KR20190025145A - The metal vapour deposition of plastic card manufacturing methods and metal vacuum deposition plating plastic card - Google Patents

The metal vapour deposition of plastic card manufacturing methods and metal vacuum deposition plating plastic card Download PDF

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KR20190025145A
KR20190025145A KR1020170110166A KR20170110166A KR20190025145A KR 20190025145 A KR20190025145 A KR 20190025145A KR 1020170110166 A KR1020170110166 A KR 1020170110166A KR 20170110166 A KR20170110166 A KR 20170110166A KR 20190025145 A KR20190025145 A KR 20190025145A
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metal
sheet
printed sheet
plastic card
copper plate
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KR102029809B1 (en
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남기성
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코나엠 주식회사
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41CPROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00Forme preparation
    • B41C1/02Engraving; Heads therefor
    • B41C1/04Engraving; Heads therefor using heads controlled by an electric information signal
    • B41C1/05Heat-generating engraving heads, e.g. laser beam, electron beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41CPROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00Forme preparation
    • B41C1/06Transferring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/38Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for embossing, e.g. for making matrices for stereotypes
    • B41J3/385Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for embossing, e.g. for making matrices for stereotypes of plates, e.g. metal plates, plastic cards
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/20Metallic material, boron or silicon on organic substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/28Vacuum evaporation by wave energy or particle radiation
    • C23C14/30Vacuum evaporation by wave energy or particle radiation by electron bombardment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58After-treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/02Local etching
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
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Abstract

The present invention relates to a method to manufacture a plastic card having metal vacuum-deposited thereon, capable of realizing a high quality vacuum deposition plastic card, and a plastic card thereof. According to the present invention, the method to manufacture a plastic card having metal vacuum-deposited thereon comprises: a step of making a copper plate having a fine corrugated pattern (11) formed thereon; a step of completing an upper printing sheet (21); a first deposition step of forming a metal thin film (21b) of a surface of the upper printing sheet (21); a second deposition step of forming an anti-finger water repellent coating layer (21c) of the upper printing sheet (21); a laminating step; and a step of performing cutting along the outer appearance of a card.

Description

금속이 진공증착된 플라스틱카드의 제조방법 및 금속이 진공증착된 플라스틱카드{The metal vapour deposition of plastic card manufacturing methods and metal vacuum deposition plating plastic card}BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method for manufacturing a plastic card having a metal vacuum deposited thereon,

본 발명은 금속이 진공증착된 플라스틱카드의 제조방법 및 금속이 진공증착된 플라스틱카드에 관한 것으로서, 더욱 상세하게는 요철무늬가 형성된 동판(銅版) 위에 합성수지시트를 올려놓고 가열하면서 압력을 가하여 동판의 요철무늬가 전사(全寫)되면 금속을 진공증착하여 금속의 질감을 느낄 수 있는 금속 특유의 무늬를 재현할 수 있는 고품질의 진공증착 플라스틱카드를 구현할 수 있도록 한 발명에 관한 것이다.
BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of manufacturing a plastic card on which a metal is vacuum-deposited and a plastic card on which a metal is vacuum-deposited. More specifically, (EN) Provided is a high - quality vacuum evaporated plastic card which can reproduce a metal - specific pattern that can feel the texture of a metal by vacuum depositing a metal when the uneven pattern is transferred (full).

일반적으로 플라스틱카드는 신용카드(credit card), 현금카드(cash card), 교통카드와 같이 현금을 대신하여 사용할 수 있고, 대용량의 정보를 수록할 수 있는 집적회로 칩들이 내장된 카드는 병원의 진료카드, 각종 멤버카드 등으로 활용되는 것으로서 현대에는 다양한 용도의 플라스틱카드들이 널리 사용된다.Generally, plastic cards can be used in place of cash, such as credit cards, cash cards, and transportation cards, and cards with integrated circuit chips that can store large amounts of information can be used for hospital care Cards, and various member cards, and plastic cards for various purposes are widely used in modern times.

