KR20190050524A - Epoxy resin composition - Google Patents

Abstract

An epoxy resin composition of the present invention comprises an epoxy resin having a non-condensed cyclic polycyclic structure and at least three functional groups, and a benzoxazine-based curing agent, thereby being able to maintain the content of an inorganic filler in the epoxy resin at 80 wt% or more and exhibit excellent high temperature dielectric properties and high glass transition temperature (Tg).

Description

EPOXY RESIN COMPOSITION [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition for semiconductor encapsulation, which is useful for encapsulating high-power semiconductors.

Due to the market demand for high-performance power semiconductors, the performance of silicon-based devices, which are currently mainstream, is rapidly increasing. Accordingly, silicon carbide (SiC) and gallium nitride (GaN) -based devices have been actively studied as novel materials having advantages of high breakdown voltage, high current, and high temperature operation over silicon (Si) based devices.

The high performance of the power semiconductor raises the driving temperature and requires high heat resistance to the material constituting the device. In particular, since heat resistance to a sealing material for sealing each part of a semiconductor device is particularly high, development of a semiconductor sealing material having a high glass transition temperature (Tg) has been increasing.

An epoxy resin composition for semiconductor encapsulation in which an ortho cresol novolak type epoxy resin and a phenol type curing agent are mixed is generally applied. However, such an encapsulant composition has a glass transition temperature (Tg) of only about 175 占 폚, and there is a limit to increase in Tg. In order to realize a higher glass transition temperature (Tg), Korean Patent No. 10-0861324 has also applied a condensed ring polycyclic epoxy resin such as naphthalene or anthracene structure. However, since the condensed cyclic epoxy resin can not set the content of the filler to be high because of high melt viscosity or softening point, it is vulnerable to deformation due to heat and moisture penetration, and is vulnerable to brittle after curing. In addition, it has a disadvantage that electric characteristics at a required high driving temperature are insufficient.

Korean Patent Laid-Open Publication No. 2014-0123065 discloses a technique of securing high heat resistance by optimizing skeleton density of a resin by applying a biphenyl type resin. However, such a biphenyl type resin generally has a disadvantage of poor dielectric properties.

On the other hand, a high glass transition temperature (Tg) and excellent electrical characteristics can be realized by using an acid anhydride-based resin as a curing agent. However, since the acid anhydride-based resin capable of having a high glass transition temperature (Tg) has a high melting point, it is difficult to apply to a manufacturing process of a general epoxy resin encapsulant, and a filler content can not be set high due to a high melting point. Therefore, it is vulnerable to thermal deformation and moisture penetration at a high driving temperature, and is vulnerable to cracking after curing.

Accordingly, there is a need to develop an epoxy resin composition having high heat resistance, high filler content, and excellent electrical properties at high temperatures.

Disclosed is an epoxy resin composition for semiconductor encapsulation which is capable of setting a content of a filler to a high level and has high heat resistance and excellent electrical properties at a high temperature and is applicable as an encapsulating material for a high power semiconductor.

The epoxy resin comprises an epoxy resin, a curing agent, a curing accelerator and a filler, wherein the epoxy resin comprises an intramolecular non-condensed cyclic polycyclic structure and an epoxy resin having at least three functional groups, The present invention provides an epoxy resin composition comprising the compound.

The present invention also provides a semiconductor device encapsulated using the above-described epoxy resin composition.

In the present invention, the content of the filler can be set higher than that of the conventional semiconductor encapsulating composition using the condensed-ring type epoxy resin, and the epoxy resin having high heat resistance and excellent electrical characteristics at high temperature, To provide a resin composition.

Since the epoxy composition according to the present invention has a high heat resistance, the continuous workability is excellent at a use temperature of 180 deg. Accordingly, the epoxy resin composition of the present invention can be usefully used as an encapsulating material for a high-performance, high-power semiconductor.

