KR20190007942A - Method of patterning multi-layer structure - Google Patents

Abstract

The present invention provides a method for patterning a multi-layer structure, which does not accompany a surface pollution problem due to residual particles, an edge quality problem of a multi-layer structure, and the like. The method for patterning a multi-layer structure includes: a step of forming a first layer having multiple voids inside on a first surface of a substrate, of a first layer forming material; a step of forming a second layer of a second layer forming material on the first layer so that the surface of a first area of the first layer is exposed, wherein a part of the second layer forming material is attached to at least a part of the first surface of the substrate by being penetrated into the multiple voids of the first layer; and a step of removing the first area of the first layer. A method for manufacturing a light extraction substrate of an organic light emitting device includes: a step of forming a scattering layer including the multiple voids, of a scattering layer forming material on the first surface of the substrate; a step of forming a flattening layer having less surface roughness than that of the scattering layer, on the scattering layer so that the surface of the first area of the scattering layer is exposed, wherein a part of the flattening layer forming material is penetrated into the multiple voids of the scattering layer and is attached to at least a part of the first surface of the substrate; and a step of removing the first area of the scattering layer.

Description

[0001] METHOD OF PATTERNING MULTI-LAYER STRUCTURE [0002]

The present disclosure relates to a method of patterning a multi-layer structure, and more particularly to a method of patterning a multi-layer structure for forming a second layer on a first layer so that a portion of the first layer is exposed, will be.

Structures on which a multilayer structure is formed on a substrate are being manufactured and used as intermediate products or final products in various technical fields. For example, in the manufacturing processes of display devices, semiconductor devices, and lighting devices, such structures are manufactured as an intermediate product. It is required that each of the layers constituting such a multilayer structure be patterned so as to have a predetermined size and shape at an accurate position.

To this end, it can be considered that the constituent layers constituting the multi-layer structure are formed in a predetermined size and shape at an accurate position from the beginning. However, these methods require precise alignment between the constituent layers. Therefore, the process difficulty is increased and expensive aligning equipment is required, which may lead to an increase in the process cost.

Next, after forming the constituent layers, it may be considered to remove a portion to have a predetermined size and shape at the correct position. However, even in these methods, the edge quality problem of the finally obtained multi-layer structure, surface contamination problem due to residual particles, and the like may be caused. Therefore, a new method for solving these problems is required.

It is an object of the present disclosure to provide an improved multilayer structure patterning method that does not require precise alignment between the constituent layers, and which does not involve edge quality problems of the multilayer structure, surface contamination problems due to residual particles, and the like.

In order to accomplish the above object, the present disclosure provides a method for forming a first layer on a first side of a substrate, the method comprising: forming a first layer having a plurality of voids therein, Forming a second layer on the first layer such that a surface of a first region of the first layer is exposed with a second layer forming material, wherein a portion of the second layer- Penetrating voids and attaching to at least a portion of said first side of said substrate; And removing the first region of the first layer.

 The disclosure also provides a method of forming a scattering layer on a first side of a substrate, the scattering layer having a plurality of voids therein; A flat layer having a lower surface roughness than the scattering layer is formed on the scattering layer so that a surface of the first region of the scattering layer is exposed as a flat layer forming material, The plurality of voids being attached to at least a portion of the first side of the substrate; And removing the first region of the scattering layer. The present invention also provides a method of manufacturing a light extracting substrate of an organic light emitting device.

