KR20080084660A - Opto-electric-bus module and manufacturing method of the same - Google Patents

Abstract

A photoelectric bus module is provided to perform an electrical communication process as well as an optical communication process by using an optical element and an electrical wiring. A photoelectric distribution unit(300) includes an optical waveguide(301), at least one first electrical wiring(302), and a concave or convex fine structure(303). The concave or convex fine structure is formed at a lower part of a structure including the optical waveguide and the first electrical wiring. An optical bench(103,203) includes a concave or convex fine structure which is formed at a part corresponding to the fine structure formed in the photoelectric distribution unit. A photoelectric element is mounted in the optical bench in order to perform an optical communication process. The optical bench further includes at least one second electrical wiring to be electrically connected to the semiconductor chip.

Description

Opto-electric-bus module and manufacturing method of the same

The present invention relates to an optical bus module and a method for manufacturing the same, and more particularly, to an optical bus module and a method for manufacturing the same, which simultaneously provide optical and electrical communication between semiconductor chips.

The present invention is derived from a study conducted as part of the IT next generation core technology development project of the Ministry of Information and Communication and the Ministry of Information and Telecommunications Research and Development. [Task Management Number: 2006-S-073-01, Title: Nano-Flexible Photoelectric for Mobile Devices] Wiring module]

The development of semiconductor device technology embedded in portable information communication devices demands an information transmission technology capable of quickly transferring a large amount of information to a monitor, hard disk, and memory.

Moreover, recent portable terminals such as mobile phones require high speed interconnection technology between semiconductor chips capable of processing image and video information as well as past voice information.

With the development of this technology, optical interconnection technologies are emerging to overcome the limitations of signal integrity problems, crosstalk, EMI, etc. of the existing electric conductors for high-speed interconnection between semiconductor chips, and various optical connectors Optical communication structures and methods between semiconductor chips using connectors have been developed.

However, traditional parallel optical interconnection techniques using optical connectors require a removable optical connector technique that can be freely constructed and dismantled as needed, with precise and robust optical coupling between the optoelectronic device (light emitting device) and the optical fiber.

However, the detachable optical connector technology has a high possibility that the optical alignment between the optoelectronic device and the optical fiber may be distorted in a repetitive detachable process, thereby degrading the optical coupling efficiency. In addition, a decrease in the optical coupling efficiency may cause a problem in the loss or transmission of information that is continuously transmitted.

More robust and robust optical connectors have been developed for precise and robust optical alignment between optoelectronic devices and optical fibers, but this method has a problem in that the size of the optical connector is increased. Increasing the size of the optical connector size can result in inappropriate space utilization of the entire optical communication module and system using the optical connector.

In addition, the recent communication between semiconductor chips requires not only the existing high speed optical communication but also the existing low speed electric communication, and according to the increase in the transmission length and the miniaturization of the semiconductor chip, between the semiconductor chips using the existing PCB substrate. Telecommunication is difficult to miniaturize due to consideration of the thickness and space of the PCB substrate.

The present invention has been made in an effort to provide a simple and robust photoelectric bus module and a method of manufacturing the same, which simultaneously provide optical communication and electric communication between semiconductor chips.

One embodiment of the optical bus module according to the present invention for achieving the above technical problem, the microstructure and iron-shaped microstructures in the lower portion of the structure in which the optical waveguide and at least one first electrical wiring is inserted A photoelectric wiring part in which at least one of the structures is formed; And an iron-shaped microstructure or recessed microstructure in a portion corresponding to the microstructure formed in the photoelectric wiring portion, a photoelectric device is mounted, and at least one second electrical wiring for electrical connection with the semiconductor chip is formed. It includes; optical bench.

According to an embodiment of the present invention, a method of fabricating an optoelectronic wiring part according to the present invention may be achieved by applying an ultraviolet curable polymer material to a substrate and curing it with ultraviolet rays to form a lower cladding, and an optical waveguide and an electricity on the lower cladding. Forming a wiring; Applying an ultraviolet curable polymer material on the lower clad to form an upper clad, and compressing the UV-transmissive mold having the iron-shaped microstructure on the upper clad and curing with ultraviolet light; And separating the mold from the upper clad.

Another embodiment of the method for manufacturing the photoelectric wiring portion according to the present invention for achieving the technical solidification, by applying an ultraviolet curable polymer material to the substrate and cured with ultraviolet rays to form a lower clad, the optical waveguide formed on top of the lower clad Making; Applying an ultraviolet curable polymer material on the lower clad to form an upper clad, compressing an ultraviolet-transmissive mold having recessed microstructures to the upper clad and curing with ultraviolet light; Separating the mold from the upper clad; And forming an electrical wiring on the upper cladding.

According to the present invention, the optical communication between the semiconductor chips and the electrical communication can be completed at the same time through the optical bus module that is also provided with low-speed electrical communication while maintaining passive optical coupling.

Hereinafter, an optical bus module and a manufacturing method thereof according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a view showing the configuration of an optical bus module according to an embodiment of the present invention.

Referring to FIG. 1, the photoelectric bus module according to the present invention includes a light transmission and reception unit 100, a photoelectric reception unit 200, and a photoelectric wiring unit 300.

The optical transmission unit 100 includes a PCB substrate 101, an optoelectronic device drive 102, an optical bench 103, and a light emitting device 104 formed on the optical bench. A convex microstructure 106 is formed on the silicon bench, and an electrical wiring 107 is formed on an upper surface of a portion of the concave microstructure 106 and the optical bench 103.

The photoelectric receiver 200 includes a PCB substrate 201, an optoelectronic device amplifier 202, an optical bench 203, and a light receiving device 204 formed on the optical bench. When the convex microstructure 206 is formed in the optical bench 203, the electrical wiring 207 is formed on the upper surface of the convex microstructure 206 and the optical bench 203. That is, the shapes of the light transmitting and receiving sections are symmetrical.

The photoelectric wiring unit 300 is composed of an optical waveguide 301, an electrical wiring 302, and a recessed microstructure 303, and an electrical wiring 302 is formed at an lower portion of the recessed microstructure. It is.

2A to 2C are views illustrating in detail the optical transmission and reception unit of the optical bus module according to an embodiment of the present invention.

Referring to FIGS. 2A and 2B, the photoelectric wiring unit 300 includes an optical waveguide 301, an electrical wiring 302, and a recessed microstructure 303 inserted into a flexible polymer structure 304. can do. The end of the electrical wiring 302 is open at the bottom of the recessed microstructure 303.