Hereinafter, the present invention will be described in detail. However, it should be understood that the present invention is not limited to the following embodiments, and various elements may be modified or selectively mixed according to need. Accordingly, it is to be understood that the invention includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

≪ Epoxy resin composition &

The epoxy resin composition for semiconductor encapsulation (EMC: epoxy molding compound) according to the present invention includes an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler. If necessary, it may further include at least one additive commonly used in the art such as a coupling agent, a colorant, a release agent, a modifier, a flame retardant, and a low-stressing agent.

Hereinafter, the composition of the epoxy resin composition will be specifically described.

Epoxy resin

The epoxy resin composition of the present invention uses an epoxy resin having an intramolecular non-condensed cyclic polycyclic structure and at least three functional groups (for example, an epoxy group) as an epoxy resin. Since the epoxy resin has a relatively low melting point and softening point as compared with the conventional epoxy resin having a condensed cyclic polycyclic structure such as a naphthalene / anthracene structure, the restriction of the filler content in the encapsulating material composition is overcome, The content of the filler can be set to be 85 to 91% by weight. Further, when a cured product is formed by a curing reaction, a polyfunctional epoxy group improves the resistance to water absorption and heat resistance to give high reliability, and has excellent strength and mechanical properties after curing. In addition, since the epoxy resin composition containing the epoxy resin has a high glass transition temperature (Tg) of 200 ° C or more and an excellent dielectric property at a high temperature (200 ° C) of 5.5 or less, It can be usefully used for bagging purposes.

The epoxy resin of the present invention includes an epoxy resin represented by the following formula (1).

In this formula,

R ₁ -R ₃ are each independently a C ₁ -C ₆ alkyl group or a C ₁ -C ₆ alkoxy group,

R ₄ -R ₁₉ are each independently hydrogen or a C ₁ -C ₆ alkyl group.

The epoxy resin represented by Formula 1 may be represented by Formula 1a below.

[Formula 1a]

Wherein R ₁ -R ₃ are each independently a C ₁ -C ₆ alkyl group or a C ₁ -C ₆ alkoxy group.

In the present specification, the C ₁ -C ₆ alkyl group means a straight chain or branched hydrocarbon composed of _{1 to 6} carbon atoms. Examples include, but are not limited to, methyl, ethyl, n-propyl, i-propyl, n-butyl, i-butyl, t-butyl, n-pentyl,

The C ₁ -C ₆ alkoxy group means a straight-chain or branched alkoxy group having 1 to ₆ carbon atoms. Examples include, but are not limited to, methoxy, ethoxy, n-propanoxy, and the like.

The R ₁ -R ₃ may be the same or different from each other, and each independently may be an alkyl group such as a methyl group, an ethyl group or a propyl group, or an alkoxy group such as a methoxy group, an ethoxy group or a propoxy group.

The epoxy resin represented by the general formula (1) can suitably control the melt viscosity and the softening point according to the type of substituent introduced into R ₁ -R ₃ within a range described later.

The epoxy resin represented by the above formula (1) may have a melt viscosity of less than 3 poise, for example, 0.5-3 poise at 150 ° C, as measured using an ICI viscometer (Research Equipment Co., TW 5NX). The softening point of the epoxy resin may be 100 占 폚 or lower, for example, 50-100 占 폚. Due to the low melt viscosity and the softening point, the content of the inorganic filler can be set to be higher than 80 wt%, for example, in the range of 85-91 wt%, and kneading can be easily performed.

The epoxy equivalent of the epoxy resin represented by the above formula (1) is not particularly limited. The epoxy equivalent (EEW) may be, for example, 180-300 g / eq, and in another example 200-280 g / eq.

The content of the epoxy resin represented by Formula 1 may be 40-100 wt% based on the total weight of the epoxy resin. When the content of the epoxy resin represented by the above-mentioned formula (1) is less than 40% by weight, other epoxy resins having a sufficiently high glass transition temperature (Tg) or having a high glass transition temperature (Tg) such as naphthalene type or anthracene type It may be difficult to set the content of the inorganic filler to a high value when mixed. Further, it is difficult to achieve a dielectric constant at 200 DEG C and below 5.5 after curing.

