KR20190046669A - Transfer apparatus and transfer method - Google Patents

Abstract

The present invention relates to a transfer device and a transfer method. The transfer device comprises: a coating portion for coating an uncured resin on a substrate; a substrate installing portion in which a substrate is positioned and integrally installed; a mold installation portion for installing a mold on a sheet; a transfer roller; and a plasma unit for transferring a transfer pattern formed on the mold to the resin coated on the substrate and then cleaning the mold by irradiating the mold with the plasma stripped from the resin of the substrate, wherein the mold, which is stripped from the resin of the substrate, after being cleaned by irradiating the plasma with the plasma unit, is again used for transferring a transfer pattern.

Description

TRANSFER APPARATUS AND TRANSFER METHOD BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

The present invention relates to a transfer apparatus, and more particularly to a transfer apparatus and a transfer method for transferring a fine transfer pattern formed on a mold to a resin coated on a substrate.

A conventional transfer device for transferring a fine transfer pattern formed on a mold to a resin coated on a substrate is known (see US9,604,402B2). In the conventional transfer device, the mold used for transferring is stretched between the mold fabric and the winding roll.

In the transfer device of the conventional example, in order to reduce the amount of use of the mold, there is a case where transfer is performed to a plurality of substrates by repeatedly using a mold used for transferring (a mold stretched between the mold fabric and the winding roll) have.

In the conventional transfer device, since the mold is repeatedly used a plurality of times, deterioration of mold releasability (increase in the difficulty of peeling the mold from the resin after the resin is cured by pressing the transfer pattern onto the resin of the substrate) There is a possibility that the shape of the transferred pattern on the substrate may be deteriorated due to an increase in adhesion of fine particles or the like to the transfer pattern.

The present application has been made in view of the above problems, and it is an object of the present invention to provide a transfer device for transferring a fine transfer pattern formed on a mold to a resin coated on a substrate, even when the mold is used repeatedly a plurality of times, And to provide a device capable of preventing deterioration of the shape of a pattern transferred to a substrate.

A transfer device according to a first aspect of the present application is a transfer device for transferring a fine transfer pattern formed on a mold to a resin coated on a substrate and includes a coating portion for coating an uncured resin on a substrate, A mold mounting part for mounting a mold on the sheet, a transfer roller for fine transfer, which is formed on the mold in the resin coated on the substrate, and a transfer roller And a plasma unit for cleaning the mold by irradiating a plasma to the mold which has been peeled from the resin of the substrate after transferring the transfer pattern formed on the mold to the resin. The mold that has been peeled off from the resin of the substrate is used for transferring the transfer pattern again after cleaning by irradiating the plasma with the plasma unit.

The plasma unit may be configured to change the irradiation amount of the plasma to the mold according to the number of times the mold is transferred.

The transfer device further comprises a fabric mold in which the mold is wound and a winding roll for winding a mold fed out from the fabric mold. A mold stretched between the fabric mold and the winding roll is wound around the transfer roller, The pressing of the mold to the resin and the peeling of the mold from the resin are carried out by the roll transfer in which the transfer roller is moved while the mold is pressed against the resin by using the roller and after the peeling of the mold from the resin is completed, The plasma unit may be configured to irradiate the plasma to the peeled mold.

If the cleaning of the mold by the plasma unit is insufficient, the winding roll may take up the portion of the mold which is peeled off from the resin, and a new portion of the mold may be drawn out from the raw mold.

The transfer apparatus according to the first aspect further includes a mold detection unit for detecting contamination of the mold peeled from the resin and determines whether or not the cleaning of the mold by the plasma unit is insufficient in accordance with the detection result in the mold detection unit You can.

A transfer device according to a second aspect of the present application is a transfer device for transferring a fine transfer pattern formed on a mold to a resin coated on a substrate and includes a coating portion for coating an uncured resin on a substrate, A transferring roller for transferring a fine transfer pattern formed on the mold to the resin coated on the substrate, and a transfer roller for transferring the fine transfer pattern formed on the mold to the substrate, And a plasma unit for irradiating the plasma. The plasma unit has a head and a driving unit. The coating portion and the plasma unit are simultaneously moved with respect to the substrate, and the uncured resin is coated on the substrate in the coating portion while the plasma is irradiated on the substrate in the plasma unit.

The plasma unit is configured to irradiate the plasma, which has been peeled off from the resin of the substrate after transfer, with plasma. The driving unit of the plasma unit is supported by the coating unit, and the plasma unit is moved from the plasma unit driven by the driving unit of the plasma unit, And the plasma may be configured to be irradiated to the mold which is peeled from the resin of the substrate.

Plasma may be irradiated from the head of the plasma unit to the mold which has been peeled off from the resin of the substrate after transfer to the substrate.

The head is capable of pivoting with respect to the coated portion so that the posture of the head when irradiating the plasma from the head with the plasma is rotated at a predetermined angle with respect to the posture of the head when irradiating the plasma from the head to the mold .

The transfer method according to the third aspect of the present application is a transfer method for transferring a fine transfer pattern formed on a mold to a resin coated on a substrate and includes a step of coating an uncured resin onto a substrate using a coated portion And a step of irradiating a plasma using a plasma unit on the substrate, wherein the plasma unit has a head and a driving unit, and the coating unit and the plasma unit move simultaneously with respect to the substrate, , And the uncured resin is applied to the substrate in the coating step.

The transfer device according to the fourth aspect of the present application is a transfer device for transferring a fine transfer pattern formed on a mold to a resin coated on a substrate and is a transfer device for transferring an uncured resin which can be cured by electromagnetic waves of a predetermined wavelength, A mold mounting portion for mounting a mold on a sheet, a plasma unit for irradiating a plasma to the substrate, and a transferring portion for transferring the transferring A transfer roller for carrying out the pressing of the mold to the resin and the separation of the mold from the resin by the roll transfer in which the transfer roller is moved while the mold is pressed against the resin and a transfer roller for transferring the mold A resin hardening section for irradiating the resin with electromagnetic waves of a predetermined wavelength in a state in which the pressing is performed, When the transfer roller is moved to, and a control unit to control the resin curing portion to emit an electromagnetic wave of predetermined wavelength into the resin.

The control unit may control the resin hardening unit to irradiate the resin with electromagnetic waves of a predetermined wavelength even when the transfer roller is moving in the direction of peeling the mold from the resin in the roll transfer.

The control unit may control the resin hardening unit to adjust the intensity of the electromagnetic wave having a predetermined wavelength to be irradiated to the resin, in accordance with the amount of movement of the transfer roller in the roll transfer.

The coating portion may include a plurality of ink jet heads arranged alternately, and the substrate may be coated with the uncured resin in a particulate state by being discharged from the plurality of inkjet heads.

The control unit may control the coated portion so that the uncured resin to be coated on the substrate has a shape corresponding to a fine transfer pattern formed on the mold.

The control unit controls the coating unit so as to adjust the amount of the uncured resin so as to control the resin hardening unit so as to adjust the intensity of the electromagnetic wave of a predetermined wavelength in accordance with the amount of the coated resin in accordance with the transfer pattern formed on the mold You can.

According to the embodiment of the present application, even when the mold is repeatedly used a plurality of times in the transfer device for transferring the fine transfer pattern formed on the mold to the resin coated on the substrate, the mold releasability is deteriorated, It is possible to prevent the deterioration of the shape of the transferred pattern.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a view showing a schematic configuration of a transfer device according to an embodiment; FIG.
Fig. 2 is an II arrow in Fig. 1. Fig.
Fig. 3 is an arrow III in Fig. 1. Fig.
Fig. 4 is an IV arrow diagram in Fig. 1. Fig.
5 is an enlarged view of a portion V in Fig.
6 is a diagram showing the operation of the transfer device according to the embodiment.
7 is a diagram showing the operation of the transfer device according to the embodiment.
8 is a diagram showing the operation of the transfer device according to the embodiment.
9 is a diagram showing the operation of the transfer device according to the embodiment.
10 is a diagram showing the operation of the transfer apparatus according to the embodiment.
11 is a diagram showing the operation of the transfer apparatus according to the embodiment.
12 is a diagram showing the operation of the transfer device according to the embodiment.
13 is a view showing the installation of a mold in a transfer device according to the embodiment.
14 is a view showing the setting of a mold in a transfer device according to the embodiment.
Fig. 15 is a view showing the installation of a mold in a transfer device according to the embodiment. Fig.
16 is a view showing the installation of a mold in a transfer device according to the embodiment.
17 is a view showing the setting of a mold in a transfer device according to the embodiment.
18A to 18C are diagrams showing the operation of the transfer roller and the like of the transfer device according to the embodiment.
19 (a) to 19 (d) are diagrams showing transfer to a transfer device according to the embodiment.
Fig. 20 is a view showing the shape of a resin according to a modified example applied in a coated portion of a transfer device according to the embodiment. Fig.
21 (a) and 21 (b) are views showing the case where the transfer roller guide portion is provided in the substrate holding portion in the transfer device according to the embodiment. Fig. 21 (c) Fig. 4 is an enlarged view of the XXIC portion in Fig.
Figs. 22A and 22B are views showing the curing of the resin on the substrate provided on the substrate holding portion of the transfer apparatus according to the embodiment. Fig.
23 is an enlarged view of a portion XXIII in Fig.
FIG. 24A is an example of a transfer pattern formed on a substrate, and FIG. 24B is a cross-sectional view taken along line XXIVB-XXIVB in FIG. 24A.

Hereinafter, a transfer apparatus according to the embodiment will be described with reference to Figs. 1 to 24 (b).

As shown in Figs. 19A to 19D, the transfer apparatus 1 according to the embodiment is provided with a thin film resin 5 coated on the top surface of the substrate 3, for example, , And transferring the fine transfer pattern 9 formed on the mold 7.

Here, as the resin (5), a resin which is cured by an electromagnetic wave of a predetermined wavelength, more specifically, an ultraviolet ray hardening resin can be mentioned. Examples of the substrate 3 include glass, PET resin, and the like.

Further, as shown in Fig. 19 (b), the fine transfer pattern 9 is formed by, for example, repeating fine irregularities. The dimensions of the widths B1 and B2 and the height H1 of the concavities and convexities are equal to or larger than the wavelength of the visible light or equal to the wavelength of the visible light or smaller than the wavelength of the visible light, have. That is, the dimensions of the widths (B1, B2) and the height (H1) of the concavities and convexities are 1 to several times as many as the wavelength of visible light. The aspect ratio (H1 / B1 or H1 / B2) of the unevenness is, for example, about 1 to 2.