The optical transmission unit 100 is formed with an optoelectronic device 102 and an optical bench 103 mounted on the substrate 101. The optical bench 103 is formed with an optoelectronic device 104 and a wide recess 105. An iron recess microstructure 106 is formed in the wide recess 105, and is formed on the upper portion of the iron recess microstructure 106. The electrical wiring 107 is formed to the upper surface of the optical bench 103.

The electrical wirings 107, 108, and 109 are formed of three types of electrical communication electrical wiring 107, optical element electrical wiring 108, and integrated electrical wiring 109, respectively.

The optoelectronic device 104 is a light emitting device or a light receiving device. The end of the electrical wiring 107 is formed to extend to the upper portion of the convex microstructure 106.

The recessed microstructure 303 formed in the photoelectric wiring unit 300 is inserted into the recessed microstructure 106 formed in the optical bench 103 of the optical transmission unit 100 by a flip-chip coupling method, thereby providing an optoelectronic device. The 104 and the optical waveguide 301 are automatically optically coupled in the vertical / horizontal direction.

In addition, the electrical wiring 302 formed on the lower part of the microstructure 303 of the electrical wiring 107 and the photoelectric wiring portion 300 formed on the upper part of the convex microstructure 106 formed on the optical bench 103. This is automatically electrically connected.

Referring to FIG. 2B, the recess microstructure 303 of the photoelectric wiring part 300 and the recess microstructure 106 of the optical bench 103 are formed into a pyramid structure to combine the recess and the recess microstructures. Flip-chip coupling in the vertical direction can be applied.

Referring to FIG. 2C, in the combination of the recessed microstructure 303 formed in the photoelectric wiring part 300 and the convex microstructure 106 formed in the optical bench 103 of the optical transmission and reception unit 100, the structure of FIG. Instead of the vertical flip-chip coupling method using the pyramidal recessed microstructure 303 and the recessed microstructure 106, the recessed microstructure 303 and the recessed microstructure 106 are shaped like square columns. The photoelectric wiring unit 300 may be designed to be coupled to the optical bench in a sliding form while being formed in a horizontal direction. According to this method, the optical alignment distance between the optical waveguide 301 and the photoelectric device 104 can be easily adjusted.

3A to 3E are views illustrating optical coupling and electrical coupling of an optical bus module according to another embodiment of the present invention.

3A is a configuration in which the optical bench 103 of the photoelectric wiring unit 300 and the optical transmission and reception unit 100 are photocoupled. As described with reference to FIG. 2, the recessed microstructure 303 of the photoelectric wiring 300 is connected to the convex microstructure 106 of the optical bench to simultaneously complete optical alignment and electrical connection.

3B and 3C show the AA ′ cross section of FIG. 3A.

Referring to FIG. 3B, the recessed microstructure of the photoelectric wiring part 300 includes the recessed microstructure 303 (hereinafter, referred to as a “first recessed microstructure”) in which the electrical wiring 302 is formed. And unformed recessed microstructure 305 (hereinafter referred to as 'second recessed microstructure').

The iron-shaped microstructure shown in the optical bench 103 of the optical transmission unit 100 is also referred to as the iron-type microstructure 106 (hereinafter, referred to as 'first iron microstructure') on which the electrical wiring 107 is formed. An iron-shaped microstructure 111 (hereinafter referred to as a “second iron-structure microstructure”) in which no wiring is formed is included.

An optical waveguide 301 may be formed between the first recessed microstructure 303 and the second recessed microstructure 305 of the photoelectric wiring 300.

In the recessed surface of the first recessed microstructure 303, a space 306 and an electrical wiring 302 into which an electrical wiring formed on the recessed surface of the first concave microstructure 106 of the optical bench 103 can be inserted. It may be provided together. At this time, the horizontal position of the optical waveguide 301 and the electrical wiring 302 may be the same or not the same.

Referring to FIG. 3C, the first concave microstructure 303 is connected to the first concave microstructure 106, and the second concave microstructure 305 is connected to the second concave microstructure 111.

The second concave microstructure 305 formed in the photoelectric wiring unit 300 and the second convex microstructure 111 formed in the optical bench 103 of the optical transmission unit 100 are coupled to each other to form an optoelectronic device 104. Automatic alignment of the optical waveguide 301 in the vertical and horizontal directions is completed.

In addition, the electrical wiring 107 formed on the convex surface of the partial convex microstructure 106 formed on the optical bench 103 and the electrical surface formed on the concave surface of the partial concave microstructure 303 of the photoelectric wiring 300 are formed. As the wiring 302 is electrically connected, not only optical coupling but also electrical connection of the photoelectric wiring unit 300 and the optical transmission and reception unit 100 are completed at the same time.

In this case, the second recessed microstructure 305 and the second convex microstructure 111 are used for vertical and horizontal optical alignment between the optical waveguide 301 and the photoelectric device 104 of the photoelectric wiring 300.

By adjusting the heights of the second convex microstructure 111 and the second recessed microstructure 305, the height of the optical waveguide 301 of the photoelectric wiring part 300 mounted on the optical bench 103 can be adjusted. have. In addition, when the positions of the second recessed microstructure 305 and the second convex microstructure 111 are adjusted, the horizontal position of the optical waveguide 301 of the photoelectric wiring part 300 mounted on the optical bench 103 is adjusted. Can be adjusted.

The combination of the first concave microstructure 303 and the first convex microstructure 106 makes electrical connections to the concave surface and the electrical wirings 302 and 107 formed on the concave surface, respectively.

The electrical wiring 107 formed on the first convex microstructure 106 has a certain thickness. Therefore, when the photoelectric wiring unit 300 and the optical bench 103 are coupled, the height between the optical waveguide and the photoelectric device may be changed. In order to prevent this, the first recessed microstructure 303 includes a space 306 into which the electrical wiring 107 of the first convex microstructure 106 is inserted.

That is, when the photoelectric wiring 300 is coupled to the optical bench 103, the space 306 receives the electrical wiring 107, whereby the second recessed microstructure 304 and the second recessed microstructure 111 are formed. ) Maintains a constant height between the optical waveguide and the optoelectronic device, which is configured at the time of coupling, so that the optical coupling efficiency is not changed.