이중에서도 VIP 고객을 위하여 차별화 된 금속재질의 신용카드가 개발되어 있고, 금속카드는 금속광택이 표출되는 고품위의 신용카드를 구현하여 특수 고객들에 제공된다.Among them, differentiated metal credit cards have been developed for VIP customers, and metal cards are provided to special customers by implementing a high-quality credit card that displays metallic luster.

그러나, 종래의 금속카드들은 얇은 박막의 금속시트를 사용하거나 금속분말을 얇게 코팅하여 제작하는 것이므로 금속판재에 형성된 요철무늬와 같이 금속의 질감을 느낄 수 있는 고유의 무늬를 재현하기 어려웠다.However, since conventional metal cards are manufactured by using a thin sheet of metal sheet or thinly coating the metal powder, it is difficult to reproduce a unique pattern that can feel the texture of metal like a concave / convex pattern formed on a metal plate.

종래에는 등록실용공보 제20-0382725호 "금속박막 플라스틱카드"(선행기술1) 및 공개특허공보 제10-2017-0061572호 "안테나를 내장한 비접촉식 금속카드"(선행기술2)가 제안된 바 있다.In the related art, a "metal thin film plastic card" (prior art 1) and a non-contact type metal card with an antenna incorporated therein (Prior art 2) have been proposed in the registration room publication No. 20-0382725 and the patent document 10-2017-0061572 have.

상기 선행기술1은 합성수지 코어시트의 상,하부에는 코어시트 보다 작은 크기의 금속박막이 부착되어 둘레에는 여백이 형성되고, 코어시트의 상부면 여백에는 안테나코일이 둘레를 따라 설치되어 코어시트 내측에 고정된 IC칩과 연결되며, 코어시트의 상부에는 인쇄층이 형성된 상부 코팅지가 부착되고, 코어시트의 하부면에는 인쇄층이 형성된 하부 코팅지가 부착되어 차례로 적층된 상태에서 열 접착됨을 특징으로 하는 금속박막 플라스틱카드이다.In the prior art 1 , a metal thin film having a size smaller than that of the core sheet is attached to upper and lower portions of the synthetic resin core sheet, margins are formed around the core sheet, antenna coils are installed along the periphery of the upper surface of the core sheet, Wherein a top coated paper having a print layer formed thereon is attached to an upper portion of the core sheet and a lower coated paper having a print layer formed on a lower surface of the core sheet is thermally adhered in a stacked state, It is a thin plastic card.

상기 선행기술2는 "금속판재로 이루어진 본체의 소정 영역에 형성된 제1홀 및 본체와 제1홀의 일측면 사이를 절개하여 형성된 제1슬롯을 구비한 제1바디시트; 상기 제1바디시트와 동일한 크기를 갖는 제2바디시트; 상기 제1,2바디시트들 사이에 배치되며, 안테나가 탑재된 안테나 인레이; 상기 제1바디시트의 제1홀에 안착된 카드용 IC 칩을 구비하고, 상기 제1바디 시트의 제1홀은 안테나의 내부 영역에 위치하도록 구성된 것을 특징으로 하는 안테나를 내장한 비접촉식 금속 카드"이다.In the prior art 2 , a first body sheet having a first hole formed in a predetermined region of a body made of a metal plate and a first slot formed by cutting between a body and one side of the first hole, A second body sheet having a size larger than that of the first body sheet, an antenna inlay on which the antenna is mounted, disposed between the first and second body sheets, and a card IC chip mounted on the first hole of the first body sheet, 1 " is a non-contact type metal card incorporating an antenna, characterized in that the first hole of the body sheet is positioned in the inner region of the antenna.