1 is a flowchart of a method of patterning a multi-layer structure according to some embodiments.
2 is a cross-sectional view illustrating a method of patterning a multi-layer structure according to any one of the embodiments shown in FIG.
3 is a plan view showing a patterned multilayer structure according to a multilayer structure patterning method according to any one of the embodiments shown in FIG.
4 is a plan view showing a method of patterning a multi-layer structure according to any one of the embodiments shown in FIG.
5 is a cross-sectional view illustrating a method of manufacturing an organic light emitting device according to a control example.
FIG. 6 is a photograph showing light emission of the organic light emitting device manufactured by the method of manufacturing the organic light emitting device shown in FIG.
7 is a cross-sectional view showing a method of manufacturing an organic light emitting device according to some embodiments.
8 is a photograph showing light emission of the organic light emitting device manufactured by the method of manufacturing the organic light emitting device shown in FIG.
9 is an image captured by an electron microscope for a first dispersion liquid for forming a scattering layer of a light extraction substrate according to some embodiments.
10 is an image captured by an electron microscope for a second dispersion liquid for forming a scattering layer of a light extraction substrate according to some embodiments.
11 is an image captured by an electron microscope of a section of a light extracting substrate according to some embodiments.
12 to 14 are images captured by an electron microscope after removing a first region of a scattering layer in a light extracting substrate according to some embodiments.
15 is an image captured by an optical microscope after removing a first region of a scattering layer in a light extracting substrate according to some embodiments.

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

1 is a flowchart of a method of patterning a multi-layer structure according to some embodiments.

In some embodiments, as shown in Figure 1, a method of patterning a multi-layer structure includes forming a first layer on a first side of a substrate, forming a first layer of a first region of the first layer Forming a second layer on the first layer such that the first surface of the first layer facing away from the first surface is exposed, and removing the first region of the first layer.

FIG. 2 is a cross-sectional view showing a method of patterning a multi-layer structure according to any one of the embodiments shown in FIG. 1, and FIG. 3 is a cross-sectional view illustrating a method of patterning a multi-layer structure according to any one of the embodiments shown in FIG. 4 is a plan view showing a method of patterning a multi-layer structure according to any one of the embodiments shown in FIG. 1. FIG.

In some embodiments, the substrate 100 may include a glass substrate, a metal oxide substrate, a metal nitride substrate, a synthetic resin substrate, or the like. In some embodiments, the glass substrate may include a soda lime glass (SiO2-CaO-Na2O) substrate, an aluminosilicate glass (SiO2-Al2O3-Na2O) substrate, In some embodiments. The substrate 100 may be a glass substrate produced by a fusion method, a floating method, or the like. In some embodiments, the substrate 100 may comprise chemically tempered glass or thermally tempered glass. In some embodiments, the substrate 100 may comprise a flexible substrate or a non-flexible substrate. In some embodiments, the flexible substrate may have a thickness of 1.5 mm or less.

In some embodiments, the first layer-forming material forming the first layer 200 may comprise a metal oxide or the like. In some embodiments, the first layer-forming material may be a material having a high refractive index and being transparent to visible light. In some embodiments, the first layer 200 may be formed by coating the first layer forming material on the first side of the substrate 100. In some embodiments, the first layer forming material may be coated on the substrate 100 by a variety of methods such as slot die coating, spin coating, bar coating, and the like. In some embodiments, the first layer 200 may include a plurality of voids therein. In some embodiments, the first layer 200 may have greater porosity than the second layer 300. In some embodiments, the voids may have a size (diameter) of 10 nm to 700 nm, but this disclosure is not so limited. In some embodiments, the volume occupied by the voids may be 20-50% of the volume of the first layer 200, but this disclosure is not so limited.

In some embodiments, the second layer-forming material forming the second layer 300 may comprise organic materials, inorganic materials, organic hybrids, and the like. In some embodiments, the second layer 300 may be formed by coating the second layer forming material. For example, in some embodiments, the second layer 300 may be formed by wet coating the second layer forming material. In some embodiments, the second layer forming material may be coated on the first layer 200 by a variety of methods such as slot die coating, ink jet printing, spin coating, bar coating, and the like. In some embodiments, a portion of the second layer forming material may penetrate the voids of the first layer 200. In some of these embodiments, a portion of the second layer forming material may be attached to at least a portion of the first surface of the substrate 100 past the entire thickness of the first layer 200. [ In some embodiments, the adhesion of the second layer-forming material to the substrate 100 may be greater than the adhesion of the first layer-forming material to the substrate 100. The greater the adhesion of the second layer forming material to the first layer 200 when the first region 200 of the first layer 200 is removed by holding the first layer 200 more firmly against the substrate 100 ≪ / RTI > is not removed. However, this disclosure is not necessarily so limited, and in some other embodiments, the adhesion of the second layer-forming material may be substantially equal to or less than the adhesion of the first layer-forming material. The adhesion area of the first layer 200 and the second layer forming material with respect to the substrate 100 is increased so that the first layer 200 is further bonded to the substrate 100 A firm grip effect can be obtained. In some embodiments, the second layer forming material may have a higher adhesion than the Cross-Cut Test result 5B as defined in ASTM D3359.

