KR20190048092A - Conductive polyarylene sulfide resin composition - Google Patents

Abstract

The present invention relates to a conductive polyarylene sulfide resin composition with excellent electrical conductivity and miscibility, which comprises a mixture mixed with equal to or greater than 1 part by weight and less than 50 parts by weight of polystyrene sulfonate with respect to 100 parts by weight of polyarylene sulfide.

Description

CONDUCTIVE POLYARYLENE SULFIDE RESIN COMPOSITION [0001] The present invention relates to a conductive polyarylene sulfide resin composition,

The present invention relates to a conductive polyarylene sulfide resin composition having high kneadability together with excellent electrical conductivity.

Polyarylene sulfide (PAS), which is represented by polyphenylene sulfide (PPS), is widely used in automobiles, electrical and electronic products, machinery and the like due to its excellent strength, heat resistance, Has been widely used as a substitute for the same die casting metal. Particularly, since PPS resin has good flowability, it is advantageous to use it as a compound by kneading with a filler such as glass fiber or a reinforcing agent.

Generally, PPS polymers are non-conductive materials that do not have electrical conductivity. There have been attempts to impart electrical conductivity through sulfonation, but this has not been actively studied. Especially, it has been difficult to select acidic solvent for sulfonation of PPS polymer and to control acid treatment time.

Another method is proposed in which PPS resin is mixed with conductive carbon. However, conductive carbon has a poor kneading property with PPS resin, which makes it difficult to form a film, and the effect of imparting conductivity is not sufficient.

Japanese Patent Registration No. 57-021456 Japanese Patent Registration No. 60-008335

SUMMARY OF THE INVENTION An object of the present invention is to provide a conductive polyarylene sulfide resin composition having excellent electrical conductivity and high kneadability by solving the above problems.

Another object of the present invention is to provide a resin composition for forming a conductive polymer film comprising the above composition, a conductive polymer film produced using the resin composition, and a method for producing the same.

According to one embodiment of the present invention, there is provided a conductive polyarylene sulfide resin composition comprising 100 parts by weight of polyarylene sulfide, and a mixture of polystyrene sulfonate in an amount of 1 part by weight to less than 50 parts by weight .

According to another embodiment of the present invention, there is provided a resin composition for forming a conductive polymer film, which comprises the conductive polyarylene sulfide resin composition.

According to another embodiment of the present invention, the resin composition for forming a conductive polymer film is subjected to a pressure heat treatment at a temperature of 200 to 350 ° C and a pressure of 1 to 10 MPa for 10 seconds to 10 minutes The method comprising the steps of: preparing a conductive polymer film;

According to another embodiment of the present invention, there is provided a polyarylene sulfide resin composition comprising 100 parts by weight of polyarylene sulfide and 1 to 50 parts by weight of polystyrene sulfonate, A conductive polymer film having a thickness of 0.1 to 0.2 mm and a sheet resistance of 10 ⁹ to 10 ¹² Ω / □ is provided.

The conductive polyarylene sulfide resin composition according to the present invention has excellent electrical conductivity and high kneadability. As a result, it is possible to produce a film exhibiting excellent electrical conductivity without concern for the dendrites (dicentricity) between the polymers in the film at the time of film formation by high temperature pressurization.

1 is a photograph showing the result of evaluating the stability of the conductive polyarylene sulfide resin composition according to Comparative Example 1 at high temperature.
2 is a photograph showing a result of evaluating the stability of the conductive polyarylene sulfide resin composition according to Example 1 at high temperature.
3 is a graph showing the results of thermal analysis of the conductive polymer film prepared in Example 1 using differential scanning calorimetry (DSC).
4 is a graph showing the results of DSC analysis of polyphenylene sulfide (PPS).

Hereinafter, the present invention will be described more specifically. In addition, the present invention can be variously modified and can take various forms, so that specific embodiments are illustrated and described in detail below. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

Also, " comprising " as used herein should be interpreted as specifying the presence of particular features, integers, steps, operations, elements and / or components, It does not exclude the presence or addition of an ingredient.

Hereinafter, a composition for forming a conductive polymer film according to a specific embodiment of the present invention, a method for producing the same, and a conductive polymer film produced using the composition will be described.

