KR20190022042A - Environment-friendly solder paste composite - Google Patents

Abstract

Disclosed is an environment-friendly solder paste composite, which is possible to be cleaned with water by not adding resin, thereby being environment-friendly and ensuring excellent adhesion. According to the present invention, the environment-friendly solder paste composite includes: 1-10 wt% of a thixotropic agent; 5-15 wt% of an activator; 10-20 wt% of a dispersant; and 40-60 wt% of a solvent.

Description

FIELD OF THE INVENTION [0001] The present invention relates to an environmentally friendly solder paste composition,

The present invention relates to an environmentally friendly solder paste composition, and more particularly, to an environmentally friendly solder paste composition that can be washed with water as no resin is added, thereby ensuring environmentally friendly and excellent adhesion.

In general, in the field of integrated circuit technology, a printed circuit board (PCB) on which a metal layer such as a metal circuit pattern, under bump metallurgy (UBM) or the like is formed, or a solder paste printed on a wafer for bonding a chip or the like using a solder ball And then reflow is performed.

Conventional fluxes use resins, mainly maleic acid / acrylic / epoxy resins, which are difficult to remove completely when washed with water and use organic cleaners. However, since such an organic cleaning agent causes environmental pollution, the use thereof is limited, and it is necessary to replace the organic cleaning agent.

A related prior art is Korean Patent Laid-Open Publication No. 10-2012-0060770 (published on Jun. 12, 2012), which discloses a curable flux composition and a soldering method.

An object of the present invention is to provide an eco-friendly solder paste composition that can be washed with water as the resin is not added, thereby ensuring environmentally friendly and excellent adhesion.

According to an aspect of the present invention, there is provided an environmentally friendly solder paste composition comprising 1 to 10% by weight of a solder paste; 5-15 wt% active agent; 10 to 20% by weight of a dispersant; And 40 to 60% by weight of a solvent.

At this time, the chewing agent may include at least one selected from aerosil wax, amide wax and carnauba wax.

The active agent may include at least one selected from the group consisting of succinic acid, adipic acid, palmitic acid, tetradecanoic acid, and dimethylolpropionic acid. .

Wherein the solvent comprises a first solvent and a second solvent added to the first solvent, wherein the first solvent is glycidyl ether and the second solvent is selected from the group consisting of glycol ethers, glycerin and alcohols It is preferable to include at least one selected.

Particularly, the first and second solvents are preferably mixed in a weight ratio of 5: 5 to 9: 1.

The eco-friendly solder paste composition according to an embodiment of the present invention may have a viscosity of 8,000 to 25,000 cps.

The eco-friendly solder paste composition according to an embodiment of the present invention may further include a silicone-based defoaming agent and may be washed with water.

The eco-friendly solder paste composition according to the present invention is a solvent in which glycidyl ether, which is a first solvent, and glycol ether, which is a second solvent, are mixed, thereby securing viscosity and securing excellent adhesion, There is an advantage that it can be removed by washing with environmentally friendly water rather than the organic cleaning agent which causes it.

Further, by using the green solder paste composition according to the present invention in which the mixing ratio of the glycidyl ether as the first solvent and the glycol ether as the second solvent at an optimum ratio is used, the appropriate solubility can be secured and the viscosity It is possible to improve the adhesiveness according to the present invention. In addition, since it is excellent in washing property, it can be easily washed in water and thus it can be said to be environmentally friendly.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and how to accomplish them, will become apparent by reference to the embodiments described in detail below with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Hereinafter, an eco-friendly solder paste composition according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

The eco-friendly solder paste composition according to an embodiment of the present invention comprises 1 to 10% by weight of a plasticizer, 5 to 15% by weight of an activator, 10 to 20% by weight of a dispersant and 40 to 60% by weight of a solvent.

The chelants are added to improve the printability of the environmentally friendly solder paste composition and to reduce the surface tension. In this case, there are no particular limitations on the materials which can be used as a shaving agent, but waxes are preferably used, and specifically, one or more selected from aerosil wax, amide wax, carnauba wax, It is good to use.

It is preferable that such a padding agent is added in an amount of 1 to 10% by weight, more preferably 3 to 7% by weight based on the total weight of the eco-friendly solder paste composition. If the addition amount of the sizing agent is less than 1% by weight, the fluidity may be lowered to cause defects in printing. On the contrary, when the addition amount of the chelating agent is more than 10% by weight, the tackiness (thixotropic property) is high and the stickiness is increased when the squeegee is separated from the squeegee, which may lower the workability.