The epoxy resin composition of the present invention may further include an epoxy resin commonly used in a semiconductor encapsulant, in addition to the epoxy resin represented by the above-mentioned formula (1).

As the above-mentioned epoxy resin to be further included, conventional epoxy resins known in the art can be used without limitation. For example, a polymer or oligomer containing at least two epoxy groups in a molecule, and a polymer or oligomer produced by the ring-opening reaction of the epoxy group. Non-limiting examples of epoxy resins that can be used include bisphenol A, alicyclic, linear aliphatic, (os) cresol novolak, naphthol novolac, biphenyl, multifunctional, naphthalene, anthracene, Diene type epoxy resin and the like. The above-described components may be used alone or in combination of two or more. In particular, when at least one epoxy resin among the (os) cresol novolak type epoxy resin and the naphthalene type epoxy resin is contained, high heat resistance can be realized.

The epoxy resin may have an epoxy equivalent weight (EEW) of 120-280 g / eq and a softening point of 50-120 ° C.

In the present invention, the total epoxy resin containing the epoxy resin represented by Formula 1 is not particularly limited and may be, for example, 2-20% by weight based on the total weight of the epoxy resin composition, and 5-10% Lt; / RTI > When the content of the epoxy resin is less than 2% by weight, the adhesiveness, electrical insulation, flowability and moldability of the sealing material may be deteriorated. When the amount exceeds 20% by weight, hardening of the cured product is difficult, And the content of the filler is relatively decreased, so that the strength and mechanical characteristics may be deteriorated.

Hardener

In the epoxy resin composition of the present invention, the curing agent includes a benzoxazine-based compound as a component which reacts with an epoxy resin as a main resin and proceeds the curing of the composition.

The compounding ratio of the curing agent to the epoxy resin may range from 0.5 to 1.2 equivalents, for example, from 0.7 to 1.1 equivalents, of the reactive groups in the curing agent relative to one equivalent of the epoxy group in the whole epoxy resin. If the amount of the reactive group in the curing agent relative to 1 equivalent of the epoxy group is less than 0.5 equivalent, the curability is low and the continuous workability becomes poor, and the strength of the cured product becomes weak. On the other hand, when the amount of the reactive group in the curing agent relative to 1 equivalent of the epoxy group exceeds 1.2 equivalents, the adhesive property of the cured product lowers and water resistance becomes poor, so that the reliability of the package (PKG) is deteriorated at high temperature and high humidity.

The benzoxazine-based compound may be represented by the following general formula (2), but is not particularly limited thereto.

In this formula,

X is a C ₁ -C ₁₀ alkylene group,

R ₂₀ -R ₂₇ are each independently hydrogen or a C ₁ -C ₆ alkyl group.

The benzoxazine resin represented by Formula 2 may be represented by Formula 2a below.

(2a)

The softening point of the benzoxazine-based resin represented by Formula 2 may be 100 ° C or less, for example, 50-100 ° C.

The content of the benzoxazine resin represented by the formula (2) may be 15-100 wt% based on the total weight of the curing agent. When the content of the benzoxazine resin is less than 15%, a sufficiently high glass transition temperature (Tg) of the epoxy resin composition can not be obtained.

When the benzoxazine-based compound represented by the above formula (2) is used alone as a curing agent, the blending ratio of the curing agent and the epoxy resin is preferably 0.5-1.1 equivalents to the reaction active group in the benzoxazine-based compound with respect to 1 equivalent of the epoxy group in the whole epoxy resin, For example, in the range of 0.7-0.9 equivalents. If the amount of the reactive group of the benzoxazine based on one equivalent of the epoxy group is less than 0.5 equivalent, the curing property is low and the continuous workability becomes weak, and the strength of the cured product becomes weak. On the other hand, when the amount of the active group of the benzoxazine based on 1 equivalent of the epoxy group is more than 1.1 equivalents, the adhesive property of the cured product becomes low and the water resistance becomes poor, and the reliability of the high temperature high humidity of the package (PKG) is lowered.

