KR102059172B1 - Adhesive film for encapsulation member of organic electronic device and encapsulation member comprising the same - Google Patents

Abstract

The present invention relates to an adhesive film for an organic electronic device and an encapsulant for an organic electronic device comprising the same and, more specifically, to an adhesive film for an organic electronic device, which removes and blocks organic materials such as moisture, impurities, and the like from access to the organic electronic device and has an excellent effect of moisture resistance and heat resistance while not occurring the delamination which may occur when water is removed, and to an encapsulant for an organic electronic device comprising the same.

Description

Adhesive film for organic electronic device encapsulation material and encapsulation material for organic electronic device including same {Adhesive film for encapsulation member of organic electronic device and encapsulation member comprising the same}

The present invention relates to an adhesive film for an organic electronic device encapsulation material and an organic electronic device encapsulation material including the same, and more particularly, to remove and block a material that is a defective source such as moisture and impurities to the organic electronic device, The present invention relates to an adhesive film for an organic electronic device encapsulant and an organic electronic device encapsulant including the same, which does not have an interlayer peeling phenomenon that may occur when this is removed and has excellent moisture resistance and heat resistance.

An organic light emitting diode (OLED) is a light emitting diode in which a light emitting layer is formed of a thin organic compound. The organic light emitting diode (OLED) uses an electroluminescence phenomenon that generates light by passing a current through a fluorescent organic compound. Such organic light emitting diodes generally implement main colors in three colors (Red, Green, Blue) independent pixel method, bioconversion method (CCM), and Curly filter method, and the amount of organic materials included in the light emitting material used Therefore, it is divided into low molecular organic light emitting diode and high molecular organic light emitting diode. In addition, the driving method may be classified into a passive driving method and an active driving method.

Such an organic light emitting diode has characteristics such as high efficiency, low voltage driving, and simple driving by self-emission, and has an advantage of expressing a high quality video. In addition, applications for flexible displays and organic electronic devices using flexible properties of organic materials are also expected.

The organic light emitting diode is manufactured by stacking an organic compound, which is a light emitting layer, on a substrate in the form of a thin film. However, organic compounds used in organic light emitting diodes are very sensitive to impurities, oxygen, and moisture, and thus have a problem in that their properties are easily deteriorated by external exposure or moisture and oxygen penetration. Such deterioration of organic matters affects the luminescence properties of the organic light emitting diode and shortens its lifespan. In order to prevent such a phenomenon, a thin film encapsulation is required to prevent oxygen, moisture, and the like from flowing into the organic electronic device.

Conventionally, metal cans or glass are processed into caps to have grooves, and a desiccant for absorbing moisture in the grooves is mounted in powder form. However, this method is to remove encapsulated organic electronic devices to a desired level for moisture permeation. There is a problem that the organic electronic device is blocked from access to the defective materials such as moisture and impurities, and does not have an interlayer peeling phenomenon that may occur when water is removed, and it is difficult to simultaneously have an excellent effect of moisture resistance and heat resistance.

Korean Laid-Open Patent No. 10-2006-0030718 (published: 2006.04.11)

The present invention has been made in order to solve the above problems, the problem to be solved of the present invention is to remove and block to prevent the access to the material, such as moisture, impurities, etc. to the organic electronic device, may occur when the water is removed It is to provide an excellent effect of moisture resistance and heat resistance at the same time does not occur delamination phenomenon.

In order to solve the above problems, the adhesive film for an organic electronic device encapsulant of the present invention comprises an adhesive layer formed by including an adhesive resin, a tackifier and a moisture absorbent, the adhesive layer is measured by 15% It may be:

[Equation 1]

% Measured = 100 × S ₂ / S ₁

In Equation 1, S ₁ is a parallel plate having a diameter of 8 mm in a stress relaxation test mode with ARES (Advanced Rheometric Expansion System) in a state where an adhesive layer is prepared with a thickness of 600 μm. The maximum stress value measured when 50% strain is applied to the adhesive film by applying 200gf of normal force at 80 ° C., and S ₂ is 180 ° when the strain is applied to the adhesive film. The stress value measured after holding for seconds.

As a preferred embodiment of the present invention, the adhesive layer of the present invention may be 1 to 8% of the measured value according to Equation (1).

As a preferred embodiment of the present invention, the adhesive layer of the present invention may include a first adhesive layer and a second adhesive layer formed on one surface of the first adhesive layer.

As a preferred embodiment of the present invention, the first adhesive layer of the present invention may have a measured value of 15% or less, preferably 3 to 10% according to Equation 1 above.

As a preferred embodiment of the present invention, the second adhesive layer of the present invention may be 10% or less, preferably 1 to 6% of the measured value according to Equation (1).

As a preferred embodiment of the present invention, the first adhesive layer and the second adhesive layer may have a deviation of 8% or less in the measured value according to Equation (1).

As a preferred embodiment of the present invention, the first adhesive layer and the second adhesive layer may have a thickness ratio of 1: 2 to 7.

As a preferred embodiment of the present invention, the first adhesive layer may have a thickness of 1 ~ 30㎛.

As a preferred embodiment of the present invention, the second adhesive layer may have a thickness of 15 ~ 70㎛.

As a preferred embodiment of the present invention, the adhesive layer of the present invention may further include a curing agent.

As a preferred embodiment of the present invention, the curing agent of the present invention may include a compound represented by the following formula (1).

[Formula 1]

In Formula 1, A ₁ and A ₂ are each independently -CH _2- , -CH ₂ CH _2- , -CH ₂ CH ₂ CH _2- , -CH ₂ CH ₂ CH ₂ CH ₂ -or -CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH _2- .

On the other hand, the organic electronic device encapsulation material of the present invention may include the adhesive film for an organic electronic device encapsulation material of the present invention mentioned above.

The light emitting device of the present invention may include a substrate, an organic electronic device formed on at least one surface of the substrate, and an encapsulant for the organic electronic device of the present invention for packaging the organic electronic device.

Hereinafter, the term used by this invention is demonstrated.

The term hygroscopic agent used in the present invention may adsorb moisture by physical or chemical bonding such as the interface of the moisture absorber and van der Waals force, and the moisture adsorption substance and chemical reaction in which the components of the substance do not change due to the adsorption of moisture. It includes all the water-absorbing substances that absorb moisture through and change into new substances.

The adhesive film for an organic electronic device encapsulant of the present invention can effectively prevent moisture from reaching the organic electronic device by blocking oxygen, impurities, and moisture and effectively removing moisture that is permeated, thereby preventing the life and durability of the organic electronic device. Can be significantly improved. In addition, the interlayer peeling phenomenon, which may occur when water is removed, does not occur and at the same time has excellent effects of moisture resistance and heat resistance.

1 and 2 are cross-sectional views of an adhesive film for an organic electronic device encapsulant according to an embodiment of the present invention.
3 and 4 are cross-sectional schematic diagrams of a light emitting device according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. The drawings and description are to be regarded as illustrative in nature and not restrictive. Like reference numerals designate like elements throughout the specification.

Specifically, FIG. 1 is a cross-sectional view of an adhesive film for an organic electronic device encapsulant according to an exemplary embodiment of the present invention. The adhesive film 10 for an organic electronic device encapsulant includes an adhesive layer 15 and an adhesive layer 15. It may further include a base film (13, 14) such as a release film formed on the top and / or bottom of the). The base film serves to support and protect the adhesive film 10 for organic electronic devices.

The adhesive layer 15 may include an adhesive resin 15b, a tackifier, and a moisture absorbent 15a.

First, the adhesive resin 15b may include a first adhesive resin and a second adhesive resin, and the weight ratio of the first adhesive resin and the second adhesive resin is 1: 0.1 to 10, preferably 1: 1 to 9. It may be included in a weight ratio, more preferably 1: 1.1 to 5. If the weight ratio of the first adhesive resin and the second adhesive resin is less than 1: 0.1 may cause a problem of lowering the reliability, if the weight ratio exceeds 1: 10 may cause a problem that the elastic force is lowered.

The first adhesive resin may include a random copolymer in which ethylene, propylene, and diene compounds are copolymerized. At this time, ethylene and propylene may be random copolymerized in a weight ratio of 1: 0.3 to 1.4, preferably in a weight ratio of 1: 0.5 to 1.2. If the weight ratio of ethylene and propylene to be copolymerized is less than 1: 0.3, it may cause panel adhesion defect due to the increase in modulus and hardness, resulting in a problem of lowering the adhesive strength with the substrate and the physical properties at low temperature and reducing the elastic modulus. According to the present invention, the absorbent may adversely affect the volume expansion, and when the weight ratio exceeds 1: 1.4, the panel sag may occur due to the decrease in modulus and hardness, and the decrease in the mechanical properties may lead to the decrease in the mechanical properties of the product. Difficulties in high filling may cause a problem of deterioration of reliability.

In addition, the diene-based compound may be included in 2 to 15% by weight, preferably 7 to 11% by weight based on the total weight of the random copolymer copolymerized with ethylene, propylene and diene-based compound. If the diene-based compound is less than 2% by weight may cause the panel sagging problem due to the lower modulus due to the lower curing rate and curing density, the heat resistance may be lowered, the substrate due to the expansion of the absorbent volume due to the elasticity decrease It can cause the phenomenon of lifting and when it exceeds 15% by weight, the lack of wettability due to the high curing density causes a decrease in adhesive strength with the substrate, compatibility between resins, and a decrease in panel adhesion due to high modulus. It may cause a phenomenon.