그러나, 상기 선행기술1은 0.02∼0.1mm 정도의 두께를 갖는 얇은 호일 형태의 금속박막(薄膜)을 형성한 기술이고, 상기 선행기술2는 금속평판으로 카드본체를 구성하되 본체의 슬롯에 일측이 개방된 홀을 형성하여 안테나 또는 단말기로부터 방사된 자기장에 의해 금속평판에 와전류(Eddy current)가 발생되는 것을 방지할 수 있도록 한 기술이므로, 본원발명과 같이, 동판(銅版)의 요철무늬를 합성수지시트에 전사(全寫)한 후 진공증착하여 금속의 질감을 느낄 수 있는 금속 특유의 무늬를 재현할 수 있도록 한 기술을 찾아볼 수 없었다.
However, in the prior art 1 , a thin foil-shaped metal thin film having a thickness of about 0.02 to 0.1 mm is formed. In the prior art 2 , a metal plate is used as a card body, It is possible to prevent eddy currents from being generated on the metal plate due to the magnetic field radiated from the antenna or the terminal by forming the open hole. Therefore, as in the present invention , the protrusion pattern of the copper plate And there was no technique to reproduce the pattern unique to the metal, which can feel the texture of the metal by vacuum deposition after the transfer.

본 발명은 상기한 문제점을 감안하여 창안한 것으로서, 그 목적은 동판(銅版)의 요철무늬를 합성수지시트에 전사(全寫)하고, 진공상태에서 금속 증착하여 금속 특유의 질감 무늬를 재현할 수 있는 금속이 진공증착된 플라스틱카드의 제조방법을 제공함에 있는 것이다.
SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a method of manufacturing a metal plate which can reproduce a texture pattern unique to a metal by transferring a protruding pattern of a copper plate onto a synthetic resin sheet, And a method of manufacturing a plastic card in which a metal is vacuum-deposited.

상기한 목적을 달성하기 위한 본 발명의 특징은, 금속판재의 표면을 CNC가공이나 레이저가공을 실시하여 미세 요철무늬(11)가 형성된 동판(銅版)을 제작하는 단계; 상기 동판(10) 위에 합성수지시트를 올려놓고, 가열 및 가압하여 동판(10)의 요철무늬(11)가 합성수지시트에 전사되도록 하여 상부인쇄시트(21)를 완성하는 단계; 요철무늬(21a)가 전사된 상부인쇄시트(21)를 진공챔버(30)의 내부에 넣고, 타겟(31)에 놓여진 금속화합물(32)에 전자빔(E-beam)을 조사하여 금속화합물(32) 표면을 가속전자로 가열하고 기화시켜 상부인쇄시트(21)의 표면에 금속박막(21b)이 형성되도록 하는 1차 증착단계; 타겟(31)에 놓여진 불소수지화합물에 전자빔을 조사(照射)하여 표면을 가열하고 기화시켜 상부인쇄시트(21)의 표면에 AF(Anti-Finger) 발수코팅층(21c)을 형성하는 2차 증착단계; 1,2차 증착작업이 완료된 상부인쇄시트(21)의 하부에 합성수지로 이루어진 코어시트(22) 및 하부인쇄시트(23)를 차례로 적층하고, 가열 및 가압하여 라미네이팅(laminating)하는 단계; 열 접착이 완료된 시트들을 냉각시키고, 카드의 외형을 따라 절단하는 단계로 이루어진 것을 특징으로 하는 금속이 진공증착된 플라스틱카드의 제조방법에 의하여 달성될 수 있는 것이다.
According to an aspect of the present invention, there is provided a method of manufacturing a copper plate, comprising the steps of: CNC machining or laser machining a surface of a metal plate to form a copper plate on which fine concave-convex patterns are formed; Completing the upper printed sheet 21 by placing a synthetic resin sheet on the copper plate 10 and heating and pressurizing the uneven pattern 11 to transfer the uneven pattern 11 of the copper plate 10 to the synthetic resin sheet; The upper printed sheet 21 to which the uneven pattern 21a has been transferred is placed in the vacuum chamber 30 and an electron beam 32 is irradiated to the metal compound 32 placed on the target 31 to form the metal compound 32 ) Surface with an accelerating electron so as to form a thin metal film (21b) on the surface of the upper printed sheet (21); A secondary deposition step of heating and vaporizing the surface of the fluororesin compound placed on the target 31 to form an AF (Anti-Finger) water-repellent coating layer 21c on the surface of the upper printed sheet 21 ; Laminating a core sheet (22) and a lower printed sheet (23), which are made of synthetic resin, in order on the lower part of the upper printed sheet (21) after the first and second deposition processes have been completed, and heating and pressing them; And cooling the sheets having been subjected to the heat adhesion and cutting the sheet along the outer shape of the card. The metal can be achieved by a method of manufacturing a vacuum-deposited plastic card.