The epoxy resin composition according to the present invention may further comprise a curing agent which is usually used in a semiconductor encapsulant, in addition to the benzoxazine curing agent represented by the above-mentioned formula (2).

As the above-mentioned curing agent which is further contained, a conventional curing agent known in the art for curing reaction with an epoxy resin can be used without limitation. As the curing agent for semiconductor encapsulation, it is appropriate to use a phenol resin-based curing agent having excellent physical properties such as moisture resistance, heat resistance and preservability.

As the phenol resin-based curing agent, there can be used all the monomers, oligomers, and polymers containing at least two phenolic hydroxy groups which react with the epoxy resin component and promote curing in the molecular structure without limitation, and its molecular weight and molecular structure And is not particularly limited. Non-limiting examples of usable phenolic resin-based curing agents include xylock-type phenol resins, cresol novolak resins, phenol alkyl resins, various novolac resins synthesized from bisphenol A, dihydrobiphenyl resins, polyaromatic phenol resins, Phenol novolak type, naphthalene type, dicyclopentadiene type phenol resin, and the like. The above-mentioned components may be used alone or in combination of two or more.

When the benzoxazine-based compound represented by the above formula (2) is mixed with at least one phenol resin-based curing agent as a curing agent, the compounding ratio of the curing agent to the epoxy resin is preferably such that the reaction active group in the total curing agent is 0.7 -1.2 equivalents, such as 0.8-1.1 equivalents. When the activating group of the curing agent is less than 0.7 equivalent, the curing speed of the epoxy resin composition is slowed. When the equivalent of the epoxy resin composition is more than 1.2 equivalent, the strength of the cured product after the final curing tends to decrease. In addition, when the compounding ratio of the curing agent to the epoxy resin is out of the above range, high temperature pyrolysis due to an unreacted epoxy group or curing agent may occur.

The content of the curing agent containing the benzoxazine-based compound represented by the general formula (2) can be appropriately controlled depending on the content of the main resin. The content of the curing agent is not particularly limited. For example, the content of the curing agent may range from 1 to 20% by weight based on the total weight of the epoxy resin composition, and alternatively, it may range from 2 to 10% by weight. If the content of the curing agent is less than 1% by weight, the curing property and the moldability may be problematic. If the content of the curing agent is more than 20% by weight, the reliability may be lowered and the strength of the cured product may be lowered.

Hardening accelerator

In the epoxy resin composition of the present invention, the curing accelerator is a component for promoting the curing reaction between the epoxy resin and the curing agent, and can be used without any limitations as commonly used in the art.

Non-limiting examples of available curing accelerators include imidazole compounds such as 2-methylimidazole, 2-ethyl-4-methylimidazole, and 2-phenylimidazole; Amine compounds such as triethylamine, tributylamine and benzyldimethylamine; Tertiary amine compounds such as 2- (dimethylaminomethyl) phenol, 2,4,6-tris (dimethylaminomethyl) phenol and 1,8-diazabicyclo (5,4,0) undec-7-ene; And organic phosphine compounds such as phenylphosphine, diphenylphosphine, triphenylphosphine, tributylphosphine and tri (p-methylphenyl) phosphine. The above-mentioned components may be used singly or in combination of two or more. Particularly, an organic phosphine compound having excellent moisture resistance and heat hardness can be used.

The content of the curing accelerator may be appropriately controlled depending on the reactivity of the main resin or the curing agent. The content of the curing accelerator may be, for example, 0.05-1.0 wt%, and in another example 0.05-0.5 wt%, based on the total weight of the epoxy resin composition. If the content of the curing accelerator is less than 0.05% by weight, the curability may be deteriorated. If the content is more than 1.0% by weight, flowability may be deteriorated due to overcuring.