The first adhesive resin may have a weight average molecular weight of 30,000 to 1,550,000, and preferably a weight average molecular weight of 40,000 to 1,500,000.

If the weight average molecular weight of the first adhesive resin is less than 30,000, the panel sag due to the gelation rate and modulus decrease may occur, the heat resistance may be lowered, and as the packing property of the moisture absorbent is lowered, the reliability may be lowered. Mechanical properties may be lowered. In addition, if the weight average molecular weight exceeds 1,550,000, adhesion to the substrate may be lowered due to the decrease in wettability, and adhesion to the panel may be lowered due to an increase in gelation rate and modulus.

The second adhesive resin may include a compound represented by Formula 2 below.

[Formula 2]

In Chemical Formula 2, R ¹ is a hydrogen atom, a straight alkenyl group of C3 to C10 or a ground alkenyl group of C4 to C10, preferably R ¹ is a hydrogen atom, a straight alkenyl group of C4 to C8 or C4 It may be a crushed alkenyl group of ~ C8.

In addition, as R ¹ of the formula (2) is a hydrogen atom, a straight alkenyl group of C3 ~ C10 or C4 ~ C10 may be more excellent reliability.

In addition, in Formula 2, n may be a rational number satisfying the weight average molecular weight 30,000 ~ 1,550,000, preferably may be a rational number satisfying the weight average molecular weight 40,000 ~ 1,500,000. If the weight average molecular weight is less than 30,000, panel deflection may occur due to a decrease in modulus, heat resistance may be lowered, reliability may be lowered as the packing property of the absorbent is lowered, and mechanical properties may be lowered. In addition, the phenomenon of lifting with the substrate may occur due to the volume expansion of the absorbent due to the decrease in elasticity. In addition, when the weight average molecular weight exceeds 1,550,000, the adhesion to the substrate may decrease due to the decrease in wettability, and the adhesion to the panel may decrease as the modulus increases.

Next, the tackifier may be included without limitation as long as the adhesive resin is usually used in the adhesive film for organic electronic device encapsulant, preferably hydrogenated petroleum resin, hydrogenated rosin paper, hydrogenated rosin ester resin, hydrogenated terpene resin, hydrogenated It may include at least one selected from a terpene phenol resin, a polymerized rosin resin and a polymerized rosin ester resin.

The tackifier included in the adhesive layer 15 may include 50 to 300 parts by weight, preferably 80 to 280 parts by weight based on 100 parts by weight of the adhesive resin 15b. If the tackifier is less than 50 parts by weight with respect to 100 parts by weight of the adhesive resin may have a problem of poor moisture resistance, and if the tackifier exceeds 300 parts by weight, the durability and moisture resistance due to the elastic lowering of the adhesive layer (Brittle) is lowered Can cause problems.

Next, the absorbent 15a may be included without limitation as long as it is an encapsulant used for packaging an organic electronic device. Preferably, the absorbent 15a includes a zeolite, titania, zirconia or montmorillonite as a component, a metal salt, and a metal oxide. It may include one or more of the, more preferably may include a metal oxide, even more preferably may include calcium oxide (CaO) in the metal oxide.

Metal oxides include silica (SiO ₂ ), alumina (Al ₂ O ₃ ), lithium oxide (Li ₂ O), sodium oxide (Na ₂ O), barium oxide (BaO), calcium oxide (CaO) or magnesium oxide (MgO) It may include one or more of metal oxides, organic metal oxides, and phosphorus pentoxide (P ₂ O ₅ ).

Metal salts include lithium sulfate (Li ₂ SO ₄ ), sodium sulfate (Na ₂ SO ₄ ), calcium sulfate (CaSO ₄ ), magnesium sulfate (MgSO ₄ ), cobalt sulfate (CoSO ₄ ), gallium sulfate (Ga ₂ (SO ₄ ) ₃ ), Sulfates such as titanium sulfate (Ti (SO ₄ ) ₂ ) or nickel sulfate (NiSO ₄ ), calcium chloride (CaCl ₂ ), magnesium chloride (MgCl ₂ ), strontium chloride (SrCl ₂ ), yttrium chloride (YCl ₃ ), Copper chloride (CuCl ₂ ), cesium fluoride (CsF), tantalum fluoride (TaF ₅ ), niobium fluoride (NbF ₅ ), lithium bromide (LiBr), calcium bromide (CaBr ₂ ), cesium bromide (CeBr ₃ ), selenium bromide ( Metal halides such as SeBr ₄ ), vanadium bromide (VBr ₃ ), magnesium bromide (MgBr ₂ ), barium iodide (BaI ₂ ) or magnesium iodide (MgI ₂ ) and barium perchlorate (Ba (ClO ₄ ) ₂ ) or magnesium perchlorate It may contain one or more of metal chlorates, such as (Mg (ClO ₄ ) ₂ ).

The moisture absorbent 15a may preferably have a purity of 95% or more. If the purity is less than 95%, not only the water absorption function is lowered, but the material included in the absorbent may act as an impurity, which may cause a defect of the adhesive film, and may also affect the organic electronic device, but is not limited thereto.

The moisture absorbent 15a included in the adhesive layer 15 may include 10 to 550 parts by weight, preferably 20 to 520 parts by weight based on 100 parts by weight of the adhesive resin 15b. If the moisture absorbent is less than 10 parts by weight based on 100 parts by weight of the adhesive resin, the durability of the organic electronic device may be reduced, and the water removal effect may be remarkably lowered. Thus, the desired adhesive film may not be realized. If the moisture absorbent exceeds 550 parts by weight, the wettability is insufficient. Due to the poor adhesion between the adhesive film and the organic electronic device, such as adhesion failure, the reliability of the organic electronic device is lowered, and due to excessive volume expansion during moisture absorption, the life of the organic electronic device is shortened. May occur.

Meanwhile, the adhesive layer 15 of the present invention may further include a curing agent.

When the curing agent is included in the adhesive layer 15 of the present invention, the curing agent may include 2 to 50 parts by weight, preferably 5 to 40 parts by weight, based on 100 parts by weight of the adhesive resin 15b. If it contains less than 2 parts by weight of the curing agent can not achieve the desired gelation rate and modulus, the elastic force may be reduced, if it contains more than 50 parts by weight poor panel bonding due to high modulus and hardness As a result, a problem of deterioration of adhesion due to a decrease in wettability may occur.

The curing agent may be included as long as it is a material that can be used as a curing agent without limitation, preferably may include a material capable of ensuring a sufficient crosslinking density of the adhesive film by acting as a crosslinking agent, more preferably urethane acrylic It may include one or more selected from the group consisting of a rate-based curing agent and an acrylate-based curing agent, more preferably may include a compound represented by the formula (1).

[Formula 1]

In Formula 1, A ₁ and A ₂ are each independently -CH _2- , -CH ₂ CH _2- , -CH ₂ CH ₂ CH _2- , -CH ₂ CH ₂ CH ₂ CH ₂ -or -CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH _2- , preferably -CH _2- , -CH ₂ CH ₂ -or -CH ₂ CH ₂ CH _2- .

Furthermore, the adhesive layer 15 of the present invention may further include a UV initiator.

When the UV initiator is included in the adhesive layer 15 of the present invention, the UV initiator may include 0.1 to 10 parts by weight, preferably 0.5 to 8 parts by weight, based on 100 parts by weight of the adhesive resin 15b. If the UV initiator is included in less than 0.1 parts by weight may cause a problem of poor heat resistance due to poor UV curing, and if it contains more than 10 parts by weight may cause a problem of poor heat resistance due to a lower curing density.

UV initiator may be included without limitation as long as it is commonly used as a UV initiator, preferably Mono Acyl Phosphine, Bis Acyl Phosphine, α-Hydroxyketone ), α-aminoketone (α-Aminoketone), phenylglyoxylate (Phenylglyoxylate), it may include one or more selected from benzyldimethyl-ketal (Benzyldimethyl-ketal).

Meanwhile, the adhesive layer 15 included in the adhesive film 10 for an organic electronic device encapsulant according to the present invention has a viscosity of 100,000 to 300,000 Pa · s (50 ° C.), preferably of 120,000 to 280,000 Pa · s (50). ° C). If the viscosity of the adhesive layer 15 is less than 100,000 Pa · s (50 ° C.), the processability may not be good due to an increase in the tack, and thus, the release film may not be peeled off, and the viscosity may be 300,000 Pa · s ( When the temperature exceeds 50 ° C., the adhesive strength with the substrate may decrease due to the decrease in the tack.

The viscosity may be a viscosity measured by a conventional viscosity measuring method, and preferably, the samples are laminated to a thickness of 800 to 900 μm, punched into a circle having a diameter of 8 mm, and then the viscosity measuring equipment (ARES-G2, TA) is The sample can be placed on a plate and measured. At this time, the measurement conditions can be measured at 5% strain, axial force 0.05N, sensitivity 0.005N, 1 rad / s, -5 ~ 130 ° C, and axial direction before measurement Measurements can be initiated with the above conditions after gap adjustment and sample stabilization with 0.5 N of force and 0.05 N of sensitivity, but are not limited thereto.

Furthermore, the adhesive layer 15 of the present invention has a measured value of 15% or less, preferably 1 to 10%, more preferably 2.8 to 5.4%, even more preferably 3.3 to 5.0, even more, according to Equation 1 below. Preferably 3.7-4.55%. If the measured value according to Equation 1 of the adhesive layer 15 exceeds 15%, a problem may occur in that the adhesive strength with the substrate (glass, metal, etc.) decreases.

