KR20190021002A - Polyolefin mix resin for encapsulation member of organic electronic device, Adhesive composition comprising the same and Adhesive film comprising the same - Google Patents

Abstract

The present invention relates to a polyolefin-based mixed resin for an encapsulant of an organic electronic device, an adhesive composition for an encapsulant of an organic electronic device comprising the same, and an adhesive film for an encapsulant of an organic electronic device comprising the same and, more specifically, to a polyolefin-based mixed resin for an encapsulant of an organic electronic device, an adhesive composition for an encapsulant of an organic electronic device comprising the same, and an adhesive film for an encapsulant of an organic electronic device comprising the same. The adhesive film eliminates and prevents defect causing materials such as moisture, impurities and the like, and thus the defect causing materials cannot access the organic electronic device, an interlayer separation phenomenon which may occur when the moisture is removed does not occur, and at the same time, excellent moisture resistance and heat resistance are obtained.

Description

TECHNICAL FIELD [0001] The present invention relates to a polyolefin-based mixed resin for an organic electronic device encapsulant, an adhesive composition for an organic electronic device encapsulating material containing the same, and an adhesive film for an organic electronic device encapsulating material containing the same. film comprising the same}

The present invention relates to a polyolefin-based mixed resin for an organic electronic device encapsulant, an adhesive composition for an organic electronic device encapsulant comprising the same, and an adhesive film for an organic electronic device encapsulant comprising the same. More particularly, A polyolefin-based mixed resin for an organic electronic device encapsulant, which has an effect of preventing moisture from being removed, preventing a delamination phenomenon that may occur when moisture is removed, and having excellent moisture resistance and heat resistance, An adhesive composition for an organic electronic device encapsulant, and an adhesive film for an organic electronic device encapsulant containing the same.

An organic light emitting diode (OLED) is a light emitting diode in which a light emitting layer is a thin film organic compound, and utilizes an electroluminescent phenomenon in which a current is passed through a fluorescent organic compound to generate light. Such organic light emitting diodes are generally realized by three colors (Red, Green, Blue) independent pixel method, a biotransformation method (CCM), a color filter method and the like. Accordingly, the organic light emitting diode is classified into a low molecular organic light emitting diode and a polymer organic light emitting diode. In addition, it can be divided into a passive type driving method and an active type driving method according to a driving method.

Such organic light emitting diodes are characterized by high efficiency, low voltage driving, and simple driving due to self-emission, which is advantageous in that they can display high-quality moving images. Also, application to flexible displays and organic electronic devices using flexible properties of organic materials is expected.

The organic light emitting diode is manufactured by laminating an organic compound, which is a light emitting layer, on a substrate in the form of a thin film. However, the organic compound used in the organic light emitting diode is very sensitive to impurities, oxygen and moisture, and has a problem that the characteristics are easily deteriorated by external exposure, moisture, and oxygen penetration. Such deterioration of the organic material affects the luminescence characteristics of the organic light emitting diode and shortens the lifetime. In order to prevent such a phenomenon, Thin Film Encapsulation (hereinafter referred to as " Thin Film Encapsulation ") is required to prevent oxygen, moisture and the like from being introduced into the organic electronic device.

Conventionally, a metal can or a glass is processed into a cap shape having grooves, and a moisture-absorbing agent for absorbing moisture is mounted in a powder form in the groove. However, this method is performed by removing the moisture- There is a problem in that the organic electronic device is prevented from approaching a defect causing substance such as moisture and impurities, and the interlayer separation phenomenon that may occur when moisture is removed does not occur, and the effect of moisture resistance and heat resistance is hardly obtained at the same time.

Korean Patent Publication No. 10-2006-0030718 (published on April 4, 2006)

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide an organic electronic device capable of removing and blocking an organic material, such as moisture, impurities, Which is excellent in moisture resistance and heat resistance.

In order to solve the problems described above, the polyolefin-based mixed resin for an organic electronic device encapsulant of the present invention comprises a first adhesive resin and a second adhesive resin, wherein the first adhesive resin has a crystallization temperature And the second adhesive resin may have a crystallization temperature of 100 ° C to 140 ° C when measured by the following measurement method 1.

[Measurement method 1]

The crystallization temperature (Tc) is measured through a peak analysis of the cooling curve of the heat flux measured by differential scanning calorimetry (DSC) while cooling from 200 ° C to -150 ° C at a rate of 10 ° C / min.

In one preferred embodiment of the present invention, the first adhesive resin and the second adhesive resin may be contained in a weight ratio of 1: 0.1 to 10.

In one preferred embodiment of the present invention, the first adhesive resin comprises a random copolymer obtained by copolymerizing ethylene, propylene and a diene compound having a weight average molecular weight of 30,000 to 1,550,000, and the second adhesive resin is represented by the following formula ≪ / RTI > compounds.

[Chemical Formula 1]

In Formula 1, R ¹ is a hydrogen atom, a straight chain alkenyl group having 3 to 10 carbon atoms or a branched alkenyl group having 4 to 10 carbon atoms, and n is a number satisfying a weight average molecular weight of 30,000 to 1,550,000 It is rational number.

In one preferred embodiment of the present invention, ethylene and propylene are randomly copolymerized at a weight ratio of 1: 0.3 to 1.4, and the diene-based compound may include 2 to 15% by weight based on the total weight of the random copolymer.

On the other hand, the adhesive composition for an organic electronic device encapsulant of the present invention may comprise the above-mentioned mixed resin, tackifier and hygroscopic agent.

In one embodiment of the present invention, the moisture absorbent is silica (SiO _2), alumina (Al ₂ O _3), lithium oxide (Li ₂ O), sodium oxide (Na2O), barium (BaO), calcium oxide (CaO) , Magnesium oxide (MgO), and phosphorus pentoxide (P ₂ O ₅ ).

In one preferred embodiment of the present invention, the tackifier includes at least one of a hydrogenated petroleum resin, a hydrogenated rosin resin, a hydrogenated rosin ester resin, a hydrogenated terpene resin, a hydrogenated terpene phenol resin, a polymerized rosin resin and a polymerized rosin ester resin .

In one preferred embodiment of the present invention, the tackifier is contained in an amount of 50 to 300 parts by weight based on 100 parts by weight of the mixed resin, and the hygroscopic agent may include 10 to 550 parts by weight based on 100 parts by weight of the mixed resin.

In one preferred embodiment of the present invention, the adhesive composition of the present invention further comprises at least one of a curing agent and a UV initiator, wherein the curing agent is contained in an amount of 2 to 50 parts by weight based on 100 parts by weight of the mixed resin, And 0.1 to 10 parts by weight based on 100 parts by weight of the mixed resin.

In one preferred embodiment of the present invention, the viscosity of the adhesive composition of the present invention may be 100,000 to 300,000 Pa 占 퐏 (50 占 폚).

Further, the adhesive film for the organic electronic device encapsulant of the present invention may include an adhesive layer formed by including the above-mentioned adhesive composition.

In one preferred embodiment of the present invention, the adhesive film of the present invention has a glass adhesive strength of 1500 gf / 25 mm or more as measured according to the following Measuring Method 2, a metal adhesive strength of 1000 gf / 25 mm Or more.

[Measurement method 2]

After the adhesive tape was laminated on the upper surface of the adhesive film and the sample was cut to a width of 25 mm and a length of 120 mm, the adhesive film was laminated to the glass at 80 DEG C, and the prepared sample was left to stand at room temperature for 30 minutes. Measure the glass adhesion at the speed.

[Measuring method 3]

The upper surface of the adhesive film was laminated to an 80 占 퐉 -thick Ni alloy at 80 占 폚, and an adhesive strength measuring tape was laminated on the adhesive film. The sample was cut into a width of 25 mm and a length of 120 mm, Measure the metal adhesion at 300 mm / min.

In one preferred embodiment of the present invention, the adhesive layer of the present invention may include a first adhesive layer and a second adhesive layer formed on one surface of the first adhesive layer.

As a preferred embodiment of the present invention, the first adhesive layer of the present invention comprises a first mixed resin, a tackifier and a first moisture absorbent, wherein the first mixed resin comprises a first adhesive resin and a second adhesive resin at a ratio of 1: 0.1 To 10 by weight, and the tackifier includes 50 to 300 parts by weight based on 100 parts by weight of the first mixed resin, and the first moisture absorber may include 1 to 40 parts by weight with respect to 100 parts by weight of the first mixed resin. have.

As a preferred embodiment of the present invention, the tackifier of the first adhesive layer of the present invention comprises a first tackifier and a second tackifier in a weight ratio of 1: 0.5 to 1.5, and the softening point of the first tackifier is less than the softening point of the applied second pressure-sensitive adhesive agent, a first absorbent in the first adhesive layer of the present invention may include silica (SiO _2).

In one preferred embodiment of the present invention, the first adhesive layer of the present invention further comprises at least one of a curing agent and a UV initiator, and the curing agent of the first adhesive layer of the present invention is used in an amount of 2 to 30 And the UV initiator of the first adhesive layer of the present invention may comprise 0.1 to 5 parts by weight based on 100 parts by weight of the first mixed resin.

As a preferred embodiment of the present invention, the second adhesive layer of the present invention comprises a second mixed resin, a tackifier and a second moisture absorbent, and the second mixed resin comprises a first adhesive resin and a second adhesive resin at a ratio of 1: 0.1 To 10, and the tackifier of the second adhesive layer of the present invention comprises 60 to 300 parts by weight based on 100 parts by weight of the second mixed resin, and the second moisture absorber of the present invention comprises 100 parts by weight of the second mixed resin 50 to 450 parts by weight based on 100 parts by weight of the composition.

As a preferred embodiment of the present invention, the tackifier of the second adhesive layer of the present invention comprises a first tackifier, and the second moisture absorber of the second adhesive layer of the present invention may comprise calcium oxide (CaO) .

In one preferred embodiment of the present invention, the second adhesive layer of the present invention further comprises at least one of a curing agent and a UV initiator, the curing agent comprises 10 to 40 parts by weight per 100 parts by weight of the second mixed resin, May be 0.1 to 8 parts by weight based on 100 parts by weight of the second mixed resin.

As a preferred embodiment of the present invention, the viscosity of the first adhesive layer of the present invention may be 150,000 Pa.s (50 占 폚) or less and the viscosity of the second adhesive layer may be 200,000 Pa 占 퐏 (50 占 폚) or more.

On the other hand, the sealing material for an organic electronic device of the present invention includes the above-mentioned adhesive film of the present invention.

In addition, the light emitting device of the present invention includes a substrate, an organic electronic device formed on at least one side of the substrate, and an encapsulant for organic electronic devices mentioned above that packages the organic electronic device.

Hereinafter, terms used in the present invention will be described.

The term "hygroscopic agent" used in the present invention can adsorb moisture by physical or chemical bonding such as interface between a moisture absorber and van der Waals force, and can adsorb moisture adsorbing materials and chemical reactions that do not change the composition of a substance due to adsorption of water All of which absorb moisture and change into new substances

The term " crystallization temperature " used herein refers to a temperature at which crystallization occurs in which the arrangement of materials is irregular and the arrangement thereof is regularly changed by attraction between molecules / atoms. For example, differential scanning calorimetry (DSC) . In one example, the crystallization temperature is set to a temperature of 20 ° C / min in order to equalize the thermal history of the polyolefin resin while the measurement container is filled with a sample in an amount of about 0.5 mg to 10 mg and a nitrogen gas flow rate of 20 ml / The temperature was raised from 0 ° C to 200 ° C at a heating rate and maintained at that temperature for 2 minutes and then cooled to a temperature of -150 ° C at a rate of 10 ° C / ), That is, the exothermic peak temperature at the time of cooling can be measured as the crystallization temperature.

The peak of the present invention means a vertex or apex of a cooling curve or a heating curve, for example, a point at which the slope of the tangent line is zero. However, the point where the slope of the tangent line is not changed, that is, the inflection point is excluded, with respect to the point where the slope of the tangent line is 0, from among the points whose slant of the tangent line is zero.

INDUSTRIAL APPLICABILITY The polyolefin-based mixed resin for the organic electronic device encapsulant of the present invention, the adhesive composition for the organic electronic device encapsulant containing the same, and the adhesive film for the organic electronic device encapsulating material containing the same, effectively block moisture, oxygen, impurities, It is possible to remarkably prevent moisture from reaching the organic electronic device, thereby remarkably improving the lifetime and durability of the organic electronic device. In addition, there is no interlayer peeling phenomenon that may occur when moisture is removed, and an effect of excellent moisture resistance and heat resistance is obtained.

1 and 2 are sectional views of an adhesive film for an organic electronic device encapsulant according to a preferred embodiment of the present invention.
3 and 4 are cross-sectional schematic views of a light emitting device according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same reference numerals are assigned to the same or similar components throughout the specification.