Inorganic filler

In the epoxy resin composition of the present invention, the inorganic filler can be used as an inorganic filler applicable in the art as a component for improving the strength of the sealing material and lowering the moisture absorption amount.

Non-limiting examples of usable inorganic fillers include silica, silica nitride, alumina, aluminum nitride, boron nitride, and the like (high purity) silica fillers such as natural silica, synthetic silica, fused silica, have. The above-mentioned components may be used alone or in combination of two or more.

The average particle diameter of the inorganic filler is not particularly limited, and may be in the range of, for example, 1-50 mu m, and in another example 5-30 mu m. Considering the filling property in the mold, the maximum particle diameter of the inorganic filler may be 180 占 퐉 or less, for example, 150 占 퐉 or less. The shape of the inorganic filler is not particularly limited, and may be, for example, spherical, angular, amorphous, or a mixed form thereof.

As the inorganic filler, fused or synthetic silica having an average degree of sphericity of 0.92 or more and an average particle diameter of 1 to 30 m can be used, and reliability at the time of mechanical strength and low moisture absorption can be improved.

The content of the inorganic filler is not particularly limited, and may be, for example, 80 to 91% by weight based on the total weight of the epoxy resin composition. When the content of the filler is less than 80 parts by weight, the strength is lowered by an increase in the moisture absorption amount, and adhesion after the reflow soldering process may be deteriorated. On the other hand, if the content of the filler exceeds 91 wt%, the viscosity may increase and the flowability may be deteriorated, resulting in poor moldability.

The epoxy resin composition for semiconductor encapsulation of the present invention can effectively satisfy the package characteristic level required at a filler content of about 85% or more (for example, about 87% by weight), which is commonly used in the art.

additive

The epoxy resin composition of the present invention may optionally further contain additives conventionally used in the field of encapsulants, so long as the inherent characteristics of the composition are not impaired.

Examples of usable additives include, but are not limited to, coupling agents, coloring agents, release agents, modifiers, flame retardants, low stressing agents, and mixtures of two or more thereof. The content of such an additive may be appropriately added within the range of contents known in the art, for example, 0.05-5% by weight based on the total weight of the epoxy resin composition.

In the present invention, a conventional flame retardant in the art can be used to impart flame retardancy. Non-limiting examples of flame retardants that can be used include metal hydroxides, phosphorus and nitrogen containing organic compounds (e.g., resorcinol diphosphate, phosphate, phenoxyphosphazene, melamine cyanurate ), Phenolic melamine resin), or a mixture thereof. The above-mentioned components may be used alone or in combination of two or more. Examples of such metal hydroxides include hydroxides of metals selected from magnesium, calcium, strontium, barium, boron, aluminum and gallium.

The coupling agent is a substance that imparts a bonding force between an organic material (e.g., resin) and an inorganic material (e.g., an inorganic filler) through a stable dispersibility thereof, and conventional materials known in the art can be used. For example, a silane coupling agent or a titanate coupling agent such as an epoxy silane coupling agent, an amino silane coupling agent, an alkyl silane coupling agent, a uread silane coupling agent, an acryl silane coupling agent, a vinyl silane coupling agent or a mercaptosilane coupling agent, a titanate coupling agent, an aluminum / zirconium coupling agent, An organic coupling agent may be used. The above-mentioned components may be used alone or in combination of two or more. The content of the coupling agent is not particularly limited, and may be in the range of 0.1-0.6 wt% based on the total weight of the epoxy resin composition.

As the coloring agent, coloring agents such as carbon black, spinach, and other organic coloring agents may be used. The colorant may be used in an amount of 0.1-0.4 wt% based on the total weight of the epoxy resin composition, but is not particularly limited thereto.

The releasing agent is a material used for securing a releasing force that minimizes adherence to a mold after molding. As the release agent, a long-chain fatty acid, a metal salt of a long-chain fatty acid, a paraffin wax, a natural wax, a synthetic wax or a mixture thereof may be used. Natural waxes include carnauba wax and synthetic waxes include polyethylene wax. The content of the releasing agent is not particularly limited, and may be, for example, 0.1 to 0.4% by weight based on the total weight of the epoxy resin composition.