The conductive polyarylene sulfide resin composition according to one embodiment of the present invention is a conductive polyarylene sulfide resin composition,

Based on 100 parts by weight of the polyarylene sulfide, the polystyrene sulfonate is mixed in an amount of 1 part by weight to less than 50 parts by weight.

As described above, in the present invention, the polyarylene sulfide represented by polyphenylene sulfide (PPS), which is excellent in miscibility with polyarylene sulfide and is capable of imparting electrical conductivity, It is possible to improve the conductivity of the resin composition and to improve the kneading property. As a result, it is possible to produce a film having excellent electrical conductivity without fear of generation of the intermolecular intermolecular film at the time of film formation under high temperature .

Specifically, in the conductive polyarylene sulfide resin composition according to one embodiment of the invention, the polyarylene sulfide includes a structure in which an aromatic ring and a sulfur atom are bonded to each other as a repeating unit. More specifically, the polyarylene sulfide may be polyphenylene sulfide containing a repeating unit represented by the following formula (1).

[Chemical Formula 1]

Wherein R ₁ is independently selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a nitro group, an amino group, and a phenyl group,

m is an integer of 0 to 4;

In the above formula (1), the bond of the sulfur atom (S) to the aromatic ring may be bonded at various positions such as para and meta, but bonding to the para position may exhibit better heat resistance and crystallinity.

In addition, the polyarylene sulfide may have a number average molecular weight of 5,000 to 100,000 g / mol, more specifically 10,000 to 50,000 g / mol. In the present invention, the number average molecular weight (Mn) means a value measured by high-temperature gel permeation chromatography (GPC) in terms of standard polystyrene.

In addition, the polyarylene sulfide has a melt mass flow rate (MFR) of 10 to 10,000 g / 10 min measured at 315 캜 at a pressure of 2.16 kg in accordance with the ASTM d 25.4 mm standard using a MI (Melt Flow Index) More specifically 10 to 1,000 g / 10 min. When the MFR is within the above range, the resin composition containing the MFR can exhibit excellent processability and film formability.

The polyarylene sulfide may have a melting temperature (Tm) measured by thermal analysis using differential scanning calorimetry (DSC) under a condition that the weight average molecular weight and the MFR are satisfied, 350 ° C and a crystallization temperature Tc of 200 to 330 ° C, more specifically Tm of 240 to 330 ° C and Tc of 220 to 310 ° C. The polyarylene sulfide that satisfies such physical property requirements simultaneously can exhibit mechanical strength and processability as well as excellent heat resistance in the production of the resin composition.

In a polyarylene sulfide resin composition according to an embodiment of the present invention, polystyrene sulfonate (PSS) is a sulfonate group capable of forming a charge transfer complex with other compounds in a basic skeleton structure (SO ₃ ^- ), An electron mobility function is imparted to the electron mobility region formed by the π-π conjugation of the aromatic rings between the polyarylene sulfide main chains to exhibit electrical conductivity and exhibit excellent miscibility. PSS exhibits excellent thermal stability even at a high temperature, particularly at a temperature not lower than the Td of polyarylene sulfide, and is free from the risk of separation during high-temperature pressurization for film formation and is simply kneaded without bonding with the polyarylene sulfide main chain in the resin composition , There is no fear that the physical properties of the polyarylene sulfide polymer main chain are changed due to crosslinking.

Specifically, the PSS may include a repeating unit represented by the following formula (2):

(2)

In Formula 2,

R ₂ are each independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms,

p is an integer of 0 to 4;

The polystyrene sulfonate may have a weight average molecular weight of 1,000 to 1,000,000 g / mol, more specifically 10,000 to 500,000 g / mol. When polystyrene sulfonate has a weight average molecular weight in the above range, it can exhibit more excellent compatibility with polyarylene sulfide, and as a result, the resin composition containing the polystyrene sulfonate can exhibit mechanical properties with excellent high temperature stability.

The polystyrene sulfonate may be contained in an amount of 1 part by weight or more and less than 50 parts by weight based on 100 parts by weight of the polyarylene sulfide.