The activator serves to remove the oxide of the substrate that may occur when the solder ball is attached, thereby increasing the bonding force of the solder ball. Such an active agent may be at least one selected from the group consisting of succinic acid, adipic acid, palmitic acid, tetradecanoic acid and dimethylolpropionic acid. .

It is preferable that such an activator is added at a content ratio of 5 to 15% by weight, more preferably 8 to 12% by weight, based on the total weight of the environmentally friendly solder paste composition. If the addition amount of the activator is less than 5% by weight, the surface tension in the soldering process may be large, and the spreadability and wettability may not be good and the oxide film of the substrate may not be removed. On the contrary, when the addition amount of the activator is more than 15% by weight, the surface tension may be excessively lowered.

The dispersant is added for the purpose of uniformly dispersing the materials in the environmentally friendly solder paste composition. For example, sodium dioctyl sulfosuccinate may be used as the dispersing agent, but it is not necessarily limited thereto, and it may be obvious that various materials can be used as the dispersing agent.

Such a dispersant is preferably added at a content ratio of 10 to 20% by weight, more preferably 14 to 17% by weight, based on the total weight of the eco-friendly solder paste composition. When the addition amount of the dispersing agent is less than 10% by weight, problems such as printing failure and storage stability may occur. On the other hand, if the addition amount of the dispersing agent is more than 20% by weight, the insulation resistance characteristic may be deteriorated.

The solvent is added to adjust the viscosity. At this time, since the environmentally friendly solder paste composition according to the embodiment of the present invention does not contain a resin, it is difficult to obtain viscosity when only a general solvent of glycol ethers is used as a solvent. In order to ensure viscosity, glycol ethers (Poly) glycidyl ether was added.

That is, the solvent of the present invention comprises a first solvent and a second solvent added to the first solvent, wherein the first solvent is glycidyl ether and the second solvent is selected from glycol ethers, glycerol and alcohols It is preferable to use at least one of them.

Particularly, the first and second solvents are preferably mixed in a weight ratio of 5: 5 to 9: 1, which is a mixture of a first solvent which is glycidyl ether and a first solvent selected from glycol ethers, glycerol and alcohols The viscosity and the washability change are different according to the ratio of the second solvent, and the viscosity and the washing property can be improved while ensuring the appropriate solubility.

If the mixing ratio of the first and second solvents is less than 5: 5, the solubility is increased but the viscosity is lowered and the washing property is lowered due to the decrease in the amount of the glycidyl ether. On the other hand, when the mixing ratio of the first and second solvents is more than 9: 1, the viscosity and washability are improved but the solubility is rapidly lowered.

Such a solvent is preferably added in an amount of 40 to 60% by weight, more preferably 45 to 57% by weight, and most preferably 54 to 56% by weight based on the total weight of the eco-friendly solder paste composition. If the added amount of the solvent is less than 40% by weight, the solubility is weak and the powder additive such as the active agent may not be completely dissolved and the reliability may be lowered. On the other hand, if the added amount of the solvent exceeds 60 wt%, the substrate may be contaminated by the residue or the solder paste may be contaminated.

In this case, the eco-friendly solder paste composition according to an embodiment of the present invention has a viscosity of 8,000 to 25,000 cps. If the viscosity is less than 8,000 cps, adhesion with the solder powder is poor, and the solder paste is spread and crumbled. There is a fear that the drying phenomenon may occur due to the gradual effect and the slippage in the printing process is not good so that a uniform amount of paste may not be formed on the substrate.

The eco-friendly solder paste composition according to an embodiment of the present invention may further include an antifoaming agent. The antifoaming agent may be added in an amount of 5 to 15% by weight based on the total weight of the eco-friendly solder paste composition. As the defoaming agent, a silicone defoaming agent may be used. The eco-friendly solder paste composition according to an embodiment of the present invention may further include an auxiliary additive such as a flow modifier, a thickener, etc. The flow modifier or thickener is not limited as long as it is a known one. For example, Compounds, modified cellulose, and the like can be used.

As described above, the eco-friendly solder paste composition according to the embodiment of the present invention is obtained by mixing a glyceride ether as a first solvent and a glycol ether as a second solvent, But it is advantageous in that it can be cleaned and removed with environmentally friendly water rather than an organic cleaning agent causing environmental pollution.

In addition, the environmentally friendly solder paste composition according to the embodiment of the present invention can obtain an appropriate solubility by using a mixture of glycidyl ether as a first solvent and glycol ether as a second solvent at an optimum ratio It is possible to improve the adhesiveness according to an increase in viscosity and to be easily environmentally friendly because it is excellent in washing property and can be easily washed in water.

Example

Hereinafter, a preferred embodiment will be described in order to facilitate understanding of the present invention. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined by the appended claims.