As the low-stressing agent, a modified silicone resin, a modified polybutadiene, and the like can be used. As the modifier, silicone powder or the like may be used, and for example, hydrotalcite ion-capturing agent may be used.

The epoxy resin composition according to the present invention includes a trifunctional epoxy resin having a non-condensed cyclic polycyclic structure having a low melt viscosity, and thus can be used in a wide variety of applications, , Good dielectric properties at high temperature, high glass transition temperature).

In the epoxy resin composition, the inorganic filler may be contained in an amount of 85 wt% or more, such as 85-90 wt%, based on a flowability standard of 30 inches or more. In addition, the inorganic filler may be up to 92 wt%, such as 90-92 wt%, based on a flow rate of less than 15 inches and less than 30 inches.

The epoxy resin composition may have a glass transition temperature (Tg) of 200 ° C or higher, for example, 200-230 ° C. The epoxy-time-curable composition may have a dielectric constant at 200 ° C after curing of less than 5.5, such as 4.0-5.5.

The method for producing the epoxy resin composition of the present invention is not particularly limited and can be produced by using a conventional method known in the art. For example, it can be produced by a known melt-kneading method using a Banbury mixer, a kneader, a roll, a single or twin extruder, a cone, or the like.

For example, the above-mentioned components may be homogeneously mixed and melt-mixed at a temperature of 100-130 ° C using a heat kneader, cooled to room temperature, pulverized into powder, .

<Semiconductor device>

The present invention provides a semiconductor device encapsulated with the above-described epoxy resin composition.

A semiconductor device to which the epoxy composition can be applied refers to an electronic circuit (integrated circuit) which is formed by integrating and wiring a transistor, a diode, a resistor, a capacitor, etc. on a semiconductor chip or a substrate. For example, the semiconductor device may be a transistor, a diode, a microprocessor, a semiconductor memory, a power semiconductor, or the like. The semiconductor device may be a high-power semiconductor device including at least one of silicon (Si), silicon carbide (SiC), and gallium nitride (GaN).

The method for encapsulating and manufacturing a semiconductor device using the epoxy resin composition according to the present invention is not particularly limited and may be manufactured by a method known in the art. For example, it can be manufactured by sealing a semiconductor element by a molding method such as a transfer mold, a compression mold, or an injection mold.

Hereinafter, the present invention will be described more specifically by way of examples. However, the following examples are provided to aid understanding of the present invention and are not intended to limit the scope of the present invention in any sense.

[ Example  1-5]

Specifications of raw materials constituting the epoxy resin composition of the present invention are shown in Table 1 below. The epoxy resin, the curing agent, the curing accelerator, the filler, and the additive component were mixed according to the composition shown in Table 2 below, melted and mixed at a temperature of 100-130 ° C using a melt kneader, cooled to room temperature, After the pulverization, the epoxy resin composition of Example 1-5 was prepared through a blending process. In Table 2, the usage unit of each composition is% by weight.

 [ Comparative Example  1-4]

Using the epoxy resin, curing agent, curing accelerator, filler, and additive components according to the composition shown in Table 2 above, an epoxy resin composition of Comparative Example 1-4 was prepared in the same manner as in Example.

[ Experimental Example . Property evaluation]

The physical properties of the epoxy resin compositions prepared in Examples 1-5 and Comparative Examples 1-4 were measured as follows. Specimens for evaluating physical properties were prepared by molding the epoxy resin composition powder prepared in each of Examples and Comparative Examples at 175 캜 for 120 seconds by molding in a transfer molding manner and then curing at 190 캜 for 6 hours.

(1) Spiral flow

The flowability of the epoxy resin composition prepared in each of the Examples and Comparative Examples was measured using a mold for evaluation according to the EMMI-1-66 standard at 175 DEG C and 70 kgf / cm2 using a transfer molding press.