The polyol-based finely mixed resin for the organic electronic device encapsulant of the present invention comprises a first adhesive resin and a second adhesive resin.

The first adhesive resin may not have a crystallization temperature measured by the following measurement method 1, and the first adhesive resin may not have a crystallization temperature of 100 ° C to 140 ° C when measured by the following measurement method 1.

The second adhesive resin may have a crystallization temperature of 100 ° C to 140 ° C, preferably 110 to 130 ° C, more preferably 115 ° C to 125 ° C, as measured by the following measurement method 2.

[Measurement method 1]

The crystallization temperature (Tc) was measured through a peak analysis of the cooling curve of the heat flux measured by a differential scanning calorimetry (DSC) while cooling from a temperature of 200 ° C. to a temperature of -150 ° C. at a rate of 10 ° C./min

Specifically, the polyol-based finely mixed resin for an organic electronic device encapsulant of the present invention is a mixture of a first adhesive resin having no crystallization temperature (no exothermic peak appears) and a second adhesive resin having a crystallization temperature of 100 ° C to 140 ° C By showing the property with the minimum crystal region, it is possible to show both viscous and elastic properties irrespective of temperature, and durability is advantageous by showing sufficient viscoelasticity at a wide temperature.

Further, if a material having a crystallization temperature of 140 ° C or higher is used as the second adhesive resin, it may be vulnerable to an external impact, resulting in a problem of deterioration of adhesive strength with a substrate.

On the other hand, the first adhesive resin and the second adhesive resin may be contained in a weight ratio of 1: 0.1 to 10, preferably 1: 1 to 9, more preferably 1: 1.1 to 5. If the weight ratio of the first adhesive resin and the second adhesive resin is less than 1: 0.1, the reliability may be deteriorated. If the weight ratio is more than 1: 10, the elasticity may be lowered.

The first adhesive resin may include a random copolymer obtained by copolymerizing ethylene, propylene and a diene-based compound. At this time, ethylene and propylene can be randomly copolymerized in a weight ratio of 1: 0.3 to 1.4, preferably 1: 0.5 to 1.2. If the weight ratio of ethylene and propylene to be copolymerized is less than 1: 0.3, it may lead to poor adhesion of the panel due to the increase of modulus and hardness, a problem of deteriorating the adhesive strength with the base material and the property at low temperature, And if the weight ratio exceeds 1: 1.4, the panel may be deflected due to modulus and hardness lowering, and deterioration of the mechanical properties may be caused by deterioration of the mechanical properties of the product. If the weight ratio of the moisture absorber There is a problem that the reliability is lowered due to difficulty in completing high-level operations.

The diene compound may be contained in an amount of 2 to 15% by weight, preferably 7 to 11% by weight based on the total weight of the copolymerized random copolymer of ethylene, propylene and a diene compound. If the content of the diene compound is less than 2% by weight, the modulus may be lowered due to a low curing rate and a curing density, which may cause a problem of panel sagging and heat resistance may be deteriorated. If the content exceeds 15% by weight, a problem of poor adhesion due to lack of wettability due to high curing density, lower compatibility of resin with resin, deterioration of panel adhesion due to high modulus, and yellowing due to heat ≪ / RTI >

The first adhesive resin may have a weight average molecular weight of 30,000 to 1,550,000, and preferably a weight average molecular weight of 40,000 to 1,500,000.

If the weight average molecular weight of the first adhesive resin is less than 30,000, panel shrinkage may occur due to a decrease in gelation rate and modulus, heat resistance may be lowered, reliability of the hygroscopic agent may decrease, Mechanical properties may be deteriorated. If the weight average molecular weight exceeds 1,550,000, adhesion to the substrate may be deteriorated due to a decrease in wettability, and adhesiveness to the panel may be deteriorated due to increase in gelation rate and modulus.

The second adhesive resin may include a compound represented by the following formula (1).

[Chemical Formula 1]

In Formula 1, R ¹ is a hydrogen atom, a straight chain alkenyl group having 3 to 10 carbon atoms or a branched alkenyl group having 4 to 10 carbon atoms, preferably R ¹ is a hydrogen atom, a straight chain alkenyl group having 4 to 8 carbon atoms, To C8. ≪ / RTI >

The reliability can be further improved by the fact that R ^{1 in the general} formula (1) is a hydrogen atom, a straight-chain alkenyl group having 3 to 10 carbon atoms or a branched alkenyl group having 4 to 10 carbon atoms.

In the above formula (1), n is a rational number satisfying a weight average molecular weight of 30,000 to 1,550,000, preferably a rational number satisfying a weight average molecular weight of 40,000 to 1,500,000. If the weight average molecular weight is less than 30,000, panel shrinkage may occur due to modulus reduction, heat resistance may be lowered, reliability of the moisture absorbent may be lowered, mechanical properties may be deteriorated, , Lifting phenomenon with the substrate due to volume expansion of the moisture absorbent due to the lowering of elasticity may occur. On the other hand, if the weight average molecular weight exceeds 1,550,000, the adhesion to the substrate may be deteriorated due to the lowering of the wettability, and the adhesion to the panel may deteriorate as the modulus increases.

Meanwhile, the adhesive composition for an organic electronic device encapsulant of the present invention may include the above-mentioned mixed resin of the present invention, a tackifier, and a moisture absorber.

The tackifier is not particularly limited as long as it is a pressure-sensitive adhesive resin commonly used in an adhesive composition for an organic electronic device encapsulant. Preferably, the tackifier is a hydrogenated petroleum resin, a hydrogenated rosin resin, a hydrogenated rosin ester resin, a hydrogenated terpene resin, , A polymerized rosin resin, and a polymerized rosin ester resin.

The tackifier may be contained in an amount of 50 to 300 parts by weight, preferably 80 to 280 parts by weight, based on 100 parts by weight of the mixed resin. If the amount of the tackifier is less than 50 parts by weight based on 100 parts by weight of the mixed resin, the moisture resistance may be poor. If the tackifier is more than 300 parts by weight, the durability and moisture resistance May occur.

Next, the moisture absorber can be included without limitation as long as it is an encapsulant commonly used in the packaging of organic electronic devices. Preferably, the moisture absorber includes a moisture absorber containing a zeolite, titania, zirconia or montmorillonite as a component, a metal salt, Or more, and more preferably, it may include a metal oxide, and still more preferably, it may include calcium oxide (CaO) among the metal oxides.

Metal oxides such as silica (SiO _2), alumina (Al ₂ O _3), lithium oxide (Li ₂ O), sodium (Na2O), barium oxide (BaO), magnesium calcium oxide (CaO) or oxide (MgO) oxide Metal oxides, organic metal oxides, and phosphorus pentoxide (P ₂ O ₅ ).

Metal salt is lithium sulfate (Li ₂ SO _4), sodium sulfate (Na ₂ SO _4), calcium sulfate (CaSO _4), magnesium sulfate (MgSO _4), cobalt sulfate (CoSO _4), sulfate, gallium (Ga ₂ (SO _{4) 3} ), titanium sulfate (Ti (SO _{4) 2)} or nickel sulfate (NiSO _4), such as the sulphate, calcium chloride (CaCl _2), magnesium chloride (MgCl _2), strontium chloride (SrCl _2), chloride, yttrium (YCl _3), copper chloride (CuCl _2), cesium fluoride (CsF), fluoride tantalum (TaF _5), fluoride, niobium (NbF _5), lithium bromide (LiBr), calcium bromide (CaBr _2), bromide, cesium (CeBr _3), bromide, selenium ( SeBr _4), bromide, vanadium (VBr _3), magnesium bromide (MgBr _2), barium iodide (BaI _2), or magnesium iodide (MgI ₂₎ metal halides and barium perchlorate, such as (Ba (ClO _{4) 2)} or magnesium perchlorate (Mg (ClO _{4) 2)} may comprise at least one of the metal chlorite and the like.

The desiccant may preferably have a purity of 95% or more. If the purity is less than 95%, not only the water absorption function is deteriorated but also the substance contained in the moisture absorbent acts as an impurity to cause defects of the adhesive film and may affect the organic electronic device, but the present invention is not limited thereto.

The moisture absorbent may be contained in an amount of 10 to 550 parts by weight, preferably 20 to 520 parts by weight, based on 100 parts by weight of the mixed resin. If the amount of the moisture absorber is less than 10 parts by weight based on 100 parts by weight of the mixed resin, the durability of the organic electronic device is lowered and the effect of removing water is remarkably lowered. The reliability of the organic electronic device is deteriorated due to the adhesion between the adhesive film and the organic electronic device and adhesion failure due to adhesion and lifting due to excessive volume expansion during moisture absorption, May occur.

On the other hand, the adhesive composition of the present invention may further include at least one of a curing agent and a UV initiator.

When the adhesive composition includes a curing agent, the curing agent may include 2 to 50 parts by weight, preferably 5 to 40 parts by weight, based on 100 parts by weight of the mixed resin. If the content of the curing agent is less than 2 parts by weight, the desired gelation rate and modulus can not be achieved, and the elasticity may be deteriorated. When the curing agent is contained in an amount exceeding 50 parts by weight, , A problem of deterioration of adhesion due to lowering of wettability may occur.

The curing agent may include any material that can be used usually as a curing agent, and may include a material capable of securing sufficient crosslinking density of the adhesive film by acting as a crosslinking agent, and more preferably, Based curing agent and an acrylate-based curing agent.

The curing agent may have a weight average molecular weight of 100 to 1500, and preferably a weight average molecular weight of 200 to 1300. If the weight average molecular weight of the curing agent is less than 100, the adhesion of the panel to the substrate may deteriorate due to the increase of the hardness and the outgassing of the unreacted curing agent may occur. If the weight average molecular weight exceeds 1500, The mechanical properties may be deteriorated due to the increase of the softness.

When the adhesive composition of the present invention contains a UV initiator, the UV initiator may be contained in an amount of 0.1 to 10 parts by weight, preferably 0.5 to 8 parts by weight, based on 100 parts by weight of the mixed resin. If the UV initiator is contained in an amount of less than 0.1 part by weight, heat resistance due to poor UV curing may be poor. If the UV curing initiator is contained in an amount exceeding 10 parts by weight, heat resistance may be poor due to a decrease in curing density.

The UV initiator may include, without limitation, as long as it is conventionally used as a UV initiator, and is preferably monoacyl phosphine, bisacyl phosphine,? -Hydroxyketone ), alpha -aminoketone, phenylglyoxylate, benzyldimethyl-ketal, and the like.

Meanwhile, the viscosity of the adhesive composition of the present invention may be 100,000 to 300,000 Pa · s (50 ° C), and preferably 120,000 to 280,000 Pa · s (50 ° C). If the viscosity of the adhesive composition of the present invention is less than 100,000 Pa 占 퐏 (50 占 폚), the processability may become poor due to an increase in the tack, so that the release film may not be peeled off. (50 DEG C), there may occur a problem that the adhesive strength with the substrate is lowered due to a decrease in the tack.

The viscosity may be a viscosity measured by a conventional viscosity measuring method. Preferably, the sample is laminated to a thickness of 800 to 900 占 퐉, and is formed into a circular shape having a diameter of 8 mm. Thereafter, a viscosity measuring instrument (ARES-G2, TA) The sample can be placed on the plate and measured. At this time, the measurement conditions can be measured with a 5% strain, an axial force of 0.05 N, a sensitivity of 0.005 N, 1 rad / s, and -5 to 130 ° C., The measurement may be started under the above conditions after adjustment of the gap and sample stabilization with an Axial Force of 0.5 N, a sensitivity of 0.05 N, but is not limited thereto.

Meanwhile, the present invention provides an adhesive film for an organic electronic device encapsulant, which comprises an adhesive layer formed by including the above-mentioned adhesive composition of the present invention.

1 is a cross-sectional view of an adhesive film for an organic electronic device encapsulant according to a preferred embodiment of the present invention, wherein the adhesive film 10 for an organic electronic device encapsulant of the present invention includes an adhesive layer 15, And a base film (13, 14) such as a release film formed on the top and / or bottom of the base film (13, 14). The base film serves to support and protect the adhesive film 10 for the organic electronic device encapsulant.

The adhesive layer 15 of the present invention may be formed to include a mixed resin 15b, a tackifier, and a moisture absorbent 15a.

First, the mixed resin 15b may include a first adhesive resin and a second adhesive resin, and the first adhesive resin and the second adhesive resin may be mixed in a weight ratio of 1: 0.1-10, preferably 1: 1 to 9 Weight ratio, more preferably in a weight ratio of 1: 1.1 to 5. If the weight ratio of the first adhesive resin and the second adhesive resin is less than 1: 0.1, the reliability may be deteriorated. If the weight ratio is more than 1: 10, the elasticity may be lowered.