In some embodiments, the first region 201 of the first layer 200 may be removed using a water jet apparatus. Additionally or alternatively, in some embodiments, the first area 201 of the first layer 200 may be removed by brush cleaning. In some embodiments, a cleaning liquid may be used as a scavenger used to remove the first region 201 of the first layer 200. For example, the first region 201 of the first layer 200 may be removed by applying a cleaning liquid to the first region 201 of the first layer 200 using a water-jet apparatus. By rinsing the first region 201 using a rinse solution, it can help clean the first region 201 of the first layer 200 without leaving particles. In some embodiments, Deionized Water can be used as a cleaning liquid. However, the present disclosure is not limited thereto, and in addition thereto, or alternatively, a mechanical abrasive, a chemical mechanical abrasive, or the like may be included in the cleaning liquid. In some embodiments, removal of the first region 201 may be accomplished by a variety of methods, including mechanical, chemical, optical, and electrical.

In some embodiments, removal of the first region 201 of the first layer 200 may be completed with only a single process, but in other embodiments, the first region 201 of the first layer 200 may be removed Multiple processes may be required to remove. In some embodiments, the first region 201 of the first layer 200 is an area formed to extend from the first side of the first layer 200 to the second side opposite the first side. However, it is not required that the edge surface of the first region 201 of the first layer 200 extend exactly along the thickness direction of the first layer 200 (in the fourth figure of FIG. 2, the first region 201 The edge of the first layer 200 is shown to extend along the vertical direction that is exactly the thickness direction of the first layer 200). For example, the area of the first area 201 on the first side of the first layer 200 It does not require that the area occupied by the second surface is exactly the same. For example, even if the stripe-shaped first region 201 is to be removed, the shape formed by the first region 201 on the first surface may match or be similar to the stripe shape, It may not be similar to the shape. In some embodiments, an additional process may be performed to make the shape formed on the second surface stripe shape, but in some other embodiments, the non-inlaid material may be finalized while being permitted.

In some embodiments, the first region 201 of the first layer 200 may be located away from (i.e., not abutting) all or a portion of the edge of the first layer 200. For example, in some embodiments, the second layer 300 is formed such that the first region 201 of the first layer 200 is completely surrounded by the remaining region of the first layer 200, The first region 201 of the first layer 200 may be positioned away from (i.e., not in contact with) the entirety of the edge of the first layer 200. However, in certain other embodiments, the first region 201 of the first layer 200 may be spaced apart from (i.e., not in contact with) a portion of the edge of the first layer 200, ). 4, the first region 201 of the first layer 200 is formed to form the entirety of the edge of the first layer 200 (the first layer 200 The second layer 300 can be formed.

In some embodiments, the first region 201 of the first layer 200 may comprise a plurality of segments spaced from one another (e.g., parallel segment segments).

In some embodiments, the second layer 300 is separated by the first region 201 of the first layer 200 to include a plurality of segments that are spaced apart from each other, as shown in FIG. 4, Layer 300 may be formed.

FIG. 5 is a cross-sectional view showing a method of manufacturing an organic light emitting device according to a control example, and FIG. 6 is a photograph showing light emission of the organic light emitting device manufactured by the method of manufacturing the organic light emitting device shown in FIG.

In the organic light emitting device manufactured by the method of manufacturing the organic light emitting device shown in FIG. 5, external air and moisture penetrate through the light extracting layer exposed to the outside, and the organic light emitting diode 400 is fatal It can have an adverse effect. FIG. 6 shows a phenomenon in which dark streaks occur in the organic light emitting device when air and moisture permeate into the organic light emitting device manufactured by the manufacturing method of the organic light emitting device shown in FIG. Therefore, edge exclusion of the light extracting layer is required as shown in Fig. 7 to be described later. 8 (the size of the light emitting region is about 12 x 24 mm 2), the organic light emitting device manufactured by the manufacturing method of the organic light emitting device shown in FIG. 7 is prevented from intrusion of air and moisture from the outside, Show me.