[Equation 1]

% Measured = 100 × S ₂ / S ₁

In Equation 1, S ₁ is a parallel plate having a diameter of 8 mm in a stress relaxation test mode with ARES (Advanced Rheometric Expansion System) in a state where an adhesive layer is prepared with a thickness of 600 μm. The maximum stress value measured when 50% strain is applied to the adhesive film by applying 200gf of normal force at 80 ° C., and S ₂ is 180 ° when the strain is applied to the adhesive film. The stress value measured after holding for seconds.

On the other hand, when the adhesive layer 15 of the single layer structure is provided, the adhesive film 10 for an organic electronic device encapsulant according to the present invention has a glass adhesive force of 1500 gf / 25 mm or more, preferably 1600, measured according to Measurement Method 1 below. gf / 25 mm or more, more preferably 1600 to 3000 gf / 25 mm.

[Measurement method 1]

After laminating the adhesive force measuring tape (7475, TESA) to the upper surface of the adhesive film through a 2Kg Hand Roller, cut the sample into 25mm width and 120mm length, laminating the lower surface of the adhesive film on glass at 80 ℃ , The prepared sample is allowed to stand at room temperature for 30 minutes, and the glass adhesive force is measured at 300 mm / min speed.

In addition, when the adhesive layer 15 of the single layer structure is provided, the adhesive film 10 for an organic electronic device encapsulant of the present invention has a metal adhesive force of 1000 gf / 25 mm or more, preferably 1100, measured according to the following Measurement Method 2. gf / 25 mm or more, more preferably 1100 to 2500 gf / 25 mm.

[Measurement Method 2]

At 80 ° C, the upper surface of the adhesive film is laminated on a Ni alloy having a thickness of 80 μm, and the adhesive force measuring tape (7475, TESA) is laminated on the lower surface of the adhesive film through a 2Kg Hand Roller, and the sample is 25 mm in width and 120 in length. After cutting to mm, the prepared sample was allowed to stand at room temperature for 30 minutes, and the metal adhesive force was measured at a speed of 300 mm / min.

As the adhesive force measured according to the measuring method 1 and the measuring method 2 satisfies the above range, peeling of the adhesive film may be significantly reduced when applied to the organic electronic device.

Furthermore, according to the preferred embodiment of the present invention, the adhesive film 10 for the organic electronic device encapsulant of the present invention is shown in Figure 2, the adhesive layer is a multi-layer structure of the first adhesive layer 11 and the first adhesive layer 11 The second adhesive layer 12 formed on one surface thereof may be included.

At this time, the adhesive film 10 for the organic electronic device encapsulation material of the present invention may further include a base film 14, such as a release film formed on the lower portion of the first adhesive layer 11, the upper portion of the second adhesive layer 12 It may further include a base film 13, such as formed release film.

The first adhesive layer 11 is a layer in direct contact with the organic electronic device (not shown), and may include an adhesive resin 11b, a tackifier, and a first absorbent 11a. In this case, the adhesive resin 11b may include a first adhesive resin and a second adhesive resin, the tackifier may include a first adhesive agent, and may further include a second adhesive agent. .

The second adhesive layer 12 may include an adhesive resin 12b, a tackifier, and a second absorbent 12a. In this case, the adhesive resin 12b may include a first adhesive resin and a second adhesive resin, and the tackifier may include a first adhesive agent.

First, the first adhesive layer 11 will be described as follows.

The adhesive resin 11b of the first adhesive layer may include a first adhesive resin and a second adhesive resin, and the first adhesive resin and the second adhesive resin may be the first adhesive resin 15b (Fig. 1). It may include the same material as the adhesive resin and the second adhesive resin.

The first adhesive resin and the second adhesive resin of the adhesive resin 11b may be included in a weight ratio of 1: 0.1 to 10, preferably in a weight ratio of 1: 1 to 9, more preferably in a weight ratio of 1: 1.1 to 5. have. If the weight ratio of the first adhesive resin and the second adhesive resin is less than 1: 0.1 may cause a problem of lowering the reliability, if the weight ratio exceeds 1: 10 may cause a problem that the elastic force of the adhesive layer is lowered.

The tackifier of the first adhesive layer 11 may include a first adhesive agent, and may further include a second adhesive agent. Each of the first adhesive agent and the second adhesive agent may be independently included as long as it is a tackifier, which is typically used in an adhesive film for an organic electronic device encapsulant, and preferably, a tackifier may improve reliability. Agent, and more preferably may include one or more selected from hydrogenated petroleum resin, hydrogenated rosin resin, hydrogenated rosin ester resin, hydrogenated terpene resin, hydrogenated terpene phenol resin, polymerized rosin resin and polymerized rosin ester resin. And, more preferably, the softening point may include different hydrogenated petroleum resin. For example, when the softening point includes different hydrogenated petroleum resin, the softening point of the first adhesive agent may be smaller than the softening point of the second adhesive agent, but is not limited thereto.

When the first adhesive agent and the second adhesive agent of the first adhesive layer 11 include hydrogenated petroleum resin, and the first adhesive agent contains hydrogenated petroleum resin smaller than the softening point of the second adhesive agent, 1 It may be included in a weight ratio of: 0.5 to 1.5, preferably in a weight ratio of 1: 0.6 to 1.4. If the weight ratio of the first adhesive agent and the second adhesive agent is less than 1: 0.5 may cause a problem that the heat-resistant holding power is lowered, and if the weight ratio exceeds 1: 1.5, the adhesive strength with the substrate due to the adhesion and wettability decreases Problems may arise.

The tackifier of the first adhesive layer 11 may include 50 to 300 parts by weight, preferably 80 to 280 parts by weight, based on 100 parts by weight of the adhesive resin 11b of the first adhesive layer 11. If the tackifier is included in less than 50 parts by weight with respect to 100 parts by weight of the adhesive resin may have a problem of poor moisture resistance, and if the tackifier is included in excess of 300 parts by weight, the elastic lowering of the first adhesive layer (Brittle) The durability and moisture resistance may be reduced.

The first absorbent 11a of the first adhesive layer 11 may be used without limitation as long as it is a material that can be used as a hygroscopic agent, and preferably silica may be used. As silica is used as the first absorbent 11a, water removal performance is excellent, separation of the organic electronic device and the encapsulant can be prevented, and durability of the organic electronic device can be significantly increased.

The first moisture absorbent 11a of the first adhesive layer 11 has a BET specific surface area of 2 to 20 m ² / g, preferably a BET specific surface area of 3 to 14 m ² / g, more preferably a BET specific surface area of 4 It may be ~ 8m ² / g. The specific surface area was measured using the BET method, and specifically, by adding a sample of 1 g of the first absorbent to the tube, it can be measured using ASAP2020 (Micromeritics, USA) without pretreatment at -195 ° C. The average value can be obtained by measuring three times on the same sample. If the BET specific surface area of the first moisture absorbent 11a exceeds 20 m ² / g, not only the adhesion with the substrate may be lowered but also the resin flow may decrease, resulting in poor adhesion. In addition, if the surface is rough or porous BET specific surface area may be large, there is a problem that the panel damage may occur due to the rough surface. Therefore, the first absorbent of the present invention may exhibit a high spherical ratio by having a low BET specific surface area.

The first absorbent 11a of the first adhesive layer 11 may be included in an amount of 1 to 40 parts by weight, preferably 5 to 35 parts by weight, based on 100 parts by weight of the adhesive resin 11b of the first adhesive layer 11. If the first absorbent 11a is included in less than 1 part by weight, it is not possible to achieve the water removal effect in the first adhesive layer, which may cause the durability of the organic electronic device to be lowered. If it is included, there may be a problem that the reliability of the organic electronic device is lowered due to poor adhesion, such as adhesion between the adhesive film and the organic electronic device, adhesion due to lack of wettability.

Meanwhile, the first adhesive layer 11 of the present invention may further include a curing agent.

When the curing agent is included in the first adhesive layer 11, the curing agent may include 2 to 30 parts by weight, preferably 5 to 25 parts by weight, based on 100 parts by weight of the adhesive resin 11b of the first adhesive layer 11. . If it contains less than 2 parts by weight of the curing agent can not achieve the desired gelling rate and modulus, the elastic force may be reduced, if it contains more than 30 parts by weight of the panel adhesion failure due to high modulus and hardness As a result, a problem of deterioration of adhesion due to a decrease in wettability may occur.

The curing agent may be included as long as it is a material that can be used as a curing agent without limitation, preferably may include a material capable of ensuring a sufficient crosslinking density of the adhesive film by acting as a crosslinking agent, more preferably urethane acrylic It may include one or more selected from the group consisting of a rate-based curing agent and an acrylate-based curing agent, more preferably may include a compound represented by the formula (1).

[Formula 1]

In Formula 1, A ₁ and A ₂ are each independently -CH _2- , -CH ₂ CH _2- , -CH ₂ CH ₂ CH _2- , -CH ₂ CH ₂ CH ₂ CH ₂ -or -CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH _2- , preferably -CH _2- , -CH ₂ CH ₂ -or -CH ₂ CH ₂ CH _2- .

Furthermore, the first adhesive layer 11 of the present invention may further include a UV initiator.

When the UV adhesive is included in the first adhesive layer 11 of the present invention, the UV initiator is 0.1 to 5 parts by weight, preferably 0.5 to 4, based on 100 parts by weight of the adhesive resin 11b of the first adhesive layer 11. It may include parts by weight. If the UV initiator is included in less than 0.1 parts by weight may cause a problem of poor heat resistance due to poor UV curing, and if it contains more than 5 parts by weight may cause a problem of poor heat resistance due to a lower curing density.