For convenience of explanation, it is assumed that a predetermined one horizontal direction is an X-axis direction, another predetermined horizontal direction is a Y-axis direction orthogonal to the X-axis direction, and an X- (Vertical direction) in the Z-axis direction. One side in the X-axis direction is set as the front side and the other side in the X-axis direction is set as the rear side.

Here, the transfer will be described with reference to Figs. 19 (a) to 19 (d).

The transfer is performed by hardening the resin 5 while the mold 7 is pressed against the uncured resin 5 on the substrate 3 and thereafter peeling the mold 7 from the resin 5.

More specifically, the mold 7 is pressed against the substrate 3 (see Fig. 19 (a)) provided on the upper surface of the uncured UV cured resin 5 as a thin film (Fig. 19 (b)).

In the state in which the mold 7 is pressed, the uncured cured ultraviolet curable resin 5 is filled in the transfer pattern 9 of the mold 7. 19 (b), the tip end (lower end) of the transfer pattern 9 and the upper surface of the substrate 3 are slightly spaced from each other, and an uncured ultraviolet curing resin Resin) 5 is contained. It is preferable that the value of the thickness T1 is " 0 ", but this is very difficult.

19 (b), ultraviolet rays are irradiated to the uncured ultraviolet-curable resin 5 through at least one of the substrate 3 and the mold 7 to form the ultraviolet-curable resin 5, .

Subsequently, the mold 7 is peeled off from the state shown in Fig. 19 (b). Thereby, the cured ultraviolet-curable resin 5 remains on the substrate 3 (see Fig. 19 (c)). The shape (pattern) of the transfer pattern 9 is transferred to the cured ultraviolet-curable resin 5.

In the state shown in Fig. 19 (c), the residual film 11 is present on the substrate 3. The residual film 11 is formed by curing the resin 5 having the thickness T1 shown in Fig. 19 (b).

The residual film 11 is removed by ashing as shown in FIG. 19C and the residual film 11 disappears and a part of the upper surface of the substrate 3 3) is exposed.

1, the transfer device 1 includes a substrate mounting portion 13, a coating portion 15, a mold mounting portion 17, a mold pressing portion 19, a resin hardening portion 21, And a mold peeling unit 23.

In the substrate mounting portion 13, the substrate 3 is positioned and integrally provided. The coating portion 15 applies an uncured ultraviolet cured resin 5 to the upper surface of the substrate 3 provided on the substrate mounting portion 13. [ The state shown in Fig. 19 (a) is attained by coating of the uncured ultraviolet curing resin 5 by the coated portion 15 on the substrate 3. [

The mold mounting portion 17 is provided with a sheet-like mold 7 in which a transfer pattern 9 is formed on one side in the thickness direction.

The mold pressing portion 19 presses the mold 7 provided on the mold mounting portion 17 to the uncured UV curable resin 5 on the upper surface of the substrate 3. The state shown in Figs. 19 (b) and 18 (c) is attained by the pressing of the mold 7 by the mold pressing portion 19 onto the ultraviolet curing resin 5 of the substrate 3.

The resin hardening section 21 hardens the uncured ultraviolet hardening resin 5 on which the mold 7 is pressed. The mold peeling section 23 peels the mold 7 from the cured resin 5. By peeling the mold 7 from the cured resin 5, the state shown in Fig. 19 (c) is obtained.

1 and 22, etc., the substrate mounting portion 13 includes a substrate mounting body 25 and holds the substrate 3 by, for example, vacuum adsorption. (For example, rectangular) grooves 27 for vacuum adsorption are formed on the upper surface (for example, the upper surface of the rectangular planar shape) of the substrate mounting body 25. The groove 27 is formed as a portion recessed downward from the upper surface of the substrate mounting member 25. [

In the groove 27, an air suction hole 29 for sucking air is provided. The air suction holes 29 are connected to a vacuum pump (not shown) at a lower portion of the substrate mounting body 25. The substrate 3 mounted on the substrate mounting portion 13 is vertically oriented in the thickness direction and the lower surface of the substrate 3 is in surface contact with the upper surface of the substrate mounting body 25. [

As shown in Figs. 22 (a) and 22 (b), when the state in which the substrate 3 formed in a rectangular flat plate shape is provided in the substrate mounting portion 13 is viewed in the Z- The substrate 3 is located inside the mounting body 25 and the groove 27 is located inside the substrate 3. [ The grooves 27 are located in the vicinity of the outer periphery of the substrate 3.

Then, by lowering the air pressure in the groove 27, the substrate 3 is fixed to the substrate mounting body 25. [ In this state, since the air pressure is almost "0" at the inside (rectangular portion) of the groove 27 in the Z-axis direction, the substrate 3 is held with a relatively strong force.

The coating section 15 discharges the fine cured ultraviolet ray curable resin 5 from the ink jet head 31 to form an uncured ultraviolet curable resin 5 on the substrate 3 provided on the substrate mounting section 13 (5) is coated with a thin film. The ink-jet head 31 is formed by arranging a plurality of nozzles for discharging the uncured ultraviolet-curing resin 5 on the fine particles. The ink jet head 31 is slightly spaced from the substrate 3 above the substrate 3 provided on the substrate mounting portion 13. [

A plurality of inkjet heads 31 (31A, 31B, 31C, and 31D) are provided. 5 and the like, in order that the uncured UV curable resin 5 is coated on the substrate 3 provided on the substrate mounting portion 13 in a desired shape, the respective inkjet heads 31 Are alternately arranged.

When a state in which the uncured UV cured resin 5 coated on the substrate 3 is in the targeted form is seen from the Z axis direction, the uncured UV cured resin 5, which is not shown, For example, a rectangle smaller than the substrate 3, and is located on the inner side of the substrate 3. In addition, an uncured ultraviolet-curing resin 5 may be provided on the entire upper surface of the substrate 3.

By alternately arranging the ink jet heads 31 (31A, 31B, 31C, and 31D), voids are prevented from being formed in the uncured UV curable resin 5 coated.

That is, when viewed in the Z-axis direction, in a part of the upper surface of the substrate 3 (for example, the central portion of the substrate 3; the portion surrounded by the uncured UV-curable resin 5), the uncured UV- The substrate 3 is exposed (the uncured ultraviolet-curing resin 5 does not become a target shape) due to the presence of the substrate 5 in the non-existent state.

Or an uncured ultraviolet-curable resin 5 which is to be originally one continuous form is interrupted halfway and the un-cured ultraviolet-curable resin 5 is divided into two or more portions (an uncured ultraviolet-cured resin (That is, the object 5 does not become a target shape).

The outer shape of the housing 33 of the ink jet head 31 is formed in a rectangular parallelepiped shape, and the dimension in the Y-axis direction is larger than the dimension in the X-axis direction. The inkjet head 31 emits an uncured ultraviolet curable resin 5 from the bottom surface of the housing 33 downward.

As shown in Fig. 5, the resin discharge region 35 for discharging the resin 5 of the ink jet head 31 is formed into a rectangular shape. The lengthwise direction of the resin discharge portion 35 is the Y axis direction and the resin discharge portion 35 is formed at the center of the housing 33 of the inkjet head inside the housing 33 of the inkjet head .

The ink jet heads 31 (31A, 31B, 31C and 31D) are arranged in the Y axis direction and the ink jet heads 31 are shifted alternately in the X axis direction. The lengthwise end of the resin discharge region 35 of the inkjet head 31 is overlapped with the end of the resin discharge region 35 of the adjacent inkjet head 31 adjacent to the inkjet head 31 5).

More specifically, the first ink-jet head 31A located at one end in the Y-axis direction is disposed such that the longitudinal direction of the resin-releasing portion 35 (the housing 33 of the ink-jet head) is the Y-axis direction. The second inkjet head 31B adjacent to the first inkjet head 31A is arranged such that the longitudinal direction of the resin discharge portion 35 is in the Y axis direction and the first inkjet head 31B in the X axis direction 31A.

In view of the Z axis direction, the resin discharge portion 35 of the first inkjet head 31A and the resin discharge portion 35 of the second inkjet head 31B are slightly spaced apart from each other in the X axis direction, The end of the resin ejection part 35 of the first inkjet head 31A on the side of the second inkjet head 31B and the end of the first inkjet head 31B of the resin ejecting part 35 of the second inkjet head 31B 31A are overlapped with each other.

The third inkjet head 31C adjacent to the second inkjet head 31B is arranged so that the longitudinal direction of the resin discharge portion 35 is the Y axis direction and in the X axis direction, Is slightly spaced from the first inkjet head 31B and is located at the same position as the first inkjet head 31A.

In the Z-axis direction, the resin-releasing portion 35 of the second ink-jet head 31B and the resin-releasing portion 35 of the third ink-jet head 31C are slightly spaced from each other in the X-axis direction The end portion of the resin ejection portion 35 of the second inkjet head 31B on the third inkjet head 31C side and the end of the resin ejection portion 35 of the third inkjet head 31C The ends of the two inkjet heads 31B side overlap each other. The fourth inkjet head 31D is also provided in the above-described manner.

In this way, the respective ink jet heads 31 (31A, 31B, 31C, and 31D) are arranged so that the respective ink jet heads 31 are alternately arranged. Each of the ink jet heads 31 has the same specifications, for example, and is located at the same position in the Z-axis direction.

In the above description, four inkjet heads 31 are provided, but two or three inkjet heads 31 may be provided, or five or more inkjet heads 31 may be provided. . Even in this case, the respective ink jet heads 31 are alternately arranged.

Curing ultraviolet curable resin 5 is discharged from each inkjet head 31 by the respective inkjet heads 31 being disposed alternately with respect to the substrate 3 provided on the substrate mounting portion 13, When the inkjet head 31 is relatively moved in the X-axis direction, it is possible to easily apply the ultraviolet-curable resin 5 in the form of a thin film on the substrate 3 without breaking it.

Under the control of the control unit 41 (see FIG. 1) including the CPU 37 and the memory 39, the size of the substrate 3 provided on the substrate mounting part 13 The inkjet head 31 for ejecting the uncured cured ultraviolet curable resin 5 and the inkjet head 31 for ejecting the uncured cured ultraviolet cured resin 5 may be set.

In the above description, the thickness of the uncured UV cured resin 5 coated on the substrate 3 is constant, but as shown in Fig. 20, the uncured UV curable resin 5 coated on the substrate 3 The thickness of the resin 5 may be appropriately changed.

That is, by controlling the coating portion 15 in the control portion 41, the uncured UV curable resin 5 coated on the substrate 3 is made to correspond to the fine transfer pattern 9 formed on the mold 7 It may be a single shape.

When transferring the fine transfer pattern 9 formed on the mold 7 to the uncured ultraviolet curing resin 5 coated on the substrate 3 and transferring the transfer pattern 9 to the substrate 3, Cured resin 5 is formed into a shape corresponding to the fine transfer pattern 9 so as to reduce the gap formed between the transparent resin layer 3 and the resin film 5 and to reduce the thickness of the residual film 11 formed by the resin 5 entering the gap You can.