The first adhesive resin may include a random copolymer obtained by copolymerizing ethylene, propylene and a diene-based compound. At this time, ethylene and propylene can be randomly copolymerized in a weight ratio of 1: 0.3 to 1.4, preferably 1: 0.5 to 1.2. If the weight ratio of ethylene and propylene to be copolymerized is less than 1: 0.3, it may lead to poor adhesion of the panel due to the increase of modulus and hardness, a problem of deteriorating the adhesive strength with the base material and the property at low temperature, And if the weight ratio exceeds 1: 1.4, the panel may be deflected due to modulus and hardness lowering, and deterioration of the mechanical properties may be caused by deterioration of the mechanical properties of the product. If the weight ratio of the moisture absorber There is a problem that the reliability is lowered due to difficulty in completing high-level operations.

The diene compound may be contained in an amount of 2 to 15% by weight, preferably 7 to 11% by weight based on the total weight of the copolymerized random copolymer of ethylene, propylene and a diene compound. If the content of the diene compound is less than 2% by weight, the modulus may be lowered due to a low curing rate and a curing density, which may cause a problem of panel deflection and may deteriorate the heat resistance. Due to the expansion of the moisture absorbent, If the content is more than 15% by weight, a problem of poor adhesion due to lack of wetting due to high curing density, low compatibility with resins, deterioration of panel adhesion due to high modulus, And may cause a phenomenon.

The first adhesive resin may have a weight average molecular weight of 30,000 to 1,550,000, and preferably a weight average molecular weight of 40,000 to 1,500,000. If the weight average molecular weight of the first adhesive resin is less than 30,000, panel shrinkage may occur due to a decrease in gelation rate and modulus, heat resistance may be lowered, reliability of the hygroscopic agent may decrease, Mechanical properties may be deteriorated. If the weight average molecular weight exceeds 1,550,000, adhesion to the substrate may be deteriorated due to a decrease in wettability, and adhesiveness to the panel may be deteriorated due to increase in gelation rate and modulus.

The second adhesive resin may include a compound represented by the following formula (1).

[Chemical Formula 1]

In Formula 1, R ¹ is a hydrogen atom, a straight chain alkenyl group having 3 to 10 carbon atoms or a branched alkenyl group having 4 to 10 carbon atoms, preferably R ¹ is a hydrogen atom, a straight chain alkenyl group having 4 to 8 carbon atoms, To C8. ≪ / RTI >

The reliability can be further improved by the fact that R ^{1 in the general} formula (1) is a hydrogen atom, a straight-chain alkenyl group having 3 to 10 carbon atoms or a branched alkenyl group having 4 to 10 carbon atoms.

In the above formula (1), n is a rational number satisfying a weight average molecular weight of 30,000 to 1,550,000, preferably a rational number satisfying a weight average molecular weight of 40,000 to 1,500,000. If the weight average molecular weight is less than 30,000, panel shrinkage may occur due to modulus reduction, heat resistance may be lowered, reliability of the moisture absorbent may be lowered, mechanical properties may be deteriorated, , Lifting phenomenon with the substrate due to volume expansion of the moisture absorbent due to the lowering of elasticity may occur. On the other hand, if the weight average molecular weight exceeds 1,550,000, the adhesion to the substrate may be deteriorated due to the lowering of the wettability, and the adhesion to the panel may deteriorate as the modulus increases.

Next, the tackifier is not particularly limited as long as it is a pressure-sensitive adhesive resin commonly used in an adhesive film for an organic electronic device encapsulant, and is preferably a hydrogenated petroleum resin, a hydrogenated rosin resin, a hydrogenated rosin ester resin, a hydrogenated terpene resin, A terpene phenol resin, a polymerized rosin resin, and a polymerized rosin ester resin.

The tackifier contained in the adhesive layer 15 of the present invention may contain 50 to 300 parts by weight, preferably 80 to 280 parts by weight, based on 100 parts by weight of the mixed resin 15b. If less than 50 parts by weight of the tackifier is added to 100 parts by weight of the mixed resin, the moisture resistance may be poor. If the tackifier is more than 300 parts by weight, durability and moisture resistance due to the brittleness of the adhesive layer may deteriorate There may be a problem.

Next, the moisture absorber 15a can be included without limitation as long as it is an encapsulant commonly used in packaging of organic electronic devices, and preferably a moisture absorber containing a zeolite, titania, zirconia or montmorillonite as a component, a metal salt and a metal oxide And more preferably, it may include a metal oxide, and still more preferably, it may include calcium oxide (CaO) among the metal oxides.

Metal oxides such as silica (SiO _2), alumina (Al ₂ O _3), lithium oxide (Li ₂ O), sodium (Na2O), barium oxide (BaO), magnesium calcium oxide (CaO) or oxide (MgO) oxide Metal oxides, organic metal oxides, and phosphorus pentoxide (P ₂ O ₅ ).

Metal salt is lithium sulfate (Li ₂ SO _4), sodium sulfate (Na ₂ SO _4), calcium sulfate (CaSO _4), magnesium sulfate (MgSO _4), cobalt sulfate (CoSO _4), sulfate, gallium (Ga ₂ (SO _{4) 3} ), titanium sulfate (Ti (SO _{4) 2)} or nickel sulfate (NiSO _4), such as the sulphate, calcium chloride (CaCl _2), magnesium chloride (MgCl _2), strontium chloride (SrCl _2), chloride, yttrium (YCl _3), copper chloride (CuCl _2), cesium fluoride (CsF), fluoride tantalum (TaF _5), fluoride, niobium (NbF _5), lithium bromide (LiBr), calcium bromide (CaBr _2), bromide, cesium (CeBr _3), bromide, selenium ( SeBr _4), bromide, vanadium (VBr _3), magnesium bromide (MgBr _2), barium iodide (BaI _2), or magnesium iodide (MgI ₂₎ metal halides and barium perchlorate, such as (Ba (ClO _{4) 2)} or magnesium perchlorate (Mg (ClO _{4) 2)} may comprise at least one of the metal chlorite and the like.

The desiccant 15a may preferably have a purity of 95% or more. If the purity is less than 95%, not only the water absorption function is deteriorated but also the substance contained in the moisture absorbent acts as an impurity to cause defects of the adhesive film and may affect the organic electronic device, but the present invention is not limited thereto.

The moisture absorbent 15a contained in the adhesive layer 15 of the present invention may contain 10 to 550 parts by weight, preferably 20 to 520 parts by weight, based on 100 parts by weight of the mixed resin 15b. If the amount of the moisture absorber is less than 10 parts by weight based on 100 parts by weight of the mixed resin, the durability of the organic electronic device is lowered and the effect of removing water is remarkably lowered. The reliability of the organic electronic device is deteriorated due to the adhesion between the adhesive film and the organic electronic device and adhesion failure due to adhesion and lifting due to excessive volume expansion during moisture absorption, May occur.

On the other hand, the adhesive layer 15 of the present invention may further include at least one of a curing agent and a UV initiator.

When the curing agent is contained in the adhesive layer 15 of the present invention, the curing agent may include 2 to 50 parts by weight, preferably 5 to 40 parts by weight, based on 100 parts by weight of the mixed resin. If the content of the curing agent is less than 2 parts by weight, the desired gelation rate and modulus can not be achieved, and the elasticity may be deteriorated. When the curing agent is contained in an amount exceeding 50 parts by weight, , A problem of deterioration of adhesion due to lowering of wettability may occur.

The curing agent may include any material that can be used usually as a curing agent, and may include a material capable of securing sufficient crosslinking density of the adhesive film by acting as a crosslinking agent, and more preferably, Based curing agent and an acrylate-based curing agent.

The curing agent may have a weight average molecular weight of 100 to 1500, and preferably a weight average molecular weight of 200 to 1300. If the weight average molecular weight of the curing agent is less than 100, the adhesion of the panel to the substrate may deteriorate due to the increase of the hardness and the outgassing of the unreacted curing agent may occur. If the weight average molecular weight exceeds 1500, The mechanical properties may be deteriorated due to the increase of the softness.

When the UV initiator is included in the adhesive layer 15 of the present invention, the amount of the UV initiator may be 0.1 to 10 parts by weight, preferably 0.5 to 8 parts by weight, based on 100 parts by weight of the mixed resin. If the UV initiator is contained in an amount of less than 0.1 part by weight, heat resistance due to poor UV curing may be poor. If the UV curing initiator is contained in an amount exceeding 10 parts by weight, heat resistance may be poor due to a decrease in curing density.

The UV initiator may include, without limitation, as long as it is conventionally used as a UV initiator, and is preferably monoacyl phosphine, bisacyl phosphine,? -Hydroxyketone ), alpha -aminoketone, phenylglyoxylate, benzyldimethyl-ketal, and the like.

On the other hand, the adhesive layer 15 included in the adhesive film 10 for an organic electronic device encapsulant according to the present invention has a viscosity of 100,000 to 300,000 Pa · s (50 ° C), preferably a viscosity of 120,000 to 280,000 Pa · s Lt; 0 > C). If the viscosity of the adhesive layer 15 is less than 100,000 Pa 占 퐏 (50 占 폚), the processability may become poor due to an increase in the tack, so that the releasing film may not be peeled off and a viscosity of 300,000 Pa.s 50 deg. C), there may arise a problem that the adhesive strength with the substrate is lowered due to the decrease in the tack.

The viscosity may be a viscosity measured by a conventional viscosity measuring method. Preferably, the sample is laminated to a thickness of 800 to 900 占 퐉, and is formed into a circular shape having a diameter of 8 mm. Thereafter, a viscosity measuring instrument (ARES-G2, TA) The sample can be placed on the plate and measured. At this time, the measurement conditions can be measured with a 5% strain, an axial force of 0.05 N, a sensitivity of 0.005 N, 1 rad / s, and -5 to 130 ° C., The measurement may be started under the above conditions after adjustment of the gap and sample stabilization with an Axial Force of 0.5 N, a sensitivity of 0.05 N, but is not limited thereto.

On the other hand, when the adhesive layer 15 having a single-layer structure is provided, the adhesive film 10 for an organic electronic device encapsulant of the present invention has a glass adhesion of 1500 gf / 25 mm or more, preferably 1600 gf / 25 mm or more.

[Measurement method 1]

An adhesive force measuring tape 7475 (TESA) was laminated on the upper surface of the adhesive film through a hand roller (2Kg Hand Roller), and the sample was cut into a width of 25 mm and a length of 120 mm. , And the prepared sample was allowed to stand at room temperature for 30 minutes, and the glass adhesion was measured at a rate of 300 mm / min.

When the single-layer adhesive layer 15 is provided, the adhesive film 10 for an organic electronic device encapsulant of the present invention has a metal adhesive strength of 1000 gf / 25 mm or more, preferably 1100 gf / 25 mm or more.

[Measurement method 2]

The upper surface of the adhesive film was laminated to an 80 占 퐉 -thick Ni alloy at 80 占 폚, and an adhesive force measuring tape 7475 (TESA) was laminated on the adhesive film through a hand roller (2Kg Hand Roller) After cutting the sample, the prepared sample is allowed to stand at room temperature for 30 minutes, and the metal adhesion is measured at a speed of 300 mm / min.

As the adhesive force measured according to the above-mentioned Measuring Method 1 and Measuring Method 2 satisfies the above range, peeling of the adhesive film may be significantly deteriorated when applied to an organic electronic device.

According to a preferred embodiment of the present invention, as shown in FIG. 2, the adhesive film 10 for an organic electronic device encapsulant according to the present invention has a multilayer structure of a first adhesive layer 11 and a first adhesive layer 11 And a second adhesive layer 12 formed on one surface.

At this time, the adhesive film 10 for an organic electronic device encapsulant of the present invention may further include a base film 14 such as a release film formed under the first adhesive layer 11, And a base film 13 such as a release film formed thereon.

The first adhesive layer 11 may be formed to include a first mixed resin 11b, a tackifier and a first moisture absorber 11a as a layer directly contacting an organic electronic device (not shown). At this time, the first mixed resin 11b may include a first adhesive resin and a second adhesive resin, and the tackifier may include a first tackifier, and further includes a second tackifier .

The second adhesive layer 12 may include a second mixed resin 12b, a tackifier, and a second moisture absorbent 12a. At this time, the second mixed resin 12b may include a first adhesive resin and a second adhesive resin, and the tackifier may include a first tackifier.

First, the first adhesive layer 11 will be described as follows.

The first adhesive resin and the second adhesive resin of the first adhesive layer may include a first adhesive resin and a second adhesive resin, The first adhesive resin and the second adhesive resin.

