KR20190047387A - Imprinting mold and manufacturing method for imprinting mold - Google Patents

Abstract

An embodiment of the present invention provides an imprinting mold. The imprinting mold comprises a grid pattern part including a grid pattern unit on one side, wherein at least one side of the grid pattern unit includes an amorphous metal layer. In addition, depending on the thickness of the amorphous metal layer, the grid pattern part has a gradually increasing duty from one side to the other side.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a mold for imprinting and a method of manufacturing a mold for imprinting,

The present invention relates to a mold for imprinting and a method of manufacturing a mold for imprinting.

Recently, as interest in a display unit implementing Augmented Reality (AR), Mixed Reality (MR), or Virtual Reality (VR) has increased, There is a trend. A display unit implementing an augmented reality, a mixed reality, or a virtual reality includes a diffused light guide plate using a diffraction phenomenon based on the wave-like property of light. The diffraction light guide plate includes a diffraction grating pattern capable of guiding the light incident on the diffraction light guide plate to one point by internally reflecting or totally reflecting the light incident on the diffraction light guide plate.

A diffraction grating pattern including a diffraction grating pattern was manufactured through an imprinting process using a master mold in which a diffraction grating pattern was engraved. However, the master mold has a problem that the production time and production cost are large. Thus, a diffraction light guide plate was manufactured using a duplicate mold manufactured by transferring a grid pattern of a master mold to a polyethylene terephthalate (PET) substrate having a relatively low production cost and a short production time. However, the replica mold based on a base material such as PET has poor durability, so that there is a problem that the imprinting efficiency is drastically deteriorated when a repetitive imprinting process is performed.

Also, the diffraction grating patterns included in the mold used for manufacturing the conventional diffraction grating pattern had the same duty, and the diffraction grating patterns of the diffraction grating patterns produced using the molds had the same duty in all the areas. As the duty of the diffraction grating pattern included in the diffraction light guide plate was the same, the light diffraction efficiency in the diffraction grating pattern included in the diffraction light guide plate was the same. In the case where the light diffraction efficiency is the same in the entire region of the diffraction light guide plate, the amount of light diffracted by the diffraction light guide plate is reduced in the process of reflection or total reflection of light in the diffused light guide plate, . When the amount of light diffracted by the diffracting light guide plate is different from each other, light having a high light intensity is emitted in the portion where the diffracted light amount is large, while light having low light intensity is emitted in the portion where the diffracted light amount is small, A problem that the light intensity of the light is not constant may occur. The display unit using such a diffraction light guide plate has a problem that it is difficult to provide a homogeneous quality image to the user.

Accordingly, there is a need for a technique capable of manufacturing an imprinting mold capable of improving the durability of the imprinting mold and producing a diffracted light guide plate having a constant amount of light diffracted in the diffraction grating pattern.

The present disclosure is intended to provide a mold for imprinting and a method for manufacturing a mold for imprinting.

One embodiment of the present invention includes a lattice pattern unit including a lattice pattern unit on one surface thereof, wherein at least one surface of the lattice pattern unit includes an amorphous metal layer, and the lattice pattern unit has, on one side, Lt; RTI ID = 0.0 > increasing < / RTI >

Still another embodiment of the present invention provides a method for manufacturing an imprinting mold.

According to an embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: preparing a mold including a grid pattern unit including a grid pattern unit on one side; And forming an amorphous metal layer on at least one surface of the lattice pattern unit by obliquely depositing at least one amorphous metal on the lattice pattern unit, And the duty is gradually increased in the direction toward the other side of the mold.

Still another embodiment of the present invention provides a diffracting light guide plate.

An embodiment of the present invention provides a diffracting light guide plate including a diffraction grating pattern manufactured using the imprinting mold.

According to an embodiment of the present invention, the imprinting mold includes a lattice pattern portion including an amorphous metal layer, so that durability can be improved.

According to one embodiment of the present invention, it is possible to provide an imprinting mold capable of manufacturing a diffraction light guide plate having a constant amount of light diffracted in the diffraction grating pattern.

According to an embodiment of the present invention, an imprinting mold including a grid pattern portion whose duty gradually increases from one side to the other side can be easily manufactured.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of an imprinting mold including a grid pattern part according to an embodiment of the present invention; FIG.
2A and 2B are schematic views of a lattice pattern unit including a lattice pattern unit having an amorphous metal layer according to an embodiment of the present invention.
FIGS. 3A to 3C are schematic views of a grid pattern unit having an inclined pattern including a grid pattern unit provided with an amorphous metal layer according to an embodiment of the present invention.
FIG. 4 is a schematic view of an imprinting mold including a plurality of grid pattern portions on one side.
FIG. 5 is a schematic view illustrating depositing an amorphous metal on an imprinting mold including a lattice pattern portion according to an embodiment of the present invention. Referring to FIG.
6 is a graph showing the results of measuring the thicknesses of the amorphous metal layers included in the imprinting molds prepared in Examples 1 and 2 of the present invention.
FIG. 7 is a view showing XRD (X-ray diffraction spectroscopy) analysis results of the amorphous metal layer included in the imprinting mold manufactured in Examples 1 to 3 of the present invention.
8 is a phase diagram showing a composition range of the amorphous metal layer included in the imprinting mold manufactured in Examples 1 to 3 of the present invention.

Throughout this specification, when an element is referred to as " comprising ", it means that it can include other elements as well, without departing from the other elements unless specifically stated otherwise.

Throughout this specification, when a member is " on " another member, it includes not only when the member is in contact with the other member, but also when there is another member between the two members.

In the entire specification of the present application, the Young's modulus of a member is obtained by fixing both ends of a sample prepared according to JIS-K6251-1 standard, and then applying a force in a direction perpendicular to the thickness direction of the sample, (Stress) per unit area according to the following formula (1). Specifically, it may be a value obtained by calculating the ratio of the stress to the measured tensile rate. As the measuring instrument, a dynamic mechanical analyzer (DMA 800, TA Instruments) may be used.