UV initiator may be included without limitation as long as it is commonly used as a UV initiator, preferably Mono Acyl Phosphine, Bis Acyl Phosphine, α-Hydroxyketone ), α-aminoketone (α-Aminoketone), phenylglyoxylate (Phenylglyoxylate), it may include one or more selected from benzyldimethyl-ketal (Benzyldimethyl-ketal).

Meanwhile, the first adhesive layer 11 included in the adhesive film 10 for an organic electronic device encapsulant according to the present invention has a viscosity of 150,000 Pa · s (50 ° C.) or less, preferably 10,000 to 130,000 Pa · s ( 50 ° C.). If the viscosity of the first adhesive layer 11 exceeds 150,000 Pa · s (50 ° C.), a problem may occur in that the adhesive strength with the substrate decreases due to the decrease in the tack.

The viscosity may be a viscosity measured by a conventional viscosity measuring method, and preferably, the samples are laminated to a thickness of 800 to 900 μm, punched into a circle having a diameter of 8 mm, and then the viscosity measuring equipment (ARES-G2, TA) is The sample can be placed on a plate and measured. At this time, the measurement conditions can be measured with 5% strain, axial force 0.05N, sensitivity 0.005N, 1 rad / s, -5 ~ 130 ℃, and axial force before measurement (Axial Force) 0.5N, Sensitivity (0.05N) After the gap adjustment and sample stabilization can be measured under the above conditions, but is not limited thereto.

Next, the second adhesive layer 12 formed on one surface of the first adhesive layer 11 of the present invention will be described.

The adhesive resin 12b of the second adhesive layer 12 may include a first adhesive resin and a second adhesive resin, and the first adhesive resin and the second adhesive resin may be the adhesive resins 15b (FIG. 1) described above. It may comprise the same material as the first adhesive resin and the second adhesive resin.

The first adhesive resin and the second adhesive resin of the adhesive resin 12b may be included in a weight ratio of 1: 0.1 to 10, preferably in a weight ratio of 1: 1 to 9, and more preferably in a weight ratio of 1: 1.1 to 5. have. If the weight ratio of the first adhesive resin and the second adhesive resin is less than 1: 0.1 may cause a problem of lowering the reliability, if the weight ratio exceeds 1: 10 may cause a problem that the elastic force of the adhesive layer is lowered.

The tackifier of the second adhesive layer 12 may include a first adhesive agent. The first adhesive agent may be included without limitation as long as it is an adhesive resin that is commonly used in the adhesive film for organic electronic devices, preferably hydrogenated petroleum resin, hydrogenated rosin paper, hydrogenated rosin ester resin, hydrogenated terpene resin, hydrogenated terpene phenol It may include one or more selected from a resin, a polymerized rosin resin and a polymerized rosin ester resin.

The first adhesive imparting agent of the second adhesive layer 12 may include 60 to 300 parts by weight, preferably 90 to 280 parts by weight based on 100 parts by weight of the adhesive resin 12b of the second adhesive layer 12. If the first adhesive agent is included in less than 60 parts by weight based on 100 parts by weight of the adhesive resin may have a problem of poor moisture resistance, if the first adhesive agent is included in excess of 300 parts by weight, the elastic lowering of the second adhesive layer (Brittle) may cause a problem that the durability and moisture resistance is lowered.

The second absorbent 12a of the second adhesive layer 12 may be used without limitation as long as it can be used as a moisture absorbent. Preferably, an absorbent, metal salt, and metal including zeolite, titania, zirconia or montmorillonite as a component It may include one or more of the oxides, more preferably may include a metal oxide, even more preferably may include calcium oxide (CaO) in the metal oxide.

Metal oxides include silica (SiO ₂ ), alumina (Al ₂ O ₃ ), lithium oxide (Li ₂ O), sodium oxide (Na ₂ O), barium oxide (BaO), calcium oxide (CaO) or magnesium oxide (MgO) It may include one or more of metal oxides, organic metal oxides, and phosphorus pentoxide (P ₂ O ₅ ).

Metal salts include lithium sulfate (Li ₂ SO ₄ ), sodium sulfate (Na ₂ SO ₄ ), calcium sulfate (CaSO ₄ ), magnesium sulfate (MgSO ₄ ), cobalt sulfate (CoSO ₄ ), gallium sulfate (Ga ₂ (SO ₄ ) ₃ ), Sulfates such as titanium sulfate (Ti (SO ₄ ) ₂ ) or nickel sulfate (NiSO ₄ ), calcium chloride (CaCl ₂ ), magnesium chloride (MgCl ₂ ), strontium chloride (SrCl ₂ ), yttrium chloride (YCl ₃ ), Copper chloride (CuCl ₂ ), cesium fluoride (CsF), tantalum fluoride (TaF ₅ ), niobium fluoride (NbF ₅ ), lithium bromide (LiBr), calcium bromide (CaBr 2), cesium bromide (CeBr ₃ ), selenium bromide (SeBr ₄ ), metal halides such as vanadium bromide (VBr ₃ ), magnesium bromide (MgBr ₂ ), barium iodide (BaI ₂ ) or magnesium iodide (MgI ₂ ) and barium perchlorate (Ba (ClO ₄ ) ₂ ) or magnesium perchlorate ( It may contain one or more of metal chlorate, such as Mg (ClO ₄ ) ₂ ).

It is preferable that the second absorbent 12a has a purity of 95% or more. If the purity is less than 95%, not only the water absorption function is lowered, but the material included in the absorbent may act as an impurity, which may cause a defect of the adhesive film, and may also affect the organic electronic device, but is not limited thereto.

The second absorbent 12a of the second adhesive layer 12 may include 50 to 450 parts by weight, and preferably 70 to 430 parts by weight based on 100 parts by weight of the adhesive resin 12b of the second adhesive layer 12. If the second absorbent 12a is included in less than 50 parts by weight, there may be a problem that a desired adhesive film may not be realized, such as the water removal effect is significantly lowered. ) And the adhesive layer including the first adhesive layer 11 and the second adhesive layer 12 and / or the second adhesive layer 12 and the first adhesive layer 11 due to excessive volume expansion during moisture absorption. Moisture may rapidly penetrate the organic electronic device and shorten the life of the organic electronic device.

On the other hand, the second moisture absorbent 12a of the second adhesive layer 12 is not limited in shape or particle size, but preferably may have a spherical shape having an average particle diameter of 5 nm to 8 μm to improve dispersibility in the second adhesive layer. Preferably, it may be spherical with an average particle diameter of 10 nm to 6 ㎛. This is desirable to thin the adhesive film while having a desired water removal function.

On the other hand, the second adhesive layer 12 of the present invention may further include a curing agent.

When the curing agent is included in the second adhesive layer 12, the curing agent may include 10 to 40 parts by weight, preferably 12 to 35 parts by weight, based on 100 parts by weight of the adhesive resin 12b of the second adhesive layer 12. .

If it contains less than 10 parts by weight of the curing agent can not achieve the desired gelation rate and modulus, the elastic force may be reduced, if it contains more than 40 parts by weight high panel strength due to high modulus and hardness As a result, a problem of deterioration of adhesion due to a decrease in wettability may occur.

The curing agent may be included as long as it is a material that can be used as a curing agent without limitation, preferably may include a material capable of ensuring a sufficient crosslinking density of the adhesive film by acting as a crosslinking agent, more preferably urethane acrylic It may include one or more selected from the group consisting of a rate-based curing agent and an acrylate-based curing agent, more preferably may include a compound represented by the formula (1).

[Formula 1]

In Formula 1, A ₁ and A ₂ are each independently -CH _2- , -CH ₂ CH _2- , -CH ₂ CH ₂ CH _2- , -CH ₂ CH ₂ CH ₂ CH ₂ -or -CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH _2- , preferably -CH _2- , -CH ₂ CH ₂ -or -CH ₂ CH ₂ CH _2- .

Furthermore, the second adhesive layer 12 of the present invention may further include a UV initiator.

When the UV initiator is included in the second adhesive layer 12 of the present invention, the UV initiator is 0.1 to 8 parts by weight, preferably 0.5 to 6, based on 100 parts by weight of the adhesive resin 12b of the second adhesive layer 12. It may include parts by weight. If the UV initiator is included in less than 0.1 part by weight may cause a problem of poor heat resistance due to poor UV curing, and if it contains more than 8 parts by weight may cause a problem of poor heat resistance due to lowering the curing density.

UV initiator may be included without limitation as long as it is commonly used as a UV initiator, preferably Mono Acyl Phosphine, Bis Acyl Phosphine, α-Hydroxyketone ), α-aminoketone (α-Aminoketone), phenylglyoxylate (Phenylglyoxylate), it may include one or more selected from benzyldimethyl-ketal (Benzyldimethyl-ketal).

Meanwhile, the second adhesive layer 12 included in the adhesive film 10 for an organic electronic device encapsulant according to the present invention has a viscosity of 200,000 Pa · s (50 ° C.) or more, preferably 220,000 to 1,000,000 Pa · s ( 50 ° C.). If the viscosity of the second adhesive layer 12 is less than 200,000 Pa · s (50 ° C.), a problem may occur in that the adhesive strength with the substrate decreases due to the decrease in the tack.