If the content of polystyrene sulfonate is less than 1 part by weight, the effect of improving electrical conductivity is insignificant. When the amount of polystyrene sulfonate is more than 50 parts by weight, it is difficult to uniformly mix with polyarylene sulfide. Accordingly, The mechanical strength of the film may be greatly reduced due to the lowering of the kneading property, and the film may be broken and may form a compartment when an external force is generated. Considering the good balance of the electrical conductivity and mechanical properties of the resin composition and the film due to the control of the content of polystyrene sulfonate in the mixture, the polystyrene sulfonate is more preferably 20 To 40 parts by weight, and more particularly from 20 to 30 parts by weight.

Meanwhile, the polyarylene sulfide resin composition according to one embodiment of the present invention may contain a coupling agent, a filler, an impact resistance imparting agent, a reinforcing agent, a releasing agent, a colorant, an antioxidant, a heat stabilizer, a UV stabilizer, An ultraviolet absorber, a foaming agent, a flame retardant, a flame retarding agent, an antirust agent, a lubricant or a nucleating agent, and the like.

Specifically, when a coupling agent is further included, the coupling agent may be a silane coupling agent or a titanium coupling agent, and more specifically, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyl Epoxy group-containing alkoxysilane compounds such as triethoxysilane and? - (3,4-epoxycyclohexyl) ethyltrimethoxysilane; isocyanatopropyltrimethoxysilane, γ-isocyanatopropyltrimethoxysilane, γ-isocyanatopropyltriethoxysilane, γ-isocyanatopropylmethyldimethoxysilane, γ-isocyanatopropylmethyldiethoxysilane, γ-isocyanatopropyl Isocyanato group-containing alkoxysilane compounds such as ethyldimethoxysilane,? -Isocyanatopropylethyldiethoxysilane and? -Isocyanatopropyltrichlorosilane; amino group-containing alkoxysilane compounds such as? - (2-aminoethyl) aminopropylmethyldimethoxysilane,? - (2-aminoethyl) aminopropyltrimethoxysilane and? -aminopropyltrimethoxysilane; containing alkoxysilane compounds such as? -hydroxypropyltrimethoxysilane,? -hydroxypropyltrimethoxysilane,? -hydroxypropyltriethoxysilane, and the like, and any one or a mixture of two or more of them may be used.

The coupling agent may be contained in an amount of 10 wt% or less, more specifically 0.01 to 5 wt% or less, based on the total weight of the conductive polyarylene sulfide resin composition. When the content is within the above range, the mechanical strength characteristics of the polyarylene sulfide resin composition can be improved, and the viscosity can be increased to impart excellent moldability.

When the filler is further included, the filler may be a metal material such as nickel, copper, gold, silver, aluminum, zinc, nickel, tin, lead, chromium, platinum, palladium, tungsten, molybdenum An alloy, a mixture, or an intermetallic compound; Or carbonaceous materials such as artificial graphite, natural graphite, glassy carbon, carbon black, acetylene black, Ketjenblack, carbon fiber and carbon nanotube. Any one or a mixture of two or more of them may be used. In addition, the filler may be surface-treated with a silanol group-containing compound or the like to improve miscibility with polyarylene sulfide.

The filler may be contained in an amount of 10 wt% or less, more specifically, 1 to 5 wt% or less based on the total weight of the conductive polyarylene sulfide resin composition. When the content is within the above range, the mechanical strength characteristics and conductivity of the polyarylene sulfide resin composition can be improved without fear of deterioration of moldability.

In the case of further including an impact-imparting agent, the impact-imparting agent may specifically be a thermoplastic elastomer obtained by copolymerizing an -olefin and a vinyl polymerizable compound. Examples of the? -Olefins include? -Olefins having 2 to 8 carbon atoms such as ethylene, propylene and 1-butene. Examples of the vinyl polymerizable compound include?,?,? ? -unsaturated carboxylic acids and alkyl esters thereof; Alpha, beta -unsaturated dicarboxylic acids and derivatives thereof such as maleic acid, fumaric acid and itaconic acid; Or glycidyl (meth) acrylate.

The impact resistance imparting agent may be contained in an amount of 20% by weight or less, more specifically 5 to 10% by weight or less based on the total weight of the conductive polyarylene sulfide resin composition. When contained within the above-mentioned content range, excellent moldability and releasability can be exhibited with excellent impact resistance and tensile strength characteristics.

