plurality of second optical elements 420 may be optically connected to each other through a plurality of horizontal optical waveguides 303. The plurality of second optical devices 420 and the third optical devices 430 may be optically connected to each other through the plurality of horizontal optical waveguides 303.

10, the sixth optical integrated circuit chip 25 includes a substrate 2100, a first clad film 2210, a second clad film 2220, a plurality of horizontal optical waveguides 303, Device 410, a plurality of fourth optical elements 440, and an electronic circuit 500. The substrate 2100, the first clad film 2210, and the second clad film 2220 are formed on the substrate (100 in FIG. 1), the first clad film (210 in FIG. 1) 2 clad film (220 in FIG. 1).

A plurality of horizontal optical waveguides 303 may be disposed between the first clad film 2210 and the second clad film 2220. The plurality of horizontal optical waveguides 303 may extend in a direction parallel to the upper surface of the substrate 2100. The plurality of horizontal optical waveguides 303 may have a larger refractive index than the first and second clad films 2210 and 2220. For example, the plurality of horizontal optical waveguides 303 may include silicon nitride (e.g., SiN) or silicon oxynitride (e.g., SiON). A section of a part of the plurality of horizontal optical waveguides 303 may be exposed at the side of the sixth optical integrated circuit chip 25. [

The first optical element 410 and the plurality of fourth optical elements 440 may be different optical elements. For example, the first optical element 410 and the plurality of optical elements 440 may each include a demultiplexer (DEMUX) and photodiodes. The first optical element 410 and the plurality of fourth optical elements 440 may be optically connected to each other through a plurality of horizontal optical waveguides 303.

Referring again to FIG. 8, a plurality of fifth optical integrated circuit chips 24 and a plurality of sixth optical integrated circuit chips 25 may be alternately stacked. The plurality of fifth optical integrated circuit chips (24) and the plurality of sixth optical integrated circuit chips (25) may be parallel to each other. An adhesive layer (not shown) may be provided between the fifth optical integrated circuit chip 24 and the sixth optical integrated circuit chip 25 immediately adjacent to each other. For example, the adhesive layer may comprise an epoxy.

The fourth optical waveguide chip 13 can optically connect the fifth optical integrated circuit chip 24 and the sixth optical integrated circuit chip 25 to each other. 5) in the fourth optical waveguide chip 13 is connected to the horizontal optical waveguide 303 and the sixth optical integrated circuit chip 25 in the fifth optical integrated circuit chip 24 The optical waveguide 303 may be arranged to face the horizontal optical waveguide 303 in FIG.

The fifth optical waveguide chip 14 can optically connect an optical element (not shown) outside the sixth optical integrated circuit chip 25 and the three-dimensional optical integrated circuit module 6 to each other. The second horizontal optical waveguide 301 in the fifth optical waveguide chip 14 may be arranged to face the horizontal optical waveguide 303 in the sixth optical integrated circuit chip 25. [

The plurality of fifth optical integrated circuit chips 24 and the plurality of sixth optical integrated circuit chips 25 each include two fifth optical integrated circuit chips 24 and two sixth optical integrated circuit chips 25 But this is illustrative. In other exemplary embodiments, the plurality of fifth optical integrated circuit chips 24 and the plurality of sixth optical integrated circuit chips 25 may each include three or more chips.

Generally, optical connection of different optical integrated circuit chips can be achieved by a method of bonding the optical integrated circuit chips to each other. When a direct bonding method of the optical integrated circuit chips is used, the degree of freedom in disposing the optical integrated circuit chips is reduced, so that a three-dimensional optical integrated circuit module having a multilayer structure (i.e., a structure in which the optical integrated circuit chips are stacked) it's difficult.

The fifth and sixth optical integrated circuit chips 25 and 26 according to the concept of the present invention can be optically connected to each other by the fourth optical waveguide chip 13. [ Accordingly, a three-dimensional optical integrated circuit module having various structures can be provided.

11 is an exploded perspective view of a three-dimensional optical integrated circuit module according to exemplary embodiments of the present invention. For brevity of description, substantially the same contents as those described with reference to Figs. 8 to 10 may not be described.

11, a plurality of first horizontal optical blocks LB1, a plurality of second horizontal optical blocks LB2, a plurality of first vertical optical blocks VB1, a second vertical optical block VB2, , And a third vertical optical block (VB3) may be provided.