The first adhesive resin and the second adhesive resin of the first mixed resin 11b are contained in a weight ratio of 1: 0.1 to 10, preferably 1: 1 to 9, more preferably 1: 1.1 to 5 can do. If the weight ratio of the first adhesive resin and the second adhesive resin is less than 1: 0.1, the reliability may be deteriorated. If the weight ratio is more than 1: 10, the elasticity of the adhesive layer may be deteriorated.

The tackifier of the first adhesive layer 11 may comprise a first tackifier and may further comprise a second tackifier. The first tackifier and the second tackifier may each independently include any tackifier that is usually used in an adhesive film for an electronic electronic device encapsulant, and preferably a tackifier capable of improving reliability And more preferably at least one selected from a hydrogenated petroleum resin, a hydrogenated rosin resin, a hydrogenated rosin ester resin, a hydrogenated terpene resin, a hydrogenated terpene phenol resin, a polymerized rosin resin and a polymerized rosin ester resin And more preferably a hydrogenated petroleum resin having a different softening point. For example, when the softening point includes a hydrogenated petroleum resin, the softening point of the first tackifier may be smaller than the softening point of the second tackifier, but is not limited thereto.

When the first adhesive agent and the second adhesive agent of the first adhesive layer 11 comprise a hydrogenated petroleum resin and the first tackifier contains a hydrogenated petroleum resin that is smaller than the softening point of the second tackifier, : 0.5 to 1.5, preferably in a weight ratio of 1: 0.6 to 1.4. If the weight ratio of the first tackifier and the second tackifier is less than 1: 0.5, the heat resistance may deteriorate. If the weight ratio is more than 1: 1.5, the adhesive strength and the wettability may deteriorate, Problems can arise.

The tackifier of the first adhesive layer 11 may include 50 to 300 parts by weight, preferably 80 to 280 parts by weight based on 100 parts by weight of the first mixed resin 11b of the first adhesive layer 11. [ If the tackifier is contained in an amount of less than 50 parts by weight with respect to 100 parts by weight of the first mixed resin, the moisture resistance may be poor. If the tackifier is contained in excess of 300 parts by weight, ) May have a problem of deteriorating durability and moisture resistance.

The first moisture absorber (11a) of the first adhesive layer (11) can be used without limitation as long as it is a material which can be usually used as a moisture absorber. Silica can be preferably used. The use of silica as the first moisture absorber (11a) provides excellent moisture removal performance, can prevent separation of the organic electronic device and the sealing material, and can significantly increase the durability of the organic electronic device.

The first moisture absorber 11a of the first adhesive layer 11 preferably has a BET specific surface area of 2 to 20 m ² / g, preferably a BET specific surface area of 3 to 14 m ² / g, more preferably a BET specific surface area of 4 To 8 m < ² > / g. The specific surface area was measured using the BET method. Specifically, a sample of 1 g of the first moisture absorber was added to the tube, and measurement was carried out at -195 ° C. using ASAP2020 (Micromeritics, USA) without pretreatment. The average value can be obtained by measuring three times for the same sample. If the BET specific surface area of the first moisture absorber 11a is more than 20 m ² / g, not only the adhesive strength with the substrate decreases but also the resin flow is lowered, resulting in poor adhesion. Also, when the surface is rough or porous, the BET specific surface area may become large, and panel damage may occur due to surface roughness. Therefore, the first moisture absorber of the present invention can exhibit a high sphericity by having a low BET specific surface area.

The first moisture absorbent 11a of the first adhesive layer 11 may be contained in an amount of 1 to 40 parts by weight, preferably 5 to 35 parts by weight, based on 100 parts by weight of the first mixed resin 11b of the first adhesive layer 11 have. If the amount of the first moisture absorber (11a) is less than 1 part by weight, the desired effect of removing water from the desired first adhesive layer can not be attained and the durability of the organic electronic device may deteriorate. The reliability of the organic electronic device may be deteriorated due to adhesion failure such as adhesive strength between the adhesive film and the organic electronic device and adhesive force due to lack of wettability.

On the other hand, the first adhesive layer 11 of the present invention may further include at least one of a curing agent and a UV initiator.

When the curing agent is contained in the first adhesive layer 11, the curing agent may include 2 to 30 parts by weight, preferably 5 to 25 parts by weight, based on 100 parts by weight of the first mixed resin. If the content of the curing agent is less than 2 parts by weight, the desired gelation rate and modulus can not be achieved, and the elasticity may be deteriorated. When the curing agent is contained in an amount exceeding 30 parts by weight, , A problem of deterioration of adhesion due to lowering of wettability may occur.

The curing agent may include any material that can be used usually as a curing agent, and may include a material capable of securing sufficient crosslinking density of the adhesive film by acting as a crosslinking agent, and more preferably, Based curing agent and an acrylate-based curing agent.

The curing agent may have a weight average molecular weight of 100 to 1500, and preferably a weight average molecular weight of 200 to 1300. If the weight average molecular weight of the curing agent is less than 100, the adhesion of the panel to the substrate may deteriorate due to the increase of the hardness and the outgassing of the unreacted curing agent may occur. If the weight average molecular weight exceeds 1500, The mechanical properties may be deteriorated due to the increase of the softness.

When the UV initiator is included in the first adhesive layer 11 of the present invention, the amount of the UV initiator may be 0.1 to 5 parts by weight, preferably 0.5 to 4 parts by weight, based on 100 parts by weight of the first mixed resin. If the UV initiator is contained in an amount of less than 0.1 parts by weight, heat resistance may be poor due to poor UV curing. If the UV curing agent is added in an amount exceeding 5 parts by weight, heat resistance may be poor due to a decrease in curing density.

The UV initiator may include, without limitation, as long as it is conventionally used as a UV initiator, and is preferably monoacyl phosphine, bisacyl phosphine,? -Hydroxyketone ), alpha -aminoketone, phenylglyoxylate, benzyldimethyl-ketal, and the like.

On the other hand, the adhesive layer 15 included in the adhesive film 10 for an organic electronic device encapsulant according to the present invention has a viscosity of 100,000 to 300,000 Pa · s (50 ° C), preferably a viscosity of 120,000 to 280,000 Pa · s Lt; 0 > C). If the viscosity of the adhesive layer 15 is less than 100,000 Pa 占 퐏 (50 占 폚), the processability may become poor due to an increase in the tack, so that the releasing film may not be peeled off and a viscosity of 300,000 Pa.s 50 deg. C), there may arise a problem that the adhesive strength with the substrate is lowered due to the decrease in the tack.

The viscosity may be a viscosity measured by a conventional viscosity measuring method. Preferably, the sample is laminated to a thickness of 800 to 900 占 퐉, and is formed into a circular shape having a diameter of 8 mm. Thereafter, a viscosity measuring instrument (ARES-G2, TA) The sample can be placed on the plate and measured. At this time, the measurement conditions can be measured with a 5% strain, an axial force of 0.05 N, a sensitivity of 0.005 N, 1 rad / s, and -5 to 130 ° C., The measurement may be started under the above conditions after adjustment of the gap and sample stabilization with an Axial Force of 0.5 N, a sensitivity of 0.05 N, but is not limited thereto.

On the other hand, when the adhesive layer 15 having a single-layer structure is provided, the adhesive film 10 for an organic electronic device encapsulant of the present invention has a glass adhesive strength of 1500 gf / 25 mm or more, preferably 1600 gf / 25 mm or more.

[Measurement method 2]

An adhesive force measuring tape 7475 (TESA) was laminated on the upper surface of the adhesive film through a hand roller (2Kg Hand Roller), and the sample was cut into a width of 25 mm and a length of 120 mm. , And the prepared sample was allowed to stand at room temperature for 30 minutes, and the glass adhesion was measured at a rate of 300 mm / min.

When the single-layer adhesive layer 15 is provided, the adhesive film 10 for an organic electronic device encapsulant of the present invention has a metal adhesive strength of 1000 gf / 25 mm or more, preferably 1100 gf / 25 mm or more.

[Measuring method 3]

The upper surface of the adhesive film was laminated to an 80 占 퐉 -thick Ni alloy at 80 占 폚, and an adhesive force measuring tape 7475 (TESA) was laminated on the adhesive film through a hand roller (2Kg Hand Roller) After cutting the sample, the prepared sample is allowed to stand at room temperature for 30 minutes, and the metal adhesion is measured at a speed of 300 mm / min.

When the adhesive force measured according to the measurement method 2 and the measurement method 3 satisfies the above range, peeling of the adhesive film may be significantly deteriorated when applied to an organic electronic device.

Further, according to a preferred embodiment of the present invention, as shown in FIG. 2, the adhesive film 10 for an organic electronic device encapsulant of the present invention includes a first adhesive layer 11 and a first adhesive layer 11 And a second adhesive layer 12 formed on one surface.

At this time, the adhesive film 10 for an organic electronic device encapsulant of the present invention may further include a base film 14 such as a release film formed under the first adhesive layer 11, And a base film 13 such as a release film formed thereon.

The first adhesive layer 11 may be formed to include a first mixed resin 11b, a tackifier and a first moisture absorber 11a as a layer directly contacting an organic electronic device (not shown). At this time, the first mixed resin 11b may include a first adhesive resin and a second adhesive resin, and the tackifier may include a first tackifier, and further includes a second tackifier .

The second adhesive layer 12 may include a second mixed resin 12b, a tackifier, and a second moisture absorbent 12a. At this time, the second mixed resin 12b may include a first adhesive resin and a second adhesive resin, and the tackifier may include a first tackifier.

First, the first adhesive layer 11 of the present invention will be described below.

The first adhesive resin and the second adhesive resin of the first adhesive layer may include a first adhesive resin and a second adhesive resin, The first adhesive resin and the second adhesive resin.

The first adhesive resin and the second adhesive resin of the first mixed resin 11b are contained in a weight ratio of 1: 0.1 to 10, preferably 1: 1 to 9, more preferably 1: 1.1 to 5 can do. If the weight ratio of the first adhesive resin and the second adhesive resin is less than 1: 0.1, the reliability may be deteriorated. If the weight ratio is more than 1: 10, the elasticity may be lowered.

The tackifier of the first adhesive layer 11 may comprise a first tackifier and may further comprise a second tackifier. The first tackifier and the second tackifier may each independently include any tackifier that is usually used in an adhesive film for organic electronic devices, and preferably a tackifier capable of improving reliability And more preferably at least one selected from a hydrogenated petroleum resin, a hydrogenated rosin resin, a hydrogenated rosin ester resin, a hydrogenated terpene resin, a hydrogenated terpene phenol resin, a polymerized rosin resin and a polymerized rosin ester resin , And more preferably a hydrogenated petroleum resin having a different softening point. For example, when the softening point includes a hydrogenated petroleum resin, the softening point of the first tackifier may be smaller than the softening point of the second tackifier, but is not limited thereto.

When the first adhesive agent and the second adhesive agent of the first adhesive layer 11 comprise a hydrogenated petroleum resin and the first tackifier contains a hydrogenated petroleum resin that is smaller than the softening point of the second tackifier, : 0.5 to 1.5, preferably in a weight ratio of 1: 0.6 to 1.4. If the weight ratio of the first tackifier and the second tackifier is less than 1: 0.5, the heat resistance may deteriorate. If the weight ratio is more than 1: 1.5, the adhesive strength and the wettability may deteriorate, Problems can arise.

The tackifier of the first adhesive layer 11 may include 50 to 300 parts by weight, preferably 80 to 280 parts by weight based on 100 parts by weight of the first mixed resin 11b of the first adhesive layer 11. [ If the tackifier is contained in an amount of less than 50 parts by weight with respect to 100 parts by weight of the first mixed resin, the moisture resistance may be poor. If the tackifier is contained in excess of 300 parts by weight, ) May have a problem of deteriorating durability and moisture resistance.

The first moisture absorber (11a) of the first adhesive layer (11) can be used without limitation as long as it is a material which can be usually used as a moisture absorber. Silica can be preferably used. The use of silica as the first moisture absorber (11a) provides excellent moisture removal performance, can prevent separation of the organic electronic device and the sealing material, and can significantly increase the durability of the organic electronic device.

The first moisture absorber 11a of the first adhesive layer 11 preferably has a BET specific surface area of 2 to 20 m ² / g, preferably a BET specific surface area of 3 to 14 m ² / g, more preferably a BET specific surface area of 4 To 8 m < ² > / g. The specific surface area was measured using the BET method. Specifically, a sample of 1 g of the first moisture absorber was added to the tube, and measurement was carried out at -195 ° C. using ASAP2020 (Micromeritics, USA) without pretreatment. The average value can be obtained by measuring three times for the same sample. If the BET specific surface area of the first moisture absorber 11a is more than 20 m ² / g, not only the adhesive strength with the substrate decreases but also the resin flow is lowered, resulting in poor adhesion. Also, when the surface is rough or porous, the BET specific surface area may become large, and panel damage may occur due to surface roughness. Therefore, the first moisture absorber of the present invention can exhibit a high sphericity by having a low BET specific surface area.

