KR20190027052A - Heater for substrate processing - Google Patents

Abstract

The present invention relates to a heater to process a substrate, capable of minimizing particles generated in a heat treatment space with a simple configuration. According to the present invention, the heater to process a substrate comprises: a base; a heating wire formed by screen-printing paste on the lower surface of the base; a heating wire installation unit formed in a groove shape, which communicates with an injection path to be recessed from the lower surface of the base, to secure the minimum cross section of the heating wire; a protective layer coated on the lower surface of the base to protect the heating wire; a separation protrusion protruding from the upper surface of the base to separate the lower surface of a substrate to be processed from the upper surface of the base; and a heat conductive gas supplied between the upper surface of the base and the substrate, which are separated from each other by the base separation protrusion, and conducting heat emitted from the heating wire to the substrate to be processed. Accordingly, provided are effects of reducing manufacturing costs, manufacturing a high-quality thin film, and increasing reliability in a heat treatment process.

Description

[0001] The present invention relates to a heater for substrate processing,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a heater for processing a substrate, and more particularly to a heater for processing a substrate used in a heat treatment process for heating a glass substrate used for manufacturing an OLED (Organic Light-Emitting Diode).

OLED (Organic Light-Emitting Diode) is an organic light-emitting diode (OLED), which is an organic semiconductor device that can be applied to displays and lighting by using self-emitting phenomenon. In the OLED, an organic semiconductor layer is laminated between two electrodes, a transparent electrode is injected into a hole, and a metal electrode is injected with electrons to form an exciton in the organic semiconductor layer. The excitons are made in a low energy state, And the light is emitted to the transparent electrode and the substrate.

Such an OLED is formed by including a thin film transistor formed on the surface of a glass substrate as an active element. Such a thin film transistor is generally formed by depositing an amorphous silicon thin film on the surface of a transparent glass substrate, crystallizing the amorphous silicon thin film into a crystalline silicon thin film, and injecting necessary dopant thereto to activate the amorphous silicon thin film.

At this time, the amorphous silicon thin film is formed on a glass substrate by a chemical vapor deposition method, a spin coating method, or the like, and is crystallized into a polycrystalline silicon thin film by a predetermined heat treatment step, and a necessary dopant is injected and activated .

The heat treatment apparatus used in the heat treatment process of the OLED has already been disclosed in Korean Patent No. 1015595, a heat treatment system for semiconductor devices, and the like.

In a conventional heat treatment apparatus, a resistance heater or a lamp heater is mainly used as a heating element.

However, the lamp heater is not only complicated in construction but also has a problem in that the manufacturing cost of the heat treatment apparatus increases accordingly.

In addition, when the resistance heater is exposed to the heat treatment space, particles are generated during the heat treatment process, and particles generated at this time have a problem of deteriorating the quality of the thin film.

Korean Patent No. 1015595 (Announced on Mar. 2011, 2011)

An object of the present invention is to provide a heater for processing a substrate that minimizes particles in a heat treatment process space with a simple configuration.

A heater for processing a substrate according to the present invention includes a base, a heat ray screen-printed on a lower surface of the base, a protective layer coated on a lower surface of the base to protect the heat ray, A thermal protrusion protruding from the upper surface of the base so that the lower surface of the substrate to be mounted and the upper surface of the base are spaced apart from each other and a thermal conductive gas between the upper surface of the base and the upper surface of the base, And a gas flow path through which the heat emitted from the heat ray is conducted to the substrate to be processed by the thermally conductive gas.

The base may be made of a light-transmissive material that changes the wavelength band of light emitted from the heat ray while transmitting the base.

The substrate to be processed is a glass substrate, and the base, the protective layer, and the spacing protrusions may be dielectric bodies.

Wherein the substrate processing heater is protruded from a rim portion of an upper surface of the base so that the substrate to be processed is aligned with an upper surface of the base and the substrate mounted on the upper surface of the base is separated from the upper surface of the base The alignment protrusions may be formed on the substrate.