이상에서 상술한 제조과정 의하여 완성된 진공증착 플라스틱카드(20)는, 동판(10)의 요철무늬(11)가 합성수지시트에 전사(全寫)되어 정밀한 무늬 및 문양이 형성되고, 진공증착에 의하여 금속의 질감을 느낄 수 있는 금속 특유의 무늬를 재현할 수 있는 것이므로 상부인쇄시트(21)가 합성수지로 제작되었다 하더라고 금속판재를 직접 가공한 것과 같은 효과를 얻을 수 있을 뿐 아니라 동판(10)의 무늬가 전사된 상부인쇄시트(21)의 요철무늬(21a)는 보다 입체적이면서도 금속특유의 질감을 잘 표출하면서도 2단계 증착단계에 의한 발수코팅층(21c)은 산화물피막에 의하여 지문(指紋)이 남지 않도록 매끈하게 코팅되어 보는 각도에 따라서 다양한 빛깔과 색상을 나타낼 수 있는 것으로서 장기간 사용하더라도 금속박막이 벗겨지지 않고, 먼지가 달라붙지 않아 전체적인 플라스틱카드(20)의 내구성을 높여줄 수 있고, 고품위를 느낄 수 있는 고품질의 진공증착 플라스틱카드를 제공할 수 있는 등의 이점이 있다.
The vacuum vapor deposited plastic card 20 completed by the above-described manufacturing process has the concavo-convex pattern 11 of the copper plate 10 transferred to the synthetic resin sheet to form precise patterns and patterns, It is possible to reproduce the pattern unique to the metal which can feel the texture of the metal, so that the same effect as that of directly machining the metal plate can be obtained even though the upper printed sheet 21 is made of synthetic resin, The concave-convex pattern 21a of the upper printed sheet 21 transferred thereon is more stereoscopic and exhibits a texture unique to the metal, while the water-repellent coating layer 21c formed by the two-step deposition step is formed so that the fingerprint is not left by the oxide film It is able to display various colors and colors according to the viewing angle, and even if it is used for a long time, the metal thin film is not peeled off, It is possible to provide a high-quality vacuum-deposited plastic card which can enhance the durability of the plastic card 20 and can feel high-quality.

도 1은 본 발명에 의한 금속이 진공증착된 플라스틱카드의 실물사진.
도 2a ∼ 도 2d는 본 발명에 의한 금속이 진공증착된 플라스틱카드의 제조과정을 순차적으로 나열한 제조공정 사시도,
도 3a ∼ 도 3h는 본 발명에 의한 금속이 진공증착된 플라스틱카드의 제조과정을 순차적으로 나열한 제조공정 단면도.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a photograph of a plastic card in which a metal is vacuum-deposited according to the present invention. FIG.
FIGS. 2A to 2D are perspective views illustrating a process of manufacturing a plastic card in which a metal is vacuum-deposited according to the present invention,
3A to 3H are cross-sectional views illustrating a manufacturing process of a plastic card in which a metal is vacuum-deposited according to the present invention.

이하, 상기한 목적을 달성하기 위한 바람직한 실시예를 첨부된 도면에 의하여 상세히 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

실시예Example

금속판재의 표면을 CNC가공이나 레이저가공을 실시하여 미세 요철무늬(11)가 형성된 동판(銅版)을 제작하는 단계를 실시하였다.The surface of the metal plate was subjected to a step of CNC machining or laser machining to produce a copper plate on which the fine uneven patterns 11 were formed.

상기 단계에서 제작되는 요철무늬(11)는 금속이 갖는 특유의 질감을 느낄 수 있도록 가공되어 고품위를 느낄 수 있도록 제작된다.The concavo-convex pattern 11 produced in the above step is fabricated so that it can feel the unique texture of the metal and feel high-quality.