When the reinforcing agent is further included, the reinforcing agent may be specifically selected from among silica, alumina, glass beads, glass fiber, carbon fiber, boron nitride, talc, silicate (alumina silicate and the like), silicon chloride, silicon carbide, (Calcium carbonate, magnesium carbonate, dolomite, etc.) or sulfate (calcium sulfate, barium sulfate, etc.), and any one or a mixture of two or more of them may be used.

The reinforcing agent may be contained in an amount of 10 wt% or less, more specifically 1 to 7 wt% or less based on the total weight of the conductive polyarylene sulfide resin composition. When the content is within the above range, the strength, rigidity, heat resistance, dimensional stability, and the like of the resin composition can be improved.

In addition, the conductive polyarylene sulfide resin composition according to one embodiment of the present invention can be used in combination with the above-described components, depending on the application, such as polyester resin, polyamide resin, polyimide resin, polyetherimide resin, polycarbonate resin, A polyether ether ketone resin, a polyether ketone resin, a polyarylene resin, a polyethylene resin, a polypropylene resin, a polytetrafluoroethylene resin, a polytetrafluoroethylene resin, a polystyrene resin, an ABS resin, Synthetic resin such as resin, phenol resin, urethane resin, and liquid crystal polymer, and elastomer such as fluorine rubber. These other polymer resins can be suitably used in accordance with the use of the resin composition within a range not hindering the effect of the present invention.

As described above, the conductive polyarylene sulfide resin composition according to an embodiment of the present invention includes polystyrene sulfide, which imparts electrical conductivity to the polyarylene sulfide together with polyarylene sulfide and has excellent miscibility, Excellent electrical conductivity can be exhibited. In addition, the polyarylene sulfide is not doped with polystyrene sulfide or reacts with each other to form a reactant, but is contained in the resin composition in a simple mixed state and because of excellent compatibility of polystyrene sulfide with polyarylene sulfide By forming the homogeneous mixture, excellent thermal stability can be exhibited without changing the thermal behavior before and after the kneading, and furthermore, the electrical conductivity and the mechanical characteristics can be well balanced by controlling the content of polystyrene sulfide in the mixture. As a result, it is possible to form a film by high temperature pressing, and the produced film can also exhibit excellent electrical conductivity and mechanical properties.

According to another embodiment of the present invention, there is provided a composition for forming a conductive polymer film comprising the conductive polyarylene sulfide resin composition, an electroconductive polymer film using the composition, and a method for manufacturing the same.

The composition for forming a conductive polymer film includes the conductive polyarylene sulfide resin composition described above, and may further include a solvent and other additives capable of enhancing film formability as required.

The conductive polymer film may be produced by a conventional film forming method, except that the composition for forming a conductive polymer film is used.

For example, the conductive polymer film may be produced by charging the composition for forming a conductive polymer film into a film forming apparatus, followed by pressing at a high temperature.

In addition, the composition for forming an electroconductive polymer film may be added in such a manner that the thickness of the finally produced film, specifically, the thickness of the finally produced film is 0.01 to 1 mm.

Next, the composition for forming an electroconductive polymer film or the coating film is subjected to a heat treatment process under high-temperature pressurization conditions.

Specifically, the heat treatment process may be performed at a temperature of 200 to 350 DEG C and a pressure of 1 to 10 MPa for 10 seconds to 10 minutes.

If the temperature is less than 200 ° C or the pressure is less than 1 MPa, the film may not be formed, or the two polymers may not be sufficiently mixed. When the temperature is more than 350 ° C or more than 10 MPa, The crosslinking of the polymer chains or crosslinking of the polymer chain occurs, and there is a possibility that the physical properties of the polymer itself may be modified.

If the heat treatment is carried out for more than 10 minutes under the above-mentioned conditions, the polymer may be discolored to brown or dark brown. If the heat treatment is performed for less than 10 seconds, the film may not be formed or the two polymers may not be mixed sufficiently .

Accordingly, in consideration of the film forming property and the physical property control effect of the simultaneous control of the temperature, the pressure and the treatment time in the high-temperature pressurizing step, more specifically, a temperature of 290 to 310 DEG C and a pressure of 5 to 7 MPa , It can be performed for not less than 20 seconds and not more than 3 minutes.

The conductive polymer film produced by the above method has excellent electrical conductivity and mechanical properties and can be applied to various fields.