Throughout this specification, the tensile strength of any member may refer to the maximum stress measured until the member is broken by tensile load, with a dynamic mechanical analyzer (DMA 800, TA Instruments) can be used.

In the entire specification of the present application, the toughness of a member is obtained by fixing both ends of a sample prepared according to JIS-K6251-1 standard and then applying a force in a direction perpendicular to the thickness direction of the sample to determine a tensile strength Which is a value obtained by measuring the stress per unit area. Specifically, it may be a value obtained by calculating the integrated value of the function derived by the measured tensile rate and stress. As the measuring instrument, a dynamic mechanical analyzer (DMA 800, TA Instruments) may be used.

Hereinafter, the present invention will be described in more detail.

One embodiment of the present invention includes a lattice pattern unit including a lattice pattern unit on one surface thereof, wherein at least one surface of the lattice pattern unit includes an amorphous metal layer, and the lattice pattern unit has, on one side, Lt; RTI ID = 0.0 > increasing < / RTI >

According to an embodiment of the present invention, the imprinting mold includes a lattice pattern portion including an amorphous metal layer, so that durability can be improved.

According to an embodiment of the present invention, one surface of the imprinting mold may include a lattice pattern portion including a lattice pattern unit. The lattice pattern unit may include a plurality of lattice pattern units, and at least one surface of the lattice pattern unit may include an amorphous metal layer. That is, an amorphous metal layer may be provided on at least one surface of the lattice pattern unit.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of an imprinting mold including a grid pattern part according to an embodiment of the present invention; FIG. 1 illustrates an imprinting mold 100 having a lattice pattern unit including a lattice pattern unit 200 provided continuously along a direction perpendicular to the other side A of the lattice pattern unit, Fig.

2A and 2B are schematic views of a lattice pattern unit including a lattice pattern unit having an amorphous metal layer according to an embodiment of the present invention. 2A is a view showing a lattice pattern unit including a lattice pattern unit having an amorphous metal layer 300 on one side of a lattice pattern unit 200. Fig. And a lattice pattern unit including an amorphous metal layer 300 on an upper surface thereof.

Referring to FIGS. 2A and 2B, in the cross-sectional direction of the imprinting mold, the grid pattern unit 200 may include one side surface, the other side surface, and the upper surface. Referring to FIG. 2A, one side of the grid pattern unit 200 may include the amorphous metal layer 300. Referring to FIG. 2B, one side surface and the upper surface of the grid pattern unit 200 may include an amorphous metal layer 300. Wherein the amorphous metal layer is formed on one side surface of the grid pattern unit or an amorphous metal layer is formed on one side surface and the upper surface of the grid pattern unit to form the grating pattern unit, Can be improved.

According to an embodiment of the present invention, the lattice pattern portion may include a lattice pattern unit including an amorphous metal layer on one side. Specifically, the lattice pattern unit may include a lattice pattern unit having an amorphous metal layer on one surface thereof, and may include a lattice pattern unit having no amorphous metal layer. Referring to FIG. 2B, the lattice pattern unit may include a lattice pattern unit 200 having no amorphous metal layer 300 and a lattice pattern unit 200 having at least one amorphous metal layer 300 on at least one side thereof.

According to an embodiment of the present invention, the grid pattern portion may be embossed or embossed on one surface of the imprinting mold. 2A and 2B, one surface of the imprinting mold 100 may include a lattice pattern portion including the lattice pattern unit 200 having a relief shape.

According to an embodiment of the present invention, the thickness of the amorphous metal layer may gradually increase the duty of the lattice pattern portion from one side to the other side. In the present invention, " duty " may mean a value obtained by dividing the value of the width of the lattice pattern unit included in the lattice pattern unit by the period of the lattice pattern unit (width of the lattice pattern unit / period of the lattice pattern unit). In the present invention, the value of the width of the grid pattern unit may mean the width of the grid pattern unit including the thickness of the amorphous metal layer. Specifically, the width of the lattice pattern unit may be a sum of the width of the lattice pattern unit itself and the thickness of the amorphous metal layer on one side of the lattice pattern unit. 2A, when the amorphous metal layer 300 is provided on one side of the lattice pattern unit 200, the width of the lattice pattern unit is the sum of the width of the lattice pattern unit itself and the thickness of the amorphous metal layer (d2) . ≪ / RTI > When the amorphous metal layer is not included on at least one surface of the lattice pattern unit, the width of the lattice pattern unit may mean the width of the lattice pattern unit itself. In addition, in the present invention, the pitch of the lattice pattern unit refers to the interval at which the lattice pattern unit is repeated. As shown in Fig. 2A, a pitch of one lattice pattern unit and another lattice pattern unit adjacent thereto And the length d1 between points. One point of one grid pattern unit and one point of another grid pattern unit may refer to positions corresponding to each other among the grid pattern units.

According to an embodiment of the present invention, the thickness increasing rate of the amorphous metal layer may be 0.5% / mm to 15% / mm from one side to the other side of the lattice pattern portion. Specifically, the thickness increasing rate of the amorphous metal layer is 1% / mm to 13% / mm, 2% / mm to 10% / mm, 3% / mm to 7% To 0.5% / mm to 6.5% / mm, or from 7% / mm to 9.5% / mm. The durability of the imprinting mold provided on one side of the lattice pattern portion including the amorphous metal layer can be effectively improved by adjusting the rate of increase of the thickness of the amorphous metal layer in the above-described range from one side to the other side of the lattice pattern portion .

According to an embodiment of the present invention, the shapes of the grid pattern units included in the grid pattern unit may be the same. Specifically, the plurality of grid pattern units may have the same height, width, and period. If a plurality of grid pattern units included in the grid pattern unit are identical to each other, a mold provided on one surface of the grid pattern unit including the grid pattern unit may be more easily manufactured. However, depending on the application in which the imprinting mold is used, the shapes of the grid pattern units included in the grid pattern unit may be different from each other.