7 is a cross-sectional view showing a method of manufacturing an organic light emitting device according to some embodiments.

In the organic light emitting device, a substantial part of light emitted by total reflection, light waveguide, surface plasmon or the like is lost and only a part of the emitted light can be emitted to the outside. It is reported that about 80% of the emitted light is lost. Therefore, a light extracting layer may be provided in the organic light emitting device in order to minimize the loss of such light and extract the maximum light to the outside.

In some embodiments, the multilayer structures, the first layer 200 and the second layer 300, described with reference to FIGS. 1-4, may each include a light extraction layer, a scattering layer 200, (300). Basically, the explanations described with reference to Figs. 1 to 4 are equally applicable to the embodiments described with reference to Figs. 7 to 15, as far as it is permitted. Likewise, the descriptions to be described with reference to Figs. 7 to 15 can be equally applied to the embodiments described with reference to Figs. 1 to 4, if allowed. In some embodiments, the organic light emitting device may be a lighting device, but in some other embodiments the organic light emitting device may be a display device. However, the present disclosure is not limited thereto, and the organic light emitting device can be used for various purposes.

In some embodiments, a method of fabricating a light extracting substrate of an organic light emitting device includes forming a scattering layer 200 on a first side of a substrate 100 and forming a first region of the scattering layer 200 Forming a planar layer (300) on the scattering layer (200) to expose and removing the first region of the scattering layer (200).

In some embodiments, the scattering layer 200 may be formed by coating. In some of these embodiments, the scattering layer 200 may be formed by wet coating. In some embodiments, the scattering layer 200 may be fired by applying heat before the planarizing layer 300 is formed. Additionally or alternatively, in some embodiments, the scattering layer 200 may be fired with the planarizing layer 300 after forming the planarizing layer 300. In some embodiments, the scattering layer 200 may have voids therein. In some embodiments, the voids may have a sub-micro size. In some embodiments, the voids may have a size (diameter) of 10 nm to 700 nm, but this disclosure is not so limited. In some embodiments, the scattering layer 200 may have greater porosity than the planar layer 300. In some embodiments, the voids in the scattering layer 200 may cause the surface roughness of the scattering layer 200.

If the electrode layer of the organic light emitting diode 400 is directly formed on the scattering layer 200 having such a surface roughness, the surface roughness of the scattering layer 200 may have a serious adverse effect on the electrical characteristics and lifetime of the electrode layer. Thus, in some embodiments, a flat layer 300 having a surface roughness less than that of the scattering layer 200 may be formed on the scattering layer 200. Here, the surface roughness of the scattering layer 200 and the flat layer 300 can be compared using various roughness parameters. For example, in some embodiments, R _RMS of the planarizing layer 300 is smaller than the _RMS R of the scattering layer 200. Additionally or alternatively, in some embodiments, the Ra of the planarization layer 300 is less than the Ra of the scattering layer 200. In some embodiments, the planarizing layer 300 may be formed by applying a planarizing layer-forming material on the scattering layer. At this time, a part of the flat layer forming material may be penetrated into the voids of the scattering layer 200 and attached to at least a part of the first surface of the substrate 100. In some embodiments, the planarizing layer 300 may be formed by coating. In some of these embodiments, the planarizing layer 300 may be formed by wet coating. In some embodiments, after forming the planarizing layer 300, the planarizing layer 300 may be fired.

In some embodiments, a first region of the scattering layer 200 may be removed using a water jet, sonification, or the like. In some embodiments, by removing the first region of the scattering layer 200, the multi-layer structure including the scattering layer 200 and the planarizing layer 300 can be separated into at least two segments.