경우에 따라서는 금속판재에 그림이나 문자를 필름으로 현상하고 화학적 방법으로 부식하는 에칭(etching) 가공방법을 사용할 수 있고, 에칭가공은 금속 특유의 무늬가 정밀하게 형성되면서도 세밀한 그림이나 문자를 형성할 수도 있다.In some cases, it is possible to use an etching processing method of developing a picture or a letter on a metal plate by a film and corroding it by a chemical method, and the etching processing can form a fine picture or character while precisely forming a metal- It is possible.

이어서, 도 2a와 도 3a 및 도 3b에서 도시한 바와 같이, 상기 동판(10) 위에 합성수지시트를 올려놓고, 가열 및 가압하여 동판(10)의 요철무늬(11)가 합성수지시트에 전사되도록 하여 상부인쇄시트(21)를 완성하는 단계를 실시하였다.Next, as shown in Figs. 2A and 3A and 3B, a synthetic resin sheet is placed on the copper plate 10, and the convex-concave pattern 11 of the copper plate 10 is transferred to the synthetic resin sheet by heating and pressing, A step of completing the printing sheet 21 was carried out.

이어서, 도 2b와 도 3c에서 도시한 바와 같이, 요철무늬(21a)가 전사된 상부인쇄시트(21)를 진공챔버(30)의 내부에 넣고, 타겟(31)에 놓여진 금속화합물(32)에 전자빔(E-beam)을 조사하여 금속화합물(32)의 표면을 가속전자로 가열하고 기화시켜 도 3d에서 도시한 바와 같이, 상부인쇄시트(21)의 표면에 금속박막(21b)을 형성하는 1차 증착단계를 실시하였다.Subsequently, as shown in Figs. 2B and 3C, the upper printed sheet 21 to which the uneven pattern 21a is transferred is placed in the vacuum chamber 30, and the metal compound 32 placed on the target 31 As shown in FIG. 3D, the surface of the metal compound 32 is heated with accelerating electrons by irradiating an electron beam (E-beam) to vaporize the surface of the metal compound 32 to form a metal thin film 21b on the surface of the upper printed sheet 21 The deposition step was performed.

상기 단계에 사용된 금속화합물(32)은 주석(Sn)을 주성분으로 하는 화합물로 이-빔발생기로 전자빔(E-beam)을 조사(照射)하여 주석의 표면을 가속전자로 가열하였고, 주석의 표면가열에 의하여 기화되는 금속물질이 상부인쇄시트(21)의 표면에 증착되면서 금속박막(21b)이 형성되도록 하였다.The metal compound 32 used in the above step is a compound containing tin (Sn) as a main component and is irradiated with an electron beam (E-beam) by an electron beam generator to heat the surface of the tin by accelerating electrons. A metal material vaporized by surface heating is deposited on the surface of the upper printed sheet 21 to form the metal thin film 21b.

상기 1차 증착단계에 의하여 상부인쇄시트(21)의 표면에 금속박막(21b)이 입혀지면 고광택을 발산하여 고품위를 느낄 수 있는 금속의 빛깔을 표출할 수 있고, 요철무늬(21a)는 금속 특유의 질감 무늬를 재현하여 금속판재를 가공한 느낌을 줄 수 있는 것이다.When the metal thin film 21b is coated on the surface of the upper printed sheet 21 by the primary deposition step, the metallic color that can feel high quality by emitting a high gloss can be displayed. The irregular pattern 21a is made of metal It is possible to reproduce the texture pattern of the metal plate to give a feeling of processing.

이어서, 타겟(31)에 놓여진 불소수지화합물에 전자빔을 조사(照射)하여 표면을 가열하면서 기화시켜 도 3e에서 도시한 바와 같이, 상부인쇄시트(21)의 표면에 AF(Anti-Finger) 발수코팅층(21c)을 형성하는 2차 증착단계를 실시하였다.Subsequently, the fluorine resin compound placed on the target 31 is irradiated with an electron beam to vaporize the surface while heating the surface to form an AF (Anti-Finger) water-repellent coating layer 21 on the surface of the upper printed sheet 21, And a second deposition step of forming the first electrode 21c.