In addition, the photoelectric wiring unit 300 includes two layers, an upper clad 304-2 and a lower clad 304-1. The recessed surface of the recessed microstructure 305 in which no electrical wiring is formed is located at the side where the two clad layers meet. In the optical bench, microstructures corresponding to the microstructures formed on the upper clad 304-2 of the photoelectric wiring part 300 are formed.

3d to 3f show the cross-section B-B 'of FIG. 3a.

3D to 3F, the first recessed microstructure 303 formed in the photoelectric wiring unit 300 is inserted into the first convex microstructure 106 of the optical bench 103 of the optical transmission and reception unit 100. The active region 110 and the optical waveguide 301 of the optoelectronic device 104 are automatically optically coupled in the vertical direction.

In addition, the bottom surface of the first recessed microstructure 303 of the photoelectric wiring 300 and the electrical wiring 107 formed on the upper portion of the first convex microstructure 106 of the optical bench 103 at the time of optical coupling. The electrical wiring 302 formed in this is connected.

Referring to FIG. 3F, the optical signal 1000 generated by the optoelectronic device 104 is directly transmitted to the optical waveguide 301 formed in the optoelectronic wiring unit 300 and proceeds to the photoelectric receiver 200 of FIG. 1.

In addition, the electrical signal 2000 generated from some semiconductor chips of the optical transmission and reception unit 100 is transmitted to the electrical wiring 107 of the first convex-type microstructure 106, and subsequently, the first recessed portion of the photoelectric wiring unit 300. Proceeding along the electrical wiring 303 formed in the type microstructure 303 is transferred to the photoelectric receiving unit 200 of FIG.

4a and 4b show another embodiment for increasing the optical coupling efficiency of the photoelectric bus module according to another embodiment of the present invention.

FIG. 4A illustrates an embodiment in which the photoelectric device 104 provides a more efficient optical coupling by supplying a light source focused through the lens 307 provided in the photoelectric wiring unit 300 to the optical waveguide 301.

4B illustrates an embodiment in which the photoelectric wiring unit 300 further includes a lens 307 and a polarizer 308. The excitation of the surface plasmon polaritone, which theoretically explains the optical transmission to the metal optical waveguide, requires the light of TM mode to be incident.

If the light generated by the light emitting device (for example, VCSEL) does not include the TM mode or generates only the TE mode, the polarizer 308 is used to convert the TE mode light generated by the light emitting device into the TM mode. The surface plasmon polaritone of the optical waveguide can inject the required TM mode light.

5 shows another embodiment of an optical bus module according to an embodiment of the invention

The configuration of FIG. 5 includes all the components described in FIGS. 2 to 3. However, the electric wire is not formed in the convex-type microstructure 106 formed in the optical bench 103 of the optical transmission receivers 100 and 200. In addition, no electrical wiring is formed in the recessed microstructure 303 of the photoelectric wiring unit 300.

Therefore, through the combination of the concave-type microstructure 106 of the optical bench 103 and the recess-type microstructure 303 of the photoelectric wiring 300, the automatic vertical of the photoelectric element 104 and the optical waveguide 301 and Only the light alignment in the horizontal direction is completed. In this case, the recessed microstructure 303 of the photoelectric wiring unit 300 and the iron-shaped microstructure 106 of the optical bench 103 may be formed as a pyramid-shaped structure and combined as shown in FIG. 2B.

6a to 6d show another embodiment of the opto-bus module according to an embodiment of the present invention.

Referring to FIG. 6A, the optical transmission receiver 100 or 200 is provided with an optoelectronic device drive 102 and an optical bench 103 mounted on a substrate 101. The optical bench 103 is formed with an optoelectronic device 104 and a wide recess 105. The optoelectronic device 104 is a light emitting device or a light receiving device. An optical waveguide 301 is formed in the photoelectric wiring unit 300.

6B to 6D, the photoelectric wiring unit 300 is inserted into the wide recess 105 of the optical bench to complete the optical alignment between the active region 110 and the optical waveguide 301 of the photoelectric device 104. . At this time, by adjusting the height and width of the photoelectric wiring unit 300 can adjust the optical alignment accuracy between the active region 110 and the optical waveguide 301 of the photoelectric device 104.

7 shows another embodiment of an opto-bus module according to an embodiment of the present invention.

The configuration of FIG. 7 includes all the components described in FIGS. 2 to 3. However, the wide recess 105 is not formed in the optical bench 103 of the optical transmission receiver 100 or 200.

The recessed microstructure 305 formed in the photoelectric wiring part 300 and the iron-shaped microstructure 111 formed in the optical bench 103 of the optical transmission and reception unit 100 are coupled to each other, whereby the photoelectric device 104 and the optical waveguide ( Automatic vertical and horizontal alignment of light between 301 is completed.

In addition, the electrical wiring 107 formed on the upper part of the convex microstructure 106 formed on the optical bench 103 and the electrical wiring formed on the lower part of the recessed microstructure 303 of the photoelectric wiring 300 ( 302 is automatically electrically connected, so that not only optical coupling but also electrical connection of the photoelectric wiring unit 300 and the optical transmission and reception unit 100 are completed at the same time.

8A and 8B show another embodiment of an opto-bus module according to an embodiment of the present invention.

The configuration of the opto-bus module of FIGS. 8A and 8B includes all the components described in FIGS. 2 to 3. However, a wide recess 105 is not formed in the optical bench 103 of the optical transmission receiver 100 or 200, and a 45 degree reflector 309 is further added to the cross section of the optical waveguide 301 of the photoelectric wiring 300. It is provided. This is an embodiment applicable to the case where the photoelectric device 104 uses VCSEL or PD to emit vertically or vertically.

The principle of optical coupling and electrical coupling of the photoelectric wiring unit 300 and the optical transmission receiver 100 to 200 is as shown in FIG. 8B, which is the same as the principle described with reference to FIGS. 2 to 3.

9a and 9b show another embodiment for increasing the optical coupling efficiency of the photoelectric bus module according to another embodiment of the present invention.

FIG. 9A illustrates an embodiment in which the photoelectric device 104 provides a more efficient optical coupling by supplying a light source focused through the lens 307 provided in the photoelectric wiring unit 300 to the optical waveguide 301.

9B illustrates an embodiment in which the photoelectric wiring unit 300 further includes a lens 307 and a polarizer 308. The excitation of the surface plasmon polaritone, which theoretically explains the optical transmission to the metal optical waveguide, requires the light of TM mode to be incident.