Each of the plurality of first horizontal optical blocks LB1 may be substantially the same as the sixth optical integrated circuit chip (25 of Fig. 10) described with reference to Fig. Each of the plurality of second horizontal optical blocks LB2 may be substantially the same as the fifth optical integrated circuit chip (24 in Fig. 9) described with reference to Fig. Each of the plurality of first vertical optical blocks VB1 may be substantially the same as the fifth optical waveguide chip 14 (Fig. 8) described with reference to Fig.

The second vertical optical block VB2 may be substantially the same as the fifth optical integrated circuit chip (24 in Fig. 9) described with reference to Fig. 9) in the second vertical optical block VB2 may be different from the plurality of second optical devices (420 in FIG. 9) in the second horizontal optical block LB2. have. 9) in the second horizontal optical block LB2 may be an optical modulator, and a plurality of second optical devices (for example, The optical elements (420 in FIG. 9) may be a polarization control device.

The third vertical optical block VB3 includes a substrate 100, a first clad film 210, a second clad film 220, a plurality of horizontal optical waveguides 303, and a fifth optical device 450 can do. The substrate 100, the first clad film 210, and the second clad film 220 are formed on the substrate (100 in FIG. 1), the first clad film (210 in FIG. 1) 2 clad film (220 in FIG. 1). In the exemplary embodiments, the fifth optical element 450 may be a Semiconductor Optical Amplifier (SOA).

A plurality of horizontal optical waveguides 303 may be disposed between the first clad film 210 and the second clad film 220. The plurality of horizontal optical waveguides 303 may extend in a direction parallel to the upper surface of the substrate 100. The plurality of horizontal optical waveguides 303 may have a larger refractive index than the first and second clad films 210 and 220. For example, the plurality of horizontal optical waveguides 303 may include silicon nitride (e.g., SiN) or silicon oxynitride (e.g., SiON). A section of a part of the plurality of horizontal optical waveguides 303 may be exposed at the side of the third vertical optical block VB3.

The plurality of first vertical optical blocks VB1, the second vertical optical block VB2 and the third vertical optical block VB3 may include a plurality of first horizontal optical blocks LB1 and a plurality of second horizontal optical blocks VB1, Lt; RTI ID = 0.0 > LB2. ≪ / RTI > The plurality of first vertical optical blocks VB1, the second vertical optical block VB2 and the third vertical optical block VB3 may include a plurality of first horizontal optical blocks LB1 and a plurality of second horizontal optical blocks VB1, LB2. ≪ / RTI > For example, the first clad film 210 or 2210 and the second clad film 223 in the first vertical optical block VB1, the second vertical optical block VB2, and the third vertical optical block VB3, 220 or 2200 may be stacked in the first direction D1 and the first and second clad films 2210 and 2210 in the plurality of first horizontal optical blocks LB1 and the plurality of second horizontal optical blocks LB2. And 2220 may be stacked in a second direction D3 intersecting the first direction D1. For example, the first and third directions D1 and D3 may be perpendicular to each other.

The plurality of first vertical optical blocks VB1 may be optically connected to the plurality of first horizontal optical blocks LB1. The first vertical optical block VB1 can optically connect the first horizontal optical block LB1 and an optical element (not shown) outside the three-dimensional optical integrated circuit module 7 to each other.

The second vertical optical block VB2 includes a second horizontal optical block LB2 disposed on any one of the plurality of first horizontal optical blocks LB1 and the plurality of first horizontal optical blocks LB1, Lt; / RTI > The second vertical optical block VB2 can optically connect the first horizontal optical block LB1 and the second horizontal optical block LB2. In the exemplary embodiments, the second vertical optical block VB2 can process the optical signal received from the first horizontal optical block LB1 and transmit it to the second horizontal optical block LB2.

The third vertical optical block VB3 includes a second horizontal optical block LB2 disposed on the other one of the plurality of first horizontal optical blocks LB1 and the other one of the plurality of first horizontal optical blocks LB1, Lt; / RTI > The third vertical optical block VB3 can optically connect the first horizontal optical block LB1 and the second horizontal optical block LB2. In the exemplary embodiments, the third vertical optical block VB3 may process the optical signal received from the first horizontal optical block LB1 and may transmit the optical signal to the second horizontal optical block LB2. At this time, the method of processing the optical signal by the third vertical optical block VB3 may be different from the method of processing the optical signal by the second vertical optical block VB2.