In some embodiments, a first region of the substrate 100 corresponding to the first region of the scattering layer 200 is diced to obtain a plurality of light extraction substrates, and then an organic light emitting diode Can be formed. In some other embodiments, after forming the organic light emitting diodes 400 on the at least two segments, the first region of the substrate 100, corresponding to the first region of the scattering layer 200, Can be singed. In some other embodiments, as shown in FIG. 7, an encapsulation layer 500, which encapsulates the at least two segments after each of the organic light emitting diodes 400 are formed on at least two segments, The first region of the substrate 100 corresponding to the first region of the scattering layer 200 may be diced. In some embodiments, as shown in FIG. 7, a single encapsulation layer 500 may encapsulate at least two segments in common, but this disclosure is not so limited. In some other embodiments, encapsulation layers 500 and segments may be formed to correspond to each other. In some other embodiments, a portion of the encapsulation layer 500 is formed to correspond to each of the segments, and the remainder may be formed to encapsulate at least two segments in common.

The organic light emitting diode 400 includes an anode electrode layer, an organic layer, and a cathode electrode layer sequentially stacked on the flattening layer 300. The organic layer includes a light emitting layer.

FIG. 9 is an image of an electron microscope for capturing a first dispersion liquid for forming a scattering layer of a light extraction substrate according to certain embodiments. FIG. 11 is an image captured by an electron microscope of a section of a light extracting substrate according to some embodiments.

In some embodiments, the scattering layering material may comprise first aggregates of metal oxides and second aggregates of metal oxides.

In some embodiments, the first aggregates may be formed by aggregation of TiO ₂ nanoparticles of 30-50 nm size. In some embodiments, the second aggregates may be formed by aggregation of TiO ₂ nanoparticles of 30-50 nm size. In some embodiments, the size of the first aggregate may have a size of 0.04 to 2.7 mu m. In some embodiments, the size of the second aggregate may have a size of 0.035 to 2.7 mu m. Here, the aggregate size was measured using a Partan Size Analyzer (Model: Mastersizer 2000) manufactured by Malvern Corporation.

In some embodiments, the first aggregates may have a smaller specific surface area than the second aggregates. In some embodiments, the first agglomerates and the second agglomerates have the same chemical composition and the same crystal phase, but may have different crystal habit. In some of these embodiments, the first agglomerates and the second agglomerates may have a chemical composition of TiO ₂ . In some of these embodiments, the first agglomerates and the second agglomerates may have a rutile or anatase crystalline phase. In some of these embodiments, the first aggregates may have a dentrite crystallization habit and the second aggregates may have rod-shaped crystallization habits.

Although the first agglomerate and the second agglomerate have the same chemical composition and the same crystal phase, the specific surface area may be different if the crystal habit is different. For example, in some embodiments, the first aggregate of TiO ₂ on rutile crystals has dendrite crystal wetting and may have a specific surface area of about 30.4 m 2 / g. Also, in some embodiments, the TiO ₂ second aggregate on the rutile crystal has rod-shaped crystallinity and can have a specific surface area of about 92.8 m 2 / g. Thus, the scattering layer forming material comprising the mixture of the first agglomerate and the first aggregate of TiO ₂ on the same rutile crystal phase is greater than 30.4 m ² / g and greater than 92.8 m ² / g, depending on the ratio of the first agglomerate and the second agglomerate ^Lt ; RTI ID = 0.0 > ² / g. ≪ / RTI > For example, in some embodiments, the scattering layering material may have a specific surface area of about 50 m 2 / g. The specific surface area was measured using a Gas Adsorption Analyzer (Macsorb HM Model-1208).

As described above, the first agglomerates and the second agglomerates have different agglomeration processes, and their shapes may be different from each other. As such, when the second aggregates of the first aggregates of TiO ₂ and TiO _2, that is, aggregates of TiO ₂ constituting the scattering layer were formed in various forms, it is possible to maximize the light-scattering effect. In the process of when forming the scattering layer, TiO ₂ is fired, a number of voids in, that is to say, a large number of pores refractive index is 1, the naturally occurring with a degree of size that may have caused a scattering of light inside the scattering layer . Since the agglomerates of TiO ₂ are formed in a dendrite shape and a rod shape, pores defined as a space between these agglomerates can be formed into various shapes capable of maximizing the light scattering effect.