According to an embodiment of the present invention, the amorphous metal layer may include at least one amorphous metal. In addition, the amorphous metal layer may include a base metal in addition to the amorphous metal. For example, the base metal may include at least one of carbon, phosphorus, boron, tin, and silicon, but the type of the base metal is not limited.

According to an embodiment of the present invention, the amorphous metal layer may be an amorphous alloy layer. The amorphous metal layer may be an amorphous alloy layer containing at least one of magnesium, copper, zirconium, iron and yttrium, cobalt, lanthanum, aluminum, nickel, zirconium, titanium, beryllium and gallium. In addition, the amorphous metal layer may include the base metal. For example, the amorphous metal layer may be a La-Al-Cu alloy, an La-Al-Ni alloy, a Mg-Al-Cu alloy, a Mg-Al-Ni alloy, a Zr- Zr-Ti-Al-Cu alloy, Zr-Ti-Al-Ni alloy, Zr-Ti-Cu-Be alloy, Zr- Based alloy, Fe-Al-C alloy, Fe-Al-B alloy, Fe-Al-Si alloy, Fe-Ga-P alloy, Fe-Ga- Fe-Co-Nb-B alloy, Fe-Co-Zr-B alloy, Fe-Co-Hf-B alloy, Fe- Ni-Zr-B alloy, Fe-Ni-Hf-B alloy, Fe-Ni-Nb-B alloy and Ti-Ni-Cu-Sn alloy.

According to an embodiment of the present invention, the durability of the imprinting mold can be improved by including the amorphous metal layer containing at least one amorphous metal on at least one side of the lattice pattern unit.

2A shows the period d1 of the lattice pattern unit 200. In Fig. The lattice pattern unit 200 may have a period d1 of 100 nm or more and 600 nm or less and a height h of the lattice pattern unit 200 may be more than 0 nm and less than 600 nm. Specifically, the lattice pattern unit may have a lattice pattern of 125 nm or more and 450 nm or less, 250 nm or more and 350 nm or less, 200 nm or more and 400 nm or less, 150 nm or more and 300 nm or less, 350 nm or more and 400 nm or less, Lt; / RTI > The height of the lattice pattern unit may be 30 nm or more and 500 nm or less, 100 nm or more and 400 nm or less, 150 nm or more and 300 nm or less, 200 nm or more and 250 nm or less, 450 nm or more and 550 nm or less, . The width (d2) of the grid pattern unit 200 may be 10 nm or more and 600 nm or less. Specifically, the width of the lattice pattern unit is from 50 nm to 500 nm, from 100 nm to 400 nm, from 200 nm to 300 nm, from 25 nm to 150 nm, from 250 nm to 350 nm, or from 400 nm to 550 nm nm or less. However, the period, height, and width of the lattice pattern unit are not limited to the above description.

2A and 2B, the thickness of the amorphous metal layer 300 included in at least one side of the grid pattern unit 200 gradually increases from one side (A) to the other side (B) of the grid pattern unit . That is, the width of the grid pattern unit having the amorphous metal layer may be gradually increased. As the width of the lattice pattern unit gradually increases from one side of the lattice pattern unit to the other side when the period of the lattice pattern unit is constant, the duty of the lattice pattern unit gradually increases from one side to the other side of the lattice pattern unit Can be increased.

According to an embodiment of the present invention, the duty of the lattice pattern portion may be 0.1 or more and 1.0 or less. Specifically, the duty of the lattice pattern portion may be 0.2 or more and 0.8 or less, 0.4 or more and 0.6 or less, 0.1 or more and 0.3 or less, 0.3 or more and 0.7 or less, or 0.8 or more and 1.0 or less. The durability of the mold for imprinting including the lattice pattern portion having the above-described range of duty can be excellent.

According to an embodiment of the present invention, the thickness of the imprinting mold may be 25 μm or more and 500 μm or less. Specifically, the thickness of the imprinting mold is not less than 30 μm and not more than 450 μm, not less than 50 μm and not more than 300 μm, not less than 70 μm and not more than 230 μm, not less than 90 μm and not more than 210 μm, not less than 110 μm and not more than 200 μm, Mu m or less, 60 mu m or more and 100 mu m or less, 120 mu m or more and 150 mu m or less, 170 mu m or more and 200 mu m or less, 200 mu m or more and 240 mu m or less, 300 mu m or more and 400 mu m or less or 420 mu m or more and 480 mu m or less. However, the thickness of the imprinting mold is not limited to the above-mentioned range.

According to one embodiment of the present invention, the modulus of the imprinting mold may be 2.5 GPa to 30 GPa at 25 ° C. Specifically, the modulus of the imprinting mold, which is included on one side of the lattice pattern portion including the lattice pattern unit including the amorphous metal layer on at least one side, is 25 GPa or more, 25 GPa or less, 25 GPa or less, Below GPa, 7 GPa to 15 GPa, 4 GPa to 10 GPa, 12 GPa to 18 GPa, or 20 GPa to 28 GPa or less. The modulus of the imprinting mold can be measured using an apparatus and a method for measuring the modulus of a mold in the art. For example, both ends of a sample of an imprint mold prepared according to JIS-K6251-1 standard are fixed using a dynamic mechanical analyzer (DMA 800, TA Instruments), and then the sample is immersed in a direction perpendicular to the thickness direction of the sample The modulus of the imprinting mold can be measured by measuring the stress per unit area according to the tensile strength by applying a force and calculating the ratio of the stress to the measured tensile strength. The modulus of the imprint mold may be controlled by controlling the type of the substrate included in the imprint mold and the type of the metal contained in the amorphous metal layer.

According to an embodiment of the present invention, the imprinting mold having a modulus in the above-mentioned range is excellent in durability, so that it is possible to effectively prevent imprinting efficiency from being degraded even when a plurality of imprinting operations are performed. When the modulus of the imprinting mold is low, the imprinting process is repeatedly performed, so that the durability of the imprinting mold is rapidly lowered, and the imprinting mold is damaged or the imprinting efficiency is reduced have. On the other hand, the imprinting mold having the modulus in the above-described range has an advantage that the imprinting process can be performed a greater number of times than the imprinting mold having the amorphous metal layer. In addition, the pattern corresponding to the lattice pattern portion included in one surface of the imprinting mold can be imprinted more precisely.