For example, the fine transfer pattern 9 has a line and space shape. That is, when viewed in the Y-axis direction, the shape of the fine transfer pattern 9 is a rectangular wave shape in which rectangular convex portions and rectangular concave portions alternately repeat (see Fig. 19 (b)). In this case, the uncured UV cured resin 5 coated on the substrate 3 is formed into a wave shape.

For example, as shown in Fig. 20 as viewed in the Y-axis direction, a wave-like shape in which a portion coated with an uncured UV-curable resin 5 thickly and a portion coated thinly is alternately formed. In this waveform, for example, the pitch value of the wave is larger than the value of the wave height (the maximum thickness of the resin 5 - the minimum thickness of the resin 5), and the wave height value is smaller than the minimum value of the resin 5 Is larger than the value of the thickness.

When the transfer (pressing of the mold 7 onto the ultraviolet-curing resin 5) is performed, the rectangular convex portion of the transfer pattern 9 enters the portion where the resin 5 is thinly coated, and the resin 5 is thickened Thereby allowing the coated portion to enter the rectangular concave portion of the transfer pattern 9.

The residual film 11 shown in FIG. 19 (c) can be reduced by coating the uncured ultraviolet-curable resin 5 as shown in FIG.

The thickness of the uncured ultraviolet-cured resin 5 coated on the substrate 3 before transfer may be changed in the X-axis direction. For example, in order to eliminate or reduce surplus resin at the end of transfer (when the pressing of the mold 7 onto the resin 5 on the substrate 3 is terminated) (Right side in Fig. 18 (a)) and the side where pressing is finished (left side in Fig. 19 (a) and Fig. 18 (a)). Details of roll transfer shown in Figs. 18 (a) to 18 (c) will be described later.

The thickness of the uncured UV curable resin 5 coated on the substrate 3 before transfer may be changed in the Y-axis direction. For example, in order to eliminate the shortage of the resin 5 at the central portion of the substrate 3 when transferring, the thickness of the resin 5 may be made thick at the central portion of the Y-axis and thin at the end.

Next, the mold mounting portion 17, the mold pressing portion 19, and the mold releasing portion 23 will be described.

As shown in Figs. 2 to 4, the mold mounting portion 17 is provided with a far-end mold (mold fabric) 43 on which a mold 7 having a predetermined width (dimension in the Y-axis direction) (Raw roll) 43 provided on the original mold mounting portion 45 and a take-up roll 47 (take-up roll) for winding the mold 7 fed from the original mold And a take-up roll mounting portion 49 on which the take-up roll is mounted. In Fig. 2, the display of the mold 7 is omitted in order to prevent the display of the drawing from becoming complicated and difficult to see.

The mold 7 is stretched at a predetermined tension between the raw fabric mold 43 provided at the original mold mounting portion 45 and the winding roll 47 provided at the winding roll mounting portion 49, And is stretched at all times.

The mold 7 stretched between the far-end mold 43 and the take-up roll 47 rotates the far-end mold 43 and the take-up roll 47 appropriately, 43 to the take-up roll 47 and, conversely, from the take-up roll 47 to the far-end mold 43.

The mold pressing portion 19 and the mold releasing portion 23 are provided with transfer rollers 51 as shown in Figs. 1, 2 and 18 (a) to 18 (c). The transfer roller 51 is provided with a mold 7 extending between a raw fabric mold 43 provided on the original mold mounting portion 45 and a winding roll 47 provided on the winding roll mounting portion 49 It is wrapped.

The transfer of the rolls using the transfer rollers 51 causes the mold 7 to be pressed against the ultraviolet curing resin 5 which is not cured during transfer and the peeling of the mold 7 from the cured ultraviolet curing resin 5 during transfer Is performed.

The roll transfer is carried out by transferring the mold 7 onto the transfer roller 51 and transferring the ultraviolet curable resin 5 coated on the substrate 3 and the substrate 3 in the form of a thin film to the transfer roller 51 The transfer roller 51 is moved relative to the substrate 3 in the X-axis direction while the mold 7 (the lower end of the mold 7 linearly extending in the Y-axis direction) (Rear end) of the substrate 3 toward the other end (front end) (see Figs. 18 (a) to 18 (c)).

18 (a), the transfer roller 51 wound around the mold 7 with respect to the substrate 3 provided on the substrate mounting portion 13 is moved forward in the X-axis direction 18 (c) through the state shown in Fig. 18 (b), and the state shown in Fig. 18 (c) is obtained by moving the mold 7 (left side in Fig. 18 Pressing ends.

The ultraviolet curing resin 5 is cured by using the resin curing portion 21 in the state shown in Figure 18 (c) and then the mold 3 (The right side in Fig. 18 (c)), for example, at a constant speed, the peeling of the mold 7 is completed.

At this time, the transfer roller 51 is pushed to the substrate 3 (lower side) by an actuator (not shown) such as an air pressure cylinder. In addition, regardless of the position of the transfer roller 51 due to the movement of the transfer roller 51, it is possible to prevent the transfer of the transfer material between the transfer roller 51 and the transfer roller 51, Between the winding rolls 47, the mold 7 is formed into a flat plate shape without stretching and is stretched.

The transferring apparatus 1 is provided with a resin hardened portion 21 (for example, an ultraviolet ray generating device 53) as shown in Figs. 1, 18 and the like. The ultraviolet ray generator 53 irradiates the ultraviolet ray hardening resin 5 with ultraviolet rays in order to harden the ultraviolet ray hardening resin 5 while the mold 7 is being pressed onto the ultraviolet ray hardening resin 5.

The ultraviolet ray generator 53 is located at a position slightly away from the transfer roller 51 on the rear side of the transfer roller 51 in the X axis direction and is located on the rear side of the transfer roller 51 in the Z axis direction, (In the direction of the thickness of the Z-axis) of the mold 7 is located on the upper side of the portion of the mold 7 slightly distanced from the portion of the mold 7.

The ultraviolet ray generator 53 generates ultraviolet rays toward the lower side and the generated ultraviolet rays are irradiated to the ultraviolet ray hardening resin 5 of the substrate 3 through the mold 7.

Although not shown, the ultraviolet ray generator 53 is elongated in the Y-axis direction when viewed from the Z-axis direction, and the ultraviolet ray generator 53 is mounted on the substrate (not shown) The entirety of the ultraviolet ray hardening resin (the resin to which the transfer pattern 9 is pressed) 5 provided on the substrate 3 is hardened by moving relative to the substrate 3 in the X-axis direction.

In the transfer apparatus 1, when the transfer roller 51 is moving in the direction (forward direction) in which the mold 7 is pressed against the ultraviolet-curable resin 5 under the control of the control unit 41, The ultraviolet ray generator 53 irradiates the ultraviolet ray to the ultraviolet ray hardening resin 5 when the transfer roller 51 is moving in the direction (backward direction) in which the mold is peeled from the ultraviolet ray hardening resin 5.

That is, when the transfer roller 51 is moving in the direction (the front side) in which the pressed area of the mold 7 to the ultraviolet curable resin 5 in the roll transfer is increased (when the mold 7 is pressed) And when the transfer roller 51 is moving in the direction in which the pressed area of the mold 7 against the UV curable resin 5 in the roll transfer is reduced (when the mold 7 is peeled off) , The ultraviolet ray generator 53 irradiates ultraviolet rays onto the ultraviolet ray hardening resin 5.

More specifically, when the transfer roller 51 reciprocates, the ultraviolet ray generator 53 irradiates the ultraviolet ray to the ultraviolet ray hardening resin 5. The ultraviolet ray generator 53 irradiates the ultraviolet ray to the ultraviolet ray hardening resin 5 only at any time when the transfer roller 51 is moving to the front side and the transfer roller 51 is moving to the back side .

In order to prevent occurrence of sink marks in the ultraviolet-curable resin 5 under the control of the control unit 41, the transfer apparatus 1 is configured to control the transfer of the ultraviolet- , The ultraviolet ray generator 53 emits the ultraviolet light to adjust the intensity of the ultraviolet light irradiated to the ultraviolet-curable resin 5 (changes the irradiation pattern).

Here, the depression will be described. The ultraviolet-curing resin 5 may shrink when cured. If the uncured cured ultraviolet curable resin 5 is not supplied by the amount of the decrease in volume due to the shrinkage, the transferred pattern 9 of the mold 7 causes defects called dents in the pattern formed on the ultraviolet curable resin 5 .

Curing ultraviolet curable resin 5 is applied to a region (region of the substrate 3) having an area larger than the area of the transfer pattern 9 formed on the mold 7, for example, . The central portion of the region where the uncured UV cured resin 5 is coated is first cured so that the amount of decrease in volume due to the shrinkage of the ultraviolet cured resin 5 is determined by the amount of the uncured UV curable resin 5 Curing ultraviolet curing resin 5 is naturally slightly flowed from the periphery of the coated region so as to be supplemented. The curing of the uncured UV curable resin 5 proceeds from the central portion of the coated region toward the peripheral portion.

For example, as shown in Fig. 22 (a), when the mold 7 is pressed against the resin 5, a portion extending from the portion passing the center line L2 (center line L2 as indicated by arrow A1) When the mold 7 is peeled off from the resin 5, the ultraviolet light is irradiated from the part past the center line L2 (as indicated by the arrow A2) to the center line L2 And the irradiation of ultraviolet rays may be started. Thereby, the central portion of the ultraviolet-curable resin 5 is not finally cured, and the occurrence of depression in the ultraviolet-curable resin 5 is prevented.

In this case, the intensity of ultraviolet light is constant (regardless of the position of the transfer roller 51 in the X-axis direction) regardless of the elapsed time, and further, The longitudinal direction of the ultraviolet ray region). In addition, the center line L2 may be offset to the right or left in Fig. 22 (a).

22 (b), the intensity of the ultraviolet rays is changed toward the outside from the central portion of the substrate 3 by appropriately changing the position of the ultraviolet ray generator 53 in the Y axis direction or the X axis direction , The ultraviolet curing resin 5 may be cured.

The ultraviolet ray generator 53 can arrange, for example, a plurality of small-sized UV lamps of the LED type in a straight line in the Y-axis direction, and adjust the illuminance of each UV lamp in the controller 41. [ Thereby, the light source of the ultraviolet ray generator 53 becomes one linear shape and extends in the Y-axis direction.

The ultraviolet ray generator 53 may be formed by combining a plurality of UV lamps into one block, and one linear UV lamp may be constituted by a plurality of blocks, and the illumination of the lamp may be controlled (adjusted) for each block. Each block is arranged linearly in the Y-axis direction, for example.