In some embodiments, the scattering layer may further comprise a plurality of light scattering particles. The size of primary particles of a plurality of light scattering particles may be between 10 and 500 nm. At this time, the plurality of light scattering particles may be arranged on the lower side adjacent to the substrate with reference to the scattering layer inside. These multiple light scattering particles form complex light scattering structures together with the pores. In some embodiments, a plurality of light scattering particles can be arranged or formed on the substrate, for example, by being mixed with TiO ₂ on rutile crystal and then applied onto the substrate. Additionally or alternatively, in some embodiments, the plurality of light scattering particles may be formed on the substrate, prior to the scattering layer, and then covered by the scattering layer, via a separate process from the scattering layer formation. In some embodiments, the light scattering particles may be formed of any one or a combination of two or more of the candidate metal oxide containing SiO _2, TiO _2, ZnO and SnO _2.

Since TiO ₂ on the rutile crystal phase is a high-refractive index (HRI) metal oxide having a refractive index of 2.5 to 2.7, many pores having a refractive index of 1 are formed therein, and light scattering particles having another refractive index are formed A complex multi-refractive index structure such as a high refractive index / low refractive index or a high refractive index / low refractive index / high refractive index having different refractive indices or maximizing a refractive index difference is formed. When such a complex multi-refractive index structure is disposed on a path through which light emitted from the organic light emitting diode is emitted, the emission path of the light emitted from the organic light emitting diode is diversified, so that the increase in the light extraction efficiency of the organic light emitting device can be maximized.

If the thickness of the scattering layer is too large, it is difficult for the flat layer forming material to penetrate until reaching the substrate, so that the thickness of the scattering layer may be required to be appropriately selected. In some embodiments, the thickness of the scattering layer may be between 0.5 and 3.0 um, and the thickness of the light extracting layer may be between 1.0 and 4.0 um, but this disclosure is not so limited.

In some embodiments, to maximize the light extraction efficiency of the organic light emitting device, the planarizing layer may have a refractive index difference from the scattering layer. In some embodiments, the planarizing layer may be comprised of an organic or inorganic material, or may comprise an organic or inorganic hybrid. In some embodiments, PDMS (polydimethylsiloxane), which exhibits a refractive index of 1.3 to 1.5 with an organic material forming a flat layer, may be used. Material selected from In some embodiments, the planarizing layer is an inorganic material exhibiting a refractive index of _{1.7 ~ 2.7 MgO, Al 2 O} 3, ZrO 2, SnO 2, ZnO, SiO 2, metal oxides, high refractive index polymers, such as TiO ₂ Since the scattering layer is made of TiO ₂ having a high refractive index, the selection criterion can be limited to a material having a lower refractive index than TiO ₂ . The light extraction efficiency of the organic light emitting device can be improved through the refractive index difference by providing the light extraction layer having a laminated structure in which the refractive indexes of the light emitting layers are different from each other in the path along which the light emitted from the organic light emitting diode is emitted.

In some embodiments, only a portion of the total volume occupied by the plurality of voids of the scattering layer may be filled by the planarizing material. In some embodiments, the voids in the scattering layer may be uniformly distributed such that the scattering layer may function as if it had a single refractive index of any magnitude between the refractive index of the substrate of the scattering layer and the refractive index of the pores, May be small. In order to compensate for this, in some embodiments, the flat layer forming material is irregularly filled in the voids of the scattering layer, thereby maximizing the light scattering effect.