The viscosity may be a viscosity measured by a conventional viscosity measuring method, and preferably, the samples are laminated to a thickness of 800 to 900 μm, punched into a circle having a diameter of 8 mm, and then the viscosity measuring equipment (ARES-G2, TA) is The sample can be placed on a plate and measured. At this time, the measurement conditions can be measured with 5% strain, axial force 0.05N, sensitivity 0.005N, 1 rad / s, -5 ~ 130 ℃, and axial force before measurement (Axial Force) 0.5N, Sensitivity (0.05N) After the gap adjustment and sample stabilization can be measured under the above conditions, but is not limited thereto.

Meanwhile, when the adhesive layer having a multilayer structure including the first adhesive layer 11 and the second adhesive layer 12 is provided, the adhesive film 10 for the organic electronic device encapsulant according to the present invention has an adhesive force measured according to Measurement Method 1 below. The thickness may be 1500 gf / 25 mm or more, preferably 1600 gf / 25 mm or more, more preferably 1600 to 3000 gf / 25 mm.

[Measurement method 1]

After laminating the adhesive force measuring tape (7475, TESA) to the upper surface of the adhesive film through a 2Kg Hand Roller, cut the sample into 25mm width and 120mm length, laminating the lower surface of the adhesive film on glass at 80 ℃ , The prepared sample is allowed to stand at room temperature for 30 minutes, and the glass adhesive force is measured at 300 mm / min speed.

In addition, when the adhesive layer of the multilayer structure including the first adhesive layer 11 and the second adhesive layer 12 is provided, the adhesive film 10 for an organic electronic device encapsulant of the present invention is a metal measured according to the following measuring method 2 The adhesive force may be 1000 gf / 25 mm or more, preferably 1100 gf / 25 mm or more, more preferably 1100 to 2500 gf / 25 mm.

[Measurement Method 2]

At 80 ° C, the upper surface of the adhesive film is laminated on a Ni alloy having a thickness of 80 μm, and the adhesive force measuring tape (7475, TESA) is laminated on the lower surface of the adhesive film through a 2Kg Hand Roller, and the sample is 25 mm in width and 120 in length. After cutting to mm, the prepared sample was allowed to stand at room temperature for 30 minutes, and the metal adhesive force was measured at a speed of 300 mm / min.

As the adhesive force measured according to the measuring method 1 and the measuring method 2 satisfies the above range, peeling of the adhesive film may be significantly reduced when applied to the organic electronic device.

On the other hand, when the adhesive layer 15 of the above-mentioned single layer structure, the first adhesive layer 11 and the second adhesive layer 12 including the adhesive layer of the multilayer structure including the second adhesive layer, the specifications such as size and thickness may vary depending on the purpose Preferably, the first adhesive layer 11 and the second adhesive layer 12 has a thickness ratio of 1: 2 to 7, more preferably, a thickness ratio of 1: 2.8 to 5.2, still more preferably a thickness ratio of 1: 3.2 to 4.8, Even more preferably, it may have a thickness ratio of 1: 3.6 to 4.4.

In addition, the thickness of the first adhesive layer 11 of the present invention may be 1 to 30㎛, preferably 7 to 13㎛, more preferably 8 to 12㎛, even more preferably 9 to 11㎛, the present invention The second adhesive layer 12 may have a thickness of 15 to 70 μm, preferably 28 to 52 μm, more preferably 32 to 48 μm, even more preferably 36 to 44 μm.

In addition, the adhesive layer of the multilayer structure including the adhesive layer 15, the first adhesive layer 11, and the second adhesive layer 12 having a single layer structure may be a dry adhesive layer or a hardened adhesive layer.

Meanwhile, as mentioned above, when the adhesive layer of the present invention includes the first adhesive layer 11 and the second adhesive layer 12 formed on one surface of the first adhesive layer 11, the first adhesive layer 11 is represented by the following equation (1). According to the measured value may be 15%, preferably 3 to 10%, more preferably 4.4 to 8.3%, even more preferably 5.0 to 7.6%, even more preferably 5.6 to 7.0%. If the measured value according to Equation 1 of the first adhesive layer 11 exceeds 15%, a problem may occur in that adhesive force with a substrate (glass, metal, etc.) is lowered.

[Equation 1]

% Measured = 100 × S ₂ / S ₁

In Equation 1, S ₁ is a parallel plate having a diameter of 8 mm in a stress relaxation test mode with ARES (Advanced Rheometric Expansion System) in a state where an adhesive layer is prepared with a thickness of 600 μm. The maximum stress value measured when 50% strain is applied to the adhesive film by applying 200gf of normal force at 80 ° C., and S ₂ is 180 ° when the strain is applied to the adhesive film. The stress value measured after holding for seconds.

In addition, the second adhesive layer 12 of the present invention has a measured value of 10% or less, preferably 1 to 6%, more preferably 2.3 to 4.4%, still more preferably 2.6 to 4.1%, Even more preferably, it may be 3.0 to 3.7%.

If the measured value according to Equation 1 of the second adhesive layer 12 exceeds 10%, a problem may occur in that the adhesive force with the substrate (glass, metal, etc.) decreases.

In addition, in the first adhesive layer 11 and the second adhesive layer 12 of the present invention, the deviation of the measured value according to Equation 1 is 8% or less, preferably 2.0 to 3.9%, more preferably 2.3 to 3.6%, Even more preferably 2.6-3.3%. If the deviation is more than 8%, there may be a problem that the reliability due to shrinkage and / or expansion of the adhesive layer during the thermal process is degraded.

Furthermore, as mentioned above, when the adhesive layer of the present invention includes the first adhesive layer 11 and the second adhesive layer 12 formed on one surface of the first adhesive layer 11, the first adhesive layer 11 is represented by Equation 2 below. According to the measured value may be 8.4 to 15.8%, preferably 9.68 to 14.52%, more preferably 10.89 to 13.31%. If the measured value according to Equation 2 of the first adhesive layer 11 is less than 8.4%, heat resistance may be deteriorated, and a resin over flow may occur. When the measured value exceeds 15.8%, the resin may be mixed with a substrate (glass, metal, etc.). Problems that the adhesive strength is lowered may occur.

[Equation 2]

% Measured = 100 × S ₄ / S ₃

S ₃ is a vertical force of 200 gf at 85 ° C. using a parallel plate with a diameter of 8 mm in the stress relaxation test mode with ARES (Advanced Rheometric Expansion System) in the state of making the adhesive layer 600 μm thick. (normal force) is applied, the maximum stress value measured when 30% strain (strain) to the adhesive film, S ₄ is measured after maintaining the state in which the strain is applied to the adhesive film for 180 seconds Stress value.

In addition, the second adhesive layer 12 of the present invention may have a measured value of 1 to 20%, preferably 7.32 to 10.98%, and more preferably 8.23 to 10.07% according to Equation 2.

If the measured value according to Equation 2 of the second adhesive layer 12 is less than 1%, heat resistance may deteriorate, and resin over flow may occur, and if it exceeds 20%, adhesive strength with a substrate (glass, metal, etc.) This deterioration problem may occur.

In addition, in the first adhesive layer 11 and the second adhesive layer 12 of the present invention, the deviation of the measured value according to Equation 2 is 11.6% or less, preferably 0.39 to 6.29%, and more preferably 2.36 to 3.54%. Can be. If the deviation exceeds 11.6%, there may be a problem that the reliability due to shrinkage and / or expansion of the adhesive layer during the thermal process is degraded.

In addition, as mentioned above, when the adhesive layer of the present invention includes the first adhesive layer 11 and the second adhesive layer 12 formed on one surface of the first adhesive layer 11, the first adhesive layer 11 is formed at 25 ° C. (210 390) × 10 ³ Pa, preferably (240 to 360) × 10 ³ Pa, and more preferably (270 to 330) × 10 ³ Pa. If the tensile modulus of elasticity of the first adhesive layer 11 is less than 210 × 10 ^3, durability may be degraded. If the tensile modulus of the first adhesive layer 11 is greater than 390 × 10 ³ Pa, the substrate (glass, metal, etc.) may expand due to volume expansion due to reaction with moisture. May cause problems such as lifting and / or cracking.

Further, the second adhesive layer 12 has a tensile modulus of (1,400 to 2,600) × 10 ³ Pa at 25 ° C., preferably a tensile modulus of (1,600 to 2,400) × 10 ³ Pa, more preferably (1,800 to 2,200) It can have a tensile modulus of × 10 ³ Pa. If the tensile modulus of the second adhesive layer 12 is less than 1,400 × 10 ³ Pa, durability may be deteriorated. If the tensile modulus of the second adhesive layer 12 exceeds 2,600 × 10 ³ Pa, the substrate (glass, metal) may be caused by volume expansion due to reaction with moisture. Etc.) and / or cracking may occur.

In addition, the first adhesive layer 11 and the second adhesive layer 12 of the present invention has a variation in tensile modulus at 25 ° C. of 2,390 × 10 ³ Pa or less, preferably 1,010 × 10 ³ Pa to 2,040 × 10 ³ Pa, more Preferably, it may be 1,530 × 10 ³ Pa to 1,870 × 10 ³ Pa. If the deviation exceeds 2,390 × 10 ³ Pa, partial film fracture and cracking may occur due to shrinkage and / or expansion of the adhesive layer.

Furthermore, the adhesive layer of this invention can satisfy all the following conditions (1) and conditions (2).

≤7.16, 바람직하게는 5.37≤

≤6.92 일 수 있다.As condition (1), 5.78≤

≤7.16, preferably 5.37≤

≤6.92.