If the light generated by the light emitting device (for example, VCSEL) does not include the TM mode or generates only the TE mode, the polarizer 308 is used to convert the TE mode light generated by the light emitting device into the TM mode. Light of TM mode required for surface plasmon polaritone excitation of the optical waveguide can be incident.

10 shows another embodiment of the opto-bus module according to an embodiment of the present invention.

Referring to FIG. 10, an optical waveguide 301 includes an optical waveguide 301, an electrical wiring 302, and an electrical wiring 302 inserted into a flexible polymer structure 304. Type microstructure 303 (hereinafter referred to as "first recessed microstructure") and recessed microstructure 305 (hereinafter referred to as "second recessed microstructure") where no electrical wiring is formed. do. The end of the electrical wiring 302 is open at the bottom surface of the first recessed microstructure 303.

The optical transmission receiver 100 or 200 is formed with an optoelectronic device drive 102 and an optical bench 103 mounted on a substrate 101. The optical bench 103 is formed with an optoelectronic device 104 and a wide recess 105, and the wide recess 105 is a convex-type microstructure 106 having an electrical wiring 302 (hereinafter, ' And a convex microstructure 111 (hereinafter referred to as a 'second convex microstructure') in which electrical wiring is not formed. The end of the electric wiring 107 is formed to extend to the upper portion of the convex microstructure 106 of the optical bench. At this time, the photoelectric device 104 is a light emitting device or a light receiving device, the photoelectric device is located on the inclined wall surface of the wide recess portion 105. At this time, the slope of the inclined wall has a value between 0 and 90 degrees.

The electrical wirings 107, 108, and 109 are formed of three types of electrical communication electrical wiring 107, optical element electrical wiring 108, and integrated electrical wiring 109, respectively.

11A to 11B are views illustrating optical coupling and electrical coupling of an optical bus module according to another embodiment of the present invention.

FIG. 11A illustrates a configuration in which the photoelectric wiring unit 300 and the optical bench 103 of the optical transmission receiver 100 or 200 are photocoupled. As described with reference to FIG. 2, the recessed microstructure 303 of the photoelectric wiring part 300 is connected to the convex microstructure 106 of the optical bench to simultaneously complete optical alignment and electrical connection.

As shown in and described with reference to FIGS. 3B to 3F, the first recessed microstructure 303 is the first concave microstructure 106, and the second recessed microstructure 305 is the second concave microstructure 111. ) Is connected.

The second concave-type microstructure 305 formed in the photoelectric wiring part 300 and the second convex-type microstructure 111 formed in the optical bench 103 of the optical transmission and reception unit 100 are coupled to each other, thereby providing an optoelectronic device 104. Automatic alignment of light in the vertical and horizontal directions between and the optical waveguide 301 is completed.

In addition, the electrical wiring 107 formed on the upper part of the convex microstructure 106 formed on the optical bench 103 and the electrical wiring formed on the lower part of the recessed microstructure 303 of the photoelectric wiring 300 ( 302 is automatically electrically connected, so that not only optical coupling but also electrical connection of the photoelectric wiring unit 300 and the optical transmission and reception unit 100 are completed at the same time.

Referring to FIG. 11B, the recessed microstructure 303 formed in the photoelectric wiring unit 300 is inserted into the convex microstructure 106 of the optical bench 103 of the optical transmission and reception unit 100, thereby providing the photoelectric device 104. The active region 110 and the optical waveguide 301 are automatically optically coupled in the vertical direction and the horizontal direction.

In addition, the electrical wiring 107 formed on the upper portion of the convex microstructure 106 of the optical bench 103 and the electrical wiring 302 formed on the bottom surface of the recessed microstructure 303 of the photoelectric wiring 300 are provided. It is connected automatically.

12 shows another embodiment of an optical bus module according to another embodiment of the present invention.

Referring to FIG. 12, an optical waveguide 301 inserted into a flexible polymer structure 304, an electrical wiring 302, and an iron-type microstructure in which the photoelectric wiring 300 is formed is provided. 331 (hereinafter, referred to as a “first iron microstructure”) and an iron microstructure 332 (hereinafter referred to as a “second iron microstructure”) in which electrical wiring is not formed. An end of the electrical wiring 302 is open at the top of the first convex microstructure 331.

The optical transmission receiver 100 or 200 is provided with an optoelectronic device 102 and an optical bench 103 mounted on the substrate 101. The optical bench 103 includes an optoelectronic device 104, a recessed microstructure 131 on which electrical wiring is formed (hereinafter referred to as a first recessed microstructure), and a recessed microstructure on which electrical wiring is not formed. The structure 132 (hereinafter, referred to as 'second recessed microstructure') is formed. The end of the electric wiring 107 is formed to extend to the lower portion of the recessed microstructure 131 of the optical bench. At this time, the photoelectric device 104 is a light emitting device or a light receiving device.

The electrical wirings 107, 108, and 109 are formed of three types of electrical communication electrical wiring 107, optical element electrical wiring 108, and integrated electrical wiring 109, respectively.

13A to 13D illustrate optical coupling and electrical coupling of an optical bus module according to another embodiment of the present invention.

Referring to FIG. 13A, the photoelectric wiring unit 300 includes a first convex microstructure 331 and a second convex microstructure 332, and an optical waveguide 301 may be formed therebetween. have.

The optical bench 103 is provided with a first recessed microstructure 131 and a second recessed microstructure 132 on which a second electric wiring 107 is formed.

In the lower portion of the first recessed microstructure 331, a space 112 and an electrical wiring 107 into which electrical wiring formed on an upper portion of the first concave microstructure 331 of the photoelectric wiring 300 may be inserted. It may be provided together.

Referring to FIG. 13B, the first concave microstructure 331 is connected to the first concave microstructure 131, and the second concave microstructure 332 is connected to the second concave microstructure 132.

The second concave microstructure 332 formed in the photoelectric wiring part 300 and the second concave portion microstructure 132 formed in the optical bench 103 of the optical transmission receiver 100 or 200 are coupled to each other, thereby providing an optoelectronic device ( Automatic alignment of the light in the vertical and horizontal directions of the 104 and the optical waveguide 301 is completed.

In addition, the first electrical formed on the upper part of the electrical wiring 107 formed on the lower part of the recessed microstructure 131 formed on the optical bench 103 and the part of the convex shaped microstructure 331 of the photoelectric wiring part 300. Since the wiring 302 is automatically electrically connected, not only the optical coupling but also the electrical connection of the photoelectric wiring 300 and the optical transmission and reception unit 100 are completed at the same time.