(2) Curing time

An epoxy resin composition powder prepared on a 175 占 폚 hot plate was applied to measure the gel time.

(3) Glass transition temperature (Tg)

Specimens of the same size were molded and measured using a TMA (Thermomechanical Analyzer). The temperature was measured at room temperature to 300 ° C at a heating rate of 10 ° C / min using a TA company 'TMA Q400', and the Tg was determined using an onset point technique.

(4) Dielectric constant (Dk)

The dielectric constant was measured from 30 ° C to 240 ° C after curing by using a circular specimen with a diameter of 30 mm and a thickness of 2 mm. The measurement conditions were 1 Hz and 1.5 V AC.

(5) Mold workability

MQFP-244 Book molds were classified into five stages based on the release force measured during continuous molding operation. The higher the number, the better the mold workability.

As can be seen from the results of Table 3, the epoxy resin composition of Example 1-5 exhibited a high glass transition temperature (Tg) of 200 ° C or higher after curing and exhibited a dielectric constant at 200 ° C of 5.5 or less at a high temperature Excellent dielectric properties were exhibited. At the same time, it was confirmed that mold workability was also excellent. It was also found that a flowability level of 30 inches or more can be maintained even at a high filler content of 86% by weight.

In contrast, an epoxy resin composition (Comparative Example 1, Comparative Example 3) containing no benzoxazine type curing agent or containing less than a predetermined amount, an epoxy resin composition containing a less amount of the epoxy resin of the present structure (Comparative Example 2) and The epoxy resin composition (Comparative Example 4) not containing the epoxy resin and the benzoxazine curing agent of the present invention had a glass transition temperature (Tg) of 200 ° C or higher after curing, a dielectric constant of less than 5.5 at 200 ° C, inch flowability at the same time.

Claims (7)

An epoxy resin composition comprising an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler,
Wherein the epoxy resin comprises an epoxy resin represented by the following formula (1)
Wherein the curing agent comprises a benzoxazine based compound,
The content of the epoxy resin represented by the following formula (1) is 40-100 wt% based on the total weight of the epoxy resin,
Wherein the content of the benzoxazine-based compound is 15-100 wt% based on the total weight of the curing agent:
[Chemical Formula 1]

In this formula,
R ₁ -R ₃ are each independently a C ₁ -C ₆ alkyl group or a C ₁ -C ₆ alkoxy group,
R ₄ -R ₁₉ are each independently hydrogen or a C ₁ -C ₆ alkyl group. The epoxy resin composition according to claim 1, wherein the epoxy resin represented by Formula (1) has an epoxy equivalent of 180-300 g / eq and a softening point of 50-100 deg. C at 150 DEG C of 3 poise or less, Composition. The epoxy resin composition according to claim 1, wherein the benzoxazine-based compound is represented by the following formula (2): &lt; EMI ID =
(2)

In this formula,
X is a C ₁ -C ₁₀ alkylene group,
R ₂₀ -R ₂₇ are each independently hydrogen or a C ₁ -C ₆ alkyl group. The epoxy resin composition according to claim 1, wherein the reactive group in the curing agent is 0.5 to 1.2 equivalents based on 1 equivalent of the epoxy group in the epoxy resin. The epoxy resin composition according to claim 1, wherein when the benzoxazine-based compound is used alone as the curing agent, the reaction active group in the benzoxazine-based compound is 0.5-1.1 equivalents based on 1 equivalent of the epoxy group in the epoxy resin. The epoxy resin composition according to claim 1, wherein the epoxy resin comprises 2-20 wt% of the epoxy resin, 1-20 wt% of the curing agent, 0.05-1.0 wt% of the curing accelerator, and 80-91 wt% of the inorganic filler, &Lt; / RTI &gt; A semiconductor device encapsulated with an epoxy resin composition according to any one of claims 1 to 6.