The alignment protrusion may be made of a dielectric material.

Wherein the base is divided into a plurality of regions and the heating line is divided into the plurality of regions, the substrate processing heater includes a plurality of temperature sensors each detecting a temperature of the plurality of regions, a plurality A plurality of lead wires, a plurality of lead wires and a support plate for supporting the plurality of electrodes, a plurality of lead wires, a plurality of lead wires, a plurality of lead wires, a plurality of lead wires, And a seal that is disposed on a junction between the cover and the base.

The cover and the fastening screw for fastening the cover and the base may be made of a dielectric material.

The substrate processing heater may further include a heat ray attaching portion having a groove shape recessed into a lower surface of the base to secure a minimum cross-sectional area of the heat ray.

The heat ray installation part may include an injection path opened to the lower side of the base so that the paste can be injected to the inside of the base and an accommodation path in which the paste injected through the injection path is communicated with the injection path have.

The receiving passage may have a greater width than the injection passage.

The injection path may have an inclined surface which gradually expands toward the receiving passage.

Since the base for the substrate processing according to the present invention is disposed between the heat source and the substrate, it is possible to prevent the pattern shadows of the heat ray from being formed on the substrate due to the change of the wavelength range of the heat source and the diffusion of heat, It penetrates deeply and can be uniformly dried and heat-treated from the inside.

Further, since the heater for processing a substrate according to the present invention uses the paste applied to the base as a heat ray to unite the role of the heater and the window glass, it is possible to shorten and integrate the manufacturing process, secure the inner space of the heat treatment equipment, There is an effect.

Further, the heater for treating a substrate according to the present invention can prevent impurities due to heat ray oxidation and baking out, thereby manufacturing a high-quality thin film and improving the reliability of a heat treatment process.

1 is a cross-sectional view showing a heater for processing a substrate according to the first embodiment.
2 is an exploded perspective view showing a heater for substrate processing according to the first embodiment.
3 is a bottom perspective view showing a base on which a hot wire of the heater for substrate processing according to the first embodiment is installed.
4 is a cross-sectional view schematically showing a part of a heater for substrate processing according to the second embodiment.
5 is an enlarged cross-sectional view showing a heat wire installing portion of the heater for substrate processing according to the second embodiment.
Fig. 6 is a cross-sectional view showing a heat wire attaching portion of the heater for substrate processing according to the third embodiment.
7 is a cross-sectional view schematically showing a part of a heater for substrate processing according to the fourth embodiment.

The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms and the inventor may appropriately define the concept of the term in order to best describe its invention It should be construed as meaning and concept consistent with the technical idea of the present invention. Therefore, the embodiments described in the present specification and the configurations shown in the drawings are only examples of the present invention, and are not intended to represent all of the technical ideas of the present invention, so that various equivalents and modifications may be made thereto .

Hereinafter, a heater for processing a substrate according to the present invention will be described with reference to the accompanying drawings.

2 is an exploded perspective view showing a heater for processing a substrate according to the first embodiment. FIG. 3 is an exploded perspective view of the substrate processing heater according to the first embodiment. FIG. And FIG. 5 is a bottom perspective view showing a base provided with a hot wire of FIG.

1 to 3, the heater 100 for processing a substrate according to the first embodiment can be used for heat-treating a glass substrate 10 used for manufacturing an OLED.

The heater 100 for processing a substrate according to the first embodiment may include a base 110. The base 110 serves as a base for installing the hot wire 111, which is an electric resistance heating body.

Here, it is preferable that the base 110 is made of the same material as the glass substrate 10. Since the base 110 is made of the same material as the glass substrate 10, it can maintain a firm bonding state with the heat ray 111 and can change the wavelength range of the light emitted from the heat ray 111, It is possible to prevent shadows from being generated on the substrate 10 in accordance with the pattern of the heat ray 111.