In this case, the second convex microstructure 332 and the second recessed microstructure 131 are used for vertical and horizontal optical alignment between the optical waveguide 301 and the photoelectric device 104 of the photoelectric wiring 300.

When the height of the second convex microstructure 332 and the second recessed microstructure 132 is adjusted, the height of the optical waveguide 301 of the photoelectric wiring part 300 mounted on the optical bench 103 is adjusted. Can be. In addition, when the positions of the second recessed microstructure 132 and the second convex microstructure 332 are adjusted, the horizontal position of the optical waveguide 301 of the photoelectric wiring part 300 mounted on the optical bench 103 is adjusted. Can be adjusted.

The combination of the first convex microstructure 331 and the first concave microstructure 131 is used for electrical connection of the electrical wirings 302 and 107 formed on the lower and upper portions, respectively.

The electrical wiring 302 formed on the first convex microstructure 331 has a certain thickness. Therefore, the designed height between the optical waveguide and the photoelectric device may be changed when the photoelectric wiring unit 300 and the optical bench 103 are coupled to each other. In order to prevent this, the first recessed microstructure 131 includes a space 112 into which the electrical wiring 302 of the first convex microstructure 331 is inserted.

That is, when the photoelectric wiring 300 is coupled to the optical bench 103, the electrical wiring 302 is accommodated in the space 112, whereby the second recessed microstructure 132 and the second recessed microstructure 331 are provided. ) Maintains a constant height between the optical waveguide and the optoelectronic device, which is configured at the time of coupling, so that the optical coupling efficiency is not changed.

FIG. 13C is a cross-sectional view of the horizontal direction in which the photonic wiring unit 300 and the optical bench 103 of the optical transmission receiver 100 or 200 are photocoupled. Similar to that described with reference to FIG. 2, the convex microstructure 331 of the photoelectric wiring part 300 is connected to the recessed microstructure 131 of the optical bench to simultaneously complete optical alignment and electrical connection.

The first convex microstructure 331 is connected to the first concave microstructure 131, and the second convex microstructure 332 is connected to the second concave microstructure 132.

The second concave microstructure 332 formed in the photoelectric wiring part 300 and the second concave portion microstructure 132 formed in the optical bench 103 of the light transmission receiver 100 or 200 are coupled to each other by sliding. The automatic alignment of the device 104 and the optical waveguide 301 in the vertical and horizontal directions is completed.

In addition, the electrical wiring 107 formed on the lower part of the recessed microstructure 131 formed in the optical bench 103 and the electrical wiring formed on the upper part of the convex microstructure 331 of the photoelectric wiring 300 ( 302 is automatically electrically connected, so that not only optical coupling but also electrical connection between the photoelectric wiring unit 300 and the optical transmission and reception unit 100 are completed at the same time.

Referring to FIG. 13D, the convex microstructure 331 formed in the photoelectric wiring unit 300 is inserted into the recessed microstructure 131 of the optical bench 103 of the optical transmission receiver 100 or 200, thereby providing an optoelectronic device ( The active region 110 and the optical waveguide 301 of the 104 are automatically optically coupled in the vertical and horizontal directions.

In addition, the electrical wiring 107 formed on the lower portion of the recessed microstructure 106 of the optical bench 103 and the electrical wiring 302 formed on the upper portion of the iron-shaped microstructure 331 of the photoelectric wiring 300 are automatically formed. Is connected.

Referring to FIG. 13E, the concave-type microstructures 331 to 332 of the photoelectric wiring part 300 and the recess-type microstructures 131 to 132 of the optical bench 103 are formed as pyramidal structures to form recesses and convex microstructures. In the coupling of the vertical flip-chip coupling method can be applied.

14A to 14C show another embodiment of an opto-bus module according to an embodiment of the present invention.

The configuration of the optoelectronic bus module of FIG. 14A includes all the components described in FIGS. 12 to 13. However, a 45 degree reflector 309 is further provided on the cross section of the optical waveguide 301 of the photoelectric wiring unit 300. This is an embodiment applicable when the photoelectric device 104 uses a VCSEL or PD that emits light vertically or receives light vertically.

The principle of optical coupling and electrical coupling of the photoelectric wiring unit 300 and the optical transmission receiver 100 to 200 is as shown in FIGS. 14B to 14C, which is the same as the principle described with reference to FIGS. 12 to 13.

15a to 15d show another embodiment for increasing the optical coupling efficiency of the photoelectric bus module according to another embodiment of the present invention.

FIG. 15A illustrates an embodiment in which the photoelectric device 104 provides a high efficiency optical coupling by supplying a light source focused through the lens 307 provided in the photoelectric wiring unit 300 to the optical waveguide 301.

FIG. 15B illustrates an embodiment in which the photoelectric wiring unit 300 further includes a lens 307 and a polarizer 308. The excitation of the surface plasmon polaritone, which theoretically explains the optical transmission to the metal optical waveguide, requires the light of TM mode to be incident.

If the light generated by the light emitting device (for example, VCSEL) does not include the TM mode or generates only the TE mode, the polarizer 308 is used to convert the TE mode light generated by the light emitting device into the TM mode. The surface plasmon polaritone of the optical waveguide can inject the required TM mode light.

FIG. 15C shows a more efficient optical coupling by supplying a light source focused through a lens 307 to a 45-degree reflector 309 provided in the photoelectric wiring unit 300 to the optical waveguide 301. It is an embodiment to provide.

FIG. 15D illustrates an embodiment in which the polarizer 308 is further provided on the 45 degree reflector 309 and the lens 307 provided in the photoelectric wiring unit 300. The excitation of the surface plasmon polaritone, which theoretically explains the optical transmission to the metal optical waveguide, requires the light of TM mode to be incident.

If the light generated by the light emitting device (for example, VCSEL) does not include the TM mode or generates only the TE mode, the polarizer 308 is used to convert the TE mode light generated by the light emitting device into the TM mode. Light of TM mode required for surface plasmon polaritone excitation of the optical waveguide can be incident.

16 shows various embodiments of an optical bus module according to another embodiment of the present invention.