In the above description, a plurality of UV lamps are arranged in one row, but a plurality of UV lamps may be arranged in a plurality of rows such as two rows (a form in which each row is arranged at a slight interval in the X- . In this case, it is preferable that the UV lamps in each row are shifted from the Y-axis direction so that a plurality of UV lamps are alternately arranged in a plan view (as viewed in the Z direction).

Even if the control section 41 controls the coating section 15 so as to adjust the amount of the uncured UV curable resin 5 in accordance with the transfer pattern 9 formed on the mold 7 do. The control section 41 may control the resin hardening section 21 so as to adjust the intensity of the ultraviolet ray (which may be a radiation amount) depending on the amount of the uncured ultraviolet hardening resin 5 applied.

Here, the control of the coating portion 15 and the control of the resin hardening portion 21 will be described by way of example. 24 (a) and 24 (b) are views showing an example of the molded article 103, and correspond to FIG. 19 (d). The transfer pattern 9 of the molded product 103 is a slightly complicated shape and the molded product 103 has a large number of large-size portions (not shown) formed by the cured ultraviolet- Convex portions 105 (e.g., columnar patterns 105B having a large volume) are arranged at predetermined intervals.

In the molded article 103, a plurality of convex portions 105 (for example, a cylinder having a small volume and a small volume) are formed by the ultraviolet cured resin 5 cured in the peripheral portion of the substrate 3 in plan view Pattern 105A) are arranged at a predetermined interval (same interval as the plurality of convex portions 105B having a large size).

24 (a) and 24 (b), when an uncured ultraviolet-curing resin 5 is coated on the surface of the substrate 3 in an average (uniform thickness) Curing resin 5 is coated), the ultraviolet-curing resin 5 becomes insufficient at the central portion of the substrate 3. [0053]

When the uncured UV curable resin 5 is uniformly and thickly supplied to the surface of the substrate 3 so that the shortage of the ultraviolet cured resin 5 does not occur at the central portion of the substrate 3, Curing ultraviolet curing resin 5 is excessively supplied at the peripheral portion of the substrate 1. Thus, when the transfer is performed, the residual film 11 (see FIG. 19 (c)) is increased in the peripheral portion of the substrate 3, and removal of the residual film 11 becomes more difficult. In addition, the amount of the ultraviolet-curing resin 5 used increases.

In order to solve this problem, the coating amount in the coating portion 15 is controlled by the control portion 41 so that the uncured UV curable resin 5 is made thick (thick) at the central portion of the substrate 3, Curing ultraviolet-curing resin 5 is thinly supplied at the peripheral portion of the substrate 1. Thus, the ultraviolet-curing resin 5 can be appropriately supplied to the transfer pattern as a whole without excess or deficiency.

Further, the transfer pattern may be divided into a plurality of portions (for example, nine equal parts) as viewed in plan, and the amount of the resin 5 necessary for each of the divided portions may be calculated and supplied.

The molded product 103 having the transfer pattern (the plurality of convex portions 105) as shown in Figs. 24 (a) and 24 (b) is transferred from the ultraviolet ray generator 53 to the uncured ultraviolet curable resin 5, , There arises a problem that ultraviolet rays of uniform intensity (uniform amount) are irradiated.

That is, when ultraviolet light of a strength enough to cure the ultraviolet curable resin 5 in the peripheral portion of the substrate 3 is irradiated, ultraviolet light is too weak in the central portion of the substrate 3, and shortage of curing of the ultraviolet curable resin 5 occurs . On the other hand, when the ultraviolet curable resin 5 at the central portion of the substrate 3 is irradiated with ultraviolet light of an intensity enough to cure the ultraviolet curable resin 5 at the peripheral portion of the substrate 3, Curing ultraviolet curing resin 5 is not supplied from the periphery to the central portion of the substrate 3, so that depression occurs in the central portion of the substrate 3.

In order to solve this problem, the quality of the molded article 103 can be improved by adjusting the irradiation amount (intensity) of the ultraviolet ray according to the coating amount of the ultraviolet ray hardening resin 5 by the control part 41.

24 (a) and 24 (b), the amount of ultraviolet rays to be irradiated on the peripheral portion of the substrate 3 is reduced, The irradiation amount of ultraviolet rays at the central portion is increased. When moving the ultraviolet ray generator 53 forward, ultraviolet rays may be irradiated only at the central portion of the substrate 3, and ultraviolet rays of uniform intensity may be irradiated to the entire substrate 3 when moving toward the rear side.

Further, the irradiation amount of ultraviolet rays to the ultraviolet cured resin coated on the substrate 3 may be adjusted by suitably adjusting the moving speed of the ultraviolet ray generator 53 in the X-axis direction.

In the transfer device 1, a plasma unit 55 is provided. The plasma unit 55 irradiates a plasma onto the fine transfer pattern 9 provided in the mold 7 which is peeled from the resin 5 of the substrate 3 after the transfer. The irradiation of the plasma by the plasma unit 55 is carried out for cleaning the fine transfer pattern 9 provided on the mold 7.

The plasma unit 55 has a head 57 and a driving unit 59. Then, the atmospheric pressure plasma (AP plasma) is generated from the head 57 and the generated atmospheric plasma is irradiated to the mold 7 to decompose the contamination of the mold 7 such as the fine transfer pattern 9 · Perform removal.

The irradiation of the plasma to the mold 7 may be performed each time the transfer is finished, or may be performed every time a plurality of transfers are completed.

When the cleaning of the fine transfer pattern 9 of the mold 7 by the plasma unit 55 is insufficient, the transfer apparatus 1 is peeled off from the ultraviolet ray hardening resin 5 to form a mold The new unused portion of the mold 7 is extracted from the far-end mold 43 by winding the portion of the mold 7 on the take-up roll 47. The unused portion of the newly fed mold 7 is used for the next transfer.

Plasma is also irradiated onto the upper surface of the substrate 3 before the uncured UV-curable resin 5 is applied by the plasma unit 55. [ The irradiation of the plasma on the upper surface of the substrate 3 is carried out in order to improve the wettability of the substrate 3.

The coating portion 15 moves the inkjet head 31 from the one end to the other end of the substrate 3 with respect to the substrate 3 in the X axis direction to separate the uncured ultraviolet- 3) in the form of a thin film. The plasma unit 55 (the head 57 and the driving unit 59) is supported by the coating portion 15.

The transfer apparatus 1 is provided with a mold installation auxiliary section 61. The mold installation auxiliary portion 61 is provided with a mold 7 wound around the transfer roller 51 to be guided by the mold mold 43 provided in the far-end mold mounting portion 45, Up roll 47 which has been wound around the take-up reel. This guide is formed while the portion of the mold 7 to be fed out is, for example, almost tightened while preventing the occurrence of wrinkles at the portion of the mold 7 fed out from the far-end mold 43.

More specifically, as shown in Fig. 13, the mold 7 before being installed in the transfer apparatus 1 is wound around the core material 63 of the far-end mold 43 mostly at one end side in the longitudinal direction. The mold 7 before being installed in the transfer apparatus 1 has a slightly protruded portion on the other end side in the longitudinal direction extending and protruding from the far-end mold 43, and a distal end portion of the far- And the mold supporting portion 65, as shown in Fig. The mold supporting portion 65 is separate from the core material 67 of the winding roll 47 but may be the core material 67 of the winding roll 47. [

The mold installation auxiliary section 61 is provided with a mold installation assistant member 69 movable with respect to the original mold installation section 45, the transfer roller 51 and the winding roll installation section 49. A mold support portion 65 is integrally provided in the mold installation assisting member 69. [ Then, the mold supporting member 65 provided on the mold mounting assistant member 69 and the mold mounting assistant member 69 is moved, whereby the above-described guide is performed.

The transfer apparatus 1 will be further described.

As shown in Fig. 1 and the like, the transfer apparatus 1 has, for example, a base body 71 having a planar upper surface. On the upper surface of the base body 71, a substrate mounting body 25 is integrally provided. The substrate mounting body 25 is located in the middle portion of the base body 71 in the X-axis direction and the Y-axis direction.

The transfer apparatus 1 also has a first support body 73, a second support body 75 and a third support body 77.

The first support body 73 extends upward from the upper surface of the base body 71 and is supported on the base body 71 by a linear guide bearing (not shown). An actuator such as a servo motor The position of movement relative to the base body 71 in the X-axis direction can be determined.

The inkjet head 31 and the head 57 of the plasma unit 55 and the drive unit 59 are supported on the first support body 73. [ The ink jet head 31 is provided integrally with the first support body 73. [

The ink jet head 31 is located on the rear side of the first support body 73 in the X-axis direction. The head 57 of the plasma unit 55 is located on the rear side of the ink jet head 31 in the X axis direction.

The ink jet head 31 and the head 57 of the plasma unit 55 are positioned above the substrate 3 provided on the substrate mounting portion 13 in the Z axis direction.

The driving unit 59 of the plasma unit 55 is stacked on the first support body 73 and integrated with the first support body 73.

The head 57 of the first support body 73, the inkjet head 31 and the plasma unit 55 is located at the front end portion of the base body 71 in the X axis direction in the initial state, The inkjet head 31 and the head 57 of the plasma unit 55 can move in the X axis direction from the position where the ink jet head 31 and the plasma unit 55 come to the rear side of the substrate mounting body 25 (see Fig. 8).

The head 57 of the plasma unit 55 is supported by the first support body 73 so as to be movable and positionable in the Z-axis direction, and the axis C1 extending in the Y- For example, at an angle of 90 [deg.].

By this pivotal positioning, the direction in which the plasma is generated can be switched between the rear side in the X-axis direction and the lower side in the Z-axis direction.

Further, the ink jet head 31 may be supported by the first support body 73 so that the ink jet head 31 can be moved and positioned in the Z-axis direction.

The second support body 75 extends upward from the upper surface of the base body 71 and is supported on the base body 71 by a linear guide bearing (not shown). An actuator such as a servo motor The position of movement relative to the base body 71 in the X-axis direction can be determined. 2, 3 and 4, the second support body 75 is engaged with the base body 71 only on one side in the Y-axis direction.

The second support body 75 is provided with a far-end mold mounting portion 45 and a transfer roller 51 and an ultraviolet ray generator 53 are supported.

The transfer roller 51 and the ultraviolet ray generator 53 are positioned above the substrate 3 provided on the substrate mounting portion 13 in the Z axis direction. The far-end mold mounting portion 45 is located above the transfer roller 51 and the ultraviolet ray generator 53 in the Z-axis direction.