상기 단계에 의하여 형성된 발수코팅층(21c)은 상부인쇄시트(21)의 완전방수가 이루어질 수 있도록 하고, 손으로 만지더라도 지문(指紋)이 남지 않아 먼지와 같은 이물질의 부착되지 않도록 매끈하게 코팅되는 것으로서 전체적인 상부인쇄시트(21)의 내구성을 높여줄 수 있고, 보다 금속의 광택이 잘 표출될 수 있는 것이다.The water-repellent coating layer 21c formed by the above step allows the upper printed sheet 21 to be completely waterproofed and smoothly coated so as to prevent foreign substances such as dust from adhering due to no fingerprints remaining even when the user touches the upper printed sheet 21 The durability of the entire upper-printing sheet 21 can be improved, and the luster of the metal can be expressed well.

이어서, 도 2c와 도 3f에서 도시한 바와 같이, 1,2차 증착작업이 완료된 상부인쇄시트(21)의 하부에 합성수지로 이루어진 코어시트(22) 및 하부인쇄시트(23)를 차례로 적층하고, 가열 및 가압하여 라미네이팅(laminating)하는 단계를 실시하였다.Next, as shown in Figs. 2C and 3F, a core sheet 22 made of synthetic resin and a lower printed sheet 23 are sequentially laminated on the lower part of the upper printed sheet 21 after the first and second deposition operations have been completed, Followed by laminating by heating and pressing.

이어서, 도 2d와 도 3g에서 도시한 바와 같이, 열 접착이 완료된 시트들을 냉각시키고, 카드의 외형을 따라 절단하는 단계를 실시하여 금속의 진공증착이 완료된 플라스틱카드의 제조를 완성하였다.Next, as shown in FIGS. 2d and 3g, the steps of cooling the heat-sealed sheets and cutting the card according to the outline of the card were completed, thereby completing the fabrication of the plastic card in which the metal vapor deposition was completed.

한편, 상기 진공증착 플라스틱카드(20)에는 도 3h에서 도시한 바와 같이, CNC와 같은 밀링커터로 안내홈을 가공하여 IC칩(24)을 부착하는 단계가 더 포함되도록 하여 대용량의 정보를 수록할 수 있는 집적회로 칩을 부착하여 다양한 종류의 카드로 사용할 수 있고, 상기 하부인쇄시트(23)의 저면에 마그네틱테이프(25)를 부착하는 단계가 더 포함되도록 하여 각종 정보를 마그네틱테이프(25)에 수록하는 카드로 사용할 수 있는 것이다.As shown in FIG. 3H, the vacuum deposition plastic card 20 may further include a step of attaching the IC chip 24 by machining a guide groove with a milling cutter such as CNC to store a large amount of information And a step of attaching a magnetic tape 25 to the bottom surface of the lower printed sheet 23 so that various kinds of information can be recorded on the magnetic tape 25 It can be used as a recorded card.

전술한 제조과정 의하여 완성된 진공증착 플라스틱카드(20)는, 동판(10)의 요철무늬(11)가 합성수지시트에 전사(全寫)되어 정밀한 무늬 및 문양이 형성되고, 진공증착에 의하여 금속의 질감을 느낄 수 있는 금속 특유의 무늬를 재현할 수 있는 것이므로 상부인쇄시트(21)가 합성수지로 제작되었다 하더라고 금속판재를 직접 가공한 것과 같은 효과를 나타내어 고품위를 느낄 수 있는 고품질의 진공증착 플라스틱카드를 구현할 수 있는 것이다.The vacuum deposited plastic card 20 completed by the above-described manufacturing process can be obtained by a process wherein the uneven pattern 11 of the copper plate 10 is transferred to the synthetic resin sheet to form precise patterns and patterns, Since the upper printed sheet 21 is made of synthetic resin, it is possible to reproduce a pattern unique to metal that can feel the texture. Even if the upper printed sheet 21 is made of synthetic resin, it is possible to produce a high quality vacuum- It can be implemented.