The first moisture absorbent 11a of the first adhesive layer 11 may be contained in an amount of 1 to 40 parts by weight, preferably 5 to 35 parts by weight, based on 100 parts by weight of the first mixed resin 11b of the first adhesive layer 11 have. If the amount of the first moisture absorber (11a) is less than 1 part by weight, the desired effect of removing water from the desired first adhesive layer can not be attained and the durability of the organic electronic device may deteriorate. The reliability of the organic electronic device may be deteriorated due to adhesion failure such as adhesive strength between the adhesive film and the organic electronic device and adhesive force due to lack of wettability.

On the other hand, the first adhesive layer 11 of the present invention may further include at least one of a curing agent and a UV initiator.

When the curing agent is contained in the first adhesive layer 11 of the present invention, the curing agent may include 2 to 30 parts by weight, preferably 5 to 25 parts by weight, based on 100 parts by weight of the first mixed resin. If the content of the curing agent is less than 2 parts by weight, the desired gelation rate and modulus can not be achieved, and the elasticity may be deteriorated. When the curing agent is contained in an amount exceeding 30 parts by weight, , A problem of deterioration of adhesion due to lowering of wettability may occur.

The curing agent may include any material that can be used usually as a curing agent, and may include a material capable of securing sufficient crosslinking density of the adhesive film by acting as a crosslinking agent, and more preferably, Based curing agent and an acrylate-based curing agent.

The curing agent may have a weight average molecular weight of 100 to 1500, and preferably a weight average molecular weight of 200 to 1300. If the weight average molecular weight of the curing agent is less than 100, the adhesion of the panel to the substrate may deteriorate due to the increase of the hardness and the outgassing of the unreacted curing agent may occur. If the weight average molecular weight exceeds 1500, The mechanical properties may be deteriorated due to the increase of the softness.

When the UV initiator is included in the first adhesive layer 11 of the present invention, the amount of the UV initiator may be 0.1 to 5 parts by weight, preferably 0.5 to 4 parts by weight, based on 100 parts by weight of the first mixed resin. If the UV initiator is contained in an amount of less than 0.1 parts by weight, heat resistance may be poor due to poor UV curing. If the UV curing agent is added in an amount exceeding 5 parts by weight, heat resistance may be poor due to a decrease in curing density.

The UV initiator may include, without limitation, as long as it is conventionally used as a UV initiator, and is preferably monoacyl phosphine, bisacyl phosphine,? -Hydroxyketone ), alpha -aminoketone, phenylglyoxylate, benzyldimethyl-ketal, and the like.

Meanwhile, the first adhesive layer 11 included in the adhesive film for an organic electronic device encapsulant according to the present invention has a viscosity of 150,000 Pa · s (50 ° C) or less, preferably a viscosity of 10,000 to 130,000 Pa · s (50 ° C) Lt; / RTI > If the viscosity of the first adhesive layer 11 exceeds 150,000 Pa 占 퐏 (50 占 폚), there may occur a problem that the adhesive force with the substrate is lowered due to a decrease in the tack.

The viscosity may be a viscosity measured by a conventional viscosity measuring method. Preferably, the sample is laminated to a thickness of 800 to 900 占 퐉, and is formed into a circular shape having a diameter of 8 mm. Thereafter, a viscosity measuring instrument (ARES-G2, TA) The sample can be placed on the plate and measured. At this time, the measurement conditions can be measured with a 5% strain, an axial force of 0.05 N, a sensitivity of 0.005 N, 1 rad / s, and -5 to 130 ° C., The measurement may be started under the above conditions after adjustment of the gap and sample stabilization with an Axial Force of 0.5 N, a sensitivity of 0.05 N, but is not limited thereto.

Next, the second adhesive layer 12 formed on one surface of the first adhesive layer 11 of the present invention will be described.

The second mixed resin 12b of the second adhesive layer 12 may include a first adhesive resin and a second adhesive resin, and the first adhesive resin and the second adhesive resin may contain the above-mentioned mixed resin 15b, 1) and the same material as the second adhesive resin.

The first adhesive resin and the second adhesive resin of the second mixed resin 12b are contained in a weight ratio of 1: 0.1 to 10, preferably 1: 1 to 9, more preferably 1: 1.1 to 5 can do. If the weight ratio of the first adhesive resin and the second adhesive resin is less than 1: 0.1, the reliability may be deteriorated. If the weight ratio is more than 1: 10, the elasticity of the adhesive layer may be deteriorated.

The tackifier of the second adhesive layer 12 may comprise a first tackifier. The first tackifier may be any adhesive resin commonly used in an adhesive film for organic electronic devices, and may preferably include a hydrogenated petroleum resin, a hydrogenated rosin resin, a hydrogenated rosin ester resin, a hydrogenated terpene resin, a hydrogenated terpene phenol A resin, a polymerized rosin resin, and a polymerized rosin ester resin.

The first tackifier of the second adhesive layer 12 may contain 60 to 300 parts by weight, preferably 90 to 280 parts by weight, based on 100 parts by weight of the second mixed resin 12b of the second adhesive layer 12 . If the first tackifier is contained in an amount of less than 60 parts by weight with respect to 100 parts by weight of the second mixed resin, the moisture resistance may be poor. If the first tackifier is contained in excess of 300 parts by weight, There may arise a problem that the durability and the moisture resistance due to the brittleness decrease.

The second moisture absorber 12a of the second adhesive layer 12 can be used without limitation as long as it is a material which can be usually used as a moisture absorber. Preferably, the second moisture absorber 12a is a moisture absorber containing a component such as zeolite, titania, zirconia or montmorillonite, Oxides, more preferably metal oxides, and even more preferably calcium oxide (CaO) among the metal oxides.

Metal oxides such as silica (SiO _2), alumina (Al ₂ O _3), lithium oxide (Li ₂ O), sodium (Na2O), barium oxide (BaO), magnesium calcium oxide (CaO) or oxide (MgO) oxide Metal oxides, organic metal oxides, and phosphorus pentoxide (P ₂ O ₅ ).

Metal salt is lithium sulfate (Li ₂ SO _4), sodium sulfate (Na ₂ SO _4), calcium sulfate (CaSO _4), magnesium sulfate (MgSO _4), cobalt sulfate (CoSO _4), sulfate, gallium (Ga ₂ (SO _{4) 3} ), titanium sulfate (Ti (SO _{4) 2)} or nickel sulfate (NiSO _4), such as the sulphate, calcium chloride (CaCl _2), magnesium chloride (MgCl _2), strontium chloride (SrCl _2), chloride, yttrium (YCl _3), copper chloride (CuCl _2), cesium fluoride (CsF), fluoride tantalum (TaF _5), fluoride, niobium (NbF _5), lithium bromide (LiBr), calcium bromide (CaBr _2), bromide, cesium (CeBr _3), bromide, selenium ( SeBr _4), bromide, vanadium (VBr _3), magnesium bromide (MgBr _2), barium iodide (BaI _2), or magnesium iodide (MgI ₂₎ metal halides and barium perchlorate, such as (Ba (ClO _{4) 2)} or magnesium perchlorate (Mg (ClO _{4) 2)} may comprise at least one of the metal chlorite and the like.

The second moisture absorbent 12a may preferably have a purity of 95% or more. If the purity is less than 95%, not only the water absorption function is deteriorated but also the substance contained in the moisture absorbent acts as an impurity to cause defects of the adhesive film and may affect the organic electronic device, but the present invention is not limited thereto.

The second moisture absorbent 12a of the second adhesive layer 12 may be contained in an amount of 50 to 450 parts by weight, preferably 70 to 430 parts by weight, based on 100 parts by weight of the second mixed resin 12b of the second adhesive layer 12 have. If the second moisture absorbent 12a is contained in an amount less than 50 parts by weight, the desired adhesive film may not be obtained, for example, the water removing effect is significantly lowered. If the second adhesive layer 12a is contained in an amount exceeding 450 parts by weight, The adhesion between the first adhesive layer 11 and the second adhesive layer 12 and / or the adhesive layer 12 including the second adhesive layer 12 and the first adhesive layer 11 due to excessive volume expansion upon moisture absorption, There may be a problem that the moisture permeates rapidly between the organic electronic devices, thereby shortening the lifetime of the organic electronic device.

On the other hand, the shape and the particle diameter of the second moisture absorbent 12a of the second adhesive layer 12 are not limited, but may preferably be spherical with an average particle diameter of 5 nm to 8 m in order to improve the dispersibility in the second adhesive layer , Preferably a spherical shape having an average particle diameter of 10 nm to 6 탆. Accordingly, it is desirable to have a desired moisture removing function and thin the adhesive film.

On the other hand, the second adhesive layer 12 of the present invention may further include at least one of a curing agent and a UV initiator.

When the curing agent is contained in the second adhesive layer 12 of the present invention, the curing agent may include 10 to 40 parts by weight, preferably 12 to 35 parts by weight, based on 100 parts by weight of the second mixed resin. If the content of the curing agent is less than 10 parts by weight, the desired gelation rate and modulus can not be achieved, and the elasticity may be deteriorated. When the curing agent is contained in an amount exceeding 40 parts by weight, , A problem of deterioration of adhesion due to lowering of wettability may occur.

The curing agent may include any material that can be used usually as a curing agent, and may include a material capable of securing sufficient crosslinking density of the adhesive film by acting as a crosslinking agent, and more preferably, Based curing agent and an acrylate-based curing agent.

The curing agent may have a weight average molecular weight of 100 to 1500, and preferably a weight average molecular weight of 200 to 1300. If the weight average molecular weight of the curing agent is less than 100, the adhesion of the panel to the substrate may deteriorate due to the increase of the hardness and the outgassing of the unreacted curing agent may occur. If the weight average molecular weight exceeds 1500, The mechanical properties may be deteriorated due to the increase of the softness.

When the UV initiator is included in the second adhesive layer 12 of the present invention, the amount of the UV initiator may be 0.1 to 8 parts by weight, preferably 0.5 to 6 parts by weight, based on 100 parts by weight of the second mixed resin. If the UV initiator is contained in an amount of less than 0.1 parts by weight, heat resistance may be poor due to poor UV curing. If the UV curing agent is contained in an amount exceeding 8 parts by weight, heat resistance may be poor due to a decrease in the curing density.

The UV initiator may include, without limitation, as long as it is conventionally used as a UV initiator, and is preferably monoacyl phosphine, bisacyl phosphine,? -Hydroxyketone ), alpha -aminoketone, phenylglyoxylate, benzyldimethyl-ketal, and the like.

Meanwhile, the second adhesive layer 12 included in the adhesive film for an organic electronic device encapsulant according to the present invention has a viscosity of 200,000 Pa · s (50 ° C) or more, preferably a viscosity of 220,000 to 1,000,000 Pa · s (50 ° C) Lt; / RTI > If the viscosity of the second adhesive layer 12 is less than 200,000 Pa 占 퐏 (50 占 폚), there may arise a problem that the adhesive force with the substrate is lowered due to a decrease in the tack.

The viscosity may be a viscosity measured by a conventional viscosity measuring method. Preferably, the sample is laminated to a thickness of 800 to 900 占 퐉, and is formed into a circular shape having a diameter of 8 mm. Thereafter, a viscosity measuring instrument (ARES-G2, TA) The sample can be placed on the plate and measured. At this time, the measurement conditions can be measured with a 5% strain, an axial force of 0.05 N, a sensitivity of 0.005 N, 1 rad / s, and -5 to 130 ° C., The measurement may be started under the above conditions after adjustment of the gap and sample stabilization with an Axial Force of 0.5 N, a sensitivity of 0.05 N, but is not limited thereto.

On the other hand, in the case where the adhesive layer for a multilayer structure including the first adhesive layer 11 and the second adhesive layer 12 is provided, the adhesive film for the organic electronic device encapsulant of the present invention has an adhesive strength of 1500 gf / 25 mm or more, preferably 1600 gf / 25 mm or more.

[Measurement method 2]

An adhesive force measuring tape 7475 (TESA) was laminated on the upper surface of the adhesive film through a hand roller (2Kg Hand Roller), and the sample was cut into a width of 25 mm and a length of 120 mm. , And the prepared sample was allowed to stand at room temperature for 30 minutes, and the glass adhesion was measured at a rate of 300 mm / min.

When the adhesive film for the organic electronic device encapsulant of the present invention has a multilayer structure of adhesive layers including the first adhesive layer 11 and the second adhesive layer 12, gf / 25 mm or more, preferably 1100 gf / 25 mm or more.