The far-end mold mounting portion 45, the transfer roller 51, and the ultraviolet ray generator 53 are located, for example, inside the second support body 75 in the X-axis direction. In the X-axis direction, the far-end mold mounting portion 45 and the transfer roller 51 are located on the front side of the second support body 75 and the ultraviolet ray generator 53 is slightly separated from the transfer roller 51 Is located on the rear side of the transfer roller (51).

1) from the initial position, and the ultraviolet ray generator 53 is moved from the position of the initial state to the position of the substrate mounting body 25 (Refer to Fig. 11) which is located on the front side with respect to the X-axis direction.

The columnar transfer roller 51 is rotatably supported with respect to the second support body 75 with the central axis of the transfer roller 51 (the central axis extending in the Y axis direction) as the rotational center, The actuator can be rotated at a predetermined torque or rotational speed and stopped at a predetermined rotational position by an actuator such as a servo motor.

When the mold 7 is pressed against the resin 5 of the substrate 3 and the mold 7 is peeled from the resin 5, The transfer roller 51 rotates at a rotational speed synchronized with the moving speed in the X-axis direction. Further, the transfer roller 51 may be rotated following the moving speed of the transfer roller 51 in the X-axis direction without using an actuator.

The transfer roller 51 is movable in the Z-axis direction with respect to the second support member 75 and the ultraviolet ray generator 53 is also movable relative to the second support member 75, for example, Along with the transfer roller 51, is movable in the Z-axis direction, and is positioned at either the upper end position or the lower end position.

As shown in FIGS. 1 and 4, the far-end mold mounting portion 45 has a columnar first shaft member 79. The first shaft member 79 protrudes from the second support body 75 toward the other end in the Y-axis direction. That is, the first shaft member 79 is provided on the second support body 75 as if it were a cantilever. The first shaft member 79 is rotatably supported on the second support member 75 with the center axis of the first shaft member 79 (the central axis extending in the Y-axis direction) as the center of rotation And can be rotated at a predetermined torque or rotational speed by an actuator such as a servo motor, stopped at a predetermined rotational position, and stopped at a predetermined torque.

The core material 63 of the far-end mold 43 is formed into a cylindrical shape. The farthest mold 43 is integrally installed in the first shaft member 79 by passing the first shaft member 79 through the cylinder of the core material 63. [ The fabric mold 43 is easily detachable from the first shaft member 79 having a cantilever shape.

In the far-end mold 43, as shown in Fig. 23, since the interleaving sheet 81 is inserted between the overlapped molds 7, scratches and the like of the mold 7 are prevented. As shown in Fig. 1, etc., the wastepaper 81 which is unnecessary due to the mold 7 being extended and protruded from the far-end mold 43 is wound on the wiping roll 83 provided on the second support body 75. [ The sheet separator 81 wound around the separator take-up roll 83 is extended and extended from the separator take-up roll 83 as necessary.

The third support body 77 also extends upward from the upper surface of the base body 71 and is integrally provided on the base body 71. As shown in Figs. 2 and 3, the third support body 77 is also engaged with the base body 71 only on one side in the Y-axis normal direction.

The third support body 77 is provided with a winding roll mounting portion 49 and a guide roller 85 supported thereon.

The position of the lower end of the guide roller 85 in the Z axis direction is set such that the position of the lower end of the guide roller 85 is the same as the position of the transfer roller 51 when the mold 7 is pressed against the resin 5 of the substrate 3 provided on the substrate- It coincides with the bottom position. The mold 7 stretched between the guide roller 85 and the transfer roller 51 when the mold 7 is pressed against the resin 5 of the substrate 3 provided on the substrate mounting portion 13, The portion of the light guide plate 1 is developed in the horizontal direction.

The guide roller 85 may be movable in the Z-axis direction relative to the third support body 77 in accordance with the thickness of the substrate 3 or the like.

In the Z-axis direction, the take-up roll mounting portion 49 is located slightly above the guide rollers 85. [

In the X-axis direction, the take-up roll mounting portion 49 and the guide roller 85 are located, for example, on the inner side of the third support body 77. The third support body 77 is located on the rear side of the second support body 75 in the X-axis direction.

The columnar guide roller 85 is rotatably supported on the third support body 77 with the center axis extending in the Y-axis direction of the guide roller 85 as the center of rotation. The guide roller 85 can be stopped at a predetermined rotational position by rotating at a predetermined torque or rotational speed by an actuator (not shown) such as a servo motor.

When the mold 7 is wound by the take-up roll 47 provided on the take-up roll mounting portion 49, the mold 7 is wound around the transfer roller 51 in the X- And rotates at a rotational speed synchronized with the moving speed. Further, the guide roller 85 may be rotated following the winding speed of the mold 7 without using an actuator.

As shown in Figs. 1 to 3 and the like, the winding roll mounting portion 49 has a columnar second shaft member 87. [ The second shaft member 87 protrudes from the third support body 77 toward the other end in the Y-axis direction. That is, the second shaft member 87 is provided on the third support body 77 as if it were a cantilever. The second shaft member 87 is rotatably supported on the third support body 77 with the center axis extending in the Y axis direction of the second shaft member 87 as the center of rotation. The second shaft member 87 is rotated at a predetermined torque or rotational speed by an actuator (not shown) such as a servo motor, stopped at a predetermined rotational position, and stopped at a predetermined torque .

The core material 67 of the winding roll 47 is formed into a cylindrical shape. The winding roll 47 is integrally provided to the second shaft member 87 by passing the second shaft member 87 through the cylinder of the core material 67. [ The winding roll 47 is easily detachable from the second shaft member 87. [

In the take-up roll 47, as shown in Fig. 23, the interleaving sheet 81 is inserted between the overlapped molds 7. When it is necessary to insert the separable sheet 81 between the overlapped molds 7 as shown in Figure 1 or the like when the mold 7 is wound by the take-up roll 47, The separator 81 is supplied from the separator feed roll 89 provided. The separator 81 fed from the separator feed roll 89 is wound up again on the separator feed roll 89 as necessary.

The mold installation assistant member 69 is provided on the upper surface of the base body 71 and supported by the base body 71 by a linear guide bearing (not shown), and an actuator (not shown) such as a servo motor, The position of movement relative to the base body 71 in the X-axis direction can be determined.

15), the mold installation assisting member 69 is moved forward slightly in the X-axis direction from the position of the second support body 75 in the initial state And is located on the rear side of the substrate mounting body 25 on the side of the substrate mounting body 25.

16), the mold installation assisting member 69 is located almost directly below the take-up roll mounting portion 49. When the mold mounting assisting member 69 is positioned most rearward in the X-axis direction (see Fig.

Further, the mold setting assistant member 69 may be manually moved (by a human hand) to the base body 71 to be moved.

The mold mounting assistant member 69 is located at the center of the other end side in the Y axis direction relative to the engaging portion of the base body 71 of the second support body 75 or the third support body 77, Is installed.

As shown in Fig. 15 and the like, the mold installation assistant member 69 is located slightly below the guide roller 85 in the Z-axis direction.

A mold supporting portion 65 having a mold 7 extending therefrom is integrally and detachably mounted on the mold mounting assistant member 69.

A mold mold 43 is provided in the fabric mold mounting portion 45 and the mold supporting portion 65 having the tip end of the mold 7 extending and protruding from the original mold 43 is fixed to the mold mounting assistant member 69, And the mold 7 is moved around the transfer roller 51 by moving the mold setting assistant member 69 (mold supporting portion 65) while the mold 7 is extended and projected from the original mold 43. As a result, (For example, as shown in Fig. 16, to the vicinity of the winding roll 47) to the portion of the winding roll 47 provided on the winding roll mounting portion 49. [

The distal end portion of the mold 7 extending and protruding from the fabric mold 43 is attached to the mold supporting portion 65 by an adhesive or an adhesive tape.

The mold supporting portion 65 with the leading end of the mold 7 attached reaches the vicinity of the winding roll 47 provided on the winding roll mounting portion 49 by guiding the mold supporting portion 65 in this way. Thereafter, the mold 7 is peeled off from the mold supporter 65 and the leading end of the mold 7 is attached to the take-up roll 47, whereby the mold 7 can be mounted on the transfer device 1 (See FIG. 17, etc.). The mold supporting portion 65 may be the core material 67 of the winding roll 47 as shown above.

As shown in Fig. 21, a transfer roller guide portion 91 may be provided on the front and rear sides of the substrate mounting member 25. Fig.

In this case, when the resin 5 coated on the substrate 3 provided on the substrate mounting portion 13 of the mold 7 due to the movement of the transfer roller 51 is pressed, the transfer roller guide portion 91 guide the transfer roller 51.

The transfer roller 51 supporting the mold 7 is moved by the transfer roller guide portion 91 to be applied to the substrate 3 provided on the substrate mounting portion 13 of the mold 7 Or may be configured to eliminate or alleviate the shock when the pressing on the resin 5 is started. Eliminating or mitigating the occurrence of shocks does not adversely affect the transfer precision.

That is, the transfer roller 51 is moved forward by the transfer roller guide portion 91 to move the transfer roller 51 to the front side of the mold 7 using the transfer roller 51 to the substrate 3, (Shock when the transfer roller 51 suddenly abuts against the substrate 3 with the mold 7 therebetween) at the start of pressing can be eliminated or mitigated.

The transfer roller 51 supporting the mold 7 is moved by the transfer roller guide portion 91 to be applied to the substrate 3 provided on the substrate mounting portion 13 of the mold 7 Or may be configured to eliminate or alleviate the shock when the pressing on the resin 5 is terminated.

That is, the transfer roller 51 is moved to the rear side so that the shock (the transfer roller 51 is pressed against the mold (7)) at the start of peeling of the mold 7 from the substrate 3 provided on the substrate mounting portion 13 7) and the abrupt contact with the substrate 3) can be eliminated or mitigated.

The transfer roller guide portion 91 is provided with an inclined member 93 integrally provided on the front side and the rear side of the substrate mounting body 25. Each of the inclined members 93 has a plate-like substrate mounting member engaging portion 95 and a substantially flat plate-shaped transfer roller engaging portion 97, and is formed in an L shape as viewed in the Y-axis direction.

When viewed in the Y-axis direction, the substrate mounting member engagement portion 95 is elongated in the Z-axis direction and is in contact with the substrate mounting member 25. [

The transfer roller engagement portion 97 is elongated in the X-axis direction (in the moving direction of the transfer roller 51) as viewed in the Y-axis direction (as viewed in the drawing direction of the central axis of the transfer roller 51) Axis direction from the upper end of the squeezing engagement portion 95 and in a direction away from the substrate mounting body 25. [

The transfer roller engagement portion 97 has a proximal side portion 99 located on the substrate mounting body 25 side and a distal side portion 101 separated from the substrate mounting body 25. The proximal-side region 99 is elongated in the X-axis direction, but the proximal-side region 101 is inclined at a slight angle (1 to 20 占 with respect to the X-axis direction). The boundary between the proximal-side region 99 and the proximal-side region 101 is circular in an arc-like shape (see R in FIG. 21 (c)).