Referring to FIG. 16, the photoelectric wiring unit 300 includes an optical waveguide 301 inserted into a flexible polymer structure 304, an electrical wiring 302, and an iron-type microstructure in which electrical wiring is formed. 331 (hereinafter, referred to as a “first iron microstructure”) and an iron microstructure 332 (hereinafter referred to as a “second iron microstructure”) in which electrical wiring is not formed. The end of the electrical wiring 302 is open at the top of the first concave microstructure 331.

The optical transmission receiver 100 or 200 includes a first optical bench 103, an optoelectronic device drive 102 and a second optical bench 116 mounted on the first optical bench 103, and an electrical wiring 107. ) Formed recessed microstructure 131 (hereinafter referred to as "first recessed microstructure") and recessed microstructure 132 (hereinafter referred to as "second recessed microstructure") without electrical wiring ') Is formed. An optoelectronic device 104 is formed in the second optical bench 116. The end of the electric wiring 107 is formed to extend to the lower portion of the first recessed microstructure 131 of the first optical bench. At this time, the photoelectric device 104 is a light emitting device or a light receiving device.

The electrical wirings 107, 108, and 109 are formed of three types of electrical communication electrical wiring 107, optical element electrical wiring 108, and integrated electrical wiring 109, respectively.

17A to 17B are views illustrating optical coupling and electrical coupling of an optical bus module according to another embodiment of the present invention.

FIG. 17A illustrates a cross section in a horizontal direction in which the photonic wiring unit 300 and the optical bench 103 of the optical transmission receiver 100 or 200 are photocoupled. The first convex microstructure 331 of the photoelectric wiring unit 300 is connected to the first concave microstructure 131 of the optical bench to simultaneously complete optical alignment and electrical connection.

The first convex microstructure 331 is connected to the first concave microstructure 131, and the second convex microstructure 332 is connected to the second concave microstructure 132.

In addition, the optical bench 116 in which the optoelectronic device 104 is mounted is inserted into the third recessed microstructure 115.

The second convex microstructure 332 formed on the photoelectric wiring part 300 and the second recessed microstructure 132 formed on the optical bench 103 of the light transmission receiver 100 or 200 are coupled to each other by sliding. The automatic alignment of the device 104 and the optical waveguide 301 in the vertical and horizontal directions is completed.

In addition, the electrical wiring 107 formed on the lower part of the recessed microstructure 131 formed in the optical bench 103 and the electrical wiring formed on the upper part of the convex microstructure 331 of the photoelectric wiring 300 ( 302 is automatically electrically connected, so that not only optical coupling but also electrical connection of the photoelectric wiring unit 300 and the optical transmission and reception unit 100 are completed at the same time.

Referring to FIG. 17B, the convex microstructure 331 formed in the photoelectric wiring unit 300 is inserted into the recessed microstructure 131 of the optical bench 103 of the optical transmission receiver 100 or 200, thereby providing an optoelectronic device ( The active region 110 and the optical waveguide 301 of the 104 are automatically optically coupled in the vertical and horizontal directions.

In addition, the electrical wiring 107 formed under the recessed microstructure 106 of the optical bench 103 and the electrical wiring 302 formed on the convex microstructure 331 of the photoelectric wiring 300 are automatically formed. Connected.

18A to 18C are views for explaining the configuration and optical transmission principle of the optical waveguide used in the optical waveguide portion of the optical bus module according to an embodiment of the present invention.

As shown in FIG. 18A, the optical waveguide 4 has a characteristic of transmitting incident light up to several centimeters in length by using a metal line having a thin thickness and tens of microns embedded in the dielectric 3. In this way, the optical waveguide using the metal line is called a metal line optical waveguide.

In the present invention, the optical waveguide of the optical waveguide portion may be a metal line optical waveguide, and may be flexible. The optical transmission of metal line optical waveguides can be explained by the long-range surface plasmon polaritone (LR-SPP) theory.

Briefly describing the optical waveguide principle of a metal line optical waveguide, an optical signal is transmitted through polarization of free electrons in the metal line and mutual coupling of these polarizations.

Such continuous coupling of free electrons is called surface plasmon polariton, and long-distance light transmission using this is theoretically called long-range surface plasmon polariton.

Surface Plasmon (SP) is an oscillation wave of charge density that travels along a boundary where the real terms of the dielectric constants are opposite to each other, and the surface charge density oscillation forms a longitudinal surface constraint wave.

The longitudinal surface restraint wave is a component in which the electric field component of the incident wave is perpendicular to the interface, and only TM mode (Transverse Magnetic Mode) can excite and wave the long-distance surface plasmon polaritone.

Such a metal line optical waveguide can sufficiently transmit an optical signal with a metal wire having a fine size, for example, a thickness of about 5 to 200 nm and a width of about 2 to 100 μm.

FIG. 18B illustrates a state in which the polarization of the free electrons is properly formed, and thus the optical signal is smoothly transmitted. FIG. 13C illustrates a state in which the optical signal is not smoothly transmitted because the polarization of the free electrons is inappropriately formed.

That is, light transmission occurs smoothly when the TM mode Ex in the x-axis direction is asymmetrical through polarization of free electrons.

Intensity of the optical signal transmitted to the right part is schematically represented. It can be seen that the optical signal is smoothly transmitted in FIG. 13B compared to FIG. 13C.

Meanwhile, the dielectric constants ε1 and ε3 of the dielectric above the metal wire and the metal wire below the metal wire may be different from each other, but may also be the same. By using this principle, the metal wire light may be surrounded by the same dielectric. A waveguide can be formed.

19 is a diagram illustrating a communication system for providing photoelectric simultaneous communication using a photoaligned module and a photoaligned module according to an embodiment of the present invention.

Referring to FIG. 19, an integrated electrical signal (consisting of a photoelectric signal and a telecommunication signal) configured by the first semiconductor chip 501 of the first main board 500 is optically transmitted to the optical bus module through the electrical connector 502. It is delivered to the integrated electrical wiring 109 of the bride 100. The photoelectric signal of the integrated electrical signal of the integrated electrical wiring 109 is separately transmitted to the photoelectric device drive 102 and transferred to the photoelectric device through the electrical wiring 108 for the photoelectric device to generate an optical signal. The generated optical signal is transmitted to the photoelectric receiving unit 200 through the waveguide 301 of the photoelectric wiring unit 300. In addition, the electrical communication signals among the integrated electrical signals of the integrated electrical wiring 109 are separately separated and connected to the second electrical wiring, and the photoelectric receiving unit 200 through the first electrical wiring 302 of the photoelectric wiring unit 300. Is passed to.