According to an embodiment of the present invention, the tensile strength of the imprinting mold may be 100 MPa or more and 500 MPa or less at 25 ° C. Specifically, the tensile strength of the imprinting mold, which is included on one side of the grid pattern unit including the grid pattern unit including the amorphous metal layer on at least one surface thereof, is 150 MPa or more and 400 MPa or less, 200 MPa or more 300 MPa or less, 120 MPa or more and 200 MPa or less, 220 MPa or more and 350 MPa or less, or 400 MPa or more and 480 MPa or less. The tensile strength of the imprinting mold can be measured using an apparatus and a method for measuring the tensile strength of a mold in the art. For example, a tensile load is applied to a mold for imprinting using a dynamic mechanical analyzer (DMA 800, TA Instruments), and the maximum stress until the imprinting mold is broken can be measured. The tensile strength of the imprint mold may be controlled by controlling the type of the substrate included in the imprint mold and the type of metal contained in the amorphous metal layer.

According to an embodiment of the present invention, the imprinting mold having the tensile strength in the above-mentioned range is excellent in durability, and thus it is possible to effectively prevent imprinting efficiency from being degraded even when a plurality of imprinting operations are performed. In addition, the pattern corresponding to the lattice pattern portion included in one surface of the imprinting mold can be imprinted more precisely.

According to an embodiment of the present invention, the toughness of the imprinting mold may be 100 MPa or more and 500 MPa or less at 25 ° C. Specifically, the toughness of the imprinting mold included on one side of the grid pattern unit including the grid pattern unit including the amorphous metal layer on at least one surface thereof is not less than 150 MPa and not more than 450 MPa, not less than 200 MPa and not more than 350 MPa MPa or less, 100 MPa or more and 180 MPa or less, 200 MPa or more and 350 MPa or less, or 400 MPa or more and 480 MPa or less. The imprinting mold having a tensile strength in the above-mentioned range can be excellent in durability. The imprinting of the imprinting mold can be measured using an apparatus and a method for measuring the tensile of a mold in the art. For example, both ends of a sample of an imprint mold prepared according to JIS-K6251-1 standard are fixed using a dynamic mechanical analyzer (DMA 800, TA Instruments), and then the sample is immersed in a direction perpendicular to the thickness direction of the sample The stress per unit area according to the tensile strength is measured by applying a force and the integrated value of the function derived by the measured tensile ratio and stress is calculated to obtain the stress of the imprinting mold . The toughness of the imprint mold may be controlled by controlling the type of the substrate included in the imprint mold and the type of metal contained in the amorphous metal layer.

According to an embodiment of the present invention, the grid pattern unit may include an inclined pattern unit. Specifically, the grid pattern units included in the grid pattern unit may be inclined based on one surface of the mold.

According to an embodiment of the present invention, the grid pattern unit may include a grid pattern unit whose height gradually increases from one side to the other side. Specifically, the height of the grid pattern unit included in the grid pattern unit may be gradually increased along the other direction from one side of the grid pattern unit.

FIGS. 3A to 3C are schematic views of a grid pattern unit having an inclined pattern including a grid pattern unit provided with an amorphous metal layer according to an embodiment of the present invention. 3A is a cross-sectional view of a lattice pattern unit 200 including a grating pattern unit 300 having an inclined angle of &thetas; on one side of the mold 100 for imprinting and having an amorphous metal layer 300 on one side. Fig. 3B shows a lattice pattern unit 200 including a lattice pattern unit 200 having an inclined surface on one side of the mold 100 and including an amorphous metal layer 300 on one side and an upper surface FIG. FIG. 3C is a view showing a lattice pattern unit including a lattice pattern unit 200 whose height gradually increases from one side (A) to the other side (B) of the lattice pattern unit.

The inclination angle? Formed by the lattice pattern units included in the grid pattern portion of the inclined pattern with respect to one surface of the imprinting mold may be 50 ° or more and less than 90 °. Specifically, the lattice pattern unit may have an inclination angle of 55 ° to 80 °, 60 ° to 75 °, 65 ° to 85 °, 50 ° to 65 °, or 70 ° to 80 ° inclination.

3A to 3C, the thickness of the amorphous metal layer 300 included in at least one side of the grid pattern unit 200 along the other side (B) from one side (A) to the other side (B) , The width of the grid pattern unit having the amorphous metal layer can be gradually increased. Accordingly, the duty of the grid pattern portion of the warp pattern can be gradually increased along the other direction from one side.

According to an embodiment of the present invention, the imprinting mold may be a mold for manufacturing a diffraction light guide plate. Specifically, by using the imprinting mold, a diffraction light guide plate using diffraction phenomenon based on the wave property of light can be manufactured. The diffraction light guide plate manufactured using the imprinting mold can be used in a display unit implementing Augmented Reality (AR), Mixed Reality (MR), or Virtual Reality (VR). The grating pattern portion included in one surface of the imprinting mold and the diffraction grating pattern included in the diffraction light guide plate correspond to each other. That is, a diffraction grating pattern including a diffraction grating pattern in which the duty is gradually increased along the other direction from one side to the other using the imprinting mold including the grating pattern portion having the grating pattern portion gradually increasing in the direction from the one side to the other side, A light guide plate can be manufactured.