If the base 110 is made of a material different from that of the glass substrate 10, particles may be generated from the base 110 due to the heat of the heat ray 111 during processing of the glass substrate 10, The generated particles are deposited on the glass substrate 10 or deposited on the inner wall of a chamber (not shown) for processing the glass substrate 10 to form a thin film of the glass substrate 10 during the heat treatment process of the glass substrate 10 Organic thin film, silicon thin film, and the like).

Therefore, in order to prevent particles from being generated during the heat treatment process of the glass substrate 10, the base 110 may be made of the same material as the glass substrate 10 such as glass, ceramic, Cera Glass, It is preferable that it is made of a dielectric material of a similar material.

As described above, the substrate processing heater 100 according to the first embodiment can prevent the generation of particles during the heat treatment process of the glass substrate 10, and can secure the reliability of the heat treatment process of the glass substrate 10.

On the other hand, the heat ray 111 can be formed on the lower surface of the base 110 by using a screen printing technique, a paste having resistance according to the capacity calculation set at the time of designing the heater. When the heat ray 111 is formed on the base 110 by the screen printing technique using the paste, the thickness, width, and spacing of the heat ray 111 can be freely designed. As the material of the paste, conductors such as gold, silver, platinum, tungsten and the like can be used.

A protective layer 130 for protecting the heat ray 111 may be formed on the lower surface of the base 110 on which the heat ray 111 is formed. The protective layer 130 is preferably made of a dielectric material such as glass, ceramics, ceramics or the like as well as a dielectric material which is the same or similar material to the glass substrate 10 as the base 110 for installing the heat ray 111 Do.

The heater 100 for processing a substrate according to the first embodiment supports the glass substrate 10 on the upper surface of the base 110, that is, the opposite surface of the lower surface of the base 110 on which the heat ray 111 is installed, The substrate 10 can be heat-treated.

When electric power is supplied to the heat ray 111, the heat ray 111 can generate heat and emit heat due to heat generation. The heater 100 for processing a substrate according to the first embodiment does not support the glass substrate 10 on the lower surface of the base 110 on which the heat ray 111 is mounted but also on the upper surface of the glass substrate 10 The light emitted from the heat ray 111 can be uniformly expanded while reaching the glass substrate 10 while being transmitted through the base 110 while the heat ray 111 is heated. Since the light emitted from the heat ray 111 while the heat ray 111 generates heat is transmitted through the base 110 and its wavelength band is changed to far infrared rays or near infrared rays, the light is transmitted through the base 110 smoothly, It is possible to perform heat treatment from the inside of the substrate.

At this time, when the glass substrate 10 is supported on the upper surface of the base 110, electrification occurs between the upper surface of the base 110 and the lower surface of the glass substrate 10 facing the base 110 And it may be difficult to separate the glass substrate 10 from the base 110.

The heater 100 for processing a substrate according to the first embodiment further includes a protrusion 113 protruding from the upper surface of the base 110 to separate the glass substrate 10 from the upper surface of the base 110 . Of course, the material of the spacing protrusion 113 is also preferably made of a dielectric material which is the same or similar to the material of the glass substrate 10, like the base 110 and the protective layer 130.

The glass substrate 10 is separated from the upper surface of the base 110 by the spacing protrusions 113 so that the heat emitted from the heat ray 111 can be smoothly conducted to the glass substrate 10, The heater 100 for processing a substrate according to the embodiment can supply the thermally conductive gas G to a space where the base 110 and the glass substrate 10 are spaced apart. That is, the heater 100 for processing a substrate according to the first embodiment may include a gas flow path 150 that penetrates the base 110 and opens to the upper surface of the base 110. As the thermal conduction gas (G), an inert gas such as helium, nitrogen or the like can be used.