20 and 21 are views illustrating an example of a manufacturing method of the photoelectric wiring unit according to the present invention. That is, FIG. 20 illustrates a method of fabricating an optoelectronic wiring portion including a recessed microstructure, and FIG. 21 illustrates a method of fabricating an optoelectronic wiring portion including an iron microstructure.

Referring to FIG. 20, an ultraviolet (UV) curable polymer material is applied to a substrate and cured with ultraviolet light to form a lower clad, and an optical waveguide and an electrical wiring are formed on the lower clad.

An ultraviolet curable polymer material is applied on the lower clad to form the upper clad, and the ultraviolet-transmissive mold having the iron-shaped microstructure is pressed onto the upper clad and cured with ultraviolet rays. Next, the mold is spaced apart from the upper clad to obtain a photoelectric wiring portion having a recessed microstructure in which a final electrode is formed.

Referring to FIG. 21, an ultraviolet curable polymer material is coated on a substrate and cured with ultraviolet rays to form a lower clad, and an optical waveguide is formed on the lower clad.

An ultraviolet curable polymer material is applied over the lower clad to form the upper clad, and the ultraviolet-transmissive mold having the recessed microstructure is pressed onto the upper clad and cured with ultraviolet light. Then, the mold is spaced apart from the upper clad to form electrical wiring in the upper clad.

As described above, the optical bus module according to the present invention provides optical / electrical simultaneous communication between boards. It is also used for optical / electrical simultaneous communication between board-chip or chip-chip.

As described above, the photoelectric interface module according to the present invention can provide optical communication between semiconductor chips efficiently by directly providing an optical element in the photoelectric interface module itself without using an additional optical component necessary for optical coupling between the photoelectric element and the optical waveguide. Provides a pluggable module.

In addition, the present invention provides a photoelectric interface method in which not only optical communication between semiconductor devices but also electrical communication are simultaneously completed using electrical wiring provided on the photoelectric interface module.

Furthermore, the optical interface module according to the present invention uses a metal line optical waveguide using a long-period long-range surface plasmon polariton, thereby providing a core-clad based optical waveguide having a thickness of several hundred microns. Compared to the structure, the entire thickness of the optical waveguide can be manufactured to several tens of microns or less, thereby dramatically increasing the thickness integration of the photoelectric interface module.

The invention can also be embodied as computer readable code on a computer readable recording medium. The computer-readable recording medium includes all kinds of recording devices in which data that can be read by a computer system is stored.

Examples of computer-readable recording media include ROM, RAM, CD-ROM, magnetic tape, floppy disk, optical data storage, and the like, and may also be implemented in the form of a carrier wave (for example, transmission over the Internet). Include. The computer readable recording medium can also be distributed over network coupled computer systems so that the computer readable code is stored and executed in a distributed fashion.

So far I looked at the center of the preferred embodiment for the present invention. Those skilled in the art will appreciate that the present invention can be implemented in a modified form without departing from the essential features of the present invention. Therefore, the disclosed embodiments should be considered in descriptive sense only and not for purposes of limitation. The scope of the present invention is shown in the claims rather than the foregoing description, and all differences within the scope will be construed as being included in the present invention.

1 is a view showing the configuration of an optical bus module according to an embodiment of the present invention.

2A to 2C are views illustrating in detail the optical transmission and reception unit of the optical bus module according to an embodiment of the present invention.

3A to 3E are views illustrating optical coupling and electrical coupling of an optical bus module according to another embodiment of the present invention.

4a and 4b show another embodiment for increasing the optical coupling efficiency of the photoelectric bus module according to another embodiment of the present invention.

5 shows another embodiment of an opto-bus module according to one embodiment of the invention.

6a to 6d show another embodiment of the opto-bus module according to an embodiment of the present invention.

7 shows another embodiment of an opto-bus module according to an embodiment of the present invention.

8A and 8B show another embodiment of an opto-bus module according to an embodiment of the present invention.

9a and 9b show another embodiment for increasing the optical coupling efficiency of the photoelectric bus module according to another embodiment of the present invention.

10 shows another embodiment of the opto-bus module according to an embodiment of the present invention.

11A to 11B are views illustrating optical coupling and electrical coupling of an optical bus module according to another embodiment of the present invention.

12 shows another embodiment of an optical bus module according to another embodiment of the present invention.

13A to 13D illustrate optical coupling and electrical coupling of an optical bus module according to another embodiment of the present invention.

14A to 14C show another embodiment of an opto-bus module according to an embodiment of the present invention.

15a to 15d show another embodiment for increasing the optical coupling efficiency of the photoelectric bus module according to another embodiment of the present invention.

16 shows various embodiments of an optical bus module according to another embodiment of the present invention.

17A to 17B are views illustrating optical coupling and electrical coupling of an optical bus module according to another embodiment of the present invention.

18A to 18C are views for explaining the configuration and optical transmission principle of the optical waveguide used in the optical waveguide portion of the optical bus module according to an embodiment of the present invention.

19 is a diagram illustrating a communication system for providing photoelectric simultaneous communication using a photoaligned module and a photoaligned module according to an embodiment of the present invention.

20 and 21 are views illustrating an example of a manufacturing method of the photoelectric wiring unit according to the present invention.

Claims (32)