In the case of the lattice pattern provided in the imprinting mold for producing the conventional diffraction light guide plate, the duty of the lattice pattern was the same. The duty of the diffraction grating pattern provided in the conventional diffraction grating pattern manufactured using the imprinting mold having the same duty of the grating pattern was the same and the light diffraction efficiency in the entire region of the diffraction light guide plate was the same. When the light diffraction efficiency is the same in the entire region of the diffractive light guide plate, the amount of light diffracted by the diffractive light guide plate is reduced in the process of reflection or total reflection of light in the diffused light guide plate. Specifically, when light is incident on one side of the diffracting light guide plate and the light is guided to the other side of the diffracting light guide plate, the amount of light diffracted from one side to the other side of the diffracting light guide plate is reduced. When the amount of light diffracted by the diffracting light guide plate is different from each other, light having a high light intensity is emitted in the portion where the diffracted light amount is large, while light having low light intensity is emitted in the portion where the diffracted light amount is small, A problem that the light intensity of the light is not constant may occur.

Meanwhile, according to one embodiment of the present invention, a diffraction grating pattern including a diffraction grating pattern whose duty gradually increases from one side to the other side by using the imprinting mold can be manufactured. As the duty gradually increases from one side of the diffraction grating pattern included in the diffraction grating pattern to the other side, the light diffraction efficiency of the diffraction grating pattern along the other side of the diffraction grating pattern can be gradually increased. As the light diffraction efficiency of the diffracting light guide plate is gradually increased, the amount of light diffracted in the diffraction grating pattern of the diffracting light guide plate can be controlled in the same manner. Specifically, when light is incident on one side of the diffraction grating pattern and the light is guided to the other side of the diffraction grating pattern, the light diffraction efficiency gradually increases from one side to the other side of the diffraction grating pattern, The amount of light diffracted in the diffraction grating pattern can be controlled in the same manner.

Therefore, according to one embodiment of the present invention, it is possible to provide an imprinting mold capable of manufacturing a diffraction light guide plate having a constant amount of light diffracted in the diffraction grating pattern.

According to an embodiment of the present invention, the imprinting mold may be a replica mold. Specifically, the imprinting mold may be a replica mold of a master mold. The master mold may include a grid pattern, and the grid pattern of the master mold may have a shape corresponding to a grid pattern portion of the imprinting mold. For example, when the master mold includes a grating pattern having a concave shape, the one surface of the imprinting mold manufactured using the master mold may include a grating pattern portion having a relief shape corresponding to the concave grating pattern .

According to an embodiment of the present invention, it is possible to provide a replica mold capable of replacing a master mold which is time consuming and costly to manufacture. Therefore, by using the imprinting mold, which is a replica mold of the master mold, it is possible to reduce the time and cost for manufacturing the master mold, thereby effectively reducing the cost of the imprinting process. Further, since the lattice pattern portion of the impurity mold includes an amorphous metal layer, it is possible to effectively overcome the problem of low durability which is a disadvantage of the replica mold.

According to one embodiment of the present invention, the imprinting mold is a polyvinyl chloride resin, a polystyrene resin, an acrylonitrile butadiene styrene resin, a polyethylene phthalate resin, a polyolefin resin. A urethane acrylate resin, an epoxy acrylate resin, a polyamide resin, a polyimide resin, a silicone resin, and a polyester resin. In addition, the imprinting mold may include an acrylic resin. However, the type of resin included in the imprinting mold is not limited.

According to an embodiment of the present invention, a grid pattern portion can be easily formed on one surface of the imprinting mold including the resin. The imprinting mold including the above-mentioned resin is a softer mold, and a master mold including a lattice pattern can be used to easily clone a lattice pattern portion having a shape corresponding to the lattice pattern on one surface of the imprinting mold have. In addition, since the lattice pattern portion of the imprinting mold includes an amorphous metal layer, the durability of the imprinting mold including the above-mentioned resin can be effectively improved.

According to an embodiment of the present invention, a plurality of grid pattern portions may be formed on one surface of the imprinting mold. For example, the first region, the second region, and the third region may be formed on one surface of the imprinting mold, the first region may include a first grid pattern portion, and the second region may include a second grid pattern portion , And the third region may include a third grid pattern portion. The first lattice pattern unit may include a plurality of first lattice pattern units, the second lattice pattern unit may include a plurality of second lattice pattern units, and the third lattice pattern unit may include a plurality of third lattice pattern units .

FIG. 4 is a schematic view of an imprinting mold including a plurality of grid pattern portions on one side. 4 illustrates a first region 410 including a first grid pattern portion, a second region 420 including a second grid pattern portion, and a third region 430 including a third grid pattern portion. Fig. 3 is a view showing the mold 100 for imprinting. 4, the first region 410 may include a first lattice pattern portion including a plurality of first lattice pattern units 210, and the second region 420 may include a plurality of second lattice pattern units 210. For example, And the third region 430 may include a third lattice pattern portion including a plurality of third lattice pattern units 230. The third lattice pattern portion 230 may include a second lattice pattern portion including a plurality of second lattice pattern units 220,

According to an embodiment of the present invention, the first lattice pattern units included in the first lattice pattern unit, the second lattice pattern unit included in the second lattice pattern unit, and the second lattice pattern unit included in the third lattice pattern unit The third grid pattern units may have different shapes. For example, the first grid-pattern unit and the second grid-pattern unit may have different slopes, inclination angles, heights, widths, and the like. 4, the second amorphous metal layer 320 included in the second grid pattern unit 220 and the third amorphous metal layer 330 included in the third grid pattern unit 230 have the same thickness Can be different. Referring to FIG. 4, a first lattice pattern unit including a first lattice pattern unit 210 having no amorphous metal layer may be formed on one surface of the imprinting mold. However, an amorphous metal layer may be included on at least one side of the first lattice pattern unit included in the first lattice pattern unit.

Another embodiment of the present invention provides a method of making a mold for imprinting.

According to an embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: preparing a mold including a grid pattern unit including a grid pattern unit on one side; And forming an amorphous metal layer on at least one surface of the lattice pattern unit by obliquely depositing at least one amorphous metal on the lattice pattern unit, And the duty is gradually increased in the direction toward the other side of the mold.