The transfer roller 51 and the mold 7 wound around the transfer roller 51 are configured so as to abut the inclined member 93 over the entire length in the Y-axis direction. However, the transfer roller 51, A part of the mold 7 wound around the transfer roller 51 may come in contact with the inclined member 93. [ For example, only the end of the transfer roller 51 on which the transfer pattern is not formed or the end portion (one end or the other end in the Y-axis direction) of the mold 7 wound around the transfer roller 51, 93, as shown in Fig.

When the mold 7 is peeled from the resin 5 by the roll transfer, the transfer roller guide portion 91 (front slant member 93B) is pressed against the mold 7 from the resin 5 And the transfer roller guide portion 91 (rear side inclined member 93A) is configured to stop the peeling of the mold 7 from the resin 5 So as to eliminate or alleviate the shock in the operation of the apparatus.

Further, either the front side inclined member 93B or the rear side inclined member 93A may be omitted.

When the pressing of the mold 7 against the ultraviolet curable resin 5 (substrate 3) is started (the transfer roller 51 is engaged with the substrate 3 provided on the substrate mounting body 25, The operation of the transfer roller 51 and the like will be described.

21 (a), the transfer roller 51 and the mold 7 are separated from the rear side inclined member 93A in the state where the transfer roller 51 is located on the right side (rear side) have. When the transfer roller 51 is moved to the front side (left side) from this state, as shown in Fig. 21 (a), the transfer roller 51 is pressed against the rear side inclined member 93A Side region 101 of the base end portion 101a. The position of the mold 7 in contact with the tip end side portion 101 is slightly lower than the upper surface of the substrate 3 provided in the substrate mounting portion 13 in the Z axis direction .

In addition, since the inclination angle of the distal end side portion 101 is small, the shock at the time of abutment can be reduced.

When the transfer roller 51 moves further forward (leftward) from the position shown in FIG. 21 (a), the transfer roller 51 moves upward as it is pushed upward by the distal end portion 101. At this time, the transfer roller 51 remains in contact with the tip-side portion 101 with the mold 7 interposed therebetween.

When the transfer roller 51 further moves to the front side (left side), the transfer roller 51 abuts the base-end side portion 99 of the rear side inclined member 93A with the mold 7 interposed therebetween.

When the transfer roller 51 moves further forward (leftward), the transfer roller 51 is moved in the horizontal direction (along the X axis) while maintaining the state in which the transfer roller 51 abuts against the base- Direction. The position of the mold 7 at this time (the portion abutted against the distal end portion 101) coincides with the position of the upper surface of the substrate 3 provided on the substrate mounting portion 13 in the Z axis direction .

When the transfer roller 51 further moves to the front side (left side), the resin 5 (the substrate 3) of the mold 7 starts to be pressed as shown in Fig. 21 (b). At the start of this pressing, since the height of the transfer roller 51 is not changed, shock is hardly generated. There is no possibility that the end portion of the substrate 3 or the like is broken.

When the transfer roller 51 is moved to the front side (left side), the transfer roller 51 comes into contact with the front side inclined member 93B with the mold 7 interposed therebetween. At this time, since the height position of the transfer roller 51 spaced from the substrate 3 provided on the substrate mounting portion 13 is not abruptly changed, the mold 3 with the transfer roller 51 applied to the substrate 3 It is possible to eliminate or mitigate the shock at the end of the pressing of the substrates 3 and 7, thereby eliminating the possibility that the ends of the substrate 3 or the like are broken.

21 (c), a slight distance in the X-axis direction (for example, a distance between the front side inclined member 93B and the substrate 3) is set between the rear side inclined member 93A 3) and is far smaller than the value of the radius of the transfer roller 51) L3, but the distance L3 may be " 0 ".

The height position of the rear side inclined member 93A (front side inclined member 93B) may be adjustable with respect to the substrate mounting member 25 in accordance with the thickness of the substrate 3. [

The operation of the transfer roller 51 or the like at the time of peeling the mold 7 from the cured ultraviolet cured resin 5 (substrate 3) starts to press the mold 7 onto the resin 5 And the reverse operation. However, the transfer roller 51 and the mold 7 first contact the front side inclined member 93B.

The rear side inclined member 93A or the front side inclined member 93B may be omitted. 1 and so on.

Next, the operation of the transfer apparatus 1 will be described.

In the initial state, as shown in Fig. 1, the mold 7 is provided in the transfer device 1, the first support body 73 is located at the front end position, and the second support body 75 is located at the rear end position And the head 57 in a state in which plasma of the plasma unit 55 is not generated is located at the upper position and the transfer roller 51 and the ultraviolet ray generator 53 are located at the upper position. Further, a substrate 3 is provided on the substrate mounting body 25.

The upper portion of the substrate mounting body 25 is formed of a conductor, and acts as an electrode when irradiating the plasma.

6, the head 57 of the plasma unit 55 is positioned at the lower end position from the above-described initial state under the control of the control unit 41, and as shown in Fig. 7, The first support body 73 is moved backward while plasma is generated toward the lower substrate 3 and an ultraviolet cured resin 5 is coated on the substrate 3 with the inkjet head 31. [

8 shows a state in which coating of the uncured ultraviolet curing resin 5 on the substrate 3 is finished. In this state, no plasma is generated from the head 57, The release of the uncured ultraviolet-curing resin 5 also ceased.

Subsequently, the first supporting body 73 is moved to the front side, and is positioned at the front end position as shown in Fig. 9, and the transfer roller 51 and the ultraviolet ray generator 53 are positioned at the lower end position.

Subsequently, as shown in Fig. 10, the mold 7 is pressed against the substrate 3 while moving the second support body 75 toward the front side. At this time, the mold 7 is extended and protruded from the original mold 43 in accordance with the movement toward the front side of the transfer roller 51, and ultraviolet rays are irradiated from the ultraviolet ray generator 53 onto the ultraviolet curable resin 5 of the substrate 3 .

11 shows a state in which the pressing of the mold 7 onto the substrate 3 is completed. In this state, ultraviolet rays are not generated from the ultraviolet ray generator 53.

Subsequently, the second support body 75 is moved backward from the state shown in Fig. 11, and the mold 7 is peeled from the substrate 3 or the resin 5. At this time, the mold 7 is wound from the far-end mold 43 and the ultraviolet curable resin 5 of the substrate 3 is irradiated with ultraviolet rays from the ultraviolet ray generator 53.

The second support body 75 is positioned at the rear end position and the transfer pattern of the mold 7 is transferred to the mold 7 after the peeling of the mold 7 from the substrate 3 or the resin 5 9 to the resin 5 of the substrate 3 is terminated. When the next transfer is performed, the substrate 3 to be transferred next is exchanged.

Next, the cleaning operation of the mold 7 by the plasma unit 55 will be described.

The cleaning object of the mold 7 by the plasma unit 55 is a portion of the mold 7 (particularly, the fine transfer pattern 9) used for transferring the substrate 3 to the ultraviolet curing resin 5.

As shown in Fig. 12, the head 57 of the plasma unit 55 is positioned at the upper end position and is rotated about the axis C1 shown in Fig. 1 to generate plasma toward the rear side, The first support body 73 is positioned at the rear end position, and the head 57 is positioned in the vicinity of the mold 7.

Plasma is generated from the head 57 toward the mold 7 in the state shown in Fig. 12, and the mold 7 and the winding roll 47 are appropriately subjected to winding and drawing of the mold 7 , The entire area of the mold 7 used for transferring the substrate 3 to the resin 5 is irradiated with plasma and cleaned.

A conductive plate (not shown) is provided on the opposite side of the head 57 with the mold 7 interposed therebetween. The electrically conductive plate acts as an electrode when the plasma unit 55 irradiates the mold 7 with plasma.

The cleaning of the mold 7 by the plasma unit 55 is performed when the mold 7 is peeled from the cured ultraviolet curing resin 5 instead of or in addition to the cleaning to the state shown in Fig. . That is, the mold 7 may be cleaned by irradiating a plasma from the plasma unit 55 to a portion of the mold 7 immediately after peeling from the cured ultraviolet-curing resin 5 during roll transfer.

11, the second support body 75 is moved to the rear side to peel the mold 7 from the substrate 3 and the ultraviolet curing resin 5, The head 57 (first support body 73) of the plasma unit 55 also moves rearward and the mold 7 immediately after being peeled off from the ultraviolet curing resin 5 is irradiated with the plasma unit 55 The plasma may be irradiated.

The moving speed of the plasma unit 55 to the rear side of the head 57 coincides with the moving speed of the second supporting body 75 and the moving speed of the second supporting body 75 and the head of the plasma unit 55 The distance between the second support body 75 and the head 57 in the X direction is a constant distance at which the plasma can be irradiated to the mold 7.

When a plurality of transfers are performed in order by repeatedly using a certain portion of the mold 7 on the ultraviolet curing resin 5 of the plurality of substrates 3, (At least one of the number of times of irradiation and the irradiation intensity) to the portion of the mold 7 used for the transfer by the transfer means.

Will be described in more detail. 12, plasma is irradiated from the plasma unit 55 to the peeled mold 7 after the peeling of the mold 7 from the ultraviolet curing resin 5 is completed. The mold 7 is cleaned by timely winding and drawing of the mold 7 by the far-end mold 43 and the take-up roll 47 after the peeling of the mold 7 is completed, And irradiating the entire area of the mold 7 used for the transfer to the ultraviolet curable resin 5 with plasma. The portion of the cleaned mold 7 is used again for the next transfer.

In this way, the portion of the mold 7 used for transferring is repeatedly cleaned by plasma irradiation and used again for transferring. In this case, the cleaning of the mold 7 is carried out taking into account that the number of times of use for transfer increases.

For example, after the first transfer, the mold 7 and the winding roll 47 are wound and fed back one time only from the state shown in Fig. 12 by the far-end mold 43 and the winding roll 47. At this time, The entire portion of the mold 7 used for transferring the substrate 3 to the ultraviolet curing resin 5 is irradiated with plasma.

The irradiation of the plasma may be performed either in one operation of winding and drawing the mold 7 or in one operation of winding and drawing the mold 7.

12, the reciprocating operation of the winding and drawing of the mold 7 is performed twice. At this time, the ultraviolet-curable resin 5 of the substrate 3 is conveyed to the position The entire area of the mold 7 used for transferring the plasma is irradiated with the plasma.