An optoelectronic wiring portion in which at least one of a yaw-shaped microstructure and an iron-shaped microstructure is formed under the optical waveguide and the structure into which the at least one first electrical wiring is inserted; And An iron-shaped microstructure or a recess-shaped microstructure is formed in a portion corresponding to the microstructure formed in the photoelectric wiring portion, and an optoelectronic device for performing optical communication through the optical waveguide is mounted, and for electrical connection with a semiconductor chip. And an optical bench on which at least one second electrical wiring is formed. The method of claim 1, The first electrical wiring is exposed to at least one uneven surface of the microstructure formed on the photoelectric wiring, The second electrical wiring is formed on the uneven surface of the microstructure of the optical bench, wherein the second electrical wiring is present at a position corresponding to the microstructure of the photonic wiring portion to which the first electrical wiring is exposed. Opto-bus module, characterized in that connected. The method of claim 1, For vertical and horizontal optical alignment between the optoelectronic device and the optical waveguide, recessed microstructures or iron-shaped microstructures having a predetermined position and height and no electrical wiring are formed in the photoelectric wiring portion and the optical bench. Opto-bus module, characterized in that formed in the corresponding position. The method of claim 1, In order to complete the vertical and horizontal optical alignment between the photoelectric device and the optical waveguide and the true connection of the photoelectric wiring portion and the optical bench at the same time, recessed microstructure or convex portion having a predetermined position and height and an electrical wire is formed. Opto-bus module, characterized in that the microstructures are formed at positions corresponding to each other in the photoelectric wiring and the optical bench. The method of claim 1, And the butt-coupling optical coupling between the optoelectronic device and the optical waveguide. The method of claim 1, The recessed microstructure and the iron microstructure are formed in contact with the corners of the photoelectric wiring portion and the optical bench in the shape of a square column, the recessed microstructure is characterized in that the sliding to the iron microstructure Opto-bus module. The method of claim 1, The optical waveguide is a dielectric optical waveguide of the core-clad structure, the optical waveguide of the core-clad structure is formed of a polymer optical material containing a halogen element or deuterium. The method of claim 1, And the optical waveguide is a metal optical waveguide including at least one metal wire to which an optical signal is transmitted and a polymer optical material surrounding the metal wire. The method of claim 8, The optical optical waveguide module has a thickness of 5 to 200 nm and a width of 2 to 100 μm. The method of claim 8, And the metal optical waveguide is flexible. The method of claim 1, The optoelectronic bus module is mounted on the optical bench surface having an inclination of 0 ~ 90 degrees The method of claim 1, wherein the optical bench, A first optical bench mounted with an optoelectronic device on a 90 degree inclined surface; And And a second optical bench having a concave-type microstructure or a recess-shaped microstructure formed at a portion corresponding to the microstructure formed on the photoelectric wiring, and having a recess-shaped microstructure into which the first optical bench is inserted. Photoelectric bus module. The method of claim 1, And the photoelectric device is a light emitting device or a light receiving device, and the light emitting device uses a surface emitting laser (VCSEL) which is a TM mode light emitting device. The method of claim 13, And a 45 degree reflector is provided at the end of the photoelectric wiring to increase the optical coupling efficiency between the surface emitting laser and the metal optical waveguide. The method of claim 13, And a polarizer for adjusting the polarization characteristic of the vertical optical signal under the 45 degree reflector. The method of claim 13, And a lens for condensing a vertical optical signal under the 45 degree reflector. The method of claim 16, An optical bus module including a photoelectric wiring unit, wherein an optical waveguide of a core-clad type is formed inside the 45 degree reflector. The method of claim 1, And the photoelectric device is a light emitting device or a light receiving device, and the light emitting device uses a laser diode which is a TM mode light emitting device. The method of claim 18, And the polarizer is positioned between the TE mode light emitting element and the photoelectric wiring part in order to convert light into a TM mode when the light emitting element is a TE mode light emitting element. The method of claim 19, In order to increase the optical coupling efficiency, the optical bus module, characterized in that further comprising a lens between the laser diode and the photoelectric wiring. The method of claim 1, And the optical bench is formed of silicon or a polymer material. The method of claim 1, The recessed microstructure in which the first electrical wiring is formed in the photoelectric wiring part includes a space accommodating a thickness of the second electrical wiring formed in the iron-shaped microstructure of the optical bench corresponding to the recessed microstructure. Photoelectric bus module characterized in that. The method of claim 1, The cross-section of the recessed microstructure and the iron-shaped microstructure is formed in a rhombus shape, so that the horizontal and vertical movement does not occur when the photoelectric wiring portion and the optical bench is electrically connected. The method of claim 1, And the photoelectric wiring portion is composed of two layers of claddings, and a recessed surface of the recessed microstructure of the photoelectric wiring portion is in contact with a surface where the two layers meet. The method of claim 1, The optoelectronic bus module comprising the cladding of two layers, and the convex microstructure of the optoelectronic wiring part is formed on the clad. The method of claim 1, The recessed surface of the recessed microstructure of the photoelectric wiring part is formed to the side surface of the photoelectric wiring part in a direction parallel to the optical waveguide, and the length of the recessed surface is determined according to the distance between the photoelectric element and the optical waveguide. Optoelectronic bus module, characterized in that. An optical waveguide part into which an optical waveguide and at least one electric wiring are inserted; And An optical bench having a wide yaw formed in which a part of the front end of the photoelectric wiring part is inserted to a predetermined depth and mounted with an optical device for performing optical communication through the optical waveguide; module. An optoelectronic wiring portion in which at least one of a yaw shaped microstructure and an iron shaped microstructure is formed under the optical waveguide and the structure into which the at least one first electrical wiring is inserted; And An optical bench having an iron-shaped microstructure or a recess-shaped microstructure formed at a portion corresponding to the microstructure formed on the photoelectric wiring portion, an optoelectronic device for performing optical communication through the optical waveguide, and formed on the optical bench to form the first electrical wiring And an optical transmission receiver including a second electrical wiring electrically connected to the second semiconductor wire and a semiconductor chip connected to both the photoelectric device and the second electrical wiring. The method of claim 28, The first electrical wiring is exposed to at least one uneven surface of the microstructure formed on the photoelectric wiring, The second electrical wiring is formed on the uneven surface of the microstructure of the optical bench, wherein the second electrical wiring is present at a position corresponding to the microstructure of the photoelectric wiring portion to which the first electrical wiring is exposed. Optoelectronic communication system, characterized in that connected. The method of claim 28, For vertical and horizontal optical alignment between the optoelectronic device and the optical waveguide, recessed microstructures or iron-shaped microstructures having a predetermined position and height and no electrical wiring are formed in the photoelectric wiring portion and the optical bench. Optoelectronic communication system, characterized in that formed in the corresponding position. Applying an ultraviolet curable polymer material to a substrate and curing with ultraviolet light to form a lower clad, and forming an optical waveguide and an electrical wiring on top of the lower clad; Applying an ultraviolet curable polymer material on the lower clad to form an upper clad, and compressing the UV-transmissive mold having the iron-shaped microstructure on the upper clad and curing with ultraviolet light; And And separating the mold from the upper cladding. Applying an ultraviolet curable polymer material to a substrate and curing with ultraviolet light to form a lower clad, and forming an optical waveguide on top of the lower clad; Applying an ultraviolet curable polymer material on the lower clad to form an upper clad, compressing an ultraviolet-transmissive mold having recessed microstructures to the upper clad and curing with ultraviolet light; Separating the mold from the upper clad; And And forming an electrical wiring on the upper cladding.

Images