The imprinting mold manufactured in the method for manufacturing an imprinting mold according to an embodiment of the present invention may be substantially the same as the imprinting mold according to an embodiment of the present invention. The lattice pattern unit, the lattice pattern unit, and the amorphous metal layer in the method for manufacturing an imprinting mold according to an embodiment of the present invention can be applied to a lattice pattern unit, a lattice pattern unit and a lattice pattern unit of an imprinting mold according to an embodiment of the present invention. And may be substantially the same as the amorphous metal layer.

According to one embodiment of the present invention, the step of preparing the mold may form the lattice pattern portion on one side of the mold. Specifically, a plurality of grid pattern units may be formed on one surface of the mold, and a mold provided on one surface of the grid pattern unit including the grid pattern unit may be prepared.

According to an embodiment of the present invention, the mold including the lattice pattern portion may be formed using an imprinting process using the master mold and the curable resin composition in which the lattice pattern portion is engraved. The master mold may have an engraved grid pattern corresponding to the grid pattern portion of the mold. In the imprinting process using the master mold and the curable resin composition, the curable resin composition may be first applied on a substrate, and the master pattern may be imprinted on the surface of the curable resin composition using the master mold. Thereafter, the curable resin composition is cured to prepare a mold including a lattice pattern portion on one side. That is, the mold may be a replica mold of the master mold. Therefore, according to one embodiment of the present invention, it is possible to easily manufacture a replica mold that can replace a master mold which is time-consuming and expensive to manufacture.

According to one embodiment of the present invention, the curable resin composition may be a photocurable resin composition or a thermosetting resin composition. That is, the curable resin composition can be cured by photo-curing or thermosetting. Specifically, the curable resin composition is a polyvinyl chloride resin, a polystyrene resin, an acrylonitrile butadiene styrene resin, a polyethylene phthalate resin, a polyolefin resin. An epoxy acrylate resin, a polyamide resin, a polyimide resin, a silicone resin and a polyester resin, and the curable resin composition containing the above-mentioned resin may be photo-cured or heat- Can be formed. In addition, the curable resin composition may include an acrylic resin.

According to an embodiment of the present invention, a grid pattern portion included in one surface of the mold may be formed using a lithography process or a laser etching process. Specifically, a lattice pattern unit is formed on the surface of a cured product formed on one surface of a substrate by applying a curable resin composition on one surface of the substrate and curing the lattice pattern unit by using a lithography process or a laser etching process. Can be produced.

According to an embodiment of the present invention, the step of forming the amorphous metal layer may include at least one step of depositing at least one amorphous metal on the lattice pattern portion to form an amorphous metal layer on at least one surface of the lattice pattern unit. Specifically, the amorphous metal layer may be formed by obliquely depositing an amorphous alloy on at least one surface of the grid pattern unit included in the grid pattern unit.

According to an embodiment of the present invention, the tilted deposition may be performed by a sputtering method, an E-beam evaporation method, a thermal evaporation method, a plasma enhanced chemical vapor deposition (PECVD) method, Or low pressure chemical vapor deposition (LPCVD). However, the method of performing the oblique deposition is not limited. Hereinafter, for the sake of convenience of explanation, the description will be made mainly about performing the oblique deposition using the sputtering method.

According to an embodiment of the present invention, at least one amorphous metal may be obliquely deposited on the grid pattern portion. Specifically, in the case of performing the oblique deposition using the sputtering method, a plurality of single metal deposition targets may be formed on the lattice pattern portion using the alloy deposition target containing the composition of the target amorphous metal layer as the deposition target, or by using the sputtering method, As shown in FIG.

The amorphous metal used in the method of manufacturing the imprinting mold according to an embodiment of the present invention may be substantially the same as the amorphous metal used in the imprinting mold according to one embodiment of the present invention.

According to an embodiment of the present invention, an amorphous metal may be deposited on at least one surface of the grid pattern unit. Specifically, an amorphous metal may be deposited on one side of the grid pattern unit to form an amorphous metal layer, or an amorphous metal may be deposited on one side and an upper surface of the grid pattern unit to form an amorphous metal layer. In order to form an amorphous metal layer on only one side of the lattice pattern unit, a release film or the like may be attached only to the upper surface of the lattice pattern unit to protect the upper surface of the lattice pattern unit. For example, a mold release film is attached and protected on the upper surface of each of a plurality of grid pattern units provided on one surface of a mold, and then a deposition target containing at least one amorphous metal is sputtered, An amorphous metal layer may be formed on the release film. Thereafter, the release film is peeled off from the upper surface of the lattice pattern unit to form an imprinting mold including an amorphous metal layer on one side of the lattice pattern unit.

According to an embodiment of the present invention, at least one amorphous metal may be obliquely deposited on the grid pattern portion to easily produce an imprinting mold in which the duty gradually increases from one side to the other side of the grid pattern portion .

FIG. 5 is a schematic view illustrating depositing an amorphous metal on an imprinting mold including a lattice pattern portion according to an embodiment of the present invention. Referring to FIG. 5 is a sectional view of a mold 100 for imprinting according to an embodiment of the present invention. Referring to FIG. 5, an imprinting target 500 including at least one amorphous metal is subjected to oblique deposition Fig.

5, one surface of the deposition target 500 including at least one amorphous metal and the one surface of the mold 100 including the lattice pattern portion are inclined with respect to each other, thereby forming a lattice pattern on one surface of the mold including the lattice pattern portion Tilt deposition may be performed. By performing the oblique deposition on one surface of the mold including the grid pattern portion, an imprinting mold including a grid pattern portion whose duty increases from one side to the other side can be manufactured. 5, the amorphous metal ions liberated from the deposition target by sputtering the deposition target 500 in a state where one surface of the deposition target 500 and one surface of the mold 100 are inclined with respect to each other, And reaches the grid pattern unit contained in the grid pattern unit. At this time, the density of the amorphous metal ions reaching the grid pattern unit decreases as the distance between one surface of the mold and one surface of the deposition target becomes longer. Referring to FIG. 5, the distance between the mold 100 and the deposition target 500 gradually approaches from one side (A) to the other side (B) of the lattice pattern portion. The density of the amorphous metal ions reaching the grid pattern units 200 included in one surface of the mold 100 is gradually increased from one side A to the other side B of the grid pattern unit. As a result, the thickness of the amorphous metal layer formed by deposition on the grid pattern unit in the direction from one side (A) to the other side (B) of the lattice pattern portion gradually increases and the duty from one side (A) An increased grid pattern portion can be formed on one surface of the mold.