≤5.6, 바람직하게는 4.28≤

≤5.35일 수 있다.Moreover, as condition (2), 4.22 <=

≤5.6, preferably 4.28≤

≤5.35.

Under the above condition (1), a ₁ and a ₂ are the storage modulus (Pa) and loss modulus (Pa) at 25 ° C., respectively, and b ₁ and b ₂ are the storage modulus (Pa) and loss modulus at 50 ° C., respectively. Pa).

이 5.28 미만이면 패널 처짐현상이 발생함에 따라 부피 팽창을 방지할 수 없는 문제가 발생할 수 있고, 7.16을 초과하면 외부충격에 의한 완충효과가 저하됨에 따라 내구성이 저하될 수 있다.If under the above condition (1)

If it is less than 5.28, there may be a problem that the volume expansion may not be prevented as the panel sag occurs, and if it exceeds 7.16, the durability may be degraded as the buffering effect due to external shock is lowered.

이 4.22 미만이면 합착공정 중 오버 플로우(Over Flow)가 발생함에 따라 기포 발생 및/또는 신뢰성이 저하될 수 있고, 5.6을 초과하면 패널의 단차를 매꾸지 못함에 따라 점착력 저하 및/또는 층간 박리현상이 발생할 수 있다.Also, if the condition (2)

If it is less than 4.22, bubbles may be generated and / or reliability may decrease as overflow occurs during the bonding process, and if it exceeds 5.6, adhesive force decreases and / or interlayer peeling may occur as the panel is not smoothed. This can happen.

In addition, the adhesive layer of the present invention may satisfy the following condition (3).

≤5.02, 바람직하게는 3.59≤

≤4.87일 수 있다.As condition (3), 3.46≤

≤5.02, preferably 3.59≤

≤ 4.87.

Under the above condition (3), c ₁ and c ₂ are the storage modulus Pa and the loss modulus Pa at 100 ° C., respectively.

이 3.46 미만이면 점착제의 흐름성으로 인해 내열성이 저하되는 문제가 발생할 수 있고, 5.02를 초과하면 젖음성부족에 따른 점착력 저하 및 내열성이 저하되는 문제가 발생할 수 있다.If the above condition (3)

If less than 3.46 may cause a problem that the heat resistance is lowered due to the flowability of the pressure-sensitive adhesive, if it exceeds 5.02 may cause a problem that the adhesive strength and heat resistance is lowered due to lack of wettability.

Further, the adhesive layer of the present invention may have a storage modulus of 7 × 10 ⁶ to 1.5 × 10 ⁸ Pa, preferably 8 × 10 ⁶ to 1 × 10 ⁸ Pa at 25 ° C. so as to satisfy condition (1), 25 The loss modulus at 10 ° C. may be 10 ⁷ to 2 × 10 ⁸ Pa, preferably 1.2 × 10 ⁷ to 1.5 × 10 ⁸ Pa. If the storage elastic modulus is less than 7 × 10 ⁶ Pa at 25 ° C., the panel sag may occur and thus, the volume expansion may not be prevented. If the storage elastic modulus is greater than 1.5 × 10 ⁸ Pa, the buffering effect due to external impact may be caused. As it is lowered, durability may be lowered. In addition, when the elastic modulus of loss is less than 10 ⁷ Pa at 25 ℃ may cause a problem that can not prevent the expansion of the volume as the panel sag occurs, and if it exceeds 2 × 10 ⁸ Pa to reduce the buffering effect due to external impact Accordingly, durability may be lowered.

In addition, the adhesive layer of the present invention may have a storage modulus of 10 ⁶ ~ 1.5 × 10 ⁷ Pa, preferably 1.2 × 10 ⁶ ~ 9 × 10 ⁶ Pa at 50 ℃, to satisfy the condition (2), at 50 ℃ The loss modulus may be 8 × 10 ⁵ to 1.5 × 10 ⁷ Pa, preferably 9 × 10 ⁵ to 1 × 10 ⁷ Pa. If the storage elastic modulus is less than 10 ⁶ Pa at 50 ° C, bubbles may be generated and / or reliability may decrease as overflow occurs during the bonding process, and if the storage elastic modulus is greater than 1.5 × 10 ⁷ Pa, Failure to do so may result in reduced adhesion and / or delamination. Further, when at 50 ℃ loss elastic modulus is 8 × 10 ⁵ As is less than Pa of the cementation process overflow (Over Flow) occurs, and the bubbler and / or the reliability may be degraded, exceeds 1.5 × 10 ⁷ Pa of a panel Failure to fill in the level may result in a decrease in adhesive force and / or delamination.

In addition, the adhesive layer of the present invention may have a storage modulus of 2 × 10 ⁵ to 8 × 10 ⁶ Pa, preferably 3 × 10 ⁵ to 6 × 10 ⁶ Pa at 100 ° C., so as to satisfy condition (3), 100 The loss modulus at ° C may be 5 × 10 ⁴ to 2 × 10 ⁶ Pa, preferably 6 × 10 ⁴ to 1.5 × 10 ⁶ Pa. If the storage elastic modulus is less than 2 × 10 ⁵ Pa at 100 ° C., the heat resistance may be degraded due to the flowability of the pressure-sensitive adhesive. If the storage elastic modulus is higher than 8 × 10 ⁶ Pa, the adhesive strength and heat resistance may be reduced due to the lack of wettability. Problems may arise. Also, if the loss elastic modulus at 100 ℃ less than 5 × 10 ⁴ Pa due to the flowability of the adhesive may cause a problem that heat resistance decreases, and if it exceeds 2 × 10 ⁶ Pa that the adhesive strength decreases and the heat resistance of the wettability enough degradation Problems may arise.

Meanwhile, the adhesive layer of the present invention may have a gel content of 45 to 95%, preferably 50 to 90%, as measured by Equation 3 below.

[Equation 3]

The weight of the adhesive layer dried in Equation 3 is cut to 100 mm x 25 mm in width × length, put the adhesive layer cut into a vial bottle containing 5 g of toluene, and allowed to stand for 15 minutes. The adhesive layer was dried by hot air drying at 160 ° C. for 30 minutes to completely remove toluene, and then the weight measured.

If the gelation rate of the adhesive layer is less than 45%, panel deflection occurs, and expansion due to moisture absorption cannot be prevented, and bubbles are generated and / or reliability as overflow occurs during the bonding process. It may be lowered, a problem may occur that the heat resistance is lowered due to the flow of the pressure-sensitive adhesive. In addition, if the gelation rate of the adhesive layer exceeds 95%, the durability may be reduced as the buffering effect due to external impact is lowered, and a decrease in adhesive force and / or delamination may occur as the step of the panel is not smoothed. It may be, the problem of deterioration of adhesion and heat resistance due to lack of wettability may occur.

Furthermore, the adhesive layer of the present invention may satisfy both of the following conditions (4) and (5) in order to solve such a problem.

, 바람직하게는 10.15≤

≤80.2일 수 있고, 조건 (5)로써, 0.01≤

≤0.9, 바람직하게는 0.02≤

≤0.6일 수 있다.As condition (4), 8≤

, Preferably 10.15

≤80.2, and as condition (5), 0.01≤

≤0.9, preferably 0.02≤

≤0.6.

Where d is the thickness of the adhesive layer (µm) and e is the average particle diameter (µm) of the moisture absorbent.

이 8 미만이면 유기전자장치 봉지재용 접착필름의 합착성이 저하될 수 있고, 접착층 표면에 흡습제가 돌출되는 문제가 발생할 수 있으며, 접착층 표면에서 묻어나오는 흡습제로 인하여 신뢰성이 저하될 수 있다. 또한, 만일 상기 조건 (5)에서

가 0.01 미만이면 접착층 표면에 흡습제가 묻어나오는 문제가 발생할 수 있고, 신뢰성 및 합착성이 저하될 수 있으며,

가 0.9를 초과하면 유기전자장치 봉지재용 접착필름의 합착성이 저하될 수 있고, 접착층 표면에 흡습제가 돌출되는 문제가 발생할 수 있다.If the above conditions (4)

If less than 8, the adhesiveness of the adhesive film for an organic electronic device encapsulant may be reduced, a problem may occur in which a moisture absorbent protrudes from the surface of the adhesive layer, and reliability may be lowered due to the moisture absorbent burying from the surface of the adhesive layer. Also, if the condition (5)

If less than 0.01 may cause a problem that the moisture absorbent is buried on the surface of the adhesive layer, reliability and adhesion may be lowered,

When it exceeds 0.9, the adhesiveness of the adhesive film for an organic electronic device encapsulant may decrease, and a problem may occur in which a moisture absorbent protrudes from the surface of the adhesive layer.

At this time, the adhesive layer of the present invention may have a thickness of 8 to 85㎛, preferably 10 to 80㎛ to satisfy the conditions (4) and (5). If the thickness of the adhesive layer is less than 8㎛ the adhesiveness of the adhesive film for organic electronic device encapsulation may be lowered, there may be a problem that the moisture absorbent protrudes on the surface of the adhesive layer, if the thickness exceeds 85㎛ for the organic electronic device encapsulant Problems in which the reliability of the adhesive film is degraded may occur.

Meanwhile, the present invention includes an encapsulant for an organic electronic device including the above-mentioned adhesive film for an organic electronic device encapsulant, and includes a light emitting device including the encapsulant for the organic electronic device.

The light emitting device includes a substrate, an organic electronic device formed on at least one surface of the substrate, and an encapsulant for an organic electronic device according to the present invention for packaging the organic electronic device.