In the same manner, also in the third and subsequent transfers, the reciprocating operation of the winding and feeding of the mold 7 is performed as many times as the number of times of transfer, and at this time, Plasma is irradiated to the entire portion of the mold 7 used for transferring. Then, when the transfer is performed a predetermined number of times (for example, five times), the mold 7 is sent from the far-end mold 43 to the take-up roll 47 and the portion of the mold 7 used for transferring is exchanged .

As described above, by changing the irradiation amount of the plasma to the mold 7 by the plasma unit 55 in accordance with the number of times of transferring, it is possible to appropriately clean the mold 7 in which the contamination becomes worse every time the transfer number increases .

It is also possible to provide a mold detection unit (not shown) for detecting the contamination of the portion of the mold 7 that has been peeled off from the ultraviolet curing resin 5. As the mold detecting unit, for example, a transmission type photoelectric sensor or a reflection type photoelectric sensor can be used.

It is also possible to determine whether or not the cleaning of the mold 7 by the plasma unit 55 is insufficient, in accordance with the detection result of the mold detection unit.

For example, after the completion of the cleaning of the mold 7 by the plasma unit 55, the contamination of the portion of the mold 7, which has been peeled off from the ultraviolet ray hardening resin 5, It is judged that the cleaning of the mold 7 by the plasma unit 55 is insufficient and the replacement of the mold 7 is carried out so that the cleaning of the mold 7 is insufficient .

It is also possible to detect confusion (for example, defects or the like) of the transferred pattern 9 at the portion of the mold 7 that has been peeled off from the ultraviolet cured resin 5 by the mold detecting portion. That is, after the cleaning of the mold 7 by the plasma unit 55 is completed, the transfer pattern 9 of the portion of the mold 7, which has been peeled off from the ultraviolet curing resin 5, The mold 7 may be exchanged when the shape of the mold 7 is lower than a predetermined threshold value.

The head portion 57 of the coating unit 15 and the plasma unit 55 move relative to the substrate 3 provided on the substrate mounting portion 13 at the same time while the plasma unit 55 Curable ultraviolet curable resin 5 may be coated on the substrate 3 at the coating portion 15 while irradiating the substrate 3 with plasma.

More specifically, the coating portion 15 and the head 57 of the plasma unit 55 are moved together with the substrate 3 provided on the substrate mounting portion 13 in the X-axis direction. Further, the coated portion 15 is located on the front side of the plasma unit 55 in the X-axis direction.

6, the coating head 15 and the head 57 of the plasma unit 55 are placed on the front side of the substrate 3 provided on the substrate mounting portion 13, The head 57 of the plasma unit 55 is moved from the head 57 of the plasma unit 55 to the substrate 3 provided on the substrate mounting portion 13 Curing ultraviolet curable resin 5 may be applied to the substrate 3 provided on the substrate mounting portion 13 in the coating portion 15 immediately after the irradiation.

Although the ultraviolet curing resin 5 not cured is not cured in the plasma irradiated from the head 57 of the plasma unit 55 to the substrate 3, (Not shown) shielding the plasma irradiated from the head 57 of the plasma unit 55 when the uncured UV cured resin 5 is likely to be cured by the plasma irradiated onto the substrate 3, And the plasma irradiated from the head 57 of the plasma unit 55 is prevented from reaching the uncured ultraviolet curing resin 5 coated on the coating portion 15.

The head portion 57 of the coating unit 15 and the plasma unit 55 move simultaneously with the substrate 3 provided on the substrate mounting portion 13 and the plasma is irradiated with the plasma from the plasma unit 55 The uncured resin 5 is coated on the substrate 3 in the coating portion 15 so that the wettability of the substrate 3 is improved and the coating of the uncured UV curable resin 5 on the substrate 3 is performed So that the time required for the transfer can be shortened.

Although the plasma unit 55 is configured to irradiate plasma to the mold 7 peeled off from the ultraviolet curing resin 5 of the substrate 3 after transferring the plasma, the driving unit 59 is supported on the coating unit 15 So that the coating portion 15, the head 57, and the driving portion 59 move simultaneously in the X-axis direction.

The substrate 3 is transferred from the head 57 of the plasma unit 55 driven by the driving unit 59 of the plasma unit 55 to the mold 7 , The driving unit 59 and the head 57 of the plasma unit 55 are made common.

Here, the common use of the head 57 of the plasma unit 55 will be described in detail.

The surface of the substrate 3 to which the plasma is irradiated by the plasma unit 55 and the surface of the mold 7 to which the plasma is irradiated by the plasma unit 55 intersect each other.

The surface of the substrate 3 to which the plasma is irradiated by the plasma unit 55 is a plane orthogonal to the Z-axis direction, for example, and the surface of the mold 7 irradiated with the plasma by the plasma unit 55 For example, a plane orthogonal to the X-axis direction. As described above, the surface of the substrate 3 to which the plasma is irradiated by the plasma unit 55 and the surface of the mold 7 to which the plasma is irradiated by the plasma unit 55 are orthogonal to each other.

The head 57 can be rotated with respect to the coated portion 15 or the like. The attitude of the head 57 when irradiating the plasma from the head 57 to the surface of the substrate 3 is determined by the attitude of the head 57 at the time of irradiating the surface of the mold 7 with the plasma from the head 57 (For example, 90 degrees) with respect to the center of rotation.

The head 57 of the plasma unit 55 has the first support body 73 so as to be rotated and positioned at an angle of, for example, 90 degrees with the axis C1 extending in the Y- Respectively. By this pivotal positioning, the direction in which the plasma is generated can be switched between the rear side in the X-axis direction and the lower side in the Z-axis direction.

When plasma is irradiated to the surface of the substrate 3 from the head 57 and plasma is generated toward the lower side in the Z axis direction and plasma is irradiated from the head 57 to the surface of the mold 7, The plasma is generated toward the rear side in the axial direction.

The position of the head 57 at the time of irradiating the plasma from the head 57 to the surface of the substrate 3 corresponds to the position of the head 57 when the plasma is irradiated from the head 57 to the surface of the mold 7 The substrate 3 and the mold 7 in different positions and postures can be precisely irradiated with the plasma by using the single head 57. In this case,

Next, the installation of the mold 7 to the transfer apparatus 1 using the mold installation auxiliary section 61 will be described.

13, the second support body 75 is located at the rear end position, the mold setting assistant member 69 is located at the front end position, and the farthest mold mounting section 45 is provided with the fabric It is assumed that the mold 43 is not provided.

The core material 63 of the far-end mold 43 is installed in the far-end mold 43 (see Fig. 14), and the mold 7 is appropriately extended and projected from the far-end mold 43, The mold supporting portion 65 is integrally provided in the mold setting assistant member 69 (see Fig. 15).

Subsequently, the mold installation assistant member 69 is moved rearward while properly extending and protruding the mold 7 from the far-end mold 43, and is positioned at the rear end position (see Fig. 16). The mold 7 extending and protruding between the far-end mold 43 and the mold supporter 65 is wound around the transfer roller 51 and the guide roller 85 to be engaged.

The leading end portion of the mold 7 is detached from the mold supporting portion 65 and fixed to the core material 67 of the winding roll 47 (see Fig. 17).

According to the transfer apparatus 1, since the uncured resin 5 is applied to the substrate 3 by using the inkjet head 31, the coating accuracy (the uncoated resin 5 coated on the substrate 3 (For example, the precision of the film thickness of the ultraviolet curable resin 5) can be made good. That is, the resin 5 can be provided on the substrate 3 with a smaller thickness than in the case of using other coating methods such as spraying.

It is possible to make the volume of the resin 5 before transfer and the volume of the resin 5 after transfer substantially equal to each other by making the film thickness accuracy of the resin 5 satisfactory, It is possible to reduce the thickness as much as possible, or to suppress the occurrence of the residual film 11. [

Since the transfer apparatus 1 is provided with a plurality of inkjet heads 31, the coating of the uncured ultraviolet-curable resin 5 can be performed only at the portion of the substrate 3 requiring coating of the resin 5 can do. For example, the inkjet head 31 for ejecting the uncured UV curable resin 5 and the inkjet head 31 for ejecting the uncured UV curable resin 5 can be set, Even if the size is changed, it can cope flexibly. Further, in the case of transferring a plurality of transfer patterns 9 by one transfer (for example, in the case of acquiring four or eight in one substrate 3), four transfer patterns 9 are acquired from eight acquisitions Even if the shape of the mold 7 is changed, it can be flexibly coped with.

Since the plurality of inkjet heads 31 are arranged alternately according to the transfer apparatus 1, when the uncured UV curable resin 5 is coated on the substrate 3, (A portion where the resin 5 is not coated) is prevented from being generated.

20, the uncured UV curable resin 5 coated on the substrate 3 is transferred onto the fine transfer pattern 9 formed on the mold 7, The flow amount of the uncured UV curable resin 5 at the time of transferring is reduced and generation of the residual film 11 and the like can be further suppressed and at the same time, The shape of the transfer pattern 9 becomes sharp and the shape accuracy is improved.

According to the transfer apparatus 1, ultraviolet rays are irradiated onto the ultraviolet curable resin 5 when the transfer roller 51 is moving forward and the transfer roller 51 is moving backward, The time for irradiating the ultraviolet rays to the cured resin 5 can be prolonged and the ultraviolet curing resin 5 can be prevented from being used without using the ultraviolet ray generator 53 with a large output (without increasing the size of the ultraviolet ray generator 53) So that it can be surely hardened.

In addition, according to the transfer apparatus 1, since the minute transfer pattern 9 of the mold 7 peeled from the ultraviolet curing resin 5 of the substrate 3 is transferred to the plasma unit 55 after the transfer, It is possible to prevent the deterioration of the mold releasing property of the mold 7 and the deterioration of the pattern of the pattern transferred to the resin 5 of the substrate 3.

Since the transfer unit 1 is configured to improve the wettability of the substrate 3 by the plasma unit 55, the hydrophilicity of the substrate 3 is increased, and the adhesion strength between the substrate 3 and the resin 5 .

Since the plasma unit 55 is supported by the coating portion 15 having a small installation volume without increasing the volume of the transfer unit 1 of the transfer unit 1, Thereby facilitating the placement.

According to the transfer apparatus 1, the mold 7 fed out from the far-end mold 43 provided in the far-end mold mounting section 45 can be prevented from colliding with the transfer rollers And the mold installation auxiliary portion 61 for guiding the winding roll 47 to the winding roll 47 provided on the winding roll setting portion 49 is provided on the mold 1 Can be done easily and quickly without requiring an expert.

In the above description, although one transfer pattern 9 is transferred to the resin 5 of one substrate 3 by transferring the transfer sheet onto one substrate 3 once, The plurality of transfer patterns 9 may be transferred to the resin 5 of one substrate 3 by transferring the transfer pattern 9 onto the substrate 3 once.