In addition, alignment protrusions 115 may be formed on the upper surface of the base 110. The alignment protrusions 115 may protrude from the rim of the base 110. The alignment protrusion 115 guides the glass substrate 10 so that the glass substrate 10 loaded on the upper surface of the base 110 can be easily aligned on the upper surface of the base 110. The alignment protrusion 115 also prevents the glass substrate 10, which is aligned on the upper surface of the base 110, from being detached from the upper surface of the base 110 during the heat treatment process. Of course, it is preferable that the material of the alignment protrusion 115 is also made of a dielectric material which is the same or similar material as the glass substrate 10, like the base 110, the protection layer 130, and the separation protrusion 113.

A plurality of regions, for example, a central portion of the base 110 and a peripheral portion of the base 110 may be formed as separate regions in the base 110 in order to uniformly heat the entire surface of the glass substrate 10 And the heating lines 111 can be separately controlled for each area. Accordingly, the heat lines 111 can be separated for each region, and a plurality of electrodes 170 for applying a separate power source to the separated heat lines 111 can be connected. The plurality of electrodes 170 may be exposed to the lower surface of the base 110.

In addition, a temperature sensor (not shown) may be connected to each region for measuring the temperature of each of the plurality of divided regions and separately controlling the power applied to the heating line 111 according to the temperature of each region. A plurality of lead wires 190 connected to the base 110 may be exposed to the lower surface of the base 110.

Since the plurality of electrodes 170 and the plurality of lead wires 190 are exposed on the lower surface of the base 110 as described above, the heater 100 for processing a substrate according to the first embodiment includes a plurality of electrodes 170, And may further include a support plate 210 for stably supporting the lead wire 190. Of course, the support plate 210 may be provided with a spacing member 211 for maintaining a gap between the base 110 and the support plate 210.

In order to prevent the plurality of electrodes 170, the plurality of lead wires 170 and the support plate 210 from being exposed to the process space inside the chamber (not shown), a cover 230 is coupled . Of course, it is preferable that the material of the cover 230 is also made of a dielectric material which is the same or similar to the material of the glass substrate 10 as the base 110, the protective layer 130, the spacing protrusions 113, and the alignment protrusions 115 .

The fastening screw 250 for fastening the cover 230 to the base 110 may also be made of a dielectric material which is the same or similar material as the glass substrate 10. The inside of the cover 230 and the base 110 A seal 270 may be disposed at a junction between the cover 230 and the base 110 to maintain the airtightness of the cover 230 and the base 110.

Hereinafter, the operation of the heater for substrate processing according to the first embodiment will be described.

First, the heater 100 for processing a substrate according to the first embodiment may be disposed inside a chamber (not shown) in which a vacuum atmosphere is formed to heat the glass substrate 10. Of course, a gate valve (not shown) for loading / unloading the glass substrate 10 may be installed on one side wall of the chamber (not shown).

The heater 100 for processing a substrate according to the first embodiment is configured such that the lower surface of the base 110 provided with the heat ray 111 faces downward and the upper surface of the base 110 for supporting the glass substrate 10 faces upward As shown in FIG.

In this state, the glass substrate 10 is loaded into the chamber (not shown) in a state where the heater 100 for processing a substrate according to the first embodiment is disposed inside the chamber (not shown). The glass substrate 10 may be seated on the upper surface of the base 110.

At this time, the alignment protrusions 115 guide the glass substrate 10 so that the glass substrate 10 is aligned on the upper surface of the base 110. The spacing protrusion 113 maintains the state that the glass substrate 10 is spaced apart from the upper surface of the base 110 so that the upper surface of the base 110 and the glass substrate 10 are in surface contact with each other to prevent electrification .

When power is applied to the heating wire 111 in a state where the glass substrate 10 is mounted on the upper surface of the base 110 as described above, the heating wire 111 generates heat by electric resistance, .

The light emitted from the heating line 111 passes through the base 110 and reaches the glass substrate 10. The light is changed into far infrared rays or near infrared rays while changing its wavelength band while passing through the base 110, So that drying and heat treatment can be performed from the inside. The far-infrared rays transmit thermal energy to the glass substrate 10 through the base 110. At this time, since the far-infrared rays are uniformly dispersed while being transmitted through the base 110, a uniform temperature is distributed on the base 110, and a shadow according to the pattern of the heat rays 111 is not generated.