Therefore, according to an embodiment of the present invention, it is possible to easily manufacture an imprinting mold including a lattice pattern part having a gradually increasing duty from one side to the other side on one side.

According to an embodiment of the present invention, the step of forming the amorphous metal layer may be performed by performing inclined deposition with inclining the mold, or performing inclined deposition with inclining the deposition target. 5, the position of the deposition target 500 may be fixed and the position of the mold 100 may be adjusted to obliquely deposit the mold 100 by inclining the mold 100 with respect to one surface of the deposition target 500. In addition, the position of the mold may be fixed, and the position of the deposition target may be adjusted to obliquely deposit the deposition target by inclining the deposition target with respect to one surface of the mold.

According to an embodiment of the present invention, the oblique deposition may be performed at an angle of not less than 1 DEG and not more than 75 DEG with respect to the grid pattern portion on one side of the mold. 5, the inclined deposition can be performed by setting the angle 1 between the one surface of the deposition target 500 and one surface of the mold 100 to be equal to or greater than 1 and equal to or less than 75 degrees. Specifically, the oblique deposition may be performed at an angle of not less than 3 degrees and not more than 65 degrees, not less than 5 degrees nor more than 50 degrees, not less than 10 degrees nor more than 40 degrees, not less than 25 degrees nor more than 30 degrees, not less than 1 degrees 15 degrees or less, 20 degrees or more and 35 degrees or less, 40 degrees or more and 45 degrees or less, or 50 degrees or more and 70 degrees or less.

According to an embodiment of the present invention, the thickness of the amorphous metal layer included in the grid pattern unit gradually increases from one side to the other side of the lattice pattern portion by adjusting the angle at which the oblique deposition is performed to the above- A mold for printing can be manufactured. That is, it is possible to easily manufacture the imprinting mold including the lattice pattern portion whose duty gradually increases from one side to the other side. When the angle at which the oblique deposition is performed is out of the above range, it may not be easy to gradually change the thickness of the amorphous metal layer included in the lattice pattern unit from one side to the other side of the lattice pattern portion. In addition, it may not be easy to form an amorphous metal layer on a desired portion of the lattice pattern unit.

Another embodiment of the present invention provides a diffracting light guide plate.

An embodiment of the present invention provides a diffracting light guide plate including a diffraction grating pattern manufactured using the imprinting mold.

According to an embodiment of the present invention, the diffraction grating pattern included in the diffraction light guide plate manufactured using the imprinting mold may have a duty gradually increased from one side to the other side. Therefore, the amount of light diffracted in the diffraction grating pattern region of the diffracting light guide plate can be constant.

According to an embodiment of the present invention, the diffracting light guide plate includes a display unit capable of realizing a provided image in Augmented Reality (AR), Mixed Reality (MR), or Virtual Reality (VR) Lt; / RTI > The display unit including the diffracting light guide plate having a constant amount of light diffracted in the diffraction grating pattern region can realize the provided image as augmented reality, mixed reality, or virtual reality with superior quality.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail with reference to examples. However, the embodiments according to the present invention can be modified into various other forms, and the scope of the present invention is not construed as being limited to the embodiments described below. Embodiments of the present disclosure are provided to enable those skilled in the art to more fully understand the present invention.

Example  One

A photocurable resin composition comprising a photocurable resin prepared from a composition comprising propylene glycol monomethyl ether acetate (PGMEA) as a solvent, dipentaerythritol hexaacrylate (DPHA) as a monomer, and Irgacure 184 as a photopolymerization initiator was prepared . Further, a polyimide (PI) film having a thickness of 100 mu m was prepared as a substrate.

The photocurable resin composition prepared on one side of the substrate was coated and dried at a temperature of 80 캜 for about 3 minutes. Thereafter, imprinting was performed on the surface of the photocurable resin composition using a master mold in which a pattern of a predetermined lattice pattern portion was engraved. In the imprinting process, the photocurable resin composition was cured by irradiating ultraviolet rays having an intensity of 100 mW / cm ² or more at a temperature of about 40 캜 for 60 seconds or more, thereby preparing a mold including a lattice pattern with one side. Thereafter, the produced mold was peeled from one side of the substrate to prepare a mold having a length of 50 mm and a width of 50 mm.

Magnesium, copper and yttrium were prepared. The alloy deposition target had a magnesium content of 50 at%, a copper content of 35 at%, and a yttrium content of 15 at%.

As shown in FIG. 5, an angle (?) Between the alloy deposition target and one surface of the mold is set to about 1.5 degrees, and an output of the DC sputtering apparatus is set to 100 W, and the alloy deposition target is sputtered to perform oblique deposition Respectively. As a result, an imprinting mold having a lattice pattern unit including a lattice pattern unit including an amorphous metal layer on one side and an upper surface was manufactured as shown in FIG. 3B.

Example  2

The mold for imprinting was manufactured in the same manner as in Example 1, except that the angle (?) Between the alloy deposition target and one surface of the mold was set to about 11 °, and the output of the DC sputtering apparatus was set to 200 W Respectively.

Example  3

A mold for imprinting was produced in the same manner as in Example 1, except that the output of the DC sputtering apparatus was set to 300 W.

Amorphous Metal layer  Thickness measurement

The thicknesses of the amorphous metal layers provided on the grid pattern units included in the imprinting molds prepared in Example 1 and Example 2 were measured, and the results are shown in FIG.

6 is a graph showing the results of measuring the thicknesses of the amorphous metal layers included in the imprinting molds prepared in Examples 1 and 2 of the present invention. 6 is a graph showing a result of measuring the thickness of the amorphous metal layer according to the position in the length (L1) direction of the mold 100 shown in FIG. In Fig. 6, the position 0 mm on the X axis represents the position of the mold one side (A) in Fig. 5, and the position 50 mm represents the position on the other side of the mold B of Fig.