One. Solder Paste  Composition manufacturing

Table 1 shows the compositions of the solder paste compositions prepared according to Examples 1 to 3 and Comparative Examples 1 to 2 and their composition ratios.

[Table 1] (unit:% by weight)

Example  One

After cooling the mixture at 130 ° C to 140 ° C in a reactor, the mixture was cooled and aged at 10 ° C for 48 hours to obtain a solder paste A composition was prepared. At this time, amide wax was used as a chiral agent, adipic acid was used as an activator, sodium dioctyl sulfosuccinate was used as a dispersant, and a silicone antifoaming agent was used as a defoaming agent. Glycidyl ether and glycol ether in a weight ratio of 5: 5 were used.

Example  2

A solder paste composition was prepared in the same manner as in Example 1 except that polyglycidyl ether and glycol ether were mixed in a weight ratio of 6: 4 as a solvent.

Example  3

A solder paste composition was prepared in the same manner as in Example 1, except that polyglycidyl ether and glycol ether were mixed in a weight ratio of 8: 2 as a solvent.

Comparative Example  One

A solder paste composition was prepared in the same manner as in Example 1 except that polyglycidyl ether and glycol ether were mixed as a solvent at a weight ratio of 2: 8.

Comparative Example  2

A solder paste composition was prepared in the same manner as in Example 1 except that polyglycidyl ether and glycol ether were mixed as a solvent at a weight ratio of 4: 6.

2. Property evaluation

Table 2 shows the results of evaluation of the physical properties of the solder paste composition prepared according to Examples 1 to 3 and Comparative Examples 1 and 2.

1) Solubility

RE-550 H type clay system at a rotation speed of 30 rpm and a measurement temperature of 150 캜.

?: Greater than 9.1 to less than 9.2

?: More than 9.0 to less than 9.1

X: less than 9.0

2) Viscosity

The solder paste composition was printed on the substrate to a thickness of 0.4 탆 to form a flux, and after standing at 20 캜 for 48 hours, the viscosity was measured using a Malcom PCU-205 apparatus.

3) Washability

A solder paste composition was applied on a metal pad treated with Cu OSP on the substrate to a thickness of 0.5 mu m to form a flux, and a solder ball of 200 mu m was positioned and reflowed. Thereafter, the flux was washed with water for 5 minutes and then photographed with a scanning electron microscope (SEM), and the washability was evaluated visually.

○: No residue.

Δ: Residue is slightly present.

X: A large amount of residue is present.

[Table 2]

Referring to Table 1 and Table 2, it can be seen that the viscosity and the washing property vary depending on the mixing ratio of the polyglycidyl ether and the glycol ether.

At this time, as in Examples 1 to 3, although the solubility was somewhat deteriorated as the amount of the polyglycidyl ether was increased, it was confirmed that the viscosity was increased and the washing property was improved.

On the other hand, when the polyglycidyl ether and the glycol ether were mixed at the weight ratio of 2: 8 and 4: 6, respectively, as in Comparative Examples 1 and 2, the solubility was excellent, but the addition amount of polyglycidyl ether was relatively decreased It can be confirmed that the viscosity is lower than the target value and the washing property is not good.

Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. These changes and modifications may be made without departing from the scope of the present invention. Accordingly, the scope of the present invention should be determined by the following claims.

Claims (8)

1 to 10% by weight of chewing gum;
5-15 wt% active agent;
10 to 20% by weight of a dispersant; And
40 to 60% by weight of a solvent;
Wherein the green solder paste composition is a green solder paste composition.
The method according to claim 1,
The chelating agent
Wherein the green solder paste composition comprises at least one selected from the group consisting of waxes, aerosil waxes, amide waxes and carnauba waxes.
The method according to claim 1,
The active agent
And at least one selected from the group consisting of succinic acid, adipic acid, palmitic acid, tetradecanoic acid and dimethylolpropionic acid. Wherein the green solder paste composition is a green solder paste composition.
The method according to claim 1,
The solvent
A first solvent and a second solvent added to the first solvent,
Wherein the first solvent is glycidyl ether,
Wherein the second solvent comprises at least one selected from the group consisting of glycol ethers, glycerol, and alcohols.
5. The method of claim 4,
The first and second solvents
5: 5 to 9: 1 by weight based on the weight of the green solder paste composition.
The method according to claim 1,
The paste composition
Wherein the green solder paste composition has a viscosity of 8,000 to 25,000 cps.
The method according to claim 1,
The paste composition
A green solder paste composition further comprising a silicon-based antifoaming agent.
The method according to claim 1,
The paste composition
Wherein the solder paste is washed with water.