또한, 동판(10)의 무늬가 전사된 상부인쇄시트(21)의 요철무늬(21a)는 보다 입체적이면서도 금속특유의 질감을 잘 표출하면서도 2단계 증착단계에 의한 발수코팅층(21c)은 산화물피막에 의하여 지문(指紋)이 남지 않도록 매끈하게 코팅되어 보는 각도에 따라서 다양한 빛깔과 색상을 나타낼 수 있는 것으로서 장기간 사용하더라도 금속박막이 벗겨지지 않고, 먼지가 달라붙지 않아 전체적인 플라스틱카드(20)의 내구성을 높여줄 수 있는 것이다.The concavo-convex pattern 21a of the upper printed sheet 21 to which the pattern of the copper plate 10 is transferred is more stereoscopic and exhibits a metal-specific texture while the water repellent coating layer 21c by the two- Therefore, the metal thin film is not peeled off and the dust does not stick even if it is used for a long period of time, so that the durability of the entire plastic card 20 is enhanced. I can give.

한편, 상기 제조과정에 의하여 완성된 진공증착 플라스틱카드(20)는. 동판(10)의 요철무늬(11)가 상부인쇄시트(21)에 전사되고, 1차 진공증착에 의하여 상부인쇄시트(21)의 표면에 금속박막(21b)형성되며, 2차 증착단계에 의하여 금속박막(21b)의 표면에는 발수코팅층(21c)이 형성되고, 상부인쇄시트(21)의 하부에 합성수지로 이루어진 코어시트(22) 및 하부인쇄시트(23)가 적층되어 라미네이팅 된 후 카드의 외형대로 절단된 구성으로 되어 있다.On the other hand, the vacuum-deposited plastic card 20 completed by the above-mentioned manufacturing process has the following advantages. The concave-convex pattern 11 of the copper plate 10 is transferred to the upper printing sheet 21 and the metal thin film 21b is formed on the surface of the upper printing sheet 21 by the first vacuum vapor deposition, A water repellent coating layer 21c is formed on the surface of the metal thin film 21b and a core sheet 22 and a lower printed sheet 23 made of synthetic resin are laminated and laminated on the lower part of the upper printed sheet 21, As shown in FIG.

이상에서는 본 발명의 바람직한 실시예에 대하여 도시하고 또한 설명하였으나, 본 발명은 상기한 실시예에 한정되지 아니하며, 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 본 발명이 속하는 분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변형 실시가 가능한 것은 물론이고, 그와 같은 변경은 기재된 청구범위 내에 있게 된다.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but many variations and modifications may be made without departing from the scope of the invention. It will be understood by those skilled in the art that various changes may be made and equivalents may be resorted to without departing from the scope of the appended claims.

10 : 동판 11 : 요철무늬
20 : 플라스틱카드 21 : 상부인쇄시트
21a : 요철무늬 21b : 금속박막
21c : 발수코팅층 22 : 코어시트
23 : 하부인쇄시트 24 : IC칩
25 : 마그네틱테이프 30 : 진공챔버
31 : 타겟 32 : 금속화합물
10: copper plate 11: uneven pattern
20: plastic card 21: upper printed sheet
21a: rugged pattern 21b: metal thin film
21c: Water repellent coating layer 22: Core sheet
23: Lower printed sheet 24: IC chip
25: Magnetic tape 30: Vacuum chamber
31: target 32: metal compound

Claims (4)