[Measuring method 3]

The upper surface of the adhesive film was laminated to an 80 占 퐉 -thick Ni alloy at 80 占 폚, and an adhesive force measuring tape 7475 (TESA) was laminated on the adhesive film through a hand roller (2Kg Hand Roller) After cutting the sample, the prepared sample is allowed to stand at room temperature for 30 minutes, and the metal adhesion is measured at a speed of 300 mm / min.

When the adhesive force measured according to the measurement method 2 and the measurement method 3 satisfies the above range, peeling of the adhesive film may be significantly deteriorated when applied to an organic electronic device.

On the other hand, when the adhesive layer 15 having a single layer structure and the adhesive layer having a multilayer structure including the first adhesive layer 11 and the second adhesive layer 12 are included, the specifications such as the size and the thickness may vary depending on the purpose. The present invention is not particularly limited to this.

The multi-layered adhesive layer including the single-layered adhesive layer 15, the first adhesive layer 11 and the second adhesive layer 12 may be a dried adhesive layer or a cured adhesive layer.

As described above, when the adhesive layer of the present invention includes the first adhesive layer 11 and the second adhesive layer 12 formed on one surface of the first adhesive layer 11, the first adhesive layer 11 satisfies the following formula (1) May be 8.4 to 15.8%, preferably 9.68 to 14.52%, more preferably 10.89 to 13.31%. If the measured value according to the formula (1) of the first adhesive layer 11 is less than 8.4%, heat resistance may be deteriorated and resin overflow may occur. If the measured value exceeds 15.8% There is a possibility that the adhesive force is lowered.

[Equation 1]

Measured value (%) = 100 x S ₂ / S ₁

S ₁ is a 600 ㎛ thick adhesive layer, developed by ARES (Advanced Rheometric Expansion System) in a stress relaxation test mode using a parallel plate with a diameter of 8 mm and a vertical force of 200 gf at 85 ° C S ₂ is a value obtained by holding the state of applying the deformation to the adhesive film for 180 seconds and then measuring the stress value by applying a normal force to the adhesive film, It is a stress value.

In the second adhesive layer 12 of the present invention, the measured value according to Equation 1 may be 1 to 20%, preferably 7.32 to 10.98%, and more preferably 8.23 to 10.07%. If the measured value according to the formula (1) of the second adhesive layer 12 is less than 1%, the heat resistance may deteriorate and resin overflow may occur. If the measured value is more than 20%, the adhesive strength to the substrate (glass, May be deteriorated.

In the first adhesive layer 11 and the second adhesive layer 12 of the present invention, the deviation of the measured value according to Equation 1 is 11.6% or less, preferably 0.39 to 6.29%, more preferably 2.36 to 3.54% . If the deviation exceeds 11.6%, there may be a problem that the reliability due to shrinkage and / or expansion of the adhesive layer during the thermal process is deteriorated.

As described above, when the adhesive layer of the present invention includes the first adhesive layer 11 and the second adhesive layer 12 formed on one surface of the first adhesive layer 11, ~ 390) × 10 ³ Pa, tensile modulus, preferably a ^{(240 ~ 360) × 10 3} Pa of the tensile elastic modulus, more preferably (270-330) may have a tensile modulus × 10 ³ Pa in. If, the tensile modulus of the first adhesive layer (11) 210 × 10 ³ is less than if there may occur a problem in that durability is reduced, when it exceeds 390 × 10 ³ Pa substrate by volume expansion due to moisture and the reaction (glass, metal etc. And / or cracks may occur.

The second adhesive layer 12 preferably has a tensile modulus of elasticity of (1,400 to 2,600) × 10 ³ Pa, preferably a tensile modulus of elasticity of 1,600 to 2,400 × 10 ³ Pa, X 10 < ³ > Pa. If, a second adhesive layer 12 when the tensile modulus is less than 1,400 × 10 ^3, and may cause a problem that the durability is lowered, if it exceeds 2,600 × 10 ³ Pa substrate by volume expansion due to moisture and the reaction (glass, metal etc. And / or cracks may occur.

The first adhesive layer 11 and the second adhesive layer 12 of the present invention preferably have a variation in tensile modulus at 25 ° C of 2,390 × 10 ³ Pa or less, preferably 1,010 × 10 ³ Pa to 2,040 × 10 ³ Pa, And preferably 1,530 x 10 ³ Pa to 1,870 x 10 ³ Pa. If the deviation exceeds 2,390 x 10 < ³ > Pa, partial film breakage and cracking may occur due to shrinkage and / or expansion of the adhesive layer.

Further, the adhesive layer of the present invention can satisfy all of the following conditions (1) and (2).

≤7.16, 바람직하게는 5.37≤

≤6.92 일 수 있다.As the condition (1), 5.78?

? 7.16, preferably 5.37?

≪ / = 6.92.

≤5.6, 바람직하게는 4.28≤

≤5.35일 수 있다.Further, as the condition (2), 4.22?

? 5.6, preferably 4.28?

Lt; = 5.35.

In the above condition (1), a ₁ and a ₂ are a storage elastic modulus (Pa) and a loss elastic modulus (Pa) at 25 ° C, b ₁ and b ₂ are a storage elastic modulus (Pa) Pa).

이 5.28 미만이면 패널 처짐현상이 발생함에 따라 부피 팽창을 방지할 수 없는 문제가 발생할 수 있고, 7.16을 초과하면 외부충격에 의한 완충효과가 저하됨에 따라 내구성이 저하될 수 있다. If, in the above condition (1)

If it is less than 5.28, the panel bulge phenomenon may cause a problem that bulky bulge can not be prevented. If it is more than 7.16, the damping effect may be lowered because the buffering effect due to external impact is lowered.

이 4.22 미만이면 합착공정 중 오버 플로우(Over Flow)가 발생함에 따라 기포 발생 및/또는 신뢰성이 저하될 수 있고, 5.6을 초과하면 패널의 단차를 매꾸지 못함에 따라 점착력 저하 및/또는 층간 박리현상이 발생할 수 있다.If the above condition (2) is satisfied

Is less than 4.22, bubbling and / or reliability may be deteriorated due to overflow during the laminating process, and when it exceeds 5.6, it is difficult to cover the step of the panel, Can occur.

Further, the adhesive layer of the present invention can satisfy the following condition (3).

≤5.02, 바람직하게는 3.59≤

≤4.87일 수 있다.As the condition (3), 3.46?

≪ / = 5.02, preferably 3.59

? 4.87.

In the above condition (3), c ₁ and c ₂ are the storage elastic modulus (Pa) and loss elastic modulus (Pa) at 100, respectively.

이 3.46 미만이면 점착제의 흐름성으로 인해 내열성이 저하되는 문제가 발생할 수 있고, 5.02를 초과하면 젖음성 부족에 따른 점착력 저하 및 내열성이 저하되는 문제가 발생할 수 있다.If, in the above condition (3)

Is less than 3.46, the heat resistance may deteriorate due to the flowability of the pressure-sensitive adhesive, and when it is more than 5.02, there may arise a problem that the adhesiveness is lowered and the heat resistance is lowered due to insufficient wettability.

The adhesive layer of the present invention may have a storage modulus at 25 ° C of 7 x 10 ⁶ to 1.5 x 10 ⁸ Pa, preferably 8 x 10 ⁶ to 1 x 10 ⁸ Pa, satisfying the condition (1) ° C., the loss elastic modulus may be 10 ⁷ to 2 × 10 ⁸ Pa, preferably 1.2 × 10 ⁷ to 1.5 × 10 ⁸ Pa. If the storage elastic modulus at 25 ° C is less than 7 × 10 ⁶ Pa, the panel sagging phenomenon may occur and the volume expansion may not be prevented. If the storage modulus exceeds 1.5 × 10 ⁸ Pa, The durability may be lowered. If the loss elastic modulus at 25 DEG C is less than 10 < ⁷ > Pa, the panel sagging phenomenon may occur and the volume expansion may not be prevented. When the pressure loss exceeds 2 x 10 < ⁸ > Pa, The durability may be deteriorated.

The adhesive layer of the present invention may have a storage elastic modulus at 50 ° C of from 10 ⁶ to 1.5 x 10 ⁷ Pa, preferably from 1.2 x 10 ⁶ to 9 x 10 ⁶ Pa, satisfying the condition (2) The loss elastic modulus may be 8 x 10 ⁵ to 1.5 x 10 ⁷ Pa, preferably 9 x 10 ⁵ to 1 x 10 ⁷ Pa. If the storage elastic modulus at 50 ° C is less than 10 ⁶ Pa, bubbles and / or reliability may be lowered as overflow occurs during the laminating process. If the storage modulus exceeds 1.5 × 10 ⁷ Pa, If it does not, it may cause adhesion deterioration and / or delamination. If the loss modulus at 50 ° C. is less than 8 × 10 ⁵ Pa, bubbles and / or reliability may be reduced as the overflow occurs during the adhesion process. If the loss modulus exceeds 1.5 × 10 ⁷ Pa, If the steps are not formed, the adhesion may be deteriorated and / or delamination may occur.

The adhesive layer of the present invention may have a storage elastic modulus at 100 占 폚 of from 2 占⁰⁵ to 8 占⁰⁶ Pa, preferably from 3 占⁵ to 6 占⁰⁶ Pa, so as to satisfy the condition (3) ° C., the loss elastic modulus may be 5 × 10 ⁴ to 2 × 10 ⁶ Pa, preferably 6 × 10 ⁴ to 1.5 × 10 ⁶ Pa. If the storage elastic modulus at 100 is less than 2 x 10 < ⁵ > Pa, the heat resistance may deteriorate due to the flowability of the pressure sensitive adhesive. If the storage modulus exceeds 8 x 10 < ⁶ > Pa, May occur. If the loss elastic modulus at 100 DEG C is less than 5 x 10 < ⁴ > Pa, the heat resistance may deteriorate due to the flowability of the pressure-sensitive adhesive, and if it exceeds 2 x 10 < ⁶ > Pa, Problems can arise.

On the other hand, the adhesive layer of the present invention may have a gel content of 45 to 95% as measured by the following formula (2), preferably a gelation rate of 50 to 90%.

&Quot; (2) "

The adhesive layer dried in the above formula (2) was cut into an adhesive layer having a size of 100 mm x 25 mm. The adhesive layer was cut into a vial bottle containing 5 g of toluene and allowed to stand for 15 minutes. The adhesive layer was filtered, The filtered adhesive layer was dried by hot air at 160 ° C for 30 minutes to remove the toluene completely.

If the gelation rate of the adhesive layer is less than 45%, panel sagging occurs, expansion due to moisture absorption can not be prevented, and overflow occurs during the laminating process, so that bubble generation and / And the heat resistance may deteriorate due to the flowability of the pressure-sensitive adhesive. If the gelation rate of the adhesive layer exceeds 95%, the buffering effect due to the external impact may be lowered, and the durability may be deteriorated. If the step of the panel is not formed, the adhesive strength may decrease and / And there is a possibility that the adhesiveness and the heat resistance are deteriorated due to the lack of wettability.

Furthermore, the adhesive layer of the present invention can satisfy all of the following conditions (4) and (5) to solve such a problem.

, 바람직하게는 10.15≤

≤80.2일 수 있고, 조건 (5)로써, 0.01≤

≤0.9, 바람직하게는 0.02≤

≤0.6일 수 있다.As the condition (4), 8?

, Preferably 10 <

80.2, and as the condition (5), 0.01?

? 0.9, preferably 0.02?

Lt; / = 0.6.

Here, d represents the thickness (占 퐉) of the adhesive layer, and e represents the average particle diameter (占 퐉) of the moisture absorber.

이 8 미만이면 유기전자장치 봉지재용 접착필름의 합착성이 저하될 수 있고, 접착층 표면에 흡습제가 돌출되는 문제가 발생할 수 있으며, 접착층 표면에서 묻어나오는 흡습제로 인하여 신뢰성이 저하될 수 있다. 또한, 만일 상기 조건 (5)에서

가 0.01 미만이면 접착층 표면에 흡습제가 묻어나오는 문제가 발생할 수 있고, 신뢰성 및 합착성이 저하될 수 있으며,

가 0.9를 초과하면 유기전자장치 봉지재용 접착필름의 합착성이 저하될 수 있고, 접착층 표면에 흡습제가 돌출되는 문제가 발생할 수 있다.If, in the condition (4)

Is less than 8, adhesion of the adhesive film for the organic electronic device encapsulant may be deteriorated, a problem that the moisture absorber protrudes on the surface of the adhesive layer may occur, and reliability may be lowered due to the moisture absorber sticking out from the surface of the adhesive layer. If the condition (5) is satisfied

Is less than 0.01, there is a problem that the moisture absorbent may come on the surface of the adhesive layer, and reliability and cohesiveness may be lowered,

Is more than 0.9, adhesion of the adhesive film for an organic electronic device encapsulant may be deteriorated, and a problem that the moisture absorber protrudes on the surface of the adhesive layer may occur.