In some embodiments, a first dispersion is prepared by dispersing first aggregates in a first solvent, and second aggregates having a different specific surface area from the first aggregates are dispersed in a second solvent to prepare a second dispersion, 1 dispersion and a second dispersion may be mixed and the mixed solution may be coated on the first side of the substrate to form a scattering layer. For example, a first dispersion is prepared by dispersing TiO ₂ first aggregates having a rutile crystal phase or an anatase crystal phase, particularly a rutile crystal dendritic crystal habit, in a first solvent. At this time, in some embodiments, TiO ₂ may be dispersed in the first solvent by 5 to 60 wt% in the process of preparing the first dispersion. In some embodiments, the first solvent may comprise an organic solvent and H ₂ O. In some embodiments, a second dispersion is prepared by dispersing rod-shaped TiO ₂ second aggregates having a rutile crystal phase in the second solvent, wherein the rod-shaped TiO ₂ second aggregates have a specific surface area greater than that of the first aggregate. In some embodiments, TiO ₂ may be dispersed in the second solvent in an amount of 5 to 60 wt% in the process of preparing the second dispersion. In some embodiments, the second solvent may comprise an organic solvent such as EtOH. The first dispersion and the second dispersion are then mixed to produce a dispersion to be applied onto the substrate. At this time, in some embodiments, a plurality of light scattering particles can be mixed into the dispersion.

Next, a dispersion liquid is coated on the substrate to form a scattering layer. In the scattering layer thus formed, a large number of pores are formed spontaneously in the interior, and light scattering particles mixed in the dispersion in the dispersion preparation step may be arranged downward.

Next, a flat layer is formed on the scattering layer.

Experimental Example

12 to 14 are images captured by an electron microscope after removing a first region of a scattering layer in a light extracting substrate according to some embodiments.

A porous TiO 2 scattering layer was formed, and a flat layer was bar-coated thereon with an organic hybrimer of Toray. Thereafter, only the first region of the scattering layer not coated with the flat layer was selectively wiped using an Ultima wiper with ethanol. The image was then captured with an electron microscope. FIG. 12 is an image obtained by capturing the light extraction substrate in an oblique direction so that the thickness and the top surface of the light extraction substrate are captured at the same time. FIG. 11 is an enlarged image of the rectangular box of FIG. It is an image obtained by capturing. The left part in FIGS. 10 and 12 shows the lamination of the substrate, the scattering layer and the flat layer, and the right part shows only the removed substrate of the scattering layer and the flat layer. As a result of the experiment, it was confirmed that only the first region of the first layer not coated with the second layer can be relatively easily removed without damaging the coating of the second layer.

15 is an image captured by an optical microscope after removing a first region of a scattering layer in a light extracting substrate according to some embodiments.

Porous TiO2 scattering layer was formed, and a flat layer was selectively coated thereon using a slot die coater and an organic hygrometer of Toray Company. Thereafter, a 200-bar water jet was used to selectively remove only the first region of the scattered layer not coated with the flat layer. The image was then captured with an optical microscope. The magnification was x10. The upper right quadrant of FIG. 15 is photographed from the top of the light extraction substrate, and the remaining three quadrants are images captured using an optical microscope at the top of the light extraction substrate. Among the four quadrants, the image of the upper right quadrant is shown in the remaining three quadrants. As a result of the experiment, it was confirmed that only the first region of the first layer not coated with the second layer can be relatively easily removed without damaging the coating of the second layer.

Claims (23)