Referring to FIG. 6, it was confirmed that the thicknesses of the amorphous metal layers in the imprinting molds prepared in Examples 1 and 2 of the present invention increased linearly from one side of the mold to the other. That is, it was confirmed that the imprinting mold manufactured in Example 1 and Example 2 of the present invention includes a grid pattern portion whose duty gradually increases from one side to the other side.

In the imprinting mold manufactured in Example 1, it was confirmed that the rate of increase in the thickness of the amorphous metal layer was about 0.55% / mm from one side to the other side of the lattice pattern portion. In the imprinting mold prepared in Example 2, it was confirmed that the amorphous metal layer had a thickness increase rate of about 3.2% / mm from one side to the other side of the lattice pattern portion.

Amorphous Metal layer XRD  analysis

The amorphous metal layers included in the imprint molds prepared in Examples 1 to 3 of the present invention were analyzed by X-ray diffraction spectroscopy (XRD) using an X-ray diffractometer (D4 endeavor, Bruker). The contents of magnesium, copper and yttrium contained in the amorphous metal layer included in the imprinting molds prepared in Examples 1 to 3 of the present invention through XRD analysis are shown in Table 1 below.

Mg
(at%) Cu
(at%) Y
(at%) Example 1 72 20 8 Example 2 77 21 2 Example 3 76 22 2

FIG. 7 is a view showing XRD (X-ray diffraction spectroscopy) analysis results of the amorphous metal layer included in the imprinting mold manufactured in Examples 1 to 3 of the present invention.

8 is a phase diagram showing a composition range of the amorphous metal layer included in the imprinting mold manufactured in Examples 1 to 3 of the present invention. Specifically, FIG. 8 shows a three-element diagram of magnesium, copper, and yttrium, showing amorphous and crystalline regions according to the contents of magnesium, copper, and yttrium. More specifically, FIG. 8 is a graph showing that an amorphous region includes regions corresponding to the contents of magnesium, copper, and yttrium in the amorphous metal layer included in the imprinting mold manufactured in Examples 1 to 3 of the present invention to be.

Referring to Table 1, FIG. 7, and FIG. 8, it was confirmed that the amorphous metal layer included in the imprinting mold manufactured in Examples 1 to 3 of the present invention had no crystallinity.

For imprinting Mold  Property measurement

A mold for imprinting and a PI substrate prepared according to Example 1 of the present invention were prepared. Thereafter, the prepared mold for imprinting and the PI substrate were cut to a width of 10 mm and a length of 60 mm to prepare a sample. Both ends of the sample were fixed using a dynamic mechanical analyzer (Zwick / Roell Z010 UTM) And the stress per unit area was measured according to the tensile ratio (Strain). The modulus, tensile strength and tensile strength of the mold for imprinting and the PI substrate prepared according to Example 1 of the present invention, using the measured tensile ratios and stresses, are shown in Table 2 below.

Example 1 PI substrate Modulus
(GPa) 3.0 2.3 The tensile strength
(MPa) 220 170 tenacity
(MPa) 175 75

Referring to Table 2, it was confirmed that the value of the modulus, tensile strength, and toughness of the mold for imprinting provided with the amorphous metal layer according to Example 1 of the present invention was larger than that of the PI substrate without the amorphous metal layer. Therefore, according to one embodiment of the present invention, it is confirmed that an imprinting mold having improved durability can be manufactured by forming the amorphous metal layer on the lattice pattern portion of the mold.

100: mold
200: grid pattern unit
210: first lattice pattern unit
220: first lattice pattern unit
230: Third grid pattern unit
300: amorphous metal layer
320: second amorphous metal layer
330: third amorphous metal layer
410: first region
420: second region
430: third region
500: deposition target

Claims (11)

And a grid pattern unit including a grid pattern unit on one surface,
Wherein at least one surface of the lattice pattern unit includes an amorphous metal layer,
Wherein the thickness of the amorphous metal layer increases the duty of the grid pattern portion gradually from one side to the other side. The method according to claim 1,
Wherein the lattice pattern portion includes an inclined pattern unit. The method according to claim 1,
Wherein the grid pattern unit includes a grid pattern unit whose height gradually increases from one side to the other side. The method according to claim 1,
Wherein the amorphous metal layer has a thickness increasing rate of 0.5% / mm to 15% / mm from one side to the other side of the lattice pattern portion. The method according to claim 1,
The imprinting mold may be a polyvinyl chloride resin, a polystyrene resin, an acrylonitrile butadiene styrene resin, a polyethylene phthalate resin, a polyolefin resin. An epoxy acrylate resin, a polyamide resin, a polyimide resin, a silicone resin, and a polyester resin. The method according to claim 1,
Wherein the imprinting mold is a replica mold. Preparing a mold including a grid pattern unit including a grid pattern unit on one surface thereof; And
And forming an amorphous metal layer on at least one surface of the grid pattern unit by obliquely depositing at least one amorphous metal on the grid pattern unit,
Wherein a density of the amorphous metal layer increases gradually from one side to the other side of the grid pattern portion. The method of claim 7,
Wherein the step of forming the amorphous metal layer comprises performing an inclined deposition by inclining the mold, or performing an inclined deposition by inclining the deposition target. The method of claim 7,
Wherein the oblique deposition is performed at an angle of not less than 1 DEG and not more than 75 DEG with respect to the grid pattern portion on one surface of the mold. The method of claim 7,
Wherein the oblique deposition is performed by one of a sputtering method, an electron beam evaporation method, a thermal evaporation method, a plasma chemical vapor deposition method, and a low pressure chemical vapor deposition method. The method of claim 7,
Wherein the mold including the lattice pattern portion is formed using an imprinting process using the master mold and the curable resin composition in which the lattice pattern portion is engraved.

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