When a plurality of transfer patterns 9 are transferred to the resin 5 of one substrate 3, one substrate 3 is divided for each transfer region of one transfer pattern 9, Or a semi-finished product.

For example, in the case where a transfer pattern (for example, the same transfer pattern) 9 is transferred by one transfer onto each of the four portions in which the resin 5 of one substrate 3 is provided, (3) is divided into quadrants to obtain four products or semi-finished products.

In the above description, a portion of the mold 7 stretched between the far-end mold 43 and the take-up roll 47 is wound around the transfer roller 51 for transfer, but one mold (length 7 may be fixed to the outer periphery of the transfer roller 51 (integrally wound), and the transfer may be performed. In this case, the mold 7 is detachably (replaceably) attached to the transfer roller 51.

That is, the transfer roller 51 is pressed against the uncured resin 5 coated on the substrate 3 and the substrate 3 in the form of a thin film while the mold 7 is being pressed using the transfer roller 51, (7) from the resin (5) to the resin (5) during the transfer, by moving the mold (7) in the axial direction from the one end to the other end of the substrate Or may be configured to be peeled off. In this case, a thermoplastic resin may be used as the resin (5).

Further, the above-described method may be grasped as an invention of the method.

That is, a transfer method in which a fine transfer pattern 9 formed on the mold 7 is transferred to the resin 5 coated on the substrate 3, and the uncured resin 5 on the fine particles is transferred onto the inkjet head 31, As a transfer method in which the resin 5 is coated on the substrate 3 by discharging the resin 5 from the substrate 3.

A transfer method in which a fine transfer pattern 9 formed on a mold 7 is transferred to a resin 5 coated on a substrate 3 is carried out by transferring a resin 5 of the substrate 3 And a plasma irradiating step of irradiating the fine transfer pattern 9 of the peeled mold 7 with the plasma.

A transfer method in which a fine transfer pattern 9 formed on a mold 7 is transferred to a resin 5 coated on a substrate 3 is carried out so that a fabric mold 43, A mold clamping step of winding a mold 7 fed from a far-end mold 43 installed in the far-end mold installing step onto a transfer roller 51; The end of the mold 7 that is fed from the far-end mold 43 provided on the far-end mold mounting portion 45 and wound around the transfer roller 51 in the mold mounting process is wound around the take- When the mold winding process and the mold winding roll setting process are performed after the fabric mold 43 is installed in the fabric mold mounting process, The mold 7 fed out from the installed far-end mold 43 is fed out The rollers 51 are wound around the transfer rollers 51 in a state in which the fed portion is tightened while suppressing the occurrence of wrinkles in the wound rollers 49 It may be grasped as a transfer method having a mold guide process for guiding by using the auxiliary portion 61. [

In this case, most of the one end side in the longitudinal direction of the mold 7 is wound around the core material 63 of the far-end mold 43 before the fabric mold mounting step, the mold winding step and the mold winding roll mounting step are performed And a slight portion on the other end side in the longitudinal direction is extended and protruded from the far-end mold 43, and the tip end of the farthest portion of the extended portion is provided in the mold supporting portion 65. [ The mold setting auxiliary portion 61 includes a mold setting auxiliary member 61 movable with respect to the original mold mounting portion 45 and the transfer roller 51 and the winding roll setting portion 49. The mold setting auxiliary member 69 A mold supporting portion 65 is provided.

1 transfer device
3 substrate
5 resin
7 mold
9 Transcription pattern
11 Substrate
13 Substrate mounting part
15 porcelain
17 Mold mounting part
19 pressing portion
21 Resin hardening part
23 peeling section
25 substrate mounting body
27 Home
29 Air suction hole
31 inkjet head
31A First inkjet head
31B Second inkjet head
31C third ink jet head
31D Fourth inkjet head
33 Housing
35 resin release site
39 Memory
41 control unit
43 Fabric Mold
45 Fabric mold installation part
47 Winding Roll
49 Winding roll mounting part
51 transfer roller
53 Ultraviolet ray generator
55 Plasma unit
57 head
59 driver
61 Mold installation assistant
63 core material
65 mold support
67 core material
69 Mold mounting auxiliary member
71 base body
73 First support
75 second support
77 Third support
79 First shaft member
81 kanji
83 Separator winding roll
85 Guide rollers
87 Second shaft member
89 sheet feed roll
91 Transfer roller guide portion
93 inclined member
93A rear side inclined member
93B Front side inclined member
95 Substrate mounting body Joint part
97 Transfer roller jamming area
99 base area
101 tip portion
105 convex portion

Claims (16)

A transfer device for transferring a fine transfer pattern formed on a mold to a resin coated on a substrate,
A coating portion for coating the uncured resin with the resin on the substrate,
A substrate mounting part for positioning and integrally mounting the substrate,
A mold mounting portion for mounting the mold on the sheet,
A transfer roller for transferring the fine transfer pattern formed on the mold to the resin coated on the substrate,
A plasma unit for cleaning the mold by irradiating a plasma to the mold separated from the resin of the substrate after transferring the transfer pattern formed on the mold to the resin coated on the substrate,
Respectively,
The mold peeled off from the resin of the substrate is cleaned by irradiating the plasma with the plasma unit and then used again for transferring the transfer pattern
Wherein the transfer device is a transfer device. The method according to claim 1,
The plasma unit is configured to change the irradiation amount of the plasma to the mold according to the number of times the mold has performed the transfer
Wherein the transfer device is a transfer device. The method according to claim 1,
A fabric mold in which the mold is wound,
Further comprising a winding roll for winding the mold fed from the far-end mold,
Wherein the transfer roller is wound with the mold drawn between the fabric mold and the winding roll,
The pressing of the mold to the resin and the peeling of the mold from the resin are carried out by roll transfer in which the transfer roller is moved while the mold is pressed on the resin by using the transfer roller,
After the peeling of the mold from the resin is completed, the plasma unit is irradiated with plasma by irradiating plasma to the peeled mold
Wherein the transfer device is a transfer device. The method of claim 3,
When the cleaning of the mold by the plasma unit is insufficient, the winding roll takes up the part of the mold which has been peeled off from the resin, and a new part of the mold is fed out from the fabric mold
Wherein the transfer device is a transfer device. 5. The method of claim 4,
Further comprising a mold detecting section for detecting contamination of the mold which has been peeled off from the resin,
Whether or not the cleaning of the mold by the plasma unit is insufficient is determined in accordance with the detection result of the mold detection unit
Wherein the transfer device is a transfer device. A transfer device for transferring a fine transfer pattern formed on a mold to a resin coated on a substrate,
A coating portion for coating the uncured resin with the resin on the substrate,
A substrate mounting part for positioning and integrally mounting the substrate,
A mold mounting portion for mounting the mold on the sheet,
A transfer roller for transferring the fine transfer pattern formed on the mold to the resin coated on the substrate,
And a plasma unit for irradiating the plasma to the substrate
Respectively,
The plasma unit includes a head and a driving unit,
The coating unit and the plasma unit simultaneously move with respect to the substrate, and while the plasma is irradiated on the substrate in the plasma unit, the uncured coating is applied to the substrate by the coating unit
Wherein the transfer device is a transfer device. The method according to claim 6,
The plasma unit is configured to irradiate plasma to the mold which is peeled from the resin of the substrate after the transfer,
Wherein the driving unit of the plasma unit is supported by the coating unit,
The plasma is irradiated from the plasma unit driven by the driving unit of the plasma unit to the mold which is peeled from the substrate and the resin of the substrate after the transfer
Wherein the transfer device is a transfer device. 8. The method of claim 7,
The plasma is irradiated from the head of the plasma unit to the substrate and the mold peeled off from the resin of the substrate after the transfer
Wherein the transfer device is a transfer device. The method according to claim 6,
Wherein the head is rotatable with respect to the coated portion,
Wherein the posture of the head when irradiating the plasma from the head with the plasma is configured to rotate by a predetermined angle with respect to the posture of the head when the plasma is irradiated to the mold from the head
Wherein the transfer device is a transfer device. A transfer method for transferring a fine transfer pattern formed on a mold to a resin coated on a substrate,
A step of coating the substrate with the uncured resin on the substrate using a coating part;
A step of irradiating the plasma with a plasma unit on the substrate
Including,
The plasma unit includes a head and a driving unit,
The coating unit and the plasma unit move simultaneously with the substrate to irradiate the plasma of the substrate in the plasma irradiating step and to apply the uncured resin to the substrate in the coating step
≪ / RTI > A transfer device for transferring a fine transfer pattern formed on a mold to a resin coated on a substrate,
A coating portion for coating said substrate with said uncured resin that can be cured by electromagnetic waves of a predetermined wavelength,
A substrate mounting part for positioning and integrally mounting the substrate,
A mold mounting portion for mounting the mold on the sheet,
A plasma unit for irradiating the substrate with plasma,
The transfer of the mold to the resin is carried out by the roll transfer in which the mold is wound on the resin while the mold is being pressed against the resin and the transfer roller is moved to carry out the separation of the mold from the resin The transfer roller,
A resin hardening portion for irradiating the resin with electromagnetic waves of a predetermined wavelength in a state in which the mold is pressed onto the resin by the transfer roller,
And a control unit for controlling the resin hardening unit to irradiate the resin with the electromagnetic wave of the predetermined wavelength when the transfer roller is moving in the direction of pressing the mold against the resin in the roll transfer
Wherein the transferring device is a transferring device. 12. The method of claim 11,
The control unit controls the resin hardening unit to irradiate the resin with the electromagnetic wave of the predetermined wavelength even when the transfer roller is moving in the direction of peeling the mold from the resin in the roll transfer
Wherein the transfer device is a transfer device. 12. The method of claim 11,
The control unit controls the resin hardening unit to adjust the intensity of the electromagnetic wave of the predetermined wavelength irradiated to the resin in accordance with the amount of movement of the transfer roller in the roll transfer
Wherein the transfer device is a transfer device. 12. The method of claim 11,
Wherein the coating portion comprises a plurality of ink jet heads arranged alternately,
Curing the fine-patterned resin from the plurality of inkjet heads,
Wherein the transfer device is a transfer device. 12. The method of claim 11,
The control unit controls the coating unit so that the uncured resin coated on the substrate has a shape corresponding to a fine transfer pattern formed on the mold
Wherein the transfer device is a transfer device. 16. The method of claim 15,
Wherein the control unit controls the coating unit so as to adjust the coating amount of the uncured coating material in accordance with the transfer pattern formed on the mold so as to adjust the intensity of the electromagnetic wave of the predetermined wavelength in accordance with the coated resin amount To control the resin curing section
Wherein the transfer device is a transfer device.

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