Specifically, the conductive polymer film contains polystyrene sulfonate in an amount of 1 part by weight to less than 50 parts by weight based on 100 parts by weight of polyarylene sulfide, and has a thickness of 0.1 to 0.2 mm and a specific surface area of 10 ⁹ to 10 ¹² Ω / , A flexural strength of Fs of from 50 to 115 MPa Fm of from 1000 to 3800 MPa, a tensile strength of from 10 to 50 MPa and a tensile strength of from 1.0 to 2.7% epsilon M.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. However, this is provided as an example of the invention, and the scope of the invention is not limited thereto in any sense.

The materials used in the following Examples and Comparative Examples are as follows:

PPS: polyphenylene sulfide (Mn: 18,000 g / mol, MFR: 821 g / 10 mol at 315 ° C, melt viscosity: 41.52 Pa.s, yield: 91%, Tm: 280.65 ° C, Tc: 238 ° C)

PSS: polystyrene sulfonate (Mw: 70,000 g / mol)

Example 1

1 part by weight of PSS was mixed with 100 parts by weight of PPS to prepare a conductive polyarylene sulfide resin composition. The composition thus prepared was put into a hot press machine as a composition for forming a conductive polymer film, and kept at 300 ° C and 7 MPa for 1 minute to form a film (film thickness: 0.14 mm).

Examples 2 to 5

The procedure of Example 1 was repeated except that the amount of PSS relative to 100 parts by weight of PPS was changed to 10 parts by weight, 20 parts by weight, 30 parts by weight and 40 parts by weight, An arylene sulfide resin composition and a conductive polymer film were prepared.

Comparative Example 1

A conductive polyarylene sulfide resin composition and a conductive polymer film were prepared in the same manner as in Example 1 except that PSS was not used in Example 1.

Comparative Example 2

A conductive polyarylene sulfide resin composition and a conductive polymer film were prepared in the same manner as in Example 1, except that 50 parts by weight of PSS was mixed with 100 parts by weight of PPS in Example 1.

Test Example 1

The conductive polyarylene sulfide resin composition prepared in Example 1 and Comparative Example 1 was held at 7 Mpa for 1 minute at 300 DEG C, and the composition of the composition was observed.

The results are shown in Figs. 1 and 2, respectively.

FIG. 1 shows the result of observing the high temperature stability of the conductive polyarylene sulfide resin composition of Comparative Example 1. FIG. 2 shows the result of observing the high temperature stability of the conductive polyarylene sulfide resin composition of Example 1. FIG.

As shown in Figs. 1 and 2, no change in discoloration or the like was observed in the resin compositions of Example 1 and Comparative Example 1 even when they were kept at a high temperature for a long time. From these results, it can be confirmed that the resin composition of Example 1 in which PSS is further mixed has excellent high-temperature stability.

Test Example 2

The resin composition and the conductive polymer film prepared in Example 1 were subjected to thermal analysis using differential scanning calorimetry (DSC). The results are shown in FIG. 3. For reference, the results of DSC analysis of Tm and Tc of PPS alone are shown in FIG.

As a result, in the case of the conductive polyarylene sulfide resin composition, there was no change in the value indicating the thermal behavior such as Tm and Tc, and no peak estimated as a new reactant was found. From this, it can be seen that the two polymers of PPS and PSS in the resin composition are contained in a simple mixed state.

Meanwhile, as shown in FIG. 3, the Tm of the film of the conductive polymer film was 281 ° C after kneading, and as shown in FIG. 4, there was no change at 281 ° C which is the Tm value of PPS alone. Also, the Tc of the film was changed to 251 ° C (see FIG. 3) after kneading at 250 ° C of PPS alone (see FIG. 4), and there was no significant change when comparing before and after kneading. Also, Tg of PSS can be confirmed at 98 ° C after kneading, and a shoulder peak of PSS appears at 230 ° C. The DSC analysis showed no significant shifts in the Tm and Tc values and changes in the graphical system that could occur when the reactants were formed by doping or reacting with each other. From these results, it can be seen that PPS and PSS are simple mixture.

Test Example 3

The surface resistance of the conductive polymer films prepared in Examples 1 to 5 and Comparative Example 1 was measured using a 4-point probe. The results are shown in Table 1 below.