According to a preferred embodiment of the present invention, the light emitting device 100 of the present invention is formed with a single-layer adhesive layer 115 including an adhesive resin 115b and a moisture absorbent 115a as shown in FIG. According to another preferred embodiment of the present invention, the light emitting device 100 of the present invention is a first adhesive layer including an adhesive resin (111b) and the first absorbent (111a) as shown in FIG. 111) and a second adhesive layer 112 including an adhesive resin 112b and a second absorbent 112a.

The following description will be made based on the light emitting device 100 having the adhesive layer having the multilayer structure of FIG. 4.

In the light emitting device 100 according to the present invention, an organic electronic device 102 is formed on a substrate 101 and at least one surface of the substrate 101, and organic electronic devices are disposed on the substrate 101 and the organic electronic device 102. Device sealing materials 111 and 112 are formed. The encapsulant for an organic electronic device includes a first adhesive layer 111 including an adhesive resin 111b including a first adhesive resin and a second adhesive resin and a moisture absorbent 111a including silica; And a second adhesive layer 112 formed on one surface of the first adhesive layer and including an adhesive resin 112b including a first adhesive resin and a second adhesive resin and a moisture absorbent 112a.

The substrate 101 may be preferably any one of a glass substrate, a quartz substrate, a sapphire substrate, a plastic substrate, and a flexible polymer film that can be bent.

The organic electronic device 102 formed on at least one surface of the substrate 101 is formed by thinning a lower electrode on the substrate 102 and sequentially stacking an n-type semiconductor layer, an active layer, a p-type semiconductor layer, and an upper electrode thereon. After etching may be formed or manufactured through a separate substrate may be formed by placing on the substrate 101. The method of forming the organic electronic device 102 on the substrate 101 may be based on methods known in the art, and is not particularly limited in the present invention, and the organic electronic device 102 may be organic. It may be a light emitting diode.

Next, the organic electronic device encapsulation material (111, 112) according to the present invention for packaging the organic electronic device 102, the specific method of the packaging may be by a known conventional method, In the invention, there is no particular limitation. As a non-limiting example, the first adhesive layer 111 of the encapsulants 111 and 112 for organic electronic devices is formed directly on the organic electronic device 102 in the organic electronic device 102 formed on the substrate 101. It may be performed by applying heat and / or pressure using a vacuum press or a vacuum laminator or the like in the contacted state. In addition, heat may be applied to cure the adhesive layer, and in the case of an adhesive including a photocurable adhesive resin, the adhesive may be moved to a chamber to which light is irradiated, thereby making the curing process more rough.

Hereinafter, the present invention will be described through the following examples. At this time, the following examples are only presented to illustrate the invention, the scope of the present invention is not limited by the following examples.

Example 1 Preparation of Adhesive Film for Organic Electronic Device Encapsulant

(1) Preparation of the first adhesive layer

In order to form the first adhesive layer, a random copolymer (the first adhesive resin) copolymerized with ethylene, propylene and a diene compound and a compound represented by the following formula (2-1) (second adhesive resin) were used at a weight ratio of 1: 2.33. After preparing the adhesive resin by mixing, 80 parts by weight of the first adhesive agent (SU-90, Kolon Industries) and 50 parts by weight of the second adhesive agent (SU-100, Kolon Industries) based on 100 parts by weight of the adhesive resin As the curing agent, 11 parts by weight of the compound represented by the following formula (1-1), 3 parts by weight of UV initiator (irgacure TPO, Ciba) and 24 parts by weight of silica having an average particle diameter of 0.5 μm were added and stirred.

After the stirring was completed, the mixture was passed through a capsule filter to remove foreign substances, and then applied to a heavy release antistatic release PET (RT81AS, SKCHass) having a thickness of 75 μm using a slot die coater, and then dried at 120 ° C. to remove the solvent. A first adhesive layer having a final thickness of 10 μm was prepared.

The first adhesive resin was prepared by copolymerizing ethylene and propylene monomers at a weight ratio of 1: 0.85, and copolymerizing a diene compound at 9% by weight based on the total weight of the random copolymer, and the diene compound was ethylidene norbornene ( It is a random copolymer having a weight average molecular weight of 500,000 prepared using ethylidene norbornene).

[Formula 1-1]

[Formula 2-1]

In Formula 2-1, R ¹ is isoprene, and n is a ratio of 400,000 to a weight average molecular weight of the compound represented by Formula 2-1.

(2) Preparation of the second adhesive layer

In order to form the second adhesive layer, a random copolymer (the first adhesive resin) copolymerized with ethylene, propylene and a diene compound and the compound represented by the following formula (2-1) (second adhesive resin) were used at a weight ratio of 1: 2.33. After preparing the adhesive resin by mixing, 150 parts by weight of the first adhesive agent (SU-90, Kolon Industries) based on 100 parts by weight of the adhesive resin, 17 parts by weight of the compound represented by the following formula 1-1 as a curing agent, UV 3 parts by weight of an initiator (irgacure TPO, Ciba) and 100 parts by weight of calcium oxide having an average particle diameter of 3 μm were added and then stirred.

After the stirring was completed, the viscosity was adjusted to 800 cps at 20 ° C., the filter was passed through the capsule filter to remove foreign substances, and then applied to the light release mold PET (RF02, SKCHass) having a thickness of 38 μm using a slot die coater, followed by drying at 120 ° C. After removing the solvent to prepare a second adhesive layer having a final thickness of 40 ㎛.

The first adhesive resin was prepared by copolymerizing ethylene and propylene monomers at a weight ratio of 1: 0.85, and copolymerizing a diene compound at 9% by weight based on the total weight of the random copolymer, and the diene compound was ethylidene norbornene ( It is a random copolymer having a weight average molecular weight of 500,000 prepared using ethylidene norbornene).

[Formula 1-1]

[Formula 2-1]

In Formula 2-1, R ¹ is isoprene, and n is a ratio of 400,000 to a weight average molecular weight of the compound represented by Formula 2-1.

(3) Preparation of adhesive film

An adhesive film was prepared by laminating a second adhesive layer to face the first adhesive layer thus prepared and passing the 70 ° C. lamination.

Example 2 Preparation of Adhesive Film for Organic Electronic Device Encapsulant

An adhesive film for an organic electronic device encapsulant was prepared in the same manner as in Example 1. However, unlike Example 1, the final thickness of the second adhesive layer was prepared in 50 ㎛ to prepare an adhesive film.

Example 3 Preparation of Adhesive Film for Organic Electronic Device Encapsulant

An adhesive film for an organic electronic device encapsulant was prepared in the same manner as in Example 1. However, unlike Example 1, the final thickness of the second adhesive layer was prepared in 60 ㎛ to prepare an adhesive film.

Example 4 Preparation of Adhesive Film for Organic Electronic Device Encapsulant

An adhesive film for an organic electronic device encapsulant was prepared in the same manner as in Example 1. However, unlike Example 1, the final thickness of the second adhesive layer was prepared in 30 ㎛ to prepare an adhesive film.

Example 5 Preparation of Adhesive Film for Organic Electronic Device Encapsulant

An adhesive film for an organic electronic device encapsulant was prepared in the same manner as in Example 1. However, unlike Example 1, the final thickness of the second adhesive layer was prepared in 20 ㎛ to prepare an adhesive film.

Example 6 Preparation of Adhesive Film for Organic Electronic Device Encapsulant

An adhesive film for an organic electronic device encapsulant was prepared in the same manner as in Example 1. However, unlike Example 1, an adhesive film was prepared using a compound represented by the following Formula 3 as a curing agent of the first adhesive layer and the second adhesive layer.

[Formula 3]

Example 7 Preparation of Adhesive Film for Organic Electronic Device Encapsulant

An adhesive film for an organic electronic device encapsulant was prepared in the same manner as in Example 1. However, unlike Example 1, an adhesive film was prepared using a compound represented by the following Formula 4 as a curing agent of the first adhesive layer and the second adhesive layer.

[Formula 4]

Example 8 Preparation of Adhesive Film for Organic Electronic Device Encapsulant

An adhesive film for an organic electronic device encapsulant was prepared in the same manner as in Example 1. However, unlike Example 1, an adhesive film was prepared using a compound represented by the following Formula 5 as a curing agent of the first adhesive layer and the second adhesive layer.

[Formula 5]

Comparative Example 1: Preparation of Adhesive Film for Organic Electronic Device Encapsulant

An adhesive film for an organic electronic device encapsulant was prepared in the same manner as in Example 1. However, unlike Example 1, a compound represented by the following formula (5) was used as the curing agent of the first adhesive layer, and the final thickness of the first adhesive layer was prepared to 20 μm, and the compound represented by the following formula (5) as the curing agent of the second adhesive layer Using the, the final thickness of the second adhesive layer was prepared to 30 ㎛ to prepare an adhesive film.

[Formula 5]

Experimental Example 1

The measured values (%) according to Equation 1 below were calculated for the adhesive films prepared according to Examples and Comparative Examples, respectively, and are shown in Tables 1 and 2.

[Equation 1]

% Measured = 100 × S ₂ / S ₁

In Equation 1, S ₁ is a parallel plate having a diameter of 8 mm in a stress relaxation test mode with ARES (Advanced Rheometric Expansion System) in a state where an adhesive layer is prepared with a thickness of 600 μm. The maximum stress value measured when 50% strain is applied to the adhesive film by applying 200gf of normal force at 80 ° C., and S ₂ is 180 ° when the strain is applied to the adhesive film. The stress value measured after holding for seconds.