At this time, the adhesive layer of the present invention may have a thickness of 8 to 85 탆, preferably 10 to 80 탆, so as to satisfy the above conditions (4) and (5). If the thickness of the adhesive layer is less than 8 mu m, the adhesion of the adhesive film for the organic electronic device encapsulant may be deteriorated and the moisture absorber may protrude from the surface of the adhesive layer. If the thickness exceeds 85 mu m, The reliability of the adhesive film may deteriorate.

On the other hand, the present invention includes an encapsulant for an organic electronic device including the above-mentioned adhesive film for an organic electronic encapsulant, and includes a light emitting device including the encapsulant for the organic electronic device.

The light emitting device includes a substrate, an organic electronic device formed on at least one side of the substrate, and an encapsulant for an organic electronic device according to the present invention for packaging the organic electronic device.

According to a preferred embodiment of the present invention, the light emitting device 100 of the present invention is formed by providing a single-layered adhesive layer 115 including a mixed resin 115b and a moisture absorbent 115a as shown in FIG. According to another preferred embodiment of the present invention, the light emitting device 100 of the present invention includes a first mixed resin 111b and a first moisture absorbent 111a including a first mixed resin 111b and a first moisture absorbent 111a as shown in FIG. 4, And a second adhesive layer 112 including an adhesive layer 111 and a second mixed resin 112b and a second moisture absorbent 112a.

The following description will be made with reference to the light emitting device 100 having the adhesive layer of the multi-layer structure shown in Fig.

A light emitting device 100 according to the present invention includes a substrate 101 and an organic electronic device 102 formed on at least one surface of the substrate 101. An organic electronic device 102 is formed on the substrate 101 and the organic electronic device 102, Encapsulants 111 and 112 are formed. The encapsulating material for the organic electronic device includes a first adhesive layer 111 including a first mixed resin 111b including a first adhesive resin and a second adhesive resin and a moisture absorbent 111a including silica; And a second adhesive layer 112 formed on one surface of the first adhesive layer and including a second mixed resin 112b including a first adhesive resin and a second adhesive resin and a moisture absorbent 112a.

The substrate 101 may preferably be a glass substrate, a quartz substrate, a sapphire substrate, a plastic substrate, and a flexible polymer film that can be bent.

The organic electronic device 102 formed on at least one surface of the substrate 101 is formed by sequentially forming an n-type semiconductor layer, an active layer, a p-type semiconductor layer, and an upper electrode on the substrate 102, Or may be formed by disposing on a substrate 101 after being manufactured through a separate substrate. A specific method of forming the organic electronic device 102 on the substrate 101 is not particularly limited in the present invention, and the organic electronic device 102 may include organic May be a light emitting diode.

Next, the encapsulant 111, 112 for the organic electronic device according to the present invention for packaging the organic electronic device 102, the specific method of the packaging can be carried out by a known conventional method, But the invention is not particularly limited. As a non-limiting example, a first adhesive layer 111 of an encapsulant 111, 112 for an organic electronic device is formed directly on an organic electronic device 102 formed on a substrate 101, Or by applying heat and / or pressure using a vacuum press or a vacuum laminator in the contacted state. In addition, heat can be applied to cure the adhesive layer, and in the case of an adhesive containing a photo-curable adhesive resin, the adhesive can be moved to a chamber to be irradiated with light to further cure.

Hereinafter, the present invention will be described with reference to the following examples. The following examples are provided to illustrate the invention, but the scope of the present invention is not limited by the following examples.

Preparation Example 1: Preparation of polyolefin-based mixed resin

A random copolymer (first adhesive resin) obtained by copolymerizing ethylene, propylene and a diene compound and a compound represented by the following formula (second adhesive resin) were mixed at a weight ratio of 1: 2.33 to prepare a polyolefin-based mixed resin.

The first adhesive resin was prepared by copolymerizing ethylene and propylene monomers at a weight ratio of 1: 0.85 and copolymerizing a diene compound in an amount of 9 wt% based on the total weight of the random copolymer. The diene compound was ethylidene norbornene ( ethylidene norbornene), which is a random copolymer having a weight average molecular weight of 500,000.

 [Chemical Formula 1]

In the formula (1), R ¹ is isoprene, and n is a rational number satisfying a weight average molecular weight of 400,000 of the compound represented by the formula (1).

The first adhesive resin and the second adhesive resin were each cooled at a rate of 10 ° C / min from the temperature of 200 ° C to -150 ° C, and the peak of the cooling curve of the heat flux measured by a differential scanning calorimetry (DSC) The crystallization temperature (Tc) was measured through analysis. The crystallization temperature of the first adhesive resin was not measured, and the second adhesive resin was measured at 120 ° C.

Comparative Preparation Example 1

A polyolefin-based mixed resin was prepared in the same manner as in Preparation Example 1.

However, a polyolefin-based mixed resin was produced using only the first adhesive resin prepared in Preparation Example 1, without using the second adhesive resin.

Comparative Preparation Example 2

A polyolefin-based mixed resin was prepared in the same manner as in Preparation Example 1.

However, a polyolefin-based mixed resin was produced using only the second adhesive resin prepared in Preparation Example 1, without using the first adhesive resin.

Example 1: Preparation of an adhesive film for an organic electronic device encapsulant

(1) First adhesive layer formation

In order to form the first adhesive layer, 80 parts by weight of a first tackifier (SU-90, manufactured by Kolon Industries) and 100 parts by weight of a second tackifier (first blending resin) were added to 100 parts by weight of the polyolefin- , 3 parts by weight of a UV initiator (irgacure TPO, Ciba), and 50 parts by weight of an acrylic resin (SU-100, Kolon Industries) having a weight average molecular weight of 226 as a curing agent, 24 parts by weight of phosphorus silicate were added and stirred. After the stirring was completed, the mixture was passed through a capsule filter to remove foreign matters. The mixture was applied to a heavy-weight anti-static type PET (RT81AS, SKCHass) having a thickness of 75 μm using a slot die coater and then dried at 120 ° C. to remove the solvent A first adhesive layer having a final thickness of 20 m was prepared.

(2) Formation of second adhesive layer

(SU-90, Kolon Industries) was added to 100 parts by weight of the polyolefin-based mixed resin (second mixed resin) prepared in Preparation Example 1 to form the second adhesive layer, , 17 parts by weight of an acrylate having a weight average molecular weight of 226 as a curing agent and having a weight average molecular weight of 226 (M200, Specialty Specialty Chemicals), 3 parts by weight of a UV initiator (irgacure TPO, Ciba) and 100 parts by weight of calcium oxide having an average particle diameter of 3 μm Followed by stirring.

After the stirring, the mixture was adjusted to a viscosity of 800 cps at 20 ° C., passed through a capsule filter to remove foreign substances, and applied to a light-release PET (RF02, SKCHass) having a thickness of 38 μm by a slot die coater. And the solvent was removed to prepare a second adhesive layer having a final thickness of 30 탆.

The first adhesive layer thus prepared was laminated so as to face the second adhesive layer and passed through a 70 占 폚 laminated roll to produce an adhesive film.

Examples 2 to 41 and Comparative Examples 1 to 5

The adhesive films of the following Tables 1 to 8 were prepared in the same manner as in Example 1 except that the weight average molecular weight of the first adhesive resin and the second adhesive resin, the content of the curing agent, the content of the UV initiator, .

Comparative Example 6

An adhesive film was prepared in the same manner as in Example 1.

An adhesive film was prepared using the polyolefin-based mixed resin prepared in Comparative Preparation Example 1, instead of the polyolefin-based mixed resin prepared in Preparative Example 1 used for the production of the first adhesive layer and the second adhesive layer.

Comparative Example 7

An adhesive film was prepared in the same manner as in Example 1.

An adhesive film was prepared using the polyolefin-based mixed resin prepared in Comparative Preparation Example 2 instead of the polyolefin-based mixed resin prepared in Preparative Example 1 used for the production of the first adhesive layer and the second adhesive layer.

<Experimental Example 1>

The following properties of the adhesive films prepared by the above Examples and Comparative Examples were measured and shown in Tables 1 to 9 below.

1. Evaluation of moisture penetration of adhesive film

After cutting the specimen to a size of 95mm × 95mm, remove the protective film from the 100mm × 100mm alkali-free glass, fit the specimen so that the specimen can be positioned 2.5mm from the edges of the four sides of the alkali-free glass, Using a roll laminator. After removing the remaining release film from the adhered specimen, another 100 mm × 100 mm non-alkali glass is covered and laminated with a vacuum laminator at 65 ° C. for 1 minute to prepare a sample bonded together without bubbles. The sample after the cementation is completed The length of water penetration in 1000 hour units in a reliability chamber set at 85 DEG C and 85% relative humidity was observed under a microscope.

2. Evaluation of volume expansion of adhesive film

The release film of the test piece was removed from the SUS plate having a thickness of 50 mu m cut to 30 mm x 20 mm and then attached using a roll laminator heated to about 65 deg. The attached specimens were cut with a knife in accordance with the SUS size and then attached to a 40 mm × 30 mm 0.7 T non-alkali glass using a roll laminator heated to 65 ° C. After confirming that the specimen adhered well between glass and SUS without voids, it was observed for 1,000 hours at a time interval of 100 hours in a reliability chamber set at 85 ° C and 85% relative humidity. Was observed through an optical microscope.

⊚ when the height change is less than 1 탆, ◎ when the height change is less than 1 to 3 탆 at the moisture absorbing portion, △ when the height change is less than 3 to 5 탆 at the moisture absorbing portion, And when the change is 5 占 퐉 or more, it is indicated by 占.

3. Evaluation of Heat Resistance of Adhesive Film

The specimen was cut into a size of 50 mm x 80 mm and the protective film of the specimen was removed. Then, the specimen was attached to a 60 mm x 150 mm 0.08T Ni alloy at 80 deg. C, Gap 1 mm, Speed 1 using a roll laminator. The liner film of the adhered specimen was removed and attached to a 30 mm x 70 mm 5T non-alkali glass at 80 ° C, Gap 1 mm, Speed 1 using a roll laminator. The specimen attached to the glass was fixed vertically to a chamber of 130 mm, and a weight of 1 kg was suspended to determine the flow of the adhesive.

In this case, the evaluation results are shown as O when there is no abnormality, and X when a little.

4. Evaluation of glass adhesion

Adhesive strength measurement tape 7475 (TESA) was laminated on the adhesive film on a 2 kg hand roller with respect to the adhesive films prepared according to Examples and Comparative Examples, and the sample was laminated with a tape having a width of 25 mm and a length of 120 After the laminate was laminated to an alkali-free glass at 80 DEG C, the sample was allowed to stand at room temperature for 30 minutes, and the glass adhesion was measured at a rate of 300 mm / min through a universal material tester (UTM) .

5. Evaluation of adhesion of metal

The adhesive film prepared according to Examples and Comparative Example was laminated to an 80 占 퐉 thick Ni alloy having a thickness of 80 占 퐉 at 80 占 폚 and laminated to an adhesive film tape 7475 (TESA) 25 mm and a length of 120 mm, the prepared sample was allowed to stand at room temperature for 30 minutes, and the metal adhesion was measured at a rate of 300 mm / min through a universal material testing machine (UTM).

<Experimental Example 2>

(Electron transport layer: NPD / thickness 800 A, light emitting layer Alq 3 / thickness 300 A, electron injection layer LiF / thickness 10 A, cathode Al + Liq / thickness 1,000 A) was deposited on the ITO patterned substrate, OLED unit specimens emitting green light were prepared after lamination of the adhesive films according to Examples and Comparative Examples at room temperature. The following properties of the specimens were evaluated and shown in Tables 1 to 9.

1. Evaluation of durability of organic light emitting device according to moisture penetration of adhesive film

The generation and / or growth of pixel shrinkage and dark spots in the light emitting part in each time period were observed in a time × 100 digital microscope under the environment of a temperature of 85 ° C. and a relative humidity of 85% The time required for pixel shrinkage to occur more than 50% and / or dark spot was measured.

◎ when pixel shrinkage occurs more than 50%, ◎ when dark spots are generated for more than 1,000 hours, 50% when pixel shrinkage occurs, and when dark spots are generated for less than 1000 hours to 800 hours, △ when the occurrence time of dark spot is less than 800 hours or more than 600 hours, 50% or more when the dark spot is generated, and × when the dark spot generation time is less than 600 hours.