Forming on the first side of the substrate a first layer having a plurality of voids therein as a first layer forming material;
Forming a second layer on the first layer such that a surface of a first region of the first layer is exposed with a second layer forming material, wherein a portion of the second layer- Penetrating voids and attaching to at least a portion of said first side of said substrate;
Removing the first region of the first layer;
≪ / RTI >
The method according to claim 1,
The adhesion of the second layer forming material to the substrate is greater than the adhesion of the first layer forming material to the substrate,
Method for patterning multilayer structures.
The method according to claim 1,
Wherein the first layer has a porosity greater than the second layer,
Method for patterning multilayer structures.
The method according to claim 1,
Wherein forming the second layer comprises wet coating the second layer forming material on the first layer.
Method for patterning multilayer structures.
The method according to claim 1,
Forming the second layer comprises coating the second layer forming material using an ink jet printer,
Method for patterning multilayer structures.
The method according to claim 1,
Wherein the removing comprises cleaning and removing the first region of the first layer using a rinse solution.
Method for patterning multilayer structures.
The method according to claim 6,
Wherein the cleaning liquid comprises pure water.
Method for patterning multilayer structures.
The method according to claim 6,
Wherein the removing is performed by applying the cleaning liquid to the first region of the first layer using a water-
Method for patterning multilayer structures.
Forming a scattering layer on the first side of the substrate, the scattering layer forming material having a plurality of voids therein;
A flat layer having a lower surface roughness than the scattering layer is formed on the scattering layer so that a surface of the first region of the scattering layer is exposed as a flat layer forming material, The plurality of voids being attached to at least a portion of the first side of the substrate;
Removing the first region of the scattering layer;
Wherein the organic light-emitting device is a light-extraction substrate.
10. The method of claim 9,
Wherein the adhesion of the flat layer forming material to the substrate is greater than the adhesion of the scattering layer forming material to the substrate,
Method for patterning multilayer structures.
10. The method of claim 9,
Wherein the scattering layer has a porosity greater than that of the planar layer,
Method for patterning multilayer structures.
The method of claim 9, wherein the plurality of voids have a size of 10 to 70 nm,
Method for patterning multilayer structures.
10. The method of claim 9,
Wherein the plurality of boys occupy a volume of 20-50% of the volume of the scattering layer,
Method for patterning multilayer structures.
10. The method of claim 9,
Wherein forming the planarizing layer comprises wet coating the planarizing layer forming material on the scattering layer.
Method for patterning multilayer structures.
10. The method of claim 9,
Wherein the scattering layering material comprises first agglomerates of a metal oxide and second agglomerates of a metal oxide and wherein the first agglomerates have a smaller specific surface area than the second agglomerates,
A method of manufacturing a light extraction substrate of an organic light emitting device.

10. The method of claim 9,
Wherein the scattering layering material comprises first agglomerates of a metal oxide and second agglomerates of a metal oxide,
Wherein the first aggregates and the second aggregates have the same chemical composition and the same crystal phase and have different crystal habits,
A method of manufacturing a light extraction substrate of an organic light emitting device.
17. The method of claim 16,
The same chemical composition the same crystalline phase, and containing the TiO ₂ is included in the crystalline phase of rutile or anatase crystalline phase of the first light aggregates may have a dent crystal habit said second aggregates are having a crystal habit of the rod-like,
A method of manufacturing a light extraction substrate of an organic light emitting device.
10. The method of claim 9,
To form the scattering layer,
Dispersing the first aggregates in a first solvent to produce a first dispersion and dispersing the second aggregates in a second solvent to produce a second dispersion,
Mixing the first dispersion and the second dispersion and coating the mixture on the first side of the substrate,
Wherein the first solvent comprises an organic solvent and H ₂ 0, and the second solvent comprises an organic solvent,
A method of manufacturing a light extraction substrate of an organic light emitting device.
10. The method of claim 9,
Wherein only a part of the total volume occupied by the plurality of voids is filled by the flat layer forming material,
A method of manufacturing a light extraction substrate of an organic light emitting device.
10. The method of claim 9,
Wherein the flat layer forming material comprises an organic hy- drobimer,
A method of manufacturing a light extraction substrate of an organic light emitting device.
Forming on the first side of the substrate a scattering layer having a plurality of voids therein as a scattering layer forming material;
Forming a flat layer on the scattering layer such that the surface of the first region of the scattering layer is exposed with a flat layer forming material, wherein a part of the flat layer forming material is infiltrated into the plurality of voids of the scattering layer, Attached to at least a portion of the first side of the substrate;
And removing the first region of the scattering layer.
A method of manufacturing an organic light emitting device.
22. The method of claim 21,
Further comprising dicing a first region of the substrate corresponding to the first region of the scattering layer,
A method of manufacturing an organic light emitting device.
22. The method of claim 21,
By removing the first region of the scattering layer, the multi-layer structure including the scattering layer and the planarizing layer is separated into at least two segments,
Forming organic light emitting diodes on the at least two segments,
Forming an encapsulation layer encapsulating the organic light emitting diodes and the at least two segments;
Further comprising dicing a first region of the substrate corresponding to the first region of the scattering layer,
A method of manufacturing an organic light emitting device.

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