At the same time, a thermally conductive gas G can be supplied between the glass substrate 10 and the upper surface of the base 110. The thermal conduction gas G transfers heat from the upper surface of the base 110 to the glass substrate 10. Thus, the thermal conduction gas G prevents the loss of thermal energy that can be lost as the glass substrate 10 is spaced from the upper surface of the base 110.

On the other hand, a temperature sensor (not shown) for individual temperature control for each region detects the temperature of each region. A control unit (not shown) controls a power supplied to the heating wire 111 according to the temperature of the base 110 detected by a temperature sensor (not shown).

Therefore, the temperature of the plurality of heat lines 111 can be individually controlled and heated to a uniform temperature with respect to the entire surface of the glass substrate 10.

As described above, the heater 100 according to the first embodiment can heat the glass substrate 10 by the heat generated from the heat ray 111 formed in paste on the base 110, so that the scale of the equipment can be simplified. In the heater 100 according to the first embodiment of the present invention, the light emitted from the heat ray 111 is transmitted through the base 110, the wavelength band thereof is changed, and the heat transfer is performed between the glass substrate 10 and the upper surface of the base 110. [ It is possible to smoothly transfer heat energy to the glass substrate 10 by supplying the gas G. In the heater 100 for processing a substrate according to the first embodiment, since the components attached to the base 110 and the base 110 are made of a dielectric material which is the same or similar material as the glass substrate 10, It is possible to prevent particles from being generated during the heat treatment process of the substrate 10, thereby securing the reliability of the heat treatment process.

Hereinafter, a heater for processing a substrate according to another embodiment will be described. In the following description, components similar to those of the substrate processing heater according to the first embodiment described above are denoted by the same reference numerals, and detailed description thereof will be omitted. Therefore, elements omitted from the detailed description in the following description should be understood with reference to the above description.

The heater 100 for processing a substrate as described above needs to form the heat lines 111 with a minimum distance in order to maximize the heat generating efficiency within the limited area of the base 110. [ However, the minimum cross-sectional area of the heat ray 111 that generates heat by the electric resistance is also limited.

Therefore, the heater 100 for processing a substrate according to the second embodiment may further include a hot wire attaching portion formed on a lower surface of the base 110 to secure a minimum cross-sectional area of the hot wire 111. [

FIG. 4 is a cross-sectional view schematically showing a part of the heater for substrate processing according to the second embodiment, and FIG. 5 is an enlarged cross-sectional view showing a heat line attachment part of the heater for substrate processing according to the second embodiment.

Referring to FIGS. 4 and 5, the heat-radiating portion may be formed in a groove shape that is recessed from the lower surface of the base 110. The hot wire installation part may include an injection path 111a through which the paste is injected and a receiving path 111b through which the paste injected through the injection path 111a is communicated with the injection path 111a. The accommodation passage 111b may have a width larger than the injection passage 111a.

The heat-radiating part is provided to overcome a limited installation area of the heat ray 111 exposed to the outside of the lower surface of the base 110 and to secure a minimum cross-sectional area of the heat ray 111 for electric resistance inside the base 110 do. Therefore, the heat ray 111 can be densely installed within the limited area of the base 110.

At this time, the cross-sectional area of the heat ray 111 can be designed differently from the area corresponding to the rim of the base 110 and the area corresponding to the center of the base 110. [

That is, in FIG. 4, the cross-sectional area of the heat ray 111 in the region corresponding to the central portion of the base 110 is larger than the cross-sectional area of the heat ray 111 in the region corresponding to the rim of the base 110 However, according to the result of the temperature distribution test for the entire surface of the base 110, the heat ray 111 in the region corresponding to the rim of the base 110, rather than the cross-sectional area of the heat ray 111 in the region corresponding to the central portion of the base 110 111 can be designed to be larger.