2. Evaluation of durability of adhesive film

The specimens were observed for 1,000 hours at a time interval of 100 hours in a reliability chamber set at 85 ° C and 85% relative humidity, so that the interface separation between the organic electronic device and the adhesive film, the generation of bubbles in the adhesive film, To assess physical damage. And when the evaluation results are not good, any abnormality such as?, Separation of interfaces, cracks, generation of bubbles in the adhesive film, separation between adhesive layers, or the like occurs.

As can be seen from Tables 1 to 9 above,

Preferred first adhesive resin, the second adhesive resin molecular weight, R ^1, the first adhesive resin and a second adhesive resin weight ratio of the monomer content, the tackifier in the random copolymer of Formula 1 of claim content, moisture absorbent content of the curing agent of the present invention Examples 1 to 7, Example 9, Example 10, Example 13, Example 14, Example 17, Example 18, Example 21, and Example 22, which satisfied all of the content, the molecular weight of the curing agent, Example 25, Example 26, Example 29, Example 30, Example 33, Example 36, Example 39 and Example 41 are examples 8, 11 and 12 , Example 15, Example 16, Example 19, Example 20, Example 23, Example 24, Example 27, Example 28, Example 31, Example 32, Example 34, Example 35, Compared to Example 37, Example 38, Example 40, and Comparative Examples 1 to 5, the water permeation length was short and the volume expansion of the adhesive film was small There was no, the good and the durability evaluation results of the heat resistance and the organic light emitting element and the durability of the adhesive film excellent in the adhesive strength was excellent.

Specifically, Examples 1, 9, and 10, which satisfy the weight ratio of the first adhesive resin and the second adhesive resin, are efficient in removing and blocking moisture compared to Example 8 in which the weight ratio of the first adhesive resin and the second adhesive resin is unsatisfactory, The water removal and blocking efficiency was more efficient than that of Example 11, the water penetration length was short, and the durability of the adhesive film was excellent.

In addition, Example 1, Example 13, and Example 14 satisfying the copolymerization ratio of ethylene and propylene were more effective in removing moisture and blocking than those of Example 12 which did not satisfy this requirement, Had excellent thermal resistance and durability of the adhesive film and was superior in adhesion strength. The moisture removal and blocking efficiency was more efficient than that of Example 15, so that the moisture penetration length was short and the volume expansion of the adhesive film was almost zero , And the durability of the adhesive film was excellent.

In addition, Example 1, Example 17, and Example 18 satisfying the content and the weight ratio of the first and second tackifiers exhibited efficient water removal and blocking compared to Example 16, The water permeation length was short and the heat resistance was excellent. In comparison with Example 19, the moisture removal and blocking were efficient, the water permeation length was short, the durability of the adhesive film was excellent, and the adhesive strength was excellent.

In addition, Example 1, Example 21, and Example 22 that satisfied the content of the tackifier of the second adhesive layer were more effective in removing and blocking moisture than in Example 20 in which the content of the tackifier was not satisfied, The moisture removal and blocking efficiency was more efficient than that of Example 23, the water permeation length was short, the volume expansion of the adhesive film was almost zero, and the durability of the adhesive film was excellent.

Example 1, Example 25, and Example 26, which satisfied the content of the first moisture absorbent, were more effective in removing and blocking water than Example 24 which did not satisfy this requirement, The durability evaluation result was good and the durability of the adhesive film was excellent. In comparison with Example 27, the volume expansion of the adhesive film was almost zero, and the durability of the adhesive film was excellent.

In addition, Example 1, Example 29, and Example 30, which satisfied the content of the second moisture absorbent, were effective in water removal and blocking more efficiently than Example 28 which did not satisfy the requirement, And the moisture penetration length was short, the volume expansion of the adhesive film was hardly observed, the durability evaluation result of the organic light emitting device was good, the durability of the adhesive film was excellent, Adhesion was excellent.

In addition, Example 1 and Example 33 that satisfied the curing agent content of the first adhesive layer had little volume expansion of the adhesive film as compared with Example 32 which did not satisfy this requirement, and the durability evaluation results of the organic light emitting device were good. Compared to Example 34, the durability of the adhesive film was excellent and the adhesive strength was excellent.

Further, Examples 1 and 36, which satisfied the curing agent content of the second adhesive layer, showed almost no volume expansion of the adhesive film as compared with Example 35 which did not satisfy the requirements, and the durability evaluation results of the organic light emitting device were good. Compared to Example 37, the durability of the adhesive film was excellent and the adhesive strength was excellent.

In addition, Example 1 and Example 39 which satisfied the weight average molecular weight of the curing agent were more effective than those of Example 38 which did not satisfy this requirement, that water removal and blocking were efficient, the water permeation length was short, the durability of the adhesive film was excellent, The adhesive strength was excellent, the volume expansion of the adhesive film was almost zero as compared with Example 40, and the durability of the adhesive film was excellent.

In Example 41 including an adhesive layer having a multilayer structure and Example 41 including an adhesive layer having a single-layer structure, moisture removal and blocking were efficient, moisture permeation length was short, volume expansion of the adhesive film was scarcely occurred, The durability evaluation results of the organic light emitting device were good, the durability of the adhesive film was excellent, and the adhesive strength was excellent.

In Examples 1 to 3, which satisfied the weight average molecular weight of the first adhesive resin, water removal and blocking were more efficient than those of Comparative Example 1 which did not satisfy the requirements, and thus the water permeation length was short and the volume expansion of the adhesive film was almost The durability of the adhesive film was excellent, the durability of the adhesive film was superior to that of Comparative Example 2, and the adhesive strength was excellent.

In Examples 1, 4 and 5, which satisfied the weight average molecular weight of the second adhesive resin. Compared with Comparative Example 3 which did not satisfy this requirement, the moisture removal and blocking were efficient, the water permeation length was short, the adhesive film did not expand in volume, the durability of the adhesive film was excellent and the durability And excellent adhesive strength.

In addition, compared with Comparative Example 5 in which R ¹ of the second adhesive resin of the present invention satisfied R1, Example 6, and Example 7, water removal and blocking became efficient and moisture permeation length was short , And there was almost no volume expansion of the adhesive film.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (21)

A first adhesive resin and a second adhesive resin,
Wherein the first adhesive resin has no crystallization temperature measured by the following measuring method 1 and the second adhesive resin has a crystallization temperature of 100 ° C to 140 ° C when measured by the following measuring method 1 Polyolefin-based mixed resin for encapsulant;
[Measurement method 1]
The crystallization temperature (Tc) is measured through a peak analysis of the cooling curve of the heat flux measured by differential scanning calorimetry (DSC) while cooling from 200 ° C to -150 ° C at a rate of 10 ° C / min.
The method according to claim 1,
Wherein the first adhesive resin and the second adhesive resin are contained in a weight ratio of 1: 0.1 to 10: 1. A polyolefin-based mixed resin for an organic electronic device encapsulant.
The method according to claim 1,
Wherein the first adhesive resin comprises a random copolymer obtained by copolymerizing ethylene, propylene and a diene compound having a weight average molecular weight of 30,000 to 1,550,000,
Wherein the second adhesive resin comprises a compound represented by the following formula (1).
[Chemical Formula 1]

In Formula 1, R ¹ is a hydrogen atom, a straight chain alkenyl group having 3 to 10 carbon atoms or a branched alkenyl group having 4 to 10 carbon atoms, and n is a number satisfying a weight average molecular weight of 30,000 to 1,550,000 It is rational number.
The method of claim 3,
The ethylene and propylene are randomly copolymerized in a weight ratio of 1: 0.3 to 1.4,
Wherein the diene-based compound comprises 2 to 15% by weight based on the total weight of the random copolymer.
5. A mixed resin according to any one of claims 1 to 4,
Tackifiers; And
Absorbent; &Lt; / RTI &gt; characterized in that the adhesive composition comprises an organic binder.
6. The method of claim 5,
The moisture absorbent may be selected from the group consisting of silica (SiO ₂ ), alumina (Al ₂ O ₃ ), lithium oxide (Li ₂ O), sodium oxide (Na ₂ O), barium oxide (BaO), calcium oxide (CaO), magnesium oxide Phosphorus (P ₂ O ₅ )
Wherein the tackifier comprises at least one of a hydrogenated petroleum resin, a hydrogenated rosin resin, a hydrogenated rosin ester resin, a hydrogenated terpene resin, a hydrogenated terpene phenol resin, a polymerized rosin resin and a polymerized rosin ester resin Adhesive composition.
The method according to claim 6,
The tackifier is contained in an amount of 50 to 300 parts by weight based on 100 parts by weight of the mixed resin,
Wherein the moisture absorber comprises 10 to 550 parts by weight based on 100 parts by weight of the mixed resin.
6. The method of claim 5,
Wherein the adhesive composition further comprises at least one of a curing agent and a UV initiator,
The curing agent is contained in an amount of 2 to 50 parts by weight based on 100 parts by weight of the mixed resin,
Wherein the UV initiator comprises 0.1 to 10 parts by weight based on 100 parts by weight of the mixed resin.
The method according to claim 1,
Wherein the adhesive composition has a viscosity of 100,000 to 300,000 Pa 占 퐏 (50 占 폚).
An adhesive film for an organic electronic device encapsulant, which comprises an adhesive layer formed by including the adhesive composition of any one of claims 5 to 9.
11. The method of claim 10,
The adhesive film had a glass adhesive strength of 1500 gf / 25 mm or more as measured according to the following Measuring Method 2,
Wherein the metal adhesive force measured according to the following Measuring Method 3 is 1000 gf / 25 mm or more.
[Measurement method 2]
After the adhesive tape was laminated on the upper surface of the adhesive film and the sample was cut to a width of 25 mm and a length of 120 mm, the adhesive film was laminated to the glass at 80 DEG C, and the prepared sample was allowed to stand at room temperature for 30 minutes. Measure the glass adhesion at the speed.
[Measuring method 3]
The upper surface of the adhesive film was laminated to an 80 占 퐉 -thick Ni alloy at 80 占 폚, and an adhesive strength measuring tape was laminated on the adhesive film. The sample was cut into a width of 25 mm and a length of 120 mm, Measuring metal adhesion at 300 mm / min speed
11. The method of claim 10,
Wherein the adhesive layer comprises: a first adhesive layer; And a second adhesive layer formed on one surface of the first adhesive layer.
13. The method of claim 12,
Wherein the first adhesive layer comprises a first mixed resin, a tackifier, and a first moisture absorbent,
Wherein the first mixed resin includes a first adhesive resin and a second adhesive resin in a weight ratio of 1: 0.1 to 10,
Wherein the tackifier comprises 50 to 300 parts by weight based on 100 parts by weight of the first mixed resin,
Wherein the first moisture absorber comprises 1 to 40 parts by weight based on 100 parts by weight of the first mixed resin.
14. The method of claim 13,
Wherein the tackifier comprises a first tackifier and a second tackifier in a weight ratio of 1: 0.5 to 1.5,
The softening point of the first tackifier is less than the softening point of the second tackifier,
Wherein the first absorbent is an organic electronic device sealed damper adhesive film comprises a silica (SiO _2).
14. The method of claim 13,
Wherein the first adhesive layer further comprises at least one of a curing agent and a UV initiator,
Wherein the curing agent comprises 2 to 30 parts by weight based on 100 parts by weight of the first mixed resin,
Wherein the UV initiator comprises 0.1 to 5 parts by weight based on 100 parts by weight of the first mixed resin.
12. The method of claim 11,
Wherein the second adhesive layer comprises a second mixed resin, a tackifier, and a second moisture absorbent,
Wherein the second mixed resin includes a first adhesive resin and a second adhesive resin in a weight ratio of 1: 0.1 to 10,
Wherein the tackifier comprises 60 to 300 parts by weight based on 100 parts by weight of the second mixed resin,
Wherein the second moisture absorber comprises 50 to 450 parts by weight based on 100 parts by weight of the second mixed resin.
17. The method of claim 16,
Wherein the tackifier comprises a first tackifier,
Wherein the second moisture absorber comprises calcium oxide (CaO).
17. The method of claim 16,
Wherein the second adhesive layer further comprises at least one of a curing agent and a UV initiator,
Wherein the curing agent comprises 10 to 40 parts by weight based on 100 parts by weight of the second mixed resin,
Wherein the UV initiator comprises 0.1 to 8 parts by weight based on 100 parts by weight of the second mixed resin.
12. The method of claim 11,
The first adhesive layer has a viscosity of 150,000 Pa 占 퐏 (50 占 폚) or less,
Wherein the viscosity of the second adhesive layer is not less than 200,000 Pa 占 퐏 (50 占 폚).
An encapsulant for an organic electronic device comprising the adhesive film according to any one of claims 10 to 19.
Board;
An organic electronic device formed on at least one side of the substrate; And
The encapsulant for an organic electronic device according to claim 20, which is packaged with the organic electronic device.

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