금속판재의 표면을 CNC가공이나 레이저가공을 실시하여 미세 요철무늬(11)가 형성된 동판(銅版)을 제작하는 단계;
상기 동판(10) 위에 합성수지시트를 올려놓고, 가열 및 가압하여 동판(10)의 요철무늬(11)가 합성수지시트에 전사되도록 하여 상부인쇄시트(21)를 완성하는 단계;
요철무늬(21a)가 전사된 상부인쇄시트(21)를 진공챔버(30)의 내부에 넣고, 타겟(31)에 놓여진 금속화합물(32)에 전자빔(E-beam)을 조사하여 금속화합물(32) 표면을 가속전자로 가열하고 기화시켜 상부인쇄시트(21)의 표면에 금속박막(21b)이 형성되도록 하는 1차 증착단계;
타겟(31)에 놓여진 불소수지화합물에 전자빔을 조사(照射)하여 표면을 가열하고 기화시켜 상부인쇄시트(21)의 표면에 AF(Anti-Finger) 발수코팅층(21c)을 형성하는 2차 증착단계;
1,2차 증착작업이 완료된 상부인쇄시트(21)의 하부에 합성수지로 이루어진 코어시트(22) 및 하부인쇄시트(23)를 차례로 적층하고, 가열 및 가압하여 라미네이팅(laminating)하는 단계;
열 접착이 완료된 시트들을 냉각시키고, 카드의 외형을 따라 절단하는 단계로 이루어진 것을 특징으로 하는 금속이 진공증착된 플라스틱카드의 제조방법.
A step of CNC machining or laser machining the surface of the metal sheet material to produce a copper plate on which fine concave-convex patterns 11 are formed;
Completing the upper printed sheet 21 by placing a synthetic resin sheet on the copper plate 10 and heating and pressurizing the uneven pattern 11 to transfer the uneven pattern 11 of the copper plate 10 to the synthetic resin sheet;
The upper printed sheet 21 to which the uneven pattern 21a has been transferred is placed in the vacuum chamber 30 and an electron beam 32 is irradiated to the metal compound 32 placed on the target 31 to form the metal compound 32 ) Surface with an accelerating electron so as to form a thin metal film (21b) on the surface of the upper printed sheet (21);
A secondary deposition step of heating and vaporizing the surface of the fluororesin compound placed on the target 31 to form an AF (Anti-Finger) water-repellent coating layer 21c on the surface of the upper printed sheet 21 ;
Laminating a core sheet (22) and a lower printed sheet (23), which are made of synthetic resin, in order on the lower part of the upper printed sheet (21) after the first and second deposition processes have been completed, and heating and pressing them;
And cooling the sheets after the heat bonding is completed, and cutting the sheet according to the outer shape of the card.
제 1항에 있어서,
상기 동판(銅版)의 제작하는 단계에서는, 금속판재에 그림이나 문자를 필름으로 현상하고 화학적 방법으로 부식하는 에칭(etching) 가공방법을 사용하며,
상기 1차 증착단계의 금속화합물(32)은 주석(Sn)을 주성분으로 하는 금속화합물을 사용한 것을 특징으로 하는 금속이 진공증착된 플라스틱카드의 제조방법.
The method according to claim 1,
In the step of manufacturing the copper plate, an etching process is used in which a picture or a letter is developed into a film on a metal plate and is corroded by a chemical method.
Wherein the metal compound (32) in the primary deposition step is a metal compound containing tin (Sn) as a main component.
제 1항에 있어서,
상기 플라스틱카드(20)에는 밀링커터로 안내홈을 가공하여 IC칩(24)을 부착하는 단계가 더 포함되고,
상기 하부인쇄시트(23)의 저면에는 마그네틱테이프(25)를 부착하는 단계가 더 포함되도록 한 것을 특징으로 하는 금속이 진공증착된 플라스틱카드의 제조방법.
The method according to claim 1,
Further comprising the step of attaching the IC chip (24) to the plastic card (20) by machining a guide groove with a milling cutter,
Wherein the step of attaching a magnetic tape (25) to the bottom surface of the lower printed sheet (23) is further included.
동판(10)의 요철무늬(11)가 상부인쇄시트(21)에 전사되고, 1차 진공증착에 의하여 상부인쇄시트(21)의 표면에 금속박막(21b)형성되며, 2차 증착단계에 의하여 금속박막(21b)의 표면에는 발수코팅층(21c)이 형성되고, 상부인쇄시트(21)의 하부에 합성수지로 이루어진 코어시트(22) 및 하부인쇄시트(23)가 적층되어 라미네이팅 된 후 카드의 외형대로 절단된 것을 특징으로 하는 금속이 진공증착된 플라스틱카드.
The concave-convex pattern 11 of the copper plate 10 is transferred to the upper printing sheet 21 and the metal thin film 21b is formed on the surface of the upper printing sheet 21 by the first vacuum vapor deposition, A water repellent coating layer 21c is formed on the surface of the metal thin film 21b and a core sheet 22 and a lower printed sheet 23 made of synthetic resin are laminated and laminated on the lower part of the upper printed sheet 21, Wherein the metal is vacuum vapor deposited.
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