Fig. 6 is a cross-sectional view showing a heat wire attaching portion of the heater for substrate processing according to the third embodiment.

Referring to Fig. 6, the ramp 111c may have an inclined surface 111e that gradually expands toward the receiving passage 111d. This inclined surface 111e allows the paste to flow smoothly into the receiving space 111d having a larger width than the inclined path 111c and ensures a larger cross sectional area of the heat ray 111. [

7 is a cross-sectional view schematically showing a part of a heater for substrate processing according to the fourth embodiment.

Referring to FIG. 7, the heat ray 111 is installed in the heat ray installation portion to secure a cross-sectional area. In order to secure a larger amount of heat, the heat ray 111 is installed between the heat rays 111 installed in the heat ray installation portion, The heat ray 111a can be added by applying an additional paste to the paste.

Therefore, the heater for treating a substrate according to the fourth embodiment can secure a maximum amount of heat for processing the substrate 10 by securing the heat ray 111, 111a having the maximum capacity within a limited area of the base 110. [

The embodiments of the present invention described above and shown in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of the present invention as long as they are obvious to those skilled in the art.

10: glass substrate
100: Heater for substrate processing
110: Base
111: Heat line
113:
115: guide projection
130: Protective layer
150: gas channel
170: electrode
190: Lead wire
210: Support plate
211:
230: cover
250: Tightening screw
270: sealing

Claims (11)

Base;
A hot wire on which a conductive paste is screen printed on the lower surface of the base;
A protective layer applied to the lower surface of the base to protect the heat rays;
A protrusion protruding from the upper surface of the base so that the lower surface of the substrate to be processed, which is seated on the upper surface of the base, is spaced from the upper surface of the base;
And a gas flow passage for supplying a heat conduction gas between the upper surface of the base and the substrate spaced apart from each other by the base spaced projection to conduct heat emitted from the heat conduction to the substrate to be processed by the heat conduction gas And a heater for heating the substrate. The method according to claim 1,
Wherein the base is made of a light-transmissive material that changes the wavelength band while the light emitted from the heat ray is transmitted through the base. The method according to claim 1,
Wherein the substrate to be processed is a glass substrate,
Wherein the base, the protective layer, and the spacing protrusions are made of a dielectric material. The method of claim 3,
An alignment protrusion protruding from a rim of the upper surface of the base to align the substrate to be processed on the upper surface of the base and prevent the substrate mounted on the upper surface of the base from being detached from the upper surface of the base, And a heater for heating the substrate. 5. The method of claim 4,
Wherein the alignment protrusions are made of a dielectric material. The method according to claim 1,
Wherein the base is divided into a plurality of regions, the heat lines are divided into the plurality of regions,
A plurality of temperature sensors each detecting a temperature of the plurality of regions;
A plurality of lead wires drawn out from the plurality of temperature sensors;
A plurality of electrodes respectively drawn out from the plurality of heat lines so as to individually control the temperatures of the plurality of regions;
A supporting plate for supporting the plurality of lead wires and the plurality of electrodes;
A cover fastened to a lower surface of the base so that the plurality of lead wires, the plurality of electrodes, and the support plate are not exposed to the outside;
And a seal disposed on a junction of the cover and the base. The method according to claim 6,
Wherein the cover and the fastening screw for fastening the cover and the base are made of a dielectric material. The method according to claim 1,
Further comprising a heat-radiating portion for forming a recess in the lower surface of the base to secure a minimum cross-sectional area of the heat ray. 9. The method of claim 8,
The heat-
An injection path opened to the lower side of the base so that the paste can be injected into the base;
And a receiving space for receiving the paste injected through the injection path in communication with the injection path. 10. The method of claim 9,
Wherein the receiving passage has a larger width than the injection path. 10. The method of claim 9,
Wherein the injection path has an inclined surface that gradually expands toward the receiving passage.

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