Experimental Example 2

The physical properties of the adhesive films prepared through the Examples and Comparative Examples were measured and shown in Tables 1 and 2 below.

1. Evaluation of Water Penetration of Adhesive Film

After cutting the specimen (= adhesive film) to the size of 95mm × 95mm, remove the protective film on the 100mm × 100mm alkali-free glass, and then align the specimen so that the specimen can be positioned 2.5mm inward from the four edges of the alkali-free glass. It was then attached using a roll laminator heated to 65 ℃. After removing the release film remaining on the attached specimen, cover another 100mm × 100mm alkali-free glass, lamination at 65 ℃ with a vacuum laminator for 1 minute to prepare a sample without bubbles. After the completion of the bonding, the sample was observed under a microscope for the length of water penetration in 1000 hours in a reliability chamber set at 85 ° C. and 85% relative humidity.

2. Evaluation of Volume Expansion of Adhesive Film

The release film of the specimen (= adhesive film) was removed on a 50 μm thick SUS plate cut to 30 mm × 20 mm, and then attached using a roll laminator heated to about 65 ° C. The attached specimen was cut with a knife to fit the size of SUS, and then attached to a 40mm × 30mm 0.7T alkali-free glass using a roll laminator heated at 65 ° C. After confirming that the specimen was well adhered between the glass and the SUS without voids, observe it for 1,000 hours at 100 hours intervals in a reliability chamber set at 85 ° C and 85% relative humidity. The height change of was observed through an optical microscope.

Observation results: ◎ If the height change is less than 12 μm in the moisture absorption area, ◎ If the height change is less than 12 to 14 μm in the moisture absorption area, △ If the height change is less than 14 to 16 μm in the water absorption area, △, Height is at the water absorption area. When the change is 16 µm or more, it is represented by ×.

3. Heat resistance evaluation of adhesive film

The specimen (= adhesive film) was cut to a size of 50mm × 80mm, and after removing the protective film of the specimen, it was attached to a 60mm × 150mm 0.08T Ni alloy using a roll laminator under the conditions of 80 ° C., Gap 1mm, and Speed 1. After removing the liner film of the attached specimen was attached to 30mm × 70mm 5T alkali-free Glass using a roll laminator at 80 ℃, Gap 1mm, Speed 1 conditions. After fixing the specimen attached to the glass vertically to the chamber (Chamber) of 130 ℃, hanging the weight of 1kg to determine the presence of adhesive (adhesive) flow. At this time, when there was no abnormality as a result of evaluation, (circle) it showed as x when it flowed even a little.

4. Glass adhesion evaluation

For the adhesive film prepared according to the Examples and Comparative Examples, the adhesive force measuring tape (7475, TESA) is laminated on the upper surface of the adhesive film through a 2 kg hand roller (2 kg hand roller), and the sample (= adhesive film) width After cutting to 25 mm and length 120 mm, laminating the lower surface of the adhesive film to an alkali-free glass at 80 ℃, the sample was left at room temperature for 30 minutes, at a speed of 300 mm / min through a universal testing machine (UTM) Glass adhesion was measured.

5. Evaluation of metal adhesion

With respect to the adhesive films prepared according to the Examples and Comparative Examples, the upper surface of the adhesive film was laminated on a Ni alloy having a thickness of 80 μm at 80 ° C., and the adhesive force measuring tapes 7475 and TESA were laminated on the lower surface of the adhesive film, thereby obtaining a sample (= After the adhesive film) was cut into a width of 25 mm and a length of 120 mm, the prepared sample was allowed to stand at room temperature for 30 minutes, and the metal adhesive force was measured at a speed of 300 mm / min through a universal testing machine (UTM).

Experimental Example 3

An organic light emitting device (hole transporting layer NPD / thickness 800A, light emitting layer Alq3 / thickness 300A, electron injection layer LiF / thickness 10A, cathode Al + Liq / thickness 1,000 A) was deposited and deposited on a substrate having an ITO pattern. After laminating the adhesive films according to Examples and Comparative Examples, an OLED unit specimen emitting green light was prepared. After the evaluation of the physical properties of the specimens are shown in Table 1 and Table 2.

1. Evaluation of Durability of Organic Light-Emitting Device According to Moisture Penetration of Adhesive Film

The specimens were observed at 100 ° C and 85% relative humidity for generation and / or growth of pixel shrinkage and dark spots at 100 ° C for 100 hours using a digital microscope of × 100. The time taken for the pixel reduction to occur at least 50% and / or to produce dark spots was measured.

At this time, when 50% or more of pixel reduction occurs and the time required to generate dark spots is more than 1,000 hours. ◎, when 50% or more of pixel reduction occurs and the time required to generate dark spots is less than 1000 hours to 800 hours or more. When the time required for generation and dark spot generation is less than 800 hours to 600 hours or more, △, when the time for generating the pixel reduction 50% or more and the time for dark spot generation is less than 600 hours is indicated by ×.

2. Evaluation of Durability of Adhesive Film

Specimens were observed for 1,000 hours at 100-hour intervals in a reliability chamber set at 85 ° C and relative humidity of 85%, and then subjected to optical microscopy for interfacial separation between organic electronic devices and adhesive films, bubble formation in cracks or adhesive films, and separation between adhesive layers. Observed through to evaluate the physical damage. In the case where there was no abnormality as a result of evaluation, any abnormality such as interfacial separation, cracking in the crack or adhesive film, separation between the adhesive layers and the like was indicated by x.

As can be seen in Table 1, the adhesive film prepared in Example 1 was confirmed that the volume expansion evaluation is superior to the adhesive film prepared in Example 2 and also excellent adhesion.

In addition, the adhesive film prepared in Example 1 was not only shorter moisture penetration length than the adhesive film prepared in Example 3, it was confirmed that the volume expansion evaluation is remarkably excellent and also excellent adhesion. In particular, the adhesive film prepared in Example 3 was found to be significantly worse than the adhesive film prepared in Example 1 in the durability evaluation.

In addition, the adhesive film prepared in Example 1 was confirmed that the adhesive strength is superior to the adhesive film prepared in Example 3.

In addition, the adhesive film prepared in Example 1 was confirmed that not only the moisture penetration length is shorter, but also the adhesive strength than the adhesive film prepared in Example 4.

As can be seen in Table 2, the adhesive film prepared in Example 1 was not only shorter in moisture penetration length than the adhesive films prepared in Examples 6, 7 and Comparative Example 1, it was confirmed that the adhesive strength is excellent.

In addition, the adhesive film prepared in Example 1 was not only shorter in moisture penetration length than the adhesive film prepared in Example 8, it was confirmed that the adhesive strength is excellent.

Simple modifications or changes of the present invention can be easily carried out by those skilled in the art, and all such modifications or changes can be regarded as being included in the scope of the present invention.

Claims (10)

An adhesive layer formed of an adhesive resin, a tackifier, a moisture absorbent, and a curing agent;
The adhesive layer has a measured value of 15% or less according to Equation 1 below.
The curing agent is an adhesive film for an organic electronic device sealing material comprising a compound represented by the formula (1);
[Equation 1]
% Measured = 100 × S ₂ / S ₁
In Equation 1, S ₁ is a parallel plate having a diameter of 8 mm in a stress relaxation test mode with ARES (Advanced Rheometric Expansion System) in a state where an adhesive layer is prepared with a thickness of 600 μm. The maximum stress value measured when 50% strain is applied to the adhesive film by applying 200gf of normal force at 80 ° C., and S ₂ is 180 ° when the strain is applied to the adhesive film. The stress value measured after holding for seconds,
[Formula 1]

In Formula 1, A ₁ and A ₂ are each independently -CH _2- , -CH ₂ CH _2- , -CH ₂ CH ₂ CH _2- , -CH ₂ CH ₂ CH ₂ CH ₂ -or -CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH _2- .
The method of claim 1,
The adhesive layer is an adhesive film for an organic electronic device encapsulant, characterized in that the measured value according to the equation (1) is 1 ~ 8%.
The method of claim 1,
The adhesive layer is a first adhesive layer; And a second adhesive layer formed on one surface of the first adhesive layer. Including,
The first adhesive layer has a measured value of 15% or less according to Equation 1, and the second adhesive layer has a measured value of 10% or less according to Equation 1, wherein the adhesive film for an organic electronic device encapsulant.
The method of claim 3,
The first adhesive layer has a measured value of 3 to 10% according to Equation 1, and the second adhesive layer has a measured value of 1 to 6% according to Equation 1 .
The method of claim 4, wherein
The first adhesive layer and the second adhesive layer is an adhesive film for an organic electronic device sealing material, characterized in that the deviation of the measured value according to the equation (1) is 8% or less.
The method of claim 3,
The adhesive film for an organic electronic device encapsulant, wherein the first adhesive layer and the second adhesive layer have a thickness ratio of 1: 2 to 7.
The method of claim 6,
The first adhesive layer has a thickness of 1 ~ 30㎛,
The second adhesive layer is an adhesive film for an organic electronic device sealing material, characterized in that having a thickness of 15 ~ 70㎛.
delete An organic electronic device encapsulation material comprising the adhesive film for organic electronic device encapsulation material according to any one of claims 1 to 7.
Board;
An organic electronic device formed on at least one surface of the substrate; And
Light-emitting device comprising ;; an organic electronic device encapsulation material according to claim 9 for packaging the organic electronic device.

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