Polystyrene sulfonate content
(Parts by weight) Sheet resistance (Ω / □) Example 1 One 10 ¹² Example 2 10 10 ¹¹ Example 3 20 10 ⁹ Example 4 30 10 ⁹ Example 5 40 10 ⁹ Comparative Example 1 0 10 ¹⁴ Comparative Example 2 50 Psalm making Impossible

As a result, the conductive polymer films of Examples 1 to 5, in which PSS was mixed, exhibited remarkably reduced sheet resistance values as compared with Comparative Example 1 which included PPS alone. From this, it can be confirmed that the electrical conductivity of the resin composition can be greatly improved by mixing PSS.

On the other hand, in the case of Comparative Example 2 containing 50 parts by weight of PSS as a binder resin, the original shape was lost due to external force in the form of a film due to a decrease in the kneading property between the PPS polymer and the PSS polymer. Therefore, sheet resistance measurement was impossible.

Test Example 4

The flexural strength and tensile strength of the resin composition prepared in Examples 1 to 5 and Comparative Examples 1 and 2 were measured after the specimens were produced. The results are shown in Table 2 below.

Flexural strength: The flexural strength was measured according to ISO 178 using a universal testing machine (UTM).

Tensile strength: The tensile strength was measured according to ASTM D 0638 using UTM.

Polystyrene sulfonate content (parts by weight) Flexural strength The tensile strength Fm (MPa) Fs (MPa) Ts (MPa) 竜 M (%) Example 1 One 3750 112.6 45.2 2.7 Example 2 10 3420 104 39 2.1 Example 3 20 2907 92 29 1.9 Example 4 30 2156 81 21 1.6 Example 5 40 1294 58 12 1.1 Comparative Example 1 0 3870 114.6 46.7 2.7 Comparative Example 2 50 Psalm not available Psalm not available Psalm not available Psalm not available

As a result of the measurement of the bending strength, the mechanical properties of the tensile strength and the bending strength were decreased due to the increase of the brittle of the PPS compound in the film as the content of PSS was increased with respect to the content of PPS. When the weight ratio of PSS to 100 parts by weight of PPS was 50 In the case of the weight part, the original shape was lost by the external force in the film form, and the film was broken. From these results, the electrical conductivity can be improved by mixing PPS and PSS. However, if the mixing ratio is not optimized, the mechanical strength of the film is greatly reduced due to the poor kneading property.

Claims (10)

Based on 100 parts by weight of polyarylene sulfide,
Wherein the polystyrene sulfonate is mixed in an amount of 1 part by weight to less than 50 parts by weight.
The method according to claim 1,
Wherein the polyarylene sulfide is polyphenylene sulfide. 2. The conductive polyarylene sulfide resin composition according to claim 1, wherein the polyarylene sulfide is polyphenylene sulfide.
The method according to claim 1,
Wherein the polyarylene sulfide has a number average molecular weight of 5,000 to 100,000 g / mol and a melt mass flow rate measured at 315 DEG C of 10 to 1,000 g / 10 min.
The method according to claim 1,
Wherein the polyarylene sulfide has a melting temperature (Tm) of 220 to 350 占 폚, a crystallization temperature (Tc) of 200 to 330 占 폚, and a conductive polyarylene sulfide resin composition.
The method according to claim 1,
Wherein the polystyrene sulfonate is contained in an amount of 20 to 40 parts by weight based on 100 parts by weight of the polyarylene sulfide.
The method according to claim 1,
Wherein the polystyrene sulfonate comprises a repeating unit represented by the following formula (2): < EMI ID =
(2)

In Formula 2,
R ₂ are each independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms,
p is an integer of 0 to 4;
The method according to claim 1,
The polystyrene sulfonate has a weight average molecular weight of 1,000 to 1,000,000 g / mol.
A resin composition for forming a conductive polymer film, comprising the conductive polyarylene sulfide resin composition according to any one of claims 1 to 7.
Heat-treating the resin composition for forming a conductive polymer film according to claim 8 at a temperature of 200 to 350 DEG C and a pressure of 1 to 10 MPa for 10 seconds or more and 10 minutes or less, Gt;
Wherein the polystyrene sulfonate is contained in an amount of 1 part by weight or more and less than 50 parts by weight based on 100 parts by weight of the polyarylene sulfide,
A conductive polymer film having a thickness of 0.1 to 0.2 mm and a sheet resistance value of 10 ⁹ to 10 ¹² ? / ?.

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