The first vertical optical block VB2 and the third vertical optical block VB3 according to the concept of the present invention include a plurality of first horizontal optical blocks LB1 and a plurality of second vertical optical blocks VB1, Of the second horizontal optical blocks LB2. A plurality of first horizontal optical blocks LB1 and a plurality of second horizontal optical blocks LB2 according to the concept of the present invention may include a plurality of first vertical optical blocks VB1, VB2, and a third vertical optical block VB3. Accordingly, a three-dimensional optical integrated circuit module having various structures can be provided.

The above description of embodiments of the technical idea of the present invention provides an example for explaining the technical idea of the present invention. Therefore, the technical spirit of the present invention is not limited to the above-described embodiments, but various modifications and changes may be made by those skilled in the art within the technical scope of the present invention, It is clear that this is possible.

Claims (11)

Optical integrated circuit chip structure; And
And an optical waveguide chip disposed on a side surface of the optical integrated circuit chip structure,
The optical integrated circuit chip structure includes:
A lower optical integrated circuit chip; And
And a top optical integrated circuit chip provided on the bottom optical integrated circuit chip,
Wherein the lower and upper optical integrated circuit chips are optically connected to each other by the optical waveguide chip.
The method according to claim 1,
Each of the optical waveguide chip, the upper optical integrated circuit chip, and the lower optical integrated circuit chip comprises:
Board; And
And a first clad film and a second clad film which are sequentially stacked on the substrate,
The first and second clad films of the optical waveguide chip are stacked in a first direction,
Wherein the first and second clad films of the upper optical integrated circuit chip and the lower optical integrated circuit chip are stacked in a second direction crossing the first direction.
3. The method of claim 2,
Wherein the first direction and the second direction are perpendicular to each other.
The method according to claim 1,
Each of the optical waveguide chip, the upper optical integrated circuit chip, and the lower optical integrated circuit chip comprises:
Board; And
And a horizontal optical waveguide extending in a direction parallel to an upper surface of the substrate,
Wherein the substrate of the optical waveguide chip is arranged to intersect the substrate of the upper optical integrated circuit chip or the substrate of the lower optical integrated circuit chip.
5. The method of claim 4,
Wherein the substrate of the optical waveguide chip is disposed perpendicular to the substrate of the upper optical integrated circuit chip or the substrate of the lower optical integrated circuit chip.
5. The method of claim 4,
Wherein end surfaces of the horizontal optical waveguide in the optical waveguide chip are exposed at a side of the optical waveguide chip,
And both the end faces of the horizontal optical waveguide in the optical waveguide chip are in contact with the side faces of the upper and lower optical integrated circuit chips, respectively.
The method according to claim 6,
An end surface of the horizontal optical waveguide in the upper optical integrated circuit chip is exposed at the side of the upper optical integrated circuit chip,
A cross section of the horizontal optical waveguide in the lower optical integrated circuit chip is exposed at the side of the lower optical integrated circuit chip,
Wherein the two end faces of the horizontal optical waveguide exposed at the side of the optical waveguide chip are respectively connected to the three-dimensional optical integrated circuit facing the end faces of the horizontal optical waveguides exposed at the sides of the upper and lower optical integrated circuit chips, module.
8. The method of claim 7,
Wherein both the end faces of the horizontal optical waveguide exposed at the side of the optical waveguide chip are connected to the end faces of the three-dimensional optical integrated circuit < RTI ID = 0.0 > module.
5. The method of claim 4,
Wherein the horizontal optical waveguide in the optical waveguide chip has a first portion extending in a first direction and a second portion extending in a second direction crossing the first direction from both ends of the first portion, Integrated circuit module.
10. The method of claim 9,
Wherein the horizontal optical waveguide in the optical waveguide chip further comprises a mirror region provided at intersections of the first portion and the second portions,
Wherein the light traveling along the first portion is reflected in the mirror region and enters the second portion.
The method according to claim 1,
Wherein the upper and lower optical integrated circuit chips comprise electronic circuits.

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